JP2019024033A - Package for optical sensor, and optical sensor device - Google Patents

Abstract

To provide a package for an optical sensor and the other which can keep a light-receiving function satisfactorily.SOLUTION: A package 1 for an optical sensor according to the present invention comprises: a substrate 2; a frame 3; and a lid 4. The substrate 2 has a mount region of each element in its upper face. The frame 3 is located so as to surround the respective mount regions on the upper face of the substrate 2. The lid 4 has: a first through-hole 31 located on an upper face of the frame 3 and over a first light-receiving element mount region 11; a second through-hole 32 located over a light-emitting element mount region 13; a first opening 41 located over a second light-receiving element mount region 12 and opening downward; and a second opening 42 opening from the first opening 41 to the second through-hole 32. The substrate 2 has a protrusion 21 located at such a position that it overlaps with the second through-hole 32 between the second light-receiving element mount region 12 and the light-emitting element mount region 13, extending from an inner wall of the frame 3 to an inner wall opposed thereto and protruding to a position of a lower end of the lid 4.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an optical sensor package in which an optical element, for example, a light emitting element and a light receiving element are accommodated, and an optical sensor device.

  Conventionally, in a mobile terminal such as a mobile phone or a smartphone, an optical sensor device such as a distance measuring sensor is used to detect the distance between the user's face and the mobile terminal. As this optical sensor device, for example, a device in which a light emitting element such as an infrared light emitting element and a light receiving element such as an infrared light receiving element are housed in a substrate is used. Such an optical sensor device has a substrate in which two recesses, a recess for a light emitting element in which an infrared light emitting element or the like is accommodated and a recess for a light receiving element in which an infrared light receiving element or the like is accommodated, are provided adjacent to each other. Above, these elements are housed.

  And between the recessed part for light emitting elements and the recessed part for light receiving elements which adjoin each other is light-shielded with resin. In the optical sensor device, light is emitted upward from the light emitting element, and a part of the emitted light is reflected by the object to be detected, and the light receiving element detects the reflected light. This makes it possible to detect the distance between the object to be detected and the portable terminal (see Patent Document 1).

JP 2014-81284 A

  With the technique disclosed in Patent Document 1, there is a concern that a light shielding resin spreads on the upper surface of the light receiving element. At this time, the light receiving function may be affected.

  An optical sensor package according to an embodiment of the present invention includes a substrate, a frame, and a lid. The substrate has a first light receiving element mounting area on which the first light receiving element is mounted, a second light receiving element mounting area on which the second light receiving element is mounted, and a light emitting element mounting area on which the light emitting element is mounted on the upper surface. Have. The frame is positioned on the upper surface of the substrate so as to surround the first light receiving element mounting region, the second light receiving element mounting region, and the light emitting element mounting region. The lid body is located above the first light receiving element mounting region, located on the upper surface of the frame body, and has a space between the first through hole penetrating vertically and the first through hole, and in the light emitting element mounting region. A first through hole that is located above and between the second through hole penetrating vertically and between the first through hole and the second through hole, above the second light receiving element mounting region, and opened downward. It has an opening and a second opening that opens from the first opening to the second through hole. The board protrudes upward to the position of the lower end of the lid body from the inner wall of the frame body to the opposing inner wall between the second light receiving element mounting area and the light emitting element mounting area at a position overlapping the second through hole. Has a protrusion.

  An optical sensor device according to an embodiment of the present invention includes the above-described optical sensor package, a first light receiving element, a second light receiving element, and a light emitting element. The first light receiving element is mounted in the first light receiving element mounting region. The second light receiving element is mounted in the second light receiving element mounting region. The light emitting element is mounted in the light emitting element mounting region.

The optical sensor package and the optical sensor device according to an embodiment of the present invention can maintain a good light receiving function.

It is a perspective view which shows the package for optical sensors which concerns on one Embodiment of this invention. It is a top view which shows the package for optical sensors which concerns on one Embodiment of this invention. It is sectional drawing which shows the package for optical sensors which concerns on one Embodiment of this invention. It is sectional drawing which shows the package for optical sensors which concerns on other embodiment of this invention. It is a top view which shows a part of package for optical sensors which concerns on one Embodiment of this invention. It is sectional drawing which shows the package for optical sensors which concerns on other embodiment of this invention. It is sectional drawing which shows the package for optical sensors which concerns on other embodiment of this invention. It is sectional drawing which shows the package for optical sensors which concerns on other embodiment of this invention. It is a top view which shows the optical sensor apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows the optical sensor apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention.

  An optical sensor package 1 and an optical sensor device 100 according to an embodiment of the present invention will be described with reference to the drawings. In the optical sensor device 100, each element (the first light receiving element 51, the second light receiving element 52, and the light emitting element 33) is mounted on the optical sensor package 1.

<Configuration of optical sensor package>
FIG. 1 is a perspective view showing an optical sensor package according to an embodiment of the present invention. FIG. 2 is a top view showing an optical sensor package according to an embodiment of the present invention. FIG. 3 is a cross-sectional view showing an optical sensor package according to an embodiment of the present invention. FIG. 4 is a cross-sectional view showing an optical sensor package according to another embodiment of the present invention. FIG. 5 is a top view showing a part of an optical sensor package according to an embodiment of the present invention. FIG. 6 is a cross-sectional view showing an optical sensor package according to another embodiment of the present invention. FIG. 7 is a cross-sectional view showing an optical sensor package according to another embodiment of the present invention. FIG. 8 is a cross-sectional view showing an optical sensor package according to another embodiment of the present invention. In these drawings, the optical sensor package 1 includes a substrate 2, a frame body 3, and a lid body 4.

  As shown in FIGS. 1 to 5, the optical sensor package 1 includes a substrate 2, a frame body 3, and a lid body 4. The substrate 2 has a first light receiving element mounting area 11, a second light receiving element mounting area 12, and a light emitting element mounting area 13 on the upper surface. The frame 3 is located on the upper surface of the substrate 2 so as to surround each mounting region. The lid 4 is located on the upper surface of the frame 3 and includes a first through hole 31, a second through hole 32, a first opening 41, and a second opening 42.

  On the upper surface of the substrate 2, a first light receiving element mounting region 11 on which the first light receiving element 51 is mounted, a second light receiving element mounting region 12 on which the second light receiving element 52 is mounted, and a light emitting element 53 are mounted. And a light emitting element mounting region 13. For example, the substrate 2 has a rectangular shape in a top view. The substrate 2 has a size of, for example, 2 mm × 4 mm to 3 mm × 6 mm and a thickness of 0.2 mm to 1 mm.

The substrate 2 may be made of ceramic, for example. Moreover, an organic substrate and a semiconductor substrate may be sufficient. Since each element is mounted on the upper surface of the substrate 2, it is preferable to use a material having excellent heat dissipation to such an extent that heat generated from the element can be released to the outside.

  The frame 3 is located on the upper surface of the substrate 2. The frame 3 is bonded to the substrate 2 with, for example, a bonding material. The frame 3 is positioned so as to surround the first light receiving element mounting area 11, the second light receiving element mounting area 12, and the light emitting element mounting area 13. The frame 3 has, for example, a rectangular shape when viewed from above. The frame 3 has a size of 2 mm × 4 mm to 3 mm × 6 mm, for example, and a height of 0.1 mm to 1 mm. The thickness is 0.1 mm to 0.5 mm.

  The frame 3 may be made of ceramic, for example. Further, it may be a resin material or other light-shielding material. At this time, the light shielding property is to suppress the incidence of light other than the light emitted from the light emitting element 53, which has the same wavelength as the light emitted from the light emitting element 53. Further, the frame 3 may be formed integrally with the substrate 2. In this case, a bonding material for bonding the substrate 2 and the frame 3 becomes unnecessary. In particular, since the bonding material needs to have excellent light shielding properties, if the substrate 2 and the frame 3 are integrated, light emitted from the light emitting element 53 and incident light are difficult to escape to the outside. Can do. Further, it is possible to make it difficult for external light other than the light emitted from the light emitting element 53 and the incident light to reach the inside.

  The lid 4 is located on the upper surface of the frame 3. The lid 4 has a first through hole 31, a second through hole 32, a first opening 41, and a second opening 42. The lid body 4 has, for example, a rectangular shape when viewed from above. The lid 4 has a size of 2 mm × 4 mm to 3 mm × 6 mm, for example, and a thickness of 0.2 mm to 1 mm.

  The lid 4 may be made of ceramic, for example. Moreover, an organic substrate and a resin material may be sufficient. In addition, a light-shielding material can be used. In the case where the substrate 2 and the frame 3 are not integrated, and those in different states are bonded with a bonding material or the like, the lid 4 and the frame 3 may be integrated. Since the lid body 4 and the frame body 3 are integrated, a bonding material for joining the lid body 4 and the frame body 3 becomes unnecessary. In particular, since the bonding material needs to have excellent light shielding properties, if the lid 4 and the frame 3 are integrated, the light emitted from the light emitting element 53 and the incident light are not easily escaped to the outside. Can do. Further, it is possible to make it difficult for external light other than the light emitted from the light emitting element 53 and the incident light to reach the inside. In other words, the lid 4 passes light emitted to the detected object and light incident upon being reflected by the detected object. Other light (radiated light that interferes with detection, incident light) should not pass through.

  The first through hole 31 penetrates the lid body 4 up and down. That is, a hole is formed in the thickness direction of the lid body 4. The first through hole 31 is located above the first light receiving element mounting region 11. Of the light emitted from the light emitting element 53, the light reflected by the detection object enters the first through hole 31. The first through hole 31 has, for example, a circular shape when viewed from above. Moreover, the 1st through-hole 31 is a magnitude | size, for example, and a diameter is 0.1 mm-1 mm.

The 2nd through-hole 32 has penetrated the cover body 4 up and down. That is, a hole is formed in the thickness direction of the lid body 4. The second through hole 32 is located above the light emitting element mounting region 13 with a space from the first through hole 31. The light emitted from the light emitting element 53 toward the object to be detected passes through the second through hole 32. That is, the light radiated from the light emitting element 53 passes through the first through hole 31 as radiated light,
The light reaches the detected object, is reflected by the detected object, and the reflected light passes through the second through hole 32 as incident light and reaches the first light receiving element 51. The second through hole 32 has, for example, a circular shape when viewed from above. The second through-hole 32 has a size of 0.1 mm to 1 mm, for example.

The first opening 41 opens downward. The first opening 41 has a first through hole 31 and a second
It is located between the through hole 32. The first opening 41 is located above the second light receiving element mounting region 12. The first opening 41 is, for example, circular when viewed from the bottom surface of the lid body 4 and has a diameter of 0.1 mm to 1 mm.

  The second opening 42 opens from the first opening 41 to the second through hole 32. That is, the lid 4 opens in the width direction (direction perpendicular to the thickness direction in a cross-sectional view). The second opening 42 may have a rectangular column shape, and one side is 0.5 mm to 1 mm. A second transparent substrate 62 to be described later is located in the second opening 42. At this time, the second opening 42 may continuously open in the downward direction with respect to the first opening 41, or may continuously open in the lateral direction as shown in FIG. Good.

  From the above, the light emitted from the light emitting element 53 is divided into two directions. That is, the second light is emitted from the second through-hole 32 to reach the object to be detected, and the light that has arrived is reflected and incident on the first through-hole 31 to reach the first light receiving element 51, and the second This is a case where the first opening 41 is reached from the through hole 32 through the second opening 42 and the second light receiving element 52 is reached from the first opening 41. That is, the distance to the detected object is measured from the difference between the time when the light emitted from the light emitting element 53 reaches the second light receiving element 52 and the time when the light is reflected by the detected object and reaches the first light receiving element 51. can do.

  The substrate 2 has a protruding portion 21 at a position overlapping the second through hole 32. The protruding portion 21 protrudes upward. The protruding portion 21 is located between the second light receiving element mounting area 12 and the light emitting element mounting area 13. The protruding portion 21 is located from the inner wall of the frame body 3 to the opposing inner wall. That is, the space where each light receiving element mounting area is located and the space where the light emitting element mounting area 13 is located are separated. At this time, the protrusion 21 preferably protrudes to the position of the lower end of the lid 4. That is, it is good that it is the same as the height of the frame 3. Further, it is preferable that the protrusion 21 is in contact with at least the lid 4. Accordingly, it is possible to reduce the light emitted from the light emitting element 53 from reaching the first light receiving element 51 directly. In addition, a good optical path to the second light receiving element 51 can be formed.

  Since the optical sensor package 1 according to an embodiment of the present invention has the above-described configuration, the bonding material made of resin or the like does not cover the light receiving elements and the light emitting elements 53, and accommodates the elements. Since the space is partitioned, it is possible to reduce the possibility that the light-shielding resin adheres to the light receiving element. Moreover, the possibility of disconnection of the wire or the like due to heat shrinkage during resin curing can be reduced. Moreover, it is difficult for the light of each light receiving element and the light emitting element 53 to escape to the outside, and it is difficult to enter from the outside. That is, it can be set as the package for optical sensors excellent in electrical reliability and light-shielding property.

  As shown in FIG. 6, in the optical sensor package 1 according to another embodiment of the present invention, the second opening 42 may also open downward. That is, the 1st opening part 41, the 2nd opening part 42, and the 2nd through-hole 32 may be continuing. At this time, the light shielding member 5 may be provided on the upper surface of the protruding portion 21. In other words, the first opening 41 and the second opening 42 are integrated, and there is no part of the lid 4 on the lower surface of the second transparent substrate 62 described later, and the first opening 41 and the second opening 42 are directly joined to the light shielding member 5. Good. At this time, the end of the second opening 42 is preferably separated from the end of the second light receiving element mounting region 12 (second light receiving element 52) in a top view. At this time, the end of the second opening 42 indicates a position closest to the second light receiving element mounting region 12 (second light receiving element 52) in plan view, and the second light receiving element mounting region 12 (second The end of the light receiving element 52) indicates a location closest to the second opening 42 in plan view. In other words, when viewed from above, the end of the second opening 42 does not overlap the end of the second light receiving element mounting region 12, and the second opening 42 is positioned on the protruding portion side. This can reduce the light emitted from the light emitting element 53 from reaching the first light receiving element 51 directly.

  As shown in FIG. 7, in the optical sensor package 1 according to another embodiment of the present invention, the lid 4 may have a plurality of layers. In addition, since the lid 4 is integrally formed, the boundary between the plurality of layers is a portion where the diameter of each through hole is different, although it is not shown in the drawing. In the case where the lid 4 has a plurality of layers, the diameter of the through hole may be changed at a portion constituting the first through hole 31 and the second through hole 32. That is, the diameter may be different depending on the layer. Accordingly, since there is a space inside the lid body 4, a first transparent substrate 61 and a second transparent substrate 62 described later can be fitted in accordance with the size of the diameter. Further, the diameter of the hole in the upper layer may be smaller than the size of the hole in the lower layer. Accordingly, the light incident on the first through hole 31 can be received over a wide area when reaching the first light receiving element 51. Further, it is possible to reduce scattering of light emitted from the light emitting element 53 with spread. In addition, entry of unnecessary light (sunlight or the like) from the outside can be reduced.

  Further, as shown in FIG. 8, in the optical sensor package 1 according to another embodiment of the present invention, the upper width of the first opening 41 may be smaller than the lower width. That is, in the cross-sectional view in the thickness direction of the lid body 4, the first opening portion 41 may have a tapered shape in which the opening increases downward. With such a structure, it becomes easy to irradiate the light from the second opening 42 to the second light receiving element 52.

  That is, when light having a specific wavelength, such as infrared light or visible light, is emitted from the light emitting element 53 accommodated in the second through-hole 22 to the upper side of the first substrate 11, the wavelength is efficiently obtained by the above-described structure. Can be emitted to the object to be detected. A part of the specific wavelength emitted from the light emitting element 53 is reflected by an object to be detected such as a user's face and is received by the first light receiving element 51 more efficiently by the structure of the first through hole 21 described above. It becomes possible to detect the distance between the object to be detected and the portable terminal with higher detection sensitivity.

  At this time, the first through hole 31 and the second through hole 32 may gradually increase in width from the upper side to the lower side of each through hole. Due to such a structure, the detection sensitivity to the detection object can be further increased by the interaction between the light emitting element 53 and the light receiving elements as a pair of sensor elements.

<Method for Manufacturing Optical Sensor Package>
If the substrate 2, the frame 3, and the lid 4 are made of, for example, an aluminum oxide sintered body, a suitable organic binder and organic solvent are kneaded with the raw material powder such as aluminum oxide and silicon oxide. The ceramic slurry produced in this way is formed into a sheet shape to produce a plurality of ceramic green sheets, and these ceramic green sheets are laminated and then fired at a temperature of about 1600 ° C. in a reducing atmosphere. Can do. At this time, when the substrate 2 and the frame body 3 or the frame body 3 and the lid body 4 are integrated, the ceramic green sheets constituting each of them may be laminated and fired simultaneously.

  The substrate 2 may be formed as a mother substrate in which a plurality of wiring substrate regions are arranged. If the wiring conductor is made of tungsten, molybdenum, or the like, a plating layer such as nickel or gold is deposited on the exposed wiring conductor, and then the mother substrate is divided, so that FIG. A first substrate 11 as shown at 10 is fabricated.

The 1st through-hole 31, the 2nd through-hole 32, the 1st opening part 41, and the 2nd opening part 42 which were provided in the cover body 4 can be formed as follows, for example. For example, a rectangular hole or a circular hole is formed in a part of the ceramic green sheet on the upper surface of the lid 4 by a method such as punching, and a ceramic green sheet having two holes is produced. To do. The hole is not limited to a rectangular shape or a circular shape, and may be an elliptical shape or a rectangular shape with chamfered corners. The lid 4 constituting the optical sensor package 1 can be manufactured by laminating and adhering the ceramic green sheet to be the upper surface on the ceramic green sheet to be the lower surface.

  In the above description, a ceramic green sheet is prepared from a ceramic slurry prepared by kneading together with an organic binder suitable for a raw material powder such as aluminum oxide and an organic solvent, and a plurality of these ceramic green sheets are laminated. Although an example in which the substrate 2, the frame 3 and the lid 4 of the optical sensor package 1 are manufactured has been shown, the substrate 2, the frame 3 and the lid 4 may be made of an organic resin material. . If the lid 4 is made of an organic resin material, the organic resin material (uncured) is formed in a mold processed into a shape and dimensions for forming the first through hole 31 and the second through hole 32. It can also be prepared by filling and curing by heating.

  In order to provide a structure in which the lower width of the first through hole 31 is larger than the upper width and a structure in which the lower width of the second through hole 32 is larger than the upper width, for example, the upper surface of the lid 4 is provided. For example, a rectangular or circular hole is formed in a part of the ceramic green sheet by a method such as punching to produce a ceramic green sheet in which the first through hole 31 and the second through hole 32 are formed. In this case, the first through hole 31 and the second through hole 32 are provided at the tip (smaller diameter side) of the punch by making the punch used for punching into a structure in which two cylinders having different diameters are connected. At the same time, it is only necessary to press the inside of the ceramic green sheet by pressing so that the constricted portion of the upper punch (the boundary portion between the small diameter side and the large diameter side) is eliminated.

<Configuration of optical sensor device>
FIG. 9 is a top view showing an optical sensor device according to an embodiment of the present invention. FIG. 10 is a cross-sectional view showing an optical sensor device according to an embodiment of the present invention. FIG. 11 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention. FIG. 12 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention. FIG. 13 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention. FIG. 14 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention. FIG. 15 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention. In these drawings, an optical sensor device 100 according to an embodiment of the present invention includes the optical sensor package 1 described above, a first light receiving element 561, a second light receiving element 52, and a light emitting element 53. Moreover, the circuit board 6, the 1st transparent substrate 61, and the 2nd transparent substrate 62 may be further provided. The first light receiving element 51 and the second light receiving element 52 may be formed integrally with the circuit board 6 as will be described later. In this case, only the light emitting element 53 is mounted. .

  The optical sensor device 100 is mounted on the first light receiving element 51 mounted on the first light receiving element mounting area 11, the second light receiving element 52 mounted on the second light receiving element mounting area 12, and the light emitting element mounting area 13. The light emitting element 53 is provided. At this time, as shown in FIGS. 11 to 15, the first light receiving element 51 and the second light receiving element 52 are overlapped with the first light receiving element mounting region 11 and the second light receiving element mounting region 12, respectively. It may be built in.

  The circuit board 6 has, for example, a rectangular shape in a top view, and has a size of 1.2 mm × 2.0 mm to 3.0 mm × 6.0 mm. The height is, for example, 0.1 mm to 2.0. For example, it is formed from a semiconductor component such as an IC (Integrated Circuit), a resin material, an organic substrate, a ceramic, or the like. The circuit board 6 has a first light receiving element mounting region 11 and a second light receiving element mounting region 12.

  The circuit board 6 is an organic material suitable for a raw material powder such as aluminum oxide and silicon oxide if the portion to be a base is made of, for example, an aluminum oxide sintered body, like the substrate 2, the frame body 3 and the lid body 4. A ceramic slurry prepared by kneading a binder and an organic solvent is formed into a sheet to produce a plurality of ceramic green sheets, and these ceramic green sheets are laminated and then fired at a temperature of about 1600 ° C. in a reducing atmosphere. It can be made by doing.

  The circuit board 6 may be formed as a mother board in which a plurality of wiring board regions are arranged. If the wiring conductor is made of tungsten, molybdenum, or the like, after the plating layer such as nickel or gold is deposited on the exposed wiring conductor, the circuit board 6 is divided by dividing such a mother board. Produced. In addition, the circuit board 6 may be made of an organic resin material.

  Further, the first through hole 31 and the second through hole 32 of the lid body 4 are closed, and the first transparent substrate 61 and the second transparent substrate 62 for emitting light to the outside and making it enter the inside are joined or fitted. It may be. At this time, the 1st transparent substrate 61 and the 2nd transparent substrate 62 are glass, resin, etc., for example. The resin is acrylic or the like. At this time, as described above, the second opening 42 opens downward, has a light shielding member between the upper surface of the protrusion 21 and the second opening 42, and the second opening 42 in the top view. When the end of the opening 42 is separated from the end of the second light receiving element mounting 52, the thickness of the second transparent substrate 62 is not more than half the depth of the second opening 42. There may be. Thus, the light shielding effect can be maintained.

  The first transparent substrate 61 and the second transparent substrate 62 may be located between the upper end and the lower end of the lid body 4. This can reduce the scratches on the transparent substrate from the outside. Further, when the first transparent substrate 61 and the second transparent substrate 62 are in a position overlapping the upper end of the lid body 4, the thickness can be reduced. Further, when the first transparent substrate 61 and the second transparent substrate 62 are in a position overlapping the lower end of the lid 4, the first transparent substrate 61 and the second transparent substrate 62 can be made less susceptible to external influences.

  In addition, the portion where light shielding properties are desired and the portion that reflects light from the light emitting element 53 may have the light shielding film 7 on the surfaces of the first transparent substrate 61 and the second transparent substrate 62. In particular, when the upper surface of the second transparent substrate 62 is the same as the upper surface of the lid 4, the upper surface of the second transparent substrate 62 is exposed. Therefore, the light shielding film 7 is positioned so as to surround the second through hole 32. At this time, it is preferable that the light shielding film 7 is provided on the entire upper surface of the second transparent substrate 62 except for the position overlapping the second through hole 32. This makes it difficult for the emitted light and incident light from the light emitting element 53 to escape to the outside, and makes it difficult for outside light other than the emitted light and incident light of the light emitting element 53 to enter.

  A plurality of external connection conductors may be provided on the lower surface of the substrate 2. The plurality of external connection conductors of the substrate 2 are electrically connected to the external substrate or the like by a bonding material such as solder.

  Here, the light-emitting element 53 having a light-emitting portion is composed of a radiation element that radiates physical energy such as infrared rays, electromagnetic waves, or ultrasonic waves, and the first light-receiving element 51 and the second light-receiving element 52 having a light-receiving portion are The light-emitting element 53 and the second light-receiving element 52 are used as a pair.

Further, the light emitting element 53 has a structure in which, for example, the periphery of the light emitting portion is covered with, for example, a transparent resin having a light collecting property, and is connected to a part of each light receiving element as a chip component. Therefore, it has a structure protruding from the main surface of each light receiving element, and the protruding portion of the light emitting element is positioned in each through hole. Therefore, due to the synergistic effect of the transparent resin having the light collecting property and the arrangement of each element
The object to be detected can be efficiently irradiated with light of a specific wavelength such as infrared light or visible light. Therefore, it is possible to realize the optical sensor device 100 having high detection sensitivity that can efficiently detect the light having a specific wavelength reflected by the detection target with the light receiving unit.

  Examples of the elements constituting the light emitting element 53 include a gallium arsenide (Ga-As) light emitting diode, an ultrasonic oscillator (ultrasonic wave), and a microwave oscillator (electromagnetic wave). The first light receiving element 51 and the second light receiving element 52 are a photodiode, an ultrasonic oscillator (ultrasonic wave), a microwave detecting element (electromagnetic wave), and the like. The elements constituting the first light receiving element 51 and the second light receiving element 52 are semiconductor materials such as gallium arsenide, and the first light receiving element 51, the second light receiving element 52, and the light emitting element 53 are provided. It operates as a functional component that emits or receives light by photoelectric conversion. Then, the power supplied to the light emitting element 53 through the wiring conductor or the like is photoelectrically converted by the light emitting element 53 by the light emitting element 53 and the light receiving elements which are the pair of sensor elements, and infrared rays are emitted. Further, infrared light reflected by the object to be detected is detected by the light receiving unit and converted into an electric signal. The electric signal is transmitted to an external electric circuit such as a detection circuit or a display display circuit via a wiring conductor (not shown).

  For example, a step portion is provided on the inner wall of the second through hole 22 of the ceramic green sheet on the upper surface, and a bonding connection terminal is provided on the step portion so that the terminal of the second light receiving element 52 and the step portion are provided. The bonding connection terminals may be connected by wire bonding. With such a connection method, the connection terminal for bonding provided on the first substrate 11 and the terminal of the second light receiving element 52 can be satisfactorily connected. Furthermore, if an illuminance sensor is mounted on this stepped portion, a proximity illuminance integrated sensor device having an illuminance sensor function for controlling the backlight of the liquid crystal screen for power saving by detecting the illuminance along with the proximity sensor function. You can also.

  Note that the optical sensor package 1 and the optical sensor device 100 of the present invention are not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention. There is no problem. Further, various combinations are possible with respect to each embodiment to the extent that no contradiction occurs. Moreover, although the optical sensor package 1 and the optical sensor device according to the embodiment of the present invention have been described as a distance measuring sensor device, other devices that operate by a pair of sensor elements of a light emitting element and a light receiving element, for example, It can be applied to proximity illuminance integrated sensor devices, proximity sensor devices, pulse blood flow sensor devices, and the like.

DESCRIPTION OF SYMBOLS 1 Optical sensor package 2 Board | substrate 3 Frame body 4 Cover body 5 Light shielding member 6 Circuit board 7 Light shielding film 11 1st light receiving element mounting area 12 2nd light receiving element mounting area 13 Light emitting element mounting area 21 Protrusion part 31 1st through-hole 32 Second through hole 41 First opening 42 Second opening 51 First light receiving element 52 Second light receiving element 53 Light emitting element 61 First transparent substrate 62 Second transparent substrate 100 Optical sensor device

Claims (12)

A substrate having a first light receiving element mounting area on which the first light receiving element is mounted, a second light receiving element mounting area on which the second light receiving element is mounted, and a light emitting element mounting area on which the light emitting element is mounted; A frame body positioned on the upper surface of the substrate so as to surround the first light receiving element mounting region, the second light receiving element mounting region, and the light emitting element mounting region;
Positioned above the first light receiving element mounting region on the upper surface of the frame, and spaced from the first through hole penetrating vertically and the first through hole, and the light emitting element mounting region The second through-hole penetrating vertically and between the first through-hole and the second through-hole, located above the second light receiving element mounting region and opened downward And a lid body having a first opening portion and a second opening portion opened from the first opening portion to the second through hole,
In the position where the substrate overlaps with the second through-hole, the position of the lower end of the lid is between the second light receiving element mounting region and the light emitting element mounting region and extends from the inner wall of the frame to the opposing inner wall. An optical sensor package characterized by having a protruding portion protruding upward.   The second opening is open downward, has a light shielding member between the upper surface of the protruding portion and the second opening, and when viewed from above, the end of the second opening is The optical sensor package according to claim 1, wherein the optical sensor package is separated from an end of the second light receiving element mounting region. The lid body has a plurality of layers,
The optical sensor package according to claim 1, wherein the diameter of the second through hole differs depending on the layer. The lid body has a plurality of layers,
The optical sensor package according to any one of claims 1 to 3, wherein the diameter of the first through hole differs depending on the layer.   5. The optical sensor package according to claim 1, wherein the first opening is tapered in a cross-sectional view in the thickness direction of the lid.   The optical sensor package according to claim 1, wherein the substrate and the frame are integrated. An optical sensor package according to any one of claims 1 to 6;
A first light receiving element mounted in the first light receiving element mounting region;
A second light receiving element mounted in the second light receiving element mounting region;
An optical sensor device comprising: a light emitting element mounted in the light emitting element mounting region. An optical sensor package according to any one of claims 1 to 6;
A first light receiving element mounted at a position overlapping the first light receiving element mounting region, and a second light receiving element mounted at a position overlapping the second light receiving element mounting region, located on the upper surface of the optical sensor package; Having a circuit board;
An optical sensor device comprising: a light emitting element mounted in the light emitting element mounting region. A first transparent substrate located in the first through hole;
The optical sensor device according to claim 7, further comprising a second transparent substrate located in the second opening. The first transparent substrate is located between an upper end and a lower end of the lid;
10. The optical sensor device according to claim 9, wherein the first through hole has a diameter above the first transparent substrate smaller than a diameter below the first transparent substrate. The upper end of the second transparent substrate overlaps the upper end of the lid,
11. The optical sensor device according to claim 9, further comprising a light shielding film positioned so as to surround the second through hole.   The second opening is open downward, has a light shielding member between the upper surface of the protruding portion and the second opening, and when viewed from above, the end of the second opening is 10. The optical sensor device according to claim 9, wherein the optical sensor device is separated from an end of the second light receiving element, and the thickness of the second transparent substrate is less than or equal to one half of the depth of the second opening. .

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