JP2019065177A - Polishing composition, polishing method, and manufacturing method of polishing composition - Google Patents

Abstract

To provide a polishing composition capable of polishing a surface of an alloy, an organic material (resin) or metal oxide at sufficient polishing rate, and providing high quality mirror surface, a polishing method, and a manufacturing method of the polishing composition.SOLUTION: A polishing composition consists of an O/W type (oil in water drop type) emulsion containing an abrasion grain a surfactant containing at least one of polyglyceryl fatty acid ester and polysaccharide type surfactant, a lubricant, an organic solvent and water.SELECTED DRAWING: None

Description

  The present invention relates to a polishing composition, a polishing method, and a method for producing a polishing composition.

Conventionally, mirror finishing and smoothing have been performed by polishing the surface of an organic material such as an alloy or a synthetic resin or metal oxide. However, in the conventional polishing method, it may not be possible to efficiently obtain a high quality mirror surface.
For example, in the case of an alloy, since the main component and the main component are mixed with elements having different hardness, various defects such as protrusions, dents, and scratches may occur on the surface of the alloy after polishing. In addition, there was also a case where haze (haze) occurs on the surface of the alloy. Therefore, it was not easy to mirror finish the alloy to a high degree by polishing (see Patent Documents 1 and 2).

In the case of a resin which is an organic material, the hardness is lower than that of an object to be polished such as an alloy, so when polishing is performed using a conventional polishing composition using colloidal silica as abrasive grains, after polishing In some cases, various defects such as protrusions, dents, scratches, etc. may occur on the surface of the resin (see Patent Document 3). In addition, there was also a case where haze occurred on the surface of the resin.
Furthermore, in order to polish the surface of the metal oxide which is a hard and brittle material to perform mirror finishing and smoothing, a polishing composition containing diamond abrasive is conventionally used, but polishing containing diamond abrasive is used. In addition to being expensive, the composition for use is susceptible to scratching and has a problem that it is difficult to obtain a high quality mirror surface. Moreover, in the conventional polishing composition which used colloidal silica as an abrasive grain, although a scratch did not arise, there existed a case where sufficient polishing speed was not obtained (refer patent document 4, 5).
In addition, some conventional polishing compositions cause separation (phase separation) of various components contained in the polishing composition, and some of them are insufficient in terms of stability.

Japanese Patent Application Laid-Open No. 01-246068 JP-A-11-010492 JP, 2016-065203, A Japanese Patent Application Laid-Open No. 7-179848 JP 2008-44078 A

  Therefore, the present invention solves the problems of the prior art as described above and can polish the surfaces of alloys, organic materials (resins) and metal oxides at a sufficient polishing rate, and obtain high quality mirror surfaces. It is an object of the present invention to provide a polishing composition, a polishing method, and a method for producing a polishing composition that can be used.

  In order to solve the above problems, a polishing composition according to one aspect of the present invention comprises an abrasive, a surfactant containing at least one of a polyglycerin fatty acid ester and a polysaccharide surfactant, a lubricating oil, and an organic solvent. It consists of an emulsion of the O / W type (oil-in-water type) containing water and water.

Moreover, the summary of the polishing method according to another aspect of the present invention is that the object to be polished is polished using the polishing composition according to the above one aspect.
Furthermore, a method for producing a polishing composition according to another aspect of the present invention is a method for producing the polishing composition according to the above one aspect, which comprises an abrasive grain, a surfactant, a lubricating oil, and an organic substance. The gist of the present invention is to have the step of mixing the solvent and water so as to form an O / W emulsion.

  According to the present invention, it is possible to polish the surface of an organic material such as an alloy or a synthetic resin or metal oxide at a sufficient polishing rate, and to obtain a high quality mirror surface.

It is a figure showing the composition of the automatic polish device used in one embodiment of the polish method using the constituent for polish concerning the present invention.

  One embodiment of the present invention will be described in detail. The following embodiment shows an example of the present invention, and the present invention is not limited to the present embodiment. In addition, various modifications or improvements can be added to the following embodiments, and a form in which such modifications or improvements are added can be included in the present invention.

  The polishing composition of the present embodiment is used for polishing an object to be polished containing at least one of an alloy, a resin and a metal oxide, and comprises at least one of an abrasive, a polyglycerin fatty acid ester and a polysaccharide surfactant. It consists of an emulsion of the O / W type containing surfactant, lubricating oil, an organic solvent, and water containing.

Such a polishing composition of the present embodiment can be used for polishing an object to be polished containing at least one of an alloy, a resin and a metal oxide. Then, if the object to be polished is polished using the polishing composition of this embodiment, the surface of the alloy, resin or metal oxide can be polished at a sufficient polishing rate, and a high quality mirror surface can be obtained. It is. It is also possible to enhance the stability of the polishing composition. More specifically, if the object to be polished is polished using the polishing composition of this embodiment, the surface of the object to be polished containing at least one of an alloy, a resin and a metal oxide is polished at a sufficient polishing rate. While being possible, it is possible to improve the smoothness of the surface of the object to be polished and to obtain a high-gloss mirror surface with high gloss, that is, low haze and few defects such as scratches. In addition, since the polishing composition of the present embodiment is an O / W type emulsion, the stability can be enhanced.
The polishing composition of the present embodiment will be described in detail below. In addition, the measurement of the various operation and physical properties demonstrated below was performed on the conditions of room temperature (20 degreeC or more and 25 degrees C or less), and the relative humidity 40% or more and 50% or less unless there is particular notice.

1. 1. About abrading object 1-1 About an alloy The polishing composition of this embodiment can be used for the use which abrades the abrading object containing an alloy. The alloy contains a metal species which is a main component and a metal species which is different from the metal species of the main component. The number of metal species is not particularly limited, and may be two or three or more. Further, the method of producing the alloy is not particularly limited, and for example, casting, forging, or rolling can be used. In addition, said "main component" means the component with most content in an alloy.

  The metal species of the main component among the metal species contained in the alloy is preferably any one selected from the group consisting of aluminum, titanium, magnesium, iron, nickel and copper. The more preferred alloy is that the main metal species is aluminum, titanium, iron, nickel or copper. The alloys are named based on the main metal species. Thus, examples of the alloy include aluminum alloy, titanium alloy, magnesium alloy, iron alloy (for example, stainless steel), nickel alloy, copper alloy and the like.

  The aluminum alloy contains aluminum as a main component, and further contains at least one selected from silicon, iron, copper, manganese, magnesium, zinc, and chromium as a metal species different from the metal species of the main component. The content of the metal species other than aluminum in the aluminum alloy is, for example, 0.1% by mass or more, more specifically 0.1% by mass or more and 10% by mass or less. As an example of the aluminum alloy, alloy numbers 2000 series, 3000 series, 4000 series, 5000 series, 6000 series, 7000 series listed in Japanese Industrial Standard (JIS) H4000: 2006, H4040: 2006, and H4100: 2006, Those in the 8000 range are listed.

  The titanium alloy further contains at least one selected from, for example, aluminum, iron, and vanadium as a metal type that is mainly composed of titanium and is different from the metal species of the main component. The content of metal species other than titanium in the titanium alloy is, for example, 3.5% by mass or more and 30% by mass or less. Examples of titanium alloys include 11 to 23, 50, 60, 61, and 80 of the types described in Japanese Industrial Standard (JIS) H 4600: 2012.

  The magnesium alloy contains magnesium as a main component, and further contains at least one selected from, for example, aluminum, zinc, manganese, zirconium, and a rare earth element as a metal species different from the metal species of the main component. The content of metal species other than magnesium in the magnesium alloy is, for example, 0.3% by mass or more and 10% by mass or less. As an example of a magnesium alloy, AZ10, 31, 61, 63, 80, 81, 91, 92 etc. which are described in Japanese Industrial Standard (JIS) H4201: 2011, H4203: 2011, and H4204: 2011, etc. are mentioned.

  The iron alloy (for example, stainless steel) contains iron as a main component, and further contains at least one selected from, for example, chromium, nickel, molybdenum, and manganese as a metal species different from the metal species of the main component. The content of metal species other than iron in the iron alloy is, for example, 10% by mass or more and 50% by mass or less. As an example of stainless steel, in the symbol of the type described in Japanese Industrial Standard (JIS) G4303: 2005, SUS201, 303, 303Se, 304, 304L, 304NI, 305, 305JI, 309S, 310S, 316, 316L, 321 347, 384, XM7, 303F, 303C, 430, 430F, 434, 410, 416, 420J1, 420J2, 420F, 420C, 631J1 and the like.

  The nickel alloy further contains at least one selected from, for example, iron, chromium, molybdenum, and cobalt as a metal type that is mainly composed of nickel and is different from the metal species of the main component. The content of metal species other than nickel in the nickel alloy is, for example, 20% by mass or more and 75% by mass or less. As an example of the nickel alloy, NCF 600, 601, 625, 750, 800, 800 H, 825, NW 0276, 4400, 6002, 6022, and the like in the alloy numbers described in Japanese Industrial Standard (JIS) H4551: 2000.

  The copper alloy contains copper as a main component, and further contains at least one selected from iron, lead, zinc, and tin as a metal species different from the metal species of the main component. The content of the metal species other than copper in the copper alloy is, for example, 3% by mass or more and 50% by mass or less. As an example of the copper alloy, C2100, 2200, 2300, 2400, 2600, 2680, 2720, 2801, 3560, 3561, 3710, 3713, 4250, and the alloy numbers described in Japanese Industrial Standard (JIS) H3100: 2006. 4430, 4621, 4640, 6140, 6161, 6280, 6301, 7060, 7150, 1401, 2051, 6711, 6712 and the like.

1-2. Resin The polishing composition of the present embodiment can be used for polishing an object to be polished containing a resin that is an organic material. When the object to be polished is a resin, it may be a member (resin member) formed of a resin, or a resin film coated on the surface of a base material. Moreover, the kind of resin is not specifically limited, Either of a thermosetting resin and a thermoplastic resin may be sufficient.

  As an example of a thermosetting resin, an epoxy resin, a polyimide resin, a phenol resin, an amino resin, unsaturated polyester resin etc. are mentioned, for example. In addition, super engineering plastics such as polyphenylsulfone resin (PPSU), polyphenylene sulfide resin (PPS), polyetheretherketone resin (PEEK) and polyamideimide resin (PAI) can be mentioned.

Examples of the thermoplastic resin include, for example, polystyrene resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), (meth) acrylic resin, organic acid vinyl ester resin or derivative thereof, vinyl ether resin, polyvinyl chloride, poly Halogen-containing resin such as vinylidene chloride and polyvinylidene fluoride, olefin resin such as polyethylene and polypropylene, polycarbonate resin, saturated polyester resin such as polyethylene terephthalate and polyethylene naphthalate, polyamide resin, thermoplastic polyurethane resin, polysulfone resin (for example, polyether resin Sulfone, polysulfone), polyphenylene ether resin (eg, polymer of 2,6-xylenol), cellulose derivative (eg, cellulose esters, cellulose carver Over preparative, cellulose ethers), silicone resins (e.g., polydimethylsiloxane, polymethylphenylsiloxane), and the like.
The above resins may be used alone or in combination of two or more.

1-3 Metal Oxide The polishing composition of the present embodiment can be used for polishing a metal oxide-containing object to be polished. The metal oxide is a metal or metalloid oxide or a composite oxide thereof, and for example, an oxide or metalloid or metalloid of one or more metals selected from elements of Groups 3, 4 and 13 of the periodic table These complex oxides are mentioned. Specifically, in addition to silicon oxide (silica), aluminum oxide (alumina), titanium oxide (titania), zirconium oxide (zirconia), gallium oxide, yttrium oxide (yttria), germanium oxide, and complex oxides of these are listed. Be Among these metal oxides, silicon oxide, aluminum oxide (such as corundum), zirconium oxide and yttrium oxide are particularly preferable.

  The metal oxide contained in the object to be polished may be a mixture of a plurality of metal or metalloid oxides, or may be a mixture of a plurality of complex oxides, or a metal or metalloid. It may be a mixture of an oxide and a complex oxide. Further, the metal oxide contained in the object to be polished may be a composite material of metal or metalloid oxide or composite oxide and other kinds of materials (for example, metal, carbon, ceramic).

  Furthermore, the metal oxide contained in the object to be polished may be in the form of a single crystal, a polycrystal, a sintered body (ceramic) or the like. When the metal oxide is in such a form, the object to be polished can be made entirely of the metal oxide. Alternatively, the metal oxide contained in the object to be polished may be in the form of an anodized film formed by anodizing a pure metal or alloy. That is, the metal oxide contained in the object to be polished may be an oxide formed on the surface of a metal, such as a pure metal or an anodic oxide film of an alloy, in which the metal itself is oxidized.

When the metal oxide is in such a form, the object to be polished may be a part of the metal oxide and the other part of the other material. In the case where the metal oxide is an anodized film, the object to be polished is one in which a portion including the surface is made of metal oxide and the other portion is made of a pure metal or an alloy.
Examples of the anodized film include films composed of aluminum oxide, titanium oxide, magnesium oxide, or zirconium oxide.
In addition, thermal spraying (for example, plasma spraying, flame spraying), plating, chemical vapor deposition (CVD), physical vapor deposition (PVD) on the surface of a substrate of a type of material (for example, metal, carbon, ceramic) different from metal oxides The object to be polished may be configured by forming a film by film processing such as.

Examples of coatings formed by thermal spraying include metal oxide coatings composed of aluminum oxide, zirconium oxide or yttrium oxide.
Examples of the film formed by plating include a metal film composed of zinc, nickel, chromium, tin, copper or an alloy thereof.
Examples of films formed by chemical vapor deposition include ceramic films composed of silicon oxide, aluminum oxide or silicon nitride.
Examples of films formed by physical vapor deposition include metal films composed of copper, chromium, titanium, copper alloys, nickel alloys, or iron alloys.

2. Abrasive Grains The polishing composition of the present embodiment contains abrasive grains that function to physically polish the surface of the object to be polished. The type of abrasive grains to be blended into the polishing composition of the present embodiment is not particularly limited, and any of inorganic particles, organic particles, and organic-inorganic composite particles may be used. Specific examples of the inorganic particles include, for example, metal oxides such as aluminum oxide, silicon oxide, cerium oxide (ceria), titanium oxide, zirconium oxide, zircon, yttrium oxide, gallium oxide, germanium oxide, manganese oxide, tin oxide, etc. Particles, particles of carbides such as silicon carbide, boron carbide and titanium carbide, particles of nitrides such as titanium nitride, silicon nitride and boron nitride, particles of borides such as titanium boride and tungsten boride . Moreover, as a specific example of organic particle | grains, polymethyl methacrylate (PMMA) particle | grains are mentioned, for example. These abrasive grains may be used alone or in combination of two or more.

Among these abrasives, particles of aluminum oxide, silicon oxide and zirconia oxide are preferable, and particles of aluminum oxide are more preferable.
The content of the abrasive grains in the polishing composition of the present embodiment may be 1.0% by mass or more and 30% by mass or less of the entire polishing composition. The content of the abrasive grains is preferably 5.0% by mass or more and 30% by mass or less of the entire polishing composition. If the content of abrasive grains is 5.0% by mass or more, it is possible to polish an object to be polished (for example, an iron alloy (stainless steel)) at a high polishing rate. In addition, if the content of the abrasive grains is 30% by mass or less, the cost of the polishing composition can be suppressed, and the scratch on the surface to be polished of the object to be polished (for example, iron alloy (stainless steel)) after polishing And the like can be further suppressed.

  The physical properties of the abrasive grains in the polishing composition of the present embodiment are not particularly limited, but the average primary particle diameter of the abrasive grains is preferably 0.1 μm or more and 4.5 μm or less. When the average primary particle diameter of the abrasive grains is 0.1 μm or more and 4.5 μm or less, an effect of maintaining a constant polishing rate without generating a scratch is exhibited. 1.0 micrometer or less is more preferable, and, as for the average primary particle diameter of an abrasive grain, 0.5 micrometer or less is more preferable. The average primary particle diameter of the abrasive grains can be determined, for example, as an average primary particle diameter obtained by measuring the area of the particles in the scanning electron microscope image and determining the diameter of a circle having the same area as that. .

  Further, the 50% particle diameter (hereinafter sometimes referred to as "D50") in the volume-based integrated particle diameter distribution, which is the average secondary particle diameter of the abrasive grains, may be 0.05 μm or more and 30 μm or less, more preferably The thickness is 0.1 μm to 10 μm, and more preferably 0.2 μm to 5 μm. When the average secondary particle diameter of the abrasive grains is within the above range, the surface roughness of the surface to be polished of the object to be polished (for example, iron alloy (stainless steel)) after polishing is excellent and the polishing after polishing is performed It is hard to produce grinding scratches, such as a scratch, in the to-be-polished surface of a subject (for example, iron alloy (stainless steel)). In addition, a sufficient polishing rate can be obtained. When the particle diameter of the abrasive grains is too small, it is possible to reduce the generation of defects such as polishing scratches and the generation of haze, but there is a possibility that a sufficient polishing rate can not be obtained. Further, when the particle diameter of the abrasive grains is too large, a sufficient polishing rate can be obtained, but there is a possibility that the occurrence of defects such as polishing scratches and the occurrence of haze may not be reduced.

The particle size of the abrasive grains can be measured using various measurements, and for example, it can be measured using a dynamic light scattering method, a laser diffraction method, a laser scattering method, or a pore electrical resistance method. it can.
The abrasive grains may be used alone or in combination of two or more. When two or more types of abrasive grains are mixed, the average secondary particle diameter of the abrasive grains may be the same or different.

In addition, if the alpha conversion rate of aluminum oxide is 40% or more, polishing can be performed at a higher polishing rate. The alpha conversion rate of aluminum oxide is more preferably 45% or more, further preferably 50% or more.
The production method of the aluminum oxide particles is not particularly limited, but the aluminum oxide having the physical properties as described above can be produced by various methods such as the Bayer method (wet method), aluminum alkoxide method, alum method, hydrothermal synthesis method, etc. After obtaining aluminum hydroxide, it can be manufactured by a method of converting it to aluminum oxide by heat treatment.

3. Composition for Polishing The polishing composition of the present embodiment is an emulsion of the O / W type, and contains a surfactant, a lubricating oil, an organic solvent, and water, in addition to the abrasive grains of the present embodiment. Moreover, the polishing composition of the present embodiment may contain other additives, as desired.

3-1 Surfactant The polishing composition of the present embodiment contains a surfactant for emulsifying an oil phase and an aqueous phase to form an O / W type emulsion.
As surfactant, nonionic surfactant, anionic surfactant, cationic surfactant, amphoteric surfactant etc. are mentioned.
Specifically, as the nonionic surfactant, polyoxyethylene (POE) alkyl ether, sorbitan fatty acid ester, polyoxyethylene (POE) sorbitan fatty acid ester, polyoxyethylene (POE) sorbitol fatty acid ester, glycerin fatty acid ester, Polyglycerin fatty acid ester, condensed ricinoleate ester, propylene glycol fatty acid ester, polyoxyethylene (POE) fatty acid ester, sucrose fatty acid ester, polyoxyethylene (POE) hydrogenated castor oil, polyoxyethylene (POE) alkylamine, alkyl alkanol An amide etc. are mentioned. Here, the sucrose fatty acid ester is classified into a polysaccharide surfactant.

Further, as the anionic surfactant, alkyl sulfates in the form of sulfates, alkyl ether sulfates, polyoxyethylene (POE) alkyl sulfates, monoacylglycerol sulfates, alkanesulfonic acids in the form of sulfonates, Alkyl sulfosuccinic acid, coconut fatty acid methyl taurine, alkyl ether carboxylic acid of carboxylic acid type, lauryl phosphoric acid of phosphoric acid type, polyoxyethylene (POE) alkyl ether phosphoric acid and the like or salts thereof can be mentioned.
Further, as the cationic surfactant, aliphatic amine salts, aliphatic quaternary ammonium salts, benzalkonium chloride salts, benzethonium chloride, pyridinium salts, imidazolinium salts and the like or salts thereof can be mentioned.
Moreover, as an amphoteric surfactant, carboxybetaine type, amino carboxylate, imidazolinium betaine, lecithin, alkylamine oxide and the like can be mentioned.

  Among these, nonionic surfactants and anionic surfactants are preferable in terms of stability and ease of handling. Among nonionic surfactants, from the viewpoint of reducing defects after polishing, sorbitan fatty acid ester, polyoxyethylene (POE) sorbitan fatty acid ester, polyoxyethylene (POE) sorbitol fatty acid ester, glycerin fatty acid ester, polyglycerin fatty acid ester Preferred are condensed ricinoleate, propylene glycol fatty acid ester and sucrose fatty acid ester, and more preferred are polyglycerin fatty acid ester, sorbitan fatty acid ester and sucrose fatty acid ester. Further, among the anionic surfactants, from the viewpoint of reducing defects after polishing, a sulfuric acid ester type is preferable, and a lauryl sulfuric acid ester and a salt thereof are more preferable.

  Acidic and basic substances can be added to salt the surfactant. Examples of the acidic substance include inorganic acids such as hydrochloric acid, sulfuric acid and nitric acid. Moreover, an acetic acid etc. are mentioned as an organic acid. Examples of the basic substance include hydroxides of alkali metals such as sodium hydroxide and potassium hydroxide which are inorganic bases. In addition, organic bases monoethanolamine, diethanolamine, triethanolamine, ethylenediamine, diethylenetriamine, triethylenetetramine, methylethylene, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, n-butylamine, n-dibutylamine, n-triamine Butylamine, tert-butylamine, ethylenediamine, N-ethylethylenediamine, diethylenetriamine, triethylenetetramine, 1,2-diaminopropane, tetramethylammonium hydroxide, cyclohexylamine, N, N, N ', N'-tetramethylethylenediamine, pyrrolidine , Piperidine, piperazine, pyridine, pyrazine, 1,2-cyclohexanediamine, 1,4-cyclohexanediamide Monoisopropanolamine, diisopropanolamine, triisopropanolamine, N, N-bis (2-hydroxyethyl) -N-cyclohexylamine, N, N, N ′, N′-tetrakis (2-hydroxyethyl) ethylenediamine, N , N, N ', N'-tetrakis (2-hydroxyethyl) -1,6-hexamethylenediamine, dicyclohexylamine, cyclohexyldiethanolamine, morpholine, 2-amino-2-methyl-1-propanol, monoethanoldiisopropanolamine And amines such as N, N-dimethylethanolamine and N, N-diethylethanolamine.

As the acidic substance that converts the surfactant into a salt, hydrochloric acid and sulfuric acid are preferable in terms of odor and suppression of hydrolysis of the surfactant. From the viewpoint of the stability of the aqueous solution of the surfactant, sodium hydroxide, potassium hydroxide, ammonia and triethanolamine are preferred as the basic substance for forming a salt of the surfactant.
The above surfactants can be used alone or in combination of two or more. For example, from the viewpoint of suppressing the separation of the slurry, two or more nonionic surfactants may be used in combination. Further, from the viewpoint of reducing defects after polishing, a nonionic surfactant and an anionic surfactant may be used in combination. In addition, two or more types of nonionic surfactants and anionic surfactants may be used in combination.

  When two or more types of nonionic surfactants are used in combination, a nonionic surfactant having a relatively high value of HLB (Hydrophilic-Lipophilic Balance) (hereinafter, "first nonionic surfactant" Agent) and a nonionic surfactant having a lower HLB value than the first nonionic surfactant (hereinafter also referred to as "second nonionic surfactant"), the first nonionic surfactant The weighted average of each HLB value of the agent and the second nonionic surfactant (mixed HLB value) is preferably between 6 and 13, preferably between 7 and 12, and more preferably between 8 and 10. You may mix it. When the HLB value is adjusted to between 8 and 10, a slurry of an O / W type emulsion is obtained in which the organic solvent and the lubricating oil are stably dispersed in water and the storage stability is excellent. Further, the mixed HLB value of the surfactant may be adjusted to be within ± 1 of the mixed HLB value of the lubricating oil and the organic solvent described later. Such adjustment reduces the size of oil droplets in the polishing composition and increases the stability of the polishing composition. On the other hand, without such adjustment, the size of oil droplets in the polishing composition may be increased, and the stability of the polishing composition may be reduced.

The HLB value of the lubricating oil and the organic solvent can be determined by micellar state evaluation by emulsification experiments using known surfactants, or can be determined from literature data.
Moreover, it is most preferable to mix the alkyl sulfate ester of anionic surfactant or its salt with surfactant which mixed the above-mentioned 2 or more types. As a salt to mix, sodium lauryl sulfate is mentioned, for example.

  As described above, the surfactant of the present embodiment may contain, for example, at least one of polyglycerin fatty acid ester and sucrose fatty acid ester which is a polysaccharide surfactant. Further, the surfactant of the present embodiment may have an HLB of polyglycerin fatty acid ester or an HLB of sucrose fatty acid ester which is a polysaccharide type surfactant may be 5.0 or more and 15 or less. When the HLB is in the range of 5.0 or more and 15 or less, suppression of haze generation can be expected. Further, the surfactant according to this embodiment is a nonionic surfactant having a structure different from at least one of polyglycerin fatty acid ester and sucrose fatty acid ester which is a polysaccharide type surfactant and polyglycerin fatty acid ester or sucrose fatty acid ester And the sorbitan fatty acid ester. In addition, the surfactant of the present embodiment may further include sodium lauryl sulfate which is a sulfate type salt classified as an anionic surfactant. Thus, the stability as an O / W emulsion may be increased by using a plurality of surfactants in combination.

  The content of each surfactant in the polishing composition of the present embodiment may be 0.01% by mass or more and 10% by mass or less of the entire polishing composition, and preferably 0.1% by mass or more and 5% by mass Or less, more preferably 0.3% by mass or more and 3% by mass or less. When the content of each surfactant is in the above range, the emulsification is improved, the polishing rate is maintained, and the occurrence of defects and haze is reduced. In addition, when content of each surfactant is less than 0.01 mass%, there exists a possibility that it may become emulsification failure. In addition, when the content of each surfactant is more than 10% by mass, a decrease in polishing rate, defects and haze may occur.

3-2. Lubricating Oil The polishing composition of the present embodiment contains a lubricating oil to form an O / W type emulsion. When a lubricating oil is used, the occurrence of defects during polishing is suppressed, and improvement in the surface gloss of the object to be polished after polishing can be expected.
Examples of the lubricating oil include mineral oil based lubricating oils, synthetic oil based lubricating oils, vegetable oil based lubricating oils and animal oil based lubricating oils.
Mineral oil-based lubricating oils are produced, for example, by refining a lubricating oil fraction of petroleum. Specific examples thereof include paraffinic lubricating oils, naphthenic lubricating oils, spindle oils, machine oils, neutral oils, bright stocks and the like.

  Synthetic oil-based lubricating oils are produced, for example, by cracking, synthesizing and refining petroleum components. Specifically, hydrocarbon-based lubricating oils (α-olefin oregomers, polybudenes, alkylbenzenes, cycloalkanes, etc.), ester-based lubricating oils (monoesters, diesters, polyol esters, phosphoric esters, silicates, etc.), Ether-based lubricating oils (polyglycols, phenyl ethers, etc.), silicone-based lubricating oils (polysiloxanes, dimethylpolysiloxanes, silicone oils, etc.), fluorinated lubricating oils (halocarbons, etc.), glycerin, liquid paraffin, polybutene, etc. .

Vegetable oil type lubricating oils include fish oil, tallow oil, cottonseed oil, soybean oil, tall oil, castor oil, coconut oil, linseed oil, rapeseed oil, tung oil, olive oil and the like.
Examples of animal oil type lubricating oils include beef tallow, squalane, lanolin and the like.
With regard to vegetable oil and animal oil, from the viewpoint of controlling the structure of the fatty acid moiety, the vegetable oil and animal oil may be heated in the presence of an alkali to separate into glycerin and fatty acid, and esterified again with any fatty acid.
Among these lubricating oils, synthetic oils or mineral oils are preferred from the viewpoint of stable product quality. The above lubricating oils may be used alone or in combination of two or more.

  The content of the lubricating oil in the polishing composition of the present embodiment is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.2% by mass or more and 5% by mass or less of the entire polishing composition. Or less, more preferably 0.2% by mass or more and 3% by mass or less. When the content of the lubricating oil is in the above range, the stability of the polishing composition as an O / W type emulsion is enhanced. If the content of the lubricating oil is less than 0.1% by mass, the glossiness of the object to be polished after polishing may be lowered, and if it is more than 10% by mass, the object is slippery at the time of polishing and the polishing rate is reduced. There is a fear.

3-3 Organic Solvent The polishing composition of the present embodiment contains an organic solvent in order to form an O / W type emulsion. When an organic solvent is used, the above-mentioned lubricant is uniformly dispersed in the solvent, slippage at the time of polishing is improved, and it is expected to suppress scratching of the object to be polished after polishing.
The organic solvent is, for example, an organic solvent containing a saturated aliphatic hydrocarbon or a saturated aliphatic cyclic hydrocarbon having a boiling point of 120 ° C. or higher. Specific examples of the organic solvent include petroleum-based aliphatic solvents, saturated aliphatic hydrocarbon-based solvents, terpene-based solvents, terpenes and the like.

Examples of petroleum-based aliphatic solvents include kerosene, solvent naphtha, and Stoddard solvents.
Examples of saturated aliphatic hydrocarbon solvents include nonane, decane and dodecane.
Examples of terpene solvents include camphor oil, turpentine oil and pine oil.
Examples of terpenes include pinene and dipinene.
The organic solvents may be used alone or in combination of two or more.

  The content of the organic solvent in the polishing composition of the present embodiment is preferably 0.1% by mass or more and 30% by mass or less, more preferably 0.5% by mass or more and 20% by mass or less of the entire polishing composition. Or less, more preferably 1.0% by mass or more and 20% by mass or less. When the content of the organic solvent is in the above range, the stability of the polishing composition as an O / W emulsion is enhanced. The boiling point of the organic solvent is preferably 120 ° C. or more. On the other hand, if the boiling point of the organic solvent is less than 120 ° C., the components of the organic solvent may be dried during polishing, which may make it difficult to perform stable polishing.

3-4 Water The polishing composition of the present embodiment contains a liquid medium as a dispersion medium or solvent in which abrasive grains are dispersed and other components are dispersed or dissolved. As a liquid medium, water is preferable, and from the viewpoint of suppressing inhibition of the action of other components, water containing as little impurity as possible is preferable. Specifically, pure water, ultrapure water, or distilled water from which foreign matter has been removed through a filter after removing impurity ions with an ion exchange resin is preferable.

3-5 Other Additives The polishing composition of the present embodiment may further contain a pH adjuster and other additives as needed in order to improve its performance. For example, the polishing composition may contain an additive having the function of adjusting the viscosity (viscosity) of the polishing composition, such as a thickener. In addition, the polishing composition may contain an additive, such as a complexing agent, an etching agent, an oxidizing agent, and the like, having an effect of further increasing the polishing rate. The polishing composition may also contain a water-soluble polymer (which may be a copolymer, a salt thereof or a derivative thereof) acting on the surface of the object to be polished or the surface of the abrasive grains. Furthermore, the polishing composition may contain an additive such as a dispersing agent for improving the dispersibility of the abrasive grains or a dispersing aid for facilitating redispersion of aggregates of the abrasive grains. Furthermore, the polishing composition may contain known additives such as preservatives, mildew proofing agents, and rust preventives.

  These various additives are known in many patent documents etc. as what can usually be added in polishing composition, and the kind and addition amount of an additive are not specifically limited. However, the amount of addition of these additives is preferably less than 5% by mass with respect to the entire polishing composition, and more preferably less than 2% by mass. These additives may be used alone or in combination of two or more.

Adjustment of the pH of the polishing composition of the present embodiment may be performed with a pH adjuster. The pH adjuster can adjust the pH of the polishing composition, thereby controlling the polishing speed of the object to be polished, the dispersibility of the abrasive grains, and the like. The pH adjusters may be used alone or in combination of two or more.
The pH can be changed according to the object to be polished, and is usually in the range of 1 or more and 13 or less. In particular, when the object to be polished is an iron alloy (stainless steel), the pH is preferably in the range of 6.0 or more and 11.0 or less, more preferably in the range of 7.0 or more and 10.0 or less, and 7.0 or 9.0 The following range is more preferable. When the pH value of the polishing composition of the present embodiment is within the above range, excessive etching of the object to be polished can be prevented, and defects generated on the surface of the object to be polished can be reduced. be able to.

  As the pH adjuster, known acids, bases or salts thereof can be used. Specific examples of the acid that can be used as a pH adjuster include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid and phosphoric acid, formic acid, acetic acid, propionone Acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n-heptanoic acid, 2-methylhexanoic acid, n-octanoic acid , 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, tartaric acid, citric acid, Lactic acid, diglycolic acid, 2-furancarboxylic acid, 2,5-furandicarboxylic acid, 3-furancarboxylic acid, 2-tetrahydrofuranic acid, methoxyacetic acid, methoxyphenyl vinegar , And phenoxy organic acids such as acetic acid.

When using an inorganic acid as a pH adjuster, sulfuric acid, nitric acid, hydrochloric acid, phosphoric acid and the like are preferable from the viewpoint of improving the polishing rate.
When an organic acid is used as the pH adjuster, glycolic acid, succinic acid, maleic acid, citric acid, tartaric acid, malic acid, gluconic acid, itaconic acid and the like are preferable.

  Bases usable as pH adjusters include amines such as aliphatic amines and aromatic amines, organic bases such as quaternary ammonium hydroxide, hydroxides of alkali metals such as potassium hydroxide and sodium hydroxide, and alkaline earths Examples include metal hydroxides and ammonia. Among these bases, potassium hydroxide, sodium hydroxide, ammonia, ethanolamine, diethanolamine and triethanolamine are preferable in view of easy availability.

Further, in place of the acid mentioned above or in combination with the acid mentioned above, a salt such as ammonium salt or alkali metal salt of the acid may be used as a pH adjuster. In particular, in the case of salts of weak acids and strong bases, salts of strong acids and weak bases, or salts of weak acids and weak bases, the buffering action of pH can be expected, and in the case of salts of strong acids and strong bases. It is possible to adjust the conductivity as well as the pH with a small amount.
The addition amount of the pH adjuster is not particularly limited, and may be appropriately adjusted so that the polishing composition has a desired pH.

Examples of the thickener include hydrated aluminum silicate, dimethyloctadecyl salt of montmorillonite clay, alkali-soluble acrylic polymer, colloidal silica, alumina sol, heavy metal soap, polyvinyl alcohol, carboxymethylcellulose, xanthan gum and the like.
Among these, alkali-soluble acrylic polymers are preferable because of easy handling.

  Examples of these thickeners include Primal RM-4, Primal RM-5, Primal TT-615, Primal TT-935, Primal TT-950 (both from Rohm and Haas Japan Ltd.), Carbopol 981. And Carbopol 934, Carbopol ETD 2020, Carbopol EZ-1, Carbopol Ultrez 10, PEMULENTR-1, PEMULEN TR-2 (all from BFGoodrich) and the like. These may be used alone or in combination of two or more.

  The content of the thickener in the polishing composition of the present embodiment may be 0.01% by mass or more and 10% by mass or less of the entire polishing composition, and more preferably 0.1% by mass or more and 5% by mass or less More preferably, they are 0.3 mass% or more and 3 mass% or less. When the content of the thickener is in the above range, the handling of the polishing composition becomes easy. When the content of the thickener is less than 0.01% by mass, the viscosity does not increase and the stability of the polishing composition may be reduced. When the content is more than 10% by mass, the viscosity is excessively increased. The handling of the polishing composition becomes difficult.

  Examples of complexing agents include inorganic acids, organic acids, amino acids, nitrile compounds, chelating agents and the like. Specific examples of the inorganic acid include sulfuric acid, nitric acid, boric acid, carbonic acid and the like. Specific examples of the organic acid include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n- Heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid Acid, phthalic acid, malic acid, tartaric acid, citric acid, lactic acid and the like can be mentioned. Organic sulfuric acids such as methanesulfonic acid, ethanesulfonic acid and isethionic acid can also be used. Salts such as alkali metal salts of inorganic acids or organic acids may be used in place of or in combination with inorganic acids or organic acids. Among these complexing agents, glycine, alanine, malic acid, tartaric acid, citric acid, glycolic acid, isethionic acid, or salts thereof are preferred.

  Examples of the chelating agent include carboxylic acid type chelating agents such as gluconic acid, amine type chelating agents such as ethylenediamine, diethylenetriamine and trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid and triethylenetetramine Examples include polyaminopolycarboxylic acid-based chelating agents such as hexaacetic acid and diethylenetriaminepentaacetic acid. Also, 2-aminoethyl phosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, amino tri (methylene phosphonic acid), ethylene diamine tetrakis (methylene phosphonic acid), diethylene triamine penta (methylene phosphonic acid), ethane-1,1- 1 Organic phosphonic acid chelating agents such as diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphosphonic acid, 1-phosphonobutane-2,3,4-tricarboxylic acid, phenol derivatives, 1,3-diketones Etc. can also be mentioned as an example of a chelating agent.

Examples of the etchant include inorganic acids such as nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid and hydrofluoric acid, organic acids such as acetic acid, citric acid, tartaric acid and methanesulfonic acid, potassium hydroxide, sodium hydroxide, ammonia etc. Inorganic alkalis, and organic alkalis such as amines and quaternary ammonium hydroxides.
Examples of the oxidizing agent include hydrogen peroxide, peracetic acid, percarbonate, urea peroxide, perchlorate, persulfate, nitric acid, potassium permanganate and the like.

  Examples of water-soluble polymers (copolymers and their salts, derivatives thereof) include polycarboxylic acids such as polyacrylates, polyphosphonic acids, polysulfonic acids such as polystyrene sulfonic acids, xanthan gum, sodium alginate and the like And polysaccharide derivatives such as hydroxyethyl cellulose and carboxymethyl cellulose. Further, polyethylene glycol, polyvinyl alcohol, polyvinyl pyrrolidone, sorbitan monooleate, an oxyalkylene polymer having one or more oxyalkylene units, and the like can also be mentioned as examples of the water-soluble polymer.

Examples of the dispersion aid include pyrophosphates and condensed phosphates such as hexametaphosphate.
Examples of preservatives include sodium hypochlorite and the like.
Examples of the fungicides include oxazolines such as oxazolidine-2,5-dione and the like.
Examples of the anticorrosive agent include surfactants, alcohols, polymers, resins, amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid and the like.

4. Method for Producing Polishing Composition The method for producing the polishing composition of the present embodiment is not particularly limited, and alumina and optionally various additives are stirred and mixed in a liquid solvent such as water. It can be manufactured by For example, it can manufacture by stirring and mixing the alumina which is abrasive grain, and various additives, such as surfactant and lubricating oil and an organic solvent, in water. Although the temperature at the time of mixing each component is not specifically limited, 10 to 40 degreeC is preferable and you may heat in order to improve a dissolution rate. Also, the mixing time is not particularly limited. The method of dissolving and dispersing each component is optional, and stirring with a blade stirrer or ultrasonic dispersion may be used, but it is preferable to use a dispersing device such as a homogenizer in order to perform emulsification well.

  The polishing composition of the present embodiment may be of one-component type or multi-component type of two or more components. In the case where the object to be polished is polished using a polishing apparatus having a plurality of supply paths for the polishing composition, the polishing may be performed as follows. That is, a plurality of raw material compositions serving as the raw materials of the polishing composition are prepared in advance, and the plurality of raw material compositions are supplied into the polishing apparatus through the supply path, and the plurality of raw material compositions are provided in the polishing apparatus The polishing may be carried out in such a manner as to be mixed to form a polishing composition.

  The polishing composition of the present embodiment may be prepared by diluting a stock solution of the polishing composition with water. When the polishing composition is a two-component type, the order of mixing and dilution of the two raw material compositions used as the raw material of the polishing composition is arbitrary. For example, one raw material composition may be diluted with water and then mixed with the other raw material composition, or both raw material compositions may be mixed and diluted with water at the same time, or both After mixing the raw material composition of (1), it may be diluted with water.

5. Regarding Polishing Apparatus and Polishing Method The polishing composition of the present embodiment can be used, for example, in a polishing apparatus and polishing conditions that are generally used in the polishing of an object to be polished comprising an alloy material and an organic material. As a polishing apparatus, a general single-sided polishing apparatus or a double-sided polishing apparatus can be used. In the case of polishing using a single-side polishing apparatus, a holding object called a carrier is used to hold an object to be polished, and a polishing plate is attached to a surface plate to which a polishing pad is attached while supplying a polishing composition. The surface of the object to be polished is polished by rotating the surface plate. In the case of polishing using a double-side polishing apparatus, a carrier is used to hold the object to be polished, and while feeding the polishing composition, the platen to which the polishing pad is attached is pressed against both sides of the object to be polished Both surfaces of the object to be polished are polished by rotating the pad and the object to be polished in opposite directions. Regardless of which polishing apparatus is used, the object to be polished is the physical action by the friction between the polishing pad and the polishing composition and the object to be polished, and the chemical action of the polishing composition on the object to be polished Is polished.

  In the present embodiment, although the above-described polishing apparatus and polishing method can be used, it may be polished using a CNC grinding apparatus or a robot arm. For example, in the case of polishing using a robot arm, polishing may be performed using the automatic polishing apparatus 1 of FIG.

  The automatic polishing apparatus 1 of FIG. 1 includes a robot arm 2, a polishing pad 10, a polishing tool 4, a pressing force detection unit 5, and a controller 7. Since the robot arm 2 has a plurality of joints 20, 21, 22, the tip portion 23 to which the polishing pad 10, the polishing tool 4, and the pressing force detection unit 5 are attached can be moved in a plurality of directions. . The member to be polished has a three-dimensional shape.

  The polishing tool 4 is attached to the distal end portion 23 via the pressing force detection unit 5 and rotates the polishing pad 10 with a direction perpendicular to the polishing surface 10 a of the polishing pad 10 as a rotation axis by a built-in drive means. The driving means of the polishing tool 4 is not particularly limited, but in general, single action, double action, gear action or the like is used. The controller 7 controls the behavior of the robot arm 2 and the rotation of the polishing pad 10 by the polishing tool 4. The polishing composition is supplied between the polishing surface 10 a of the polishing pad 10 and the polishing surface of the member 90 from the polishing composition supply mechanism (not shown).

  The controller 7 presses the polishing surface 10 a of the polishing pad 10 against the polishing surface of the member 90 by the robot arm 2 and rotates the polishing pad 10 to polish the polishing surface of the member 90. The pressing force detection unit 5 detects the pressing force of the polishing surface 10 a of the polishing pad 10 against the polishing surface of the member 90. The controller 7 may adjust the force for pressing the polishing surface 10 a against the polishing surface of the member 90 based on the detection result of the pressing force by the pressing force detection unit 5. Further, the controller 7 moves the polishing pad 10 on the polishing surface of the member 90 while keeping the pressing force of the polishing surface 10 a against the polishing surface of the member 90 constant based on the detection result of the pressing force by the pressing force detection unit 5 The robot arm 2 may be controlled as follows.

  In addition, the polishing method using the polishing composition of the present embodiment is applied to the case where the polishing pad is attached to the tip of the hand polisher and the polishing operator manually moves the hand polisher to polish the polishing surface. Good. The driving means of the hand polisher is not particularly limited, but in general, single action, double action, gear action and the like are used.

Among the polishing conditions, the polishing load (the pressure applied to the object to be polished at the time of polishing) is not particularly limited, but generally, the larger the polishing load, the higher the frictional force between the abrasive grains and the object to be polished. As a result, mechanical processing characteristics are improved and the polishing rate is increased. Preferably polishing load is not more than 2kPa (20gf / cm ²⁾ or more 98kPa (1000gf / cm ^2), more preferably 3kPa (30gf / cm ²⁾ or more 78kPa (800gf / cm ²⁾ or less, more preferably 3 kPa ( 30 gf / cm ² or more and 59 kPa (600 gf / cm ² ) or less. When the polishing load is in the above range, in addition to the fact that a sufficiently high polishing rate is exhibited, the occurrence of breakage or surface defect of the object to be polished can be reduced.

  Further, among the polishing conditions, the linear velocity (the relative velocity between the polishing pad and the object to be polished during polishing) generally refers to the rotational speed of the polishing pad, the rotational velocity of the carrier, the size of the object to be polished, the number of objects to be polished, etc. to be influenced. When the linear velocity is high, the frequency with which the abrasive grains are in contact with the object to be polished becomes high, so the frictional force acting between the object to be polished and the abrasive grains becomes large, and the mechanical polishing action on the object to be polished becomes large. . Also, the heat generated by friction may enhance the chemical polishing action of the polishing composition.

The linear velocity is not particularly limited, but is preferably 10 m / min to 300 m / min, and more preferably 30 m / min to 250 m / min. When the linear velocity is in the above range, in addition to achieving a sufficiently high polishing rate, an appropriate frictional force can be applied to the object to be polished. On the other hand, the friction directly generated between the polishing pad and the object to be polished is preferably as small as possible because it does not contribute to the polishing.
Furthermore, although the supply rate of the polishing composition among the polishing conditions depends on the type of polishing object, the type of polishing apparatus, and other polishing conditions, the polishing composition is the entire polishing object and polishing pad. It is preferable that the supply rate be sufficient to uniformly supply the

  The type of polishing pad is not particularly limited, and materials having various physical properties such as material, thickness and hardness can be used. For example, polishing pads of various materials such as polyurethane type, non-woven type, and suede type can be used. In addition, any of the polishing pads containing abrasive grains and the polishing pads not containing abrasive grains can be used.

  Furthermore, the polishing composition of the present embodiment can be recovered after being used for polishing an object to be polished, and reused for polishing the object to be polished. As an example of a method of reusing the polishing composition, there is a method in which the used polishing composition discharged from the polishing apparatus is collected in a tank and circulated from the tank into the polishing apparatus and used for polishing. It can be mentioned. When the polishing composition is used cyclically, the amount of the polishing composition discharged as waste liquid can be reduced, so that the environmental load can be reduced. In addition, since the amount of the polishing composition to be used can be reduced, the manufacturing cost required for polishing the object to be polished can be suppressed.

  When the polishing composition of the present embodiment is reused, a part or all of abrasive grains, additives and the like consumed and lost due to use for polishing is added as a composition modifier and reused. It is good to do. What mixed abrasives, an additive, etc. by arbitrary mixing ratios may be used as a composition regulator, and you may use an abrasive, an additive, etc. as a composition regulator independently as it is. By additionally adding a composition modifier, the composition can be adjusted to a composition suitable for reuse of the polishing composition, and suitable polishing can be performed. The concentrations of the abrasive grains and the additive contained in the composition adjusting agent are arbitrary and not particularly limited, and may be appropriately adjusted according to the size of the tank and the polishing conditions.

〔Example〕
EXAMPLES The present invention will be described more specifically by showing examples and comparative examples below, but the present invention is not limited to these examples.

<Preparation of Polishing Composition>
Alumina particles (abrasive grains), an anionic surfactant, a first nonionic surfactant, a second nonionic surfactant, an organic solvent, and a lubricating oil in the amounts shown in Tables 1 to 5 are respectively added to water and mixed Then, polishing compositions of Examples 1 to 30 and Comparative Examples 1 to 15 were prepared. The average secondary particle diameter of the alumina particles is 0.3 μm. The average secondary particle size of the alumina particles was measured using Multisizer III (manufactured by Beckman Coulter, Inc.).
Then, using these polishing compositions, a SUS316L substrate having a side of 45 mm, a thickness of 8 mm and a side surface of R4.5 was polished.

  The object to be polished is a SUS316L substrate of 45 mm on a side and a side surface of R4.5. The material of the polishing pad used is suede. Other polishing conditions are as follows. In addition, polishing temperature measures the temperature of the polishing surface of the polishing pad at the time of completion | finish of polishing using an infrared radiation thermometer.

Polishing pressure: 6 kPa (60 gf / cm ² )
Rotation speed of polishing plate: 1000 rpm
Supply amount of polishing composition: 15 g / min
Polishing time: 2 minutes Polishing temperature: 23 ° C
After completion of the polishing, the polishing rate, the number of scratches generated on the polished surface (the number of defects) and the haze of the polished surface were evaluated. In addition, the stability of the polishing composition was also evaluated. The results are shown in Tables 1-5.

The polishing rate was calculated from the mass change of the object to be polished before and after the polishing. The polishing rate passed 0.1 μm / min or more and rejected less than 0.1 μm / min.
The scratch is a linear polishing scratch, and one side of the substrate after polishing was observed using a 50 × lens of VHX-2000 (manufactured by Keyence Corporation). It evaluated by the number of defects which exist in one side. A: 0-5, B: 6-15, C: 16 or more, A and B were passed, and C was rejected.
The haze of the substrate after polishing was observed by using a 50 × lens of VHX-2000 (manufactured by Keyence Corporation) to observe one side of the substrate after polishing and evaluating the area of the portion where white turbidity defects are present on one side. A: 0 to 5%, B: 6 to 20%, C: 21% or more, A and B were passed, and C was rejected.

  For stability, 100 g of each slurry is stored in a container having a volume of 250 mL and stored at 25 ° C., 43 ° C., 50 ° C., 60 ° C. for one week (168 hours), and then the state of the slurry in the container is visually observed Observed. Those in which the slurry was separated into two or more layers were marked x, and those in which the dispersion could be maintained were marked ○.

  As shown in Table 1, each of the polishing compositions of Examples 1 to 9 includes alumina particles, sodium lauryl sulfate (Na), at least one of polyglycerin fatty acid ester and sorbitan fatty acid ester, and naphthenic hydrocarbon. And an oil-in-water emulsion containing spindle oil and water, and the surface of the object to be polished is polished at a sufficient polishing rate as compared with the polishing compositions of Comparative Examples 1 to 6, and defects The number and haze were also good. Moreover, the stability at each temperature of the emulsion was also good.

In addition, regarding evaluation of a haze, the upper limit of HLB of surfactant was 15, and the lower limit of HLB was 5 so that the result of Example 3, 5 might show.
Further, as can be seen from the results of Example 6, when the nonionic surfactant having the same structure was used, the stability of the emulsion was slightly inferior to that of Examples 1-5.
In addition, as seen from the results of Examples 7 to 9, when the nonionic surfactant (polyglycerin fatty acid ester) was used alone, the stability of the emulsion was inferior to that of Examples 1 to 6.

  As shown in Table 2, each polishing composition of Examples 10 to 15 comprises alumina particles, sodium lauryl sulfate (Na), at least one of sucrose fatty acid ester and sorbitan fatty acid ester, and naphthenic hydrocarbon. And an oil-in-water emulsion containing spindle oil and water, and the surface of the object to be polished is polished at a sufficient polishing rate as compared with the polishing compositions of Comparative Examples 7 to 11, and defects The number and haze were also good. In addition, the stability of the emulsion was also good.

In addition, regarding evaluation of a haze, the upper limit of HLB of surfactant was 15, and the lower limit of HLB was 5 so that the result of Example 11, 13 might show.
Further, as can be seen from the results of Example 14, when the nonionic surfactant having the same structure was used, the stability of the emulsion was slightly inferior to that of Examples 10-13.
Further, as can be seen from the results of Example 15, when the nonionic surfactant (sucrose fatty acid ester) was used alone, the stability of the emulsion was inferior to that of Examples 10-14.

  As shown in Table 3, the polishing composition of Example 16 includes alumina particles, sodium lauryl sulfate (Na), at least one of polyglycerin fatty acid ester and sucrose fatty acid ester, naphthenic hydrocarbon, and spindle. The surface of the object to be polished is polished at a sufficient polishing rate as compared with the polishing compositions of Comparative Examples 12 to 15 and is composed of an oil and an O / W type emulsion containing water, and the number of defects and The haze was also good. In addition, the stability of the polishing composition was also good.

As can be seen from the results of Examples 17 and 18, when polyglycerin fatty acid ester or sucrose fatty acid ester and polyoxyethylene (POE) sorbitan fatty acid ester are used in combination, the number of defects is an example. Less than sixteen.
In addition, as can be seen from the results of Examples 19 and 20, when polyglycerin fatty acid ester or sucrose fatty acid ester and polyoxyethylene (POE) alkyl ether are used in combination, the stability of the object to be polished is , Inferior to Examples 16-18.

As shown in Table 4, each polishing composition of Examples 21 to 23 contained an anionic surfactant, and the stability of the emulsion was good.
In addition, as the result of Example 24 shows, when the anionic surfactant was not used, the stability of the emulsion was inferior to Examples 21-23 which used the anionic surfactant. That is, in order to polish the surface of the object to be polished at a sufficient polishing rate and to improve the number of defects, the haze and the stability of the emulsion respectively, the nonionic composition has two different types of nonionic surfactants in the polishing composition. It is preferable to add an anionic surfactant while adding the agent.
In addition, as can be seen from the results of Examples 25 to 26, when silicone elastomer (silicone oil) is used as the lubricating oil, the stability of the emulsion is determined from Examples 21 to 23 where spindle oil is used as the lubricating oil. It was also inferior.

  As shown in Table 5, in each of the polishing compositions of Examples 27 to 29, since the concentration of the alumina particles (abrasive grains) is in the range of 1% by mass to 30% by mass, the surface of the object to be polished is While being polished at a sufficient polishing rate, the number of defects and the haze were also good. In addition, the stability of the emulsion was also good.

10 polishing pad 90 members

Claims (13)

  A polishing composition comprising an O / W type emulsion containing abrasive grains, a surfactant containing at least one of a polyglycerin fatty acid ester and a polysaccharide surfactant, a lubricating oil, an organic solvent, and water.   The polishing composition according to claim 1, wherein the polysaccharide surfactant is sucrose fatty acid ester.   The polishing composition according to claim 1 or 2, wherein the HLB of the polyglycerin fatty acid ester or the HLB of the polysaccharide surfactant is 5 or more and 15 or less.   The surfactant according to claim 1, wherein the surfactant comprises the polyglycerin fatty acid ester or the polysaccharide surfactant, and the polyglycerin fatty acid ester or the nonionic surfactant having a different structure from the polysaccharide surfactant. Polishing composition of any one of -3.   The polishing composition according to claim 4, wherein the surfactant comprises the polyglycerin fatty acid ester or the polysaccharide surfactant and sorbitan fatty acid ester.   The polishing composition according to any one of claims 1 to 5, wherein the surfactant further comprises an anionic surfactant.   The polishing composition according to claim 6, wherein the anionic surfactant is a sulfate type or a salt thereof.   A polishing method for polishing an object to be polished using the polishing composition according to any one of claims 1 to 7.   The polishing method according to claim 8, wherein at least one of the alloy material, the metal oxide and the organic material is polished.   The polishing method according to claim 9, wherein the alloy material is any one selected from the group consisting of an aluminum alloy, a titanium alloy, an iron alloy, a magnesium alloy, a nickel alloy and a copper alloy.   The metal oxide includes silicon oxide (silica), aluminum oxide (alumina), titanium oxide (titania), zirconium oxide (zirconia), gallium oxide, yttrium oxide (yttria), germanium oxide, and complex oxides thereof The polishing method according to claim 9, which is any one selected.   The organic material is polycarbonate resin, acrylic resin, acrylonitrile-butadiene-styrene copolymer resin, urethane resin, polyphenylsulfone resin (PPSU), polyphenylene sulfide resin (PPS), polyetheretherketone resin (PEEK) and polyamideimide The polishing method according to claim 9, comprising any one selected from the group consisting of a resin (PAI). It is a method of manufacturing the constituent for polish according to any one of claims 1 to 7,
A method for producing a polishing composition, comprising the step of mixing the abrasive grains, the surfactant, the lubricating oil, the organic solvent, and the water to form an O / W type emulsion.

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