JP2019075523A5 - - Google Patents
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- Publication number
- JP2019075523A5 JP2019075523A5 JP2017202739A JP2017202739A JP2019075523A5 JP 2019075523 A5 JP2019075523 A5 JP 2019075523A5 JP 2017202739 A JP2017202739 A JP 2017202739A JP 2017202739 A JP2017202739 A JP 2017202739A JP 2019075523 A5 JP2019075523 A5 JP 2019075523A5
- Authority
- JP
- Japan
- Prior art keywords
- pad
- switching elements
- drive unit
- bonding wires
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017202739A JP6988362B2 (ja) | 2017-10-19 | 2017-10-19 | 半導体モジュール |
| PCT/JP2018/031114 WO2019077871A1 (ja) | 2017-10-19 | 2018-08-23 | 半導体モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017202739A JP6988362B2 (ja) | 2017-10-19 | 2017-10-19 | 半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019075523A JP2019075523A (ja) | 2019-05-16 |
| JP2019075523A5 true JP2019075523A5 (cg-RX-API-DMAC10.html) | 2019-12-05 |
| JP6988362B2 JP6988362B2 (ja) | 2022-01-05 |
Family
ID=66174520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017202739A Active JP6988362B2 (ja) | 2017-10-19 | 2017-10-19 | 半導体モジュール |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6988362B2 (cg-RX-API-DMAC10.html) |
| WO (1) | WO2019077871A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7359581B2 (ja) * | 2019-07-10 | 2023-10-11 | 株式会社デンソー | 半導体装置 |
| JP7660487B2 (ja) * | 2021-11-22 | 2025-04-11 | 三菱電機株式会社 | 半導体装置 |
| JP7766537B2 (ja) * | 2022-03-29 | 2025-11-10 | 三菱電機株式会社 | 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム |
| JP7785815B2 (ja) * | 2022-11-17 | 2025-12-15 | 海信家電集団股▲ふん▼有限公司 | パワーモジュール及び設備 |
| JP2024546542A (ja) * | 2022-11-17 | 2024-12-26 | 海信家電集団股▲ふん▼有限公司 | パワーモジュール及び設備 |
| EP4611036A4 (en) * | 2022-11-17 | 2026-01-14 | Hisense Home Appliances Group Co Ltd | FRAME, POWER MODULE AND DEVICE ASSEMBLY |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5267959B2 (ja) * | 2011-05-30 | 2013-08-21 | 株式会社デンソー | 半導体モジュール、及び、それを用いた駆動装置 |
| JP6261309B2 (ja) * | 2013-12-02 | 2018-01-17 | 三菱電機株式会社 | パワーモジュール |
| JP6379525B2 (ja) * | 2014-03-05 | 2018-08-29 | 住友電気工業株式会社 | 半導体モジュール |
-
2017
- 2017-10-19 JP JP2017202739A patent/JP6988362B2/ja active Active
-
2018
- 2018-08-23 WO PCT/JP2018/031114 patent/WO2019077871A1/ja not_active Ceased