JP2019000978A - Grinding tool and manufacturing method of the same - Google Patents

Abstract

To provide a grinding tool which enables polishing small pieces to be securely attached thereto and can be manufactured in a highly cost-effective method.SOLUTION: A polishing tool 2 includes a substrate 21 and multiple polishing small pieces 22. The substrate 21 has a first surface 211 and a second surface and multiple holes. Each hole extends through the substrate 21 and has a first opening located on a first surface 211 and a second opening located on a second surface. The second opening is larger than the first opening. The polishing small pieces 22 are respectively disposed in the holes and attached to the substrate through multiple adhesion parts. Each of the polishing small pieces 22 has: a tip protruding outward from the first surface 211; and the other portion covered by one of the adhesion parts in the corresponding hole. The first opening of the hole is smaller than the polishing small piece 22, and the polishing small pieces 22 are respectively held in the holes. Further, an embodiment described in the specification includes a manufacturing method of the polishing tool 2.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a grinding tool and a method for manufacturing a grinding tool.

  Grinding and / or polishing techniques are generally used to create the desired surface roughness or plane of a rigid portion such as a metal, ceramic or glass portion, or semiconductor wafer. To that end, grinding and / or polishing techniques use a tool having an abrasive member capable of wearing a rigid surface.

A well-known polishing technique is a chemical mechanical polishing (CMP) technique used in semiconductor manufacturing processes. CMP uses a corrosive chemical slurry with a polishing pad to remove unwanted residues and to planarize the surface of a wafer that can be made of ceramic, silicon, glass, sapphire, or metal.
After using the polishing pad for a certain period of time, the grinding action of the polishing pad may be reduced. Thus, additional grinding tools (also referred to as “conditioners”) are typically used to roughen the surface of the polishing pad in order to maintain the optimum grinding effect of the polishing pad.

  Conventionally, the cutting rate of a grinding tool may be improved by increasing the distribution density of an abrasive member provided in the grinding tool. This requires an increase in the amount of abrasive material in the grinding tool, which makes it more expensive to manufacture the grinding tool.

FIG. 1 is a schematic diagram showing a conventional technique for manufacturing a conditioner 1. The mesh plate 13 can be used to position and control the height of the polishing member 11 disposed in the mold 14. Next, an adhesive or resin 12 can be applied over the entire polishing member 11 inside the mold 14. Pressure and vacuum can be applied to reduce the formation of air voids in the adhesive or resin 12.
Once the adhesive or resin 12 is cured, the conditioner 1 shown in FIG. 2 comprising the polishing member 11 bonded to the cured adhesive or resin 12 is removed from the mold 14. can get. In practice, the aforementioned conditioner 1 can have several drawbacks. For example, the cured adhesive or resin 12 may be altered by contact with a corrosive chemical slurry, which may cause the abrasive member 11 to come off.

  Accordingly, there is a need for an improved grinding tool that can be manufactured in a cost-effective manner, can be securely attached to an abrasive member, and can at least address the aforementioned problems.

  This specification describes a grinding tool to which abrasive pieces can be securely attached and manufactured in a cost-effective manner. The grinding tool includes a substrate and a plurality of polishing pieces. The substrate has a first surface and a second surface and a plurality of holes, each hole extending through the substrate, each having a first opening on the first surface and a second opening. The second opening is larger than the first opening. Each of the polishing pieces is disposed in the hole and is attached to the substrate via a plurality of bonding portions. Each polishing piece is bonded to the tip protruding outward from the first surface and inside the corresponding hole. The first opening of the hole is smaller than the abrasive piece, each of which is held in the hole.

  The present description further describes a method of manufacturing a grinding tool. The method includes a substrate having a first surface and a second surface and a plurality of holes, each hole extending through the substrate, each having a first opening in the first surface, Providing a substrate having a second opening in the second surface, wherein the second opening is larger than the first opening, and each polishing piece is disposed in the hole through the second opening and polished. The small piece is generally larger than the first opening, partially protrudes outward from the first opening, and the substrate is disposed on a fixed support having a plurality of positioning recesses, and the first opening The abrasive pieces projecting from each of the abrasive pieces are partially received in the positioning recesses, and each of the plurality of adhesive portions is applied through the second opening into the hole, whereby the adhesive portions are each in the interior of the hole. Cover the small piece and attach the abrasive piece firmly to the substrate Including the.

It is the schematic which shows the prior art which manufactures a conditioner. It is a schematic sectional drawing which shows the conventional conditioner. It is a schematic top view which shows one Embodiment of a grinding tool. It is a section showing one embodiment of a grinding tool. It is sectional drawing which shows the structure of the modification of a grinding tool. It is sectional drawing which shows the structure of another modification of a grinding tool. It is a flowchart of the method process of manufacturing a grinding tool. It is the schematic of the intermediate stage of manufacture of a grinding tool. It is the schematic of the intermediate stage of manufacture of a grinding tool. It is the schematic of the intermediate stage of manufacture of a grinding tool. It is the schematic of the intermediate stage of manufacture of a grinding tool.

FIG. 3 is a schematic top view showing an embodiment of the grinding tool 2, and FIG. 4 is a cross-sectional view showing the grinding tool 2.
Please refer to FIG. 3 and FIG. The grinding tool 2 may include a substrate 21 and a plurality of polishing pieces 22 firmly attached to the substrate 21. The substrate 21 may be a single rigid body. The substrate 21 may be made of a robust and chemically stable material, which may illustratively include metallic materials such as stainless steel, ceramic, and the like. According to one embodiment, the substrate 21 is made of stainless steel so that when the grinding tool 2 is used in contact with an acidic or alkaline slurry, the grinding tool is not very exposed to chemical alteration.
There is no specific limit imposed on the size of the substrate 21. According to one embodiment, the substrate 21 may be a substantially circular disc having a diameter of about 4 inches and a thickness of about 2 mm to about 3 mm. The substrate 21 may have two opposing surfaces 211 and 212, the surface 211 being the working surface of the grinding tool 2 and the surface 212 being the non-working surface of the grinding tool 2. The polishing pieces 22 can be distributed over the entire surface 211 of the substrate 21 and can protrude outwardly from this surface.

  The abrasive strip 22 can be made of any suitable material with high hardness. Examples of suitable materials for the abrasive pieces 22 may include, but are not limited to, diamond, cubic boron nitride, aluminum oxide, and silicon carbide. The shape of the polishing piece 22 is not limited, and may be, for example, a regular hexahedron crystal form. Further, the polishing piece 22 may be any suitable size depending on the function required of the grinding tool 2. According to one embodiment, the size of the abrasive pieces 22 may illustratively be from about 20 to about 30 US mesh, ie, the mesh screen used to filter the abrasive pieces 22 will have about There may be 20 to about 30 openings and the average maximum width of the abrasive strips 22 is about 800 μm to about 1000 μm. According to one embodiment, the substrate 21 may be provided with about 60 to about 300 polishing pieces 22.

  Please refer to FIG. The substrate 21 may include a plurality of holes 213. Each of the polishing pieces 22 may be disposed in the hole 213, and each of the polishing pieces 22 may be attached to the substrate 21 via a plurality of bonding portions 216. Each of the polishing pieces 22 attached in such a manner may have a tip 221 protruding from the surface 211 of the substrate 21 and a remaining portion entirely covered with an adhesive portion 216 inside the hole 213 of the substrate 21. . In other words, the polishing piece 22 protrudes outward from the surface 211 of the substrate 21, but does not protrude from the surface 212 of the substrate 21.

  Each hole 213 can extend through the substrate 21 and can each form two openings 212A and 211A in two opposing faces 212 and 211. According to an example structure, the openings 212A and 211A may be circular, and the opening 212A may be larger than the opening 211A. Further, the polishing piece 22 is generally larger than the opening 211A. For example, the diameter of each opening 211 </ b> A may be generally smaller than each polishing piece 22, for example, smaller than the average size or average maximum width of the polishing pieces 22. According to one embodiment, the diameter of the opening 212A may be 1 mm to 2 mm, such as 1 mm, and the diameter of the opening 211A may be 0.4 mm to 0.75 mm, such as 750 m. According to one embodiment, the size ratio (eg, diameter ratio) between the opening 211A and the opening 212A may be between about 0.2 and about 0.75, such as 0.4 to 0.375. When the sizes are different from each other in this way, the smaller opening 211 </ b> A can prevent the polishing piece 22 from passing through, so that the polishing piece 22 can be held in the hole 213. As a result, the abrasive pieces 22 can be prevented from falling from the grinding tool 2 during use. If the polishing piece 22 is positioned in the hole 213, the polishing piece 22 can partially protrude outward from the opening 211 </ b> A in the surface 211 of the substrate 21.

According to one embodiment, each hole 213 may include two hole sections 215 and 214 that are connected to each other in different sizes and shapes. The hole section 215 may be illustratively cylindrical and the other hole section 214 may be illustratively shaped like a trapezoidal cone. The hole section 215 may open to the surface 212 through the opening 212A and may have an inner wall that is substantially perpendicular to the surface 212. The hole section 214 may open to the surface 211 through the opening 211 </ b> A and may have a tapered shape that narrows toward the surface 211. For example, the material angle between the inner wall of the hole compartment 214 and the surface 211 may be about 70 to about 89 degrees.
Since the diameter of the hole section 215 is generally larger than any diameter of the tapered hole section 214, the adhesive material that flows from the hole section 215 toward the hole section 214 to form the bonding portion 216 completely passes the hole 213. Filling can be performed, thereby reducing the generation of air voids inside the bonding portion 216. The portion of the polishing piece 22 received inside the hole 213 is in contact with the adhesive portion 216, so that the polishing piece 22 can be substantially attached to the substrate 21. Examples of a material suitable for the bonding portion 216 may include an epoxy resin, a phenol resin, a polyester resin, a polyamide resin, a polyimide resin, a polycarbonate resin, and any combination thereof.

FIG. 5 is a cross-sectional view showing the structure of a modified example of the grinding tool 3.
Please refer to FIG. The grinding tool 3 may include a substrate 21, a polishing piece 22 attached to the substrate 21, and a base substrate 31. The base substrate 31 may be provided to further enhance the rigidity of the grinding tool 3. The substrate 21 may have the same structure as described above, and the polishing piece 22 may be attached to the substrate 21 in a similar manner. More specifically, the same hole 213 described above may be provided in the substrate 21 and extend through two opposing surfaces 211 and 212 of the substrate 21.
Each of the polishing pieces 22 may be disposed in the hole 213, and each of the polishing pieces 22 may be attached to the substrate 21 via the bonding portion 216. Each of the polishing pieces 22 attached in such a manner may have a tip 221 protruding from the surface 211 of the substrate 21 and a remaining portion entirely covered with an adhesive portion 216 inside the hole 213 of the substrate 21. . The base substrate 31 may have a recess 311 provided on the main surface of the base substrate, and the substrate 21 is attached to the base substrate 31 including the polishing piece 22 disposed in the recess 311 and protruding outward. May be. According to one embodiment, a plurality of recesses 311 may be provided on the main surface of the base substrate 31, and each of the plurality of substrates 21 including the polishing pieces 22 may be disposed in the recesses 311.

FIG. 6 is a cross-sectional view showing the structure of another modification of the grinding tool 4.
Please refer to FIG. The grinding tool 4 may include a substrate 41 and a plurality of polishing pieces 22, each of which is attached to the substrate 41.

The substrate 41 may be formed as a single rigid body as a whole. In particular, the substrate 41 may be made of a robust and chemically stable material, which may illustratively include stainless steel, ceramic, and the like. According to one embodiment, the substrate 41 is made of stainless steel so that when the grinding tool 4 is used in contact with an acidic or alkaline slurry, the grinding tool is not very exposed to chemical alteration.
There is no specific limit imposed on the size of the substrate 41. According to one embodiment, the substrate 41 may be a substantially circular disc having a diameter of about 4 inches. Further, the substrate 41 may have a thickness larger than the thickness of the substrate 21 described above so that the rigidity of the grinding tool 4 is increased. For example, the thickness of the substrate 41 may be 5 mm to 6.35 mm.

  The substrate 41 may include a plurality of holes 413 that extend through two opposing surfaces 411 and 412 of the substrate 41. Each of the polishing pieces 22 may be disposed in the hole 413, and each of the polishing pieces 22 may be attached to the substrate 41 via the bonding portion 416. Each polishing piece 22 attached in such a manner may have a tip 421 protruding from the surface 411 of the substrate 41 and a remaining portion entirely covered with an adhesive portion 416 inside the hole 413 of the substrate 41. . In other words, the polishing piece 22 partially protrudes outward from the surface 411 of the substrate 41, but does not protrude from the surface 412 of the substrate 41.

Please refer to FIG. Each hole 413 extending through the substrate 41 may have two openings 412A and 411A on two opposite faces 412 and 411, respectively. According to an example structure, the openings 412A and 411A may be circular, and the opening 412A may be larger than the opening 411A. Further, the polishing piece 22 is generally larger than the opening 411A. For example, the diameter of each opening 411A may be generally smaller than each polishing piece 22, and may be smaller than the average size or average maximum width of the polishing piece 22, for example. According to one embodiment, the diameter of the opening 412A may be 1 mm to 2 mm, such as 2 mm, and the diameter of the opening 411A may be 0.4 mm to 0.75 mm, such as 750 μm.
When the sizes are different from each other in this way, the smaller opening 411 </ b> A can prevent the polishing piece 22 from passing through, so that the polishing piece 22 can be held in the hole 413. As a result, the abrasive pieces 22 can be prevented from falling from the grinding tool 4 during use. If the polishing piece 22 is positioned in the hole 413, the polishing piece 22 can partially protrude outward from the opening 411 </ b> A in the surface 411 of the substrate 41.

In the embodiment shown in FIG. 6, each hole 413 may include three hole sections 415, 417 and 414 that are connected to each other, the hole section 417 being located between the two hole sections 415 and 414. And connected to both compartments. The hole section 415 can open to the surface 412 through the opening 412A, and the hole section 414 can open to the surface 411 through the opening 411A. The hole section 415 may illustratively be cylindrical with the inner wall being substantially perpendicular to the surface 412. The hole section 417 may be cylindrical and the diameter may be generally uniform along its axis, which may illustratively be about 1 mm.
The hole section 414 may illustratively have a tapered shape that narrows toward the surface 411 (eg, a trapezoidal cone). For example, the material angle between the inner wall of the hole section 414 and the surface 411 can be about 70 to about 89 degrees. Since the diameter of the hole section 415 is generally larger than the diameter of the hole section 417 and the hole section 417 is generally larger than the hole section 414, the hole section 415 passes through the hole section 417 toward the hole section 414. The flowing adhesive material can completely fill the holes 413, thereby reducing the occurrence of air voids inside the adhesive 416.
The portion of the polishing piece 22 received inside the hole 413 is in contact with the adhesive portion 416, so that the polishing piece 22 can be substantially attached to the substrate 41.

FIG. 7 is a flowchart of exemplary method steps for manufacturing the grinding tool 2, 3 or 4 described above. 8 to 11 are schematic diagrams showing various intermediate stages of manufacturing a grinding tool according to the method steps shown in FIG.
Please refer to FIG. 7 and FIG. The substrate 21 including the holes 213 may be provided in the first step S110 of manufacturing the grinding tool 2 or 3. Each hole 213 opens into two opposing surfaces 212 and 211 of the substrate 21 via two openings 212A and 211A, respectively, and the opening 212A is larger than the opening 211A.

  According to one embodiment, the holes 213 and the openings 212A and 211A may be formed by drilling the substrate 21 using a machining tool. For example, step S110 drills the larger hole section 215 and opening 212A through the surface 212 of the substrate 21, and then drills the smaller hole section 214 and opening 211A through the surface 211 of the substrate 21. May be included. It will be appreciated that other techniques may be used to manufacture the substrate 21 that includes the holes 213. For example, in another embodiment, the substrate 21 including the holes 213 may be formed directly by powder metallurgy, which may include pressing and sintering metal powder to form the substrate 21 including the holes 213. .

  Please refer to FIG. 7 and FIG. In step S120, each of the polishing pieces 22 may be inserted through the opening 212A and disposed in the hole 213 of the substrate 21. Since the opening 211 </ b> A is smaller than the polishing piece 22, each of the polishing pieces 22 can be held in the hole section 214 of the hole 213.

  Please refer to FIG. 7 and FIG. In the next step S <b> 130, the substrate 21 including the polishing piece 22 can be placed on the fixed support 5 and the surface 211 of the substrate 21 can be in contact with the fixed support 5. The fixed support 5 may include a plurality of positioning recesses 51 whose depths are accurately controlled, and the substrate 21 is disposed on the fixed support 5 and has a polishing piece 22 (particularly, a tip 221 of the polishing piece). Protrudes from the opening 211A and is received at least partially in the positioning recess 51 and can contact the bottom of the positioning recess 51. As a result, the position of the polishing piece 22 in the hole 213 can be adjusted so that the tip 221 of the polishing piece 22 can protrude from the surface 211 of the substrate 21 to a desired height. In particular, the tips 221 of the polishing pieces 22 can thereby be of the same height and protrude from the surface 211 of the substrate 21 to have substantially the same height, and the remaining portions of the polishing pieces 22 are formed in the holes 213. Located inside. For example, the depth of the positioning recess 51 may be about 0.01 mm to about 0.3 mm, and the tip 221 of the polishing piece 22 can protrude outward from the surface 211 of the substrate 21 to a height of about 100 μm. A grinding tool in which the height of the polishing piece 22 can be set can be advantageously used as a conditioner for uniformly polishing the surface of the object.

  Please refer to FIG. 7 and FIG. While the substrate 21 is maintained at a position on the fixed support 5, in step S <b> 140, each of the adhesive portions 216 passes through the opening 212 </ b> A using the adhesive dispenser 6 that securely attaches the polishing piece 22 to the substrate 21. Can be applied inside. The amount of adhesive inserted through the opening 212A can be controlled so that the adhesive 216 can completely fill the hole 213 and cover the portion of the abrasive strip 22 inside the hole 213. Examples of suitable materials for the bonding portion 216 may include epoxy, phenolic resin, polyester resin, polyamide resin, polyimide resin, polycarbonate resin, and any combination thereof.

It will be appreciated that the steps S110, S120, S130 and S140 described herein can be similarly applied to manufacture the grinding tool 4 based on the substrate 41 provided with the holes 413. In this case, the substrate 41 including the holes 413 may be provided in the first step S110. For example, step S110 drills the hole section 415 in the substrate 41, then drills the hole section 417 connected to the hole section 415, and finally drills the hole section 414 communicating with the hole sections 415 and 417. May be included.
The hole sections 415 and 414 formed in this way can each have openings 412A and 411A in two opposite faces 412 and 411 of the substrate 41. Subsequently, in step S <b> 120, the polishing pieces 22 may be inserted into the openings 412 </ b> A and disposed in the holes 413 of the substrate 41. Next, Step S <b> 130 is performed to properly position the polishing piece 22 in the hole 413. Finally, in step S140, the bonding portions 416 can be applied to the holes 413 through the openings 412A, respectively, to firmly attach the polishing pieces 22 to the substrate 41.

  According to one embodiment, the method steps may further include attaching a substrate 21 having a polishing piece 22 secured therein to a base substrate 31 to form the grinding tool 3 shown in FIG. The base substrate 31 may include a recess 311, and the substrate 21 may be positioned and attached within the recess 311.

  An advantage of the structures and methods described herein includes the ability to manufacture grinding tools in a cost effective manner. The grinding tool can comprise an abrasive strip that is secured to a substrate that includes a substantially air void-free bond, thereby providing a secure attachment of the abrasive strip.

  The manufacture of the grinding tool and its manufacturing process have been described in the context of a particular embodiment. These embodiments are meant to be illustrative and not limiting. Many variations, modifications, additions and improvements are possible. These and other variations, modifications, additions and improvements may fall within the scope of the invention as defined in the following claims.

Claims (20)

A grinding tool,
A substrate having a first surface and a second surface and a plurality of holes, each of the holes extending through the substrate, each having a first opening on the first surface and a second surface A second surface, wherein the second opening is larger than the first opening, and
A plurality of polishing pieces, each disposed in the hole and attached to the substrate via a plurality of adhesive portions, each polishing piece having a tip protruding outward from the first surface; A plurality of abrasive pieces having a remaining portion covered with one of the adhesive portions within the corresponding hole, and a grinding tool comprising:
The first opening of the hole is smaller than the polishing piece, and each of the polishing pieces is held in the hole,
Grinding tool.   Each of the holes includes at least a first hole section and a second hole section connected to each other, the first hole section opening to the first surface through the first opening; The grinding tool according to claim 1, wherein the second hole section opens to the second surface through the second opening.   Each of the holes further includes a third hole section between the first hole section and the second hole section, wherein each of the third hole sections includes the first hole section and the second hole section. The grinding tool according to claim 2, wherein the grinding tool is connected to the hole section.   The grinding tool according to claim 2, wherein the first hole section has a tapered shape that narrows toward the first surface.   The grinding tool according to claim 4, wherein the material angle between the inner wall of the first hole section and the first surface is about 70 to about 89 degrees.   The grinding tool according to claim 2, wherein the second hole section has an inner wall substantially perpendicular to the second surface.   The grinding tool according to claim 1, wherein the diameter of the first opening is 0.4 mm to 0.75 mm, and the diameter of the second opening is 1 mm to 2 mm.   The grinding tool according to claim 1, wherein the substrate is a single rigid body.   The grinding tool according to claim 1, wherein the substrate is made of a metal material or ceramic.   The grinding tool according to claim 1, wherein the polishing piece is made of diamond, cubic boron nitride, aluminum oxide or silicon carbide.   The grinding tool according to claim 1, wherein the polishing pieces are in the form of a hexahedron crystal, and the average maximum width of the polishing pieces is about 800m to about 1000m.   The grinding tool according to claim 1, further comprising a base substrate having a surface including a recess, wherein the substrate is disposed in the recess and attached to the base substrate.   2. The grinding tool according to claim 1, wherein the adhesive portion is an epoxy, a phenol resin, a polyester resin, a polyamide resin, a polyimide resin, a polycarbonate resin, or any combination thereof. A method for manufacturing a grinding tool, comprising:
A substrate having a first surface and a second surface and a plurality of holes, each of the holes extending through the substrate, each having a first opening on the first surface and a second surface Providing a substrate having a second opening on the second surface, wherein the second opening is larger than the first opening;
Each of a plurality of polishing pieces is disposed in the hole through the second opening, and the polishing piece is generally larger than the first opening and partially protrudes outward from the first opening. When,
Disposing the substrate on a fixed support having a plurality of positioning recesses, each of the polishing pieces protruding from the first opening being partially received in the positioning recess;
Each of a plurality of adhesive portions is applied through the second opening and into the hole, whereby the adhesive portions each cover the abrasive pieces inside the holes and securely attach the abrasive pieces to the substrate. Including,
Method.   15. The method according to claim 14, further comprising attaching the substrate including the polishing piece to a base substrate having a surface including a recess, and the substrate is disposed in the recess of the base substrate. the method of.   The positioning recess of the fixed support has a precisely controlled depth, and in the step of placing the substrate on the fixed support, the polishing piece is desired from the first surface of the substrate. The method according to claim 14, wherein the position of the polishing piece in the hole is adjusted so that the polishing piece can protrude to a height of 15 mm.   The step of providing a substrate having first and second surfaces and a plurality of holes includes drilling the holes in the substrate, wherein each of the holes is connected to each other in a first hole section. And the second hole section, the first hole section has a tapered shape, opens to the first surface through the first opening, and the second hole section has a cylindrical shape, 15. The method of claim 14, wherein the second surface is opened through the second opening.   The step of providing a substrate having a first surface and a second surface and a plurality of holes includes drilling the holes in the substrate, each of the holes being connected to each other; Including a second hole section and a third hole section, wherein the first hole section has a tapered shape, opens to the first surface through the first opening, and the second hole section includes , Opening through the second opening into the second surface, the third hole section being located between the first hole section and the second hole section, The method according to claim 14.   The method according to claim 14, wherein the substrate is a single rigid body.   The method according to claim 14, wherein the substrate is made of a metallic material or ceramic.

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