JP2019083231A5 - - Google Patents

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Publication number
JP2019083231A5
JP2019083231A5 JP2017208549A JP2017208549A JP2019083231A5 JP 2019083231 A5 JP2019083231 A5 JP 2019083231A5 JP 2017208549 A JP2017208549 A JP 2017208549A JP 2017208549 A JP2017208549 A JP 2017208549A JP 2019083231 A5 JP2019083231 A5 JP 2019083231A5
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JP
Japan
Prior art keywords
substrate
reaction product
time
gas
film
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Application number
JP2017208549A
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English (en)
Japanese (ja)
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JP6919498B2 (ja
JP2019083231A (ja
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Priority to JP2017208549A priority Critical patent/JP6919498B2/ja
Priority claimed from JP2017208549A external-priority patent/JP6919498B2/ja
Priority to PCT/JP2018/039523 priority patent/WO2019082937A1/ja
Publication of JP2019083231A publication Critical patent/JP2019083231A/ja
Publication of JP2019083231A5 publication Critical patent/JP2019083231A5/ja
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Publication of JP6919498B2 publication Critical patent/JP6919498B2/ja
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JP2017208549A 2017-10-27 2017-10-27 成膜装置及び成膜方法 Active JP6919498B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017208549A JP6919498B2 (ja) 2017-10-27 2017-10-27 成膜装置及び成膜方法
PCT/JP2018/039523 WO2019082937A1 (ja) 2017-10-27 2018-10-24 成膜装置及び成膜方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017208549A JP6919498B2 (ja) 2017-10-27 2017-10-27 成膜装置及び成膜方法

Publications (3)

Publication Number Publication Date
JP2019083231A JP2019083231A (ja) 2019-05-30
JP2019083231A5 true JP2019083231A5 (zh) 2020-10-01
JP6919498B2 JP6919498B2 (ja) 2021-08-18

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ID=66247893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017208549A Active JP6919498B2 (ja) 2017-10-27 2017-10-27 成膜装置及び成膜方法

Country Status (2)

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JP (1) JP6919498B2 (zh)
WO (1) WO2019082937A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114269967A (zh) * 2019-09-10 2022-04-01 应用材料公司 蒸气输送方法与设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI334450B (en) * 2004-03-12 2010-12-11 Hitachi Int Electric Inc Wafer treatment device and the manufacturing method of semiconductor device
KR101536257B1 (ko) * 2009-07-22 2015-07-13 한국에이에스엠지니텍 주식회사 수평 흐름 증착 장치 및 이를 이용한 증착 방법
JP5742185B2 (ja) * 2010-03-19 2015-07-01 東京エレクトロン株式会社 成膜装置、成膜方法、回転数の最適化方法及び記憶媒体
CN107924829B (zh) * 2015-09-30 2021-07-23 株式会社国际电气 半导体器件的制造方法、衬底处理装置及记录介质
JP6665726B2 (ja) * 2016-08-01 2020-03-13 東京エレクトロン株式会社 成膜装置

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