JP2019050515A - Electronic device - Google Patents

Electronic device Download PDF

Info

Publication number
JP2019050515A
JP2019050515A JP2017174117A JP2017174117A JP2019050515A JP 2019050515 A JP2019050515 A JP 2019050515A JP 2017174117 A JP2017174117 A JP 2017174117A JP 2017174117 A JP2017174117 A JP 2017174117A JP 2019050515 A JP2019050515 A JP 2019050515A
Authority
JP
Japan
Prior art keywords
sound
electronic device
sound path
speaker
top plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017174117A
Other languages
Japanese (ja)
Other versions
JP6874613B2 (en
Inventor
山口 敦
Atsushi Yamaguchi
敦 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2017174117A priority Critical patent/JP6874613B2/en
Publication of JP2019050515A publication Critical patent/JP2019050515A/en
Application granted granted Critical
Publication of JP6874613B2 publication Critical patent/JP6874613B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

To make it difficult for sounds from a speaker to enter a sound path through vibration of a surface member.SOLUTION: An electronic device is disclosed, which comprises: a surface member forming a surface part of the electronic device; a sound hole which opens in the surface part in a first direction; a sound path formed in the electronic device and extending through a range that overlaps with the surface member to a second position in a second direction crossing the first direction when viewed from a first position leading to the sound hole in the first direction; a microphone connected to the sound path through the second position; a speaker provided in the electronic device and attached to the surface member; and a plate-like member provided in the electronic device, opposed to the surface member and spaced apart therefrom in the first direction by a first distance, and forming a wall face on a surface member side in the sound path in the first direction.SELECTED DRAWING: Figure 4

Description

本開示は、電子機器に関する。   The present disclosure relates to an electronic device.

電話機のフリップカバーに音響ガイドを形成し、音響ガイド内の音道における開口位置から所定距離にマイクロフォンを配置する技術が知られている。   There is known a technique of forming an acoustic guide on a flip cover of a telephone and disposing a microphone at a predetermined distance from an opening position in a sound path in the acoustic guide.

特表2000-509922号公報Japanese Patent Publication No. 2000-509922

しかしながら、上記のような従来技術では、スピーカからの音を表面部材(機器表面部を形成する部材)の振動を介して音道に入り難くすることが難しい。スピーカが表面部材に取り付けられると、スピーカからの音に起因して、表面部材が振動し易い。表面部材が振動すると、表面部材に隣接して設けられる音道に音が入り易くなる。音道にスピーカからの音が有意に入ると、音道の奥部に配置されるマイクロフォンで拾われることで、ハウリングやエコーが生じるおそれがある。   However, in the conventional technology as described above, it is difficult to make it difficult for the sound from the speaker to enter the sound path through the vibration of the surface member (the member forming the device surface portion). When the speaker is attached to the surface member, the surface member is likely to vibrate due to the sound from the speaker. When the surface member vibrates, sound tends to enter the sound path provided adjacent to the surface member. If the sound from the speaker significantly enters the sound path, howling and echo may occur due to being picked up by the microphone disposed at the back of the sound path.

そこで、1つの側面では、本発明は、スピーカからの音が表面部材の振動を介して音道に入り難くすることを目的とする。   Therefore, in one aspect, the present invention aims to make it difficult for the sound from the speaker to enter the sound path through the vibration of the surface member.

1つの側面では、電子機器であって、
当該電子機器の表面部を形成する表面部材と、
前記表面部に第1方向に開口する音孔と、
当該電子機器の内部に形成され、前記第1方向に視て前記音孔に重なる第1位置から、前記第1方向に視て前記表面部材に重なって、前記第1方向に交差する第2方向に第2位置まで延在する音道と、
前記第2位置を介して前記音道に接続されるマイクロフォンと、
前記内部に設けられ、前記表面部材に取り付けられるスピーカと、
前記内部に設けられ、前記表面部材に対し前記第1方向で第1距離だけ離れて対向し、前記第1方向で前記音道における前記表面部材側の壁面を形成する板状部材とを含む、電子機器が提供される。
In one aspect, the electronic device is
A surface member forming a surface portion of the electronic device;
A sound hole opened in the first direction in the surface portion;
A second direction formed inside the electronic device and overlapping the sound member from the first position viewed in the first direction and overlapping the sound hole, overlapping the surface member as viewed in the first direction, and intersecting the first direction A sound path extending to the second position,
A microphone connected to the sound path via the second position;
A speaker provided in the interior and attached to the surface member;
A plate-like member provided in the inside and facing the surface member at a first distance away from the first member in the first direction and forming a wall surface on the surface member side of the sound path in the first direction; An electronic device is provided.

1つの側面では、本発明によれば、スピーカからの音が表面部材の振動を介して音道に入り難くすることが可能となる。   In one aspect, according to the present invention, it is possible to make it difficult for the sound from the speaker to enter the sound path through the vibration of the surface member.

一実施例による電子機器を示す概略的な断面図である。FIG. 1 is a schematic cross-sectional view showing an electronic device according to an embodiment. 透視による電子機器の上面図である。It is a top view of electronic equipment by see-through. 電子機器の断面図である。It is a sectional view of electronic equipment. 図3のQ部の拡大図である。It is an enlarged view of the Q section of FIG. 音道構造に関連する構成の分解斜視図である。It is a disassembled perspective view of the structure relevant to a sound path structure. 音の伝達経路の説明図である。It is explanatory drawing of the transmission path of a sound. 比較例の分解斜視図である。It is an exploded perspective view of a comparative example. 比較例で生じる問題点の説明図である。It is explanatory drawing of the problem which arises in a comparative example. スピーカ由来音抑制機能の説明図である。It is explanatory drawing of a speaker origin sound suppression function.

以下、添付図面を参照しながら各実施例について詳細に説明する。   Hereinafter, each example will be described in detail with reference to the attached drawings.

図1は、一実施例による電子機器1を示す概略的な断面図である。図1には、互いに直交する3方向であるX方向、Y方向、及びZ方向が定義されている。Z方向(第1方向の一例)は、電子機器1の厚み方向に対応し、天板部材12の平面に垂直な方向に対応する。X方向は、Z方向に垂直な方向であり、かつ、電子機器1の短手方向に平行である。但し、X方向は、電子機器1の短手方向ではなく長手方向に平行であってもよい。以下では、説明上、Z方向のZ1側を「上側」とし、「上面視」とは、Z1側からZ方向に視たビューを意味する。また、以下で、機器上面部とは、特に言及しない限り、電子機器1における上側の表面を供する部位を表す。また、機器側面部とは、特に言及しない限り、電子機器1における部位であって、Z方向に垂直な方向を法線とする側の表面を供する部位を表す。機器底面部等についても同様である。図2は、透視による電子機器1の上面図である。図3は、X方向の中心を通るYZ平面で切断したときの電子機器1の断面図である。   FIG. 1 is a schematic cross-sectional view showing an electronic device 1 according to an embodiment. In FIG. 1, an X direction, a Y direction, and a Z direction which are three directions orthogonal to one another are defined. The Z direction (an example of a first direction) corresponds to the thickness direction of the electronic device 1 and corresponds to the direction perpendicular to the plane of the top plate member 12. The X direction is a direction perpendicular to the Z direction and parallel to the short direction of the electronic device 1. However, the X direction may be parallel to the longitudinal direction of the electronic device 1 instead of the lateral direction. Hereinafter, for the sake of description, the Z1 side in the Z direction is referred to as “upper side”, and “top view” means a view viewed in the Z direction from the Z1 side. Also, hereinafter, the device upper surface portion indicates a portion providing the upper surface of the electronic device 1 unless otherwise stated. Further, the device side surface portion is a portion in the electronic device 1 unless otherwise stated, and represents a portion providing a surface on the side having a direction perpendicular to the Z direction as a normal. The same applies to the bottom of the device. FIG. 2 is a top view of the electronic device 1 by perspective. FIG. 3 is a cross-sectional view of the electronic device 1 taken along the YZ plane passing through the center in the X direction.

電子機器1は、通信機能を備える端末であり、例えばスマートフォンやタブレット端末機、携帯型ゲーム機等である。電子機器1は、好ましくは、ハンズフリー通話機能を備える。   The electronic device 1 is a terminal having a communication function, and is, for example, a smartphone, a tablet terminal, a portable game machine, or the like. The electronic device 1 preferably has a hands-free call function.

電子機器1は、筐体10と、天板部材12(表面部材の一例)と、マイクロフォン14と、スピーカ16と、音道構造30と、板状部材70(図4参照)とを含む。   The electronic device 1 includes a housing 10, a top plate member 12 (an example of a surface member), a microphone 14, a speaker 16, a sound path structure 30, and a plate member 70 (see FIG. 4).

筐体10は、例えば樹脂により形成される。筐体10は、機器側面部と、機器底面部(機器下面部)とを形成する。筐体10は、更に機器上面部の一部(天板部材12の外周部)を形成してもよい。以下、筐体10内とは、機器側面部、機器底面部、及び機器上面部よりも機器中心側の空間であり、電子機器1の内部(以下、「機器内部」とも称する)と同義である。筐体10内には、図示しない基板や電子部品(マイクロフォン14やスピーカ16等を含む)が搭載される。   The housing 10 is formed of, for example, a resin. The housing 10 forms a device side surface portion and a device bottom surface portion (device bottom surface portion). The housing 10 may further form a part of the upper surface portion of the device (the outer peripheral portion of the top plate member 12). Hereinafter, the inside of the case 10 is a space on the device center side of the device side surface, the device bottom surface, and the device upper surface, and is synonymous with the inside of the electronic device 1 (hereinafter also referred to as “device inside”). . In the housing 10, a substrate and electronic parts (including the microphone 14, the speaker 16 and the like) (not shown) are mounted.

筐体10は、複数の筐体部材から形成されてよい。本実施例では、一例として、筐体10は、機器側面部及び機器上面部の一部(天板部材12の外周部)を形成する側面部材101と、機器底面部を形成する底面部材102とを含む。尚、変形例では、側面部材101と底面部材102は、一体で形成されてもよい。尚、以下では、側面部材101が形成する機器上面部の領域を、「額縁領域」とも称する。額縁領域は、天板部材12の外周に延在し、天板部材12の外周縁から電子機器1の外周縁までの領域に対応する。但し、変形例では、額縁領域が無くされてもよく、天板部材12が電子機器1の外周縁まで延在してもよい。   The housing 10 may be formed of a plurality of housing members. In the present embodiment, as an example, the housing 10 includes a side member 101 that forms an apparatus side surface part and a part of the apparatus top surface (an outer peripheral part of the top plate member 12), and a bottom surface member 102 that forms an equipment bottom surface part. including. In the modification, the side surface member 101 and the bottom surface member 102 may be integrally formed. In addition, below, the area | region of the apparatus upper surface part which the side member 101 forms is also called "frame area | region." The frame region extends to the outer periphery of the top plate member 12 and corresponds to the region from the outer peripheral edge of the top plate member 12 to the outer peripheral edge of the electronic device 1. However, in the modification, the frame area may be eliminated, and the top plate member 12 may extend to the outer peripheral edge of the electronic device 1.

電子機器1は、機器上面部に、上下方向に開口(穿孔)する音孔110を有する。本実施例では、一例として、電子機器1は、機器上面部(天板部材12側の表面部)に音孔110を有する。これは、ユーザが画面に向かっているときの音声認識率や音声伝達効率が高まるためである。   The electronic device 1 has a sound hole 110 which is opened (perforated) in the vertical direction on the upper surface of the device. In the present embodiment, as an example, the electronic device 1 has the sound hole 110 in the device upper surface portion (surface portion on the top plate member 12 side). This is because the speech recognition rate and speech transmission efficiency increase when the user is moving to the screen.

音孔110は、天板部材12に形成されてもよいし、筐体10に形成されてもよいし、筐体10及び天板部材12により協動して形成されてもよい。本実施例では、一例として、音孔110は、図1及び図3に示すように、筐体10及び天板部材12により協動して形成される。具体的には、音孔110のY方向Y1側の縁部は、側面部材101のY方向Y2側の縁部により形成され、音孔110の他の縁部は、天板部材12のY方向Y1側の縁部の切欠き部122(図2参照)により形成される。これにより、額縁領域を狭くして(例えば側面部材101の板厚分に相当する長さまで狭くして)意匠性を高めることができる。但し、変形例では、額縁領域内に音孔110が形成されてもよい。この場合、音孔110は、好ましくは、天板部材12に隣接して設けられる。   The sound hole 110 may be formed in the top plate member 12, may be formed in the housing 10, or may be formed in cooperation with the housing 10 and the top plate member 12. In the present embodiment, as an example, as shown in FIGS. 1 and 3, the sound hole 110 is formed in cooperation with the housing 10 and the top plate member 12. Specifically, the edge on the Y direction Y1 side of the sound hole 110 is formed by the edge on the Y direction Y2 side of the side member 101, and the other edge of the sound hole 110 is in the Y direction of the top plate member 12. It is formed by the notch 122 (refer FIG. 2) of the edge by the side of Y1. Thereby, the designability can be enhanced by narrowing the frame area (eg, narrowing to a length corresponding to the thickness of the side member 101). However, in the modification, the sound hole 110 may be formed in the frame area. In this case, the sound hole 110 is preferably provided adjacent to the top plate member 12.

音孔110の開口形状(上面視の形状)は、任意であり、例えば円形や矩形(正方形又は長方形)である。音孔110の開口形状の寸法は、5mm以下とされる。例えば、音孔110の開口形状について、Y方向の最大寸法がα[mm],X方向の最大寸法がβ[mm]であるとき、寸法α,βは、すべて5mm以下とされる。本実施例では、一例として、寸法α,βは、α=1.0、かつ、β=1.0である。   The opening shape (the shape in top view) of the sound hole 110 is arbitrary, and is, for example, circular or rectangular (square or rectangular). The dimension of the opening shape of the sound hole 110 is 5 mm or less. For example, with regard to the aperture shape of the sound hole 110, when the maximum dimension in the Y direction is α [mm] and the maximum dimension in the X direction is β [mm], the dimensions α and β are all 5 mm or less. In the present embodiment, as an example, the dimensions α and β are α = 1.0 and β = 1.0.

天板部材12は、機器表面部(本実施例では機器上面部)を形成する表面部材である。天板部材12は、比較的剛性の高い部材である。天板部材12は、例えば液晶パネルユニットや有機EL(ElectroLuminescence)パネルユニット等で用いられる天板部材である。尚、天板部材12は、タッチパネルを一体的に含んでよい。本実施例では、一例として、天板部材12は、ガラス板であり、液晶パネルユニット12bの上側を覆う。   The top plate member 12 is a surface member that forms a device surface portion (in the present embodiment, a device top surface portion). The top plate member 12 is a relatively rigid member. The top plate member 12 is a top plate member used, for example, in a liquid crystal panel unit or an organic EL (ElectroLuminescence) panel unit. The top plate member 12 may integrally include a touch panel. In the present embodiment, as an example, the top plate member 12 is a glass plate and covers the upper side of the liquid crystal panel unit 12 b.

天板部材12は、Y方向Y2側の端部付近にスピーカ穴121を有する。また、天板部材12は、Y方向Y1側の縁部に切欠き部122を有する。   The top plate member 12 has a speaker hole 121 near the end on the Y direction Y 2 side. Moreover, the top plate member 12 has the notch part 122 in the edge by the side of Y direction Y1.

マイクロフォン14は、機器内部に設けられる。マイクロフォン14は、音道構造30(後述)を介して伝達される音や音声に応じた電気信号(音声信号)を発生する。マイクロフォン14は、例えばダイヤフラムを用いたコンデンサ型が用いられてもよい。   The microphone 14 is provided inside the device. The microphone 14 generates an electrical signal (audio signal) according to the sound and voice transmitted through the sound path structure 30 (described later). The microphone 14 may be, for example, a capacitor type using a diaphragm.

スピーカ16は、機器内部に設けられる。スピーカ16は、図3に示すように、天板部材12に取り付けられる。即ち、スピーカ16は、天板部材12の下面に実装される。スピーカ16は、天板部材12のスピーカ穴121に対向する位置に設けられる。スピーカ16からの音は、スピーカ穴121を介して機器外部に伝達される。   The speaker 16 is provided inside the device. The speaker 16 is attached to the top plate member 12 as shown in FIG. That is, the speaker 16 is mounted on the lower surface of the top plate member 12. The speaker 16 is provided at a position facing the speaker hole 121 of the top plate member 12. The sound from the speaker 16 is transmitted to the outside of the device through the speaker hole 121.

スピーカ16は、好ましくは、Y方向でマイクロフォン14とは逆側の端部に設けられる。これは、スピーカ16からの音がマイクロフォン14に拾われ難くするためである。ステレオスピーカ構成機器の場合は、それぞれのスピーカとマイクロフォンの距離が遠くなるように設けられることが好ましい。本実施例では、一例として、スピーカ16は、天板部材12におけるY方向Y2側の端部に取り付けられるのに対して、マイクロフォン14は、天板部材12におけるY方向Y1側の端部の下方に設けられる。   The speaker 16 is preferably provided at the end opposite to the microphone 14 in the Y direction. This is to make it difficult for the microphone 14 to pick up the sound from the speaker 16. In the case of stereo speaker components, it is preferable that the distance between each speaker and the microphone be long. In the present embodiment, as an example, the speaker 16 is attached to the end of the top plate member 12 on the Y direction Y2 side, while the microphone 14 is below the end of the top plate member 12 on the Y direction Y1 side. Provided in

音道構造30は、機器内部に形成される。本実施例では、音道構造30は、側面部材101と後述の板状部材70とにより協動して形成される。但し、変形例では、音道構造30は、側面部材101に代えて又は加えて、他の部材と板状部材70とにより協動して形成されてもよい。   The sound path structure 30 is formed inside the device. In the present embodiment, the sound path structure 30 is formed in cooperation with the side surface member 101 and a plate-like member 70 described later. However, in the modification, the sound path structure 30 may be formed in cooperation with another member and the plate-like member 70 instead of or in addition to the side surface member 101.

ここで、図4及び図5を参照して、図4は、音道構造30及び板状部材70の説明図であり、図3のQ部の拡大図である。図5は、X方向の中心を通るYZ平面で切断したときの音道構造30に関連する構成の分解斜視図である。尚、図5では、底面部材102の図示が省略されている。   Here, referring to FIGS. 4 and 5, FIG. 4 is an explanatory view of the sound path structure 30 and the plate-like member 70, and is an enlarged view of a portion Q in FIG. FIG. 5 is an exploded perspective view of the configuration associated with the sound path structure 30 when cut along the YZ plane passing through the center in the X direction. In addition, illustration of the bottom face member 102 is abbreviate | omitted in FIG.

音道構造30は、水平音道310(音道の一例)と、上下音道320とを含む。   The sound path structure 30 includes a horizontal sound path 310 (an example of a sound path) and upper and lower sound paths 320.

水平音道310は、音孔110に繋がる第1位置P1から、Y方向に平行な方向(第2方向の一例)に第2位置P2まで延在する。即ち、水平音道310は、音孔110の直下の第1位置P1(上面視で音孔110に重なる第1位置)から、第1位置P1に対しY方向Y2側にオフセットした第2位置P2まで延在する。尚、本実施例では、一例として、水平音道310は、Y方向に平行に延在するが、Y方向に対して斜めに延在してもよい。即ち、水平音道310は、XY平面内の任意の方向に延在してもよい。また、水平音道310は、XY平面に対して僅かに傾斜した方向に延在してもよい。また、本実施例では、一例として、水平音道310は、直線状に延在するが、屈曲や湾曲を伴って延在してもよい。   The horizontal sound path 310 extends from a first position P1 connected to the sound hole 110 to a second position P2 in a direction parallel to the Y direction (an example of a second direction). That is, the horizontal sound path 310 is a second position P2 offset from the first position P1 immediately below the sound hole 110 (the first position overlapping the sound hole 110 in top view) to the Y direction Y2 side with respect to the first position P1. Extend up to In the present embodiment, as an example, the horizontal sound path 310 extends parallel to the Y direction, but may extend diagonally to the Y direction. That is, the horizontal sound path 310 may extend in any direction in the XY plane. Also, the horizontal sound path 310 may extend in a direction slightly inclined with respect to the XY plane. Further, in the present embodiment, as an example, the horizontal sound path 310 extends linearly, but may extend with bending or bending.

水平音道310は、上面視で、天板部材12に重なる範囲を通る。即ち、水平音道310は、図4に示すように、天板部材12の下方を通る。   The horizontal sound path 310 passes through a range overlapping with the top plate member 12 in top view. That is, as shown in FIG. 4, the horizontal sound path 310 passes below the top plate member 12.

水平音道310の断面形状(水平音道310の延在方向に視た断面形状)は、任意であるが、好ましくは、矩形(正方形又は長方形)である。矩形の場合、寸法管理が容易であり、かつ、最も製造が容易となる。水平音道310の断面形状の寸法は、好ましくは、5mm以下とされる。例えば、水平音道310の断面形状が縦a[mm],横b[mm]であるとき、寸法a,bは、すべて5mm以下とされる。本実施例では、一例として、寸法a,bは、例えばa=1.0、かつ、b=1.0である。   The cross-sectional shape of the horizontal sound path 310 (the cross-sectional shape in the extension direction of the horizontal sound path 310) is arbitrary, but preferably is rectangular (square or rectangular). In the case of a rectangular shape, dimensional control is easy and manufacture is the easiest. The dimension of the cross-sectional shape of the horizontal sound path 310 is preferably 5 mm or less. For example, when the cross-sectional shape of the horizontal sound path 310 is vertical a [mm] and horizontal b [mm], the dimensions a and b are all 5 mm or less. In the present embodiment, as an example, the dimensions a and b are, for example, a = 1.0 and b = 1.0.

上下音道320は、水平音道310の第2位置P2側の端部に接続される。上下音道320は、Z方向に平行に下方にマイクロフォン14まで延在する。尚、上下音道320には、防水シートが設けられてもよい。この場合、防水シートは、シート状の形態であり、防水機能を有する。防水シートは、例えば商品名“ゴア(登録商標)アコースティックベントGAW325”などを用いて形成することができる。また、この場合、上下音道320は、防水シートが配置される室であって、XY平面で切断した際の断面形状が拡大される室を途中に含んでよい。   The upper and lower sound paths 320 are connected to an end of the horizontal sound path 310 on the second position P2 side. The upper and lower sound paths 320 extend downward to the microphone 14 in parallel with the Z direction. A waterproof sheet may be provided on the upper and lower sound path 320. In this case, the waterproof sheet is in the form of a sheet and has a waterproof function. The waterproof sheet can be formed, for example, using a trade name “Gore (registered trademark) Acoustic Vent GAW 325” or the like. Further, in this case, the upper and lower sound path 320 may be a room in which the waterproof sheet is disposed, and may include a room in the middle of which the cross-sectional shape at the time of cutting in the XY plane is enlarged.

同様に、上下音道320の断面形状(上下音道320の延在方向に視た断面形状)は、任意であるが、好ましくは、矩形(正方形又は長方形)である。上下音道320の断面形状の寸法は、好ましくは、5mm以下とされる。例えば、上下音道320の断面形状が縦c[mm],横d[mm]であるとき、寸法c,dは、すべて5mm以下とされる。本実施例では、一例として、寸法c,dは、例えばc=1.0、かつ、d=1.0である。   Similarly, the cross-sectional shape of the upper and lower sound paths 320 (the cross-sectional shape viewed in the extension direction of the upper and lower sound paths 320) is arbitrary, but is preferably rectangular (square or rectangular). The dimension of the cross-sectional shape of the upper and lower sound path 320 is preferably 5 mm or less. For example, when the cross-sectional shapes of the upper and lower sound paths 320 are vertical c [mm] and horizontal d [mm], the dimensions c and d are all 5 mm or less. In the present embodiment, as an example, the dimensions c and d are, for example, c = 1.0 and d = 1.0.

尚、本実施例では、一例として、音道構造30は、水平音道310と上下音道320とを含むが、上下音道320とマイクロフォン14との間に更なる音道を含んでもよい。   In the present embodiment, as an example, the sound path structure 30 includes the horizontal sound path 310 and the upper and lower sound paths 320, but a further sound path may be included between the upper and lower sound paths 320 and the microphone 14.

本実施例では、一例として、側面部材101は、図5に示すように、機器側面部等に加えて、Y方向Y2側に突出しXY平面内に延在する梁部1011を更に形成する。梁部1011は、天板部材12に対し上下方向で対向する。尚、変形例では、梁部1011は、側面部材101とは別体の部材により形成されてもよい。   In the present embodiment, as an example, as shown in FIG. 5, the side surface member 101 further forms a beam portion 1011 that protrudes to the Y direction Y2 side and extends in the XY plane in addition to the device side surface portion and the like. The beam portion 1011 opposes the top plate member 12 in the vertical direction. In the modification, the beam portion 1011 may be formed of a member separate from the side member 101.

梁部1011の上側表面(天板部材12に対向する側の表面)には、下方に凹む凹部90が形成される。凹部90の深さΔ2(図4参照)は、後述の距離Δ1と板状部材70の板厚とを足した値に対応する。凹部90の底部表面(上側表面)910には、図5に示すように、水平音道310を形成する溝92が凹設される。溝92は、Y方向に延在する。溝92は、底を有するタイプであるが、溝92のY方向Y2側の端部は、上下音道320を形成するために穿孔されてよい。また、梁部1011の下側表面には、上下音道320の開口部に対応する位置にマイクロフォン14が取り付けられる。マイクロフォン14は、ゴムパッキン141のような密閉性を高めるための部材を介して、梁部1011に取り付けられてよい。このようにして、側面部材101を利用して、音道構造30を形成できる。尚、図4及び図5に示す例では、梁部1011の上側表面は、凹部90の領域を除いて、両面テープ1020を介して天板部材12に接合される。   On the upper surface (the surface on the side facing the top plate member 12) of the beam portion 1011, a recessed portion 90 which is recessed downward is formed. The depth Δ2 (see FIG. 4) of the recess 90 corresponds to a value obtained by adding a distance Δ1 described later and the plate thickness of the plate-like member 70. On the bottom surface (upper surface) 910 of the recess 90, as shown in FIG. 5, a groove 92 forming a horizontal sound path 310 is recessed. The groove 92 extends in the Y direction. The groove 92 is of the type having a bottom, but the end on the Y direction Y 2 side of the groove 92 may be perforated to form the upper and lower sound paths 320. Further, the microphone 14 is attached to the lower surface of the beam portion 1011 at a position corresponding to the opening of the upper and lower sound path 320. The microphone 14 may be attached to the beam portion 1011 via a member such as a rubber packing 141 for improving sealing. Thus, the sound path structure 30 can be formed by using the side surface member 101. In the example shown in FIGS. 4 and 5, the upper surface of the beam portion 1011 is joined to the top plate member 12 through the double-sided adhesive tape 1020 except for the region of the recess 90.

板状部材70は、薄板状の形態である。板状部材70は、好ましくは、薄くかつ剛性が比較的高い。板状部材70は、例えばPET(Polyethylene terephthalate)のような樹脂により形成される。板状部材70は、機器内部に設けられる。板状部材70は、後述のように、音道構造30を天板部材12から実質的に離隔することで、スピーカ16から天板部材12を介して伝達される音が、マイクロフォン14に伝播され難くする機能(以下、「スピーカ由来音抑制機能」とも称する)を有する。   The plate-like member 70 is in the form of a thin plate. The plate-like member 70 is preferably thin and relatively high in rigidity. The plate-like member 70 is formed of, for example, a resin such as PET (polyethylene terephthalate). The plate member 70 is provided inside the device. As described later, the plate member 70 substantially separates the sound path structure 30 from the top plate member 12, whereby the sound transmitted from the speaker 16 through the top plate member 12 is propagated to the microphone 14. It has a function to make it difficult (hereinafter, also referred to as "speaker-derived sound suppression function").

板状部材70は、図4に示すように、天板部材12に対し上下方向で距離Δ1(第1距離の一例)だけ離れて対向する。従って、板状部材70は、天板部材12に直接接触することはない。これにより、板状部材70に天板部材12の振動が直接伝達されることを、防止できる。尚、距離Δ1は、距離Δ2よりも板状部材70の厚み分だけ小さい。距離Δ1は、水平音道310の寸法よりも有意に小さく、好ましい例は、後述する。   As shown in FIG. 4, the plate-like member 70 faces the top plate member 12 at a distance Δ1 (an example of a first distance) in the up-down direction to face. Therefore, the plate member 70 does not directly contact the top plate member 12. Thereby, it is possible to prevent the vibration of the top plate member 12 from being directly transmitted to the plate member 70. The distance Δ1 is smaller than the distance Δ2 by the thickness of the plate-like member 70. The distance Δ1 is significantly smaller than the dimension of the horizontal sound path 310, and a preferred example will be described later.

板状部材70は、上下方向で水平音道310における上側の壁面3101(天板部材12側の壁面)を形成する。即ち、板状部材70は、底部表面910の溝92を覆う。   The plate member 70 forms the upper wall surface 3101 (the wall surface on the top plate member 12 side) in the horizontal sound path 310 in the vertical direction. That is, the plate-like member 70 covers the groove 92 of the bottom surface 910.

板状部材70は、スピーカ由来音抑制機能を高める観点から、好ましくは、Y方向での水平音道310の延在範囲のうちの、音孔110の直下を除く範囲全体にわたり、壁面3101を形成する。即ち、板状部材70は、音孔110の直下を除いて水平音道310の上側を覆う。スピーカ由来音抑制機能については後述する。   The plate-like member 70 preferably forms the wall surface 3101 over the entire range except the area directly below the sound hole 110 in the extension range of the horizontal sound path 310 in the Y direction from the viewpoint of enhancing the speaker-derived sound suppression function. Do. That is, the plate-like member 70 covers the upper side of the horizontal sound path 310 except immediately below the sound hole 110. The speaker-derived sound suppression function will be described later.

板状部材70は、図5に示すように、天板部材12の切欠き部122に対応する切欠き部72を有してよい。板状部材70は、切欠き部122に切欠き部72が位置合わせされる態様で、凹部90の底部表面910上に設けられる。これにより、上面視で音孔110から板状部材70は可視とならず、板状部材70が意匠性を阻害しない構成を実現できる。但し、変形例では、板状部材70は、上面視で音孔110から一部が可視となる形態であってもよい。   The plate-like member 70 may have a notch 72 corresponding to the notch 122 of the top plate 12, as shown in FIG. The plate-like member 70 is provided on the bottom surface 910 of the recess 90 in a manner such that the notch 72 is aligned with the notch 122. As a result, the plate-like member 70 is not visible from the sound hole 110 in top view, and a configuration in which the plate-like member 70 does not inhibit the design can be realized. However, in a modification, the plate-like member 70 may have a form in which a part is visible from the sound hole 110 in top view.

板状部材70の延在領域は、上面視で、凹部90の底部表面910の領域に内包される。即ち、板状部材70は、凹部90内に延在し、凹部90外へは延在しない。板状部材70は、好ましくは、凹部90の底部表面910に面接触する。即ち、板状部材70は、好ましくは、凹部90の底部表面910に沿って延在する。これにより、板状部材70と凹部90の底部表面910との間の隙間が、溝92の領域を除いて実質的に0となり、音道構造30の密閉性を高めることができる。尚、板状部材70は、凹部90の底部表面910上に載置されるだけであってもよいが、好ましくは、音道構造30の密閉性を高めるために、凹部90の底部表面910に接着や両面テープ等により固定される。   The extension area of the plate-like member 70 is included in the area of the bottom surface 910 of the recess 90 in top view. That is, the plate-like member 70 extends into the recess 90 and does not extend out of the recess 90. The plate 70 preferably contacts the bottom surface 910 of the recess 90. That is, the plate-like member 70 preferably extends along the bottom surface 910 of the recess 90. Thereby, the gap between the plate member 70 and the bottom surface 910 of the recess 90 is substantially zero except for the area of the groove 92, and the sealing property of the sound path structure 30 can be enhanced. Although the plate member 70 may only be placed on the bottom surface 910 of the recess 90, preferably, the bottom surface 910 of the recess 90 is provided to enhance the sealing property of the sound path structure 30. It is fixed by adhesion or double-sided tape.

ところで、近年、携帯電話やスマートフォン、タブレット、パソコンなど、通話する機能を持った機器が多くなってきており、電話機のように受話部分と発音部分を顔に近づけることが困難な機器でも通話をする機会が増えてきた。例えば、ノートブック型パソコンやタブレット機器で通話を行う場合、通常ヘッドセットを用いる。最近の機器では、ヘッドセットを使わずに通話するためのハンズフリー通話機能が搭載されている。   By the way, in recent years, there are many devices that have the function to make calls, such as mobile phones, smartphones, tablets, and personal computers, and even with devices that make it difficult to bring the receiving part and the pronunciation part close to the face Opportunities have increased. For example, when making a call on a notebook computer or a tablet device, a headset is usually used. Recent devices are equipped with a hands-free calling function to make calls without using a headset.

ハンズフリー通話機能は、スピーカから相手の音を出しながら、マイクロフォンで相手に向かって言葉を発し通話できる機能である。スピーカで音を出しながらマイクロフォンで音をセンシングすると、そのままでは内部増幅による音のループができてしまい、一般に言うハウリングが発生する。また、増幅のループゲインが1を超えない場合は、伝送の遅延でエコーとして音の回り込みが発生する。ハウリングもエコーもどちらも通話品質を著しく落とすため、エコーキャンセリング機能などを搭載する場合がある。しかしながら、端末との距離が離れても会話が成立するように大きな音をスピーカから出そうとすると、ゲインをあげることによりエコーキャンセリング機能の限界を超えてしまい、通話品質の悪化を招く。   The hands-free calling function is a function that allows the user to speak and talk to the other party with the microphone while making the other party's sound from the speaker. If the microphone senses the sound while emitting the sound from the speaker, the sound amplification will be made as it is, and the so-called howling will occur. In addition, if the loop gain of amplification does not exceed 1, sound wraparound occurs as echo due to transmission delay. Since both the howling and the echo significantly reduce the call quality, an echo canceling function or the like may be provided. However, if a loud sound is to be output from the speaker so that conversation can be established even if the distance from the terminal is large, the gain is increased to exceed the limit of the echo canceling function, resulting in deterioration of the speech quality.

この点、本実施例によれば、上述のように、板状部材70によるスピーカ由来音抑制機能が実現されるので、ハンズフリー通話時に生じうるハウリングやエコーを抑制できる(この点は更に図6以降を参照して後述)。これにより、良好な通話品質を維持できる。尚、本実施例においても、エコーキャンセリング機能は備えられてよい。この場合、エコーキャンセリング機能は、例えばフィードバック型である。本実施例では、天板部材12は剛性が比較的高く時間遅れが略無くスピーカ16の音が伝わるが、フィードバック型では、かかる時間遅れが略無い音を消すことが難しい。本実施例は、かかるエコーキャンセリング機能では消し難い音を低減できる点で有利となる。   In this respect, according to the present embodiment, as described above, since the speaker-derived sound suppressing function is realized by the plate-like member 70, it is possible to suppress howling and echo that may occur during hands-free calling (this point is further illustrated in FIG. See below for details). Thereby, good call quality can be maintained. Also in this embodiment, an echo canceling function may be provided. In this case, the echo canceling function is, for example, a feedback type. In the present embodiment, the top plate member 12 has a relatively high rigidity and almost no time delay, and the sound of the speaker 16 is transmitted in the feedback type, but it is difficult to eliminate the sound having substantially no such time delay. This embodiment is advantageous in that such echo canceling function can reduce the sound that is hard to cancel.

また、本実施例によれば、上述のように、マイクロフォン14及びスピーカ16ともに上側に設けられるので、ユーザは、ハンズフリー通話機能での会話を、画面を見ながら行うことができる。従って、本実施例によれば、例えば機器側面部に音孔を形成した場合に比べて(即ちマイクロフォンを側面側に設ける場合に比べて)、ハンズフリー通話時の利便性が向上する。   Further, according to the present embodiment, as described above, since both the microphone 14 and the speaker 16 are provided on the upper side, the user can make a conversation in the hands-free call function while looking at the screen. Therefore, according to the present embodiment, the convenience during hands-free calling is improved, for example, as compared to the case where the sound hole is formed in the side surface of the device (that is, compared to the case where the microphone is provided on the side).

また、本実施例によれば、上述のように、水平音道310を有するので、音孔110を介してマイクロフォン14へと侵入しうる水に対する防水性を高めることができる。即ち、本実施例によれば、音孔110の直下にマイクロフォン14を配置する場合に比べて、防水性を高めることができる。   Further, according to the present embodiment, as described above, since the horizontal sound path 310 is provided, it is possible to enhance the waterproof property against water which may intrude into the microphone 14 through the sound hole 110. That is, according to the present embodiment, the waterproofness can be enhanced as compared with the case where the microphone 14 is disposed immediately below the sound hole 110.

尚、防水性を高めるために水平音道310を形成すると、水平音道310が天板部材12の下方を通る傾向となり、後述の比較例(図7A及び図7B)で生じる問題が生じやすくなる。本実施例によれば、防水性を高めつつ、後述の比較例で生じる問題を無くす又は低減できる。   In addition, if the horizontal sound path 310 is formed to enhance waterproofness, the horizontal sound path 310 tends to pass below the top plate member 12, which tends to cause a problem that occurs in a comparative example described later (FIGS. 7A and 7B). . According to this embodiment, it is possible to eliminate or reduce the problem caused in the comparative example described later while enhancing the waterproofness.

ここで、図6以降を参照して、ハウリングやエコーの抑制効果について更に説明する。   Here, howling and echo suppression effects will be further described with reference to FIG.

図6は、スピーカ16から天板部材12を介して伝達される音の説明図であり、図3と同様、X方向の中心を通るYZ平面で切断したときの電子機器1の断面図である。図7Aは、比較例の分解斜視図であり、図5との対比用の図である。図7Bは、比較例で生じる問題点の説明図である。図8は、スピーカ由来音抑制機能の説明図である。   FIG. 6 is an explanatory view of the sound transmitted from the speaker 16 through the top plate member 12 and is a cross-sectional view of the electronic device 1 when cut along the YZ plane passing through the center in the X direction as in FIG. . FIG. 7A is an exploded perspective view of a comparative example and is a view for comparison with FIG. 5. FIG. 7B is an explanatory view of a problem that occurs in the comparative example. FIG. 8 is an explanatory view of a speaker-derived sound suppression function.

比較例では、図7Aに示すように、側面部材101に代わる側面部材101Aは、凹部90を備えておらず、また、板状部材70が設けられない。また、両面テープ1020Aは、梁部1011Aにおける溝92を除く全範囲を天板部材12に接着するように設けられる。尚、溝92は、天板部材12の下方にY方向に延在する音道30Aを形成する。   In the comparative example, as shown in FIG. 7A, the side surface member 101A replacing the side surface member 101 does not have the recess 90, and the plate-like member 70 is not provided. The double-sided adhesive tape 1020A is provided so as to adhere the entire range of the beam portion 1011A excluding the groove 92 to the top plate member 12. The groove 92 forms a sound path 30A extending in the Y direction below the top plate member 12.

図6に示すように、スピーカ16から生じる音は、主にスピーカ穴121を介して機器外部に出力されるが(図6の矢印R0参照)、スピーカ16の振動に起因して天板部材12が振動する(図6の矢印R1参照)。即ち、スピーカ16の振動が天板部材12に伝わり、天板部材12が振動する。これは、天板部材12が比較的剛性の高い部材であるためと、スピーカ16が直接的に天板部材12に取り付けられているためである。換言すると、スピーカ16は、振動を発生すべく、比較的剛性の高い部材に取り付けられるため、天板部材12に取り付けられることが有効となるが、その反面として、天板部材12に伝わる振動が問題となり得る。   As shown in FIG. 6, the sound generated from the speaker 16 is mainly output to the outside of the device through the speaker hole 121 (see the arrow R0 in FIG. 6), but the top plate member 12 due to the vibration of the speaker 16 Vibrate (see arrow R1 in FIG. 6). That is, the vibration of the speaker 16 is transmitted to the top plate member 12, and the top plate member 12 vibrates. This is because the top plate member 12 is a relatively rigid member and the speaker 16 is directly attached to the top plate member 12. In other words, since the speaker 16 is attached to a relatively rigid member in order to generate vibrations, it is effective to attach the speaker 16 to the top plate member 12, but on the other hand, the vibration transmitted to the top plate member 12 is It can be a problem.

この点、比較例では、図7Bに示すように、天板部材12の端部(音孔側の端部)までスピーカ16の振動が伝わることで、音道30Aの上側の壁面を形成する天板部材12の端部が振動する(図7Bの矢印R2参照)。この結果、スピーカ16の振動(音)が音道30Aを介してマイクロフォン14で拾われ易くなる。スピーカ16の音がマイクロフォン14で拾われると、ユーザの発話による音(図7Bの矢印R4参照)だけがマイクロフォン14で拾われる状態ではなくなり、ハウリングやエコーの原因となる。   In this point, in the comparative example, as shown in FIG. 7B, the vibration of the speaker 16 is transmitted to the end of the top plate member 12 (the end on the sound hole side) to form the upper wall of the sound path 30A. The end of the plate member 12 vibrates (see arrow R2 in FIG. 7B). As a result, the vibration (sound) of the speaker 16 is easily picked up by the microphone 14 through the sound path 30A. When the sound of the speaker 16 is picked up by the microphone 14, only the sound by the user's speech (see the arrow R4 in FIG. 7B) is not in the state picked up by the microphone 14 and causes howling or echo.

より具体的には、スピーカの振動はパネルに伝わり、パネルにおけるマイクロフォン側の端部まで伝わる。比較例のように、マイクロフォンの音道の一部に振動伝達構造が存在すると、パネルの端部の振動を音と同様に扱ってしまう。比較例では、結果的に、エコーキャンセリング機能によりこの振動原因の音もキャンセルして通話品質を確保するためには、スピーカの音量が制限されることなる。   More specifically, the vibration of the speaker is transmitted to the panel and transmitted to the end of the panel on the microphone side. As in the comparative example, when the vibration transmission structure exists in part of the sound path of the microphone, the vibration of the end of the panel is treated like the sound. In the comparative example, as a result, in order to cancel the sound of the vibration cause by the echo canceling function to ensure the communication quality, the volume of the speaker is limited.

尚、一般的に、ユーザがハンズフリー通話を行うときは、相手の声がスピーカから発生するが、機器の外を音響としてマイクロフォンに伝達する音がメインとなるようにマイクロフォンを振動対策したり、スピーカの振動対策を行ったりする。この際、スピーカの振動対策は最小限となることが多い。スピーカの振動対策を行うために防振を行うと、スピーカの振動板の上下する力を弱めてしまうためである。即ち、固定されているマグネット側が筐体に固定されているときに振動板が上下することで音が出る。筐体との結合がゴムなどで浮くと、振動板の駆動の反作用でマグネットが逃げる方向に動き、結果的に音が小さくなる。   Generally, when the user talks hands-free, the other party's voice is generated from the speaker, but the microphone is countered as vibration so that the sound transmitted from the outside of the device to the microphone becomes the main, Take measures to prevent vibration of the speakers. At this time, vibration countermeasures for the speaker are often minimized. If vibration isolation is performed in order to take measures against vibration of the speaker, the force to move the diaphragm of the speaker up and down is weakened. That is, when the fixed magnet side is fixed to the housing, a sound is produced by moving the diaphragm up and down. When the connection with the housing floats with rubber or the like, the reaction of the drive of the diaphragm causes the magnet to move in the direction of escaping, and as a result, the sound becomes smaller.

これに対して、本実施例によれば、板状部材70を有するので、上述の比較例で生じる問題を解消又は低減できる。具体的には、本実施例では、図8に示すように、天板部材12の端部(音孔側の端部)までスピーカ16の振動が伝わることで、天板部材12の端部が振動する(図8の矢印R2参照)。本実施例によれば、上述のように、板状部材70を備えることで、天板部材12の端部は、音道の上側の壁面を形成しないので、天板部材12の端部の振動が音道構造30を介してマイクロフォン14に拾われ難くなる。従って、本実施例によれば、スピーカ16の音量を制限しなくても、通話品質を確保することが容易である。   On the other hand, according to the present embodiment, since the plate-like member 70 is provided, it is possible to solve or reduce the problems occurring in the above-described comparative example. Specifically, in the present embodiment, as shown in FIG. 8, the vibration of the speaker 16 is transmitted to the end of the top plate member 12 (the end portion on the sound hole side), so that the end portion of the top plate member 12 is Vibrate (see arrow R2 in FIG. 8). According to the present embodiment, as described above, by providing the plate-like member 70, the end of the top plate member 12 does not form the upper wall surface of the sound path, so the vibration of the end of the top plate member 12 Are difficult to be picked up by the microphone 14 via the sound path structure 30. Therefore, according to the present embodiment, it is easy to ensure the communication quality without restricting the volume of the speaker 16.

次に、上下方向で板状部材70と天板部材12との間の隙間に対応する距離Δ1の好ましい例について説明する。   Next, a preferable example of the distance Δ1 corresponding to the gap between the plate member 70 and the top plate member 12 in the vertical direction will be described.

距離Δ1は、好ましくは、0.016mm以上である。これにより、スピーカ16からの音により天板部材12が80dBかつ100Hzで振動した場合でも、天板部材12と板状部材70との間の干渉(物理的な干渉)を防止できる。80dBかつ100Hzは、想定される最悪条件であるが、スピーカ16の特性等に応じて、他の数値が利用されてもよい。   The distance Δ1 is preferably 0.016 mm or more. Thereby, even when the top plate member 12 vibrates at 80 dB and 100 Hz due to the sound from the speaker 16, interference (physical interference) between the top plate member 12 and the plate-like member 70 can be prevented. Although 80 dB and 100 Hz are assumed worst conditions, other numerical values may be used depending on the characteristics of the speaker 16 or the like.

距離Δ1は、好ましくは、音道幅(上述した寸法α、β、a、b、c、d)の最大値の20%以下である。例えば、寸法α、β、a、b、c、及びdが全て1mmであるとき、距離Δ1は、0.2mm以下である。これにより、ユーザの発話による音(図8の矢印R4参照)のうちの、板状部材70と天板部材12との間の隙間を伝わり得る音の割合を、影響のないレベル(この場合、20%)以下まで低減できる。   The distance Δ1 is preferably 20% or less of the maximum value of the width of the sound path (the above-mentioned dimensions α, β, a, b, c, d). For example, when the dimensions α, β, a, b, c, and d are all 1 mm, the distance Δ1 is 0.2 mm or less. Thereby, the ratio of the sound that can be transmitted through the gap between the plate member 70 and the top plate member 12 out of the sound (see the arrow R4 in FIG. 8) by the user's speech is a level without influence (in this case, It can be reduced to 20% or less.

以上、各実施例について詳述したが、特定の実施例に限定されるものではなく、特許請求の範囲に記載された範囲内において、種々の変形及び変更が可能である。また、前述した実施例の構成要素を全部又は複数を組み合わせることも可能である。   As mentioned above, although each Example was explained in full detail, it is not limited to a specific example, A various deformation | transformation and change are possible within the range described in the claim. In addition, it is also possible to combine all or a plurality of the components of the above-described embodiment.

例えば、上述した実施例では、電子機器1は、ハンズフリー通話機能を備えるが、かかるハンズフリー通話機能を備えなくてもよい。例えば、電子機器1が小型である場合は、スピーカ穴121と音孔110との間隔が十分でなく、ハンズフリー通話と同様の状態(音声が音孔110に届き難い状態)が形成されうるので、本実施例の効果が有用となりうる。   For example, in the above-described embodiment, the electronic device 1 includes the hands-free calling function, but may not include the hands-free calling function. For example, when the electronic device 1 is small, the distance between the speaker hole 121 and the sound hole 110 is not sufficient, and a state similar to hands-free calling (a state in which sound does not easily reach the sound hole 110) may be formed. The effect of this embodiment can be useful.

また、上述した実施例では、板状部材70は、音孔110の直下での音道構造30の密閉性を高めるために、切欠き部72を有する矩形の形態であるが、これに限られない。例えば、板状部材70は、切欠き部72を有する他の形態であってもよいし、切欠き部72を有しない矩形の形態であってもよい。切欠き部72を有しない矩形の形態の場合、板状部材70のY方向Y1側の縁部は、切欠き部72のY方向Y2側の縁部に設定されてもよい。   Further, in the embodiment described above, the plate-like member 70 is in the form of a rectangle having the notch portion 72 in order to enhance the sealability of the sound path structure 30 immediately below the sound hole 110, but is limited thereto. Absent. For example, the plate-like member 70 may have another shape having the notches 72 or may have a rectangular shape not having the notches 72. In the case of the rectangular form which does not have the notch part 72, the edge by the side of the Y direction Y1 of the plate-like member 70 may be set to the edge by the side of the Y direction Y2 of the notch 72.

なお、以上の実施例に関し、さらに以下の付記を開示する。
[付記1]
電子機器であって、
当該電子機器の表面部を形成する表面部材と、
前記表面部に第1方向に開口する音孔と、
当該電子機器の内部に形成され、前記第1方向に視て前記音孔に重なる第1位置から、前記第1方向に視て前記表面部材に重なって、前記第1方向に交差する第2方向に第2位置まで延在する音道と、
前記第2位置を介して前記音道に接続されるマイクロフォンと、
前記内部に設けられ、前記表面部材に取り付けられるスピーカと、
前記内部に設けられ、前記表面部材に対し前記第1方向で第1距離だけ離れて対向し、前記第1方向で前記音道における前記表面部材側の壁面を形成する板状部材とを含む、電子機器。
[付記2]
前記板状部材は、前記第2方向での前記音道の延在範囲のうちの、前記第1方向に視て前記音孔に重なる範囲を除く全範囲にわたり、前記壁面を形成する、付記1に記載の電子機器。
[付記3]
当該電子機器の側面部から前記内部へと延設され、前記表面部材に対し前記第1方向で対向する梁部であって、前記表面部材に対向する側の表面に、前記第1方向で前記表面部材から遠ざかる側に凹む凹部を形成し、かつ、前記凹部の底部表面に、前記音道を形成する溝を形成する梁部を更に含み、
前記板状部材は、前記溝を覆う態様で前記凹部の底部表面に沿って延在する、付記1又は2に記載の電子機器。
[付記4]
前記梁部は、前記側面部と一体に形成される、付記3に記載の電子機器。
[付記5]
前記表面部材は、ガラス板であり、
前記音孔は、前記第2方向で前記表面部材の縁部と前記側面部との間に位置する、付記3に記載の電子機器。
[付記6]
前記表面部材は、前記第2方向の一端側で前記音孔が形成され、前記第2方向の他端側で前記スピーカが取り付けられる、付記1〜5のうちのいずれか1項に記載の電子機器。
[付記7]
前記第1距離は、0・016mm以上である、付記1〜6のうちのいずれか1項に記載の電子機器。
[付記8]
前記第1距離は、前記第2方向に視た前記音道の断面形状のおける縦及び横の各寸法のうちの大きい方の20%以下である、付記1〜7のうちのいずれか1項に記載の電子機器。
[付記9]
前記第1距離は、0.2mm以下である、付記1〜7のうちのいずれか1項に記載の電子機器。
In addition, the following additional remarks are disclosed regarding the above-mentioned example.
[Supplementary Note 1]
An electronic device,
A surface member forming a surface portion of the electronic device;
A sound hole opened in the first direction in the surface portion;
A second direction formed inside the electronic device and overlapping the sound member from the first position viewed in the first direction and overlapping the sound hole, overlapping the surface member as viewed in the first direction, and intersecting the first direction A sound path extending to the second position,
A microphone connected to the sound path via the second position;
A speaker provided in the interior and attached to the surface member;
A plate-like member provided in the inside and facing the surface member at a first distance away from the first member in the first direction and forming a wall surface on the surface member side of the sound path in the first direction; Electronics.
[Supplementary Note 2]
The plate-like member forms the wall surface over the entire range of the extension range of the sound path in the second direction except the range overlapping with the sound hole as viewed in the first direction. Electronic device described in.
[Supplementary Note 3]
The beam portion extending from the side surface of the electronic device to the inside and facing the surface member in the first direction, the surface facing the surface member facing the surface in the first direction And a beam portion forming a recess recessed on the side away from the surface member, and forming a groove forming the sound path on the bottom surface of the recess,
The electronic device according to Appendix 1 or 2, wherein the plate-like member extends along the bottom surface of the recess in a manner covering the groove.
[Supplementary Note 4]
The electronic device according to appendix 3, wherein the beam portion is integrally formed with the side surface portion.
[Supplementary Note 5]
The surface member is a glass plate,
The electronic device according to appendix 3, wherein the sound hole is located between an edge of the surface member and the side surface in the second direction.
[Supplementary Note 6]
The electronic according to any one of Appendices 1 to 5, wherein in the surface member, the sound hole is formed on one end side in the second direction, and the speaker is attached on the other end side in the second direction. machine.
[Supplementary Note 7]
The electronic device according to any one of appendices 1 to 6, wherein the first distance is 0.10 mm or more.
[Supplementary Note 8]
Additional clause any one of supplementary notes 1-7 in which said 1st distance is 20% or less of the larger one of the length and the horizontal dimension in the cross-sectional shape of the said sound path seen in said 2nd direction Electronic device described in.
[Supplementary Note 9]
The electronic device according to any one of appendices 1 to 7, wherein the first distance is 0.2 mm or less.

1 電子機器
10 筐体
12 天板部材
14 マイクロフォン
16 スピーカ
30 音道構造
30A 音道
70 板状部材
72 切欠き部
90 凹部
92 溝
101 側面部材
102 底面部材
110 音孔
121 スピーカ穴
122 切欠き部
310 水平音道
320 上下音道
910 底部表面
1011 梁部
1020 両面テープ
3101 壁面
Reference Signs List 1 electronic device 10 case 12 top plate member 14 microphone 16 speaker 30 sound path structure 30 A sound path 70 plate member 72 notch portion 90 recess portion 92 groove portion 101 side member 102 bottom member 110 sound hole 121 speaker hole 122 notch portion 310 Horizontal sound path 320 Upper and lower sound path 910 Bottom surface 1011 Beam 1020 Double-sided tape 3101 Wall surface

Claims (6)

電子機器であって、
当該電子機器の表面部を形成する表面部材と、
前記表面部に第1方向に開口する音孔と、
当該電子機器の内部に形成され、前記第1方向に視て前記音孔に重なる第1位置から、前記第1方向に視て前記表面部材に重なって、前記第1方向に交差する第2方向に第2位置まで延在する音道と、
前記第2位置を介して前記音道に接続されるマイクロフォンと、
前記内部に設けられ、前記表面部材に取り付けられるスピーカと、
前記内部に設けられ、前記表面部材に対し前記第1方向で第1距離だけ離れて対向し、前記第1方向で前記音道における前記表面部材側の壁面を形成する板状部材とを含む、電子機器。
An electronic device,
A surface member forming a surface portion of the electronic device;
A sound hole opened in the first direction in the surface portion;
A second direction formed inside the electronic device and overlapping the sound member from the first position viewed in the first direction and overlapping the sound hole, overlapping the surface member as viewed in the first direction, and intersecting the first direction A sound path extending to the second position,
A microphone connected to the sound path via the second position;
A speaker provided in the interior and attached to the surface member;
A plate-like member provided in the inside and facing the surface member at a first distance away from the first member in the first direction and forming a wall surface on the surface member side of the sound path in the first direction; Electronics.
前記板状部材は、前記第2方向での前記音道の延在範囲のうちの、前記第1方向に視て前記音孔に重なる範囲を除く全範囲にわたり、前記壁面を形成する、請求項1に記載の電子機器。   The plate-like member forms the wall surface over the entire range of the extension range of the sound path in the second direction except the range overlapping with the sound hole as viewed in the first direction. The electronic device as described in 1. 当該電子機器の側面部から前記内部へと延設され、前記表面部材に対し前記第1方向で対向する梁部であって、前記表面部材に対向する側の表面に、前記第1方向で前記表面部材から遠ざかる側に凹む凹部を形成し、かつ、前記凹部の底部表面に、前記音道を形成する溝を形成する梁部を更に含み、
前記板状部材は、前記溝を覆う態様で前記凹部の底部表面に沿って延在する、請求項1又は2に記載の電子機器。
The beam portion extending from the side surface of the electronic device to the inside and facing the surface member in the first direction, the surface facing the surface member facing the surface in the first direction And a beam portion forming a recess recessed on the side away from the surface member, and forming a groove forming the sound path on the bottom surface of the recess,
The electronic device according to claim 1, wherein the plate-like member extends along the bottom surface of the recess in a manner to cover the groove.
前記第1距離は、0・016mm以上である、請求項1〜3のうちのいずれか1項に記載の電子機器。   The electronic device according to any one of claims 1 to 3, wherein the first distance is 0.10 mm or more. 前記第1距離は、前記第2方向に視た前記音道の断面形状のおける縦及び横の各寸法のうちの大きい方の20%以下である、請求項1〜4のうちのいずれか1項に記載の電子機器。   5. The method according to claim 1, wherein the first distance is equal to or less than 20% of a larger one of vertical and horizontal dimensions of a cross-sectional shape of the sound path viewed in the second direction. The electronic device as described in a paragraph. 前記第1距離は、0.2mm以下である、請求項1〜4のうちのいずれか1項に記載の電子機器。   The electronic device according to any one of claims 1 to 4, wherein the first distance is 0.2 mm or less.
JP2017174117A 2017-09-11 2017-09-11 Electronics Active JP6874613B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017174117A JP6874613B2 (en) 2017-09-11 2017-09-11 Electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017174117A JP6874613B2 (en) 2017-09-11 2017-09-11 Electronics

Publications (2)

Publication Number Publication Date
JP2019050515A true JP2019050515A (en) 2019-03-28
JP6874613B2 JP6874613B2 (en) 2021-05-19

Family

ID=65905858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017174117A Active JP6874613B2 (en) 2017-09-11 2017-09-11 Electronics

Country Status (1)

Country Link
JP (1) JP6874613B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202997A (en) * 1993-12-28 1995-08-04 Nec Corp Structure for transmission part of electronic instrument
JP2010130106A (en) * 2008-11-25 2010-06-10 Fujitsu Ltd Radio communication terminal device
JP2010177901A (en) * 2009-01-28 2010-08-12 Funai Electric Co Ltd Microphone unit
JP2013247662A (en) * 2012-05-29 2013-12-09 Kyocera Corp Electronic apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202997A (en) * 1993-12-28 1995-08-04 Nec Corp Structure for transmission part of electronic instrument
JP2010130106A (en) * 2008-11-25 2010-06-10 Fujitsu Ltd Radio communication terminal device
JP2010177901A (en) * 2009-01-28 2010-08-12 Funai Electric Co Ltd Microphone unit
JP2013247662A (en) * 2012-05-29 2013-12-09 Kyocera Corp Electronic apparatus

Also Published As

Publication number Publication date
JP6874613B2 (en) 2021-05-19

Similar Documents

Publication Publication Date Title
US10567858B2 (en) Loudspeaker module and terminal device
US8520866B2 (en) Apparatus, method, and computer program product providing sound-produced tactile feedback
US9866969B2 (en) Handheld device
WO2012124348A1 (en) Mobile terminal device
US9049505B2 (en) Electronic device with loudspeaker
US20110317868A1 (en) Electroacoustic transducer
US20210112332A1 (en) Sound generating device
KR20220157469A (en) electronic device
JP4435841B2 (en) Electronics
WO2021129185A1 (en) Sound generating device module and electronic product
JP2020167670A (en) Microphone and smart audio apparatus
JP2011055300A (en) Portable terminal device
JP2010135868A (en) Acoustic apparatus, and electronic device
EP2913987B1 (en) Mobile terminal device and method for manufacturing the same
US10341474B1 (en) Mobile device
JP6874613B2 (en) Electronics
JP2018148398A (en) Handsfree call assistant device and handsfree call assistant system
JP2015061190A (en) Portable terminal
US8160289B2 (en) Speaker with auxiliary air hole
JP5900121B2 (en) Sound equipment
KR20230133929A (en) Electronics
WO2020063415A1 (en) Sound production assembly and electronic apparatus
CN114125115A (en) Electroacoustic module and electronic equipment
EP2837207B1 (en) A transducer with an output window in a second plane
CN113163041A (en) Electronic device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210209

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210302

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210323

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210405

R150 Certificate of patent or registration of utility model

Ref document number: 6874613

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150