JP2019016615A - Optical sensor and electronic apparatus including the same - Google Patents

Optical sensor and electronic apparatus including the same Download PDF

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JP2019016615A
JP2019016615A JP2015234644A JP2015234644A JP2019016615A JP 2019016615 A JP2019016615 A JP 2019016615A JP 2015234644 A JP2015234644 A JP 2015234644A JP 2015234644 A JP2015234644 A JP 2015234644A JP 2019016615 A JP2019016615 A JP 2019016615A
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light
light receiving
emitting element
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教和 岡田
Norikazu Okada
教和 岡田
真志 萬徳
Shinji Mantoku
真志 萬徳
敏幸 高田
Toshiyuki Takada
敏幸 高田
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Sharp Corp
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract

To provide a low-cost optical sensor capable of receiving weak light and an electronic apparatus including the same.SOLUTION: An optical sensor (1) includes: a light emitting element (11) emitting light toward an object (50) to be detected; an optical member (12) transmitting part of light emitted from the light emitting element (11) and reflecting other part of light emitted from the light emitting element (11); a light receiving element (14) including a first light receiving portion (14a) receiving reflected light from the object (50) to be detected and second light receiving portions (14b, 102B); and reflected light guide members (15, 16) reflecting reflected light from the optical member (12) and guiding the reflected light to the second light receiving portion (14b) of the light receiving element (14).SELECTED DRAWING: Figure 1

Description

この発明は、光センサおよびそれを備えた電子機器に関する。   The present invention relates to an optical sensor and an electronic device including the same.

従来、光センサとしては、発光素子の後端面から出射された光を受光するモニタ用受光素子を備え、モニタ用受光素子の受光量に基づいて、発光素子の前端面から出射される光をモニタするものがある(例えば特開２００１−２５０２５４号公報(特許文献1)参照)。   Conventionally, as an optical sensor, a light receiving element for monitoring that receives light emitted from the rear end face of the light emitting element is provided, and light emitted from the front end face of the light emitting element is monitored based on the amount of light received by the light receiving element for monitoring. (For example, refer to JP 2001-250254 A (Patent Document 1)).

また、他の光センサとしては、発光素子から出射された光の一部を透過すると共に、上記光の入射方向に交差する方向に上記光の残部を反射する光分離素子と、この光分離素子からの反射光を受光するモニタ用受光素子とを備えたものがある(特開２０１４-７２４７０号公報(特許文献２)参照)。   As another optical sensor, a light separation element that transmits a part of the light emitted from the light emitting element and reflects the remainder of the light in a direction crossing the incident direction of the light, and the light separation element And a monitor light-receiving element that receives reflected light from the light source (see Japanese Patent Application Laid-Open No. 2014-72470 (Patent Document 2)).

このようなモニタ用受光素子を用いれば、被検出物からの反射光の光量変動を抑制できるので、有益である。   Use of such a monitor light-receiving element is advantageous because fluctuations in the amount of reflected light from the object to be detected can be suppressed.

しかしながら、上記モニタ用受光素子で微弱光をモニタする場合、特開２０１１-２５８６４５(特許文献３)に開示されているような光減衰器が必要となるため、製造コストが増大してしまうという問題がある。   However, when weak light is monitored by the monitor light receiving element, an optical attenuator as disclosed in Japanese Patent Application Laid-Open No. 2011-258645 (Patent Document 3) is required, which increases the manufacturing cost. There is.

特開２００１−２５０２５４号公報JP 2001-250254 A 特開２０１４−７２４７０号公報JP 2014-72470 A 特開２０１１−２５８６４５号公報JP2011-258645A

そこで、この発明の課題は、微弱光を受光できる低コストな光センサおよびそれを備えた電子機器を提供することにある。   Accordingly, an object of the present invention is to provide a low-cost optical sensor that can receive weak light and an electronic apparatus including the same.

上記課題を解決するため、この発明の光センサは、
被検出物に向けて光を出射する発光素子と、
上記発光素子から出射された光の一部を透過すると共に、上記発光素子から出射された光の他の一部を反射する光学部材と、
上記被検出物からの反射光を受光する第１受光部と、第２受光部とを有する受光素子と、
上記光学部材からの反射光を反射して上記受光素子の上記第２受光部へ案内する反射光案内部材と
を備えることを特徴としている。 In order to solve the above problems, an optical sensor of the present invention is
A light emitting element that emits light toward an object to be detected;
An optical member that transmits part of the light emitted from the light emitting element and reflects the other part of the light emitted from the light emitting element;
A light receiving element having a first light receiving unit that receives reflected light from the object to be detected, and a second light receiving unit;
A reflected light guide member that reflects reflected light from the optical member and guides the reflected light to the second light receiving portion of the light receiving element.

一実施形態の光センサでは、
上記反射光案内部材は、上記被検出物から上記第１受光部へ向かう反射光が通る第１導光路と、上記光学部材から上記第２受光部へ向かう反射光が通る第２導光路とを有し、
上記第１導光路と上記第２導光路とは互いに分離されている。 In one embodiment of the optical sensor,
The reflected light guide member includes a first light guide path through which reflected light traveling from the detected object toward the first light receiving section passes, and a second light guide path through which reflected light traveling from the optical member toward the second light receiving section passes. Have
The first light guide path and the second light guide path are separated from each other.

一実施形態の光センサでは、
上記反射光案内部材は、上記発光素子の上面上に搭載し、かつ、上記受光素子が下面に接続された基板を有し、
上記基板には、上記受光素子の上記第１,第２受光部の少なくとも一部に重なるように、上記上面から上記下面まで貫通する第１,第２貫通穴が設けられている。 In one embodiment of the optical sensor,
The reflected light guide member has a substrate mounted on the upper surface of the light emitting element, and the light receiving element is connected to the lower surface,
The substrate is provided with first and second through holes penetrating from the upper surface to the lower surface so as to overlap at least part of the first and second light receiving portions of the light receiving element.

一実施形態の光センサでは、
上記発光素子と上記受光素子の上記第１受光部との間には、上記基板の一部が介在する。 In one embodiment of the optical sensor,
A part of the substrate is interposed between the light emitting element and the first light receiving portion of the light receiving element.

この発明の電子機器は、
この発明または一実施形態のうちのいずれか１つの光センサを備えたことを特徴としている。 The electronic device of the present invention is
The present invention or any one of the embodiments includes an optical sensor.

この発明の光センサは、光学部材からの反射光を反射して受光素子の第２受光部へ案内する反射光案内部材を備えるので、受光素子の第２受光部で微弱光を受光することができると共に、製造コストを低減できる。   Since the optical sensor of the present invention includes the reflected light guide member that reflects the reflected light from the optical member and guides it to the second light receiving portion of the light receiving element, the second light receiving portion of the light receiving element can receive weak light. In addition, the manufacturing cost can be reduced.

また、この発明の電子機器は、上記光センサを備えるので、受光素子の第２受光部で微弱光を受光することができると共に、製造コストを低減できる。   Moreover, since the electronic device of this invention is provided with the said optical sensor, while being able to receive weak light in the 2nd light-receiving part of a light receiving element, it can reduce manufacturing cost.

この発明の第１実施形態の光センサを説明するための模式断面図である。It is a schematic cross section for demonstrating the photosensor of 1st Embodiment of this invention. アバランシェフォトダイオードをガイガーモードで使用するときの回路図である。It is a circuit diagram when using an avalanche photodiode in Geiger mode. 上記第１実施形態の光センサの一変形例のブロック図である。It is a block diagram of a modification of the photosensor of the first embodiment. この発明の第２実施形態の光センサを説明するための模式断面図である。It is a schematic cross section for demonstrating the photosensor of 2nd Embodiment of this invention. 光路変更部入力口高さと基準側入力光量との関係を示すシミュレーショングラフである。It is a simulation graph which shows the relationship between an optical path change part input port height and a reference | standard side input light quantity. 上記第２実施形態の受光素子の第２受光部への入射光線数のシミュレーション図である。It is a simulation figure of the number of incident light rays to the 2nd light-receiving part of the light receiving element of the said 2nd Embodiment. 上記第２実施形態の受光素子の第２受光部への入射光線数の他のシミュレーション図である。It is another simulation figure of the number of incident light rays to the 2nd light-receiving part of the light receiving element of the said 2nd Embodiment. この発明の第３実施形態の光センサを説明するための模式断面図である。It is a schematic cross section for demonstrating the optical sensor of 3rd Embodiment of this invention. 上記第３実施形態の光センサの一変形例を説明するための模式断面図である。It is a schematic cross section for explaining a modification of the optical sensor of the third embodiment.

以下、この発明の光センサおよびそれを備えた電子機器を図示の実施の形態により詳細に説明する。   DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an optical sensor of the present invention and an electronic apparatus equipped with the same will be described in detail with reference to the illustrated embodiments.

〔第１実施形態〕
図１は、この発明の第１実施形態の光センサ１を説明するための模式断面図である。 [First Embodiment]
FIG. 1 is a schematic cross-sectional view for explaining an optical sensor 1 according to a first embodiment of the present invention.

上記光センサ１は、発光素子１１と、出射側窓ガラス１２と、入射側窓ガラス１３と、受光素子１４と、基板１５と、蓋１６とを備えている。なお、出射側窓ガラス１２は光学部材の一例である。また、基板１５および蓋１６は反射光案内部材の一例である。   The optical sensor 1 includes a light emitting element 11, an emission side window glass 12, an incident side window glass 13, a light receiving element 14, a substrate 15, and a lid 16. The exit side window glass 12 is an example of an optical member. The substrate 15 and the lid 16 are an example of a reflected light guide member.

上記発光素子１１は、基板１５の上面上に搭載され、被検出物５０に向けて光を出射する。また、発光素子１１の下面の電極は、基板１５の上面に設けられた配線パターン(図示せず)に例えばダイボンドペーストで電気的に接続されている。一方、発光素子１１の上面の電極は、上記配線パターンにワイヤ２１を介して電機的に接続されている。このような発光素子１１として、例えば、ＶＣＳＥＬ(面発光レーザー)、ＬＥＤ(Light Emitting Diode：発光ダイオード)などが用いられる。   The light emitting element 11 is mounted on the upper surface of the substrate 15 and emits light toward the detection object 50. The electrodes on the lower surface of the light emitting element 11 are electrically connected to a wiring pattern (not shown) provided on the upper surface of the substrate 15 by, for example, a die bond paste. On the other hand, the electrode on the upper surface of the light emitting element 11 is electrically connected to the wiring pattern via a wire 21. As such a light emitting element 11, for example, a VCSEL (surface emitting laser), an LED (Light Emitting Diode) or the like is used.

上記出射側窓ガラス１２は、発光素子１１と被検出物５０の間の光路上に配置されている。より詳しくは、出射側窓ガラス１２は、発光素子１１から出射された光の一部を透過すると共に、発光素子１１から出射された光の他の一部を反射する。ここで、例えば、発光素子１１から出射された光の約９０％を透過すると共に、発光素子１１から出射された光の約１０％を反射するガラスが、出射側窓ガラス１２として用いられてもよい。   The exit side window glass 12 is disposed on the optical path between the light emitting element 11 and the detection object 50. More specifically, the emission side window glass 12 transmits a part of the light emitted from the light emitting element 11 and reflects the other part of the light emitted from the light emitting element 11. Here, for example, glass that transmits about 90% of the light emitted from the light emitting element 11 and reflects about 10% of the light emitted from the light emitting element 11 may be used as the emission side window glass 12. Good.

上記受光素子１４は、発光素子１１と所定間隔を空けて隣り合うように、基板１５の上面上に搭載されている。この受光素子１４は、被検出物５０からの反射光を受光する第１受光部１４ａと、第２受光部１４ｂとを有している。この第１受光部１４ａの受光面積は、第２受光部１４ｂの受光面積と同じまたは略同じとなっている。ここで、被検出物５０からの反射光は、入射側窓ガラス１３を介して、受光素子１４の第１受光部１４ａに入射するようになっている。また、発光素子１１から出射された光のうち、出射側窓ガラス１２を通過せずに反射された光が、さらに複数回反射されて、第２受光部１４ｂに入射する。また、第１受光部１４ａと第２受光部１４ｂのうちの少なくとも一方は、アバランシェフォトダイオードの構造を有するようにしてもよい。   The light receiving element 14 is mounted on the upper surface of the substrate 15 so as to be adjacent to the light emitting element 11 at a predetermined interval. The light receiving element 14 includes a first light receiving unit 14a that receives reflected light from the detection object 50, and a second light receiving unit 14b. The light receiving area of the first light receiving unit 14a is the same as or substantially the same as the light receiving area of the second light receiving unit 14b. Here, the reflected light from the detected object 50 enters the first light receiving part 14 a of the light receiving element 14 through the incident side window glass 13. In addition, among the light emitted from the light emitting element 11, the light reflected without passing through the emission side window glass 12 is further reflected a plurality of times and enters the second light receiving unit 14 b. Further, at least one of the first light receiving unit 14a and the second light receiving unit 14b may have an avalanche photodiode structure.

上記基板１５および蓋１６は、出射側窓ガラス１２からの反射光を反射して受光素子１４の第２受光部１４ｂへ案内する。この基板１５は平板形状に形成されており、基板１５の上面に平行な方向において、発光素子１１が受光素子１４と隣り合っている。一方、蓋１６には、基板１５の上面に取り付けられ、基板１５の上面の大部分を覆っている。この蓋１６には、発光素子１１上に位置するように出射側窓ガラス１２が取り付けられていると共に、受光素子１４の第１受光部１４ａ上に位置するように入射側窓ガラス１３が取り付けられている。   The substrate 15 and the lid 16 reflect the reflected light from the emission side window glass 12 and guide it to the second light receiving part 14 b of the light receiving element 14. The substrate 15 is formed in a flat plate shape, and the light emitting element 11 is adjacent to the light receiving element 14 in a direction parallel to the upper surface of the substrate 15. On the other hand, the lid 16 is attached to the upper surface of the substrate 15 and covers most of the upper surface of the substrate 15. An emission side window glass 12 is attached to the lid 16 so as to be positioned on the light emitting element 11, and an incident side window glass 13 is attached so as to be positioned on the first light receiving part 14 a of the light receiving element 14. ing.

また、上記光センサ１は、被検出物５０から受光素子１４の第１受光部１４ａへ向かう反射光が通る第１導光路３１と、出射側窓ガラス１２から受光素子１４の第２受光部１４ｂへ向かう反射光が通る第２導光路３２と備えている。この第１導光路３１と第２導光路３２は互いに光学的に分離されている。ここで、第１導光路３１は蓋１６の内面で形成されている。一方、第２導光路３２は基板１５の上面と蓋１６の内面とで形成されている。   The optical sensor 1 includes a first light guide path 31 through which reflected light from the detection object 50 toward the first light receiving portion 14a of the light receiving element 14 passes, and a second light receiving portion 14b of the light receiving element 14 from the emission side window glass 12. And a second light guide path 32 through which reflected light travels toward. The first light guide 31 and the second light guide 32 are optically separated from each other. Here, the first light guide 31 is formed on the inner surface of the lid 16. On the other hand, the second light guide path 32 is formed by the upper surface of the substrate 15 and the inner surface of the lid 16.

また、上記蓋１６は、例えば、樹脂、セラミックなどの絶縁材料で形成されており、発光素子１１と受光素子１４の第１受光部１４ａの間に介在する隔壁部１６ａを有している。より詳しくは、隔壁部１６ａは、受光素子１４の上面の一部であって第１受光部１４ａと第２受光部１４ｂの間の部分に当接している。   The lid 16 is made of an insulating material such as resin or ceramic, and has a partition wall portion 16 a interposed between the light emitting element 11 and the first light receiving portion 14 a of the light receiving element 14. More specifically, the partition wall 16a is in contact with a portion of the upper surface of the light receiving element 14 and between the first light receiving portion 14a and the second light receiving portion 14b.

上記構成の光センサ１では、発光素子１１から出射された光の一部が出射側窓ガラス１２を透過するとき、その光の他の一部は、出射側窓ガラス１２によって反射された後、基板１５の上面と蓋１６の内面とでさらに反射される。これにより、上記光の他の一部を微弱光にして受光素子１４の第２受光部１４ｂに入射させることができる。したがって、発光素子１１から出射された光に対応する微弱光を受光素子１４の第２受光部１４ｂで受光することができる。   In the optical sensor 1 having the above configuration, when a part of the light emitted from the light emitting element 11 is transmitted through the emission side window glass 12, the other part of the light is reflected by the emission side window glass 12, The light is further reflected by the upper surface of the substrate 15 and the inner surface of the lid 16. Thereby, the other part of the light can be made weak and incident on the second light receiving portion 14 b of the light receiving element 14. Therefore, the weak light corresponding to the light emitted from the light emitting element 11 can be received by the second light receiving portion 14 b of the light receiving element 14.

また、上記出射側窓ガラス１２からの反射光を反射で減衰させることによって、特開２０１１-２５８６４５に開示されているような光減衰器を用いなくてもよいので、製造コストを低減できる。   Further, by attenuating the reflected light from the exit side window glass 12 by reflection, it is not necessary to use an optical attenuator as disclosed in JP 2011-258645A, and thus the manufacturing cost can be reduced.

また、上記被検出物５０が受光素子１４の第１受光部１４ａから遠く離れているとき、受光素子１４の第１受光部１４ａの受光量が小さくなるが、受光素子１４の第２受光部１４ｂで微弱光を受光し、この微弱光を基準光としてモニタすれば、遠くの被検出物５０であっても高精度に検出することができる。   Further, when the object 50 is far from the first light receiving portion 14a of the light receiving element 14, the amount of light received by the first light receiving portion 14a of the light receiving element 14 is reduced, but the second light receiving portion 14b of the light receiving element 14 is reduced. By receiving the weak light and monitoring the weak light as the reference light, even the far object 50 can be detected with high accuracy.

また、上記受光素子１４の第２受光部１４ｂで微弱光を受光できるので、第１受光部１４ａと第２受光部１４ｂの両方に同等特性のアバランシェフォトダイオードの構造を採用することができる。   Further, since the second light receiving portion 14b of the light receiving element 14 can receive weak light, it is possible to employ an avalanche photodiode structure having equivalent characteristics for both the first light receiving portion 14a and the second light receiving portion 14b.

また、上記第１導光路３１と第２導光路３２が互いに光学的に分離されているので、第１導光路３１の反射光が第２導光路３２の反射光と干渉するのを防ぐことができる。したがって、受光素子１４の第１受光部１４ａの受光量に基づいて、被検出物５０の検出を行ったとき、その検出の精度の信頼性を高めることができる。   Further, since the first light guide 31 and the second light guide 32 are optically separated from each other, it is possible to prevent the reflected light of the first light guide 31 from interfering with the reflected light of the second light guide 32. it can. Therefore, when the detected object 50 is detected based on the amount of light received by the first light receiving portion 14a of the light receiving element 14, the reliability of the detection accuracy can be increased.

また、上記蓋１６の隔壁部１６ａが発光素子１１と受光素子１４の第１受光部１４ａとの間に介在するので、発光素子１１によって出射される光の一部が被検出物５０に経由せずに受光素子１４の第１受光部１４ａに直接入射するのを蓋１６の隔壁部１６ａで確実に防ぐことができる。   Further, since the partition wall portion 16a of the lid 16 is interposed between the light emitting element 11 and the first light receiving portion 14a of the light receiving element 14, a part of the light emitted by the light emitting element 11 passes through the detected object 50. Without being directly incident on the first light receiving portion 14 a of the light receiving element 14, the partition wall portion 16 a of the lid 16 can be reliably prevented.

また、上記第２導光路３２は、基板１５の上面と蓋１６の内面とで形成された空間である。すなわち、第２導光路３２にはフィルタ材料などを配置していない。したがって、光センサ１の製造コストの増大を抑制することができる。   The second light guide path 32 is a space formed by the upper surface of the substrate 15 and the inner surface of the lid 16. That is, no filter material or the like is disposed in the second light guide path 32. Therefore, an increase in manufacturing cost of the optical sensor 1 can be suppressed.

ところで、光通信やＴＯＦ(time of flight：飛行時間)計測において、フォトダイオードのアバランシェ効果を利用し、微弱光を高速に検出する手法で、アバランシェフォトダイオードが用いられている。このアバランシェフォトダイオードは、逆バイアス電圧を降伏電圧(ブレークダウン電圧)以下で動作させると受光量に対して追従して出力電流が変動するリニアモードとなり、ブレークダウン電圧以上で動作させるとガイガーモードとなる。このガイガーモードでは、単一フォトンの入射でもアバランシェ現象を起こし、大きな出力電流を得ることができることから、ＳＰＡＤ(シングルフォトンアバランシェダイオード）と呼ばれる。   By the way, in optical communication and TOF (time of flight) measurement, an avalanche photodiode is used as a technique for detecting faint light at high speed using the avalanche effect of a photodiode. This avalanche photodiode is in a linear mode in which the output current fluctuates following the amount of light received when the reverse bias voltage is operated below the breakdown voltage (breakdown voltage). Become. This Geiger mode is called SPAD (single photon avalanche diode) because an avalanche phenomenon occurs even when a single photon is incident and a large output current can be obtained.

図２は、ＳＰＡＤ６１をガイガーモードで使用するときの回路図である。   FIG. 2 is a circuit diagram when the SPAD 61 is used in the Geiger mode.

上記ＳＰＡＤ６１はクエンチング抵抗６２に直列接続されており、トランジスタ６３のゲートがＳＰＡＤ６１とクエンチング抵抗６２の間に接続されている。これにより、ＳＰＡＤ６１に定以上の電流が流れると、ＳＰＡＤ６１に印加される電圧が低下し、アバランシェ現象が停止する。   The SPAD 61 is connected in series to the quenching resistor 62, and the gate of the transistor 63 is connected between the SPAD 61 and the quenching resistor 62. As a result, when a current greater than or equal to a constant value flows through the SPAD 61, the voltage applied to the SPAD 61 decreases, and the avalanche phenomenon stops.

上記ＳＰＡＤ６１の構造を第１受光部１４ａと第２受光部１４ｂの両方に採用した場合、受光素子１４は高速動作が可能であり、第２受光部１４ｂが反射光を検出した時点から、第１受光部１４ａが反射光を検出した時点までの時間tを用いて、光センサ１と被検出物５０までの距離Ｌを、Ｌ＝Ｃ(光速)×ｔ÷２で高精度に算出することが可能である。   When the structure of the SPAD 61 is adopted in both the first light receiving unit 14a and the second light receiving unit 14b, the light receiving element 14 can operate at high speed, and the first light receiving unit 14b detects the reflected light from the first time. Using the time t until the time when the light receiving unit 14a detects the reflected light, the distance L between the optical sensor 1 and the detected object 50 can be calculated with high accuracy by L = C (light velocity) × t / 2. Is possible.

図３は上記光センサ１の一変形例のブロック図である。ここで、１０１は高電圧源回路、１０２Ａは第１受光部の一例としての検出側ＳＰＡＤアレイ部、１０２Ｂは第２受光部の一例としての基準側ＳＰＡＤアレイ部、１０３Ａは検出側ＳＰＡＤアレイ部接続部、１０３Ｂは基準側ＳＰＡＤアレイ部接続部、１０４は発振器、１０５はフェイズロックループ回路、１０６はディレイロックループ回路、１０７Ａは検出側パルスカウンタ回路、１０７Ｂは基準側パルスカウンタ回路、１０８はレンジカウンタ回路、１０９はデータレジスタ・Ｉ２Ｃ(Inter Integrated Circuit)回路、１１０はエミッタドライバ、１１１は発光素子、１１２は入出力回路である。   FIG. 3 is a block diagram of a modification of the optical sensor 1. Here, 101 is a high voltage source circuit, 102A is a detection side SPAD array unit as an example of a first light receiving unit, 102B is a reference side SPAD array unit as an example of a second light receiving unit, and 103A is connected to a detection side SPAD array unit. , 103B is a reference side SPAD array connection unit, 104 is an oscillator, 105 is a phase lock loop circuit, 106 is a delay lock loop circuit, 107A is a detection side pulse counter circuit, 107B is a reference side pulse counter circuit, and 108 is a range counter Reference numeral 109 denotes a data register / I2C (Inter Integrated Circuit) circuit, 110 denotes an emitter driver, 111 denotes a light emitting element, and 112 denotes an input / output circuit.

上記エミッタドライバ１１０でパルス駆動した発光素子１１１による光信号を、高電圧の逆バイアスを印加した検出側ＳＰＡＤアレイ部１０２Ａおよび基準側ＳＰＡＤアレイ部１０２Ｂで受光する。このとき、検出側ＳＰＡＤアレイ部１０２Ａの検出信号と基準側ＳＰＡＤアレイ部１０２Ｂの検出信号との時間差を約１万発のパルス分ディレイロックループ１０６で平均化する。この時間差に依存するパルス信号数をレンジカウンタ回路１０８で検出し、データレジスタ・Ｉ２Ｃ回路１０９にて距離値または距離値に変換可能なカウント値(検知時間)として出力する。したがって、検出側ＳＰＡＤアレイ部１０２Ａの特性と基準側ＳＰＡＤアレイ部１０２Ｂの特性とを互いに同等にすることは、有益である。   An optical signal from the light emitting element 111 pulse-driven by the emitter driver 110 is received by the detection side SPAD array unit 102A and the reference side SPAD array unit 102B to which a high voltage reverse bias is applied. At this time, the time difference between the detection signal of the detection side SPAD array unit 102A and the detection signal of the reference side SPAD array unit 102B is averaged by the delay lock loop 106 for about 10,000 pulses. The number of pulse signals depending on the time difference is detected by the range counter circuit 108 and output as a distance value or a count value (detection time) that can be converted into a distance value by the data register / I2C circuit 109. Therefore, it is beneficial to make the characteristics of the detection side SPAD array unit 102A and the characteristics of the reference side SPAD array unit 102B equal to each other.

なお、図３において、ＡＶＤＤはアナログ電圧用端子、ＡＶＤＤはアナログ電源端子、ＡＧＮＤはアナロググランド端子、ＤＧＮＤはデジタルグランド端子、ＩＮＴはインタラプタ信号出力端子、ＳＣＬはシリアルクロック、ＳＤＡはシリアルデータ、ＶＣＳＥＬ＿Ａはアノード端子、ＶＣＳＥＬ＿Ｋはカソード端子、ＡＶＤＤ＿ＶＣＳＥＬは発光素子用アナログ電源端子、ＡＶＳＳ＿ＶＣＳＥＬは発光素子用アナロググランド端子である。   In FIG. 3, AVDD is an analog voltage terminal, AVDD is an analog power supply terminal, AGND is an analog ground terminal, DGND is a digital ground terminal, INT is an interrupter signal output terminal, SCL is a serial clock, SDA is serial data, and VCSEL_A is VCSEL_A. An anode terminal, VCSEL_K is a cathode terminal, AVDD_VCSEL is an analog power supply terminal for light emitting elements, and AVSS_VCSEL is an analog ground terminal for light emitting elements.

上記第１実施形態では、第２導光路３２に何も配置していなかったが、例えばフィルタなどを配置してもよい。第２導光路３２にフィルタを配置する場合、そのフィルタは、基板１５や蓋１６に接着できるし、出射側窓ガラス１２からの反射光の減衰量も調整できる。   In the first embodiment, nothing is arranged in the second light guide path 32, but a filter or the like may be arranged, for example. When a filter is disposed in the second light guide path 32, the filter can be bonded to the substrate 15 and the lid 16, and the attenuation amount of the reflected light from the emission side window glass 12 can be adjusted.

［第２実施形態］
図４は、この発明の第２実施形態の光センサ２０１を説明するための模式断面図である。この図４では、上記第１実施形態の構成部と同一の構成部については、上記第１実施形態の構成部の参照番号と同一の参照番号を付している。 [Second Embodiment]
FIG. 4 is a schematic cross-sectional view for explaining an optical sensor 201 according to the second embodiment of the present invention. In FIG. 4, the same reference numerals as those of the first embodiment are assigned to the same components as those of the first embodiment.

上記光センサ２０１は、スタック構造を得るために、上記第１実施形態の基板１５および蓋１６とは異なる形状の基板２１５および蓋２１６を備えている点が、上記第１実施形態と異なっている。なお、基板２１５および蓋２１６は反射光案内部材の一例である。   The optical sensor 201 is different from the first embodiment in that the optical sensor 201 includes a substrate 215 and a lid 216 different in shape from the substrate 15 and the lid 16 of the first embodiment in order to obtain a stack structure. . The substrate 215 and the lid 216 are examples of the reflected light guide member.

上記基板２１５は、両端部が被検出物５０側とは反対側に屈曲しており、上面から下面まで貫通する第１,第２貫通穴２１５ａ,２１５ｂを有している。また、基板２１５の上面には発光素子１１が搭載されている。一方、基板２１５の下面には受光素子１４が接続されている。ここで、基板２１５の第１,第２貫通穴２１５ａ,２１５ｂは受光素子１４の第１,第２受光部１４ａ,１４ｂと重ねられる。より詳しくは、第１,第２受光部１４ａ,１４ｂは全部が第１,第２貫通穴３１５ａ３１５ｂと重なって露出している。また、基板２１５の下面への受光素子１４の接続は、例えばフリップチップチップボンディングなどで行ってもよい。   The substrate 215 has first and second through holes 215a and 215b that are bent at opposite ends from the object 50 side and penetrate from the upper surface to the lower surface. The light emitting element 11 is mounted on the upper surface of the substrate 215. On the other hand, the light receiving element 14 is connected to the lower surface of the substrate 215. Here, the first and second through holes 215 a and 215 b of the substrate 215 are overlapped with the first and second light receiving portions 14 a and 14 b of the light receiving element 14. More specifically, the first and second light receiving portions 14a and 14b are all exposed to overlap the first and second through holes 315a and 315b. The light receiving element 14 may be connected to the lower surface of the substrate 215 by, for example, flip chip chip bonding.

また、上記基板２１５は、一部が発光素子１１と受光素子１４の第１受光部１４ａとの間に介在するように配置されている。   The substrate 215 is disposed so that a part thereof is interposed between the light emitting element 11 and the first light receiving portion 14 a of the light receiving element 14.

上記蓋２１６は、上記第１実施形態の蓋１６と同様に、例えば、樹脂、セラミックなどの絶縁材料で形成されているが、上記第１実施形態の蓋１６に比べて図中左右方向のサイズが小さくなっている。また、上記第１実施形態と同様に、蓋２１６には出射側窓ガラス１２および入射側窓ガラス１３が取り付けられている。   The lid 216 is formed of an insulating material such as resin or ceramic, for example, like the lid 16 of the first embodiment. However, the lid 216 has a size in the left-right direction in the drawing as compared with the lid 16 of the first embodiment. Is getting smaller. Similarly to the first embodiment, the lid 216 is provided with the emission side window glass 12 and the incident side window glass 13.

なお、２１６ａは、発光素子１１と受光素子１４の第１受光部１４ａの間に介在する隔壁部である。   Reference numeral 216 a denotes a partition wall interposed between the light emitting element 11 and the first light receiving part 14 a of the light receiving element 14.

上記構成の光センサ２０１は、上記第１実施形態と同様の効果を奏し、その上、発光素子１１、受光素子１４および基板２１５がスタック構造を形成するので、基板２１５の厚さ方向に垂直な方向のサイズを小さくすることができる。   The optical sensor 201 having the above configuration has the same effects as those of the first embodiment. In addition, the light emitting element 11, the light receiving element 14, and the substrate 215 form a stack structure, so that the optical sensor 201 is perpendicular to the thickness direction of the substrate 215. The size of the direction can be reduced.

また、上記基板２１５の下面に受光素子１４を接続していても、基板２１５の第１貫通穴２１５ａが受光素子１４の第１受光部１４ａに重なるので、発光素子１１４側の被検出物５０からの反射光を受光素子１４の第１受光部１４ａに容易に入射させることができる。   Even if the light receiving element 14 is connected to the lower surface of the substrate 215, the first through hole 215 a of the substrate 215 overlaps the first light receiving portion 14 a of the light receiving element 14. Can be easily incident on the first light receiving portion 14a of the light receiving element 14.

また、上記基板２１５の第２貫通穴２１５ｂが受光素子１４の第２受光部１４ｂに重なるので、発光素子１１４側の出射側窓ガラス１２からの反射光を受光素子１４の第２受光部１４ｂに容易に入射させることができる。   Further, since the second through hole 215b of the substrate 215 overlaps the second light receiving portion 14b of the light receiving element 14, the reflected light from the emission side window glass 12 on the light emitting element 114 side is reflected to the second light receiving portion 14b of the light receiving element 14. It can be easily incident.

また、上記発光素子１１と受光素子１４の第１受光部１４ａとの間に基板２１５の一部が介在するので、発光素子１１によって出射される光の一部が被検出物５０を経由せずに受光素子１４の第１受光部１４ａに直接入射するのを基板２１５の一部で防ぐことができる。   In addition, since a part of the substrate 215 is interposed between the light emitting element 11 and the first light receiving portion 14 a of the light receiving element 14, a part of the light emitted by the light emitting element 11 does not pass through the detected object 50. It is possible to prevent a part of the substrate 215 from directly entering the first light receiving portion 14 a of the light receiving element 14.

ところで、スマートフォンなどに用いられるカメラにおいては、発光素子近傍にＴＯＦセンサを配置することにより、オートフォーカスの高速化が図られているこれは、上記ＴＯＦセンサで対象物までの距離を計測することより、ＣＭＯＳ(Complementary Metal Oxide Semiconductor:相補型金属酸化膜半導体)イメージセンサのピント合わせを短時間で実施することが可能となるからである。   By the way, in a camera used for a smartphone or the like, a high-speed autofocus is achieved by arranging a TOF sensor in the vicinity of the light emitting element. This is because the TOF sensor measures the distance to an object. This is because a CMOS (Complementary Metal Oxide Semiconductor) image sensor can be focused in a short time.

上記スマートフォンのようなモバイル機器には、より小型のセンサが求められるため、光センサ２０１のスタック構造は有益である。   Since a smaller sensor is required for a mobile device such as the smartphone, the stack structure of the optical sensor 201 is useful.

図５〜図７は、上記光センサ２０１についてシミュレーションした結果を示す図である。より詳しくは、図５は、図４の高さＨに相当する光路変更部入力口高さと、受光素子１４の第２受光部１４ｂの受光量に相当する基準側入力光量との関係をシミュレーションした結果を示すグラフである。また、図６は、上記光路変更部入力口高さを１００μｍに設定したとき、受光素子１４の第２受光部１４ｂに入射する光をシミュレーションした結果を示す図である。また、図７は、上記光路変更部入力口高さを２００μｍに設定したとき、受光素子１４の第２受光部１４ｂに入射する光をシミュレーションした結果を示す図である。また、図６,図７の長方形は第２受光部１４ｂの受光面に相当し、この長方形内の点の数で入射光線数が示されている。また、図６,図７の紙面の左右方向は図４の紙面に垂直な方向に対応する。また、図６,図７の紙面の上下方向は図４の紙面の左右方向に対応する。   5-7 is a figure which shows the result of having simulated about the said optical sensor 201. FIG. More specifically, FIG. 5 simulates the relationship between the optical path changing unit input port height corresponding to the height H in FIG. 4 and the reference side input light amount corresponding to the received light amount of the second light receiving unit 14 b of the light receiving element 14. It is a graph which shows a result. FIG. 6 is a diagram showing a result of simulating light incident on the second light receiving portion 14b of the light receiving element 14 when the height of the optical path changing portion input port is set to 100 μm. FIG. 7 is a diagram showing a result of simulating light incident on the second light receiving portion 14b of the light receiving element 14 when the optical path changing portion input port height is set to 200 μm. 6 and 7 correspond to the light receiving surface of the second light receiving unit 14b, and the number of incident rays is indicated by the number of points in the rectangle. 6 and 7 corresponds to a direction perpendicular to the paper surface of FIG. 6 and 7 corresponds to the horizontal direction of the paper surface of FIG.

上記光路変更部入力口高さを１００μｍから徐々に高くして行ったとき、図５に示すように、光路変更部入力口高さが約２００μｍになったところで、出射側窓ガラス１２による直接反射光(出射側窓ガラス１２に反射された後、基板２１５の上面や、蓋２１６の内面に反射されずに、受光素子１４の第２受光部１４ｂに向かう光)の影響が生じる。これは、図６,図７に示すように、受光素子１４の第２受光部１４ｂの受光量の増加を示す黒の濃い線は、光路変更部入力口高さを１００μｍに設定したときは出ていないが、光路変更部入力口高さを２００μｍに設定したときは出ていることから分かる。上記直接反射光が受光素子１４の第２受光部１４ｂに直接入射する場合、外乱光も受光素子１４の第２受光部１４ｂに直接入射できる状態となるので、受光素子１４の第２受光部１４ｂで受光する光を基準光と用いると、被検出物５０の検出精度が低下してしまう。したがって、上記光路変更部入力口高さは約１５０μｍ程度が最適値と考えられる。   When the optical path changing unit input port height is gradually increased from 100 μm, as shown in FIG. 5, when the optical path changing unit input port height is about 200 μm, direct reflection by the exit side window glass 12 is performed. There is an influence of light (light that is reflected by the emission-side window glass 12 and then is not reflected by the upper surface of the substrate 215 or the inner surface of the lid 216 but is directed to the second light-receiving portion 14b of the light-receiving element 14). As shown in FIGS. 6 and 7, the dark black line indicating the increase in the amount of light received by the second light receiving unit 14b of the light receiving element 14 appears when the optical path changing unit input port height is set to 100 μm. However, it can be seen from the fact that when the height of the input port of the optical path changing unit is set to 200 μm, it is output. When the directly reflected light is directly incident on the second light receiving portion 14b of the light receiving element 14, disturbance light can be directly incident on the second light receiving portion 14b of the light receiving element 14, so that the second light receiving portion 14b of the light receiving element 14 is reached. If the light received at is used as the reference light, the detection accuracy of the detection object 50 is lowered. Therefore, the optimum value of the height of the optical path changing unit input port is about 150 μm.

特に、ＴＯＦセンサにこの発明を用いる場合、アバランシェフォトダイオードをガイガーモードで用いるとき、図２に示す高電圧ＨＶを最適値に設定する必要がある。この設定には、基準光を受光するための受光部への外乱光の入射を防ぐ必要があるので、上記光路変更部入力口高さの調整は有益である。   In particular, when the present invention is used for the TOF sensor, when the avalanche photodiode is used in the Geiger mode, it is necessary to set the high voltage HV shown in FIG. 2 to an optimum value. In this setting, since it is necessary to prevent disturbance light from entering the light receiving unit for receiving the reference light, the adjustment of the optical path changing unit input port height is beneficial.

［第３実施形態］
図８は、この発明の第３実施形態の光センサ３０１を説明するための模式断面図である。この図８では、上記第１実施形態の構成部と同一の構成部については、上記第１実施形態の構成部の参照番号と同一の参照番号を付している。 [Third Embodiment]
FIG. 8 is a schematic cross-sectional view for explaining an optical sensor 301 according to a third embodiment of the present invention. In FIG. 8, the same reference numerals as those of the first embodiment are assigned to the same components as those of the first embodiment.

上記光センサ３０１は、上記第１実施形態の入射側窓ガラス１３および蓋１６に対応する入射側窓ガラスおよび蓋を備えず、上記第１実施形態の出射側窓ガラス１２および基板１５とは異なる形状の出射側窓ガラス３１２および基板３１５を備えている点が、上記第１実施形態と異なっている。なお、出射側窓ガラス３１２は光学部材の一例である。また、出射側窓ガラス３１２は反射光案内部材の一例も兼ねる。また、基板３１５は反射光案内部材の一例である。   The optical sensor 301 does not include the incident-side window glass and the lid corresponding to the incident-side window glass 13 and the lid 16 of the first embodiment, and is different from the emission-side window glass 12 and the substrate 15 of the first embodiment. It differs from the first embodiment in that it includes a shaped emission side window glass 312 and a substrate 315. The exit side window glass 312 is an example of an optical member. The exit side window glass 312 also serves as an example of a reflected light guide member. The substrate 315 is an example of a reflected light guide member.

上記出射側窓ガラス３１２は、発光素子１１と被検出物５０の間の光路上に配置されている。より詳しくは、出射側窓ガラス３１２は、発光素子１１から出射された光の一部を透過すると共に、発光素子１１から出射された光の他の一部を反射する。ここで、例えば、発光素子１１から出射された光の約９０％を透過すると共に、発光素子１１から出射された光の約１０％を反射するガラスが、出射側窓ガラス１２として用いられてもよい。   The exit side window glass 312 is disposed on the optical path between the light emitting element 11 and the detection object 50. More specifically, the exit side window glass 312 transmits a part of the light emitted from the light emitting element 11 and reflects the other part of the light emitted from the light emitting element 11. Here, for example, glass that transmits about 90% of the light emitted from the light emitting element 11 and reflects about 10% of the light emitted from the light emitting element 11 may be used as the emission side window glass 12. Good.

上記基板３１５は、両端部が被検出物５０側とは反対側に屈曲しており、上面から下面まで貫通する第１,第２貫通穴３１５ａ,３１５ｂを有している。また、基板３１５の上面には発光素子１１が搭載されている。一方、基板３１５の下面には受光素子１４が接続されている。ここで、基板３１５の第１,第２貫通穴３１５ａ,３１５ｂは受光素子１４の第１,第２受光部１４ａ,１４ｂと重ねられる。より詳しくは、第１受光部１４ａは全部が第１貫通穴３１５ａと重なって露出しているが、第２受光部１４ｂは一部だけが第２貫通穴３１５ｂと重なって露出している。また、基板３１５の下面への受光素子１４の接続は、例えばフリップチップチップボンディングなどで行ってもよい。   The substrate 315 has first and second through holes 315a and 315b that are bent at opposite ends from the object 50 side and penetrate from the upper surface to the lower surface. The light emitting element 11 is mounted on the upper surface of the substrate 315. On the other hand, the light receiving element 14 is connected to the lower surface of the substrate 315. Here, the first and second through holes 315 a and 315 b of the substrate 315 are overlapped with the first and second light receiving portions 14 a and 14 b of the light receiving element 14. More specifically, the first light receiving portion 14a is entirely exposed to overlap with the first through hole 315a, but the second light receiving portion 14b is only partially exposed to overlap with the second through hole 315b. The light receiving element 14 may be connected to the lower surface of the substrate 315 by, for example, flip chip chip bonding.

また、上記基板３１５は、一部が発光素子１１と受光素子１４の第１受光部１４ａとの間に介在するように配置されている。   The substrate 315 is disposed so that a part thereof is interposed between the light emitting element 11 and the first light receiving portion 14 a of the light receiving element 14.

また、上記基板３１５には、発光素子１１および第２貫通穴３１５ｂ上に位置するように出射側窓ガラス３１２が取り付けられている。   In addition, an emission side window glass 312 is attached to the substrate 315 so as to be positioned on the light emitting element 11 and the second through hole 315b.

上記構成の光センサ３０１では、発光素子１１から出射された光の一部が出射側窓ガラス３１２を透過するとき、その光の他の一部は、出射側窓ガラス３１２によって反射された後、少なくとも基板１５の上面と出射側窓ガラス３１２の下面とでさらに反射されて、受光素子１４の第２受光部１４ｂに向かう。このとき、出射側窓ガラス３１２の下面で反射された反射光が、基板３１５の第２貫通穴３１５ｂの内周面でさらに反射されて、受光素子１４の第２受光部１４ｂに向かうこともある。したがって、上記第１実施形態と同様の作用効果が得られる。   In the optical sensor 301 having the above configuration, when a part of the light emitted from the light emitting element 11 passes through the emission side window glass 312, the other part of the light is reflected by the emission side window glass 312, The light is further reflected at least by the upper surface of the substrate 15 and the lower surface of the exit side window glass 312, and travels toward the second light receiving portion 14 b of the light receiving element 14. At this time, the reflected light reflected by the lower surface of the exit-side window glass 312 may be further reflected by the inner peripheral surface of the second through hole 315b of the substrate 315 and directed toward the second light receiving portion 14b of the light receiving element 14. . Therefore, the same effect as the first embodiment can be obtained.

また、上記発光素子１１、受光素子１４および基板３１５がスタック構造を形成し、基板３１５の第１,第２貫通穴３１５ａ,３１５ｂの少なくとも一部が受光素子１４の第１,第２受光部１４ａ,１４ｂに重なり、発光素子１１と受光素子１４の第１受光部１４ａとの間に基板３１５の一部が介在するので、上記第２実施形態と同様の作用効果も得られる。   The light emitting element 11, the light receiving element 14, and the substrate 315 form a stack structure, and at least a part of the first and second through holes 315a and 315b of the substrate 315 is the first and second light receiving portions 14a of the light receiving element 14. , 14b and a part of the substrate 315 is interposed between the light emitting element 11 and the first light receiving portion 14a of the light receiving element 14, so that the same effect as the second embodiment can be obtained.

また、上記第１実施形態の入射側窓ガラス１３および蓋１６に対応する入射側窓ガラスおよび蓋が無いので、上記第１実施形態よりも材料が少なくなる。したがって、材料のばらつきや、工程のばらつきにより、特性変動が生じるのを防ぐことができる。   Moreover, since there is no incident side window glass and cover corresponding to the incident side window glass 13 and the cover 16 of the first embodiment, the material is smaller than that of the first embodiment. Therefore, it is possible to prevent characteristic variation from occurring due to material variations and process variations.

また、上記第１貫通穴３１５ａからは第１受光部１４ａの全部が露出するが、第２貫通穴３１５ｂからは第２受光部１４ｂの一部だけが露出しているので、第２受光部１４ｂの受光面積は第１受光部１４ａの受光面積よりも小さくなっている。したがって、第２受光部１４ｂに外乱光が入射する可能性を下げることができる。   Further, the entire first light receiving portion 14a is exposed from the first through hole 315a, but only a part of the second light receiving portion 14b is exposed from the second through hole 315b. Therefore, the second light receiving portion 14b is exposed. Is smaller than the light receiving area of the first light receiving portion 14a. Therefore, it is possible to reduce the possibility that ambient light enters the second light receiving unit 14b.

上記第３実施形態では、発光素子１１上に出射側窓ガラス３１２を配置していたが、発光素子１１上に出射側窓ガラス３１２を配置しないようにしてもよい。このようにする場合、例えば、図９に示すように、樹脂ポッティングにより形成した樹脂３４０で発光素子１１を覆ってもよい。樹脂３４０で発光素子１１を覆えば、出射側窓ガラス３１２を安価な樹脂３４０で代用できるので、製造コストをさらに低減することができる。なお、樹脂３４０は光学部材の一例である。   In the third embodiment, the emission side window glass 312 is disposed on the light emitting element 11. However, the emission side window glass 312 may not be disposed on the light emitting element 11. In this case, for example, as shown in FIG. 9, the light emitting element 11 may be covered with a resin 340 formed by resin potting. If the light emitting element 11 is covered with the resin 340, the emission side window glass 312 can be substituted with an inexpensive resin 340, and thus the manufacturing cost can be further reduced. The resin 340 is an example of an optical member.

この発明の具体的な実施形態について説明したが、この発明は上記第１〜第３実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することができる。例えば、上記第１〜第３実施形態に記載した内容を適宜組み合わせたものを、この発明の一実施形態としてもよい。また、この発明は、光の受光量を検出する近接センサ、照度センサ、もしくは光の伝搬時間を測量するＴＯＦセンサに用いてもよい。また、この発明の電子機器としては、例えば、スマートフォン、プロジェクタ、ロボット掃除機などがある。   Although specific embodiments of the present invention have been described, the present invention is not limited to the first to third embodiments, and can be implemented with various modifications within the scope of the present invention. For example, what combined suitably the content described in the said 1st-3rd embodiment is good also as one Embodiment of this invention. Further, the present invention may be used for a proximity sensor that detects the amount of received light, an illuminance sensor, or a TOF sensor that measures the propagation time of light. Examples of the electronic device of the present invention include a smartphone, a projector, and a robot cleaner.

以上纏めると、この発明の光センサ１,２０１,３０１は、
被検出物５０に向けて光を出射する発光素子１１,１１１と、
上記発光素子１１,１１１から出射された光の一部を透過すると共に、上記発光素子１１,１１１から出射された光の他の一部を反射する光学部材１２,３１２,３４０と
上記被検出物５０からの反射光を受光する第１受光部１４ａ,１０２Ａと、第２受光部１４ｂ,１０２Ｂとを有する受光素子１４と、
上記光学部材１２,３１２,３４０からの反射光を反射して上記受光素子１４の上記第２受光部１４ｂ,１０２Ｂへ案内する反射光案内部材１５,１６,２１５,２１６,３１２,３１５と
を備えることを特徴としている。 In summary, the optical sensors 1, 201, 301 of the present invention are:
Light-emitting elements 11 and 111 that emit light toward the detection object 50;
Optical members 12, 312, 340 that transmit part of the light emitted from the light emitting elements 11, 111 and reflect the other part of the light emitted from the light emitting elements 11, 111, and the object to be detected A light receiving element 14 having first light receiving portions 14a and 102A for receiving reflected light from 50 and second light receiving portions 14b and 102B;
Reflected light guide members 15, 16, 215, 216, 312, 315 for reflecting the reflected light from the optical members 12, 312, 340 and guiding them to the second light receiving portions 14 b, 102 B of the light receiving element 14. It is characterized by that.

上記構成によれば、上記発光素子１１,１１１から出射された光の一部が光学部材１２,３１２,３４０を透過するとき、上記光の他の一部が光学部材１２,３１２,３４０によって反射される。この光学部材１２,３１２,３４０からの反射光は反射光案内部材１５,１６,２１５,２１６,３１２,３１５に反射されて受光素子１４の第２受光部１４ｂ,１０２Ｂに入射するので、受光素子１４の第２受光部１４ｂ,１０２Ｂへの入射光を微弱光にすることができる。すなわち、上記受光素子１４の第２受光部１４ｂ,１０２Ｂで微弱光を受光することができる。   According to the above configuration, when a part of the light emitted from the light emitting elements 11, 111 passes through the optical members 12, 312, 340, the other part of the light is reflected by the optical members 12, 312, 340. Is done. Since the reflected light from the optical members 12, 312, and 340 is reflected by the reflected light guide members 15, 16, 215, 216, 312, and 315 and enters the second light receiving portions 14b and 102B of the light receiving element 14, the light receiving element The incident light to the 14 second light receiving portions 14b and 102B can be made weak light. That is, weak light can be received by the second light receiving portions 14b and 102B of the light receiving element 14.

また、上記光学部材１２,３１２,３４０からの反射光をさらに反射させることで減衰させるので、特開２０１１-２５８６４５に開示されているような光減衰器を用いなくてもよい。したがって、製造コストを低減することができる。   Further, since the reflected light from the optical members 12, 312, and 340 is further attenuated by being reflected, it is not necessary to use an optical attenuator as disclosed in JP 2011-258645A. Therefore, the manufacturing cost can be reduced.

一実施形態の光センサ１,２０１,３０１では、
上記反射光案内部材１５,１６,２１５,２１６,３１２,３１５は、上記被検出物５０から上記第１受光部１４ａへ向かう反射光が通る第１導光路３１と、上記光学部材１２,３１２,３４０から上記第２受光部１４ｂへ向かう反射光が通る第２導光路３２とを有し、
上記第１導光路３１と上記第２導光路３２とは互いに分離されている。 In one embodiment of the optical sensor 1, 201, 301,
The reflected light guide members 15, 16, 215, 216, 312, 315 include a first light guide path 31 through which reflected light from the detected object 50 toward the first light receiving unit 14 a passes, and the optical members 12, 312, A second light guide path 32 through which reflected light from 340 toward the second light receiving unit 14b passes,
The first light guide 31 and the second light guide 32 are separated from each other.

上記実施形態によれば、上記第２導光路３２を通る反射光が、第１導光路３１を通る反射光と干渉するのを防ぐことができるので、受光素子１４の第１受光部１４ａの受光量に基づいて、被検出物５０の検出を行ったとき、その検出の精度の信頼性を高めることができる。   According to the embodiment, since the reflected light passing through the second light guide path 32 can be prevented from interfering with the reflected light passing through the first light guide path 31, the light received by the first light receiving portion 14a of the light receiving element 14 can be prevented. When the detection object 50 is detected based on the amount, the reliability of the detection accuracy can be increased.

一実施形態の光センサ２０１,３０１では、
上記反射光案内部材２１５,２１６,３１２,３１５は、上記発光素子１１の上面上に搭載し、かつ、上記受光素子１４が下面に接続された基板２１５,３１５を有し、
上記基板２１５,３１５には、上記受光素子１４の上記第１,第２受光部１４ａ１４ｂの少なくとも一部に重なるように、上記上面から上記下面まで貫通する第１,第２貫通穴２１５ａ,２１５ｂ,３１５ａ,３１５ｂが設けられている。 In one embodiment of the optical sensor 201, 301,
The reflected light guide members 215, 216, 312, and 315 have substrates 215 and 315 mounted on the upper surface of the light emitting element 11 and the light receiving element 14 connected to the lower surface,
In the substrates 215 and 315, first and second through holes 215a and 215b penetrating from the upper surface to the lower surface so as to overlap at least part of the first and second light receiving portions 14a14b of the light receiving element 14. 315a and 315b are provided.

上記実施形態によれば、上記発光素子１１、受光素子１４および基板２１５,３１５でスタック構造が得られるので、基板２１５,３１５の厚さ方向に垂直な方向のサイズを小さくすることができる。   According to the above embodiment, a stack structure is obtained by the light emitting element 11, the light receiving element 14, and the substrates 215 and 315, so that the size in the direction perpendicular to the thickness direction of the substrates 215 and 315 can be reduced.

また、上記基板２１５,３１５の下面に受光素子１４を接続してもいても、基板２１５,３１５の第１貫通穴２１５ａ,２１５ｂが受光素子１４の第１受光部１４ａの少なくともに重なるので、発光素子１１側の被検出物５０からの反射光を受光素子１４の第１受光部１４ａに容易に入射させることができる。   Even if the light receiving element 14 is connected to the lower surfaces of the substrates 215 and 315, the first through holes 215 a and 215 b of the substrates 215 and 315 overlap with at least the first light receiving portion 14 a of the light receiving element 14. The reflected light from the detection object 50 on the element 11 side can be easily incident on the first light receiving portion 14 a of the light receiving element 14.

また、上記基板２１５,３１５の第２貫通穴３１５ａ,３１５ｂが受光素子１４の第２受光部１４ｂ,１０２Ｂの少なくとも一部に重なるので、発光素子１１側の光学部材１２,３１２,３４０からの反射光を受光素子１４の第２受光部１４ｂに容易に入射させることができる。   Further, since the second through holes 315a and 315b of the substrates 215 and 315 overlap at least part of the second light receiving portions 14b and 102B of the light receiving element 14, reflection from the optical members 12, 312 and 340 on the light emitting element 11 side. Light can be easily incident on the second light receiving portion 14 b of the light receiving element 14.

一実施形態の光センサ２０１,３０１では、
上記発光素子１１と上記受光素子１４の上記第１受光部１４ａ,との間には、上記基板２１５,３１５の一部が介在する。 In one embodiment of the optical sensor 201, 301,
Part of the substrates 215 and 315 is interposed between the light emitting element 11 and the first light receiving portion 14 a of the light receiving element 14.

上記実施形態によれば、上記発光素子１１と受光素子１４の第１受光部１４ａとの間に基板２１５,３１５の一部を介在させているので、発光素子１１によって出射される光の一部が受光素子１４の第１受光部１４ａに直接入射するのを基板２１５,３１５の一部で防ぐことができる。   According to the above embodiment, since a part of the substrates 215 and 315 is interposed between the light emitting element 11 and the first light receiving part 14a of the light receiving element 14, a part of the light emitted by the light emitting element 11 is used. Can be prevented by a part of the substrates 215 and 315 from directly entering the first light receiving portion 14 a of the light receiving element 14.

この発明の電子機器は、
この発明または一実施形態のうちのいずれか１つの光センサ１,２０１,３０１を備えたことを特徴としている。 The electronic device of the present invention is
The present invention or any one of the embodiments is characterized by including any one of the optical sensors 1, 201, 301.

上記構成によれば、上記光センサ１,２０１,３０１を備えるので、受光素子１４の第２受光部１４ｂ,１０２Ｂで微弱光を受光することができると共に、製造コストを低減できる。   According to the above configuration, since the optical sensors 1, 201, 301 are provided, the second light receiving portions 14b, 102B of the light receiving element 14 can receive weak light and the manufacturing cost can be reduced.

１,２０１,３０１ 光センサ
１１ 発光素子
１２,３１２ 出射側窓ガラス
１３ 入射側窓ガラス
１４ 受光素子
１４ａ 第１受光部
１４ｂ 第２受光部
１５,２１５,３１５ 基板
１６,２１６ 蓋
５０ 被検出物
１０２Ａ 検出側ＳＰＡＤアレイ部
１０２Ｂは基準側ＳＰＡＤアレイ部
２１５ａ,３１５ａ 第１貫通穴
２１５ｂ,３１５ｂ 第２貫通穴
３４０ 樹脂 DESCRIPTION OF SYMBOLS 1,201,301 Optical sensor 11 Light emitting element 12,312 Output side window glass 13 Incident side window glass 14 Light receiving element 14a First light receiving part 14b Second light receiving part 15,215,315 Substrate 16,216 Cover 50 Detected object 102A The detection side SPAD array part 102B is a reference side SPAD array part 215a, 315a first through hole 215b, 315b second through hole 340 resin.

Claims (5)

被検出物に向けて光を出射する発光素子と、
上記発光素子から出射された光の一部を透過すると共に、上記発光素子から出射された光の他の一部を反射する光学部材と、
上記被検出物からの反射光を受光する第１受光部と、第２受光部とを有する受光素子と、
上記光学部材からの反射光を反射して上記受光素子の上記第２受光部へ案内する反射光案内部材と
を備えることを特徴とする光センサ。 A light emitting element that emits light toward an object to be detected;
An optical member that transmits part of the light emitted from the light emitting element and reflects the other part of the light emitted from the light emitting element;
A light receiving element having a first light receiving unit that receives reflected light from the object to be detected, and a second light receiving unit;
An optical sensor comprising: a reflected light guide member that reflects reflected light from the optical member and guides the reflected light to the second light receiving portion of the light receiving element. 請求項１に記載の光センサにおいて、
上記反射光案内部材は、上記被検出物から上記第１受光部へ向かう反射光が通る第１導光路と、上記光学部材から上記第２受光部へ向かう反射光が通る第２導光路とを形成し、
上記第１導光路と上記第２導光路とは互いに分離されていることを特徴とする光センサ。 The optical sensor according to claim 1,
The reflected light guide member includes a first light guide path through which reflected light traveling from the detected object toward the first light receiving section passes, and a second light guide path through which reflected light traveling from the optical member toward the second light receiving section passes. Forming,
The optical sensor, wherein the first light guide path and the second light guide path are separated from each other. 請求項１または２に記載の光センサにおいて、
上記反射光案内部材は、上記発光素子の上面上に搭載し、かつ、上記受光素子が下面に接続された基板を有し、
上記基板には、上記受光素子の上記第１,第２受光部の少なくとも一部に重なるように、上記上面から上記下面まで貫通する第１,第２貫通穴が設けられていることを特徴とする光センサ。 The optical sensor according to claim 1 or 2,
The reflected light guide member has a substrate mounted on the upper surface of the light emitting element, and the light receiving element is connected to the lower surface,
The substrate is provided with first and second through holes penetrating from the upper surface to the lower surface so as to overlap at least a part of the first and second light receiving portions of the light receiving element. Light sensor. 請求項３に記載の光センサにおいて、
上記発光素子と上記受光素子の上記第１受光部との間は、上記基板の一部が介在することを特徴とする光センサ。 The optical sensor according to claim 3.
A part of the substrate is interposed between the light emitting element and the first light receiving portion of the light receiving element. 請求項１から４までのいずれか一項に記載の光センサを備えたことを特徴とする電子機器。   An electronic apparatus comprising the optical sensor according to any one of claims 1 to 4.
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