JP2019001138A - Molding jig and manufacturing method of cured product of photocurable resin - Google Patents
Molding jig and manufacturing method of cured product of photocurable resin Download PDFInfo
- Publication number
- JP2019001138A JP2019001138A JP2017120316A JP2017120316A JP2019001138A JP 2019001138 A JP2019001138 A JP 2019001138A JP 2017120316 A JP2017120316 A JP 2017120316A JP 2017120316 A JP2017120316 A JP 2017120316A JP 2019001138 A JP2019001138 A JP 2019001138A
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- Prior art keywords
- photocurable resin
- meth
- light
- resin
- light shielding
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- 229920005989 resin Polymers 0.000 title claims abstract description 122
- 239000011347 resin Substances 0.000 title claims abstract description 122
- 238000000465 moulding Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 125000006850 spacer group Chemical group 0.000 claims abstract description 40
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000000016 photochemical curing Methods 0.000 claims description 12
- 238000011049 filling Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 44
- 239000003822 epoxy resin Substances 0.000 description 44
- 229920000647 polyepoxide Polymers 0.000 description 44
- -1 acryl Chemical group 0.000 description 40
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 23
- 238000000034 method Methods 0.000 description 20
- 239000000178 monomer Substances 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 17
- 238000001723 curing Methods 0.000 description 15
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 12
- 125000002947 alkylene group Chemical group 0.000 description 12
- 230000001588 bifunctional effect Effects 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 125000002723 alicyclic group Chemical group 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 239000005357 flat glass Substances 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- TXZNVWGSLKSTDH-XCADPSHZSA-N (1Z,3Z,5Z)-cyclodeca-1,3,5-triene Chemical class C1CC\C=C/C=C\C=C/C1 TXZNVWGSLKSTDH-XCADPSHZSA-N 0.000 description 1
- XHXSXTIIDBZEKB-UHFFFAOYSA-N 1,2,3,4,5,6,7,8-octamethylanthracene-9,10-dione Chemical compound CC1=C(C)C(C)=C2C(=O)C3=C(C)C(C)=C(C)C(C)=C3C(=O)C2=C1C XHXSXTIIDBZEKB-UHFFFAOYSA-N 0.000 description 1
- JWTGRKUQJXIWCV-UHFFFAOYSA-N 1,2,3-trihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(O)C(O)CO JWTGRKUQJXIWCV-UHFFFAOYSA-N 0.000 description 1
- GNRPVZNNVOGXHD-UHFFFAOYSA-N 1,2-dimethylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=C(C)C(C)=CC=C3C(=O)C2=C1 GNRPVZNNVOGXHD-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- LMGYOBQJBQAZKC-UHFFFAOYSA-N 1-(2-ethylphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 LMGYOBQJBQAZKC-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- LZWVPGJPVCYAOC-UHFFFAOYSA-N 2,3-diphenylanthracene-9,10-dione Chemical compound C=1C=CC=CC=1C=1C=C2C(=O)C3=CC=CC=C3C(=O)C2=CC=1C1=CC=CC=C1 LZWVPGJPVCYAOC-UHFFFAOYSA-N 0.000 description 1
- ZIHDWZZSOZGDDK-UHFFFAOYSA-N 2-(2,3-dihydroxy-2-phenylpropanoyl)benzenesulfonic acid Chemical compound OCC(C(C=1C(=CC=CC=1)S(=O)(=O)O)=O)(O)C1=CC=CC=C1 ZIHDWZZSOZGDDK-UHFFFAOYSA-N 0.000 description 1
- NSWNXQGJAPQOID-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical class ClC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSWNXQGJAPQOID-UHFFFAOYSA-N 0.000 description 1
- UIHRWPYOTGCOJP-UHFFFAOYSA-N 2-(2-fluorophenyl)-4,5-diphenyl-1h-imidazole Chemical class FC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 UIHRWPYOTGCOJP-UHFFFAOYSA-N 0.000 description 1
- JVCBVNUOEFLXGK-UHFFFAOYSA-N 2-(2-methoxyphenyl)-1h-imidazole Chemical class COC1=CC=CC=C1C1=NC=CN1 JVCBVNUOEFLXGK-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- SNFCQJAJPFWBDJ-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class C1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 SNFCQJAJPFWBDJ-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NPRYHWFMGPYJIY-UHFFFAOYSA-N 2-cyclohexyloxirane Chemical compound C1OC1C1CCCCC1 NPRYHWFMGPYJIY-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- NTZCFGZBDDCNHI-UHFFFAOYSA-N 2-phenylanthracene-9,10-dione Chemical compound C=1C=C2C(=O)C3=CC=CC=C3C(=O)C2=CC=1C1=CC=CC=C1 NTZCFGZBDDCNHI-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 1
- YMVIYCFGOTYKGI-UHFFFAOYSA-N OC.OC.C1CCCCCCCCC1 Chemical compound OC.OC.C1CCCCCCCCC1 YMVIYCFGOTYKGI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- SEEVRZDUPHZSOX-UHFFFAOYSA-N [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(C)=NOC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-UHFFFAOYSA-N 0.000 description 1
- ARNIZPSLPHFDED-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-(4-methoxyphenyl)methanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 ARNIZPSLPHFDED-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 150000001251 acridines Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- IMNFDUFMRHMDMM-UHFFFAOYSA-N anhydrous n-heptane Natural products CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical class C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- KTPIWUHKYIJBCR-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-4-ene-1,2-dicarboxylate Chemical compound C1C=CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KTPIWUHKYIJBCR-UHFFFAOYSA-N 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- ULAUBQTVYAVTFT-UHFFFAOYSA-N dinitro carbonate Chemical compound [O-][N+](=O)OC(=O)O[N+]([O-])=O ULAUBQTVYAVTFT-UHFFFAOYSA-N 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- QKLCQKPAECHXCQ-UHFFFAOYSA-N ethyl phenylglyoxylate Chemical compound CCOC(=O)C(=O)C1=CC=CC=C1 QKLCQKPAECHXCQ-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- OTRIMLCPYJAPPD-UHFFFAOYSA-N methanol prop-2-enoic acid Chemical compound OC.OC.OC(=O)C=C.OC(=O)C=C OTRIMLCPYJAPPD-UHFFFAOYSA-N 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- XZHHMXJAOXVQPW-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)-2-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC=CC=C1N(CC1OC1)CC1OC1 XZHHMXJAOXVQPW-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本発明は、成形治具及び光硬化性樹脂硬化物の製造方法に関する。 The present invention relates to a molding jig and a method for producing a photocurable resin cured product.
所望の立体形状を有する成形品を得る手法として、液状樹脂である熱硬化性樹脂又は光硬化性樹脂を成形治具に充填した後、その液状樹脂を硬化させる手法が知られている。硬化性樹脂と光硬化性樹脂の何れを用いた場合でも、液状樹脂から成形した成形品には、硬化収縮による体積減少(以下、「引け」という)を生じることがある。引けは、美観を損ねたり、意図した形状及び/又は寸法を出せないといった問題の要因となる。引けを抑制するため、従来、液状樹脂に充填材を配合して成形を行っている。 As a technique for obtaining a molded product having a desired three-dimensional shape, a technique is known in which a liquid resin is cured with a thermosetting resin or a photocurable resin, and then the liquid resin is cured. Regardless of whether a curable resin or a photocurable resin is used, a volume reduction (hereinafter referred to as “shrunk”) may occur in a molded product molded from a liquid resin due to curing shrinkage. The close-up causes problems such as loss of aesthetics and failure to produce the intended shape and / or dimensions. In order to suppress the shrinkage, conventionally, molding is performed by blending a filler with a liquid resin.
光硬化性樹脂は、熱硬化性樹脂よりも硬化収縮が大きいものの、光学特性に優れていることから、光硬化性樹脂を用いた光学部品等の高精度部品への要求が高まっている。しかし、光硬化性樹脂に充填材を多量に配合すると光学特性を悪化させるため、光硬化性樹脂を用いた光学部品等の製造に際しては、充填材を多量に配合して引けを抑制する手法は採用できない。 Although a photocurable resin has a larger curing shrinkage than a thermosetting resin, it is excellent in optical characteristics, so that there is an increasing demand for high-precision components such as optical components using the photocurable resin. However, when a large amount of filler is added to the photocurable resin, the optical properties are deteriorated. Therefore, when manufacturing optical parts using a photocurable resin, a method for suppressing the shrinkage by adding a large amount of the filler is Cannot be adopted.
光硬化性樹脂の引けに起因する上記の問題(美観を損ねたり、意図した形状、寸法を出せない、といった問題)を抑制する手法として、特許文献1には、樹脂供給バルブを介して樹脂保持空間に光硬化性樹脂を充填した後に、光源から光を照射して、樹脂保持空間の光硬化性樹脂硬化させて成形体を得る装置において、前記樹脂供給バルブの内部に突出しピンを挿通して備え、樹脂保持空間の光硬化性樹脂が完全に硬化する前に、この突出しピンを樹脂保持空間の光硬化性樹脂に押圧して凹部を形成する方法、すなわち、凹部を形成することで樹脂保持空間の光硬化性樹脂を押圧し、光硬化性樹脂を樹脂保持空間に沿った形状にすることで、硬化収縮よる体積減少である「引け」が発生した場合であっても、成形品の形状を樹脂保持空間に対応する意図した形状とすることを可能とする技術が開示されている。 As a technique for suppressing the above-mentioned problems caused by photocuring resin shrinkage (problems such as loss of aesthetics or inability to obtain the intended shape and dimensions), Patent Document 1 discloses a resin holding via a resin supply valve. After filling the space with a photocurable resin, light is irradiated from the light source to cure the photocurable resin in the resin holding space to obtain a molded body. Before the photocurable resin in the resin holding space is completely cured, the protruding pin is pressed against the photocurable resin in the resin holding space to form a recess, that is, the resin is held by forming the recess. Even if the shrinkage, which is a volume reduction due to curing shrinkage, occurs by pressing the photocurable resin in the space and forming the photocurable resin along the resin holding space, the shape of the molded product To the resin holding space Possible and a technique that the intended shape to have been disclosed.
特許文献1の技術は、樹脂板又は金属板のような対象物の表面に光硬化性樹脂の硬化物を成形するもので、樹脂供給バルブを介して光硬化性樹脂を充填する樹脂保持空間は、前記対象物と、光を透過する導光型(透明成形型)と、突出しピン付き樹脂供給バルブによって構成される。この方法では、樹脂保持空間にわずかな漏れがあると、突出しピンの突出しによる圧力が樹脂保持空間内の光硬化性樹脂に十分に伝わらず、成形品の形状が樹脂保持空間に対応する意図した形状とならない問題があった。
また、特許文献1の技術は、常温下で流動性を示す比較的低分子量の光硬化性樹脂を用いることを前提としているが、このような光硬化性樹脂は、突出しピンの突出し時に樹脂保持空間から漏れやすい傾向にある。この現象を回避するために、樹脂保持空間内の光硬化性樹脂をある程度硬化させ、粘度を高めてから、突出しピンを突出すると、光硬化性樹脂内を圧力が均一に伝わらず、部分的に引けが生じてしまい、成形品の形状が樹脂保持空間に対応する意図した形状とならない問題があった。
更に、特許文献1の方法では、所望の成形品の形状に応じて、その都度、透明成形型を作製する必要があり、費用負担が大きいため、少量の生産や試作には適さないという問題があった。
The technique of Patent Document 1 is to form a cured product of a photocurable resin on the surface of an object such as a resin plate or a metal plate, and a resin holding space filled with the photocurable resin via a resin supply valve is The object, a light guide type (transparent mold) that transmits light, and a resin supply valve with a protruding pin are included. In this method, if there is a slight leak in the resin holding space, the pressure due to the protrusion of the protruding pin is not sufficiently transmitted to the photocurable resin in the resin holding space, and the shape of the molded product is intended to correspond to the resin holding space. There was a problem of not being in shape.
Moreover, although the technique of patent document 1 presupposes using the comparatively low molecular weight photocurable resin which shows fluidity at normal temperature, such a photocurable resin is resin holding | maintenance at the time of protrusion of a protrusion pin. It tends to leak from space. In order to avoid this phenomenon, if the photocurable resin in the resin holding space is cured to some extent and the viscosity is increased, and then the protruding pin is protruded, the pressure is not uniformly transmitted through the photocurable resin, but partially. There is a problem that the shrinkage occurs and the shape of the molded product does not become the intended shape corresponding to the resin holding space.
Furthermore, in the method of Patent Document 1, it is necessary to produce a transparent mold each time according to the shape of a desired molded product, and the cost burden is large, so there is a problem that it is not suitable for small-scale production or trial production. there were.
本発明は、上記の問題を解決し、成形型に光硬化性樹脂を充填し硬化させて成形品を得る際に、引けに起因する問題(美観を損ねたり、意図した形状、寸法を出せない、といった問題)を抑制することができ、かつ、成形型の作製コストを抑制することができる技術を提供するものである。 The present invention solves the above-mentioned problems, and when a mold is filled with a photocurable resin and cured to obtain a molded product, problems caused by shrinkage (damage to aesthetics, or the intended shape and dimensions cannot be obtained) It is possible to provide a technology that can suppress the above problem) and can suppress the manufacturing cost of the mold.
上記のような問題を解決するため、本発明者らは鋭意検討した結果、特定の構造の成形治具を用いることによって上記問題を解決することができることを見出し、本発明を完成させた。本発明は、以下の[1]〜[4]を提供する。
[1] 板状部材の中央部に形成された中央空間と、前記中央空間と前記板状部材の外縁を結ぶ注入口とを有するスペーサと、
前記スペーサの上面に配置されて前記中央空間の上面を被覆する上面部材と、
前記スペーサの下面に配置されて前記中央空間の下面を被覆する下面部材と、
前記スペーサと前記上面部材と前記下面部材を貫通して固定する連結部材からなる成形治具であって、
前記上面部材及び前記下面部材は、活性光線を透過する透明板と、前記透明板の一面に貼付された遮光部材からなり、
前記遮光部材は、中央部に、前記遮光部材を切り欠いて形成した透過口を有し、
前記中央空間が、上下面を前記遮光部材で被覆された遮光部と、上下面を前記遮光部材で被覆されない透光部からなる、成形治具。
[2] 前記遮光部材が、片面に粘着テープを備える遮光テープである、[1]に記載の成形治具。
[3] [1]に記載の成形治具を用いて光硬化性樹脂硬化物の成形を行う光硬化性樹脂硬化物の製造方法であって、
前記注入口から光硬化性樹脂を注入して、前記中央空間に光硬化性樹脂を充填する充填工程と、
前記成形治具に向けて活性光線を照射して、前記透光部に活性光線を透過させる照射工程を有する、光硬化性樹脂硬化物の製造方法。
[4] 前記照射工程で、光硬化収縮により減少した光硬化性樹脂の体積分が、前記遮光部にあって未硬化である光硬化性樹脂及び/又は前記注入口内にあって未硬化である光硬化性樹脂で補充される、[3]に記載の光硬化性樹脂硬化物の製造方法。
In order to solve the above problems, the present inventors have intensively studied. As a result, they have found that the above problems can be solved by using a molding jig having a specific structure, and completed the present invention. The present invention provides the following [1] to [4].
[1] A spacer having a central space formed in the central portion of the plate-like member, and an injection port connecting the central space and the outer edge of the plate-like member;
An upper surface member disposed on the upper surface of the spacer and covering the upper surface of the central space;
A lower surface member disposed on the lower surface of the spacer and covering the lower surface of the central space;
A molding jig comprising a connecting member that penetrates and fixes the spacer, the upper surface member, and the lower surface member,
The upper surface member and the lower surface member are composed of a transparent plate that transmits actinic rays and a light-shielding member attached to one surface of the transparent plate,
The light shielding member has a transmission port formed by cutting out the light shielding member at a central portion,
A molding jig, wherein the central space includes a light shielding portion whose upper and lower surfaces are covered with the light shielding member, and a light transmitting portion whose upper and lower surfaces are not covered with the light shielding member.
[2] The forming jig according to [1], wherein the light shielding member is a light shielding tape including an adhesive tape on one side.
[3] A method for producing a photocurable resin cured product, wherein the photocurable resin cured product is molded using the molding jig according to [1],
A filling step of injecting a photocurable resin from the injection port and filling the central space with the photocurable resin;
A method for producing a photocurable resin cured product, comprising an irradiation step of irradiating an actinic ray toward the forming jig and transmitting the actinic ray to the translucent part.
[4] In the irradiation step, the volume of the photocurable resin reduced by photocuring shrinkage is uncured in the light-shielding portion and / or in the injection port in the light-shielding portion and uncured. The method for producing a cured photocurable resin according to [3], which is supplemented with a photocurable resin.
上記[1]の構成からなる成形治具を用いて光硬化性樹脂硬化物の成形を行うことにより、活性光線を照射した際、光硬化収縮により光硬化性樹脂の体積が減少した分が、遮光部にあって未硬化である樹脂及び/又は注入口内にあって未硬化である光硬化性樹脂で補充されるため、光硬化性樹脂の硬化収縮による引けに起因する問題を抑制することができる。また、前記の未硬化の樹脂の存在により、スペーサと光硬化性樹脂の線膨張係数の違いによるクラック発生を防ぐことができる。 When the photocurable resin cured product is molded using the molding jig having the configuration of the above [1], when the active ray is irradiated, the volume of the photocurable resin is reduced due to photocuring shrinkage. Since it is supplemented with an uncured resin in the light-shielding portion and / or an uncured photocurable resin in the injection port, it can suppress problems caused by shrinkage due to curing shrinkage of the photocurable resin. it can. In addition, the presence of the uncured resin can prevent the occurrence of cracks due to the difference in the linear expansion coefficient between the spacer and the photocurable resin.
上記[1]の簡易な構造の成形治具は、従来の透明成形型と比べて、低コストで得ることができ、少量の生産や試作にも好適に用いることができる。 The molding jig having the simple structure [1] can be obtained at a lower cost than conventional transparent molds, and can be suitably used for a small amount of production or trial production.
以下、本発明の一実施形態における成形治具及び光硬化性樹脂硬化物の製造方法を詳述する。なお、本発明は下記の実施形態にされるものではない。 Hereinafter, the manufacturing method of the shaping | molding jig and photocurable resin hardened | cured material in one Embodiment of this invention is explained in full detail. In addition, this invention is not made into the following embodiment.
[成形治具]
図1及び図2に示すように、成形治具は、板状のスペーサ1と、スペーサ1の上面に配置される上面部材2と、スペーサ1の下面に配置される下面部材3と、スペーサ1と上面部材2と下面部材3を貫通して固定する連結部材4から構成される。
連結部材4は、スペーサ1と上面部材2と下面部材3を位置あわせして、固定する機能を有する円筒形状の部材である。連結部材4として、例えば、ステンレス、鉄等からなるピン等が挙げられる。
[Molding jig]
As shown in FIGS. 1 and 2, the forming jig includes a plate-like spacer 1, an upper surface member 2 disposed on the upper surface of the spacer 1, a lower surface member 3 disposed on the lower surface of the spacer 1, and the spacer 1. And a connecting member 4 that penetrates and fixes the upper surface member 2 and the lower surface member 3.
The connecting member 4 is a cylindrical member having a function of aligning and fixing the spacer 1, the upper surface member 2, and the lower surface member 3. Examples of the connecting member 4 include a pin made of stainless steel or iron.
スペーサ1は、均一の厚みの板状部材からなり、図4に示すように、その中央部に中央空間5を有する。中央空間5は、前記均一の厚みの板状部材を所望の成形形状にくりぬいて形成することができる。
またスペーサ1は、中央空間5に光硬化性樹脂を注入するための注入口6を有する。注入口6は、中央空間5と前記板状部材の外縁を結ぶように、板状部材を切り欠いて形成することができる。
スペーサ1は、連結部材4が挿入される連結孔7を有する。
スペーサ1の材料としては、アルミ、ステンレス、鉄、プラスチック、ゴム等が挙げられる。
The spacer 1 is composed of a plate-like member having a uniform thickness, and has a central space 5 at the center as shown in FIG. The central space 5 can be formed by hollowing out the plate member having the uniform thickness into a desired shape.
The spacer 1 also has an injection port 6 for injecting a photocurable resin into the central space 5. The injection port 6 can be formed by cutting out the plate member so as to connect the central space 5 and the outer edge of the plate member.
The spacer 1 has a connecting hole 7 into which the connecting member 4 is inserted.
Examples of the material of the spacer 1 include aluminum, stainless steel, iron, plastic, and rubber.
上面部材2は、図5に示すように、活性光線を透過する透明板8と、前記透明板8の上面に貼付された遮光部材9からなり、前記遮光部材9は、中央部に、前記遮光部材9を切り欠いて形成した透過口10を有する。
透明板8と遮光部材9は、連結部材4が挿入される連結孔11を有する。
As shown in FIG. 5, the upper surface member 2 includes a transparent plate 8 that transmits actinic rays and a light shielding member 9 attached to the upper surface of the transparent plate 8. The light shielding member 9 has the light shielding member in the center. It has a transmission port 10 formed by cutting out the member 9.
The transparent plate 8 and the light shielding member 9 have a connection hole 11 into which the connection member 4 is inserted.
下面部材3は、図6に示すように、活性光線を透過する透明板12と、前記透明板12の下面に貼付された遮光部材13からなり、前記遮光部材13は、中央部に、前記遮光部材13を切り欠いて形成した透過口14を有する。
透明板12と遮光部材13は、連結部材4が挿入される連結孔15を有する。
As shown in FIG. 6, the lower surface member 3 includes a transparent plate 12 that transmits actinic rays and a light shielding member 13 attached to the lower surface of the transparent plate 12. The light shielding member 13 has the light shielding member at the center. It has a transmission port 14 formed by cutting out the member 13.
The transparent plate 12 and the light shielding member 13 have a connection hole 15 into which the connection member 4 is inserted.
透明板8、12は、光硬化性樹脂を硬化させるのに必要な活性光線を透過する透明の板である。透明板8、12として、例えば、ガラス、プラスチック等が挙げられる。
用いる活性光線の波長を吸収しない材料が望ましい。石英ガラスが特に好ましいが、アクリル樹脂やポリエチレン樹脂等のポリオレフィン樹脂を用いることもできる。
The transparent plates 8 and 12 are transparent plates that transmit actinic rays necessary for curing the photocurable resin. Examples of the transparent plates 8 and 12 include glass and plastic.
A material that does not absorb the wavelength of the active light to be used is desirable. Quartz glass is particularly preferred, but polyolefin resins such as acrylic resin and polyethylene resin can also be used.
遮光部材9、13は、活性光線を遮断する機能を有する部材である。遮光部材9、13として、例えば、片面に粘着テープを備える遮光テープ等が挙げられる。 The light shielding members 9 and 13 are members having a function of blocking actinic rays. Examples of the light shielding members 9 and 13 include a light shielding tape having an adhesive tape on one side.
上面部材2の透過口10の開口面積(S1)とスペーサ1の中央空間5の開口面積(S2)は、相似形であり、S1<S2の関係を有する。下面部材3の透過口14の開口面積(S1´)とスペーサ1の中央空間5の開口面積(S2)も、相似形であり、S1´<S2の関係を有する。このため、図7に示すように、スペーサ1の中央空間5は、上下面を遮光部材9、13で被覆された遮光部16と、上下面を遮光部材で被覆されない透光部17を有する。 The opening area (S1) of the transmission port 10 of the upper surface member 2 and the opening area (S2) of the central space 5 of the spacer 1 are similar and have a relationship of S1 <S2. The opening area (S1 ′) of the transmission port 14 of the lower surface member 3 and the opening area (S2) of the central space 5 of the spacer 1 are also similar and have a relationship of S1 ′ <S2. For this reason, as shown in FIG. 7, the central space 5 of the spacer 1 has a light shielding portion 16 whose upper and lower surfaces are covered with light shielding members 9 and 13, and a light transmitting portion 17 whose upper and lower surfaces are not covered with the light shielding member.
成形治具は、上面部材2の透明板8と下面部材3の透明板12の間にスペーサ1を挟み、上面部材2の連結孔11と、スペーサ1の連結孔7と、下面部材3の連結孔15を位置あわせして連結部材4を挿入し固定して、組み立てることができる。 The forming jig sandwiches the spacer 1 between the transparent plate 8 of the upper surface member 2 and the transparent plate 12 of the lower surface member 3, and connects the connection hole 11 of the upper surface member 2, the connection hole 7 of the spacer 1, and the lower surface member 3. The hole 15 can be aligned and the connecting member 4 can be inserted and fixed for assembly.
[光硬化性樹脂硬化物の製造方法]
本実施形態における光硬化性樹脂硬化物の製造方法は、成形治具の注入口6から、液状、若しくは軟化した光硬化性樹脂を注入して、スペーサ1の中央空間5に光硬化性樹脂を充填する充填工程と、図7に示すうように、成形治具に向けて活性光線18を照射して、スペーサ1の透光部17に活性光線を透過させる照射工程を有する。光硬化性樹脂の硬化後、成形治具を解体して、成形品である光硬化性樹脂硬化物を取り出す。
[Method for producing cured photocurable resin]
In the method for producing a cured photocurable resin in the present embodiment, a liquid or softened photocurable resin is injected from the injection port 6 of the forming jig, and the photocurable resin is injected into the central space 5 of the spacer 1. As shown in FIG. 7, the filling step for filling and the irradiation step of irradiating the forming beam with the actinic ray 18 and transmitting the actinic ray to the light transmitting portion 17 of the spacer 1 are provided. After the photocurable resin is cured, the molding jig is disassembled to take out the cured photocurable resin that is a molded product.
照射工程では、スペーサ1の透光部17を介して、光硬化性樹脂に活性光線が照射される。光硬化性樹脂に活性光線を照射すると、光硬化収縮により光硬化性樹脂の体積が減少するが、本発明の方法によれば、遮光部16にあって未硬化で流動性を有する光硬化性樹脂及び/又は注入口6内にあって未硬化で流動性を有する光硬化性樹脂で、光硬化収縮による光硬化性樹脂の体積減少分が補充される。
このため、本発明によれば、光硬化性樹脂の引けに起因する問題を抑制することができる。また、前記の未硬化で流動性を有する樹脂の存在により、スペーサと光硬化性樹脂の線膨張係数の違いによるクラック発生を防ぐことができる。
In the irradiation step, actinic rays are irradiated to the photocurable resin through the light transmitting portion 17 of the spacer 1. When the photocurable resin is irradiated with actinic rays, the volume of the photocurable resin is reduced due to photocuring shrinkage. However, according to the method of the present invention, the photocurable resin is uncured and has fluidity in the light shielding portion 16. The resin and / or the photocurable resin that is in the injection port 6 and is uncured and has fluidity, is supplemented by the volume decrease of the photocurable resin due to photocuring shrinkage.
For this reason, according to this invention, the problem resulting from the shrinkage | contraction of photocurable resin can be suppressed. In addition, the presence of the uncured resin having fluidity can prevent the occurrence of cracks due to the difference in linear expansion coefficient between the spacer and the photocurable resin.
以下、本実施形態に係る光硬化性樹脂硬化物の製造方法で用いる処理条件、樹脂等について詳細に説明する。 Hereinafter, processing conditions, resins, and the like used in the method for producing a photocurable resin cured product according to the present embodiment will be described in detail.
(活性光線)
活性光線としては、電子線及び紫外線が一般的であるが、特に限定されない。光硬化性樹脂に含まれる光反応材料の反応を促進する波長を有する光線であり、例えば、紫外線(380〜450nm程度)、可視光線(620〜750nm程度)、レーザー光線等を用いることができる。例えば、未硬化状態の光硬化性樹脂に、紫外線露光装置を用いて紫外線(UV)を一定量照射し、光硬化性樹脂を硬化させることによって硬化物を得ることができる。紫外線露光装置としては、太陽光、高圧水銀灯、低圧水銀灯、メタルハライドランプ、半導体レーザー等が挙げられる。
(Active light)
The actinic rays are generally electron beams and ultraviolet rays, but are not particularly limited. For example, ultraviolet rays (about 380 to 450 nm), visible rays (about 620 to 750 nm), laser beams, and the like can be used as the light rays having a wavelength that promotes the reaction of the photoreactive material contained in the photocurable resin. For example, a cured product can be obtained by irradiating an uncured photocurable resin with a certain amount of ultraviolet rays (UV) using an ultraviolet exposure device and curing the photocurable resin. Examples of the ultraviolet exposure apparatus include sunlight, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, and a semiconductor laser.
(光硬化性樹脂)
光硬化性樹脂は、光エネルギーの作用で液状から固体に変化する合成有機材料であり、一般に、重合性化合物、そのオリゴマー及び/又はポリマー、光重合開始剤、各種添加剤から構成される組成物である。
硬化収縮は、組成物を構成する化合物が反応し、その配列が再構成される結果、体積が減少するもので、二重結合を有する重合性化合物が大きく寄与すると言われている。予め重合性化合物を反応させ、オリゴマー及び/又はポリマーとして収縮させておき、重合性化合物の配合量を減らすことで硬化収縮を抑えることができる。
そのオリゴマー及び/又は ポリマーは、液状で、単独で硬化することができるように、又は重合性化合物と併用し硬化することができるように、官能基を有することが好ましい。
光硬化性樹脂は、下記の(A)成分と(B)成分と(C)成分を含むことが好ましい。
(Photo-curing resin)
A photocurable resin is a synthetic organic material that changes from a liquid state to a solid state under the action of light energy, and is generally composed of a polymerizable compound, an oligomer and / or polymer thereof, a photopolymerization initiator, and various additives. It is.
Curing shrinkage is said to reduce the volume as a result of the reaction of the compounds constituting the composition and the rearrangement of the arrangement thereof, and it is said that the polymerizable compound having a double bond contributes greatly. Curing shrinkage can be suppressed by reacting a polymerizable compound in advance and shrinking it as an oligomer and / or polymer and reducing the amount of the polymerizable compound.
The oligomer and / or polymer is preferably in a liquid state and has a functional group so that it can be cured alone or in combination with a polymerizable compound.
It is preferable that a photocurable resin contains the following (A) component, (B) component, and (C) component.
〔(A)成分:側鎖に(メタ)アクリロイル基を有するポリマー〕
(A)成分として、側鎖を(メタ)アクリロイル基により変性したアクリルポリマー(a1)、側鎖を(メタ)アクリロイル基により変性したイソプレンポリマー(a2)等が挙げられる。
側鎖を(メタ)アクリロイル基により変性したアクリルポリマー(a1)は、下記一般式(1)で示される構造単位、及び下記一般式(2)で示される構造単位を有することが好ましい。側鎖を(メタ)アクリル変性する方法としては、例えば下記一般式(3)で示される水酸基を有する構造単位、若しくはカルボキシル基を有する構造単位を、ポリマーの主鎖中に持たせておいて、下記一般式(4)で示される2−イソシアナートエチル(メタ)アクリレート等のイソシアナート基を有する(メタ)アクリレートを付加する方法がある。また、別の方法として、例えば、下記一般式(5)で示されるようなグリシジル基を有する構造単位をポリマーの主鎖中に持たせておき、これに(メタ)アクリル酸を付加する方法が挙げられる。さらに、グラフト重合により(メタ)アクリル側鎖を形成する方法も挙げられるが、下記一般式(3)で示されるような水酸基に2−イソシアナートエチル(メタ)アクリレート等のイソシアナート基を有する(メタ)アクリレートを付加する方法、又は下記一般式(5)で示されるようなグリシジル基に(メタ)アクリル酸を付加する方法がより好ましい。
下記一般式(3)で示されるような水酸基にイソシアナート基を有する(メタ)アクリレートを付加する場合、水酸基1当量に対して、イソシアナート基を有する(メタ)アクリレートを0.01〜0.9当量の比率になるように付加するのが好ましい。同様に下記一般式(5)で示されるようなグリシジル基に(メタ)アクリル酸を付加する場合、グリシジル基1当量に対して、(メタ)アクリル酸を0.01〜0.9当量の比率になるように付加するのが好ましい。
これらの方法によれば、側鎖の(メタ)アクリロイル基が、ウレタン結合若しくはエステル結合を介して主鎖に結合した構造が得られる。これらの構造を有すると衝撃吸収性、低誘電率化等の観点で好ましい。
[(A) component: a polymer having a (meth) acryloyl group in the side chain]
Examples of the component (A) include an acrylic polymer (a1) having a side chain modified with a (meth) acryloyl group, an isoprene polymer (a2) having a side chain modified with a (meth) acryloyl group, and the like.
The acrylic polymer (a1) whose side chain is modified with a (meth) acryloyl group preferably has a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2). As a method of modifying the side chain by (meth) acryl, for example, a structural unit having a hydroxyl group represented by the following general formula (3) or a structural unit having a carboxyl group is allowed to have in the main chain of the polymer, There is a method of adding a (meth) acrylate having an isocyanate group such as 2-isocyanatoethyl (meth) acrylate represented by the following general formula (4). Further, as another method, for example, there is a method in which a structural unit having a glycidyl group as represented by the following general formula (5) is provided in the main chain of the polymer and (meth) acrylic acid is added thereto. Can be mentioned. Furthermore, although the method of forming a (meth) acryl side chain by graft polymerization is also mentioned, it has isocyanate groups, such as 2-isocyanatoethyl (meth) acrylate, in the hydroxyl group as shown by following General formula (3) ( A method of adding (meth) acrylate or a method of adding (meth) acrylic acid to a glycidyl group as shown by the following general formula (5) is more preferable.
When a (meth) acrylate having an isocyanate group is added to a hydroxyl group represented by the following general formula (3), the (meth) acrylate having an isocyanate group is added in an amount of 0.01 to 0. It is preferable to add such that the ratio is 9 equivalents. Similarly, when (meth) acrylic acid is added to a glycidyl group as represented by the following general formula (5), a ratio of 0.01 to 0.9 equivalent of (meth) acrylic acid to 1 equivalent of glycidyl group It is preferable to add such that
According to these methods, a structure in which a side chain (meth) acryloyl group is bonded to the main chain via a urethane bond or an ester bond is obtained. These structures are preferable from the viewpoints of impact absorption, low dielectric constant and the like.
(一般式(1)、(2)中、R1A、R2A、R2Bは、それぞれ独立に水素若しくはメチル基を表し、R1Bは、炭素数4〜18のアルキル基若しくは脂環式アルキル基を表し、Xは、−CH2CH2−、−(CH2CH2O)pCH2CH2−{pは1〜500の整数}、−R2C−OCONH−R2D−若しくはR2E−CH(OH)CH2−を表し、R2C、R2D及びR2Eは、それぞれ独立に炭素数1〜10のアルキレン基若しくは脂環式アルキレン基を表す。) (In General Formulas (1) and (2), R 1A , R 2A and R 2B each independently represent hydrogen or a methyl group, and R 1B represents an alkyl group or alicyclic alkyl group having 4 to 18 carbon atoms. X represents —CH 2 CH 2 —, — (CH 2 CH 2 O) pCH 2 CH 2 — {p is an integer of 1 to 500}, —R 2C —OCONH—R 2D — or R 2E —CH. (OH) CH 2 — is represented, and R 2C , R 2D and R 2E each independently represent an alkylene group having 1 to 10 carbon atoms or an alicyclic alkylene group.
(一般式(3)中、R3Aは水素若しくはメチル基を表し、R3Bは炭素数1〜10のアルキレン基若しくは脂環式アルキレン基を表す。)
(In General Formula (3), R 3A represents hydrogen or a methyl group, and R 3B represents an alkylene group having 1 to 10 carbon atoms or an alicyclic alkylene group.)
(一般式(4)中、R4Aは水素若しくはメチル基を表し、R4Bは炭素数1〜10のアルキレン基若しくは脂環式アルキレン基を表す。)
(In General Formula (4), R 4A represents hydrogen or a methyl group, and R 4B represents an alkylene group having 1 to 10 carbon atoms or an alicyclic alkylene group.)
(一般式(5)中、R5Aは水素若しくはメチル基を表し、R5Bは炭素数1〜10のアルキレン基若しくは脂環式アルキレン基を表す。)
(In General Formula (5), R 5A represents hydrogen or a methyl group, and R 5B represents an alkylene group having 1 to 10 carbon atoms or an alicyclic alkylene group.)
側鎖を(メタ)アクリロイル基により変性したアクリルポリマー(a1)において、上記一般式(1)が主に含まれることが好ましい。
また、R1Bは、炭素数8〜12のアルキル基であることが好ましい。
In the acrylic polymer (a1) in which the side chain is modified with a (meth) acryloyl group, it is preferable that the general formula (1) is mainly included.
R 1B is preferably an alkyl group having 8 to 12 carbon atoms.
一方、前記(a2)(メタ)アクリロイル基を有するイソプレンポリマーとしては、例えば、下記一般式(6)で表される化合物が挙げられる。 On the other hand, examples of the isoprene polymer having the (a2) (meth) acryloyl group include compounds represented by the following general formula (6).
(一般式(6)中、mは50〜1000の数を示し、nは1〜5の数を示し、R6Aは水素原子又はメチル基を示す。)
mは100〜800が好ましく、150〜700がより好ましく、200〜600が更に好ましい。nは1.5〜4が好ましく、1.5〜3.5がより好ましく、1.5〜3が更に好ましい。
(In General Formula (6), m represents a number of 50 to 1000, n represents a number of 1 to 5, and R 6A represents a hydrogen atom or a methyl group.)
m is preferably 100 to 800, more preferably 150 to 700, and still more preferably 200 to 600. n is preferably 1.5 to 4, more preferably 1.5 to 3.5, and still more preferably 1.5 to 3.
前記一般式(6)で表される化合物は、UC102、UC203(株式会社クラレ製)として商業的に入手可能である。 The compound represented by the general formula (6) is commercially available as UC102 and UC203 (manufactured by Kuraray Co., Ltd.).
硬化収縮抑制の観点からは、(a1)と(a2)を併用することが好ましい。 From the viewpoint of suppressing curing shrinkage, it is preferable to use (a1) and (a2) in combination.
(A)成分の重量平均分子量は、具体的には、3,000〜300,000が好ましく、5,000〜100,000がより好ましく、9,000〜50,000がさらに好ましい。
なお、本実施の形態において、重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)によって測定することができる。
Specifically, the weight average molecular weight of the component (A) is preferably 3,000 to 300,000, more preferably 5,000 to 100,000, and still more preferably 9,000 to 50,000.
In the present embodiment, the weight average molecular weight can be measured by gel permeation chromatography (GPC).
(A)成分の含有量は、(A)成分と(B)成分の総量に対して、60〜100質量%が好ましく、73〜100質量%がより好ましく、80〜100質量%が更に好ましい。60質量%以上であると、硬化収縮率が低減する。 60-100 mass% is preferable with respect to the total amount of (A) component and (B) component, and, as for content of (A) component, 73-100 mass% is more preferable, and 80-100 mass% is still more preferable. When it is 60% by mass or more, the curing shrinkage rate is reduced.
〔(B)成分:重合性化合物〕
(B)成分としては、例えば、分子内に1個の(メタ)アクリロイル基を有する単量体(b1)、分子内に2個以上の(メタ)アクリロイル基を有する単量体(b2)等が挙げられる。
[(B) component: polymerizable compound]
Examples of the component (B) include a monomer (b1) having one (meth) acryloyl group in the molecule, a monomer (b2) having two or more (meth) acryloyl groups in the molecule, and the like. Is mentioned.
(分子内に1個の(メタ)アクリロイル基を有する単量体(b1))
分子内に1個のエチレン性不飽和基を有する単量体(b1)としては、アクリル酸、メタクリル酸、それらの誘導体(以下、(メタ)アクリル酸系誘導体という場合もある)が好ましいものとして挙げられる。
(Monomer (b1) having one (meth) acryloyl group in the molecule)
As the monomer (b1) having one ethylenically unsaturated group in the molecule, acrylic acid, methacrylic acid, and derivatives thereof (hereinafter sometimes referred to as (meth) acrylic acid derivatives) are preferable. Can be mentioned.
具体的には、分子内に1個のエチレン性不飽和基を有する単量体(b1)としては、メチル(メタ)アクリレート、n−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、イソノニル(メタ)アクリレート、n−オクチル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート等のアルキル(メタ)アクリレート、ベンジル(メタ)アクリレート等のアラルキル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート等のアルコキシアルキル(メタ)アクリレート、N,N−ジメチルアミノエチル(メタ)アクリレート等のアミノアルキル(メタ)アクリレート、ジエチレングリコールエチルエーテルの(メタ)アクリル酸エステル、トリエチレングリコールブチルエーテルの(メタ)アクリル酸エステル、ジプロピレングリコールメチルエーテルの(メタ)アクリル酸エステル等のポリアルキレングリコールアルキルエーテルの(メタ)アクリル酸エステル、ヘキサエチレングリコールフェニルエーテルの(メタ)アクリル酸エステル等のポリアルキレングリコールアリールエーテルの(メタ)アクリル酸エステル、ノニルフェノキシポリエチレングリコールの(メタ)アクリル酸エステル等のアルキル基の炭素数が4〜12のアルキルフェノキシポリエチレングリコールの(メタ)アクリル酸エステル(エチレングリコールの構造単位の平均値が1〜20)、シクロヘキシル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、メトキシ化シクロデカトリエン(メタ)アクリレート等の脂環式基を有する(メタ)アクリル酸エステル、ヘプタデカフロロデシル(メタ)アクリレート等のフッ素化アルキル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート、3−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート、グリセロールモノ(メタ)アクリレート等の水酸基を有する(メタ)アクリル酸エステル、グリシジル(メタ)アクリレート等のグリシジル基を有する(メタ)アクリル酸エステル、(メタ)アクリル酸、(メタ)アクリルアミド、(メタ)アクリロイルモルホリン等が挙げられる。硬化収縮率をより低減できる観点からは、アルキル基の炭素数が4〜12のアルキルフェノキシポリエチレングリコールの(メタ)アクリル酸エステル(エチレングリコールの構造単位の平均値が1〜20)が好ましい。
これらの分子内に1個のエチレン性不飽和基を有する単量体(b1)は、1種で又は2種以上併用して用いることができる。
なお、上記の(メタ)アクリル酸系誘導体と共に又は代えて、(メタ)アクリロニトリル、スチレン、酢酸ビニル、エチレン、プロピレン等のエチレン性不飽和結合を分子内に1個有する単量体を使用することもできるが、(メタ)アクリル酸系誘導体が好ましい。
Specifically, as the monomer (b1) having one ethylenically unsaturated group in the molecule, methyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl Alkyl (meth) acrylates such as (meth) acrylate, isononyl (meth) acrylate, n-octyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, and aralkyl (meth) acrylates such as benzyl (meth) acrylate , Alkoxyalkyl (meth) acrylates such as butoxyethyl (meth) acrylate, aminoalkyl (meth) acrylates such as N, N-dimethylaminoethyl (meth) acrylate, (meth) acrylic acid esters of diethylene glycol ethyl ether, tri (Meth) acrylic acid ester of polyalkylene glycol alkyl ether such as (meth) acrylic acid ester of tylene glycol butyl ether, (meth) acrylic acid ester of dipropylene glycol methyl ether, (meth) acrylic acid ester of hexaethylene glycol phenyl ether (Meth) acrylic acid esters of alkylphenoxypolyethylene glycols having 4 to 12 carbon atoms such as (meth) acrylic acid esters of polyalkylene glycol aryl ethers, and (meth) acrylic acid esters of nonylphenoxypolyethylene glycol The average value of ethylene glycol structural units is 1 to 20), cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, isobornyl (meth) acrylate , (Meth) acrylic acid ester having an alicyclic group such as methoxylated cyclodecatriene (meth) acrylate, fluorinated alkyl (meth) acrylate such as heptadecafluorodecyl (meth) acrylate, 2-hydroxyethyl (meta ) Acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, glycerol mono (meth) acrylate and other hydroxyl group-containing (meth) acrylic acid esters, glycidyl (meth) acrylate and other glycidyl groups (Meth) acrylic acid ester, (meth) acrylic acid, (meth) acrylamide, (meth) acryloylmorpholine, etc. are mentioned. From the viewpoint of further reducing the curing shrinkage rate, an alkylphenoxypolyethylene glycol (meth) acrylic acid ester having an alkyl group having 4 to 12 carbon atoms (average of ethylene glycol structural units is 1 to 20) is preferable.
The monomer (b1) having one ethylenically unsaturated group in these molecules can be used alone or in combination of two or more.
In addition to or instead of the above (meth) acrylic acid derivative, use a monomer having one ethylenically unsaturated bond in the molecule such as (meth) acrylonitrile, styrene, vinyl acetate, ethylene, propylene. However, (meth) acrylic acid derivatives are preferred.
(分子内に2個以上のエチレン性不飽和基を有する単量体(b2))
上記の分子内に1個のエチレン性不飽和基を有する単量体(b1)と共に分子内に2個以上のエチレン性不飽和結合を有する単量体(b2)を使用することができる。
(Monomer (b2) having two or more ethylenically unsaturated groups in the molecule)
The monomer (b2) having two or more ethylenically unsaturated bonds in the molecule can be used together with the monomer (b1) having one ethylenically unsaturated group in the molecule.
分子内に2個以上のエチレン性不飽和基を有する単量体(b2)を用いる場合は、硬化性、密着性及び硬化収縮性の観点から、(B)成分中における分子内に2個以上のエチレン性不飽和基を有する単量体(b2)の含有量は、0.1〜20質量%が好ましく、0.5〜10質量%がより好ましく、1〜5質量%が更に好ましい。 When using the monomer (b2) having two or more ethylenically unsaturated groups in the molecule, two or more in the molecule in the component (B) from the viewpoints of curability, adhesion and curing shrinkage. The content of the monomer (b2) having an ethylenically unsaturated group is preferably from 0.1 to 20 mass%, more preferably from 0.5 to 10 mass%, still more preferably from 1 to 5 mass%.
分子内に2個以上のエチレン性不飽和基を有する単量体(b2)としては、分子内に1個のエチレン性不飽和基を有する単量体(b1)の場合と同様に、アクリル酸、メタクリル酸、及びそれらの誘導体((メタ)アクリル酸系誘導体)が好ましい。 As the monomer (b2) having two or more ethylenically unsaturated groups in the molecule, as in the case of the monomer (b1) having one ethylenically unsaturated group in the molecule, acrylic acid is used. , Methacrylic acid, and derivatives thereof ((meth) acrylic acid derivatives) are preferred.
このような分子内に2個以上のエチレン性不飽和結合を有する単量体(b2)としては、ビスフェノールAジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,3−ブチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、グリセロールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、テトラエチレングリコールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリス((メタ)アクリロキシエチル)イソシアヌレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート等が挙げられる。 Examples of the monomer (b2) having two or more ethylenically unsaturated bonds in the molecule include bisphenol A di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,3- Butylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, glycerol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, tetraethylene glycol Di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris ((meth) acryloxyethyl) isocyanurate, pentaerythritol tetra (meth) Acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate.
分子内に2個以上のエチレン性不飽和結合を有する単量体(b2)としては、さらに、下記の一般式(7)で示されるビスフェノールAのアルキレンオキシド付加物のジアクリレート、一般式(8)で示されるビスフェノールAのエピクロルヒドリン変性物とアクリル酸の付加エステル化物、一般式(9)で示されるリン酸のアルキレンオキシド付加物のジアクリレート、一般式(10)で示されるフタル酸のエピクロルヒドリン変性物とアクリル酸の付加エステル化物、一般式(11)で示される1,6−ヘキサンジオールのエピクロルヒドリン変性物とアクリル酸の付加エステル化物(アクリル基を一分子中に2個有するもの)、一般式(12)で示されるリン酸のアルキレンオキシド付加物のトリアクリレート、一般式(13)で示されるトリメチロールプロパンのアルキレンオキシド付加物のトリアクリレート等が挙げられる。 As the monomer (b2) having two or more ethylenically unsaturated bonds in the molecule, a diacrylate of an alkylene oxide adduct of bisphenol A represented by the following general formula (7), a general formula (8 ) Epichlorohydrin modified product of bisphenol A and acrylic acid addition ester product, diacrylate of alkylene oxide adduct of phosphoric acid represented by general formula (9), and epichlorohydrin modification of phthalic acid represented by general formula (10) Product and acrylic acid addition esterified product, 1,6-hexanediol epichlorohydrin modified product of general formula (11) and acrylic acid addition esterified product (having two acrylic groups in one molecule), general formula Triacrylate of an alkylene oxide adduct of phosphoric acid represented by (12), represented by general formula (13) Triacrylates of the alkylene oxide adduct of trimethylol propane that.
(ただし、一般式(7)中、R7A及びR7Bはそれぞれ独立に、エチレン基又はプロピレン基を示し、m及びnはそれぞれ独立に、1〜5の整数を示し、m及びnがそれぞれ2以上の場合、複数のR7A−Oは同一でも異なっていてもよく、複数のR7B−Oは同一でも異なっていてもよい。)
(However, in General formula (7), R < 7A > and R < 7B > show an ethylene group or a propylene group each independently, m and n show the integer of 1-5 each independently, m and n are each 2 In the above case, a plurality of R 7A —O may be the same or different, and a plurality of R 7B —O may be the same or different.)
(ただし、一般式(8)中、a及びbはそれぞれ1を示す)
(In the general formula (8), a and b each represent 1)
(ただし、一般式(9)中、R9A及びR9Bは、それぞれ独立にエチレン基又はプロピレン基を示し、c及びdはそれぞれ独立に、1〜5の整数を示し、c及びdがそれぞれ2以上の場合、複数のR9A−Oは同一でも異なっていてもよく、複数のR9B−Oは同一でも異なっていてもよい。)
(In the general formula (9), R 9A and R 9B each independently represent an ethylene group or a propylene group, c and d each independently represent an integer of 1 to 5, and c and d are each 2) In the above case, a plurality of R 9A —O may be the same or different, and a plurality of R 9B —O may be the same or different.)
(ただし、一般式(10)中、e及びfはそれぞれ1を示す)
(In the general formula (10), e and f each represent 1)
(ただし、一般式(11)中、g及びhは1を示す)
(However, in general formula (11), g and h show 1)
(ただし、一般式(12)中、R12Aはエチレン基又はプロピレン基を示し、3個のiはそれぞれ独立に、1〜5の整数を示し、iが2以上の場合、複数のR12A−Oは同一でも異なっていてもよい。)
(However, in general formula (12), R <12A > shows an ethylene group or a propylene group, and three i show an integer of 1-5 each independently, and when i is two or more, several R <12A >- O may be the same or different.)
(ただし、一般式(13)中、R13A、R13B及びR13Cは、それぞれ独立にエチレン基又はプロピレン基を示し、j、k及びpはそれぞれ独立に、1〜3の整数を示し、j、k及びpがそれぞれ2以上の場合、複数のR13A−O、R13B−O及びR13C−Oはそれぞれにおいて同一でも異なっていてもよい。)
(In the general formula (13), R 13A , R 13B and R 13C each independently represent an ethylene group or a propylene group, j, k and p each independently represent an integer of 1 to 3; j , K and p are each 2 or more, the plurality of R 13A —O, R 13B —O and R 13C —O may be the same or different from each other.)
なお、上記の(メタ)アクリル酸系誘導体と共に又は代えて、それ以外のエチレン性不飽和結合を分子内に2個以上有する単量体(ジビニルベンゼン等)を使用することもできるが、(メタ)アクリル酸系誘導体が好ましい。
これらの分子内に2個以上のエチレン性不飽和結合を有する単量体(b2)は、単独で又は2種以上を組み合わせて用いることができる。
In addition to or in place of the above (meth) acrylic acid derivative, a monomer (divinylbenzene or the like) having two or more other ethylenically unsaturated bonds in the molecule can also be used. ) Acrylic acid derivatives are preferred.
The monomer (b2) having two or more ethylenically unsaturated bonds in these molecules can be used alone or in combination of two or more.
また、前記(メタ)アクリレート以外に好ましい重合性化合物として、分子内に2つ以上のエポキシ基を有する化合物を含むものも挙げられる。 Moreover, what contains the compound which has a 2 or more epoxy group in a molecule | numerator as a preferable polymeric compound other than the said (meth) acrylate is mentioned.
具体的には、ヒドロキノン型エポキシ樹脂、レゾルシノール型エポキシ樹脂、カテコール型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、テトラブロモビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールAF型エポキシ樹脂、ビスフェノールAD型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹脂、フルオレン型エポキシ樹脂等の2官能フェノールグリシジルエーテル型エポキシ樹脂;水添ビスフェノールA型エポキシ樹脂、水添ビスフェノールF型エポキシ樹脂、水添2,2´−ビフェノール型エポキシ樹脂、水添4,4´−ビフェノール型エポキシ樹脂等の水添2官能フェノールグリシジルエーテル型エポキシ樹脂;フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ジシクロペンタジエン−フェノール型エポキシ樹脂、ジシクロペンタジエン−クレゾール型エポキシ樹脂、テトラフェニロールエタン型エポキシ樹脂等の3官能以上の多官能フェノールグリシジルエーテル型エポキシ樹脂;ポリエチレングリコール型エポキシ樹脂、ポリプロピレングリコール型エポキシ樹脂、ネオペンチルグリコール型エポキシ樹脂、1,6−ヘキサンジオール型エポキシ樹脂等の2官能脂肪族アルコールグリシジルエーテル型エポキシ樹脂;シクロヘキサンジオール型エポキシ樹脂、シクロヘキサンジメタノール型エポキシ樹脂、トリシクロデカンジメタノール型エポキシ樹脂等の2官能脂環式アルコールグリシジルエーテル型エポキシ樹脂;トリメチロールプロパン型エポキシ樹脂、ソルビトール型エポキシ樹脂、グリセリン型エポキシ樹脂等の3官能以上の多官能脂肪族アルコールグリシジルエーテル型エポキシ樹脂;フタル酸ジグリシジルエステル等の2官能芳香族グリシジルエステル;テトラヒドロフタル酸ジグリシジルエステル、ヘキサヒドロフタル酸ジグリシジルエステル等の2官能脂環式グリシジルエステル;N,N−ジグリシジルアニリン、N,N−ジグリシジルトリフルオロメチルアニリン等の2官能芳香族グリシジルアミン;N,N,N´,N´−テトラグリシジル−4,4−ジアミノジフェニルメタン、1,3−ビス(N,N−グリシジルアミノメチル)シクロヘキサン、N,N,o−トリグリシジル−p−アミノフェノール等の3官能以上の多官能芳香族グリシジルアミン;アリサイクリックジエポキシアセタール、アリサイクリックジエポキシアジペート、アリサイクリックジエポキシカルボキシレート、ビニルシクロヘキセンジオキシド等の2官能脂環式エポキシ樹脂;2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加体等の3官能以上の多官能脂環式エポキシ樹脂;トリグリシジルイソシアヌレート等の3官能以上の多官能複素環式エポキシ樹脂;オルガノポリシロキサン型エポキシ樹脂等のケイ素含有2官能又は3官能以上の多官能エポキシ樹脂等が挙げられる。
これらの中でも、透明性及び耐熱性の観点から、上記2官能フェノールグリシジルエーテル型エポキシ樹脂;上記水添2官能フェノールグリシジルエーテル型エポキシ樹脂;上記3官能以上の多官能フェノールグリシジルエーテル型エポキシ樹脂;上記2官能脂環式アルコールグリシジルエーテル型エポキシ樹脂であることが好ましい。
以上の化合物は、単独で又は2種類以上を組み合わせて使用することができ、さらにその他の重合性化合物と組み合わせて使用することもできる。
Specifically, hydroquinone type epoxy resin, resorcinol type epoxy resin, catechol type epoxy resin, bisphenol A type epoxy resin, tetrabromobisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, bisphenol AD type epoxy Resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, etc. bifunctional phenol glycidyl ether type epoxy resin; hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, hydrogenated 2,2'- Hydrogenated bifunctional phenol glycidyl ether type epoxy resin such as biphenol type epoxy resin, hydrogenated 4,4'-biphenol type epoxy resin; phenol novolac type epoxy resin, cresol novolac Polyfunctional phenol glycidyl ether type epoxy resins such as epoxy resin, dicyclopentadiene-phenol type epoxy resin, dicyclopentadiene-cresol type epoxy resin, tetraphenylolethane type epoxy resin, etc .; polyethylene glycol type epoxy resin , Polypropylene glycol type epoxy resin, neopentyl glycol type epoxy resin, 1,6-hexanediol type epoxy resin, etc. bifunctional aliphatic alcohol glycidyl ether type epoxy resin; cyclohexanediol type epoxy resin, cyclohexanedimethanol type epoxy resin, tri Bifunctional alicyclic alcohol glycidyl ether type epoxy resin such as cyclodecane dimethanol type epoxy resin; Trimethylolpropane type epoxy resin, sorbitol type Trifunctional or higher polyfunctional aliphatic alcohol glycidyl ether type epoxy resin such as poxy resin and glycerin type epoxy resin; Bifunctional aromatic glycidyl ester such as diglycidyl phthalate; Tetrahydrophthalic acid diglycidyl ester, Hexahydrophthalic acid di Bifunctional alicyclic glycidyl esters such as glycidyl ester; bifunctional aromatic glycidyl amines such as N, N-diglycidyl aniline and N, N-diglycidyl trifluoromethylaniline; N, N, N ′, N′-tetra Trifunctional or higher polyfunctional aromatic glycidylamine such as glycidyl-4,4-diaminodiphenylmethane, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, N, N, o-triglycidyl-p-aminophenol An alicyclic diepoxy acetal, Bifunctional cycloaliphatic epoxy resins such as cyclic diepoxy adipate, alicyclic diepoxy carboxylate, vinylcyclohexene dioxide; 1,2-epoxy-4- of 2,2-bis (hydroxymethyl) -1-butanol Trifunctional or higher polyfunctional alicyclic epoxy resin such as (2-oxiranyl) cyclohexane adduct; Trifunctional or higher functional heterocyclic epoxy resin such as triglycidyl isocyanurate; Silicon-containing organopolysiloxane type epoxy resin A bifunctional or trifunctional or higher polyfunctional epoxy resin is exemplified.
Among these, from the viewpoint of transparency and heat resistance, the above bifunctional phenol glycidyl ether type epoxy resin; the above hydrogenated bifunctional phenol glycidyl ether type epoxy resin; the above trifunctional or more polyfunctional phenol glycidyl ether type epoxy resin; A bifunctional alicyclic alcohol glycidyl ether type epoxy resin is preferred.
These compounds can be used alone or in combination of two or more, and can also be used in combination with other polymerizable compounds.
〔(C)成分:光重合開始剤〕
(C)成分は、紫外線などの活性光線の照射によって重合を開始させるものであれば特に制限はなく、例えば、(B)成分としてエチレン性不飽和基を有する化合物を用いる場合、光ラジカル重合開始剤等が挙げられる。
[(C) component: photopolymerization initiator]
The component (C) is not particularly limited as long as it initiates polymerization by irradiation with actinic rays such as ultraviolet rays. For example, when a compound having an ethylenically unsaturated group is used as the component (B), radical photopolymerization is initiated. Agents and the like.
光ラジカル重合開始剤としては、特に制限はなく、2,2−ジメトキシ−1,2−ジフェニルエタン−1−オン等のベンゾインケタール;1−ヒドロキシシクロヘキシルフェニルケトン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、1−[4−(2−ヒドロキシエトキシ)フェニル]−2−ヒドロキシ−2−メチル−1−プロパン−1−オン、2−ヒドロキシ−1−{4[4−(2−ヒドロキシ−2−メチルプロピオニル)ベンジル]フェニル}−2−メチルプロパン−1−オン等のα−ヒドロキシケトン;フェニルグリオキシル酸メチル、フェニルグリオキシル酸エチル、オキシフェニル酢酸2−(2−ヒドロキシエトキシ)エチル、オキシフェニル酢酸2−(2−オキソ−2−フェニルアセトキシエトキシ)エチル等のグリオキシエステル;2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリン−4−イルフェニル)−ブタン−1−オン、2−ジメチルアミノ−2−(4−メチルベンジル)−1−(4−モルフォリン−4−イルフェニル)−ブタン−1−オン、1,2−メチル−1−[4−(メチルチオ)フェニル]−(4−モルフォリン)−2−イルプロパン−1−オン等のα−アミノケトン;1,2−オクタンジオン,1−[4−(フェニルチオ),2−(O−ベンゾイルオキシム)]、エタノン,1−[9−エチル−6−(2−メチルベンゾイル)−9H−カルバゾール−3−イル],1−(O−アセチルオキシム)等のオキシムエステル;ビス(2,4,6−トリメチルベンゾイル)フェニルホスフィンオキシド、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチルペンチルホスフィンオキシド、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキシド等のホスフィンオキシド;2−(o−クロロフェニル)−4,5−ジフェニルイミダゾール二量体、2−(o−クロロフェニル)−4,5−ジ(メトキシフェニル)イミダゾール二量体、2−(o−フルオロフェニル)−4,5−ジフェニルイミダゾール二量体、2−(o−メトキシフェニル)−4,5−ジフェニルイミダゾール二量体、2−(p−メトキシフェニル)−4,5−ジフェニルイミダゾール二量体等の2,4,5−トリアリールイミダゾール二量体;ベンゾフェノン、N,N´−テトラメチル−4,4´−ジアミノベンゾフェノン、N,N´−テトラエチル−4,4´−ジアミノベンゾフェノン、4−メトキシ−4´−ジメチルアミノベンゾフェノン等のベンゾフェノン化合物;2−エチルアントラキノン、フェナントレンキノン、2−tert−ブチルアントラキノン、オクタメチルアントラキノン、1,2−ベンズアントラキノン、2,3−ベンズアントラキノン、2−フェニルアントラキノン、2,3−ジフェニルアントラキノン、1−クロロアントラキノン、2−メチルアントラキノン、1,4−ナフトキノン、9,10−フェナントラキノン、2−メチル−1,4−ナフトキノン、2,3−ジメチルアントラキノン等のキノン化合物;ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインフェニルエーテル等のベンゾインエーテル;ベンゾイン、メチルベンゾイン、エチルベンゾイン等のベンゾイン化合物;ベンジルジメチルケタール等のベンジル化合物;9−フェニルアクリジン、1,7−ビス(9,9´−アクリジニルヘプタン)等のアクリジン化合物:N−フェニルグリシン、クマリン等が挙げられる。
また、前記2,4,5−トリアリールイミダゾール二量体において、2つのトリアリールイミダゾール部位のアリール基の置換基は、同一で対称な化合物を与えてもよく、相違して非対称な化合物を与えてもよい。
以上の光ラジカル重合開始剤は、単独で又は2種類以上組み合わせて用いることができる。さらに、適切な増感剤と組み合わせて用いることもできる。
There is no restriction | limiting in particular as radical photopolymerization initiator, benzoin ketals, such as 2, 2- dimethoxy- 1, 2- diphenyl ethane- 1-one; 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1 -Phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4 [4- ( Α-hydroxy ketones such as 2-hydroxy-2-methylpropionyl) benzyl] phenyl} -2-methylpropan-1-one; methyl phenylglyoxylate, ethyl phenylglyoxylate, 2- (2-hydroxyethoxy) oxyphenylacetate Ethyl, 2- (2-oxo-2-phenylacetoxyethoxy) ethyl oxyphenylacetate Of 2-benzyl-2-dimethylamino-1- (4-morpholin-4-ylphenyl) -butan-1-one, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin-4-ylphenyl) -butan-1-one, 1,2-methyl-1- [4- (methylthio) phenyl]-(4-morpholin) -2-ylpropan-1-one Α-amino ketones such as 1,2-octanedione, 1- [4- (phenylthio), 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl)- 9H-carbazol-3-yl], 1- (O-acetyloxime) and other oxime esters; bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, bis (2,6-dimethoxy) Benzoyl) -2,4,4-trimethylpentylphosphine oxide, phosphine oxide such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (O-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4, 2,4,5-triarylimidazole dimers such as 5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer; benzophenone, N, N′-tetramethyl -4,4'-diaminobenzophenone, N, N'-tetraethyl-4,4'-diaminobenzophene Non-benzophenone compounds such as 4-methoxy-4'-dimethylaminobenzophenone; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3 -Quinone compounds such as dimethyl anthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, methyl benzoin and ethyl benzoin ; Benzyl compounds such as benzyl dimethyl ketal; 9-phenyl acridine, 1,7-bis (9,9'-acridinyl heptane) or the like of acridine compounds: N- phenylglycine, coumarin and the like.
In the 2,4,5-triarylimidazole dimer, the substituents of the aryl groups at the two triarylimidazole sites may give the same and symmetric compounds, but give differently asymmetric compounds. May be.
The above radical photopolymerization initiators can be used alone or in combination of two or more. Furthermore, it can also be used in combination with an appropriate sensitizer.
また、(C)重合性化合物として上記のエポキシ樹脂を用いる場合、光重合開始剤として、光カチオン重合開始剤等が挙げられる。 Moreover, when using said epoxy resin as (C) polymeric compound, a photocationic polymerization initiator etc. are mentioned as a photoinitiator.
光カチオン重合開始剤として、p−メトキシベンゼンジアゾニウムヘキサフルオロホスフェート等のアリールジアゾニウム塩;ジフェニルヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアンチモネート等のジアリールヨードニウム塩;トリフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロアンチモネート、ジフェニル−4−チオフェノキシフェニルスルホニウムヘキサフルオロホスフェート、ジフェニル−4−チオフェノキシフェニルスルホニウムヘキサフルオロアンチモネート、ジフェニル−4−チオフェノキシフェニルスルホニウムペンタフルオロヒドロキシアンチモネート等のトリアリールスルホニウム塩;トリフェニルセレノニウムヘキサフルオロホスフェート、トリフェニルセレノニウムテトラフルオロボレート、トリフェニルセレノニウムヘキサフルオロアンチモネート等のトリアリールセレノニウム塩;ジメチルフェナシルスルホニウムヘキサフルオロアンチモネート、ジエチルフェナシルスルホニウムヘキサフルオロアンチモネート等のジアルキルフェナシルスルホニウム塩;4−ヒドロキシフェニルジメチルスルホニウムヘキサフルオロアンチモネート、4−ヒドロキシフェニルベンジルメチルスルホニウムヘキサフルオロアンチモネート等のジアルキル−4−ヒドロキシ塩;α−ヒドロキシメチルベンゾインスルホン酸エステル、N−ヒドロキシイミドスルホネート、α−スルホニロキシケトン、β−スルホニロキシケトン等のスルホン酸エステル等が挙げられる。 As a photocationic polymerization initiator, aryl diazonium salts such as p-methoxybenzenediazonium hexafluorophosphate; diaryliodonium salts such as diphenyliodonium hexafluorophosphate and diphenyliodonium hexafluoroantimonate; triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexa Triarylsulfonium salts such as fluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium hexafluorophosphate, diphenyl-4-thiophenoxyphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium pentafluorohydroxyantimonate; Phenylselenonium hexafluoro Triarylselenonium salts such as sulfate, triphenylselenonium tetrafluoroborate and triphenylselenonium hexafluoroantimonate; dialkylphenacylsulfonium salts such as dimethylphenacylsulfonium hexafluoroantimonate and diethylphenacylsulfonium hexafluoroantimonate Dialkyl-4-hydroxy salts such as 4-hydroxyphenyldimethylsulfonium hexafluoroantimonate and 4-hydroxyphenylbenzylmethylsulfonium hexafluoroantimonate; α-hydroxymethylbenzoin sulfonate, N-hydroxyimide sulfonate, α-sulfo Examples thereof include sulfonic acid esters such as nitroxy ketone and β-sulfonyloxy ketone.
これらの中で、硬化性、透明性、及び耐熱性の観点から、上記トリアリールスルホニウム塩であることが好ましい。これらの熱及び光カチオン重合開始剤は、単独で又は2種類以上組み合わせて用いることができる。さらに適切な増感剤と組み合わせて用いることもできる。 Among these, the above triarylsulfonium salts are preferable from the viewpoints of curability, transparency, and heat resistance. These thermal and photocationic polymerization initiators can be used alone or in combination of two or more. Furthermore, it can also be used in combination with an appropriate sensitizer.
(C)成分の配合量は、(A)成分と(B)成分の総量100質量部に対して、0.1〜10質量部であることが好ましい。0.1質量部以上であれば、硬化が十分であり、10質量部以下であれば十分な光透過性が得られる。以上の観点から、重合開始剤の配合量は0.3〜7質量部であることがより好ましく、0.5〜5質量部であることが更に好ましい。 (C) It is preferable that the compounding quantity of a component is 0.1-10 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component. If it is 0.1 parts by mass or more, curing is sufficient, and if it is 10 parts by mass or less, sufficient light transmittance is obtained. From the above viewpoint, the blending amount of the polymerization initiator is more preferably 0.3 to 7 parts by mass, and further preferably 0.5 to 5 parts by mass.
また、この他に必要に応じて様々な添加剤を含有しても良く、シランカップリング剤等の密着性向上剤、ヒンダードアミン系の光安定剤、フェノール系やリン系の酸化防止剤、硬化促進剤、チオール化合物等の連鎖移動剤、染料、充填剤、顔料、チキソトロピー付与剤、可塑剤、難燃剤、離型剤、界面活性剤、滑剤、帯電防止剤、各種フィラー、重金属不活性化剤などの添加剤を加えることができる。これらは、一種を単独で使用してもよいし、二種以上を併用してもよい。 In addition to these, various additives may be contained as required, such as adhesion improvers such as silane coupling agents, hindered amine light stabilizers, phenolic and phosphorus antioxidants, curing accelerators. Agents, chain transfer agents such as thiol compounds, dyes, fillers, pigments, thixotropic agents, plasticizers, flame retardants, mold release agents, surfactants, lubricants, antistatic agents, various fillers, heavy metal deactivators, etc. Additives can be added. These may be used individually by 1 type and may use 2 or more types together.
以下、本発明を実施例により更に具体的に説明するが、本発明はその要旨を超えない限り、以下の実施例に限定されない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example, unless the summary is exceeded.
[材料の作製]
(光硬化性樹脂)
[(A)側鎖に(メタ)アクリロイル基を有するポリマーの合成]
反応管にラウリルアクリレート(共栄社化学株式会社製)99g、ヒドロキシブチルアクリレート(日本化成株式会社製)1g、n−オクチルメルカプタン(和光純薬工業株式会社製)0.75g及びパーブチルO(t−ブチルパーオキシ−2−エチルヘキサノエート、日油株式会社製)0.5gを入れ、攪拌後に80℃の水バスに入れ、4時間加熱した。次いで、100℃のオーブンで1時間保持した後にオーブンから出して室温(約25℃)になるまで放置した。次にメチルエーテルハイドロキノン(和光純薬工業株式会社製)0.051g及び2−イソシアナトエチルメタアクリレート(昭和電工株式会社製)1.08gを入れた。その反応管を60℃のバスで3時間加温し、目的物のアクリルポリマー1(重量平均分子量が約10,000)を得た。
[Production of materials]
(Photo-curing resin)
[(A) Synthesis of polymer having (meth) acryloyl group in side chain]
In a reaction tube, 99 g of lauryl acrylate (manufactured by Kyoeisha Chemical Co., Ltd.), 1 g of hydroxybutyl acrylate (manufactured by Nippon Kasei Co., Ltd.), 0.75 g of n-octyl mercaptan (manufactured by Wako Pure Chemical Industries, Ltd.) and perbutyl O (t-butyl par) 0.5 g of oxy-2-ethylhexanoate (manufactured by NOF Corporation) was added, and after stirring, placed in an 80 ° C. water bath and heated for 4 hours. Subsequently, after hold | maintaining in 100 degreeC oven for 1 hour, it removed from oven and left until it became room temperature (about 25 degreeC). Next, 0.051 g of methyl ether hydroquinone (manufactured by Wako Pure Chemical Industries, Ltd.) and 1.08 g of 2-isocyanatoethyl methacrylate (manufactured by Showa Denko KK) were added. The reaction tube was heated in a bath at 60 ° C. for 3 hours to obtain the target acrylic polymer 1 (weight average molecular weight of about 10,000).
(光硬化性樹脂1)
(A)側鎖に(メタ)アクリロイル基を有するポリマーとして上記のアクリルポリマー1を55質量部、メタクリロイル基を有するイソプレン UC−102(株式会社クラレ製、前記一般式(6)に示す構造を有し、m=400、n=2、数平均分子量17,000)を20質量部、(B)重合性化合物としてライトアクリレートLA(ラウリルアクリレート、共栄社化学株式会社製)を20質量部、(C)光重合開始剤としてイルガキュア1870(ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルフォスフィンオキサイドと1−ヒドロキシ−シクロヘキシル−フェニル−ケトンの混合物、BASF社製、「イルガキュア」は登録商標。)1質量部、真球状微粒子(架橋ポリメタクリル酸メチル、テクポリマーSBX−6、積水化成品株式会社製)1.05質量部を混合し光硬化性樹脂1とした。
(Photocurable resin 1)
(A) 55 parts by mass of the above acrylic polymer 1 as a polymer having a (meth) acryloyl group in the side chain, isoprene UC-102 having a methacryloyl group (made by Kuraray Co., Ltd., having the structure represented by the general formula (6) M = 400, n = 2, number average molecular weight 17,000) 20 parts by mass, (B) 20 parts by mass of light acrylate LA (lauryl acrylate, manufactured by Kyoeisha Chemical Co., Ltd.) as the polymerizable compound, (C) Irgacure 1870 (bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and 1-hydroxy-cyclohexyl-phenyl-ketone mixture, BASF Corporation, “Irgacure” as a photopolymerization initiator Is a registered trademark.) 1 part by mass, spherical particles (cross-linked polymethyl methacrylate, Techpolymer S) X-6, Sekisui Plastics Co., Ltd.) was mixed with the photocurable resin 1 1.05 part by weight.
(光硬化性樹脂2)
(B)重合性化合物としてDCP−A(ジシクロペンタジエンジメタノールジアクリレート、共栄社化学株式会社製)を100質量部、(C)光重合開始剤としてイルガキュア184(1−ヒドロキシ−シクロヘキシル−フェニル−ケトン、BASF社製)、真球状微粒子(架橋ポリメタクリル酸メチル、テクポリマーSBX−6、積水化成品株式会社製)1.0質量部を混合し光硬化性樹脂2とした。
(Photocurable resin 2)
(B) 100 parts by mass of DCP-A (dicyclopentadiene dimethanol diacrylate, manufactured by Kyoeisha Chemical Co., Ltd.) as the polymerizable compound, (C) Irgacure 184 (1-hydroxy-cyclohexyl-phenyl-ketone) as the photopolymerization initiator , BASF) and spherical particles (cross-linked polymethyl methacrylate, Techpolymer SBX-6, manufactured by Sekisui Plastics Co., Ltd.) (1.0 part by mass) were mixed to obtain photocurable resin 2.
[光硬化性樹脂硬化物(成形品)の作製]
光硬化性樹脂硬化物として、縦40mm、横40mm、厚み1.05mmのシート形状の成形品(光散乱部品)を、以下のように作製した。
(実施例1)
厚さ3mmの青板ガラスを90mm×90mm、90mm×70mmにカットしたものを1枚ずつ準備し、ピン挿入用の穴を加工した。幅200mmの遮光用のカプトンテープを準備し、予め所定の寸法で作製しておいた刃型で打ち抜き、前記青板ガラスにφ3.0mmのピンで位置合わせをしながら貼り付けた。スペーサは厚さ1.05mmのSUS430を準備し、ワイヤーカットにより所定の寸法にカットした。
次に、下側青板ガラス、スペーサ、上側青板ガラスの順で重ねた後、ピンで位置合わせ及び固定を行って図1に示す成形治具を作製した。この成形治具の樹脂注入口より光硬化性樹脂を流し込み、高圧水銀ランプを有する紫外線露光装置により上面より25mJ/cm2、下面より65mJ/cm2の紫外線光を照射し成形を行った。その後、成形治具から成形品を取り外し、下記の評価を行った。
(比較例1)
注入口を有さないスペーサを使用し、樹脂の注入方法を変更した点以外は、実施例1と同様にして、成形品を作製した。比較例1では、青板ガラスに遮光テープを施した下面治具の上にスペーサを乗せ位置合わせした状態で樹脂を注入し、青板ガラスに遮光テープを施した上面治具を乗せ位置合わせを行った。
(比較例2)
遮光フィルムを施さない点以外は、実施例1と同様にして、成形品を作製した。
(比較例3)
位置決めピンを用いない点以外は、実施例1と同様にして、成形品を作製した。
[Production of cured photocurable resin (molded product)]
As a photo-cured resin cured product, a sheet-shaped molded product (light scattering component) having a length of 40 mm, a width of 40 mm, and a thickness of 1.05 mm was produced as follows.
Example 1
A 3 mm thick blue plate glass cut into 90 mm × 90 mm and 90 mm × 70 mm was prepared one by one, and a pin insertion hole was processed. A light-shielding Kapton tape having a width of 200 mm was prepared, punched with a blade mold prepared in advance with a predetermined size, and attached to the blue plate glass while being aligned with a φ3.0 mm pin. As the spacer, SUS430 having a thickness of 1.05 mm was prepared and cut into a predetermined size by wire cutting.
Next, after stacking the lower blue plate glass, the spacer, and the upper blue plate glass in this order, alignment and fixing were performed with pins to produce the forming jig shown in FIG. Pouring a photocurable resin from the resin injection port of the mandrel, 25 mJ / cm 2 from the upper surface by ultraviolet exposure apparatus having a high-pressure mercury lamp were irradiated by molding the ultraviolet light of 65 mJ / cm 2 from the lower surface. Thereafter, the molded product was removed from the molding jig, and the following evaluation was performed.
(Comparative Example 1)
A molded product was produced in the same manner as in Example 1 except that a spacer having no inlet was used and the resin injection method was changed. In Comparative Example 1, the resin was injected in a state where the spacer was placed on the lower surface jig provided with the light shielding tape on the blue plate glass, and the upper surface jig provided with the light shielding tape was placed on the blue plate glass for alignment. .
(Comparative Example 2)
A molded product was produced in the same manner as in Example 1 except that the light-shielding film was not applied.
(Comparative Example 3)
A molded product was produced in the same manner as in Example 1 except that no positioning pin was used.
[評価]
実施例1及び比較例1〜3について、光硬化性硬化物の硬化工程における作業性を評価した。また、硬化後の外観観察を行い、完成した前記光硬化性硬化物の評価を行った。評価結果を表1に示す。
下記表において、評価は以下の基準で行い、基準を満たすものは○、基準を外れるものは×として評価を行った。
(作業性)
樹脂充填性 :スペーサ内側に充填された樹脂に目視できるボイド及び/又は未充填部が無き事。
位置合わせ性 :スペーサ、遮光テープを施したガラスとの位置ずれ量が±1.0mm以下であること。
(外観)
クラック :成形後に割れ及び/又は目視できる亀裂が無き事。
表面凹凸 :成形後、表面に目視できる凸凹が無き事。
厚さむら :成形後の厚みばらつきは、設計値に対し±50μmであること。
[Evaluation]
About Example 1 and Comparative Examples 1-3, the workability | operativity in the hardening process of a photocurable hardened | cured material was evaluated. Moreover, the external appearance observation after hardening was performed and the completed said photocurable hardened | cured material was evaluated. The evaluation results are shown in Table 1.
In the following table, the evaluation was performed according to the following criteria, and evaluations were made with ○ indicating that the criteria were satisfied and × indicating that the criteria were not satisfied.
(Workability)
Resin fillability: No visible voids and / or unfilled parts in the resin filled inside the spacer.
Positionability: The amount of positional deviation with respect to the glass provided with the spacer and the light-shielding tape is ± 1.0 mm or less.
(appearance)
Cracks: No cracks and / or visible cracks after molding.
Surface irregularities: No irregularities visible on the surface after molding.
Thickness unevenness: The thickness variation after molding is ± 50 μm with respect to the design value.
(実施例1)
本発明の成形治具を用いた実施例では作業性も良く、完成した先期光硬化性硬化物の外観もクラック、表面の凹凸、厚さむら等は見られず良好であった。
(比較例1)
スペーサに樹脂注入口を設けない成形治具を用いた比較例1では、作業性が悪くスペーサ内の中央空間に樹脂を充填しきれなかった。また光硬化時に発生する引けに対し樹脂の補充が不十分で有り、クラック、表面の凹凸、厚さむらの発生が見られた。
(比較例2)
遮光フィルムを施さない成形治具を用いた比較例2では、光硬化時に注入口、スペーサ内側の側面の樹脂も硬化してしまう事から、光硬化時に発生する引けに対し樹脂の補充がされずクラック、表面の凹凸、厚さむらの発生が見られた。
(比較例3)
位置決めピンを用いない成形治具を用いた比較例3では、上面治具の間に位置ずれが生じ、遮光フィルムより内側にずれたスペーサの内側の側面の樹脂が光硬化時に硬化しクラックの発生が見られた。
Example 1
In the examples using the molding jig of the present invention, workability was good, and the appearance of the completed previous photo-cured cured product was good with no cracks, surface irregularities, thickness irregularities and the like.
(Comparative Example 1)
In Comparative Example 1 using a molding jig in which the resin injection port was not provided in the spacer, the workability was poor and the central space in the spacer could not be filled with the resin. In addition, the resin was insufficiently replenished against the shrinkage that occurred during photocuring, and cracks, surface irregularities, and uneven thickness were observed.
(Comparative Example 2)
In Comparative Example 2 using a molding jig without a light-shielding film, the resin on the side surface inside the inlet and the spacer is also cured at the time of photocuring, so the resin is not replenished for the shrinkage that occurs at the time of photocuring. Cracks, surface irregularities, and uneven thickness were observed.
(Comparative Example 3)
In Comparative Example 3 using a forming jig that does not use a positioning pin, a positional shift occurs between the upper surface jigs, and the resin on the inner side surface of the spacer that is shifted inward from the light-shielding film is hardened during photocuring to generate cracks. It was observed.
本発明の実施例では、比較例と比べて作業性に優れ、得られた成形品外観も良好であった。 In the Example of this invention, it was excellent in workability | operativity compared with the comparative example, and the obtained molded article external appearance was also favorable.
本発明によれば、透明成形型を用いて光硬化性樹脂硬化物の成形を行う従来技術と比べて、光硬化性樹脂の硬化収縮による引けに起因する問題を抑制することができ、かつ、成形型の作製コストを抑制することができるため、少量の生産や試作にも好適に用いることができる。 According to the present invention, it is possible to suppress problems caused by shrinkage due to curing shrinkage of the photocurable resin, as compared with the prior art in which a photocurable resin cured product is molded using a transparent mold, and Since the production cost of the mold can be suppressed, it can be suitably used for a small amount of production or trial production.
1 スペーサ
2 上面部材
3 下面部材
4 連結部材
5 中央空間
6 注入口
7 連結孔
8 透明板
9 遮光部材
10 透過口
11 連結孔
12 透明板
13 遮光部材
14 透過口
15 連結孔
16 遮光部
17 透光部
18 活性光線
DESCRIPTION OF SYMBOLS 1 Spacer 2 Upper surface member 3 Lower surface member 4 Connection member 5 Central space 6 Inlet 7 Connection hole 8 Transparent plate 9 Light shielding member 10 Transmission port 11 Connection hole 12 Transparent plate 13 Light shielding member 14 Transmission port 15 Connection hole 16 Light shielding part 17 Light transmission Part 18 Actinic rays
Claims (4)
前記スペーサの上面に配置されて前記中央空間の上面を被覆する上面部材と、
前記スペーサの下面に配置されて前記中央空間の下面を被覆する下面部材と、
前記スペーサと前記上面部材と前記下面部材を固定する連結部材からなる成形治具であって、
前記上面部材及び前記下面部材は、活性光線を透過する透明板と、前記透明板の一面に貼付された遮光部材からなり、
前記遮光部材は、中央部に、前記遮光部材を切り欠いて形成した透過口を有し、
前記中央空間が、上下面を前記遮光部材で被覆された遮光部と、上下面を前記遮光部材で被覆されない透光部からなる、成形治具。 A spacer having a central space formed in the central portion of the plate-like member, and an inlet that connects the central space and the outer edge of the plate-like member;
An upper surface member disposed on the upper surface of the spacer and covering the upper surface of the central space;
A lower surface member disposed on the lower surface of the spacer and covering the lower surface of the central space;
A molding jig comprising a connecting member for fixing the spacer, the upper surface member, and the lower surface member,
The upper surface member and the lower surface member are composed of a transparent plate that transmits actinic rays and a light-shielding member attached to one surface of the transparent plate,
The light shielding member has a transmission port formed by cutting out the light shielding member at a central portion,
A molding jig, wherein the central space includes a light shielding portion whose upper and lower surfaces are covered with the light shielding member, and a light transmitting portion whose upper and lower surfaces are not covered with the light shielding member.
前記注入口から光硬化性樹脂を注入して、前記中央空間に光硬化性樹脂を充填する充填工程と、
前記成形治具に向けて活性光線を照射して、前記透光部に活性光線を透過させる照射工程を有する、光硬化性樹脂硬化物の製造方法。 A method for producing a photocurable resin cured product for molding a photocurable resin using the molding jig according to claim 1,
A filling step of injecting a photocurable resin from the injection port and filling the central space with the photocurable resin;
A method for producing a photocurable resin cured product, comprising an irradiation step of irradiating an actinic ray toward the forming jig and transmitting the actinic ray to the translucent part.
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