JP2018192200A - Heating cooker - Google Patents

Abstract

To provide an arrangement structure of a heat sink and a cooling fan, capable of increasing cooling efficiency of the heat sink on which electronic components having a large heat quantity, such as an IGBT are mounted.SOLUTION: A heating cooker includes: a container body; a heating means; a lid body opening/closing the upper opening of the container body; a control board on which electronic components for controlling the heating means are arranged; a heat sink mounted on the control board and cooling the electronic components; and a cooling fan sending cooling air to the heat sink. In the heating cooker, the heat sink has a first heat sink and a second heat sink, and the first heat sink and the second heat sink face the cooling fan, and are positioned so as to be separated from each other at a prescribed space.SELECTED DRAWING: Figure 6

Description

  This invention relates to the cooling structure of the electronic component provided on the control board of heating cookers, such as a rice cooker.

  Recently, demand for rice cookers, which are a type of heating cooker, has increased, and many functions have been added. For example, an induction heating method using a work coil as a heating means has been adopted, and it is dense and efficient. Rice cookers are widely used as one of the easy-to-use products.

  And in the induction heating method using such a work coil, in order to perform more precise and efficient rice cooking control, etc., a plurality of work coils are provided such as a bottom part, a side part or a shoulder part, and each is controlled separately. What to do has already been proposed.

  The above-described control is a so-called module in which, for example, an IGBT as a switching circuit, a diode bridge as a rectifier circuit, and various chip components mounted on the substrate and circuit-formed are covered with a resin and mounted on a control board. It is executed by the action of various electronic components such as an HIC called a hybrid integrated circuit.

  By the way, the IGBT, the diode bridge, and the HIC, which are the electronic components, generate heat and need to be cooled (especially, the IGBT and the diode bridge need to be cooled). In order to prevent mutual dielectric breakdown, According to the article safety law (so-called electric safety law), it is required to arrange them at a predetermined distance.

  Some rice cookers are small, but with such a rice cooker, it is difficult to enlarge the storage space for the heat generating electronic components including the cooling fan and the heat sink.

  In order to eliminate such an adverse effect, the one shown in FIG. 10 has been proposed. Briefly, a heat sink 4 is attached to a lower part of a control board 2 supported by a board support case 1 and mounted with various electronic components 3 such as an HIC, and a control board is provided at the lower end of the control board 2. The cooling fan 5 is provided in a form substantially orthogonal to 2.

  The heat sink 4 includes a flat plate portion 4a and a plurality of fins 4b. On the upper surface of the flat plate portion 4a, an electronic component 3a that generates heat, for example, an IBGT and a diode bridge are arranged at a predetermined distance, and the lower surface of the flat plate portion 4a. The plurality of fins 4 b are arranged in parallel so as to face the cooling fan 5.

  Further, a duct 7 is provided at the lower end of the substrate support case 1, a notch 6 is provided at the lower end of the control substrate 2, and a groove portion that opens in the vertical direction at the base of the heat sink 4 on the control substrate 2 side. 8 forms the air passage 9.

  Then, the cooling air from the cooling fan 5 flows in the duct 7 as indicated by an arrow M3 and is divided into an arrow M1 and an arrow M2, and the cooling air indicated by the arrow M1 passes between the fins 4b and passes through the IGBT and the diode bridge. Cooling and the cooling air indicated by the arrow M2 cools other electronic components such as an HIC through the air passage 9.

  By the way, in the above-mentioned conventional one, it is necessary to provide the groove portion 8 at the base of the heat sink 4 to form the air passage 9, so that the production cost increases so much, and the cooling air passing through the air passage 9 reduces the heat of the heat sink 4. Therefore, the cooling effect of HIC or the like is inevitably reduced, and further, if the route passes through the air blowing path 9, the distance from the cooling fan 5 to the HIC or the like becomes longer, and the adverse effect that the cooling efficiency is reduced accordingly. Arise. And if a cooling fan is enlarged in order to suppress the reduction of cooling efficiency, the new bad effect that a rice cooker will enlarge will arise.

JP 2017-42541 A

  An object of the present invention is to provide an arrangement structure of a heat sink and a cooling fan that can increase the cooling efficiency of a heat sink to which an electronic component having a large amount of heat generation such as an IGBT is attached.

  In order to achieve the above object, the present invention adopts the following configuration.

  In the invention according to claim 1, the container main body, the heating means, the lid for opening and closing the upper opening of the container main body, the control board on which electronic parts for controlling the heating means are arranged, and the control board are attached to the control board A cooking device comprising: a heat sink that cools the electronic component; and a cooling fan that sends cooling air to the heat sink, wherein the heat sink includes a first heat sink and a second heat sink. The heat sink and the second heat sink are respectively configured to face the cooling fan and be separated from each other by a predetermined space.

  According to a second aspect of the present invention, the electronic component includes at least a first electronic component to a third electronic component that generate a large amount of heat, the first electronic component is attached to the first heat sink, and the second electronic component is attached to the first heat sink. The second electronic component is attached to the heat sink, and the third electronic component is arranged in the predetermined space.

  According to a third aspect of the present invention, the first electronic component is an IGBT, the second electronic component is a diode bridge, and the third electronic component is a hybrid integrated circuit (HIC).

  In the invention according to claim 4, each of the first heat sink and the second heat sink has a plurality of fins, and each of the plurality of fins is located at a predetermined distance away from each other with its tips facing each other.

  In the invention according to claim 5, when the cooling fan is viewed from the leeward side from the leeward side, most of the first heat sink, most of the second heat sink, and most of the predetermined space are: A configuration located in the same projection area as the cooling fan. Note that the “most part” means about 100% to 90% of the first heat sink, the second heat sink, and the predetermined space.

  In the invention which concerns on Claim 6, it is the structure which has a rib which supports the said 3rd electronic component.

  The present invention efficiently cools two heatsinks by dividing the heatsink for cooling electronic components with a large amount of heat generation into two parts, opposing the two heatsinks to the cooling fan and separating them from each other by a predetermined space. As a result, it is possible to increase the cooling efficiency of the electronic components having a large amount of heat to be arranged in the respective heat sinks.

  In addition, since a part of the cooling air can be directly sent to the control board through a predetermined space between the two heat sinks, it is not necessary to provide an air passage in the heat sink as in the above-described conventional example, thereby reducing the production cost. In addition to cooling the two heat sinks, other electronic components on the control board can be efficiently cooled.

  In addition, by attaching electronic components with high heat generation to the two heat sinks and placing other electronic components with high heat generation in a predetermined space between the two heat sinks, the three types of electronic components with high heat generation are more efficient. Can be cooled effectively, and each can be properly arranged while maintaining a safe insulation distance stipulated by the Electric Safety Act. Furthermore, the size of the cooling fan can be suppressed, and the cooking device can be made smaller. Can be

  Further, by facing the fins of the two heat sinks, the first electronic component (that is, IGBT), the second electronic component (that is, diode bridge), and the third electronic component (that is, diode bridge) that generate a large amount of heat are generated. , HIC) can be more efficiently cooled, and each can be properly arranged while maintaining a safer insulation distance.

  Further, when the cooling fan is viewed from the leeward side from the leeward side, most of the two heat sinks and the predetermined space are provided in the projection area having the same shape as the cooling fan, so that the cooling air from the cooling fan can be efficiently circulated. It can be sent to two heat sinks and a predetermined space, and the three types of electronic components that generate a large amount of heat can be cooled more efficiently.

  Further, by providing a rib that supports the third electronic component (that is, the HIC), which is an electronic component that generates a large amount of heat, contact between the HIC and the heat sink can be prevented, and adverse thermal effects on the HIC can be suppressed. .

Whole perspective view of rice cooker seen from diagonally above Cross section of rice cooker The perspective view which looked at the state which removed the container body from the slanting lower part FIG. 3 is a perspective view in which a cord winder, a substrate support case, and a cooling fan are further removed from FIG. Partial enlarged view of the container body and cooling fan as seen from below A perspective view of the control board and the cooling fan as viewed obliquely from the front to the rear A view of the fan case seen from diagonally below Partial enlarged view of ribs on the cooling fan and fan case as seen from diagonally above Partial enlarged view from above showing the relationship between the heat sink, ribs and HIC Expanded sectional view of a conventional control board and cooling fan

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, below, it demonstrates using a rice cooker. 1 and 2 are a perspective view and a sectional view of the entire rice cooker, and FIGS. 3 to 9 are perspective views of the vicinity of the cooling fan and the control board. In FIG. 1, the side with the operation unit and the push button is the front or front side, the side with the pressure regulating unit and the hinge part on the opposite side is the rear or rear side, and the direction orthogonal to the front-rear direction is the left-right direction. The upper side is the upper side and the lower side is the lower side. In addition, as shown in FIG. 1, let the side which becomes the right side in the planar view at the time of seeing the front from back be a right side or the right side, and let the left side be the left side or the left side.

  The substantially whole rice cooker S is shown in FIG.1 and FIG.2. The rice cooker S includes a lid 21 and a container body 30. The lid body 21 has a hinge portion 22 having a spring (not shown) on the rear side thereof, and has a push button 23 for opening and closing on the front side thereof. When the push button 23 is pressed, the engagement on the lid body 21 side is performed. The locking means is disengaged from the locking means on the container body 30 side, and the cover body 21 is rotated rearward about the hinge portion 22 by the spring force of the spring to open the upper opening of the container body 30. .

  In addition, a pressure adjusting unit 24 having a rectangular shape in plan view and having a substantially rectangular parallelepiped shape as a whole is detachably fitted in a recessed fitting portion (not shown) behind the upper surface of the lid body 21 and is stored in the container body 30. The steam generated in the pan 32 is regulated, and the regulated steam is discharged to the outside from the elongated steam outlet 25 in the left-right direction provided on the upper surface.

  Moreover, on the upper surface on the front side of the lid 21, a display unit 26 that displays various information such as a rice cooking course and a rice cooking time, and a plurality of rice cooking courses such as a white rice course and a brown rice course are selected, and rice cooking starts and cancels. And a plurality of operation buttons 27 for supporting reservation and the like, and the user presses the operation buttons 27 while referring to the display content of the display unit 26 to instruct cooking.

  The container body 30 includes an outer case 31 and an inner case 33. The outer case 31 is an integrally molded member made of synthetic resin that forms an outer shell, and its bottom portion is integrally formed with the side portion. As a whole, the outer case 31 has a container shape having an opening on the upper side, and a plurality of rear case portions are provided on the rear side of the bottom portion. An air intake port 39 is opened, and a plurality of air discharge ports (not shown) are opened on the front side of the bottom. The bottom portion of the outer case 31 may be separate from the side portion.

  The inner case 33 is made of a heat-resistant synthetic resin such as polyethylene terephthalate and functions as a protective frame for the inner pot 32. The inner case 33 has an approximate shape to the inner pot 32 and has a metal pot or earthenware pot inside. The pan 32 is detachably stored. In addition, a sensor insertion port 34a for projecting the tip of the center sensor 34 is provided at the center of the bottom.

  The inner pan 32 is made of iron, magnetic stainless steel, or the like made of a high magnetic material with a large eddy current induced inside, or aluminum that is lightweight and has low skin resistance. Only a magnetic stainless steel with a large skin resistance formed by pressure bonding or iron welding can be used.

  The entire inner pot 32 has a substantially W-shaped cross section similar to that of the inner case 33. When the inner pot 32 is stored in the inner case 33, the center bottom surface of the inner pot 32 is formed at the center of the bottom of the inner case 33. The top of the center sensor 34 protruding from the sensor insertion port 34a is pressed, and the heating control of the rice cooker S is made possible. That is, if the inner pot 32 is not housed in the inner case 33, the inner pot 32 and the center sensor 34 serve as a safety device for the rice cooker S so that heating control is not performed. The center sensor 34 is a known sensor and includes a reed switch that detects the set state of the inner pot 32 and a thermistor that detects the temperature of the inner pot 32.

  The upper end of the inner case 33 is integrally coupled to the upper end of the outer case 31 via a shoulder member 35 that is a shoulder portion, and a handle 35 a is provided on the outer peripheral side portion of the shoulder member 35. The handle 35a rotates about 90 degrees to the top when carrying the rice cooker S, and is rotated about 90 degrees to the rear side again after being carried and stored in the position shown in the figure.

  The inner case 33 has a bottom work coil 36 and a side work coil 37 which are heating means for induction heating the inner pot 32 on the outer surface of the bottom part and the curved part outer surface from the bottom part to the side part. The side work coil 37 is concentrically disposed at each position of the bottom portion and the curved portion of the inner case 33 with the center of the bottom portion of the inner case 33 as the center.

  A synthetic resin coil support base 38 is provided below the bottom work coil 36 and the side work coil 37. By attaching the coil support base 38 to the inner case 33 with screws or the like, the bottom work coil 38 is provided. The coil 36 and the side work coil 37 are fixed at the illustrated positions.

  An inner space 40 is provided between the outer case 31 and the inner case 33, and a cord winder 41, a board support case 44, a control board 45, and a cooling fan 50 are provided on the rear side of the inner space 40. .

  The cord winder 41 winds up the power cord and stores it in the container body 30 when not in use, and is provided in a form standing between the outer case 31 and the substrate support case 44.

  The substrate support case 44 is attached to the shoulder member 35 in a form that hangs down from the shoulder member 35 in the internal space 40 in front of the cord winder 41, and the control substrate 45 is connected to the front of the substrate support case 44. It is attached in the form of standing along the side surface, and various electrons such as a relay and a coil for controlling heating means such as the bottom work coil 36 and the side work coil 37 are provided on the front side surface. A component 46 is mounted.

  The electronic component 46 is, for example, a transistor or the like in which a MOSFET is incorporated in a gate portion as one of semiconductor elements, and is an IGBT 46a (corresponding to a first electronic component) used as a switching circuit. A diode bridge 46b (corresponding to a second electronic component) that is a rectifier circuit that flows in either one of the circuits is formed by mounting various chip components on a dedicated substrate to form a circuit and covering the whole with a resin. It consists of a hybrid integrated circuit (ie, HIC) 46c (corresponding to a third electronic component) formed by modularization and others.

  The IGBT 46a, the diode bridge 46b, and the HIC 46c are those that need to be cooled because they generate heat, and need to be separated from each other by a predetermined distance so as not to cause dielectric breakdown.

  In addition, one ZNR 46d is provided as an electronic component that is likely to fall down like the HIC 46c. The HIC 46c, ZNR 46d, and other electronic components are attached to the control board 45. The IGBT 46a and the diode bridge 46b are attached to two heat sinks described later, and the HIC 46c and the ZNR 46d are formed between the two heat sinks. It is attached on the control board 45 which will be located in the predetermined space 49. The ZNR 46d may not be provided.

  Below the center of the front surface of the control board 45, a first heat sink 47 and a second heat sink 48 are attached in a form having a predetermined distance 49 in the left-right direction and having a predetermined space 49 therebetween (see FIGS. 6 and 9). . In the present embodiment, the first heat sink 47 to which the IGBT 46a is attached is arranged on the right side, and the second heat sink 48 to which the diode bridge 46b is attached on the left side, but the reverse is also possible.

  The first heat sink 47 and the second heat sink 48 have substantially the same shape, and have L-shaped main body portions 47a and 48a that are integrally formed, and a plurality of fins 47b and 48b (see FIGS. 6 and 9). ). The first heat sink 47 and the second heat sink 48 may not have the same shape as the main body portions 47a and 48a and the plurality of fins 47b and 48b.

  The main body portions 47a and 48a are L-shaped members in plan view including substrate contact portions 47aa and 48aa and component mounting portions 47ab and 48ab, and the substrate contact portions 47aa and 48aa are on the front side of the control board 45. The parts mounting portions 47ab and 48ab are rectangular flat plates extending in the front-rear direction.

  The right-side first heat sink 47 mounting part 47ab has an IGBT 46a attached to its outer surface, a plurality of fins 47b attached to its inner surface, and the left second heat sink 48 mounting part etc. A diode bridge 46b is attached to the outer surface of the portion 48ab, and a plurality of fins 48b are attached to the inner surface thereof.

  As a result, the plurality of fins 47b of the first heat sink 47 and the plurality of fins 48b of the second heat sink 48 are opposed to each other with their tips spaced apart by a predetermined space 49, and the IGBT 46a and the diode bridge 46b are predetermined. It will be located away from the insulation distance.

  Each of the plurality of fins 47b and 48b is a flat plate having a rectangular shape when viewed from the front side to the rear side, and the long side portion is positioned in the vertical direction (see FIG. 6). That is, the plurality of fins 47b and 48b are attached to the inner sides of the component mounting parts 47ab and 48ab so that the fins 47b and 48b are parallel to the control board 45, and the tips of the fins 47b and 48b face each other with a predetermined space 49 apart.

  In other words, each of the plurality of fins 47b and 48b is located in the front-rear direction, and the vertical air passages 47c and 48c are formed between the fins (see FIG. 9). The cooling air is sent from the lower side to the upper side so as to follow the control board 45 through the air blowing paths 47 c and 48 c and the predetermined space 49. That is, the air passages 47c and 48c of the plurality of fins 47b and 48b are formed along the direction in which the cooling air from the cooling fan 50 flows, and the cooling air from the cooling fan 50 is rectified and flows. That is, the heat dissipation efficiency of the plurality of fins 47b and 48b is increased.

  The predetermined space 49 between the first heat sink 47 and the second heat sink 48 located at the lower center of the control board 45, that is, between the tips of the plurality of fins 47b and the tips of the plurality of fins 48b, The HIC 46c is disposed on the upper side, the ZNR 46d is disposed on the upper side (see FIG. 6), and is supported by ribs 52 and 53 described later.

  The cooling fan 50 has a plurality of blades 50a, and in the embodiment which is on the upstream side, takes in air from the lower air intake 39 and blows air toward the upper side which is the downstream side. It is located below the lower end and is attached to the fan case 51 in a form substantially orthogonal to the control board 45. As shown in FIG. 1, the cooling fan 50 may be inclined with respect to the control board 45, and the inclination is preferably 90 ° ± 10 °. Further, the cooling air is discharged to the outside through the air outlet (not shown).

  As shown in FIG. 7, the fan case 51 includes a short arc portion 51a having a short length in the circumferential direction from the upper end to the lower end, a long arc portion 51b having a long length in the circumferential direction, and a U-shaped fan in a bottom view. An integrally formed member made of synthetic resin having a receiving part 51c. A cooling fan 50 having a rectangular shape in plan view is attached to the fan receiving part 51c from below, and the short arc part 51a and the long arc part 51b are connected to the inner case 33. It is attached to the outer peripheral surface and fixed.

  The arc-shaped central region 51bb, which is a part of the long arc portion 51b in the fan receiving portion 51c, extends in the vertical direction and extends from the front side to the rear side, that is, toward the control board 45 side. Two sets of ribs having a substantially rectangular shape in side view protruding, specifically, an upper rib 52 and a lower rib 53 are integrally formed.

  The upper rib 52 is composed of two plates arranged in parallel, the distance between the two plates is the same as or slightly larger than the width of the ZNR 46d, and the lower rib 53 is also arranged in parallel. The distance between the two plates is the same as or slightly larger than the width of the HIC 46c. Note that it may be slightly reduced.

  When the fan case 51 and the control board 45 are attached at predetermined positions, the upper rib 52 and the lower rib 53 are located in a predetermined space 49 between the first heat sink 47 and the second heat sink 48.

  The ZNR 46d and the HIC 46c are easily tilted or fallen by being wrapped in a resin. When the ZNR 46d and the HIC 46c are placed in the predetermined space 49 and tilted or fallen, they come into contact with the heat sink and receive heat from the heat sink.

  The upper rib 52 and the lower rib 53 prevent the above-described adverse effects. When the control board 45 is attached to the internal space 40, the ZNR 46d on the control board 45 is supported by the tip portion inserted into the upper rib 52. The tip of the HIC 46c is supported by being inserted into the lower rib 53, but the length h1 of each insertion (see FIG. 9) is as short as possible (approximately at most about half), and the ZNR 46d and the HIC 46c Most of the side area faces the fins 47b and 48b (see FIG. 9).

  And, with such an arrangement, the cooling air hits many surfaces of the ZNR 46d and the HIC 46c, and the cooling efficiency of the HIC 46c and the ZNR 46d is increased. The harmful effect of being heated by the heat of the fins 47b and 48b is prevented.

  In addition, the length h2 (see FIG. 9) in the front-rear direction between the tips of the ZNR 46d and the HIC 46c and the roots of the upper rib 52 and the lower rib 53 (that is, the outer surface of the central region 51bb) can be increased. The rib inner cylindrical space 54 that is formed by the inner surfaces facing the upper rib 52 and the lower rib 53, the tip surfaces of the ZNR 46d and the HIC 46c, and the outer surface of the central region 51bb can be enlarged.

  The in-rib cylindrical space 54 faces the cooling fan 50, and can rectify the cooling air and send more cooling air toward the control board 45. In addition, the rib inner cylindrical space 54 also has a heat shielding function to block the heat of the fins 47b and 48b, and suppresses the temperature rise of the cooling air passing through the inside.

  In other words, the upper rib 52 and the lower rib 53 have three functions of preventing the ZNR 46d and the HIC 46c from being inclined or collapsing, rectifying the cooling air, and shielding the heat. The lengths of the upper rib 52 and the lower rib 53 in the left-right direction are shorter than the length of the predetermined space 49 in the left-right direction, and the length of the upper rib 52 in the vertical direction is longer than that of the lower rib 53. Yes. That is, the cooling efficiency of the HIC 46c can be further increased by providing the HIC 46c having a larger calorific value than the ZNR 46d in the vicinity of the cooling fan 50.

  The cooling fan 50 has a rectangular shape in plan view, and has a length H1 in the left-right direction and a length H2 in the front-rear direction as shown in FIG. 5 (however, the cooling fan 50 is omitted in the figure). It is of a size. As shown in FIG. 5, when the cooling fan 50 is viewed from the leeward side (front side in FIG. 5) to the leeward side (back side in FIG. 5), the first heat sink 47, the second heat sink 48, and the predetermined space 49 are The cooling fan 50 is disposed in the same projection area.

  With such a configuration, all of the cooling air from the cooling fan 50 is efficiently sent to the first heat sink 47, the second heat sink 48, and the predetermined space 49, and the cooling efficiency thereof can be further improved. it can.

  The present invention is not limited to the configuration of each of the above embodiments, and can be appropriately changed in design without departing from the gist of the invention. For example, the HIC is described as being disposed in the predetermined space 49. If it is a place where the cooling air from the cooling fan 50 directly hits, for example, it may be on the control board 45 outside the predetermined space 49 shifted to the windward side from the predetermined space 49.

DESCRIPTION OF SYMBOLS S Rice cooker 21 Cover body 22 Hinge part 23 Push button 24 Pressure regulation unit 25 Steam discharge port 26 Display part 27 Operation button 30 Container body 31 Outer case 32 Inner pan 33 Inner case 34 Center sensor 34a Sensor insertion port 35 Shoulder member 35a Handle 36 Bottom Work Coil 37 Side Work Coil 38 Coil Support Base 39 Air Intake 40 Internal Space 41 Cord Winder 44 Board Support Case 45 Control Board 46 Electronic Component 46a IGBT
46b Diode bridge 46c HIC
46d ZNR 47 First heat sink 47a Main body portion 47aa Substrate contact portion 47ab Parts mounting portion 47b Fin 47c air passage 48 Second heat sink 48a Main body portion 48aa Substrate contact portion 48ab Parts etc. mounting portion 48b Fin 48c air passage 49 Predetermined space 50 Cooling fan 50a Blade 51 Fan case 51a Short arc portion 51b Long arc portion 51bb Central region 51c Fan receiving portion 52 Upper rib 53 Lower rib 54 Cylindrical space in the rib

Claims (6)

A container body;
Heating means;
A lid for opening and closing the upper opening of the container body;
A control board on which electronic components for controlling the heating means are disposed;
A heat sink attached to the control board for cooling the electronic component;
A heating cooker having a cooling fan for sending cooling air to the heat sink,
The heat sink has a first heat sink and a second heat sink,
The cooking device according to claim 1, wherein the first heat sink and the second heat sink are opposed to the cooling fan and are spaced apart from each other by a predetermined space. The electronic component has at least a first electronic component to a third electronic component that generate a large amount of heat,
The first electronic component is attached to the first heat sink,
The second electronic component is attached to the second heat sink,
The cooking device according to claim 1, wherein the third electronic component is disposed in the predetermined space.   The cooking device according to claim 2, wherein the first electronic component is an IGBT, the second electronic component is a diode bridge, and the third electronic component is a hybrid integrated circuit (HIC). . Each of the first heat sink and the second heat sink has a plurality of fins,
The cooking device according to any one of claims 1 to 3, wherein each of the plurality of fins is positioned at a predetermined distance away from each other with leading ends thereof facing each other.   When the cooling fan is viewed from the leeward side on the leeward side, most of the first heat sink, most of the second heat sink, and most of the predetermined space are within the same projection area as the cooling fan. The heating cooker according to any one of claims 1 to 4, wherein the heating cooker is located in the area.   The cooking device according to any one of claims 2 to 5, further comprising a rib that supports the third electronic component.

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