JP2018195607A - Substrate processing device and method for maintenance of substrate processing device - Google Patents

Abstract

To adequately perform the maintenance of a liquid discharge unit.SOLUTION: A substrate processing device 1 comprises: a process liquid supplying unit 5 which brings up a process liquid; a liquid discharge unit 60 which discharges the process liquid from the process liquid supplying unit 5 to the outside of a chamber 11; a cleaning liquid supplying unit 63 which supplies the liquid discharge unit 60 with a cleaning liquid; a detector unit 64 which acquires, from the liquid discharge unit 60, a necessity-of-maintenance degree indicative of a degree of the necessity of maintenance of the liquid discharge unit 60; and a control part 71. The control part causes the cleaning liquid supplying unit 63 to supply the cleaning liquid to the liquid discharge unit 60 when the necessity-of-maintenance degree acquired by the detector unit 64 is a first threshold or higher and lower than a second threshold. The control part 71 issues a warning signal when the necessity-of-maintenance degree acquired by the detector unit 64 is the second threshold or higher. Thus, when pollution or clogging occurs in the liquid discharge unit 60 and the substrate processing device needs maintaining, the maintenance of the liquid discharge unit 60 can be suitably and automatically performed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a substrate processing apparatus for processing a substrate and a maintenance method for the substrate processing apparatus.

  Conventionally, in a manufacturing process of a semiconductor substrate (hereinafter simply referred to as “substrate”), various processes are performed on the substrate. For example, in the coating processing apparatus of Patent Document 1, a resist solution is supplied onto a wafer held by a spin chuck from a resist solution discharge nozzle. Resist liquid or the like scattered from the wafer is received by the cup and discharged from the bottom of the cup to the drain.

  Patent Document 2 discloses a cleaning apparatus that cleans a substrate by immersing the substrate in a processing tank in which a chemical solution is stored. In the said cleaning apparatus, the liquid level sensor which detects the height of the liquid level in a processing tank is provided. In the liquid level sensor, nitrogen gas is sent to a tube installed in the treatment tank at a constant pressure, and the liquid level of the chemical liquid is obtained based on the pressure difference between the pressure in the chemical liquid and the atmospheric pressure.

JP 2004-305966 A JP 2003-230868 A

  By the way, in such a substrate processing apparatus, a processing liquid having a relatively high viscosity may be used. In addition, when processing by sequentially supplying a plurality of types of processing liquids to the substrate, a plurality of types of processing liquids that increase in viscosity by causing phase separation or gelation when mixed are used. Sometimes. Moreover, coagulation | solidification may arise by mixing with multiple types of processing liquid. If such a high-viscosity treatment liquid, gel-like substance, coagulated substance, or the like adheres to or clogs the drainage part, there is a possibility that the discharge of the treatment liquid by the drainage part may be hindered.

  In Patent Document 2, in order to prevent the tube of the liquid level sensor from being clogged with a reaction product formed in the chemical solution, air or the like is supplied to the tube when the chemical solution in the processing tank is changed or at the operator's judgment. It has been proposed to blow off the reaction product from the tube by pumping. However, when cleaning the tube at the time of chemical solution exchange, if the tube is clogged before the chemical solution exchange, the cleaning device may malfunction. Further, when the tube is cleaned based on the operator's judgment, if the tube is clogged before the operator's inspection or the operator makes a judgment error, the cleaning device may possibly malfunction.

  The present invention has been made in view of the above problems, and an object of the present invention is to suitably perform maintenance of a drainage part in a substrate processing apparatus. Another object is to automatically switch processing according to the necessity of maintenance of the drainage section.

  The invention according to claim 1 is a substrate processing apparatus for processing a substrate, wherein the chamber, a substrate holding part for holding the substrate in the chamber, a processing liquid supply part for discharging a processing liquid, and the processing liquid A drainage unit that discharges the processing liquid from the supply unit to the outside of the chamber, a cleaning liquid supply unit that supplies the cleaning liquid to the drainage unit, and a maintenance necessity that indicates the degree of maintenance required for the drainage unit When the maintenance necessity acquired by the detection unit is greater than or equal to a first threshold value and less than a second threshold value, the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit. And a control unit that issues a warning signal when the maintenance necessity acquired by the detection unit is equal to or greater than the second threshold value.

  The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the maintenance by the detection unit is required when the control unit issues a discharge start command to the processing liquid supply unit. The degree is acquired.

  Invention of Claim 3 is the substrate processing apparatus of Claim 2, Comprising: When the output from the said detection part is more than the said 1st threshold value and less than the said 2nd threshold value, the said discharge start instruction | command is the said After the processing liquid is transmitted to the processing liquid supply unit, the processing liquid is supplied from the processing liquid supply unit to the substrate and the substrate is processed, the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit. .

  A fourth aspect of the present invention is the substrate processing apparatus according to any one of the first to third aspects, wherein after the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit, the detection unit If the maintenance necessity level is reacquired by the detection unit and the maintenance necessity level reacquired by the detection unit is greater than or equal to the first threshold value and less than the second threshold value, the cleaning liquid supply is controlled by the control unit. When the cleaning liquid is supplied from the unit to the drainage unit and the maintenance necessity reacquired by the detection unit is equal to or greater than the second threshold, a warning signal is issued by the control unit.

  A fifth aspect of the present invention is the substrate processing apparatus according to any one of the first to fourth aspects, wherein the detection unit is directed toward a transparent or translucent drainage pipe of the drainage unit. A light-emitting unit that emits light; and a light-receiving unit that receives light from the light-emitting unit that has passed through the drainage tube, the processing liquid discharged from the processing liquid supply unit is colored, and the first threshold value is The second threshold corresponds to the amount of light reduced due to the treatment liquid remaining in the drain pipe, corresponding to the amount of light reduced due to the coloring of the inner surface of the drain pipe by the treatment liquid.

  According to a sixth aspect of the present invention, there is provided a chamber, a substrate holding part for holding a substrate in the chamber, a processing liquid supply part for discharging a processing liquid, and a processing liquid from the processing liquid supply part outside the chamber. A substrate processing apparatus maintenance method for processing the substrate, comprising: a) a maintenance necessity level indicating a degree of necessity of maintenance of the drainage unit from the drainage unit And b) when the maintenance necessity acquired in the step a) is not less than a first threshold value and less than a second threshold value, a cleaning liquid is supplied to the drainage part, and in the step a) And a step of issuing a warning signal when the acquired maintenance necessity level is equal to or greater than the second threshold value.

  A seventh aspect of the present invention is the maintenance method according to the sixth aspect, wherein the step a) is performed by using a discharge start command issued to the processing liquid supply unit as a trigger.

  The invention according to claim 8 is the maintenance method according to claim 7, wherein, in the step b), when the degree of maintenance necessity is not less than the first threshold value and less than the second threshold value, the discharge start is performed. The command is transmitted to the processing liquid supply unit, and after the processing liquid is supplied from the processing liquid supply unit to the substrate and the substrate is processed, the cleaning liquid is supplied to the drainage unit.

  Invention of Claim 9 is the maintenance method as described in any one of Claim 6 thru | or 8, Comprising: When the said washing | cleaning liquid is supplied to the said drainage part in c) said b) process, said b ) After the step, the step of reacquiring the maintenance necessity, and d) when the maintenance necessity reacquired in the c) step is not less than the first threshold and less than the second threshold. And a step of supplying a warning signal when the cleaning liquid is supplied to the drainage part and the maintenance necessity reacquired in the step c) is equal to or greater than the second threshold value.

  Invention of Claim 10 is the maintenance method as described in any one of Claim 6 thru | or 9, Comprising: In the said a) process, the said maintenance necessity is transparent or translucent of the said drainage part. The processing liquid obtained based on the amount of light transmitted through the drainage pipe and discharged from the processing liquid supply unit is colored, and the first threshold value is determined by coloring the inner surface of the drainage pipe with the processing liquid. Corresponding to the reduced amount of light, the second threshold corresponds to the amount of light that is reduced due to the treatment liquid remaining in the drainage pipe.

  In the present invention, the drainage part can be suitably maintained.

It is a figure which shows the structure of the substrate processing apparatus which concerns on one embodiment. It is a block diagram which shows a process liquid supply part and a process liquid discharge part. It is a figure which shows the flow of a maintenance of a drainage part. It is a figure which shows the flow of a maintenance of a drainage part. It is a figure which shows the structure of another substrate processing apparatus.

  FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-wafer type apparatus that processes semiconductor substrates 9 (hereinafter simply referred to as “substrates 9”) one by one. The substrate processing apparatus 1 performs processing by supplying a processing liquid to the substrate 9. In FIG. 1, a part of the configuration of the substrate processing apparatus 1 is shown in cross section.

  The substrate processing apparatus 1 includes a chamber 11, a substrate holding unit 31, a substrate rotating mechanism 33, a cup unit 4, a processing liquid supply unit 5, a processing liquid discharge unit 6, and a control unit 71. Inside the chamber 11, the substrate holding part 31, the cup part 4 and the like are accommodated. The control unit 71 controls each configuration of the substrate processing apparatus 1. The control unit 71 is a general computer system including a CPU that performs various arithmetic processes, a ROM that stores basic programs, a RAM that stores various information, and the like.

  The substrate holding part 31 is a substantially disk-shaped member centering on the central axis J1 which faces the up-down direction. The substrate 9 is disposed above the substrate holding unit 31. The substrate 9 is held by the substrate holding unit 31 in a horizontal state in the chamber 11. The substrate rotation mechanism 33 is disposed below the substrate holding unit 31. The substrate rotation mechanism 33 rotates the substrate 9 together with the substrate holder 31 around the central axis J1. The substrate rotation mechanism 33 is accommodated in a rotation mechanism accommodating portion 34 having a substantially cylindrical shape with a lid.

  The processing liquid supply unit 5 discharges the processing liquid toward the substrate 9. In the example illustrated in FIG. 1, the treatment liquid supply unit 5 individually supplies a plurality of types of treatment liquids to the substrate 9. The processing liquid supply unit 5 includes a first nozzle 51, a second nozzle 52, and a third nozzle 53. Each of the first nozzle 51 and the second nozzle 52 supplies a processing liquid from above the substrate 9 toward the upper main surface of the substrate 9 (hereinafter referred to as “upper surface 91”). In a state where the processing liquid is supplied from the first nozzle 51 to the substrate 9, the second nozzle 52 and the third nozzle 53 are retracted to the outside in the radial direction of the substrate 9. When the processing liquid is supplied from the second nozzle 52 to the substrate 9, the first nozzle 51 and the third nozzle 53 retreat outward in the radial direction of the substrate 9, and the second nozzle 52 is above the substrate 9. To position. The third nozzle 53 supplies the processing liquid from above the substrate 9 toward the peripheral region (that is, the edge portion) of the upper surface 91 of the substrate 9. In FIG. 1, the first nozzle 51, the second nozzle 52, and the third nozzle 53 are drawn above the substrate 9. The processing liquid supply unit 5 may also include a lower nozzle that is disposed below the substrate 9 and supplies the processing liquid to the lower main surface of the substrate 9.

  The cup portion 4 is an annular member centered on the central axis J <b> 1 and is disposed around the substrate 9 and the substrate holding portion 31. The cup part 4 includes an upper cup part 41, a lower cup part 42, and a cup moving mechanism 43. The upper cup portion 41 is a substantially cylindrical member centered on the central axis J1. The upper cup portion 41 is disposed on the outer side in the radial direction of the substrate 9 and the substrate holding portion 31 and covers the sides of the substrate 9 and the substrate holding portion 31 over the entire circumference. The upper cup portion 41 receives a processing liquid and the like scattered from the rotating substrate 9 toward the periphery. The cup moving mechanism 43 moves the upper cup portion 41 in the vertical direction. The upper cup portion 41 is moved by a cup moving mechanism 43 between a processing position that is a position around the substrate 9 shown in FIG. 1 and a retracted position below the processing position.

  The lower cup part 42 is a bottomed substantially cylindrical member centering on the central axis J1. The lower cup portion 42 is disposed on the radially outer side of the rotation mechanism housing portion 34 below the upper cup portion 41. For example, the lower cup portion 42 is fixed to the outer surface of the rotation mechanism housing portion 34. The lower cup part 42 is connected to the lower part of the upper cup part 41. Specifically, the lower end portion of the upper cup portion 41 is inserted into the lower cup portion 42. The lower cup part 42 receives the processing liquid received by the upper cup part 41. At the bottom of the lower cup portion 42, a drain port 44 for discharging the processing liquid received by the lower cup portion 42 is provided. A drain pipe 61 (hereinafter, referred to as “common drain pipe 61”) of the processing liquid discharge section 6 that guides the processing liquid and the like to the outside of the chamber 11 is connected to the drain port 44. The common drain pipe 61 extends downward from the drain port 44. For example, the common drain pipe 61 may extend substantially vertically downward, or may extend downward while being inclined with respect to the vertical direction.

  FIG. 2 is a block diagram illustrating the processing liquid supply unit 5 and the processing liquid discharge unit 6 of the substrate processing apparatus 1. In FIG. 2, configurations other than the processing liquid supply unit 5 and the processing liquid discharge unit 6 are also shown. The first nozzle 51 is connected to a chemical liquid supply source 54, a substrate cleaning liquid supply source 55, and an IPA (isopropyl alcohol) supply source 56. The second nozzle 52 is connected to the filler solution supply source 57. The third nozzle 53 is connected to the IPA supply source 56.

  The chemical solution delivered from the chemical solution supply source 54 is supplied to the central portion of the upper surface 91 of the substrate 9 through the first nozzle 51. As the chemical solution, for example, an etching solution such as hydrofluoric acid or an aqueous tetramethylammonium hydroxide solution is used. The substrate cleaning liquid sent from the substrate cleaning liquid supply source 55 is also supplied to the central portion of the upper surface 91 of the substrate 9 through the first nozzle 51. For example, pure water (DIW: deionized water) or carbonated water is used as the substrate cleaning liquid. The IPA sent from the IPA supply source 56 to the first nozzle 51 is supplied to the central portion of the upper surface 91 of the substrate 9 through the first nozzle 51.

  At the lower end of the first nozzle 51, for example, a plurality of discharge ports for chemical solution, substrate cleaning solution, and IPA are provided, and different types of treatment liquids are supplied to the upper surface of the substrate 9 through different pipes and discharge ports. 91. In the treatment liquid supply unit 5, for example, instead of the first nozzle 51, a plurality of treatment liquid nozzles that respectively supply the chemical liquid, the substrate cleaning liquid, and the IPA to the central portion of the upper surface 91 of the substrate 9 may be provided.

  The filler solution sent from the filler solution supply source 57 to the second nozzle 52 is supplied to the central portion of the upper surface 91 of the substrate 9 through the second nozzle 52. As the filler solution, for example, a solution in which a polymer that is a solid solute is dissolved in a solvent is used. When the polymer is water-insoluble, for example, IPA is used as the solvent. The polymer is solidified by evaporation of the solvent on the substrate 9 and is sublimated in a device different from the substrate processing apparatus 1, and is also called a sublimation agent. Further, the filler solution has a property of causing phase separation to become a gel-like substance by mixing with a specific liquid (for example, water) different from the solvent. The filler solution is, for example, a colored liquid such as red.

  The IPA sent from the IPA supply source 56 to the third nozzle 53 is supplied to the peripheral area of the upper surface 91 of the substrate 9 through the third nozzle 53.

  The processing of the substrate 9 in the substrate processing apparatus 1 is performed in the order of chemical processing, cleaning processing, IPA replacement processing, filler filling processing, edge rinse processing, and drying processing, for example. Specifically, first, a chemical solution is applied to the substrate 9 by supplying the chemical solution from the first nozzle 51 to the rotating substrate 9. Subsequently, the supply of the chemical liquid is stopped, and the substrate 9 is cleaned by supplying the substrate cleaning liquid from the first nozzle 51 to the rotating substrate 9. Next, the supply of the substrate cleaning liquid is stopped, and IPA is supplied from the first nozzle 51 to the rotating substrate 9, whereby the substrate cleaning liquid on the substrate 9 is replaced with IPA.

  Furthermore, after the supply of IPA is stopped and the filler solution is supplied from the second nozzle 52 to the rotating substrate 9 for a predetermined time, the rotation speed of the substrate 9 is reduced, and the entire upper surface 91 of the substrate 9 is The state covered with the filler solution is maintained. As a result, the filler solution is filled between the patterns on the upper surface 91 of the substrate 9. Thereafter, the rotational speed of the substrate 9 is increased, and IPA is supplied from the third nozzle 53 to the peripheral region of the upper surface 91 of the substrate 9, thereby performing an edge rinse process for removing the filler solution in the peripheral region of the substrate 9. Is called. And the rotational speed of the board | substrate 9 is increased and the drying process of the board | substrate 9 is performed. The chemical liquid, the substrate cleaning liquid, the IPA and the filler solution supplied onto the substrate 9 during the above processing are received by the cup unit 4 and are passed to the common drain pipe 61 of the processing liquid discharge unit 6 through the drain port 44. Discharged.

  The processing liquid discharge unit 6 includes a liquid discharge unit 60, a cleaning liquid supply unit 63, and a detection unit 64. The drainage unit 60 includes the above-described common drainage pipe 61 and a switching valve 62. The common drain pipe 61 is a drain pipe for discharging a plurality of types of processing liquid supplied from the processing liquid supply unit 5 to the substrate 9 to the outside of the chamber 11. The common drain pipe 61 is, for example, a transparent or translucent pipe. The switching valve 62 is connected to the common drain pipe 61 outside the chamber 11. The switching valve 62 switches destinations of a plurality of types of processing liquids guided from the chamber 11 by the common drain pipe 61.

  In the example shown in FIG. 2, three liquid supply pipes 621 a, 621 b, and 621 c are connected to the switching valve 62. The switching valve 62 is a so-called triple valve having three valves 62a, 62b, and 62c. In the switching valve 62, by switching the built-in valves 62a, 62b, 62c, the liquid flowing in from the common drain pipe 61 is changed to any one of the three liquid feeding pipes 621a, 621b, 621c (a plurality of feeding pipes). A liquid tube may be selected). In addition, by closing all the valves 62a, 62b, and 62c of the switching valve 62, the liquid is not guided to any of the three liquid supply pipes 621a, 621b, and 621c, and the liquid is temporarily stored in the switching valve 62. Can also be stored. In the switching valve 62, for example, IPA discharged from the chamber 11 is guided to the uppermost liquid supply pipe 621a in the drawing. Moreover, the filler solution discharged | emitted from the chamber 11 is guide | induced to the 2nd liquid feeding pipe | tube 621b from the upper side in a figure. Further, the chemical liquid and the substrate cleaning liquid discharged from the chamber 11 are guided to the lowermost liquid supply pipe 621c in the drawing.

  The detection unit 64 is provided at a predetermined detection position on the common drainage pipe 61 and acquires the maintenance necessity level of the drainage unit 60. The maintenance necessity level of the drainage unit 60 is an index indicating the degree of necessity of maintenance of the drainage unit 60. As the necessity for maintenance in the drainage unit 60 increases, the degree of maintenance necessity increases. The detection position described above may be any position on the common drain pipe 61 that connects the drain port 44 and the switching valve 62. Preferably, the detection position by the detection unit 64 is outside the chamber 11. For example, the detection unit 64 is attached to the common drain pipe 61 outside the chamber 11. The attachment position of the detection unit 64 is the detection position described above.

  The detection unit 64 is an optical sensor including, for example, a light emitting unit 641 and a light receiving unit 642. The light emitting unit 641 emits light toward the transparent or semi-transparent common drain pipe 61. The light receiving unit 642 receives light emitted from the light emitting unit 641 and transmitted through the common drain pipe 61. The above-mentioned maintenance necessity level is acquired based on the amount of light received by the light receiving unit 642 (that is, the amount of received light).

  The degree of maintenance required is, for example, the amount of light received in the reference state in which the common drain pipe 61 is in a normal state as the reference amount of received light, and the actual amount of light received by the light receiving unit 642 with respect to the reference amount of received light (hereinafter “measured amount of received light” It is acquired based on the ratio. In this case, as the ratio of the measured light reception amount to the reference light reception amount decreases, the maintenance necessity increases. The maintenance necessity level acquired by the detection unit 64 is sent to the control unit 71. In the common drain pipe 61, only a part (that is, a detection position) where the detection unit 64 is provided may be transparent or translucent, and parts other than the detection position may be opaque.

  The cleaning liquid supply unit 63 supplies the cleaning liquid (that is, the draining part cleaning liquid) to the draining unit 60. Specifically, the cleaning liquid supply unit 63 is connected to the common drain pipe 61 between the chamber 11 and the detection unit 64 and supplies the cleaning liquid to the common drain pipe 61. As the cleaning liquid supplied from the cleaning liquid supply unit 63, for example, various liquids having a property of dissolving the polymer that has been turned into a gel substance are used. The cleaning liquid is, for example, the same liquid as the solvent of the filler solution. In the above example, IPA is used as the cleaning liquid. In this case, the cleaning liquid from the cleaning liquid supply unit 63 is the same as one of the plurality of types of processing liquids supplied from the processing liquid supply unit 5 to the substrate 9.

  The control unit 71 stores in advance a first threshold value and a second threshold value relating to the necessity of maintenance. The second threshold value is larger than the first threshold value and indicates that the need for maintenance is higher than the maintenance necessity level indicated by the first threshold value. The first threshold is a reference state in which a colored (for example, red) filler solution adheres to the inner surface of a transparent or translucent common drain pipe 61 and the inner face is colored, and the common drain pipe 61 is not colored. Corresponds to the amount of received light that is reduced compared to. The second threshold value is the amount of measured light received that is reduced compared to the reference state due to increased scattering and refraction in the common drainpipe 61 due to the treatment liquid such as the filler solution remaining in the common drainpipe 61. Corresponding to That is, the first threshold value is a threshold value corresponding to the dirt of the common drain pipe 61, and the second threshold value is a threshold value corresponding to the clogging of the common drain pipe 61. For example, the first threshold value corresponds to a measured light reception amount of about 50% of the reference light reception amount, and the second threshold value corresponds to a measurement light reception amount of about 10% of the reference light reception amount.

  In the substrate processing apparatus 1, when the maintenance necessity acquired by the detection unit 64 is less than the first threshold, the control unit 71 determines that maintenance of the drainage unit 60 is unnecessary. In addition, when the maintenance necessity acquired by the detection unit 64 is equal to or higher than the first threshold value and lower than the second threshold value, the control unit 71 indicates that the drainage unit 60 is not clogged but contamination has progressed to some extent. to decide. Then, the control unit 71 controls the cleaning liquid supply unit 63 to supply the cleaning liquid from the cleaning liquid supply unit 63 to the drainage unit 60 so that the drainage unit 60 is cleaned. On the other hand, when the maintenance necessary degree acquired by the detection unit 64 is equal to or greater than the second threshold, the control unit 71 determines that the drainage unit 60 is clogged, and does not perform cleaning of the drainage unit 60. To emit.

  Hereinafter, the maintenance flow of the drainage unit 60 in the substrate processing apparatus 1 will be described with reference to FIGS. 3A and 3B. In the maintenance illustrated in FIGS. 3A and 3B, as described above, the substrate 9 is subjected to the chemical solution processing, the cleaning processing, the IPA replacement processing, the filler filling processing, the edge rinse processing, and the drying processing (hereinafter, these processing is performed). When the processing is collectively performed in order, the necessity of maintenance of the processing liquid discharge unit 6 is considered. Specifically, first, the control unit 71 issues a chemical liquid discharge start command to the processing liquid supply unit 5 (step S11). The discharge start command is a command for instructing the processing liquid supply unit 5 to start discharge of the chemical liquid onto the substrate 9. However, in step S <b> 11, the discharge start command issued from the control unit 71 is not yet sent to the processing liquid supply unit 5.

  Subsequently, the detection unit 64 is controlled by the control unit 71 with the discharge start command issued in step S11 as a trigger, and the necessity of maintenance is acquired (step S12). When the maintenance necessity level acquired by the detection unit 64 (that is, the received light amount acquired by the light receiving unit 642) is sent to the control unit 71, the control unit 71 sets the maintenance necessity level and the first threshold value and the second threshold value. Comparison is performed (step S13).

  When the maintenance necessity level output from the detection unit 64 is less than the first threshold, the control unit 71 determines that maintenance of the drainage unit 60 is unnecessary. Then, the discharge start command issued in step S11 is transmitted to the processing liquid supply unit 5, and the chemical liquid is supplied from the processing liquid supply unit 5 to the substrate 9 to perform the chemical processing. Thereafter, a cleaning process, an IPA replacement process, a filler filling process, an edge rinse process, and a drying process are sequentially performed on the substrate 9 (step S141). In this case, the drainage unit 60 is not cleaned. When the series of processes for the substrate 9 is completed, the substrate 9 is unloaded from the substrate processing apparatus 1 and the substrate 9 to be processed next is loaded into the substrate processing apparatus 1.

  When the maintenance necessity level output from the detection unit 64 is equal to or greater than the second threshold, the control unit 71 determines that the drainage unit 60 is clogged. Then, the discharge start command issued in step S11 is canceled without being transmitted to the processing liquid supply unit 5, and the above-described series of processing for the substrate 9 is stopped. Thereafter, a warning signal is issued by the control unit 71 (step S161). In the substrate processing apparatus 1, a warning operation is performed based on a warning signal from the control unit 71, and warning information is transmitted to the worker. The warning operation in the substrate processing apparatus 1 is, for example, notification by a warning sound, display of a warning on the operation screen of the substrate processing apparatus 1, display of a warning image on the operator's operation terminal, or display to the operator's communication terminal. Sending a warning email. The worker who has received the warning information performs, for example, a maintenance operation for eliminating clogging of the drainage unit 60.

  On the other hand, when the maintenance necessity output from the detection unit 64 is equal to or higher than the first threshold value and lower than the second threshold value, the control unit 71 can execute a series of processes on the substrate 9 but also needs to maintain the drainage unit 60. It is judged that. Then, the discharge start command issued in step S <b> 11 is transmitted to the processing liquid supply unit 5. As a result, the chemical liquid is supplied from the processing liquid supply unit 5 to the substrate 9 and the chemical liquid processing is performed on the substrate 9. Thereafter, a cleaning process, an IPA replacement process, a filler filling process, an edge rinse process, and a drying process are sequentially performed on the substrate 9 (step S151). When the series of processes for the substrate 9 is completed, the substrate 9 is unloaded from the substrate processing apparatus 1.

  Further, when the cleaning liquid supply unit 63 is controlled by the control unit 71, the above-described cleaning liquid is supplied from the cleaning liquid supply unit 63 to the common drain pipe 61 of the drainage unit 60, and the drainage unit 60 is cleaned ( Step S152). The cleaning of the drainage unit 60 is a preventive process for preventing the drainage unit 60 from being clogged. The drainage unit 60 may be cleaned in parallel with the unloading of the substrate 9 from the substrate processing apparatus 1 or may be performed before or after the unloading of the substrate 9.

  In the substrate processing apparatus 1, after the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the drainage unit 60 in step S152, the detection unit 64 reacquires the maintenance necessity (step S153). The maintenance necessity reacquired by the detection unit 64 in step S153 is compared with the first threshold value and the second threshold value in the control unit 71 (step S154).

  When the re-acquired degree of maintenance is less than the first threshold, the controller 71 determines that the drainage unit 60 has been suitably cleaned and the drainage unit 60 has been cleaned to a permissible range. In this case, the maintenance of the drainage unit 60 ends, and the substrate 9 to be processed next is carried into the substrate processing apparatus 1.

  When the re-acquired maintenance necessity is equal to or greater than the second threshold, the control unit 71 performs the state of the drainage unit 60 by processing the substrate 9 in step S151 and / or cleaning the drainage unit 60 in step S152. It is determined that the drainage part 60 is clogged. Then, a warning signal is issued by the control unit 71 (step S158), a warning operation based on the warning signal is performed, and warning information is transmitted to the worker. The worker who has received the warning information performs, for example, a maintenance operation for eliminating clogging of the drainage unit 60.

  On the other hand, when the re-acquired maintenance necessity is equal to or higher than the first threshold value and lower than the second threshold value, the control unit 71 has not removed the dirt of the drainage unit 60 to the allowable range, and It is determined that maintenance is required. Then, when the cleaning liquid supply unit 63 is controlled by the control unit 71, the above-described cleaning liquid is supplied from the cleaning liquid supply unit 63 to the common drain pipe 61 of the drainage unit 60, and the drainage unit 60 is cleaned again. (Step S155).

  When the cleaning of the drainage unit 60 is completed, the number of cleanings of the drainage unit 60 performed after step S11 (hereinafter referred to as “the number of cleanings”) is compared with a predetermined limit number (step S156). . The limit number is set in advance for the purpose of preventing the drainage unit 60 from being washed indefinitely. The limit number may be set as appropriate within a range of 2 times or more, for example, 3 times.

  When the number of cleanings of the drainage unit 60 is less than the limit number, the process returns to step S153, the maintenance necessity level is reacquired, and the maintenance necessity level is compared with the first threshold value and the second threshold value (step S153). , S154). When the re-acquired maintenance necessity is less than the first threshold value, the maintenance of the drainage unit 60 ends, and the substrate 9 to be processed next is carried into the substrate processing apparatus 1. When the re-acquired maintenance necessity level is equal to or higher than the second threshold value, a warning signal is issued by the control unit 71 (step S158).

  On the other hand, when the maintenance requirement reacquired is equal to or higher than the first threshold value and lower than the second threshold value, the cleaning liquid is supplied from the cleaning liquid supply unit 63, and the drainage unit 60 is cleaned again (step S155). Then, the number of cleanings of the drainage unit 60 is compared with the limited number of times (step S156). It judges that it is not carried out, and issues a warning signal (step S157). In the substrate processing apparatus 1, a warning operation based on the warning signal is performed, and warning information is transmitted to the worker. The worker who has received the warning information performs, for example, a maintenance operation for removing dirt from the drainage unit 60.

  As described above, the substrate processing apparatus 1 includes the chamber 11, the substrate holding unit 31, the drainage unit 60, the cleaning liquid supply unit 63, the detection unit 64, and the control unit 71. The substrate holding unit 31 holds the substrate 9 in the chamber 11. The processing liquid supply unit 5 discharges the processing liquid. The drainage unit 60 discharges the processing liquid from the processing liquid supply unit 5 to the outside of the chamber 11. The cleaning liquid supply unit 63 supplies the cleaning liquid to the drainage unit 60. The detecting unit 64 acquires a maintenance necessity level indicating the degree of maintenance necessity of the drainage unit 60 from the drainage unit 60. When the maintenance necessity acquired by the detection unit 64 is equal to or higher than the first threshold value and lower than the second threshold value, the control unit 71 causes the cleaning liquid supply unit 63 to supply the cleaning liquid to the drainage unit 60. When the maintenance necessity acquired by the detection unit 64 is equal to or greater than the second threshold, the control unit 71 issues a warning signal.

  As described above, the substrate processing apparatus 1 acquires the maintenance necessity from the drainage unit 60 (step S12), and performs the maintenance of the drainage unit 60 based on the maintenance necessity (steps S152 and S161). Thereby, when the drainage part 60 becomes dirty or clogged and maintenance is required, the maintenance of the drainage part 60 can be performed automatically and suitably. As a result, the maintenance time in the substrate processing apparatus 1 can be shortened and the production efficiency can be improved as compared with the case where maintenance is periodically performed even when maintenance is not necessary or is not necessary. Can do.

  In addition, in the substrate processing apparatus 1, when it is determined that the drainage unit 60 is to be maintained, the content of maintenance (that is, the type of maintenance) can be automatically switched according to the degree of maintenance. As described above, in the substrate processing apparatus 1, the prevention process for preventing clogging of the drainage unit 60 and the trouble detection process for detecting clogging of the drainage unit 60 can be performed with the same configuration. Therefore, the structure of the substrate processing apparatus 1 can be simplified.

  In the substrate processing apparatus 1, the degree of maintenance required by the detection unit 64 is acquired (step S <b> 12), triggered by the controller 71 issuing a discharge start command to the processing liquid supply unit 5 (step S <b> 11). Thereby, whenever the opportunity for the drainage part 60 to be utilized for discharge | emission of a process liquid arises, the necessity for the maintenance with respect to the drainage part 60 is considered. As a result, since the prevention process for preventing clogging of the drainage part 60 can be suitably performed, the possibility of clogging of the drainage part 60 can be reduced.

  As described above, when the output from the detection unit 64 is greater than or equal to the first threshold value and less than the second threshold value, the ejection start command is transmitted to the processing liquid supply unit 5, and the processing liquid is supplied from the processing liquid supply unit 5 to the substrate 9. Is supplied to process the substrate 9 (step S151). Thereafter, the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the drainage unit 60 (step S152). In this way, the cleaning efficiency of the substrate processing apparatus 1 can be further improved by cleaning the drainage unit 60 after the processing of the substrate 9 is performed without being interrupted or interrupted.

  In the substrate processing apparatus 1, after the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the drainage unit 60, the detection level is reacquired by the detection unit 64 (steps S 152 and S 153). When the maintenance necessity reacquired by the detection unit 64 is not less than the first threshold value and less than the second threshold value, the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the drainage unit 60 by the control of the control unit 71 (step S155). ). When the maintenance necessity reacquired by the detection unit 64 is equal to or greater than the second threshold value, the control unit 71 issues a warning signal (step S158). Thereby, when the washing | cleaning of the drainage part 60 in step S152 is insufficient, the drainage part 60 can be automatically rewashed. Further, when the state of the drainage unit 60 is deteriorated by the processing of the substrate 9 in step S151 or the cleaning in step S152 (that is, when the degree of clogging of the drainage unit 60 is deteriorated), the next substrate 9 is processed. Prior to performing the chemical treatment or the like, it is possible to quickly find the state deterioration of the drainage part 60.

  As described above, the detection unit 64 includes the light emitting unit 641 and the light receiving unit 642. The light emitting unit 641 emits light toward the transparent or translucent common drainage pipe 61 of the drainage unit 60. The light receiving unit 642 receives light from the light emitting unit 641 that has passed through the common drain pipe 61. Moreover, the processing liquid (for example, filler solution) discharged from the processing liquid supply part 5 is colored. The first threshold corresponds to the amount of light that has decreased due to the coloring of the inner surface of the common drain pipe 61 by the processing liquid. The second threshold corresponds to the amount of light that is reduced due to the treatment liquid being accumulated in the common drain pipe 61. Thereby, it is possible to easily and accurately detect the dirt of the common drain pipe 61 that is relatively difficult to detect. Further, the contamination of the common drain pipe 61 and the clogging of the drain section 60 can be accurately distinguished and detected.

  Various changes can be made in the substrate processing apparatus 1 described above.

  For example, the detection unit 64 is not necessarily the above-described optical sensor, and may be an optical sensor having another structure. The detection unit 64 may be various sensors other than the optical sensor (for example, a capacitance sensor attached to the wall surface of the common drainage pipe 61) as long as the maintenance necessity level can be acquired from the drainage unit 60. There may be. When a capacitance sensor is used as the detection unit 64, the common drain pipe 61 may be opaque. Further, the treatment liquid flowing through the common drain pipe 61 may be transparent or translucent.

  The flow of maintenance of the drainage unit 60 in the substrate processing apparatus 1 is not limited to that illustrated in FIGS. 3A and 3B, and may be changed as appropriate. For example, after cleaning the drainage unit 60 in step S152, steps S153 to S158 may be omitted and the maintenance of the drainage unit 60 may be completed.

  In the substrate processing apparatus 1, it is not always necessary to acquire the necessity of maintenance immediately before the series of processes on the substrate 9 (that is, immediately before supplying the processing liquid). For example, as shown in FIG. 4, acquisition of the necessity of maintenance may be performed immediately before pre-dispensing to the pre-dispensing unit 81 provided in the substrate processing apparatus 1. Pre-dispensing is, for example, discharging and discarding the processing liquid remaining at the tip of the first nozzle 51 before the processing liquid (for example, chemical) is supplied from the first nozzle 51 to the substrate 9. It is. Pre-dispensing may also be performed for the second nozzle 52 and the third nozzle 53, respectively. In FIG. 4, the chemical liquid supply source 54, the substrate cleaning liquid supply source 55, the IPA supply source 56, and the filler solution supply source 57 shown in FIG.

  The pre-dispensing part 81 is disposed outside the cup part 4 in the radial direction in the chamber 11. The pre-dispensing unit 81 receives the pre-dispensed processing liquid from the first nozzle 51. The processing liquid received by the pre-dispensing unit 81 is guided to the outside of the chamber 11 by the pre-dispensing pipe 82 and is guided to the common drain pipe 61 outside the chamber 11. The pre-dispensing pipe 82 is connected to the common drain pipe 61 on the chamber 11 side of the common drain pipe 61 from the detection position (that is, upstream of the position where the detection unit 64 is provided). In the example shown in FIG. 5, the pre-dispensing pipe 82 is connected to the common drain pipe 61 between the connection section where the cleaning liquid supply section 63 is connected to the common drain pipe 61 and the detection position by the detection section 64. The Note that the pre-dispensing pipe 82 may be connected to the common drain pipe 61 in the chamber 11.

  When acquisition of the necessity of maintenance is performed immediately before pre-dispensing, the maintenance flow of the drainage unit 60 is almost the same as that shown in FIGS. 3A and 3B. However, in step S <b> 11 of FIG. 3A, a discharge start command for pre-dispensing the chemical is issued from the control unit 71 to the processing liquid supply unit 5. Further, instead of a series of processes for the substrate 9 in step S141 and step S151, the discharge start command is transmitted to the processing liquid supply unit 5, and the chemical liquid is pre-dispensed from the processing liquid supply unit 5 to the pre-dispensing unit 81. . That is, a series of processing (step S151) is not performed on the substrate 9 before the drainage unit 60 is cleaned in step S152. Subsequent to the pre-dispensing of the chemical solution, pre-dispensing of the substrate cleaning liquid, IPA, and filler solution may be performed toward the pre-dispensing unit 81. Other steps are the same as those shown in FIGS. 3A and 3B.

  Even when the maintenance necessity level is acquired immediately before pre-dispensing, maintenance of the drainage unit 60 can be automatically and suitably performed as in the case illustrated in FIGS. 3A and 3B. As a result, the maintenance time in the substrate processing apparatus 1 can be shortened and the production efficiency can be improved. In the substrate processing apparatus 1, the preventive process for preventing clogging of the drainage unit 60 and the trouble detection process for detecting clogging of the drainage unit 60 can be performed with the same configuration. Therefore, the structure of the substrate processing apparatus 1 can be simplified.

  In the substrate processing apparatus 1 shown in FIG. 4, maintenance is required by the detection unit 64, similar to the case illustrated in FIGS. 3A and 3B, triggered by the control unit 71 issuing a discharge start command to the processing liquid supply unit 5. The degree is acquired (step S12). Thereby, since the preventive process which prevents the clogging of the drainage part 60 can be performed suitably, possibility that the clogging of the drainage part 60 will occur can be reduced.

  In the substrate processing apparatus 1, when the output from the detection unit 64 is greater than or equal to the first threshold and less than the second threshold, the ejection start command is transmitted to the treatment liquid supply unit 5 and pre-dispensing is performed. Thereafter, as in the case illustrated in FIGS. 3A and 3B, the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the drainage unit 60 (step S152). Thereby, the production efficiency of the substrate processing apparatus 1 can be further improved.

  In the substrate processing apparatus 1, as in the case illustrated in FIGS. 3A and 3B, after the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the liquid draining unit 60, the detection unit 64 reacquires the maintenance necessity level ( Steps S152 and S153). When the maintenance necessity reacquired by the detection unit 64 is not less than the first threshold value and less than the second threshold value, the cleaning liquid is supplied from the cleaning liquid supply unit 63 to the drainage unit 60 by the control of the control unit 71 (step S155). ). When the maintenance necessity reacquired by the detection unit 64 is equal to or greater than the second threshold value, the control unit 71 issues a warning signal (step S158). Thereby, when the washing | cleaning of the drainage part 60 in step S152 is insufficient, the drainage part 60 can be automatically rewashed. In addition, when the state of the drainage unit 60 deteriorates due to pre-dispensing of the processing liquid or the cleaning in step S152 (that is, when the degree of clogging of the drainage unit 60 deteriorates), the state of the drainage unit 60 is quickly deteriorated. Can be found in.

  In the substrate processing apparatus 1 shown in FIGS. 1 and 4, it is not always necessary to acquire the necessity of maintenance immediately before a series of processes on the substrate 9 or immediately before pre-dispensing. In other words, the acquisition of the necessity level of maintenance in step S12 does not need to be performed using a processing liquid discharge start command to the processing liquid supply unit 5 as a trigger. For example, the maintenance necessary degree acquisition (step S12) may be performed by using a predetermined number of substrates 9 as a trigger since the previous maintenance necessary degree acquisition. Alternatively, as the trigger, an elapsed time from the previous acquisition of the necessity for maintenance or the number of discharges of the filler solution from the previous acquisition of the need for maintenance may be used.

  Further, in the substrate processing apparatus 1, steps S11 to S13, S141, S151 to S158, and S161 to steps S11 and S141 shown in FIG. 3A and FIG. , S151 may be omitted. The process is performed in parallel with the cleaning process of the entire substrate processing apparatus 1, for example. In any case, similarly to the above, maintenance of the drainage part 60 can be performed automatically and suitably. Moreover, since the prevention process for preventing clogging of the drainage part 60 and the trouble detection process for detecting clogging of the drainage part 60 can be performed with the same configuration, the structure of the substrate processing apparatus 1 is simplified. be able to.

  In the substrate processing apparatus 1, the plurality of types of processing liquids supplied from the processing liquid supply unit 5 to the substrate 9 are not limited to the above-described example, and may be variously changed. Further, the cleaning liquid supplied from the cleaning liquid supply unit 63 to the drainage unit 60 may be variously changed. For example, an acidic treatment liquid and an alkaline treatment liquid that produce precipitates when mixed with the plurality of kinds of treatment liquids may be included. In this case, a liquid that dissolves the precipitate is used as the cleaning liquid supplied from the cleaning liquid supply unit 63.

  The substrate processing apparatus 1 described above may be used for processing glass substrates used in display devices such as liquid crystal display devices, plasma displays, and FEDs (field emission displays) in addition to semiconductor substrates. Alternatively, the substrate processing apparatus 1 described above may be used for processing of an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, and the like.

  The configurations in the above-described embodiments and modifications may be combined as appropriate as long as they do not contradict each other.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 5 Processing liquid supply part 9 Substrate 11 Chamber 31 Substrate holding part 60 Drainage part 61 Common drainage pipe 63 Cleaning liquid supply part 64 Detection part 71 Control part 641 Light emission part 642 Light receiving part S11-S13, S141, S151 Steps S158 and S161

Claims (10)

A substrate processing apparatus for processing a substrate,
A chamber;
A substrate holder for holding the substrate in the chamber;
A processing liquid supply section for discharging the processing liquid;
A drainage section for discharging the processing liquid from the processing liquid supply section to the outside of the chamber;
A cleaning liquid supply section for supplying a cleaning liquid to the drainage section;
A detection unit for obtaining a maintenance necessity level indicating the degree of necessity of maintenance of the drainage unit from the drainage unit;
When the maintenance necessity acquired by the detection unit is equal to or higher than a first threshold value and lower than a second threshold value, the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit, and the maintenance acquired by the detection unit A control unit that issues a warning signal when the degree of necessity is equal to or greater than the second threshold;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus according to claim 1, wherein the maintenance unit is acquired by the detection unit triggered by the controller issuing a discharge start command to the processing liquid supply unit. The substrate processing apparatus according to claim 2,
When the output from the detection unit is not less than the first threshold value and less than the second threshold value, the discharge start command is transmitted to the processing liquid supply unit, and the processing liquid is supplied from the processing liquid supply unit to the substrate. Then, after the substrate is processed, the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit. A substrate processing apparatus according to any one of claims 1 to 3, wherein
After the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit, the maintenance unit is reacquired by the detection unit,
When the maintenance necessity reacquired by the detection unit is not less than the first threshold and less than the second threshold, the cleaning liquid is supplied from the cleaning liquid supply unit to the drainage unit by the control of the control unit. ,
The substrate processing apparatus according to claim 1, wherein a warning signal is issued by the control unit when the maintenance necessity reacquired by the detection unit is equal to or greater than the second threshold value. The substrate processing apparatus according to claim 1, wherein
The detection unit is
A light emitting unit that emits light toward a transparent or translucent drainage tube of the drainage unit;
A light receiving unit that receives light from the light emitting unit that has passed through the drainage pipe;
With
The treatment liquid discharged from the treatment liquid supply unit is colored,
The first threshold corresponds to the amount of light reduced by coloring the inner surface of the drainage pipe with the treatment liquid,
The substrate processing apparatus, wherein the second threshold value corresponds to a light amount decreased due to the treatment liquid remaining in the drain pipe. A chamber, a substrate holding unit that holds the substrate in the chamber, a processing liquid supply unit that discharges the processing liquid, and a drainage unit that discharges the processing liquid from the processing liquid supply unit to the outside of the chamber, A maintenance method for a substrate processing apparatus for processing the substrate,
a) acquiring a maintenance necessity level indicating the degree of necessity of maintenance of the drainage unit from the drainage unit;
b) When the maintenance necessity acquired in the step a) is not less than a first threshold value and less than a second threshold value, a cleaning liquid is supplied to the drainage part, and the maintenance acquired in the step a) Issuing a warning signal if the degree of necessity is greater than or equal to the second threshold;
A maintenance method comprising: The maintenance method according to claim 6, wherein
A maintenance method, wherein the step a) is performed using a discharge start command issued to the processing liquid supply unit as a trigger. The maintenance method according to claim 7,
In the step b), when the maintenance necessity is equal to or higher than the first threshold and lower than the second threshold, the discharge start command is transmitted to the processing liquid supply unit, and the processing liquid supply unit transfers the substrate to the substrate. A maintenance method, wherein after the processing liquid is supplied and the substrate is processed, the cleaning liquid is supplied to the drainage section. A maintenance method according to any one of claims 6 to 8, comprising:
c) when the cleaning liquid is supplied to the drainage part in the step b), the step of reacquiring the maintenance necessity after the step b);
d) If the maintenance necessity reacquired in the step c) is not less than the first threshold and less than the second threshold, the cleaning liquid is supplied to the drainage section, A step of issuing a warning signal when the acquired degree of maintenance required is not less than the second threshold;
A maintenance method, further comprising: A maintenance method according to any one of claims 6 to 9,
In the step a), the maintenance degree is acquired based on the amount of light transmitted through the transparent or translucent drainage pipe of the drainage part,
The treatment liquid discharged from the treatment liquid supply unit is colored,
The first threshold corresponds to the amount of light reduced by coloring the inner surface of the drainage pipe with the treatment liquid,
The maintenance method according to claim 2, wherein the second threshold value corresponds to a light amount decreased due to accumulation of the processing liquid in the drainage pipe.

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