JP2019007783A - Electronic component alignment device - Google Patents

Abstract

To provide an electronic component alignment device in which the electronic component is securely stored in storage part of the hole even if the electronic component is in contact with a funnel part and separated from an adsorption collet.SOLUTION: An electronic component alignment device includes: a carrier 14 having a pocket 24; a first adsorption collet 17 for adsorbing an electronic component 13 at the lower end; a second adsorption collect 18 for adsorbing the electronic component 13 at the upper end; and a control part. The pocket 24 is made from a hole 25 and a through-hole 26. The hole 25 has a funnel part 27 and a storage part 28. The control part causes the first adsorption collect 17 to descend to the lowest position in a state that the electronic component 13 is adsorbed, and causes the second adsorption collect 18 to adsorbed to the electronic component 13 adsorbed to the first adsorption collect 17. Further, the control device releases the first adsorption collect 17, and causes the second adsorption collet 18 adsorbing the electronic component 13 to descend till the electronic component 13 is supported by the bottom wall of the hole 25.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component aligning device including a carrier having a hole for accommodating an electronic component, and a suction collet for loading the electronic component into the hole.

  Conventionally, in an energization inspection of an electronic component such as a semiconductor device or a chip component, a probe of an inspection apparatus is pressed against a connection terminal of the electronic component. In conducting this energization test, the electronic components are accommodated in the alignment holes and aligned in order to align the positions of the connection terminals of the electronic components and the probe. This “alignment” is to adjust the position of the electronic component in the vertical and horizontal directions and the angle around the axis in the direction of inserting the electronic component into the hole to a position and an angle suitable for the probe.

  The conventional carrier alignment holes are formed in the carrier 1 as shown in FIG. The carrier 1 is a plate-like member in which a plurality of holes 2 are formed, and a loader unit (not shown), which will be described later, is inserted into the holes 2 and an inspection device (not shown) is inserted. Be transported.

The hole 2 of the carrier 1 shown in FIG. 10 has a funnel portion 4 that opens on the upper surface 1 a of the carrier 1, and a housing portion 5 that houses the electronic component 3 under the funnel portion 4.
The funnel portion 4 is formed in a funnel shape in which the opening width gradually narrows from the portion opening on the top surface 1 a of the carrier 1 toward the bottom surface 2 a of the hole 2.
The accommodating portion 4 has a side wall 6 into which the electronic component 3 is fitted and a bottom wall 7 that supports the electronic component 3. A through hole 8 is opened in the bottom wall 7.

The through hole 8 is open to the bottom surface 2 a of the hole 2 and the lower surface 1 b of the carrier 1.
The electronic component 3 is adsorbed and held by an adsorbing collet 9 of a loader unit described later.
As described in Patent Document 1, for example, the loader unit includes a tray on which a large number of electronic components before inspection are placed, and a transfer device that transfers the electronic components from the tray to a carrier.
The tray is formed with a plurality of recesses for accommodating electronic components. The recess is formed in a shape that allows minute movement of the electronic component so that the electronic component can be easily put in and out.

The transfer device has a suction collet 9 that is sucked onto the upper surface of the electronic component. The suction collet 9 moves in the vertical direction and the horizontal direction while being sucked by the electronic component 3 and holding the electronic component 3.
When the electronic component 3 is moved from the tray to the carrier in the loader unit, first, the suction collet 9 is attracted to the upper surface of the electronic component 3 on the tray and is raised while holding the electronic component 3. Then, the suction collet 9 moves down from the upper side of the tray to the upper side of the carrier 1 and then descends.

When the suction collet 9 is lowered, the electronic component 3 is inserted into the funnel portion 4 of the hole 2 from above as shown in FIG. At this time, if the electronic component 3 is deviated from the correct position, the lower end portion of the electronic component 3 is pressed against the wall surface of the funnel portion 4, and the electronic component 3 is moved against the suction collet 9 so that the displacement is eliminated. Move. For this reason, the electronic component 3 is lowered while being aligned, and is accommodated in the accommodating portion 5 of the hole 2 in a state where the alignment is completed.
The suction collet 9 rises after the electronic component 3 is accommodated in the accommodating portion 5 of the hole 2 and returns to the initial position.

After the electronic component 3 is accommodated in the hole 2 in this way, the carrier 1 is transported to the inspection device by a transport device (not shown).
When the carrier 1 is transported to the inspection apparatus, a probe (not shown) is inserted into the through hole 8 opened on the lower surface 1b of the carrier 1 from below. The energization inspection is performed in a state where the probe is in contact with the connection terminal of the electronic component 3. Although not shown, a fixing jig is inserted into the hole 2 from above during an energization inspection, and the electronic component 3 is pressed against the bottom wall 7 of the hole 2 by the fixing jig.

Japanese Patent Application Laid-Open No. 6-177583

However, in the conventional electronic component aligning apparatus constituted by the carrier 1 having the hole 2 and the suction collet 9 for inserting the electronic component 3 into the hole 2 from above, the electronic component 3 is inserted into the hole 2 of the carrier 1. During the insertion process, the electronic component 3 may come off the suction collet 9 and fall in a state of being inclined into the hole 2 as indicated by a two-dot chain line in FIG.
The reason why the electronic component 3 is detached from the suction collet 9 is that the electronic component 3 is inclined when the lower end portion of the electronic component 3 comes into contact with the wall surface of the funnel portion 4 as shown by a solid line in FIG. This is considered to be because a gap is generated between 3 and the suction collet 9 and the electronic component 3 cannot be sucked.

  An object of the present invention is to provide an electronic component aligning device in which an electronic component is reliably accommodated in a hole accommodating portion even if the electronic component comes into contact with the funnel portion and is separated from the suction collet.

  In order to achieve this object, an electronic component aligning device according to the present invention has a hole that opens on one surface, accommodates an electronic component, and a through hole that opens on the other surface and the bottom surface of the hole. A plate-shaped carrier, a first suction surface that is attracted to the electronic component is formed at the lower end, a first suction collet that moves up and down with the vicinity of the opening of the hole as the lowest position of the moving range, and a first suction surface that attracts the electronic component A second suction collet that is formed at the upper end, moves up and down through the hole and the through-hole, with the vicinity of the opening of the hole being the uppermost position of the movement range, the first suction collet and the first suction collet And a controller for controlling the lifting and lowering operation of the suction collet 2 and switching between suction and release, and the opening width of the hole gradually increases from the portion opening on the one surface of the carrier toward the bottom surface. It gets narrower A funnel part formed in a bowl shape, and a housing part that is continuous from the funnel part and is defined by a side wall to which the electronic part is fitted and a bottom wall that supports the lower end of the electronic part, and the control part includes: The first adsorption collet is lowered to the lowest position while the electronic component is adsorbed on the first adsorption surface, and the second adsorption collet is adsorbed by the first adsorption collet. While adsorbing to the electronic component, the first adsorbing collet is released, and the second adsorbing collet is lowered with the electronic component adsorbed until the electronic component is supported by the bottom wall of the hole.

  According to the present invention, in the electronic component alignment apparatus, the hole and the through hole are provided at a plurality of positions of the carrier, respectively, and the first suction collet and the second suction collet are at the plurality of positions. And may be provided correspondingly.

  According to the present invention, in the electronic component aligning apparatus, a first movement for moving the plurality of upper suction collets in a first direction out of a first direction and a second direction orthogonal to each other in the horizontal direction. An apparatus, and a second moving device that moves the plurality of second suction collets in the first direction, wherein the hole and the through-hole include the first direction of the carrier and the second direction. The plurality of first adsorption collets and the plurality of second adsorption collets are respectively arranged at a predetermined interval in the second direction. Are mounted side by side, driven by the first moving device and the second moving device, respectively, moved intermittently in the first direction, and loaded with electronic components in the plurality of holes each time it stops. Also good.

  In the electronic component aligning apparatus according to the present invention, the electronic component aligning operation is started from the state where the electronic component is attracted and held by the first suction collet. The first suction collet descends in a state where the electronic component is sucked, and positions the electronic component near the opening of the hole of the carrier. The second suction collet rises through the through-hole and the hole of the carrier, and is held by the first suction collet and sucked by the electronic component located near the opening of the hole. The second suction collet descends after the first suction collet releases the electronic component.

  When the second suction collet is lowered, the electronic component is lowered in the hole. When the electronic component is not located at a position where the electronic component can be fitted into the hole accommodating portion, the lower end portion of the electronic component contacts the wall surface of the funnel portion of the hole. The wall surface of the funnel portion is inclined so that the opening width of the funnel portion becomes gradually narrower as it goes downward. For this reason, when an electronic component contacts a funnel part, an electronic component moves and the adsorption position of an electronic component is corrected.

When the electronic component comes into contact with the funnel portion, the electronic component may be inclined and a part of the lower surface of the electronic component may be separated from the second suction collet. In such a case, the suction force of the second suction collet and the gravity act on the electronic component, so that the electronic component slides down along the wall surface of the funnel and is again attracted to the second suction collet. become.
The second suction collet that has sucked the electronic component in this manner is lowered until the electronic component is fitted in the hole accommodating portion and supported by the bottom wall of the hole. The electronic components are aligned by fitting the electronic components into the housing portion.

  Therefore, according to the present invention, even if the electronic component comes into contact with the funnel portion and is separated from the suction collet, the electronic component is again attracted to the second suction collet, and the electronic component is reliably accommodated in the hole accommodating portion. An apparatus for aligning parts can be provided.

It is a side view which shows the structure of the alignment device for electronic components which concerns on this invention. It is a perspective view which fractures | ruptures and shows a conveyance table. It is a perspective view which shows the structure of the drive system of a 2nd adsorption collet. It is sectional drawing which expands and shows a part of carrier. It is a block diagram which shows the structure of a control system. It is sectional drawing for demonstrating operation | movement of the 1st and 2nd adsorption collet. FIG. 6A shows a state before delivery of the electronic component, and FIG. 6B shows a state at the time of delivery of the electronic component. FIG. 6C shows a state after delivery, and FIG. 6D shows a state where the electronic component is lowered in the funnel portion. FIG. 6E shows a state in which the electronic component has been detached from the second suction collet. FIG. 6 (F) shows a state where the electronic component is placed on the bottom wall of the hole, and FIG. 6 (G) shows a state where the second suction collet is lowered away from the electronic component. It is a flowchart for demonstrating operation | movement of the alignment device for electronic components. It is a flowchart for demonstrating operation | movement of the alignment device for electronic components. It is a timing chart for demonstrating operation | movement of the alignment device for electronic components. It is sectional drawing for demonstrating the structure of the conventional alignment device for electronic components. It is sectional drawing which shows the state from which the electronic component removed from the adsorption collet in the conventional alignment device for electronic components.

Hereinafter, an embodiment of an electronic device alignment apparatus according to the present invention will be described in detail with reference to FIGS.
An electronic component aligning apparatus 11 shown in FIG. 1 takes out an electronic component 13 from a component supply tray 12 shown in the center of FIG. 1, and loads the electronic component 13 on a carrier 14 for conveying the component. It is a device that aligns by. In FIG. 1, the components are schematically depicted in order to facilitate understanding of the configuration of the electronic component aligning device 11.

  The electronic component aligning device 11 includes a component supply unit 15 that sends the electronic component 13 from the tray 12 to the carrier 14, and a loading unit 16 that receives the electronic component 13 from the component supply unit 15 and loads the electronic component 13 on the carrier 14. Yes. As will be described in detail later, the component supply unit 15 includes a first suction collet 17 that is attracted to the upper surface of the electronic component 13, and conveys the electronic component 13 together with the first suction collet 17.

The loading unit 16 includes a second suction collet 18 that is attracted to the lower surface of the electronic component 13, and the electronic component 13 is lowered together with the second suction collet 18 and loaded into the carrier 14.
The electronic component 13 loaded on the carrier 14 is sent together with the carrier 14 to an inspection device (not shown), and an energization inspection is performed in the inspection device.

  The tray 12 is formed in a plate shape, is supported by the support base 21 and is disposed at substantially the same height as the carrier 14. On the upper surface of the tray 12, a plurality of recesses 22 for accommodating the electronic components 13 are formed. The electronic component 13 is a rectangular parallelepiped component, and is accommodated in the recess 22 with a connection terminal (not shown) positioned below. The concave portion 22 is formed in a shape that allows slight movement of the electronic component 13 in the horizontal direction and rotation around the vertical axis.

  This “slightly permissible state” is a state in which the movement of the electronic component 13 is not completely restricted, and the electronic component 13 is changed so that the vertical direction and the horizontal direction of the electronic component 13 change in a plan view. It is in a state where there is no movement or rotation. The vertical direction of the electronic component 13 is a first direction out of a first direction and a second direction that are orthogonal to each other in the horizontal direction. The horizontal direction is the second direction. In this embodiment, the left-right direction in FIG. 1 is defined as a first direction, and the direction orthogonal to the paper surface of FIG. 1 is described as a second direction.

  The plurality of recesses 22 provided in the tray 12 are matrixes in a plan view in a plurality of positions arranged at a predetermined formation pitch in the first direction and a plurality of positions arranged at a predetermined formation pitch in the second direction. It is provided so that it may be located in a shape. In the tray 12 used in this embodiment, the formation pitch of the plurality of recesses 22 is different between the first direction and the second recess 22. The formation pitch of the recesses 22 in the first direction varies depending on the size of the electronic component 13 to be accommodated. On the other hand, the formation pitch of the recesses 22 in the second direction is constant regardless of the size of the electronic component 13 to be accommodated.

<Composition of carrier>
The carrier 14 is formed in a plate shape, and is supported by the transport table 23 as shown in FIG. The transfer table 23 includes a horizontal transfer surface 23a extending in the first direction, guide walls 23b extending in the first direction on both sides of the transfer surface 23a, and the like. The carrier 14 is pushed from one side in the first direction (right side in FIG. 2) while being placed on the transport surface 23a, and moves horizontally to the other side in the first direction. Then, the carrier 14 abuts on a movable stopper (not shown) and is positioned at the component loading position shown in FIG. The carrier 14 moves on the transport surface 23a after the electronic component 13 is loaded, and is sent to an apparatus (not shown) in the next process.

As shown in FIG. 2, the carrier 14 has a plurality of pockets 24 formed in a matrix. In the carrier 14 according to this embodiment, the formation pitch of the pockets 24 in the first direction and the formation pitch in the second direction are constant without depending on the size of the electronic component 13. The formation pitch of the pockets 24 in the second direction is equal to the formation pitch of the recesses 22 of the tray 12 in the second direction.
The pockets 24 according to this embodiment are provided at eight places in the first direction and eight places in the second direction, respectively. That is, the carrier 14 is provided with a row of eight pockets 24 arranged in the second direction for each of the eight locations in the first direction. In the electronic device aligning apparatus 11 according to this embodiment, as will be described in detail later, in order to load the electronic components 13 with a plurality of first suction collets 17 arranged in two rows in the first direction, there is one row in between. A row of two pockets 24 separated from each other is defined as one pocket group, and for convenience, 64 pockets 24 are divided into first to fourth pocket groups.

  The first pocket group includes eight pockets 24 in the first row and eight pockets 24 in the third row, counting from the right in FIG. The second pocket group includes eight pockets 24 in the second row and eight pockets 24 in the fourth row. The third pocket group includes eight pockets 24 in the fifth row and eight pockets 24 in the seventh row. The fourth pocket group includes eight pockets 24 in the sixth row and eight pockets 24 in the eighth row.

As shown in FIG. 4, these pockets 24 are constituted by a hole 25 that opens on the upper surface 14 a of the carrier 14, and a bottom surface 28 a of this hole and a lower surface 14 b of the carrier 14, and through holes 26 that open respectively. In this embodiment, the upper surface 14a of the carrier 14 corresponds to “one surface” in the present invention, and the lower surface 14b of the carrier 14 corresponds to “the other surface” in the present invention.
The hole 25 includes a funnel portion 27 located on the upper side, and a housing portion 28 located on the lower side continuously to the funnel portion 27.

The funnel portion 27 is formed in a funnel shape in which the opening width gradually narrows from a portion opening in the upper surface 14 a of the carrier 14 toward the bottom surface 28 a of the housing portion 28. The opening shapes of the funnel portion 27 and the accommodating portion 28 are quadrangular when viewed from above. Of the four sides of the quadrangle, two sides facing each other are parallel to the first direction, and the other two sides are parallel to the second direction.
The accommodating portion 28 is defined by a side wall 31 into which the electronic component 13 is fitted and a bottom wall 32 that supports the lower end of the electronic component 13. Note that the size and shape of the funnel portion 27 and the accommodating portion 28 constituting the hole 25 may be appropriately determined according to the size and shape of the electronic component to be inspected.

The opening width of the accommodating portion 28 in the first direction (the distance between the pair of side walls 31 facing each other) and the opening width of the accommodating portion 28 in the second direction are the clearance d between the side wall 31 and the electronic component 13. Is the dimension to be formed. The clearance d corresponds to the width of a range in which the connection terminal of the electronic component 13 can move without being detached from the probe of the inspection apparatus. For this reason, the electronic component 13 is aligned in the housing portion 28 so that the connection terminals are surely in contact with the probe.
The through hole 26 opens to the bottom surface 28 a of the housing portion 28 and the lower surface 14 b of the carrier 14. The opening shape of the through-hole 26 may be a square or a circle as long as it is smaller than the bottom surface 28a of the accommodating portion 28 and has a size and shape that allows a second suction collet 18 to be described later to be inserted.

<Configuration of parts supply unit>
As shown in FIG. 1, the component supply unit 15 includes a first moving device 41 disposed above the tray 12 and the carrier 14. The first moving device 41 is supported by the parallel moving device 42 at both ends in the first direction. The parallel movement device 42 according to this embodiment includes a support frame 43 extending in the vertical direction, a guide rail 44 supported by the support frame 43 and extending in the second direction, and a first along the guide rail 44. A moving ball screw mechanism (not shown) for driving the moving device 41 in the second direction. The support frame 43 is supported by a base 71 described later. The parallel movement ball screw mechanism converts the rotation of the parallel movement motor 45 (see FIG. 5) into a thrust acting in the second direction and transmits it to the first moving device 41. The operation of the parallel movement motor 45 is controlled by a control device 46 (see FIG. 5) described later.

  The first moving device 41 includes a first ball screw shaft 47 whose both ends are rotatably supported by the parallel moving device 42, and a first ball screw nut 48 on the first ball screw shaft 47. A first support member 49 connected, and a first suction unit 51 supported by the first support member 49 via a first lifting device 50 are provided. One end portion (the left end portion in FIG. 1) of the first ball screw shaft 47 is rotatably supported by the first bearing member 52.

  The other end of the first ball screw shaft 47 is connected to the first moving device motor 53. The first bearing member 52 and the first moving device motor 53 are movably supported by the guide rails 44 of the parallel moving device 42 and are driven by the parallel moving device 42 to move in the second direction. The first moving device motor 53 rotates the first ball screw shaft 47 in the forward rotation direction or the reverse rotation direction. The operation of the first moving device motor 53 is controlled by a control device 46 described later.

The first ball screw nut 48 is screwed onto the first ball screw shaft 47, and the rotation of the first ball screw shaft 47 is converted into a thrust acting in the first direction to convert the first support member 49 into the first support member 49. To communicate.
The first support member 49 is supported by a guide member (not shown) extending in the first direction so as to be movable in the first direction. The rotational force transmitted from the first ball screw nut 48 to the first support member 49 when the first ball screw shaft 47 rotates is received by this guide member. Therefore, when the first ball screw shaft 47 rotates, the first ball screw nut 48 and the first support member 49 move in the first direction along the guide member without rotating.

The first elevating device 50 includes a guide rail 54 extending in the vertical direction, a slider 55 supported by the guide rail 54 so as to be movable up and down, and an elevating drive mechanism for driving the first suction unit 51 in the vertical direction (see FIG. (Not shown). The guide rail 54 is fixed to the first support member 49. The slider 55 is fixed to the first suction unit 51. The elevating drive mechanism can be constituted by, for example, a ball screw mechanism or a rack and pinion type drive mechanism. This elevating drive mechanism uses a first elevating device motor 56 (see FIG. 5) as a power source, and converts the rotation of the first elevating device motor 56 into a thrust acting in the vertical direction. To the suction unit 51.
The operation of the first lifting device motor 56 is controlled by a control device 46 described later.

The first suction unit 51 includes a first lifting member 61 to which the slider 55 described above is fixed, and a plurality of first suction members attached to the first lifting member 61 via suction collet lifting devices 62. And a collet 17. The lifting / lowering device 62 for the suction collet is provided for each first suction collet 17 and its operation is controlled by a control device 46 described later to lift and lower the first suction collet 17 individually.
The first elevating member 61 is formed with passage holes 61 a connected to all the first suction collets 17. The passage hole 61 a is connected to the first suction device 64 via the first suction pipe 63.

  The first suction device 64 sucks air from the first suction collet 17 through the first suction pipe 63 and the passage hole 61a. The operation of the first suction device 64 is controlled by a control device 46 described later. A first adsorption sensor 65 is connected to the air passage between the first suction device 64 and the first adsorption collet 17. The first adsorption sensor 65 detects the pressure in the air passage and sends it to the controller 46 as a signal.

The first suction collet 17 is formed in a cylindrical shape, and protrudes downward from the lower end portion of the first elevating member 61. At the lower end of the first suction collet 17, a first suction surface 66 that sucks the electronic component 13 is formed. In the first suction collet 17 according to this embodiment, the first lifting device 50 and the suction collet lifting device 62 described above operate, so that the lift position P1 spaced upward from the carrier 14 and the carrier 14 It moves up and down between the first delivery position P2 set in the vicinity of the opening of the hole 25 {see FIG. 6B}. For this reason, the first suction collet 17 moves up and down with the vicinity of the opening of the hole 25 as the lowest position in the movement range.
As shown in FIG. 6B, the first delivery position P2 according to this embodiment has a lower surface of the electronic component 13 sucked by the first suction collet 17 and an upper end of a second suction collet 18 to be described later. Are the same height. In this embodiment, the first delivery position P2 corresponds to the “lowermost position” in the present invention.

  Although not shown in detail in the first elevating member 61 according to this embodiment, the 16 first suction collets 17 respectively correspond to the positions of the plurality of pockets 24 of the carrier 14. It is attached via an elevator device 62. More specifically, a total of sixteen first suction collets 17 are arranged so that eight first suction collets 17 are arranged in one row in the second direction, and this row is two rows in the first direction. Has been placed.

  The arrangement pitch of the first suction collets 17 in the second direction is equal to the formation pitch of the pockets 24 of the carrier 14 in the second direction. Further, the interval between the rows, that is, the arrangement pitch of the first suction collets 17 in the first direction is different from the formation pitch of the pockets 24 in the first direction, as shown in FIG. The arrangement pitch in the first first direction of the first suction collet 17 according to this embodiment is an arrangement pitch at which the electronic components 13 can be efficiently taken out from the tray 12. Such an arrangement pitch is, for example, an arrangement pitch that allows the largest electronic component 13 to be sucked from the concave portion 22 of the tray 12 at once by the 16 first suction collets 17. This arrangement pitch corresponds to twice the formation pitch of the pockets 24 in the first direction in this embodiment. The arrangement pitch of the first adsorption collet in the first direction is not limited to the arrangement pitch shown in this embodiment and can be changed as appropriate. That is, the arrangement pitch may be equal to or three times the formation pitch of the pockets 24, or may not be an integral multiple of the formation pitch of the pockets 24.

<Configuration of loading unit>
As shown in FIG. 1, the loading unit 16 includes a second moving device 72 supported by a base 71 and a plurality of second suction collets 18 attached to the uppermost portion of the second moving device 72. It has. The base 71 supports all the components of the electronic component aligning device 11.
As shown in FIGS. 2 and 3, the second moving device 72 includes a second ball screw shaft 73 that extends in the first direction on the base 71 and below the transfer table 23, and the second ball screw shaft 73. A second support member 75 connected to the ball screw shaft 73 via a second ball screw nut 74 (see FIG. 1), and supported by the second support member 75 via a second lifting device 76. The second suction unit 77 is provided.

One end of the second ball screw shaft 73 (the right end in FIG. 3) is rotatably supported by the second bearing member 78. The second bearing member 78 is fixed to the base 71. The other end of the second ball screw shaft 73 passes through the third bearing member 79 and is connected to the belt-type transmission mechanism 81. The other end of the second ball screw shaft 73 is connected to a second moving device motor 82 via a belt-type transmission mechanism 81. The third bearing member 79 is fixed to the base 71 and rotatably supports the second ball screw shaft 73.
The belt-type transmission mechanism 81 includes a driven pulley 83 fixed to the second ball screw shaft 73, a drive pulley 85 fixed to the rotating shaft 84 of the second moving device motor 82, and these driven pulleys 83. A belt 86 wound around a drive pulley 85 is provided.

  As described above, the second moving device motor 82 is connected to the second ball screw shaft 73 via the belt-type transmission mechanism 81, so that the rotating shaft 84 and the second moving device motor 82 are connected to the second ball screw shaft 73. The ball screw shaft 73 rotates in the same direction. The second moving device motor 82 rotates the second ball screw shaft 73 in the forward rotation direction or the reverse rotation direction. The operation of the second moving device motor 82 is controlled by the control device 46 described later.

The second ball screw nut 74 is screwed into the second ball screw shaft 73, converts the rotation of the second ball screw shaft 73 into a thrust acting in the first direction, and the second support member 75. To communicate.
The second support member 75 is supported by a guide member (not shown) extending in the first direction so as to be movable in the first direction. The rotational force transmitted from the second ball screw nut 74 to the second support member 75 when the second ball screw shaft 73 rotates is received by this guide member. For this reason, when the second ball screw shaft 73 rotates, the second ball screw nut 74 and the second support member 75 move in the first direction along the guide member without rotating.

  The second elevating device 76 includes a guide rail 91 extending in the vertical direction, a slider 92 supported by the guide rail 91 so as to be movable up and down, an elevating drive mechanism 93 for driving the second suction unit 77 in the vertical direction, and the like. It has. The guide rail 91 is fixed to a support plate 94 that is an upper end portion of the second support member 75. The slider 92 is fixed to a lifting plate 95 that is a lower end portion of the second suction unit 77.

The elevating drive mechanism 93 includes a rack 96 (see FIG. 1) provided at one end of the elevating plate 95, a pinion 97 that meshes with the rack 96, and a second elevating device motor 98 that drives the pinion 97. This is a rack-and-pinion drive mechanism equipped with the above. The elevating drive mechanism 93 converts the rotation of the second elevating device motor 98 into a thrust acting in the vertical direction and transmits it to the second suction unit 77.
The operation of the second lifting device motor 98 is controlled by the control device 46 described later.

  The second suction unit 77 includes a lifting plate 95 to which the slider 92 and the rack 96 of the second lifting device 76 are fixed, and a second lifting member 99 provided on the lifting plate 95. Yes. The second suction collet 18 of the loading unit 16 is formed in a cylindrical shape, and is attached to the upper end portion of the second elevating member 99 so as to protrude upward. At the upper end of the second suction collet 18, a second suction surface 101 that is sucked by the electronic component 13 is formed.

  In the second suction collet 18 according to this embodiment, the second elevating device 76 described above operates to pass through the through-hole 26 and the hole 25 of the carrier 14 and a second delivery position P3 (described later). 1) and the lower limit position P4 {see FIG. 6G}. The second delivery position P3 is set near the opening of the hole 25 of the carrier 14. For this reason, the second suction collet 18 moves up and down with the vicinity of the opening of the hole 25 as the highest position in the movement range.

As shown in FIG. 6B, the second delivery position P3 according to this embodiment includes the lower surface of the electronic component 13 sucked by the first suction collet 17 at the first delivery position P2, and the second delivery position P3. The upper end (second suction surface 101) of the suction collet 18 is at the same height. In this embodiment, the second delivery position P3 corresponds to the “top position” in the present invention.
The lower limit position P4 is a position where the second suction collet 18 is spaced downward from the carrier 14.

  As shown in FIG. 3, 16 second suction collets 18 are attached to the second lifting member 99 according to this embodiment, corresponding to the positions of the plurality of pockets 24 of the carrier 14. More specifically, a total of 16 second suction collets 18 are arranged so that eight second suction collets 18 are arranged in a row in the second direction, and this row becomes two rows in the first direction. Has been placed. The arrangement pitch of the second suction collet 18 in the second direction is equal to the formation pitch of the pockets 24 of the carrier 14 in the second direction. The interval between the columns, that is, the arrangement pitch of the second adsorption collet 18 in the first direction is equal to the arrangement pitch of the first adsorption collet 17 in the first direction, as shown in FIG. The arrangement pitch of the second adsorption collet 18 in the second direction according to this embodiment is twice the formation pitch of the pockets 24 in the first direction. The arrangement pitch of the second suction collet 18 in the first direction is not limited to twice the formation pitch of the pockets 24. The arrangement pitch may be the same as the formation pitch of the pockets 24, or three times the arrangement pitch. It is also possible.

  In the second lifting member 99, passage holes 102 (see FIG. 1) connected to all the second suction collets 18 are formed. The passage hole 102 is connected to the second suction device 104 via the second suction pipe 103. The second suction device 104 sucks air from the second suction collet 18 through the second suction pipe 103 and the passage hole 102. The operation of the second suction device 104 is controlled by a control device 46 described later. A second adsorption sensor 105 is connected to the air passage between the second suction device 104 and the second adsorption collet 18. The second adsorption sensor 105 detects the pressure in the air passage and sends it to the controller 46 as a signal.

<Configuration of control device>
Although not shown in detail, the control device 46 includes a computer including an arithmetic device, a storage device, an interface circuit, and the like, and a control program installed in the computer.
As shown in FIG. 5, the control device 46 is connected to the input device 106 and operates various actuators based on data sent from the input device 106 and signals input from various sensors. This data includes information such as the number and positions of the recesses 22 of the tray 12 and the pockets 24 of the carrier 14. The input device 106 is operated when an operator (not shown) starts or stops the electronic component aligning device 11 and sends a signal to the control device 46 to achieve this purpose. In the present embodiment, the parameter for managing the first to fourth pocket groups described above is referred to as “variable X”.

  The actuator connected to the control device 46 includes a parallel movement motor 45, a first movement device motor 53, a first lifting device motor 56, a suction collet lifting device 62, and a first suction. The device 64, the second moving device motor 82, the second lifting device motor 98, the second suction device 104, and the alarm device 107. Although not shown, the alarm device 107 is a device that notifies an operator of an abnormality using a display device, a warning light, a speaker, or the like.

The control device 46 is connected to a plurality of rotary encoders 108 provided in each of the motors described above, and controls the operation of the electronic component aligning device 11 based on the detection values of these rotary encoders 108. That is, the control device 46 controls the operation of moving the first suction collet 17 and the second suction collet 18 in the horizontal direction and the raising / lowering operation, and switching the suction and release of both the suction collets 17 and 18. .
In this embodiment, the control device 46 corresponds to a “control unit” in the present invention.

<Description of operation>
Next, the configuration of the control device 46 will be described using FIGS. 6 to 9 together with the operation of the electronic component aligning device 11. In the timing chart of FIG. 9, the reference numerals of the respective steps are described at the time when the steps of the flowcharts shown in FIGS. 7 and 8 are performed.

  When the operator performs an operation at the start of the input device 106, the control device 46 starts a control operation. At this time, the value of the variable X for managing the pocket group is set to “1”. First, the control device 46 operates the first moving device 41, the parallel moving device 42, the first lifting device 50 and the suction collet lifting device 62, and the first suction device 64. The electronic component 13 on the tray 12 is attracted to the suction collet 17 (step 1). At this time, the electronic component 13 is adsorbed to all the 16 first adsorbing collets 17.

  Next, the control device 46 determines whether or not the detection value of the first suction sensor 65 is a value at the time of component suction (step 2). At this time, if at least one of the 16 first suction collets 17 does not attract the electronic component 13 or if it is not completely absorbed (step S2: NO), the first Since the pressure detected by the suction sensor 65 becomes larger than that at the normal time, the control device 46 operates the alarm device 107 as an operation at the time of abnormality and stops all the actuators (step S3).

  When the detected value of the first adsorption sensor 65 is equal to the normal value (step S2: YES), the control device 46 operates the first moving device 41 and the parallel moving device 42, and the variable X As shown in FIG. 6A, the first suction collet 17 is moved above the target X-th pocket group. When the first part is loaded immediately after startup, the first suction collet 17 moves above the first pocket group. At the time of loading the first part, the control device 46 operates the second moving device 72 and the second lifting / lowering device 76 at or before step S4, and the second suction collet 18 is moved to the first pocket group. Insert into the pocket 24 from below. At this time, as shown in FIGS. 6A and 9, the second suction collet 18 rises from the lower limit position P4 to the second delivery position P3.

  Thereafter, the control device 46 operates the first lifting device 50 and the suction collet lifting device 62 to lower the first suction collet 17 to the first delivery position P2, as shown in FIG. 6B. (Step S5). At this time, the electronic component 13 stops in contact with the upper end of the second suction collet 18 in the funnel portion 27 of the pocket 24. And the control apparatus 46 operates the 2nd suction device 104, and makes the 2nd adsorption collet 18 a suction state (step S6). After putting the second suction collet 18 into the suction state, the controller 46 stops the first suction device 64 and stops the suction of the first suction collet 17 (step S7). Thus, the electronic component 13 is adsorbed by the second adsorbing collet 18 when the first adsorbing collet 17 is released.

  After the first suction collet 17 is in the released state, the control device 46 determines whether or not the detection value of the second suction sensor 105 is a value at the time of component suction (step S8). At this time, if at least one of the 16 second suction collets 18 does not attract the electronic component 13 or if it is not completely absorbed (step S8: NO), the second Since the pressure detected by the adsorption sensor 105 becomes larger than that at the normal time, the control device 46 operates the alarm device 107 as an operation at the time of abnormality and stops all the actuators (step S9).

  When the detection value of the second adsorption sensor 105 is equal to the normal value (step S8: YES), as shown in FIG. 6C, the control device 46 is connected to the first lifting device 50 and the adsorption collet. The first lifting collet 17 is lifted by operating the lifting / lowering device 62 (step S10). Thereafter, the control device 46 operates the second lifting device 76 to lower the second suction collet 18 as shown in FIG. 6D (step S11). The lowering speed of the second suction collet 18 at this time can be constant or can be changed according to the height of the electronic component 13. When the descending speed is changed in accordance with the height of the electronic component 13, when the electronic component 13 passes through the funnel portion 27 of the pocket 24, the descending speed is relatively slow, and the electronic component 13 is accommodated in the accommodating portion 28 of the pocket 24. After entering, make the descent speed relatively fast.

The horizontal position of the electronic component 13 relative to the second suction collet 18 and the angle around the vertical axis depend on the position and angle when the electronic component 13 is removed from the tray 12 by the first suction collet 17. To do. For this reason, the electronic component 13 rarely falls in the pocket 24 and directly enters the housing portion 28, and the lower end of the electronic component 13 often comes into contact with the wall surface of the funnel portion 27.
The wall surface of the funnel portion 27 is inclined so that the opening width of the funnel portion 27 gradually becomes narrower as it goes downward. For this reason, when the electronic component 13 contacts the funnel portion 27, the electronic component 13 is pushed by the wall surface of the funnel portion 27 and moves in the horizontal direction, and the suction position of the electronic component 13 is corrected.

  The electronic component 13 may be attracted to the second suction collet 18 while being biased toward one of the first directions or one of the second directions. In such a case, as shown in FIG. 6E, the electronic component 13 is inclined when it comes into contact with the funnel portion 27, and a part of the lower surface of the electronic component 13 is easily separated from the second suction collet 18. . However, in the electronic component aligning apparatus according to this embodiment, since the second suction collet 18 is located below the electronic component 13, even if the electronic component 13 is separated from the second suction collet 18, No part 27 is left behind.

  This is because the suction force of the second suction collet 18 and gravity act on the electronic component 13, and the electronic component 13 slides down along the wall surface of the funnel portion 27. The electronic component 13 is again adsorbed by the second adsorption collet 18 in a state where the horizontal position and the angle around the vertical axis are corrected by contact with the funnel portion 27. Both are lowered and fitted into the accommodating portion 28. By fitting the electronic component 13 in the housing portion 28 in this way, the position of the electronic component relative to the carrier 14 in the first and second directions and the angle around the vertical axis are aligned.

  The control device 46 always detects the height of the second suction collet 18 after starting the lowering of the second suction collet 18 in step S11. Then, as shown in FIG. 6 (F), the control device moves the second lifting / lowering device when the second suction collet 18 is lowered to a position where the electronic component 13 is supported by the bottom wall 32 of the hole 25 of the pocket 24. 76 is stopped (step S12).

  Next, the control device 46 determines whether or not the detection value of the second suction sensor 105 is a value at the time of component suction (step S13). At this time, when the pressure detected by the second adsorption sensor 105 is larger than normal (step S13: NO), the control device 46 operates the alarm device 107 as an operation at the time of abnormality, and all the actuators are operated. Stop (step S14).

  When the detected value of the second suction sensor 105 is equal to the normal value (step S13: YES), the control device 46 stops the second suction device 104 and performs suction by the second suction collet 18. Is stopped (step S15). Thereafter, as shown in FIG. 6G, the control device 46 operates the second lifting device 76 to lower the second suction collet 18 to the lower limit position P4 and stop it (step S16).

  After the second suction collet 18 is lowered to the lower limit position P4 in this way, the control device 46 adds 1 to the variable X that identifies the pocket group to be loaded with parts (step S17), and the variable X is the pocket group. It is determined whether or not it is equal to or less than the total number (step S18). If the variable X exceeds the total number of pocket groups (step S18: NO), the operation of loading the electronic component 13 on one carrier 14 is terminated.

  When the variable X is equal to or smaller than the total number of pocket groups (step S18: YES), the control device 46 operates the second moving device 72 to move the second suction collet 18 below the X + 1th pocket group. (Step S19). And the control apparatus 46 operates the 2nd raising / lowering apparatus 76, and raises the 2nd adsorption collet 18 to the 1st delivery position P2 (step S20). Thereafter, the control device 46 returns to step S1 and repeats the operations from step S1 to step S20 until the electronic components 13 are loaded in all the pockets 24 of the carrier 14. That is, each time the first suction collet 17 and the second suction collet 18 are driven by the first moving device 41 and the second moving device 72 to move intermittently in the first direction and stop. The electronic component 13 is loaded into the pocket 24 of the carrier 14.

<Explanation of effect by embodiment>
In the electronic component aligning device 11 according to this embodiment, when the electronic component 13 is adsorbed by the second adsorption collet 18 and descends in the hole 25 of the carrier 14, the electronic component 13 contacts the wall surface of the funnel portion 27. The horizontal position of 13 and the angle around the vertical axis are corrected. At this time, even if the electronic component 13 is tilted by contact with the wall surface of the funnel portion 27 and is detached from the second suction collet 18, gravity and the suction force by the second suction collet 18 act on the electronic component 13. Therefore, the electronic component 13 slides down along the wall surface of the funnel portion 27.

As a result, the electronic component 13 is again attracted to the second suction collet 18. Then, the electronic component 13 is lowered together with the second suction collet 18 and fitted into the accommodating portion 28 of the hole 25 of the carrier 14, thereby being aligned at a predetermined position with respect to the carrier 14.
Therefore, according to this embodiment, even if the electronic component 13 contacts the funnel portion 27 and is separated from the suction collet, the electronic component 13 is again attracted to the second suction collet 18, and the electronic component 13 is accommodated in the housing portion of the hole 25. Thus, it is possible to provide an aligning device for electronic components that is securely accommodated in 28.

The hole 25 and the through hole 26 of the carrier 14 according to this embodiment are provided at a plurality of positions of the carrier 14, respectively. Further, the first suction collet 17 and the second suction collet 18 are respectively provided corresponding to the plurality of positions of the carrier 14.
For this reason, according to this embodiment, since a plurality of electronic components 13 can be aligned at a time, an electronic component aligning device capable of efficiently aligning the electronic components 13 is provided. it can.

  In the electronic component aligning device 11 according to this embodiment, the plurality of first suction collets 17 arranged in the second direction are driven by the first moving device 41 and move simultaneously. In addition, the plurality of second suction collets 18 arranged in the second direction are driven by the second moving device 72 and move simultaneously. The first suction collet 17 and the second suction collet 18 are driven by the first and second moving devices 41 and 72, respectively, and move intermittently in the first direction. The electronic component 13 is loaded into the plurality of holes 25.

  For this reason, the batch loading operation of loading a plurality of electronic components 13 arranged in the second direction at a time is repeated while changing the position in the first direction. Therefore, according to this embodiment, the alignment and loading of the electronic component 13 can be performed as fast as possible with respect to the carrier 14 in which the holes 25 and the through holes 26 are provided in a matrix, so that productivity is improved. Can be improved.

  The electronic component aligning device according to the above-described embodiment is configured to determine whether or not the electronic component 13 is sucked using the second suction sensor 105 when the electronic component 13 is supported by the bottom wall 32 of the hole 25. Has been adopted. For this reason, the pass / fail judgment after the electronic component 13 is loaded in the pocket 24 is easily performed with high accuracy.

  The component supply unit 15 according to the above-described embodiment employs a configuration in which the first suction collet 17 moves in the first direction and the second direction. However, the component supply unit 15 can take a configuration in which the first suction collet 17 moves only in the first direction. In addition, the first moving device 41 of the component supply unit 15 can be configured using a drive mechanism different from the ball screw mechanism.

  The loading unit 16 according to the above-described embodiment has a configuration in which the second suction collet 18 moves in the first direction. However, the electronic device aligning device according to the present invention is not limited to such a limitation. The loading unit 16 can take a configuration in which the second suction collet 18 moves in the first direction and the second direction. This configuration can be realized by installing a translation device equivalent to the component supply unit 15.

  Sixteen first adsorption collets 17 are attached to the first adsorption unit 51 according to the above-described embodiment, and sixteen second adsorption collets 18 are attached to the second adsorption unit 77. However, the number of first and second adsorption collets 17 and 18 is not limited to the number shown in this embodiment, and can be changed as appropriate. Further, the number of pockets 24 of the carrier 14 is not limited to the number shown in this embodiment, and can be appropriately changed.

  In the above-described embodiment, the example in which the arrangement pitch in the first direction and the second direction of the plurality of first and second suction collets 17 and 18 is made constant is shown. However, the present invention is not limited to such a limitation. The plurality of first suction collets 17 includes a first pitch changing device (not shown) that changes the arrangement pitch of at least one of the arrangement pitch in the first direction and the arrangement pitch in the second direction. It can equip with the 1st adsorption | suction unit 51 via.

  The plurality of second adsorption collets 18 are second pitch changing devices (not shown) that change the arrangement pitch of at least one of the arrangement pitch in the first direction and the arrangement pitch in the second direction. ) To the second suction unit 77. In these first and second pitch changing devices, devices that change the arrangement pitch of each suction collet by the power of an actuator (not shown), and parts such as spacers and shims are replaced by an operator. This can be realized by using an apparatus having a configuration in which the arrangement pitch changes.

  By thus providing the first and second pitch changing devices, there is no restriction due to the formation pitch of the concave portions 22 of the tray 12. After the electronic component 13 is taken out from the recess 22 of the tray 12 by the first suction collet 17, the arrangement pitch of the first suction collet 17 in the first and second directions is matched with the formation pitch of the pockets 24 of the carrier 14. By changing, it becomes possible to load all the electronic components 13 into the plurality of pockets 24 at a time. Also in the second suction collet 18, a plurality of electronic components 13 can be loaded into the pocket 24 at a time by changing the arrangement pitch in accordance with the formation pitch of the pocket 24 in the first direction or the second direction. it can.

  DESCRIPTION OF SYMBOLS 11 ... Alignment apparatus for electronic components, 13 ... Electronic components, 14 ... Carrier, 14a ... Upper surface, 14b ... Lower surface, 17 ... 1st adsorption collet, 18 ... 2nd adsorption collet, 101 ... 2nd adsorption surface, 25 DESCRIPTION OF SYMBOLS ... Hole, 26 ... Through-hole, 27 ... Funnel part, 28 ... Accommodating part, 31 ... Side wall, 32 ... Bottom wall, 41 ... 1st moving apparatus, 46 ... Control apparatus, 50 ... 1st raising / lowering apparatus, 62 ... Lifting device for suction collet, 64 ... first suction device, 66 ... first suction surface, 72 ... second moving device, 76 ... second lifting device, 104 ... second suction device, P2 ... first Delivery position, P3... Second delivery position.

Claims (3)

A plate-like carrier having an opening on one surface and accommodating an electronic component; and a through-hole opening on the other surface and the bottom surface of the hole;
A first suction collet that is formed at the lower end of the first suction surface to be sucked into the electronic component and moves up and down with the vicinity of the opening of the hole as the lowest position of the moving range;
A second suction collet that is formed at the upper end of the second suction surface to be sucked by the electronic component, and moves up and down through the hole and the through hole with the vicinity of the opening of the hole as the uppermost position of the movement range;
A controller for controlling the lifting and lowering operations of the first suction collet and the second suction collet and switching between suction and release;
The hole is
A funnel portion formed in a funnel shape in which the opening width gradually narrows from the portion opening in the one surface of the carrier toward the bottom surface;
A housing part that is continuous from the funnel part and that is defined by a side wall into which the electronic component is fitted and a bottom wall that supports the lower end of the electronic component;
The controller is
Lowering the first suction collet to the lowest position in a state where electronic components are sucked to the first suction surface;
Adsorbing the second adsorption collet to an electronic component adsorbed on the first adsorption collet and releasing the first adsorption collet;
An electronic component aligning device that lowers the second suction collet in a state where the electronic component is sucked until the electronic component is supported by the bottom wall of the hole. The electronic device alignment apparatus according to claim 1,
The hole and the through hole are respectively provided at a plurality of positions of the carrier;
The electronic component aligning device, wherein the first suction collet and the second suction collet are provided corresponding to the plurality of positions, respectively. The electronic device alignment apparatus according to claim 2,
further,
A first moving device that moves the plurality of first suction collets in a first direction out of a first direction and a second direction orthogonal to each other in the horizontal direction;
A second moving device that moves a plurality of the second adsorption collets in the first direction;
The hole and the through hole are respectively provided at positions arranged at predetermined intervals in the first direction and the second direction of the carrier,
The plurality of first adsorption collets and the plurality of second adsorption collets are provided side by side with a predetermined interval in the second direction, and the first moving device and the second moving device. The electronic component aligning apparatus is characterized in that the electronic components are intermittently moved in the first direction and loaded into the plurality of holes each time they are stopped.

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