JP2018531301A5 - - Google Patents

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Publication number
JP2018531301A5
JP2018531301A5 JP2018514983A JP2018514983A JP2018531301A5 JP 2018531301 A5 JP2018531301 A5 JP 2018531301A5 JP 2018514983 A JP2018514983 A JP 2018514983A JP 2018514983 A JP2018514983 A JP 2018514983A JP 2018531301 A5 JP2018531301 A5 JP 2018531301A5
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JP
Japan
Prior art keywords
hydroxyl
sultone
alkyl
compounds
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018514983A
Other languages
English (en)
Japanese (ja)
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JP6622908B2 (ja
JP2018531301A6 (ja
JP2018531301A (ja
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Publication date
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Priority claimed from PCT/CN2015/091435 external-priority patent/WO2017059565A1/en
Publication of JP2018531301A publication Critical patent/JP2018531301A/ja
Publication of JP2018531301A6 publication Critical patent/JP2018531301A6/ja
Publication of JP2018531301A5 publication Critical patent/JP2018531301A5/ja
Application granted granted Critical
Publication of JP6622908B2 publication Critical patent/JP6622908B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018514983A 2015-10-08 2015-10-08 アミン、ポリアクリルアミド、及びスルトンの反応生成物の化合物を含有する銅電気めっき浴 Expired - Fee Related JP6622908B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/091435 WO2017059565A1 (en) 2015-10-08 2015-10-08 Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

Publications (4)

Publication Number Publication Date
JP2018531301A JP2018531301A (ja) 2018-10-25
JP2018531301A6 JP2018531301A6 (ja) 2018-12-13
JP2018531301A5 true JP2018531301A5 (OSRAM) 2019-10-31
JP6622908B2 JP6622908B2 (ja) 2019-12-18

Family

ID=58487163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018514983A Expired - Fee Related JP6622908B2 (ja) 2015-10-08 2015-10-08 アミン、ポリアクリルアミド、及びスルトンの反応生成物の化合物を含有する銅電気めっき浴

Country Status (7)

Country Link
US (2) US10604858B2 (OSRAM)
EP (1) EP3359552B1 (OSRAM)
JP (1) JP6622908B2 (OSRAM)
KR (1) KR102125240B1 (OSRAM)
CN (1) CN108026129A (OSRAM)
TW (1) TWI609101B (OSRAM)
WO (1) WO2017059565A1 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3359552B1 (en) * 2015-10-08 2020-04-01 Rohm and Haas Electronic Materials LLC Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
CN108026655B (zh) * 2015-10-08 2020-04-14 罗门哈斯电子材料有限责任公司 含有胺和聚丙烯酰胺的反应产物的化合物的铜电镀覆浴

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2453847B1 (fr) * 1979-04-13 1985-08-16 Anvar Procede pour l'obtention d'ampholytes porteurs utilisables dans les diverses techniques d'electrofocalisation
IT1254898B (it) * 1992-04-21 1995-10-11 Gianfranco Palumbo Idrogeli di tipo polietereammidoamminico come materiali eparinizzabili
US5534611A (en) * 1993-10-29 1996-07-09 Nalco Chemical Company Sulfonated and carboxylated aminoethylenephosphonic acid and aminobis (methylene) phosphinic acid
US5866660A (en) * 1997-03-13 1999-02-02 Isp Investments Inc. Polyvinyl prolidone and crosslinker with divinyl and chelation group
EP2199315B1 (en) * 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
EP2714807B1 (en) * 2011-06-01 2019-01-02 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
KR101385280B1 (ko) * 2012-05-23 2014-04-16 한국과학기술원 역상 현탁중합과 전구체를 이용한 가교된 하이퍼브랜치 폴리아미도아민 입자의 제조 방법
EP2917265B1 (en) * 2012-11-09 2019-01-02 Basf Se Composition for metal electroplating comprising leveling agent
US20160104918A1 (en) * 2013-05-24 2016-04-14 Joyce Wang Gel polymer electrolyte and lithium ion batteries employing the gel polymer electrolyte
US9922844B2 (en) * 2014-03-12 2018-03-20 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
CN104762643A (zh) * 2014-12-17 2015-07-08 安捷利电子科技（苏州）有限公司 一种通孔、盲孔和线路共镀的镀铜药水
EP3359552B1 (en) * 2015-10-08 2020-04-01 Rohm and Haas Electronic Materials LLC Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

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