JP2018194744A - Pellicle frame and production method thereof - Google Patents

Abstract

To provide a pellicle frame and a production method thereof, which can suppress the generation of particles.SOLUTION: Since an inside member 25 that constitutes an inside surface 23 of a bottom hole 17 of a pellicle frame 1 is formed of a material (a resin, for example, such as an epoxy resin) having the hardness lower than a material that constitutes a frame body 2 of the pellicle frame, even when, for example, a stainless tool pin 19 is frequently inserted in and removed from the bottom hole 17 and the tool pin 19 comes into contact frequently with the inside member 25, the tool pin 19 is difficult to be worn. Therefore, since generation of particles due to wear of the tool pin 19 can be suppressed, when producing, for example, semiconductor components, generation of defect of a wiring pattern can be suppressed. Furthermore, the frequency of exchange of the tool pin 19 can be reduced.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a pellicle frame and a manufacturing method thereof.

  In semiconductor manufacturing, a photomask is used in an exposure process for forming a wiring pattern on a semiconductor wafer. If foreign matter (particles or the like) adheres to the photomask, a defect in the wiring pattern occurs.

As a countermeasure against this, that is, in order to prevent dust, a pellicle on which a transparent thin film (pellicle film) covering the surface of the photomask is stretched is used.
Also, a rectangular frame called a pellicle frame is used to dispose the pellicle film at a predetermined distance from the photomask. Since this pellicle frame is required to have high flatness and rigidity in order to suppress deformation of the photomask, a ceramic material having high rigidity and high hardness such as alumina is suitable as the material. Yes.

  In addition, the pellicle frame is provided with a plurality of bottomed holes 110 on the outer periphery of the pellicle frame 100 as shown in FIG. That is, when gripping, transporting, positioning, etc. of the pellicle frame 100, a jig pin 120 extending from the temporary frame or the like is fitted into the bottomed hole 110, and the pellicle frame 100 is held by the jig pin 120 to Work such as moving the frame 100 is performed (see Patent Document 1).

JP-A-9-204039

  By the way, in the case of a pellicle frame made of ceramic, for example, a jig pin made of stainless steel having a lower hardness than the pellicle frame may be used so as not to damage the pellicle frame. There is a problem that due to the wear of the pins, the generation of particles and the replacement frequency of the jig pins increase.

  In other words, the jig pin is repeatedly inserted into and removed from the bottomed hole of the pellicle frame. For example, in the case of a pellicle frame with a high hardness such as a ceramic pellicle frame, the tip of the jig pin with a low hardness, etc. Wears and particles are likely to be generated (that is, dust is likely to be generated).

There is also a problem that the jig pin is worn and the frequency of stopping the process for replacement becomes high.
For example, generation of particles from the pellicle frame causes a defect in the wiring pattern as described above. Therefore, it is desired to suppress the generation of particles, but the countermeasure is not always sufficient.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a pellicle frame that suppresses the generation of particles and does not complicate the production process, and a method for manufacturing the pellicle frame.

  (1) A first aspect of the present invention is a pellicle membrane comprising a frame having a Young's modulus of 150 GPa or more and a Vickers hardness of 800 Hv or more, and having a bottomed hole opened on the outer peripheral surface of the frame. This relates to a pellicle frame for tensioning. In addition, the outer peripheral surface side of the frame body is a side opposite to the inner peripheral surface side surrounded by the frame body itself.

  The bottomed hole of the pellicle frame includes at least a through hole that penetrates the frame body, and an inner member that covers at least a part of the inner peripheral surface of the through hole and has a closed portion that closes the through hole. The inner member is made of a material whose hardness is lower than that of the material constituting the frame.

  In the first aspect, the inner member that covers at least a part of the inner peripheral surface of the through hole of the pellicle frame and has a closing portion that closes the through hole is made of a material having a hardness lower than that of the material constituting the frame. Therefore, even when the jig pin is inserted into and removed from the bottomed hole many times and the jig pin contacts the inner member many times, the jig pin is not easily worn. For this reason, generation of particles (dust) due to wear of the jig pins can be suppressed, so that a remarkable effect can be achieved, for example, that generation of defects in a wiring pattern in manufacturing a semiconductor component can be suppressed. Furthermore, since the wear of the jig pins can be suppressed, the frequency of replacing the jig pins can be reduced.

  Further, in the first aspect, the bottomed hole of the pellicle frame is configured to close the through hole (specifically, the inner peripheral surface side opposite to the outer peripheral surface where the bottomed hole opens) at the closing portion. Therefore, it is easy to form a bottomed hole.

  That is, it is not easy to form a bottomed hole by drilling, for example, for a frame body of a pellicle frame having high hardness such as ceramics. In addition, if electric discharge machining is applied using conductive ceramics, drilling is possible regardless of the hardness of the material. However, when bottomed holes are formed by die-sinking electric discharge machining, sludge is discharged. In addition, the machining speed is slow, and the hole shape follows the shape of the electrode rod. Therefore, frequent exchange of the electrode rod is required, resulting in poor productivity.

  On the other hand, in this first aspect, for example, when a through hole is formed by fine hole electric discharge machining, an electrode rod having a through hole at the center is used, so that sludge can be easily discharged compared to die-sinking electric discharge machining. And processing time is short. In addition, even if the tip of the electrode rod is consumed, it is only necessary to penetrate the electrode rod, so there is no need for frequent electrode rod replacement such as die-sinking electric discharge machining, and the hole diameter is stable. is there.

  And after opening a through-hole, since one opening end of the through-hole used as the bottom part of a bottomed hole should just be obstruct | occluded with resin etc., it is remarkable that formation of a bottomed hole is easy as a whole. There is an effect.

  (2) In the second aspect of the present invention, the material constituting the inner member of the bottomed hole may be a material lower than Vickers hardness (HV) 200 or a material lower than Rockwell hardness (HRM) 130. .

In the second aspect, as the material constituting the inner member of the bottomed hole, for example, a material having a sufficiently low hardness such that wear on a jig pin made of stainless steel or the like is hardly generated is illustrated.
The Rockwell hardness is M scale.

(3) In the third aspect of the present invention, the material constituting the frame may be a material mainly composed of ceramics.
In the third aspect, a material suitable as a material constituting the frame is illustrated. A frame body mainly composed of ceramics has a high Young's modulus and a high Vickers hardness, and is suitable as a material for a pellicle frame that requires high flatness and rigidity.

(4) In the fourth aspect of the present invention, the material constituting the inner member of the bottomed hole may be a resin.
In this 4th aspect, the material suitable as a material which comprises an inner member is illustrated. That is, after the through hole is formed, the inner member can be easily provided by filling the through hole with resin and molding.

(5) In the fifth aspect of the present invention, the opening end on the inner peripheral surface side in the through hole of the frame body may be provided with a closing plate.
In the fifth aspect, the closing plate can prevent the inner member from being exposed to the inner peripheral surface of the pellicle frame. Thereby, it is possible to suppress generation of particles due to deterioration of the inner member.

(6) A sixth aspect of the present invention relates to a method for manufacturing a pellicle frame according to any one of the first to fifth aspects.
In this method for manufacturing a pellicle frame, a step of forming a through hole in a bottomed hole forming portion with respect to the frame body of the pellicle frame, and a material for forming the inner member in the through hole are filled with the bottomed hole. Forming a step.

  In the sixth aspect of the present invention, after the through hole is formed in the frame body of the pellicle frame, the material constituting the inner member is filled in the through hole, for example, by processing the filled portion. A bottom hole can be formed.

(7) In the seventh aspect of the present invention, the through hole may be formed by electric discharge machining or drilling.
In the seventh aspect, a suitable method for forming a through hole is illustrated. For example, when the frame body of the pellicle frame has conductivity, the through hole can be easily formed by, for example, pore electric discharge machining. Further, for example, when the frame body of the pellicle frame does not have conductivity, the through hole can be formed by drilling.

  (8) In the eighth aspect of the present invention, when the bottomed hole is formed, the through hole is filled with the material constituting the inner member, and the holed shape of the bottomed hole is formed with respect to the filled material. Processing may be performed.

In the eighth aspect, a suitable method for making the bottomed hole into a desired shape is illustrated.
For example, after filling the through hole with a resin material and solidifying, a recess may be formed by a drill or the like to form a bottomed hole. When a thermosetting resin is used as the resin, a bottomed hole shape jig (such as a punch) is inserted into the filled resin and cured by heating to form a bottomed hole shape. Good. Alternatively, when a thermoplastic resin is used as the resin, a bottomed hole-shaped jig may be inserted into the filled flexible resin and then cured to form the bottomed hole.

<The configuration of the present invention is described below>
-As the material of the frame of the pellicle frame, a conductive or non-conductive material can be adopted. For example, alumina / titanium carbide, alumina / titanium carbide / titanium nitride, zirconia / titanium carbide, carbide, cermet, or the like can be used as the conductive material. As the non-conductive material, for example, ceramics such as alumina, silicon nitride, and zirconia can be employed.

  However, in order to form a through hole in the frame body by electric discharge machining, it is preferable to form the frame body from a conductive material. Here, when a conductive material is used as the frame material, even if the pellicle frame is charged during process flow or transportation, it is easy to remove static electricity and suppress adsorption of particles or the like to the pellicle frame. it can.

The conductive material is preferably a material having a volume resistivity at 20 ° C. of 1.0 × 10 ⁻³ Ω · cm or less when formed as a pellicle frame.
In addition, as a ceramic material, the thing of Vickers hardness (Hv) 1000-2000Hv is employable, for example.

  -Even if the inner member provided with the obstruction | occlusion part is comprised with the same material as a whole, it may be comprised with a partially different material. For example, in the inner member, the blocking portion and other portions (for example, a covering portion that covers the inner peripheral surface of the through hole) may be made of different materials. For example, it is preferable that the covering portion is made of a material having a lower hardness than the closing portion. It is desirable that the entire inner peripheral surface of the through hole is covered with the inner member.

  As the material for the inner member, for example, an epoxy resin (bisphenol type), a phenol resin (novolak type), a polyimide resin, a PET resin, a PEEK resin, or the like can be used.

In addition, as a Rockwell hardness (M scale) of the above-mentioned resin, the thing of 60-120 HRM is employable.
-As a material of a jig | tool pin, a highly versatile material is easy to be employ | adopted, for example, the material whose hardness is lower than the material which comprises a frame can be employ | adopted. In addition, a material having higher hardness than the material constituting the inner member can be adopted. For example, metals, such as stainless steel (SUS304, SUS430), are mentioned. In addition, as a Vickers hardness of stainless steel, the thing of 180-190Hv is mentioned.

  -About the above-mentioned Vickers hardness, it measures based on JIS2244: 2009. Moreover, about the above-mentioned Rockwell hardness, it measures by "M scale (HRM)" based on JIS7202-2: 2001.

It is a perspective view which shows the pellicle frame of 1st Embodiment. It is sectional drawing which shows the cross section which fractured | ruptured the pellicle frame of 1st Embodiment along XY plane. It is AA sectional drawing in FIG. FIG. 3 is an enlarged cross-sectional view showing a part of a cross section of the pellicle frame cut along the XY plane in order to show how to use the bottomed hole of the pellicle frame of the first embodiment. (A) is a top view which shows the state which looked at the pellicle frame of 1st Embodiment from the outer peripheral surface side, (b) is BB sectional drawing in Fig.5 (a). It is process drawing which shows the manufacturing method of the pellicle frame of 1st Embodiment. It is explanatory drawing which shows the formation method of a bottomed hole among the manufacturing methods of the pellicle frame of 1st Embodiment. FIG. 5 is a cross-sectional view showing a pellicle frame and the like according to a second embodiment, with an enlarged part of a cross section obtained by breaking the pellicle frame along the XY plane. It is explanatory drawing of a prior art.

Embodiments to which the present invention is applied will be described below with reference to the drawings.
[1. First Embodiment]
[1-1. overall structure]
First, the overall configuration of the pellicle frame of the first embodiment will be described.

  As shown in FIGS. 1 to 3, the pellicle frame 1 is a member in which a pellicle film 3 (see FIG. 3) is stretched on one side (upper side of FIG. 3). The pellicle frame 1 is mainly composed of a ceramic frame (for example, a frame made of conductive ceramics mainly composed of alumina and containing titanium carbide) 2. 1 and 2 show the pellicle frame 1 itself, and FIG. 3 shows a pellicle 5 in which a pellicle film 3 is stretched on one side of the pellicle frame 1.

  Hereinafter, among all the surfaces of the pellicle frame 1, an inner surface surrounded by the pellicle frame 1 itself is referred to as an inner peripheral surface 7, and an outer surface opposite to the inner side is referred to as an outer peripheral surface 9. Of the surfaces connected to the inner peripheral surface 7 and the outer peripheral surface 9, the side on which the pellicle film 3 is stretched is referred to as the upper surface 11, and the opposite surface is referred to as the lower surface 13. In addition, when it is not necessary to distinguish these surfaces, they may be simply referred to as surfaces.

  As shown in FIG. 1, in the orthogonal X-axis, Y-axis, and Z-axis coordinate systems, the pellicle frame 1 is a rectangular frame (that is, an annular member) in a plan view as viewed from the Z direction. The center has a central through hole 15 that is rectangular in plan view.

  That is, the pellicle frame 1 (and hence the frame body 2) is composed of long frame portions arranged in four directions, top, bottom, left, and right, in a plan view on the same plane. Specifically, the pellicle frame 1 includes a first frame portion 1a and a second frame portion 1b arranged parallel to the X axis, and a third frame portion 1c and a fourth frame portion 1d arranged parallel to the Y axis. It is configured.

  The dimension of the outer shape of the pellicle frame 1 is, for example, about 149 mm in length (Y direction) × about 120 mm in width (X direction) × about 3 mm in thickness (Z direction). Moreover, each frame part 1a-1d of the pellicle frame 1 is a quadratic prism, and the dimension of the width (dimension of the width seen from the Z direction) is the same (namely, about 2 mm).

  Further, the frame body 2 of the pellicle frame 1 has the characteristics that the Young's modulus is 150 GPa or more and the Vickers hardness is 800 Hv or more. The flatness of the pellicle frame 1 (and hence the frame body 2) is 10 μm or less.

  As shown in FIG. 2, the pellicle frame 1 (specifically, the frame body 2) has two locations on both frame portions (that is, the third frame portion 1c and the fourth frame portion 1d) in the X direction, as shown in FIG. Bottomed holes 17a, 17b, 17c, and 17d (generally referred to as 17), which are depressions that open to the outer peripheral surface 9 side, are provided at (total of four locations).

As shown in FIG. 3, the bottomed hole 17 is a bottomed round hole having a diameter of 1.5 mm and a depth of 1.2 mm, for example, and the bottom is arranged in a conical shape.
The bottomed hole 17 is used for the manufacture of the pellicle 5 and subsequent positioning for attachment to a photomask (not shown). For example, at the time of positioning, each jig pin 19 shown in FIG. 4 provided in a pellicle manufacturing apparatus or pellicle mounting apparatus (not shown) moves in the direction of the arrow in FIG. 17 is fitted.

  As shown in FIGS. 1 and 2, the third frame portion 1c of the pellicle frame 1 (specifically, the frame body 2) is provided with a through hole 20 having a diameter of 0.5 mm, for example. The through-hole 20 is used to adjust the atmospheric pressure between the pellicle 5 and the space surrounded by the photomask and the external environment after the pellicle 5 is attached to the photomask. Note that a filter (not shown) is provided in the through hole 20 so that dust does not enter from the external environment.

[1-2. Configuration of bottomed hole]
Next, the configuration of the bottomed hole 17 that is a main part of the first embodiment will be described in detail.
Since the configuration of each bottomed hole 17 is the same, here, for example, the bottomed hole 17a of the third frame portion 1c will be described as an example.

  As shown in FIG. 5, the frame body 2 (specifically, the third frame portion 1c) is provided with a through hole 21 having a diameter of 2 mm, for example, so as to penetrate in the width direction (left-right direction in FIG. 3: X direction). Yes. In the through hole 21, the inner member 7 is closed so as to close the inner peripheral surface 7 side of the through hole 21 (below in FIG. 5B) and cover the entire inner peripheral surface 23 of the through hole 21. 25 is arranged.

  The inner member 25 has a cup shape having a recess 27 whose center portion is recessed, and a bottomed hole 17a is formed by the inner member 25 (specifically, the recess 27 which is a recess) disposed in the through hole 21. ing.

  Specifically, as shown in FIG. 5B, the inner member 25 includes a disk-shaped blocking portion 29 that closes the through-hole 21, and an inner peripheral surface of the through-hole 21 that extends from the blocking portion 29 toward the outer peripheral surface 9. And a cylindrical inner portion 31 that covers the wall 23 (that constitutes the wall surface of the recess 27).

  Particularly in the first embodiment, the material constituting the inner member 25 is made of a material having a lower hardness than the material constituting the frame body 2 of the pellicle frame 1. For example, it consists of resin, such as an epoxy resin. That is, the material constituting the inner member 25 is made of a material that is softer than the material constituting the frame body 2, in other words, the material that hardly damages the jig pins 19 as compared with the frame body 2.

  For example, since the frame body 2 of the pellicle frame 1 has a Vickers hardness of 800 Hv or higher, a material having a Vickers hardness lower than 200 Hv or a material having a Rockwell hardness lower than 130 HRM is used as the material constituting the inner member 25. Can do.

As a material of the jig pin 19, a metal having a lower hardness than the frame body 2 of the pellicle frame 1 and a higher hardness than the inner member 25, for example, a metal such as stainless steel is used.
[1-3. Outline of Pellicle Frame Manufacturing Method]
Next, an outline of a method for manufacturing the pellicle frame 1 will be described.

(First step P1)
As shown in FIG. 6, a powder (that is, a base powder) that is a raw material of the frame 2 of the pellicle frame 1 was produced.

  Here, the powder is a substance that becomes the basis of the sintered body constituting the frame 2, and as will be described later, a sintering aid is appropriately added to the raw material powder such as alumina or conductive material, and wet mixing is performed. After that, it is produced into granules of 50 μm to 100 μm by a spray drying method.

The particle size of the raw material powder was measured by the laser diffraction / scattering method, but may be measured by a dynamic light scattering method or a sedimentation method.
(Second process P2)
Next, this powder was molded to form the original shape of the frame 2 of the pellicle frame 1.

(Third step P3)
Next, after forming the powder, it was fired at a predetermined temperature.
This firing temperature depends on the composition of the powder, but is generally 1500 ° C. or higher. By firing, a sintered body having a high Young's modulus and hardness can be obtained.

(4th process P4)
Next, thickness processing (specifically grinding processing) which adjusts the thickness was performed to the sintered compact.

Here, the thickness was made uniform except for a polishing allowance (for example, 0.05 to 0.10 mm) of precision planar processing (tenth process P10) described later.
(5th process P5)
Next, the inner shape / outer shape processing was performed on the sintered body after the thickness processing.

Specifically, the outer peripheral surface of the sintered body is gripped by a holding jig (not shown), wire electric discharge machining is performed on the inner peripheral surface and the outer peripheral surface of the sintered body, and the inner shape and outer shape are aimed. Processed to dimensions.
(6th process P6)
Next, surface treatment of the electric discharge machining surface was performed on the sintered body after the inner shape / outer shape machining.

Specifically, the thermally deteriorated layer generated by the electric discharge machining was removed by sandblasting.
(Seventh step P7)
Next, drilling was performed on the sintered body after the surface treatment of the electric discharge machining surface.

Specifically, by using a fine hole electric discharge machine (not shown), one through-hole 20 for adjusting atmospheric pressure is formed on the side surface of the frame 2 of the pellicle frame 1 and the through-hole 21 for bottomed hole is formed. Four places were formed.
(Eighth process P8)
Next, the surface treatment of the electric discharge machining surface was performed on each of the through holes 20 and 21.

Specifically, the thermally deteriorated layer generated on the inner peripheral surfaces of the through holes 20 and 21 by electric discharge machining was removed by sandblasting.
(9th process P9)
Next, the through hole 21 is filled with a different material such as a resin having a lower hardness than the frame body 2 of the pellicle frame 1 (that is, the material of the inner member 25), and formed into a desired shape, thereby forming the bottomed hole 17. did.

(10th process P10)
Next, precision plane processing was performed on the sintered body after being filled with the different material.
(11th process P11)
Thereafter, chamfering may be performed on the frame body 2 of the pellicle frame 1.

In the seventh to ninth steps P7 to P9, since the flatness does not vary, the tenth step P10 may be performed before the seventh step P7.
[1-4. Example]
Next, specific examples of the method for manufacturing the pellicle frame 1 will be described in detail.

(First step P1)
In the production process of this substrate, 63% by volume of α-alumina powder having an average particle size of 0.5 μm, 10% by volume of titanium carbide having an average particle size of 1.0 μm, 25% by volume of titanium nitride having an average particle size of 1.0 μm, and the balance A composite material composed of a sintering aid of MgO: Y ₂ O ₃ = 1: 1 was prepared.

Then, this composite material was wet-mixed, an organic binder for molding was added, and then a composite ceramic base powder of alumina / titanium carbide / titanium nitride was produced by an ordinary spray drying method.
(Second process P2)
In this forming step, the composite ceramic base powder is formed into a frame shape with a size of about 182 mm in length, 147 mm in width, 6 mm in thickness, and 5 mm in frame width by a die pressing method, and the original pellicle frame 1 (powder compact) ) Was produced.

  Here, the outer shape of the frame body 2 of the pellicle frame 1 shrinks by about 20 to 30% by a baking process described later, and therefore, it is formed in advance larger than the frame body 2 of the pellicle frame 1 after baking. The frame body 2 of the pellicle frame 1 can have various sizes according to the size of the exposure mask in the semiconductor exposure apparatus.

(Third step P3)
In this firing step, the powder compact was removed from the binder, fired in an inert gas at 1700 ° C. for 2 hours, and a dense ceramic sintered body having electrical conductivity was obtained.

The dimensions of the sintered body were about 151 mm long × 122 mm wide × 5 mm thick, and a frame width of about 4 mm. There was a distortion of about 0.3 mm.
(4th process P4)
In this thickness processing step, the upper and lower surfaces (both surfaces in the thickness direction) of the sintered body were ground by the same amount with a surface grinder and processed to a thickness of 3.1 mm. In addition, the flatness after the surface grinding was 20 to 40 μm.

(5th process P5)
In this inner shape / outer shape processing step, the inner shape and outer shape of the sintered body were processed into a length of 149 mm × width of 120 mm and a frame width of 2 mm by wire electric discharge machining. In addition, you may perform R process of a ridge part (corner part) in this case.

(6th process P6)
In the surface treatment process of the electric discharge machining surface, the heat-affected layer on the electric discharge machining surface was removed by sandblasting. In the sandblast treatment, silicon carbide abrasive grains having a particle size of # 600 (average particle size of about 30 μm) were used. The thickness of the removed layer was about 5 μm.

(Seventh step P7)
In this drilling process, as shown in FIG. 7 (a), a through pilot hole (through hole 21 for a bottomed hole) was formed.

  More specifically, φ2 is applied to the opposite long side frame portions (third frame portion 1c and fourth frame portion 1d) of the frame body 2 of the pellicle frame 1 as a prepared hole of the bottomed hole 17 by thin hole electric discharge machining. A through-hole 21 of 0.0 mm was formed.

  When the through hole 21 is formed, the electrode rod feeding process length can be increased by the amount of consumption of the tip of the electrode rod (not shown), so that it is not necessary to replace the electrode rod. The processing time was about 2 minutes / hole. Further, the discharge gap between the through hole 21 and the electrode rod was 0.05 mm in diameter.

Similarly, a through hole 20 for adjusting the atmospheric pressure was formed.
Specifically, a through hole 20 having a diameter of 0.5 mm was formed at the center position of the third frame portion 1c with respect to the frame body 2 of the pellicle frame 1 by thin hole electric discharge machining.

  When the through-hole 20 is formed, the electrode rod feeding process length can be increased by the amount of consumption of the tip of the electrode rod, so that it is not necessary to replace the electrode rod. The processing time was about 2 minutes / hole. The discharge gap between the through hole 20 and the electrode rod was 0.05 mm in diameter.

(Eighth process P8)
In the surface treatment process of the electric discharge machining surface, the heat-affected layer on the inner peripheral surfaces of the through holes 20 and 21 subjected to electric discharge machining was removed by sandblasting.

In the sandblast treatment, silicon carbide abrasive grains having a particle size of # 600 (average particle size of about 30 μm) were used. The thickness of the removed layer was about 5 μm.
In addition, since the hole diameter of the through-holes 20 and 21 after processing increases by setting the discharge gap and removing the heat-affected layer, the electrode rod used for processing the through-hole 20 is set to φ0.4 mm and used for processing the through-hole 21. The electrode rod had a diameter of φ1.9 mm smaller than the inner diameter of the through hole 21.

(9th process P9)
In the step of forming the bottomed hole 17, first, as shown in FIG. 7B, the pellicle frame 1 is placed on the shielding plate jig 41 and an uncured epoxy resin is filled in the through hole 21. Thus, the filling portion 43 was formed.

  Next, as shown in FIG. 7C, a φ45 mm punch 45 is pushed into the filling portion 43 to a depth of 1.2 mm, and heat treatment is performed at 120 ° C. for 60 minutes to cure the epoxy resin, The punch shape which is the shape of the bottomed hole 17 was transferred.

After curing, as shown in FIG. 7 (d), the punch 45 was extracted to complete the inner shape of the bottomed hole 17. At this time, the punch 45 may be punched and tapered.
Alternatively, the punch shape may be transferred using an ultraviolet curable resin. When an ultraviolet curable resin is used, the bottomed hole 17 can be formed in a short time because the resin can be temporarily cured in a short time. Note that the punch 45 may be extracted after the temporary curing and the resin may be completely cured by heat treatment.

  After extracting the punch 45, as shown in FIG. 7E, the protruding portion 43a of the epoxy resin (that is, the protruding portion of the top or bottom) was removed by machining to obtain the desired bottomed hole 17. . That is, a configuration in which the inner member 25 having the concave portion 27 in the shape of the bottomed hole 17 is disposed in the through hole 21 was obtained.

(10th process P10)
In this precision planar processing, the sintered body was polished at a rate of 25 to 50 μm on each side to process a thickness of 3.0 mm and a flatness of less than 10 μm. Thereby, the pellicle frame 1 was completed.

(11th process P11)
Thereafter, chamfering may be performed on the frame body 2 of the pellicle frame 1. For example, the R processing may be performed so that the ridge portion of the frame body 2 has an R radius of 0.03 to 0.05 mm by brush polishing.

  Through the above-described treatment, a pellicle frame 1 composed mainly of a frame 2 mainly composed of alumina was obtained. When the Young's modulus and the Vickers hardness of the frame 2 of the pellicle frame 1 were measured, the Young's modulus was 420 GPa and the Vickers hardness was 2100 Hv.

[1-5. effect]
(1) In the first embodiment, the inner member 25 constituting the inner peripheral surface 23 of the bottomed hole 17 of the pellicle frame 1 is made of a material having a lower hardness than the material constituting the frame body 2 of the pellicle frame 1 (for example, Even if the jig pin 19 made of, for example, stainless steel is repeatedly inserted into and removed from the bottomed hole 17 and the jig pin 19 contacts the inner member 25 many times, the jig The pin 19 is not easily worn. Therefore, since the generation of particles due to wear of the jig pins 19 can be suppressed, for example, there is a remarkable effect that the generation of wiring pattern defects during the manufacture of semiconductor components can be suppressed. Further, it is possible to prevent the jig pin 19 from being worn out, and to increase the frequency of stopping the process for exchanging the jig pin 19, and to suppress the complication of the production process.

  (2) In the first embodiment, the bottomed hole 17 of the pellicle frame 1 is configured to close the through hole 21 that penetrates the frame body 2 of the pellicle frame 1 by the closing portion 29 of the inner member 25. Therefore, formation of the bottomed hole 17 is easy.

  In other words, since the through-hole 21 can be opened in the frame body 2 by pore electric discharge machining, the machining time is shorter than that of die-sinking electric discharge machining, and frequent electrode rod replacement as in die-sinking electric discharge machining is unnecessary. In addition, there is an advantage that the hole diameter is stabilized.

  Moreover, it is good also as opening the through-hole 21 in the frame 2 by drilling. Even when the through hole 21 is formed by drilling, it is not necessary to frequently replace the electrode rod as in die-sinking electric discharge machining. However, when considering the chipping or the like of the frame body 2 in the vicinity of the through-hole 21, it is preferable to form the through-hole 21 by pore electric discharge machining rather than drilling because the chipping of the frame body 2 can be suppressed.

  (3) Further, in the first embodiment, after forming the through hole 21 in the frame 2 of the pellicle frame 1, the through hole 21 is filled with a material constituting the inner member 25 (for example, a resin such as epoxy resin). To do. And the hole used as the bottomed hole 17 is formed in the filling part 43 with the punch 45 grade | etc.,. Therefore, there is an advantage that the bottomed hole 17 can be easily formed.

[1-6. Application example]
(1) As a material constituting the frame of the pellicle frame 1, for example, conductive ceramics described in Table 1 below can be adopted. Further, for example, non-conductive ceramics described in Table 2 below can be employed.

  Moreover, as a composition (compounding composition) of electroconductive ceramics, the composition of following Table 3 is employable. Further, as the composition of the conductive material (other than ceramics), the composition shown in Table 4 below can be adopted. Furthermore, the composition shown in Table 5 below can be adopted as the composition of the nonconductive ceramic.

  Note that Nos. 1 to 3 in Table 1 and Nos. 10 to 12 in Table 3 are the same material. Nos. 4-6 in Table 1 and Nos. 13-15 in Table 4 are the same material. Nos. 7-9 in Table 2 and Nos. 16-18 in Table 5 are the same material.

  (2) As resin with which the bottomed hole 17 is formed, thermosetting resin such as phenol resin or polyimide resin can be used in addition to the epoxy resin. Further, a thermoplastic resin such as a PET resin or a PEEK resin can be used.

(3) When the bottomed hole 17 is formed, the resin filled in the through hole 21 may be cured, and the bottomed hole 17 may be opened by a drill or the like with respect to the cured resin.
(4) As the material of the resin, a material having high durability against ultraviolet rays or a material that hardly generates particles is preferable. The color of the resin can be selected as appropriate.

[1-7. Correspondence of wording]
In the first embodiment, the pellicle frame 1, the frame body 2, the pellicle film 3, the bottomed hole 17, the through hole 21, the inner member 25, and the closing portion 29 are respectively the pellicle frame, the frame body, and the pellicle film of the present invention. This corresponds to an example of a bottomed hole, a through hole, an inner member, and a closed portion.

[2. Second Embodiment]
Next, the second embodiment will be described, but the description of the same contents as the first embodiment will be omitted or simplified.

[2-1. Constitution]
As shown in FIG. 8, the pellicle frame 51 in the second embodiment is mainly composed of a ceramic frame body 52, as in the first embodiment, and is similar to each frame portion in the first embodiment. 53.

And the bottomed hole 55 is formed in the 3rd, 4th frame part similar to 1st Embodiment corresponding to a long side among each frame part 53. As shown in FIG. In addition, in FIG. 8, the 3rd frame part 53c is illustrated.
Particularly in the second embodiment, the outer peripheral surface 57 (upper side in FIG. 8) side of the portion where the bottomed hole 55 is formed and the surrounding portion is projected outward (ie, the width is larger). Is configured).

  Specifically, the outer peripheral surface 57 side of the frame portion 53 is formed with a convex portion 59 that protrudes with a certain thickness so as to increase in width, and in the portion where the convex portion 59 is formed, the frame portion 53. A through hole 61 is formed so as to pass through the.

  Further, the opening 65 on the inner peripheral surface 63 (lower side in FIG. 8) side of the through-hole 61 is sealed by a ceramic plate (blocking plate) 67 made of the same material as the pellicle frame 51, for example. The through-hole 61 is filled with a resin such as an epoxy resin, and a cup-shaped inner member 69 similar to that of the first embodiment is formed from this resin.

In addition, the bottomed hole 55 is comprised by the recessed part 71 of the inner member 69 similarly to 1st Embodiment.
[2-2. Production method]
Since the manufacturing method of the pellicle frame 51 in the second embodiment is basically the same as that in the first embodiment, the description will focus on the differences.

First, the frame body 52 of the pellicle frame 51 having the convex portions 59 can be produced by wire electric discharge machining as in the first embodiment.
Then, as shown in FIG. 8, in the portion where the convex portion 59 of the frame body 52 is located, the through hole 61 is formed in the frame body 52, and the closing plate 67 is disposed so as to close the opening 65 of the through hole 61. To do.

  Thereafter, an epoxy resin is filled from the side where the through hole 61 is not closed (opening side: the upper side in FIG. 8), and the bottomed hole 55 is formed using a punch or the like as in the first embodiment. The closing plate 67 is fixed integrally with the curing of the epoxy resin.

[2-3. effect]
The second embodiment has the same effects as the first embodiment.
In the second embodiment, since the opening 65 of the through hole 61 is closed by the hard blocking plate 67, the epoxy resin is not exposed to the inner peripheral surface 63 side of the pellicle frame 51. Therefore, there is an advantage that deterioration of the inner member 69 made of epoxy resin or the like is suppressed, and particles are hardly discharged to the inner peripheral surface 63 side of the pellicle frame 51.

Furthermore, since the thickness of the part which opens the through-hole 61 (namely, thickness of the frame 2) is large, there exists an advantage that intensity | strength is high.
[3. Other Embodiments]
In addition, this invention is not limited to the said embodiment etc. at all, Of course, as long as it belongs to the technical scope of this invention, it can take various forms.

  (1) For example, as the ceramic material forming the frame of the pellicle frame, various materials such as silicon nitride, zirconia, composite ceramics of alumina and titanium carbide, as disclosed in, for example, JP-A-2016-122091 Material can be adopted.

  As disclosed in the publication (see Embodiments 2 and 3), for example, a pellicle frame (that is, a frame) using zirconia has a Young's modulus of 210 GPa and a Vickers hardness of 1200 Hv, and is a composite of alumina and titanium carbide. The pellicle frame using ceramics has a Young's modulus of 420 GPa and a Vickers hardness of 2100 Hv.

  (2) In addition, the function which one component in each said embodiment has may be shared by a some component, or the function which a some component has may be exhibited by one component. Moreover, you may abbreviate | omit a part of structure of each said embodiment. In addition, at least a part of the configuration of each of the above embodiments may be added to or replaced with the configuration of another embodiment. In addition, all the aspects included in the technical idea specified from the wording described in the claims are embodiments of the present invention.

DESCRIPTION OF SYMBOLS 1, 51 ... Pellicle frame 1a, 1b, 1c, 1d, 53c ... Frame part 2, 52 ... Frame body 3 ... Pellicle film 5 ... Pellicle 17, 55 ... Bottom hole 21, 61 ... Through-hole 25, 69 ... Inner member 29 ... Blocking part

Claims (8)

A pellicle frame having a Young's modulus of 150 GPa or more and having a Vickers hardness of 800 Hv or more and a bottomed hole that opens on the outer peripheral surface of the frame, ,
The bottomed hole includes at least a through hole that penetrates the frame body, and an inner member that covers at least a part of the inner peripheral surface of the through hole and has a closed portion that closes the through hole. And
The inner member is made of a material whose hardness is lower than that of the material constituting the frame,
Pellicle frame. The material constituting the inner member of the bottomed hole is lower than Vickers hardness 200 Hv or lower than Rockwell hardness 130 HRM,
The pellicle frame according to claim 1. The material constituting the frame is made of a material whose main component is ceramic,
The pellicle frame according to claim 1 or 2. The material constituting the inner member of the bottomed hole is made of resin.
The pellicle frame according to any one of claims 1 to 3. The opening end on the inner peripheral surface side in the through hole of the frame body is provided with a closing plate,
The pellicle frame according to any one of claims 1 to 4. A method for producing a pellicle frame according to any one of claims 1 to 5,
Forming the through hole at the bottomed hole forming portion with respect to the frame of the pellicle frame;
Filling the through hole with a material constituting the inner member to form the bottomed hole;
A method for manufacturing a pellicle frame. Forming the through hole by electric discharge machining or drilling;
A method for manufacturing a pellicle frame according to claim 6. In the case of forming the bottomed hole, the through hole is filled with a material constituting the inner member, and the filled material is processed into a hole shape of the bottomed hole.
A method for manufacturing a pellicle frame according to claim 6 or 7.