JP2019033465A - headphone - Google Patents

Abstract

To provide a headphone capable of adjusting frequency response characteristics in accordance with a shape of a housing.SOLUTION: A left sound emitting unit 10 includes: a driver unit 14; a baffle plate 12; a housing cover 17; and an acoustic resistance material 15 arranged between the driver unit and the housing cover. The housing cover forms a space between the driver unit and the baffle plate. The driver unit includes a diaphragm 141 and communication holes. A space includes a first area A1 and a second area A2. The diaphragm includes a main dome 141a and a sub-dome 141b. The communication holes include: a first communication hole 142ah opposing to the main dome and introducing a first sonic wave from the main dome to the first area; and second communication holes 143bh opposing to the sub-dome and introducing a second sonic wave from the sub-dome to the second area. The housing cover includes at least one vent hole 171h1 for allowing the second area to communicate with an outer side of the housing cover.SELECTED DRAWING: Figure 3

Description

  The present invention relates to headphones.

  Among sealed headphones (hereinafter referred to as “headphones”), for example, ear-covered headphones are worn on the heads of headphone users so that users can listen to music from a sound source such as a music player. Used for. The headphones include a pair of sound emission units (earpieces) and a connecting member connected to both sound emission units.

  The sound emitting unit includes a driver unit, a baffle plate, and a housing. The driver unit converts, for example, an electrical signal (audio signal) from a sound source such as a musical sound player into a sound wave and outputs the sound wave. The driver unit is a dynamic driver unit including a diaphragm, a magnetic circuit, and a unit case. The baffle plate holds the driver unit. The housing accommodates the driver unit. The housing is attached to the baffle plate and forms a space (air chamber) together with the driver unit and the baffle plate.

  Generally, the frequency response characteristics of headphones are adjusted by the volume of the housing (volume of the air chamber) and the acoustic resistance material accommodated in the housing (see, for example, Patent Document 1 and Patent Document 2).

  In the technique disclosed in Patent Document 1, a hole provided in a driver unit through which a sound wave introduced from the diaphragm into the air chamber passes is covered with a braking cloth such as a nonwoven fabric, and the frequency of the headphones is determined depending on the material and thickness of the braking cloth. Adjust the response characteristics.

  The technique disclosed in Patent Document 2 divides an air chamber into a plurality of cavities (a main cavity, a first subcavity, and a second subcavity) by a sub housing that covers the driver unit and a plurality of acoustic resistance materials, The frequency response characteristics of the headphones are adjusted by selecting various acoustic resistance materials.

Japanese Utility Model Publication No.59-121989 JP 2003-179990 A

  The technique disclosed in Patent Document 1 must disassemble the driver unit in order to replace some of the braking cloths. Therefore, in the technique disclosed in Patent Document 1, it is difficult to replace the braking cloth, and it is impossible to adjust the frequency response characteristics of the headphones corresponding to housings (air chambers) having different shapes and sizes (volumes).

  On the other hand, in the technique disclosed in Patent Document 2, the sub housing must be attached to the baffle plate in order to arrange a plurality of acoustic resistance materials in the air chamber. The shape and size of the acoustic resistance material depends on the shape and size of the sub-housing. Therefore, it is difficult for the technique disclosed in Patent Document 2 to adjust the frequency response characteristics of the headphones in correspondence with housings (air chambers) having different shapes and sizes (volumes).

  The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a headphone capable of easily adjusting the frequency response characteristic according to the shape of the housing.

  A headphone according to the present invention includes a headband, a first sound emitting unit attached to one end of the headband, and a second sound emitting unit attached to the other end of the headband, and the first sound emitting unit. The unit includes a driver unit, a baffle plate to which the driver unit is attached, a housing cover that houses the driver unit, and an acoustic resistance material that is disposed between the driver unit and the housing cover. A space is formed by the unit and the baffle plate, and the driver unit includes a diaphragm and a communication hole for introducing sound waves from the diaphragm into the space, and the space is adjacent to the first region and the first region. The diaphragm includes a main dome and a sub dome, and the communication hole faces the main dome, A first communication hole for introducing the first sound wave from the first region into the first region, and a second communication hole facing the sub dome and introducing the second sound wave from the sub dome into the second region. It comprises at least one vent hole for communicating the two regions with the outside of the housing cover.

  According to the present invention, it is possible to easily adjust the frequency response characteristics of the headphones according to the shape of the housing.

1 is a perspective view showing an embodiment of a headphone according to the present invention. It is A arrow directional view of the left sound emission unit with which the headphones of FIG. 1 are provided. FIG. 3 is a cross-sectional view of the left sound emission unit of FIG. It is a disassembled perspective view of the left sound emission unit of FIG. It is a left view of the baffle board with which the left sound emission unit of FIG. 2 is provided, and a driver unit. It is a right view of the housing cover with which the left sound emission unit of FIG. 2 is provided. It is CC sectional view taken on the line of the headphones of FIG. It is a schematic diagram which shows the path | route of the sound wave from the diaphragm with which the headphones of FIG. 1 are provided.

● Headphones ●
Hereinafter, embodiments of headphones according to the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of a headphone according to the present invention.

  The headphone 1 is attached to the head of the user of the headphone 1 and outputs sound waves according to an audio signal from a sound source (not shown) such as a portable music player toward the user's ear. The headphone 1 is a wired headphone that receives an audio signal from a sound source via a cable.

  The headphones according to the present invention may be wireless headphones that receive audio signals from a sound source via a wireless communication line.

  In the following description, the up / down / left / right / front / rear directions with respect to the headphones 1 are the same as the up / down / right / left / back / front / back directions with respect to the user when the headphones 1 are mounted on the user's head (hereinafter referred to as “worn state”). is there. That is, for example, the left sound emission unit 10 to be described later is attached to the left ear of the user.

  The headphone 1 includes a left sound emission unit 10, a right sound emission unit 20, and a headband 30. The left sound emitting unit 10 and the right sound emitting unit 20 constitute a pair of sound emitting units.

  FIG. 2 is a view of the left sound emission unit 10 in FIG.

  The left sound emitting unit 10 is mounted around the user's left ear and outputs sound waves according to the sound signal from the sound source.

FIG. 3 is a cross-sectional view of the left sound emission unit 10 of FIG.
FIG. 4 is an exploded perspective view of the left sound emission unit 10.

  The left sound emission unit 10 includes an ear pad 11, a baffle plate 12, a protector 13, a driver unit 14, an acoustic resistance material 15, a connecting member 16, and a housing cover 17. The baffle plate 12, the driver unit 14, and the housing cover 17 constitute a left housing LH.

  The ear pad 11 is a cushioning material between the left housing LH and the user's head.

FIG. 5 is a left side view of the baffle plate 12 and the driver unit 14.
This figure shows the baffle plate 12 and the driver unit 14 held by the baffle plate 12 as viewed from the left.

  The baffle plate 12 holds the ear pad 11 and the driver unit 14. The baffle plate 12 is made of, for example, a synthetic resin. The baffle plate 12 is oval when viewed from the left side. The baffle plate 12 includes a first sound hole 12h1, a second sound hole 12h2, a third sound hole 12h3, a fourth sound hole 12h4, and a unit mounting hole 12h5.

  The first sound hole 12h1 to the fourth sound hole 12h4 have an arc shape when viewed from the left side. The first sound holes 12h1 to the fourth sound holes 12h4 are arranged at equal intervals in the circumferential direction around the unit mounting holes 12h5. The functions of the first sound hole 12h1 to the fourth sound hole 12h4 will be described later.

  The unit mounting hole 12h5 holds the driver unit 14. The unit mounting hole 12h5 is circular in the left side view. The unit mounting hole 12h5 is disposed at the center of the baffle plate 12 in the left side view.

Returning to FIG. 3 and FIG.
The protector 13 protects the driver unit 14. The protector 13 has a disk shape. The protector 13 includes a plurality of slit-shaped sound holes 13h. The sound hole 13h introduces sound waves from the driver unit 14 into the second space R2 described later.

  The driver unit 14 converts an audio signal from the sound source into a sound wave and outputs the sound wave. The driver unit 14 includes a diaphragm 141, a drive unit 142, and a frame 143.

  The vibration plate 141 vibrates based on the drive (vibration) of the drive unit 142 and outputs sound waves. The diaphragm 141 includes a main dome 141a and a sub dome 141b.

  The main dome 141a mainly generates sound waves in the middle sound range (about 2 kHz) -high sound range (about 40 kHz). The main dome 141a has a circular dome shape when viewed from the left side, and a dome shape that protrudes rightward (left side of the paper in FIG. 3) when viewed in cross section.

  The sub dome 141b mainly generates a sound wave in a low sound range (about 200 Hz or less). The sub dome 141b has a ring shape in the left side view and a circular arc shape to the right in the cross sectional view. The sub dome 141b is connected to the outer peripheral edge of the main dome 141a.

  The drive unit 142 drives (vibrates) the diaphragm 141 by driving (vibrating) according to the processing signal. The drive unit 142 includes a magnetic circuit 142a and a voice coil 142b.

  The magnetic circuit 142a includes a magnetic gap G and a first communication hole 142ah, and generates a magnetic flux in the magnetic gap G. The first communication hole 142ah is a hole that penetrates the magnetic circuit 142a in the left-right direction (the left-right direction in FIG. 3). The first communication hole 142ah is disposed at the center of the magnetic circuit 142a. The magnetic circuit 142 a is fitted into the main body 143 a of the frame 143.

  The voice coil 142b is driven according to the audio signal. The voice coil 142b is attached to the boundary between the main dome 141a and the sub dome 141b of the diaphragm 141 on the left surface of the diaphragm 141 (the surface on the right side in FIG. 3).

  The frame 143 holds the diaphragm 141 and the drive unit 142. The frame 143 is made of, for example, a synthetic resin. The frame 143 has a circular hat shape (see FIG. 5) in plan view. The frame 143 includes a main body portion 143a and a flange portion 143b. The main body 143a is cylindrical. The collar portion 143b has a ring shape. The flange portion 143b is disposed on the outer peripheral surface of the opening end of the main body portion 143a. The flange portion 143b includes a plurality of communication holes (hereinafter referred to as “second communication holes”) 143bh for braking the diaphragm 141. As shown in FIG. 5, the second communication holes 143bh are arranged at equal intervals in the circumferential direction of the flange portion 143b.

  Note that some of the second communication holes may be covered from the left with an acoustic resistance material (not shown) such as a nonwoven fabric. Of the plurality of second communication holes, the second communication hole covered with the acoustic resistance material is determined by the frequency response characteristics of the headphones.

  The diaphragm 141 is attached to the right surface (the surface on the left side of FIG. 3) of the flange portion 143b of the frame 143. At this time, the first communication hole 142ah of the magnetic circuit 142a faces the main dome 141a, and the plurality of second communication holes 143bh of the flange portion 143b faces the sub dome 141b. The voice coil 142b is disposed in the magnetic gap G of the magnetic circuit 142a.

  The acoustic resistance material 15 has a middle and high frequency range of sound waves (hereinafter referred to as “first sound waves”) P1 (see FIG. 8) passing through the first communication hole 142ah of the magnetic circuit 142a among the sound waves from the diaphragm 141. Attenuating acoustic resistance. That is, the acoustic resistance material 15 is a sound absorbing material in the middle / high sound range. The acoustic resistance material 15 includes a first acoustic resistance material 151 and a second acoustic resistance material 152.

  The first acoustic resistance material 151 is an acoustic resistance that passes the high sound range of the first sound wave P1. The first acoustic resistance material 151 has a disk shape with an opening 151h at the center, that is, a flat ring shape. The first acoustic resistance material 151 is made of a synthetic resin such as silicon rubber, for example. The diameter of the opening 151h (the inner diameter of the first acoustic resistance material 151) L1 is larger than the diameter L2 of the first communication hole 142ah of the magnetic circuit 142a.

  The second acoustic resistance material 152 is an acoustic resistance that passes through the midrange of the first sound wave P1. The second acoustic resistance material 152 has a disk shape. The second acoustic resistance material 152 is made of, for example, a foamable resin such as urethane. The outer diameter L3 of the second acoustic resistance material 152 is larger than the outer diameter L4 of the first acoustic resistance material 151. The thickness of the second acoustic resistance material 152 is larger than the thickness of the first acoustic resistance material 151.

  The connecting member 16 connects the left housing LH and the headband 30 (see FIG. 1), and supports the left housing LH with respect to the headband 30. The connecting member 16 includes an arc-shaped main body portion 161, a rotation support portion 162, a first support portion 163, and a second support portion 164.

  The rotation support part 162 supports the main body part 161 with respect to the headband 30. The main body portion 161 can rotate with respect to the headband 30 around the rotation support portion 162. The rotation support portion 162 is disposed at the center of the main body portion 161. The first support portion 163 and the second support portion 164 support the main body portion 161 with respect to the left housing LH. The main body 161 can swing with respect to the left housing LH around the first support 163 and the second support 164. That is, the left housing LH can rotate and swing with respect to the headband 30 via the connecting member 16.

  The housing cover 17 accommodates the driver unit 14, the acoustic resistance material 15, and the connecting member 16. The housing cover 17 includes a housing member 171 and a cover member 172.

FIG. 6 is a right side view of the housing cover 17.
This figure shows the housing cover 17 as viewed from the right.

  The accommodating member 171 accommodates the driver unit 14, the acoustic resistance material 15, and the connecting member 16 (see FIG. 4). The accommodating member 171 has an open end and has an elliptical bowl shape in the right side view. The housing member 171 is made of a synthetic resin such as acrylonitrile / butadiene / styrene resin (ABS), for example. The housing member 171 includes a peripheral surface portion 171a, a bottom surface portion 171b, a notch portion 171c, a first connection support portion 171d, a second connection support portion 171e, a first ventilation hole 171h1, a second ventilation hole 171h2, And an opening 171h3.

  The notch 171c restricts the movement of the rotation support part 162 of the connecting member 16 (swing of the connecting member 16). The notch 171 c is disposed on the upper surface of the peripheral surface portion 171 a of the housing member 171.

  The first connection support portion 171 d supports the first support portion 163 of the connection member 16. The second connection support portion 171 e supports the second support portion 164 of the connection member 16.

  The first ventilation hole 171h1 and the second ventilation hole 171h2 release part of the sound wave from the driver unit 14 to the outside of the housing cover 17. The first ventilation hole 171h1 and the second ventilation hole 171h2 are arranged at the lower part of the housing member 171 with a space in the front-rear direction. The first ventilation hole 171h1 and the second ventilation hole 171h2 penetrate the housing member 171 in the left-right direction.

  The opening 171h3 together with the cover member 172 forms a recess in the present invention. The opening 171h3 is disposed at the center of the bottom surface portion 171b in the right side view.

Returning to FIG.
The cover member 172 protects the outer surface of the housing member 171. The cover member 172 is made of, for example, an aluminum metal. The cover member 172 includes a restriction hole 172h.

  The cover member 172 is attached to the outer surface of the housing member 171 and covers the outer surface of the housing member 171. As a result, the cover member 172 closes one end of the opening 171h3 of the housing member 171 and forms a recess together with the opening 171h3 as described above. At this time, the cover member 172 exposes the first ventilation hole 171h1 and the second ventilation hole 171h2 to the outside of the housing cover 17, for example, by a slit-shaped opening. Therefore, the inside of the housing cover 17 communicates with the outside of the housing cover 17 via the first ventilation hole 171h1 and the second ventilation hole 171h2. That is, the first vent hole 171h1 and the second vent hole 171h2 function as vent holes in the present invention.

  FIG. 7 is a cross-sectional view of the headphone 1 of FIG.

  The restriction hole 172h restricts the movement of the rotation support portion 162 of the connecting member 16 (the swing of the connecting member 16). The shape of the restriction hole 172h is a shape in which the short side of the rectangle is replaced with a semicircle. The restriction hole 172h is arranged on the upper part of the cover member 172 so as to be aligned with the notch 171c (see FIG. 6) of the housing member 171. As a result, the inside of the housing cover 17 communicates with the outside of the housing cover 17 through the notch 171c and the restriction hole 172h. That is, the notch 171c and the restriction hole 172h function as a vent hole in the present invention.

Returning to FIG.
The right sound emitting unit 20 is mounted around the user's right ear and outputs sound waves according to the sound signal from the sound source. The configuration of the right sound emission unit 20 is the same as that of the left sound emission unit 10.

  The headband 30 connects a pair of sound emitting units (the left sound emitting unit 10 and the right sound emitting unit 20). That is, the left sound emission unit 10 is attached to one end of the headband 30, and the right sound emission unit 20 is attached to the other end of the headband 30. The headband 30 is arched along the shape of the user's head.

Assembly of Left Sound Output Unit Next, the assembly of the left sound output unit 10 will be described with reference to FIGS. 3 and 4.

  First, the protector 13 and the driver unit 14 are attached to the baffle plate 12. The driver unit 14 is fitted into the unit mounting hole 12h5 of the baffle plate 12 with the vibration plate 141 facing rightward (leftward in FIG. 3). The protector 13 is attached to the right side of the baffle plate 12 (the left side in FIG. 3). The protector 13 covers the unit mounting hole 12h5 and faces the vibration plate 141.

  Next, the connecting member 16 is accommodated in the housing cover 17. The first support part 163 is supported by the first connection support part 171d. The second support part 164 is supported by the second connection support part 171e. The rotation support portion 162 passes through the cutout portion 171c of the housing cover 17 and the restriction hole 172h. That is, the rotation support portion 162 that is a part of the connecting member 16 is disposed in the notch portion 171c and the restriction hole 172h.

  Thus, the number of holes arranged in the housing cover 17 is reduced by causing the restricting hole 172h in which a part of the connecting member 16 (the rotation support part 162) is arranged and the notch part 171c to function also as a ventilation hole. In addition, the size of each of the first vent hole 171h1 and the second vent hole 171h2 can be reduced. As a result, the degree of freedom in arranging the air holes is increased and the design of the headphones 1 is improved.

  Next, the acoustic resistance material 15 is accommodated in the housing cover 17 in the order of the second acoustic resistance material 152 and the first acoustic resistance material 151. The second acoustic resistance material 152 covers the opening 171 h 3 of the housing member 171, that is, the concave portion of the housing cover 17 from the right side, and comes into contact with the right surface of the bottom surface portion 171 b of the housing member 171 (the left surface in FIG. 3). As a result, the recess (opening 171h3) of the housing cover 17 faces the second acoustic resistance material 152. The first acoustic resistance material 151 abuts on the second acoustic resistance material 152. That is, the second acoustic resistance material 152 is disposed between the first acoustic resistance material 151 and the housing cover 17.

  Next, the baffle plate 12 is attached to the open end of the housing cover 17. Therefore, the open end of the housing cover 17 is covered with the baffle plate 12 and the driver unit 14. As a result, the housing cover 17 forms a space (hereinafter referred to as “first space”) R <b> 1 with the baffle plate 12 and the driver unit 14. The driver unit 14 is accommodated in the housing cover 17.

  The first acoustic resistance material 151 contacts the driver unit 14 and the second acoustic resistance material 152. The second acoustic resistance material 152 contacts the housing cover 17. That is, the first acoustic resistance material 151 and the second acoustic resistance material 152 are sandwiched between the driver unit 14 and the housing cover 17 (the bottom surface portion 171b of the housing member 171). At this time, the first acoustic resistance material 151 and the second acoustic resistance material 152 are pressed by the driver unit 14 and the housing cover 17. Therefore, the driver unit 14 is fixed to the baffle plate 12 by the repulsive force between the first acoustic resistance material 151 and the second acoustic resistance material 152. As a result, when the driver unit 14 outputs a sound wave (when the diaphragm 141 vibrates), the vibration of the driver unit 14 is suppressed. When the sound wave from the driver unit 14 reaches the housing cover 17, the vibration of the housing cover 17 due to the sound wave is absorbed by the second acoustic resistance material 152.

  On the left side of the driver unit 14 (rightward in FIG. 3), the first acoustic resistance material 151, the space r1 inside the opening 151h of the first acoustic resistance material 151, the second acoustic resistance material 152, and the recess A space r2 in (opening 171h3) is arranged. The first communication hole 142ah communicates with the space r1. The concave portion faces the first communication hole 142ah via the second acoustic resistance material 152. The second acoustic resistance material 152 has a central portion facing the first communication hole 142ah and an outer edge portion facing the second communication hole 143bh.

  The first space R1 includes a region (hereinafter referred to as “first region”) A1 in which the first acoustic resistance material 151, the space r1, and the second acoustic resistance material 152 are disposed, and the first region A1. It is divided into a ring-shaped space (hereinafter referred to as “second region”) A2 along the circumferential direction of the acoustic resistance material 15 and a region (hereinafter referred to as “third region”) A3 occupied by the space r2 in the recess. It is done. In other words, the first space R1 includes the first region A1, the second region A2, and the third region A3.

  The first area A1 is a substantially disk-shaped area. The second region A2 is a substantially ring-shaped region that is adjacent to the first region A1 and surrounds the first region A1 in the circumferential direction of the acoustic resistance material 15. The third area A3 is a disk-shaped area adjacent to the first area A1.

  The second region A2 (first space R1) is located outside the housing cover 17 via the first ventilation hole 171h1, the second ventilation hole 171h2, and the restriction hole 172h (notch 171c) of the housing cover 17. Communicate with space.

  The space r3 on the inner side (left side) of the main dome 141a communicates with the first region A1 (space r1) through the first communication hole 142ah. The space r4 inside (left side) of the sub dome 141b communicates with the second region A2 through the second communication hole 143bh.

  Next, the ear pad 11 is attached to the right surface of the baffle plate 12. In the mounted state, the ear pad 11 forms a space (hereinafter referred to as “second space”) R <b> 2 between the protector 13 and the user's temporal region.

  The first space R1 (second region A2) communicates with the second space R2 via the first sound hole 12h1 to the fourth sound hole 12h4 of the baffle plate 12. Therefore, the balance between the air stiffness of the first space R1 and the air stiffness of the second space R2 is maintained, and the vibration of the diaphragm 141 becomes smooth.

Operation of Headphone Next, the operation of the headphone 1 will be described using the left sound emission unit 10 as an example.

  FIG. 8 is a schematic diagram showing a sound wave path from the diaphragm 141 in the cross-sectional view of the left sound emitting unit 10 of FIG.

  In the figure, among the sound waves from the diaphragm 141, the path of the first sound wave P1 is indicated by a white arrow, and the path of the second sound wave P2 is indicated by a black arrow. Here, the second sound wave P2 is a sound wave that passes through the second communication hole 143bh among the sound waves from the diaphragm 141.

  When the vibration plate 141 vibrates, the first sound wave P1 is output from the main dome 141a and the second sound wave P2 is output from the sub dome 141b to the left from the vibration plate 141, respectively. The first sound wave P1 is a sound wave having a high sound pressure level mainly in the middle / high range, and the second sound wave P2 is a sound wave mainly having a high sound pressure level in the low sound range.

  The first sound wave P1 from the main dome 141a passes through the first communication hole 142ah and reaches the first region A1 (space r1). That is, the first communication hole 142ah introduces the sound wave (first sound wave P1) from the diaphragm 141 (main dome 141a) into the first space R1 (first region A1).

  A part of the first sound wave P1 that has reached the first region A1 (space r1) is reflected by the second acoustic resistance material 152, proceeds in the space r1 toward the first acoustic resistance material 151, and the first acoustic resistance. The material 151 is entered. The first sound wave P1 that has entered the first acoustic resistance material 151 passes through the first acoustic resistance material 151 and reaches the second region A2. The sound wave P11 that has reached the second area A2 is the first sound wave P1 in which the middle sound range is attenuated (the sound pressure level is suppressed) by the first acoustic resistance material 151.

  On the other hand, another part of the first sound wave P1 that has reached the first area A1 enters the second acoustic resistance material 152 and reaches the third area A3 (space r2). That is, the opening 151 h of the first acoustic resistance material 151 introduces a part of the first sound wave P <b> 1 to the second acoustic resistance material 152. The first sound wave P1 reaching the third region A3 is reflected by the cover member 172 and enters the second acoustic resistance material 152 again.

  Here, as described above, the housing member 171 is in contact with the second acoustic resistance material 152, and the cover member 172 is fixed to the housing member 171. Therefore, when the cover member 172 reflects the first sound wave P1, the vibration (resonance with the first sound wave P1) of the cover member 172 is transmitted to the second acoustic resistance material 152 via the housing member 171, and the second acoustic resistance. Absorbed by the material 152. That is, the vibration of the housing cover 17 is suppressed. That is, the generation of low-frequency sound waves due to the vibration of the housing cover 17 is suppressed. Therefore, the frequency response characteristic of the headphones 1 in the low sound range is improved.

  The first sound wave P1 that has entered the second acoustic resistance material 152 again passes through the second acoustic resistance material 152 and reaches the second region A2. The sound wave P12 that has reached the second region A2 is the first sound wave P1 in which the high frequency range is attenuated by the second acoustic resistance material 152.

  Next, the second sound wave P2 from the sub dome 141b passes through the second communication hole 143bh of the flange portion 143b and reaches the second region A2. That is, the second communication hole 143bh introduces the sound wave (second sound wave P2) from the diaphragm 141 (sub dome 141b) into the first space R1 (second region A2). As described above, the second sound wave P2 that has reached the second region A2 is a sound wave mainly having a high sound pressure level in the low sound range.

  In this way, the first sound wave P1 from the main dome 141a is high due to the sound wave P11 whose middle sound range is reduced by the first acoustic resistance material 151 (the sound pressure level of the high sound range is high) and the second sound resistance material 152. The sound wave P12 is divided into the sound wave P12 whose sound range is reduced (the sound pressure level in the middle sound range is high) and reaches the second region A2. On the other hand, the second sound wave P2 from the sub dome 141b reaches the second region A2 in a state where the sound pressure level in the low sound region is high. That is, each of the sound waves P11, P12, P2 output from the diaphragm 141 to the first space R1 reaches the second region A2 in a state where the sound pressure level in a predetermined sound region (low sound region, middle sound region, high sound region) is high. To do.

  Further, by arranging the ring-shaped first acoustic resistance material 151 and the disk-shaped second acoustic resistance material 152 in the first area A1, the reflection distance of the first sound wave P1 that has reached the first area A1, that is, The distance that the first sound wave P1 travels in the first region A1 is compared to the case where no acoustic resistance material is arranged in the first region A1 or the case where a single acoustic resistance material is arranged in the first region A1. Extended.

  The sound waves P11, P12, P2 that have reached the second region A2 travel toward the peripheral surface portion 171a of the housing member 171 while being reflected by the baffle plate 12 and the housing cover 17 in the second region A2, and thus are vent holes, that is, The first vent hole 171h1, the second vent hole 171h2, and the restriction hole 172h (notch portion 171c) are discharged to the outside of the left housing LH. As a result, in the frequency response characteristics of the headphones 1, the sound pressure level in a predetermined sound range (low sound range, mid sound range, high sound range) corresponding to each sound wave P11, P12, P2 increases.

  Here, in the ventilation holes (first ventilation hole 171h1, second ventilation hole 171h2, regulation hole 172h (ventilation hole)), each sound wave P11, P12, P2 is left housing left housing LH (second region A2) from the left housing. This is a route to the outside of the LH. That is, the air in the vent hole functions as an acoustic resistance to the sound waves P11, P12, P2 from the inside of the left housing LH (second region A2) to the outside of the left housing LH. Usually, the acoustic resistance value of the air in the vent hole depends on the size of the vent hole. As a result, for example, in the frequency response characteristics of the headphones 1, the sound pressure level in the low frequency range increases when the vent hole is reduced, and the sound pressure level in the low frequency range decreases when the vent hole is increased.

Summary According to the embodiment described above, the first sound wave P1 from the main dome 141a is reflected in the first region A1, passes through the acoustic resistance material 15, and reaches the second region A2. The first sound wave P <b> 1 (P <b> 11, P <b> 12) that has reached the second region A <b> 2 is attenuated in a predetermined sound range (medium sound region, high sound region) by the acoustic resistance material 15. On the other hand, the second sound wave P2 from the sub dome 141b reaches the second region A2 without being attenuated. The sound waves P11, P12, and P2 that have reached the second region A2 are formed in the housing cover 17 (left housing LH) from the ventilation holes, that is, the first ventilation hole 171h1, the second ventilation hole 171h2, and the restriction hole 172h (notch portion 171c). ) To the outside. As a result, in the frequency response characteristics of the headphones 1, the sound pressure level in a predetermined sound range (low range, mid range, and high range) is increased.

  Further, according to the embodiment described above, the acoustic resistance material 15 includes the first acoustic resistance material 151 and the second acoustic resistance material 152. The material of the first acoustic resistance material 151 is different from the material of the second acoustic resistance material 152. Therefore, in the first region A1, the first sound wave P1 that has passed through the acoustic resistance material 15 becomes two sound waves P11 and P12 whose predetermined sound range (medium sound range and high sound range) is attenuated by the acoustic resistance material 15.

  Thus, the headphone 1 adjusts the sound pressure level of the first sound wave P1 with the first acoustic resistance material 151 and the second acoustic resistance material 152 in the first area A1, and each sound wave P11 in the second area A2. , P12, P2 are discharged to the outside of the left housing LH through the vent holes 171h1, 171h2, 172h (171c). As a result, in the frequency response characteristics of the headphones 1, the sound pressure level in a predetermined sound range (low range, mid range, and high range) is increased. The first region and the second region are determined by the shapes of the first acoustic resistance material 151 and the second acoustic resistance material 152, respectively. The first acoustic resistance material 151 and the second acoustic resistance material 152 are sandwiched between the driver unit 14 and the housing cover 17 and can be easily exchanged. That is, the headphones according to the present invention can easily adjust the frequency response characteristics according to the shape of the left housing LH by exchanging the acoustic resistance material 15 arranged in the first region and adjusting the size of the vent hole. Can do.

  Furthermore, according to the embodiment described above, the first acoustic resistance material 151 has a ring shape and includes the openings 151h for introducing the first sound wave P1 into the first acoustic resistance material 151 and the second acoustic resistance material 152, respectively. . The diameter of the opening 151h is larger than the diameter of the first communication hole 142ah. Therefore, the first sound wave P1 that has reached the first region A1 enters the second acoustic resistance material 152, travels in the space r1 while being reflected between the second acoustic resistance material 152 and the driver unit 14, The first acoustic resistance material 151 is reached. That is, the reflection distance of the first sound wave P1 that has reached the first region A1 (the distance traveled by the first sound wave P1) is extended according to the diameter of the opening 151h. As a result, in the frequency response characteristics of the headphones 1, the sound pressure level at a predetermined frequency corresponding to the reflection distance of the first sound wave P1 is improved. In other words, the headphones according to the present invention adjust the reflection distance of the first sound wave P1 by changing the shapes of the first acoustic resistance material 151 and the second acoustic resistance material 152, and according to the reflection distance. Improve the sound pressure level at a predetermined frequency.

  Furthermore, according to the embodiment described above, the housing cover 17 includes the concave portion constituted by the opening 171h3 of the housing member 171 and the cover member 172. The first sound wave P1 that has passed through the second acoustic resistance material 152 is reflected by the metal (cover member 172) in the space r2 in the recess. As a result, the first sound wave P <b> 1 is reflected by the cover member 172 without the middle sound region and the high sound region being absorbed by the housing member 171. Further, the reflection distance of the first sound wave P1 that has reached the space r2 is extended by the reflection distance in the space r2.

  In the embodiment described above, the material of the first acoustic resistance material 151 is different from the material of the second acoustic resistance material 152. Instead, the material of the first acoustic resistance material may be the same as the material of the second acoustic resistance material. In this case, the first sound wave that has passed through the acoustic resistance material and reached the second region is a sound wave in which only a predetermined sound region is reduced. As a result, in the frequency response characteristics of the headphones 1, the sound pressure levels of the low sound range and the predetermined sound range are increased.

  Further, the shapes and sizes of the first acoustic resistance material and the second acoustic resistance material are not limited to the present embodiment. That is, for example, the shape and size of each of the first acoustic resistance material and the second acoustic resistance material may be appropriately changed according to the frequency response characteristics of the headphones.

  Further, the bottom surface portion of the housing member may include a circular rib for positioning the second acoustic resistance material. In this case, a rib is arrange | positioned at the outer periphery of the right surface of a bottom face part, for example.

  Furthermore, the first communication hole may be formed in the magnetic circuit and the frame. That is, for example, the frame may have a hat shape including an opening that forms the first communication hole together with the opening of the magnetic circuit in the center.

DESCRIPTION OF SYMBOLS 1 Headphone 10 Left sound emission unit 11 Ear pad 12 Baffle plate 13 Protector 14 Driver unit 141 Diaphragm 141a Main dome 141b Sub dome 142 Drive part 142a Magnetic circuit 142ah 1st communication hole (communication hole)
142b Voice coil 143 Frame 143bh Second communication hole (communication hole)
15 acoustic resistance material 151 first acoustic resistance material 152 second acoustic resistance material 16 connecting member 162 rotation support portion 17 housing cover 171 housing member 171h1 first ventilation hole (ventilation hole)
171h2 Second vent (vent)
171h3 Opening (concave)
171c Notch 172 Cover member 172h Restriction hole (vent hole)
20 Right sound emission unit 30 Headband R1 First space (space)
A1 1st area A2 2nd area A3 3rd area LH Left housing

Claims (15)

A headband,
A first sound emitting unit attached to one end of the headband;
A second sound emitting unit attached to the other end of the headband;
Having
The first sound emitting unit is
A driver unit;
A baffle plate to which the driver unit is attached;
A housing cover for housing the driver unit;
An acoustic resistance material disposed between the driver unit and the housing cover;
With
The housing cover forms a space between the driver unit and the baffle plate,
The driver unit is
A diaphragm,
A communication hole for introducing sound waves from the diaphragm into the space;
With
The space is
A first region;
A second region adjacent to the first region;
Including
The diaphragm is
The main dome,
A subdome,
With
The communication hole is
A first communication hole facing the main dome and introducing a first sound wave from the main dome into the first region;
A second communication hole facing the sub dome and introducing a second sound wave from the sub dome into the second region;
Including
The housing cover is
At least one vent hole communicating the second region with the outside of the housing cover;
Comprising
Headphones characterized by that. The acoustic resistance material is disposed in the first region.
The headphones according to claim 1. The first sound emitting unit is
A connecting member connected to the headband;
With
A part of the connecting member is disposed in any one of the at least one vent hole.
The headphones according to claim 1. The acoustic resistance material contacts the driver unit and the housing cover;
The headphones according to claim 1. The acoustic resistance material is
A first acoustic resistance material;
A second acoustic resistance material disposed between the first acoustic resistance material and the housing cover;
including,
The headphones according to claim 1. The material of the first acoustic resistance material is different from the material of the second acoustic resistance material.
The headphones according to claim 5. The material of the first acoustic resistance material is the same as the material of the second acoustic resistance material.
The headphones according to claim 5. The first acoustic resistance material contacts the driver unit,
The second acoustic resistance material contacts the housing cover;
The headphones according to claim 5. The first acoustic resistance material is:
Opening,
With
The opening introduces the first sound wave into the second acoustic resistance material,
The headphones according to claim 5. The first acoustic resistance material is ring-shaped,
The second acoustic resistance material is disk-shaped,
The outer diameter of the second acoustic resistance material is smaller than the outer diameter of the first acoustic resistance material,
The headphones according to claim 9. The second acoustic resistance material faces the first communication hole and the second communication hole.
The headphones according to claim 9. The diameter of the opening is larger than the diameter of the first communication hole.
The headphones according to claim 9. The housing cover includes a recess,
The concave portion faces the acoustic resistance material.
The headphones according to claim 1. The housing cover includes a recess,
The recess is opposed to the first communication hole;
The headphones according to claim 1. The driver unit is
A magnetic circuit for vibrating the diaphragm;
A frame for holding the magnetic circuit;
With
The magnetic circuit includes the first communication hole,
The frame includes the second communication hole.
The headphones according to claim 1.

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