JP2019078609A - Method of manufacturing physical quantity sensor, physical quantity sensor, inertial measurement device, mobile positioning device, portable electronic device, electronic device, and mobile body - Google Patents

Abstract

To provide a manufacturing method for a physical quantity sensor which is easy to manufacture and effectively reduces unwanted vibrations, and to provide the physical quantity sensor, inertial measurement device, mobile positioning device, portable electronic device, electronic device, and mobile body.SOLUTION: A physical quantity sensor of the present invention comprises a vibrator, and a spring that supports the vibrator in a manner that allows the vibrator to vibrate in a first direction. The spring comprises an arm extending along a second direction perpendicular to the first direction, and a protective beam disposed next to the arm on one side in the first direction to extend in the second direction.SELECTED DRAWING: Figure 17

Description

  The present invention relates to a method of manufacturing a physical quantity sensor, a physical quantity sensor, an inertial measurement device, a mobile object positioning device, a portable electronic device, an electronic device, and a mobile object.

  DESCRIPTION OF RELATED ART Conventionally, the structure of patent document 1 is known as a gyro sensor (physical quantity sensor). The gyro sensor described in Patent Document 1 has a frame that can vibrate in the X-axis direction, a proof mass disposed inside the frame, and a proof mass that can be displaced in the Y-axis direction with respect to the frame. A proof mass and a beam connecting the frame and a sense electrode disposed opposite to the proof mass. In such a gyro sensor, an axis orthogonal to both the X-axis and the Y-axis in a state in which the frame is vibrated in the X-axis direction together with the proof mass (this state is hereinafter referred to as "drive vibration mode"). Coriolis force displaces the proof mass in the Y-axis direction when the angular velocity around it is applied, and the capacitance between the proof mass and the sense electrode changes. Therefore, the angular velocity can be detected based on the change in capacitance.

Japanese Patent Application Publication No. 2002-540406

  Further, in Patent Document 1, when the cross-sectional shape of the beam deviates from the rectangle as in a parallelogram, the frame and the proof mass vibrate not only in the X-axis direction but also in the Y-axis direction in the drive vibration mode. It points out the problem that the detection characteristic of angular velocity decreases. In Patent Document 1, a part of the beam is processed (removed) by laser irradiation to reduce unnecessary vibration in the Y-axis direction as described above (this vibration is also referred to as “quadrature”).

  However, in order to irradiate the laser with a laser, high alignment accuracy is required. Further, it is difficult to simultaneously process a plurality of portions of the beam by laser irradiation. Thus, in the method of processing a beam by laser irradiation, there is a problem that productivity (efficiency) is bad.

  An object of the present invention is to provide a method of manufacturing a physical quantity sensor that is easy to manufacture and can effectively reduce unnecessary vibration, a physical quantity sensor, an inertial measurement apparatus, a mobile positioning apparatus, a portable electronic apparatus, an electronic apparatus and a mobile To provide.

  The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following invention.

The method of manufacturing a physical quantity sensor according to the present invention comprises the steps of: forming a mask on a substrate;
An element portion forming step of forming an element portion from the substrate by dry etching the substrate through the mask;
The element unit is
A vibrating body,
And a spring for vibratably supporting the vibrator in a first direction,
The spring is
An arm extending along a second direction orthogonal to the first direction;
And a protection beam disposed adjacent to one side in the first direction with respect to the arm and extending in the second direction.
Thereby, the cross-sectional shape of the arm can be controlled by the protective beam, and the physical quantity sensor in which the quadrature is effectively suppressed can be manufactured.

In the method of manufacturing a physical quantity sensor according to the present invention, in the element portion forming step, a plurality of the element portions are formed from the substrate,
Preferably, in at least two of the element portions, the separation distance between the arm and the protective beam is different from each other.
Thereby, the cross-sectional shape of the arm of each element part can be made into a desired shape, without being influenced by the position in a board | substrate.

The physical quantity sensor of the present invention comprises a vibrator and
And a spring for vibratably supporting the vibrator in a first direction,
The spring is
An arm extending along a second direction orthogonal to the first direction;
And a protection beam disposed adjacent to one side in the first direction with respect to the arm and extending in the second direction.
Thereby, the cross-sectional shape of the arm can be controlled by the protective beam, and a physical quantity sensor in which the quadrature is effectively suppressed can be obtained.

In the physical quantity sensor of the present invention, the spring includes a plurality of the arms arranged side by side in the first direction,
Preferably, the protective beam is disposed between a pair of adjacent arms.
Thereby, direct contact between the arms can be prevented. Moreover, the impact beam at the time of a contact can also be relieved by a protection beam. Therefore, breakage of the arm can be effectively suppressed.

In the physical quantity sensor of the present invention, the spring has a connection portion connecting the pair of adjacent arms,
Preferably, the protective beam is connected to the connecting portion.
The connection portion is a portion which hardly affects the characteristics of the spring as compared with the arm. Therefore, by connecting the protective beam to the connection portion, it is possible to effectively suppress the fluctuation of the characteristics of the spring. Also, the design of the entire spring including the protective beam is easier than when the protective beam is connected to the arm.

In the physical quantity sensor of the present invention, preferably, the protective beam is connected to the arm.
Thereby, the protective beam can be displaced together with the arm, and an unintended contact between the protective beam and the arm can be effectively suppressed.

In the physical quantity sensor of the present invention, it is preferable that a plurality of the protective beams are disposed along the second direction.
As a result, the protective beam can be shortened, and the mechanical strength of the protective beam is improved accordingly.

In the physical quantity sensor of the present invention, it is preferable that a separation distance between one of the pair of adjacent arms and the protective beam and a separation distance between the other and the protective beam be different.
As a result, the arms and the protective beam can be sufficiently approached while sufficiently separating the arms from each other. Therefore, while being able to suppress the contact of the arms at the time of a drive, the cross-sectional shape of an arm can be controlled more effectively.

An inertial measurement device of the present invention is a physical quantity sensor of the present invention,
And a control circuit that controls driving of the physical quantity sensor.
Thereby, the effect of the physical quantity sensor of the present invention can be obtained, and a highly reliable inertial measurement device can be obtained.

A mobile positioning device according to the present invention comprises the inertial measurement device according to the present invention;
A receiver for receiving a satellite signal on which position information is superimposed from a positioning satellite;
An acquisition unit that acquires position information of the reception unit based on the received satellite signal;
An arithmetic unit that calculates the attitude of the moving object based on the inertial data output from the inertial measurement device;
And calculating a position of the moving body by correcting the position information based on the calculated attitude.
Thereby, the effect of the inertial measurement device of the present invention can be enjoyed, and a highly reliable mobile positioning device can be obtained.

A portable electronic device of the present invention is the physical quantity sensor of the present invention,
A case containing the physical quantity sensor;
A processing unit housed in the case and processing output data from the physical quantity sensor;
A display unit housed in the case;
And a translucent cover closing the opening of the case.
Thereby, the effect of the physical quantity sensor of the present invention can be enjoyed, and a highly reliable portable electronic device can be obtained.

An electronic device of the present invention includes the physical quantity sensor of the present invention,
And a control unit that performs control based on a detection signal output from the physical quantity sensor.
Thereby, the effect of the physical quantity sensor of the present invention can be obtained, and a highly reliable electronic device can be obtained.

A mobile according to the present invention is a physical quantity sensor according to the present invention,
And a control unit that performs control based on a detection signal output from the physical quantity sensor.
Thereby, the effect of the physical quantity sensor of the present invention can be enjoyed, and a highly reliable mobile object can be obtained.

It is a top view showing a physical quantity sensor concerning a 1st embodiment of the present invention. It is the sectional view on the AA line in FIG. It is a top view which shows the element part which the physical quantity sensor of FIG. 1 has. It is a figure which shows the voltage applied to the physical quantity sensor of FIG. It is a schematic diagram for demonstrating the vibration mode of the element part shown in FIG. It is a top view which shows the spring which the element part shown in FIG. 3 has. It is the BB sectional drawing in FIG. It is sectional drawing which shows the modification of the spring shown in FIG. It is sectional drawing which shows the modification of the spring shown in FIG. It is sectional drawing which shows the modification of the spring shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the spring shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the spring shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the spring shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the spring shown in FIG. It is a top view which shows the drive spring which the element part shown in FIG. 3 has. It is a top view which shows the drive spring which the element part shown in FIG. 3 has. It is a top view which shows the detection spring which the element part shown in FIG. 3 has. It is a top view which shows the connection spring which the element part shown in FIG. 3 has. It is a flowchart which shows the manufacturing method of the physical quantity sensor shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is a top view which shows the spring which the physical quantity sensor which concerns on 2nd Embodiment of this invention has. It is a top view which shows the spring which the physical quantity sensor which concerns on 3rd Embodiment of this invention has. It is an exploded perspective view of an inertial measurement device concerning a 4th embodiment of the present invention. FIG. 28 is a perspective view of a substrate of the inertial measurement device shown in FIG. 27. It is a block diagram showing the whole system of the mobile positioning device concerning a 5th embodiment of the present invention. It is a figure which shows the effect | action of the mobile positioning device shown in FIG. It is a perspective view showing the electronic equipment concerning a 6th embodiment of the present invention. It is a perspective view showing the electronic equipment concerning a 7th embodiment of the present invention. It is a perspective view which shows the electronic device which concerns on 8th Embodiment of this invention. It is a top view which shows the portable electronic device which concerns on 9th Embodiment of this invention. It is a functional block diagram which shows schematic structure of the portable electronic device shown in FIG. It is a perspective view showing the mobile concerning a 10th embodiment of the present invention.

  Hereinafter, a method of manufacturing a physical quantity sensor, a physical quantity sensor, an inertial measurement device, a mobile positioning device, a portable electronic device, an electronic device, and a mobile according to the present invention will be described in detail based on embodiments shown in the attached drawings.

First Embodiment
First, a physical quantity sensor and a method of manufacturing the physical quantity sensor according to the first embodiment of the present invention will be described.

  FIG. 1 is a plan view showing a physical quantity sensor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a plan view showing an element portion of the physical quantity sensor of FIG. FIG. 4 is a diagram showing voltages applied to the physical quantity sensor of FIG. FIG. 5 is a schematic view for explaining a vibration mode of the element portion shown in FIG. 6 is a plan view showing a spring included in the element portion shown in FIG. 7 is a cross-sectional view taken along the line B-B in FIG. 8 to 10 are cross-sectional views showing modifications of the spring shown in FIG. 11 to 14 are cross-sectional views for explaining the method of manufacturing the spring shown in FIG. 15 and 16 are each a plan view showing a drive spring of the element portion shown in FIG. FIG. 17 is a plan view showing a detection spring included in the element portion shown in FIG. FIG. 18 is a plan view showing a connection spring included in the element portion shown in FIG. FIG. 19 is a flowchart showing a method of manufacturing the physical quantity sensor shown in FIG. 20 to 24 are cross-sectional views for explaining the method of manufacturing the physical quantity sensor shown in FIG.

  In each figure, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other. A direction parallel to the X axis is also referred to as "X axis direction", a direction parallel to the Y axis as "Y axis direction", and a direction parallel to the Z axis as "Z axis direction". Moreover, the arrow tip side of each axis is also referred to as "plus side", and the opposite side is also referred to as "minus side". Moreover, the Z axis direction plus side is also referred to as "upper", and the Z axis direction minus side is also referred to as "down".

  In the specification of the present application, the term "orthogonal" includes the case where they intersect at an angle slightly inclined from 90 ° (for example, 90 ° ± 5 °), in addition to the case where they intersect at 90 °. Specifically, when the X axis is inclined by about ± 5 ° with respect to the normal direction of the YZ plane, the Y axis is inclined by about ± 5 ° with respect to the normal direction of the XZ plane. The case of being inclined by about ± 5 ° with respect to the normal direction of the XY plane is also included in “orthogonal”.

  The physical quantity sensor 1 shown in FIG. 1 is an angular velocity sensor capable of detecting an angular velocity ωy around the Y axis. The physical quantity sensor 1 includes a substrate 2, a lid 3, and an element unit 4.

  As shown in FIG. 1, the substrate 2 has a rectangular shape in plan view. Further, the substrate 2 has a recess 21 opened on the top surface. The concave portion 21 functions as a relief portion for preventing (suppressing) the contact between the element portion 4 and the substrate 2. The substrate 2 also has a plurality of mounts 22 (221, 222, 224, 225) protruding from the bottom surface of the recess 21. The element portion 4 is bonded to the upper surface of the mount 22. Thereby, the element portion 4 can be fixed to the substrate 2 in a state where the contact with the substrate 2 is prevented. Further, the substrate 2 has groove portions 23, 24, 25, 26, 27, 28 opened on the upper surface.

The substrate 2 is made of, for example, a glass material containing an alkali metal ion (sodium ion: Na ⁺ ), specifically, borosilicate glass such as Tempax glass (registered trademark) or Pyrex glass (registered trademark). A glass substrate can be used. However, the constituent material of the substrate 2 is not particularly limited, and a silicon substrate, a ceramic substrate or the like may be used.

  As shown in FIG. 1, fixed detection electrodes 81 and 82 are disposed on the bottom of the recess 21. Wirings 73, 74, 75, 76, 77, 78 are disposed in the grooves 23, 24, 25, 26, 27, 28. The wires 73, 74, 77, 78 are electrically connected to the element unit 4, and the wires 75, 76 are electrically connected to the fixed detection electrodes 81, 82. In addition, one end portions of the wires 73, 74, 75, 76, 77, 78 are exposed to the outside of the lid 3 and function as electrode pads P for electrical connection with an external device.

  As shown in FIG. 1, the lid 3 has a rectangular plan view shape. Moreover, as shown in FIG. 2, the cover 3 has the recessed part 31 opened to a lower surface. The lid 3 is joined to the top surface of the substrate 2 so as to accommodate the element portion 4 in the recess 31. Then, a storage space S for storing the element portion 4 is formed inside the lid 3 and the substrate 2.

  Further, as shown in FIG. 2, the lid 3 has a communication hole 32 communicating the inside and the outside of the storage space S. Therefore, the storage space S can be replaced with a desired atmosphere via the communication hole 32. Further, a sealing member 33 is disposed in the communication hole 32, and the communication hole 32 is hermetically sealed by the sealing member 33. The storage space S is preferably in a reduced pressure state, particularly in a vacuum state. Thereby, the viscous resistance is reduced, and the element unit 4 can be vibrated efficiently.

  For example, a silicon substrate can be used as such a lid 3. However, the lid 3 is not particularly limited, and for example, a glass substrate or a ceramic substrate may be used. The method of bonding the substrate 2 and the lid 3 is not particularly limited, and may be appropriately selected depending on the materials of the substrate 2 and the lid 3. However, for example, bonding surfaces activated by anodic bonding or plasma irradiation Examples include activation bonding for bonding together, bonding using a bonding material such as glass frit, and diffusion bonding for bonding metal films formed on the upper surface of the substrate 2 and the lower surface of the lid 3. In the present embodiment, the substrate 2 and the lid 3 are bonded via the glass frit 39 (low melting point glass).

  The element unit 4 is disposed in the storage space S, and is joined to the upper surface of the mount 22. For example, the element section 4 is to pattern a conductive silicon substrate doped with an impurity such as phosphorus (P), boron (B), arsenic (As) or the like by a dry etching method (silicon deep etching, particularly a Bosch method). Can be formed by Hereinafter, the configuration of the element unit 4 will be described based on FIG. Hereinafter, a straight line that intersects with the center O of the element unit 4 and extends in the Y-axis direction in plan view from the Z-axis direction is also referred to as a “virtual straight line α”. Further, in FIG. 3, the details of the element unit 4 are not shown for convenience of explanation. The details of the element unit 4 will be separately described based on FIGS. 15 to 18.

  As shown in FIG. 3, the shape of the element unit 4 is symmetrical with respect to the imaginary straight line α. Further, the element unit 4 includes two drive units 41A and 41B disposed on both sides of the imaginary straight line α. The drive portion 41A has a comb-shaped movable drive electrode 411A, and a fixed drive electrode 412A which has a comb shape and is disposed so as to be engaged with the movable drive electrode 411A. Similarly, the drive unit 41B has a comb-shaped movable drive electrode 411B and a fixed drive electrode 412B which has a comb shape and is disposed so as to be engaged with the movable drive electrode 411B.

  The fixed drive electrodes 412A and 412B are each bonded to the upper surface of the mount 221 and fixed to the substrate 2. The movable drive electrodes 411A and 411B are electrically connected to the wiring 73, respectively, and the fixed drive electrodes 412A and 412B are electrically connected to the wiring 74, respectively.

  Further, the element unit 4 includes four fixing portions 42A arranged around the driving portion 41A and four fixing portions 42B arranged around the driving portion 41B. The fixing portions 42 </ b> A and 42 </ b> B are bonded to the top surface of the mount 222 and fixed to the substrate 2.

  Further, the element unit 4 has four drive springs 43A for connecting the fixed portions 42A and the movable drive electrodes 411A, and four drive springs 43B for connecting the fixed portions 42B and the movable drive electrodes 411B. ing. Each drive spring 43A is elastically deformed in the X-axis direction to allow displacement of the movable drive electrode 411A in the X-axis direction, and each drive spring 43B is elastically deformed in the X-axis direction to move the X-axis of the movable drive electrode 411B. Displacement in the direction is allowed.

  To vibrate the movable drive electrodes 411A and 411B, for example, the voltage V1 shown in FIG. 4 is applied to the movable drive electrodes 411A and 411B via the wiring 73, and the voltage V2 shown in FIG. The voltage is applied to the electrodes 412A and 412B. The voltage V1 is a constant voltage of about 15 V larger than the GND reference (for example, a potential of about 0.9 V), and the voltage V2 is a rectangular wave centered on the GND reference.

  As a result, electrostatic attraction is generated between movable drive electrode 411A and fixed drive electrode 412A and between movable drive electrode 411B and fixed drive electrode 412B, and movable drive electrode 411A moves drive spring 43A in the X-axis direction. The movable drive electrode 411B vibrates in the X axis direction while elastically deforming the drive spring 43B in the X axis direction while vibrating in the X axis direction while being elastically deformed. As described above, since the drive parts 41A and 41B are disposed symmetrically with respect to the imaginary straight line α, the movable drive electrodes 411A and 411B vibrate in the opposite phase in the X axis direction so as to approach and separate from each other. Do. Therefore, the vibration of the movable drive electrodes 411A and 411B is cancelled, and the vibration leakage can be reduced. Hereinafter, this vibration mode is also referred to as "drive vibration mode".

  The voltages V1 and V2 are not particularly limited as long as the driving vibration mode can be excited. Further, in the physical quantity sensor 1 of the present embodiment, an electrostatic drive system in which the drive vibration mode is excited by electrostatic attraction is used, but a system in which excitation is not particularly limited, for example, a piezoelectric drive system, Lorentz of a magnetic field It is also possible to apply an electromagnetic drive system or the like using power.

  The element unit 4 further includes a detection unit 44A located between the drive unit 41A and the virtual straight line α, and a detection unit 44B located between the drive unit 41B and the virtual straight line α. The detection unit 44A is configured of a plate-like movable detection electrode 441A. Similarly, the detection unit 44B is configured of a plate-like movable detection electrode 441B. The movable detection electrode 441A is disposed to face the fixed detection electrode 81, and the movable detection electrode 441B is disposed to face the fixed detection electrode 82.

  The movable detection electrodes 441A and 441B are electrically connected to the wiring 73, the fixed detection electrode 81 is electrically connected to the wiring 75, and the fixed detection electrode 82 is electrically connected to the wiring 76. . When the physical quantity sensor 1 is driven, a capacitance Ca is formed between the movable detection electrode 441A and the fixed detection electrode 81, and a capacitance Cb is formed between the movable detection electrode 441B and the fixed detection electrode 82. Ru.

  Further, the element unit 4 includes two fixing portions 451 and 452 disposed between the detection units 44A and 44B. The fixing portions 451 and 452 are respectively bonded to the upper surface of the mount 224 and fixed to the substrate 2. In the present embodiment, the movable drive electrodes 411A and 411B and the movable detection electrodes 441A and 441B are electrically connected to the wiring 73 through the fixed portions 451 and 452, respectively.

  The element unit 4 also includes four detection springs 46A connecting the movable detection electrode 441A and the fixed portions 42A, 451 and 452, and four detection springs connecting the movable detection electrode 441B and the fixed portions 42B, 451 and 452 And 46B. Each detection spring 46A elastically deforms in the X-axis direction to allow displacement of the movable detection electrode 441A in the X-axis direction, and elastic deformation in the Z-axis direction causes displacement of the movable detection electrode 441A in the Z-axis direction Permissible. Similarly, each detection spring 46B elastically deforms in the X-axis direction to allow displacement of the movable detection electrode 441B in the X-axis direction, and elastically deforms in the Z-axis direction to move the movable detection electrode 441B in the Z-axis direction Displacement is acceptable.

  The element unit 4 is located between the movable drive electrode 411A and the movable detection electrode 441A, and is located between the beam 47A connecting these, the movable drive electrode 411B and the movable detection electrode 441B, and these are connected And the beam 47B. Therefore, as shown in FIG. 5, in the drive vibration mode, the movable detection electrodes 441A and 441B also vibrate in the opposite phase in the X-axis direction integrally with the movable drive electrodes 411A and 411B. In other words, in the drive vibration mode, the movable body 4A (oscillator) which is an assembly of the movable drive electrode 411A, the movable detection electrode 441A and the beam 47A, and the assembly of the movable drive electrode 411B, the movable detection electrode 441B and the beam 47B A certain movable body 4B (oscillator) vibrates in the opposite phase in the X-axis direction.

  When angular velocity ωy is applied to the physical quantity sensor 1 while driving in such a driving vibration mode, the movable detection electrodes 441A and 441B are detected spring as shown by an arrow A in FIG. It vibrates in the opposite phase in the Z-axis direction while elastically deforming 46A and 46B in the Z-axis direction. In addition, below, this vibration mode is also called "detection vibration mode." In the detection vibration mode, since the movable detection electrodes 441A and 441B vibrate in the Z-axis direction, the gap between the movable detection electrode 441A and the fixed detection electrode 81 and the gap between the movable detection electrode 441B and the fixed detection electrode 82 change, Along with that, the capacitances Ca and Cb change respectively. Therefore, the angular velocity ωy can be obtained based on the changes in the capacitances Ca and Cb.

  In the detection vibration mode, the electrostatic capacitance Cb decreases as the electrostatic capacitance Ca increases, and conversely, the electrostatic capacitance Cb increases as the electrostatic capacitance Ca decreases. Therefore, the detection signal (signal according to the size of the capacitance Ca) output from the wiring 75 and the detection signal (signal according to the size of the capacitance Cb) output from the wiring 76 are differentially By performing calculation (subtraction processing: Ca-Cb), noise can be canceled, and the angular velocity ωy can be detected more accurately.

  Further, as shown in FIG. 3, the element unit 4 has a frame 48 located at the central portion (between the detection units 44A and 44B). The frame 48 has an “H” shape, and includes a defective portion 481 (recessed portion) located on the negative side in the Y-axis direction and a defective portion 482 (recessed portion) located on the positive side in the Y-axis direction. The fixing portion 451 is disposed over the inside and outside of the defect portion 481, and the fixing portion 452 is disposed over the inside and outside of the defect portion 482. As a result, the fixing portions 451 and 452 can be formed long in the Y-axis direction, and the bonding area with the substrate 2 is increased accordingly, and the bonding strength between the substrate 2 and the element portion 4 is increased.

  The element portion 4 is located between the fixed portion 451 and the frame 48, and is connected with a frame spring 488, and between the fixed portion 452 and the frame 48 with a frame spring 489 for connecting these. ,have. The frame springs 488 and 489 respectively extend in the Y-axis direction, and are elastically deformable in the X-axis direction.

  Further, the element portion 4 is located between the frame 48 and the movable detection electrode 441A, and is a connection spring for connecting these, and between the frame 48 and the movable detection electrode 441B, and a connection spring for connecting these. And 40B. The connection spring 40A supports the movable detection electrode 441A together with the detection spring 46A, and the connection spring 40B supports the movable detection electrode 441B together with the detection spring 46B. As a result, the movable detection electrodes 441A and 441B can be supported in a more stable posture, and unnecessary vibration (spurious) of the movable detection electrodes 441A and 441B can be reduced.

  The element unit 4 further includes monitor units 49A and 49B for detecting the vibration state of the movable detection electrodes 441A and 441B in the drive vibration mode. The monitor unit 49A includes a comb-shaped movable monitor electrode 491A disposed on the movable detection electrode 441A, and fixed monitor electrodes 492A and 493A which are comb-shaped and are engaged with the movable monitor electrode 491A. There is. Similarly, the monitor unit 49B includes a comb-like movable monitor electrode 491B disposed on the movable detection electrode 441B, and fixed monitor electrodes 492B and 493B having a comb-like shape and engaged with the movable monitor electrode 491B. Have. The fixed monitor electrodes 492A, 493A, 492B, 493B are respectively bonded to the upper surface of the mount 225 and fixed to the substrate 2.

  In the monitor 49A, the fixed monitor electrode 492A is positioned on the positive side in the X-axis direction of the movable monitor electrode 491A, and the fixed monitor electrode 493A is positioned on the negative side in the X-axis direction. On the other hand, in the monitor unit 49B, the fixed monitor electrode 492B is positioned on the minus side in the X axis direction of the movable monitor electrode 491B, and the fixed monitor electrode 493B is positioned on the plus side in the X axis direction.

  The movable monitor electrodes 491A and 491B are electrically connected to the wiring 73, the fixed monitor electrodes 492A and 492B are electrically connected to the wiring 77, and the fixed monitor electrodes 493A and 493B are electrically connected to the wiring 78. It is connected. When the physical quantity sensor 1 is driven, a capacitance Cc is formed between the movable monitor electrode 491A and the fixed monitor electrode 492A and between the movable monitor electrode 491B and the fixed monitor electrode 492B, and the movable monitor electrode 491A and the fixed monitor A capacitance Cd is formed between the electrode 493A and between the movable monitor electrode 491B and the fixed monitor electrode 493B.

  As described above, in the drive vibration mode, since the movable detection electrodes 441A and 441B vibrate in the X-axis direction, the gap between the movable monitor electrode 491A and the fixed monitor electrodes 492A and 493A and the movable monitor electrode 491B and the fixed monitor electrode 492B, The gap with 493 B changes, and the capacitances Cc and Cd change accordingly. Therefore, the vibration state of the movable detection electrodes 441A and 441B can be detected based on the changes in the capacitances Cc and Cd.

  The configuration of the element unit 4 has been described above. Next, the configuration of the drive springs 43A and 43B, the detection springs 46A and 46B, and the connection springs 40A and 40B, which is one of the features of the physical quantity sensor 1, will be described in detail. The drive springs 43A and 43B, the detection springs 46A and 46B, and the connection springs 40A and 40B have the same characteristic structure that "the protective beam 53 is provided side by side with the arm 51". These will be described as "springs 5".

  As shown in FIG. 6, the spring 5 has a serpentine shape that reciprocates in the Y-axis direction. Specifically, the spring 5 connects one end portions of two arms 51 (511, 512) extending in the Y-axis direction and arranged side by side along the X-axis direction with one ends of the arms 511, 512. And a connection portion 52. The other end of the arm 511 is connected to the fixed portion 58, and the other end of the arm 512 is connected to the vibrating body 59. In the spring 5 having such a configuration, the arms 511 and 512 elastically deform in the X-axis direction, whereby the vibrating body 59 is displaced in the X-axis direction with respect to the fixed portion 58. The number of arms 51 is not particularly limited, and may be one or three or more.

  The separation distance D3 between the adjacent arms 511 and 512 is not particularly limited, but is preferably, for example, 5 μm or more and 20 μm or less. Thereby, the excessive enlargement of the spring 5 can be suppressed. In addition, a space that allows deformation of the arms 511 and 512 can be sufficiently secured, and contact between the arms 511 and 512 can be effectively suppressed.

  Further, as shown in FIG. 7, the arm 51 has an isosceles trapezoidal cross-sectional shape. That is, the cross sectional shape of the arm 51 is symmetrical with respect to a straight line L passing through the middle point of the upper side 51a (the side on the plus side in the Z-axis direction) and the lower side 51b (the side on the plus side in the Z-axis direction). ing. Thereby, the arm 51 substantially does not include the vibration component in the Z-axis direction, and unnecessary vibration in the drive vibration mode, that is, vibration in the Z-axis direction of the movable detection electrode 441A can be suppressed. Here, even if it is called an isosceles trapezoid, for example, when the height T of the arm 51 is about 50 μm and the width W 1 of the upper side 51 a is about 2.0 μm to 2.5 μm, the lower side 51 b The width W2 is an isosceles trapezoid which can be regarded as substantially rectangular (rectangular) with a width W2 of about 2.5 μm to about 3.0 μm (exaggerated in the figure for convenience of the description).

  The cross sectional shape of the arm 51 is not particularly limited. For example, as shown in FIG. 8, it may be an isosceles trapezoid vertically reversed from that of the present embodiment, and as shown in FIG. It may have a barrel shape having a tapered portion 51 ′ whose width gradually increases downward and a tapered portion 51 ′ ′ located on the lower side of the tapered portion 51 ′ and whose width gradually decreases from the upper side to the lower side 10 may be rectangular as shown in Fig. 10. The cross sectional shape of the arm 51 is easily influenced by the environment of dry etching, and often becomes any of the shapes described above.

  Further, as shown in FIG. 6, the spring 5 further has a protective beam 53 positioned on one side of each arm 51 in the X-axis direction. Specifically, the protective beam 531 (53) is disposed on the positive side in the X axis direction of the arm 511 and between the arms 511 and 512, and the protective beam 532 on the positive side in the X axis direction of the arm 512. (53) is arranged. The protective beams 531 and 532 extend along the Y-axis direction so as to be parallel to the arms 511 and 512, respectively. The width (length in the X-axis direction) of the protective beams 531 and 532 is not particularly limited, but can be, for example, 2 μm or more and 5 μm or less. As a result, the protective beams 531 and 532 become thinner while sufficiently securing the mechanical strength of the protective beams 531 and 532. The protective beams 531 and 532 are each connected to the connecting portion 52 at one end.

  By providing such a protective beam 53, when the arm 51 elastically deforms excessively, the arm 51 collides with another portion via the protective beam 53, so that the shock is absorbed and mitigated by the protective beam 53. It is possible to reduce an excessive impact on the 51. Therefore, breakage of the arm 51 can be effectively suppressed. Further, when the arm 51 contacts the protective beam 53, the elastic deformation of the arm 51 is further suppressed, and the excessive elastic deformation of the arm 51 can also be suppressed.

  In particular, in the present embodiment, the protective beam 531 is disposed between the adjacent arms 511 and 512. Therefore, when the arms 511 and 512 are excessively deformed, they will be in contact with each other via the protective beam 531, and the impact can be suppressed to a smaller level than in the case where the arms 511 and 512 are in direct contact. Since the arms 511 and 512 have low mechanical strength and are easily damaged, the protection beam 531 is disposed to prevent the arms 511 and 512 from coming into direct contact, thereby providing a spring 5 having high mechanical strength. It becomes.

  Here, the relationship between the separation distance D1 between the arm 511 and the protection beam 531 and the separation distance D2 between the arm 512 and the protection beam 531 is not particularly limited, but preferably D1 ≠ D2, and D1 <D1. It is preferable that it is D2. By setting D1 ≠ D2, when the arms 511 and 512 are elastically deformed excessively as described above, simultaneous contact from both sides of the protection beam 531 can be suppressed. Therefore, the protective beam 531 elastically deforms at the time of contact with the arm 511 and at the time of contact with the arm 512, and the impact at the time of contact can be effectively absorbed and mitigated.

  Further, as described above, the protection beams 531 and 532 are connected to the connection portion 52, respectively. The connecting portion 52 is a portion which hardly affects the characteristics of the spring 5 as compared with the arms 511 and 512. Therefore, by connecting the protective beams 531 and 532 to the connection portion 52, the fluctuation of the characteristics of the spring 5 can be effectively suppressed. Further, the design of the entire spring 5 including the protective beams 531 and 532 is easier than, for example, the case where the protective beam 53 is connected to the arm 51.

  Such a protective beam 53 can also exhibit the following effects in the process of manufacturing the spring 5. In addition, for convenience of explanation, the effect of the protective beam 53 described above is also referred to as “the effect on the structure”, and the effect of the protective beam 53 described below is also referred to as “the effect on the manufacturing method”.

  First, a method of manufacturing the spring 5 will be briefly described. The spring 5 is formed by forming a hard mask HM on the upper surface of the silicon substrate 50 as shown in FIG. 11, and dry etching the silicon substrate 50 through the hard mask HM as shown in FIG. Can. As dry etching, a dry Bosch (Bosch) method in which an etching process using a reactive plasma gas is combined with a deposition process can be used.

  The processing of the silicon substrate 50 by reactive plasma gas introduces an etching gas into a chamber in which the silicon substrate 50 is disposed to generate reactive plasma, but the reactive plasma has a density concentric with the silicon substrate 50. Because of the distribution, the incident angle differs depending on the position in the chamber. Therefore, distribution occurs in the vertical processing accuracy in the silicon substrate 50. Specifically, in the central portion of the chamber, the etching proceeds substantially perpendicularly to the silicon substrate 50, so the cross-sectional shape of the arm 51 is an isosceles trapezoid. On the other hand, at the edge of the chamber, the etching proceeds in a direction inclined with respect to the silicon substrate 50, so the cross-sectional shape of the arm 51 is a trapezoid inclined from the isosceles trapezoid. The degree of inclination tends to increase from the center to the edge of the chamber.

  When the cross sectional shape of the arm 51 is inclined from the isosceles trapezoid, the arm 51 includes the vibration component in the Z-axis direction in addition to the vibration component in the X-axis direction, so the element unit 4 is vibrated in the driving vibration mode. At this time, the movable detection electrodes 441A and 441B vibrate in the Z-axis direction. Then, although the angular velocity ωy is not applied to the physical quantity sensor 1, the capacitances Ca and Cb change. Therefore, a quadrature signal (noise signal) is generated, and the detection accuracy of the angular velocity ωy is deteriorated. In the following, the vibration (in particular, the vibration in the Z-axis direction) other than the X-axis direction of the movable detection electrodes 441A and 441B in the drive vibration mode is also referred to as a quadrature.

  The physical quantity sensor 1 arranges a protective beam 53 next to the arm 51 in order to eliminate such a problem (the occurrence of quadrature). That is, the protective beam 53 has a function of suppressing the cross-sectional shape of the arm 51 from being broken from the isosceles trapezoid. Here, in dry etching, as the separation distance between adjacent structures (portions remaining after dry etching) is smaller, the inclination of the side surface tends to be larger. It is considered that this is because as the distance between adjacent structures is smaller, as the etching progresses, the reactive gas is less likely to enter between the adjacent structures, and the etching rate is lowered. By using such a property, by adjusting the separation distance D1 between the arm 51 and the protective beam 53, the inclination angle θ1 of the side surface 51c of the arm 51 on the protective beam 53 side can be adjusted. Therefore, for the arm 51 whose cross-sectional shape is assumed to be inclined from the isosceles trapezoid as a result of dry etching, the protective beam 53 is disposed next to the arm 51 and the arm 51 according to the assumed degree of inclination. By adjusting the separation distance D1 with the protective beam 53, the cross-sectional shape of the arm 51 after dry etching can be made approximately isosceles trapezoidal.

  Specifically, as shown in FIG. 13, when the protective beam 53 is not disposed, the cross sectional shape of the arm 51 is inclined from the isosceles trapezoid. As shown in FIG. 53 is disposed at a predetermined separation distance D1, and the cross-sectional shape of the arm 51 is made equal by making the inclination angle θ1 of the side surface 51c on the protection beam 53 side of the arm 51 equal to the inclination angle θ2 of the opposite side surface 51d. It can be an isosceles trapezoid. Therefore, the physical quantity sensor 1 in which the quadrature is effectively suppressed can be obtained. The separation distance D1 is not particularly limited, but is preferably, for example, about 0.1 μm or more and 2 μm or less. This makes it easy to adjust the inclination angle θ1. If the separation distance D1 is less than 0.1 μm, it becomes too difficult for the reactive gas to infiltrate, and depending on the thickness and the like of the silicon substrate 50, etching defects may occur. On the other hand, if it exceeds 2 μm, the adjustment effect of the inclination angle θ1 is saturated (that is, the inclination angle θ1 hardly changes even if the separated distance D1 is further increased), and merely the enlargement of the spring 5 is caused. There is a risk of

  As described above, depending on where in the chamber the inclination of the cross-sectional shape of the arm 51 from the isosceles trapezoid differs, for example, a predetermined area (for example, a central portion in the chamber, an edge) It is preferable to set the separation distance D1 for each arm 51 and arrange the protective beam 53 every part). Further, for example, in the arm 51 located at the central portion in the chamber, since it is difficult to cause a deviation from the isosceles trapezoidal cross-sectional shape, the protection beam 53 may not be arranged next to such an arm 51 .

  In the above, the “effect on manufacturing method” of the protective beam 53 has been described. In addition, although it is preferable that the protection beam 53 can exhibit both "the effect on a structure" and "the effect on a manufacturing method", only one of these can be exhibited, It is also good.

  Next, drive springs 43A and 43B, detection springs 46A and 46B, and connection springs 40A and 40B of this embodiment to which such a spring 5 is applied will be described.

  First, the drive spring 43A 'in FIG. 3 will be described as a representative of the four drive springs 43A. As shown in FIG. 15, the drive spring 43A ′ extends in the Y-axis direction, and includes two arms 511 and 512 arranged in the X-axis direction, and the Y-axis of these two arms 511 and 512. A connection portion 521 connecting the end portions on the positive direction side and a connection portion 522 connecting the end portion on the negative side in the Y-axis direction of the arm 512 and the movable drive electrode 411A are included.

  In addition, the drive spring 43A ′ has a protection beam 531 disposed adjacent to the X axis direction plus side of the arm 511 and a protection beam 532 disposed adjacent to the X axis direction plus side of the arm 512. doing. The protective beam 531 has its end on the positive side in the Y-axis direction connected to the connecting portion 521, and the protective beam 532 has its end on the negative side in the Y-axis direction connected to the connecting portion 522. According to such a configuration, the shift of the cross sectional shape of the arm 511 can be suppressed by the protective beam 531, and the shift of the cross sectional shape of the arm 512 can be suppressed by the protective beam 532.

  Next, the drive spring 43B 'in FIG. 3 will be described as a representative of the four drive springs 43B. As shown in FIG. 16, the drive spring 43B 'extends in the Y-axis direction, and includes two arms 511 and 512 arranged side by side in the X-axis direction, and the Y-axis of the two arms 511 and 512. A connection portion 521 connecting the end portions on the positive direction side and a connection portion 522 connecting the end portion on the negative side in the Y-axis direction of the arm 512 and the movable drive electrode 411B are included.

  In addition, the drive spring 43B ′ has a protection beam 531 disposed adjacent to the X axis direction plus side of the arm 511, and a protection beam 532 disposed adjacent to the X axis direction plus side of the arm 512. doing. The protective beam 531 is connected at the negative end in the Y-axis direction to the fixing portion 42B, and the protective beam 532 is connected at the positive end in the Y-axis direction to the connecting portion 521. According to such a configuration, the shift of the cross sectional shape of the arm 511 can be suppressed by the protective beam 531, and the shift of the cross sectional shape of the arm 512 can be suppressed by the protective beam 532.

  Next, the detection spring 46A 'in FIG. 3 will be described on behalf of the four detection springs 46A. As shown in FIG. 17, the detection spring 46A ′ extends in the Y-axis direction, and is provided with four arms 511, 512, 513, 514 arranged side by side in the X-axis direction, and the Y-axis direction minus of the arm 511. A connecting portion 521 connecting the end of the side and the fixing portion 451, a connecting portion 522 connecting the ends of the arms 511 and 512 on the plus side of the Y axis direction, and the minus side of the arms 512 and 513 in the Y axis direction A connection 523 for connecting the ends, a connection 524 for connecting the ends of the arms 513 and 514 on the positive side in the Y-axis direction, an end on the negative side in the Y-axis direction of the arm 514, and the movable detection electrode 441A And an arm 55 for connecting the

  In addition, the detection spring 46A ′ includes a protection beam 531 disposed adjacent to the X axis direction plus side of the arm 511, a protection beam 532 disposed adjacent to the X axis direction plus side of the arm 512, and the arm 513. The protection beam 533 is disposed adjacent to the X axis direction plus side, and the protection beam 534 disposed adjacent to the X axis direction plus side of the arm 514. The protective beam 531 is connected at its Y-axis direction positive end to the connecting portion 522, and the protective beam 532 is connected at the negative Y-axis direction end to the connecting portion 523. In each of the terminals 534, the end on the plus side in the Y-axis direction is connected to the connection 524.

  According to such a configuration, the shift of the cross sectional shape of the arm 511 can be suppressed by the protective beam 531, the shift of the cross sectional shape of the arm 512 can be suppressed by the protective beam 532, and the cross section of the arm 513 by the protective beam 533 The protective beam 534 can suppress the displacement of the cross sectional shape of the arm 514.

  Next, the detection spring 46B 'in FIG. 3 will be described on behalf of the four detection springs 46B. As shown in FIG. 17, the detection spring 46B ′ extends in the Y-axis direction, and is provided with four arms 511, 512, 513, and 514 arranged in the X-axis direction, and the Y-axis direction minus of the arm 511. A connecting portion 521 connecting the end of the side and the fixing portion 451, a connecting portion 522 connecting the ends of the arms 511 and 512 on the plus side of the Y axis direction, and the minus side of the arms 512 and 513 in the Y axis direction A connection portion 523 for connecting the end portions, a connection portion 524 for connecting the end portions of the arms 513 and 514 on the positive Y-axis direction side, an end portion on the negative Y-axis direction of the arm 514 and the movable detection electrode 441B And an arm 55 for connecting the

  Further, the detection spring 46 B ′ includes a protection beam 531 disposed adjacent to the X axis direction plus side of the arm 511, a protection beam 532 disposed adjacent to the X axis direction plus side of the arm 512, and the arm 513. The protection beam 533 is disposed adjacent to the X axis direction plus side, and the protection beam 534 disposed adjacent to the X axis direction plus side of the arm 514. The protective beam 531 has its negative end connected to the connecting portion 521, the protective beam 532 has its positive end connected to the connecting portion 522, and the protective beam 533 has The Y axis direction minus side end is connected to the connecting portion 523, and the Y axis direction plus side end of the protective beam 534 is connected to the connecting portion 524.

  According to such a configuration, the shift of the cross sectional shape of the arm 511 can be suppressed by the protective beam 531, the shift of the cross sectional shape of the arm 512 can be suppressed by the protective beam 532, and the cross section of the arm 513 by the protective beam 533 The protective beam 534 can suppress the displacement of the cross sectional shape of the arm 514.

  Next, the connection spring 40A will be described. As shown in FIG. 18, the connection spring 40A has a first portion 40A ′ and a second portion 40A ′ ′. The first portion 40A ′ extends in the Y-axis direction and is aligned in the X-axis direction. Of the three arms 511, 512, and 513 arranged in the Y direction of the Y axis direction of the arm 511 and the frame 48, and the ends of the arms 511 and 512 in the Y direction of the Y axis direction It has connecting part 522 which connects parts, and connecting part 523 which connects end parts on the Y axis direction plus side of arms 512 and 513. Moreover, 2nd part 40A ′ ′ is in the Y axis direction. Extending in the X-axis direction, a connecting portion 524 connecting the end of the arm 514 on the Y-axis direction negative side and the frame 48, and an arm 514 , 515 Y-axis direction plus side end same A connecting portion 525 for connecting, and a connecting portion 526 for connecting the ends of the Y-axis minus direction side of the arm 515 and 516, a. Further, the connection spring 40A has a connection portion 57 for connecting the distal end portions of the arms 513 and 516 and the movable detection electrode 441A.

  Further, the first portion 40A ′ includes a protection beam 531 disposed adjacent to the X axis direction plus side of the arm 511, a protection beam 532 disposed adjacent to the X axis direction plus side of the arm 512, and the arm And a protective beam 533 disposed adjacent to the positive side in the X-axis direction of 513. The protective beam 531 is connected at the negative end in the Y-axis direction to the connecting portion 522, and the protective beams 532 and 533 are connected at the positive end in the Y-axis direction to the connecting portion 523. There is.

  Further, the second portion 40A ′ ′ includes a protection beam 534 disposed adjacent to the X axis direction plus side of the arm 514, a protection beam 535 disposed adjacent to the X axis direction plus side of the arm 515, and the arm The protective beam 536 is disposed adjacent to the positive side of the X axis direction 516. The protective beam 534 is connected to the connecting portion 525 by the end on the positive side in the Y axis direction to protect the protective beam 534. The beams 535 and 536 are connected to the connecting portion 526 at the negative end in the Y-axis direction.

  According to such a configuration, the shift of the cross sectional shape of the arm 511 can be suppressed by the protective beam 531, the shift of the cross sectional shape of the arm 512 can be suppressed by the protective beam 532, and the cross section of the arm 513 by the protective beam 533 Displacement of the cross section of the arm 514 can be suppressed by the protection beam 534, deviation of the cross section of the arm 515 can be suppressed by the protection beam 535, and displacement of the cross section of the arm 516 by the protection beam 536 Can be suppressed.

  Next, the connection spring 40B will be described. As shown in FIG. 18, the connection spring 40B has a first portion 40B ′ and a second portion 40B ′ ′. The first portion 40B ′ extends in the Y axis direction and is aligned in the X axis direction. Of the three arms 511, 512, and 513 arranged in the Y direction of the Y axis direction of the arm 511 and the frame 48, and the ends of the arms 511 and 512 in the Y direction of the Y axis direction It has connecting part 522 which connects parts, and connecting part 523 which connects the end parts on the Y axis direction plus side of arms 512 and 513. Moreover, the second part 40B ′ ′ is in the Y axis direction. Extending in the X-axis direction, a connecting portion 524 connecting the end of the arm 514 on the Y-axis direction negative side and the frame 48, and an arm 514 , 515 Y-axis direction plus side end same A connecting portion 525 for connecting, and a connecting portion 526 for connecting the ends of the Y-axis minus direction side of the arm 515 and 516, a. Further, the connection spring 40B has a connection portion 57 for connecting the distal end portions of the arms 513 and 516 and the movable detection electrode 441B.

  Further, the first portion 40B ′ includes a protection beam 531 disposed adjacent to the X axis direction plus side of the arm 511, a protection beam 532 disposed adjacent to the X axis direction plus side of the arm 512, and the arm And a protective beam 533 disposed adjacent to the positive side in the X-axis direction of 513. The protective beam 531 has its end on the positive side in the Y-axis direction connected to the connecting portion 521, and the protective beam 532 has its end on the negative side in the Y-axis direction connected to the connecting portion 522, and the protective beam 533 has The end on the plus side in the Y-axis direction is connected to the connection portion 523.

  Further, the second portion 40B ′ ′ includes a protection beam 534 disposed adjacent to the X axis direction plus side of the arm 514, a protection beam 535 disposed adjacent to the X axis direction plus side of the arm 515, and the arm And a protective beam 536 disposed adjacent to the positive side in the X-axis direction of the optical axis 516. The protective beam 534 is connected to the connecting portion 524 at the negative end side in the Y-axis direction to protect the protective beam 534. The end of the beam 535 on the positive side in the Y-axis direction is connected to the connecting portion 525, and the end on the negative side in the Y-axis direction of the protective beam 536 is connected to the connecting portion 526.

  According to such a configuration, the shift of the cross sectional shape of the arm 511 can be suppressed by the protective beam 531, the shift of the cross sectional shape of the arm 512 can be suppressed by the protective beam 532, and the cross section of the arm 513 by the protective beam 533 Displacement of the cross section of the arm 514 can be suppressed by the protection beam 534, deviation of the cross section of the arm 515 can be suppressed by the protection beam 535, and displacement of the cross section of the arm 516 by the protection beam 536 Can be suppressed.

  The drive springs 43A and 43B, the detection springs 46A and 46B, and the connection springs 40A and 40B of the present embodiment to which the spring 5 is applied have been described above, but the configuration thereof is not particularly limited. It is sufficient to have the arm 51 of the above and one protection beam 53 corresponding thereto. In addition, at least one of the drive springs 43A and 43B, the detection springs 46A and 46B, and the connection springs 40A and 40B may not have the protective beam 53. Incidentally, it is the detection springs 46A and 46B that the displacement of the cross-sectional shape most affects the quadrature, the drive springs 43A and 43B that affect next, and the connection springs 40A and 40B that are the most difficult to affect . Therefore, for example, the configuration of the spring 5 having the protective beam 53 may be applied to the detection springs 46A and 46B and the drive springs 43A and 43B, and the protective beam 53 may not be provided to the connection springs 40A and 40B.

  The physical quantity sensor 1 has been described above. Such a physical quantity sensor 1 includes the movable body 4A, 4B (oscillator) and the spring 5 (drive spring 43A, 43B, detection spring) that vibratably supports the movable body 4A, 4B in the X-axis direction (first direction). 46A, 46A and connecting springs 40A, 40B). Further, the spring 5 is adjacent to one side of the arm 51 extending in the Y-axis direction (second direction) orthogonal to the X-axis direction (first direction) with respect to the arm 51 in the X-axis direction. And a protective beam 53 extending along the Y-axis direction. According to such a configuration, as described above, the cross-sectional shape of the arm 51 can be controlled by the protective beam 53, and the physical quantity sensor 1 in which the quadrature is effectively suppressed can be obtained. Further, the protection beam 53 can prevent the arm 51 from directly contacting other parts, and can effectively suppress the breakage of the arm 51. In the present embodiment, the protective beam 53 is positioned on the positive side in the X-axis direction with respect to the target arm 51, but the present invention is not limited thereto. The protective beam 53 on the negative side in the X-axis direction with respect to the arm 51 May be located, and may be appropriately selected according to the conditions of dry etching and the like.

  In particular, in the present embodiment, the spring 5 has a plurality of arms 51 arranged side by side in the X-axis direction, and the protective beam 53 is arranged between a pair of adjacent arms 51. According to such a configuration, direct contact between the arms 51 can be prevented. Moreover, the impact at the time of contact can also be relieved by the protection beam 53. Therefore, breakage of the arm 51 can be effectively suppressed.

  Further, as described above, in the physical quantity sensor 1 of the present embodiment, the spring 5 has the connecting portion 52 that connects the pair of adjacent arms 51. The protective beam 53 is connected to the connection portion 52. The connecting portion 52 is a portion which is less likely to affect the characteristics of the spring 5 than the arm 51. Therefore, by connecting the protective beam 53 to the connection portion 52, the fluctuation of the characteristics of the spring 5 can be effectively suppressed. Further, the design of the entire spring 5 including the protective beam 53 is easier than when the protective beam 53 is connected to the arm 51.

  Further, as described above, in the physical quantity sensor 1 of this embodiment, the separation distance D1 between one of the pair of arms 511 and 512 adjacent to each other (arm 511) and the protective beam 531, the other (arm 512) and the protective beam 531 And the separation distance D2 are different. In this embodiment, D1 <D2. Thereby, the arm 511 and the protection beam 531 can be sufficiently approached while sufficiently separating the distance between the arms 511 and 512 from each other. Therefore, while being able to suppress the contact of the arms 511 and 512 at the time of a drive, the cross-sectional shape of the arm 511 can be controlled more effectively.

  Next, a method of manufacturing the physical quantity sensor 1 will be described. As shown in FIG. 19, in the method of manufacturing the physical quantity sensor 1, a preparation step S 1 of preparing the glass substrate 20 which is a base material of the substrate 2, and bonding a silicon substrate 40 which is a base material of the element portion 4 to the glass substrate 20. Bonding step S2, mask formation step S3 of forming hard mask HM on the upper surface of silicon substrate 40, and element portion formation step S4 of dry etching the silicon substrate 40 through hard mask HM to form element portion 4 A lid bonding step S5 of bonding the silicon substrate 30 as a base material of the lid 3 to the glass substrate 20 and a singulation step S6 of the plurality of physical quantity sensors 1 are included. The respective steps will be sequentially described below.

[Preparation step S1]
First, a glass substrate 20 to be a base material of the substrate 2 is prepared. Next, the recess 21, the mount 22 (221, 222, 224, 225) and the grooves 23, 24, 25, 26, 27, 28 are formed in the glass substrate 20. These can be formed, for example, by wet etching. In the glass substrate 20, a plurality of singulation areas Q that will be singulated later and become one substrate 2 are provided in a matrix, and for each of the singulation areas Q, the recess 21 and the mount 22 are provided. And the grooves 23, 24, 25, 26, 27, 28 are formed. Next, the wirings 73, 74, 75, 76, 77, 78 are formed for each of the singulated regions Q.

[Bonding process S2]
As shown in FIG. 20, a silicon substrate 40 to be a base material of the element portion 4 is prepared, and the silicon substrate 40 is bonded to the glass substrate 20. It does not specifically limit as a joining method of the silicon substrate 40 and the glass substrate 20, For example, it can join by the anodic bonding method. Next, after thinning the silicon substrate 40 using CMP (chemical mechanical polishing) as necessary, the silicon substrate 40 is doped (diffused) with an impurity such as phosphorus, boron, or arsenic to impart conductivity.

[Mask forming step S3]
Next, as shown in FIG. 21, a hard mask HM having dry etching resistance is formed on the upper surface of the silicon substrate 40 so as to correspond to the shape of the element portion 4. For example, it can be formed by patterning a silicon oxide film formed by thermally oxidizing the surface of the silicon substrate 40. Here, as described above, since the displacement in the cross-sectional shape of the arm 51 occurs depending on the position in the silicon substrate 40, the arm 51 and the protection beam 53 for each element unit 4 do not generate the displacement. The separation distance D1 is set, and the hard mask HM is formed to be the set separation distance D1. The separation distance D1 may be set, for example, in a relatively wide area including a plurality of element portions 4 such as a center portion in the chamber and an edge portion, or a relatively narrow area such as each element portion 4 It may be set for each area, may be set for each narrower area such as every spring 5, or may be set for each narrower area such as every arm 51. Further, the arm 51 located at the central portion in the chamber may have a mask shape such that the protective beam 53 is not formed next to the arm 51 in the portion, since no deviation occurs in the cross sectional shape.

[Element part formation process S4]
Next, the silicon substrate 40 is dry etched through the hard mask HM. The dry etching method is not particularly limited, but in the present embodiment, a dry Bosch (Bosch) method in which an etching process using a reactive plasma gas and a deposition (deposition) process are combined is used. Thereby, as shown in FIG. 22, a plurality of element units 4 are formed for each singulated area Q. As described above, since the separation distance D1 is set for each of the element units 4 according to the position in the silicon substrate 40, an arm having a desired (isosceles trapezoidal) cross-sectional shape in each element unit 4 51 can be formed.

Lid bonding step S5
Next, a silicon substrate 30 to be a base material of the lid 3 is prepared, and the silicon substrate 30 is patterned using a photolithographic technique and an etching technique to form a recess 31 for each singulated region Q. Next, as shown in FIG. 23, the silicon substrate 30 is bonded to the glass substrate 20 through the glass frit 39. Thereby, storage space S which stores element part 4 is formed for every division area. Next, after the inside of the storage space S is made into a desired atmosphere via the communication hole 32, the communication hole 32 is sealed by the sealing member 33. Thereby, the laminated body 10 in which the several physical quantity sensor 1 was integrally formed is obtained.

[Separating step S6]
Next, for example, the stacked body 10 is singulated for each singulation area Q using a dicing blade or the like. Thereby, as shown in FIG. 24, a plurality of physical quantity sensors 1 are formed at once.

  The method of manufacturing the physical quantity sensor 1 has been described above. In the method of manufacturing such a physical quantity sensor 1, as described above, the mask forming step S3 of forming the hard mask HM (mask) on the silicon substrate 40 (substrate) and the dry etching of the silicon substrate 40 via the hard mask HM. And the element portion forming step S4 of forming the element portion 4 from the silicon substrate 40. The element portion 4 obtained in the element portion forming step S4 includes the movable bodies 4A and 4B, and the spring 5 for supporting the movable bodies 4A and 4B so as to be able to vibrate in the X-axis direction. Furthermore, the spring 5 is disposed adjacent to one side of the arm 51 extending in the Y-axis direction (second direction) orthogonal to the X-axis direction with respect to the arm 51, the Y-axis And a protective beam 53 extending along the direction. According to such a manufacturing method, the cross-sectional shape of the arm 51 can be controlled by the protective beam 53, and the physical quantity sensor 1 in which the quadrature is effectively suppressed can be manufactured. Further, the protection beam 53 can prevent the arm 51 from coming into direct contact with other parts, and the breakage of the arm 51 can be effectively suppressed. Therefore, the physical quantity sensor 1 with high mechanical strength can be obtained.

  Further, as described above, in the element portion forming step S4, the plurality of element portions 4 are formed from the silicon substrate 40. Further, in at least two element units 4, the separation distance D1 between the arm 51 and the protective beam 53 is different. Thereby, the cross-sectional shape of the arm 51 of each element unit 4 can be made into a desired shape without being influenced by the position in the silicon substrate 40.

Second Embodiment
Next, a physical quantity sensor according to a second embodiment of the present invention will be described.

  FIG. 25 is a plan view showing a spring included in the physical quantity sensor according to the second embodiment of the present invention.

  The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above except that the configuration of the spring 5 is different.

  In the following description, the physical quantity sensor according to the second embodiment will be described focusing on differences from the first embodiment described above, and the description of the same matters will be omitted. Further, in FIG. 25, the same components as those of the embodiment described above are denoted by the same reference numerals.

  As shown in FIG. 25, in the spring 5 of the present embodiment, a plurality of protection beams 53 are disposed for one arm 51, and the plurality of protection beams 53 are disposed along the Y-axis direction. In the present embodiment, two protection beams 53 are disposed along the Y-axis direction. The one protective beam 53 is connected to the connecting portion 521 (52) connected to one end of the arm 51, and the other protective beam 53 is connected to the other end of the arm 51. Connected to (52). According to such a configuration, the protective beam 53 can be shortened as compared with the first embodiment described above, and the mechanical strength of the protective beam 53 is improved accordingly. Further, one protective beam 53 is displaced together with the connecting portion 521, and the other protective beam 53 is displaced together with the connecting portion 522. Therefore, the two protection beams 53 are displaced independently with the elastic deformation of the arm 51, and the contact between the protection beam 53 and the arm 51 can be effectively suppressed in the drive vibration mode.

  As described above, in the spring 5 of the present embodiment, a plurality of protection beams 53 are disposed along the Y-axis direction. Thereby, the protective beam 53 can be shortened as compared with the first embodiment described above, and the mechanical strength of the protective beam 53 is improved accordingly. In particular, in the present embodiment, two protection beams 53 are disposed along the Y-axis direction. As described above, by using two protection beams 53, one can be connected to the connection portion 521, and the other can be connected to the connection portion 522. That is, all the protection beams 53 can be connected to the connection portion 52. Therefore, as described in the first embodiment described above, the fluctuation of the characteristics of the spring 5 can be effectively suppressed, and the design of the entire spring 5 becomes easy.

  Also by such a second embodiment, the same effect as that of the first embodiment described above can be exhibited. In addition, three or more protection beams 53 may be disposed along the Y-axis direction (for example, see the third embodiment described later).

Third Embodiment
Next, a physical quantity sensor according to a third embodiment of the present invention will be described.

  FIG. 26 is a plan view showing a spring included in the physical quantity sensor according to the third embodiment of the present invention.

  The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above except that the configuration of the spring 5 is different.

  In the following description, the physical quantity sensor of the third embodiment will be described focusing on differences from the first embodiment described above, and the description of the same matters will be omitted. Further, in FIG. 28, the same components as those in the above-described embodiment are denoted by the same reference numerals.

  As shown in FIG. 26, in the spring 5 of this embodiment, a plurality of protection beams 53 are disposed for one arm 51, and the plurality of protection beams 53 are disposed along the Y-axis direction. In the present embodiment, four protection beams 53 are disposed along the Y-axis direction. Each protective beam 53 is connected to the arm 51 via the connecting beam 54. According to such a configuration, the protective beam 53 can be shortened as compared with the first embodiment described above, and the mechanical strength of the protective beam 53 is improved accordingly. Further, since the protective beam 53 is connected to the arm 51, the protective beam 53 can be displaced together with the arm 51. Therefore, in the drive vibration mode, the contact between the protective beam 53 and the arm 51 can be effectively suppressed.

  As described above, in the spring 5 of the present embodiment, a plurality of protection beams 53 are disposed along the Y-axis direction. Thereby, the protective beam 53 can be shortened as compared with the first embodiment described above, and the mechanical strength of the protective beam 53 is improved accordingly. In particular, in the present embodiment, the protective beam 53 is connected to the arm 51. Therefore, the protective beam 53 can be displaced together with the arm 51, and an unintended contact between the protective beam 53 and the arm 51 can be effectively suppressed.

  Also by such a third embodiment, the same effect as that of the first embodiment described above can be exhibited.

Fourth Embodiment
Next, an inertial measurement device according to a fourth embodiment of the present invention will be described.

  FIG. 27 is an exploded perspective view of the inertial measurement device according to the fourth embodiment of the present invention. FIG. 28 is a perspective view of a substrate of the inertial measurement device shown in FIG.

  An inertial measurement device 2000 (IMU: Inertial Measurement Unit) shown in FIG. 27 is an inertial measurement device that detects the posture or behavior (inertial momentum) of a moving object (mounted device) such as a car or a robot. The inertial measurement device 2000 functions as a so-called six-axis motion sensor provided with a three-axis acceleration sensor and a three-axis angular velocity sensor.

  The inertial measurement device 2000 is a rectangular solid having a substantially square planar shape. In addition, screw holes 2110 as fixing portions are formed in the vicinity of two apexes located in the diagonal direction of the square. The inertial measurement device 2000 can be fixed to the mounting surface of a mounting object such as a car by passing two screws through the two screw holes 2110. In addition, it is also possible to miniaturize to a size that can be mounted on, for example, a smartphone or a digital camera, by selecting parts or changing the design.

  The inertial measurement device 2000 has an outer case 2100, a joining member 2200, and a sensor module 2300. The inside of the outer case 2100 has the joining member 2200 interposed therein, and the sensor module 2300 is inserted. There is. The sensor module 2300 also includes an inner case 2310 and a substrate 2320.

  The outer shape of the outer case 2100 is a rectangular solid having a substantially square planar shape, similar to the overall shape of the inertial measurement device 2000 described above, and screw holes 2110 are formed in the vicinity of two apexes located in the diagonal direction of the square. It is done. The outer case 2100 is box-shaped, and the sensor module 2300 is housed inside.

  The inner case 2310 is a member that supports the substrate 2320 and has a shape that fits inside the outer case 2100. Further, in the inner case 2310, a recess 2311 for preventing contact with the substrate 2320 and an opening 2312 for exposing a connector 2330 described later are formed. Such an inner case 2310 is joined to the outer case 2100 via a joining member 2200 (for example, a packing impregnated with an adhesive). A substrate 2320 is bonded to the lower surface of the inner case 2310 via an adhesive.

  As shown in FIG. 28, a connector 2330, an angular velocity sensor 2340z for detecting an angular velocity around the Z axis, an acceleration sensor 2350 for detecting an acceleration in each axial direction of the X axis, Y axis and Z axis, etc. Has been implemented. Further, on the side surface of the substrate 2320, an angular velocity sensor 2340x for detecting an angular velocity around the X axis and an angular velocity sensor 2340y for detecting an angular velocity around the Y axis are mounted. The angular velocity sensors 2340z, 2340x, and 2340y are not particularly limited, and, for example, vibration gyro sensors using Coriolis force can be used. In particular, the configuration of the embodiment described above can be used to detect the angular velocity in the Y-axis direction. Further, the acceleration sensor 2350 is not particularly limited, and, for example, a capacitive acceleration sensor can be used.

  Further, a control IC 2360 is mounted on the lower surface of the substrate 2320. The control IC 2360 is an MCU (Micro Controller Unit), incorporates a storage unit including a non-volatile memory, an A / D converter, and the like, and controls each unit of the inertial measurement device 2000. The storage unit stores a program that defines the order and content for detecting acceleration and angular velocity, a program that digitizes detection data and incorporates it into packet data, and accompanying data. A plurality of other electronic components are mounted on the substrate 2320.

  The inertial measurement device 2000 has been described above. Such an inertial measurement device 2000 includes angular velocity sensors 2340z, 2340x, 2340y and an acceleration sensor 2350 as physical quantity sensors, and a control IC 2360 (control circuit) for controlling driving of the respective sensors 2340z, 2340x, 2340y, 2350. It contains. Thereby, the effect of the physical quantity sensor of the present invention can be obtained, and a highly reliable inertial measurement device 2000 can be obtained.

Fifth Embodiment
Next, a mobile positioning device according to a fifth embodiment of the present invention will be described.

  FIG. 29 is a block diagram showing an entire system of a mobile positioning device according to a fifth embodiment of the present invention. FIG. 30 shows the operation of the mobile positioning device shown in FIG.

  A mobile body positioning device 3000 shown in FIG. 29 is a device mounted on a mobile body and used to position the mobile body. The moving body is not particularly limited, and may be a bicycle, a car (including a four-wheeled car and a motorcycle), a train, an airplane, a ship, etc., but in the present embodiment, it will be described as a four-wheeled car. The mobile positioning device 3000 includes an inertial measurement device 3100 (IMU), an arithmetic processing unit 3200, a GPS receiving unit 3300, a receiving antenna 3400, a position information obtaining unit 3500, a position combining unit 3600, and a processing unit 3700. , A communication unit 3800, and a display unit 3900. As the inertial measurement device 3100, for example, the above-described inertial measurement device 2000 can be used.

  Further, the inertial measurement device 3100 has a 3-axis acceleration sensor 3110 and a 3-axis angular velocity sensor 3120. Arithmetic processing unit 3200 receives acceleration data from acceleration sensor 3110 and angular velocity data from angular velocity sensor 3120, performs inertial navigation arithmetic processing on these data, and performs inertial navigation positioning data (data including acceleration and attitude of moving body) Output).

  Also, the GPS reception unit 3300 receives a signal from a GPS satellite (GPS carrier wave, satellite signal on which position information is superimposed) via the reception antenna 3400. The position information acquisition unit 3500 also outputs GPS positioning data representing the position (latitude, longitude, altitude), velocity, and direction of the mobile positioning device 3000 (mobile) based on the signal received by the GPS reception unit 3300. Do. The GPS positioning data also includes status data indicating a reception state, a reception time, and the like.

  The position synthesis unit 3600 determines the position of the moving object, specifically, the moving object on the ground, based on the inertial navigation positioning data output from the arithmetic processing unit 3200 and the GPS positioning data output from the position information acquisition unit 3500. Calculate if you are traveling in position. For example, even if the position of the moving object included in the GPS positioning data is the same, as shown in FIG. 30, if the posture of the moving object is different due to the influence of the inclination of the ground, the different position of the ground The moving body is traveling. Therefore, it is not possible to calculate the accurate position of the mobile using GPS positioning data alone. Therefore, the position synthesis unit 3600 calculates which position on the ground the moving body is traveling using the inertial navigation positioning data (in particular, data on the attitude of the moving body). Note that the determination can be made relatively easily by calculation using a trigonometric function (slope θ with respect to the vertical direction).

  The position data output from the position combining unit 3600 is subjected to predetermined processing by the processing unit 3700, and is displayed on the display unit 3900 as a positioning result. The position data may be transmitted to the external device by the communication unit 3800.

  The mobile positioning device 3000 has been described above. As described above, such a mobile positioning device 3000 includes the inertial measurement device 3100, the GPS receiving unit 3300 (receiving unit) for receiving the satellite signal on which the position information is superimposed from the positioning satellite, and the received satellite signal Based on the position information acquisition unit 3500 (acquisition unit) that acquires position information of the GPS reception unit 3300 and the inertial navigation positioning data (inertial data) output from the inertial measurement device 3100, It includes an arithmetic processing unit 3200 (arithmetic unit) to calculate, and a position synthesis unit 3600 (calculator) that calculates the position of the moving body by correcting the position information based on the calculated attitude. As a result, the effect of the inertial measurement device 3100 (2000) can be obtained, and a highly reliable mobile positioning device 3000 can be obtained.

Sixth Embodiment
Next, an electronic device according to a sixth embodiment of the present invention will be described.
FIG. 31 is a perspective view showing an electronic device according to a sixth embodiment of the present invention.

  A mobile (or notebook) personal computer 1100 shown in FIG. 31 is an application of the electronic device of the present invention. In this figure, the personal computer 1100 comprises a main unit 1104 having a keyboard 1102 and a display unit 1106 having a display unit 1108. The display unit 1106 is connected to the main unit 1104 via a hinge structure. It is rotatably supported.

  Such a personal computer 1100 incorporates the physical quantity sensor 1, the physical quantity sensor 1, and a control circuit 1110 (control unit) that performs control based on a detection signal output from the physical quantity sensor 1. The physical quantity sensor 1 is not particularly limited, but, for example, any one of the above-described embodiments can be used.

  Such a personal computer 1100 (electronic device) includes the physical quantity sensor 1 and a control circuit 1110 (control unit) that performs control based on a detection signal output from the physical quantity sensor 1. Therefore, the effects of the physical quantity sensor 1 described above can be obtained, and high reliability can be exhibited.

Seventh Embodiment
Next, an electronic device according to a seventh embodiment of the present invention will be described.
FIG. 32 is a perspective view showing an electronic device according to a seventh embodiment of the present invention.

  A mobile phone 1200 (including a PHS) shown in FIG. 32 is an application of the electronic device of the present invention. In this figure, the mobile phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is provided between the operation button 1202 and the earpiece 1204. It is arranged.

  Such a mobile phone 1200 incorporates the physical quantity sensor 1 and a control circuit 1210 (control unit) that performs control based on the detection signal output from the physical quantity sensor 1. The physical quantity sensor 1 is not particularly limited, but, for example, any one of the above-described embodiments can be used.

  Such a mobile phone 1200 (electronic device) includes the physical quantity sensor 1 and a control circuit 1210 (control unit) that performs control based on a detection signal output from the physical quantity sensor 1. Therefore, the effects of the physical quantity sensor 1 described above can be obtained, and high reliability can be exhibited.

Eighth Embodiment
Next, an electronic device according to an eighth embodiment of the present invention will be described.
FIG. 33 is a perspective view showing an electronic device according to an eighth embodiment of the present invention.

  The digital still camera 1300 shown in FIG. 33 is an application of the electronic device of the present invention. In this figure, a display unit 1310 is provided on the back of the case 1302, and is configured to perform display based on an image pickup signal from a CCD, and the display unit 1310 functions as a finder for displaying an object as an electronic image. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the rear side in the drawing) of the case 1302. Then, when the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the imaging signal of the CCD at that time is transferred and stored in the memory 1308.

  The digital still camera 1300 incorporates the physical quantity sensor 1 and a control circuit 1320 (control unit) that performs control based on the detection signal output from the physical quantity sensor 1. The physical quantity sensor 1 is not particularly limited, but, for example, any one of the above-described embodiments can be used.

  Such a digital still camera 1300 (electronic device) includes the physical quantity sensor 1 and a control circuit 1320 (control unit) that performs control based on a detection signal output from the physical quantity sensor 1. Therefore, the effects of the physical quantity sensor 1 described above can be obtained, and high reliability can be exhibited.

  The electronic device according to the present invention may be, for example, a smartphone, a tablet terminal, a watch (including a smart watch), an inkjet discharge, in addition to the personal computer and the mobile phone of the above-described embodiment and the digital still camera of the present embodiment. Devices (for example, inkjet printers), laptop personal computers, televisions, wearable terminals such as HMDs (head mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic organizers (including communication function included), electronics Dictionaries, calculators, electronic game devices, word processors, workstations, video phones, television monitors for crime prevention, electronic binoculars, POS terminals, medical devices (such as electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiogram measuring devices, ultrasound examinations Devices, electronic endoscopes), fish finders, various measuring devices, devices for mobile terminal base stations, instruments (for example, instruments of vehicles, aircraft, ships), flight simulators, network servers, etc. it can.

The Ninth Embodiment
Next, a portable electronic device according to a ninth embodiment of the present invention will be described.

  FIG. 34 is a plan view showing a portable electronic device according to a ninth embodiment of the present invention. FIG. 35 is a functional block diagram showing a schematic configuration of the portable electronic device shown in FIG.

  A wristwatch-type activity meter 1400 (active tracker) shown in FIG. 34 is a wrist device to which the portable electronic device of the present invention is applied. The activity meter 1400 is attached to a site (subject) such as the user's wrist by a band 1401. Further, the activity meter 1400 is equipped with a display portion 1402 of digital display, and is capable of wireless communication. The physical quantity sensor 1 according to the present invention described above is incorporated in the activity meter 1400 as an acceleration sensor 1408 that measures acceleration and an angular velocity sensor 1409 that measures angular velocity.

  The activity meter 1400 includes a case 1403 in which the physical quantity sensor 1 is accommodated, a processing unit 1410 which is accommodated in the case 1403 and processes output data from the physical quantity sensor 1, and a display unit 1402 which is accommodated in the case 1403. And a translucent cover 1404 closing the opening of the case 1403. In addition, a bezel 1405 is provided on the outside of the translucent cover 1404. A plurality of operation buttons 1406 and 1407 are provided on the side surface of the case 1403.

  As shown in FIG. 35, the acceleration sensor 1408 detects each acceleration in the directions of three axes intersecting (ideally orthogonal) with each other, and a signal (acceleration (acceleration according to the detected magnitude and direction of the three axis acceleration) Output signal). Further, the angular velocity sensor 1409 detects angular velocities in the directions of three axes intersecting (ideally orthogonal) with each other, and outputs a signal (angular velocity signal) according to the magnitude and direction of the detected three axial angular velocity. .

  In the liquid crystal display (LCD) constituting the display unit 1402, for example, position information using the GPS sensor 1411 or the geomagnetic sensor 1412, an acceleration sensor 1408 included in the movement amount or physical quantity sensor 1, an angular velocity according to various detection modes. The exercise information such as the amount of exercise using the sensor 1409 or the like, the biological information such as the pulse rate using the pulse sensor 1413 or the like, or the time information such as the current time is displayed. In addition, the environmental temperature using the temperature sensor 1414 can also be displayed.

  The communication unit 1415 performs various controls for establishing communication between the user terminal and an information terminal (not shown). The communication unit 1415 may be, for example, Bluetooth (registered trademark) (including BTLE: Bluetooth Low Energy), Wi-Fi (registered trademark) (Wireless Fidelity), Zigbee (registered trademark), NFC (Near field communication), ANT + (registered trademark) It is configured to include a transceiver corresponding to a short distance wireless communication standard such as a trademark, and a connector corresponding to a communication bus standard such as USB (Universal Serial Bus).

  The processing unit 1410 (processor) is configured of, for example, a micro processing unit (MPU), a digital signal processor (DSP), an application specific integrated circuit (ASIC), or the like. The processing unit 1410 executes various processes based on the program stored in the storage unit 1416 and the signals input from the operation unit 1417 (for example, operation buttons 1406 and 1407). The processing by the processing unit 1410 includes data processing for each output signal of the GPS sensor 1411, the geomagnetic sensor 1412, the pressure sensor 1418, the acceleration sensor 1408, the angular velocity sensor 1409, the pulse sensor 1413, the temperature sensor 1414, and the timer unit 1419, Display processing for displaying an image on the screen, sound output processing for outputting sound to the sound output unit 1420, communication processing for communicating with an information terminal via the communication unit 1415, power control processing for supplying power from the battery 1421 to each unit, etc. Is included.

Such an activity meter 1400 can have at least the following functions.
1. Distance: Measure the total distance from the start of measurement by high precision GPS function.
2. Pace: Displays the current running pace from the pace distance measurement.
3. Average Speed: Average Speed Calculates and displays the average speed from the start of driving to the present.
4. Elevation: Measure and display elevation by GPS function.
5. Stride: Measures and displays stride even in a tunnel where GPS radio waves do not reach.
6. Pitch: Measure and display the number of steps per minute.
7. Heart rate: The heart rate is measured and displayed by the pulse sensor.
8. Slope: Measure and display the slope of the ground during training or trail running in mountainous areas.
9. Auto lap: Automatic lap measurement is performed when running a certain distance or certain time set in advance.
10. Exercise calories burned: Display calories burned.
11. Number of steps: Display the total number of steps from the start of exercise.

  The activity meter 1400 (portable electronic device) includes a physical quantity sensor 1, a case 1403 in which the physical quantity sensor 1 is housed, and a case 1403, and a processing unit 1410 that processes output data from the physical quantity sensor 1. And a light transmitting cover 1404 closing the opening of the case 1403. Therefore, the effects of the physical quantity sensor 1 described above can be obtained, and high reliability can be exhibited.

  The activity meter 1400 can be widely applied to a running watch, a runner's watch, a runner's watch for multi sports such as a duathlon or a triathlon, an outdoor watch, and a satellite positioning system, for example, a GPS watch equipped with GPS.

  Also, although the above description has been made using the GPS (Global Positioning System) as a satellite positioning system, another Global Navigation Satellite System (GNSS) may be used. For example, one or more of satellite positioning systems such as EGNOS (European Geostationary-Satellite Navigation Overlay Service), QZSS (Quasi Zenith Satellite System), GLONASS (GLO Bal NAvigation Satellite System), GALILEO, BeiDou (BeiDou Navigation Satellite System), etc. You may use In addition, using at least one of the satellite positioning systems, the Satellite-based Augmentation System (SBAS) such as Wide Area Augmentation System (WAAS), European Geostationary-Satellite Navigation Overlay Service (EGNOS), etc. It is also good.

Tenth Embodiment
Next, a mobile unit according to a tenth embodiment of the present invention will be described.
FIG. 36 is a perspective view showing a mobile unit according to the tenth embodiment of the present invention.

  An automobile 1500 shown in FIG. 36 is an automobile to which the mobile unit of the present invention is applied. In this figure, a physical quantity sensor 1 is built in an automobile 1500, and the physical quantity sensor 1 can detect the posture of a vehicle body 1501. A detection signal of the physical quantity sensor 1 is supplied to a vehicle body posture control device 1502 (a posture control unit), and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and according to the detection result Control the brakes of the individual wheels 1503. Here, as the physical quantity sensor 1, for example, the same ones as those in the above-described embodiments can be used.

  Such an automobile 1500 (moving body) includes the physical quantity sensor 1 and a vehicle body posture control device 1502 (control unit) that performs control based on a detection signal output from the physical quantity sensor 1. Therefore, the effects of the physical quantity sensor 1 described above can be obtained, and high reliability can be exhibited.

  In addition, the physical quantity sensor 1 also includes car navigation systems, car air conditioners, antilock brake systems (ABS), airbags, tire pressure monitoring systems (TPMS: Tire Pressure Monitoring System), engine control, hybrid vehicles It can be widely applied to electronic control units (ECUs) such as battery monitors of electric vehicles and electric vehicles.

  Also, the moving body is not limited to the car 1500, and can be applied to, for example, airplanes, rockets, artificial satellites, ships, AGVs (unmanned transport vehicles), biped robots, unmanned airplanes such as drone etc. .

  The method for manufacturing the physical quantity sensor, the physical quantity sensor, the inertial measurement device, the mobile object positioning device, the portable electronic device, the electronic device, and the mobile object according to the present invention have been described above based on the illustrated embodiments. The configuration of each part is not limited, and may be replaced with any configuration having the same function. In addition, any other component may be added to the present invention. Also, the embodiments described above may be combined as appropriate.

  Further, in the embodiment described above, the physical quantity sensor that detects angular velocity has been described. However, the present invention is not limited to this, and for example, acceleration may be detected. In addition, both acceleration and angular velocity may be detected.

  DESCRIPTION OF SYMBOLS 1 ... Physical quantity sensor, 10 ... Laminated body, 2 ... Board | substrate, 20 ... Glass substrate, 21 ... Recess, 22, 221, 222, 224, 225 ... Mount, 23, 24, 25, 26, 27, 28 ... Groove part, 3 ... Lid body, 30 ... Silicon substrate, 31 ... Concave portion, 32 ... Communication hole, 33 ... Sealing member, 39 ... Glass frit, 4 ... Element part, 4A, 4B ... Movable body, 40 ... Silicon substrate, 40A, 40B ... Connection spring, 40A ′, 40B ′: first part, 40A ′ ′, 40B ′ ′, second part, 41A, 41B: drive part, 411A, 411B: movable drive electrode, 412A, 412B: fixed drive electrode, 42A, 42B: Fixed part, 43A, 43A ', 43B, 43B' ... drive spring, 44A, 44B ... detection part, 441A, 441B ... movable detection electrode, 451, 452 ... fixed part, 46A, 46A ', 46B, 6B '... detection spring, 47A, 47B ... beam, 48 ... frame, 481, 482 ... defect part, 488, 489 ... frame spring, 49A, 49B ... monitor part, 491A, 491B ... movable monitor electrode, 492A, 492B, 493A , 493B: fixed monitor electrode, 5: spring, 50: silicon substrate, 51, 511, 512, 513, 514, 515, 516: arm, 51 ′, 51 ′ ′: taper portion, 51a: upper side, 51b: lower side, 51c ... Side face, 51 d ... Side face, 52, 521, 522, 523, 524, 525 ... Connection part, 53, 531, 532, 533, 534, 535, 536 ... Protection beam, 54 ... Coupling beam, 55 ... Arm, Reference Signs List 57 connection part 58 fixed part 59 vibrator 73 73 74 75 76 77 78 wiring 81 81 fixed detection Polar, 1100 personal computer, 1102 keyboard, 1104 main unit, 1106 display unit, 1108 display unit, 1110 control circuit, 1200 mobile phone, 1202 operation button, 1204 earpiece, 1206 talk Reference numeral 1210 Display unit 1210 Control circuit 1300 Digital still camera 1302 Case 1304 Light receiving unit 1306 Shutter button 1308 Memory 1310 Display unit 1320 Control circuit 1400 Activity meter , 1401: display portion, 1403: case, 1404: translucent cover, 1405: bezel, 1406: operation button, 1407: operation button, 1408: acceleration sensor, 1409: angular velocity sensor, 1410: processing unit, 1411 ... GPS Sensor 1412 Geomagnetic sensor 1413 Pulse sensor 1414 Temperature sensor 1414 Communication unit 1416 Storage unit 1417 Operation unit 1418 Pressure sensor 1419 Timekeeping unit 1420 Sound output unit 1421 Battery, 1500: Car, 1501: Car body, 1502: Car body attitude control device, 1503: Wheel, 2000: Inertial measurement device, 2100: Outer case, 2110: Screw hole, 2200: Joint member, 2300: Sensor module, 2310: Inner Case, 2311 ... recessed portion, 2312 ... opening, 2320 ... substrate, 2330 ... connector, 2340x, 2340y, 2340z ... angular velocity sensor, 2350 ... acceleration sensor, 2360 ... control IC, 3000 ... moving body positioning device, 3100 ... inertial measurement device, 31 DESCRIPTION OF SYMBOLS 0 ... Acceleration sensor, 3120 ... Angular velocity sensor, 3200 ... Arithmetic processing part, 3300 ... GPS reception part, 3400 ... Reception antenna, 3500 ... Position information acquisition part, 3600 ... Position synthetic | combination part, 3700 ... Processing part, 3800 ... Communications part, 3900: display unit, A: arrow, D1, D2, D3: separation distance, HM: hard mask, O: center, P: electrode pad, Q: singulation area, S: storage space, T: height, V1 , V2 ... voltage, α ... virtual straight line, θ ... inclination, θ1, θ2 ... inclination angle, ωy ... angular velocity

Claims (13)

A mask forming step of forming a mask on the substrate;
An element portion forming step of forming an element portion from the substrate by dry etching the substrate through the mask;
The element unit is
A vibrating body,
And a spring for vibratably supporting the vibrator in a first direction,
The spring is
An arm extending along a second direction orthogonal to the first direction;
A method of manufacturing a physical quantity sensor, comprising: a protection beam disposed adjacent to one side of the first direction with respect to the arm and extending along the second direction. In the element portion forming step, a plurality of the element portions are formed from the substrate,
The manufacturing method of the physical quantity sensor according to claim 1, wherein the separation distance between the arm and the protective beam is different in at least two of the element units. A vibrating body,
And a spring for vibratably supporting the vibrator in a first direction,
The spring is
An arm extending along a second direction orthogonal to the first direction;
And a protective beam disposed adjacent to one side of the first direction with respect to the arm and extending along the second direction. The spring includes a plurality of the arms arranged side by side in the first direction,
The physical quantity sensor according to claim 3, wherein the protection beam is disposed between a pair of adjacent arms. The spring has a connecting portion that connects a pair of adjacent arms.
The physical quantity sensor according to claim 4, wherein the protective beam is connected to the connection portion.   The physical quantity sensor according to claim 3, wherein the protective beam is connected to the arm.   The physical quantity sensor according to any one of claims 3 to 6, wherein a plurality of the protection beams are arranged along the second direction.   The physical quantity sensor according to any one of claims 4 to 7, wherein a separation distance between one of the pair of adjacent arms and the protection beam and a separation distance between the other and the protection beam are different. A physical quantity sensor according to any one of claims 3 to 8,
And a control circuit that controls driving of the physical quantity sensor. An inertial measurement device according to claim 9;
A receiver for receiving a satellite signal on which position information is superimposed from a positioning satellite;
An acquisition unit that acquires position information of the reception unit based on the received satellite signal;
An arithmetic unit that calculates the attitude of the moving object based on the inertial data output from the inertial measurement device;
And a calculator configured to calculate the position of the mobile body by correcting the position information based on the calculated attitude. A physical quantity sensor according to any one of claims 3 to 8,
A case containing the physical quantity sensor;
A processing unit housed in the case and processing output data from the physical quantity sensor;
A display unit housed in the case;
And a translucent cover closing the opening of the case. A physical quantity sensor according to any one of claims 3 to 8,
And a control unit configured to perform control based on a detection signal output from the physical quantity sensor. A physical quantity sensor according to any one of claims 3 to 8,
And a control unit configured to perform control based on a detection signal output from the physical quantity sensor.

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