JP2018523154A5 - - Google Patents

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Publication number
JP2018523154A5
JP2018523154A5 JP2017562599A JP2017562599A JP2018523154A5 JP 2018523154 A5 JP2018523154 A5 JP 2018523154A5 JP 2017562599 A JP2017562599 A JP 2017562599A JP 2017562599 A JP2017562599 A JP 2017562599A JP 2018523154 A5 JP2018523154 A5 JP 2018523154A5
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JP
Japan
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data
processing module
image processing
pinhole
image
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JP2017562599A
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English (en)
Japanese (ja)
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JP2018523154A (ja
JP7195738B2 (ja
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Priority claimed from PCT/US2016/031570 external-priority patent/WO2016195927A1/en
Publication of JP2018523154A publication Critical patent/JP2018523154A/ja
Publication of JP2018523154A5 publication Critical patent/JP2018523154A5/ja
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JP2017562599A 2015-06-02 2016-05-10 構造化照明イメージングシステムを較正するためおよび構造化照明画像をキャプチャするためのシステムおよび方法 Active JP7195738B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562169675P 2015-06-02 2015-06-02
US62/169,675 2015-06-02
PCT/US2016/031570 WO2016195927A1 (en) 2015-06-02 2016-05-10 Systems and methods for calibrating a structured illumination imaging system and for capturing a structured illumination image

Publications (3)

Publication Number Publication Date
JP2018523154A JP2018523154A (ja) 2018-08-16
JP2018523154A5 true JP2018523154A5 (https=) 2019-06-13
JP7195738B2 JP7195738B2 (ja) 2022-12-26

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JP2017562599A Active JP7195738B2 (ja) 2015-06-02 2016-05-10 構造化照明イメージングシステムを較正するためおよび構造化照明画像をキャプチャするためのシステムおよび方法

Country Status (5)

Country Link
US (1) US10782514B2 (https=)
EP (2) EP3304166B1 (https=)
JP (1) JP7195738B2 (https=)
CN (1) CN107667310B (https=)
WO (1) WO2016195927A1 (https=)

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DE102021128444B4 (de) * 2021-11-02 2023-06-15 MarWeTec GmbH Verfahren zur optischen Vermessung von technischen Oberflächen und Vorrichtung zur Durchführung des Verfahrens

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