JP2019073588A - Curable composition - Google Patents
Curable composition Download PDFInfo
- Publication number
- JP2019073588A JP2019073588A JP2017199190A JP2017199190A JP2019073588A JP 2019073588 A JP2019073588 A JP 2019073588A JP 2017199190 A JP2017199190 A JP 2017199190A JP 2017199190 A JP2017199190 A JP 2017199190A JP 2019073588 A JP2019073588 A JP 2019073588A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- curable composition
- film
- organic
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 150000001875 compounds Chemical class 0.000 claims abstract description 57
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 14
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 10
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract description 9
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 8
- -1 vinylphenyl group Chemical group 0.000 claims description 37
- 238000007789 sealing Methods 0.000 claims description 17
- 239000003566 sealing material Substances 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 51
- 239000010410 layer Substances 0.000 description 35
- 239000003963 antioxidant agent Substances 0.000 description 25
- 238000000576 coating method Methods 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 15
- 230000003078 antioxidant effect Effects 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 238000000151 deposition Methods 0.000 description 11
- 239000004094 surface-active agent Substances 0.000 description 11
- 230000008021 deposition Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000605 extraction Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 208000028659 discharge Diseases 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 150000003573 thiols Chemical class 0.000 description 6
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000001841 imino group Chemical group [H]N=* 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- JQKOWSFGWIKBDS-UHFFFAOYSA-N 1,5-bis(ethenyl)naphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1C=C JQKOWSFGWIKBDS-UHFFFAOYSA-N 0.000 description 3
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000001552 radio frequency sputter deposition Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- HIACAHMKXQESOV-UHFFFAOYSA-N 1,2-bis(prop-1-en-2-yl)benzene Chemical compound CC(=C)C1=CC=CC=C1C(C)=C HIACAHMKXQESOV-UHFFFAOYSA-N 0.000 description 2
- VZORBIIKPJNHTD-UHFFFAOYSA-N 1,4-bis(ethenyl)naphthalene Chemical compound C1=CC=C2C(C=C)=CC=C(C=C)C2=C1 VZORBIIKPJNHTD-UHFFFAOYSA-N 0.000 description 2
- NRJNFASAVJETMT-UHFFFAOYSA-N 1,6-bis(ethenyl)naphthalene Chemical compound C=CC1=CC=CC2=CC(C=C)=CC=C21 NRJNFASAVJETMT-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- MHDULSOPQSUKBQ-UHFFFAOYSA-N 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-diphenylimidazol-2-yl]-4,5-diphenylimidazole Chemical compound ClC1=CC=CC=C1C(N1C2(N=C(C(=N2)C=2C=CC=CC=2)C=2C=CC=CC=2)C=2C(=CC=CC=2)Cl)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 MHDULSOPQSUKBQ-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 description 2
- BZGLBTNQDMGACY-UHFFFAOYSA-N 4,6-bis(dodecylsulfanylmethyl)-6-methylcyclohexa-1,3-dien-1-ol Chemical compound CCCCCCCCCCCCSCC1=CC=C(O)C(C)(CSCCCCCCCCCCCC)C1 BZGLBTNQDMGACY-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 2
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 238000010525 oxidative degradation reaction Methods 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000003902 salicylic acid esters Chemical class 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- POLSVAXEEHDBMJ-UHFFFAOYSA-N (2-hydroxy-4-octadecoxyphenyl)-phenylmethanone Chemical compound OC1=CC(OCCCCCCCCCCCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 POLSVAXEEHDBMJ-UHFFFAOYSA-N 0.000 description 1
- XCPFSALHURPPJE-UHFFFAOYSA-N (3,5-ditert-butyl-4-hydroxyphenyl) propanoate Chemical compound CCC(=O)OC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 XCPFSALHURPPJE-UHFFFAOYSA-N 0.000 description 1
- OMNRIRITCWODFY-UHFFFAOYSA-N (3,5-ditert-butyl-4-hydroxyphenyl)methyl diethyl phosphite Chemical compound CCOP(OCC)OCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 OMNRIRITCWODFY-UHFFFAOYSA-N 0.000 description 1
- ARVUDIQYNJVQIW-UHFFFAOYSA-N (4-dodecoxy-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC(OCCCCCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 ARVUDIQYNJVQIW-UHFFFAOYSA-N 0.000 description 1
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- BRTNWPWZQXHESZ-UHFFFAOYSA-N 1,1'-biphenyl;phosphorous acid Chemical compound OP(O)O.C1=CC=CC=C1C1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 BRTNWPWZQXHESZ-UHFFFAOYSA-N 0.000 description 1
- CFCRODHVHXGTPC-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-pentacosafluorododecane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CFCRODHVHXGTPC-UHFFFAOYSA-N 0.000 description 1
- KMMOLDZBACYVIN-UHFFFAOYSA-N 1,1,2,2,3,3-hexafluoro-1-[2-[2-[2-[2-[2-[2-(1,1,2,2,3,3-hexafluoropentoxy)propoxy]propoxy]propoxy]propoxy]propoxy]propoxy]pentane Chemical compound CCC(F)(F)C(F)(F)C(F)(F)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OC(F)(F)C(F)(F)C(F)(F)CC KMMOLDZBACYVIN-UHFFFAOYSA-N 0.000 description 1
- MKNKAWHZNOFVLS-UHFFFAOYSA-N 1,1,2,2-tetrafluoro-1-(1,1,2,2-tetrafluoropropoxy)octane Chemical compound CCCCCCC(F)(F)C(F)(F)OC(F)(F)C(C)(F)F MKNKAWHZNOFVLS-UHFFFAOYSA-N 0.000 description 1
- SJKCQODCCXCOFU-UHFFFAOYSA-N 1,1,2,2-tetrafluoro-1-[2-(1,1,2,2-tetrafluorobutoxy)ethoxy]butane Chemical compound FC(C(CC)(F)F)(F)OCCOC(C(CC)(F)F)(F)F SJKCQODCCXCOFU-UHFFFAOYSA-N 0.000 description 1
- RIZMPBJZAHNFGY-UHFFFAOYSA-N 1,1,2,2-tetrafluoro-1-hexoxyoctane Chemical compound CCCCCCOC(F)(F)C(F)(F)CCCCCC RIZMPBJZAHNFGY-UHFFFAOYSA-N 0.000 description 1
- RWEAGLZFYKQPLZ-UHFFFAOYSA-N 1-[4,5-diphenyl-2-(2,4,6-trichlorophenyl)imidazol-2-yl]-4,5-diphenyl-2-(2,4,6-trichlorophenyl)imidazole Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C(N1C2(N=C(C(=N2)C=2C=CC=CC=2)C=2C=CC=CC=2)C=2C(=CC(Cl)=CC=2Cl)Cl)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 RWEAGLZFYKQPLZ-UHFFFAOYSA-N 0.000 description 1
- SLBOQBILGNEPEB-UHFFFAOYSA-N 1-chloroprop-2-enylbenzene Chemical compound C=CC(Cl)C1=CC=CC=C1 SLBOQBILGNEPEB-UHFFFAOYSA-N 0.000 description 1
- ILNWVJZSCUTRJZ-UHFFFAOYSA-N 1-ethenyltriphenylene Chemical group C1=CC=CC2=C3C(C=C)=CC=CC3=C(C=CC=C3)C3=C21 ILNWVJZSCUTRJZ-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 description 1
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- 125000004201 2,4-dichlorophenyl group Chemical group [H]C1=C([H])C(*)=C(Cl)C([H])=C1Cl 0.000 description 1
- MXSKJYLPNPYQHH-UHFFFAOYSA-N 2,4-dimethyl-6-(1-methylcyclohexyl)phenol Chemical compound CC1=CC(C)=C(O)C(C2(C)CCCCC2)=C1 MXSKJYLPNPYQHH-UHFFFAOYSA-N 0.000 description 1
- CZNRFEXEPBITDS-UHFFFAOYSA-N 2,5-bis(2-methylbutan-2-yl)benzene-1,4-diol Chemical compound CCC(C)(C)C1=CC(O)=C(C(C)(C)CC)C=C1O CZNRFEXEPBITDS-UHFFFAOYSA-N 0.000 description 1
- JAZQIRAEJMLXFV-UHFFFAOYSA-N 2,6-bis(ethenyl)naphthalene Chemical compound C1=C(C=C)C=CC2=CC(C=C)=CC=C21 JAZQIRAEJMLXFV-UHFFFAOYSA-N 0.000 description 1
- WZNDNJFUESZPKE-UHFFFAOYSA-N 2,7-bis(ethenyl)naphthalene Chemical compound C1=CC(C=C)=CC2=CC(C=C)=CC=C21 WZNDNJFUESZPKE-UHFFFAOYSA-N 0.000 description 1
- HWRLEEPNFJNTOP-UHFFFAOYSA-N 2-(1,3,5-triazin-2-yl)phenol Chemical compound OC1=CC=CC=C1C1=NC=NC=N1 HWRLEEPNFJNTOP-UHFFFAOYSA-N 0.000 description 1
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 1
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- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- PEXOFOFLXOCMDX-UHFFFAOYSA-N tritridecyl phosphite Chemical compound CCCCCCCCCCCCCOP(OCCCCCCCCCCCCC)OCCCCCCCCCCCCC PEXOFOFLXOCMDX-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone powder Natural products C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
本発明は、表示装置、照明装置等の用途に適用可能な有機エレクトロルミネッセンス素子の封止材料として有用な硬化性組成物に関する。
本発明は、封止材としての硬化性能を維持しながらも、屈折率が高く、塗布性、透明性に優れた硬化性組成物を提供することを目的とする。
The present invention relates to a curable composition useful as a sealing material of an organic electroluminescent device applicable to applications such as display devices and lighting devices.
An object of the present invention is to provide a curable composition having a high refractive index and excellent coating properties and transparency while maintaining the curing performance as a sealing material.
対象物を硬化物により保護する等の目的で、硬化物を形成するための硬化性組成物として、現在までに種々の硬化性材料が提案されている。例えば、近年開発が進められている電子デバイス用素子の一つとして、陽極、有機発光層および陰極からなる積層構造を有する有機エレクトロルミネッセンス(EL)素子が知られている。 Various curable materials have been proposed as curable compositions for forming a cured product, for the purpose of protecting an object with the cured product. For example, an organic electroluminescent (EL) device having a laminated structure including an anode, an organic light emitting layer, and a cathode is known as one of the devices for electronic devices that has been developed in recent years.
しかしながら、有機発光層に含まれる発光材料は水分および酸素により劣化しやすいため、有機EL素子の封止を行う必要がある。そこで、有機発光層を保護するため、硬化性組成物を用いた素子封止が知られている(特許文献1)。また、有機EL素子は、その発光が素子内で起こるため、その光の取り出しには様々な方法がとられており、一般的には発光層から最外層までの各層の屈折率を調整することにより、光の取り出し効率を上げる工夫がなされている(特許文献2) However, since the light emitting material contained in the organic light emitting layer is easily deteriorated by moisture and oxygen, it is necessary to seal the organic EL element. Then, in order to protect an organic light emitting layer, element sealing using a curable composition is known (patent document 1). In addition, since the light emission of the organic EL element occurs in the element, various methods are taken for extracting the light, and generally, the refractive index of each layer from the light emitting layer to the outermost layer is adjusted. Has been devised to increase the light extraction efficiency (Patent Document 2).
有機EL素子の封止において、素子へのダメージを低減するため、焼成レス、溶剤レスの硬化組成物が望まれており、光硬化性が望ましいとされている(特許文献3)。また、省液化の観点からインクジェット塗布法が普及しつつあり、インクジェット塗布適性として低粘度の硬化組成物が望まれている。 In sealing of an organic EL element, in order to reduce damage to the element, a baking-less, solventless hardening composition is desired, and photocurability is considered to be desirable (Patent Document 3). Moreover, the inkjet coating method is spreading from a viewpoint of liquefaction-saving, and a low viscosity hardening composition is desired as inkjet coating aptitude.
しかしながら特許文献3に記載の硬化物は、光硬化できるものの粘度が高いためインクジェット塗布に適さない不具合がある。
以上のように、光硬化性があり、無溶剤で低粘度、そして高屈折率の硬化性組成物が有機EL素子の封止素材として求められている。
However, the cured product described in Patent Document 3 has a problem that it is not suitable for inkjet coating because the viscosity of the photocurable one is high.
As described above, a curable composition having a photocurable property, no solvent, low viscosity, and high refractive index is required as a sealing material for an organic EL element.
本発明の目的は、上記の有機EL素子の封止性能、ダメージ低減、インクジェット塗布性および光取り出し効率を向上させるために無溶剤で低粘度、高屈折率、加熱無しで光照射のみで硬化可能な硬化組成物を提供することにある。 It is an object of the present invention to be solventless, low viscosity, high refractive index, and curable only by light irradiation without heating in order to improve the sealing performance, damage reduction, ink jet coatability and light extraction efficiency of the above-mentioned organic EL element It is an object of the present invention to provide a curable composition.
本発明者らは上記課題を解決すべく鋭意検討を行った。その結果、以下の構成を有する硬化性組成物により上記課題を解決できることを見出し、本発明を完成した。 The present inventors diligently studied to solve the above problems. As a result, it has been found that the above-mentioned problems can be solved by the curable composition having the following constitution, and the present invention has been completed.
さらに本発明によれば、インクジェット塗布対象上での濡れ広がり性に優れ、したがって膜ムラが少なく、かつ硬化後にアウトガスの発生が少ない硬化性組成物を提供することができる。そして封止性能を維持しながらも、光取り出し効率を向上させることができる屈折率を有する封止材を得ることができる。また、このような特性を利用し、固体撮像素子等に用いるマイクロレンズ形成用材料としても好適に用いることができる。 Furthermore, according to the present invention, it is possible to provide a curable composition which is excellent in the wettability and spreadability on the ink jet application object, and hence the film unevenness is small, and the generation of the outgassing after curing is small. And while maintaining sealing performance, the sealing material which has a refractive index which can improve light extraction efficiency can be obtained. Moreover, it can use suitably also as a material for microlens formation used for a solid-state image sensor etc. using such a characteristic.
(1)少なくとも
(A)ビニル基を有する芳香族炭化水素基が1個以上直接結合した構造を有する化合物、
(B)1個以上のチオール基を有する化合物、および
(C)重合開始剤、
を含有する、粘度が1〜100mPa・sである、硬化性組成物。
(2)上記(A)化合物のビニル基を有する芳香族炭化水素基が、ビニルフェニル基である前記(1)記載の硬化性組成物。
(3)上記(A)化合物の分子量が100以上1000以下である前記(1)または(2)に記載の硬化性組成物。
(4)前記(1)から(3)のいずれかに記載の硬化性組成物を硬化させて得られる、屈折率1.60以上の硬化膜。
(5)有機EL素子の封止膜形成に用いる前記(1)から(3)のいずれかに記載の硬化性組成物。
(6)前記(5)に記載の封止膜を含有する有機EL素子。
(1) a compound having a structure in which one or more aromatic hydrocarbon groups having at least (A) a vinyl group are directly bonded,
(B) a compound having one or more thiol groups, and (C) a polymerization initiator,
Curable composition having a viscosity of 1 to 100 mPa · s.
(2) The curable composition according to the above (1), wherein the aromatic hydrocarbon group having a vinyl group of the compound (A) is a vinylphenyl group.
(3) The curable composition as described in said (1) or (2) whose molecular weight of said (A) compound is 100 or more and 1000 or less.
(4) A cured film having a refractive index of 1.60 or more, which is obtained by curing the curable composition according to any one of (1) to (3).
(5) The curable composition according to any one of (1) to (3), which is used for forming a sealing film of an organic EL element.
(6) An organic EL device containing the sealing film according to (5).
以下、本発明の実施形態について詳細に述べるが、これに限られることはない。
<硬化性組成物>
本発明の硬化性組成物は、少なくとも(A)ビニル基を有する芳香族炭化水素基が1個以上直接結合した構造を有する化合物、(B)1個以上のチオール基を有する化合物、および(C)重合開始剤、を含有する、粘度が1〜100mPa・sである、硬化性組成物であることを特徴とする。
本発明では、(A)化合物と(B)化合物が異なる化合物であってもよいし、1分子中にビニル基を有する芳香族炭化水素基が1個以上直接結合した構造と1個以上のチオール基を有する構造の両方を有する(A)化合物と(B)化合物を兼ねる化合物であってもよい。
Hereinafter, although an embodiment of the present invention is described in detail, it is not limited to this.
<Curable composition>
The curable composition of the present invention comprises a compound having a structure in which at least (A) an aromatic hydrocarbon group having a vinyl group is directly bonded to one or more, (B) a compound having one or more thiol groups, and A curable composition containing a polymerization initiator and having a viscosity of 1 to 100 mPa · s.
In the present invention, the compound (A) and the compound (B) may be different compounds, and a structure in which at least one aromatic hydrocarbon group having a vinyl group in one molecule is directly bonded to one or more thiols It may be a compound having both of the structure having a group and the compound (A) and the compound (B).
<(A)化合物>
本発明の(A)化合物は、1分子中にビニル基を有する芳香族炭化水素基が1個以上直接結合した構造を有する化合物である。
本発明の芳香族炭化水素環としては、ベンゼン環、ナフタレン環、アントラセン環、フェナントレン環、クリセン環、ピレン環、トリフェニレン環等を挙げることができ、ベンゼン環、ナフタレン環が好ましい。
<(A) Compound>
The compound (A) of the present invention is a compound having a structure in which one or more aromatic hydrocarbon groups having a vinyl group in one molecule are directly bonded.
Examples of the aromatic hydrocarbon ring of the present invention include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a chrysene ring, a pyrene ring, a triphenylene ring and the like, with a benzene ring and a naphthalene ring being preferable.
本発明のビニル基は、芳香族炭化水素環と直接結合している。ビニル基を有する芳香族炭化水素基は、一分子中に少なくとも一つ存在し二つ以上であることが好ましい。 The vinyl group of the present invention is directly bonded to the aromatic hydrocarbon ring. At least one aromatic hydrocarbon group having a vinyl group is preferably present in one molecule, and preferably two or more.
具体的にはスチレン、ジビニルベンゼン、ジイソプロペニルベンゼン、1−ビニルナフタレン、2−ビニルナフタレン、1,4−ジビニルナフタレン、1,5−ジビニルナフタレン、1、6−ジビニルナフタレン、2、6−ジビニルナフタレン、2、7−ジビニルナフタレン、9−ビニルアントラセン、2−ビニルアントラセン、9−ビニルフェナントレン、3−ビニルフェナントレン、ビニルトリフェニレン等が挙げられる。等を挙げることができるが、ジイソプロペニルベンゼン、1−ビニルナフタレン、2−ビニルナフタレン、1,4−ジビニルナフタレン、1,5−ジビニルナフタレン、1、6−ジビニルナフタレン、2、6−ジビニルナフタレン、2、7−ジビニルナフタレンが揮発性、粘度の観点で好ましい。 Specifically, styrene, divinylbenzene, diisopropenylbenzene, 1-vinylnaphthalene, 2-vinylnaphthalene, 1,4-divinylnaphthalene, 1,5-divinylnaphthalene, 1,6-divinylnaphthalene, 2,6-divinyl Naphthalene, 2,7-divinylnaphthalene, 9-vinyl anthracene, 2-vinyl anthracene, 9-vinyl phenanthrene, 3-vinyl phenanthrene, vinyl triphenylene and the like can be mentioned. Diisopropenylbenzene, 1-vinylnaphthalene, 2-vinylnaphthalene, 1,4-divinylnaphthalene, 1,5-divinylnaphthalene, 1,6-divinylnaphthalene, 2,6-divinylnaphthalene 2,7-divinylnaphthalene is preferred in view of volatility and viscosity.
<(B)化合物>
本発明の(B)化合物は、1個以上のチオール基を有する化合物である。2個以上のチオール基を有することが好ましい。具体的には(B−1)〜(B−17)を挙げることができる。好ましくは(B−2)〜(B−16)、さらに好ましくは(B−7a)〜(B−7c)である。
The compound (B) of the present invention is a compound having one or more thiol groups. It is preferable to have two or more thiol groups. Specifically, (B-1) to (B-17) can be mentioned. Preferably they are (B-2)-(B-16), More preferably, they are (B-7a)-(B-7c).
<(A)と(B)を同一分子中に有する化合物>
具体的には(1−1)〜(1−4)を挙げることができる。ただし、R1は水素原子もしくは炭素数1〜3のアルキル基、nは0〜10の整数である。
Specifically, (1-1) to (1-4) can be mentioned. However, R 1 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, n represents an integer of 0.
スピンコートやインクジェット塗布時に揮発による膜減りの観点から、(A)化合物、(B)化合物は、分子量が100以上1000程度であり135以上であることが好ましい。特に(A)化合物が100以上1000以下であることが好ましい。(A)と(B)を同一分子中に有する化合物の場合は、135以上1000以下であることが好ましい。
ビニル基とチオール基の比率はビニル基100モル部に対してチオールが10〜1000モル部、好ましくは50〜200モル部である。この比率だと、光エン−チオール反応により良好な硬化膜を得ることができる。
From the viewpoint of film loss due to volatilization at the time of spin coating or inkjet coating, the (A) compound and the (B) compound preferably have a molecular weight of about 100 to 1000, and preferably 135 or more. In particular, the (A) compound is preferably at least 100 and at most 1,000. In the case of the compound which has (A) and (B) in the same molecule, it is preferable that they are 135 or more and 1000 or less.
The ratio of vinyl group to thiol group is 10 to 1000 parts by mole, preferably 50 to 200 parts by mole of thiol per 100 parts by mole of vinyl group. At this ratio, a good cured film can be obtained by the photoene-thiol reaction.
チオール基は、芳香族炭化水素環に直接結合している必要はないが、一分子中に少なくとも一つ存在し、二つ以上であることが好ましい。
アウトガスの点から、沸点は、150℃以上であり、200℃以上であることが好ましい。(A)化合物および(B)化合物の総計は、硬化性組成物の30〜99質量%含有される。
The thiol group does not have to be directly bonded to the aromatic hydrocarbon ring, but at least one is present in one molecule, and preferably two or more.
From the viewpoint of outgassing, the boiling point is 150 ° C. or more, and preferably 200 ° C. or more. The total of the (A) compound and the (B) compound is contained in an amount of 30 to 99% by mass of the curable composition.
具体的な化合物を下記に挙げる。 Specific compounds are listed below.
<(C)重合開始剤>
本発明で好ましく使用される重合開始剤は光開始剤が好ましく、光ラジカル開始剤が挙げられる。
本発明の(C)重合開始剤は、硬化性組成物の1〜10質量%含有される。
<(C) polymerization initiator>
The polymerization initiator preferably used in the present invention is preferably a photoinitiator, and includes a photo radical initiator.
The (C) polymerization initiator of the present invention is contained in an amount of 1 to 10% by mass of the curable composition.
≪光ラジカル開始剤≫
光ラジカル開始剤としては、例えば、O−アシルオキシム化合物、アセトフェノン化合物、ビイミダゾール化合物、感放射線性カチオン重合開始剤、ベンゾイン化合物、ベンゾフェノン化合物、α−ジケトン化合物、多核キノン化合物、キサントン化合物、ホスフィン化合物、トリアジン化合物などを挙げることができる。
«Photo radical initiator»
As a photo radical initiator, For example, O-acyl oxime compound, acetophenone compound, biimidazole compound, radiation sensitive cationic polymerization initiator, benzoin compound, benzophenone compound, α-diketone compound, polynuclear quinone compound, xanthone compound, phosphine compound And triazine compounds.
上記O−アシルオキシム化合物の具体例としては、1−〔9−エチル−6−(2−メチルベンゾイル)−9.H.−カルバゾール−3−イル〕−エタン−1−オンオキシム−O−アセテート、エタノン−1−〔9−エチル−6−(2−メチル−4−テトラヒドロフラニルメトキシベンゾイル)−9.H.−カルバゾール−3−イル〕−1−(O−アセチルオキシム)またはエタノン−1−〔9−エチル−6−{2−メチル−4−(2,2−ジメチル−1,3−ジオキソラニル)メトキシベンゾイル}−9.H.−カルバゾール−3−イル〕−1−(O−アセチルオキシム)を好ましいものとして挙げることができる。
これらO−アシルオキシム化合物は、単独でまたは2種以上を混合して使用することができる。
As a specific example of the said O-acyl oxime compound, 1- [9-ethyl- 6- (2-methyl benzoyl) -9. H. -Carbazol-3-yl] -ethan-1-one oxime-O-acetate, ethanone-1- [9-ethyl-6- (2-methyl-4-tetrahydrofuranyl methoxy benzoyl) -9. H. -Carbazol-3-yl] -1- (O-acetyloxime) or ethanone-1- [9-ethyl-6- {2-methyl-4- (2,2-dimethyl-1,3-dioxolanyl) methoxybenzoyl] } -9. H. -Carbazol-3-yl] -1- (O-acetyloxime) can be mentioned as a preferred one.
These O-acyl oxime compounds can be used alone or in combination of two or more.
上記アセトフェノン化合物としては、例えばα−アミノケトン化合物、α−ヒドロキシケトン化合物およびその他のアセトフェノン化合物を挙げることができる。
これらの具体例としては、α−アミノケトン化合物として、例えば2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタン−1−オン、2−ジメチルアミノ−2−(4−メチルベンジル)−1−(4−モルフォリン−4−イル−フェニル)−ブタン−1−オン、2−メチル−1−(4−メチルチオフェニル)−2−モルフォリノプロパン−1−オンなど;
α−ヒドロキシケトン化合物として、α−アミノケトン化合物が好ましく、特に2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタン−1−オンまたは2−ジメチルアミノ−2−(4−メチルベンジル)−1−(4−モルフォリン−4−イル−フェニル)−ブタン−1−オンが好ましい。
As said acetophenone compound, an alpha-amino ketone compound, an alpha-hydroxy ketone compound, and other acetophenone compounds can be mentioned, for example.
As specific examples of these, as an α-amino ketone compound, for example, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-dimethylamino-2- (4-methylbenzyl) )-1-(4-morpholin-4-yl-phenyl) -butan-l-one, 2-methyl-l- (4-methylthiophenyl) -2-morpholinopropan-l-one and the like;
As the α-hydroxy ketone compound, an α-amino ketone compound is preferable, and in particular, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one or 2-dimethylamino-2- (4-methyl) Benzyl) -1- (4-morpholin-4-yl-phenyl) -butan-1-one is preferred.
上記ビイミダゾール化合物の具体例としては、2,2’−ビス(2−クロロフェニル)−4,4’,5,5’−テトラフェニル−1,2’−ビイミダゾール、2,2’−ビス(2,4−ジクロロフェニル)−4,4’,5,5’−テトラフェニル−1,2’−ビイミダゾールまたは2,2’−ビス(2,4,6−トリクロロフェニル)−4,4’,5,5’−テトラフェニル−1,2’−ビイミダゾールが好ましく、特に2,2’−ビス(2−クロロフェニル)−4,4’,5,5’−テトラフェニル−1,2’−ビイミダゾールが好ましい。 Specific examples of the above biimidazole compounds include 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole and 2,2′-bis 2,4-Dichlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole or 2,2'-bis (2,4,6-trichlorophenyl) -4,4', 5,5'-tetraphenyl-1,2'-biimidazole is preferred, and in particular 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole. Imidazole is preferred.
<その他の添加材料>
本発明の硬化性組成物には、必要に応じて増感剤、重合禁止剤、酸化防止剤、界面活性剤等を含有させてもよい。溶媒は必要であれば使用することは可能であるが、使用することなしに硬化性組成物とすることができる。
<Other additive materials>
The curable composition of the present invention may optionally contain a sensitizer, a polymerization inhibitor, an antioxidant, a surfactant and the like. Although a solvent can be used if necessary, it can be made a curable composition without using it.
[酸化防止剤]
酸化防止剤は、露光や加熱により発生したラジカル、又は酸化によって生成した過酸化物を分解し、重合体分子の結合の開裂を防止することができる成分である。その結果、得られる硬化膜は経時的な酸化劣化が防止され、例えば硬化膜の輝度低下を抑制することができる。
[Antioxidant]
The antioxidant is a component capable of decomposing a radical generated by exposure or heating or a peroxide generated by oxidation to prevent the cleavage of the bond of the polymer molecule. As a result, the resulting cured film is prevented from oxidative degradation with time, and, for example, the decrease in luminance of the cured film can be suppressed.
酸化防止剤として、具体的には、ヒンダードフェノール系、ヒンダードアミン系、リン系、チオール系、ベンゾトリアゾール系、ベンゾフェノン系、ヒドロキシルアミン系、サルチル酸エステル系、およびトリアジン系の化合物があげられ、公知の紫外線吸収剤、酸化防止剤等が使用できる。また、本実施形態で用いられる酸化防止剤は、ハロゲン原子を含有していないものが好ましい。 Specific examples of the antioxidant include hindered phenol type, hindered amine type, phosphorus type, thiol type, benzotriazole type, benzophenone type, hydroxylamine type, salicylic acid ester type, and triazine type compounds. UV absorbers, antioxidants and the like can be used. The antioxidant used in the present embodiment is preferably one containing no halogen atom.
これらの酸化防止剤の中でも、塗膜の透過率と感度の両立の観点から、好ましいものとしては、ヒンダードフェノール系酸化防止剤、ヒンダードアミン系酸化防止剤、リン系酸化防止剤またはチオール系酸化防止剤が挙げられる。また、より好ましくは、ヒンダードフェノール系酸化防止剤およびチオール系酸化防止剤である。 Among these antioxidants, preferred are hindered phenol-based antioxidants, hindered amine-based antioxidants, phosphorus-based antioxidants or thiol-based antioxidants from the viewpoint of achieving both the transmittance and sensitivity of the coating film. Agents. Also, more preferably, hindered phenol-based antioxidants and thiol-based antioxidants.
ヒンダードフェノール系酸化防止剤としては、2,4−ビス〔(ラウリルチオ)メチル〕−o−クレゾール、1,3,5−トリス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)、1,3,5−トリス(4−tert−ブチル−3−ヒドロキシ−2,6−ジメチルベンジル)、2,4−ビス(n−オクチルチオ)−6−(4−ヒドロキシ−3,5−ジ−tert−ブチルアニリノ)−1,3,5−トリアジン、ペンタエリスリトールテトラキス[3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート、2,6−ジ−tert−ブチル−4−ノニルフェノール、2,2’−イソブチリデンビス(4,6−ジメチル−フェノール)、4,4’−ブチリデンビス(2−tert−ブチル−5−メチルフェノール)、2,2’−チオ−ビス(6−tert−ブチル−4−メチルフェノール)、2,5−ジ−tert−アミル−ヒドロキノン、2,2’チオジエチルビス(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)−プロピオネート、1,1,3−トリス−(2’−メチル−4’−ヒドロキシ−5’−tert−ブチルフェニル)−ブタン、2,2’−メチレンビス(6−(1−メチル−シクロヘキシル)−p−クレゾール)、2,4−ジメチル−6−(1−メチル−シクロヘキシル)−フェノール、N,N−ヘキサメチレンビス(3,5−ジ−tert−ブチル−4−ヒドロキシ−ヒドロシンナムアミド)等が挙げられる。その他ヒンダードフェノール構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 Examples of hindered phenol-based antioxidants include 2,4-bis [(laurylthio) methyl] -o-cresol, 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl), 1,3,5-tris (4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl), 2,4-bis (n-octylthio) -6- (4-hydroxy-3,5-di-) tert-Butylanilino) -1,3,5-triazine, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 2,6-di-tert-butyl-4-nonylphenol 2,2'-Isobutylidenebis (4,6-dimethyl-phenol), 4,4'-butylidenebis (2-tert-butyl-5-methylpheno) ), 2,2'-thio-bis (6-tert-butyl-4-methylphenol), 2,5-di-tert-amyl-hydroquinone, 2,2'-thiodiethylbis (3,5-di- tert-Butyl-4-hydroxyphenyl) -propionate, 1,1,3-tris- (2'-methyl-4'-hydroxy-5'-tert-butylphenyl) -butane, 2,2'-methylenebis (6 -(1-methyl-cyclohexyl) -p-cresol), 2,4-dimethyl-6- (1-methyl-cyclohexyl) -phenol, N, N-hexamethylene bis (3,5-di-tert-butyl-) 4-hydroxy-hydrocinnamamide) etc. are mentioned. In addition, compounds of oligomer type and polymer type having a hindered phenol structure can also be used.
ヒンダードアミン系酸化防止剤としては、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(N−メチル−2,2,6,6−テトラメチル−4−ピペリジル)セバケート、N,N’−ビス(2,2,6,6−テトラメチル−4−ピペリジル)−1,6−ヘキサメチレンジアミン、2−メチル−2−(2,2,6,6−テトラメチル−4−ピペリジル)アミノ−N−(2,2,6,6−テトラメチル−4−ピペリジル)プロピオンアミド、テトラキス(2,2,6,6−テトラメチル−4−ピペリジル)(1,2,3,4−ブタンテトラカルボキシレート、ポリ〔{6−(1,1,3,3−テトラメチルブチル)イミノ−1,3,5−トリアジン−2,4−ジイル}{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}ヘキサメチル{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}〕、ポリ〔(6−モルホリノ−1,3,5−トリアジン−2,4−ジイル){(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}ヘキサメチン{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}〕、コハク酸ジメチルと1−(2−ヒドロキシエチル)−4−ヒドロキシ−2,2,6,6−テトラメチルピペリジンとの重縮合物、N,N’−4,7−テトラキス〔4,6−ビス{N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ}−1,3,5−トリアジン−2−イル〕−4,7−ジアザデカン−1,10−ジアミン等が挙げられる。その他ヒンダードアミン構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 As the hindered amine antioxidant, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (N-methyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate, N, N'-bis (2,2,6,6-tetramethyl-4-piperidyl) -1,6-hexamethylenediamine, 2-methyl-2- (2,2,6,6-tetramethyl-4) -Piperidyl) amino-N- (2,2,6,6-tetramethyl-4-piperidyl) propionamide, tetrakis (2,2,6,6-tetramethyl-4-piperidyl) (1,2,3, 4-butane tetracarboxylate, poly [{6- (1,1,3,3-tetramethylbutyl) imino-1,3,5-triazine-2,4-diyl} {(2,2,6,6 -Tetramethyl-4-piperidi Imino} hexamethyl {(2,2,6,6-tetramethyl-4-piperidyl) imino}], poly [(6-morpholino-1,3,5-triazine-2,4-diyl) {(2, 2,6,6-Tetramethyl-4-piperidyl) imino} hexamethine {(2,2,6,6-tetramethyl-4-piperidyl) imino}], dimethyl succinate and 1- (2-hydroxyethyl)- Polycondensate with 4-hydroxy-2,2,6,6-tetramethylpiperidine, N, N'-4,7-tetrakis [4,6-bis {N-butyl-N- (1,2,2 , 6,6-Pentamethyl-4-piperidyl) amino} -1,3,5-triazin-2-yl] -4,7-diazadecane-1,10-diamine, etc. Other oligomeric types having a hindered amine structure as well as Rimmer type compounds may also be used.
リン系酸化防止剤としては、トリス(イソデシル)フォスファイト、トリス(トリデシル)フォスファイト、フェニルイソオクチルフォスファイト、フェニルイソデシルフォスファイト、フェニルジ(トリデシル)フォスファイト、ジフェニルイソオクチルフォスファイト、ジフェニルイソデシルフォスファイト、ジフェニルトリデシルフォスファイト、トリフェニルフォスファイト、トリス(ノニルフェニル)フォスファイト、4,4’イソプロピリデンジフェノールアルキルフォスファイト、トリスノニルフェニルフォスファイト、トリスジノニルフェニルフォスファイト、トリス(2,4−ジ−tert−ブチルフェニル)フォスファイト、トリス(ビフェニル)フォスファイト、ジステアリルペンタエリスリトールジフォスファイト、ジ(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールジフォスファイト、ジ(ノニルフェニル)ペンタエリスリトールジフォスファイト、フェニルビスフェノールAペンタエリスリトールジフォスファイト、テトラトリデシル−4,4’−ブチリデンビス(3−メチル−6−tert−ブチルフェノール)ジフォスファイト、ヘキサトリデシル−1,1,3−トリス(2−メチル−4−ヒドロキシ−5−tert−ブチルフェニル)ブタントリフォスファイト、3,5−ジ−tert−ブチル−4−ヒドロキシベンジルフォスファイトジエチルエステル、ナトリウムビス(4−tert−ブチルフェニル)フォスファイト、ナトリウム−2,2−メチレンビス(4,6−ジ−tert−ブチルフェニル)−フォスファイト、1,3−ビス(ジフェノキシフォスフォニロキシ)−ベンゼン、亜リン酸エチルビス(2,4−ジ−tert−ブチル−6−メチルフェニル)等が挙げられる。その他フォスファイト構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 As a phosphorus antioxidant, tris (isodecyl) phosphite, tris (tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodecyl phosphite, phenyl di (tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl isodecyl Phosphite, diphenyl tridecyl phosphite, triphenyl phosphite, tris (nonylphenyl) phosphite, 4,4 'isopropylidene diphenol alkyl phosphite, tris nonyl phenyl phosphite, tris dinonyl phenyl phosphite, tris (2 , 4-Di-tert-butylphenyl) phosphite, tris (biphenyl) phosphite, distearyl pentaerythritol diphosphite Di (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, di (nonylphenyl) pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetratridecyl-4,4'-butylidene bis ( 3-Methyl-6-tert-butylphenol) diphosphite, hexatridecyl-1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane triphosphite, 3,5- Di-tert-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis (4-tert-butylphenyl) phosphite, sodium-2,2-methylene bis (4,6-di-tert-butylphenyl) phosphite , , 1,3-bis (di-phenoxy phosphine sulfonyl b carboxymethyl) - benzene, phosphorous acid ethyl bis (2,4-di -tert- butyl-6-methylphenyl), and the like. In addition, oligomer type and polymer type compounds having a phosphite structure can also be used.
チオール系酸化防止剤としては、2,2−チオ−ジエチレンビス〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート〕、2,4−ビス〔(オクチルチオ)メチル〕−o−クレゾール、2,4−ビス〔(ラウリルチオ)メチル〕−o−クレゾール等が挙げられる。その他チオエーテル構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 Examples of thiol-based antioxidants include 2,2-thio-diethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2,4-bis [(octylthio) methyl]- o-cresol, 2,4-bis [(laurylthio) methyl] -o-cresol, etc. may be mentioned. In addition, oligomer type and polymer type compounds having a thioether structure can also be used.
ベンゾトリアゾール系酸化防止剤としては、ベンゾトリアゾール構造を有するオリゴマータイプ及びポリマータイプの化合物等を使用することができる。 As the benzotriazole-based antioxidant, compounds of oligomer type and polymer type having a benzotriazole structure can be used.
ベンゾフェノン系酸化防止剤として具体的には、2−ヒドロキシ−4−メトキシベンゾフェノン、2,4−ジヒドロキシベンゾフェノン、2−ヒドロキシ−4−n−オクトキシベンゾフェノン、4−ドデシロキシ−2−ヒドロキシベンゾフェノン、2−ヒドロキシ−4−オクタデシロキシベンゾフェノン、2,2’ジヒドロキシ−4−メトキシベンゾフェノン、2,2’ジヒドロキシ−4,4’−ジメトキシベンゾフェノン、2,2’,4,4’−テトラヒドロキシベンゾフェノン、2−ヒドロキシ−4−メトキシ−5−スルホベンゾフェノン、2−ヒドロキシ−4−メトキシ−2’−カルボキシベンゾフェノン等が挙げられる。その他ベンゾフェノン構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 Specific examples of benzophenone-based antioxidants include 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, and 2-hydroxybenzophenone. Hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2- And hydroxy-4-methoxy-5-sulfobenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone and the like. In addition, oligomer type and polymer type compounds having a benzophenone structure can also be used.
トリアジン系酸化防止剤としては、2,4−ビス(アリル)−6−(2−ヒドロキシフェニル)−1,3,5−トリアジン等が挙げられる。その他トリアジン構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 As a triazine type antioxidant, a 2, 4- bis (allyl) 6- (2-hydroxyphenyl) 1, 3, 5- triazine etc. are mentioned. In addition, oligomer type and polymer type compounds having a triazine structure can also be used.
サルチル酸エステル系酸化防止剤としては、サリチル酸フェニル、サリチル酸p−オクチルフェニル、サリチル酸p−tert−ブチルフェニル等が挙げられる。その他サルチル酸エステル構造を有するオリゴマータイプ及びポリマータイプの化合物等も使用することができる。 Examples of the salicylate-based antioxidant include phenyl salicylate, p-octylphenyl salicylate, p-tert-butylphenyl salicylate and the like. In addition, compounds of oligomer type and polymer type having a salicylate structure can also be used.
(A)化合物と(B)化合物成分の和100質量部に対する酸化防止剤の含有量の下限としては、0.01質量部が好ましく、0.1質量部がより好ましい。上記酸化防止剤の含有量の上限としては、10質量部が好ましく、8質量部がより好ましく、7質量部がさらに好ましい。酸化防止剤の含有量を上記範囲とすることで、得られる硬化膜の経時的な酸化劣化を効果的に抑制することなどができる。なお、酸化防止剤を2種以上用いる場合、上記含有量は合計量である。 As a minimum of content of antioxidant with respect to 100 mass parts of a sum of (A) compound and (B) compound component, 0.01 mass part is preferable, and 0.1 mass part is more preferable. As a maximum of content of the above-mentioned antioxidant, 10 mass parts is preferred, 8 mass parts is more preferred, and 7 mass parts is still more preferred. By making content of antioxidant into the said range, the time-dependent oxidative degradation of the cured film obtained etc. can be suppressed effectively. In addition, when using 2 or more types of antioxidant, the said content is a total amount.
[界面活性剤]
本実施形態の硬化性組成物に含有可能な界面活性剤は、硬化性組成物の塗布性の改善、塗布ムラの低減、放射線照射部の現像性を改良するために添加することができる。好ましい界面活性剤の例としては、フッ素系界面活性剤およびシリコーン系界面活性剤が挙げられる。
[Surfactant]
The surfactant that can be contained in the curable composition of the present embodiment can be added to improve the coating properties of the curable composition, to reduce coating unevenness, and to improve the developability of the irradiated part. Examples of preferred surfactants include fluorosurfactants and silicone surfactants.
フッ素系界面活性剤としては、例えば1,1,2,2−テトラフルオロオクチル(1,1,2,2−テトラフルオロプロピル)エーテル、1,1,2,2−テトラフルオロオクチルヘキシルエーテル、オクタエチレングリコールジ(1,1,2,2−テトラフルオロブチル)エーテル、ヘキサエチレングリコール(1,1,2,2,3,3−ヘキサフルオロペンチル)エーテル、オクタプロピレングリコールジ(1,1,2,2−テトラフルオロブチル)エーテル、ヘキサプロピレングリコールジ(1,1,2,2,3,3−ヘキサフルオロペンチル)エーテル等のフルオロエーテル類;パーフルオロドデシルスルホン酸ナトリウム;1,1,2,2,8,8,9,9,10,10−デカフルオロドデカン、1,1,2,2,3,3−ヘキサフルオロデカン等のフルオロアルカン類;フルオロアルキルベンゼンスルホン酸ナトリウム類;フルオロアルキルオキシエチレンエーテル類;フルオロアルキルアンモニウムヨージド類;フルオロアルキルポリオキシエチレンエーテル類;パーフルオロアルキルポリオキシエタノール類;パーフルオロアルキルアルコキシレート類;フッ素系アルキルエステル類等を挙げることができる。 As a fluorine-based surfactant, for example, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octal Ethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,2 Fluoroethers such as 2-, 2-tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether; sodium perfluorododecyl sulfonate; 2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexa Fluoroalkanes such as fluorodecane; sodium fluoroalkyl benzene sulfonate; fluoro alkyl oxy ethylene ethers; fluoro alkyl ammonium iodides; fluoro alkyl polyoxyethylene ethers; perfluoro alkyl polyoxyethanols; perfluoro alkyl alkoxylates And fluorinated alkyl esters etc. can be mentioned.
これらのフッ素系界面活性剤の市販品としては、エフトップ(登録商標)EF301、303、352(新秋田化成(株)製)、メガファック(登録商標)F171、172、173(DIC(株)製)、フロラードFC430、431(住友スリーエム(株)製)、アサヒガードAG(登録商標)710(旭硝子(株)製)、サーフロン(登録商標)S−382、SC−101、102、103、104、105、106(AGCセイミケミカル(株)製)、FTX−218((株)ネオス製)等を挙げることができる。
シリコーン系界面活性剤の例としては、市販されている商品名で、SH200−100cs、SH28PA、SH30PA、ST89PA、SH190、SH 8400 FLUID(東レ・ダウコーニング・シリコーン(株)製)、オルガノシロキサンポリマーKP341(信越化学工業(株)製)等が挙げられる。
As commercially available products of these fluorine-based surfactants, F-Top (registered trademark) EF 301, 303, 352 (manufactured by Shin-Akita Kasei Co., Ltd.), Megafuck (registered trademark) F 171, 172, 173 (DIC Corporation) Florard FC 430, 431 (Sumitomo 3M Co., Ltd.), Asahi Guard AG (registered trademark) 710 (Asahi Glass Co., Ltd.), Surflon (registered trademark) S-382, SC-101, 102, 103, 104 105, 106 (manufactured by AGC Seimi Chemical Co., Ltd.), FTX-218 (manufactured by Neos Co., Ltd.), and the like.
Examples of silicone surfactants are commercially available trade names: SH200-100cs, SH28PA, SH30PA, ST89PA, SH190, SH 8400 FLUID (manufactured by Toray Dow Corning Silicone Co., Ltd.), organosiloxane polymer KP341 (Shin-Etsu Chemical Co., Ltd. product) etc. are mentioned.
その他任意成分として界面活性剤を使用する場合、その含有量は、(A)成分100質量部に対して、好ましくは0.01質量部〜10質量部、より好ましくは0.05質量部〜5質量部である。界面活性剤の使用量を0.01質量部〜10質量部とすることによって、本実施形態の硬化性組成物の塗布性を最適化することができる。 When a surfactant is used as another optional component, its content is preferably 0.01 parts by mass to 10 parts by mass, more preferably 0.05 parts by mass to 100 parts by mass of component (A). It is a mass part. By making the usage-amount of surfactant 0.01 mass part-10 mass parts, the coating property of the curable composition of this embodiment can be optimized.
[リン酸エステル化合物]
リン酸エステル化合物としては、2−ヒドロキシエチルメタクリレートの6−ヘキサノリド付加重合物と無水リン酸の反応生成物 (日本化薬社製「KAYAMER PM−21」)、アルキル(C12,C14,C16,C18)アシッドホスフェート(城北化学工業社製「JB−512」等が挙げられる。このようなリン酸エステル化合物は、(A)成分100質量部に対して、好ましくは0.01質量部〜10質量部、より好ましくは0.05質量部〜5質量部である。リン酸エステル化合物の使用量を0.01質量部〜10質量部とすることによって、本実施形態の硬化性組成物から得られる硬化膜の基板に対する密着性を向上させることができる。
[Phosphate ester compound]
As a phosphoric acid ester compound, a reaction product of a 6-hexanolide addition polymer of 2-hydroxyethyl methacrylate and phosphoric anhydride ("KAYAMER PM-21" manufactured by Nippon Kayaku Co., Ltd.), alkyl (C12, C14, C16, C18) Acid Phosphate ("JB-512" manufactured by Johoku Chemical Co., Ltd., etc.) Such a phosphoric acid ester compound is preferably 0.01 parts by mass to 10 parts by mass with respect to 100 parts by mass of the component (A). More preferably, it is 0.05 parts by mass to 5 parts by mass Curing obtained from the curable composition of the present embodiment by setting the amount of use of the phosphoric acid ester compound to 0.01 parts by mass to 10 parts by mass The adhesion of the film to the substrate can be improved.
[接着助剤]
接着助剤は、本実施形態の硬化性組成物から得られる絶縁膜と、その下層に配置される層や基板等との接着性をさらに向上させる目的で使用することができる。接着助剤としては、カルボキシル基、メタクリロイル基、ビニル基、イソシアネート基、オキシラニル基等の反応性官能基を有する官能性シランカップリング剤が好ましく用いられ、例えば、トリメトキシシリル安息香酸、γ−メタクリロキシプロピルトリメトキシシラン、ビニルトリアセトキシシラン、ビニルトリメトキシシラン、γ−イソシアナートプロピルトリエトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン等が挙げられる。
[有機溶剤]
必要に応じて有機溶剤を用いることができる。有機溶剤は、単独でまたは2種以上を混合して使用できる。
[Adhesive agent]
The adhesion aiding agent can be used for the purpose of further improving the adhesion between the insulating film obtained from the curable composition of the present embodiment and a layer, a substrate or the like disposed therebelow. As the adhesion assistant, functional silane coupling agents having reactive functional groups such as carboxyl group, methacryloyl group, vinyl group, isocyanate group, oxiranyl group are preferably used, and examples thereof include trimethoxysilylbenzoic acid and γ-methacrylic acid. Roxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, etc. Can be mentioned.
[Organic solvent]
An organic solvent can be used as needed. The organic solvents can be used alone or in combination of two or more.
本実施形態の硬化性組成物に使用可能な有機溶剤としては、他の含有成分を溶解または分散させるとともに、他の含有成分と反応しないものを挙げることができる。
例えば、メタノール、エタノール、イソプロパノール、ブタノール、オクタノール等のアルコール類;アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン類;酢酸エチル、酢酸ブチル、乳酸エチル、γ−ブチロラクトン、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、メチル−3−メトキシプロピオネート等のエステル類;ポリオキシエチレンラウリルエーテル、エチレングリコールモノメチルエーテル、ジエチレングリコールモノブチルエーテル、プロピレングリコールモノメチルエーテル、ジエチレングリコールメチルエチルエーテル等のエーテル類;ベンゼン、トルエン、キシレン等の芳香族炭化水素類;ジメチルホルムアミド、ジメチルアセトアミド、N−メチルピロリドン等のアミド類等が挙げられる。
As an organic solvent which can be used for the curable composition of this embodiment, while melt | dissolving or disperse | distributing other containing components, the thing which does not react with other containing components can be mentioned.
For example, alcohols such as methanol, ethanol, isopropanol, butanol and octanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; ethyl acetate, butyl acetate, ethyl lactate, γ-butyrolactone, propylene glycol monomethyl ether acetate, propylene Esters such as glycol monoethyl ether acetate and methyl 3-methoxy propionate; polyoxyethylene lauryl ether, ethylene glycol monomethyl ether, diethylene glycol monobutyl ether, ethers such as propylene glycol monomethyl ether and diethylene glycol methyl ethyl ether; benzene, Aromatic hydrocarbons such as toluene and xylene; Chill acetamide, etc. amides such as N- methylpyrrolidone.
<粘度>
本発明の硬化材料は、粘度が1〜100mPa・sであることを特徴とする。なお粘度は、JIS K2283に準拠して、E型粘度計(東機産業社製「TVE22L」)を用いて、25℃で測定した値である。この粘度とすることで硬化性組成物が被硬化物(有機EL素子)に適当な濡れ性を有することとなり、封止性を確保することができる。
この粘度は、硬化性組成物に含有される(A)化合物、(B)化合物の分子量、添加量比によって調整することができ、特に(A)化合物の分子量によって調整することが好ましい。またこの粘度範囲は、経時による粘度上昇が起こりにくい範囲でもある点で好ましい。
<Viscosity>
The cured material of the present invention is characterized by having a viscosity of 1 to 100 mPa · s. The viscosity is a value measured at 25 ° C. using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283. By setting it as this viscosity, a curable composition will have wettability suitable for a to-be-hardened | cured material (organic EL element), and sealing property can be ensured.
The viscosity can be adjusted by the molecular weight of the (A) compound and the (B) compound contained in the curable composition and the addition amount ratio, and it is particularly preferable to adjust by the molecular weight of the (A) compound. Moreover, this viscosity range is preferable in that it is also a range in which the increase in viscosity with time does not easily occur.
本実施形態の硬化膜の形成方法は、以下の工程によって形成される。 The method of forming a cured film of the present embodiment is formed by the following steps.
[工程(1)]
工程(1)では、当該硬化性組成物の溶液を基板表面に塗布し、必要に応じてプレベークを行うで塗膜を形成する。工程(1)で使用する基板としては、例えばガラス基板、シリコンウエハー、プラスチック基板、およびこれらの表面に窒化珪素等の各種無機膜が形成された基板が挙げられる。プラスチック基板としては、例えばポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート、ポリエーテルスルホン、ポリカーボネート、ポリイミド等のプラスチックを主成分とする基板などが挙げられる。
[Step (1)]
At a process (1), the solution of the said curable composition is apply | coated to a substrate surface, and a coating film is formed by prebaking as needed. Examples of the substrate used in the step (1) include a glass substrate, a silicon wafer, a plastic substrate, and a substrate having various inorganic films such as silicon nitride formed on the surface thereof. As a plastic substrate, for example, a substrate mainly composed of a plastic such as polyethylene terephthalate (PET), polybutylene terephthalate, polyether sulfone, polycarbonate, polyimide and the like can be mentioned.
当該硬化性組成物の塗布方法としては、例えばスプレー法、ロールコート法、回転塗布法(スピンコート法)、スリットダイ塗布法、バー塗布法、インクジェット法等の適宜の方法を採用することができる。これらの塗布方法の中でも、スピンコート法、インクジェット塗布法が好ましい。プレベークの条件としては、当該硬化性組成物の含有成分の種類、含有量等によっても異なるが、例えば60℃以上100℃以下で30秒間以上10分間以下程度とすることができる。上記塗膜の平均膜厚は、プレベーク後の下限として、0.1μmが好ましい。また、この上限としては、15μmが好ましく、10μmがより好ましく、8μmがさらに好ましい。 As a method of applying the curable composition, an appropriate method such as a spray method, a roll coating method, a spin coating method (spin coating method), a slit die coating method, a bar coating method, an inkjet method can be adopted. . Among these coating methods, spin coating and inkjet coating are preferable. The conditions for pre-baking may vary depending on the type, content, etc. of the components of the curable composition, but can be, for example, about 60 seconds to 100 degrees Celsius for about 30 seconds to about 10 minutes. The average film thickness of the coating film is preferably 0.1 μm as the lower limit after prebaking. Moreover, as this upper limit, 15 micrometers is preferable, 10 micrometers is more preferable, and 8 micrometers is more preferable.
[工程(2)]
工程(2)では、工程(1)で形成した塗膜に所定のパターンを有するマスクを介して放射線を照射する。このときの放射線としては、例えば紫外線、遠紫外線、X線、荷電粒子線等が挙げられる。
[Step (2)]
In the step (2), the coating film formed in the step (1) is irradiated with radiation through a mask having a predetermined pattern. Examples of radiation at this time include ultraviolet light, far ultraviolet light, X-rays, charged particle beams and the like.
露光波長としては300〜450nmが好ましい。光源としては高圧水銀灯やLEDを用いることができる。露光量としては、例えば100J/m2以上100,000J/m2以下が好ましい。また、必要に応じてインプリント法によりパターンを形成してもよい。 The exposure wavelength is preferably 300 to 450 nm. A high pressure mercury lamp or an LED can be used as a light source. The exposure amount, for example, 100 J / m 2 or more 100,000J / m 2 or less. Moreover, you may form a pattern by the imprint method as needed.
[工程(3)]
必要に応じて塗膜を加熱・焼成処理(ポストベーク処理)することによって塗膜の硬化を行ってもよい。また、工程(3)における焼成温度の下限としては、80℃が好ましい。一方、この上限としては、250℃が好ましい。焼成時間としては、加熱機器の種類により異なるが、例えばホットプレート上で加熱処理を行う場合には5分以上40分以下、オーブン中で加熱処理を行う場合には30分以上80分以下とすることができる。
[Step (3)]
If necessary, the coating may be cured by heating and baking (post-baking). Moreover, as a minimum of the calcination temperature in a process (3), 80 degreeC is preferable. On the other hand, as this upper limit, 250 ° C is preferred. The firing time varies depending on the type of the heating device, but is, for example, 5 minutes or more and 40 minutes or less when heat treatment is performed on a hot plate, and 30 minutes or more and 80 minutes or less when heat treatment is performed in an oven. be able to.
当該製造方法によれば、当該硬化性組成物の感放射線性を利用した露光および加熱によって硬化膜を形成することができる。 According to the manufacturing method, a cured film can be formed by exposure and heating utilizing the radiation sensitivity of the curable composition.
<硬化膜>
本発明の硬化性組成物を硬化した硬化物は、屈折率が1.60以上であり好ましくは1.65以上である。硫黄原子等の重量元素の使用、または縮合炭化水素環の含有割合を増やすことによって、高屈折率の硬化物を設計することができる。本発明の硬化膜は液晶表示素子や有機EL素子の封止、マイクロレンズ、反射防止膜、AR素子の回折格子などに用いることができる。
<Cured film>
The cured product obtained by curing the curable composition of the present invention has a refractive index of 1.60 or more, preferably 1.65 or more. A cured product of high refractive index can be designed by using a weight element such as a sulfur atom or by increasing the content of condensed hydrocarbon rings. The cured film of the present invention can be used for sealing a liquid crystal display element or an organic EL element, a microlens, an antireflective film, a diffraction grating of an AR element, or the like.
化合物の構造同定は、1H−NMR測定(ブルカー製、AVANCE500型)を用いて行い、分子量の測定は液体クロマトグラフ質量分析計(LC−MS 島津製作所製、LCMS−8045)を用いて行い、目的の化合物が得られていることを確認した。
[合成例1]
<化合物(1−1)の合成>
リアクティブ アンド フアンクショナルポリマー(Reactive&Functional Polymers)73(2013)624−633に従い合成した。(1−1)の分子量は150.24である。
Synthesis Example 1
<Synthesis of Compound (1-1)>
It synthesize | combined according to Reactive & Functional Polymers 73 (2013) 624-633. The molecular weight of (1-1) is 150.24.
[合成例2]
<化合物(1−2)の合成>
温度計、窒素導入管を備えた500mLの三口フラスコに(1−1)15.2g、15%水酸化ナトリウム水溶液、プロピレンスルフィド35.1g、トルエン200mL、4−メトキシフェノール0.02gおよびベンジルトリメチルアンモニウムクロリド0.1gを仕込み、室温で12時間撹拌した。反応終了後、5℃以下に氷冷した後、濃塩酸を加えてpH1に調整し、分液ロートにて水層を除去し、さらに、水で3回洗浄した後、硫酸マグネシウムで乾燥した。つづいて、シリカカラム精製(展開溶剤:ヘキサン)を行った後、濃縮、乾固して(1−2)を15.7g得た。(1−2)の分子量は224.39である。
<Synthesis of Compound (1-2)>
Thermometer, 500 mL three-necked flask equipped with a nitrogen inlet tube (1-1) 15.2 g, 15% aqueous sodium hydroxide solution, 35.1 g of propylene sulfide, 200 mL of toluene, 0.02 g of 4-methoxyphenol and benzyltrimethylammonium 0.1 g of chloride was charged and stirred at room temperature for 12 hours. After completion of the reaction, the reaction solution was ice-cooled to 5 ° C. or less, concentrated hydrochloric acid was added to adjust to pH 1, the aqueous layer was removed by a separatory funnel, and after washing three times with water, it was dried with magnesium sulfate. Subsequently, silica column purification (developing solvent: hexane) was carried out, followed by concentration and drying to obtain 15.7 g of (1-2). The molecular weight of (1-2) is 224.39.
[合成例3]
<化合物(1−3)の合成>
特許3444682の実施例1に従い化合物テトラメルカプト体(1−3B)を合成した。(1−3B)の分子量は366.74である。ついで温度計および窒素導入管を備えた500mLの三口フラスコに(1−3B)9.17g(0025mol)、エタノール200mL、4−メトキシフェノール0.02gおよびトリエチルアミン10.1gを加えた。次に、ビニルベンジルクロリド7.78g(0.051mol)を加えて一昼夜、室温で撹拌した。反応終了後、ろ過して得られた濃縮し、塩化メチレン300mLを加えて、水で3回分液洗浄を行った。次に、有機層を濃縮し、300mLのヘキサンを加え上澄みを除去することでオイル状の物質を得た。この操作を再度行い、オイル状物質を真空乾燥することで(1−3:メルカプト基の2置換体)を10.48g得た。プロトンNMRで求めた変性率は50mol%であった。(1−3)の分子量は599.06である。
Synthesis Example 3
<Synthesis of Compound (1-3)>
The compound tetramercapto compound (1-3B) was synthesized according to Example 1 of Patent No. 3444682. The molecular weight of (1-3B) is 366.74. Subsequently, 9.17 g (0025 mol) of (1-3B), 200 mL of ethanol, 0.02 g of 4-methoxyphenol and 10.1 g of triethylamine were added to a 500 mL three-necked flask equipped with a thermometer and a nitrogen inlet tube. Next, 7.78 g (0.051 mol) of vinylbenzyl chloride was added, and the mixture was stirred at room temperature overnight. After completion of the reaction, the solution was concentrated by filtration, concentrated, and 300 mL of methylene chloride was added, followed by washing with water three times. Next, the organic layer was concentrated, 300 mL of hexane was added, and the supernatant was removed to obtain an oily substance. This operation was repeated, and the oily substance was vacuum-dried to obtain 10.48 g of (1-3: 2-substituted mercapto group). The modification rate determined by proton NMR was 50 mol%. The molecular weight of (1-3) is 599.06.
[実施例1〜8、比較例1〜6]
<(1)硬化性組成物の調製>
表1に示す組成で調整後、0.2μmのフィルターを用いてろ過を行い、硬化性組成物(J−1)〜(J−8)、(RJ−1)〜(RJ−3)を得た。表1に示す材料は、下記に示した通りである。
比較例4として特許第5479248号実施例1記載の組成物を作製した。
粘度は、JIS K2283に準拠して、E型粘度計(東機産業社製「TVE22L」)を用いて、実施例および比較例で得られた硬化性組成物の25℃での値を測定した。
[Examples 1 to 8, Comparative Examples 1 to 6]
<(1) Preparation of Curable Composition>
After adjustment with the composition shown in Table 1, filtration is performed using a 0.2 μm filter to obtain curable compositions (J-1) to (J-8) and (RJ-1) to (RJ-3). The The materials shown in Table 1 are as shown below.
As Comparative Example 4, the composition described in Example 1 of Japanese Patent No. 5479248 was produced.
The viscosity was measured at 25 ° C. of the curable composition obtained in Examples and Comparative Examples using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283. .
(C)成分
(C−1):DAROCUR TPO(BASF(株)製)
(C−2):Irg.OXE−01(BASF(株)製)
(C) Component (C-1): DAROCUR TPO (manufactured by BASF Corp.)
(C-2): Irg. OXE-01 (manufactured by BASF Corporation)
(B)成分
VNA :1−ビニルナフタレン
DVNA:1,5−ジビニルナフタレン
DVB :ジビニルベンゼン m、p混合物
(B) Component VNA: 1-vinyl naphthalene DVNA: 1, 5-divinyl naphthalene DVB: divinyl benzene m, p mixture
下記界面活性剤S−1は(A)化合物と(C)化合物との総量に対して1質量%添加した。なお、実施例9だけは、実施例2の組成物から界面活性を除いた。
(S−1):SH 190(東レ・ダウコーニング(株)製)
The following surfactant S-1 was added at 1% by mass with respect to the total amount of the compound (A) and the compound (C). In Example 9 only, the surface activity was removed from the composition of Example 2.
(S-1): SH 190 (made by Toray Dow Corning Co., Ltd.)
<硬化性組成物の評価>
以上の硬化性組成物について、下記の評価を行った。結果を表2に示す。なお、特に断りの無い限り、測定は25℃55%RHの雰囲気下が行った。
<Evaluation of curable composition>
The following evaluation was performed about the above curable composition. The results are shown in Table 2. In addition, unless otherwise noted, the measurement was performed under an atmosphere of 25 ° C. and 55% RH.
≪光硬化性≫
4インチシリコンウエハー上に膜厚が5μmになるようスピンコーターの回転数を調整して塗布した。この塗膜に下記露光量の紫外線を照射して得た硬化膜のタック有無を観察した。なお、露光量は365nm換算である。
AA:1J/cm2露光でタック無し
AB:2J/cm2露光でタック無し
BB:2J/cm2露光でタックが少しあり
CC:2J/cm2露光で液状
«Photo-curing property»
The number of rotations of the spin coater was adjusted and coated on a 4-inch silicon wafer so that the film thickness was 5 μm. The coating film was irradiated with ultraviolet rays of the following exposure dose to observe the presence or absence of tackiness of the cured film obtained. The exposure amount is 365 nm equivalent.
AA: 1 J / cm 2 exposure not tackiness AB: 2 J / cm 2 exposure no tack BB: 2 J / cm 2 exposure slightly tackiness CC: 2 J / cm 2 exposure liquid
≪屈折率≫
上記硬化膜(2J/cm2露光)をプリズムカプラ法によりModel201(Metricon社製)を使用して測定した。
«Refractive index»
The cured film ( 2 J / cm 2 exposure) was measured by a prism coupler method using Model 201 (manufactured by Metricon).
≪保存安定性≫
硬化組成物を40℃の恒温槽に3日間保管し、粘度変化率を評価した。
(粘度変化率)=((保管後粘度)−(初期粘度))/(初期粘度)×100(%)
粘度変化率
AA:5%未満
AB:5〜10%
BB:10〜20%
CC:20%以上もしくはゲル化
«Preservation stability»
The cured composition was stored in a constant temperature bath at 40 ° C. for 3 days, and the viscosity change rate was evaluated.
(Viscosity change rate) = ((viscosity after storage)-(initial viscosity)) / (initial viscosity) x 100 (%)
Viscosity change rate AA: less than 5% AB: 5 to 10%
BB: 10 to 20%
CC: 20% or more or gelation
≪吐出安定性の評価≫
紫外線照射装置付きピエゾ方式インクジェットプリンタのインクジェットヘッドから、硬化性組成物1〜16の吐出試験を行い、下記の判断基準で評価した。
AA:室温(20〜25℃)で硬化性組成物をヘッドから吐出可能であり、
目視に於いて全てのノズルからインクジェット吐出可能であった。
BB:40〜60℃の加温により硬化性組成物をヘッドから吐出可能であり、
目視に於いて全てのノズルからインクジェット吐出可能であった。
CC:硬化性組成物をヘッドから吐出の初期段階で吐出不可能であった。
«Evaluation of discharge stability»
From the inkjet head of the piezo-type inkjet printer with an ultraviolet irradiation device, a discharge test of the curable compositions 1 to 16 was performed, and the following judgment criteria evaluated.
AA: The curable composition can be discharged from the head at room temperature (20 to 25 ° C.),
Ink jet discharge was possible from all the nozzles visually.
BB: The curable composition can be discharged from the head by heating at 40 to 60 ° C.
Ink jet discharge was possible from all the nozzles visually.
CC: It was impossible to discharge the curable composition from the head at the initial stage of discharge.
≪塗布膜ムラの評価≫
ガラス基板上にSiNxを膜厚100nmで成膜した評価基板に対して、50μm×50μmピッチで、ピエゾ方式インクジェットプリンタのインクジェットヘッドから、硬化性組成物1〜16のインクジェット吐出を行い、10cm角の塗布膜を作製した。さらに5分後に前記395nmLEDランプを用いて露光量1000mJ/cm2を照射し、塗布膜を硬化させた。その際、硬化膜の膜厚が10μmまたは5μmとなる様にインクジェットヘッドに印可する電圧を変化させ、吐出されるインクドット1滴の量を調整した。得られた硬化膜に対して以下の基準で評価を行った。
AA(優) :目視にて塗布膜ムラが観察されない。
BB(良) :目視にて部分的な膜厚変化による塗布膜ムラが観察される。
CC(不可):目視にて未塗布箇所が観察される。
«Evaluation of coating film unevenness»
On an evaluation substrate in which SiNx is formed in a film thickness of 100 nm on a glass substrate, the curable compositions 1 to 16 are jetted out from the ink jet head of a piezoelectric inkjet printer at a pitch of 50 μm × 50 μm. A coated film was produced. After 5 minutes, the coating film was cured by irradiating an exposure dose of 1000 mJ / cm 2 using the 395 nm LED lamp. At that time, the voltage applied to the ink jet head was changed so that the thickness of the cured film was 10 μm or 5 μm, and the amount of one ink dot ejected was adjusted. The resulting cured film was evaluated based on the following criteria.
AA (excellent): No coating film unevenness is observed visually.
BB (good): Coating film unevenness due to partial change in film thickness is visually observed.
CC (improper): The unapplied part is observed visually.
以上の結果から、芳香族炭化水素環に直接結合したビニル基と、チオール基を、同一分子中に少なくとも一つずつ有する化合物を含有する硬化性組成物は、良好な光硬化性を示し、高屈折の塗膜を得ることができ、さらに溶剤無しで塗布することが可能である。 From the above results, a curable composition containing a compound having at least one vinyl group directly bonded to an aromatic hydrocarbon ring and at least one thiol group in the same molecule exhibits good photocurability and is highly effective. It is possible to obtain refractive coatings and, furthermore, to apply without solvents.
<有機EL素子のサンプルの評価>
≪有機EL素子の作製≫
アレイ状にITO透明電極が形成されたガラス基材(日本電気硝子社製「OA−10」)と、前記ITO透明電極の一部のみが露出したコンタクトホールを有する、膜厚3μmの平坦化層とを有するアレイ基材を複数用意した。
<Evaluation of sample of organic EL element>
«Fabrication of organic EL device»
A 3 μm-thick planarizing layer having a glass substrate (“OA-10” manufactured by Nippon Electric Glass Co., Ltd.) in which ITO transparent electrodes are formed in an array and a contact hole in which only a part of the ITO transparent electrode is exposed. A plurality of array substrates were prepared.
Alターゲットを用いてDCスパッタ法により、平坦化層上に膜厚100nmのAl膜を形成した。ITOターゲットを用いてDCマグネトロンリアクティブスパッタリング法により、Al膜上に膜厚20nmのITO膜を形成した。この様にしてAl膜とITO膜とからなる陽極層を形成した基材を用いた。 An Al film with a thickness of 100 nm was formed on the planarized layer by DC sputtering using an Al target. An ITO film having a thickness of 20 nm was formed on an Al film by DC magnetron reactive sputtering using an ITO target. Thus, the base material in which the anode layer which consists of Al film and ITO film was formed was used.
レジスト材料(JSR製「オプトマーNN803」)を用いて陽極層上に塗膜を形成し、i線(波長365nm)照射、現像、流水洗浄、風乾および加熱処理を含む一連の処理を行い、陽極層の一部を開口領域として持つ画素規定層を形成した。 A coating is formed on the anode layer using a resist material ("Optomer NN 803" manufactured by JSR), and a series of treatments including i-ray (wavelength 365 nm) irradiation, development, washing with flowing water, air drying and heat treatment are performed. A pixel defining layer having a part of the opening as an opening area was formed.
陽極および画素規定層が形成された基材を真空成膜室へ移動し、成膜室を1E−4Paまで排気した後、前記基材上に、所定のパターンの蒸着マスクを用いて、正孔注入性を有する酸化モリブデン(MoOx)を抵抗加熱蒸着法により成膜速度0.004〜0.005nm/secの条件で成膜し、膜厚1nmの正孔注入層を形成した。 The base on which the anode and the pixel defining layer are formed is moved to a vacuum deposition chamber, the deposition chamber is evacuated to 1E-4 Pa, and then holes are formed on the substrate using a deposition mask of a predetermined pattern. An injection-processable molybdenum oxide (MoOx) was deposited by resistance heating deposition under the conditions of a deposition rate of 0.004 to 0.005 nm / sec to form a hole injection layer with a thickness of 1 nm.
正孔注入層上に、所定のパターンの蒸着マスクを用いて、正孔輸送性を有する4,4’−ビス[N−(1−ナフチル)−N−フェニルアミノ]ビフェニル(α−NPD)を抵抗加熱蒸着法により正孔注入層と同様の排気条件で成膜し、膜厚35nmの正孔輸送層を形成した。成膜速度は、0.2〜0.3nm/secの条件であった。 4,4′-Bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) having hole transportability is formed on the hole injection layer using a deposition mask of a predetermined pattern. A film was formed by resistance heating evaporation under the same exhaust conditions as the hole injection layer to form a hole transport layer having a thickness of 35 nm. The deposition rate was 0.2 to 0.3 nm / sec.
正孔輸送層上に、所定のパターンの蒸着マスクを用いて、緑色の発光材料としてアルキレート錯体であるトリス(8−キノリノラト)アルミニウムを抵抗加熱蒸着法により正孔輸送層と同様の成膜条件で成膜し、膜厚35nmの発光層を形成した。成膜速度は、0.5nm/sec以下の条件であった。 On the hole transport layer, tris (8-quinolinolato) aluminum which is an alkylate complex as a green light emitting material using a deposition mask of a predetermined pattern by the resistance heating deposition method, and the same film forming conditions as the hole transport layer The light emitting layer was formed to a thickness of 35 nm. The deposition rate was 0.5 nm / sec or less.
発光層上に、フッ化リチウムを抵抗加熱蒸着法により正孔注入層と同様の排気条件で成膜し、膜厚0.8nmの電子注入層を形成した。成膜速度は、0.004nm/sec以下の条件であった。
続いて電子注入層上に、マグネシウムおよびAgを抵抗加熱蒸着法により正孔注入層と同様の排気条件で同時に成膜し、膜厚5nmの第1陰極層を形成した。成膜速度は、0.5nm/sec以下の条件であった。
Lithium fluoride was deposited on the light emitting layer by resistance heating evaporation under the same exhaust conditions as the hole injecting layer to form an electron injecting layer having a thickness of 0.8 nm. The deposition rate was 0.004 nm / sec or less.
Subsequently, magnesium and Ag were simultaneously formed on the electron injection layer by resistance heating evaporation under the same exhaust conditions as the hole injection layer to form a first cathode layer having a thickness of 5 nm. The deposition rate was 0.5 nm / sec or less.
続いて、別の成膜室(スパッタ室)に上記基材を移送し、第1陰極層上に、ITOターゲットを用いてRFスパッタリング法により、膜厚100nmの第2陰極層を形成した。
以上のようにして、評価用有機EL素子を得た。
Subsequently, the substrate was transferred to another film forming chamber (sputtering chamber), and a 100 nm-thick second cathode layer was formed on the first cathode layer by an RF sputtering method using an ITO target.
The organic EL element for evaluation was obtained as mentioned above.
≪有機EL素子の薄膜封止≫
得られた有機EL素子に対して、以下の手順にて薄膜封止層を形成した。成膜室(スパッタ室)に前記有機EL素子を移送し、陰極層上に、SiNxターゲットを用いてRFスパッタリング法により、膜厚100nmの無機封止層(SiNx膜)を形成した。続いて、前記有機EL素子をN2置換されたグローブボックス中に移送し、ピエゾ方式インクジェットプリンタによって、硬化性組成物1〜16を所定のパターンに吐出し、続いてウシオ電機社製UniJetE110ZHD 395nm LEDランプを用いて露光量1000mJ/cm2を照射し、製膜された硬化性組成物を硬化させ、膜厚10μmの有機封止層を形成した。
«Thin film sealing of organic EL element»
The thin film sealing layer was formed with the following procedures with respect to the obtained organic EL element. The organic EL element was transferred to a film forming chamber (sputtering chamber), and an inorganic sealing layer (SiNx film) with a film thickness of 100 nm was formed on the cathode layer by RF sputtering using a SiNx target. Subsequently, the organic EL element is transferred into a N 2 -substituted glove box, and the curable compositions 1 to 16 are discharged in a predetermined pattern by a piezo inkjet printer, and then UniJet E110 ZHD 395 nm LED manufactured by Ushio Inc. The film was irradiated with an exposure amount of 1000 mJ / cm 2 using a lamp to cure the formed curable composition, thereby forming an organic sealing layer having a film thickness of 10 μm.
成膜室(スパッタ室)に前記有機EL素子を移送し、有機封止層上に、SiNxターゲットを用いてRFスパッタリング法により、膜厚100nmの無機封止層(SiNx膜)を形成した。以上のようにして、有機ELデバイスを得た。 The organic EL element was transferred to a film forming chamber (sputtering chamber), and an inorganic sealing layer (SiN x film) with a film thickness of 100 nm was formed on the organic sealing layer by RF sputtering using a SiN x target. An organic EL device was obtained as described above.
≪有機ELデバイスの信頼性≫
上記で得られたそれぞれの有機ELデバイスについて、85℃85%RH湿熱条件下で100h保管した後、順方向電流を10mA/cm2で通電し、発光外観(ダークスポット)を観察した。下記基準に基づき、評価した。
A(優):ダークスポットが観察されない。
C(不可):ダークスポットが1箇所以上観察される。
«Reliability of Organic EL Device»
About each organic EL device obtained above, after storing for 100 h under 85 ° C. 85% RH wet heat conditions, forward current was applied at 10 mA / cm 2 , and a light emitting appearance (dark spot) was observed. It evaluated based on the following standard.
A (excellent): Dark spots are not observed.
C (not good): One or more dark spots are observed.
≪光取り出し評価≫
有機EL素子サンプルを室温(25℃)、2.5mA/cm2の定電流条件下による点灯を行い、点灯開始直後の発光輝度(L)[cd/m2]を測定することにより、外部取り出し効率を評価した。ここで、発光輝度の測定は分光放射輝度計(TOPCON社製SR-3AR)を用いて行い、外部取り出し効率を評価した。比較例4の輝度を100とした相対強度で結果を示す。
«Light extraction evaluation»
The organic EL device sample is lit under constant current conditions of room temperature (25 ° C., 2.5 mA / cm 2 ), and the light emission luminance (L) [cd / m 2 ] immediately after the start of lighting is measured to obtain an external device. The efficiency was evaluated. Here, the measurement of light emission luminance was performed using a spectral radiance meter (SR-3AR manufactured by TOPCON), and the external extraction efficiency was evaluated. The results are shown in relative intensity with the luminance of Comparative Example 4 being 100.
≪光取り出しの評価ランク≫
A:相対強度が103を超えて110以下である
B:相対強度が100を超えて103以下である
C:相対強度が100以下である。
A: relative strength is greater than 103 and not greater than 110 B: relative intensity is greater than 100 and not greater than 103 C: relative intensity is not greater than 100
以上の通り、本発明の硬化性組成物は、封止性だけでなく、光取り出し効率にも寄与することが明らかである。 As described above, it is clear that the curable composition of the present invention contributes not only to the sealing property but also to the light extraction efficiency.
Claims (6)
(A)ビニル基を有する芳香族炭化水素基が1個以上直接結合した構造を有する化合物、
(B)1個以上のチオール基を有する化合物、および
(C)重合開始剤、
を含有し、粘度が1〜100mPa・sである、硬化性組成物。 A compound having a structure in which one or more aromatic hydrocarbon groups having at least (A) a vinyl group are directly bonded,
(B) a compound having one or more thiol groups, and (C) a polymerization initiator,
Curable composition having a viscosity of 1 to 100 mPa · s.
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Cited By (4)
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CN110819141A (en) * | 2018-08-10 | 2020-02-21 | Jsr株式会社 | Curable composition and compound |
JPWO2021006070A1 (en) * | 2019-07-05 | 2021-01-14 | ||
KR20230104906A (en) | 2020-11-10 | 2023-07-11 | 다우 실리콘즈 코포레이션 | UV Curable Compositions and Uses Thereof |
KR20230106638A (en) | 2020-11-10 | 2023-07-13 | 다우 실리콘즈 코포레이션 | UV-curable organopolysiloxane composition and use thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110819141A (en) * | 2018-08-10 | 2020-02-21 | Jsr株式会社 | Curable composition and compound |
JPWO2021006070A1 (en) * | 2019-07-05 | 2021-01-14 | ||
JP7412430B2 (en) | 2019-07-05 | 2024-01-12 | 三井化学株式会社 | Sealant for organic EL display elements and organic EL display devices |
KR20230104906A (en) | 2020-11-10 | 2023-07-11 | 다우 실리콘즈 코포레이션 | UV Curable Compositions and Uses Thereof |
KR20230106638A (en) | 2020-11-10 | 2023-07-13 | 다우 실리콘즈 코포레이션 | UV-curable organopolysiloxane composition and use thereof |
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