JP2019067002A - Non-contact type ic card and method of manufacturing circuit board - Google Patents

Abstract

To provide a light shield rate such that when a reading machine reads a card with an infrared sensor, the card can be securely detected.SOLUTION: The present invention relates to a non-contact IC card 10 which is in a substantially rectangular shape and has a circuit board 7 as an inner layer, the circuit board 7 having an insulation substrate 1, an IC chip 4 mounted on an upper surface of the insulation substrate 1, an antenna circuit 2 connected to the IC chip 4 mounted on the upper surface of the insulation substrate 1, and a dummy circuit 3 independent of the antenna circuit 2 formed on the upper surface of the insulation substrate 1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a noncontact IC card which transmits and receives information etc. contactlessly by an information reader / writer (hereinafter abbreviated as a reader) and a method of manufacturing a circuit board used in the noncontact IC card.

  In recent years, contactless IC cards have been introduced in a wide range of industries such as cash cards (bank cards), credit cards, employee ID cards, prepaid cards used for transportation and amusement services such as trains and buses, and life is familiar. It has begun to be used in various fields from business to business. Furthermore, it has begun to be widely used in highly secure fields such as basic resident register cards and driver's licenses used for services of public organizations (for non-contact type IC cards, see, for example, Patent Documents 1 and 2). .

  Therefore, various IC chips different in communication protocol, security function, memory capacity, etc. are put on the market as IC chips mounted on the noncontact IC card. On the other hand, it is desirable that manufacturers of noncontact IC cards can provide many types of noncontact IC cards on which the IC chip is mounted with low cost and short delivery time.

  In order to recognize the noncontact IC card on which the above IC chip is mounted by the reader in the IC card system, in addition to the IC chip, a sensor incorporated in the reader for each of various noncontact IC cards is used. It is necessary to have a corresponding light blocking function. The reason for this is that IC card systems in the market include a sensor that recognizes the presence of a card in a reader (including the transport unit), and the sensor detects the light shielding property of the card to After recognizing the presence, communication between the chip mounted on the card and the reader is started (for the sensor of the reader, see, for example, Patent Documents 3 and 4).

Japanese Patent Application Laid-Open No. 10-105669 Japanese Patent Laid-Open No. 2000-311225 JP-A-8-55258 Unexamined-Japanese-Patent No. 2002-109483

  Here, in order to detect the light shielding property (shielding property) of the non-contact type IC card, a material in which a component of a shielding material is added to a card skin material has been developed in the past, but productivity is bad and cost increases. There were economic issues that led to it. In conventional non-contact IC cards, in order to improve the light shielding performance (optical density) to the specified light shielding rate, many materials such as titanium oxide compounded in polymer have been developed in the past. However, when the blending amount of titanium oxide or the like is increased, mechanical properties are deteriorated due to variations in production of the skin material alone, which may lead to a decrease in yield.

  In addition, as a provisional measure for light shielding property, it is specified by measuring and selecting the light shielding rate with IC (white) card before surface printing, judging the IC card printing front pattern (dark and light), and printing the entire surface gray on the card printing back. It has been confirmed that it is possible to secure the light blocking rate of the above, but the work and management man-hours become large, and the productivity is not good.

  Also, in the conventional noncontact IC card, the light shielding property can not be ensured only with the skin material due to the tendency of thinning the card thickness, and from the position of the card end to the antenna pattern portion of the inner layer circuit board Since there is no shielded area, the card can not be recognized when the card is inserted into the reader, and a recognition error occurs in the IC card system, and the card may be clogged in the transport unit in the reader and the card can not be used. .

  The present invention is proposed in view of the above-mentioned situation, and secures productivity to suppress economical cost and secures light shielding performance to enable reliable recognition of a noncontact IC card. It is an object of the present invention to provide a method of manufacturing a noncontact IC card and a circuit board used in the noncontact IC card.

  In order to solve the problems described above, a noncontact IC card according to the present application is a noncontact IC card having a substantially rectangular shape and including a circuit board in an inner layer, the circuit board being an insulating substrate, The IC chip mounted on the upper surface of the insulating substrate, the antenna circuit connected to the IC chip formed on the upper surface of the insulating substrate, and the dummy circuit independent of the antenna circuit formed on the upper surface of the insulating substrate .

  In the circuit board, the dummy circuit may be formed on a line parallel to a long side having a predetermined distance from the long side of the noncontact IC card. In the circuit board, the dummy circuit may be formed at a position close to one corner of the noncontact IC card and at positions of line symmetry and point symmetry of the substantially rectangular shape of the noncontact IC card.

  In the method of manufacturing a circuit board used for the noncontact IC card according to the present application, the dummy circuit is processed by the same etching method as the antenna circuit on the circuit board used for the noncontact IC card.

  According to the present invention, when the noncontact IC card is inserted into the reader, regardless of the insertion direction of the IC card, the dummy circuit cuts off the irradiation light from the infrared sensor to ensure the noncontact IC card. It enables detection. Further, by processing the dummy circuit by the same etching method as the antenna circuit, it is possible to reduce the burden of manufacturing without increasing the number of steps for forming the dummy circuit.

It is a top view which shows schematic structure of the circuit board of the noncontact IC card of this Embodiment. It is sectional drawing of the non-contact-type IC card of this Embodiment. It is the top view which drew the locus | trajectory of the irradiation light of the infrared sensor of the reader on the upper surface of the noncontact IC card. It is a top view of the circuit board of the noncontact IC card of a 1st embodiment. It is a principal part enlarged top view which shows the dummy circuit of the circuit board of the noncontact IC card of 1st Embodiment.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the positional relationship between the layer configuration and the circuit board, the ratio of the thickness of each layer, and the like are different from the actual ones.

  Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is needless to say that parts having different dimensional relationships and proportions are included among the drawings. Further, the technical idea of the present invention does not specify the materials, shapes, structures, arrangements and the like of the components to the following. Various modifications may be made within the scope of the claims.

FIG. 1 is a top view for schematically explaining the arrangement of the circuit area on the circuit board of the noncontact IC card of the present embodiment. FIG. 2 is a cross-sectional view when the circuit board of the noncontact IC card according to the present embodiment is disposed at the center in the card thickness direction.

  As shown in FIG. 1 and FIG. 2, the noncontact IC card 10 of the present embodiment has a substantially rectangular plate shape, and has the insulating substrate 1. The insulating substrate 1 is not particularly limited as long as it has an insulating property and can be a base material capable of forming a circuit, but, for example, PET (polyethyne terephthalate), PEN (polyethylene naphthalate), polyimide A film substrate such as can be used. The insulating substrate 1 has a substantially rectangular plate shape corresponding to the noncontact IC card 10 having a substantially rectangular shape.

  An IC chip 4 is mounted on the upper surface of the insulating substrate 1, and an antenna circuit 2 connected to the IC chip 4 is formed along the outer periphery of the insulating substrate 1. In FIG. 1, a region (antenna circuit region) in which the antenna circuit 2 is disposed is schematically shown. For the antenna circuit 2, a metal thin film such as copper or aluminum or a conductive paint such as silver paste is used.

  Further, on the upper surface of the insulating substrate 1, a dummy circuit 3 electrically separated from the antenna circuit 2 is formed independently of the antenna circuit 2. In FIG. 1, an area (dummy circuit area) in which the dummy circuit 3 can be arranged is schematically shown. The dummy circuit 3 can be formed by a method such as etching with copper or aluminum or a conductive paste. In the present embodiment, the arrangement of dummy circuit 3 can take various aspects.

  Hereinafter, the insulating substrate 1, the IC chip 4, the antenna circuit 2 and the dummy circuit 3 integrally formed with the insulating substrate 1 will be collectively referred to as a circuit substrate 7. Similar to the insulating substrate 1, the circuit substrate 7 has a substantially rectangular plate shape corresponding to the noncontact IC card 10.

In FIG. 1, various aspects of the arrangement of the dummy circuit 3 are collectively shown for convenience. As a first example of the arrangement of the dummy circuit 3, the dummy circuit 3 includes one of the first dummy circuit 3 ₁ , the second dummy circuit 3 ₂ , the third dummy circuit 3 ₃ and the fourth dummy circuit 3 ₄ . It may be composed of a set. Region dummy circuit 3 of the first embodiment is disposed (dummy circuit region), the first dummy circuit 3 ₁ located near one corner of the substantially rectangular non-contact IC card 10, the a second dummy circuit 3, _second and third dummy circuit 3 ₃ 1 dummy circuit 3 ₁ is disposed at a position of the arrangement position axisymmetrical, fourth dummy circuit disposed in a position of point symmetry It consists of three and _four .

First dummy circuit _{3 1,} second dummy circuit _{3 2,} third dummy circuit _{3, third} and fourth dummy circuit _{3 4} is arranged near the noncontact IC10 corners. First dummy circuit 3 _1, second dummy circuit 3 _2, third dummy circuit 3, _third and fourth dummy circuit 3 _4, the extension of the pattern of the antenna circuit 2 and extending along the long side of the circuit board 7 You may arrange so that it may be on a line. Also in the first embodiment, the first dummy circuit _{3 1,} second dummy circuit _{3 2,} third dummy circuit _{3, third} and fourth dummy circuit _{3 4} of the non-contact IC card 10 of a substantially rectangular shape Along the long side, and is disposed on a line parallel to the long side having a predetermined distance from the long side.

As a second example of the arrangement of the dummy circuit 3, the dummy circuit 3 may be constituted of a pair of the fifth dummy circuit ₃₅ and the sixth dummy circuit 3 _6. The area (dummy circuit area) in which the dummy circuit 3 of the second example is arranged is a length between the outside and the long side of the antenna circuit 2 along the long side of the substantially rectangular noncontact IC card 10. It is formed on a line parallel to a long side having a predetermined distance from the side.

As a third example of the arrangement of the dummy circuit 3, the dummy circuit 3 may be constituted of a pair of the seventh dummy circuit 3 _seventh and eighth dummy circuit 3 _8. The area (dummy circuit area) in which the dummy circuit 3 of the third example is arranged is a predetermined distance from the long side inside the antenna circuit 2 along the long side of the substantially rectangular noncontact IC card 10. It is formed to be on a line parallel to the long side having.

As a fourth example of the arrangement of the dummy circuit 3, the dummy circuit 3, ninth dummy circuit _{3 9,} one tenth dummy circuit _{3 10,} 11 dummy circuit _{3 11} and 12 dummy circuit _{3 12} of It may be composed of a set. The area (dummy circuit area) in which the dummy circuit 3 of the fourth example is arranged is the first dummy circuit of the first example arranged near one corner of the substantially rectangular noncontact IC card 10 3 ₁ a ninth dummy circuit 3 ₉ disposed slightly away from the long side as a reference, the tenth dummy of the ninth dummy circuit 3 ₉ is arranged at a position of the arrangement position axisymmetrical a dummy circuit _{3 11} of the circuit _{3 10} and 11, and a twelfth dummy circuit _{3 12.} in which is arranged at the position of point symmetry. In the fourth example, the ninth dummy circuit _{3 9,} 10 dummy circuit _{3 10,} 11 dummy circuit _{3 11} and 12 dummy circuit _{3 12} of the non-contact IC card 10 of a substantially rectangular shape Along the long side, and is disposed on a line parallel to the long side having a predetermined distance from the long side.

  On the top surface of the circuit board 7, a plurality of protective layers 8 made of a PET-G substrate are formed via an adhesive sheet 9. Also on the lower surface of the circuit board 7, a plurality of protective layers 8 made of a PET-G substrate are formed via the adhesive sheet 9. The non-contact IC card 10 of the present embodiment is configured by the circuit board 7, the adhesive sheet 9 and the protective layer 8.

  FIG. 3 is a top view showing a locus drawn by the irradiation light of the infrared sensor of the reader on the upper surface of the noncontact IC card 10. As shown in FIG. In a reader (not shown), the infrared light emitted by the infrared sensor is separated by a distance L1 from one of the long sides of the noncontact IC card 10, and draws a locus of a first straight line 21 parallel to the long sides. Further, a locus of a second straight line 22 parallel to the long side is drawn apart from the other of the long sides of the noncontact IC card 10 by the distance L2. Usually, the distance L1 and the distance L2 are the same. The illumination light of the infrared sensor may be both the first straight line 21 and the second straight line 22, but may be only one of them.

  In the present embodiment, as in the first to fourth examples of the arrangement of the dummy circuits 3 described above, each dummy circuit 3 is arranged along the long side of the substantially rectangular noncontact IC card 10 from the long side It is arranged on a line parallel to a long side having a predetermined distance. Therefore, by arranging each dummy circuit 3 on the line of the locus of the first straight line 21 and the second straight line 22 drawn by the irradiation light of the infrared sensor of the reader, the irradiation light of the infrared sensor can be blocked surely. .

  As described above, the noncontact IC card 10 of the present embodiment is defined regardless of the card insertion direction by arranging the dummy circuit 3 on the circuit board 7 at a portion corresponding to the position of the infrared sensor of the reader. It is possible to secure the shielding property more than the light shielding rate of Therefore, the noncontact IC card 10 can be scanned by the infrared sensor of the reader and detected by the infrared sensor to obtain an optimal light blocking ratio for the IC card system to recognize the card. Can be provided.

  FIG. 4 is a top view showing the circuit board of the noncontact IC card according to the first embodiment. FIG. 5 is an enlarged top view showing a dummy circuit area of the circuit board of the noncontact IC card of the first embodiment, and FIGS. 5A to 5D are noncontact ICs. An arrangement of dummy circuits 3 formed near four corners of the card 10 is shown. In the first embodiment, the first example of the arrangement of the dummy circuit 3 described with reference to FIG. 1 is applied.

  As shown in FIGS. 4 and 5, on the circuit board 7 used in the noncontact IC card 10 of the first embodiment, the IC chip 4 is connected to the upper surface of the insulating substrate 1 on which the IC chip 4 is mounted. The antenna circuit 2 is formed, and the dummy circuit 3 not connected to the antenna circuit 2 is formed independently of the antenna circuit 2. The dummy circuits 3 are disposed on the extension of the pattern of the antenna circuit 2 extending along the long side of the circuit board 7 and near the four corners.

  As in the case of the noncontact IC card 10 of the first embodiment, when the antenna circuit 2 spirals, a jumper wire 6 is required to bridge a part of the antenna circuit 2 in order to form a closed circuit. It becomes. As a wiring method of the jumper wire 6, a method of forming the through hole 5 in the circuit board 7 and forming the jumper wire 6 on the lower surface of the circuit board 7 is used.

  In the noncontact IC card 10 according to the first embodiment, the circuit board 7 has the through holes 5 on the top surface formed in the outermost periphery of the antenna circuit 2 and a part of the innermost periphery. . The through holes 5 on the upper surface formed in a part of the outermost periphery and the innermost peripheral portion of the antenna circuit 2 use the jumper wires 6 in the through holes 5 on the lower surface arranged at the same position on the lower surface of the circuit board 7 It is connected. In the noncontact IC card of the first embodiment, the through holes 5 and the jumper wires 6 integrally formed on the insulating substrate 1 can also be referred to as a circuit board 7.

  As shown in the enlarged view of the main part of FIG. 5, the dummy circuit 3 of the noncontact IC card 10 of the first embodiment is an independent pattern formed on the extension of the antenna circuit 2 and is noncontact. Parallel to the long side of the formula IC card 10, it is formed at a position near the four corners at a position inside from the end face of the card so as to align with the sensor position of the reader.

  In the noncontact IC card 10 according to the first embodiment, since the circuit board 7 forms the line symmetrical or point symmetrical dummy circuit 3 at positions near the four corners other than the antenna circuit 2, the card insertion (4 Direction) In any case, the dummy circuit 3 is disposed in the card insertion portion, and an optimal light blocking ratio as an IC card light blocking property can be obtained.

  Next, a method of manufacturing the noncontact IC card according to the first embodiment will be described. Referring to the sectional view of FIG. 2, an aluminum foil of 9 μm in thickness is adhered to one side of a transparent PET of 50 μm in thickness serving as the insulating substrate 1, and the antenna circuit 2 is spirally wound by etching. Formed three. Terminal portions at both ends of the antenna circuit 2 have a terminal shape on which the IC chip 4 of an IC chip “SL2ICS 20” (trade name) manufactured by NXP Corporation can be mounted. Here, since the antenna circuit 2 and the dummy circuit 3 are simultaneously formed by the same etching method, the burden on the manufacturing process can be reduced without increasing the number of steps.

  A through hole 5 is provided in a part of the outermost periphery and the innermost periphery of the antenna circuit 2 and thereafter, a jumper wire 6 is formed by a silver paste conductive paint on the lower surface of the insulating substrate 1 by a printing method. It was conducted. Next, in order to mount the IC chip 4, potting an anisotropic conductive adhesive on the tip of the terminal corresponding to the IC chip 4, and mounting the IC chip 4 thereon and thermocompression bonding Thus, the terminal portion of the antenna circuit 2 and the IC chip 4 were connected.

  By using the circuit board 7 used for the noncontact IC card 10 manufactured according to the layer configuration shown in FIG. 2 as described above, the protective layer 8 and the adhesive sheet 9 made of the PET-G base are respectively formed on the upper and lower sides of the circuit board It laminated | stacked and comprised non-contact-type IC card 10 (size: 85.6x54.0 mm, thickness: 0.76 mm). The non-contact IC card 10 was used to evaluate the light blocking ratio with a measuring device.

  The reference of the light blocking ratio is, as shown in FIG. 3, IC on the first straight line 21 and the second straight line 22 having distances L1 and L2 of 1 to 10 mm from the long side of the IC card and parallel to the long side. It is defined that the infrared ray blocking ratio (Min value) when the infrared sensor built in the reader is detected is a prescribed value: A or more.

The measuring apparatus was constituted by an infrared sensor built-in IC reader (emission peak wavelength: 940 nm, light reception peak wavelength: 880 nm), a control substrate, a constant voltage power supply and a multimeter. With this measurement device, measure the dark current I _D (in the state where the light is blocked by the card) and the photocurrent I _L (in the state where the light is projected without shielding), and the infrared ray blocking ratio is calculated by 1-I _D / I _L did.

  As a result of evaluating the number of samples (N = 22) with the above measuring apparatus, in any of the four directions in which the noncontact IC card 10 is inserted, the light blocking ratio reference value: “A” or more and the process capacity Cp 1.33. It has been confirmed that there is a sufficient margin above. In addition, it has been proved that the information reader / writer can stably operate the card recognition and the communication.

  Although the noncontact IC card 10 has been described in the present embodiment, the present embodiment is not limited to the noncontact IC card 10 and can be applied to a general noncontact IC tag.

DESCRIPTION OF SYMBOLS 1 ... Insulating board 2 ... Antenna circuit 3 ... Dummy circuit 4 ... IC chip 5 ... Through hole 6 ... Jumper wire 7 ... Circuit board 8 ... Protective layer 9 ... Adhesive sheet 10 ... Noncontact-type IC card

Claims (4)

A noncontact IC card having a substantially rectangular shape and including a circuit board in an inner layer, wherein the circuit board is
An insulating substrate,
An IC chip mounted on the upper surface of the insulating substrate;
An antenna circuit connected to the IC chip formed on the upper surface of the insulating substrate;
A noncontact IC card, comprising: a dummy circuit independent of the antenna circuit formed on the upper surface of the insulating substrate.   The noncontact IC card according to claim 1, wherein the dummy circuit is formed on a line parallel to a long side having a predetermined distance from the long side of the noncontact IC card on the circuit board.   In the circuit board, the dummy circuit is formed at a position close to one corner of the noncontact IC card and at positions of line symmetry and point symmetry of the substantially rectangular shape of the noncontact IC card. The noncontact IC card according to claim 1 or 2.   The circuit board used for the noncontact IC card according to any one of claims 1 to 3, wherein the dummy circuit is a circuit board used for a noncontact IC card processed by the same etching method as the antenna circuit. Manufacturing method.

Images