JP2019010688A - Plate-like carrier, polishing apparatus and method of manufacturing polished object - Google Patents

Abstract

To reduce the occurrence of a flaw in polishing of an outer circumferential surface of an object to be polished having the outer circumferential surface positioned at an equal distance from and along the central axis of the object to be polished.SOLUTION: A plate-like carrier 7 comprises a storage part 9 rotatably storing an object to be polished 1 centered on the central axis of the object to be polished, the object to be polished 1 having an outer circumferential surface positioned at an equal distance from and along the central axis, the storage part 9 comprises: a support wall surface 13 opposed to the outer circumferential surface and supporting the outer circumferential surface by at least two support parts 15 in view form an upper surface; and a recessed part 17 arranged between the support parts 15 and not contacting with the outer circumferential surface. A polishing apparatus comprises a surface plate for polishing the object to be polished 1 and the plate-like carrier 7 arranged on the surface plate, and the surface plate and the carrier 7 relatively move, and thereby polish the outer circumferential surface of the object to be polished 1. A method of manufacturing the using the polishing apparatus is used for manufacturing the object to be polished using the polishing apparatus, the object to be polished having the outer circumferential surface positioned at an equal distance from and along the central axis of the object to be polished.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a plate-like carrier for polishing an object to be polished having an outer peripheral surface equidistant along a central axis, a polishing apparatus, and a method for manufacturing a polishing body having an outer peripheral surface equidistant along a central axis.

  As a method for polishing the outer peripheral surface of an object to be polished having an outer peripheral surface equidistant along the central axis, such as a plunger, a holding hole having a rectangular opening is radially formed between a pair of surface plates constituting the polishing surface. The carrier to be rotated and revolved is disposed, and the curved surface of the object to be polished is disposed in the holding hole so that the curved surface of the object is in contact with the upper and lower surface plates, and the object to be polished is rotated in the circumferential direction of the curved surface. There has been disclosed a polishing method for polishing a curved surface of an object to be polished by freely moving the object to be polished while keeping the center axis of the body along the main surface of the surface plate (Patent Document 1).

  FIG. 9 shows a schematic diagram of a conventional carrier 30. The holding hole (storage part) 31 of the carrier 30 has a rectangular shape when viewed from above. The wall surface 31 a of the holding hole 31 facing the outer peripheral surface of the object to be polished 32 is parallel to the central axis direction of the object to be polished 32, and the object to be polished 32 and the wall surface 31 a extend over the entire length of the object to be polished 32. And are in contact.

JP 2011-161559 A

  For example, when a plate-like substrate is polished with the conventional carrier 30, the surface roughness of the main surface of the substrate may be set within a predetermined range, and the surface roughness of the side surface is not a problem.

  However, when the object to be polished 32 having an outer peripheral surface of equal distance along the central axis is polished by the above-described polishing method, the object to be polished 32 rotating in the circumferential direction of the object to be polished 32 and the carrier 30 are When a foreign substance enters, there is a problem that the foreign substance comes into contact with the rotating object 32 to be rotated and scratches are generated on the outer peripheral surface of the object 32 in the circumferential direction.

  The plate-shaped carrier, the polishing apparatus, and the manufacturing method of the polishing body of the present disclosure are, for example, for producing a cylindrical or columnar polishing body, and suppress the generation of scratches on the outer peripheral surface of the polishing body. For the purpose.

  The plate-shaped carrier of the present disclosure includes a storage unit that stores a polishing target having an outer peripheral surface that is equidistant along a central axis so as to be rotatable about the central axis of the polishing target. And a support wall surface that faces the outer peripheral surface and supports the outer peripheral surface with at least two support portions when viewed from above, and a concave portion that does not contact the outer peripheral surface disposed between the support portions.

  The polishing apparatus according to the present disclosure includes the plate-like carrier and a surface plate for polishing an object to be polished having an equidistant outer peripheral surface along a central axis, and is disposed on the surface plate and the surface plate. The outer peripheral surface of the object to be polished is polished by the relative movement of the plate carrier.

A method for manufacturing a polishing body according to the present disclosure includes a surface plate for polishing an object to be polished having an outer peripheral surface that is equidistant along a central axis, and the polishing body is disposed on the surface plate, and the object to be polished is disposed on the surface of the object to be polished. A plate-like carrier having a storage portion that is rotatably stored around the central axis, the storage portion facing the outer peripheral surface, and supporting the outer peripheral surface with at least two support portions in a top view. A step of storing the object to be polished in the storage portion of a polishing apparatus, the support wall having a supporting wall surface and a recess not contacting the outer peripheral surface disposed between the support portions, and the surface plate and the carrier. And relatively moving and polishing the outer peripheral surface of the object to be polished with the surface plate.

  According to the plate-like carrier and the polishing apparatus of the present disclosure, it is possible to suppress the generation of scratches in the polishing of the outer peripheral surface of the object to be polished having the outer peripheral surface that is equidistant along the central axis. Moreover, according to the manufacturing method of the grinding | polishing body of this indication, the grinding | polishing body which an outer peripheral surface does not have a damage | wound can be manufactured.

It is the schematic of the to-be-polished body which concerns on this embodiment. It is the schematic of the plate-shaped carrier and polishing apparatus which concern on this embodiment. It is a principal part enlarged view of the plate-shaped carrier which concerns on other embodiment. It is a principal part enlarged view of the plate-shaped carrier which concerns on other embodiment. It is the schematic of the plate-shaped carrier which concerns on other embodiment. It is the schematic of the plate-shaped carrier which concerns on other embodiment. It is the schematic of the plate-shaped carrier which concerns on other embodiment. It is the schematic of the grinding | polishing apparatus which concerns on other embodiment. It is the schematic of the conventional carrier.

  The plate-shaped carrier, the polishing apparatus, and the manufacturing method of the polishing body of the present disclosure will be described with reference to the drawings. The plate carrier is also called a carrier.

  FIG. 1 is a schematic view of an object 1 to be polished. An object 1 to be polished in the present disclosure has an outer peripheral surface 3 that is equidistant along a central axis 2 indicated by A-A ′ in the drawing. The object to be polished 1 may have a columnar shape, a cylindrical shape, a through hole or a non-through hole inside, or a groove on the outer peripheral surface 3. The object to be polished 1 is polished to become a polished body.

  FIG. 2 is a schematic diagram of a polishing apparatus according to the present disclosure. 2A is a side view thereof, and FIG. 2B is a top view thereof. As shown in FIG. 2 (a), a carrier 7 is arranged on the surface plate 5. As shown in FIG. 2 (b), the carrier 7 includes a through-hole penetrating the carrier 7 up and down. A storage unit 9 is provided. The storage unit 9 stores the object to be polished 1 so as to be rotatable about the central axis 2.

  The housing 9 is larger than the body 1 for housing the body 1 and the center of the body 1 is rotated so that the body 1 rotates around the central axis 2 in the housing 9. The shaft 2 can be maintained within a predetermined range.

  In the example of FIG. 2, both the surface plate 5 and the carrier 7 are disk-shaped. Then, for example, when the carrier 7 is rotated, the surface plate 5 and the carrier 7 move relative to each other, so that the object to be polished 1 stored in the storage portion 9 can be polished by the surface plate 5. At least one of the carrier 7 and the surface plate 5 only needs to rotate.

  FIG. 3 is an enlarged view of a main part showing the object 1 to be polished housed in the housing part 9 of the carrier 7. The arrows in the figure are the traveling directions of the carrier 7 and the object 1 to be polished. Considering relative movement, the surface plate 5 advances in the direction opposite to the arrow.

  When the surface plate 5 and the carrier 7 move relative to each other, the object to be polished 1 rotates around the central axis 2, and the surface plate 5 polishes the outer peripheral surface 3 of the object to be polished 1.

  In FIG. 3, when the carrier 7 advances in the direction of the arrow (left), the object 1 is pressed against the right side of the storage portion 9. A support wall surface 13 that faces the outer peripheral surface 3 of the target object 1 and supports the outer peripheral surface 3 of the target object 1 with two support portions 15 is disposed on the right side of the target object 1 in FIG.

  The support wall surface 13 has a concave portion 17 that does not contact the outer peripheral surface 3 between the two support portions 15 in a top view.

  During polishing, the outer peripheral surface 3 of the object to be polished 1 rotates while being in contact with the support portion 15 of the support wall surface 13 of the storage portion 9.

  The conventional carrier 30 shown in FIG. 9 does not have the concave portion 17, and the outer peripheral surface of the object to be polished 32 comes into contact with the wall surface 31 a of the storage unit 31 in a wide range, and the object to be polished 32 and the wall surface 31 a of the storage unit 31 When the foreign matter entered between the two, the foreign matter continued to come into contact with the rotating object 32 to be rotated, and a circumferential scratch was generated on the outer peripheral surface.

  Examples of the foreign matter that generates such scratches include foreign matter that has adhered to the object to be polished 1 in the previous step, foreign matter derived from the apparatus, polishing scraps generated during polishing, and impurities contained in the abrasive grains. Many of these foreign substances have a diameter of 0.1 mm or less.

  According to the polishing apparatus of the present disclosure having the recess 17 in the storage portion 9, the foreign material that has entered between the object to be polished 1 and the support wall surface 13 of the storage portion 9 is relatively moved between the surface plate 5 and the carrier 7. Along with the movement, it moves to the concave portion 17 of the storage portion 9, so that the contact with the outer peripheral surface 3 of the object to be polished 1 hardly occurs, and the generation of scratches can be reduced.

  The support portion 15 may be in point contact with the object 1 to be polished. With such a structure, the contact area between the outer peripheral surface 3 of the object to be polished 1 and the support portion 15 can be reduced, and the outer periphery of the object to be polished 1 can be prevented from being scratched due to foreign matters. it can.

  As shown in FIG. 3, the support 15 may be formed in a convex shape on the support wall surface 13, and as shown in FIG. 4, the support 15 is provided at both ends in the central axis 2 direction of the object 1 to be polished. May be. Such a configuration is preferable because the contact area between the outer peripheral surface 3 and the carrier 7 is minimized.

  Further, the storage portion 9 may have a concave portion 17 at a position facing the central portion in the direction of the central axis 2 of the workpiece 1. With such a configuration, foreign matter is easily discharged.

  Further, the storage portion 9 may have a plurality of recesses 17. For example, when the storage portion 9 has three support portions 15 and has two concave portions 17 between the support portions 15, the support portions 15 per one are compared with the case where the support portion 15 has two support portions. Since the force is reduced, the support portion 15 is less likely to be worn, and generation of foreign matters due to the carrier 7 can be suppressed.

  Moreover, you may have the recessed part 17 in each of the two support wall surfaces 13 which oppose on both sides of the center axis | shaft 2 of the to-be-polished body 1. As shown in FIG. With such a configuration, it is possible to reduce the occurrence of scratches even when the object to be polished 1 comes into contact with any support wall surface 13 of the storage unit 9.

Moreover, you may have the recessed part 17 in the position which opposes on both sides of the center axis | shaft 2. As shown in FIG. With such a configuration, the same effect may be obtained even when the object to be polished 1 comes into contact with any support wall surface 13. Therefore, even when the rotation direction of the carrier 7 changes during the polishing or the relative movement direction of the carrier 7 and the surface plate 5 changes, it is possible to suppress the generation of scratches on the outer periphery 3 of the object 1 to be polished.

  The shortest distance L among the distances between the straight line connecting the two support portions 15 and the deepest portion 17a of the recess 17 may be 0.15 mm or more. Empirically, the size of foreign matter is often less than 0.1 mm, and with such a configuration, scratches are unlikely to occur on the outer peripheral surface 3.

  The arrangement of the storage portion 9 in the carrier 7 may take various forms as shown in FIGS.

  For example, in the example of FIG. 5, the plurality of storage portions 9 are radially with respect to the center of the carrier 7 (which is also the center of rotation of the carrier 7), that is, between the central axis 2 of the object 1 and the radial direction of the carrier 7. The angle formed is approximately 0 °. Further, in the example of FIG. 6, the plurality of storage portions 9 are arranged so that the angle formed by the central axis 2 of the object to be polished 1 and the radial direction of the carrier 7 is about 15 °.

  The angle formed by the radial direction of the carrier 7 and the angle formed by the central axis 2 may be arranged to be within 30 °. When the angle formed by the radial direction of the carrier 7 and the central axis 2 is increased, it is easy to increase processing accuracy such as surface roughness and cylindricity.

  Moreover, the some accommodating part 9 may be arrange | positioned at equal intervals on the concentric circle. With such a configuration, a load is uniformly applied to the plurality of objects to be polished 1 to be polished, so that the polishing amount can be made uniform easily.

  The shape of the storage portion 9 may be polygonal as shown in FIGS. 5 and 6, may be elliptical as shown in FIG. 7, and the support wall surface 13 may be curved. However, the shape of the storage portion 9 that is difficult to maintain the central axis 2 of the object 1 to be polished in the storage portion 9 such as a circle is not suitable.

  For example, when the object 1 to be polished having a diameter of 2 mm and a length of 17 mm is polished using the carrier 7 shown in FIG. 6, the thickness of the carrier 7 is 1.5 mm, and the central axis 2 of the object to be polished 1 in the storage portion 9 is used. The length in the direction (hereinafter referred to as length) is preferably 19 mm, and the distance between the opposing support wall surfaces 13 (hereinafter referred to as width) is 3.5 mm at the center and 2.5 mm at both ends.

  The shape of the storage unit 9 as viewed from above is, for example, a hexagonal shape as shown in FIGS. 4 to 6, and has a recess 17 at the center in the length direction of the support wall surface 13.

  In this case, the depth of the concave portion 17 with respect to the outer peripheral surface 3, that is, the shortest distance between the straight line connecting the two support portions 15 and the deepest portion of the concave portion 17 is about 0.45 mm. As shown in this example, the shortest distance may be 0.15 mm or more. With such a configuration, even the foreign matter having a diameter of 0.1 mm can be prevented from coming into contact with the object to be polished 1 and the foreign matter, and can be easily discharged.

  In addition, as shown in FIG. 8, the polishing apparatus according to another embodiment of the present disclosure includes an upper surface plate (not shown) and a lower surface plate 5 b that are opposed to each other with the carrier 7 interposed therebetween. A sun gear 19 and an internal gear 21 for self-revolving are provided. During polishing, slurry containing abrasive grains may be supplied between the upper surface plate and the lower surface plate 5b while rotating the upper surface plate and the lower surface plate 5b in opposite directions.

  The carrier 7 is disk-shaped and has gears on the outer periphery. The gears are called a sun gear 19 and an internal gear 21. The carrier 7 revolves between the upper surface plate and the lower surface plate 5b as the sun gear 19 and the internal gear 21 rotate. In addition, the carrier 7 of FIGS. 5-7 is also illustrated in the form which has a gearwheel on the outer periphery.

  The rotation about the central axis 2 of the workpiece 1 is caused by the relative movement of the carrier 7 and the surface plate 5. The rotation around the central axis 2 of the object 1 is caused, for example, by the revolution and rotation of the carrier 7 with respect to the surface plate 5 or the rotation of the surface plate 5.

  The smaller the angle formed by the radial direction of the carrier 7 and the central axis 2 of the object 1 to be polished, and the closer the rotation direction of the object 1 to be rotated and the direction of rotation of the carrier, the more the number of rotations of the object 1 to be polished by the rotation of the carrier 7. Become. As described above, when the angle formed by the radial direction of the carrier 7 and the central axis 2 is increased, the processing accuracy such as surface roughness and cylindricity can be easily increased.

  When the carrier 7 rotates and revolves with respect to the surface plate 5, the angle formed between the surface plate 5 and the central axis 2 of the object to be polished 1 changes during polishing. As a result, it is easy to increase the processing accuracy while increasing the polishing rate.

  The material of the surface plate 5 may be a metal such as copper, tin, or cast iron. The surface of the surface plate 5 may have grooves for supplying and discharging polishing slurry. When the surface plate 5 has a groove connected to the storage portion 9 on its main surface, foreign substances can be discharged through the groove, and abrasive grains can be supplied and discharged. In particular, if a groove is formed in the lower surface plate 5b, foreign matter can be efficiently discharged. Further, if the grooves of the surface plate 5 are arranged so as to be connected to the recesses 17 or the grooves of the carrier 7, foreign matters can be efficiently discharged.

  The material of the carrier 7 is, for example, a resin such as a vinyl chloride resin, a glass such as an epoxy glass, or a metal such as SUS. The thickness of the carrier 7 is smaller than the diameter of the object 1 to be polished. The carrier 7 may have a groove connected to the storage portion 9 on the main surface. With such a structure, foreign substances can be discharged through the grooves, and abrasive grains can be supplied and discharged. In particular, if a groove is formed on the lower surface side of the carrier 7, that is, the main surface facing the surface plate 5, foreign matter can be efficiently discharged. Further, when the groove is connected to the recess 17, foreign matter can be efficiently discharged.

  A method for manufacturing a polishing body using the polishing apparatus of the present disclosure described above will be described.

  First, an object to be polished 1 having an outer peripheral surface 3 that is equidistant along the central axis 2 is prepared. The object to be polished 1 is a columnar or cylindrical one, and may be roughly polished in advance.

  Next, the object to be polished 1 is accommodated in the accommodating portion 9 of the carrier 7 disposed on the surface plate 5. The carrier 7 has a storage portion 9 for storing the object to be polished 1 so as to be rotatable about the central axis 2 of the object to be polished 1. The storage portion 9 faces the outer peripheral surface 3 of the object to be polished 1, and the outer peripheral surface disposed between the support wall 15 and the support wall surface 13 that supports the outer peripheral surface 3 with at least two support portions 15 in a top view. A recess 17 that does not contact the surface 3 is provided.

  Then, while moving the surface plate 5 and the carrier 7 relatively and rotating the object 1 to be polished, the outer peripheral surface 3 of the object 1 to be polished is polished by the surface plate 5 to manufacture a polishing body.

  According to the method for producing a polishing body having such steps, it is possible to suppress the generation of scratches on the outer peripheral surface of the polishing body.

  In addition, in the manufacturing method of the grinding | polishing body of this indication, it is good to use the grinding | polishing apparatus of this indication, and the above-mentioned various carrier and surface plate can be used.

  As explained above, the polishing apparatus and the polishing body manufacturing method of the present disclosure can suppress the generation of scratches. Examples of the object to be polished 1 include a ceramic sintered body. Moreover, it is good to use for the transparent single crystal which becomes conspicuous when there is a crack. In particular, it may be used for the production of sapphire that is transparent and has excellent mechanical and optical properties.

  The present invention is not limited to the above-described embodiments, and various modifications, improvements, combinations, and the like can be made without departing from the scope of the present invention. For example, the polishing apparatus may be a single-side polishing apparatus provided with a pressure plate that holds and rotates the carrier 7 and pressurizes it. The polishing apparatus may be a polishing apparatus that performs mechanical polishing and chemical polishing simultaneously. A polishing pad may be disposed on the surface plate 5.

  First, 200 sapphire objects to be polished, which are single crystal bodies having an equidistant outer peripheral surface along the central axis, were prepared. The object to be polished has a cylindrical shape with a diameter of 2 mm and a length of 17 mm.

  As an example, a carrier having the form shown in FIG. 5 and a carrier having the form shown in FIG. 9 were prepared as comparative examples. Each carrier is provided with a storage portion for storing the object to be polished so as to be rotatable about the central axis of the object to be polished.

  And the to-be-polished body was accommodated in the accommodating part of the carrier of an Example, and the to-be-polished object was accommodated in the accommodating part of the carrier of the comparative example. Then, the surface plate and the carrier were relatively moved, and the outer peripheral surface of the object to be polished was polished with the surface plate.

  The surface plate is made of copper, and the carrier is made of vinyl chloride having a thickness of 1.5 mm. In addition, a slurry containing diamond abrasive grains having a particle diameter of 1 μm was used for polishing.

  In the embodiment, the storage portion has a length of 19 mm, a width of 3.5 mm at the center, and 2.5 mm at both ends, and has a hexagonal shape with recesses. On the other hand, the length of the storage portion in the comparative example is 19 mm, the width is 2.5 mm, and has no recess.

  The incidence of defect defects on the outer peripheral surface in each test was 0% for the examples and 5% for the comparative examples.

1: Polishing object 2 (AA ′): Center axis 3: Outer peripheral surface 5: Surface plate 5b: Lower surface plate 7: Carrier 9: Storage portion 13: Supporting wall surface 15: Supporting portion 17: Recessed portion 19: Sun gear 21: Internal gear

Claims (14)

A storage unit configured to store an object to be polished having an outer peripheral surface equidistant along the central axis so as to be rotatable around the central axis of the object to be polished;
The storage portion has a support wall surface that faces the outer peripheral surface and supports the outer peripheral surface with at least two support portions in a top view, and a recess that does not contact the outer peripheral surface disposed between the support portions. , Plate carrier.   The plate-like carrier according to claim 1, wherein the support portion is in point contact with the object to be polished.   The said support wall surface is a plate-shaped carrier of Claim 1 or Claim 2 which supports the said outer peripheral surface in the edge part in the axial direction of a to-be-polished body.   The plate-like carrier according to any one of claims 1 to 3, wherein the storage portion has a concave portion at a position facing the central portion of the central axis.   The plate-like carrier according to any one of claims 1 to 4, wherein the storage portion has a plurality of the concave portions.   The plate-like carrier according to claim 5, wherein the storage portion has a concave portion facing the central axis.   The plate-shaped carrier according to any one of claims 1 to 6, wherein the shortest distance among the distance between the straight line connecting the two support portions and the deepest portion of the concave portion is 0.15 mm or more.   The plate-shaped carrier in any one of Claims 1 thru | or 7 which has a groove part connected with the said accommodating part.   The plate-like carrier according to claim 8, wherein the groove portion communicates with the concave portion. A plate carrier according to any one of claims 1 to 9,
A surface plate for polishing a body to be polished having an outer peripheral surface of equal distance along the central axis,
A polishing apparatus for polishing the outer peripheral surface of the object to be polished by relatively moving the surface plate and the plate-like carrier disposed on the surface plate.   The said plate-shaped carrier is a polishing apparatus of Claim 10 which has the said groove part in the main surface facing the said surface plate. A surface plate for polishing an object to be polished having an equidistant outer peripheral surface along a central axis;
A plate-like carrier that is disposed on the surface plate and has a storage portion that stores the object to be polished rotatably about the central axis of the object to be polished;
The storage portion has a support wall surface that faces the outer peripheral surface and supports the outer peripheral surface with at least two support portions in a top view, and a recess that does not contact the outer peripheral surface disposed between the support portions. Storing the object to be polished in the storage portion of the polishing apparatus;
A method of manufacturing a polishing body comprising: relatively moving the surface plate and the carrier, and polishing the outer peripheral surface of the object to be polished with the surface plate.   The manufacturing method of the grinding | polishing body of Claim 12 whose said grinding | polishing body is a single crystal body.   The method for producing a polishing body according to claim 13, wherein the polishing body is sapphire.

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