JP2019045168A - Physical quantity sensor, inertia measurement device, mobile object positioning device, electronic device, and mobile object - Google Patents

Abstract

To reduce the degradation of detection accuracy due to the change of gaps due to a warp caused by the stress of a joint member between movable electrode fingers and fixed electrode fingers that are arranged in a pectinate pattern.SOLUTION: A sensor element comprises: pectinate-patterned fixed electrode fingers whose longitudinal direction is along a first direction; and pectinate-patterned movable electrode fingers whose longitudinal direction is along the first direction, facing the fixed electrode fingers across a gap in the second direction orthogonal to the first direction. A physical quantity sensor includes a container for accommodating the sensor element and a substrate for joining the container. With reference to the container, the outer face of the container arranged parallel to a face including the first direction and second direction is joined to the substrate with a joint material provided in a belt-like shape along in the first direction.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a physical quantity sensor, an inertial measurement device, a moving body positioning device, an electronic apparatus, and a moving body.

  In recent years, as a physical quantity sensor for detecting a physical quantity, a sensor element having a movable electrode and a fixed electrode arranged in a comb-like shape and facing each other is detected, and the physical quantity is detected based on the capacitance between these two electrodes. Capacitance type sensors have been proposed.

  As such a sensor, for example, Patent Document 1 discloses a MEMS (Micro Electro Mechanical System) in which a comb-like movable electrode finger and a fixed electrode finger are arranged as a sensor element so as to face each other with a gap. ) Sensor is described. Patent Document 2 describes an acceleration sensor including a sensor element in which a comb-like movable electrode finger and a fixed electrode finger are arranged to face each other with a gap. Patent Document 3 describes a mechanical quantity sensor in which a comb-like movable electrode finger and a fixed electrode finger are arranged as a sensor element so as to face each other with a gap.

JP 2010-238921 A U.S. Pat. No. 8,516,890 JP 2000-286430 A

  However, when the physical quantity sensor as described above is bonded (mounted) to a package or substrate using a bonding member such as an adhesive, the sensor element warps due to the stress of the bonding member (mount stress). As a result, the electrode fingers arranged in a comb-tooth shape are deformed, and the gap between the movable electrode finger and the fixed electrode finger changes, resulting in unnecessary fluctuations in the detected capacitance, There was a problem that the detection accuracy was lowered.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A physical quantity sensor according to this application example includes a comb-shaped fixed electrode finger whose longitudinal direction is along the first direction, and the longitudinal direction is along the first direction. A sensor element including a comb-like movable electrode finger facing the fixed electrode finger with a gap in the second direction orthogonal to each other, a container containing the sensor element, and the container are joined. An outer surface of the container parallel to the surface including the first direction and the second direction is provided by a bonding material provided in a band shape along the first direction. Bonded to the substrate.

  According to the physical quantity sensor according to this application example, since the bonding material for bonding the container to the base is provided in a band shape along the second direction, the bonding stress of the bonding material acts strongly in the second direction. The container is greatly deformed in the second direction, and the deformation in the first direction is small. Since the fixed electrode finger and the movable electrode finger of the sensor element are arranged in a comb shape along the first direction in the longitudinal direction, the capacitance due to the change in the gap between the two electrodes in the first direction is reduced. The physical quantity is detected by detecting the change, but the deformation of the container due to the bonding stress of the bonding material provided in a strip shape along the second direction is greatly deformed in the second direction, and the deformation in the first direction. Is small, and is less susceptible to the change in capacitance due to the change in gap. Therefore, it is possible to reduce a decrease in detection accuracy due to unnecessary fluctuations that occur in the detected capacitance due to deformation of the container due to the stress of the bonding material.

  Application Example 2 In the physical quantity sensor according to this application example, the comb-shaped first fixed electrode fingers whose longitudinal direction is along the second direction, the longitudinal direction is along the second direction, and the first sensor A first sensor element including a comb-shaped first movable electrode finger facing the first fixed electrode finger via a gap in a first direction orthogonal to the direction of 2; Comb-shaped second fixed electrode fingers along the first direction, and the longitudinal direction is along the first direction, facing the second fixed electrode fingers with a gap in the second direction A second sensor element including a comb-shaped second movable electrode finger, a container containing the first sensor element and the second sensor element, and the container joined together A substrate that is parallel to a plane that includes the first direction and the second direction. Bonding material in which the side surface is located outside the outline of the second sensor element in a plan view from the normal direction of the outer surface and is provided in a strip shape along the second direction Is bonded to the substrate.

  According to the physical quantity sensor according to this application example, the bonding material for bonding the container to the base body is located outside the outline of the second sensor element in a plan view from the normal direction of the outer surface of the container, and Since it is provided in a strip shape along the second direction, the bonding stress of the bonding material acts strongly in the second direction, and the container is greatly deformed in the second direction and deformed in the first direction. Is small. Therefore, the second sensor element in which the second fixed electrode fingers and the second movable electrode fingers are arranged in a comb-teeth shape in the longitudinal direction along the second direction has an electrostatic capacity caused by deformation in the second direction. Although it is greatly affected by the change in capacitance, since the bonding material is located outside the contour of the second sensor element, the second sensor element is out of the deformation region of the container, and the capacitance The influence of change can be reduced. Further, the first sensor element in which the first fixed electrode fingers and the first movable electrode fingers are arranged in a comb-teeth shape along the first direction is the first direction in which the deformation of the container is small. Because it detects changes in the capacitance of the device, it is difficult to be affected. As a result, even if two sensor elements (first sensor element and second sensor element) for detecting physical quantities in different directions are provided, the detected capacitance can be reduced by deformation of the container due to the stress of the bonding material. It is possible to reduce a decrease in detection accuracy caused by unnecessary fluctuations that occur.

  Application Example 3 In the physical quantity sensor according to the application example described above, the first sensor element and the second sensor element are arranged side by side along the first direction or the second direction. It is preferable.

  According to this application example, the first sensor element and the second sensor element can be efficiently arranged, and the outer shape of the container can be reduced in size.

  Application Example 4 In the physical quantity sensor described in the application example, it is preferable that the bonding material is an adhesive or a pressure-sensitive adhesive.

  According to this application example, the container and the base can be joined with an easily available adhesive or pressure-sensitive adhesive.

  Application Example 5 In the physical quantity sensor according to the application example described above, the first sensor element includes a base substrate, and the first sensor element includes a first support portion and a second support portion attached to the base substrate, and a planar surface. In view, the first movable part disposed between the first support part and the second support part, and one side of the first movable part and the first support part are connected to each other A first connecting part, a second connecting part to which the other side of the first movable part and the second support part are connected, and the first movable part includes: The first movable electrode finger having a comb shape includes a first base portion disposed between the first connection portion and the second connection portion in a plan view, The comb-shaped first fixed electrode fingers are fixed to the base substrate, and the second sensor element is the base substrate The third support portion and the fourth support portion that are attached, the second movable portion that is disposed between the third support portion and the fourth support portion in plan view, and the first support portion. A third connecting portion in which one side of the second movable portion and the third supporting portion are connected, and a second connecting portion in which the other side of the second movable portion and the fourth supporting portion are connected. 4, and the second movable portion includes a second base portion disposed between the third connection portion and the fourth connection portion in plan view, and the comb The tooth-shaped second movable electrode finger is preferably provided on the second base, and the comb-shaped second fixed electrode finger is preferably fixed to the base substrate.

  According to this application example, the first sensor element is connected to the first support portion and the second support portion, which are two support portions, via the first connection portion and the second connection portion. The 1st movable part containing a base is connected. In addition, the second sensor element includes a second base portion in the third support portion and the fourth support portion, which are two support portions, via the third connection portion and the fourth connection portion. The movable parts are connected. With such a configuration, the comb-shaped first movable electrode finger provided on the first base and the second movable electrode finger provided on the second base are located between the two fixed portions. It can be displaced stably.

  Application Example 6 In the physical quantity sensor according to the application example described above, the base substrate including the outer surface of the container is preferably glass.

  According to this application example, the first sensor element and the sensor element including the second sensor element and the substrate can be firmly bonded to each other by, for example, anodic bonding. Moreover, since the light transmittance can be imparted to the substrate, the inside of the container can be observed through the substrate.

  Application Example 7 In the physical quantity sensor according to the application example, the physical quantity sensor includes a metal electrode provided on the outer surface of the container and a metal layer provided on the base, and the container and the base Are preferably bonded using at least one of the metal electrode and the metal layer as the bonding material.

  According to this application example, in the bonding of the container and the substrate, for example, a bonding method such as flip chip bonding can be used with at least one of the metal electrode and the metal layer as a bonding material.

  Application Example 8 The physical quantity sensor described in the application example described above preferably includes a processing circuit that controls the sensor element, the first sensor element, and the second sensor element.

  According to this application example, the detection signal in which the processing circuit that controls the sensor element, the first sensor element, and the second sensor element prevents a decrease in the detection accuracy of the physical quantity caused by the deformation of the container due to the stress of the bonding material. Can be output.

  Application Example 9 An inertial measurement apparatus according to this application example includes the physical quantity sensor described in the application example, an angular velocity sensor, and a control unit that controls the physical quantity sensor and the angular velocity sensor.

  According to the inertial measurement device according to this application example, an inertial measurement device capable of communicating highly reliable physical quantity data with a physical quantity sensor that prevents a decrease in detection accuracy of a physical quantity caused by deformation of a container due to stress of a bonding material is provided. be able to.

  Application Example 10 A mobile positioning device according to this application example includes the inertial measurement device according to the application example described above, a receiving unit that receives a satellite signal on which position information is superimposed from a positioning satellite, and the received receiving device. Based on a satellite signal, an acquisition unit that acquires position information of the reception unit, a calculation unit that calculates an attitude based on inertia data output from the inertial measurement device, and the calculation unit based on the calculated attitude And a calculating unit that calculates the position of the moving body by correcting the position information.

  According to the mobile positioning device according to this application example, the position information of the receiving unit acquired from the satellite signal received by the receiving unit is based on the attitude calculated based on the inertial data output from the inertial measuring device. Since the position of the moving body is obtained by correction, the position of the moving body closer to the actual state, such as the moving body being inclined, can be obtained.

  Application Example 11 A portable electronic device according to this application example includes the physical quantity sensor according to the application example described above, a case in which the physical quantity sensor is accommodated, and output data from the physical quantity sensor that is accommodated in the case. And a display unit housed in the case, and a translucent cover that closes the opening of the case.

  According to this application example, a highly reliable portable electronic device that further enhances the reliability of control by using the output data of the physical quantity sensor that prevents the deterioration of the physical quantity detection accuracy caused by the deformation of the container due to the stress of the bonding material. Can be provided.

  Application Example 12 An electronic apparatus according to this application example includes the physical quantity sensor according to any one of the application examples described above, and a control unit that performs control based on a detection signal output from the physical quantity sensor. Yes.

  According to this application example, it is possible to provide a highly reliable electronic device that further enhances control reliability by a detection signal of a physical quantity sensor that prevents a decrease in detection accuracy of a physical quantity caused by deformation of a container due to stress of a bonding material. be able to.

  Application Example 13 A moving body according to this application example includes the physical quantity sensor according to any one of the application examples described above, an attitude control unit that performs attitude control based on a detection signal output from the physical quantity sensor, It has.

  According to this application example, a highly reliable moving body is provided in which the reliability of posture control is further improved by the detection signal of the physical quantity sensor which prevents the detection accuracy of the physical quantity caused by the deformation of the container due to the stress of the bonding material. can do.

The perspective view which shows schematic structure of the physical quantity sensor which concerns on 1st Embodiment. The AA sectional view of Drawing 1 showing the schematic structure of a physical quantity sensor. The top view which shows the example of application | coating of the adhesive agent which attaches a sensor element. The functional block diagram of a physical quantity sensor. The top view which shows the example of arrangement | positioning of the sensor element used for the physical quantity sensor. Sectional drawing which shows schematic structure of a sensor element. The perspective view which shows schematic structure of the sensor part (X-axis direction detection) of a sensor element. The perspective view which shows schematic structure of the sensor part (Y-axis direction detection) of a sensor element. The perspective view which shows schematic structure of the sensor part (Z-axis direction detection) of a sensor element. Schematic which shows an example of a stress application test method. The graph which shows the correlation with the stress application to a X-axis direction, and the capacitance change of each sensor element. The graph which shows the correlation with the stress application to a Y-axis direction, and the capacitance change of each sensor element. The top view which shows the application example 1 of a sensor element. The top view which shows the application example 2 of a sensor element. The top view which shows the application example 3 of a sensor element. Sectional drawing which shows the modification of a joining material. Sectional drawing which shows schematic structure of the physical quantity sensor which concerns on 2nd Embodiment. The top view which shows schematic structure of the physical quantity sensor which concerns on 3rd Embodiment. Sectional drawing which shows schematic structure of the physical quantity sensor which concerns on 3rd Embodiment. The top view which shows schematic structure of the physical quantity sensor which concerns on 4th Embodiment. Sectional drawing which shows schematic structure of the physical quantity sensor which concerns on 4th Embodiment. The top view which shows an example of the angular velocity sensor element used for an inertial measurement unit etc. FIG. FIG. 17B is a cross-sectional view of an example of an angular velocity sensor element. The disassembled perspective view which shows schematic structure of an inertial measurement unit. The perspective view which shows the example of arrangement | positioning of the inertial sensor element of an inertial measurement unit. The functional block diagram which shows the structural example of a mobile body positioning apparatus. The top view which shows the structure of a portable electronic device typically. The functional block diagram which shows schematic structure of a portable electronic device. The perspective view which shows typically the structure of the mobile personal computer which is an example of an electronic device. The perspective view which shows typically the structure of the smart phone (portable telephone) which is an example of an electronic device. The perspective view which shows the structure of the digital still camera which is an example of an electronic device. The perspective view which shows the structure of the motor vehicle which is an example of a mobile body.

  Hereinafter, a physical quantity sensor, an inertial measurement unit, a mobile body positioning device, an electronic device, and a mobile body according to the present invention will be described in detail based on embodiments shown in the accompanying drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, all the configurations described in the present embodiment are not necessarily essential configuration requirements of the invention.

<First Embodiment>
The physical quantity sensor according to the first embodiment will be described with reference to FIGS. 1, 2A, 2B, 3, 4, 4, 5, 6A, 6B, and 6C. FIG. 1 is a perspective view illustrating a schematic configuration of the physical quantity sensor according to the first embodiment. 2A is a cross-sectional view taken along the line AA of FIG. 1 illustrating a schematic configuration of the physical quantity sensor. FIG. 2B is a plan view showing an application example of an adhesive for attaching the sensor element. FIG. 3 is a functional block diagram of the physical quantity sensor. FIG. 4 is a plan view showing an arrangement example of sensor elements used in the physical quantity sensor. For convenience of explanation, FIG. 4 shows a state where the lid is omitted. FIG. 5 is a cross-sectional view showing a schematic configuration of the sensor element. FIG. 6A is a perspective view illustrating a schematic configuration of a sensor unit (detection in the X-axis direction) of the sensor element. FIG. 6B is a perspective view illustrating a schematic configuration of a sensor unit (detection in the Y-axis direction). FIG. 6C is a perspective view illustrating a schematic configuration of a sensor unit (detection in the Z-axis direction).

  Hereinafter, as described in each drawing, three axes orthogonal to each other will be described as an X axis, a Y axis, and a Z axis. Also, the direction parallel to the X axis is “X axis direction” or “second direction”, the direction parallel to the Y axis is “Y axis direction” or “first direction”, and the direction parallel to the Z axis is “ Also referred to as “Z-axis direction” or “third direction”. A surface including the X axis and the Y axis along the direction in which the three sensor units are arranged is also referred to as an “XY plane”. Further, the Z-axis direction is defined as a direction along the stacking (arrangement) direction of the base substrate and the lid part constituting the package, in other words, a direction along the mounting direction of the sensor element and the base substrate. Further, for convenience of explanation, in the plan view when viewed from the Z-axis direction, the surface on the + Z-axis direction side that is the lid side is the upper surface, and the surface on the opposite side to the −Z-axis direction side is the lower surface. Sometimes.

  The physical quantity sensor 1 shown in FIGS. 1, 2A, 2B, and 3 has an X-axis direction (second direction), a Y-axis direction (first direction), and a Z-axis direction (third direction), respectively. It can be used as a three-axis acceleration sensor that can detect the acceleration of each independently. Such a physical quantity sensor 1 has a package 7 and a structure 5 accommodated in the package 7. The structure 5 includes an acceleration sensor element 20 as a sensor element, and an IC (integrated circuit) 40 as a circuit element disposed on the acceleration sensor element 20, and by an adhesive 18 as a bonding material, The lower surface 20r of the acceleration sensor element 20 is joined to the inner bottom surface 10f inside the package 7 (accommodating space 17).

  As shown in FIG. 3, the acceleration sensor element 20 includes a Y-axis sensor part 21y as a first sensor element, an X-axis sensor part 21x as a second sensor element, and a Z-axis sensor part 21z. Including. Further, the IC 40 includes a processing circuit (not shown) for controlling the acceleration sensor element 20 and a detection circuit (not shown) for detecting accelerations in the X-axis, Y-axis, and Z-axis directions based on signals from the acceleration sensor element 20. A signal processing unit 45), an output circuit (output unit 46) that converts a signal from the detection circuit into a predetermined signal and outputs the signal.

(Package 7)
As shown in FIG. 1, FIG. 2A, and FIG. 2B, the package 7 that houses the structure 5 has a rectangular outer edge in plan view from the direction in which the acceleration sensor element 20 and the package 7 overlap (+ Z axis direction). Yes, connected to the third base member 13 via the base member 10 composed of the first base member 11, the second base member 12, and the third base member 13, and the sealing member 14. And a lid portion 15 as a lid body. In addition, the 1st base material 11, the 2nd base material 12, and the 3rd base material 13 are laminated | stacked in this order, and the base part 10 is comprised. The first base material 11 has a flat plate shape, the second base material 12 and the third base material 13 are annular bodies from which the central portion is removed, and the peripheral edge of the upper surface of the third base material 13. In addition, a sealing member 14 such as a seal ring or low melting point glass is formed. In addition, the 1st base material 11 which comprises the base part 10 corresponds to a base | substrate.

  In the package 7, a recessed portion (cavity) for housing the structure 5 is formed by the second base material 12 and the third base material 13 which are annular bodies from which the central portion is removed. The package 7 is accommodated in a closed space (sealed space) by closing the opening of the recessed portion (cavity) by a lid portion (lid) 15 as a lid, in other words, sealing. A space (internal space) 17 is provided, and the structure 5 can be accommodated in the accommodation space 17. As described above, the structural body 5 including the acceleration sensor element 20 and the IC 40 is accommodated in the accommodating space 17 provided between the package 7 and the lid portion 15, whereby the structural body 5 is packaged in the package 7. Therefore, the physical quantity sensor 1 can be made compact and high performance. A part of the wiring pattern and electrode pads (terminal electrodes) formed on the base portion 10 including the first base material 11 and the second base material 12 are not shown. The housing space 17 of the package 7 is hermetically sealed in a reduced-pressure atmosphere lower than atmospheric pressure or an inert gas atmosphere such as nitrogen, argon, or helium.

  A plurality of internal terminals 19 are disposed on the upper surface of the second base material 12, and a plurality of external terminals 16 are disposed on the outer bottom surface 10 r of the package 7, which is the lower surface of the first base material 11. Yes. In addition, three castellations 28b are provided on the outer surface of the package 7, respectively. Further, castellations 28a are provided at the four corners on the outer side of the package 7, respectively. The castellations 28a and 28b can be provided with wiring electrodes (not shown). Each internal terminal 19 is electrically connected to a corresponding external terminal 16 via an internal wiring (not shown) formed on the base portion 10 and wiring electrodes provided with castellations 28a and 28b.

  As the constituent material of the first base material 11, the second base material 12, and the third base material 13, ceramic or the like is preferably used. In addition, as a constituent material of the 1st base material 11, the 2nd base material 12, and the 3rd base material 13, you may use glass, resin, a metal, etc. other than a ceramic. Further, as the constituent material of the lid portion 15, for example, a metal material such as Kovar, a glass material, a silicon material, a ceramic material, or the like can be used.

(Structure 5)
The structure 5 includes an acceleration sensor element 20 and an IC 40 that is electrically connected to the acceleration sensor element 20 and is connected to the acceleration sensor element 20 by an adhesive layer 41. In other words, the IC 40 is attached to the surface of the acceleration sensor element 20 opposite to the lower surface 20r that is the surface on the first base material 11 side that constitutes the package 7. Thus, by stacking the package 7, the acceleration sensor element 20, and the IC 40, it is possible to increase the arrangement efficiency in the planar direction and reduce the area of the physical quantity sensor 1 in plan view.

  As will be described in detail later, the acceleration sensor element 20 includes a Y-axis sensor unit 21y as a first sensor element, an X-axis sensor unit 21x as a second sensor element, and a Z-axis sensor unit 21z. Including. The Y-axis sensor unit 21y and the X-axis sensor unit 21x detect acceleration in two axes (X-axis direction and Y-axis direction) in the XY plane direction, and the Z-axis sensor unit 21z is orthogonal to the XY plane. The acceleration in the Z-axis direction is detected.

  The acceleration sensor element 20 and the IC 40 are electrically connected by a bonding wire 43. In addition, the IC 40 is electrically connected to the internal terminal 19 provided on the package 7 (the upper surface of the second base material 12) by a bonding wire 42. The internal terminals 19 and the external terminals 16 are made of, for example, a metal wiring material such as tungsten (W) or molybdenum (Mo), which is screen-printed at a predetermined position and fired. It can be formed by a method of plating such as Au).

  As shown in FIG. 2A, the structure 5 is formed on the upper surface of the first base material 11 constituting the base portion 10 as a base by an adhesive 18 as a bonding material, for example, a resin base material, that is, The lower surface 20r of the acceleration sensor element 20 is joined to the inner bottom surface 10f inside the package 7 (the accommodation space 17), and is accommodated in the accommodation space 17 of the package 7. Note that the lower surface 20r of the acceleration sensor element 20 is parallel to a plane including the Y-axis direction (first direction) and the X-axis direction (second direction), which is outside the container 25 of the acceleration sensor element 20 described later. It can be rephrased as a surface. In this way, the base portion 10 and the container 25 can be joined with the easily available adhesive 18. As the bonding material, an adhesive can be used instead of the adhesive described above.

  As shown in FIG. 2B, the adhesive 18 as the bonding material has a contour of the X-axis sensor portion 21x as the second sensor element in a plan view from the normal direction of the lower surface 20r of the acceleration sensor element 20. It is located outside and is disposed in a strip shape along the X-axis direction (second direction). And the structure 5 is joined to the 1st base material 11 (base | substrate) of the package 7 with the adhesive agent 18 arrange | positioned in this way. The relationship between the Y-axis sensor unit 21y as the first sensor element and the X-axis sensor unit 21x as the second sensor element and the arrangement of the adhesive 18 as the bonding material will be described in detail later.

(Acceleration sensor element 20)
As shown in FIGS. 4 and 5, the acceleration sensor element 20 includes a container 25 having a base substrate 22 and a cap part 23, and a Y-axis sensor part 21 y as a first sensor element in the container 25, An X-axis sensor unit 21x and a Z-axis sensor unit 21z as second sensor elements are accommodated. In this embodiment, the Y-axis sensor unit 21y and the X-axis sensor unit 21x are arranged side by side along the Y-axis direction (first direction). With such an arrangement, the Y-axis sensor unit 21y and the X-axis sensor unit 21x can be arranged efficiently, and the outer shape of the container 25 can be reduced in size. For convenience of explanation, FIG. 5 shows only the Z-axis sensor unit 21z. The Y-axis sensor unit 21y, the X-axis sensor unit 21x, and the Z-axis sensor unit 21z can independently detect accelerations in the Y-axis direction, the X-axis direction, and the Z-axis direction. The Y-axis sensor unit 21y and the X-axis sensor unit 21x detect accelerations in two axes (X-axis direction and Y-axis direction) in the XY plane direction, and the Z-axis sensor unit 21z is in the XY plane. The acceleration in the orthogonal Z-axis direction is detected.

  The base substrate 22 is formed with recesses 211, 212, and 213 that open upward. Of these, the concave portion 211 functions as a relief portion for preventing contact between the X-axis sensor portion 21x disposed above the concave portion 211 and the base substrate 22. Similarly, the concave portion 212 functions as a relief portion for preventing contact between the Y-axis sensor portion 21 y disposed above the concave portion 212 and the base substrate 22. Further, the recess 213 functions as an escape portion for preventing contact between the Z-axis sensor portion 21z disposed above and the base substrate 22.

  In addition, the base substrate 22 is formed with recesses 211a, 211b, and 211c, recesses 212a, 212b, and 212c and recesses 213a, 213b, and 213c opened on the upper surface. Of these, the recesses 211a, 211b, and 211c are disposed around the recess 211, and the wirings 271, 272, and 273 for the X-axis sensor unit 21x are disposed in the recesses 211a, 211b, and 211c. . The recesses 212a, 212b, and 212c are disposed around the recess 212, and wirings 281, 282, and 283 for the Y-axis sensor unit 21y are disposed in the recesses 212a, 212b, and 212c. The recesses 213a, 213b, and 213c are disposed around the recess 213, and wirings 291, 292, and 293 for the Z-axis sensor unit 21z are disposed in the recesses 213a, 213b, and 213c. In addition, the ends of these wires 271, 272, 273, 281, 282, 283, 292, 293, and 293 are exposed to the outside of the container 25, and the exposed portions serve as connection terminals 29. Each connection terminal 29 is electrically connected to an electrode pad (not shown) of the IC 40 through a bonding wire 43.

  Such a base substrate 22 is made of, for example, a glass material containing alkali metal ions (movable ions) (for example, borosilicate glass such as Pyrex (registered trademark) glass). Thereby, the X-axis sensor unit 21x, the Y-axis sensor unit 21y, and the Z-axis sensor unit 21z formed from the silicon substrate can be firmly bonded to the base substrate 22 by anodic bonding. In addition, since light transmission can be imparted to the base substrate 22, the inside of the container 25 can be observed through the base substrate 22. However, the constituent material of the base substrate 22 is not limited to a glass material, and for example, a high-resistance silicon material can be used. In this case, joining with the X-axis sensor part 21x, the Y-axis sensor part 21y, and the Z-axis sensor part 21z can be performed through, for example, a resin adhesive, a glass paste, a metal layer, or the like.

  The X-axis sensor unit 21x as the second sensor element is a sensor unit that detects acceleration in the X-axis direction. As shown in FIG. 6A, the X-axis sensor unit 21x includes a third support unit 611 and a fourth support unit 612, a second movable unit 62, a third connection unit 631 and a fourth connection unit. It has a connecting part 632 and a plurality of second fixed electrode fingers 64, 65. The second movable portion 62 protrudes from the second base portion 621 to both sides in the Y-axis direction so that the second base portion 621 and the longitudinal direction are arranged along the Y-axis direction (first direction). A plurality of second movable electrode fingers 622. Such an X-axis sensor unit 21x is formed of, for example, a silicon substrate doped with impurities such as phosphorus and boron.

  The third support portion 611 and the fourth support portion 612 are anodically bonded to the upper surface 22f of the base substrate 22 as two fixing portions, and the third support portion 611 is connected to the wiring 271 via conductive bumps (not shown). And are electrically connected. A second movable portion 62 is provided between the third support portion 611 and the fourth support portion 612. The second movable part 62 is connected to the third support part 611 and the fourth support part 612 via the third connection part 631 and the fourth connection part 632. Since the third connecting portion 631 and the fourth connecting portion 632 can be elastically deformed in the X-axis direction like a spring, the second movable portion 62 has the third supporting portion 611 and the fourth supporting portion 612. On the other hand, as shown by the arrow a, it can be displaced in the X-axis direction.

  The plurality of second fixed electrode fingers 64 are arranged in a comb shape along the X-axis direction (second direction), and the longitudinal direction is arranged along the Y-axis direction (first direction). In other words, the plurality of second fixed electrode fingers 64 are arranged on one side in the Y-axis direction of the second movable electrode finger 622 and are spaced from each other corresponding second movable electrode finger 622 in the X-axis direction. They are arranged in a comb-teeth shape facing each other. The plurality of second fixed electrode fingers 64 are anodically bonded to the upper surface of the concave portion 211 of the base substrate 22 at the base end portion, and are electrically connected to the wiring 272 via the conductive bump B12. .

  On the other hand, the other plurality of second fixed electrode fingers 65 are arranged on the other side in the Y-axis direction of the second movable electrode finger 622 and are in the X-axis direction with respect to the corresponding second movable electrode finger 622. Are arranged in a comb-like shape facing each other with a gap therebetween. In other words, the other plurality of second fixed electrode fingers 65 are arranged in a comb-tooth shape along the X-axis direction, and the longitudinal direction is arranged along the Y-axis direction. The plurality of second fixed electrode fingers 65 are anodically bonded to the upper surface 22f of the base substrate 22 at the base end portion, and are electrically connected to the wiring 273 via the conductive bump B13.

  Using such an X-axis sensor unit 21x, acceleration in the X-axis direction is detected as follows. That is, when acceleration in the X-axis direction is applied, the second movable portion 62 elastically deforms the third connecting portion 631 and the fourth connecting portion 632 based on the magnitude of the acceleration, while in the X-axis direction. It is displaced to. Along with the displacement, the electrostatic capacitance between the second movable electrode finger 622 and the second fixed electrode finger 64 and the static electricity between the second movable electrode finger 622 and the second fixed electrode finger 65. The magnitude of the capacitance changes. Then, the acceleration is obtained by the IC 40 based on the change in the capacitance.

  The Y-axis sensor unit 21y as the first sensor element is a sensor unit that detects acceleration in the Y-axis direction. Such a Y-axis sensor unit 21y has the same configuration as the X-axis sensor unit 21x except that the Y-axis sensor unit 21y is arranged in a state of being rotated by 90 ° in plan view. As shown in FIG. 6B, the Y-axis sensor unit 21y includes a first support unit 711 and a second support unit 712, a first movable unit 72, a first connection unit 731 and a second connection unit 732. And a plurality of first fixed electrode fingers 74 and 75. The first movable portion 72 includes a first base portion 621 and a plurality of first base portions 621 that protrude from the first base portion 621 to both sides in the X-axis direction so that the longitudinal direction is the Z-axis direction (second direction). 1 movable electrode finger 722. Such a Y-axis sensor unit 21y is formed of, for example, a silicon substrate doped with impurities such as phosphorus and boron.

  The first support portion 711 and the second support portion 712 are anodically bonded to the upper surface 22f of the base substrate 22, and the first support portion 711 is electrically connected to the wiring 281 through a conductive bump (not shown). Has been. A first movable portion 72 is provided between the first support portion 711 and the second support portion 712. The first movable part 72 is connected to the first support part 711 and the second support part 712 via the first connection part 731 and the second connection part 732. Since the first connecting portion 731 and the second connecting portion 732 can be elastically deformed in the Y-axis direction like a spring, the first movable portion 72 has the first supporting portion 711 and the second supporting portion 712. On the other hand, it can be displaced in the Y-axis direction as indicated by an arrow b.

  The plurality of first fixed electrode fingers 74 are arranged in a comb shape along the Y-axis direction (first direction), and the longitudinal direction is arranged along the X-axis direction (second direction). In other words, the first fixed electrode finger 74 is disposed on one side in the X-axis direction of the first movable electrode finger 722 and is spaced from the corresponding first movable electrode finger 722 in the Y-axis direction. They are lined up in the form of opposing comb teeth. The plurality of first fixed electrode fingers 74 are anodically bonded to the upper surface of the concave portion 212 of the base substrate 22 at the base end portion, and are electrically connected to the wiring 282 through the conductive bump B22. .

  On the other hand, the other plurality of first fixed electrode fingers 75 are arranged on the other side in the X-axis direction of the first movable electrode finger 722, and the Y-axis direction with respect to the corresponding first movable electrode finger 722. Are arranged in a comb-like shape facing each other with a gap therebetween. In other words, the other plurality of first fixed electrode fingers 75 are arranged in a comb shape along the Y-axis direction, and the longitudinal direction is arranged along the X-axis direction. The plurality of first fixed electrode fingers 75 are anodically bonded to the upper surface 22f of the base substrate 22 at the base end portion, and are electrically connected to the wiring 283 through the conductive bump B23.

  Using such a Y-axis sensor unit 21y, acceleration in the Y-axis direction is detected as follows. That is, when acceleration in the Y-axis direction is applied, the first movable portion 72 elastically deforms the first connecting portion 731 and the second connecting portion 732 based on the magnitude of the acceleration, while in the Y-axis direction. It is displaced to. Along with the displacement, the electrostatic capacitance between the first movable electrode finger 722 and the first fixed electrode finger 74 and the static electricity between the first movable electrode finger 722 and the first fixed electrode finger 75. The magnitude of the capacitance changes. Then, the acceleration is obtained by the IC 40 based on the change in the capacitance.

  The Z-axis sensor unit 21z that is one of the sensor elements is a part that detects acceleration in the Z-axis direction (vertical direction). As shown in FIG. 6C, such a Z-axis sensor unit 21 z includes a support portion 811, a movable portion 82, and a pair of connecting portions 831 and 832 that connect the movable portion 82 to the support portion 811 so as to be swingable. The movable portion 82 swings with respect to the support portion 811 with the connecting portions 831 and 832 as the axis J. Such a Z-axis sensor unit 21z is formed of, for example, a silicon substrate doped with impurities such as phosphorus and boron.

  The support portion 811 is anodically bonded to the upper surface 22f of the base substrate 22, and the support portion 811 is electrically connected to the wiring 291 through a conductive bump (not shown). And the movable part 82 is provided in the both sides of the Y-axis direction of the support part 811. As shown in FIG. The movable portion 82 includes a first movable portion 821 located on the + Y direction side with respect to the axis J, and a second movable portion 822 located on the −Y direction side with respect to the axis J and larger than the first movable portion 821. doing. The first movable portion 821 and the second movable portion 822 have different rotational moments when vertical (Z-axis direction) acceleration is applied, and are designed so that a predetermined inclination occurs in the movable portion 82 according to the acceleration. Has been. Thereby, when acceleration in the Z-axis direction occurs, the movable portion 82 swings the seesaw around the axis J.

  The first detection electrode 211g electrically connected to the wiring 292 is disposed at a position facing the first movable portion 821 on the bottom surface of the recess 213, and the wiring is disposed at a position facing the second movable portion 822. A second detection electrode 211h electrically connected to 293 is disposed. Therefore, an electrostatic capacity is formed between the first movable part 821 and the first detection electrode 211g, and an electrostatic capacity is formed between the second movable part 822 and the second detection electrode 211h. Note that a dummy electrode 211i can be provided at a position facing the second movable portion 822 and on the −Y axis side of the second detection electrode 211h. The first detection electrode 211g, the second detection electrode 211h, and the dummy electrode 211i are preferably made of a transparent conductive material such as ITO, for example.

  Using such a Z-axis sensor unit 21z, acceleration in the Z-axis direction is detected as follows. That is, when the acceleration in the Z-axis direction is applied, the movable portion 82 swings the seesaw around the axis J. By such seesaw swinging of the movable portion 82, the separation distance between the first movable portion 821 and the first detection electrode 211g and the separation distance between the second movable portion 822 and the second detection electrode 211h are changed. Accordingly, the capacitance between them changes. Then, the acceleration is obtained by the IC 40 based on the change in the capacitance.

As shown in FIG. 5, the cap portion 23 has a recess 223 that opens on the lower surface, and is joined to the base substrate 22 so that the recess 223 forms an accommodation space (internal space) S2 with the recesses 211, 212, and 213. Has been. Such a cap portion 23 is formed of a silicon substrate in this embodiment. The cap part 23 and the base substrate 22 are hermetically bonded using a glass frit 24. In the state where the cap portion 23 is joined to the base substrate 22, the inside and outside of the accommodation space S <b> 2 are communicated via the recesses 211 a to 211 c, 212 a to 212 c, and 213 a to 213 c formed on the base substrate 22. Therefore, for example, the recesses 211a to 211c, 212a to 212c, and 213a to 213c are closed by a SiO ₂ film (not shown) formed by a CVD method using TEOS (tetraethoxysilane) or the like. Further, the cap portion 23 is provided with a stepped sealing hole 27 penetrating from the concave portion 223 to the outside. The sealing hole 27 is sealed with a molten metal 26, for example, a molten gold germanium alloy (AuGe), in a state where the accommodation space S2 is in a nitrogen (N ₂ ) atmosphere.

(IC40)
As shown in FIG. 2A, the IC 40 is disposed on the upper surface (on the cap portion 23) of the acceleration sensor element 20 via the adhesive layer 41. The adhesive layer 41 is not particularly limited as long as the IC 40 can be fixed on the acceleration sensor element 20. For example, solder, silver paste, a resin adhesive (die attach agent), or the like can be used.

  The IC 40 includes, for example, a drive circuit that drives the acceleration sensor element 20 and a detection circuit (signal processing unit) that detects acceleration in each of the X-axis, Y-axis, and Z-axis directions based on a signal from the acceleration sensor element 20. 45), an output circuit (output unit 46) for converting a signal from the detection circuit into a predetermined signal and outputting the signal. The IC 40 has a plurality of electrode pads (not shown) on the upper surface, and each electrode pad is electrically connected to the internal terminal 19 of the second substrate 12 via the bonding wire 42, and each electrode pad is It is electrically connected to the connection terminal 29 of the acceleration sensor element 20 through the bonding wire 43. Thereby, the acceleration sensor element 20 can be controlled.

(Disposition of bonding material)
In the adhesive 18 as a bonding material for bonding the structure 5 to the base portion 10, stress generated by curing or post-curing thermal stress may affect the output characteristics of the acceleration sensor element 20. Here, with reference to FIG. 7, FIG. 8, and FIG. 9, the influence of the stress applied to the container 25 on the output characteristics (capacity change amount) of the Y-axis sensor unit 21y and the X-axis sensor unit 21x will be described. FIG. 7 is a schematic view showing an example of a stress application test method for applying a stress to the acceleration sensor element 20 and confirming a change in its characteristics. FIG. 8 is a graph showing the correlation between the stress application in the X-axis direction (second direction) and the capacitance change of each sensor element. FIG. 9 is a graph showing the correlation between the stress application in the Y-axis direction (first direction) and the capacitance change of each sensor element.

  In this evaluation, a stress change test method as shown in FIG. 7 was used, and a change in characteristics when a stress was applied to the acceleration sensor element 20 was confirmed. In this stress application test method, as shown in FIG. 7, a plate material PL placed on a test bench BP via two support materials Fu is prepared. And the structure 5 is fixed on the board | plate material PL between the two support materials Fu with an adhesive agent (not shown). Note that the adhesive is applied to the entire bonding surface of the structure 5. In this state, the plate material PL applies a force indicated by an arrow F so as to be deformed in the direction of the test table BP using the two support materials Fu as action points. Due to the deformation of the plate material PL, the structure 5 fixed to the plate material PL can be caused to generate a stress such that a force is applied (deformed) in the direction of the two support materials Fu. In addition, the stress direction with respect to the structure 5 can be changed with the direction which the structure 5 fixes to the board | plate material PL.

  First, stress in the X-axis direction (second direction) is applied to the structure 5 in which the Y-axis sensor unit 21y and the X-axis sensor unit 21x are arranged side by side in the Y-axis direction (first direction). FIG. 8 is a graph showing the results of verifying the capacitance changes of the Y-axis sensor unit 21y and the X-axis sensor unit 21x that constitute the acceleration sensor element 20 when the voltage is applied.

  As shown in the graph of FIG. 8, when stress in the X-axis direction is applied, the second fixed electrode fingers 64 and the other second fixed electrode fingers 65 arranged in the X-axis direction, The capacitance change of the X-axis sensor unit 21x having the second movable electrode finger 622 becomes large. On the other hand, the capacitance change of the Y-axis sensor unit 21y having the first fixed electrode fingers 74 and the other first fixed electrode fingers 75 and the first movable electrode fingers 722 arranged in the Y-axis direction is almost the same. You can see that it doesn't appear.

  Next, when stress in the Y-axis direction is applied to the structure 5 in which the Y-axis sensor unit 21y and the X-axis sensor unit 21x are arranged side by side in the Y-axis direction (first direction). The graph of FIG. 9 shows the results of verifying the capacitance changes of the Y-axis sensor unit 21y and the X-axis sensor unit 21x constituting the acceleration sensor element 20.

  As shown in the graph of FIG. 9, when a stress in the Y-axis direction is applied, the second fixed electrode fingers 64 and 65 arranged in the X-axis direction, the second movable electrode finger 622, Almost no change in the capacitance of the X-axis sensor unit 21x having On the other hand, it can be seen that a capacitance change appears in the Y-axis sensor unit 21y having the first fixed electrode fingers 74 and 75 and the first movable electrode finger 722 arranged in the Y-axis direction.

  As described above, when the adhesive 18 is applied to the entire joint surface of the acceleration sensor element 20 and is fixed, when stress is applied in one direction, the second fixed electrode is applied in the direction in which the stress is applied. Since the fingers 64 and 65 and the second movable electrode finger 622 are arranged or the first fixed electrode fingers 74 and 75 and the first movable electrode finger 722 are arranged, the stress application direction (deformation direction) ) Coincides with the detection direction of the capacitance change, and the influence on the capacitance change becomes large.

  From such verification results, the inventor determines the influence on the detection accuracy of the structure 5 (acceleration sensor element 20) due to the stress caused by the adhesive 18 being applied and the heat stress after the adhesive 18 is cured or after the curing. We found that it is possible to reduce. Hereinafter, a specific configuration of the application and arrangement of the adhesive 18 will be described with reference to FIG. 2B.

  As shown in FIG. 2B, the adhesive 18 as a bonding material is outside the outline of the X-axis sensor unit 21x as the second sensor element in a plan view from the normal direction of the lower surface 20r of the acceleration sensor element 20. In the present embodiment, it is located outside the Y-axis direction and overlaps with the Y-axis sensor unit 21y as the first sensor element, and crosses the acceleration sensor element 20 along the X-axis direction (second direction). It is arranged in a belt shape. Here, the strip-shaped adhesive 18 is a state in which it extends with a width dimension in a direction (Y-axis direction in the present configuration) orthogonal to the extending direction (X-axis direction in the present configuration). Say. And the structure 5 (acceleration sensor element 20) is joined to the 1st base material 11 (base | substrate) of the package 7 by the adhesive agent 18 arrange | positioned in this way.

  As described above, the adhesive 18 for bonding the container 25 of the acceleration sensor element 20 to the base body is the second sensor in a plan view from the normal direction of the outer surface of the container 25 (the lower surface 20r of the acceleration sensor element 20). Since it is located outside the contour of the element (X-axis sensor portion 21x) and is provided in a strip shape along the X-axis direction (second direction), the bonding stress of the adhesive 18 acts strongly in the X-axis direction. As a result, the container 25 in the portion where the adhesive 18 is disposed is greatly deformed in the X-axis direction, and the deformation in the Y-axis direction (first direction) is small.

  Therefore, the X-axis sensor unit 21x in which the second fixed electrode fingers 64 and 65 and the second movable electrode finger 622 are arranged in a comb-tooth shape along the X-axis direction has a capacitance due to deformation in the X-axis direction. However, since the adhesive 18 is located outside the contour of the X-axis sensor unit 21x, the X-axis sensor unit 21x is out of the deformation region of the container 25 due to the stress of the adhesive 18, The influence of the change in capacitance can be reduced.

  Further, the Y-axis sensor unit 21y in which the first fixed electrode fingers 74 and 75 and the first movable electrode fingers 722 are arranged in a comb shape along the Y-axis direction is used for the container 25 due to the stress of the adhesive 18. Although in the deformation region in the X-axis direction, since the direction in which the capacitance is detected is the Y-axis direction, even if the container 25 is deformed in the X-axis direction, it is not easily affected. In other words, since the Y-axis sensor unit 21y detects a change in electrostatic capacity in the Y-axis direction with a small deformation of the container 25, it is difficult to be affected.

  Accordingly, even if two sensor elements (Y-axis sensor unit 21y and X-axis sensor unit 21x) for detecting acceleration in different directions (Y-axis direction and X-axis direction) are provided, the container 25 due to the stress of the adhesive 18 is provided. Due to this deformation, it is possible to reduce a decrease in detection accuracy due to unnecessary fluctuations occurring in the detected capacitance. Further, since the arrangement of the adhesive 18 can be set to a position overlapping the Y-axis sensor portion 21y in a plan view from the normal direction of the outer surface that is the outer surface of the container 25, the container 25 in the plan view Two sensor elements (the Y-axis sensor unit 21y and the X-axis sensor unit 21x) can be accommodated without increasing the size.

  According to the physical quantity sensor 1 according to the first embodiment as described above, the two sensor elements (Y-axis sensor unit 21y and X-axis sensor unit 21x) for detecting acceleration and the adhesive 18 are arranged as described above. By doing so, it is possible to reduce a decrease in detection accuracy due to unnecessary fluctuation caused by deformation of the container 25 due to the stress of the adhesive 18.

  In the first embodiment described above, in the acceleration sensor element 20, a configuration in which three sensor elements (X-axis sensor unit 21x, Y-axis sensor unit 21y, and Z-axis sensor unit 21z) are housed in the container 25 is an example. As described above, the acceleration sensor element does not necessarily include three sensor units, and can be an acceleration sensor element capable of detecting one or two axes necessary depending on the application. Hereinafter, the acceleration sensor element will be described as application example 1, application example 2, and application example 3 with reference to FIG. 10, FIG. 11, and FIG.

(Application 1)
First, an application example 1 of the acceleration sensor element will be described with reference to FIG. FIG. 10 is a plan view showing Application Example 1 of the sensor element. In the first application example, the Y-axis direction is the first direction, and the X-axis direction is the second direction.

  As shown in FIG. 10, the acceleration sensor element 201 according to the application example 1 includes one sensor unit 2x. The sensor unit 2x is a part that detects acceleration in one axial direction. Such a sensor unit 2x has the same configuration as that of the X-axis sensor unit 21x described with reference to FIGS. 4 and 6A. Therefore, although detailed description is omitted, the sensor unit 2x includes a fixed electrode finger and a movable electrode finger arranged in the X-axis direction (second direction) and having a longitudinal direction in the Y-axis direction (first direction). , Acceleration in the X-axis direction can be detected. And the sensor part 2x is airtightly accommodated in the container 251 which has the base substrate 221 and the cap part 231 similarly to 1st Embodiment. Such an acceleration sensor element 201 can detect acceleration in one axial direction (X-axis direction in this example).

  The container 251 of the acceleration sensor element 201 is bonded to the first base 11 (substrate) of the package 7 as shown in FIG. 2A by the adhesive 18a as a bonding material on the lower surface (back surface) of the base substrate 221. Yes. The adhesive 18a is disposed at a position overlapping the sensor unit 2x in a plan view from the normal direction of the lower surface (not shown) of the acceleration sensor element 201, and is an acceleration sensor along the Y-axis direction (first direction). Arranged in a strip shape across the element 201.

  The acceleration sensor element 201 is bonded to the first base material 11 (base body) of the package 7 by the adhesive 18a arranged in this manner, whereby a comb is formed along the X-axis direction (second direction). The sensor unit 2x in which the fixed electrode fingers and the movable electrode fingers are arranged in a tooth shape is in the deformation region in the Y-axis direction (first direction) of the container 251 due to the stress of the adhesive 18a, but detects the capacitance. Since the direction to perform is the X-axis direction, it is difficult to be affected by a change in capacitance caused by a change in gap caused by the deformation of the container 251 in the Y-axis direction. In other words, since the sensor unit 2x detects a change in electrostatic capacity in the X-axis direction with small deformation of the container 251, it is difficult to be affected. Therefore, it is possible to reduce a decrease in detection accuracy due to unnecessary fluctuations that occur in the detected capacitance due to the deformation of the container 251 due to the stress of the adhesive 18a.

The acceleration sensor element 201 has been described using the sensor unit 2x having the same configuration as the X-axis sensor unit 21x. However, the sensor unit similar to the Y-axis sensor unit 21y is hermetically accommodated in the container 251. It may be. In this case, the direction parallel to the X-axis is referred to as “X-axis direction” or “second direction”, and the direction parallel to the Y-axis is referred to as “Y-axis direction” or “first direction”. A fixed electrode finger or a movable electrode finger arranged in the axial direction (first direction) and having a longitudinal direction in the X-axis direction (second direction) is provided, and acceleration in the Y-axis direction (second direction) is detected. be able to.
The adhesive 18a is arranged at a position overlapping the sensor unit 2y in a plan view from the normal direction of the lower surface (not shown) of the acceleration sensor element 201, and along the X-axis direction (second direction). It is arranged in a strip shape across the acceleration sensor element 201.

(Application example 2)
Next, an application example 2 of the acceleration sensor element will be described with reference to FIG. FIG. 11 is a plan view showing Application Example 2 of the sensor element. In this application example 2, the Y-axis direction is the first direction, and the X-axis direction is the second direction.

  As shown in FIG. 11, the acceleration sensor element 202 according to the application example 2 includes two sensor units 2x (second sensor elements) and 2y (first sensor elements) arranged side by side in the Y-axis direction (first direction). Sensor element). The sensor unit 2x (second sensor element) is a part that detects acceleration in one axial direction (X-axis direction in this example). Such a sensor unit 2x has the same configuration as that of the X-axis sensor unit 21x described with reference to FIGS. 4 and 6A, and detailed description thereof is omitted, but the X-axis direction (second direction) is omitted. ) And extended in the Y-axis direction, and can detect acceleration in the X-axis direction. The sensor unit 2y (first sensor element) is a part that detects acceleration in one axial direction (Y-axis direction in this example). Such a sensor unit 2y has the same configuration as that of the Y-axis sensor unit 21y described with reference to FIGS. 4 and 6B, and a detailed description thereof will be omitted. A fixed electrode finger or a movable electrode finger extending in the axial direction is provided, and acceleration in the Y-axis direction can be detected. And the sensor part 2x and the sensor part 2y are airtightly accommodated in the container 252 which has the same structure as 1st Embodiment and has the base substrate 222 and the cap part 232. FIG. Such an acceleration sensor element 202 can detect accelerations in two axial directions (in this example, the X-axis direction and the Y-axis direction).

  The container 252 of the acceleration sensor element 202 is connected to the first base material 11 (base body) of the package 7 as shown in FIG. 2A on the lower surface (back surface) of the base substrate 222 by an adhesive 18b as a bonding material. Yes. The adhesive 18b is in a plan view from the normal direction of the lower surface (not shown) of the acceleration sensor element 202, and is outside the contour of the sensor unit 2x, in this embodiment, in the Y-axis direction, and overlaps the sensor unit 2y. It is disposed at a position and is disposed in a strip shape that crosses the acceleration sensor element 202 along the X-axis direction (second direction).

  As described above, the adhesive 18b for joining the container 252 of the acceleration sensor element 202 to the base body is located outside the outline of the sensor unit 2x in a plan view from the normal direction of the outer surface of the container 252 and is in the X-axis direction. Since it is provided in a strip shape along the (second direction), the bonding stress of the adhesive 18b acts strongly in the X-axis direction, and the container 252 in the portion where the adhesive 18b is disposed has the X-axis. The deformation in the Y-axis direction (first direction) is small.

  Therefore, the sensor unit 2x in which the fixed electrode fingers and the movable electrode fingers are arranged in a comb-tooth shape along the X-axis direction is easily affected by the change in capacitance due to the deformation in the X-axis direction, but the adhesive 18b Is located outside the contour of the sensor unit 2x, the sensor unit 2x is out of the deformation region of the container 252 due to the stress of the adhesive 18b, and the influence of the change in capacitance can be reduced.

  In addition, the sensor unit 2y in which the fixed electrode fingers and the movable electrode fingers are arranged in a comb shape along the Y-axis direction is in a deformation region in the X-axis direction of the container 252 due to the stress of the adhesive 18b. Since the direction in which the capacity is detected is the Y-axis direction, even if the container 252 is deformed in the X-axis direction, it is hardly affected. In other words, since the sensor unit 2y detects a change in electrostatic capacity in the Y-axis direction with a small deformation of the container 252, it is difficult to be affected.

  According to such a configuration, the two sensor elements (sensor unit 2y and sensor unit 2x) for detecting acceleration and the adhesive 18b are arranged as described above, whereby the container 252 is deformed by the stress of the adhesive 18b. It is possible to reduce a decrease in detection accuracy due to unnecessary fluctuations caused by. Further, the two sensor elements (the sensor unit 2y and the sensor unit 2x) can be efficiently arranged, and the outer shape of the container 252 can be reduced in size.

(Application 3)
Next, an application example 3 of the acceleration sensor element will be described with reference to FIG. FIG. 12 is a plan view showing Application Example 3 of the sensor element. In this application example 3, the Y-axis direction is the first direction, and the X-axis direction is the second direction.

  As shown in FIG. 12, the acceleration sensor element 203 according to the application example 3 includes two sensor units 2x (second sensor elements) and 2y (first sensor elements) arranged side by side in the X-axis direction (second direction). Sensor element). The sensor unit 2x is a part that detects acceleration in one axial direction (X-axis direction in this example). Such a sensor unit 2x (second sensor element) has the same configuration as the configuration of the X-axis sensor unit 21x described with reference to FIGS. 4 and 6A, and detailed description thereof is omitted. A fixed electrode finger or a movable electrode finger arranged in the axial direction and extending in the Y-axis direction (first direction) is provided, and acceleration in the X-axis direction can be detected. The sensor unit 2y (first sensor element) is a part that detects acceleration in one axial direction (Y-axis direction in this example). Such a sensor unit 2y has the same configuration as that of the Y-axis sensor unit 21y described with reference to FIGS. 4 and 6B, and a detailed description thereof will be omitted. A fixed electrode finger or a movable electrode finger extending in the axial direction is provided, and acceleration in the Y-axis direction can be detected. And the sensor part 2x and the sensor part 2y are airtightly accommodated in the container 253 which has the base substrate 225 and the cap part 233 of the structure similar to 1st Embodiment. Such an acceleration sensor element 203 can detect accelerations in two axial directions (in this example, the X-axis direction and the Y-axis direction).

  The container 253 of the acceleration sensor element 203 is bonded to the first base 11 (base) of the package 7 as shown in FIG. 2A on the back surface of the base substrate 225 by an adhesive 18c as a bonding material. The adhesive 18c is in a plan view from the normal direction of the lower surface (not shown) of the acceleration sensor element 203 and is outside the contour of the sensor unit 2y, in this embodiment, in the X-axis direction, and overlaps the sensor unit 2x. It is disposed at a position and is disposed in a strip shape that crosses the acceleration sensor element 203 along the Y-axis direction (first direction).

  Thus, the adhesive 18c that joins the container 253 of the acceleration sensor element 203 to the base body is located outside the outline of the sensor unit 2y in a plan view from the normal direction of the outer surface of the container 253, and Y Since it is provided in a strip shape along the axial direction (first direction), the bonding stress of the adhesive 18c acts strongly in the Y-axis direction, and the container 253 in the portion where the adhesive 18c is disposed is Deformation greatly occurs in the Y-axis direction, and deformation in the X-axis direction (second direction) is small.

  Therefore, the sensor unit 2y in which the fixed electrode fingers and the movable electrode fingers are arranged in a comb-teeth shape along the Y-axis direction is easily affected by the change in capacitance due to the deformation in the Y-axis direction, but the adhesive 18c. Is located outside the contour of the sensor unit 2y, the sensor unit 2y is out of the deformation region of the container 253 due to the stress of the adhesive 18c, and the influence of the change in capacitance can be reduced.

  In addition, the sensor unit 2x in which the fixed electrode fingers and the movable electrode fingers are arranged in a comb shape along the X-axis direction is in the deformation region in the Y-axis direction of the container 253 due to the stress of the adhesive 18c, but electrostatically Since the direction in which the capacity is detected is the X-axis direction, even if the container 253 is deformed in the Y-axis direction, it is hardly affected. In other words, since the sensor unit 2x detects a change in electrostatic capacity in the X-axis direction with small deformation of the container 253, it is not easily affected.

  According to such a configuration, the deformation of the container 253 due to the stress of the adhesive 18c is achieved by arranging the two sensor elements (sensor unit 2y and sensor unit 2x) for detecting acceleration and the adhesive 18c as described above. It is possible to reduce a decrease in detection accuracy due to unnecessary fluctuations caused by. Further, the two sensor elements (the sensor unit 2y and the sensor unit 2x) can be efficiently arranged, and the outer shape of the container 253 can be reduced in size.

(Modification of bonding material)
Next, a modified example of the bonding material will be described with reference to FIG. FIG. 13 is a cross-sectional view showing a modified example of the bonding material. This modification differs from the first embodiment in the configuration of the bonding material. Hereinafter, the configuration of the bonding material will be mainly described.

  As shown in FIG. 13, the physical quantity sensor 100 according to the modification includes accelerations in the X-axis direction (second direction), the Y-axis direction (first direction), and the Z-axis direction (third direction). It can be used as a three-axis acceleration sensor that can be detected independently. Similar to the first embodiment, the physical quantity sensor 100 includes the package 7 and the structure 5 accommodated in the package 7.

  The structure 5 includes an acceleration sensor element 20 as a sensor element and an IC (integrated circuit) 40 as a circuit element disposed on the acceleration sensor element 20, and the acceleration sensor element 20 as a lower surface of the container. The acceleration sensor element 20 includes at least one of the metal electrode 188 provided on the lower surface 20r of the metal and the metal layer 189 provided on the upper surface (inner bottom surface 10f) of the first base material 11 serving as the base. Is joined to the inner bottom surface 10f inside the package 7 (the accommodation space 17). In this modification, the metal electrode 188 provided on the lower surface 20r of the acceleration sensor element 20 is configured as a protruding electrode (metal bump), and the acceleration sensor element 20 is attached to the package 7 using a bonding method such as flip chip bonding. It joins to the inner bottom surface 10f of the inner side (accommodating space 17). The bonding material can be disposed in the same manner as in the first embodiment described above and Application Examples 1 to 3.

  If the bonding material having such a structure is used, at least one of the metal electrode 188 and the metal layer 189 is bonded in the bonding of the container 25 of the acceleration sensor element 20 (structure 5) and the first base material 11 as the base. As the bonding material, for example, a widely used bonding method such as flip chip bonding can be used.

Second Embodiment
Next, a physical quantity sensor according to the second embodiment will be described with reference to FIG. FIG. 14 is a cross-sectional view illustrating a schematic configuration of a physical quantity sensor according to the second embodiment. In the following description, the three axes orthogonal to each other will be described using the X axis, the Y axis, and the Z axis, as in the first embodiment. Further, for convenience of explanation, in the plan view when viewed from the Z-axis direction, the surface on the + Z-axis direction side that is the lid side is the upper surface, and the surface on the opposite side to the −Z-axis direction side is the lower surface. Sometimes. Moreover, in the following description, it demonstrates centering around difference with 1st Embodiment mentioned above, The description is abbreviate | omitted about the same matter.

  As shown in FIG. 14, the physical quantity sensor 1A according to the second embodiment can independently detect the accelerations in the X-axis direction, the Y-axis direction, and the Z-axis direction as in the first embodiment. It can be used as a three-axis acceleration sensor. Such a physical quantity sensor 1A includes a package 7A and a structure 5A accommodated in the package 7A. The structure 5A includes an IC (integrated circuit) 40A as a circuit element and an acceleration sensor element 20 as a sensor element disposed on the IC 40A. The lower surface 40r of the IC 40A is formed on the package 7A by the adhesive layer 41. It is joined inside (accommodating space 17A).

(Package 7A)
The package 7A is connected to the third base 13A via the sealing member 14 and the base 10A composed of the first base 11A, the second base 12A, and the third base 13A. And a lid portion 15 as a lid body. Since the configuration of the package 7A is the same as that of the first embodiment, detailed description thereof is omitted.

  In the package 7A, a recess (cavity) for housing the structure 5A is formed by the second base material 12A and the third base material 13A, which are annular bodies from which the central portion has been removed. The package 7A is provided with an accommodation space (internal space) 17A which is a sealed space by closing the openings of these recesses (cavities) with a lid portion 15 as a lid, and a structure is provided in the accommodation space 17A. The body 5A can be accommodated. By storing the structural body 5A in such an accommodation space 17A, a compact and high-performance physical quantity sensor 1A can be obtained. A part of the wiring patterns and electrode pads (terminal electrodes) formed on the base portion 10A including the first base material 11A and the second base material 12A are not shown. Moreover, although the 1st base material 11A has shown the example comprised by one board | substrate, as shown in 1st Embodiment, the laminated substrate which laminated | stacked the several board | substrate can also be applied. In this case, similarly to the first embodiment, a wiring pattern can be provided between the respective substrates.

  Since the constituent materials of the first base material 11A, the second base material 12A, the third base material 13A, and the lid portion 15 are the same as those in the first embodiment, the description thereof is omitted. A plurality of internal terminals 19A are arranged on the upper surface of the second base material 12A, and a plurality of external terminals 16A are arranged on the outer bottom surface 10r of the package 7A, which is the lower surface of the first base material 11A. Yes. Each internal terminal 19A is electrically connected to a corresponding external terminal 16A through an internal wiring (not shown) formed in the base portion 10A.

(Structure 5A)
The structure 5A includes an IC 40A as a circuit element, and an acceleration sensor element 20 as a sensor element disposed on the IC 40A. The IC 40A has the lower surface 40r side connected to the package 7A through the adhesive layer 41. The acceleration sensor element 20 is attached to the upper surface 40f of the IC 40A via an adhesive 18 as a bonding material.

  Note that the adhesive 18 for attaching the acceleration sensor element 20 to the IC 40A is arranged in the same configuration as in the first embodiment. Since such an adhesive 18 is the same as that of the first embodiment, description thereof is omitted. In addition, the functional configuration of the physical quantity sensor 1A and the configuration of the acceleration sensor element 20 are the same as those in the first embodiment, and a description thereof will be omitted.

  The acceleration sensor element 20 and the IC 40A constituting the structure 5A are electrically connected by a bonding wire 43A. The IC 40A is electrically connected to an internal terminal 19A provided on the package 7A (the upper surface of the second base 12A) by a bonding wire 42A. The internal terminals 19A and the external terminals 16A are made of, for example, a metal wiring material such as tungsten (W) or molybdenum (Mo) that is screen-printed at a predetermined position and baked, on which nickel (Ni), gold ( It can be formed by a method of plating such as Au).

  The IC 40A includes, for example, a drive circuit that drives the acceleration sensor element 20, and a detection circuit (signal processing unit) that detects acceleration in the X-axis, Y-axis, and Z-axis directions based on signals from the acceleration sensor element 20. 45), an output circuit (output unit 46) for converting a signal from the detection circuit into a predetermined signal and outputting the signal. The IC 40A has a plurality of electrode pads (not shown) on the upper surface 40f, and each electrode pad is electrically connected to the internal terminal 19A of the second base 12A via the bonding wire 42A. Is electrically connected to the connection terminal 29 of the acceleration sensor element 20 through the bonding wire 43A. Thereby, the acceleration sensor element 20 can be controlled.

  According to the physical quantity sensor 1A according to the second embodiment described above, the lower surface 40r of the IC 40A is connected to the inner side (the accommodating space 17A) of the package 7A by the adhesive layer 41. Thus, by laminating the first base 11A of the package 7A and the IC 40A, it is possible to increase the arrangement efficiency in the planar direction and reduce the area of the physical quantity sensor 1A in plan view. Further, by providing the two sensor elements for detecting acceleration and the adhesive 18 in the same arrangement as in the first embodiment, the detection accuracy due to unnecessary fluctuation caused by the deformation of the container 25 due to the stress of the adhesive 18 can be improved. Reduction can be reduced.

<Third Embodiment>
Next, a physical quantity sensor according to the third embodiment will be described with reference to FIGS. 15A and 15B. FIG. 15A is a plan view illustrating a schematic configuration of a physical quantity sensor according to the third embodiment. For convenience of explanation, FIG. 15A shows a state where the lid is omitted. FIG. 15B is a cross-sectional view illustrating a schematic configuration of the physical quantity sensor according to the third embodiment. In the following description, the three axes orthogonal to each other will be described using the X axis, the Y axis, and the Z axis, as in the first embodiment. For convenience of explanation, in the plan view when viewed from the Z-axis direction, the surface on the + Z-axis direction side that is the sensor element side is the upper surface, and the surface on the opposite side to the −Z-axis direction side is the lower surface. Sometimes. Moreover, in the following description, it demonstrates centering around difference with 1st Embodiment mentioned above, The description is abbreviate | omitted about the same matter.

  As shown in FIGS. 15A and 15B, the physical quantity sensor 1B according to the third embodiment includes a triaxial acceleration sensor that can independently detect accelerations in the X-axis direction, the Y-axis direction, and the Z-axis direction. It can be used as a composite sensor (6-axis sensor) including a triaxial angular velocity sensor capable of independently detecting angular velocities in the X axis direction, the Y axis direction, and the Z axis direction.

  Such a physical quantity sensor 1B includes a package 7B, an IC (integrated circuit) 40B as a circuit element housed in the package 7B, and a sensor element attached to the upper surface of the IC 40B via an adhesive 18B. The acceleration sensor element 20B and the angular velocity sensor element 300B are included, and the lower surface of the IC 40B is joined to the inside of the package 7B (accommodating space S3).

  The package 7B is a base part 10B configured by a base substrate 161 and an annular wall part 162 stacked on the base substrate 161, and a lid body connected to the wall part 162 via a sealing member 160. And a lid 169. Since the configuration of the package 7B is the same as that of the first embodiment, detailed description thereof is omitted.

  In the package 7B, a recess (cavity) that accommodates the acceleration sensor element 20B, the angular velocity sensor element 300B, and the like is formed by the base substrate 161 and the wall portion 162 that is an annular body from which the central portion is removed. The package 7B is provided with a housing space (internal space) S3 which is a sealed space by closing the opening of the recessed portion with the lid 169, and the IC 40B and the upper surface of the IC 40B are bonded to the housing space S3. The acceleration sensor element 20B and the angular velocity sensor element 300B attached via the agent 18B can be accommodated. Here, the adhesive 18 </ b> B is arranged in the same configuration as in the first embodiment.

  A part of the wiring pattern and electrode pads (terminal electrodes) formed on the base portion 10B including the base substrate 161 and the wall portion 162 are not shown. In addition, although the base substrate 161 shows an example of a single substrate, a stacked substrate in which a plurality of substrates are stacked can be applied as shown in the first embodiment. In this case, similarly to the first embodiment, a wiring pattern can be provided between the respective substrates. The constituent materials of the base substrate 161, the wall portion 162, the sealing member 160, and the lid portion 169 are the same as those in the first embodiment, and thus the description thereof is omitted.

  The IC 40B is, for example, a drive circuit that drives the acceleration sensor element 20B and the angular velocity sensor element 300B, and a detection circuit that detects acceleration in the X-axis, Y-axis, and Z-axis directions based on signals from the acceleration sensor element 20B. , A detection circuit for detecting the angular velocities in the X-axis, Y-axis, and Z-axis directions based on a signal from the angular velocity sensor element 300B, and an output for converting the signals from the respective detection circuits into predetermined signals and outputting the signals. Circuits etc. are included.

  The IC 40B has a plurality of electrode pads 145B on the upper surface, and each electrode pad 145B is electrically connected to a connection terminal 165 provided on the base substrate 161 via a bonding wire 164. Each electrode pad 145B is electrically connected to the connection terminal 29B of the acceleration sensor element 20B via the bonding wire 167. Each electrode pad 145B is electrically connected to the terminal 310B of the angular velocity sensor element 300B via the bonding wire 168. Thus, the IC 40B can control the acceleration sensor element 20B and the angular velocity sensor element 300B.

  Note that the configuration of the acceleration sensor element 20B is the same as that of the acceleration sensor element 20 of the first embodiment, and a description thereof will be omitted. Further, the acceleration sensor element 20B is not necessarily limited to the angular velocity sensor element 300B capable of detecting in the three-axis directions, but may be an acceleration sensor element capable of detecting two axes or one axis necessary for the application (acceleration shown in FIG. 10). Sensor element 201 or acceleration sensor elements 202 and 203 shown in FIGS. 11 and 12) can be used.

  The angular velocity sensor element 300B includes three sensor units (not shown) that detect the respective angular velocities in the X-axis direction, the Y-axis direction, and the Z-axis direction that are housed in the package. The three sensor units may use, for example, quartz as a vibrator, and may use a vibration gyro sensor that detects angular velocity from the Coriolis force applied to the vibrating object, or a ceramic or silicon gyro sensor as the vibrator. May be. Note that the three sensor units for detecting the respective angular velocities in the X-axis direction, the Y-axis direction, and the Z-axis direction one by one have a configuration in which one sensor unit is accommodated in one package (see FIG. 17A in the subsequent stage). 17B, the angular velocity sensor element 300) described with reference to FIG. 17B, or a configuration in which three sensor units are accommodated in one package. In addition, the angular velocity sensor element 300B is not necessarily limited to three axes, and an angular velocity sensor element that can detect two axes or one axis necessary depending on the application can be used.

  A plurality of external terminals 163 are provided on the lower surface of the base substrate 161. The plurality of external terminals 163 correspond to each of the external terminals 163 and are electrically connected to connection terminals 165 provided on the upper surface of the base substrate 161 via internal wiring (not shown).

  According to the physical quantity sensor 1B according to the third embodiment described above, the sensor element for detecting acceleration and the adhesive 18B are provided in the same arrangement as in the first embodiment, whereby the package 7B due to the stress of the adhesive 18B ( It is possible to reduce a decrease in detection accuracy due to unnecessary fluctuation caused by deformation of the base substrate 161). In addition, a composite inertial sensor including the acceleration sensor element 20B and the angular velocity sensor element 300B can be easily configured, and angular velocity data can be acquired in addition to acceleration data.

<Fourth embodiment>
Next, a physical quantity sensor according to the fourth embodiment will be described with reference to FIGS. 16A and 16B. FIG. 16A is a plan view illustrating a schematic configuration of a physical quantity sensor according to the fourth embodiment. For convenience of explanation, FIG. 16A shows a state where the lid is omitted. FIG. 16B is a cross-sectional view illustrating a schematic configuration of the physical quantity sensor according to the fourth embodiment. In the following description, the three axes orthogonal to each other will be described using the X axis, the Y axis, and the Z axis, as in the first embodiment. For convenience of explanation, in the plan view when viewed from the Z-axis direction, the surface on the + Z-axis direction side that is the sensor element side is the upper surface, and the surface on the opposite side to the −Z-axis direction side is the lower surface. Sometimes. Moreover, in the following description, it demonstrates centering around difference with 1st Embodiment mentioned above, The description is abbreviate | omitted about the same matter.

  As shown in FIGS. 16A and 16B, the physical quantity sensor 1C according to the fourth embodiment includes a triaxial acceleration sensor that can independently detect accelerations in the X-axis direction, the Y-axis direction, and the Z-axis direction. It can be used as a composite sensor (6-axis sensor) including a triaxial angular velocity sensor capable of independently detecting angular velocities in the X axis direction, the Y axis direction, and the Z axis direction.

  Such a physical quantity sensor 1C includes a package 7C, a frame 171 accommodated in the package 7C, an IC (integrated circuit) 40C as a circuit element, an acceleration sensor element 20C and an angular velocity sensor element 300C as sensor elements. ,including. The frame 171 is attached to the base substrate 172 via a bonding member (not shown). Further, the acceleration sensor element 20C and the angular velocity sensor element 300C are attached to the upper surface of the frame 171 via an adhesive 18C as a bonding material. Here, the adhesive 18C is arranged in the same configuration as in the first embodiment. The IC 40C is attached to the upper surface of the frame 171 via an adhesive layer 41C.

  The package 7 </ b> C is a base portion 10 </ b> C constituted by a base substrate 172 and an annular wall portion 173 stacked on the base substrate 172, and a lid body connected to the wall portion 173 via a sealing member 184. And a lid portion 186. Since the configuration of the package 7C is the same as that of the first embodiment, detailed description thereof is omitted.

  In the package 7C, a recess (cavity) that accommodates the acceleration sensor element 20C, the angular velocity sensor element 300C, and the like is formed by the base substrate 172 and the wall portion 173 that is an annular body from which the central portion is removed. The package 7C is provided with a housing space (internal space) S4 which is a sealed space by closing the opening of the recessed portion with a lid 186. In the housing space S4, the frame 171, the IC 40C, the acceleration The sensor element 20C and the angular velocity sensor element 300C can be accommodated. In the present embodiment, the frame 171 corresponds to a base body to which the acceleration sensor element 20C and the angular velocity sensor element 300C are attached.

  A part of the wiring pattern and electrode pads (terminal electrodes) formed on the base portion 10C including the base substrate 172 and the wall portion 173 are not shown. In addition, although the base substrate 172 shows an example of a single substrate, as shown in the first embodiment, a stacked substrate in which a plurality of substrates are stacked can also be applied. In this case, similarly to the first embodiment, a wiring pattern can be provided between the respective substrates. The constituent materials of the base substrate 172, the wall portion 173, the sealing member 184, and the lid portion 186 are the same as those in the first embodiment, and a description thereof will be omitted.

  The IC 40C is, for example, a drive circuit that drives the acceleration sensor element 20C or the angular velocity sensor element 300C, or a detection circuit that detects acceleration in each of the X-axis, Y-axis, and Z-axis directions based on a signal from the acceleration sensor element 20C. , A detection circuit for detecting the angular velocities in the X-axis, Y-axis, and Z-axis directions based on signals from the angular velocity sensor element 300C, and an output for converting the signals from the respective detection circuits into predetermined signals and outputting them Circuits etc. are included.

  The IC 40C has a plurality of electrode pads (not shown) on the upper surface, and each electrode pad is electrically connected to connection terminals 175 and 177 provided on the base substrate 172 via bonding wires 174 and 176. ing. The other electrode pads are electrically connected to the terminal 178 of the acceleration sensor element 20C via the bonding wire 179. Further, each other electrode pad is electrically connected to the terminal 181 of the angular velocity sensor element 300C through the bonding wire 182. Thus, the IC 40C can control the acceleration sensor element 20C and the angular velocity sensor element 300C.

  The configuration of the acceleration sensor element 20C is the same as that of the acceleration sensor element 20 of the first embodiment, and a description thereof will be omitted. Further, the acceleration sensor element 20C is not necessarily limited to the angular velocity sensor element 300C capable of detecting in the three-axis directions, but may be an acceleration sensor element capable of detecting two axes or one axis necessary for the application (acceleration shown in FIG. 10). Sensor element 201 or acceleration sensor elements 202 and 203 shown in FIGS. 11 and 12) can be used.

  The angular velocity sensor element 300C includes three sensor units (not shown) that detect the respective angular velocities in the X-axis direction, the Y-axis direction, and the Z-axis direction that are housed in the package. The three sensor units may use, for example, quartz as a vibrator, and may use a vibration gyro sensor that detects angular velocity from the Coriolis force applied to the vibrating object, or a ceramic or silicon gyro sensor as the vibrator. May be. Note that the three sensor units for detecting the respective angular velocities in the X-axis direction, the Y-axis direction, and the Z-axis direction one by one have a configuration in which one sensor unit is accommodated in one package (see FIG. 17A in the subsequent stage). 17B), or a configuration in which three sensor units are accommodated in one package. Further, the angular velocity sensor element 300C is not necessarily limited to three axes, and an angular velocity sensor element capable of detecting two axes or one axis necessary depending on the application can be used.

  A plurality of external terminals 185 are provided on the lower surface of the base substrate 172. The plurality of external terminals 185 correspond to the connection terminals 175 and 177 provided on the upper surface of the base substrate 172, and are electrically connected via an internal wiring (not shown).

  According to the physical quantity sensor 1C according to the fourth embodiment described above, as in the first embodiment, the thickness of the bottom plate (base substrate 172) of the package 7C in which the length of each side of the outer periphery is defined is optimized. As a result, it is possible to reduce stress caused by heating and melting at the time of assembling the package 7C or heating when the physical quantity sensor 1C is mounted on a circuit board or the like, and the output voltage of the physical quantity sensor 1C caused by this stress can be reduced. Temperature hysteresis can be reduced. In addition, a composite inertial sensor including the acceleration sensor element 20C and the angular velocity sensor element 300C can be easily configured, and angular velocity data can be acquired in addition to acceleration data.

(Angular velocity sensor element)
Here, an example of the angular velocity sensor element will be described with reference to FIGS. 17A and 17B. FIG. 17A is a plan view showing an example of an angular velocity sensor element used in an inertial measurement unit or the like. For convenience of explanation, the lid (lid) is omitted in FIG. 17A. FIG. 17B is a cross-sectional view of FIG. 17A showing an example of the angular velocity sensor element. In FIGS. 17A and 17B, the three axes orthogonal to each other are defined as an x-axis, a y-axis, and a z-axis, and the z-axis coincides with the thickness direction of the vibration device. A direction parallel to the x-axis is referred to as “x-axis direction”, a direction parallel to the y-axis is referred to as “y-axis direction”, and a direction parallel to the z-axis is referred to as “z-axis direction”.

  An angular velocity sensor element 300 shown in FIGS. 17A and 17B includes a gyro element 342 and a package 349 that houses the gyro element 342. Hereinafter, the gyro element 342 and the package 349 will be sequentially described in detail.

  FIG. 17A shows the gyro element 342 viewed from the upper side (the lid 343 side). The gyro element 342 includes a detection signal electrode, a detection signal wiring, a detection signal terminal, a detection ground electrode, a detection ground wiring, a detection ground terminal, a drive signal electrode, a drive signal wiring, a drive signal terminal, a drive ground electrode, and a drive ground. Wiring, a drive ground terminal, and the like are provided, but are omitted in the figure.

  The gyro element 342 is an “out-of-plane detection type” sensor that detects an angular velocity around the z-axis. Although not shown, the gyro element 342 includes a base material and a plurality of electrodes, wirings, and terminals provided on the surface of the base material. It consists of The gyro element 342 can be made of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. Among these, the gyro element 342 is preferably made of quartz. Thereby, the gyro element 342 which can exhibit the outstanding vibration characteristic (frequency characteristic) is obtained.

  Such a gyro element 342 includes a so-called double T-shaped vibrating body 344, a first support portion 351 and a second support portion 352 as support portions for supporting the vibrating body 344, a vibrating body 344, and a first support portion. The first connection beam 371 and the second connection beam 372 that connect the 351, and the third connection beam 373 and the fourth connection beam 374 that connect the vibrating body 344 and the second support portion 352.

  The vibrating body 344 has an extension in the xy plane and has a thickness in the z-axis direction. Such a vibrating body 344 includes a base 410 located at the center, a first detection vibrating arm 421 and a second detection vibrating arm 422 extending from the base 410 to both sides along the y-axis direction, and x from the base 410. A first connecting arm 431 and a second connecting arm 432 extending on both sides along the axial direction, and a first drive vibrating arm extending on both sides along the y-axis direction from the tip of the first connecting arm 431 441 and the third drive vibrating arm 442, and a second drive vibrating arm 443 and a fourth drive vibrating arm 444 extending from the tip of the second connecting arm 432 to both sides along the y-axis direction. ing.

  The first drive vibrating arm 441 and the third drive vibrating arm 442 may extend from the middle of the extending direction of the first connecting arm 431. Similarly, the second drive vibrating arm 443 and the fourth drive vibrating arm. 444 may extend from the middle of the extending direction of the second connecting arm 432. Further, in this embodiment, the first connecting arm 431 extending from the base portion 410, the first driving vibrating arm 441, the third driving vibrating arm 442, the second driving vibrating arm 443, and the fourth driving from the second connecting arm 432. Although the configuration in which the vibrating arm 444 extends has been described, the base 410, the first connecting arm 431, and the second connecting arm 432 may be included as a base. That is, a configuration in which the first drive vibration arm, the second drive vibration arm, the third drive vibration arm, and the fourth drive vibration arm extend from the base is also possible.

  The gyro element 342 configured as described above detects the angular velocity ω around the z-axis as follows. When an electric field is generated between the drive signal electrode (not shown) and the drive ground electrode (not shown) in a state where the angular velocity ω is not applied, the gyro element 342 causes the drive vibrating arms 441, 443, 442, and 444 to Bending vibration is performed in the x-axis direction. When an angular velocity is applied to the gyro element 342 around the z axis in the state where the driving vibration is performed, vibration in the y axis direction is generated. That is, the Coriolis force in the y-axis direction acts on the drive vibrating arms 441, 443, 442, 444 and the connecting arms 431, 432, and in response to this vibration, the detected vibration in the x-axis direction of the detection vibrating arms 421, 422 occurs. Excited. Then, the detection signal electrode (not shown) and the detection ground electrode (not shown) can detect the distortion of the detection vibrating arms 421 and 422 generated by this vibration, and the angular velocity can be obtained.

  The package 349 containing the gyro element 342 will be described. The package 349 accommodates the gyro element 342. Note that the package 349 may store an IC chip or the like for driving the gyro element 342 in addition to the gyro element 342. Such a package 349 has a substantially rectangular shape in plan view (xy plan view).

  The package 349 has a base 341 having a recess opened on the upper surface, and a lid (lid body) 343 joined to the base so as to close the opening of the recess. The base 341 includes a plate-like bottom plate 361 and a frame-like side wall 362 provided on the peripheral edge of the upper surface of the bottom plate 361. Such a package 349 has a storage space inside, and the gyro element 342 is stored and installed in the storage space in an airtight manner.

  The gyro element 342 is made of conductive material such as solder and conductive adhesive (adhesive in which conductive filler such as silver metal particles is dispersed in a resin material) at the first support portion 351 and the second support portion 352. It is fixed to the upper surface of the bottom plate 361 through the elastic fixing member 358. Since the first support portion 351 and the second support portion 352 are located at both ends of the gyro element 342 in the y-axis direction, by fixing such portions to the bottom plate 361, the vibrating body 344 of the gyro element 342 can be The gyro element 342 can be stably fixed to the bottom plate 361 by being held and supported.

  The conductive fixing member 358 corresponds to the two detection signal terminals 364, the two detection ground terminals 354, the drive signal terminal 384, and the drive ground terminal 394 provided in the first support portion 351 and the second support portion 352. Six (contact) and spaced apart from each other are provided. Further, on the upper surface of the bottom plate 361, six connection pads 350 corresponding to the two detection signal terminals 364, the two detection ground terminals 354, the drive signal terminal 384, and the drive ground terminal 394 are provided, and the conductive fixing member Each of the connection pads 350 and any one of the corresponding terminals are electrically connected via 358. Further, the connection pad 350 is electrically connected to the external terminal 380 via an unillustrated internal wiring or through electrode.

  According to the gyro element 342 having such a configuration, a required angular velocity in one axial direction can be detected efficiently and with high accuracy.

(Inertial measurement unit)
Next, an inertial measurement unit (IMU) as an inertial measurement device will be described with reference to FIGS. 18 and 19. FIG. 18 is an exploded perspective view showing a schematic configuration of the inertial measurement unit. FIG. 19 is a perspective view showing an arrangement example of inertial sensor elements of the inertial measurement unit.

  As shown in FIG. 18, an inertial measurement unit 3000 as an inertial measurement device includes an outer case 301, a joining member 310, a sensor module 325 including an inertial sensor element, and the like. In other words, the sensor module 325 is joined (inserted) with the joining member 310 interposed in the interior 303 of the outer case 301. The sensor module 325 includes an inner case 320 and a substrate 315. In order to make the explanation easier to understand, the part names are the outer case and the inner case, but may be referred to as the first case and the second case.

  The outer case 301 is a pedestal obtained by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resins, or composite materials of metals and resins may be used. Similar to the overall shape of the inertial measurement unit 3000 described above, the outer shape of the outer case 301 is a rectangular parallelepiped in plan view, and each has a through hole (an idiot hole) in the vicinity of two apexes located in the diagonal direction of the square. ) 302 is formed. The hole is not limited to the through hole (idiot hole) 302. For example, a notch that can be screwed with a screw (notch is formed in the corner portion of the outer case 301 where the through hole (idiot hole) 302 is located). (Structure to be formed) may be formed and screwed, or a flange (ear) may be formed on the side surface of the outer case 301 and the flange portion may be screwed.

  The outer case 301 is a box shape with a rectangular parallelepiped outer shape, and an inner portion 303 (inner side) is an inner space (package) surrounded by a bottom wall 305 and a side wall 304. In other words, the outer case 301 has a box shape with one surface facing the bottom wall 305 as an opening surface, and covers most of the opening portion of the opening surface (so as to close the opening portion). 325 is accommodated, and the sensor module 325 is exposed from the opening (not shown). Here, the opening surface facing the bottom wall 305 is the same surface as the upper surface 307 of the outer case 301. In addition, the planar shape of the inside 303 of the outer case 301 is a hexagonal shape with the corners of the two apexes of the square chamfered, and the two chamfered apexes correspond to the positions of the through holes (stupid holes) 302. Yes. Further, in the cross-sectional shape (thickness direction) of the interior 303, the bottom wall 305 is formed with a first joint surface 306 as a bottom wall that is one step higher than the central portion at the peripheral edge in the interior 303, that is, the interior space. That is, the first joint surface 306 is a part of the bottom wall 305 and is a stepped portion formed in a ring shape so as to surround the central portion of the bottom wall 305 in a plan view. This is a surface having a small distance from the opening surface (the same surface as the upper surface 307).

  In addition, although the example in which the outer shape of the outer case 301 is a rectangular parallelepiped with a substantially square planar shape and a box shape without a lid has been described, the outer shape of the outer case 301 is not limited to this, and the planar shape of the outer case 301 is, for example, It may be a polygon such as a square, the corner of the polygon may be chamfered, or may be a planar shape with curved sides. Further, the planar shape of the inside 303 (inside) of the outer case 301 is not limited to the hexagon described above, but may be a square (square) such as a square, or another polygon such as an octagon. Further, the outer shape of the outer case 301 and the planar shape of the inner portion 303 may be similar or may not be similar.

  The inner case 320 is a member that supports the substrate 315 and has a shape that fits inside the outer case 301. Specifically, in a plan view, it is a hexagonal shape in which the corners of the two apexes of the square are chamfered, and provided in the opening 321 that is a rectangular through hole and a surface on the side that supports the substrate 315. A recess 331 is formed. The two chamfered apexes correspond to the position of the through hole (idiot hole) 302 of the outer case 301. The height in the thickness direction (Z-axis direction) is lower than the height from the upper surface 307 of the outer case 301 to the first joint surface 306. In the preferred example, the inner case 320 is also formed by cutting out aluminum, but other materials may be used similarly to the outer case 301.

  On the back surface of the inner case 320 (the surface on the outer case 301 side), guide pins for positioning the substrate 315 and support surfaces (both not shown) are formed. The substrate 315 is set (positioned and mounted) on the guide pins and the support surface and bonded to the back surface of the inner case 320. Details of the substrate 315 will be described later. A peripheral edge portion of the back surface of the inner case 320 is a second bonding surface 322 formed of a ring-shaped plane. The second joint surface 322 is substantially the same shape as the first joint surface 306 of the outer case 301 in a plan view, and when the inner case 320 is set on the outer case 301, the second joint surface 322 is sandwiched between the two members. Two faces will face each other. In addition, about the structure of the outer case 301 and the inner case 320, it is one Example, It is not limited to this structure.

  With reference to FIG. 19, the structure of the board | substrate 315 with which the inertial sensor was mounted is demonstrated. As shown in FIG. 19, the substrate 315 is a multilayer substrate in which a plurality of through holes are formed, and a glass epoxy substrate (glass epoxy substrate) is used. Note that the substrate is not limited to the glass epoxy substrate, and may be a rigid substrate on which a plurality of inertial sensors, electronic components, connectors, and the like can be mounted. For example, a composite substrate or a ceramic substrate may be used.

  A connector 316, an angular velocity sensor 317z, a physical quantity sensor 1 as an acceleration sensor, and the like are mounted on the surface of the substrate 315 (the surface on the inner case 320 side). The connector 316 is a plug-type (male) connector and includes two rows of connection terminals arranged at an equal pitch in the X-axis direction. Preferably, a row has 10 pins, and a total of 20 connection terminals. However, the number of terminals may be appropriately changed according to design specifications.

  An angular velocity sensor 317z as an inertial sensor is a gyro sensor that detects a uniaxial angular velocity in the Z-axis direction. As a preferred example, a vibration gyro sensor that uses quartz as a vibrator and detects an angular velocity from a Coriolis force applied to a vibrating object is used. Note that the present invention is not limited to the vibration gyro sensor, and any sensor that can detect the angular velocity may be used. For example, a sensor using ceramic or silicon may be used as the vibrator.

  In addition, an angular velocity sensor 317x that detects a uniaxial angular velocity in the X-axis direction is mounted on the side surface in the X-axis direction of the substrate 315 so that the mounting surface (mounting surface) is orthogonal to the X-axis. Similarly, an angular velocity sensor 317y that detects the uniaxial angular velocity in the Y-axis direction is mounted on the side surface of the substrate 315 in the Y-axis direction so that the mounting surface (mounting surface) is orthogonal to the Y-axis.

  As the angular velocity sensors 317x, 317y, and 317z, the angular velocity sensor element 300 described above with reference to FIGS. 17A and 17B can be used. Further, the present invention is not limited to the configuration using three angular velocity sensors for each axis, and any sensor that can detect the angular velocity of three axes may be used. For example, one device (package) such as a physical quantity sensor 1 described later. Thus, a sensor device capable of detecting (detecting) three-axis angular velocities may be used.

  The physical quantity sensor 1 similar to that described in the first embodiment is capable of detecting (detecting) acceleration in three directions (three axes) of the X axis, the Y axis, and the Z axis with a single device. The capacitance type acceleration sensor element 20 (see, for example, FIG. 5) processed in the above is used and bonded to the package 7 (see, FIGS. 2A and 2B) using an adhesive 18 (see FIGS. 2A and 2B). have. If necessary, a physical quantity sensor to which the acceleration sensor element 202 capable of detecting the acceleration in the biaxial directions of the X axis and the Y axis or the acceleration sensor element 201 capable of detecting the acceleration in the single axis direction is applied. it can.

  A control IC 319 as a control circuit is mounted on the back surface of the substrate 315 (the surface on the outer case 301 side). The control IC 319 is an MCU (Micro Controller Unit), and includes a storage unit including a nonvolatile memory, an A / D converter, and the like, and controls each unit of the inertial measurement unit 3000 and outputs from the physical quantity sensor 1. Control the signal. The storage unit stores a program that defines the order and contents for detecting acceleration and angular velocity, a program that digitizes detection data and incorporates it into packet data, and accompanying data. In addition, a plurality of electronic components such as circuit components constituting a communication circuit are mounted on the substrate 315.

  According to the inertial measurement unit 3000 as described above, the physical quantity sensor according to the first embodiment using the acceleration sensor element 20 joined to the package 7 (see FIG. 2A) via the adhesive 18 (see FIGS. 2A and 2B). 1 is used, it is possible to reduce a decrease in detection accuracy in output of acceleration data due to deformation of the package 7 caused by heat treatment such as when the inertial measurement unit 3000 is mounted. Therefore, the inertial measurement unit 3000 with improved reliability can be provided.

(Mobile positioning device)
Next, a mobile body positioning apparatus using the physical quantity sensors 1, 1A, 1B, 1C will be described in detail with reference to FIG. Hereinafter, an example in which the physical quantity sensor 1 is used will be described. FIG. 20 is a functional block diagram illustrating a configuration example of the mobile body positioning device.

  As shown in FIG. 20, the mobile positioning device 5000 includes an inertial measurement unit (IMU) 3000 as an inertial measurement device, a GPS (Global Positioning System) reception unit 520 as a reception unit, and a GPS. An acquisition unit 530 that acquires position information of the reception unit 520, a calculation unit 510 that calculates the posture of the moving object, a calculation unit 540 that calculates the position of the moving object that takes into account the current state, and the calculated position of the moving object And a control unit 550 for displaying on the display unit 560 and instructing the communication unit 570 to perform communication.

  The mobile body positioning device 5000 is mounted on a mobile body such as an automobile, a construction machine, or an agricultural machine, and moves closer to the actual state in consideration of the posture of the mobile body calculated by the calculation unit 510. The position of the body can be determined. The position (position information) close to the actual state obtained in this way can contribute to accuracy improvement such as automatic driving control of the moving body based on this position information.

  The mobile positioning device 5000 obtains the position information of the GPS receiver 520 based on the satellite signal on which the position information received by the GPS receiver 520 via the GPS antenna 521 from a positioning satellite such as a GPS satellite is superimposed. Acquisition unit 530 acquires. In the mobile body positioning device 5000, the arithmetic unit 510 detects the physical quantity sensor (acceleration sensor) 1 and the angular velocity sensors 317x, 317y, and 317z included in the inertial measurement unit (IMU) 3000, and the inertial measurement unit 5000 detects inertia. The posture is calculated based on inertial data such as acceleration data and angular velocity data output from the measurement unit 3000. Then, the mobile body positioning device 5000 calculates (positions) the position of the mobile body by correcting the position information acquired by the acquisition unit 530 based on the posture calculated by the calculation unit 510 by the calculation unit 540. .

  An inertial measurement unit (IMU) 3000 includes a physical quantity sensor (acceleration sensor) 1 and angular velocity sensors 317x, 317y, and 317z. As described above, the inertial measurement unit 3000 can reduce a decrease in detection accuracy in the output of acceleration data due to package deformation caused by heat treatment or the like in the physical quantity sensor (acceleration sensor) 1 used. , With increased reliability.

  The calculation unit 510 acquires attitude data on which the inertial measurement unit 3000 is placed based on inertial data such as acceleration data and angular velocity data output from the inertial measurement unit 3000, in other words, the mobile unit positioning device 5000. Calculates the posture of the mounted moving body. Then, the calculation unit 510 outputs the calculated posture data to the calculation unit 540.

  A GPS receiving unit 520 as a receiving unit receives a satellite signal on which position information is superimposed via a GPS antenna 521. Then, the GPS reception unit 520 outputs the received satellite signal to the acquisition unit 530.

  The acquisition unit 530 acquires the position information of the current position where the GPS reception unit 520 is placed based on the transmitted satellite signal, in other words, the position information of the mobile body on which the mobile body positioning device 5000 is mounted. And the acquired position information is output to the calculation unit 540.

  The calculation unit 540 corrects the calculated position information of the moving object obtained by the acquisition unit 530 based on the posture data such as the inclination of the moving object calculated by the calculation unit 510, thereby inclining the moving object. The position (position information) of the moving body closer to the actual state is calculated taking into account the posture such as

  The control unit 550 processes the position (position information) of the moving object calculated by the calculation unit 540 and issues a display instruction to the display unit 560 or instructs the communication unit 570 to communicate with another electronic device. Or

  According to such a mobile body positioning device 5000, the position information of the GPS receiving unit 520 acquired from the satellite signal received by the GPS receiving unit 520 is used to output acceleration data due to package deformation caused by heat treatment or the like. In order to obtain the position of the moving body by correcting based on the posture calculated based on the inertial data output from the inertial measurement unit 3000 that can reduce the decrease in detection accuracy and improve the reliability. It is possible to obtain (position) detailed positional information of the moving body that is closer to the actual state, such as is tilted.

(Portable electronic devices)
Next, a portable electronic device using the physical quantity sensors 1, 1A, 1B, 1C will be described in detail based on FIG. 21 and FIG. FIG. 21 is a plan view schematically showing the configuration of the portable electronic device. FIG. 22 is a functional block diagram illustrating a schematic configuration of the portable electronic device. Hereinafter, an example in which the physical quantity sensor 1 is used will be described. In the following, a wristwatch-type activity meter (active tracker) will be described and described as an example of a portable electronic device.

  As shown in FIG. 19, the wrist device 1000, which is a wristwatch-type activity meter (active tracker), is attached to a part (subject) such as a wrist of a user by means of bands 32, 37, etc. And wireless communication is possible. The physical quantity sensor 1 according to the present invention described above is incorporated in the wrist device 1000 as a sensor that measures acceleration and a sensor that measures angular velocity.

  The wrist device 1000 is housed in the case 30 in which at least the physical quantity sensor 1 is housed, the processing unit 100 (see FIG. 20) that processes output data from the physical quantity sensor 1, and the case 30. The display unit 150 and the translucent cover 71 that closes the opening of the case 30 are provided. A bezel 78 is provided outside the case 30 of the translucent cover 71 of the case 30. A plurality of operation buttons 80 and 81 are provided on the side surface of the case 30. Hereinafter, it will be described in more detail with reference to FIG.

  The acceleration sensor 113 as the physical quantity sensor 1 detects accelerations in the three-axis directions that intersect with each other (ideally orthogonally), and a signal (acceleration signal) corresponding to the magnitude and direction of the detected three-axis acceleration. ) Is output. Further, the angular velocity sensor 114 detects each angular velocity in three axial directions that intersect (ideally orthogonal) each other, and outputs a signal (angular velocity signal) corresponding to the magnitude and direction of the detected three axial angular velocity. .

  In a liquid crystal display (LCD) constituting the display unit 150, for example, position information using the GPS sensor 110 or the geomagnetic sensor 111, an acceleration sensor 113 included in the movement amount / physical quantity sensor 1, an angular velocity, or the like according to various detection modes. Exercise information such as the amount of exercise using the sensor 114, biological information such as the pulse rate using the pulse sensor 115, or time information such as the current time is displayed. Note that the environmental temperature using the temperature sensor 116 can also be displayed.

  The communication unit 170 performs various controls for establishing communication between the user terminal and an information terminal (not shown). The communication unit 170 includes, for example, Bluetooth (registered trademark) (including BTLE: Bluetooth Low Energy), Wi-Fi (registered trademark) (Wireless Fidelity), Zigbee (registered trademark), NFC (Near field communication), and ANT + (registered). The transceiver and the communication unit 170 corresponding to a short-range wireless communication standard such as a trademark are configured to include a connector corresponding to a communication bus standard such as USB (Universal Serial Bus).

  The processing unit 100 (processor) is configured by, for example, an MPU (Micro Processing Unit), a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), or the like. The processing unit 100 executes various processes based on a program stored in the storage unit 140 and a signal input from the operation unit 120 (for example, the operation buttons 80 and 81). The processing by the processing unit 100 includes data processing for each output signal of the GPS sensor 110, the geomagnetic sensor 111, the pressure sensor 112, the acceleration sensor 113, the angular velocity sensor 114, the pulse sensor 115, the temperature sensor 116, and the time measuring unit 130, and the display unit 150. Display processing for displaying an image on the screen, sound output processing for outputting sound to the sound output unit 160, communication processing for communicating with the information terminal via the communication unit 170, power control processing for supplying power from the battery 180 to each unit, etc. Is included.

Such a wrist device 1000 can have at least the following functions.
1. Distance: The total distance from the start of measurement is measured by a highly accurate GPS function.
2. Pace: Displays the current running pace from the pace distance measurement.
3. Average speed: Average speed from the start of average speed driving to the present is calculated and displayed.
4). Elevation: The altitude is measured and displayed by the GPS function.
5. Stride: Steps are measured and displayed even in tunnels where GPS signals do not reach.
6). Pitch: Measures and displays the number of steps per minute.
7). Heart rate: The heart rate is measured and displayed by the pulse sensor.
8). Slope: Measures and displays the slope of the ground during mountain training and trail runs.
9. Auto lap: lap measurement is automatically performed when a predetermined distance or time is set.
10. Exercise calorie consumption: Displays the calorie consumption.
11. Number of steps: Displays the total number of steps from the start of exercise.

  Note that the wrist device 1000 can be widely applied to a running watch, a runner's watch, a multi-sports runner's watch such as a duathlon or a triathlon, an outdoor watch, and a satellite positioning system such as a GPS watch equipped with GPS.

  In the above description, GPS (Global Positioning System) is used as the satellite positioning system, but other Global Navigation Satellite System (GNSS) may be used. For example, one or more satellite positioning systems such as EGNOS (European Geostationary-Satellite Navigation Overlay Service), QZSS (Quasi Zenith Satellite System), GLONASS (GLObal NAvigation Satellite System), GALILEO, BeiDou (BeiDou Navigation Satellite System) May be used. In addition, satellite-based augmentation systems (SBAS) such as WAAS (Wide Area Augmentation System) and EGNOS (European Geostationary-Satellite Navigation Overlay Service) are used for at least one of the satellite positioning systems. Also good.

  Since such a portable electronic device includes the physical quantity sensor 1 and the processing unit 100, the portable electronic device has excellent reliability.

(Electronics)
Next, electronic devices using the physical quantity sensors 1, 1A, 1B, and 1C will be described in detail with reference to FIGS. Hereinafter, an example in which the physical quantity sensor 1 is used will be described.

  First, a mobile personal computer, which is an example of an electronic device, will be described with reference to FIG. FIG. 23 is a perspective view schematically illustrating a configuration of a mobile personal computer that is an example of an electronic apparatus.

  In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 includes a physical quantity sensor 1 that functions as an acceleration sensor, and the control unit 1110 performs control such as posture control based on an output signal such as detection data of the physical quantity sensor 1. Can do.

  FIG. 24 is a perspective view schematically illustrating a configuration of a smartphone (mobile phone) that is an example of an electronic apparatus.

  In this figure, a smart phone 1200 incorporates the physical quantity sensor 1 described above. An output signal such as detection data (acceleration data) detected by the physical quantity sensor 1 is transmitted to the control unit 1201 of the smartphone 1200. The control unit 1201 includes a CPU (Central Processing Unit), recognizes the attitude and behavior of the smartphone 1200 from the received detection data, and changes the display image displayed on the display unit 1208. It is possible to sound a warning sound or a sound effect, or drive a vibration motor to vibrate the main body. In other words, motion sensing of the smartphone 1200 can be performed, and the display content can be changed or sound or vibration can be generated from the measured posture or behavior. In particular, when a game application is executed, a realistic sensation can be experienced.

  FIG. 25 is a perspective view illustrating a configuration of a digital still camera which is an example of an electronic apparatus. In this figure, connection with an external device is also simply shown.

  A display unit 1310 is provided on the back of the case (body) 1302 of the digital still camera 1300, and is configured to display based on an image pickup signal from the CCD. The display unit 1310 displays the subject as an electronic image. Also functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In this digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a physical quantity sensor 1 that functions as an acceleration sensor, and the control unit 1316 performs control such as camera shake correction based on output signal detection data of the physical quantity sensor 1 or the like. be able to.

  Since such an electronic device includes the physical quantity sensor 1 and a control unit (not shown), it has excellent reliability.

  In addition to the personal computer 1100 of FIG. 23, the smartphone (mobile phone) 1200 of FIG. 24, and the digital still camera 1300 of FIG. Device (for example, inkjet printer), laptop personal computer, TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, work Station, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measurements machine Instruments (for example, vehicle, aircraft, and ship instruments), flight simulators, seismometers, pedometers, inclinometers, vibrometers that measure vibrations of hard disks, attitude control devices for flying objects such as robots and drones, automobile autos The present invention can be applied to control devices used for driving inertial navigation.

(Moving body)
Next, an example using the physical quantity sensor 1 as a representative example of a moving body using the physical quantity sensors 1, 1A, 1B, and 1C will be described in detail with reference to FIG. FIG. 26 is a perspective view illustrating a configuration of an automobile which is an example of a moving body.

  As shown in FIG. 26, a physical quantity sensor 1 is built in an automobile 1500. For example, the posture of the vehicle body 1501 can be detected by the physical quantity sensor 1. An output signal including a detection signal of the physical quantity sensor 1 is supplied to a vehicle body posture control device 1502 as a control unit, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and according to the detection result. Thus, the hardness of the suspension can be controlled, and the brakes of the individual wheels 1503 can be controlled. In addition, the physical quantity sensor 1 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine It can be widely applied to electronic control units (ECUs) such as control, inertial navigation control equipment for automatic driving, battery monitors of hybrid vehicles and electric vehicles.

  In addition to the above examples, the physical quantity sensor 1 applied to a moving body is, for example, a posture control such as a bipedal walking robot or a train, a remote control such as a radio control airplane, a radio control helicopter, and a drone or an autonomous type. It can be used in attitude control (automatic operation control) such as attitude control of flying objects, agricultural machinery (agricultural machinery), or construction machinery (construction machinery). As described above, the physical quantity sensor 1 and the respective control units (not shown) are incorporated in realizing the posture control of various moving bodies.

  Since such a moving body includes the physical quantity sensor 1 and a control unit (not shown), it has excellent reliability.

  As described above, the physical quantity sensor, the inertial measurement system, the mobile body positioning device, the electronic device, and the mobile body have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is the same. It can be replaced with any configuration having the above function. In addition, any other component may be added to the present invention.

  In the above-described embodiment, the configuration in which the acceleration sensor element has three sensor units has been described. However, the number of sensor units is not limited to this, and may be one or two. However, it may be four or more. In the above-described embodiment, the acceleration sensor element is used as the sensor element of the physical quantity sensor. However, the physical quantity sensor is not limited to the acceleration sensor element, and may be, for example, a pressure sensor element or an angular velocity sensor. It may be an element. Further, for example, it may be a composite sensor that can simultaneously detect different physical quantities such as acceleration and angular velocity.

  DESCRIPTION OF SYMBOLS 1,1A, 1B, 1C ... Physical quantity sensor, 5 ... Structure, 7 ... Package, 10 ... Base part, 10f ... Inner bottom surface, 10r ... Outer bottom surface, 11 ... First base material, 12 ... Second base material , 13 ... a third substrate, 14 ... a sealing member, 15 ... a lid part as a lid, 16 ... an external terminal, 17 ... an accommodation space, 18, 18a, 18b, 18c ... an adhesive as a bonding material, 19 ... internal terminal, 20 ... acceleration sensor element, 20r ... bottom surface, 21x ... X-axis sensor part, 21y ... Y-axis sensor part, 21z ... Z-axis sensor part, 22 ... base substrate, 22f ... top face, 23 ... cap part, 24 DESCRIPTION OF SYMBOLS ... Glass frit, 25 ... Container, 26 ... Molten metal, 27 ... Sealing hole, 28a, 28b ... Castellation, 29 ... Connection terminal, 40 ... IC as a circuit element, 41 ... Adhesive layer, 42, 43 ... Bonding wire 45 Signal processing unit 46 ... output unit 62 ... second movable unit 64,65 ... second fixed electrode finger 72 ... first movable unit 74,75 ... first fixed electrode finger 100 ... physical quantity Sensors 211, 212, 213... Recess, 211 g... First detection electrode, 211 h... Second detection electrode, 223 .. recess, 291 .. wiring, 300 .. angular velocity sensor element, 611. 621 ... second base, 622 ... second movable electrode finger, 631 ... third connection portion, 632 ... fourth connection portion, 711 ... first support portion, 712 ... second support. Part 721 ... first base part 722 ... first movable electrode finger 731 ... first connection part 732 ... second connection part 1100 ... personal computer 1200 ... smart phone (mobile phone) 1300 ... digital Still camera, 500 ... automobile, 3000 ... inertial measurement unit as inertial measurement unit, 5000 ... mobile positioning device, S2, S3, S4 ... accommodation space (internal space).

Claims (13)

A comb-like fixed electrode finger whose longitudinal direction is along the first direction, and the fixed electrode finger and the gap in the second direction perpendicular to the first direction and whose longitudinal direction is along the first direction A sensor element including comb-like movable electrode fingers facing each other through
A container containing the sensor element;
A substrate to which the container is bonded,
An outer surface of the container parallel to a surface including the first direction and the second direction is bonded to the base body by a bonding material provided in a strip shape along the first direction; Physical quantity sensor. Comb-shaped first fixed electrode fingers whose longitudinal direction is along the second direction, and the first direction in the first direction perpendicular to the second direction is the longitudinal direction along the second direction. A first sensor element including a comb-shaped first movable electrode finger facing the fixed electrode finger of the first electrode through a gap;
A comb-shaped second fixed electrode finger whose longitudinal direction is along the first direction, and the longitudinal direction is along the first direction, and the second fixed electrode finger and the gap in the second direction. A second sensor element including a comb-shaped second movable electrode finger opposed via
A container containing the first sensor element and the second sensor element;
A substrate to which the container is bonded,
The outer surface of the container parallel to the surface including the first direction and the second direction is outside the outline of the second sensor element in a plan view from the normal direction of the outer surface. And a physical quantity sensor which is bonded to the base body by a bonding material provided in a strip shape along the second direction. In claim 2,
The first sensor element and the second sensor element are:
A physical quantity sensor arranged side by side along the first direction or the second direction. In any one of Claims 1 thru | or 3,
The physical quantity sensor, wherein the bonding material is an adhesive or an adhesive. In any one of Claims 2 thru | or 4,
Including a base substrate,
The first sensor element includes:
A first support part and a second support part attached to the base substrate;
A first movable portion disposed between the first support portion and the second support portion in plan view;
A first connection part in which one side of the first movable part and the first support part are connected;
A second connection part in which the other side of the first movable part and the second support part are connected;
Including
The first movable portion includes a first base portion disposed between the first connecting portion and the second connecting portion in plan view,
The comb-shaped first movable electrode finger is provided on the first base,
The comb-shaped first fixed electrode fingers are fixed to the base substrate,
The second sensor element is
A third support part and a fourth support part attached to the base substrate;
A second movable portion disposed between the third support portion and the fourth support portion in plan view;
A third connection part in which one side of the second movable part and the third support part are connected;
A fourth connection part in which the other side of the second movable part and the fourth support part are connected;
Including
The second movable portion includes a second base portion disposed between the third coupling portion and the fourth coupling portion in plan view,
The comb-shaped second movable electrode finger is provided on the second base,
The comb-shaped second fixed electrode finger is a physical quantity sensor fixed to the base substrate. In any one of Claims 1 thru | or 5,
The physical quantity sensor, wherein the base substrate including the outer surface of the container is glass. In claim 1 or 2,
A metal electrode provided on the outer surface of the container;
A metal layer provided on the substrate,
The physical quantity sensor, wherein the container and the base are bonded using at least one of the metal electrode and the metal layer as the bonding material. In any one of Claims 1 thru | or 7,
A physical quantity sensor comprising a processing circuit for controlling the sensor element, the first sensor element, and the second sensor element. A physical quantity sensor according to any one of claims 1 to 7,
Angular velocity sensor,
A control unit for controlling the physical quantity sensor and the angular velocity sensor;
An inertial measurement device. An inertial measurement device according to claim 9;
A receiving unit for receiving a satellite signal on which position information is superimposed from a positioning satellite;
An acquisition unit that acquires position information of the reception unit based on the received satellite signal;
Based on the inertial data output from the inertial measurement device, a calculation unit that calculates the posture;
A calculation unit that calculates the position of the moving body by correcting the position information based on the calculated posture;
A mobile body positioning device. A physical quantity sensor according to any one of claims 1 to 7,
A case containing the physical quantity sensor;
A processing unit housed in the case and processing output data from the physical quantity sensor;
A display unit housed in the case;
A translucent cover closing the opening of the case;
Including portable electronic devices. A physical quantity sensor according to any one of claims 1 to 7,
A control unit that performs control based on a detection signal output from the physical quantity sensor;
Equipped with electronic equipment. A physical quantity sensor according to any one of claims 1 to 7,
An attitude control unit that performs attitude control based on a detection signal output from the physical quantity sensor;
It is equipped with a moving body.

Images