JP2022070521A - Method for manufacturing substrate having functional film - Google Patents

Abstract

To provide a method for manufacturing a substrate having a functional film, capable of both thinning a film deposition substrate and improving producibility.SOLUTION: A method for manufacturing a substrate having a functional film according to the present invention comprises: a first step of facing the surfaces to be deposited of first and second film deposition insulating substrates to be adjacently arranged; a second step of sealing a gap between the end surfaces of the first and second film deposition insulating substrates with an etching resistant sealing member; a third step of etching only the side opposite to the side of a surface to be deposited in each of the first and second film deposition insulating substrates; a fourth step of bonding a transparent resin film for warpage prevention on the surfaces to be etched in the thinned first and second film deposition insulating substrates; and a fifth step of separating the first and second film deposition insulating substrates.SELECTED DRAWING: Figure 8

Description

The present invention relates to a method for manufacturing a substrate with a functional film provided with a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell.

In recent years, film formation technology has been widely used in various fields related to the manufacture of electrical products, including the manufacturing process of lithium batteries, the manufacturing process of solar cell panels, the manufacturing process of organic EL display panels, the manufacturing process of semiconductors, and the like. .. In the film forming process of such an electric product, the processing temperature is usually high, and high heat resistance is often required for the material used as the film forming substrate.

Therefore, as the film-forming substrate, an insulating substrate having heat resistance such as glass, ceramics, and silicate minerals (mica, etc.) may be used. For example, in a lithium battery, a method of forming a plurality of element complexes including an electrode layer on a glass film-forming substrate may be adopted (see, for example, Patent Document 1). Further, some organic EL display panels also use a glass film forming substrate in order to facilitate the handling of the organic resin film in the film forming process (see, for example, Patent Document 2).

Patent No. 4465578 Japanese Unexamined Patent Publication No. 2016-004112 Japanese Unexamined Patent Publication No. 2019-006635

However, in the conventional method for manufacturing a substrate with a functional film, there is a demand for further thinning of the substrate and improvement in manufacturing efficiency, but so far, the demand for improvement in manufacturing efficiency has been sufficiently met. I couldn't say.

For example, due to restrictions in handling in the manufacturing process, when the film-forming substrate is thin, in most cases a single laminated functional film is formed on each of the single film-forming substrates. be.

On the other hand, when a plurality of laminated functional films for electric appliances are formed on a relatively large size film-forming substrate and then the substrate with the functional film is multi-chamfered, a thick plate is used as the film-forming substrate. Often they were forced to use the materials of.

An object of the present invention is to provide a method for manufacturing a substrate with a functional film, which can achieve both a thinning of a film-forming substrate and an improvement in manufacturing efficiency.

The method for manufacturing a substrate with a functional film according to the present invention is a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell (for example, a laminated functional film for an electric product). ) Shall be manufactured, and includes the following first to fifth steps. Glass is a typical example of the material of the substrate with a functional film, but it is also possible to use an inorganic material (ceramics, silicate mineral, etc.) other than glass.

In the first step, the first film-forming insulating substrate and the second film-forming insulating substrate on which a plurality of laminated functional films are each formed are opposed to each other on the surface to be filmed. Place in close proximity.

Here, the proximity arrangement refers to the case where the first film-forming insulating substrate and the second film-forming insulating substrate are directly overlapped with each other, or the first film-forming insulating substrate and the second film-forming insulating substrate are arranged. It is interpreted to include the case where inclusions such as interstitial paper are interposed between the insulating substrates for film formation and indirectly overlapped with each other.

When the interleaving paper is present, the first film-forming insulating substrate and the second film-forming insulating substrate can be easily separated, and the elements and wiring can be protected.

In the second step, the gap between the end faces of the first film-forming insulating substrate and the second film-forming insulating substrate, which are closely arranged, is sealed with an etching-resistant sealing member. Examples of the etching-resistant sealing member include an etching-resistant sealing agent, an etching-resistant tape, and an etching-resistant film.

In the third step, the first step is to etch only the opposite side of the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged in close proximity to each other, on the opposite side of the film-formed surface side. The insulating substrate for film formation and the second insulating substrate for film formation are made thinner. When the first insulating substrate for film formation and the insulating substrate for film formation have bending characteristics, the plate thickness thereof is about 0.05 to 0.20 mm (in the case of glass, the plate thickness). It is more preferable to reduce the thickness to 0.05 to 0.10 mm.).

In this etching process, an etching solution capable of dissolving the first insulating substrate for film formation and the second insulating substrate for film formation is appropriately adopted. When the insulating substrate for film formation is glass, an etching solution containing hydrofluoric acid is used for the single-sided etching treatment.

In the fourth step, a transparent resin film for preventing warpage is attached to the etched surfaces of the thinned first insulating substrate for film formation and the second insulating substrate for film formation.

The transparent resin film is preferably a film that does not need to be peeled off from the first film-forming insulating substrate and the second film-forming insulating substrate, such as a polarizing film, a touch panel film, and a surface protective film.

Subsequently, in the fifth step, the first film-forming insulating substrate to which the transparent resin film is attached and the second film-forming insulating substrate are separated.

By performing these first to fifth steps in this order, it is possible to simultaneously reduce the thickness of the film-forming insulating substrate having the plurality of laminated functional films while protecting the plurality of laminated functional films.

Therefore, it is possible to manufacture a plurality of substrates with a functional film at one time, and it is also possible to reduce the thickness of the substrate with a functional film. In particular, since it is possible to process two insulating substrates for film formation at the same time, it is easy to improve productivity.

However, when the first film-forming insulating substrate and the second film-forming insulating substrate are separated, the thickness of the first film-forming insulating substrate and the second film-forming insulating substrate becomes very thin. (For example, when the thickness is 0.1 mm or less) and the rigidity is small, the laminated functional film is used for the first film-forming insulating substrate and the second film-forming insulating substrate on the film-forming surface side, respectively. There was a risk that the first film-forming insulating substrate and the second film-forming insulating substrate would be curved (curled) due to the applied force.

On the other hand, in the present invention, by applying the force that the transparent resin film tends to shrink to the first film-forming insulating substrate and the second film-forming insulating substrate, the film-forming surface side. The first film-forming insulating substrate and the second film-forming insulating substrate are subjected to the forces applied from the laminated functional film to the first film-forming insulating substrate and the second film-forming insulating substrate, respectively. Curling of the sex substrate is suppressed.

Further, in the third step of the above-mentioned method for manufacturing a substrate with a functional film, the first film-forming insulating substrate and the second film-forming insulating substrate are glass substrates, and the first film-forming insulating substrate is used. It is preferable to reduce the thickness of the sex substrate and the second insulating substrate for film formation so as to be 0.1 mm or less.

Further, in the above-mentioned fifth step, it is preferable that the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged in close proximity to each other, are collectively separated by laser processing.

The reason is that the thinned first insulating substrate for film formation and the second insulating substrate for film formation are easily separated by the laser processing. Further, by appropriately performing the laser processing, it is possible to cut the interleaving paper and the transparent resin film at the same time as the first insulating substrate for film formation and the second insulating substrate for film formation.

According to the present invention, in the manufacture of a substrate with a functional film having a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell, a thin film-forming substrate is manufactured. It is possible to achieve both the conversion and improvement of manufacturing efficiency.

It is a figure which shows the schematic structure of the film-forming substrate which concerns on one Embodiment of this invention. It is a schematic diagram which shows an example of the state in which two film-forming substrates are overlapped. It is a schematic diagram which shows an example of the state in which two film-forming substrates are overlapped. It is a figure which shows an example of the etching apparatus used for the single-sided etching process for a film-forming substrate. It is a figure which shows an example of the division process with respect to the film-forming substrate. It is a figure which shows an example of the division process with respect to the film-forming substrate. It is a schematic diagram which shows the state which the ultra-thin film-forming substrate is curved. It is a figure which shows the state which applied the transparent resin film to the film-forming substrate. It is a figure which shows the state which applied the transparent resin film to the film-forming substrate. It is a schematic diagram which shows the other example of the state in which two film-forming substrates are overlapped. It is a figure which shows another example of the fragmentation process with respect to the film-forming substrate. It is a figure which shows the example of still another embodiment of this invention.

Hereinafter, an embodiment of a method for manufacturing a substrate with a functional film according to the present invention will be described with reference to the drawings. Here, as an example of the method for manufacturing a substrate with a functional film according to the present invention, a method for manufacturing a substrate having a laminated functional film made of an element laminate for an organic EL display will be described.

1 (A) to 1 (C) show an outline of a film-forming glass substrate 10 (corresponding to the substrate with a functional film of the present invention) in the manufacturing process of an organic EL display according to an embodiment of a substrate with a functional film. The configuration is shown.

In this embodiment, glass is used as the material of the substrate with a functional film, but in addition to glass, the insulating substrate silicon (Si), silicon dioxide (SiO ₂ ), ceramics, silicate minerals (mammalia, etc.) As long as it is an insulating substrate having heat resistance and can be dissolved by an etching solution containing hydrofluoric acid or the like, it can be appropriately adopted as a substrate for film formation.

A plurality of organic EL display element laminates 12 are formed on the film-forming glass substrate 10. In this embodiment, an example is shown in which the organic EL display element laminate 12 is arranged in a matrix of 4 rows × 4 columns to form 16 organic EL display element laminates 12, but the organic EL display is shown. The arrangement of the element laminate 12 is not limited to this.

Each organic EL display element laminate 12 includes a positive electrode layer 122, an organic EL element layer 124, and a negative electrode layer 126 formed on a film-forming glass substrate 10.

The positive electrode layer 122, the organic EL element layer 124, and the negative electrode layer 126 are described by known techniques, for example, a vacuum deposition method, an ion plating method, a CVD method, a dry film forming method such as sputtering, or an electrolytic plating method or no electrolysis. It is sequentially formed on the film-forming glass substrate 10 by a wet film-forming method such as a plating method.

When manufacturing the film-forming glass substrate 10 having the organic EL display element laminate 12, first, as shown in FIGS. 2A and 2B, a plurality of organic EL display element laminates are laminated. Two sheets of film-forming glass 10 on which the body 12 is formed are prepared, and these two film-forming glass substrates 10 are superposed on each other with their surfaces to be film-formed facing each other.

When stacking two glass substrates 10 for film formation, one is to stack them so that they are indirect contact with each other with a sheet of paper sandwiched between them, and the other is to stack them so that they are in direct contact with each other without interposing a sheet of paper or the like. It is possible to match.

3 (A) to 3 (D) show an example in which the glass substrate 10 for film formation is indirectly overlapped with the interleaving paper 14 sandwiched between them. Here, as the interleaving paper 14, a high-performance material such as an FPD interleaving paper (for example, manufactured by Tokushu Tokai Paper Co., Ltd.) is used, but ordinary printing paper, film, or the like can also be used. The purpose of using the interleaving paper 14 is to protect wiring and elements, improve the peelability between the glass substrates 10 for film formation, and the like.

As shown in FIG. 3 (B), when two film forming glass substrates 10 are stacked with the interleaving paper 14 interposed therebetween, then, as shown in FIG. 3 (C), two sheets of film forming glass are laminated. The gap between the end faces of the substrate 10 is sealed with the etching resistant sealing member 16.

The etching-resistant sealing member 16 preferably has both an adhesive function for adhering two film-forming glass substrates 10 and a sealing agent function (such as a liquid crystal cell sealant). However, the adhesive layer for adhering the two film-forming glass substrates 10 and the sealing agent may be provided separately.

Simply sealing the gap between the end faces of the two film-forming glass substrates 10 with the etching-resistant sealing member 16 may cause the end faces of the film-forming glass substrate 10 to be etched, which may cause a problem. Conceivable. Therefore, not only the gap between the end faces but also the end faces themselves may be covered with an etching resistant member as needed.

The end face of the film-forming glass substrate 10 can be coated by attaching an etching-resistant tape or film, applying an etching-resistant paint, or the like. An example of an etching resistant film is a film for various electronics manufactured by Sumiron Co., Ltd. (example: EC series). Further, as an example of the etching resistant encapsulant, an adhesive solution manufactured by Denka Corporation (eg, Templock) can be mentioned.

Subsequently, as shown in FIG. 3D, only the opposite side of the two glass substrates 10 for film formation, which are overlapped with each other with the interleaving paper 14 sandwiched between them, is etched. The two glass substrates 10 for film formation are made thinner.

In this embodiment, the film-forming glass substrate 10 on which the 16 organic EL display element laminates 12 are formed is subjected to single-sided etching treatment from about 0.50 to 1.00 mm to 0.03 to 0. Reduce the thickness to about 10 mm. Even a glass member can be bent by reducing the thickness to 0.10 mm or less. Therefore, the glass substrate 10 for film formation can be used for products that require flexibility.

In the single-sided etching process, as shown in FIG. 4A, the film-forming glass substrate 10 is introduced into the etching apparatus 50 and subjected to the etching process with an etching solution containing hydrofluoric acid, hydrochloric acid and the like. In the etching apparatus 50, while the film-forming glass substrate 10 is conveyed by the conveying roller, the etching solution is brought into contact with one side of the film-forming glass substrate 10 in the etching chamber 52 to perform single-sided etching on the film-forming glass substrate 10. Processing is done.

Since a cleaning chamber for washing away the etching solution adhering to the film forming glass substrate 10 is provided in the subsequent stage of the etching chamber 52 in the etching apparatus 50, the etching solution is removed from the film forming glass substrate 10. It is discharged from the etching apparatus 50 in a state of being.

As an example of the method of bringing the etching solution into contact with the film forming glass substrate 10, as shown in FIG. 4A, the etching solution is sprayed on the film forming glass substrate 10 in each etching chamber 52 of the etching apparatus 50. Spray etching can be mentioned.

Further, instead of spray etching, as shown in FIG. 4B, it is also possible to adopt a configuration in which the film forming glass substrate 10 is conveyed while in contact with the overflowed etching solution in the overflow type etching chamber 54. It is possible.

Further, as shown in FIG. 4C, dip-type etching is adopted in which a single or a plurality of film-forming glass substrates 10 housed in a carrier are immersed in an etching tank 56 in which an etching solution is stored. It is also possible.

In either case, the etching rate increases or decreases depending on the concentration of hydrofluoric acid contained in the etching solution. Therefore, the optimum concentration of hydrofluoric acid is in the range of 1% by weight to 15% by weight depending on the etching amount. It is important to set it to. When the film-forming glass substrate 10 passes through the etching apparatus 50, the film-forming glass substrate 10 is subjected to single-sided etching to reduce the thickness.

In the peeling step after the single-sided etching step, as shown in FIGS. 5 (A) to 5 (D), the two thinned glass substrates 10 for film formation are peeled off. First, as shown in FIGS. 5A and 5B, the edge portion of the film-forming glass substrate 10 including the contact portion with the etching-resistant sealing member 16 is separated. For the separation of the edge portion of the film-forming glass substrate 10, for example, it is preferable to perform a laser cutting process of irradiating a laser beam.

When the edge portion of the film-forming glass substrate 10 is separated, the two film-forming glass substrates 10 and the interleaving paper 14 are separated as shown in FIGS. 5 (C) and 5 (D). Following the separation of the two film-forming glass substrates 10 and the interleaving paper 14, a division step of dividing the thinned film-forming glass substrate 10 is executed.

In the dividing step, as shown in FIGS. 6 (A) and 6 (B), the plurality of organic EL display element laminates 12 formed on the film-forming glass substrate 10 are separated into a single piece. The film-forming glass substrate 10 is divided.

Since the film-forming glass substrate 10 is thinned, it can be divided by irradiating it with a laser beam and performing an ablation treatment, a filtration treatment, or the like. In addition to laser processing, it can also be divided by scrub break processing, etching processing, and the like.

By the method as described above, it is possible to reduce the thickness of two glass substrates 10 for film formation to 0.10 mm or less at the same time. That is, it is possible to simultaneously realize the ultra-thinning of the film-forming glass substrate 10 and the efficiency of manufacturing.

However, as a result of the film-forming glass substrate 10 becoming ultra-thin, the rigidity of the film-forming glass substrate 10 is lost, and as a result, when the two film-forming glass substrates 10 are separated, FIGS. 7 (A) to 7A. As shown in FIG. 7C, the inconvenience that the film forming glass substrate 10 is curved (curled) may occur.

The reason is that the force applied from the film-formed organic EL display element laminate 12 to the film-forming glass substrate 10 (usually, it is generated on the film-forming surface side due to the film-forming portion trying to shrink. This is because the rigidity to the extent that it opposes the force caused by the compressive stress) is reduced by making the film-forming glass substrate 10 ultra-thin.

Therefore, with reference to FIGS. 8 and 9, the measures for curling the glass substrate 10 for film formation at the time of ultra-thinning will be described below.

FIG. 8A shows a film forming glass substrate 10 which has been made ultra-thin so that the thickness becomes 0.10 mm or less by the above-mentioned etching treatment. The film-forming glass substrate 10 has already lost the rigidity to counter the force from the film-forming portion, but the force balance is somehow balanced by the two sheets of the film-forming glass substrate 10 being bonded together. It is kept.

In FIG. 8B, the transparent resin film 18 for straightening is attached to the surface to be etched of the glass substrate 10 for film formation in a state where the two glass substrates 10 for film formation are bonded to each other.

Normally, the transparent resin film 18 is attached to the film forming glass substrate 10 while being heated. The transparent resin film 18 preferably has a heat-shrinkable property. When the heat cools, the resin shrinks more easily with heat dissipation than glass, so that a force is generated on the surface side to which the transparent resin film 18 is attached to counteract the force applied from the organic EL display element laminate 12. become.

An example of the transparent resin film 18 is a polarizing film. In addition to the polarizing film, it is also possible to use a film that can be used as it is in a final product to which the film-forming glass substrate 10 is applied, such as a touch panel film and a surface protection film.

Usually, the polarizing film is composed of a polarizing layer obtained by adding iodine to polyvinyl alcohol, a protective layer which is a transparent film for protecting polyvinyl alcohol, and a plurality of layers such as an adhesive layer for sticking to a substrate in a laminated state.

That is, any polarizing film may be used as long as it contains a heat-shrinkable transparent film member in this laminated structure. As the heat-shrinkable transparent film, a stretched film stretched along the direction of the force to be applied to the film-forming glass substrate 10 can be used.

For example, an acrylic film, a polycarbonate film, a vinyl chloride film, a polyimide film, a polypropylene film, or a stretched polyester film can be used.

The transparent resin film 18 is attached to two film-forming glass substrates 10 by a known attachment device. The thickness of the transparent resin film 18 may be appropriately determined according to the magnitude of the force to be applied to the film forming glass substrate 10, and generally, a thickness in the range of about 50 to 500 μm may be adopted.

If the transparent resin film 18 does not have a thickness of 50 μm or more, the heat shrinkage force at the time of heating is not sufficient, so that the effect of preventing bending of the film-forming glass substrate 10 is limited. On the other hand, if the thickness is 500 μm or more, there is a risk of hindering the compactification of the final product to which the film-forming glass substrate 10 is applied.

As a method for attaching the transparent resin film 18 to the film-forming glass substrate 10, a conventional method can be used. The film-forming glass substrate 10 may be solidly attached to the entire surface to be etched, or may be attached only to positions corresponding to a plurality of regions used as the substrate of the final product.

When affixing only to a position corresponding to a plurality of areas used as a substrate of a final product, for example, a plurality of transparent resin films 18 set at predetermined positions on the peripheral surface of a roller for affixing are attached to this roller. It may be offset with respect to the film forming glass substrate 10 which is conveyed so as to be in contact with the film.

Here, as an example of the means for heating the transparent resin film 18, an autoclave may be used.

The autoclave is a device for removing air bubbles between the glass substrate and the polarizing film generated when the transparent resin film 18 is attached by putting the film-forming glass substrate 10 into a high-temperature and high-pressure tank.

The heating temperature of the transparent resin film 18 can be adjusted in the autoclave. If a plurality of heaters are installed in the heating tank of the autoclave, the polarizing film can be heated at a desired temperature by adjusting the heating temperatures thereof.

Further, it is preferable to adjust the heating temperature in the autoclave to 60 ° C. or higher and 100 ° C. or lower. When heated at 100 ° C. or higher, the characteristics of the transparent resin film 18 cannot be maintained. Further, when heated at 60 ° C. or lower, the heat shrinkage force of the transparent resin film 18 becomes small, so that it becomes difficult to keep the glass substrate 10 for film formation flat.

By applying the transparent resin film 18 to the film-forming glass substrate 10, it becomes possible to balance the front and back of the film-forming glass substrate 10 after the film-forming glass substrate 10 is separated, and the film-forming glass can be balanced. The occurrence of curl of the substrate 10 is prevented.

Moreover, since the transparent resin film 18 can be used as it is in the final product as a polarizing film, it does not need to be peeled off from the film forming glass substrate 10. Therefore, it is possible to efficiently make the film-forming glass substrate 10 ultra-thin and prevent the occurrence of bending (curl) at that time without complicating the manufacturing process.

Subsequently, with reference to FIGS. 10 and 11, an example of superimposing the two glass substrates 10 for film formation so as to be in direct contact with each other without interposing the above-mentioned interleaving paper or the like will be described. As shown in FIG. 10B, when the two film-forming glass substrates 10 are stacked without sandwiching the above-mentioned interleaving paper 14, the two sheets are subsequently formed as shown in FIG. 10C. The gap between the end faces of the film glass substrate 10 is sealed with the etching resistant sealing member 16.

Similar to the configuration of FIG. 3 described above, the etching-resistant sealing member 16 has both an adhesive function for adhering two film-forming glass substrates 10 and a sealing agent function (seal agent for liquid crystal cells, etc.). ) Is preferable. However, the adhesive layer for adhering the two film-forming glass substrates 10 and the sealing agent may be provided separately.

Similar to the above, it is preferable to cover not only the gap between the end faces of the two film-forming glass substrates 10 but also the end faces themselves with an etching-resistant member, if necessary. The end face of the film-forming glass substrate 10 can be coated by attaching an etching-resistant tape or film, applying an etching-resistant paint, or the like.

An example of an etching resistant film is a film for various electronics manufactured by Sumiron Co., Ltd. (example: EC series). Further, as an example of the etching resistant encapsulant, an adhesive solution manufactured by Denka Corporation (eg, Templock) can be mentioned.

Subsequently, as shown in FIG. 11A, the two glass substrates 10 for film formation are thinned by etching only the opposite side of the two glass substrates 10 for film formation on the side opposite to the surface to be filmed. Be made.

Then, as shown in FIG. 11B, the two thinned glass substrates 10 for film formation are collectively separated by laser processing. By this dividing process, as shown in FIG. 11C, the two film forming glass substrates 10 are separated from each other at the same time.

The process of collectively dividing the two film-forming glass substrates 10 shown in FIG. 11B by a laser processing process is generally easier to perform in the absence of the above-mentioned interleaving paper 14. However, when a slip sheet 14 having a characteristic of easily passing a laser beam (for example, a highly transparent slip sheet or the like) is used, the dividing process as shown in FIG. 11B is performed even in the presence of the slip sheet 14. It is possible to do.

Further, as shown in FIGS. 12A to 12C, the etching resistant tape 22 is used in place of the etching resistant sealing member 16 or together with the etching resistant sealing member 16. The end face of the film glass substrate 10 and the vicinity of the end face may be covered.

In this case, a frame-shaped thick plate portion is formed without etching the attachment position of the etching resistant tape 22, but by appropriately cutting the inside of the thick plate portion, there is no problem in stacking elements for an organic EL display. A film-forming glass substrate 10 with 12 can be obtained.

Since the frame-shaped thick plate portion contributes to maintaining the firmness of the thinned glass substrate 10 for film formation, there is also an advantage that the glass substrate 10 for film formation can be easily handled. ..

In the above-mentioned method for manufacturing a substrate with a functional film, only an example in which the laminated functional film is an organic EL display element laminate has been described, but a composite of lithium battery elements other than the organic EL display element laminate and Even a laminated functional film such as an element laminate for a solar cell can be treated by the same method as described above.

According to the above-described embodiment, it is possible to simultaneously manufacture a plurality of substrates with a functional film instead of manufacturing a single substrate with a functional film, thereby improving the manufacturing efficiency of the substrate with a functional film. Will be possible. Moreover, since it is possible to appropriately reduce the thickness of the substrate having a plurality of laminated functional films, it is possible to reduce the thickness of the film-forming substrate and improve the manufacturing efficiency at the same time.

The description of the embodiments described above should be considered exemplary in all respects and not restrictive. The scope of the invention is indicated by the claims, not by the embodiments described above. Furthermore, the scope of the invention is intended to include all modifications within the meaning and scope of the claims.

10-Substrate for film formation 12-Laminate of elements for organic EL display 14-Interlace 16-Etching resistant sealing member 18-Transparent resin film 22-Etching resistant tape

Claims (3)

A method for manufacturing a substrate with a functional film, which comprises a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell.
A first film-forming insulating substrate on which a plurality of laminated functional films are formed and a second film-forming insulating substrate are arranged close to each other with their surfaces to be film-formed facing each other. Steps and
A second step of sealing the gap between the end faces of the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged close to each other, with an etching-resistant sealing member.
The first formation is performed by etching only the opposite side of the first film-forming insulating substrate and the second film-forming insulating substrate arranged close to each other on the surface to be film-formed. The third step of thinning the insulating substrate for film and the second insulating substrate for film formation, and
A fourth step of attaching a transparent resin film for preventing warpage to the surface to be etched in the first thinning insulating substrate for film formation and the second insulating substrate for film formation, and the fourth step.
A fifth step of separating the first film-forming insulating substrate to which the transparent straightening film is attached and the second film-forming insulating substrate, and the fifth step.
A method for manufacturing a substrate with a functional film including at least. In the third step, the first film-forming insulating substrate and the second film-forming insulating substrate are glass substrates, and the first film-forming insulating substrate and the second film-forming insulating substrate are formed. The method for manufacturing a substrate with a functional membrane according to claim 1, wherein the thickness of the insulating substrate for a membrane is reduced to 0.1 mm or less. Claim 1 is characterized in that, in the fifth step, the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged in close proximity to each other, are collectively separated by a laser processing process. Alternatively, the method for manufacturing a substrate with a functional film according to 2.

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