JP2019006635A - Manufacturing method of substrate with functional film - Google Patents

Abstract

To provide a manufacturing method of a substrate with a functional film capable of achieving both of thinning a substrate for making a film and enhancement of manufacturing efficiency.SOLUTION: A manufacturing method of a substrate with a functional film includes at least: a first step for arranging a first insulation substrate for making film and a second insulation substrate for making film in which a plurality of lamination type functional films are made respectively with facing film forming surface thereof each other in proximity; a second step for encapsulating a gap between terminal surfaces of the first insulation substrate for making film and the second insulation substrate for making film arranged in proximity with an etching resistant encapsulating member; a third step for thinning the first insulation substrate for making film and the second insulation substrate for making film by an etching treatment on only an opposite side of the film forming surface sides of each of the first insulation substrate for making film and the second insulation substrate for making film which are arranged in proximity; and a fourth step for separating the first insulation substrate for making film and second insulation substrate for making film, which are thinned.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for producing a substrate with a functional film including a laminated functional film such as a lithium battery element laminate, an organic EL display element laminate, and a solar battery element laminate.

  2. Description of the Related Art In recent years, film formation technology has been widely used in various fields related to the manufacture of electrical products, including lithium battery manufacturing processes, solar panel manufacturing processes, organic EL display panel manufacturing processes, semiconductor manufacturing processes, and the like. . In such a film forming process of an electric product, the processing temperature is usually high, and high heat resistance is often required for a material used as a film forming substrate.

  For this reason, an insulating substrate having heat resistance such as glass, ceramics, silicate mineral (mica, etc.) may be used as a film formation substrate. For example, in a lithium battery, a technique of forming a plurality of element composites including an electrode layer on a glass film-forming substrate has been employed (see, for example, Patent Document 1). Some organic EL display panels use a glass film-forming substrate in order to facilitate the handling of the organic resin film in the film-forming process (see, for example, Patent Document 2).

Japanese Patent No. 4465578 JP, 2006-004112, A

  However, in the conventional method for manufacturing a substrate with a functional film, there is a demand for further thinning of the substrate and improvement of manufacturing efficiency. I could not say. For example, due to restrictions in handling in the manufacturing process, when the film formation substrate is thin, in most cases, a single laminated functional film is formed on each single film formation substrate. is there. On the other hand, when a plurality of laminated functional films for electrical products are formed on a relatively large size film-forming substrate and multiple substrates are provided with functional films, a thick plate is used as the film-forming substrate. Often it was forced to use materials.

  The objective of this invention is providing the manufacturing method of the board | substrate with a functional film which can make the thickness reduction of the board | substrate for film-forming, and the improvement of manufacturing efficiency compatible.

  The method for producing a substrate with a functional film according to the present invention includes a laminated functional film (for example, an electrical laminate) including a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar battery. A substrate with a functional film provided with a laminated functional film for products) is manufactured. A typical example of the material of the substrate with a functional film is glass, but inorganic materials other than glass (ceramics, silicate minerals, etc.) can also be employed. This manufacturing method includes at least the following first to fourth steps.

  In the first step, the first film-forming insulating substrate and the second film-forming insulating substrate on which a plurality of stacked functional films are formed are opposed to each other. And place them close together. Here, the close arrangement refers to the case where the first film-forming insulating substrate and the second film-forming insulating substrate are directly stacked, or the first film-forming insulating substrate and the second film-forming insulating substrate. It is interpreted to include the case where the film-forming insulating substrate is indirectly overlapped with an interposition such as a slip sheet.

  In the second step, the gap between the end surfaces of the first film-forming insulating substrate and the second film-forming insulating substrate that are arranged close to each other is sealed with an etching-resistant sealing member. Examples of the etching resistant sealing member include an etching resistant sealing agent, an etching resistant tape, and an etching resistant film.

  In the third step, the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged in proximity to each other, are etched only on the opposite side of the film-forming surface side. The film-forming insulating substrate and the second film-forming insulating substrate are thinned. In this etching process, an etching solution capable of dissolving the first film-forming insulating substrate and the second film-forming insulating substrate is appropriately employed. In the case where the insulating substrate for film formation is glass, an etching solution containing hydrofluoric acid is used for the single-sided etching process.

  In the fourth step, the thin film-forming first insulating substrate and the second film-forming insulating substrate are separated. By performing these first to fourth steps in this order, it is possible to simultaneously reduce the thickness of a film-forming insulating substrate having a plurality of laminated functional films while protecting the laminated functional films. For this reason, it becomes possible to manufacture a several board | substrate with a functional film at once, and also to implement | achieve thickness reduction of a board | substrate with a functional film. In particular, since two insulating substrates for film formation can be processed at the same time, it is easy to improve productivity.

  In the above-described fourth step, the first film-forming insulating substrate and the second film-forming insulating substrate which are arranged close to each other may be collectively divided by laser processing.

  In the first step, a slip sheet can be interposed between the first film-forming insulating substrate and the second film-forming insulating substrate. Due to the presence of the interleaving paper, the first film-forming insulating substrate and the second film-forming insulating substrate can be easily separated, and the elements and wirings can be protected. When interleaving paper is used, in the fourth step, the first film-forming insulating substrate and the second film-forming insulating substrate may be separated by removing the etching-resistant sealing member. Some etching-resistant sealing members can be easily peeled off by heating with hot water or the like, so this step can be performed by selecting an etching-resistant sealing member in consideration of peelability. It becomes possible to execute easily.

  After separating the first film-forming insulating substrate and the second film-forming insulating substrate, the thin film-forming first film-forming insulating substrate and the second film-forming insulating substrate are removed. It is preferable to further include a dividing step of dividing. By dividing the thinned insulating substrate for film formation, the working efficiency is improved as compared with the case where each divided substrate is thinned. In addition, since the thinner one can be easily divided by laser processing or the like, the working efficiency of the dividing step is also improved.

  In the method for manufacturing a substrate with a functional film, the first film-forming insulating substrate and the second film-forming insulating substrate are preferably a composite of lithium battery elements. By using the method for manufacturing a substrate with a functional film described above for manufacturing a lithium battery, it is possible to realize both thinning of the lithium battery and improvement of manufacturing efficiency.

  According to the present invention, in the production of a functional film-equipped substrate having a laminated functional film such as a lithium battery element laminate, an organic EL display element laminate, and a solar battery element laminate, the thin film deposition substrate is thin. It is possible to achieve both improvement of the manufacturing efficiency.

It is a figure showing a schematic structure of a substrate for film formation concerning one embodiment of the present invention. It is the schematic which shows an example of the state which piled up the two board | substrate for film-forming. It is the schematic which shows an example of the state which piled up the two board | substrate for film-forming. It is a figure which shows an example of the etching apparatus used for the single-sided etching process with respect to the board | substrate for film-forming. It is a figure which shows an example of the division process with respect to the film-forming substrate. It is a figure which shows an example of the division process with respect to the film-forming substrate. It is the schematic which shows the other example of the state which overlap | superposed two film-forming substrates. It is a figure which shows the other example of the parting process with respect to the film-forming board | substrate.

  Hereinafter, an embodiment of a method for manufacturing a substrate with a functional film according to the present invention will be described with reference to the drawings. Here, as an example of the method for producing a substrate with a functional film according to the present invention, a method for producing a substrate with a laminated functional film made of a lithium battery element composite will be described.

1A to 1C are schematic configurations of a glass substrate 10 for film formation (corresponding to the substrate with a functional film of the present invention) in a manufacturing process of a lithium battery according to an embodiment of the substrate with a functional film. Is shown. In this embodiment, glass is used as a material for the substrate with a functional film. In addition to glass, insulating substrate silicon (Si), silicon dioxide (SiO ₂ ), ceramics, silicate mineral (mica, etc.) As long as the substrate is a heat-resistant insulating substrate that can be dissolved by an etching solution containing hydrofluoric acid, it can be appropriately used as a film-forming substrate.

  A plurality of lithium battery element composites 12 are formed on the glass substrate 10 for film formation. In this embodiment, the lithium battery element composite 12 is arranged in a matrix of 4 rows × 4 columns to form 16 lithium battery composites 12, but the lithium battery element composite is shown. The arrangement of 12 is not limited to this.

  Each element assembly 12 for a lithium battery includes a positive electrode layer including a current collector layer 122 and a composite oxide layer 124, an electrolyte layer 126, and a negative electrode layer 128 formed on the glass substrate 10 for film formation. Yes. The current collector layer 122 is formed by a vacuum deposition method, an ion plating method, a CVD method, a dry deposition method such as sputtering, or a wet deposition method such as an electrolytic plating method or an electroless plating method. 10 is formed. The composite oxide layer 124 is formed on the current collector layer 122 by sputtering or the like. Thereafter, similarly, the electrolyte layer 126 and the negative electrode layer 128 are formed in this order.

  When manufacturing the glass substrate 10 for film formation with the lithium battery element composite body 12, first, as shown in FIGS. 2A and 2B, a plurality of lithium battery element composite bodies 12 are provided. Are prepared, and these two film forming glass substrates 10 are superposed with their film formation surfaces facing each other. When the two glass substrates for film formation 10 are overlapped, they are overlapped so as to be in indirect contact with an interleaving paper sandwiched therebetween, or in direct contact without interposing the interleaving paper or the like. It is possible to match.

  3A to 3D show an example in which the glass substrate 10 for film formation is indirectly overlapped with an interleaf paper 14 interposed therebetween. Here, a high-performance paper such as an FPD paper (for example, Tokushu Tokai Paper Co., Ltd.) is used as the paper 14, but it is also possible to use ordinary printing paper or film. Examples of the purpose of using the interleaving paper 14 include protection of wiring and elements, improvement of peelability between the glass substrates 10 for film formation, and the like.

  As shown in FIG. 3 (B), when two glass substrates for film formation 10 are stacked with the interleaf paper 14 interposed therebetween, two glass films for film formation are subsequently formed as shown in FIG. 3 (C). The gap between the end faces of the substrate 10 is sealed with an etching resistant sealing member 16. The etching resistant sealing member 16 is preferably a member having both the function of an adhesive for bonding two film-forming glass substrates 10 and the function of a sealing agent (such as a sealing agent for liquid crystal cells). However, an adhesive layer and a sealing agent for bonding the two glass substrate for film formation 10 may be provided separately.

  By simply sealing the gap between the end surfaces of the two film forming glass substrates 10 with the etching-resistant sealing member 16, the end surfaces of the film forming glass substrate 10 are etched, which may cause a problem. Conceivable. For this reason, it is preferable to cover not only the gap between the end faces but also the end face itself with an etching resistant member as necessary. The end face of the glass substrate 10 for film formation can be coated by applying an etching resistant tape or film, applying an etching resistant paint, or the like. As an example of an etching resistant film, various films for electronics (example: EC series) manufactured by Sumilon Co., Ltd. may be mentioned. Moreover, as an example of an etching resistant sealant, an adhesive solution manufactured by Denka Co., Ltd. (example: Templock) can be mentioned.

  Subsequently, as shown in FIG. 3 (D), by etching only the opposite side of the film formation surface side of the two film forming glass substrates 10 that are overlapped with the interleaf paper 14 interposed therebetween, The two film forming glass substrates 10 are thinned.

  In this embodiment, the glass substrate 10 for film formation on which 16 lithium battery element composites 12 are formed is subjected to a single-side etching process from about 0.50 to 1.00 mm to 0.03 to 0.10 mm. Thinner to the extent. Even a glass member can be bent by reducing the thickness to 0.10 mm or less. For this reason, it becomes possible to use the glass substrate 10 for film-forming with respect to the product for which flexibility is required.

  In the single-sided etching process, as shown in FIG. 4A, the glass substrate for film formation 10 is introduced into an etching apparatus 50 and is subjected to an etching process with an etching solution containing hydrofluoric acid and hydrochloric acid. In the etching apparatus 50, the single-sided etching of the film-forming glass substrate 10 is performed by bringing the etching solution into contact with one surface of the film-forming glass substrate 10 in the etching chamber 52 while the film-forming glass substrate 10 is being conveyed by the conveyance roller. Processing is performed.

  In addition, since a cleaning chamber is provided in the subsequent stage of the etching chamber 52 in the etching apparatus 50 to wash away the etching solution adhering to the film forming glass substrate 10, the etching solution is removed from the film forming glass substrate 10. In this state, it is discharged from the etching apparatus 50.

  As an example of a method of bringing the etching solution into contact with the film forming glass substrate 10, as shown in FIG. 4A, the etching solution is sprayed on the film forming glass substrate 10 in each etching chamber 52 of the etching apparatus 50. Spray etching to be performed.

  Further, instead of spray etching, as shown in FIG. 4B, it is also possible to adopt a configuration in which the glass substrate 10 for film formation is conveyed while in contact with the overflowed etching solution in the overflow type etching chamber 54. Is possible.

  Furthermore, as shown in FIG. 4C, dip-type etching is employed in which one or a plurality of film forming glass substrates 10 housed in a carrier are immersed in an etching tank 56 containing an etching solution. It is also possible.

  In any case, since the etching rate increases / decreases depending on the concentration of hydrofluoric acid contained in the etching solution, the concentration of hydrofluoric acid is in the range of about 1 wt% to 15 wt% depending on the etching amount. It is important to set When the glass substrate for film formation 10 passes through the etching apparatus 50, the glass substrate for film formation 10 is subjected to a single-side etching process to be thinned.

  In the peeling step after the single-sided etching step, as shown in FIGS. 5A to 5D, the two thin film forming glass substrates 10 are peeled. First, as shown in FIGS. 5A and 5B, the edge of the glass substrate for film formation 10 including the contact portion with the etching resistant sealing member 16 is separated. For example, the edge portion of the glass substrate 10 for film formation may be cut by laser cutting with laser beam irradiation.

  When the edge of the glass substrate for film formation 10 is cut off, the two glass substrates for film formation 10 and the interleaf paper 14 are separated as shown in FIGS. 5C and 5D. Subsequent to separation of the two film forming glass substrates 10 and the interleaf paper 14, a dividing step for dividing the thin film forming glass substrate 10 is performed.

  In the dividing step, as shown in FIGS. 6 (A) and 6 (B), a plurality of lithium battery element composites 12 formed on the film-forming glass substrate 10 are separated into single pieces. The film glass substrate 10 is divided. Since the glass substrate 10 for film formation is thin, it can be divided by performing ablation processing or filamentation processing by irradiating a laser beam. In addition to laser processing, cutting can also be performed by a scrub break process or an etching process.

  Next, an example in which two film forming glass substrates 10 are superposed so as to be in direct contact without interposing the above-described interleaving paper or the like will be described with reference to FIGS. As shown in FIG. 7B, when the two film-forming glass substrates 10 are overlapped with the interleaf paper 14 interposed therebetween, then, as shown in FIG. The gap between the end faces of the substrate 10 is sealed with an etching resistant sealing member 16. Similar to the configuration of FIG. 3 described above, the etching-resistant sealing member 16 has a function of an adhesive for bonding two film-forming glass substrates 10 and a function of a sealing agent (such as a sealing agent for a liquid crystal cell). ) Is preferred. However, an adhesive layer and a sealing agent for bonding the two glass substrate for film formation 10 may be provided separately.

  In the same manner as described above, it is preferable to cover not only the gap between the end surfaces of the two glass substrates 10 for film formation but also the end surfaces themselves with an etching resistant member as necessary. The end face of the glass substrate 10 for film formation can be coated by applying an etching resistant tape or film, applying an etching resistant paint, or the like. As an example of an etching resistant film, various films for electronics (example: EC series) manufactured by Sumilon Co., Ltd. may be mentioned. Moreover, as an example of an etching resistant sealant, an adhesive solution manufactured by Denka Co., Ltd. (example: Templock) can be mentioned.

  Subsequently, as shown in FIG. 8 (A), by etching only the opposite side of the film formation surface side of the two film formation glass substrates 10 that are overlapped with the interleaf paper 14 interposed therebetween, The two film forming glass substrates 10 are thinned. Then, as shown in FIG. 8B, the two thin film forming glass substrates 10 are collectively cut by laser processing. By this dividing process, as shown in FIG. 8C, the two glass substrates for film formation 10 are separated at the same time.

  The process of dividing the two glass substrate 10 for film formation shown in FIG. 8B together by laser processing is generally easier when the above-described slip sheet 14 is not present. However, in the case of using a slip sheet 14 having a characteristic that allows easy passage of the laser beam (for example, a highly transparent slip sheet), the cutting process shown in FIG. 8B is performed even in the presence of the slip sheet 14. Is possible.

  In addition, although illustration is abbreviate | omitted, it replaces with the etching-resistant sealing member 16, or is used together with the etching-resistant sealing member 16, and uses the etching-resistant tape, and the end surface of the film-forming glass substrate 10 and the vicinity of the end surface May be coated. In this case, the frame-like thick plate portion is formed without etching the attachment position of the etching resistant tape, and the lithium battery element composite 12 can be formed without any problem by appropriately cutting the inside of the thick plate portion. The attached glass substrate 10 for film formation can be obtained. Note that the frame-shaped thick plate portion contributes to maintaining the firmness of the thin film-forming glass substrate 10, and thus has an advantage that the film-forming glass substrate 10 can be easily handled. .

  In the above-described method for producing a substrate with a functional film, only the example in which the laminated functional film is a composite of lithium battery elements has been described. However, an organic EL display element stack other than the lithium battery element stack or the solar Even a laminated functional film such as a battery element laminate can be processed by the same method as described above.

  According to the above-mentioned embodiment, since it becomes possible to manufacture a plurality of substrates with a functional film at the same time instead of manufacturing a single substrate with a functional film, the manufacturing efficiency of the substrate with a functional film is improved. Is possible. In addition, since it is possible to appropriately reduce the thickness of a substrate having a plurality of laminated functional films, it is possible to achieve both a reduction in the thickness of a film-forming substrate and an improvement in manufacturing efficiency at the same time.

  The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

10-Substrate for film formation 12-Element composite for lithium battery 14-Interleaf 16-Etching resistant sealing member

Claims (3)

A method for producing a substrate with a functional film including a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar battery,
A first film-forming insulating substrate and a second film-forming insulating substrate each having a plurality of stacked functional films formed thereon are arranged close to each other with their film-forming surfaces facing each other. And the steps
A second step of sealing a gap between end faces of the first film-forming insulating substrate and the second film-forming insulating substrate, which are disposed in proximity, with an etching-resistant sealing member;
Only the opposite side of the film-forming surface side of each of the first film-forming insulating substrate and the second film-forming insulating substrate arranged in proximity is etched. A third step of thinning the insulating substrate for film and the second insulating substrate for film formation;
A fourth step of separating the thin film-forming insulating substrate and the second film-forming insulating substrate which have been reduced in thickness;
A method for producing a substrate with a functional film comprising at least   2. The fourth step, wherein the first film-forming insulating substrate and the second film-forming insulating substrate that are arranged close to each other are divided together by laser processing. The manufacturing method of the board | substrate with a functional film of description.   The functional film according to claim 1 or 2, wherein in the first step, a slip sheet is interposed between the first film-forming insulating substrate and the second film-forming insulating substrate. A method for manufacturing a substrate.

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