JP2019011883A - Indoor environment adjustment system - Google Patents

Abstract

To provide an indoor environment adjustment system capable of performing cooling and dehumidification in simple configuration.SOLUTION: An indoor environment adjustment system comprises: an indoor surface constituent member (a floor surface 200 and a wall surface 300) consisting of a material containing a far infrared radiation material; a first cooling source 2 including a first cooking surface 21 consisting of a material containing a far infrared radiation material; and a second cooling source 3 including a second cooling surface 31 consisting of a material containing a far infrared radiation material. The far infrared radiation material of the first cooling surface 21 and the second cooling surface 31 resonates and absorbs far infrared rays that are radiated from the far infrared radiation material of the indoor surface constituent member, such that the indoor surface constituent member is defined as a secondary cold radiation source. The second cooling surface 31 is cooled at a lower temperature than the first cooling surface 21, such that moisture is preferentially condensed on the second cooling surface 31.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an indoor environment adjustment system.

  In the case of cooling, reducing the humidity in the room is advantageous from the viewpoint of improving the cooling efficiency. For example, Patent Literature 1 discloses an air conditioning system including a dehumidifier that can increase the COP (coefficient of performance) of a cooling device. Such an air conditioning system is a system employing so-called desiccant air conditioning, but the system configuration is complicated.

JP 2017-89936 A

  An object of the present invention is to provide an indoor environment adjustment system that can perform cooling and dehumidification with a simple configuration.

Such an object is achieved by the present inventions (1) to (8) below.
(1) An indoor surface constituent member made of a material containing a far-infrared emitting substance,
A first cooling source comprising a first cooling surface made of a material containing the far-infrared emitting material;
A second cooling source comprising a second cooling surface made of a material containing the far-infrared emitting material and cooled to a temperature lower than the first cooling surface;
When the first cooling source cools the first cooling surface and the second cooling source cools the second cooling surface, the first cooling surface and the second cooling surface become It becomes a primary cold radiation source, and the far infrared radiation material on the first cooling surface and the second cooling surface resonantly absorbs the far infrared radiation emitted by the far infrared radiation material of the indoor surface component. By using the indoor surface constituent member as a secondary cold radiation source,
An indoor environment adjustment system configured to preferentially condense on the second cooling surface by cooling the second cooling surface to a temperature lower than that of the first cooling surface.

  (2) When the cooling temperature of the first cooling surface by the first cooling source is A [° C.] and the cooling temperature of the second cooling surface by the second cooling source is B [° C.] , A-B is the indoor environment adjustment system according to (1), wherein 5 to 40.

  (3) The indoor environment adjustment system according to (2), wherein the cooling temperature A is 15 to 24 ° C.

  (4) The indoor environment adjustment system according to (2) or (3), wherein the cooling temperature B is -20 to 15 ° C.

  (5) The said 1st cooling surface by a said 1st cooling source is at least one part of the ceiling surface which prescribes | regulates the indoor space which adjusts an environment, In any one of said (1) thru | or (4) Indoor environment adjustment system.

(6) The indoor environment adjustment system according to any one of (1) to (5), wherein the second cooling source is disposed on a wall surface spaced 2 m or more from a floor surface that defines an indoor space for environmental adjustment. .

  (7) The indoor environment adjustment according to any one of (1) to (6), wherein the second cooling source is disposed on a wall surface spaced 15 to 140 cm away from a ceiling surface that defines an indoor space to be adjusted. system.

  (8) The indoor environment adjustment member according to any one of (1) to (7), wherein the indoor surface component member constitutes at least a part of a wall surface and / or a floor surface that defines an indoor space for environmental adjustment. system.

  According to the present invention, cooling and dehumidification can be performed with a simple configuration. In addition, by preferentially condensing the second cooling surface, it is possible to suitably prevent condensation on the first cooling surface. Therefore, even if the indoor ceiling surface in which the environment is adjusted is configured by the first cooling surface in order to increase the cooling efficiency, the liquid droplets do not fall from the ceiling surface.

It is a figure showing typically an embodiment of an indoor environment adjustment system of the present invention. It is a figure which shows the structure of a 2nd cooling source typically. And graph (a) showing the radiation characteristics of the ZrO ₂ + CaO film is a graph showing the radiation characteristics of the Al ₂ O ₃ + TiO ₂ film (b). It is the top view (a) and front view (b) which show the other structural example of a 1st cooling source.

Hereinafter, an indoor environment adjustment system of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
1 is a diagram schematically showing an embodiment of an indoor environment adjustment system of the present invention, FIG. 2 is a diagram schematically showing a configuration of a second cooling source, and FIG. 3 is a radiation characteristic of a ZrO ₂ + CaO film. And a graph (b) showing the radiation characteristics of the Al ₂ O ₃ + TiO ₂ film.
Note that the dimensions, materials, shapes, relative arrangements, and the like of the members shown in the embodiments do not limit the scope of the present invention unless otherwise specified, and are merely examples.

  The indoor environment adjustment system 1 shown in FIG. 1 is a system provided in a room 100 for environmental adjustment. Here, the room 100 is a residential room such as a detached house or an apartment house, or a work room such as an office or a conference room. The room 100 includes a hexahedron-shaped indoor space 101 defined by a floor surface 200, four wall surfaces 300, and a ceiling surface 400.

  The indoor environment adjustment system 1 includes an indoor surface constituent member, a first cooling source 2 including a first cooling surface 21, and a second cooling source 3 including a second cooling surface 31. Moreover, in this invention, all of the indoor surface structural member, the 1st cooling surface 21, and the 2nd cooling surface 31 are comprised with the material containing the same far-infrared radiation | emission substance.

  Here, examples of the far-infrared emitting material include natural or artificial minerals, metal or metalloid oxides, nitrides, carbides, sulfides, hydroxides, salts such as carbonates, or composites thereof (double salts). ), Charcoal and the like, and one of these can be used alone or in combination of two or more. The far-infrared radiation material may be a natural material such as a shell, an organic material, a material derived from an organic material, or the like.

  In the present embodiment, the indoor surface constituent members constitute a floor surface 200 and four wall surfaces 300. In this case, the floor surface 200 is made of, for example, a floor panel formed by shaping a natural stone containing a far-infrared emitting material, a far-infrared emitting material (for example, a pulverized product of natural stone) disposed on the ground structure of the floor. It can consist of carpets and the like. Further, the wall surface 400 can be constituted by, for example, a stucco layer containing a far-infrared emitting material, a sheet material containing a far-infrared emitting material, and the like disposed (formed) on the base structure of the wall.

  In the present embodiment, the first cooling surface 21 of the first cooling source 2 constitutes the ceiling surface 400. The first cooling source 2 can be configured, for example, by forming a far-infrared radiation layer on the surface of a flat base portion on which a fluid (refrigerant) flow path (not shown) is formed. In this case, the surface opposite to the base of the far infrared radiation layer constitutes the first cooling surface 21.

The base can be made of a metal material (high thermal conductivity material) such as stainless steel, iron, copper, or an alloy containing these.
The far-infrared radiation layer supplies the far-infrared radiation material to the surface of the base by, for example, physical vapor deposition (PVD method) such as spraying or vapor deposition, or chemical vapor deposition (CVD). Can be formed. In addition, the far-infrared radiation layer can be formed by sticking a sheet material containing a far-infrared radiation material on the surface of the base, and applying and drying a coating material containing a far-infrared radiation material.

As shown in FIG. 1, the first cooling device 20 is connected to the first cooling source 2. Note that either fluid or gas (gas) may be used as the fluid (refrigerant).
In such a configuration, the first cooling source 2 is cooled by supplying the fluid (cooling fluid) cooled by the first cooling device 20 to the first cooling source 2.
In addition, the cooling mechanism of the 1st cooling device 20 can be comprised with the cooling mechanism similar to what is utilized for a general air conditioning apparatus or a refrigerator.

Further, in the present embodiment, the second cooling source 3 is disposed in a recess (step) formed at a predetermined position on the wall surface 300. As shown in FIG. 2, the second cooling source 3 is formed integrally with a flat support plate 32 in which a fluid (refrigerant) flow path (not shown) is formed, and the support plate 32, And a plurality of fins 33 formed along the vertical direction.
The surfaces of the support plate 32 and the fins 33 are covered with the same far infrared radiation layer as described above. In this case, the surface opposite to the support plate 32 of the far-infrared radiation layer constitutes the second cooling surface 31.

The support plate 32 and the fins 33 can also be made of a metal material (high thermal conductivity material) such as stainless steel, iron, copper, or an alloy containing these.
As shown in FIGS. 1 and 2, a second cooling device 30 having the same configuration as that of the first cooling device 20 is connected to the second cooling source 3. The fluid (cooling fluid) cooled by the second cooling device 30 is supplied to the second cooling source 3 via the pipe 34, whereby the second cooling source 3 is cooled.

  Further, the second cooling source 3 includes a drainage groove 35 provided below the fins 33, and a water collection tank 36 detachably attached to the lower part of the drainage groove 35. As will be described in detail later, when the second cooling source 3 is cooled, the second cooling surface 31 is cooled, and moisture contained in the air of the indoor space 101 is condensed on the second cooling surface 31. The condensed water drops fall into the drainage groove 35 and are collected in the water collection tank 36. The water collection tank 36 may be omitted and the drainage groove 35 may be directly connected to the drainage pipe.

The first cooling surface 20 (ceiling surface 400) of the first cooling source 2 is operated by operating the first cooling device 20 and the second cooling device 30 to cool the fluid and circulating the cooled fluid. Then, the second cooling surface 31 of the second cooling source 3 is cooled. When the first cooling surface 21 and the second cooling surface 31 are cooled, the temperature becomes lower than that of the floor surface 200 and the wall surface 300, and the first cooling surface 21 and the second cooling surface 31 are respectively primary cooled. It becomes a radiation source.

  At this time, the balance of the thermal equilibrium state is greatly lost, and far infrared rays are radiated from the floor surface 200 and the wall surface 300 toward the first cooling surface 21 and the second cooling surface 31. In this embodiment, since these surfaces contain the same far-infrared emitting material, most of the far-infrared rays radiated from the floor surface 200 and the wall surface 300 are far from the first cooling surface 21 and the second cooling surface 31. Resonantly absorbed by infrared radiation material with high efficiency.

  The temperature of the floor surface 200 and the wall surface 300 decreases as hot air is absorbed in the form of far infrared rays by the first cooling surface 21 and the second cooling surface 31. As a result, the floor surface 200 and the wall surface 300 become a secondary cold radiation source. As described above, the temperature of the indoor space 101 decreases.

Here, “the same far-infrared emitting material” means a far-infrared emitting material having the same or similar emissivity change pattern with respect to the wavelength of far-infrared rays (electromagnetic waves).
FIG. 3 shows radiation characteristics when ZrO ₂ + CaO and Al ₂ O ₃ + TiO ₂ sprayed films (thickness 400 μm) are heated to the same temperature. In addition, the component ratio of ZrO ₂ and CaO and the component ratio of Al ₂ O ₃ and TiO ₂ are 1: 1 (weight ratio), respectively.

FIG. 3A and FIG. 3B show that the ZrO ₂ + CaO film and the Al ₂ O ₃ + TiO ₂ film have different emissivity change patterns with respect to far-infrared wavelengths. This indicates that when the composition of the far-infrared emitting material is different (that is, when the molecular species is different), the change pattern of the emissivity with respect to the wavelength of the far-infrared is different.

Here, a temperature difference is given between the two films, the ZrO ₂ + CaO film is set to a relatively high temperature, the Al ₂ O ₃ + TiO ₂ film is set to a relatively low temperature, and far infrared rays emitted from the ZrO ₂ + CaO film are converted to Al ₂ O. Consider the case of ₃ + TiO ₂ film absorption.
From Kirchhoff's law, the emissivity is the same as the absorptivity of the substance. Therefore, when an ideal condition is considered, the emissivity is emitted from the ZrO ₂ + CaO film at a wavelength where the emissivity matches, and Al ₂ O ₃ + TiO _2. Far-infrared rays going to the film are absorbed 100% by the Al ₂ O ₃ + TiO ₂ film. In other words, from the viewpoint of energy transport efficiency, radiant energy exchange without loss is performed.

On the other hand, at a wavelength at which the emissivity of the ZrO ₂ + CaO film is larger than the emissivity of the Al ₂ O ₃ + TiO ₂ film, it is emitted from the ZrO ₂ + CaO film due to this difference in emissivity (absorbance). Some of the far infrared rays are not absorbed by the Al ₂ O ₃ + TiO ₂ film.
Since this is emissivity = absorption rate, if (emissivity of substance A> emissivity of substance B = absorption rate of substance B) at that wavelength, part of the radiant energy radiated from substance A is This is because the substance B is not absorbed.

For example, when the emissivity of the substance A is 0.9 and the emissivity of the substance B is 0.1 at a certain wavelength, the far infrared ray of the wavelength emitted from the substance A is slightly absorbed by the substance B. Most are not reflected.
From the viewpoint of energy transport efficiency, this is an exchange of radiant energy with loss.

Also, considering the case of absorbing the far infrared rays emitted from the Al ₂ O ₃ + TiO ₂ film in the ZrO ₂ + CaO film by reversing the relationship of the temperature difference, the same reasoning, Far infrared rays emitted from the Al ₂ O ₃ + TiO ₂ film toward the ZrO ₂ + CaO film are absorbed 100% by ZrO ₂ + CaO (in the case of ideal conditions).
_However, the wavelength emissivity is less than the emissivity of the _{Al 2 O} 3 + TiO 2 of ZrO 2 + _CaO, part of the far infrared radiation of the wavelength emitted from the Al ₂ O 3 + TiO _{2 is} absorbed in the ZrO 2 + CaO Loss occurs.

As described above, between substances having different emissivity change patterns with respect to wavelengths (that is, between different molecular species), loss occurs in the exchange of thermal radiation even in an ideal situation.
On the other hand, there is no loss in the exchange of thermal radiation in an ideal situation between substances having the same or similar change pattern of emissivity with respect to wavelength (that is, between the same molecular species).
The present invention is an indoor environment adjustment system that utilizes the high heat exchange efficiency through thermal radiation between the same molecular species.

The far-infrared emitting material preferably has a far-infrared emissivity of 0.6 or more, more preferably 0.8 or more, and even more preferably 0.9 or more.
Here, the far infrared ray means an electromagnetic wave having a wavelength of about 3 to 1000 μm. The emissivity of a far-infrared emitting material is defined by W / W0, where W0 is the ideal black body far-infrared radiation energy under the same conditions, and W is the far-infrared radiation energy of the material. The far-infrared emissivity value of the far-infrared emitting material is preferably a value at room temperature (for example, 25 ° C.) close to the actual use temperature of the environment adjustment system 1.

Moreover, when using a particulate far-infrared radiation | emission substance, the average particle diameter of particle | grains is although it does not specifically limit, It is preferable that it is about 5-100 micrometers, and it is more preferable that it is about 10-75 micrometers.
When the far-infrared radiation layer of the first cooling source 2, the far-infrared radiation layer of the second cooling source 3, the floor surface 200 and the wall surface 300 are made of a material containing particulate far-infrared radiation material, The particle diameter and shape of the particulate far-infrared emitting material contained in the particle may be the same or different.

In this case, the far-infrared radiation layer of the first cooling source 2, the far-infrared radiation layer of the second cooling source 3, the amount of the far-infrared radiation material contained in the constituent materials of the floor surface 200 and the wall surface 300 are also Although not particularly limited, it is preferably 1% by weight or more, more preferably 10% by weight or more, and further preferably 20% by weight or more.
The amounts of far-infrared radiation contained in the constituent materials of the far-infrared radiation layer of the first cooling source 2, the far-infrared radiation layer of the second cooling source 3, the floor surface 200 and the wall surface 300 were also the same. Or different.

In the present embodiment, the first cooling surface 21 of the first cooling source 2 constitutes the ceiling surface 400. Since the cold air flows downward from above, the convection of the air in the indoor space 101 can be promoted and the indoor space 101 can be efficiently cooled (cooled) by using the ceiling surface 400 as a cooling surface.
In addition, in the present invention, the second cooling surface 31 is cooled to a temperature lower than that of the first cooling surface 21 (ceiling surface 400). Thereby, it is possible to preferentially condense on the second cooling surface 31. For this reason, it is possible to reduce the humidity of the indoor space 101 (that is, to dehumidify the indoor space 101) without dropping the liquid droplets from the ceiling surface.

If the indoor space 101 can be dehumidified, the cooling efficiency of the indoor space 101 can be further increased. Therefore, according to the indoor environment adjustment system 1, the indoor space 101 can be cooled and dehumidified with the simple configuration as described above.

  Here, the cooling temperature of the first cooling surface 21 (ceiling surface 400) by the first cooling source 2 is A [° C.], and the cooling temperature of the second cooling surface 31 by the second cooling source 3 is B [ C]], AB is preferably about 5 to 40, more preferably about 10 to 30. Thereby, a sufficient temperature difference can be provided between the first cooling surface 21 (ceiling surface 400) and the second cooling surface 31, and condensation can be preferentially caused by the second cooling surface 31. .

  Specifically, the cooling temperature A of the first cooling surface 21 (ceiling surface 400) is preferably about 15 to 24 ° C, and more preferably about 18 to 24 ° C. As a result, it is possible to more reliably prevent condensation on the first cooling surface 21 (ceiling surface 400) while cooling the indoor space 101 more efficiently.

  On the other hand, the cooling temperature B of the second cooling surface 31 is preferably about −20 to 15 ° C., and more preferably about −10 to 5 ° C. As a result, condensation can be reliably and selectively caused by the second cooling surface 31, and the cooling function of the indoor space 101 by the second cooling surface 31 can be suitably exhibited.

  The second cooling source 3 is preferably disposed at a position 2 m or more away from the floor surface 200 (indicated by “H” in FIG. 1), and is disposed at a position approximately 2 to 2.5 m apart. More preferably. As a result, the second cooling source 3 can be prevented from being noticed, and the cooling efficiency of the indoor space 101 by the second cooling source 3 is increased as in the description of the first cooling source 2. You can also.

  Further, although depending on the size of the room 100 (the indoor space 101), the second cooling source 3 is arranged at a position (denoted by “h” in FIG. 1) that is about 15 to 140 cm away from the ceiling surface 400. It is preferable that they are arranged at positions separated by about 20 to 110 cm. In the case of a room 100 with a relatively low ceiling height (a general facility room) 100, the second cooling source 3 is preferably arranged at a position spaced about 15 to 45 cm from the ceiling surface 400. It is more preferable that they are arranged at positions separated by about 30 cm. Thereby, the ceiling surface 400 is cooled more than necessary due to the influence of the second cooling source 2, and it is possible to prevent condensation on the ceiling surface 400. In addition, it is difficult for cold air to stay in the installation location (recessed portion) of the second cooling source 3, and it is possible to prevent the occurrence of mold, and it is easy to clean the installation location.

Depending on the size of the room 100, the amount of moisture contained in the air of the indoor space 101 varies. For this reason, since the size of the 2nd cooling source 3 is also set suitably according to the size of the room 100 (indoor space 101), it is not specifically limited. For example, the 2nd cooling source 3 can be comprised so that it may have the size covering the full length of the width direction of the wall surface 300. FIG. A plurality of second cooling sources 3 may be stacked in multiple stages.
Note that the second cooling surface 31 may be subjected to a roughening process for forming irregularities. Examples of such roughening treatment include dry etching such as sandblasting, wet etching such as solvent treatment, and the like.

  Note that at least one of the first cooling surface 21 (ceiling surface 400) of the first cooling source 2, the second cooling surface 31, the floor surface 200, and the wall surface 300 of the second cooling source 3 is indoors. It may be exposed to the space 101 and may be covered with a protective layer having a thickness of 1 mm or less.

Next, another configuration example of the first cooling source 2 will be described.
FIG. 4 is a top view (a) and a front view (b) showing another configuration example of the first cooling source.
The first cooling source 2 shown in FIG. 4 is fixed to the floor surface 200 and the wall surface 300. As shown in FIG. 4A, the first cooling source 2 includes two groups of fins 22 and 23 extending in the vertical direction and made of a high thermal conductivity material as described above. ing.

The fins 22 and 23 are arranged at a predetermined inclination angle (for example, about 15 to 75 °) with respect to the wall surface 300. The first cooling source 2 may include a group of fins (a group of fins all arranged in parallel) arranged at right angles to the wall surface 300.
Further, the fins 22 and 23 are angled by 90 ° from each other. Each of the fins 22 and 23 has a vertically elongated plate shape, and a flow path (not shown) extending along the vertical direction is provided therein. Further, a far-infrared radiation layer (not shown) similar to that described above is formed on the surface of each fin 22, 23.

  As shown in FIG. 4B, the water supply pipe 24 penetrates the upper portions of the fins 22 and 23, and the drainage pipe 25 penetrates the lower portion thereof. The water supply pipe 24 and the drain pipe 25 also function as support members that support the fins 22 and 23. The water supply pipe 24 is connected to the upper ends of the flow paths in the fins 22 and 23, and the drain pipe 25 is connected to the lower ends of the flow paths in the fins 22 and 23. Further, the water supply pipe 24 and the drain pipe 25 are connected to the first cooling device 20 arranged outside the indoor space 101.

  The cooling fluid supplied from the first cooling device 20 is supplied from the water supply pipe 24 to the flow paths in the fins 22 and 23, flows downward in the flow paths, and passes through the drain pipe 25 to the first. The cooling device 20 is recovered. The recovered fluid is cooled again in the first cooling device 20 and supplied to the water supply pipe 24. The fins 22 and 23 are cooled by the circulation of the cooling fluid.

  Further, both sides of the water supply pipe 24 and the drainage pipe 25 are supported by columns 26 and 27, respectively. The lower ends of the columns 26 and 27 are fixed to the floor surface 200, and the upper portions of the columns 26 and 27 are fixed to the wall surface 300, respectively. The 1st cooling source 2 of such a structure is good-looking, and can improve the decorating property of the room 100. In addition, since a plurality of fins 22 and 23 are arranged in parallel with each other, the total area of the fins can be increased compared to the occupied area and volume. This is advantageous because the far-infrared absorption rate of the first cooling surface 21 can be increased.

Also in the second embodiment having such a configuration, the same operation and effect as in the first embodiment can be obtained.
Further, the first cooling source 2 having the same configuration as that of the second embodiment may be fixed to the ceiling surface 400.

Although the environmental adjustment system of the present invention has been described above, the present invention is not limited to these. For example, the indoor environment adjustment system of the present invention may have any other configuration, and may be replaced with a configuration that exhibits the same function.
For example, in the first embodiment, the first cooling surface 21 may constitute only a part without constituting the entire ceiling surface 400.
Further, in each of the embodiments, the wall surface 300 and / or the floor surface 200 may be formed even if the indoor surface constituent member forms the entire wall surface 300 or the floor surface 200 without forming the entire wall surface 300 and the floor surface 200. You may comprise only a part of.

DESCRIPTION OF SYMBOLS 1 Environment control system 2 1st cooling source 20 2nd cooling device 21 1st cooling surface 22, 23 Fin 24 Water supply pipe 25 Drain pipe 26, 27 Support | pillar 3 2nd cooling source 30 2nd cooling device 31 1st 2 cooling surface 32 support plate 33 fin 34 piping 35 drainage groove 36 water collection tank 100 room 101 indoor space 200 floor surface 300 wall surface 400 ceiling surface

Claims (8)

An indoor surface constituent member made of a material containing a far-infrared emitting substance;
A first cooling source comprising a first cooling surface made of a material containing the far-infrared emitting material;
A second cooling source comprising a second cooling surface made of a material containing the far-infrared emitting material and cooled to a temperature lower than the first cooling surface;
When the first cooling source cools the first cooling surface and the second cooling source cools the second cooling surface, the first cooling surface and the second cooling surface become It becomes a primary cold radiation source, and the far infrared radiation material on the first cooling surface and the second cooling surface resonantly absorbs the far infrared radiation emitted by the far infrared radiation material of the indoor surface component. By using the indoor surface constituent member as a secondary cold radiation source,
An indoor environment adjustment system configured to preferentially condense on the second cooling surface by cooling the second cooling surface to a temperature lower than that of the first cooling surface.   When the cooling temperature of the first cooling surface by the first cooling source is A [° C.] and the cooling temperature of the second cooling surface by the second cooling source is B [° C.], A− The indoor environment adjustment system according to claim 1, wherein B is 5 to 40.   The indoor environment adjustment system according to claim 2, wherein the cooling temperature A is 15 to 24 ° C.   The indoor environment adjustment system according to claim 2 or 3, wherein the cooling temperature B is -20 to 15 ° C.   The indoor environment adjustment system according to any one of claims 1 to 4, wherein the first cooling surface by the first cooling source constitutes at least a part of a ceiling surface that defines an indoor space for environmental adjustment.   The indoor environment adjustment system according to any one of claims 1 to 5, wherein the second cooling source is disposed on a wall surface that is separated by 2 m or more from a floor surface that defines an indoor space for environmental adjustment.   The indoor environment adjustment system according to any one of claims 1 to 6, wherein the second cooling source is disposed on a wall surface that is spaced 15 to 140 cm away from a ceiling surface that defines an indoor space for environmental adjustment.   The indoor environment adjusting system according to any one of claims 1 to 7, wherein the indoor surface constituting member constitutes at least a part of a wall surface and / or a floor surface that defines an indoor space for environmental adjustment.

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