JP2019058994A - Manufacturing method of workpiece carrier and widening member for polishing of workpiece carrier - Google Patents

Abstract

To provide a manufacturing method of a workpiece carrier which can uniformize a thickness in a workpiece carrier face with high precision.SOLUTION: A manufacturing method of a workpiece carrier, which adjusts a thickness by polishing a carrier substrate with a workpiece holding hole or the like formed thereon includes: a process of piercing an opening part such as the workpiece holding hole on the carrier substrate (a step S1); a process of arranging a widening member on an inner peripheral surface side of the opening part of a narrow portion, of which a width is relatively reduced, among a remaining area of the carrier substrate remained around the opening part (a step S2); and a process of polishing the carrier substrate in a state that the widening member is closely adhered to the inner peripheral surface of the opening in a position opposite to the narrow portion (a step S3).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of manufacturing a work carrier used for holding a work when a thin plate-like work such as a silicon wafer, glass, ceramic, or quartz is polished by a polishing apparatus, and a member for polishing a work carrier. It is.

  It is known to use a work carrier having an opening for holding a work when polishing both sides or one side of a work such as a silicon wafer with a polishing apparatus (see, for example, Patent Document 1).

  Patent Document 1 discloses that, at the time of manufacturing a work carrier, a steel plate serving as a carrier substrate is opened by laser cutting or the like, and planarization and thickness adjustment are performed by performing polishing processing such as lapping and polishing. It is done.

JP, 2004-148497, A

  However, when the polishing process disclosed in Patent Document 1 is performed, the thickness of the carrier substrate is wide at other locations where the outer edge of the work carrier is close to the opening and the location where the width is narrow or where the apertures are close. The inventor of the present application has found that the thickness is smaller than the thickness of the carrier substrate at the location. That is, in the conventional polishing process, it has been found that the thickness within the work carrier surface is not constant, and the thickness varies.

  Therefore, an object of the present invention is to provide a method for manufacturing a work carrier capable of making the thickness in the surface of a work carrier uniform with high accuracy, and a polishing widening member for a work carrier.

  In order to achieve the above object, a method of manufacturing a work carrier according to the present invention is a method of manufacturing a work carrier in which the thickness is adjusted by polishing a carrier substrate on which an opening is formed, the opening in the carrier substrate Drilling a hole, and providing a widening member on the inner circumferential surface side of the opening at a narrow portion where the width becomes relatively narrow among the remaining area of the carrier substrate left around the opening; And polishing the carrier substrate in a state in which the widening member is in close contact with the inner peripheral surface of the opening at a position facing the narrow portion.

Here, the opening may be at least one of a work holding hole and an abrasive supply hole. Further, the widening member may be configured to go around along the inner circumferential surface of the opening. On the other hand, the widening member may be partially provided centering on a position facing the narrowing point.
Further, the outer peripheral surface of the wide-width member may be formed with a convex portion or a concave portion fitted to a concave portion or a convex portion formed on the inner peripheral surface of the opening.

Then, the invention of the polishing wide member for polishing a work carrier is a polishing wide member for polishing of a work carrier installed along the inner circumferential surface of a carrier substrate in which an opening is formed, wherein the inner circumferential surface of the opening is It is characterized in that it is formed on the outer peripheral surface along with it.
Here, a convex portion or a concave portion fitted to the concave portion or the convex portion on the inner circumferential surface of the opening may be formed on the outer circumferential surface.

  In the method of manufacturing a work carrier according to the present invention configured as described above, the remaining area of the carrier substrate left around the opening such as the work holding hole or the polishing agent supply hole before proceeding to the polishing step of the carrier substrate. In the above, the widening member is provided on the inner peripheral surface side of the opening of the narrowing part where the width becomes relatively narrow.

  Therefore, the narrow portion of the carrier substrate is in a state of being reinforced by the widening member, and the narrow portion is prevented from being excessively polished, and the thickness within the work carrier surface can be made uniform with high accuracy. .

  The widening member can be formed to go around along the inner circumferential surface of the opening as well as at a position facing the narrowing point. Also, the widening member can be partially provided centering on the position facing the narrowing point.

  Furthermore, if a projection or recess fitted to a recess or a projection formed on the inner peripheral surface of the opening such as the work holding hole is formed on the outer peripheral surface of the wide-width member, the width increasing member Can be prevented from shifting from the position facing the narrow spot.

  Further, in the invention of the polishing spread member of the work carrier, the narrow portion of the carrier substrate can be easily reinforced only by forming it on the outer peripheral surface along the inner peripheral surface of the opening of the carrier substrate. Furthermore, by providing a convex portion or a concave portion that can be fitted to the dropout preventing unevenness of the resin insert portion attached in order to prevent damage during polishing of the work, rotation relative to the carrier substrate is prevented. be able to.

It is a flowchart explaining the process of the manufacturing method of the work carrier of this embodiment. It is a top view explaining the composition of a work career. It is a top view explaining the composition of the work career with which the ring widening material was equipped. It is the figure which showed the result of having compared the difference in thickness by the place of work carrier by the existence of ring widening material. It is a top view explaining an example of the work carrier with which the ring widening material of Example 1 was equipped. It is a top view explaining another example of the work carrier with which the ring widening material of Example 1 was equipped. FIG. 10 is a plan view illustrating the configuration of a work carrier of Example 2; It is a top view explaining the structure of the work carrier with which the fitting widening material of Example 2 was mounted | worn. It is a top view explaining the composition of the work career with which the eccentric ring material of Example 3 was equipped. It is a top view explaining the composition of the work career with which the crescent material of Example 4 was equipped. It is a top view explaining the structure of the work carrier with which the crescent material of Example 4 was mounted | worn.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a flow chart for explaining steps of a method of manufacturing the work carrier 10 of the present embodiment. FIG. 2A is a plan view for explaining the configuration of the work carrier 10.

  The work carrier 10 is used by being attached to a planar polishing apparatus that polishes both sides or one side of a thin plate-like work. For example, a planar polishing apparatus for polishing both sides of a work includes an upper platen and a lower platen, which is a platen, a sun gear disposed at the center of the upper platen and the lower platen, and an outer periphery of the upper platen and a lower platen. It has an internal gear arranged on the side. The upper surface plate, lower surface plate, sun gear and internal gear are each rotatable.

Then, the work carrier 10 as shown in FIG. 2A is disposed between the upper surface plate and the lower surface plate of the planar polishing apparatus.
The work carrier 10 has a disk-shaped main body formed by the carrier substrate 1. In the carrier substrate 1, for example, openings such as a circular work holding hole 2, an abrasive supply hole 12, and an abrasive discharge hole are bored. Although not shown, a resin insert portion is provided along the inner circumferential surface 21 of the work holding hole 2 as necessary.

  The work carrier 10 is provided with a tooth portion which meshes with a sun gear and an internal gear at an outer portion 11 which becomes an outer edge, and rotates and revolves by the rotation of the sun gear and the internal gear. Then, as the work carrier 10 rotates and revolves, both sides of the work disposed in the work holding hole 2 of the work carrier 10 are polished by the upper surface plate and the lower surface plate.

  The carrier substrate 1 is cut into a disk shape from a metal plate, a resin plate, a ceramic or the like. As the metal plate, stainless steel (SUS), high carbon chromium bearing steel, carbon tool steel (SK steel), high speed tool steel, alloy tool steel, high tensile steel, titanium and the like can be used. Further, as the resin plate, polyamide (PA), polyacetal (POM), polyvinyl chloride (PVC), polycarbonate (PC), polyimide (PI), polyamide imide (PAI), epoxy (EP) or the like can be used.

Next, a method of manufacturing the work carrier 10 of the present embodiment will be described with reference to FIG.
First, in step S 1, a circular work holding hole 2, an abrasive supply hole 12 and the like are provided in the carrier substrate 1 by cutting (piercing process). For example, a laser cutting machine can be used for this cutting process. The cutting process can also be performed by water jet process, wire process or the like.

  Subsequently, in step S2 (a widening member arranging step), the ring widening member 3 as a widening member is disposed inside at least one of the perforated work holding hole 2 and the abrasive supply hole 12. Here, as shown to FIG. 2B, the example which arrange | positions the ring widening material 3 inside the workpiece holding hole 2 is shown. Here, the remaining area of the carrier substrate 1 left around the workpiece holding hole 2 will be described with reference to FIG. 2A.

  For example, the remaining portion A, which is a remaining region, is a narrow portion having a narrow width in which the work holding hole 2 is close to the outer shape portion 11 of the work carrier 10. The remaining place A is a place where the width is relatively narrow compared to the other remaining places B-G.

  Therefore, in order to reinforce a narrowing place such as the remaining place A, the ring widening member 3 is disposed at least at a position facing it. The ring widening member 3 is annularly formed of the same material as the carrier substrate 1. That is, the ring widening member 3 is formed with a circular outer circumferential surface 31 having a diameter slightly smaller than the inner circumferential surface 21 of the work holding hole 2 and a ring of equal width whose inside is circularly opened concentrically with the outer circumferential surface 31. Formed in the shape of The material of the ring widening member 3 may be selected from materials different from that of the carrier substrate 1 as appropriate depending on the thickness of the carrier substrate 1 and the degree of variation.

  The ring widening member 3 is mounted in a state where the outer circumferential surface 31 is in close contact with the inner circumferential surface 21 of the workpiece holding hole 2. As a result, the ring widening material 3 is provided and reinforced at the position opposite to the remaining place A which is the narrowing place. Here, since the ring widening member 3 has the same width, all around the workpiece holding hole 2 (entire circumference) including not only the position facing the remaining portion A but also the narrow portion adjacent to the abrasive supply hole 12 Will be reinforced.

  Then, in step S3 (polishing step), lapping and polishing for adjusting the thickness, flatness, and parallelism of the carrier substrate 1 are performed. In this polishing step, only lapping, only polishing, or both may be selected as needed. The lapping process and the polishing process are performed in a state where the ring widening material 3 is attached to the work holding hole 2.

  The ring widening material 3 used in the polishing process is removed after the polishing process (step S4 (widening member removing process)). A resin insert portion is annularly provided on the inner circumferential surface 21 of the work holding hole 2 from which the ring widening material 3 has been removed, as necessary.

Next, the operation of the method of manufacturing the work carrier 10 of the present embodiment will be described.
In the method of manufacturing the work carrier 10 of the present embodiment configured as described above, the outer peripheral surface 31 is in close contact with the inner peripheral surface 21 of the workpiece holding hole 2 before proceeding to the polishing step of the carrier substrate 1 (step S3). The ring widening member 3 is attached as follows.

  Here, the difference in thickness depending on the location (remaining place AG (see FIG. 2A)) of the work carrier 10 after the polishing step will be described with reference to FIG. .

  First, when lapping and polishing are performed according to the conventional method in which the widening member is not attached to the workpiece holding hole 2 (case of “none” in FIG. 3), the thickness of the remaining place A which is the narrowest place is extremely extreme. It is getting thinner. Further, the thickness of the carrier substrate 1 is relatively thin also at the places near the work holding holes 2 such as the remaining places E, F, G and the like. It is considered that this is because the width of the remaining portion A is narrow, so the strength is weak and the stress at the time of processing tends to be concentrated.

  On the other hand, when the ring widening material 3 is attached to the work holding hole 2 (case of "presence" in FIG. 3), the thickness of the remaining place A is not extremely thin compared to the other. Further, also at the remaining places E, F and G, the thickness of the carrier substrate 1 approaches the relatively thick remaining places B, C and D.

  This result can be explained by “variation in thickness”. In the case where the ring widening material 3 is “none”, the thickness variation becomes about 2.0 μm, while the ring widening material 3 is attached. In the case of “yes”, the variation in thickness was greatly improved to about 0.8 μm.

  That is, in the remaining area of the carrier substrate 1 left around the work holding hole 2, the inner circumferential surface 21 side of the work holding hole 2 of the narrow portion (remaining place A etc.) where the width becomes relatively narrow is Reinforcement with the ring widening material 3 prevents the narrowing point from being excessively polished, and the thickness within the surface of the work carrier 10 can be made uniform with high accuracy.

  The reinforcement by the ring widening member 3 is formed not only at a position facing the remaining portion A which is a narrow portion but also along the inner peripheral surface 21 of the workpiece holding hole 2, so the workpiece holding hole 2 is formed. Over the entire circumference of the metal, it can be prevented from being excessively polished from other places.

  Hereinafter, Example 1 of a form different from work carrier 10 explained by the embodiment is explained, referring to Drawing 4A and Drawing 4B. The same or equivalent parts as the contents described in the above embodiment will be described using the same terms or the same reference numerals.

  In the embodiment, the work carrier 10 in which only one work holding hole 2 is bored has been described, but in the present embodiment, the work carrier 10A provided with four work holding holes 2A,. This will be described with reference to FIG. 4A.

  In the work carrier 10A, a disc-shaped main body is formed by a metal carrier substrate 1A. In the carrier substrate 1A, four circular workpiece holding holes 2A,..., Abrasives supply holes 12A,.

When the plurality of workpiece holding holes 2A,... And the polishing agent supply holes 12A,... Are bored in this way, not only the portion where the workpiece holding hole 2A approaches the outer portion 11A of the workpiece carrier 10A but also the workpiece Even places where the holding holes 2A and 2A are adjacent and places where the workpiece holding hole 2A and the abrasive supply hole 12A are adjacent may become narrow places having a narrow width.
Therefore, in order to reinforce a plurality of narrow points generated, the ring widening member 3A serving as the widening member is disposed in each of the work holding holes 2A. Further, although not shown, a ring widening member to be a widening member can be disposed also in the polishing agent supply hole 12A.

Subsequently, a work carrier 10B provided with a large number of work holding holes 2B,... Will be described with reference to FIG. 4B.
In the work carrier 10B, a disc-shaped main body is formed by a metal carrier substrate 1B. A large number of circular work holding holes 2B,... And an abrasive supply hole 12B are bored in the carrier substrate 1B.

Even when a large number of workpiece holding holes 2B,... Are bored as described above, not only the portion where the workpiece holding hole 2B is in proximity to the outer portion 11B of the workpiece carrier 10B but also a plurality of workpiece holding holes 2B,. There may be a narrow place where the width is narrow even at the place where the
Therefore, in order to reinforce a large number of narrow spots, a ring widening member 3B serving as a widening member is disposed in each work holding hole 2B.

As described above, even when a plurality of narrow portions occur in the carrier substrates 1A and 1B, the narrow portions can be excessively polished by attaching the ring widening members 3A and 3B to the work holding holes 2A and 2B and reinforcing them. Can be prevented, and the thickness in the surface of the work carrier 10A, 10B can be made uniform with high accuracy.
The other configurations and operational effects of the first embodiment are substantially the same as those of the embodiment or the other embodiments, and therefore the description thereof is omitted.

  Hereinafter, a second embodiment different from the work carriers 10, 10A and 10B described in the above embodiment and the first embodiment will be described with reference to FIGS. 5A and 5B. The same or equivalent parts as the contents described in the above embodiment or example 1 will be described using the same terms or the same reference numerals.

  In the second embodiment, the work carrier 40 in which the concave portion 52 and the convex portion are provided on the inner circumferential surface 51 of the workpiece holding hole 5 in order to improve the integrity with the resin insert portion will be described.

  As shown in FIG. 5A, in the work carrier 40, a disc-shaped main body is formed by a metal carrier substrate 4. A circular work holding hole 5 and an abrasive supply hole 42,... Are bored in the carrier substrate 4. The workpiece holding hole 5 is provided in proximity to the outer portion 41 of the carrier substrate 4.

  Here, the resin insert portion provided along the inner circumferential surface 51 of the workpiece holding hole 5 is molded of a synthetic resin material which is different in material from the carrier substrate 4 which is a metal plate. Synthetic resin materials include resins such as polyamide (PA), polyacetal (POM), polyimide (PI), polyvinyl chloride (PVC), polyamide imide (PAI), polycarbonate (PC), epoxy (EP), and glass epoxy And fiber-reinforced plastics such as cloth bake are used. In the case where the resin insert portion is provided by injection molding, a thermoplastic resin is used. Furthermore, when providing a resin insert part by thermocompression bonding, a thermosetting resin is used.

  Then, in order to prevent the resin insert portion which is different in material from the carrier substrate 4 from falling off or coming off, for example, the plurality of recessed portions 52 are intermittently spaced in the circumferential direction on the inner peripheral surface 51 of the work holding hole 5.・ Is provided. In addition, the form in which the unevenness | corrugation is continuously formed in the circumferential direction may be sufficient as the recessed part or convex part for improving integration with the resin insert part. Moreover, the recessed part or convex part may be formed in planar view trapezoid shape (wedge shape).

  Then, also in the work carrier 40, as shown in FIG. 5B, the fitting widening member 6 as a widening member for reinforcing the narrow portion is disposed before the polishing step. The fitting widening member 6 is annularly formed of, for example, the same metal plate as the carrier substrate 4. Furthermore, on the outer peripheral surface 61 of the fitting widening material 6, a plurality of convex portions 62, ... are provided at intervals in the circumferential direction.

  The convex portions 62,... Of the fitting widening member 6 are formed in positions and shapes to be fitted to the concave portions 52,. The fitting widening member 6 is mounted in a state where the outer circumferential surface 61 is in close contact with the inner circumferential surface 51 of the workpiece holding hole 5.

With the outer circumferential surface 61 of the fitting widening member 6 in close contact with the inner circumferential surface 51 of the work holding hole 5, the convex portions 62, ... of the fitting widening member 6 in the concave portions 52, ... of the work holding hole 5 When fitted, the circumferential movement (rotation) of the fitting widening member 6 is restricted. That is, even during the polishing process, relative rotation of the fitting widening member 6 with respect to the carrier substrate 4 can be prevented.
The other configurations and operational effects of the second embodiment are substantially the same as those of the above embodiment or the other embodiments, and therefore the description thereof is omitted.

  Hereinafter, a third embodiment different from the work carrier 40 described in the second embodiment will be described with reference to FIG. The same or equivalent parts as the contents described in the above embodiment or Examples 1 and 2 will be described using the same terms or the same reference numerals.

  In the work carrier 40A of the third embodiment, a disc-shaped main body is formed by a metal carrier substrate 4A. In the carrier substrate 4A, a circular work holding hole 5A, an abrasive supply hole 42A, and so on are bored. The workpiece holding hole 5A is provided in proximity to the outer portion 41A of the carrier substrate 4A. Further, the workpiece holding hole 5A and the polishing agent supply hole 42A are in close proximity to each other.

  The eccentric ring member 7 as a widening member mounted in the work holding hole 5A of the third embodiment is formed annularly by the same metal plate as the carrier substrate 4A. However, unlike the annular fitting widening material 6 of equal width described in the second embodiment, the eccentric ring material 7 has a configuration in which the width is different (changes) in the circumferential direction.

  That is, in the eccentric ring member 7, the center of the circle serving as the eccentric opening 73 is located at a position different from the center of the circle forming the outer peripheral surface 71. In the example shown in FIG. 6, the width of the eccentric ring member 7 is wide at a position facing the narrow portion close to the outer portion 41A, and the width is narrow at the abrasive supply hole 42A side.

  Further, on the outer peripheral surface 71 of the eccentric ring member 7, convex portions 72,... Are formed at positions and shapes fitted with the concave portions 52,. The outer peripheral surface 71 of the eccentric ring member 7 is in close contact with the inner peripheral surface 51 of the workpiece holding hole 5A, and the convex portions 72, ... of the eccentric ring member 7 are fitted in the concave portions 52, ... of the workpiece holding hole 5A. Then, movement of the eccentric ring member 7 in the circumferential direction is restricted.

In the case of the manufacturing method of the work carrier 40A of Example 3 and the eccentric ring member 7 configured in this way, the convex portions 72, ... of the outer peripheral surface 71 of the eccentric ring member 7 are the inner peripheral surface of the work holding hole 5A. Recesses 52,... Formed in 51 are fitted. For this reason, in the polishing process, it is possible to prevent the widest part of the eccentric ring member 7 from shifting from the position facing the narrow part adjacent to the narrowest outer portion 41A of the carrier substrate 4A.
The other configurations and operational effects of the third embodiment are substantially the same as those of the embodiment or the other embodiments, and therefore the description thereof is omitted.

  Hereinafter, a fourth embodiment different from the work carrier 40A described in the third embodiment will be described with reference to FIGS. The same or equivalent parts as the contents described in the above embodiment or Example 1-3 will be described using the same terms or the same reference numerals.

  In the third embodiment, the eccentric ring member 7 whose width changes in the circumferential direction of the workpiece holding hole 5A has been described. However, in the fourth embodiment, it is used as a widening member provided partially around the position facing the narrowing point. The crescent moon material 8 will be described.

  As shown in FIG. 7, in the work carrier 40B, a disc-shaped main body is formed by a metal carrier substrate 4B. In the carrier substrate 4B, a circular work holding hole 5B, an abrasive supply hole 42B, and so on are bored. The workpiece holding hole 5B is provided in proximity to the outer portion 41B of the carrier substrate 4B.

  And crescent moon material 8 is provided in the position which counters the narrow part which approached external part 41B. On the outer circumferential surface 81 of the crescent material 8 in an arc shape in plan view, convex portions 82, 82 are formed at positions and shapes that fit with the two concave portions 52, 52 of the workpiece holding hole 5B.

  When the outer peripheral surface 81 of the crescent material 8 is brought into close contact with the inner peripheral surface 51 of the workpiece holding hole 5B, and the convex portions 82, 82 of the crescent material 8 are fitted into the concave portions 52, 52 of the workpiece holding hole 5B, the crescent material 8 The circumferential movement of will be restricted. That is, although the crescent material 8 is not continuous so as to rotate in the circumferential direction, it is possible that the crescent material 8 is rotated (displaced) relative to the carrier substrate 4B even during polishing due to the fitting thereof. It can prevent.

  On the other hand, in the work carrier 40C shown in FIG. 8, a disc-shaped main body is formed by a metal carrier substrate 4C. In the carrier substrate 4C, a circular work holding hole 5C, an abrasive supply hole 42C, and so on are bored. The workpiece holding hole 5C is provided in proximity to the outer portion 41C of the carrier substrate 4C. In addition, a part of the polishing agent supply holes 42C and 42C is provided at a position close to the workpiece holding hole 5C.

  The crescent material 9 as a widening member is provided up to the positions of the abrasive supply holes 42C and 42C close to both sides, centering on the position facing the narrow portion close to the outer portion 41C. The convex portions 92,... Are formed on the outer circumferential surface 91 of the crescent material 9 in a semicircular shape in a plan view at positions and shapes fitted with the concave portions 52,.

As described above, when the crescent material 8 or the crescent material 9 serving as the widening member is partially provided centering on the position facing the narrowing point, the usage amount of the widening member can be reduced. In addition, extra resistance during polishing can be reduced.
The other configurations and operational effects of the fourth embodiment are substantially the same as those of the embodiment or the other embodiments, and therefore the description thereof is omitted.

  Although the embodiments and examples of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to the embodiments and examples, and the scope of the present invention will be within the scope of the present invention. Design changes are included in the present invention.

  For example, in the above embodiment and examples, the case where the workpiece holding holes 2, 2A, 2B, 5, 5A-5C are circular has been described, but the present invention is not limited to this. For example, the present invention can be applied to a workpiece carrier having a rectangular (including square) workpiece holding hole.

  Moreover, in the said embodiment and Example, although the wide member which a part of workpiece | work holding hole 2, 2A, 2B, 5, 5A-5C opened (exposed) was demonstrated, it is not limited to this Alternatively, it may be a widening member that fills all of the workpiece holding holes (for example, a disk shape having the same size as the workpiece holding holes).

  Further, in the above embodiment and examples, the widening members (ring widening members 3, 3A, 3B, fitting widening members 6, eccentric ring members 7, crescent members 8, crescent members 9) are disposed in the work holding hole 2. Although the case has been described, the invention is not limited to this, and the widening member may be disposed also on the abrasive supply holes 12, 12A, 12B, 42, 42A-42C.

  Furthermore, although the said embodiment and Example demonstrated the example which arrange | positions a spreading member to the pierced workpiece holding hole, it is not limited to this. For example, in the case where the carrier substrate is a resin plate, a method of manufacturing a work carrier can also be performed by the following steps.

  First, a first perforation leaving a widening portion so that a narrow portion where the width of the remaining area of the carrier substrate becomes relatively narrow does not occur with respect to the inner circumferential surface position of the opening finally formed in the carrier substrate Carry out the process of In short, a hole smaller than the final opening such as the workpiece holding hole is bored, and a range between the hole and a position to be the inner peripheral surface of the opening is a widening portion. This widening part can be made into the same shape as the ring widening part 3 mentioned above, the eccentric ring material 7, the crescent moon material 8, the crescent material 9 grade | etc.,. Moreover, it may be a disk-shaped widening portion.

  Subsequently, the step of polishing the carrier substrate is performed in a state in which such a widened portion remains. Finally, a second drilling step of removing the widening portion is performed to complete the final openings such as the workpiece holding holes and the abrasive supply holes.

  Even with such a method of manufacturing a work carrier, the polishing process is performed in a state in which the narrow portion of the carrier substrate is reinforced by the widening portion, so the final narrow portion becomes excessive. Polishing is prevented, and the thickness in the work carrier surface can be made uniform with high accuracy.

10, 10A, 10B Work carrier 1, 1A, 1B Carrier substrate 12 Abrasive supply hole (opening)
2, 2A, 2B work holding hole (opening)
21 Inner circumferential surface 3, 3A, 3B Ring widening material (widening member)
31 Outer peripheral surface 40, 40A-40C Work carrier 4, 4A-4C Carrier substrate 42 Abrasive agent supply hole (opening)
5,5A-5C Workpiece holding hole (opening)
51 inner circumferential surface 52 concave portion 6 fitting widening material (widening member)
61 Outer peripheral surface 62 Convex part 7 Eccentric ring material (widening member)
71 outer circumferential surface 72 convex portion 8 crescent material (widening member)
81 Outer circumferential surface 82 convex portion 9 crescent material (widening member)
91 Outer peripheral surface 92 Convex part AG Remaining place (remaining area)

Claims (7)

A method of manufacturing a work carrier, the thickness of which is adjusted by polishing a carrier substrate in which an opening is formed.
Drilling an opening in the carrier substrate;
Providing a widening member on the inner peripheral surface side of the opening of a narrow portion where the width becomes relatively narrow among the remaining area of the carrier substrate left around the opening;
And a step of polishing the carrier substrate in a state in which the widening member is in close contact with the inner peripheral surface of the opening at a position facing the narrow portion.   The method for manufacturing a work carrier according to claim 1, wherein the opening is at least one of a work holding hole and an abrasive supply hole.   The method for manufacturing a work carrier according to claim 1, wherein the widening member is formed to go around along the inner circumferential surface of the opening.   The method for manufacturing a work carrier according to claim 1 or 2, wherein the widening member is partially provided centering on a position facing the narrowing point.   The convex part or recessed part fitted to the recessed part or convex part formed in the inner peripheral surface of the said opening part is formed in the outer peripheral surface of the said wide member, The 4 or 5 characterized by the above-mentioned. A method of manufacturing a work carrier according to item 1. A polishing wide member for polishing a work carrier installed along the inner circumferential surface of a carrier substrate having an opening formed therein,
A polishing wide member for a work carrier, which is formed on an outer peripheral surface along an inner peripheral surface of the opening.   The polishing wide member for polishing a work carrier according to claim 6, wherein a convex portion or a concave portion fitted to a concave portion or a convex portion on an inner peripheral surface of the opening portion is formed on the outer peripheral surface.