JP4474762B2 - Cooling device for electric elements - Google Patents

Cooling device for electric elements Download PDF

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Publication number
JP4474762B2
JP4474762B2 JP2000283799A JP2000283799A JP4474762B2 JP 4474762 B2 JP4474762 B2 JP 4474762B2 JP 2000283799 A JP2000283799 A JP 2000283799A JP 2000283799 A JP2000283799 A JP 2000283799A JP 4474762 B2 JP4474762 B2 JP 4474762B2
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Japan
Prior art keywords
cooling
ventilation duct
electric element
circuit board
space
Prior art date
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Expired - Lifetime
Application number
JP2000283799A
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Japanese (ja)
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JP2002094275A (en
Inventor
善紀 儀賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
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Fuji Electric Systems Co Ltd
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Filing date
Publication date
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Priority to JP2000283799A priority Critical patent/JP4474762B2/en
Publication of JP2002094275A publication Critical patent/JP2002094275A/en
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Publication of JP4474762B2 publication Critical patent/JP4474762B2/en
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Description

【0001】
【発明の属する技術分野】
この発明は、通風ダクト内の冷却フィンを介して、回路基板上の電気素子を冷却する電気素子の冷却装置に関する。
【0002】
【従来の技術】
図3及び図4は電磁調理器におけるこの種の冷却装置を示すもので、図3は電磁調理器本体の概略縦断面図、図4は回路基板とともに示す冷却装置の斜視図である。周知の通り、電磁調理器は磁性体からなる鍋の底面にうず電流を誘起させて発熱させ、鍋の中の食品を加熱調理するものであるが、図3において、1はトッププレート2上に置かれた図示しない磁性体の鍋にうず電流を誘起させる誘導コイル、3は誘導コイル1に高周波電流を供給する電源回路や制御回路が搭載された回路基板である。回路基板3には各種の発熱性の電気素子が実装されているが、高周波電源の主要素子であるスイッチングトランジスタ(IGBT)4は特に発熱が大きいため、アルミダイカストからなる冷却フィン5により冷却されるようになっている。冷却フィン5は上面が開放した櫛形断面の直方体で、間隔片を介してねじにより回路基板3に固定され、その底面は回路基板3に実装されたスイッチングトランジスタ4の上面に伝熱的に接触している。
【0003】
図4において、冷却フィン5には前後端が開放した耐熱樹脂からなる門形断面の通風ダクト6が被せられ、その一端(後端)には冷却ファン7が連結されている。冷却ファン7は、通風ダクト6に対応する方形の枠体内にインペラ7a(図3)が支持され、図4の矢印A方向、つまり通風ダクト6の正面側(図3の左側)から見て時計方向に回転し、前方(矢印B方向)に向って冷却風を送風する。
この冷却風により冷却フィン5は冷却され、その底面に接触するスイッチングトランジスタ4を冷却する。回路基板3上にはスイッチングトランジスタ4以外の種々の電気素子8が実装され、それらは通風ダクト6の周辺に配置されているが、これらの電気素子8も発熱する。そこで、従来は通風ダクト6に例えばスリット9を設けるなどして、冷却ファン7からの冷却風の一部を曲線矢印Cで示すようにダクト外に適宜に漏出させ、通風ダクト近辺の電気素子8を同時に冷却するようにしている。
【0004】
【発明が解決しようとする課題】
従来は通風ダクト近辺の電気素子8を通風ダクト6から漏出させた冷却風で冷却しているが、この漏出冷却風は回路基板上で拡散するため冷却効率が悪く、十分な冷却効果が得られなかった。また、その対策として冷却風の漏出量を増やすと、冷却フィン5に対する風量に不足を生じるという問題があった。
この発明の課題は、冷却フィンを介して冷却する電気素子の冷却に支障を生じないようにしながら、その周辺の電気素子の冷却性能を向上することにある。
【0005】
【課題を解決するための手段】
上記課題を解決するために、この発明は、底面が回路基板上の電気素子に伝熱的に接触する冷却フィンと、この冷却フィンに被さる通風ダクトと、この通風ダクトの一端に連結された冷却ファンとからなり、この冷却ファンにより前記通風ダクトの一端から他端に向けて通風する冷却風により、前記冷却フィンを介して前記電気素子を冷却する電気素子の冷却装置において、前記通風ダクトの横幅空間に前記冷却フィンに対して余裕を持たせ、前記冷却フィンを接触させた前記電気素子以外の前記回路基板上の電気素子を前記通風ダクトの余裕空間に収容するようにするものとするとともに前記通風ダクトの横幅空間内において、前記冷却フィンは前記冷却ファンのインペラが上から下に回転運動をする側に片寄せて配置するのがよい。
【0006】
図5に示すように、冷却ファン7から前方に送り出される風は、通常、インペラ7aの回転方向(矢印A)の速度成分(矢印B)を有し、全体としてその回転方向に旋回している。従って、冷却ファンのインペラが上から下に回転運動をする側(図5では右側)では、冷却風も上から下に向うように旋回しており、この側に片寄せて冷却フィンを配置することにより、回路基板上に支持された冷却フィンに対し、その上面から降り注ぐように冷却風を通風して冷却効果を高め、余裕空間内に他の電気素子を収容したことによる電気素子の冷却効果の低下を小さくすることができる。
【0007】
【発明の実施の形態】
以下、従来例で示したものと同様の冷却装置における実施の形態について、図1及び図2に基づいて説明する。図1において、従来と相違するのは、通風ダクト6は横幅空間が冷却フィン5に対して余裕を持つように幅広に構成され、その余裕空間10に、従来、冷却ダクト6の外側近辺に配置されていた電気素子8の一部あるいは全部が収容されている点である。また、図2に示すように、冷却フィン5は、通風ダクト6の横幅空間内において、正面から見て時計方向(矢印A方向)に回転する冷却ファン7のインペラ7aが上から下に回転運動をする側(右側)に片寄せられて配置され、余裕空間10は左側に設けられている。
【0008】
このような冷却装置において、冷却ファン7から前方(図1の矢印B方向)に送風される冷却風の大部分は冷却フィン5を通して流れ、冷却フィン5が接触する電機素子4を冷却するが、その一部分は余裕空間10を通して流れ、電気素子8を直接冷却する。このような構成においては、冷却フィン5を通らない冷却風は全て余裕空間10に集約されて電気素子8に当てられるので、冷却に利用されることなく拡散する冷却風が少なくなり、全体として冷却効率が高くなる。また、図2において、インペラ5aが上から下に回転運動をする側に片寄せられた冷却フィン5には、矢印Cで示すように、その上面から降り注ぐように冷却風が当たるので、冷却フィン5が通風ダクト6の左右中心に配置される場合よりも冷却効率が高くなり、結果として冷却風の一部が余裕空間に流れることによる冷却効果の低下が小さくなる。なお、図示実施の形態では電磁調理器における例を示したが、この発明の適用はこれに限られるものではない。
【0009】
【発明の効果】
以上の通り、この発明によれば、冷却フィンに通風する冷却ファンの冷却風を有効に利用し、冷却フィンに接触する電気素子はもちろん、その周辺の電気素子も効率良く冷却することができる。
【図面の簡単な説明】
【図1】 この発明の実施の形態を示す電気素子の冷却装置の斜視図である。
【図2】 図1の正面図である。
【図3】 従来の電気素子の冷却装置を備えた電磁調理器の概略縦断面図である。
【図4】 図3における電気素子の冷却装置の斜視図である。
【図5】 冷却ファンの風向成分を説明する正面図である。
【符号の説明】
3 回路基板
4 電気素子
5 冷却フィン
6 ダクト
7 冷却ファン
7a インペラ
8 電気素子
10 余裕空間
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electric element cooling apparatus that cools electric elements on a circuit board through cooling fins in a ventilation duct.
[0002]
[Prior art]
3 and 4 show a cooling device of this type in an electromagnetic cooker, FIG. 3 is a schematic longitudinal sectional view of the main body of the electromagnetic cooker, and FIG. 4 is a perspective view of the cooling device shown together with a circuit board. As is well known, an electromagnetic cooker induces an eddy current at the bottom of a pan made of a magnetic material to generate heat and cooks food in the pan. In FIG. 3, 1 is on the top plate 2. An induction coil for inducing an eddy current in a magnetic pot (not shown) placed thereon is a circuit board on which a power supply circuit and a control circuit for supplying a high frequency current to the induction coil 1 are mounted. Various heat-generating electric elements are mounted on the circuit board 3, but the switching transistor (IGBT) 4, which is a main element of the high-frequency power supply, generates a particularly large amount of heat and is cooled by the cooling fins 5 made of aluminum die casting. It is like that. The cooling fin 5 is a rectangular parallelepiped with an open top surface, and is fixed to the circuit board 3 with screws through a spacing piece. The bottom surface of the cooling fin 5 is in thermal contact with the top surface of the switching transistor 4 mounted on the circuit board 3. ing.
[0003]
In FIG. 4, the cooling fin 5 is covered with a ventilation duct 6 having a gate-shaped cross section made of heat-resistant resin with open front and rear ends, and a cooling fan 7 is connected to one end (rear end) thereof. The cooling fan 7 is supported by an impeller 7a (FIG. 3) in a rectangular frame corresponding to the ventilation duct 6, and is viewed from the direction of arrow A in FIG. 4, that is, from the front side of the ventilation duct 6 (left side in FIG. 3). Rotate in the direction and blow cooling air toward the front (arrow B direction).
The cooling fin 5 is cooled by the cooling air, and the switching transistor 4 in contact with the bottom surface is cooled. Various electric elements 8 other than the switching transistor 4 are mounted on the circuit board 3, and they are arranged around the ventilation duct 6, but these electric elements 8 also generate heat. Therefore, conventionally, for example, a slit 9 is provided in the ventilation duct 6 so that a part of the cooling air from the cooling fan 7 is appropriately leaked out of the duct as indicated by a curved arrow C, so that the electric element 8 in the vicinity of the ventilation duct is provided. Are cooled at the same time.
[0004]
[Problems to be solved by the invention]
Conventionally, the electric element 8 in the vicinity of the ventilation duct is cooled by the cooling air leaked from the ventilation duct 6. However, since this leakage cooling air diffuses on the circuit board, the cooling efficiency is poor and a sufficient cooling effect is obtained. There wasn't. Further, when the leakage amount of the cooling air is increased as a countermeasure, there is a problem that the air amount with respect to the cooling fin 5 is insufficient.
The subject of this invention is improving the cooling performance of the electric element of the periphery, without producing the trouble in cooling of the electric element cooled via a cooling fin.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides a cooling fin whose bottom surface is in thermal contact with an electrical element on a circuit board, a ventilation duct covering the cooling fin, and a cooling coupled to one end of the ventilation duct. In the cooling device for an electric element that cools the electric element through the cooling fin by cooling air that is passed from one end of the ventilation duct to the other end by the cooling fan, the lateral width of the ventilation duct a margin to the cooling fins in the space, the with the electrical elements on the cooling the circuit board other than the electric element fins is contacted intended to be housed in the spare area of the ventilation duct In the lateral width space of the ventilation duct, the cooling fins may be arranged so as to be shifted to the side where the impeller of the cooling fan rotates from top to bottom.
[0006]
As shown in FIG. 5, the wind sent forward from the cooling fan 7 usually has a speed component (arrow B) in the rotational direction (arrow A) of the impeller 7a and swirls in the rotational direction as a whole. . Accordingly, on the side where the impeller of the cooling fan rotates from the top to the bottom (the right side in FIG. 5), the cooling air also turns so as to face from the top to the bottom. By cooling the cooling fins supported on the circuit board by blowing cooling air so as to pour down from the upper surface, the cooling effect is enhanced, and the cooling effect of the electric elements by accommodating other electric elements in the extra space Can be reduced.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a cooling device similar to that shown in the conventional example will be described with reference to FIGS. In FIG. 1, the difference from the conventional one is that the ventilation duct 6 is configured to be wide so that the lateral width space has a margin with respect to the cooling fin 5, and is conventionally arranged in the margin space 10 near the outside of the cooling duct 6. A part or all of the electric element 8 that has been used is accommodated. As shown in FIG. 2, the cooling fin 5 is configured such that the impeller 7 a of the cooling fan 7 that rotates clockwise (in the direction of arrow A) as viewed from the front rotates in the horizontal space of the ventilation duct 6 from top to bottom. The marginal space 10 is provided on the left side.
[0008]
In such a cooling device, most of the cooling air blown forward from the cooling fan 7 (in the direction of arrow B in FIG. 1) flows through the cooling fins 5 and cools the electric element 4 with which the cooling fins 5 contact. A part thereof flows through the marginal space 10 and directly cools the electric element 8. In such a configuration, since all the cooling air that does not pass through the cooling fins 5 is concentrated in the marginal space 10 and applied to the electric element 8, the cooling air that diffuses without being used for cooling is reduced, and the cooling as a whole is performed. Increases efficiency. Further, in FIG. 2, the cooling fin 5 that is biased toward the side where the impeller 5a performs the rotational movement from the top to the bottom, as indicated by the arrow C, receives cooling air so as to flow down from the upper surface thereof. The cooling efficiency is higher than when 5 is arranged at the center of the right and left of the ventilation duct 6, and as a result, a decrease in the cooling effect due to a part of the cooling air flowing into the marginal space is reduced. In addition, although the example in an electromagnetic cooker was shown in illustrated embodiment, application of this invention is not restricted to this.
[0009]
【The invention's effect】
As described above, according to the present invention, it is possible to effectively use the cooling air of the cooling fan that passes through the cooling fins and efficiently cool not only the electric elements that contact the cooling fins but also the peripheral electric elements.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electric element cooling apparatus according to an embodiment of the present invention.
FIG. 2 is a front view of FIG.
FIG. 3 is a schematic longitudinal sectional view of an electromagnetic cooker equipped with a conventional electric element cooling device.
4 is a perspective view of a cooling device for the electric element in FIG. 3. FIG.
FIG. 5 is a front view illustrating a wind direction component of a cooling fan.
[Explanation of symbols]
3 Circuit board 4 Electrical element 5 Cooling fin 6 Duct 7 Cooling fan 7a Impeller 8 Electrical element 10 Spacious space

Claims (1)

底面が回路基板上の電気素子に伝熱的に接触する冷却フィンと、この冷却フィンに被さる通風ダクトと、この通風ダクトの一端に連結された冷却ファンとからなり、この冷却ファンにより前記通風ダクトの一端から他端に向けて通風する冷却風により、前記冷却フィンを介して前記電気素子を冷却する電気素子の冷却装置において、
前記通風ダクトの横幅空間に前記冷却フィンに対して余裕を持たせ、前記冷却フィンを接触させた前記電気素子以外の前記回路基板上の電気素子を前記通風ダクトの余裕空間に収容するとともに、前記通風ダクトの横幅空間内において、前記冷却フィンを前記冷却ファンのインペラが上から下に回転運動をする側に片寄せて配置したことを特徴とする電気素子の冷却装置。
A cooling fin whose bottom surface is in heat transfer contact with an electric element on the circuit board, a ventilation duct covering the cooling fin, and a cooling fan connected to one end of the ventilation duct, and the ventilation duct is formed by the cooling fan. In the cooling device for an electric element that cools the electric element through the cooling fin by cooling air that is ventilated from one end to the other end,
The lateral space of the ventilation duct has a margin with respect to the cooling fins, and electrical elements on the circuit board other than the electrical elements that are in contact with the cooling fins are accommodated in the marginal space of the ventilation duct , and The cooling device for an electric element according to claim 1 , wherein the cooling fins are arranged close to a side where the impeller of the cooling fan rotates from top to bottom in a lateral width space of the ventilation duct .
JP2000283799A 2000-09-19 2000-09-19 Cooling device for electric elements Expired - Lifetime JP4474762B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000283799A JP4474762B2 (en) 2000-09-19 2000-09-19 Cooling device for electric elements

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JP4474762B2 true JP4474762B2 (en) 2010-06-09

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Publication number Priority date Publication date Assignee Title
JP5024601B2 (en) * 2007-01-12 2012-09-12 株式会社安川電機 Power converter
JP2009266852A (en) * 2008-04-22 2009-11-12 Hitachi Ltd Control device
JP5657260B2 (en) * 2010-03-03 2015-01-21 三和パッキング工業株式会社 Circuit board heat dissipation structure
JP5598255B2 (en) * 2010-10-28 2014-10-01 パナソニック株式会社 Induction heating cooker
JP5240875B2 (en) * 2011-05-16 2013-07-17 エヌイーシーコンピュータテクノ株式会社 Heat sink and electronic device using the same
JP6699695B2 (en) 2018-09-07 2020-05-27 日本電気株式会社 Electronics

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