JP2019016740A5 - - Google Patents
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- JP2019016740A5 JP2019016740A5 JP2017134746A JP2017134746A JP2019016740A5 JP 2019016740 A5 JP2019016740 A5 JP 2019016740A5 JP 2017134746 A JP2017134746 A JP 2017134746A JP 2017134746 A JP2017134746 A JP 2017134746A JP 2019016740 A5 JP2019016740 A5 JP 2019016740A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017134746A JP6829665B2 (ja) | 2017-07-10 | 2017-07-10 | リードフレーム、半導体装置、及びリードフレームの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017134746A JP6829665B2 (ja) | 2017-07-10 | 2017-07-10 | リードフレーム、半導体装置、及びリードフレームの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019016740A JP2019016740A (ja) | 2019-01-31 |
| JP2019016740A5 true JP2019016740A5 (enrdf_load_html_response) | 2020-04-09 |
| JP6829665B2 JP6829665B2 (ja) | 2021-02-10 |
Family
ID=65356567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017134746A Active JP6829665B2 (ja) | 2017-07-10 | 2017-07-10 | リードフレーム、半導体装置、及びリードフレームの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6829665B2 (enrdf_load_html_response) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7293682B2 (ja) * | 2018-12-12 | 2023-06-20 | 株式会社三洋物産 | 遊技機 |
| JP2020093053A (ja) * | 2018-12-12 | 2020-06-18 | 株式会社三洋物産 | 遊技機 |
| JP2020093052A (ja) * | 2018-12-12 | 2020-06-18 | 株式会社三洋物産 | 遊技機 |
| JP2020093050A (ja) * | 2018-12-12 | 2020-06-18 | 株式会社三洋物産 | 遊技機 |
| JP2020093049A (ja) * | 2018-12-12 | 2020-06-18 | 株式会社三洋物産 | 遊技機 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613516A (ja) * | 1992-05-26 | 1994-01-21 | Nippon Steel Corp | リードフレームの製造方法 |
| JP4269595B2 (ja) * | 2002-08-23 | 2009-05-27 | トヨタ自動車株式会社 | 酸化物半導体電極及びその製造方法 |
| US20080318061A1 (en) * | 2007-06-20 | 2008-12-25 | Akira Inaba | Insulation paste for a metal core substrate and electronic device |
| TW201250964A (en) * | 2011-01-27 | 2012-12-16 | Dainippon Printing Co Ltd | Resin-attached lead frame, method for manufacturing same, and lead frame |
| JP5456209B2 (ja) * | 2011-08-01 | 2014-03-26 | 株式会社Ｓｔｅｑ | 半導体装置及びその製造方法 |
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2017
- 2017-07-10 JP JP2017134746A patent/JP6829665B2/ja active Active