JP2019040996A - Uv optical element, package for uv optical element, optical member used for uv optical element, and method for manufacturing the optical member - Google Patents
Uv optical element, package for uv optical element, optical member used for uv optical element, and method for manufacturing the optical member Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 239000011521 glass Substances 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 239000008188 pellet Substances 0.000 claims abstract description 21
- 238000002834 transmittance Methods 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 238000001465 metallisation Methods 0.000 claims abstract description 11
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 7
- 239000011147 inorganic material Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 19
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 238000005304 joining Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
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- 238000007740 vapor deposition Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 229910052732 germanium Inorganic materials 0.000 description 1
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- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
Description
本発明は、例えば、紫外線殺菌に用いられる深紫外線LED等の紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法に関する。 The present invention relates to an ultraviolet light element such as a deep ultraviolet LED used for ultraviolet sterilization, a package for the ultraviolet light element, an optical member used for the ultraviolet light element, and a method for manufacturing the optical member.
紫外線殺菌に際しては、従来から広く水銀灯が使用されてきたが、「水銀に関する水俣条約」の発効により、2020年以降、水銀製品の製造や輸出入が制限される。そのため、現在使用されている水銀灯の寿命が尽きた後の代替光源として、紫外線LED(Light Emitting Diode)、特に波長280nm以下の深紫外線LEDが注目されている。 Mercury lamps have been widely used for ultraviolet sterilization, but the production, import and export of mercury products will be restricted after 2020 due to the enforcement of the Minamata Convention on Mercury. Therefore, ultraviolet LEDs (Light Emitting Diodes), particularly deep UV LEDs with a wavelength of 280 nm or less, are attracting attention as alternative light sources after the lifetime of currently used mercury lamps has expired.
例えば、特許文献1には、波長200nm〜360nmの紫外光を出力する発光モジュールが開示されている。この発光モジュールは、中央に発光素子が実装される有底凹部を有するセラミック製のパッケージ基板と、有底凹部の開口を覆うように取り付けられた窓部材を備えている。窓部材のうち発光素子と対向する部分にレンズ部が形成され、またレンズ部の周囲には、パッケージ基板に接合するためのフランジ部が、レンズ部と共に一体的に形成されている。紫外線LEDも発光面は平面であるため、所望する方向に光を配光させるためには、レンズが必要である。 For example, Patent Document 1 discloses a light emitting module that outputs ultraviolet light having a wavelength of 200 nm to 360 nm. The light emitting module includes a ceramic package substrate having a bottomed recess in which a light emitting element is mounted at the center, and a window member attached to cover the opening of the bottomed recess. A lens portion is formed in a portion of the window member that faces the light emitting element, and a flange portion that is joined to the package substrate is integrally formed with the lens portion around the lens portion. Since the ultraviolet LED also has a flat light emitting surface, a lens is required to distribute light in a desired direction.
上記特許文献1では、窓部材は、石英ガラスのペレット等を材料とする溶融石英を金型に流し込むことで形成される(段落0034参照)。しかしながら、石英ガラスの軟化点が約1700℃と非常に高温であり、1900℃に加熱しても非常に固く、加工するのが困難である。また、石英ガラスは、気体の蒸気圧が大きいために固体から直接気体に移行するので融液状態にはならないこともあり、溶融石英から所望するレンズ形状を得ることは非常に困難である。そのため、一般的に、インゴット状で供給される石英ガラスを所定形状に切削、研削し、さらに表面を鏡面研磨する、伝統的なガラスレンズの製造方法が用いられており、非常に高価なレンズとなってしまう。 In Patent Document 1, the window member is formed by pouring molten quartz made of quartz glass pellets or the like into a mold (see paragraph 0034). However, the softening point of quartz glass is as high as about 1700 ° C., and even when heated to 1900 ° C., it is very hard and difficult to process. In addition, since quartz glass has a high vapor pressure of gas and is directly transferred from solid to gas, it may not be in a molten state, and it is very difficult to obtain a desired lens shape from fused silica. Therefore, in general, a traditional glass lens manufacturing method in which quartz glass supplied in an ingot shape is cut and ground into a predetermined shape and the surface is mirror-polished is used. turn into.
また、波長300nm以下の深紫外線を高透過率で透過させる物質として、従来は石英ガラスが用いられていたが、近年、特許文献2に開示されているように、波長300nm以下の深紫外線を高透過率で透過させるガラスも開発されている。この種のガラスの軟化点は、1000℃以下であり、上記のような伝統的なガラスレンズの製造方法以外の製造方法によって所望するレンズ形状が得られる可能性がある。 In addition, quartz glass has been conventionally used as a substance that transmits deep ultraviolet rays having a wavelength of 300 nm or less with high transmittance, but recently, as disclosed in Patent Document 2, deep ultraviolet rays having a wavelength of 300 nm or less are high. Glass that transmits light with transmittance is also being developed. The softening point of this type of glass is 1000 ° C. or less, and a desired lens shape may be obtained by a manufacturing method other than the above-described traditional glass lens manufacturing method.
また、特許文献1の発光モジュールでは、窓部材のうち、レンズ部やフランジ部のうち、光が通過する部分以外にマスキングが施され、マスキングされていない部分に対して、真空蒸着やスパッタリング等の方法によりチタン(Ti)、銅(Cu)、ニッケル(Ni)、金(Au)を順に積層した多層膜で形成されたメタライズ処理が施されている。しかしながら、微細且つ立体形状のレンズ部やフランジ部をマスキングしてメタライズすることは容易でなく、マスキングが不十分となってメタライズ処理が適切に施されなければ、パッケージ基板と窓部材との接合及び封止が不完全となる虞がある。紫外線、特に波長の短い深紫外線は、樹脂材料等を著しく劣化させるので、深紫外線を取り扱う、発光素子及び受光素子を含む光モジュールのパッケージからの深紫外線の漏れを防止する必要があり、パッケージの接合及び封止は、製品の信頼性に大きく影響する。 Moreover, in the light emitting module of patent document 1, masking is given to the part other than the part through which light passes among a lens part and a flange part among window members, and vacuum evaporation, sputtering, etc. are applied to the part which is not masked. The metallization process formed by the multilayer film which laminated | stacked titanium (Ti), copper (Cu), nickel (Ni), and gold (Au) in order by the method is performed. However, it is not easy to mask and metallize a fine and three-dimensional lens part or flange part, and if the masking is insufficient and the metallization process is not properly performed, the bonding of the package substrate and the window member and Sealing may be incomplete. Ultraviolet rays, particularly deep ultraviolet rays with a short wavelength, remarkably deteriorate the resin material and the like. Therefore, it is necessary to prevent leakage of deep ultraviolet rays from the package of the optical module including the light emitting element and the light receiving element that handles deep ultraviolet rays. Bonding and sealing greatly affects product reliability.
本発明は、上記課題を解決するためになされたものであり、石英ガラスよりも軟化点が低く、波長250〜400nm以下の光の平均透過率が高いガラスを用い、簡単な方法により所望する形状のレンズを有する光学部材を得ることができ、且つ、簡易な工程でセラミック製のパッケージ基板と光学部材とを接合させることができる紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法を提供することを目的とする。 The present invention has been made to solve the above-mentioned problems, and uses a glass having a softening point lower than that of quartz glass and a high average transmittance of light having a wavelength of 250 to 400 nm or less, and a desired shape by a simple method. Can be obtained, and an optical element used for an ultraviolet light element, an ultraviolet light element package, and an ultraviolet light element capable of bonding a ceramic package substrate and an optical member in a simple process. It aims at providing a manufacturing method of a member and its optical member.
上記目的を達成するために、本発明に係る紫外線光素子は、
紫外線を発光する光素子と、
前記光素子が実装されるセラミック製のパッケージ基板と、
前記基板に実装された前記光素子と対向する部分にレンズを有し、前記基板に接合される光学部材と、を備えた紫外線光素子であって、
前記光学部材は、軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、
前記光学部材のうち前記基板との接合部には、該接合部と略同形状であって、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成された枠体が一体的に接合されており、
前記基板のうち前記光学部材との接合部には、メタライズ処理が施されたメタライズ部が形成されており、
前記枠体と前記メタライズ部とが無機材料により接合されることを特徴とする。
In order to achieve the above object, the ultraviolet light device according to the present invention comprises:
An optical element that emits ultraviolet rays;
A ceramic package substrate on which the optical element is mounted;
An optical element having a lens in a portion facing the optical element mounted on the substrate, and an optical member bonded to the substrate,
The optical member is formed of glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more for light having a wavelength of 250 to 400 nm,
A frame body made of a metal having substantially the same shape as that of the joint and having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is integrally formed at the joint portion of the optical member with the substrate. Are joined,
A metallized portion subjected to a metallization process is formed at a joint portion between the substrate and the optical member,
The frame body and the metallized portion are bonded with an inorganic material.
上記紫外線光素子において、前記枠体は、その表面に形成された酸化膜によって前記ガラスと封止接合されることが好ましい。 In the ultraviolet light element, the frame body is preferably sealed and bonded to the glass by an oxide film formed on a surface thereof.
上記紫外線光素子において、前記枠体と前記メタライズ部とは、金属プリフォームにより接合されることが好ましい。 In the ultraviolet light element, it is preferable that the frame body and the metallized portion are joined by a metal preform.
上記紫外線光素子において、前記枠体は、前記メタライズ部と接合される面が前記光学部材の前記基板と対向する面から露出するように、前記光学部材に埋没されていてもよい。 In the ultraviolet light element, the frame body may be embedded in the optical member such that a surface bonded to the metallized portion is exposed from a surface of the optical member facing the substrate.
上記紫外線光素子において、前記基板には、複数の前記光素子が所定の配列パターンで実装され、前記光学部材は、前記光素子の配列パターンに対応するように配列された複数のレンズを有するものであってもよい。 In the ultraviolet light element, a plurality of the optical elements are mounted on the substrate in a predetermined arrangement pattern, and the optical member has a plurality of lenses arranged so as to correspond to the arrangement pattern of the optical elements. It may be.
また、本発明に係る紫外線光素子用パッケージは、
紫外線を発光する光素子が実装されるセラミック製のパッケージ基板と、前記基板に接合される光学部材と、を備えた紫外線光素子用パッケージであって、
前記光学部材は、軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、
前記光学部材のうち前記基板との接合部には、該接合部と略同形状であって、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成された枠体が一体的に接合されており、
前記基板のうち前記光学部材との接合部には、メタライズ処理が施されたメタライズ部が形成されており、
前記枠体と前記メタライズ部とが無機材料により接合されることを特徴とする。
In addition, the package for an ultraviolet light device according to the present invention is as follows.
A package for an ultraviolet light device comprising a ceramic package substrate on which an optical device that emits ultraviolet light is mounted, and an optical member bonded to the substrate,
The optical member is formed of glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more for light having a wavelength of 250 to 400 nm,
A frame body made of a metal having substantially the same shape as that of the joint and having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is integrally formed at the joint portion of the optical member with the substrate. Are joined,
A metallized portion subjected to a metallization process is formed at a joint portion between the substrate and the optical member,
The frame body and the metallized portion are bonded with an inorganic material.
また、本発明に係る光学部材は、
紫外線を発光する光素子が実装されるセラミック製の基板に接合される光学部材であって、
軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、
前記光学部材のうち前記基板との接合部には、該接合部と略同形状であって、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成された枠体が一体的に接合されていることを特徴とする。
The optical member according to the present invention is
An optical member bonded to a ceramic substrate on which an optical element that emits ultraviolet light is mounted,
The softening point is 1000 ° C. or less, and the average transmittance for light with a wavelength of 250 to 400 nm is 80% or more, and is formed of glass.
A frame body made of a metal having substantially the same shape as that of the joint and having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is integrally formed at the joint portion of the optical member with the substrate. It is characterized by being joined.
また、本発明に係る光学部材の製造方法は、
紫外線を発光する光素子が実装されるセラミック製の基板に接合される光学部材の製造方法であって、
軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスを所定サイズのガラスペレットに切断する工程と、
前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属を、前記光学部材のうち前記基板との接合部には、前記基板のうち前記光学部材との接合部と略同形状の枠体に形成する工程と、
前記枠体の表面に酸化膜を形成し、該酸化膜によって前記枠体と前記ガラスと封止接合する工程と、
窒素ガス環境下において、所定形状に形成された治具に前記枠体及び前記ガラスペレットを載置し、前記軟化点よりも高い第1の温度に加熱して前記ガラスペレットを溶融させ、前記治具の形状を転写させた所定形状の光学部材を成形する工程と、
前記枠体のうち前記ガラスと接合していない面の酸化膜を除去する工程と、を備えたことを特徴とする。
Moreover, the manufacturing method of the optical member according to the present invention is as follows:
A method of manufacturing an optical member to be bonded to a ceramic substrate on which an optical element that emits ultraviolet light is mounted,
A step of cutting glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more with respect to light having a wavelength of 250 to 400 nm into glass pellets of a predetermined size;
A metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is formed into a frame body having substantially the same shape as a bonding portion with the optical member of the substrate. Forming, and
Forming an oxide film on the surface of the frame, and sealingly bonding the frame and the glass with the oxide film;
In a nitrogen gas environment, the frame and the glass pellet are placed on a jig formed in a predetermined shape, and heated to a first temperature higher than the softening point to melt the glass pellet, Forming an optical member having a predetermined shape to which the shape of the tool is transferred;
And a step of removing an oxide film on a surface of the frame body that is not bonded to the glass.
上記光学部材の製造方法において、
前記ガラスの軟化点よりも高く前記第1の温度よりも低い第2の温度に加熱し、前記光学部材の表面を熱研磨する工程を更に備えることが好ましい。
In the method for producing the optical member,
It is preferable to further comprise a step of heating to a second temperature higher than the softening point of the glass and lower than the first temperature, and thermally polishing the surface of the optical member.
上記光学部材の製造方法において、
前記治具は、カーボンパウダーを固めて成形したものであることが好ましい。
In the method for producing the optical member,
The jig is preferably formed by solidifying carbon powder.
本発明によれば、溶融又は軟化したガラスペレットに治具の形状を転写させて光学部材を加圧成形しているので、石英ガラスのインゴットを切削、研削する伝統的なガラスレンズの製造方法に比べて、製造工程を簡易化することができる。また、光学部材の成形と同時に、金属の枠体を光学部材に一体的に封止接合させるので、メタライズ処理のためのマスキングや蒸着工程が不要になる。更に、光学部材と一体化された枠体と、メタライズ処理されたパッケージ基板のメタライズ部とを、金属プリフォームで接合することで、パッケージ基板と光学部材とを簡易に接合させることができる。結果的に、低コストで、信頼性の高い紫外線光素子及び紫外線光素子用パッケージを提供することができる。 According to the present invention, the shape of the jig is transferred to a molten or softened glass pellet and the optical member is pressure-molded. Therefore, in the traditional glass lens manufacturing method of cutting and grinding a quartz glass ingot. In comparison, the manufacturing process can be simplified. In addition, since the metal frame is integrally sealed and joined to the optical member simultaneously with the molding of the optical member, the masking and vapor deposition steps for the metallization process are unnecessary. Furthermore, the package substrate and the optical member can be easily joined by joining the frame integrated with the optical member and the metallized portion of the metallized package substrate with a metal preform. As a result, it is possible to provide a low-cost and highly reliable ultraviolet light device and a package for the ultraviolet light device.
本発明の一実施形態に係る紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法について説明する。図1は、本発明の一実施形態に係る紫外線光素子の構成を示す。なお、紫外線光素子から発光素子を除いたものが紫外線光素子用パッケージである。 An ultraviolet light element, an ultraviolet light element package, an optical member used for the ultraviolet light element, and a method of manufacturing the optical member according to an embodiment of the present invention will be described. FIG. 1 shows a configuration of an ultraviolet light device according to an embodiment of the present invention. An ultraviolet light element package is obtained by removing a light emitting element from an ultraviolet light element.
紫外線光素子1は、深紫外線を出力する光素子2と、セラミック製のパッケージ基板3と、パッケージ基板3に接合される光学部材4を備えている。ここで、光素子2は、一例として、波長300nm以下、より好ましくは波長280nm以下、さらに好ましくは波長265nmの深紫外線を発光する深紫外線発光素子である。また、光素子2は、例えば、サファイア基板上に単一のLED構造が形成された単一のチップであってもよいし(図例)、サファイア基板上に複数のLED構造が形成された集積型のチップであってもよい。 The ultraviolet light element 1 includes an optical element 2 that outputs deep ultraviolet light, a ceramic package substrate 3, and an optical member 4 that is bonded to the package substrate 3. Here, as an example, the optical element 2 is a deep ultraviolet light emitting element that emits deep ultraviolet light having a wavelength of 300 nm or less, more preferably a wavelength of 280 nm or less, and still more preferably 265 nm. The optical element 2 may be, for example, a single chip in which a single LED structure is formed on a sapphire substrate (illustrated example), or an integrated structure in which a plurality of LED structures are formed on a sapphire substrate. It may be a die chip.
パッケージ基板3は、例えば、平面視で略正方形であり、光素子2が実装される有底凹部31と、有底凹部31の周囲を隙間無く取り囲む周壁32を有している。光学部材4は、図例の構成では、単一の球面又は単一の非球面レンズであって、有底凹部31の開口に対向する部分にレンズ41が形成され、パッケージ基板3の有底凹部31に実装された光素子2の発光面が、ちょうど光学部材4のレンズの焦点となるように、レンズ41及びパッケージ基板3の有底凹部31の深さや周壁32の高さ等が設計されている。 The package substrate 3 is, for example, substantially square in plan view, and has a bottomed recess 31 in which the optical element 2 is mounted and a peripheral wall 32 that surrounds the bottomed recess 31 without a gap. The optical member 4 is a single spherical surface or a single aspherical lens in the configuration of the illustrated example, and a lens 41 is formed in a portion facing the opening of the bottomed recess 31, and the bottomed recess of the package substrate 3 is formed. The depth of the bottomed recess 31 of the lens 41 and the package substrate 3 and the height of the peripheral wall 32 are designed so that the light emitting surface of the optical element 2 mounted on 31 is exactly the focal point of the lens of the optical member 4. Yes.
光学部材4は、平面視で略正方形であり、その外形寸法はパッケージ基板3の外形寸法と略同じであり、パッケージ基板3の周壁32の上端部33に接合される。パッケージ基板3の周壁32の上端部33は、例えば、金メッキや金蒸着等によってメタライズ処理が施されている。すなわち、本実施例では、上端部33が光学部材4との接合部であり、これがメタライズ部とされている。一方、光学部材4のパッケージ基板3に対向する側の面のうち、周壁32の上端部との接合部には、周壁32の上端部33と略同形状であって、ガラスの熱膨張係数と略同じ熱膨張係数を有する金属で形成された枠体5が一体的に封止接合されている。すなわち、枠体5も、平面視で略正方形であり、その外形寸法はパッケージ基板3の外形寸法と略同じである。 The optical member 4 has a substantially square shape in plan view, and has an outer dimension that is substantially the same as the outer dimension of the package substrate 3 and is joined to the upper end portion 33 of the peripheral wall 32 of the package substrate 3. The upper end portion 33 of the peripheral wall 32 of the package substrate 3 is subjected to metallization processing by, for example, gold plating or gold vapor deposition. That is, in the present embodiment, the upper end portion 33 is a joint portion with the optical member 4 and is a metallized portion. On the other hand, of the surface of the optical member 4 facing the package substrate 3, the joint portion with the upper end portion of the peripheral wall 32 has substantially the same shape as the upper end portion 33 of the peripheral wall 32, and has a thermal expansion coefficient of glass. A frame 5 made of metal having substantially the same thermal expansion coefficient is integrally sealed and joined. That is, the frame 5 is also substantially square in plan view, and its outer dimension is substantially the same as the outer dimension of the package substrate 3.
ここで、光学部材4は、一例として、軟化点が1000℃以下で、図2に示すように、波長250〜400nmの光に対して、厚み2.0mmの資料における平均透過率が80%以上であるガラスで形成されている。このガラスの成分としては、SiO2及びB2O3を主体とし、更に、Al2O3、Li2O、Na2O、K2O、CaO、BaO、ZnO、Y2O3、ZrO2、La2O3、Sb2O、を含有する(詳細な組成は上記特許文献2参照)。 Here, as an example, the optical member 4 has a softening point of 1000 ° C. or less and, as shown in FIG. 2, the average transmittance of a material having a thickness of 2.0 mm is 80% or more with respect to light having a wavelength of 250 to 400 nm. It is made of glass. As components of this glass, SiO 2 and B 2 O 3 are mainly used, and further Al 2 O 3 , Li 2 O, Na 2 O, K 2 O, CaO, BaO, ZnO, Y 2 O 3 , ZrO 2. , La 2 O 3 , Sb 2 O (refer to Patent Document 2 above for the detailed composition).
また、ガラス及び枠体5の熱膨張係数は、例えば、常温で4.5×10−6K−1程度であり、枠体5の材料としては、例えば厚さ0.1〜0.2mm程度のコバール(Kovar)を使用することができる。コバールは、鉄とニッケル及びコバルト等の合金であり、硬質ガラスの接着に使用される一般的な材料である。コバールの融点は1450℃程度であり、ガラスの融点よりも高い。パッケージ基板3と光学部材4とは、金属の枠体5と、パッケージ基板3の周壁32の上端部33のメタライズ処理層とを、金属プリフォーム6で溶接することで接合される。金属プリフォーム6は、金・スズといった貴金属を含む薄い金属(合金)を接合部分の形状に成形したものである。 The thermal expansion coefficient of the glass and the frame 5 is, for example, about 4.5 × 10 −6 K −1 at room temperature, and the material of the frame 5 is, for example, about 0.1 to 0.2 mm in thickness. Kovar can be used. Kovar is an alloy such as iron and nickel and cobalt, and is a common material used for bonding hard glass. The melting point of Kovar is about 1450 ° C., which is higher than the melting point of glass. The package substrate 3 and the optical member 4 are joined by welding the metal frame 5 and the metallized layer on the upper end portion 33 of the peripheral wall 32 of the package substrate 3 with a metal preform 6. The metal preform 6 is formed by molding a thin metal (alloy) containing a noble metal such as gold or tin into the shape of a joint portion.
次に、紫外線光素子1の製造方法について、図3及び図4を参照しつつ説明する。図3は、紫外線光素子1の製造方法における第1段階として、紫外線光素子1に用いられる光学部材4の製造方法であり、枠体5と一体的に接合された光学部材4の製造工程を示す。また、図4は、紫外線光素子1の製造方法における第2段階として、パッケージ基板3と光学部材4との接合工程を示す。 Next, a method for manufacturing the ultraviolet light element 1 will be described with reference to FIGS. FIG. 3 shows a manufacturing method of the optical member 4 used in the ultraviolet light element 1 as a first step in the manufacturing method of the ultraviolet light element 1. The manufacturing process of the optical member 4 integrally joined to the frame 5 is shown in FIG. Show. FIG. 4 shows a bonding step of the package substrate 3 and the optical member 4 as a second stage in the method for manufacturing the ultraviolet light element 1.
この紫外線光素子1の製造方法において、光学部材4は、ガラスを加熱し、溶融又は軟化させた後、所定の型(治具)で圧縮成形している(いわゆるコンプレッション成形)。図3(a)に示すように、固定された治具20の上面には、枠体5と略同形状の窪み21が形成されており、図3(b)に示すように、枠体5はこの窪み21に嵌装される。ここで、枠体5には酸化処理が施されており、その表面には酸化膜が形成されている。治具20は、例えば、カーボンパウダーを図示のような所定形状に圧縮成形したものである。なお、便宜上、枠体5は平面視で環状に描かれているが、正方形又は長方形丸型であってもよい。また、枠体5の厚みは実際のものよりも誇張して描かれている。 In the method for manufacturing the ultraviolet light element 1, the optical member 4 is heated and melted or softened by glass, and then compression molded with a predetermined mold (jig) (so-called compression molding). As shown in FIG. 3A, a recess 21 having substantially the same shape as that of the frame 5 is formed on the upper surface of the fixed jig 20, and as shown in FIG. Is fitted in the recess 21. Here, the frame 5 is subjected to an oxidation treatment, and an oxide film is formed on the surface thereof. The jig 20 is formed by, for example, compressing and molding carbon powder into a predetermined shape as illustrated. For convenience, the frame 5 is drawn in an annular shape in plan view, but may be a square or a round rectangle. Moreover, the thickness of the frame 5 is drawn exaggerated rather than the actual thing.
次に、図3(b)に示すように、例えば、棒状で供給されるガラスを所定サイズ(所定体積又は所定重量)のガラスペレット10に切断し、図3(c)に示すように、枠体5の中心とガラスペレット10の中心が一致するように、治具20上に載置する。次に、図3(d)に示すように、枠体5及びガラスペレット10が載置された治具20と、成形すべきレンズ形状と同形状の曲面を有する窪み26が形成された可動式の治具25とを、第1加熱炉40内に収納し、窒素ガス環境下においてガラスの軟化点よりも高い第1の温度(例えば1000℃)に加熱する。図3(d)では、ガラスペレット10が溶融又は軟化した状態を描いている。治具20も、例えば、カーボンパウダーを図示のような所定形状に圧縮成形したものであり、治具20の窪み21の中心と治具25の窪み26の中心が一致するように、治具20及び治具25が配置されている。 Next, as shown in FIG. 3 (b), for example, glass supplied in a rod shape is cut into glass pellets 10 of a predetermined size (predetermined volume or predetermined weight), and a frame as shown in FIG. 3 (c). It mounts on the jig | tool 20 so that the center of the body 5 and the center of the glass pellet 10 may correspond. Next, as shown in FIG. 3D, a movable type in which a jig 20 on which the frame body 5 and the glass pellet 10 are placed, and a depression 26 having a curved surface having the same shape as the lens to be molded are formed. The jig 25 is housed in the first heating furnace 40 and heated to a first temperature (for example, 1000 ° C.) higher than the softening point of the glass in a nitrogen gas environment. FIG. 3D shows a state where the glass pellet 10 is melted or softened. The jig 20 is, for example, compression-molded carbon powder in a predetermined shape as shown in the figure, and the jig 20 has a center of the recess 21 of the jig 20 and a center of the recess 26 of the jig 25. And the jig | tool 25 is arrange | positioned.
ガラスペレット10が、コンプレッション成形可能な程度に溶融又は軟化されると、図3(e)に示すように、可動式の治具25を治具20に向かって徐々に下降させ、窪み26の表面によってガラスペレット10を加圧変形させる。それによって、溶融したガラスペレット10の表面に窪み26の曲面が転写される。また、ガラスペレット10が溶融した時、枠体5の表面に形成された酸化膜により、枠体5とガラスとの濡れ性が良くなり、ガラス・金属界面の密着性が向上し、それらが封止(ハーメチック)接合される。このようにして治具25を所定時間所定圧力で治具20に押しつけて光学部材4を圧縮成形した後、第1加熱炉40内の温度を低下させ、治具20、治具25、成形された光学部材4及び枠体5を冷却する。 When the glass pellet 10 is melted or softened to such an extent that compression molding is possible, the movable jig 25 is gradually lowered toward the jig 20 as shown in FIG. The glass pellet 10 is deformed under pressure. Thereby, the curved surface of the depression 26 is transferred to the surface of the molten glass pellet 10. Further, when the glass pellet 10 is melted, the oxide film formed on the surface of the frame 5 improves the wettability between the frame 5 and the glass, improves the adhesion between the glass and the metal interface, and seals them. Hermetic joining. In this way, after pressing the jig 25 against the jig 20 at a predetermined pressure for a predetermined time to compress and mold the optical member 4, the temperature in the first heating furnace 40 is lowered, and the jig 20, the jig 25, and the like are molded. The optical member 4 and the frame body 5 are cooled.
また、前述のように、枠体5の材料と光学部材4の熱膨張係数が略同じであるので、冷却の際、光学部材4と枠体5とは略同じ割合で収縮するため、光学部材4と枠体5とが分離することはなく、冷却後であっても光学部材4と枠体5は一体的に封止接合されている。そして、常温に冷却した後、第1加熱炉40から治具20、治具25及び光学部材4及び枠体5を取り出し、治具25を治具20から分離する。それによって、図3(f)に示すように、封止接合された光学部材4及び枠体5が得られる。 Further, as described above, since the thermal expansion coefficient of the material of the frame body 5 and the optical member 4 are substantially the same, the optical member 4 and the frame body 5 contract at substantially the same rate during cooling. 4 and the frame 5 do not separate, and the optical member 4 and the frame 5 are integrally sealed and joined even after cooling. And after cooling to normal temperature, the jig | tool 20, the jig | tool 25, the optical member 4, and the frame 5 are taken out from the 1st heating furnace 40, and the jig | tool 25 is isolate | separated from the jig | tool 20. FIG. Thereby, as shown in FIG. 3F, the optical member 4 and the frame body 5 which are sealed and joined are obtained.
また、枠体5及び光学部材4は、別途の加熱炉(不図示)に収納し、酸素を含む空気環境下においてガラスの軟化点よりも高く、第1の温度(例えば、1000℃)よりも低い第2の温度(例えば、800℃)に再加熱されることが好ましい。この加熱処理により、カーボンパウダーの転写によるシボ加工状の光学部材4の表面が、再溶融又は再軟化されると、表面張力によって溶融又は軟化したガラスが凸部から凹部に異動し、光学部材4の表面の凹凸が徐々に均され、平滑化される。すなわち、簡易な熱処理により、レンズの表面を熱研磨することで、レンズの表面を鏡面仕上げとすることができる。 The frame 5 and the optical member 4 are housed in a separate heating furnace (not shown), and are higher than the softening point of the glass in an oxygen-containing air environment and higher than the first temperature (for example, 1000 ° C.). Reheating to a low second temperature (eg, 800 ° C.) is preferred. By this heat treatment, when the surface of the textured optical member 4 transferred by carbon powder is remelted or resoftened, the glass melted or softened by the surface tension moves from the convex portion to the concave portion, and the optical member 4 The unevenness on the surface of the film is gradually smoothed and smoothed. That is, the lens surface can be mirror-finished by thermally polishing the lens surface with a simple heat treatment.
光学部材4は、各面稜線が加圧成形時にR状の曲面となるように形成されており、図1で示したように、熱研磨により上記曲面のRが更に大きくなる。なお、上記曲面を鋭角にする必要がある場合には、光学部材の表面を機械加工で切削すればよい。上記処理を経て、光学部材4及び枠体5を接合させた後、枠体5のうちガラスと接合していない面の酸化膜が、洗浄、除去される。枠体5と接合された光学部材4は、それ自体が独立して製造及び商取引され得るものであり、以下に説明するパッケージ基板3との接合工程は、光学部材4の製造者と異なる製造者によって実施されてもよい。 The optical member 4 is formed such that each surface ridgeline becomes an R-shaped curved surface during pressure molding, and as shown in FIG. 1, the curved surface R is further increased by thermal polishing. In addition, what is necessary is just to cut the surface of an optical member by machining, when it is necessary to make the said curved surface into an acute angle. After joining the optical member 4 and the frame body 5 through the above process, the oxide film on the surface of the frame body 5 not joined to the glass is washed and removed. The optical member 4 joined to the frame 5 can be manufactured and traded independently, and the joining process with the package substrate 3 described below is a manufacturer different from the manufacturer of the optical member 4. May be implemented.
次に、図4(a)に示すように、別途、セラミックを用いて、有底凹部31と、有底凹部31の周囲を隙間無く取り囲む周壁32を有するパッケージ基板3を製造する工程と、パッケージ基板3の周壁32の上端部33に金メッキや金蒸着によりメタライズ処理を施す工程と、パッケージ基板3の有底凹部31に深紫外線LED等の光素子2を実装する工程とを経て、光素子2が実装されたパッケージ基板3を用意しておく。この段階では、枠体5のうちガラスと接合していない面の酸化膜は除去されている。また、パッケージ基板3の周壁32の上端部33は、メタライズ処理として金メッキや金蒸着(不図示)が施されている。そして、用意されたパッケージ基板3と、上記のようにして形成された枠体5と一体的に接合された光学部材4との間に、金・錫又は金・ゲルマニウムといった貴金属を含む合金等で形成された金属プリフォーム6を配置し、パッケージ基板3側の上端部33及び枠体5の下面51とが略密着するように、位置合わせを行う。そして、図4(b)に示すように、パッケージ基板3、金属プリフォーム6、及び光学部材4を、第2の加熱炉50内で、少なくとも金属プリフォーム6の溶融温度(200〜400℃)以上の温度まで加熱し、それらを溶接する。そして、金属プリフォーム6の溶融温度以下の温度まで冷却することで、金属プリフォーム6が硬化して、光学部材4と一体化された枠体5と、及びパッケージ基板3の周壁32の上端部33とが無機材料(フィレット)により接合される。 Next, as shown in FIG. 4A, separately, using ceramic, a step of manufacturing a package substrate 3 having a bottomed recess 31 and a peripheral wall 32 surrounding the bottomed recess 31 without a gap, and a package The optical element 2 is subjected to a process of metallizing the upper end portion 33 of the peripheral wall 32 of the substrate 3 by gold plating or gold vapor deposition and a process of mounting the optical element 2 such as a deep ultraviolet LED in the bottomed recess 31 of the package substrate 3. A package substrate 3 on which is mounted is prepared. At this stage, the oxide film on the surface of the frame 5 that is not bonded to the glass is removed. Further, the upper end portion 33 of the peripheral wall 32 of the package substrate 3 is subjected to gold plating or gold vapor deposition (not shown) as a metallization process. And between the prepared package substrate 3 and the optical member 4 integrally joined with the frame 5 formed as described above, an alloy containing a noble metal such as gold / tin or gold / germanium is used. The formed metal preform 6 is disposed, and alignment is performed so that the upper end portion 33 on the package substrate 3 side and the lower surface 51 of the frame body 5 are in close contact with each other. And as shown in FIG.4 (b), the melting temperature (200-400 degreeC) of the metal substrate 6 at least with the package substrate 3, the metal preform 6, and the optical member 4 in the 2nd heating furnace 50. FIG. Heat to above temperature and weld them. The metal preform 6 is cured by cooling to a temperature equal to or lower than the melting temperature of the metal preform 6, and the frame body 5 integrated with the optical member 4 and the upper end portion of the peripheral wall 32 of the package substrate 3. 33 is joined with an inorganic material (fillet).
このようにして得られた紫外線光素子1又はその紫外線光素子用パッケージでは、パッケージ基板3と光学部材4が、共に平面視で略同じ大きさ及び形状であり、また、枠体5とパッケージ基板3の周壁32の上端部33も、共に平面視で略同じ大きさ及び形状である。 In the ultraviolet light element 1 or the ultraviolet light element package thus obtained, both the package substrate 3 and the optical member 4 have substantially the same size and shape in plan view, and the frame 5 and the package substrate. The upper end portions 33 of the three peripheral walls 32 are also substantially the same size and shape in plan view.
枠体5は、光学部材4のパッケージ基板3に対向する側の下面43のうち、周壁32の上端部33に接合される部分に一体的に封止接合されている。そのため、枠体5の下面51とパッケージ基板3の周壁32のメタライズ化された上端部33とが、金属プリフォーム6により密着接合されると、パッケージ基板3の有底凹部31と光学部材4のパッケージ基板3に対向する側の下面43とで形成される空間は密閉され、紫外線光素子1又はその紫外線光素子用パッケージの外部とは遮断される。光素子2が発光素子の場合、発光素子から出力される深紫外線はパッケージ基板3と光学部材4の接合部の隙間から漏れることはなく、紫外線光素子1の周囲に存在する樹脂製品等に悪影響を与えることはほとんどなくなる。 The frame body 5 is integrally sealed and bonded to a portion of the lower surface 43 of the optical member 4 facing the package substrate 3, which is bonded to the upper end portion 33 of the peripheral wall 32. Therefore, when the lower surface 51 of the frame 5 and the metallized upper end portion 33 of the peripheral wall 32 of the package substrate 3 are closely bonded by the metal preform 6, the bottomed recess 31 of the package substrate 3 and the optical member 4 A space formed by the lower surface 43 on the side facing the package substrate 3 is hermetically sealed, and is blocked from the outside of the ultraviolet light element 1 or the ultraviolet light element package. When the optical element 2 is a light-emitting element, deep ultraviolet light output from the light-emitting element does not leak from the gap between the joint portion of the package substrate 3 and the optical member 4, and adversely affects resin products and the like existing around the ultraviolet optical element 1. Is almost never given.
ところで、図3に示す枠体5と一体的に接合された光学部材4の製造工程において、治具20及び治具25は、それぞれカーボンパウダーを圧縮して形成されたものを用いている。そのため、図3(f)において成形された光学部材4の表面には、微小なカーボンパウダーの形状が転写されてシボ加工状になっており、いわゆるつや消し処理がなされたような状態になっている。また、光学部材4の表面に、剥離したカーボンパウダーが付着している場合もあり得る。そこで、図3(f)に示す工程の後、成形された光学部材4の表面を洗浄し付着したカーボンパウダーを除去する洗浄工程を設けてもよい。具体的には、塩酸、フッ化水素水、脱イオン水等を用いて光学部材4の表面を洗浄する。 By the way, in the manufacturing process of the optical member 4 integrally joined to the frame 5 shown in FIG. 3, the jig 20 and the jig 25 are each formed by compressing carbon powder. Therefore, on the surface of the optical member 4 molded in FIG. 3 (f), the shape of the minute carbon powder is transferred to form a textured shape, so that a so-called matting process is performed. . Moreover, the peeled carbon powder may adhere to the surface of the optical member 4. Therefore, after the step shown in FIG. 3F, a cleaning step of cleaning the surface of the molded optical member 4 and removing the adhering carbon powder may be provided. Specifically, the surface of the optical member 4 is cleaned using hydrochloric acid, hydrogen fluoride water, deionized water, or the like.
なお、光素子2から出射された深紫外線を拡散して照射したい場合、光学部材4の表面に凹凸が残っていた方がよい場合もある。その場合は、図4(b)で示したパッケージ基板3と光学部材4の接合工程における加熱温度をやや低く設定するか、加熱時間をやや短く設定することによって、光学部材4の表面の再溶融又は再軟化の程度を小さくしてもよい。 In addition, when it is desired to diffuse and irradiate deep ultraviolet light emitted from the optical element 2, it may be preferable that unevenness remains on the surface of the optical member 4. In that case, the surface of the optical member 4 is remelted by setting the heating temperature in the bonding process of the package substrate 3 and the optical member 4 shown in FIG. Alternatively, the degree of resoftening may be reduced.
また、上記実施形態では、有底凹部31、周壁32及び上端部33を有するパッケージ基板3を用い、有底凹部31に光素子2が実装される構成例を示したが、枠体5に所定の厚みがあれば、図5に示すように、有底凹部31等が無い平坦な基板3Fが用いられてもよい。この場合、光学部材4が枠体5の厚みで基板3Fに対して下駄を履かせた状態で保持され、光学部材4(下面43)と基板3Fとの間に形成された隙間に、光素子2が収容される。また、上記実施形態では、光学部材4として平凸単レンズを例示したが、これに限定されるものではなく、両凸単レンズ、凸メニスカス単レンズ、あるいは、用途によっては凹単レンズ等であってもよい。それらの場合、治具20の表面にもレンズ形状に応じた窪み又は突起が形成されている。また、パッケージ基板3及び光学部材4は、平面視で略正方形の他に、略円形であってもよい。 Moreover, in the said embodiment, although the package substrate 3 which has the bottomed recessed part 31, the surrounding wall 32, and the upper end part 33 was used and the optical element 2 was mounted in the bottomed recessed part 31, the example of a structure was shown in the frame 5. As shown in FIG. 5, a flat substrate 3F having no bottomed recess 31 or the like may be used. In this case, the optical member 4 is held in a state where the clogs are put on the substrate 3F with the thickness of the frame 5, and the optical element is inserted in the gap formed between the optical member 4 (lower surface 43) and the substrate 3F. 2 is accommodated. In the above embodiment, a plano-convex single lens is exemplified as the optical member 4, but the present invention is not limited to this, and the optical member 4 may be a biconvex single lens, a convex meniscus single lens, or a concave single lens depending on applications. May be. In those cases, a recess or protrusion corresponding to the lens shape is also formed on the surface of the jig 20. Further, the package substrate 3 and the optical member 4 may be substantially circular in addition to being substantially square in plan view.
あるいは、光学部材4として、球面又は非球面の単レンズの他に、図6に示すように、光学部材4は、光学部材4は所定のパターンに配列された複数の球面レンズ又は複数の非球面レンズ41で構成されていてもよい(いわゆるレンズアレイ)。この場合も、パッケージ基板3及び光学部材4は、平面視で略正方形の他に、略円形であったり、長方形であってもよい。特に、光学部材4がレンズアレイの場合、従来の石英ガラスの研削及び研磨処理では製造不可能であり、本発明による効果は顕著である。さらに、光学部材4が単一の球面又は非球面レンズの場合であっても、レンズの厚みを薄くするためにフレネルレンズとしてもよい(図示せず)。フレネルレンズの場合も、従来の石英ガラスの研削及び研磨処理では製造不可能であり、本発明による効果は顕著である。 Alternatively, as the optical member 4, in addition to a spherical or aspherical single lens, as shown in FIG. 6, the optical member 4 includes a plurality of spherical lenses or a plurality of aspheric surfaces arranged in a predetermined pattern. The lens 41 may be configured (a so-called lens array). Also in this case, the package substrate 3 and the optical member 4 may be substantially circular or rectangular in addition to being substantially square in plan view. In particular, when the optical member 4 is a lens array, it cannot be manufactured by conventional grinding and polishing treatment of quartz glass, and the effect of the present invention is remarkable. Furthermore, even if the optical member 4 is a single spherical or aspherical lens, it may be a Fresnel lens (not shown) in order to reduce the thickness of the lens. Also in the case of a Fresnel lens, it cannot be manufactured by conventional grinding and polishing treatment of quartz glass, and the effect of the present invention is remarkable.
図7及び図8は、上記紫外線光素子及びそれに用いる光学部材の製造方法の変形例を示す。図3では、枠体5と略同形状の窪み21を有する治具20を用いているが、この変形例では、図7(a)及び(b)に示すように、上面22に凸部23を有する治具20を用い、図3等で示したものよりも厚みの薄い枠体5を、凸部23の外周部であって、治具20の上面22に直接的に載置している。そして、図7(c)(d)に示すように、溶融又は軟化したガラスペレット10は、凸部23の形状が転写されて、図7(e)(f)に示すように、成形された光学部材4の下面43は、凹部44が形成される。この場合、図8に示すように、枠体5の厚みが薄くても、光学部材4の凹部44があるので、図5で示した構成と同様に、有底凹部31等が無い平坦な基板3Fを用い、光学部材4の凹部44と基板3Fとの間に形成された空間に、光素子2を収容することができる。なお、図7の工程で作成された枠体5付きの光学部材4と、基板3Fとを接合する工程は、上記図4と同様であり、図8では、金属プリフォーム6の記載を省略している。 7 and 8 show a modification of the method for producing the ultraviolet light element and the optical member used therefor. In FIG. 3, a jig 20 having a recess 21 having substantially the same shape as the frame body 5 is used. However, in this modification, as shown in FIGS. The frame body 5 having a thickness smaller than that shown in FIG. 3 or the like is directly placed on the upper surface 22 of the jig 20 at the outer peripheral portion of the convex portion 23. . Then, as shown in FIGS. 7C and 7D, the melted or softened glass pellet 10 was formed by transferring the shape of the convex portion 23 and as shown in FIGS. 7E and 7F. A recess 44 is formed on the lower surface 43 of the optical member 4. In this case, as shown in FIG. 8, even if the thickness of the frame 5 is thin, there is a recess 44 of the optical member 4, so that the flat substrate without the bottomed recess 31 and the like is the same as the configuration shown in FIG. The optical element 2 can be accommodated in a space formed between the recess 44 of the optical member 4 and the substrate 3F using 3F. The process of joining the optical member 4 with the frame 5 and the substrate 3F created in the process of FIG. 7 is the same as that of FIG. 4, and the description of the metal preform 6 is omitted in FIG. ing.
図9及び図10は、上記紫外線光素子及びそれに用いる光学部材の製造方法の別の変形例を示す。図3では、枠体5と略同形状の窪み21を有する治具20を用いているが、この変形例では、図9(a)及び(b)に示すように、上面22がフラットな治具20を用い、枠体5を直接治具20の上面22に載置している。そして、図9(c)(d)に示すように、溶融又は軟化したガラスペレット10は枠体5の内側の空洞部に流れ込み、図9(e)(f)に示すように、成形された光学部材4の下面43は枠体5の下面と面一(つらいち)となる。また、図10に示すように、枠体5は、パッケージ基板3の周壁32の上端部33に接合される下面51が光学部材4のパッケージ基板3に対向する側の下面43から露出されるように、光学部材4に埋没されている。ここで、枠体5の環状を成す部分の内周面52に適度な大きさの凹凸部を形成しておけば、溶融又は軟化したガラスがその凹凸部に流れ込み、アンカー効果を発揮するので、光学部材4と枠体5が強固に固定される。なお、図9の工程で作成された枠体5付きの光学部材4と、パッケージ基板3とを接合する工程は、上記図4と同様であり、図10では、金属プリフォーム6の記載を省略している。 9 and 10 show another modification of the method for manufacturing the ultraviolet light element and the optical member used therefor. In FIG. 3, a jig 20 having a recess 21 having substantially the same shape as that of the frame 5 is used. However, in this modification, as shown in FIGS. 9A and 9B, the upper surface 22 is flat. The tool 5 is used to place the frame 5 directly on the upper surface 22 of the jig 20. Then, as shown in FIGS. 9 (c) and 9 (d), the molten or softened glass pellet 10 flows into the cavity inside the frame 5, and is molded as shown in FIGS. 9 (e) and 9 (f). The lower surface 43 of the optical member 4 is flush with the lower surface of the frame 5. Further, as shown in FIG. 10, the frame body 5 is exposed such that the lower surface 51 joined to the upper end portion 33 of the peripheral wall 32 of the package substrate 3 is exposed from the lower surface 43 of the optical member 4 facing the package substrate 3. Furthermore, it is buried in the optical member 4. Here, if a moderately concavo-convex portion is formed on the inner peripheral surface 52 of the annular portion of the frame body 5, the molten or softened glass flows into the concavo-convex portion and exhibits an anchor effect. The optical member 4 and the frame 5 are firmly fixed. Note that the step of joining the optical member 4 with the frame 5 and the package substrate 3 created in the step of FIG. 9 and the package substrate 3 are the same as in FIG. 4, and the description of the metal preform 6 is omitted in FIG. doing.
以上説明したように、本発明によれば、軟化点が1000℃以下で、波長250〜400nmの光に対する平均透過率が80%以上であるガラスを用い、溶融又は軟化したガラスペレット10に治具25を押しつけて光学部材4を加圧成形しているので、製造工程数が少なく、且つ、工程自体が簡単である。また、光学部材4の成形と同時に、枠体5が光学部材4に一体的に接合されているため、メタライズ処理のためのマスキングや蒸着工程が不要になる。さらに、光学部材4と一体化された枠体5と、メタライズ処理されたパッケージ基板3の周壁32の上端部33とは、互いの接合面が金属となるので、金属プリフォーム6を用いることで、容易に無機材料(フィレット)で接合でき、製造工程をさらに簡単にすることができる。結果的に、低コストで、信頼性の高い紫外線光素子1や紫外線光素子用パッケージを提供することができる。また、ガラスの材料は、上記で例示したものに限定されず、さらに波長の短い深紫外線(例えば265nm)等に対する透過率が80%よりも低くても、実用上十分な透過率(例えば70%以上)を有するものであってもよい。 As described above, according to the present invention, a glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more with respect to light having a wavelength of 250 to 400 nm is used for a glass pellet 10 that is melted or softened. Since the optical member 4 is pressure-molded by pressing 25, the number of manufacturing steps is small and the steps themselves are simple. Moreover, since the frame 5 is integrally joined to the optical member 4 simultaneously with the molding of the optical member 4, masking and vapor deposition steps for metallization processing are not required. Further, the metal preform 6 is used for the frame 5 integrated with the optical member 4 and the upper end portion 33 of the peripheral wall 32 of the metallized package substrate 3 because the joint surface is made of metal. It can be easily joined with an inorganic material (fillet), and the manufacturing process can be further simplified. As a result, it is possible to provide the ultraviolet light element 1 and the ultraviolet light element package with high reliability at low cost. Further, the glass material is not limited to those exemplified above, and even if the transmittance for deep ultraviolet rays (for example, 265 nm) having a shorter wavelength is lower than 80%, a practically sufficient transmittance (for example, 70%). The above may be included.
1 紫外線光素子
2 光素子
3 パッケージ基板(基板)
3F 基板
4 光学部材
5 枠体
10 ガラスペレット
20 治具
25 治具
33 上端部(接合部、メタライズ部)
41、42 レンズ
DESCRIPTION OF SYMBOLS 1 Ultraviolet light element 2 Optical element 3 Package substrate (board | substrate)
3F substrate 4 optical member 5 frame 10 glass pellet 20 jig 25 jig 33 upper end part (joint part, metallized part)
41, 42 Lens
Claims (10)
前記光素子が実装されるセラミック製の基板と、
前記基板に実装された前記光素子と対向する部分にレンズを有し、前記基板に接合される光学部材と、を備えた紫外線光素子であって、
前記光学部材は、軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、
前記光学部材のうち前記基板との接合部には、該接合部と略同形状であって、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成された枠体が一体的に接合されており、
前記基板のうち前記光学部材との接合部には、メタライズ処理が施されたメタライズ部が形成されており、
前記枠体と前記メタライズ部とが無機材料により接合されることを特徴とする紫外線光素子。 An optical element that emits ultraviolet rays;
A ceramic substrate on which the optical element is mounted;
An optical element having a lens in a portion facing the optical element mounted on the substrate, and an optical member bonded to the substrate,
The optical member is formed of glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more for light having a wavelength of 250 to 400 nm,
A frame body made of a metal having substantially the same shape as that of the joint and having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is integrally formed at the joint portion of the optical member with the substrate. Are joined,
A metallized portion subjected to a metallization process is formed at a joint portion between the substrate and the optical member,
The ultraviolet light element, wherein the frame body and the metallized portion are bonded with an inorganic material.
前記光学部材は、前記光素子の配列パターンに対応するように配列された複数のレンズを有することを特徴とする請求項1乃至請求項4のいずれか一項に記載の紫外線光素子。 A plurality of the optical elements are mounted on the substrate in a predetermined arrangement pattern,
The ultraviolet optical element according to claim 1, wherein the optical member includes a plurality of lenses arranged to correspond to the arrangement pattern of the optical elements.
前記光学部材は、軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、
前記光学部材のうち前記基板との接合部には、該接合部と略同形状であって、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成された枠体が一体的に接合されており、
前記基板のうち前記光学部材との接合部には、メタライズ処理が施されたメタライズ部が形成されており、
前記枠体と前記メタライズ部とが無機材料により接合されることを特徴とする紫外線光素子用パッケージ。 A package for an ultraviolet light device comprising a ceramic substrate on which an optical device that emits ultraviolet light is mounted, and an optical member bonded to the substrate,
The optical member is formed of glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more for light having a wavelength of 250 to 400 nm,
A frame body made of a metal having substantially the same shape as that of the joint and having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is integrally formed at the joint portion of the optical member with the substrate. Are joined,
A metallized portion subjected to a metallization process is formed at a joint portion between the substrate and the optical member,
A package for an ultraviolet light element, wherein the frame and the metallized portion are bonded with an inorganic material.
軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスで形成されており、
前記光学部材のうち前記基板との接合部には、該接合部と略同形状であって、前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属で形成された枠体が一体的に接合されていることを特徴とする光学部材。 An optical member bonded to a ceramic substrate on which an optical element that emits ultraviolet light is mounted,
The softening point is 1000 ° C. or less, and the average transmittance for light with a wavelength of 250 to 400 nm is 80% or more, and is formed of glass.
A frame body made of a metal having substantially the same shape as that of the joint and having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is integrally formed at the joint portion of the optical member with the substrate. An optical member which is bonded.
軟化点が1000℃以下であり、且つ波長250〜400nmの光に対する平均透過率が80%以上であるガラスを所定サイズのガラスペレットに切断する工程と、
前記ガラスの熱膨張係数と略等しい熱膨張係数を有する金属を、前記光学部材のうち前記基板との接合部には、前記基板のうち前記光学部材との接合部と略同形状の枠体に形成する工程と、
前記枠体の表面に酸化膜を形成し、該酸化膜によって前記枠体と前記ガラスと封止接合する工程と、
窒素ガス環境下において、所定形状に形成された治具に前記枠体及び前記ガラスペレットを載置し、前記軟化点よりも高い第1の温度に加熱して前記ガラスペレットを溶融させ、前記治具の形状を転写させた所定形状の光学部材を成形する工程と、
前記枠体のうち前記ガラスと接合していない面の酸化膜を除去する工程と、を備えたことを特徴とする光学部材の製造方法。 A method of manufacturing an optical member to be bonded to a ceramic substrate on which an optical element that emits ultraviolet light is mounted,
A step of cutting glass having a softening point of 1000 ° C. or less and an average transmittance of 80% or more with respect to light having a wavelength of 250 to 400 nm into glass pellets of a predetermined size;
A metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the glass is formed into a frame body having substantially the same shape as a bonding portion with the optical member of the substrate. Forming, and
Forming an oxide film on the surface of the frame, and sealingly bonding the frame and the glass with the oxide film;
In a nitrogen gas environment, the frame and the glass pellet are placed on a jig formed in a predetermined shape, and heated to a first temperature higher than the softening point to melt the glass pellet, Forming an optical member having a predetermined shape to which the shape of the tool is transferred;
And a step of removing an oxide film on a surface of the frame body that is not bonded to the glass.
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WO2020240907A1 (en) * | 2019-05-30 | 2020-12-03 | 株式会社村田製作所 | Electronic device and method of producing same |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142936A (en) * | 1984-08-06 | 1986-03-01 | Shinko Electric Ind Co Ltd | Manufacture of body structure with light transmitting window |
JPH02106056A (en) * | 1988-10-14 | 1990-04-18 | Matsushita Electron Corp | Cap with lens window |
JP2002033519A (en) * | 2000-07-14 | 2002-01-31 | Sumitomo Electric Ind Ltd | Package for optical communication, its window member, and its manufacturing method |
JP2002076494A (en) * | 2000-08-30 | 2002-03-15 | Mitsubishi Electric Corp | Cap for optical semiconductor device and optical semiconductor device using the same |
JP2003095692A (en) * | 2001-09-19 | 2003-04-03 | Nippon Electric Glass Co Ltd | Cover glass for optical semiconductor |
JP2004235652A (en) * | 2003-01-31 | 2004-08-19 | Osram Opto Semiconductors Gmbh | Light emitting diode carrier |
JP2005038956A (en) * | 2003-07-17 | 2005-02-10 | Matsushita Electric Ind Co Ltd | Optical component and manufacturing method thereof |
JP2007053261A (en) * | 2005-08-18 | 2007-03-01 | Matsushita Electric Ind Co Ltd | Package for electronic component and its manufacturing method |
JP2007103673A (en) * | 2005-10-04 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Lid and manufacturing method thereof, and manufacturing method of glass molded body |
WO2011016295A1 (en) * | 2009-08-05 | 2011-02-10 | コニカミノルタオプト株式会社 | Light emitting device and method for manufacturing light emitting device |
JPWO2011016282A1 (en) * | 2009-08-05 | 2013-01-10 | コニカミノルタアドバンストレイヤー株式会社 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD |
JP2013091593A (en) * | 2011-10-04 | 2013-05-16 | Omg Co Ltd | Ultraviolet light-transmitting glass |
WO2013179287A1 (en) * | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Photovoltaic module assembly |
JP2015018873A (en) * | 2013-07-09 | 2015-01-29 | 日機装株式会社 | Semiconductor module |
JP2015193521A (en) * | 2014-03-19 | 2015-11-05 | 日本電気硝子株式会社 | Ultraviolet transmission glass and production method |
JP2017059716A (en) * | 2015-09-17 | 2017-03-23 | 日機装株式会社 | Light emitting module and manufacturing method of the same |
JP2017073489A (en) * | 2015-10-08 | 2017-04-13 | エヌイーシー ショット コンポーネンツ株式会社 | Metal-glass lid and duv-led device arranged by use thereof |
-
2017
- 2017-08-25 JP JP2017161907A patent/JP6644745B2/en active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142936A (en) * | 1984-08-06 | 1986-03-01 | Shinko Electric Ind Co Ltd | Manufacture of body structure with light transmitting window |
JPH02106056A (en) * | 1988-10-14 | 1990-04-18 | Matsushita Electron Corp | Cap with lens window |
JP2002033519A (en) * | 2000-07-14 | 2002-01-31 | Sumitomo Electric Ind Ltd | Package for optical communication, its window member, and its manufacturing method |
JP2002076494A (en) * | 2000-08-30 | 2002-03-15 | Mitsubishi Electric Corp | Cap for optical semiconductor device and optical semiconductor device using the same |
JP2003095692A (en) * | 2001-09-19 | 2003-04-03 | Nippon Electric Glass Co Ltd | Cover glass for optical semiconductor |
JP2004235652A (en) * | 2003-01-31 | 2004-08-19 | Osram Opto Semiconductors Gmbh | Light emitting diode carrier |
JP2005038956A (en) * | 2003-07-17 | 2005-02-10 | Matsushita Electric Ind Co Ltd | Optical component and manufacturing method thereof |
JP2007053261A (en) * | 2005-08-18 | 2007-03-01 | Matsushita Electric Ind Co Ltd | Package for electronic component and its manufacturing method |
JP2007103673A (en) * | 2005-10-04 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Lid and manufacturing method thereof, and manufacturing method of glass molded body |
WO2011016295A1 (en) * | 2009-08-05 | 2011-02-10 | コニカミノルタオプト株式会社 | Light emitting device and method for manufacturing light emitting device |
JPWO2011016282A1 (en) * | 2009-08-05 | 2013-01-10 | コニカミノルタアドバンストレイヤー株式会社 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD |
JP2013091593A (en) * | 2011-10-04 | 2013-05-16 | Omg Co Ltd | Ultraviolet light-transmitting glass |
WO2013179287A1 (en) * | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Photovoltaic module assembly |
JP2015018873A (en) * | 2013-07-09 | 2015-01-29 | 日機装株式会社 | Semiconductor module |
JP2015193521A (en) * | 2014-03-19 | 2015-11-05 | 日本電気硝子株式会社 | Ultraviolet transmission glass and production method |
JP2017059716A (en) * | 2015-09-17 | 2017-03-23 | 日機装株式会社 | Light emitting module and manufacturing method of the same |
JP2017073489A (en) * | 2015-10-08 | 2017-04-13 | エヌイーシー ショット コンポーネンツ株式会社 | Metal-glass lid and duv-led device arranged by use thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020240907A1 (en) * | 2019-05-30 | 2020-12-03 | 株式会社村田製作所 | Electronic device and method of producing same |
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