JP2019064239A - Nonplanar mold, production method of nonplanar mold, and production method of resin molding - Google Patents

Abstract

To provide a nonplanar mold equipped with a stamper having a nonplanar surface.SOLUTION: A nonplanar mold 10 is equipped with a stamper 11 having a nonplanar surface, a support mold 13 having a joint surface 13a for joining with the stamper 11, and a solder 12 for joining the stamper 11 with the support mold 13. When the stamper 11 and the support mold 13 are arranged opposed to each other, a space 14 is formed due to differences in shapes between the nonplanar surface and the joint surface 13, and the solder 12 is interposed in the space 14.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a non-planar mold having a non-planar surface, a method of manufacturing the non-planar mold, and a method of manufacturing a resin molded product using the non-planar mold.

  Conventionally, when a resin molded product having fine asperities such as an optical disc is manufactured, molding is performed using an electroformed body (stamper) having asperities corresponding to the fine asperities of the resin molded product. The resin molded product is injected and filled with a molten resin material in a cavity (hollow part) formed in a pair of molds to which the electroformed body is fixed, and then the mold is separated to take out the resin after cooling. It is formed.

  For example, Patent Document 1 discloses that a flat and thick Ni electroforming (metal support layer) is joined to a fine concavo-convex processed nickel (Ni) electroforming through a heat insulating material to form a heat insulating stamper. It is done.

  For example, in patent document 2, when bonding the pattern formation layer in which the pattern was formed to a metal support layer, a pattern formation layer is fixed to a metal support layer using an adhesive layer whose thermal conductivity is lower than a metal support layer. It is disclosed to form a stamper.

Patent No. 3378840 JP, 2012-218435, A

  However, the conventional method has a structure in which a flat (flat surface) stamper on which a fine concavo-convex pattern is formed is attached to a flat surface of a metal support layer, and attachment of a non-flat stamper is not disclosed.

  Therefore, the present invention has been made in view of such problems, and a non-planar mold including a stamper having a non-planar surface, a method of manufacturing the non-planar mold, and the non-planar mold. An object of the present invention is to provide a method for producing a resin molded product.

  In order to achieve the above object, a non-flat surface mold according to an aspect of the present invention includes a stamper having a non-flat surface, a support mold having a bonding surface to be bonded to the stamper, the stamper, and the support mold. And a brazing material for joining the two, and in a state where the stamper and the support die are disposed to face each other, a space is formed between the non-planar surface and the joining surface due to the difference in the shape of each other. The brazing material intervenes in the space.

  Further, in order to achieve the above object, in the method of manufacturing a non-planar mold according to an aspect of the present invention, a first step of applying a brazing material to the surface of a support mold, and the first step described above A second step of arranging the non-planar surface of the stamper to face the supporting mold coated with the brazing material, and bonding the supporting mold and the stamper by heating and melting the brazing material And 3).

  Further, in order to achieve the above object, the method for producing a resin molded product according to one aspect of the present invention is produced by the non-flat mold described above or the non-flat mold production method described above. And a fourth step of producing a resin molded product by resin molding using the non-planar mold.

  According to the present invention, it is possible to provide a non-planar mold or the like provided with a non-planar stamper.

It is sectional drawing which shows the non-planar metal mold | die which concerns on embodiment. It is sectional drawing which shows the state which accumulated the stamper which concerns on embodiment, and the support metal mold | die. It is a flowchart which shows the flow which produces the resin molded product which concerns on embodiment. It is a flowchart which shows the flow which produces the stamper which concerns on embodiment. It is a flowchart which shows the flow which produces the non-planar metal mold which concerns on embodiment. It is sectional drawing which shows typically the flow which produces the stamper which concerns on embodiment. It is sectional drawing which shows typically the flow which produces the non-planar metal mold which concerns on embodiment. It is sectional drawing which shows typically the flow which produces the resin molded product which concerns on embodiment. It is sectional drawing which shows typically the other example of the flow which produces the non-planar metal mold | die which concerns on embodiment. It is sectional drawing which shows the other example of the stamper which concerns on embodiment.

  Hereinafter, the non-planar mold, the method of manufacturing the non-planar mold, and the method of manufacturing a resin molded product according to the embodiment of the present invention will be described in detail with reference to the drawings. Each embodiment described below shows one specific example of the present invention. Therefore, numerical values, shapes, materials, components, steps, order of steps, and the like described in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims indicating the highest concept of the present invention are described as optional components.

  Further, each drawing is a schematic view, and is not necessarily illustrated exactly. Therefore, for example, the scale and the like do not necessarily match in each figure.

  Further, in the drawings used for the description in the following embodiments, coordinate axes may be shown. The Z axis is a direction parallel to the direction in which the support mold, the solder and the stamper are stacked. Further, the X axis direction and the Y axis direction are directions orthogonal to each other on a plane perpendicular to the Z axis direction. For example, in the following embodiment, "plan view" means that a non-planar mold is viewed from the Z-axis direction.

  In addition, the description of "approximately **" is intended to include those which are recognized as substantially **. For example, when describing "approximately circular" as an example, not only perfect circular but also substantially circular. It is intended to include what is permitted.

Embodiment
Hereinafter, the present embodiment will be described with reference to FIGS. 1A to 3C.

[1. Non-planar mold]
First, the non-planar mold will be described with reference to FIGS. 1A and 1B. The non-planar mold according to the present embodiment is a mold used to produce a resin molded product by injection molding or the like. The resin molded product is, for example, a light guide plate used for a lighting apparatus. In the specification of the present application, a resin molded product is a resin molded product at least a part of which has a non-planar surface, and does not include a flat resin molded product.

  FIG. 1A is a cross-sectional view showing a non-planar mold 10 according to the present embodiment.

  As shown in FIG. 1A, the non-planar mold 10 is a mold for producing a resin molded product having a non-planar surface, and at least a part thereof has a non-planar shape. In FIG. 1A, a mold having a curved surface is shown as an example of the non-planar shape. The non-planar mold 10 includes a stamper 11, a solder 12, and a support mold 13. Specifically, the non-planar mold 10 is formed by stacking the support mold 13, the solder 12, and the stamper 11 in this order.

  The stamper 11 is an electroformed body having a non-planar shape corresponding to the shape of the resin molded product to be manufactured, and having the fine asperities 11 a formed on the surface on the side not facing the supporting mold 13. The stamper 11 has, for example, a non-planar shape as a whole of the stamper 11. In the present embodiment, the fine asperities 11 a are disposed on the surface on the Z axis plus side of the stamper 11. Thereby, the resin molded product which has the fine unevenness to which the fine unevenness 11a is transferred can be produced. The fine unevenness 11 a is an unevenness smaller than the non-planar shape of the stamper 11, and is, for example, an unevenness of micro order size. The fine asperities 11 a are an example of asperities in the stamper 11.

  The fine asperities 11 a are formed such that a resin molded product produced using the non-planar mold 10 satisfies desired performance. For example, when the resin molded product is a light guide plate, the desired performance is a desired optical characteristic. The shape of the fine asperities 11a may be appropriately determined according to the desired performance.

  The stamper 11 is not limited to having the fine asperities 11a, and may not have the fine asperities 11a.

  The stamper 11 is configured to include at least one of Cu (copper), Ni (nickel) and a Ni alloy. From the viewpoint of securing the hardness as a mold used for injection molding, it is preferable to include at least one of Ni and a Ni alloy. The Ni alloy is, for example, a Ni-Fe alloy or a Ni-Co (cobalt) alloy. In the present embodiment, the stamper 11 is configured to include Ni.

  Although the details of the method of manufacturing the stamper 11 will be described later, the stamper 11 is manufactured by electroforming a master product having a non-planar surface on which fine asperity processing has been performed. As a result, it is possible to transfer the fine asperities formed on the master product, and to produce the stamper 11 having a shape corresponding to the non-planar shape of the master product. When electroforming is performed on a master product having a non-planar surface, the current density has a distribution, so that the thickness of the stamper 11 to be manufactured becomes uneven. For example, portions such as the outer peripheral portion and the convex portion of the stamper 11 are formed thick. That is, the thickness of the stamper 11 is partially different. For example, the thickness of the stamper 11 is 0.5 mm to 3.0 mm. FIG. 1A shows an example in which the thickness of the convex portion and the outer peripheral portion of the stamper 11 is large.

  The support mold 13 is a backup mold for securing the strength of the stamper 11 in order to use the stamper 11 as a mold for injection molding. The support die 13 has a substantially rectangular parallelepiped shape, and the surface on the Z axis plus side has a non-flat surface corresponding to the non-flat surface of the stamper 11. The non-planar surface of the support mold 13 is formed to have, for example, a shape roughly approximate to the non-planar surface of the stamper 11. The non-planar surface of the support mold 13 is an example of a bonding surface (see the bonding surface 13 a in FIG. 3B) to which the stamper 11 is bonded.

  Moreover, the surface on the Z axis negative side is a substantially flat surface. The support mold 13 has a substantially rectangular parallelepiped shape, and one of the opposite surfaces has a shape that roughly approximates the non-planar shape of the stamper 11, and the other surface is a substantially flat surface. This is because the non-flat mold 10 is stably attached when the non-flat mold 10 is attached to the injection molding machine (not shown), or the heat from the heater (an example of a heat source) of the injection molding machine is non-flat metal This is to facilitate transmission to the mold 10. The support die 13 may not have a shape corresponding to the non-planar shape of the stamper 11, that is, a non-planar shape similar to the non-planar shape of the stamper 11. For example, one surface and the other surface may be substantially flat surfaces. In that case, the substantially flat surface is the bonding surface.

  The support mold 13 may be made of a material having a linear expansion coefficient close to that of the material of the stamper 11. In the present embodiment, the support mold 13 may be made of an Fe (iron) -based material having a linear expansion coefficient close to that of Ni. Further, from the viewpoint of the life during injection molding and the processability when producing the support die 13, the support die 13 is preferably made of an Fe (iron) -based material. For example, the support mold 13 is configured to include at least one of Fe and an Fe alloy. In the present embodiment, the support die 13 is configured to include an Fe alloy (specifically, stainless steel). In addition, the support die 13 is not limited to being made of an Fe-based material, and may be made of, for example, a copper-based material. The material of the support die 13 may be appropriately determined according to the material of the stamper 11.

  Since the linear expansion coefficients of the stamper 11 and the support die 13 are close to each other, the residual stress acting between the stamper 11 and the support die 13 can be reduced. For example, it is possible to reduce the stress on the heat history generated by the heat during injection molding. As a result, separation of the stamper 11 and the support mold 13 can be suppressed, and the life of the non-planar mold 10 can be extended. The difference in linear expansion coefficient between the stamper 11 and the support die 13 may be, for example, 2.0 ppm / K or less. As an example, the linear expansion coefficient of Ni used in the present embodiment is 12.8 ppm / K, and the linear expansion coefficient of stainless steel is 11.0 ppm / K.

  The thickness of the support mold 13 is not particularly limited as long as the strength of the stamper 11 can be secured.

  Here, non-planar shapes of the stamper 11 and the support die 13 will be described with reference to FIG. 1B.

  FIG. 1B is a cross-sectional view showing a state in which the stamper 11 and the support mold 13 according to the present embodiment are stacked.

  As shown in FIG. 1B, in the state where the non-planar surfaces of the stamper 11 and the support die 13 are arranged to face each other, the space 14 due to the difference in the surface shape is formed. Specifically, in a state in which the non-planar surface of the stamper 11 and the bonding surface of the support die 13 are arranged in an overlapping manner, the space 14 is formed due to the difference in the shape of each other. The space 14 is mainly generated by the thickness variation of the stamper 11. Here, it is possible to carry out post-processing to make the thickness uniform by cutting the surface of the stamper 11 on which the fine asperities 11a are not formed, that is, the surface facing the support die 13 using an end mill or the like. Even after post-processing, it is difficult to mirror finish, and processing roughness remains on the surface. That is, the space 14 is formed even if post-processing is performed. The surface of the stamper 11 on which the fine asperities 11a are not formed is a surface not in contact with the resin material for producing a resin molded product at the time of injection molding.

  In this state, when the stamper 11 is attached to the support mold 13 having a non-planar shape similar to the non-planar shape of the stamper 11, a space 14 as shown in FIG. 1B is generated. That is, when the stamper 11 and the support die 13 are disposed to face each other, a gap is generated between the stamper 11 and the support die 13. For example, the space 14 may be a gap of 100 μm or more. Due to this gap, problems occur in the heat transfer surface at the time of injection molding and the fixed surface of the stamper 11. Specifically, when the heat from the heater of the injection molding machine is transferred to the resin material (for example, acrylic resin) for producing the resin molded product, the heat from the heater is less likely to be transmitted to the space 14. . Further, at the time of injection molding, the stamper 11 moves relative to the support mold 13 and it is difficult to maintain the shape of the mold.

  Referring back to FIG. 1A, in the present embodiment, in order to fill the space 14, the stamper 11 and the support mold 13 are joined using a brazing material, and this is characterized in this point. The brazing material is, for example, a low melting brazing material containing solder. In the present embodiment, the solder 12 is used as the brazing material. The solder 12 has a high thermal conductivity and is more excellent in heat resistance than an adhesive made of a resin or the like. The brazing material is not limited to the solder 12 and may be a metal having a melting point lower than that of the metal constituting the stamper 11 and the support die 13 and having a melting point higher than the molding temperature at the time of injection molding. Further, as the solder 12, for example, a Sn-Ag-Cu-based solder may be used. The melting point of the Sn—Ag—Cu-based solder is about 220 ° C. On the other hand, the temperature applied to the non-planar mold 10 at the time of injection molding is about 150 ° C. as an example although it depends on the resin material of the resin molded product. Therefore, it can suppress that the solder 12 fuses at the time of injection molding by using a Sn-Ag-Cu type | system | group solder. Thereby, the non-planar mold 10 can hold its shape. Specifically, movement of the stamper 11 with respect to the support mold 13 at the time of injection molding can be suppressed. The solder 12 is not limited to the Sn—Ag—Cu-based solder, and may be appropriately determined depending on the melting point of the resin material and the like.

  As shown in FIG. 1A, the bonding by the solder 12 has better thermal conductivity than the bonding by an adhesive or the like. Therefore, compared with the case where it joins with an adhesive agent etc., the molding time at the time of injection molding can be shortened. That is, it leads to the improvement of productivity of a resin molded product. Further, since bonding is performed by metal bonding using the solder 12, the stamper 11 and the support die 13 can be strongly bonded. Therefore, it is possible to suppress peeling of the stamper 11 from the support mold 13 when post-processing such as cutting is performed after the stamper 11 and the support mold 13 are joined. Further, the solder 12 can be joined at a lower temperature than other metal junctions, and suppresses the joint stress between the stamper 11 and the support die 13 or the change in shape of the non-planar die 10 be able to. In particular, it is effective when the bonding area is large. Here, the bonding area is an area when the non-planar mold 10 is viewed in plan, and is, for example, an area of 200 mm × 300 mm or more.

  As described above, the non-planar mold 10 has a structure in which the support mold 13, the solder 12 and the stamper 11 are in contact in this order and stacked. The solder 12 is disposed between the stamper 11 and the support mold 13 so that the space 14 shown in FIG. 1B is not substantially formed. The fact that the space 14 is not substantially formed means that the heat transfer surface and the fixing surface may include a gap that has substantially no influence.

[2. Manufacturing method of resin molded product]
Next, a method of manufacturing a resin molded product will be described with reference to FIGS. 2A to 3C.

  FIG. 2A is a flowchart showing a flow of producing a resin molded product according to the present embodiment.

  As shown to FIG. 2A, the manufacturing method of a resin molded product is the process (S10) which produces the stamper 11 which has a non-planar surface, the process (S20) which produces the non-planar metal mold 10, and the resin molded product by injection molding. Manufacturing step (S30). Each step will be described below. First, step S10 will be described with reference to FIGS. 2B and 3A.

  FIG. 2B is a flowchart showing a flow of producing the stamper 11 according to the present embodiment. FIG. 3A is a cross-sectional view schematically showing the flow of producing the stamper 11 according to the present embodiment.

  As shown in FIG. 2B, in the step of producing the stamper 11 having a non-flat surface, first, a master product having a non-flat surface is produced (S11). The master product is an original plate for producing the stamper 11 for producing a resin molded product, and is formed of, for example, a resin material. The method for producing the master product is not particularly limited. For example, after forming fine irregularities on a flat resin plate, it may be formed by performing vacuum molding or the like on a non-planar mold.

  (A) of FIG. 3A is a figure which shows the shape of the master goods 20. FIG.

  A master article 20 having a non-planar surface as shown in FIG. 3A (a) is produced. When the resin molded product is a light guide plate, the master product 20 is formed to have desired optical characteristics. For example, the master product 20 is formed with fine asperities 20a for the light guide plate to satisfy desired optical characteristics.

  Referring back to FIG. 2B, electroforming is subsequently performed on the master product 20 produced in step S11 (S12). In the electroforming process, for example, after the surface of the master product 20 on which the fine asperities 20a are formed is subjected to a conductive treatment, the electroforming process is performed. In the present embodiment, the electroforming is Ni electroforming using Ni. The metal used for the electroforming process may be appropriately determined according to the hardness required for the surface of the stamper 11 or the like. For example, in the electroforming process, a Ni-Fe alloy, a Ni-Co alloy, Cu or the like may be used other than Ni. The conductive process is, for example, a process of forming a conductive layer (not shown) such as a Ni film on the surface of the master product 20 on which the fine asperities 20a are formed. The method of forming a conductive layer such as a Ni film is not particularly limited.

  (B) of FIG. 3A is a view showing a state in which the electroforming process is performed on the master product 20. As shown to (b) of FIG. 3A, in the electroforming process with respect to the master goods 20 which have a non-plane, a variation arises in the thickness of electroforming. Specifically, the outer peripheral portion or the convex portion is formed thick.

  Referring again to FIG. 2B, subsequently, demolding is performed to remove the master product 20 (S13), and the stamper 11 is manufactured. In addition, the variance of the electroforming thickness formed by the electroforming process remains as the variance of the thickness of the stamper 11.

  (C) of FIG. 3A is a figure which shows the stamper 11 which was dispelled and produced. As shown in (c) of FIG. 3A, in the stamper 11 having a non-flat surface as a whole, thickness variations corresponding to thickness variations of electroforming exist. Further, on the stamper 11, the fine asperities 11a to which the fine asperities 20a formed on the master product 20 are transferred are formed. For example, in the case where the fine unevenness 20a formed on the master product 20 is a recess when the flat portion of the surface on which the fine unevenness 20a is formed is a reference, the fine unevenness 11a formed on the stamper 11 is the stamper 11 Among the surfaces on which the micro-concavities and convexities 11a are formed, the projections are projected from the flat surface when the flat surface is used as a reference. The fine unevenness is not formed on the bonding surface 11 b which is a surface opposite to the surface on which the fine unevenness 11 a is formed and which is joined to the support mold 13. That is, the bonding surface 11 b of the stamper 11 is a flat surface. Further, the surface of the stamper 11 on which the fine asperities 11 a are formed is a surface that comes in contact with the resin material during injection molding.

  Next, step S20 will be described with reference to FIGS. 2C and 3B.

  FIG. 2C is a flowchart showing a flow of producing the non-planar mold 10 according to the present embodiment. FIG. 3B is a cross-sectional view schematically showing a flow of manufacturing the non-flat surface mold 10 according to the present embodiment.

  As shown in FIG. 2C, in the step of producing the non-planar mold 10, a brazing material is applied to the support mold 13 prepared in advance (S21). Specifically, paste-like solder is applied to the support die 13. In other words, in step S21, a solder foil or the like is not used. Applying paste-like solder to the support die 13 is an example of the first step.

  (D) of FIG. 3B is a figure which shows the support metal mold 13 prepared by step S21. FIG. 3B (d) shows an example in which a support mold 13 having a non-planar bonding surface 13a corresponding to the non-planar surface of the stamper 11 is prepared. That is, the bonding surface 13 a of the support die 13 has a shape that follows the non-planar surface of the stamper 11. The support mold 13 is, for example, a backup mold having a predesigned non-planar shape. The support mold 13 prepared in step S 21 may not have a non-flat surface corresponding to the non-flat surface of the stamper 11.

  (E) of FIG. 3B is a figure which shows a mode that the paste-form solder 12a is apply | coated to the support metal mold | die 13. As shown in FIG.

  As shown in (e) of FIG. 3B, the paste-like solder 12 a is applied to the non-planar surface of the support mold 13. That is, in step S21, the paste-like solder 12a is applied to the bonding surface 13a. The paste-like solder 12 a is applied, for example, to the entire non-planar surface (surface on the Z-axis plus side) of the support mold 13. The application method of the paste-like solder 12a is not particularly limited, but may be applied by a method such as printing, or may be applied by another method.

  Referring again to FIG. 2C, after step S21, a step of arranging the support die 13 to which the paste-like solder 12a is applied and the stamper 11 having a non-planar surface to be opposed is performed (S22). Specifically, the stamper 11 is stacked on the support mold 13 to which the paste-like solder 12 a is applied. For example, the paste-like solder 12a and the surface of the stamper 11 on which the fine asperities 11a are not formed are in contact with each other and stacked. The step of arranging the supporting mold 13 and the stamper 11 to face each other is an example of the second step.

  (F) of FIG. 3B is a view showing a state in which the support die 13 to which the paste-like solder 12a is applied and the stamper 11 having a non-planar surface are arranged to face each other. The state in which they are arranged to face each other is a state in which the bonding surface 13a to which the paste-like solder 12a is applied and the surface of the stamper 11 on which the fine asperities 11a are not formed are opposed to each other. The paste-like solder 12a and the stamper 11 are in a state of being directly laminated in this order. For example, the support die 13 and the stamper 11 are not in direct contact with each other.

  Then, after step S22, a step of bonding the support mold 13 and the stamper 11 is performed (S23). In step S23, the paste-like solder 12a is melted by heating, and the support mold 13 and the stamper 11 are joined. By melting the paste-like solder 12a, the paste-like solder 12a becomes a liquid and it becomes easy to fill the space 14 due to the difference in the surface shape of the support die 13 and the stamper 11 as shown in FIG. 1B. That is, the solder can be interposed in the space 14. In addition, the surface tension of the melted paste-like solder 12 a can prevent the applied paste-like solder 12 a from flowing down from the support die 13.

  The applied paste-like solder 12a contains voids due to air entrapment and / or air bubbles generated by the solvent contained in the paste-like solder 12a. By melting the paste-like solder 12a, voids can be easily removed. The step of melting the paste-like solder 12a to join the support die 13 and the stamper 11 is an example of a third step.

  In step S23, the paste-like solder 12a may be melted in a vacuum atmosphere. As a result, the voids contained in the paste-like solder 12a are more easily removed, and the voids contained in the paste-like solder 12a can be further reduced. Thus, the thermal conductivity and strength of the non-planar mold 10 can be improved. In addition, it is not limited to melting paste-like solder 12a in a vacuum atmosphere, You may make it fuse | melt in atmospheric pressure.

  Next, a resin molded product is manufactured using the non-planar mold 10 manufactured by the above method. Specifically, a resin molded product is produced by injection molding. In addition, the process of producing a resin molded product by injection molding using the non-planar mold 10 is an example of a fourth process.

  FIG. 3C is a cross-sectional view schematically showing a flow of producing the resin molded product 50 according to the present embodiment. (G) of FIG. 3C is a figure which shows the mode of resin molding, (h) of FIG. 3C is a figure which shows the resin molded product 50 produced by resin molding. In addition, in (g) of FIG. 3C, although the non-flat surface mold 10 is installed in an injection molding machine and injection molding is performed, illustration of the injection molding machine is abbreviate | omitted.

  As shown in (g) of FIG. 3C, a resin molded product is produced in the space (cavity) formed by the non-planar mold 10 and the lower mold 30 disposed opposite to the non-planar mold 10. A resin material 40 for injection is injected. At this time, heat from the heater of the injection molding machine is transferred to the resin material through the non-planar mold 10. Since the support mold 13 and the stamper 11 are joined by the solder 12, a space 14 is formed between the support mold 13 and the stamper 11, or the support mold 13 and the stamper 11 are made of an adhesive or the like. Thermal conductivity can be improved as compared with the case where they are joined.

  As shown in (h) of FIG. 3C, the fine asperities 50a to which the fine asperities 11a of the stamper 11 are transferred are formed, and a resin molded product 50 having a shape corresponding to the non-planar surface of the stamper 11 is produced. The resin molded product 50 has a shape substantially equal to that of the master product 20.

  Although the example in which the paste-like solder 12a is directly applied to the support die 13 has been described above, in order to improve the bonding between the support die 13 made of an Fe-based material and the solder 12, After the plating process is performed on the surface of the support mold 13, a paste-like solder 12a may be applied.

  FIG. 4: is sectional drawing which shows typically the other example of the flow which produces the non-planar metal mold | die 10 which concerns on this Embodiment.

  FIG. 4D is a schematic view corresponding to FIG. 3B, and shows a support mold 13 having a non-planar surface having a shape corresponding to the non-planar shape of the stamper 11. (I) of FIG. 4 shows a state in which the plating layer 15 is formed on the surface (bonding surface 13 a) of the support die 13 facing the stamper 11. The plating layer 15 is a layer made of a metal having higher bondability with the solder than the Fe-based material. The plating layer 15 is a layer made of a metal such as, for example, Cu, Ni, Au, Ag or the like. Further, among these metals, Cu or Ni may be used from the viewpoint of reducing the cost. That is, the supporting mold 13 may have a Cu plating layer or a Ni plating layer as the plating layer 15 on the surface facing the stamper 11. The method of plating treatment is not particularly limited.

  (E) of FIG. 4 is a schematic diagram corresponding to (e) of FIG. 3B, and shows a state in which paste-like solder 12a is applied. As shown to (e) of FIG. 4, the paste-form solder 12a is laminated | stacked and apply | coated on the plating layer 15. As shown in FIG. In other words, the plating layer 15 is disposed between the support die 13 and the paste-like solder 12a and in contact with both. When the plating layer 15 is formed, the paste-like solder 12a and the support die 13 may not be in direct contact with each other.

[3. effect]
As described above, the non-flat surface mold 10 according to the present embodiment includes the stamper 11 having the non-flat surface, the support mold 13 having the bonding surface 13 a joined to the stamper 11, the stamper 11 and the support mold 13. And a solder 12 for joining the two. Then, in a state where the stamper 11 and the support die 13 are disposed to face each other, a space 14 is formed between the non-planar surface and the joint surface 13 a due to the difference in the shape of each other. There is.

  Thus, the stamper 11 having a non-planar surface and the support mold 13 can be metal-joined by the solder 12, and the surface shape of the stamper 11 and the support mold 13 (specifically, the bonding surface 11 b of the stamper 11 and the support metal The space 14 generated due to the difference in the shape of the bonding surface 13 a of the mold 13 can be filled with the solder 12. Therefore, even when the space 14 is formed between the stamper 11 and the support mold 13, the non-flat mold 10 provided with the stamper 11 having the non-flat surface can be realized. For example, a non-planar mold 10 having high thermal conductivity and attachment strength is realized as compared to a non-flat mold having a space 14 or a non-flat mold in which the stamper 11 and the support mold 13 are joined by an adhesive or the like. can do.

  The bonding surface 13 a of the support die 13 has a non-flat surface corresponding to the non-flat surface of the stamper 11.

  Thereby, the space 14 generated due to the difference in the surface shape between the stamper 11 and the support mold 13 can be made smaller. In this case, although the space 14 is formed mainly by the thickness variation of the stamper 11, the space 14 is filled with the solder 12. Therefore, even when thickness variations occur in the stamper 11, it is possible to realize the non-planar mold 10 provided with the stamper 11 having the non-planar surface.

  Further, the stamper 11 contains at least one of Ni and a Ni alloy, and the support mold 13 contains at least one of Fe and an Fe alloy.

  Thus, since the stamper 11 and the support die 13 are formed of materials having similar linear expansion coefficients, the residual stress generated between the stamper 11 and the support die 13 can be reduced. In addition, Ni, Ni alloy, Fe and Fe alloys have high hardness. Therefore, it is possible to realize the non-planar mold 10 with an improved life.

  The brazing material is solder 12.

  As a result, the stamper 11 and the support die 13 can be joined by the solder 12 whose melting point is lower than that of other brazing materials and whose melting point is higher than the molding temperature at the time of resin molding. Therefore, since the temperature at the time of joining of the stamper 11 and the support die 13 can be lowered, the residual stress generated between the stamper 11 and the support die 13 at the time of joining can be reduced. Therefore, it is possible to realize the non-flat surface mold 10 whose life is further improved.

  Further, the support mold 13 has a Cu plating layer or a Ni plating layer on the surface facing the stamper 11.

  Thereby, the bondability between the support die 13 and the solder 12 can be improved.

  Further, the stamper 11 has fine asperities on the surface on the side not facing the support die 13.

  Thus, by injection molding using the non-planar mold 10, it is possible to produce a resin molded product to which the shape of the fine asperities 11a is transferred. For example, the non-planar mold 10 can be used for a mold for producing a resin molded product having a non-planar surface that is at least partially curved.

  Further, as described above, in the method of manufacturing the non-flat surface mold 10 according to the present embodiment, the step (S21) of applying the paste-like solder 12a to the surface (bonding surface 13a) of the support mold 13; A step (S22) of arranging the non-planar surface of the support die 13 to which the solder 12a is applied and the stamper 11 to face each other, and heating and melting the paste solder 12a to support the support die 13 and the stamper 11 And bonding (S23).

  Thus, even when the space 14 is formed between the stamper 11 and the support mold 13 due to the difference in the surface shapes of the stamper 11 and the support mold 13, the non-planar mold 10 is provided with the stamper 11 having a nonplanar surface. Can be realized.

  In the bonding step, the paste-like solder 12a is melted in a vacuum atmosphere.

  Thereby, since the void contained in the paste-like solder 12a can be reduced, it is possible to suppress the decrease in the thermal conductivity and the strength due to the void.

  In the application step, paste solder 12a is applied as a brazing material.

  Thereby, the space 14 formed by the difference in the surface shape of the stamper 11 and the support die 13 can be easily filled with the paste-like solder 12 a. In addition, since the bonding temperature at the time of bonding the stamper 11 and the support mold 13 can be lowered, it is possible to realize the non-flat mold 10 with an improved life.

  In addition, as described above, the method of manufacturing the resin molded product 50 according to the present embodiment uses the non-planar mold 10 described above or the non-planar mold 10 manufactured by the above method. The process of producing a resin molded product by resin molding is included.

  Thereby, the resin molded product 50 which has a non-planar surface can be produced. When the stamper 11 has the fine asperities 11a, the resin molded product 50 to which the fine asperities 11a are transferred can be manufactured.

(Other embodiments)
Although the non-planar mold, the non-planar mold manufacturing method, and the resin molded article manufacturing method have been described based on the embodiment, the present invention is not limited to this embodiment. . Unless it deviates from the main point of the present invention, a form constructed by combining various modifications that can be conceived by a person skilled in the art to the present embodiment and components in different embodiments is also included in the scope of the present invention.

  For example, although the stamper 11 has a curved surface as a non-planar surface in the above embodiment, the non-planar shape is not limited to this. For example, as shown in FIG. 5, at least a part of the stamper 111 may be formed in an angular shape such as a stepped shape, or may be another shape. Although FIG. 5 shows an example in which the fine asperities 111a are formed on the stamper 111, the fine asperities 111a may not be formed.

  Moreover, although the said embodiment demonstrated the example which joins the stamper 11 and the support metal mold 13 with the solder 12, it is not limited to this.

  Moreover, although the said embodiment demonstrated the example with which the support mold 13 was produced previously, it is not limited to this. For example, after producing the stamper 11, the shape of the stamper 11 (specifically, the shape of the surface on which the fine unevenness 11a is not formed) is measured using a non-contact 3D scanner or the like, and the measured data is used The support mold 13 may be manufactured. Thereby, the space 14 formed between the stamper 11 and the support die 13 can be reduced.

  Further, in the above embodiment, the fine asperities 11a of the stamper 11 are the asperities for the resin molded product to have the desired optical characteristics, but the fine asperities 11a are not the asperities for obtaining the desired optical characteristics. May be For example, the fine asperities 11a of the stamper 11 may be asperities for providing the resin molded product with desired water repellency. The depth (the depth defined by the top and the valley) of the fine asperity 11a having the water repellent function is, for example, 20 μm or less, and the distance between the adjacent tops is, for example, 20 μm or less. The shape of the fine asperities 11a is not limited to the above, and may be appropriately determined according to the desired water repellency.

  Moreover, each process in the manufacturing method of the resin molded product demonstrated by the said embodiment may be implemented in one process, and may be implemented in a separate process. Note that to be performed in one step means that each step is performed using one device, each step is performed sequentially, or that each step is performed in the same place. It is. Also, separate steps may be performed using different devices, each step may be performed at different times (eg, different days), or each step may be performed at different places. It is an intention to include.

10 Non-planar mold 11, 111 Stamper 11a Fine asperity (concave and convex portion)
12 Solder (Brazed material)
12a Solder paste (brazing material)
13 support die 13a bonding surface 14 space 15 plating layer (Cu plating layer, Ni plating layer)
50 resin molded products

Claims (10)

A stamper having a non-planar surface;
A supporting mold having a bonding surface to be bonded to the stamper;
And a brazing material for joining the stamper and the support mold,
In the state where the stamper and the support die are disposed to face each other, a space is formed between the non-planar surface and the bonding surface due to the difference in the shape of each other,
The brazing material intervenes in the space,
Non-planar mold. The bonding surface of the support mold has a non-planar surface corresponding to the non-planar surface of the stamper,
The non-planar mold according to claim 1. The stamper includes at least one of Ni and a Ni alloy,
The support mold contains at least one of Fe and Fe alloy,
The non-planar mold according to claim 1 or 2. The brazing material is a solder material,
The non-planar mold according to any one of claims 1 to 3. The support mold has a Cu plating layer or a Ni plating layer on the surface facing the stamper,
The non-planar mold according to any one of claims 1 to 4. The stamper has an uneven portion on the side not facing the support die.
The non-planar mold according to any one of claims 1 to 5. A first step of applying a brazing material to the surface of the support mold;
A second step of arranging the non-planar surface of the stamper to face the support mold to which the brazing material has been applied in the first step;
And a third step of bonding the supporting mold and the stamper by heating and melting the brazing material.
Non-planar mold manufacturing method. In the third step, the brazing material is melted in a vacuum atmosphere,
The manufacturing method of the non-flat surface mold of Claim 7. In the first step, paste-like solder is applied as the brazing material.
The manufacturing method of the non-planar mold of Claim 7 or 8. The nonplanar mold according to any one of claims 1 to 6 or the nonplanar mold produced by the method for manufacturing a nonplanar mold according to any one of claims 7 to 9 And a fourth step of producing a resin molded product by resin molding,
Method of producing a resin molded article.

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