JP2019000784A - Method for purification of pcb treatment facility - Google Patents

Abstract

To provide a method for purification of a PCB treatment facility by which PCB of a partition member can be reliably removed, even though the method is simple.SOLUTION: This method comprises: a scraping process in which a characteristic spot P1 is provided in each prescribed area of a partition member WL which partitions an interior of a PCT treatment facility, and the characteristic spot P1 is scraped at each first distance D1 set in a thickness direction of the partition member WL; a measurement process in which a PCB concentration of a scraping site at each first distance D1 in the partition member WL is measured; a specification process in which a second distance D2 in the thickness direction from a surface of the partition member WL is set by addition of the first distance D1, and a second distance D2, which corresponds to the scraping site at which the PCB concentration measured in the measurement process becomes a reference value or less, is specified; and a removal process in which the partition member WL in a prescribed area is scraped and removed until reaching a third distance D3 in which the first distance D1 is added to the second distance D2 from the surface of the partition member.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for purifying a PCB processing facility, and more particularly, to a method for purifying a PCB processing facility that reduces the PCB concentration of the partition member to a reference value or less by scraping and removing the partition member that partitions the PCB processing facility.

  Since PCB (polychlorinated biphenyl), which is a nonflammable insulator, is harmful to the human body, it is stipulated that it be detoxified within the legal period. After detoxification of all PCB contaminants in Japan, the PCB processing facility will be dismantled. However, the partition members such as walls, floors, and ceilings in the PCB processing facility will be exposed to air containing PCB. Since the PCB that has been exposed or leaked from PCB contaminants is attached, it is necessary to clean the partition member before dismantling the PCB processing facility.

  The method for cleaning a PCB processing facility in Patent Document 1 is to form a coating film with a liquid paint on the surface of a concrete wall, and scrape the surface to a depth of 5 to 10 mm together with the cured coating film to remove the PCB. is there. As a result, it is described that the PCB that has entered the fine recesses of the concrete wall can be removed by adhering to the coating film.

JP 2012-187456 A

  For example, in the case of a partition member made of concrete, there is a possibility that PCB has penetrated until reaching a certain depth from the surface. In the method for cleaning a PCB processing facility described in Patent Document 1, PCB existing in a recess near the surface of the partition member can be removed by adhering to the coating film, but the PCB that has penetrated deep into the partition member can be reliably removed. Since it is difficult to remove, there is room for improvement. Moreover, it is complicated to form a coating film on the entire surface of the partition member.

  Therefore, there is a demand for a method for purifying a PCB processing facility that can remove PCBs of partition members with certainty while being a simple method.

  A method for purifying a PCB processing facility is a method in which a feature point is provided for each predetermined area of a partition member that divides the interior of the PCB processing facility, and the feature point is scraped off at each first distance set in the thickness direction of the partition member. A step of measuring the PCB concentration of the scraped site for each first distance in the partition member, and adding the first distance to the second distance in the thickness direction from the surface of the partition member. Setting and specifying the second distance corresponding to the scraped site where the PCB concentration measured in the measuring step is below a reference value; and in the predetermined area, the second distance from the surface to the second distance A removal step of scraping and removing the partition member until a third distance obtained by subtracting the first distance is reached.

  In this method, the PCB concentration of the scraped site cut at each first distance (D1) is measured at a characteristic point provided in a predetermined area of the partition member. This eliminates the inconvenience that the cutting site of the first distance (D1) and the cutting site of the next first distance (D1) are mixed and the PCB concentration for each cutting site cannot be measured accurately. it can. As a result, it is possible to accurately measure the PCB concentration of the scraped site at the second distance (D2 = D1 × N) obtained by adding the first distance (D1) N times, and the first depth as the depth of penetration of the PCB. Three distances (D3 = D2-D1) can be specified reliably.

  Further, in the removing step, since the scraping is performed from the surface of the partition member in the predetermined area until the third distance (D3) is reached, it is possible to save the trouble of scraping while measuring the PCB concentration each time at a plurality of points. Furthermore, in this method, since the second distance (D2) at which the PCB concentration is equal to or lower than the reference value is specified, the method is efficient without being cut deeper than necessary.

  Thus, it was possible to provide a method for purifying a PCB processing facility that can remove the PCB of the partition member reliably while being a simple method.

  In another method, after the removing step, the partition member for the first distance is scraped off at a point different from the feature point, and whether the PCB concentration of the scraped part for the first distance is less than the reference value. It is in the point further provided with the analysis process which determines whether or not.

  Even if a feature point that is assumed to have a high PCB concentration is selected from a work history or the like in a predetermined area, a point with a higher PCB concentration may exist. As in this method, after the partition member is scraped to the third distance (D3), if the PCB concentration of the scraped portion for the first distance (D1) at a point different from the feature point is determined, the PCB of the partition member is determined. It can be removed more reliably.

It is a conceptual diagram of the purification method of the PCB processing facility which concerns on this embodiment. It is a purification | cleaning flowchart.

  Hereinafter, an embodiment of a purification method for a PCB processing facility according to the present invention will be described with reference to the drawings. In this embodiment, as an example of the purification method of the PCB processing facility, a concrete wall WL (an example of a partition member), a concrete floor WF (an example of a partition member), or a concrete made partitioning each management area of the PCB processing facility The case where the PCB of the ceiling WT (an example of a partition member) is removed will be described. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the invention.

  As shown in FIG. 1, the inside of the PCB processing facility includes a management area A in which a PCB contamination level is defined and a non-management area in which the PCB is not handled. Further, the PCB processing facility includes a cleaning facility (not shown), a plasma melting furnace, an activated carbon tank, and the like.

  The management area A includes a high concentration management area having a PCB contamination level of 3, a medium concentration management area A2 having a PCB contamination level of 2, and a low concentration management area having a PCB contamination level of 1. The high-concentration management area of PCB contamination level 3 is an area that requires high-level management because there is a possibility of contamination of the work environment by PCB under normal operation. The medium concentration control area A2 of PCB contamination level 2 is a target in which the PCB is not contaminated by the work environment under normal operation, but the high concentration PCB is handled indirectly in the process (or the PCB is almost removed). This is an area that requires appropriate management in order to handle items in the work environment. A PCB contamination level 1 low-concentration management area is an area where PCBs in the process are sealed in the equipment, so that there is no contamination of the work environment by the PCB under normal operation, and can be handled with minimal management.

  In high-concentration control areas, PCB contaminants are sorted by type, and electrical equipment is disassembled in a glove box and packed in containers (not shown) composed of, for example, washing baskets, drums, and pails. Change. Then, the cleaning basket is solvent-cleaned, the container is put into a plasma melting furnace, etc., and PCB contaminants are made harmless. PCB contaminants are composed of electrical equipment (stabilizers, transformers, capacitors, etc.), operating waste (work clothes, rubber gloves, wastes, etc.), pressure-sensitive copying paper, sludge, insulating oil, and the like.

  In the medium concentration management area A2, the outside of the glove box (inside, the high concentration management area), piping through which air and liquid containing PCB circulate, equipment with low PCB concentration, and the like are arranged. In the low-concentration management area, a sealing device, piping, or the like that encloses a liquid containing PCB is disposed. The non-management area is composed of an attic or a space between the management area A and the wall WL facing outside. In addition, each management area A and non-management area are partitioned by a wall WL, a floor WF, or a ceiling WT.

  The wall WL, floor WF, or ceiling WT of the medium concentration management area A2 or the low concentration management area is made of concrete or the like. The wall WL facing the outside of the unmanaged area is made of lightweight foamed concrete (ALC) in which reinforcing bars are embedded.

  Hereinafter, a method for removing PCB contained in the wall WL, the floor WF, or the ceiling WT of the medium concentration management area A2 will be described as an example.

  In the middle concentration management area A2, PCB contaminants having a high PCB concentration are not actively handled, but the PCB concentration in the air is relatively high because the PCB in the process is indirectly handled by a high concentration PCB. Therefore, the medium concentration management area A2 is configured such that air containing PCB is sent to an exhaust treatment facility such as an activated carbon tank for purification by an exhaust fan (not shown). The wall WL, the floor WF or the ceiling WT of the medium concentration management area A2 is in contact with the air containing the PCB so that the PCB penetrates or is opened for periodic inspection, such as a strainer provided when the air is exhausted. PCB leaks out from necessary equipment, and PCB adheres. For this reason, a site | part with a high PCB density | concentration can be pinpointed from the arrangement | positioning place and usage method of an apparatus among the wall WL, the floor WF, or the ceiling WT.

  As shown in FIGS. 1 to 2, a predetermined area for removing PCB is set in the medium density management area A2. The predetermined area may be set based on the work area per day or may be classified according to a predetermined area. Next, a feature point P1 that is assumed to have the highest PCB concentration is selected from the predetermined area. This feature point P1 is comprehensively selected based on the arrangement location, usage method, work history, and the like of the equipment.

  Next, the feature point P1 is scraped for each first distance D1 (for example, 5 mm) set in the thickness direction of the wall WL, the floor WF, or the ceiling WT (scraping step). This cutting process is performed by using a grinding machine 1 having a grindstone, a grindstone, a wire brush, and the like, and a vacuum suction device C that sucks grinding powder (cutting site) generated by scraping concrete. Exhaust gas containing the grinding powder scraped off by the grinding machine 1 is sucked by the vacuum suction device C, and the grinding powder recovered by filtering the exhaust gas passing through the pipe 3 is stored in the dust collector 2. The exhaust from which the grinding powder has been separated is detoxified by an exhaust treatment facility such as an activated carbon tank.

  Next, the PCB concentration of the grinding powder (cutting part) for the first distance D1 stored in the dust collecting unit 2 is measured (measurement step). Next, it is determined whether or not the PCB concentration of the grinding powder is lower than a reference value (for example, 0.03 mg / L-test solution, which is a graduation reference for PCB), and the above-described cutting process until the PCB concentration becomes lower than the reference value. And repeat the measurement process N times. Next, the first distance D1 is added N times, and the second distance D2 (D1 × N) corresponding to the grinding powder (cutting site) having a PCB concentration equal to or lower than the reference value is specified (specifying step). In the dust collection unit 2 of the present embodiment, the dust collection bag is removed when the grinding powder for the first distance D1 is stored, and a new dust collection bag is installed in the next cutting process. I am going to do that. Thereby, the grinding powder of the 1st distance D1 and the grinding powder of the following 1st distance D1 do not mix.

  Next, the wall WL, the floor WF, or the entire ceiling WT in a predetermined area is scraped and removed using the grinding machine 1 until the third distance D3 (D2-D1 = D1 × (N−1)) is reached from the surface ( Removal step). The removed grinding powder is refilled in a container and rendered harmless in a plasma melting furnace. In addition, after reducing the PCB concentration of the removed grinding powder below the reference value with the cleaning equipment, the PCB oil may be chemically treated, or it may be carried out from the PCB processing facility and properly processed at a different PCB processing facility. The detoxification method is not particularly limited.

  Next, at the analysis point P2 different from the feature point P1 in the predetermined area, the wall WL, the floor WF or the ceiling WT for the first distance P1 is scraped with the grinder 1, and the PCB concentration of the grinding powder (scraped part) is the reference value. It is determined whether or not (analysis process). The analysis point P2 is preferably a point that is assumed to have the next highest PCB concentration after the feature point P1.

  If the PCB concentration of the grinding powder is equal to or lower than the reference value in the analysis step, the PCB removal in the predetermined area is terminated. On the other hand, when the PCB concentration of the grinding powder is larger than the reference value in the analysis step, the wall WL, the floor WF or the ceiling WT corresponding to the first distance D1 below the third distance D3 is scraped by the grinding machine 1 at the analysis point P2. Then, the process is repeated N times until the PCB concentration of the grinding powder (cutting part) is below the reference value. Next, the wall WL, the floor WF, or the entire ceiling WT in a predetermined area is removed by grinding using the grinding machine 1 until the third distance D3 (D2−D1 = D1 × (N−1)) is reached from the surface. The removed grinding powder is refilled in a container and rendered harmless in a plasma melting furnace. In addition, after reducing the PCB concentration of the removed grinding powder below the reference value with the cleaning equipment, the PCB oil may be chemically treated, or it may be carried out from the PCB processing facility and properly processed at a different PCB processing facility. The detoxification method is not particularly limited.

  Next, at the analysis point P2 ′ (preferably the point where the third highest PCB concentration is assumed) different from the feature point P1 and the analysis point P2 in the predetermined area, the wall WL for the first distance P1, The floor WF or the ceiling WT is scraped off by the grinding machine 1. After that, the same operation as that at the analysis point P2 described above where the PCB concentration of the grinding powder is below the reference value is repeated.

  In this way, the PCB concentration of the grinding powder scraped for each first distance D1 is measured at the characteristic point P1 provided in the predetermined area of the wall WL, the floor WF, or the ceiling WT. For this reason, the inconvenience that the grinding powder of the first distance D1 and the grinding powder of the next first distance D1 are mixed and the PCB concentration for each grinding powder cannot be measured accurately can be solved. As a result, it is possible to accurately measure the PCB concentration of the grinding powder at the second distance D2 (D1 × N) obtained by adding the first distance D1 N times, and the third distance D3 (depth of penetration of the PCB) D2-D1) can be reliably identified.

  Further, in the removing step, the scraping is performed until the third distance D3 is reached from the surface of the wall WL, the floor WF, or the ceiling WT in the predetermined area, so that the trouble of scraping while measuring the PCB concentration at each of a plurality of points can be saved. Furthermore, in the present embodiment, the second distance D2 at which the PCB concentration is equal to or less than the reference value is specified, so that it is efficient without being cut deeper than necessary.

  On the other hand, even if a feature point P1 that is assumed to have a high PCB concentration is selected from a work history or the like in a predetermined area, there is a possibility that a point with a higher PCB concentration exists. If the PCB concentration of the grinding powder for the first distance D1 at the analysis point P2 different from the characteristic point P1 is determined after scraping the wall WL, floor WF or ceiling WT to the third distance D3 as in the present embodiment, The PCB of the wall WL, floor WF or ceiling WT can be removed more reliably.

[Other Embodiments]
(1) When the feature point P1 having the highest PCB concentration in the predetermined area can be reliably selected, the analysis step in the above-described embodiment may be omitted. Further, the analysis process may be executed only at one analysis point P2 without being executed at the plurality of analysis points P2, P2 ′,.
(2) In the above-described embodiment, an example in which the same grinding machine 1 is used as a device for scraping the wall WL, the floor WF, or the ceiling WT in the cutting process and the removing process has been described. The machine 1 may be used and a large grinding machine or excavator may be used in the removal step, and is not particularly limited. Also, the grinding machine 1 may be any device as long as it can collect the scraped part.
(3) The partition member of the above-described embodiment is not limited to the wall WL, the floor WF, or the ceiling WT, and may be any partition member as long as it is a member into which PCB has penetrated.

  INDUSTRIAL APPLICABILITY The present invention is applicable to a method for purifying a PCB processing facility that scrapes and removes a partition member that partitions the inside of the PCB processing facility.

D1 1st distance D2 2nd distance D3 3rd distance P1 Feature point P2 Analysis point (point different from feature point)
WF Floor (partition member)
WL wall (partition member)
WT Ceiling (partition member)

Claims (2)

A feature step is provided for each predetermined area of the partition member that partitions the inside of the PCB processing facility, and the scraping step of scraping the feature point for each first distance set in the thickness direction of the partition member;
A measurement step of measuring the PCB concentration of the scraped part for each of the first distances in the partition member;
By setting the second distance in the thickness direction from the surface of the partition member by adding the first distance, the PCB concentration measured in the measurement step corresponds to the scraped site that is below a reference value A specific step of identifying the second distance;
A removal process of scraping and removing the partition member until reaching a third distance obtained by subtracting the first distance from the surface to the second distance in the predetermined area.   After the removing step, the partition member for the first distance is scraped at a point different from the feature point, and it is determined whether the PCB concentration of the scraped part for the first distance is equal to or less than the reference value. The method for purifying a PCB processing facility according to claim 1, further comprising an analysis step.

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