JP2019070849A - Electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus excellent in portability; or to provide an electronic apparatus excellent in at-a-glance visibility; or to provide an electronic apparatus including new input means.SOLUTION: An electronic apparatus comprises: a display panel having flexibility; and two supports supporting the display panel. The two supports are connected by a connection. The display panel is fixed to one support and is provided to the other support slidably in one direction without being fixed thereto. The electronic apparatus is further provided with detection means that, when the display panel slides, can detect the amount of its displacement.SELECTED DRAWING: Figure 2

Description

One embodiment of the present invention relates to a display device. Alternatively, the present invention relates to an electronic device provided with a display device.
In particular, the present invention relates to a flexible display device. Alternatively, the present invention relates to an electronic device provided with a flexible display device.

Note that one embodiment of the present invention is not limited to the above technical field. One aspect of the invention disclosed in the present specification and the like relates to a product, a method, or a manufacturing method. One aspect of the present invention relates to a process, machine, manufacture or composition (composition of matter). Therefore, as a technical field of one embodiment of the present invention disclosed more specifically in the present specification, a semiconductor device,
A display device, a light emitting device, a power storage device, a memory device, an electronic device, a lighting device, an input device, an input / output device, a driving method thereof, or a manufacturing method thereof can be given as an example.

Note that in this specification and the like, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics. A semiconductor circuit such as a transistor, a semiconductor circuit, an arithmetic device, and a memory device are one embodiment of a semiconductor device. An imaging device, a display device, a liquid crystal display device, a light emitting device, an electro-optical device, a power generation device (including a thin film solar cell, an organic thin film solar cell, and the like), and an electronic device
There is a case where a semiconductor device is included.

In recent years, display devices are expected to be applied to various applications, and diversification is in progress. For example, a display device used for an electronic device for portable use or the like is required to be thin, lightweight, or hard to be broken. There is also a demand for new applications that have never been available.

Further, Patent Document 1 discloses a flexible active matrix light-emitting device in which a transistor as a switching element and an organic EL (Electro Luminescence) element are provided on a film substrate.

JP 2003-174153 A

In recent years, it has been considered to increase the display amount to be displayed by enlarging the display area of the display device and to improve the list property of the display. On the other hand, in portable device applications and the like, portability (also referred to as portability) is reduced when the display area is enlarged. Therefore, it has been difficult to simultaneously improve the listability of the display and high portability.

In addition, it is desired that the display panel be provided with input means as a user interface. For example, there is a display device (touch panel) to which a function of inputting by touching a screen with a finger or a stylus is added.

An object of one embodiment of the present invention is to provide an electronic device with high portability. Another object is to provide an electronic device with excellent listability. Another object is to provide an electronic device which is not easily damaged. Another object is to provide an electronic device including a new input unit.

Alternatively, an object of one embodiment of the present invention is to reduce the thickness of an electronic device. Alternatively, an object is to reduce the weight of the electronic device. Another object is to provide a novel electronic device.

Note that the descriptions of these objects do not disturb the existence of other objects. One aspect of the present invention is not required to solve all of these problems. Further, the problems other than the above are naturally apparent from the description of the specification and the like, and it is possible to extract the problems other than the above from the description of the specification and the like.

One embodiment of the present invention is an electronic device including a first support, a second support, a connection portion, and a display panel. In addition, the display panel has a function which can be bent and displayed.
The first support and the second support are connected by the connecting portion, and the first support and the second support have a function of rotating relatively through the connecting portion. The display panel also has a portion fixed to the first support and is supported by the second support so as to be movable in one direction with respect to the second support. I assume.

Another embodiment of the present invention is an electronic device including a first support, a second support, a connection portion, a display panel, and a detection unit. Further, the display panel has a function of being able to be bent and displayed. The first support and the second support are connected by a connection portion and have a function of rotating relatively through the connection portion. The display panel also has a portion fixed to the first support and is supported by the second support so that it can move in one direction relative to the second support, the first support When the body and the second support are relatively rotated, the relative position with the second support is changed. The detection means is characterized by having a function of detecting the relative position between the display panel and the second support.

In the above, the detection means includes a light emitting element and a light receiving element, one of the light emitting element and the light receiving element is fixed to the display panel, and the other of the light emitting element and the light receiving element is Preferably, it is provided by being fixed to the second support, and the light receiving element has a function of detecting light emission from the light emitting element.

Alternatively, in the above, the detection unit includes a light emitting element and a light receiving element, and the light emitting element and the light receiving element are each fixed to the second support and provided, and the light emitting element is one of the display panels. It is preferable that the light-receiving element have a function of irradiating light to a portion, and the light-receiving element have a function of detecting reflected light from the display panel.

Alternatively, in the above, the display panel includes a display portion and a non-display portion, the display portion includes a first light emitting element, and the detection unit includes a second light emitting element and a light receiving element. The second light emitting element is provided in the non-display portion, the light receiving element is fixed to the second support, and the light receiving element has a function of detecting light emission from the second light emitting element. Is preferred.

Further, in the above, it is preferable that the display panel be positioned so as not to overlap with the central position in the thickness direction of each of the first support, the connection portion, and the second support.

  Moreover, it is preferable that the said connection part has an elastic body.

The display panel preferably has a function as a touch sensor. Alternatively, it is preferable that a touch sensor be provided over the display panel.

According to the present invention, an electronic device excellent in portability can be provided. Alternatively, electronic devices with excellent listability can be provided. Alternatively, the present invention can provide an electronic device which is not easily damaged. Alternatively, an electronic device provided with new input means can be provided. Alternatively, new electronic devices can be provided.

Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these are naturally apparent from the description of the specification, drawings, claims and the like, and other effects can be extracted from the descriptions of the specification, drawings, claims and the like. It is.

6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. 6 shows an example of the configuration of an electronic device according to an embodiment. The figure which shows an example of the light emission panel based on embodiment. The figure which shows an example of the light emission panel based on embodiment. 5A to 5D illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. 5A to 5D illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. The figure which shows an example of the touch panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. FIG. 2 is a block diagram and a timing chart of a touch sensor. The circuit diagram of a touch sensor. 6 shows an example of the configuration of an electronic device according to an embodiment.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it can be easily understood by those skilled in the art that various changes can be made in the form and details without departing from the spirit and the scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

Note that in the structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description of such portions is not repeated. In addition, when referring to the same function, the hatch pattern may be the same and no reference numeral may be given.

In each of the drawings described in this specification, the size of each component, the thickness of a layer, or a region is
May be exaggerated for clarity. Therefore, it is not necessarily limited to the scale.

Note that ordinal numbers such as “first”, “second” and the like in the present specification and the like are attached to avoid confusion of constituent elements, and are not limited numerically.

Embodiment 1
In this embodiment, a structural example of the electronic device of one embodiment of the present invention will be described with reference to the drawings.

An electronic device according to one embodiment of the present invention includes a flexible display panel and two supports for supporting the display panel. The two supports are also connected by a connection. It is possible to rotate the two housings relative to each other through the connection to fold the electronic device. Therefore,
In the electronic device of one embodiment of the present invention, holding the display surface of the display panel in a flat state, bending the display surface of the display panel so that the display surface is inside (inward bending), the display surface of the display panel is outward And so on.

The electronic device of one embodiment of the present invention is excellent in the listability due to the seamless wide display region in the state where the display panel is expanded. In addition, in the state where the display panel is folded, portability is excellent.

Here, in the electronic device according to one embodiment of the present invention, the display panel is fixed to one of the supports and supported so as to slide in one direction on the other support without being fixed. It is preferable to provide. And when changing the angle of two support bodies, it is preferable to set it as the structure which a display panel slides with respect to the non-fixed support body, and the relative position of both changes. With such a configuration, when the angle of the two supports is changed and a portion of the display panel is bent, a force is applied only in the direction in which the display panel is bent, ie, in a direction perpendicular thereto (that is, It is possible to substantially eliminate the force applied in the direction perpendicular to the thickness direction of the display panel. That is, since a force to pull or compress the display panel is not applied when the display panel is bent as the display panel slides, breakage of the display panel is suppressed and a highly reliable electronic device can be realized.

Furthermore, when the display panel slides as described above, it is preferable to include detection means capable of detecting the amount of displacement. Since the displacement of the display panel changes depending on the angles of the two supports, it is possible to detect the angles of the two supports by detecting this displacement. For example, the displacement amount of the display panel can be detected by detecting a change in the relative position between the display panel and the support on the side to which the display panel is not fixed. Preferably, the change in relative position is detected optically. Further, it may be configured to detect mechanically or electrically.

As described above, by making the configuration capable of detecting the angle of the two supports, it is possible to use the angle as one input means in the electronic device. For example, the display on the display panel can be switched according to the angle of the two supports. In addition, in the state where the display surface of the display panel is folded inward, an operation such as stopping display of the display panel can be performed.

  More specifically, the following configuration can be made.

[Example of configuration]
FIG. 1A is a schematic perspective view of an electronic device 10 of one embodiment of the present invention.

The electronic device 10 includes a support 11 a, a support 11 b, a connection portion 12, a display panel 13, and a detection unit 14.

The support 11 a and the support 11 b are connected via the connection portion 12. Display panel 1
The reference numeral 3 is disposed to overlap the support 11 a, the support 11 b, and the connection portion 12. The display panel 13 is supported by at least the support 11 a and the support 11 b.

Specifically, the display panel 13 has an area fixed to the support 11a. Furthermore, the display panel 13 is supported by the support 11 b so as to slide in one direction without being fixed to the support 11 b.

In addition, the display panel 13 has flexibility. The display panel 13 has a region (also referred to as a display region) including a plurality of pixels, and can display an image in the display region. The pixel comprises a display element. In addition, below, the surface by which the image is displayed among the surfaces of the display panel 13 may be described as a display surface.

The support 11 a and the support 11 b can be relatively rotated via the connection 12. For example, the support 11a and the support 11b can be deformed through folding or twisting through the connection portion 12. Therefore, the electronic device 10 can reversibly deform the display surface of the display panel 13 from the flat state to the curved display surface.

The support 11a and the support 11b may have rigidity, or a member that can be deformed by a force that the support itself twists or curves may be used. Support 11a and Support 11
At least the display panel 13 or a material having a flexibility lower than that of the connection portion 12 may be used as b, and an elastic body such as hard rubber may be used for its frame. Besides, as materials which can constitute each case, plastics, metals such as aluminum, alloys such as stainless steel and titanium alloy, and rubbers such as silicone rubber can be used.

The connection part 12 can use suitably the material which elastically deforms one part or all. For example, all of the connection portions 12 may be elastic or may be configured to have an elastic at least at a bending portion. Or the structure which has a hinge which has one or more rotating shafts as the connection part 12 is also applicable.

When a material that elastically deforms as the connection portion 12 is used, the display surface shown in FIG. 1A is kept flat when no force is given to relatively rotate the support 11a and the support 11b. can do. Further, in order to keep the state of FIG. 1 (C) or FIG. 1 (E), the support 11a is
It is preferable to have a mechanism for fixing the support 11b and the support 11b. For example, a desorber that mechanically desorbs the support 11a and the support 11b may be separately provided, or the support 11a and the support 11b may be provided with a desorbing mechanism. Alternatively, the support 11a and the support 11b may be fixed by magnetic force.

Moreover, when it is set as the structure which has a hinge as the connection part 12, FIG.1 (C) and FIG.1 (E) are made.
It is preferable to use the hinge provided with a mechanism for fixing the relative position between the support 11a and the support 11b in the above state, since the above-described detachment tool and detachment mechanism become unnecessary. Further, by using a hinge having a stepwise fixing position, as shown in FIG. 1 (B) and FIG. 1 (D), the display panel 1 is provided.
It can also be used in a state where the display surface of 3 is curved.

For example, a material having a Young's modulus lower than that of the support 11 a and the support 11 b can be used as the connection portion 12. Further, even in the case where a material having a Young's modulus higher than that of the support 11a and the support 11b or a material having a similar Young's modulus is used, the thickness of the connection portion 12 is set to the support 1
A material thinner than 1a and the support 11b can also be applied. As a material which can constitute connection part 12, plastic, rubber, metal, an alloy, etc. can be used. For example, a material such as silicone resin or gel may be used.

FIG. 1A shows a state in which the display surface of the display panel 13 is held flat. By deforming the electronic device 10 so that the display surface of the display panel 13 is bent inward from this state, the state shown in FIG. 1B can be reversibly deformed to the state shown in FIG. Figure 1 (C)
In this state, the display panel 13 is in a state of being sandwiched and stored in the support 11a and the support 11b. When not using the electronic device 10 or when storing it in a bag etc., it can be set as such a form.

Further, by changing the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state shown in FIG. 1A, the state shown in FIG. 1D is reversed to the state shown in FIG. Can be deformed. In FIG. 1E, the display surface of the display panel 13 is positioned along the upper surface, the side surface, and the lower surface of the electronic device 10. The state shown in FIG. 1 (E) is smaller than the state shown in FIG. 1 (A), so it is suitable for use in a public place or during movement.

[Example of section configuration]
FIG. 2A shows a schematic cross-sectional view of the electronic device 10 at the cutting plane X1 shown in FIG. 1A. FIG. 2B is a schematic cross-sectional view of the cross section X2 shown in FIG. 1B, and FIG. 2C is a schematic cross-sectional view of the cross section X3 shown in FIG.

In FIG. 2A, the display panel 13 is disposed along the upper surface of each of the support 11 a, the support 11 b, and the connection portion 12. In addition, the display panel 13 has an FPC (Flexi
ble Print Circuit) 15 is connected and electrically connected to the circuit board 16 provided inside the support 11 a via the FPC 15. Also, the circuit board 16
Are electrically connected to the battery 17 provided inside the first support 11a. Also,
As shown in FIG. 2A, the battery 17 may be provided also inside the second support 11b. Although not shown here, a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted may be provided inside the support 11b. For example, the IC may have a function of driving the detection unit 14 and a function of extracting the signal output from the detection unit 14.

The display panel 13 is supported so as to be fixed to the support 11 a. For example, a part of the display panel 13 may be bonded to the support 11 a or may be mechanically fixed by a fixing tool such as a screw.

On the other hand, the display panel 13 is supported without being fixed to the support 11 b. In particular,
In FIG. 2A, the display panel 13 is supported so as to be slidable in the left-right direction with respect to the support 11b.

Here, the thickness direction of the display panel 13 (vertical direction in FIG. 2A), and the display panel 13
So that the display panel 13 does not move (shift) in one or both of the directions perpendicular to the direction of bending when it is bent (the direction perpendicular to the paper in FIG. 2A). Preferably, 13 is supported by the support 11b.

As described above, the display panel 13 is fixed to the support 11 a and supported so as not to be fixed to the support 11 b. Therefore, the support 11 a and the support 1 are connected via the connection 12.
When 1b is relatively rotated, the display panel 13 is displaced with respect to the support 11b, whereby the stress applied in the direction perpendicular to the thickness direction of the display panel 13 is alleviated, and the display panel 13 is damaged, etc. Can be suppressed. Therefore, highly reliable electronic device 10 can be realized.

FIG. 2A shows an example in which the detection means 14 is disposed on the second support 11 b. The detection means 14 has a function of detecting the relative position of the support 11 b and the display panel 13. A specific configuration example of the detection means 14 will be described later. Here, FIG. 2A shows a configuration in which the detection unit 14 is disposed on the support 11 b, but the position of the detection unit 14 can be appropriately set according to the configuration.

FIGS. 2 (B) and 2 (C) also show enlarged views of a part of the support 11b.

As shown in FIG. 2B, when the display surface of the display panel 13 is bent inward, the end portion of the display panel 13 on the support 11 b side is moved to the outside so that the display panel 13 is supported. The relative position with the body 11b is shifted. On the other hand, as shown in FIG. 2C, when the display surface of the display panel 13 is bent to the outside, the end portion of the display panel 13 on the support 11 b side moves inward. The relative position with respect to the support 11b is shifted.

As described above, by detecting the relative positional deviation between the display panel 13 and the support 11b that occurs when the display panel 13 is bent, the relative value between the support 11a and the support 11b can be determined from the value of this deviation. Position relationship can be calculated. As a result, the shape of the electronic device 10 can be detected.

  The above is the description of the cross-sectional configuration example.

[Displacement of display panel]
In the following, the amount (displacement amount) of relative positional deviation between the display panel 13 and the support 11 b which occurs when the electronic device 10 is deformed to bend the display panel 13 will be described.

FIG. 3A is a diagram schematically illustrating an electronic device of one embodiment of the present invention. The electronic device illustrated in FIG. 3A has a configuration in which the support 11 a and the support 11 b are connected by the connection portion 12 having elasticity. In addition, a display panel 13_1 is provided on one surface of the support 11a, the connection portion 12, and the support 11b, and a display panel 13_2 is provided on the other surface. In FIG. 3A, hatching patterns are attached to indicate that the display panel 13_1 and the display panel 13_2 are fixed to a part of the surface of the support 11a.

Here, in order to simultaneously explain both the case where the display surface of the display panel is inside and the case where it is outside when the connecting portion 12 is bent, an example having two display panels will be described.

Moreover, as shown to FIG. 3 (A), let thickness of each of the support body 11a, the support body 11b, and the connection part 12 be thickness t. Further, the length of the connection portion 12 is set to a length L0. In addition, display panel 13
It is assumed that the end of the display panel 13_2 and the end of the support 11b coincide with each other. Moreover, the neutral line (it is also called a neutral line) 12a of the connection part 12 is shown with the broken line in FIG. 3 (A). Here, in the present specification and the like, the neutral line means a line connecting the centers in the thickness direction of the cross section of the object when no stress is applied to the object.

Here, as shown in FIG. 3 (B), the neutral line 12a of the connection portion 12 has an angle θ with a curvature radius r0.
Just think of when it is curved. At this time, since the connection portion 12 is an elastic body, a stress generated when the connection portion 12 is bent causes the portion inside the neutral line 12 a of the connection portion 12 to contract and the stress than the neutral line 12 a of the connection portion 12. The outer part will be stretched.

Here, for simplicity, when the connecting portion 12 is bent, the thickness of the connecting portion 12 does not change, and the neutral line 12 a of the connecting portion 12 always passes through the center of the thickness of the connecting portion 12, A case is considered in which the neutral line 12a of the connecting portion 12 is curved with a constant radius of curvature from one end of the connecting portion 12 to the other end.

In FIG. 3B, the length of the neutral line 12a of the connection portion 12 is L0. Connection 12
The radius of curvature r1 in the inner surface of and the radius of curvature r2 in the outer surface are respectively as follows.

Therefore, the length L1 of the inner surface of the connection portion 12 in the cross section shown in FIG.
The length L2 of the outer surface is as follows.

Here, since the display panel 13_1 is provided in contact with the inner surface of the connection portion 12, if the display panel 13_1 does not expand or contract, the end of the display panel 13_1 is displaced to the outer side than the end of the support 11b. Thus, part of the display panel 13_1 moves relative to the support 11b. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connection portion 12,
A portion of the display panel 13_2 moves relative to the support 11b such that the end of the display panel 13_2 is displaced inward of the end of the support 11b. The displacement d1 of the display panel 13_1 with respect to the support 11b and the displacement d2 of the display panel 13_2 with respect to the support 11b are as follows, assuming that the displacement to the outside is positive.

From the equation (3), the displacement d1 of the display panel 13_1 and the displacement d of the display panel 13_2
It can be seen that 2 depends on the thickness t of the connecting portion 12 and the angle θ. Assuming that the thickness t of the connection portion 12 is constant, the angle θ can be determined by detecting the displacement amount d1 or the displacement amount d2.
Can be estimated.

The displacement amount d1 of the display panel 13_1 and the displacement amount d2 of the display panel 13_2 increase as the distance between the display panel 13_1 or the display panel 13_2 and the neutral line 12a increases. Therefore, it is preferable that the display panel be located at least away from the neutral line 12a. That is, the display panel is preferably positioned so as not to overlap with the center position in the thickness direction of each of the support 11 a, the connection portion 12, and the second support 11 b.

In fact, there may be a portion where the thickness of the curved portion of the connection portion 12 is reduced. Therefore, a difference occurs in the absolute value of the amount of displacement between the case where the display surface is bent inward as in the display panel 13_1 of FIG. 3B and the case where the display surface is bent outward as in the display panel 13_2. The displacement may differ from the value of. Therefore, in the case of calculating the angle θ from the relative displacement amount between the display panel 13 and the support 11b, it is preferable to perform correction in consideration of the shape change when the connecting portion 12 is bent.

Moreover, although the case where it was a plate-shaped shape as the connection part 12 was shown here, it is not restricted to this.
For example, as shown in FIGS. 4A and 4B, the wiring 18 can be provided in the cavity by forming the connection portion 12 having the cavity inside. The wiring 18 can electrically connect the circuit board, the battery, and the like provided inside the support 11 a and the support 11 b to each other. Further, as shown in FIGS. 4C and 4D, the stress applied to the connection portion 12 when the connection portion 12 is bent can be reduced by forming the connection portion 12 in a form having a bellows structure. . Further, as shown in FIGS. 4E and 4F, the connection portion 12 may have a bellows structure in which a cavity is provided, and the wire 18 may be provided in the cavity.

Further, although the case where an elastic body is used as the connection portion 12 has been described here, the connection portion 12 is described.
In the case where a hinge is used, the relative movable range of the support 11a and the support 11b can be limited, so that the angle θ can be calculated more accurately from the relative displacement between the support 11b and the display panel 13. It is preferable because At this time, it is preferable that the hinge has two or more rotation axes, because a design with a higher degree of freedom is possible.

  The above is the description of the displacement amount of the display panel.

[Configuration example of detection means]
As described above, the detection unit 14 refers to a mechanism having a function of detecting a change in relative position between the support 11 b and the display panel 13.

Preferably, the detection means 14 is configured to optically detect a change in position. For example, one of the light emitting element or the light receiving element may be provided on the support 11 b, and the other may be provided on the display panel 13. Alternatively, both the light emitting element and the light receiving element may be provided on the support 11 b, and the light from the light emitting element reflected by the display panel 13 may be detected by the light receiving element. Alternatively, both the light emitting element and the light receiving element may be provided in the display panel 13 so as to receive the reflected light from the support 11 b.

  More specifically, the following configuration can be used.

[Configuration Example 1]
FIG. 5A is a schematic cross-sectional view of a region including the detection means 14 of the support 11b.

The support 11 b includes a first portion 31 for supporting the display panel 13, a second portion 32 located on the display surface side of the display panel 13, and a second portion 32 located on the opposite side of the display surface side of the display panel 13. 3
Part of and. The second portion 32 and the third portion 33 may function as an exterior member of the support 11 b.

  The detection means 14 has a plurality of light receiving elements 21 and a light emitting element 22.

In the configuration shown in FIG. 5A, the plurality of light receiving elements 21 are fixed to the surface of the second portion 32 of the support 11 b facing the display panel 13. In addition, the light emitting element 22 is
It is arranged fixed to the display panel 13. The light emitting element 22 can emit light to the second portion 32 side of the support 11 b, more specifically, to the light receiving element 21 side.

The light emitted from the light emitting element 22 may be visible light, infrared light, or ultraviolet light. For example, a light emitting element which emits light having one or more peaks in a wavelength range of 300 nm to 3000 nm can be applied. In particular, when infrared light having a wavelength of 750 nm or more is used, design is easy because safety against light leakage from the support 11b is less than when visible light or ultraviolet light is used, and safety can be enhanced. It is preferable because it becomes possible.

The light emitting element 22 may be, for example, an LED (Light Emitting Diode).
A light emitting element such as an organic EL element or an inorganic EL element can be applied. In particular, in the case where the display panel 13 has a light emitting element such as an organic EL element in a pixel, the number of components can be reduced by using a light emitting element manufactured in the same process as the pixel as the light emitting element 22. In that case, the light emitted from the light emitting element 22 is light including visible light.

The light receiving element 21 is an element capable of receiving light emitted from the light emitting element 22. As the light receiving element 21, for example, a light receiving element including a photoelectric conversion element such as a photodiode or a phototransistor can be applied. Besides, a solid-state imaging device such as a CCD image sensor or a CMOS image sensor can also be applied.

Further, as described later, the light receiving element 21 may be provided on the display panel 13. At this time, particularly in the case of an optical touch panel in which the display panel 13 has a photoelectric conversion element such as a photodiode in the display region, it is preferable to manufacture the light receiving element 21 and the photoelectric conversion element in the same process.

  FIGS. 5B and 5C are schematic perspective views showing the detection means 14 and its main peripheral portion.

The display panel 13 has a display unit 13a and a non-display unit 13b. The display unit 13a is a portion having a plurality of pixels and capable of displaying an image or the like. In addition, the light emitting element 22 is disposed in a part of the non-display portion 13b. The second portion 32 of the support 11 b is arranged to overlap the non-display portion 13 b of the display panel 13.

As shown in FIG. 5B, light 23 emitted from the light emitting element 22 is emitted to the display surface side of the display panel 13. At this time, the light receiving element 21 positioned in the traveling direction of the light 23 detects the light 23.

Subsequently, it is assumed that the display panel 13 is displaced relative to the support 11 b in the direction of the arrow shown in FIG. 5 (C) from the state of FIG. 5 (B). At this time, the light emitting element 22 and the plurality of light receiving elements 21
5B, the light receiving element 21 different from that in the state of FIG. 5B is positioned in the traveling direction of the light 23 emitted from the light emitting element 22.

Although FIG. 5B and the like show the case where the traveling direction of the light 23 is a direction substantially perpendicular to the surface of the display panel 13, the present invention is not limited to this and may travel in an oblique direction. In addition, light emitting element 22
Alternatively, a light emitting element having high directivity may be used, or a light emitting element having an intensity distribution in the traveling direction may be used.

As described above, by comparing the detection intensities of the light 23 received by the plurality of light receiving elements 21, it is possible to detect the relative positional relationship between the display panel 13 and the support 11b.

The accuracy of the position detected by the detection means 14 can be improved by arranging the plurality of light receiving elements 21 as close as possible to the relative displacement direction of the display panel 13 and the support 11 b. For example, as shown in FIG. 6A, by arranging the projections of the two adjacent light receiving elements 21 to overlap with each other with respect to a vector (arrow) parallel to the direction of displacement, the accuracy of the detected position can be obtained. It can be enhanced.

Moreover, as shown to FIG. 6 (B), even when it is a case where two adjacent light receiving elements 21 are arranged with a space | interval, when the angle dependence of the light 23 from the light emitting element 22 is known beforehand In this case, it is possible to detect the position of the light emitting element 22 with high accuracy by calculating the peak position of the detected intensity from the values of the detected intensity by the plurality of light receiving elements 21.

Here, although a plurality of light receiving elements 21 are provided in the second portion 32 of the support 11 b and the light emitting elements 22 are provided in the display panel 13 as the detection means 14, the invention is not limited thereto.
For example, as shown in FIG. 7A, the display panel 13 is provided with a plurality of light receiving elements, and the support 11b is provided.
The light emitting element 22 may be provided in the second portion 32 of the second embodiment.

In addition, as shown in FIG. 7B, the first portion 31 of the support 11b is configured to have an opening, and the light emitting element 22 that emits light to the side opposite to the display surface of the display panel 13; A plurality of light receiving elements 21 provided in the third portion 33 of 11 b may be provided.

Further, as shown in FIG. 7C, a plurality of light receiving elements 21 may be provided on the opposite side of the display surface of the display panel 13 and the light emitting elements 22 may be provided on the third portion of the support 11b.

7B and 7C, the opening of the first portion 31 is at least a light emitting element 22.
It suffices to transmit the light emitted by the light emitting element and may have a light transmitting member.

  The above is the description of the configuration example 1.

[Configuration Example 2]
Hereinafter, a configuration example in which a part of the configuration is different from the configuration example 1 will be described. The description may be omitted for the parts overlapping with the above.

  FIG. 8A is a schematic perspective view showing the detection means 14 and its main peripheral portion.

The light receiving element 21 and the light emitting element 22 are arranged side by side on the surface of the second portion 32 of the support 11 b facing the display panel 13.

As shown in FIG. 8A, the light 23 emitted from the light emitting element 22 is reflected to a part of the non-display portion 13 b of the display panel 13, and a part of the reflected light is received by the light receiving element 21. Since the intensity of light received by the light receiving element 21 changes as the display panel 13 is displaced relative to the support 11b, the relative change between the display panel 13 and the support 11b is detected by detecting this change. The displacement amount can be detected.

In the non-display portion 13 b of the display panel 13, it is preferable that a portion that reflects the light 23 emitted by the light emitting element 22 has a portion with different reflectance. More specifically, along the direction perpendicular to the displacement direction of the display panel 13, it is sufficient to have portions with different reflectances.
For example, the pattern of the wiring provided in the non-display portion 13b, the pattern of the drive circuit, or the like can be used.

In addition, a pattern for position detection may be separately formed on the surface or in the inside of the non-display portion 13b of the display panel 13. For example, when the display panel 13 is displaced, a pattern may be formed in which a portion with high reflectance and a portion with low reflectance appear alternately. Such a pattern may be formed by a printing method or the like, or the surface of the display panel 13 may have a concavo-convex shape.

FIGS. 8B to 8E show examples of patterns for position detection which the non-display unit 13b of the display panel 13 has. The arrows in the figures indicate the displacement direction of the display panel 13.

In FIG. 8A, it has a first region 24 having a first reflectance and a second region 25 having a second reflectance. The second stripe-shaped direction is substantially parallel to the displacement direction of the display panel 13.
The region 25 has a pattern in which a plurality of regions 25 are arranged.

Here, the difference in reflectance between the first reflectance and the second reflectance may be, for example, 5% or more, preferably 10% or more, and more preferably 15% or more. In addition, the first reflectance and the second reflectance may have a difference in reflectance, and the first reflectance may be higher than the second reflectance.
It may be low.

In addition, as shown in FIG. 8C, the stripe-shaped second region 25 may be disposed obliquely with respect to the displacement direction. Further, as shown in FIG. 8D, the second region 25 may have a lattice shape. Alternatively, as shown in FIG. 8E, the second regions 25 may be arranged in a dot pattern.

Here, an example is shown in which two different portions of reflectance are regularly arranged, but
The above different portions of reflectance may be regularly arranged. Further, two or more portions with different reflectances may be arranged irregularly.

Although the case where the light receiving element 21 and the light emitting element 22 are disposed in the second portion 32 of the support 11 b has been described here, the light receiving element 21 and the light emitting element 22 may be disposed in the third portion 33. In that case,
As exemplified in Structural Example 1, the first portion 31 having an opening for transmitting light emitted from the light emitting element 22 may be provided.

As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11 b and using the reflected light to detect the relative position between the display panel 13 and the support 11 b, the number of parts can be reduced. Can be reduced. Further, as a pattern for detection provided in the non-display portion 13 b of the display panel 13, a pattern such as a wiring of the display panel 13 can be used,
It is possible to increase the freedom of design.

  The above is the description of the configuration example 2.

In the present embodiment, two supports are provided, but three or more supports may be provided. The greater the number of supports, the more it is possible to deform the electronic device into various shapes and the range of applications is broadened. In FIGS. 9A to 9C, three supports (support 1) are shown.
The example of a structure of the electronic device provided with 1c, 11d, 11e is shown. The electronic device shown in FIG. 9A passes the form shown in FIG. 9B by bending the display panel 13 in two places, and FIG.
The electronic device can be folded as in C).

Further, in the case of a configuration having three or more supports, the display panel 13 is fixed to one of the supports and is supported so as to slide without being fixed to the other support. Just do it. In addition, among the supports that do not support the display panel 13, one or more supports may be provided with the above-described detection means. That is, assuming that the number of supports provided in the electronic device is n, the detection means may be provided on one or more and n−1 or less of the supports. The greater the number of supports having the detection means, the more preferable it is because the form of the electronic device can be detected in more detail. Preferably, all supports that do not support the display panel 13 may be provided with detection means.

In the electronic device of one embodiment of the present invention, the support can be provided with various input means, output means, or input / output means. For example, in FIG. 20, the input button 41, the power button 42, the external connection terminal 43, the card slot 44, the optical sensor 45, the camera 46, the light source 47, the speaker 48 and the microphone 49 are provided on the support 11a or 11b. Shows an example. Moreover, in FIG. 20, the battery 17 is incorporated in each of the support body 11a and the support body 11b. In addition, the antenna 51 is mounted on a part of the support 11b.

This embodiment can be implemented in appropriate combination with at least a part of the other embodiments described in this specification.

Second Embodiment
In this embodiment, a structural example and a manufacturing method of a light-emitting panel which can be applied to a display panel included in the electronic device of one embodiment of the present invention will be described.

[Specific example 1]
FIG. 10A shows a plan view of the light-emitting panel, and a dashed dotted line A1-A2 in FIG.
An example of a cross-sectional view between them is shown in FIG. The light emitting panel shown in the specific example 1 is a top emission type light emitting panel using a color filter system. In the present embodiment, the light-emitting panel has a configuration in which one color is represented by, for example, three sub-pixels of R (red), G (green) and B (blue), R (red), G (green) ), B (blue), W (white), or R (red), G (green), B (blue)
A configuration in which one color is expressed by four sub-pixels of Y and Y (yellow) can be applied. The color elements are not particularly limited, and colors other than RGBW may be used, and may be made of, for example, yellow, cyan, or magenta.

The light-emitting panel illustrated in FIG. 10A includes a light-emitting portion 804, a driver circuit portion 806, and an FPC (Fle
xible Printed Circuit) 808. The light emitting elements and the transistors included in the light emitting portion 804 and the driver circuit portion 806 are sealed by the substrate 801, the substrate 803, and the sealing layer 823.

The light-emitting panel illustrated in FIG. 10C includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 8.
21, sealing layer 823, overcoat 849, colored layer 845, light shielding layer 847, insulating layer 84
3 includes an adhesive layer 841 and a substrate 803. The sealing layer 823, the overcoat 849, the insulating layer 843, the adhesive layer 841, and the substrate 803 transmit visible light.

The light emitting portion 804 includes the transistor 820 and the light emitting element 830 over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. The light emitting element 830 has a lower electrode 83 on the insulating layer 817.
1, the EL layer 833 on the lower electrode 831, and the upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

In addition, the light emitting portion 804 includes a coloring layer 845 overlapping with the light emitting element 830 and a light shielding layer 847 overlapping with the insulating layer 821. The colored layer 845 and the light shielding layer 847 are covered with an overcoat 849. A space between the light emitting element 830 and the overcoat 849 is filled with the sealing layer 823.

The insulating layer 815 has an effect of suppressing diffusion of impurities into the semiconductor included in the transistor. As the insulating layer 817, an insulating layer having a planarization function is preferably selected in order to reduce surface unevenness due to the transistor.

The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. In FIG. 10C, among the transistors included in the driver circuit portion 806,
One transistor is shown.

The insulating layer 813 and the substrate 801 are attached to each other by an adhesive layer 811. The insulating layer 843 and the substrate 803 are attached to each other by an adhesive layer 841. It is preferable to use a film with low water permeability for the insulating layer 813 and the insulating layer 843 because entry of an impurity such as water into the light-emitting element 830 or the transistor 820 can be suppressed, and the reliability of the light-emitting panel can be increased.

The conductive layer 857 is electrically connected to an external input terminal which transmits an external signal (a video signal, a clock signal, a start signal, a reset signal, or the like) to the driver circuit portion 806 and a potential.
Here, an example in which an FPC 808 is provided as an external input terminal is shown. In order to prevent an increase in the number of steps, the conductive layer 857 is preferably manufactured using the same material or the same step as an electrode or a wiring used for the light emitting portion or the driver circuit portion. Here, an example is described in which the conductive layer 857 is manufactured using the same material and steps as the electrode of the transistor 820.

In the light emitting panel shown in FIG. 10C, the connection body 825 is located on the substrate 803. The connection body 825 is connected to the conductive layer 857 through an opening provided in the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Also, connection body 8
25 is connected to the FPC 808. The FPC 808 and the conductive layer 857 through the connection body 825
Connect electrically. In the case where the conductive layer 857 and the substrate 803 overlap, the conductive layer 857, the connector 825, and F can be formed by opening the substrate 803 (or using a substrate having an opening).
The PC 808 can be electrically connected.

In Example 1, the insulating layer 813, the transistor 820, and the light emitting element 830 are manufactured over a highly heat-resistant manufactured substrate, the manufactured substrate is peeled off, and the insulating layer 8 is formed over the substrate 801 using the adhesive layer 811.
13 shows a light emitting panel which can be manufactured by transposing the transistor 13 and the transistor 820 and the light emitting element 830. In Example 1, the insulating layer 843 and the coloring layer 845 are formed over a manufactured substrate with high heat resistance.
And a light-emitting panel which can be manufactured by peeling off the formation substrate and peeling the insulating substrate 843, the colored layer 845, and the light shielding layer 847 over the substrate 803 using the adhesive layer 841.

In the case where a material with low heat resistance (such as resin) is used for the substrate, it is difficult to apply a high temperature to the substrate in the manufacturing process; thus, conditions for manufacturing a transistor and an insulating layer over the substrate are limited. In the case of using a material having high water permeability (such as resin) for the substrate, it is preferable to apply a high temperature to form a low water permeability film. In the manufacturing method of this embodiment, a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance; thus, a highly reliable transistor or a film with sufficiently low water permeability can be formed under high temperature. Then, by transferring them to the substrate 801 and the substrate 803, a highly reliable light emitting panel can be manufactured. Thus, in one aspect of the invention:
A lightweight or thin light emitting panel with high reliability can be realized. Details of the manufacturing method will be described later.

Note that the light-emitting element 22 described in Embodiment 1 can be used by providing a light-emitting element manufactured in the same step as the light-emitting element 830 described above in the non-display portion.

[Specific Example 2]
The top view of a light emission panel is shown in FIG. 10 (B), and the dashed-dotted line A3-A4 in FIG. 10 (B) is shown.
An example of a cross-sectional view between them is shown in FIG. The light emitting panel shown in the specific example 2 is a top emission type light emitting panel which is different from the specific example 1 and uses a color filter system. Here, only the points different from the first example will be described in detail, and the points common to the first example will not be described.

The light-emitting panel shown in FIG. 10D is different from the light-emitting panel shown in FIG. 10C in the following points.

The light-emitting panel illustrated in FIG. 10D includes a spacer 827 over the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

In the light emitting panel shown in FIG. 10D, the sizes of the substrate 801 and the substrate 803 are different.
The connector 825 is located over the insulating layer 843 and does not overlap with the substrate 803. The connection body 825 is connected to the conductive layer 857 through an opening provided in the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. The material of the substrate 803 is not limited because it is not necessary to provide the substrate 803 with an opening.

Note that the light-emitting element 22 described in Embodiment 1 can be used by providing a light-emitting element manufactured in the same step as the light-emitting element 830 described above in the non-display portion.

[Specific Example 3]
FIG. 11A shows a plan view of the light-emitting panel, and a dashed dotted line A5-A6 in FIG.
An example of a cross-sectional view between them is shown in FIG. The light-emitting panel shown in the specific example 3 is a top emission type light-emitting panel using a separate application method.

The light-emitting panel illustrated in FIG. 11A includes a light-emitting portion 804, a driver circuit portion 806, and an FPC 808. The light emitting elements and transistors included in the light emitting portion 804 and the driver circuit portion 806 are the substrate 8.
01, a substrate 803, a frame-like sealing layer 824, and a sealing layer 823 are used for sealing.

The light-emitting panel illustrated in FIG. 11C includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 8.
21 includes a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. The sealing layer 823 and the substrate 803 transmit visible light.

The frame-like sealing layer 824 is preferably a layer having a gas barrier property higher than that of the sealing layer 823. Thereby, it is possible to suppress the entry of moisture and oxygen from the outside into the light emitting panel. Therefore, a highly reliable light emitting panel can be realized.

In the third example, light emission of the light emitting element 830 is extracted from the light emitting panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 have high light transmittance as compared to the frame-shaped sealing layer 824. The sealing layer 823 preferably has a refractive index higher than that of the frame-shaped sealing layer 824. In addition, the sealing layer 823 preferably has a smaller volume shrinkage during curing than the frame-shaped sealing layer 824.

The light emitting portion 804 includes the transistor 820 and the light emitting element 830 over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. The light emitting element 830 has a lower electrode 83 on the insulating layer 817.
1, the EL layer 833 on the lower electrode 831, and the upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. In FIG. 11C, among the transistors included in the driver circuit portion 806,
One transistor is shown.

The insulating layer 813 and the substrate 801 are attached to each other by an adhesive layer 811. Insulating layer 813
It is preferable to use a film having low water permeability because it is possible to suppress the entry of impurities such as water into the light emitting element 830 and the transistor 820, and the reliability of the light emitting panel is increased.

The conductive layer 857 is electrically connected to an external input terminal which transmits an external signal or potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. Here, the conductive layer 857 is formed using the same material as the electrode included in the transistor 820,
The example produced in the same process is shown.

In the light emitting panel shown in FIG. 11C, the connection body 825 is located on the substrate 803. The connector 825 is connected to the conductive layer 857 through an opening provided in the substrate 803, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Also, the connection body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected to each other through the connection body 825.

In Example 3, the insulating layer 813, the transistor 820, and the light emitting element 830 are manufactured over a highly heat-resistant manufactured substrate, the manufactured substrate is peeled off, and the insulating layer 8 is formed over the substrate 801 using the adhesive layer 811.
13 shows a light emitting panel which can be manufactured by transposing the transistor 13 and the transistor 820 and the light emitting element 830. Since a transistor or the like can be manufactured over a manufactured substrate with high heat resistance, a highly reliable transistor or a film with sufficiently low water permeability can be formed under high temperature. And
By displacing them to the substrate 801, a highly reliable light emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and highly reliable can be realized.

Note that the light-emitting element 22 described in Embodiment 1 can be used by providing a light-emitting element manufactured in the same step as the light-emitting element 830 described above in the non-display portion.

[Specific Example 4]
The top view of a light emission panel is shown in FIG. 11 (B), and the dashed-dotted line A7-A8 in FIG. 11 (B) is shown.
An example of a cross-sectional view between them is shown in FIG. The light emitting panel shown in the specific example 4 is a bottom emission type light emitting panel using a color filter system.

The light-emitting panel illustrated in FIG. 11D includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, a coloring layer 845, an insulating layer 817a, and an insulating layer 8.
17b, a conductive layer 816, a plurality of light emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803
Have. A substrate 801, an adhesive layer 811, an insulating layer 813, an insulating layer 815, an insulating layer 817a,
The insulating layer 817 b transmits visible light.

The light emitting portion 804 includes the transistor 820, the transistor 822, and the light emitting element 830 over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. The light emitting element 830 includes a lower electrode 831 over the insulating layer 817, an EL layer 833 over the lower electrode 831, and an upper electrode 835 over the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light. The position of the coloring layer 845 overlapping with the light emitting element 830 is not particularly limited, and may be, for example, between the insulating layer 817a and the insulating layer 817b, between the insulating layer 815 and the insulating layer 817a, or the like.

The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. In FIG. 11C, among the transistors included in the driver circuit portion 806,
Two transistors are shown.

The insulating layer 813 and the substrate 801 are attached to each other by an adhesive layer 811. Insulating layer 813
It is preferable to use a low water permeability film because it is possible to suppress the entry of impurities such as water into the light emitting element 830 and the transistors 820 and 822 and the reliability of the light emitting panel is increased.

The conductive layer 857 is electrically connected to an external input terminal which transmits an external signal or potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. Here, an example in which the conductive layer 857 is formed using the same material and process as the conductive layer 816 is described.

In Specific Example 4, the insulating layer 813, the transistor 820, the light emitting element 830, and the like are manufactured over a highly heat-resistant manufactured substrate, the manufactured substrate is peeled, and the insulating layer 813 or the transistor is formed over the substrate 801 using the adhesive layer 811. A light emitting panel which can be manufactured by displacing the light emitting element 830 and the like 820 is shown. Since a transistor or the like can be manufactured over a manufactured substrate with high heat resistance, a highly reliable transistor or a film with sufficiently low water permeability can be formed under high temperature. Then, by displacing them to the substrate 801, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and highly reliable can be realized.

Note that the light-emitting element 22 described in Embodiment 1 can be used by providing a light-emitting element manufactured in the same step as the light-emitting element 830 described above in the non-display portion.

[Specific Example 5]
FIG. 11E shows an example of a light emitting panel which is different from the specific examples 1 to 4.

The light-emitting panel illustrated in FIG. 11E includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, a conductive layer 857a, a conductive layer 857b, a light-emitting element 830, an insulating layer 821, a sealing layer 82.
3 and a substrate 803.

The conductive layer 857a and the conductive layer 857b have a function as an external connection electrode of the light-emitting panel and can be electrically connected to an FPC or the like.

The light emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the lower electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emission type, a top emission type, or a dual emission type. The electrode, the substrate, the insulating layer, and the like on the light extraction side transmit visible light. The conductive layer 814 has a lower electrode 831.
Connect electrically with

The substrate on the side from which light is extracted may have a hemispherical lens, a microlens array, a film to which a concavo-convex structure is formed, a light diffusion film, or the like as a light extraction structure. For example, the light extraction structure can be formed by bonding the lens or film on a resin substrate using the substrate or an adhesive having a refractive index similar to that of the lens or film.

The conductive layer 814 is not necessarily provided, but is preferably provided because the voltage drop due to the resistance of the lower electrode 831 can be suppressed. For the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided over the insulating layer 821, the EL layer 833, the upper electrode 835, or the like.

The conductive layer 814 is formed as a single layer or stacked using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material containing any of these as a main component It can be formed. The thickness of the conductive layer 814 can be, for example, 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more.
. 5 μm or less.

When paste (silver paste or the like) is used as the material of the conductive layer electrically connected to the upper electrode 835, the metal constituting the conductive layer becomes granular and agglomerates. Therefore, the surface of the conductive layer is rough and has a large gap, and it is difficult for the EL layer 833 to completely cover the conductive layer, and electrical connection between the upper electrode and the conductive layer is facilitated, which is preferable. .

In Example 5, the insulating layer 813, the light-emitting element 830, and the like are manufactured over a highly heat-resistant manufactured substrate,
The manufacturing substrate is peeled off, and the insulating layer 813 or the light emitting element 83 is formed over the substrate 801 using the adhesive layer 811.
The light emission panel which can be produced by transposing 0 grade | etc., Is shown. On a highly heat-resistant fabricated substrate,
A highly reliable light emitting panel can be manufactured by applying a high temperature to form a film with sufficiently low water permeability and displacing the film to the substrate 801. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and highly reliable can be realized.

Note that although an example of using a light-emitting element as a display element is shown here, one embodiment of the present invention is not limited to this.

For example, in this specification and the like, a display element, a display device or a display panel which is a device having a display element, a light emitting element, and a light emitting device which is a device having a light emitting element use various modes or various elements. You can have As an example of a display element, a display device, a display panel, a light emitting element or a light emitting device, an EL (electroluminescent) element (an EL element containing an organic substance and an inorganic substance, an organic EL element, an inorganic EL element), an LED (white LED, red LE
D, green LED, blue LED, etc., transistor (transistor emitting light according to current), electron emitting element, liquid crystal element, electron ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), MEMS ( Display device using micro electro mechanical system), digital micro mirror device (DMD), D
MS (digital micro shutter), MIRASOL (registered trademark), IMOD (interference modulation) element, shutter type MEMS display element, optical interference type MEMS display element, electro wetting element, piezoelectric ceramic display, carbon There is a nanotube or the like having a display medium in which the contrast, the brightness, the reflectance, the transmittance, and the like change by an electromagnetic action. An example of a display device using an EL element is an EL display. A field emission display (FED) or an SED flat display (SED: surface-conduction electron-emitter) is an example of a display using an electron-emitting device.
Disply). As an example of a display device using a liquid crystal element, a liquid crystal display (a transmissive liquid crystal display, a semi-transmissive liquid crystal display, a reflective liquid crystal display,
There are direct-viewing type liquid crystal displays, projection type liquid crystal displays, and the like. An example of a display device using an electronic ink, an electronic powder fluid, or an electrophoretic element is electronic paper. Note that
In the case of realizing a semi-transmissive liquid crystal display or a reflective liquid crystal display, part or all of the pixel electrode may have a function as a reflective electrode. For example, part or all of the pixel electrode may have aluminum, silver, or the like. Furthermore, in that case, a storage circuit such as an SRAM can be provided under the reflective electrode. This further reduces power consumption.

Note that the light-emitting element 22 described in Embodiment 1 can be used by providing a light-emitting element manufactured in the same step as the light-emitting element 830 described above in the non-display portion.

[Example of material]
Next, materials that can be used for the light emitting panel will be described. In addition, description may be abbreviate | omitted about the structure demonstrated previously in this specification.

For the substrate, materials such as glass, quartz, organic resin, metal, alloy and the like can be used. The substrate on the side from which light from the light emitting element is extracted uses a material having a light transmitting property to the light.

In particular, it is preferable to use a flexible substrate. For example, an organic resin, or a glass, metal, or alloy having a thickness with flexibility can be used.

Because organic resin has a smaller specific gravity than glass, using organic resin as a flexible substrate,
Compared to the case of using glass, the light emitting panel can be reduced in weight, which is preferable.

It is preferable to use a material with high toughness for the substrate. As a result, it is possible to realize a light emitting panel which is excellent in impact resistance and hard to be broken. For example, by using an organic resin substrate or a thin metal substrate or alloy substrate, it is possible to realize a light-emitting panel which is lightweight and is less likely to be damaged as compared to the case of using a glass substrate.

Metal materials and alloy materials are preferable because they have high thermal conductivity and can easily conduct heat to the entire substrate, so that local temperature rise of the light emitting panel can be suppressed. The thickness of the substrate using a metal material or an alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

The material constituting the metal substrate or the alloy substrate is not particularly limited, but for example, a metal such as aluminum, copper, iron, titanium, nickel or an alloy containing one or more metals selected from these metals is used. Can. As an alloy, for example, an aluminum alloy or stainless steel can be suitably used.

In addition, when a material having a high thermal emissivity is used for the substrate, it can be suppressed that the surface temperature of the light emitting panel becomes high, and the destruction of the light emitting panel and the decrease in reliability can be suppressed. For example, the substrate may have a stacked structure of a metal substrate and a layer having a high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

As a material having flexibility and translucency, for example, polyethylene terephthalate (PE
T) Polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyether sulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, Polyamide imide resin, polyvinyl chloride resin, etc. are mentioned. In particular, it is preferable to use a material having a low coefficient of thermal expansion, and for example, a polyamideimide resin, a polyimide resin, PET, etc. can be suitably used. Alternatively, a substrate in which a fibrous body is impregnated with a resin (also referred to as a prepreg), or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used.

As a flexible substrate, a layer using the above material is a hard coat layer (eg, a silicon nitride layer) which protects the surface of the device from scratches and the like, and a layer of a material which can disperse pressure (eg, aramid resin) And the like may be laminated.

The flexible substrate can also be used by stacking a plurality of layers. In particular, when the glass layer is provided, the barrier property to water and oxygen can be improved, and a highly reliable light emitting panel can be obtained.

For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side close to the light-emitting element can be used. The thickness of the glass layer is 20 μm to 200 μm, preferably 25 μm to 100 μm. A glass layer of such a thickness can simultaneously achieve high barrier properties to water and oxygen and flexibility. In addition, the thickness of the organic resin layer is 1
The thickness is 0 μm to 200 μm, preferably 20 μm to 50 μm. By providing such an organic resin layer outside the glass layer, it is possible to suppress cracking and cracking of the glass layer and to improve mechanical strength. By applying such a composite material of a glass material and an organic resin to a substrate, a highly reliable flexible light emitting panel can be obtained.

For the adhesive layer and the sealing layer, various curable adhesives such as an ultraviolet curable photocurable adhesive, a reaction curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. As these adhesives, epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin,
Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin etc. are mentioned. In particular, materials having low moisture permeability such as epoxy resins are preferable. Also, a two-component mixed resin may be used. In addition, an adhesive sheet or the like may be used.

Further, the resin may contain a desiccant. For example, a substance that adsorbs water by chemical adsorption can be used, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide). Alternatively, a substance that adsorbs water by physical adsorption may be used, such as zeolite or silica gel. The inclusion of the desiccant is preferable because it can suppress the entry of impurities such as water into the functional element and the reliability of the light-emitting panel can be improved.

Moreover, the light extraction efficiency from a light emitting element can be improved by mixing the filler and light-scattering member with a high refractive index to the said resin. For example, titanium oxide, barium oxide,
Zeolite, zirconium or the like can be used.

The structure of the transistor included in the light-emitting panel is not particularly limited. For example, a staggered transistor or an inverted staggered transistor may be used. In addition, any top gate type or bottom gate type transistor structure may be employed. The semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, gallium nitride and the like. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In—Ga—Zn-based metal oxide, may be used.

The crystallinity of the semiconductor material used for the transistor is not particularly limited, and an amorphous semiconductor,
Any of a crystalline semiconductor (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a crystal region in part) may be used. The use of a semiconductor having crystallinity is preferable because deterioration of transistor characteristics can be suppressed.

Here, an oxide semiconductor is preferably applied to a semiconductor device such as a pixel, a driver circuit, a transistor used for a touch sensor described later, or the like. In particular, an oxide semiconductor with a larger band gap than silicon is preferably used. It is preferable to use a semiconductor material having a wider band gap and a lower carrier density than silicon because current in the off state of the transistor can be reduced.

For example, the oxide semiconductor preferably contains at least at least indium (In) or zinc (Zn). More preferably, In-M-Zn-based oxides (M is A
An oxide represented by a metal such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) is included.

In particular, the semiconductor layer has a plurality of crystal parts, and in the crystal parts, the c-axis is oriented perpendicularly to the formation surface of the semiconductor layer or the top surface of the semiconductor layer, and grain boundaries between adjacent crystal parts It is preferable to use an oxide semiconductor film which does not have

Such an oxide semiconductor does not have crystal grain boundaries, and therefore, generation of a crack in the oxide semiconductor film due to stress when the display panel is bent is suppressed. Therefore,
Such an oxide semiconductor can be preferably used for a flexible display panel or the like that is used by being curved.

By using such a material as the semiconductor layer, variation in electrical characteristics can be suppressed and a highly reliable transistor can be realized.

In addition, due to the low off current, the charge accumulated in the capacitor through the transistor can be held for a long time. By applying such a transistor to a pixel, it is possible to stop the drive circuit while maintaining the gradation of the image displayed in each display region. As a result, an electronic device with extremely low power consumption can be realized.

In order to stabilize the characteristics of the transistor, a base film is preferably provided. As the base film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a silicon nitride oxide film can be used and manufactured in a single layer or stacked layers. The underlayer is a sputtering method, a CVD (Chemical Vapor Deposition) method (plasma CVD)
Method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc., ALD
It can be formed using an atomic layer deposition (Atomic Layer Deposition) method, a coating method, a printing method, or the like. The undercoating film may not be provided if it is not necessary. In each of the above configuration examples, the insulating layer 813 can also serve as a base film of the transistor.

As a light-emitting element, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in its category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The light emitting element may be any of top emission type, bottom emission type, and dual emission type. A conductive film transmitting visible light is used for the electrode on the side from which light is extracted. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side where light is not extracted.

The conductive film transmitting visible light is, for example, indium oxide, indium tin oxide (ITO:
Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like can be used. In addition, metallic materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metallic materials, or nitrides of these metallic materials (for example, Titanium nitride or the like can also be used as thin as it has translucency. In addition, a stacked film of the above materials can be used as the conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and ITO, or the like because the conductivity can be increased.
Alternatively, graphene or the like may be used.

The conductive film that reflects visible light uses, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy containing these metal materials. Can. In addition, lanthanum, neodymium, germanium, or the like may be added to the above-described metal material or alloy. In addition, alloys of aluminum and titanium, alloys of aluminum and nickel, alloys of aluminum such as alloys of aluminum and neodymium (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper,
It can be formed using an alloy containing silver such as an alloy of silver and magnesium. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of materials of the metal film and the metal oxide film include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light and a film made of a metal material may be stacked. For example, silver and ITO
Or a laminated film of an alloy of silver and magnesium and ITO.

The electrodes may be formed by vapor deposition or sputtering, respectively. In addition, it can be formed using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

When a voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer 833, and the light-emitting substance contained in the EL layer 833 emits light.

The EL layer 833 has at least a light emitting layer. The EL layer 833 is a layer other than the light emitting layer,
Substances with high hole injection property, substances with high hole transport property, hole block materials, substances with high electron transport property, substances with high electron injection property, or substances with bipolar property (electron transport property and hole transport property It may further have a layer containing a high substance or the like.

For the EL layer 833, any of a low molecular weight compound and a high molecular weight compound can be used, and an inorganic compound may be included. The layers constituting the EL layer 833 can be formed by a deposition method (including a vacuum deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like.

In the case of applying a light-emitting element emitting white light as the light-emitting element 830, the EL layer 833 preferably contains two or more kinds of light-emitting substances. For example, white light emission can be obtained by selecting a light emitting substance so that the light emission of each of two or more light emitting substances is in a complementary color relationship. For example, light-emitting substances that emit light such as R (red), G (green), B (blue), Y (yellow), O (orange), etc., or spectral components of two or more of R, G, B It is preferable to contain 2 or more among the light-emitting substances which emit light including. In addition, it is preferable to apply a light emitting element in which a spectrum of light emitted from the light emitting element 830 has two or more peaks in a wavelength range of visible light (for example, 350 nm to 750 nm). Further, the emission spectrum of the material having a peak in the yellow wavelength region is preferably a material having spectral components in the green and red wavelength regions.

More preferably, the EL layer 833 preferably has a stacked structure of a light emitting layer containing a light emitting material emitting light of one color and a light emitting layer containing a light emitting material emitting light of another color. For example, E
The plurality of light emitting layers in the L layer 833 may be stacked in contact with each other, or may be stacked via a separation layer. For example, a separation layer may be provided between the fluorescent light emitting layer and the phosphorescent light emitting layer.

The separation layer can be provided, for example, to prevent energy transfer (in particular, triplet energy transfer) by the Dexter mechanism from the excited state of the phosphorescent material or the like generated in the phosphorescent light emitting layer to the fluorescent material or the like in the fluorescent light emitting layer. The separation layer may have a thickness of about several nm. Specifically, 0.
1 nm to 20 nm, or 1 nm to 10 nm, or 1 nm to 5 nm
It is below. The separation layer includes a single material (preferably a bipolar substance) or a plurality of materials (preferably a hole transporting material and an electron transporting material).

The separation layer may be formed using a material included in a light emitting layer in contact with the separation layer. This facilitates the manufacture of the light emitting element and reduces the driving voltage. For example, when the phosphorescent light emitting layer is formed of a host material, an assist material, and a phosphorescent material (guest material), the separation layer may be formed of the host material and the assist material. In other words, the separation layer has a region not containing a phosphorescent material, and the phosphorescent light emitting layer has a region containing a phosphorescent material. By this,
It becomes possible to deposit the separation layer and the phosphorescent light emitting layer with or without the phosphorescent material. In addition, with such a configuration, the separation layer and the phosphorescent light emitting layer can be formed in the same chamber.
This can reduce the manufacturing cost.

The light emitting element 830 may be a single element having one EL layer, or may be a tandem element in which a plurality of EL layers are stacked via a charge generation layer.

It is preferable that the light emitting element be provided between the pair of low water permeability insulating films. Thus, entry of an impurity such as water into the light emitting element can be suppressed, and a decrease in the reliability of the light emitting device can be suppressed.

Examples of the insulating film having low permeability include a film containing nitrogen and silicon such as a silicon nitride film and a silicon oxynitride film, a film containing nitrogen and aluminum such as an aluminum nitride film, and the like. Also,
A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

For example, the water vapor transmission rate of the low permeability insulating film is 1 × 10 ⁻⁵ [g / m ² · day] or less, preferably 1 × 10 ⁻⁶ [g / m ² · day] or less, more preferably 1 × ^10-7 [
g / m ² · day] or less, more preferably 1 × 10 ^-8 [g / m ² · day] or less.

  It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

As the insulating layer 815, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used, for example. In addition, an insulating layer 817 and an insulating layer 817a,
For the insulating layer 817b, for example, an organic material such as polyimide, acrylic, polyamide, polyimideamide, or benzocyclobutene-based resin can be used. Also,
A low dielectric constant material (low-k material) or the like can be used. Each insulating layer may be formed by stacking a plurality of insulating films.

The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. As resin, a polyimide resin, a polyamide resin, an acrylic resin, a siloxane resin, an epoxy resin, or a phenol resin etc. can be used, for example. In particular, it is preferable to use a photosensitive resin material so that the side wall of the opening becomes an inclined surface formed with continuous curvature.

The method for forming the insulating layer 821 is not particularly limited, and a photolithography method, a sputtering method, an evaporation method, a droplet discharge method (such as an inkjet method), a printing method (such as screen printing or offset printing) may be used.

The spacer 827 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, as the inorganic insulating material and the organic insulating material, various materials which can be used for the insulating layer can be mentioned. As the metal material, titanium, aluminum or the like can be used. By electrically connecting the spacer 827 containing a conductive material to the upper electrode 835, a potential drop due to the resistance of the upper electrode 835 can be suppressed. Also, the spacer 8
27 may be a forward tapered shape or a reverse tapered shape.

The conductive layer used in the light-emitting panel, which functions as an electrode or wiring of a transistor, or an auxiliary electrode of a light-emitting element, includes, for example, metal materials such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, or the like A single layer or a stack can be formed using an alloy material containing the elements of Alternatively, the conductive layer may be formed using a conductive metal oxide. As a conductive metal oxide, indium oxide (In ₂ O ₃ etc.), tin oxide (Sn O ₂ etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I)
It is possible to use n ₂ O ₃ -ZnO or the like or a material obtained by including silicon oxide in these metal oxide materials.

The colored layer is a colored layer that transmits light of a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) that transmits light in the blue wavelength band A color filter or the like can be used. Each colored layer is formed at a desired position by a printing method, an inkjet method, an etching method using a photolithography method, or the like using various materials.

The light shielding layer is provided between the adjacent colored layers. The light shielding layer shields the light from the adjacent light emitting elements, and suppresses color mixing between the adjacent light emitting elements. Here, light leakage can be suppressed by providing the end portion of the colored layer so as to overlap with the light shielding layer. As a light shielding layer,
A material that blocks light emission from the light-emitting element can be used, and for example, the black matrix may be formed using a metal material, a resin material containing a pigment, or a dye. Note that it is preferable to provide the light shielding layer in a region other than the light emitting portion such as the drive circuit portion because an unintended light leakage due to guided light can be suppressed.

Moreover, you may provide overcoat which covers a colored layer and a light shielding layer. By providing the overcoat, diffusion of impurities and the like contained in the colored layer to the light emitting element can be prevented. The overcoat is made of a material that transmits light emitted from the light emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used. A stacked structure of a film and an inorganic insulating film may be used.

When the material of the sealing layer is applied on the colored layer and the light shielding layer, it is preferable to use a material having high wettability to the material of the sealing layer as the material of the overcoat. For example, as the overcoat, it is preferable to use an oxide conductive film such as an ITO film, or a metal film such as an Ag film which is thin enough to have translucency.

As the connection body, a paste-like or sheet-like material obtained by mixing metal particles with a thermosetting resin and exhibiting anisotropic conductivity by thermocompression bonding can be used. As metal particles,
For example, it is preferable to use particles in which two or more types of metals are layered, such as gold particles coated with gold. Alternatively, it is preferable to use a material in which the surface of granular resin is coated with metal.

[Example of production method]
Next, a method of manufacturing a light emitting panel is illustrated using FIGS. 12 and 13. Here, the light emitting panel having the configuration of the specific example 1 (FIG. 11C) will be described as an example.

First, the peeling layer 203 is formed over the manufacturing substrate 201, and the insulating layer 813 is formed over the peeling layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light emitting elements, and an insulating layer 821 are formed over the insulating layer 813. Note that the insulating layer 821, the insulating layer 817, and the insulating layer 815 are opened so that the conductive layer 857 is exposed (FIG. 12A).
).

Further, the peeling layer 207 is formed over the manufacturing substrate 205, and the insulating layer 843 is formed over the peeling layer 207. Next, a light shielding layer 847, a coloring layer 845, and an overcoat 84 are formed over the insulating layer 843.
9 is formed (FIG. 12 (B)).

As the formation substrate 201 and the formation substrate 205, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, or the like can be used, respectively.

For the glass substrate, glass materials such as aluminosilicate glass, aluminoborosilicate glass, barium borosilicate glass and the like can be used, for example. In the case where the temperature of the heat treatment to be performed later is high, one having a strain point of 730 ° C. or higher may be used. In addition, barium oxide (
By containing a large amount of BaO), a more practical heat-resistant glass can be obtained. Besides, crystallized glass can be used.

In the case of using a glass substrate as a formation substrate, when an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film is formed between the formation substrate and the peeling layer, contamination from the glass substrate occurs. Can be prevented.

Each of the peeling layer 203 and the peeling layer 207 is an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, silicon, and the like. It is a layer which consists of an alloy material which contains, or a compound material which contains the element, and which is single layer or laminated. The crystal structure of the layer containing silicon may be amorphous, microcrystalline or polycrystalline.

The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. In addition, the coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

When the release layer has a single-layer structure, it is preferable to form a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum. Alternatively, a layer containing oxide or oxynitride of tungsten, a layer containing oxide or oxynitride of molybdenum, or a layer containing oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that
The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

In the case of forming a stacked structure of a layer containing tungsten and a layer containing an oxide of tungsten as a peeling layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed thereover. Alternatively, a layer containing an oxide of tungsten may be formed at the interface between the tungsten layer and the insulating film. In addition, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, treatment with a highly oxidizing solution such as ozone water, and the like to obtain an oxide of tungsten. You may form the containing layer. Further, plasma treatment or heat treatment may be performed in an atmosphere of oxygen, nitrogen, nitrous oxide alone, or a mixed gas of the gas and another gas. By changing the surface state of the peeling layer by the above plasma treatment or heat treatment, it is possible to control the adhesion between the peeling layer and the insulating film to be formed later.

Each insulating layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, the film formation temperature is 250 ° C. or higher by a plasma CVD method.
By forming it as ° C or less, it is possible to obtain a dense and very low permeable membrane.

After that, a material to be the sealing layer 823 is coated on the surface of the manufacturing substrate 205 provided with the colored layer 845 or the like or the surface of the manufacturing substrate 201 provided with the light emitting element 230 or the like. The production substrate 201 and the production substrate 205 are attached to each other (FIG. 12 (FIG.
C)).

Then, the manufacturing substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are attached to the adhesive layer 81.
Use 1 for bonding. Further, the manufacturing substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 803 are attached to each other using the adhesive layer 841. Although the substrate 803 does not overlap with the conductive layer 857 in FIG. 13A, the conductive layer 857 and the substrate 803 may overlap with each other.

Note that various methods can be used as appropriate in the peeling step. For example, in the case where a layer including a metal oxide film is formed on the side in contact with the layer to be peeled as a peeling layer, the metal oxide film can be weakened by crystallization and the layer to be peeled can be peeled from the formation substrate. Further, in the case where an amorphous silicon film containing hydrogen is formed as a peeling layer between a manufactured substrate having high heat resistance and a peeling layer, the amorphous silicon film is removed by laser light irradiation or etching. The peeled layer can be peeled off from the production substrate. In addition, a layer containing a metal oxide film is formed as the peeling layer on the side in contact with the layer to be peeled, the metal oxide film is weakened by crystallization, and a part of the peeling layer is treated with solution or NF.
_3, BrF _3, after removal by etching using a fluoride gas such as ClF _3, may be peeled off in the metal oxide film which is weakened. Furthermore, a film containing nitrogen, oxygen, hydrogen, or the like (eg, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used as a peeling layer, and laser light is irradiated to the peeling layer. A method may be used in which nitrogen, oxygen or hydrogen contained in the peeling layer is released as a gas to promote peeling between the layer to be peeled and the substrate. Alternatively, a method of mechanically removing the produced substrate on which the layer to be peeled is formed or removing it by etching using a solution or a fluorinated gas such as NF ₃ , BrF ₃ , or ClF ₃ can be used. In this case, the release layer may not be provided.

Moreover, a peeling process can be performed more easily by combining two or more said peeling methods. That is, after the laser beam irradiation, etching of the peeling layer with gas or solution, etc., mechanical removal with a sharp knife or a knife, etc., and the peeling layer and the layer to be peeled are easily peeled off, Peeling can also be performed by force (by a machine or the like).

Alternatively, the separation layer may be separated from the formation substrate by causing a liquid to permeate the interface between the separation layer and the separation layer. Moreover, you may peel, applying liquid, such as water, when peeling.

As another peeling method, when the peeling layer is formed of tungsten, it is preferable to carry out peeling while etching the peeling layer with a mixed solution of ammonia water and hydrogen peroxide water.

Note that when peeling is possible at the interface between the manufacturing substrate and the layer to be peeled, the peeling layer may not be provided. For example, glass is used as a manufacturing substrate, an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass, and an insulating film, a transistor, or the like is formed over the organic resin. In this case, by heating the organic resin,
Peeling can be performed at the interface between the manufacturing substrate and the organic resin. Alternatively, a metal layer may be provided between the formation substrate and the organic resin, a current may be supplied to the metal layer to heat the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin.

Finally, the conductive layer 857 is exposed by opening the insulating layer 843 and the sealing layer 823 (FIG. 13B). Note that in the case where the substrate 803 overlaps with the conductive layer 857, the conductive layer 85
In order to expose 7, the substrate 803 and the adhesive layer 841 are also opened (FIG. 13C). The means of the opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method or the like may be used. Alternatively, the film on the conductive layer 857 may be cut using a sharp blade or the like and a part of the film may be peeled off with physical force.

  Thus, the light emitting panel can be manufactured.

This embodiment can be implemented in appropriate combination with at least a part of the other embodiments described in this specification.

Third Embodiment
In this embodiment, a structural example of a foldable touch panel that can be applied to the display panel included in the electronic device of one embodiment of the present invention will be described with reference to FIGS. Note that Embodiment 2 can be referred to for materials which can be used for each layer.

[Configuration Example 1]
FIG. 14A is a top view of the touch panel. FIG. 14B is a cross-sectional view taken along alternate long and short dash line A-B and along alternate long and short dash line C-D in FIG. FIG. 14C is a cross-sectional view taken along alternate long and short dash line E-F in FIG.

  As shown in FIG. 14A, the touch panel 390 has a display portion 301.

The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. Imaging pixel 308
Can detect a finger touching the display unit 301 or the like. Thus, the touch sensor can be configured using the imaging pixel 308.

The pixel 302 includes a plurality of sub-pixels (eg, sub-pixel 302R), and the sub-pixel includes a light-emitting element and a pixel circuit capable of supplying power for driving the light-emitting element.

The pixel circuit is electrically connected to a wiring which can supply a selection signal and a wiring which can supply an image signal.

The touch panel 390 also includes a scan line driver circuit 303g (1) capable of supplying a selection signal to the pixel 302 and an image signal line driver circuit 303s (1) capable of supplying an image signal to the pixel 302.

  The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

The imaging pixel circuit is electrically connected to a wiring that can supply a control signal and a wiring that can supply a power supply potential.

As the control signal, for example, a signal capable of selecting an imaging pixel circuit from which a recorded imaging signal is read out, a signal capable of initializing the imaging pixel circuit, and a time for detecting light by the imaging pixel circuit And the like can be mentioned.

The touch panel 390 includes an imaging pixel drive circuit 303g (2) that can supply a control signal to the imaging pixel 308, and an imaging signal line drive circuit 303s (2) that reads an imaging signal.

As illustrated in FIG. 14B, the touch panel 390 includes a substrate 510 and a substrate 570 facing the substrate 510.

  A flexible material can be preferably used for the substrate 510 and the substrate 570.

A material in which transmission of unintended impurities is suppressed can be suitably used for the substrate 510 and the substrate 570. For example, the permeability of water vapor is 10 ⁻⁵ g / m ² · day or less, preferably 1
0 ^-6 g ^/ m 2 · day or less is material can be suitably used.

Materials having approximately equal linear expansion coefficients can be suitably used for the substrate 510 and the substrate 570. For example, a material having a linear expansion coefficient of 1 × 10 ⁻³ / K or less, preferably 5 × 10 ⁻⁵ / K or less, more preferably 1 × 10 ⁻⁵ / K or less can be suitably used.

The substrate 510 is a stacked body in which a flexible substrate 510b, an insulating layer 510a which prevents unintended diffusion of impurities into the light emitting element, and an adhesive layer 510c which bonds the flexible substrate 510b and the insulating layer 510a are stacked.

The substrate 570 is a stacked body of a flexible substrate 570b, an insulating layer 570a which prevents diffusion of an unintended impurity into a light emitting element, and an adhesive layer 570c which bonds the flexible substrate 570b and the insulating layer 570a.

For example, materials including polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate or a resin having an acryl, urethane, epoxy or siloxane bond can be used for the adhesive layer.

The sealing layer 560 is attached to the substrate 570 and the substrate 510. The encapsulation layer 560 has a refractive index greater than air. In the case where light is extracted to the sealing layer 560 side, the sealing layer 560 doubles as an optical bonding layer. The pixel circuit and the light emitting element (for example, the first light emitting element 350R)
Between 0 and substrate 570.

The pixel 302 includes a sub pixel 302R, a sub pixel 302G, and a sub pixel 302B (see FIG. 14).
(C)). In addition, the sub pixel 302R includes a light emitting module 380R, the sub pixel 302G includes a light emitting module 380G, and the sub pixel 302B includes a light emitting module 380B.

For example, the sub-pixel 302R includes a pixel circuit including a transistor 302t that can supply power to the first light-emitting element 350R and the first light-emitting element 350R (FIG. 14B).
. The light emitting module 380R also includes a first light emitting element 350R and an optical element (for example, a colored layer 367R).

The light emitting element 350R has a first lower electrode 351R, an upper electrode 352, and an EL layer 353 between the lower electrode 351R and the upper electrode 352 (FIG. 14C).

The EL layer 353 includes a first EL layer 353 a, a second EL layer 353 b, and a first EL layer 3.
An intermediate layer 354 between the 53a and the second EL layer 353b is provided.

The light emitting module 380R includes the first colored layer 367R on the substrate 570. The colored layer may be a layer that transmits light having a specific wavelength, and for example, a layer that selectively transmits light exhibiting red, green or blue can be used. Alternatively, a region may be provided in which light emitted from the light emitting element is transmitted as it is.

For example, the light emitting module 380R includes the first light emitting element 350R and the first colored layer 367R.
And a sealing layer 360 in contact with the

The first colored layer 367R is at a position overlapping with the first light emitting element 350R. Accordingly, part of light emitted from the light emitting element 350R is transmitted through the sealing layer 360 and the first colored layer 367R which also serve as the optical bonding layer, and is emitted to the outside of the light emitting module 380R as shown by the arrows in the figure. Be done.

The touch panel 390 includes a light shielding layer 367BM on the substrate 570. The light shielding layer 367BM is provided to surround the colored layer (for example, the first colored layer 367R).

The touch panel 390 includes the anti-reflection layer 367 p at a position overlapping the display portion 301. For example, a circularly polarizing plate can be used as the antireflective layer 367p.

The touch panel 390 includes an insulating layer 321. The insulating layer 321 is a transistor 302t.
Is covered. Note that the insulating layer 321 can be used as a layer for planarizing unevenness due to the pixel circuit. In addition, an insulating layer in which a layer capable of suppressing diffusion of impurities into the transistor 302t and the like is stacked can be applied to the insulating layer 321.

The touch panel 390 includes a light emitting element (for example, the first light emitting element 350R) over the insulating layer 321.

The touch panel 390 includes the partition 328 overlapping the end of the first lower electrode 351 R as the insulating layer 3.
21 on. In addition, a spacer 329 which controls a distance between the substrate 510 and the substrate 570 is provided over the partition wall 328.

The image signal line driver circuit 303 s (1) includes a transistor 303 t and a capacitor 303 c. Note that the driver circuit can be formed over the same substrate in the same process as the pixel circuit. Figure 14
The transistor 303 t may have a second gate 304 over the insulating layer 321 as illustrated in (B). The second gate 304 may be electrically connected to the gate of the transistor 303t, or may have different potentials. In addition, the second gate 304 may be provided for the transistor 308 t, the transistor 302 t, and the like if necessary.

The imaging pixel 308 includes an imaging pixel circuit for detecting light emitted to the photoelectric conversion element 308 p and the photoelectric conversion element 308 p. The imaging pixel circuit also includes a transistor 308t.

  For example, a pin photodiode can be used for the photoelectric conversion element 308p.

The touch panel 390 includes a wiring 311 which can supply a signal, and a terminal 319 is provided in the wiring 311. Note that an FPC 309 (1) which can supply signals such as an image signal and a synchronization signal is electrically connected to the terminal 319. Note that FPC 309 (
A printed wiring board (PWB) may be attached to 1).

The transistors formed in the same step are the transistor 302t and the transistor 303.
The present invention can be applied to transistors such as the transistor t and the transistor 308t. Embodiment 2 can be referred to for the structure of the transistor.

In addition to the gate, source, and drain of the transistor, materials which can be used for various wirings and electrodes of the touch panel include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or A single metal consisting of tungsten or an alloy containing this as a main component is used as a single layer structure or a laminated structure. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure in which an aluminum film is stacked on a titanium film, a two-layer structure in which an aluminum film is stacked on a tungsten film, a copper film on a copper-magnesium-aluminum alloy film Two-layer structure to be laminated, Two-layer structure in which a copper film is laminated on a titanium film, Two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or titanium nitride film, and the titanium film or titanium nitride film A three-layer structure in which an aluminum film or a copper film is laminated and a titanium film or a titanium nitride film is further formed thereon, a molybdenum film or a molybdenum nitride film, and the molybdenum film or the molybdenum nitride film Stack the membrane,
Furthermore, there is a three-layer structure or the like on which a molybdenum film or a molybdenum nitride film is formed. Note that
A transparent conductive material containing indium oxide, tin oxide or zinc oxide may be used. Further, it is preferable to use copper containing manganese because controllability of the shape by etching is enhanced.

Note that the light-emitting element 22 illustrated in Embodiment 1 can be used by providing a light-emitting element manufactured in the same step as the light-emitting element (for example, the first light-emitting element 350R or the like) described above in a non-display portion. In addition, by providing an imaging pixel manufactured in the same process as the imaging pixel 308 including the above-described photoelectric conversion element 308p and imaging pixel circuit in a non-display portion, it can be used as the light receiving element 21 illustrated in the first embodiment.

[Configuration Example 2]
FIGS. 15A and 15B are perspective views of the touch panel 505. FIG. Note that representative components are shown for clarity. FIG. 16 is a cross-sectional view taken along dashed-dotted line X1-X2 shown in FIG.

The touch panel 505 includes the display unit 501 and the touch sensor 595 (FIG. 15B).
. In addition, the touch panel 505 includes a substrate 510, a substrate 570, and a substrate 590. Note that each of the substrate 510, the substrate 570, and the substrate 590 is flexible.

The display portion 501 includes a substrate 510, a plurality of pixels over the substrate 510, and a plurality of wirings 511 which can supply signals to the pixels. The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and a part of the plurality of wirings 511 constitutes a terminal 519. The terminal 519 is an FPC 509 (one.
Electrically connect with

The substrate 590 is provided with a touch sensor 595 and a plurality of wirings 598 electrically connected to the touch sensor 595. A plurality of wires 598 are routed around the periphery of the substrate 590, and a portion of them form a terminal. Then, the terminal is electrically connected to the FPC 509 (2). Note that in FIG. 15B, electrodes, wirings, and the like of the touch sensor 595 provided on the back surface side (the rear side in the drawing) of the substrate 590 are indicated by solid lines for the sake of clarity.

As the touch sensor 595, for example, a capacitive touch sensor can be applied. As a capacitance method, there are a surface type capacitance method, a projection type capacitance method, and the like.

As the projected capacitive type, there are a self-capacitive type, a mutual capacitive type and the like mainly due to the difference in drive type. It is preferable to use the mutual capacitance method because simultaneous multipoint detection becomes possible.

In the following, the case of applying a projected capacitive touch sensor will be described with reference to FIG.
This will be described using

Note that various sensors capable of detecting proximity or touch of a detection target such as a finger can be applied.

The projected capacitive touch sensor 595 includes an electrode 591 and an electrode 592. The electrode 591 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is connected to the plurality of wirings 598.
Connect electrically with one of the other.

As shown in FIGS. 15A and 15B, the electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at corner portions.

The electrodes 591 are quadrilateral and are repeatedly arranged in the direction intersecting with the direction in which the electrodes 592 extend.

The wiring 594 electrically connects two electrodes 591 sandwiching the electrode 592. At this time, it is preferable that the area of the intersection of the electrode 592 and the wiring 594 be as small as possible. Thereby, the area of the area | region in which the electrode is not provided can be reduced, and the nonuniformity of the transmittance | permeability can be reduced. As a result, luminance unevenness of light transmitted through the touch sensor 595 can be reduced.

Note that the shapes of the electrode 591 and the electrode 592 are not limited to this, and can take various shapes. For example, the plurality of electrodes 591 are disposed so as not to generate a gap as much as possible, and the electrode 5 is disposed via the insulating layer.
A plurality of the electrodes 92 may be provided so as to be separated from each other so as to form a region which does not overlap with the electrode 591. At this time, it is preferable to provide a dummy electrode electrically isolated from two adjacent electrodes 592 because the area of the region having different transmittance can be reduced.

The touch sensor 595 includes a substrate 590, electrodes 591 and 592 disposed in a staggered manner on the substrate 590, an insulating layer 593 covering the electrodes 591 and 592, and adjacent electrodes 591.
Are electrically connected to each other.

The adhesive layer 597 attaches the substrate 590 to the substrate 570 such that the touch sensor 595 overlaps with the display portion 501.

The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. As the light-transmitting conductive material, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide to which gallium is added can be used. Note that a film containing graphene can also be used. The film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed into a film shape. As a method of reduction, a method of applying heat and the like can be mentioned.

After a conductive material having a light transmitting property is formed on a substrate 590 by sputtering, unnecessary portions are removed by various patterning techniques such as photolithography, and the electrode 59 is formed.
1 and an electrode 592 can be formed.

Further, as a material used for the insulating layer 593, for example, a resin such as acrylic or epoxy,
In addition to the resin having a siloxane bond, an inorganic insulating material such as silicon oxide, silicon oxynitride, or aluminum oxide can also be used.

In addition, an opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrode 591. A light-transmitting conductive material can preferably be used for the wiring 594 because the aperture ratio of the touch panel can be increased. In addition, the electrode 591 and the electrode 59
A material higher in conductivity than 2 can be suitably used for the wiring 594 because the electric resistance can be reduced.

One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in a stripe shape.

  The wire 594 is provided to cross the electrode 592.

A pair of electrodes 591 is provided to sandwich one of the electrodes 592, and the wiring 594 is a pair of electrodes 591.
Are connected electrically.

Note that the plurality of electrodes 591 does not have to be disposed in the direction orthogonal to the one electrode 592 and may be disposed to form an angle of less than 90 degrees.

One wiring 598 is electrically connected to the electrode 591 or the electrode 592. A part of the wiring 598 functions as a terminal. As the wiring 598, for example, a metal material such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy material containing the metal material can be used. it can.

Note that an insulating layer which covers the insulating layer 593 and the wiring 594 can be provided to protect the touch sensor 595.

  The connection layer 599 electrically connects the wiring 598 and the FPC 509 (2).

As the connection layer 599, various anisotropic conductive films (ACF: Anisotropic)
Conductive film and anisotropic conductive paste (ACP: Anisotro
It is possible to use pic Conductive Paste or the like.

The adhesive layer 597 has a light transmitting property. For example, a thermosetting resin or an ultraviolet curable resin can be used, and specifically, a resin such as an acrylic resin, a urethane resin, an epoxy resin, or a resin having a siloxane bond can be used.

The display unit 501 includes a plurality of pixels arranged in a matrix. The pixel includes a display element and a pixel circuit which drives the display element.

Although the case where an organic EL element which emits white light is applied to a display element is described in this embodiment mode, the display element is not limited to this.

For example, organic EL elements having different emission colors may be applied to each sub-pixel so that the color of light emitted differs for each sub-pixel.

  The structures similar to those in Structural Example 1 can be applied to the substrate 510, the substrate 570, and the sealing layer 560.

  The pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light emitting module 580R.

The sub-pixel 502R includes a pixel circuit including a transistor 502t capable of supplying power to the first light-emitting element 550R and the first light-emitting element 550R. In addition, the light emitting module 580R includes a first light emitting element 550R and an optical element (for example, a colored layer 567R).

The light emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode.

  The light emitting module 580R includes a first colored layer 567R in the light extraction direction.

In the case where the sealing layer 560 is provided on the light extraction side, the sealing layer 560 is in contact with the first light emitting element 550R and the first colored layer 567R.

The first colored layer 567R overlaps with the first light emitting element 550R. Thus, part of the light emitted from the light emitting element 550R is transmitted through the first colored layer 567R and emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

The display unit 501 has a light shielding layer 567BM in the light emission direction. The light shielding layer 567BM is provided to surround the colored layer (for example, the first colored layer 567R).

The display unit 501 includes an antireflective layer 567p at a position overlapping with the pixel. Antireflection layer 567
As p, for example, a circularly polarizing plate can be used.

The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. Note that the insulating film 521 can be used as a layer for planarizing unevenness due to the pixel circuit. In addition, a stacked film including a layer capable of suppressing diffusion of impurities can be applied to the insulating film 521. Accordingly, it is possible to suppress a decrease in the reliability of the transistor 502t and the like due to the unexpected diffusion of impurities.

The display portion 501 includes a light-emitting element (eg, the first light-emitting element 550R) over the insulating film 521.

The display portion 501 has a partition wall 528 overlapping the end portion of the first lower electrode over the insulating film 521. In addition, a spacer which controls a distance between the substrate 510 and the substrate 570 is provided over the partition wall 528.

The scan line driver circuit 503 g (1) includes a transistor 503 t and a capacitor 503 c. Note that the driver circuit can be formed over the same substrate in the same process as the pixel circuit.

The display portion 501 includes a wiring 511 which can supply a signal, and the terminal 519 is a wiring 5
11 is provided. In addition, F that can supply signals such as an image signal and a synchronization signal
The PC 509 (1) is electrically connected to the terminal 519.

Note that a printed wiring board (PWB) may be attached to the FPC 509 (1).

The display portion 501 includes wirings such as scan lines, signal lines, and power supply lines. The various conductive films described above can be used for the wiring.

Note that various transistors can be applied to the display portion 501. A structure in the case of applying a bottom gate transistor to the display portion 501 is illustrated in FIGS.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

For example, a semiconductor layer containing polycrystalline silicon which is crystallized by treatment such as laser annealing can be applied to the transistor 502 t and the transistor 503 t illustrated in FIG.

In addition, a structure in the case where a top gate transistor is applied to the display portion 501 is shown in FIG.
It is illustrated in (C).

For example, a semiconductor layer including a single crystal silicon film or the like transferred from a polycrystalline silicon or a single crystal silicon substrate or the like is illustrated in FIG.
It can be applied to 03t.

Note that by providing a light-emitting element manufactured in the same step as the light-emitting element (for example, the first light-emitting element 550R or the like) described above in the non-display portion, the light-emitting element 22 illustrated in Embodiment 1 can be used.

[Configuration Example 3]
FIG. 17 is a cross-sectional view of the touch panel 505B. The touch panel 505B described in this embodiment includes a display portion 501 for displaying supplied image information on the side provided with a transistor, and a touch sensor is provided on the substrate 510 side of the display portion. This is different from the touch panel 505 of the configuration example 2. Here, different configurations will be described in detail, and portions that can use the same configurations will use the above description.

The first colored layer 567R overlaps with the first light emitting element 550R. Also, FIG.
The light-emitting element 550R shown in A) emits light to the side where the transistor 502t is provided. Thus, part of the light emitted from the light emitting element 550R is transmitted through the first colored layer 567R and emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

The display unit 501 has a light shielding layer 567BM in the light emission direction. The light shielding layer 567BM is provided to surround the colored layer (for example, the first colored layer 567R).

The touch sensor 595 is provided on the substrate 510 side of the display portion 501 (FIG. 17A).
).

The adhesive layer 597 is between the substrate 510 and the substrate 590, and the display portion 501 and the touch sensor 5 are provided.
Stick 95 together.

Note that various transistors can be applied to the display portion 501. A structure in the case of applying a bottom gate transistor to the display portion 501 is illustrated in FIGS. 17A and 17B.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

For example, a transistor 5 illustrated in FIG. 17B includes a semiconductor layer containing polycrystalline silicon or the like.
The present invention can be applied to 02t and the transistor 503t.

In addition, a structure in the case where a top gate transistor is applied to the display portion 501 is shown in FIG.
It is illustrated in (C).

For example, a semiconductor layer including polycrystalline silicon or a transferred single crystal silicon film or the like can be formed as shown in FIG.
The present invention can be applied to the transistor 502 t and the transistor 503 t illustrated in FIG.

Note that by providing a light-emitting element manufactured in the same step as the light-emitting element (for example, the first light-emitting element 550R or the like) described above in the non-display portion, the light-emitting element 22 illustrated in Embodiment 1 can be used.

This embodiment can be implemented in appropriate combination with at least a part of the other embodiments described in this specification.

Embodiment 4
In this embodiment, an example of a driving method of a touch panel which can be applied to a display panel included in the electronic device of one embodiment of the present invention will be described with reference to the drawings.

[Example of detection method of sensor]
FIG. 18A is a block diagram showing the configuration of a mutual capacitive touch sensor. Figure 18
(A) shows a pulse voltage output circuit 601 and a current detection circuit 602. Note that FIG.
In (A), an electrode 621 to which a pulse voltage is applied and an electrode 622 which detects a change in current are respectively shown as six wirings X1 to X6 and Y1 to Y6. Also, FIG.
A) illustrates a capacitor 603 formed by overlapping the electrode 121 and the electrode 122. The functions of the electrode 121 and the electrode 122 may be replaced with each other.

The pulse voltage output circuit 601 is a circuit for applying a pulse to the X1-X6 wires in order. An electrode 1 forming a capacitor 603 by applying a pulse voltage to the wiring of X1-X6
An electric field is generated at 21 and the electrode 122. The electric field generated between the electrodes is
A change in the mutual volume of 3 can be used to detect the proximity or touch of the object to be detected.

The current detection circuit 602 is a circuit for detecting a change in current in the wirings Y1 to Y6 due to a change in mutual capacitance in the capacitor 603. In the wiring of Y1-Y6, there is no change in the detected current value if there is no proximity or contact of the detection object, but if the mutual capacitance decreases due to the proximity or contact of the detection object to be detected, the current value Detect changes that decrease. Note that current detection may be performed using an integration circuit or the like.

Next, FIG. 18B shows a timing chart of input and output waveforms in the mutual capacitive touch sensor shown in FIG. 18A. In FIG. 18B, it is assumed that detection of the detection target in each matrix is performed in one frame period. Further, in FIG. 18B, the case where the detection subject is not detected (
Two cases are shown: non-touch) and the case of detecting an object (touch). In addition, about the wiring of Y1-Y6, the waveform made into the voltage value corresponding to the detected current value is shown.

Pulse voltages are sequentially applied to the wirings of X1-X6, and in accordance with the pulse voltages, Y1-
The waveform at the wiring of Y6 changes. If there is no proximity or contact of the detection target, X1-X6
The waveform of Y1-Y6 changes uniformly according to the change of the voltage of the wiring. On the other hand, when the object to be detected approaches or contacts, the current value decreases, so the waveform of the corresponding voltage value also changes.

Thus, by detecting the change in mutual volume, the proximity or contact of the detection target can be detected.

18A shows the configuration of a passive touch sensor in which only the capacitor 603 is provided at the intersection of wirings as a touch sensor, an active touch sensor including a transistor and a capacitor may be used. FIG. 19 shows an example of one sensor circuit included in the active touch sensor.

The sensor circuit includes a capacitor 603, a transistor 611, a transistor 612, and a transistor 613. In the transistor 613, the signal G2 is supplied to the gate, the voltage VRES is supplied to one of the source and the drain, and the other is electrically connected to one electrode of the capacitor 603 and the gate of the transistor 611. In the transistor 611, one of the source and the drain is electrically connected to one of the source and the drain of the transistor 612, and the voltage V
SS will be given. In the transistor 612, the signal G2 is applied to the gate, and the other of the source and the drain is electrically connected to the wiring ML. The voltage VSS is applied to the other electrode of the capacitor 603.

Subsequently, the operation of the sensor circuit will be described. First, the transistor 613 is used as the signal G2.
The potential corresponding to the voltage VRES is applied to the node n to which the gate of the transistor 611 is connected. Then, a potential for turning off the transistor 613 is given as the signal G2, whereby the potential of the node n is held.

Subsequently, the potential of the node n changes from VRES as the mutual capacitance of the capacitors 603 changes due to the proximity or contact of a detection object such as a finger.

The reading operation gives the signal G 1 a potential which turns on the transistor 612. The current flowing to the transistor 611, that is, the current flowing to the wiring ML, changes in accordance with the potential of the node n. By detecting this current, it is possible to detect the proximity or contact of the object to be detected.

As each of the transistors 611, 612, and 613, a transistor in which an oxide semiconductor is applied to a semiconductor layer in which a channel is formed is preferably used. In particular, by applying such a transistor to the transistor 613, the potential of the node n can be held for a long time, and the operation of resupplying VRES to the node n (
The frequency of the refresh operation can be reduced.

This embodiment can be implemented in appropriate combination with at least a part of the other embodiments described in this specification.

DESCRIPTION OF SYMBOLS 10 electronic device 11a support 11b support 11c support 11d support 11e support 12 connection part 12a neutral line 13 display panel 13_1 display panel 13_2 display panel 13a display part 13b non-display part 14 detection means 15 FPC
Reference Signs List 16 circuit board 17 battery 18 wiring 21 light receiving element 22 light emitting element 23 light 24 area 25 area 31 area 32 area 33 area 41 area 41 input button 42 power button 43 external connection terminal 44 card slot 45 optical sensor 46 camera 47 light source 48 speaker 49 microphone 51 Antenna 121 Electrode 122 Electrode 201 Manufacturing substrate 203 Peeling layer 205 Manufacturing substrate 207 Peeling layer 230 Light emitting element 301 Display area 302 Pixel 302B Sub-pixel 302G Sub-pixel 302R Sub-pixel 302 t Transistor 303 c Capacitance 303 g (1) Scanning line driving circuit 303 g (2) Imaging pixel drive circuit 303s (1) Image signal line drive circuit 303s (2) Imaging signal line drive circuit 303t Transistor 304 Gate 308 Imaging pixel 308p Photoelectric conversion element 308t Transistor 309 FPC
311 wiring 319 terminal 321 insulating layer 328 partition 329 spacer 350R light emitting element 351R lower electrode 352 upper electrode 353 EL layer 353a EL layer 353b EL layer 354 intermediate layer 360 sealing layer 367BM light shielding layer 367p antireflective layer 367R colored layer 380B light emitting module 380G Light emitting module 380R Light emitting module 390 Touch panel 501 Display portion 502R Sub pixel 502t Transistor 503c Capacitance 503g Scanning line drive circuit 503t Transistor 505 Touch panel 505B Touch panel 509 FPC
510 substrate 510a insulating layer 510b flexible substrate 510c adhesive layer 511 wiring 519 terminal 521 insulating film 528 partition wall 550R light emitting element 560 sealing layer 567BM light shielding layer 567p antireflective layer 567R colored layer 570 substrate 570a insulating layer 570b flexible substrate 570c Bonding layer 580R Light emitting module 590 Substrate 591 Electrode 592 Electrode 593 Insulating layer 594 Wiring sensor 597 Bonding layer 598 Wiring layer 599 Connection layer 601 Pulse voltage output circuit 602 Current detection circuit 603 Capacitance 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 Substrate 803 substrate 804 light emitting unit 806 drive circuit unit 808 FPC
811 adhesive layer 813 insulating layer 814 conductive layer 815 insulating layer 816 conductive layer 817 insulating layer 817a insulating layer 817b insulating layer 820 transistor 821 insulating layer 822 transistor 823 sealing layer 824 sealing layer 825 connecting member 827 spacer 830 light emitting element 831 lower electrode 833 EL layer 835 upper electrode 841 adhesive layer 843 insulating layer 845 coloring layer 847 light shielding layer 849 overcoat 857 conductive layer 857 a conductive layer 857 b conductive layer

Claims (1)

A first support, a second support, a connection portion, a flexible display panel, and detection means;
The first support and the second support are connected by the connection portion,
The display panel has a portion fixed to the first support;
The display panel has a portion that is supported without being fixed to the second support so that it can move in one direction with respect to the second support.
The detection means includes a plurality of light receiving elements and a light emitting element,
The plurality of light receiving elements are provided on the second support,
The light emitting element is provided on the display panel facing the plurality of light receiving elements.
The detection means detects a relative position between the display panel and the second support, which changes when the display panel is bent by detecting light emission from the light emitting elements by each of the plurality of light receiving elements. Have the ability to detect
It has a function capable of controlling the display of the display panel based on the detection result of the detection means.
Electronics.

Images