JP2018190076A - Manufacturing method of rfid tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an RFID tag capable of suppressing bonding failure of the RFID elements and also capable of preventing degrading of productivity of the RFID tags.SOLUTION: The manufacturing method of an RFID tag of an embodiment includes a step of preparing a first leaf sheet on which a plurality of antenna patterns are arrayed, a step of preparing a second leaf sheet on which a plurality of RFIC elements are arrayed on respective positions corresponding to the plurality of antenna patterns, a step of adhering the first leaf sheet and the second leaf sheet in a thickness direction while aligning the plurality of antenna patterns and the plurality of RFIC elements, and a step of cutting the adhered first leaf sheet and the second leaf sheet in the thickness direction and forming individual pieces of the RFID tags.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing an RFID (Radio Frequency IDentifier) tag.

  Conventionally, as a method of manufacturing an RFID tag, a method of manufacturing an RFID tag using a carrier tape that accommodates a plurality of RFIC elements with a sealant is known (for example, see Patent Document 1).

  In the manufacturing method of Patent Document 1, the carrier tape is continuously pulled out from the supply reel, and the antenna base on which the antenna element is formed is pulled out from another supply reel, and the carrier tape and the antenna base are brought close to each other. Thus, the RFIC element accommodated in the carrier tape is attached to the tape-shaped antenna substrate. According to the manufacturing method of Patent Document 1, by continuously performing this operation, a plurality of RFID tags can be manufactured at a higher speed, so that the productivity of RFID tags can be improved.

Japanese Patent No. 5904316

  However, in Patent Document 1, since the carrier tape and the antenna substrate are pulled out from the supply reel, tension may be applied to the carrier tape and the antenna substrate in the longitudinal direction, and the carrier tape and the antenna substrate may be extended. In this case, due to the difference between the extension of the carrier tape and the extension of the antenna base material, the attachment position of the RFIC element may be shifted and attachment failure may occur, or the surface of the RFID tag may be warped. When the surface of the RFID tag is warped, it is difficult to print on the surface. In particular, the smaller the RFID tag is, the more difficult it is to print on the surface of the RFID tag.

  In order to suppress the elongation of the carrier tape and the antenna base material, it is considered that the tension applied to the carrier tape and the antenna base material may be lowered by slowing the speed at which the carrier tape and the antenna base material are pulled out from the supply reel. However, in this case, the productivity of the RFID tag is lowered.

  An object of the present invention is to provide an RFID tag manufacturing method capable of suppressing poor attachment of an RFIC element and suppressing a decrease in productivity of the RFID tag.

In order to achieve the above object, a method of manufacturing an RFID tag according to an aspect of the present invention includes:
Preparing a first sheet having a plurality of antenna patterns arranged;
Preparing a second sheet having a plurality of RFIC elements arranged at positions corresponding to the plurality of antenna patterns;
Aligning the plurality of antenna patterns and the plurality of RFIC elements, and bonding the first sheet and the second sheet in the thickness direction;
Cutting the first sheet and the second sheet after bonding in the thickness direction, and separating them into individual RFID tags;
including.

  According to the RFID tag manufacturing method of the present invention, it is possible to suppress poor attachment of the RFIC element and to suppress the productivity of the RFID tag.

It is a disassembled perspective view of the RFID tag manufactured by the manufacturing method of the RFID tag which concerns on embodiment of this invention. It is a disassembled perspective view which shows an example of a RFIC element. It is a flowchart which shows an example of the manufacturing method of the RFID tag which concerns on embodiment of this invention. It is a perspective view which shows an example of the manufacturing method of the RFID tag which concerns on embodiment of this invention. FIG. 5 is a perspective view illustrating a process following FIG. 4. FIG. 6 is a perspective view illustrating a process following FIG. 5. FIG. 7 is a perspective view illustrating a process following FIG. 6. FIG. 8 is a cross-sectional view showing a step that follows FIG. 7. FIG. 9 is a perspective view illustrating a process following the process in FIG. 8. It is a top view which shows the state which affixed the RFID tag shown in FIG. 1 on the tape-shaped member. It is a perspective view showing the modification of the method of arranging a plurality of RFIC elements on the 2nd sheet. FIG. 12 is a perspective view illustrating a process following the process in FIG. 11. FIG. 13 is a perspective view illustrating a process following the process in FIG. 12. FIG. 14 is a perspective view showing a step following FIG. 13. It is a perspective view which shows the example whose arrangement | sequence space | interval of the recessed part of a container is narrower than the arrangement | sequence space | interval of the RFIC element arranged in a 2nd sheet | seat sheet. It is a perspective view which shows 1 process of the modification of the method of arranging a some RFIC element in a 2nd sheet | seat sheet.

An RFID tag manufacturing method according to an aspect of the present invention includes a step of preparing a first sheet having a plurality of antenna patterns arranged;
Preparing a second sheet having a plurality of RFIC elements arranged at positions corresponding to the plurality of antenna patterns;
Aligning the plurality of antenna patterns and the plurality of RFIC elements, and bonding the first sheet and the second sheet in the thickness direction;
Cutting the first sheet and the second sheet after bonding in the thickness direction, and separating them into individual RFID tags;
including.

  According to this manufacturing method, since the first sheet and the second sheet are bonded together in the thickness direction, no tension is applied in the surface direction of the first sheet or the second sheet. Can be. As a result, it is possible to suppress poor adhesion of the RFIC element to the antenna pattern and to prevent the RFID tag from warping. In addition, after aligning the plurality of antenna patterns and the plurality of RFIC elements and bonding the first sheet and the second sheet, they are separated into individual RFID tags. A plurality of RFID tags can be manufactured simultaneously. Accordingly, it is possible to suppress a decrease in productivity of the RFID tag.

  In addition, it is preferable that the second sheet has an adhesive layer, the plurality of RFIC elements are arranged on the adhesive layer, and are attached to the first sheet by the adhesive force of the adhesive layer. . According to this manufacturing method, it is possible to eliminate the necessity of bonding a plurality of RFIC elements and a plurality of antenna patterns with an adhesive such as solder. Accordingly, for example, even when the RFID tag is bent, the connection portion between the RFIC element and the antenna pattern can be slid, so that the risk of disconnection can be reduced.

  Further, a release sheet is affixed to a main surface opposite to the main surface on which the antenna pattern of the first sheet is arranged, and the first sheet after the bonding and the When the second sheet is cut in the thickness direction, it is preferable to cut the first sheet and the second sheet so as not to cut the release sheet. According to this manufacturing method, a plurality of separated RFID tags can be held by the release paper. As a result, for example, it becomes possible to remove only the necessary RFID tag from the release paper and use it, thereby improving the handleability.

  In addition, a plurality of stacked bodies of the first sheet and the second sheet, in which the plurality of antenna patterns and the plurality of RFIC elements are aligned, are stacked in the thickness direction, and pressure is applied in the thickness direction. It is preferable to bond the first sheet and the second sheet in each laminated body by adding. According to this manufacturing method, the first sheet and the second sheet in the plurality of laminates can be bonded together, so that it is possible to further suppress the reduction in productivity of the RFID tag.

  The method further includes the step of forming a conductive paste in which conductive particles are dispersed on the first sheet before the step of bonding the first sheet and the second sheet. Is preferred. According to this manufacturing method, it is possible to improve the stability of connection between the antenna pattern and the RFIC element by interposing conductive particles between the antenna pattern and the RFIC element.

  In addition, the plurality of RFIC elements are subjected to pass / fail judgment and stored with identification information before being arranged on the second sheet, and the first sheet and the second sheet are connected to each other. It is preferable that the method further includes a step of collectively reading the identification information stored in each of the plurality of RFIC elements by a reader device after the bonding step. According to this manufacturing method, since the pass / fail determination of the plurality of RFIC elements is performed before being arranged on the second sheet, the production of defective products can be suppressed. In addition, in the step of bonding the first sheet and the second sheet, it is possible that a bonding failure of the RFIC element occurs. In this case, the reader device cannot read the identification information of the RFIC element. On the other hand, according to the manufacturing method, since the identification information of the plurality of RFIC elements is collectively read after the bonding step, it is possible to check the identification information that could not be read by the reader device. It is possible to quickly identify the RFIC element in which the occurrence occurs. Thereby, it is possible to further suppress the production of defective products, and it is possible to further suppress the decrease in productivity of the RFID tag.

  Further, it is preferable that the plurality of RFIC elements are held on a tape-like member, removed from the tape-like member by a mounter, and arranged on the second sheet by a predetermined interval. According to this manufacturing method, the RFIC elements can be arranged on the second sheet in a more rapid and accurate manner.

  Further, the plurality of RFIC elements are respectively accommodated in the plurality of recesses provided in the accommodation tool and are accommodated in the plurality of recesses when the accommodation tool vibrates in a state of being placed on the accommodation tool. It is preferable that the second sheet is attached to the adhesive layer of the second sheet so that the second sheet is arranged at a predetermined interval. According to this manufacturing method, a plurality of RFIC elements can be arranged on the second sheet at the same time more quickly and accurately.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is an exploded perspective view of an RFID tag manufactured by an RFID tag manufacturing method according to an embodiment of the present invention.

  As shown in FIG. 1, the RFID tag 1 includes an antenna substrate 2 that constitutes a part of the first sheet, and a holding substrate 3 that constitutes a part of the second sheet. The RFID tag 1 is an RFID tag whose communication frequency is, for example, 900 MHz band, that is, UHF band.

  The antenna substrate 2 is made of a heat-resistant member such as polyethylene naphthalate (PEN). An antenna pattern 21 is formed on one main surface of the antenna substrate 2. The antenna pattern 21 is made of a conductive material such as copper foil, aluminum foil, or silver paste, for example.

  The antenna pattern 21 is formed, for example, in a meander shape and includes antenna conductors 21a and 21b that function as a dipole antenna. The first input / output terminal 21aa which is one end of the antenna conductor 21a and the second input / output terminal 21ba which is one end of the antenna conductor 21b are arranged away from each other.

  The holding substrate 3 has an adhesive layer 31, and the RFIC element 4 is provided on the adhesive layer 31. In order to protect the RFIC element 4, the holding substrate 3 is made of, for example, a member having heat resistance. The adhesive layer 31 is made of, for example, an acrylic material having strong adhesiveness so as to be attached to the antenna substrate 2. The RFIC element 4 is, for example, a package or strap in which an RFIC chip is sealed. The RFIC element 4 is an RFIC element corresponding to a communication frequency of, for example, 900 MHz band, that is, UHF band. The reason why the member having heat resistance is used as the antenna substrate 2 or the holding substrate 3 is that an RFID tag used at a high temperature of, for example, 100 ° C. or more can be configured. If the RFID tag is not required to have such high temperature heat resistance, a cheaper member such as PET may be used as the antenna base 2 or the holding base 3.

  FIG. 2 is an exploded perspective view showing an example of the RFIC element 4. 2 shows a state in which the RFIC element 4 shown in FIG. Further, in the XYZ coordinate system in FIG. 2, the Z axis indicates the thickness direction. This XYZ coordinate system is intended to facilitate understanding of the invention and is not intended to limit the present invention.

  As shown in FIG. 2, the RFIC element 4 is composed of a multilayer substrate having three layers. Specifically, the RFIC element 4 is formed by laminating flexible insulating sheets 41A, 41B, and 41C made of a resin material such as polyimide or liquid crystal polymer. Note that the number of base material layers in the multilayer substrate can be appropriately adjusted according to a required inductance value or the like.

  The RFIC element 4 includes an RFIC chip 42, a plurality of inductance elements 43A, 43B, 43C, and 43D, and external connection terminals 44A and 44B. In the present embodiment, the inductance elements 43A to 43D and the external connection terminals 44A and 44B are formed on the insulating sheets 41A to 41C and are made of a conductive material such as copper.

  The RFIC chip 42 is mounted on the central portion in the longitudinal direction (Y-axis direction) on the insulating sheet 41C. The RFIC chip 42 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon. The RFIC chip 42 includes a first input / output terminal 42a and a second input / output terminal 42b.

  The inductance element 43A is composed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41C on one side in the longitudinal direction (Y-axis direction) of the insulating sheet 41C. A land 43Aa connected to the first input / output terminal 42a of the RFIC chip 42 is provided at one end portion (end portion outside the coil) of the inductance element 43A. A land 43Ab is provided at the other end of the inductance element 43A (end on the coil center side).

  The inductance element 43B is composed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41C on the other side in the longitudinal direction (Y-axis direction) of the insulating sheet 41C. A land 43Ba connected to the second input / output terminal 42b of the RFIC chip 42 is provided at one end portion (end portion outside the coil) of the inductance element 43B. Further, a land 43Bb is provided at the other end portion (end portion on the coil center side) of the inductance element 43B.

  The inductance element 43C is composed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41B on one side in the longitudinal direction (Y-axis direction) of the insulating sheet 41B. The inductance element 43C is opposed to the inductance element 43A in the stacking direction (Z-axis direction). A land 43Ca is provided at one end portion (end on the coil center side) of the inductance element 43C. The land 43Ca is connected to the land 43Ab of the inductance element 43A on the insulating sheet 41C via an interlayer connection conductor 45A such as a through-hole conductor that penetrates the insulating sheet 41B.

  The inductance element 43D is composed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41B on the other side in the longitudinal direction (Y-axis direction) of the insulating sheet 41B. The inductance element 43D is opposed to the inductance element 43B in the stacking direction (Z-axis direction). A land 43Da is provided at one end portion (end portion on the coil center side) of the inductance element 43D. The land 43Da is connected to the land 43Bb of the inductance element 43B on the insulating sheet 41C via an interlayer connection conductor 45B such as a through-hole conductor that penetrates the insulating sheet 41B.

  The inductance elements 43C and 43D on the insulating sheet 41B are integrated as one conductor pattern. That is, the other end portions (end portions outside the coil) are connected to each other. The insulating sheet 41B is formed with a through hole 41Ba for accommodating the RFIC chip 42 mounted on the insulating sheet 41C.

  The external connection terminals 44A and 44B are composed of a conductor pattern provided on the insulating sheet 41A. The external connection terminals 44A and 44B are opposed to the longitudinal direction (Y-axis direction) of the insulating sheet 41A.

  The external connection terminal 44A is connected to the land 43Ca of the inductance element 43C on the insulation sheet 41B via an interlayer connection conductor 45C such as a through-hole conductor that penetrates the insulation sheet 41A. The external connection terminal 44A is connected to the first input / output terminal 21aa of the antenna conductor 21a shown in FIG.

  The external connection terminal 44B is connected to the land 43Da of the inductance element 43D on the insulation sheet 41B via an interlayer connection conductor 45D such as a through-hole conductor that penetrates the insulation sheet 41A. The external connection terminal 44B is connected to the second input / output terminal 21ba of the antenna conductor 21b shown in FIG.

  The RFIC chip 42 exists between the inductance elements 43A and 43B and between the inductance elements 43C and 43D. When the RFIC chip 42 functions as a shield, magnetic field coupling and capacitive coupling between the spiral coil-shaped inductance elements 43A and 43B provided on the insulating sheet 41C are suppressed. Similarly, magnetic field coupling and capacitive coupling between the spiral coil-shaped inductance elements 43C and 43D provided on the insulating sheet 41B are suppressed. As a result, it is suppressed that the pass band of the communication signal becomes narrow.

  Next, a manufacturing method of the RFID tag according to the embodiment of the present invention will be described. FIG. 3 is a flowchart showing an example of the RFID tag manufacturing method according to the embodiment of the present invention. 4 to 9 are perspective views or cross-sectional views showing an example of the RFID tag manufacturing method according to the embodiment of the present invention.

  First, in step S1, an antenna base tape 2A in which a plurality of antenna patterns 21 are arranged is prepared as shown in FIG. On the main surface opposite to the main surface on which the antenna pattern 21 of the antenna base tape 2A is arranged, a release paper 23 is attached via an adhesive layer 22. The adhesive layer 22 is, for example, a double-sided tape.

  Next, in step S2, as shown in FIG. 5, the antenna base tape 2A is cut at a predetermined interval to produce a plurality of first sheet 2B. Thereby, the 1st sheet 2B by which the several antenna pattern 21 was arranged is prepared. The size of the first sheet 2B is, for example, a rectangular shape of 200 mm × 200 m or less (typically 135 mm × 135 mm).

  Next, in step S3, the pass / fail judgment is performed on the plurality of RFIC elements 4 by the characteristic sorter and the identification information is stored. For example, an identification number is stored as identification information for the RFIC element 4 whose pass / fail judgment result is “good”. In the present embodiment, the RFIC element 4 that has been determined to pass or fail is held on a tape-like member (not shown).

  Next, in step S4, as shown in FIG. 6, a plurality of RFIC elements 4 are arranged on a plurality of second sheet 3B. In the present embodiment, the plurality of RFIC elements 4 are removed from the tape-shaped member by a mounter (automatic mounting machine), and the second sheet 3B is separated at a predetermined interval so as to correspond to the plurality of antenna patterns 21. They are arranged on the adhesive layer 31. Thus, a second sheet 3B in which a plurality of RFIC elements 4 are arranged at positions corresponding to the plurality of antenna patterns 21 is prepared. At this time, in the RFIC element 4, the insulating sheet 41C is attached to the adhesive layer 31 so that the external connection terminals 44A and 44B are exposed (see FIG. 2). The size of the second sheet 3B is the same as the size of the first sheet 2B, for example, a rectangular shape of 200 mm × 200 m or less (typically 135 mm × 135 mm). Since the planar sizes of the first sheet 2B and the second sheet 3B are the same, the sheets can be accurately stacked without applying stress such as tension to the sheets. Moreover, if the sheet | seat of the same material is used for each sheet | seat, the curvature and the wave | undulation by difference in a thermal expansion coefficient etc. can be reduced.

  Note that the order of steps S1 and S2 and steps S3 and S4 is not particularly limited. For example, steps S3 and S4 may be performed before steps S1 and S2.

  Next, as shown in FIG. 7, the plurality of antenna patterns 21 and the plurality of RFIC elements 4 are aligned, and the first sheet 2B and the second sheet 2B are bonded together in the thickness direction. In the present embodiment, the following steps S5 and S6 are performed.

  In step S5, as shown in FIG. 8, the laminate 10 of the first sheet 2B and the second sheet 3B in which the plurality of antenna patterns 21 and the plurality of RFIC elements 4 are aligned is arranged in the thickness direction. A plurality (for example, 5 to 10) are stacked. In the present embodiment, the plurality of stacked bodies 10 are stacked on the pedestal 50. Each sheet 2B, 3B is provided with a blank area around the product area, and a positioning reference hole is provided in the blank area. That is, a through hole 10 </ b> A serving as a reference hole is provided at each edge of the plurality of stacked bodies 10. A plurality of pins 51 provided on the pedestal 50 are inserted into the through holes 10A, and the stacked bodies 10 are positioned so as not to be displaced. In FIG. 8, the dimensions and the like of each member are exaggerated for easy understanding. In addition, a release paper may be arrange | positioned between each laminated body 10 so that it may not stick together.

  Next, in step S6, as shown by arrows in FIG. 8, pressure is applied to the plurality of stacked bodies 10 in the thickness direction, and the first sheet 2B and the second sheet in each stacked body 10 are applied. Paste 3B. At this time, the first sheet 2B and the second sheet 3B are attached to each other by the adhesive force of the adhesive layer 31, while the antenna pattern 21 and the RFIC element 4 facing each other are in direct contact without an adhesive. To do. At this time, when air is mixed between the first sheet 2B and the second sheet 3B, the air may be pushed out by applying further pressure. Further, the air may be sucked by evacuation.

  Then, in step S6, each laminated body 10 is removed from the base 50, and as shown in FIG. 9, the 1st sheet 2B and 2nd sheet 3B after bonding are cut | disconnected in the thickness direction. The individual RFID tags 1 are separated into individual pieces. At this time, the first sheet 2B and the second sheet 3B are cut so that the release sheet 23 is not cut. Thereby, the plurality of RFID tags 1 separated into pieces are held by the release paper 23. The adhesive layer 22 may be cut or not cut.

  In addition, when it is necessary to print a barcode etc. on the surface of the RFID tag 1, it may be performed after each laminated body 10 is removed from the pedestal 50 and before being separated into individual pieces. In the present embodiment, the first sheet 2B and the second sheet 3B are the same size, and it is possible to suppress the occurrence of a step between them, so that the surface of the RFID tag 1 can be easily printed. can do.

  Next, in step S7, identification information stored in the RFIC elements 4 of the plurality of RFID tags 1 held by the release paper 23 is collectively read by a reader device (not shown). By confirming the identification information that could not be read by the reader device, the RFIC element 4 in which the attachment failure has occurred is specified. When there is an RFIC element 4 in which a sticking failure has occurred, the RFIC element 4 is removed from the release paper 23.

  According to the manufacturing method according to the present embodiment, the first sheet 2B or the second sheet 3B is bonded to the first sheet 2B and the second sheet 3B in the thickness direction. It is possible to prevent tension from being applied in the surface direction of the sheet 3B. As a result, it is possible to suppress poor adhesion of the RFIC element 4 to the antenna pattern 21 and to prevent the RFID tag 1 from warping. As a result, even if the RFID tag 1 is downsized, it is possible to easily print on the surface of the RFID tag 1. In addition, the thickness of the first sheet 2B and the second sheet 3B can be further reduced, and the cost can be reduced by preventing the material from being restricted.

  Further, according to the manufacturing method according to the present embodiment, the plurality of antenna patterns 21 and the plurality of RFIC elements 4 are aligned, and the first sheet 2B and the second sheet 3B are bonded together. Later, it is separated into individual RFID tags 1. Thereby, the some RFID tag 1 can be manufactured simultaneously. Therefore, it is possible to suppress a decrease in productivity of the RFID tag 1.

  In addition, according to the manufacturing method according to the present embodiment, the second sheet 3B has the adhesive layer 31, the plurality of RFIC elements 4 are arranged on the adhesive layer 31, and the adhesive force of the adhesive layer 31 It is made to affix on the 1st sheet | seat sheet 2B. This eliminates the need to bond the plurality of RFIC elements 4 and the plurality of antenna patterns 21 with an adhesive such as solder. As a result, for example, even when the RFID tag is bent, the connection portion between the RFIC element 4 and the antenna pattern 21 is slidable, so that concentration of stress is suppressed and there is a risk that the antenna pattern 21 is disconnected. Can be reduced. In addition, it is not necessary to form an adhesive material between the plurality of RFIC elements 4 and the plurality of antenna patterns 21, and the connection stability can be improved.

  Further, according to the manufacturing method according to the present embodiment, the first sheet 2B and the second sheet are attached so that the release sheet 23 is attached to the first sheet 2B and the release sheet 23 is not cut. The sheet 3B is cut and separated into individual RFIC elements 4. Thereby, the plurality of RFID tags 1 separated into pieces can be held by the release paper 23. As a result, for example, only the necessary RFID tag 1 can be removed from the release paper 23 and used, and the handleability can be improved.

  Moreover, according to the manufacturing method which concerns on this Embodiment, by laminating | stacking the some laminated body 10 in the thickness direction and applying a pressure to the said thickness direction, the 1st sheet | seat 2B in each laminated body 10 and The second sheet 3B is bonded together. Thereby, since the 1st sheet | seat sheet 2B and the 2nd sheet | seat sheet 3B in the some laminated body 10 can be bonded together simultaneously, the fall of productivity of RFID tag 1 can be suppressed further.

  Further, according to the manufacturing method according to the present embodiment, the first sheet 2B and the second sheet 3B are bonded together in the thickness direction, so that the plurality of sheets in the second sheet 3B are plural. More RFID tags 1 can be manufactured by narrowing the arrangement interval of the RFIC elements 4. Moreover, the antenna base material 2 which becomes unnecessary can be significantly reduced compared with the conventional manufacturing method (roll-to-roll). However, in this case, if the arrangement interval of the RFIC elements 4 is narrow, radio waves interfere, and after the arrangement of the plurality of RFIC elements 4 on the second sheet 3B, it is not possible to determine whether each RFIC element 4 is good or bad by the characteristic selector. Can happen.

  On the other hand, according to the manufacturing method according to the present embodiment, it is determined whether or not the plurality of RFIC elements 4 are arranged on the second sheet 3B and the identification information is stored. Yes. Thereby, it can suppress that a defective article is manufactured. In addition, in the step of bonding the first sheet 2B and the second sheet 3B, it is possible that defective bonding of the RFIC element 4 (antenna disconnection, positional deviation, etc.) may occur. In this case, the reader device cannot read the identification information of the RFIC element 4.

  On the other hand, according to the manufacturing method according to the present embodiment, the identification information stored in each of the plurality of RFIC elements 4 after the first sheet 2B and the second sheet 3B are bonded together. Are read at once. Accordingly, by confirming the identification information that could not be read by the reader device, the RFIC element 4 in which the sticking failure has occurred can be quickly identified on a sheet basis. As a result, it is possible to further suppress the production of defective products and to further suppress the decrease in productivity of the RFID tag 1.

  Further, according to the manufacturing method according to the present embodiment, the plurality of RFIC elements 4 are held on the tape-like member, removed from the tape-like member by the mounter, and predetermined intervals on the second sheet 3B. To be arranged in. Thereby, the RFIC elements 4 can be arranged on the second sheet 3B more quickly and accurately.

  When printing on the surface of the RFID tag 1 using a general RFID printer, the RFID tag 1 may be required to be held on a tape-like member. In this case, for example, the RFID tag 1 may be removed from the release paper 23 and the RFID tag 1 may be attached to the tape-like member 60 as shown in FIG. Even in this case, since the antenna base material 2 and the holding base material 3 are attached, the connection stability between the antenna pattern 21 and the RFIC element 4 can be ensured.

  In addition, this invention is not limited to the said embodiment, It can implement in another various aspect. For example, in the above description, the antenna conductors 21a and 21b are formed in a meander shape, and the RFID tag 1 is a UHF band RFID tag whose communication frequency is the UHF band. However, the present invention is not limited to this. For example, the antenna conductors 21a and 21b may be formed in a rectangular band shape or other shapes, for example. Further, although the antenna conductors 21a and 21b function as dipole antennas, the present invention is not limited to this. The antenna conductors 21a and 21b may function as loop type antennas or may function as other types of antennas. Further, the RFID tag 1 may be configured as an HF band RFID tag using the HF band as a communication frequency.

  In the above description, the identification information stored in the plurality of RFIC elements 4 is collectively read by the reader device after being separated into individual RFID tags 1, but the present invention is not limited to this. After the first sheet 2B and the second sheet 3B are bonded together, before the individual RFID tags 1 are separated, the identification information stored in the plurality of RFIC elements 4 is collectively collected by the reader device. May be read.

  In the above description, all steps S1 to S7 are performed. However, the present invention is not limited to this. A process of aligning the plurality of antenna patterns 21 and the plurality of RFIC elements 4 and bonding the first sheet 2B and the second sheet 3B, and dividing into individual RFID tags 1 The other steps are not necessarily performed.

  In the above description, the antenna pattern 21 and the RFIC element 4 facing each other are in direct contact with each other without an adhesive, but the present invention is not limited to this. For example, before bonding the first sheet 2B and the second sheet 3B, a conductive paste in which conductive particles are dispersed is formed on the first sheet 2B, and the antenna pattern 21 and the RFIC are formed. Conductive particles may be interposed between the element 4 and the element 4. Thereby, the stability of the connection between the antenna pattern 21 and the RFIC element 4 can be further improved. In addition, what is necessary is just to print or apply | coat the electrically conductive paste on the antenna pattern 21, for example. As the conductive paste, for example, a silver paste in which silver particles are dispersed can be used. It is preferable that the conductive paste does not have adhesiveness so that the connecting portion between the RFIC element 4 and the antenna pattern 21 can slide.

  In the above description, the plurality of RFIC elements 4 are removed from the tape-like member by the mounter and arranged on the second sheet 3B at a predetermined interval. However, the present invention is not limited to this. . For example, the plurality of RFIC elements 4 may be arranged on the second sheet 3B as follows.

  First, as shown in FIG. 11, a container 100 is prepared in which a plurality of recesses 100a capable of accommodating a plurality of RFIC elements 4 are provided in a matrix at equal intervals. The arrangement interval (also referred to as arrangement density) of the plurality of recesses 100a of the container 100 matches the arrangement interval of the plurality of RFIC elements 4 arranged on the second sheet 3B.

  Next, as shown in FIG. 12, the container 100 is mounted on the vibration device 110 and a plurality of RFIC elements 4 are placed on the container 100.

  Next, as shown in FIG. 13, with the plurality of RFIC elements 4 placed on the container 100, the container 100 is vibrated by the vibration device 110, and the RFIC elements 4 are housed one by one in each recess 100a. . Note that the RFIC element 4 that is not accommodated in the recess 100 a is dropped to the outside of the accommodation tool 100.

  Next, as shown in FIG. 14, the adhesive layer 31 of the second sheet 3 </ b> B is brought into contact with the main surface of the container 100 on the recess 100 a side in a state where the RFIC element 4 is stored in each recess 100 a. Thereby, the RFIC element 4 accommodated in each recessed part 100a is affixed (transferred) to the adhesion layer 31 of the 2nd sheet | seat sheet 3B.

  Next, the second sheet 3B is separated from the container 100. Thereby, as shown in FIG. 6, a plurality of RFIC elements 4 can be arranged on the second sheet 3B at predetermined intervals. According to this method, a plurality of RFIC elements 4 can be simultaneously arranged on the second sheet 3B more quickly and accurately.

  In the above description, the arrangement interval of the plurality of recesses 100a of the container 100 is the same as the arrangement interval of the plurality of RFIC elements 4 arranged in the second sheet 3B, but the present invention is not limited to this. Not. For example, the arrangement interval of the recesses 100a of the container 100 may be narrower than the arrangement interval of the RFIC elements 4 arranged in the second sheet 3B. For example, as shown in FIG. 15, the arrangement interval L1 in the X1 direction of the recesses 100a of the container 100 may be 1/3 of the arrangement interval L2 of the RFIC elements 4 arranged in the second sheet 3B.

  In this case, as shown in FIG. 16, the recesses 100a other than the first row and the fourth row of the container 100 are covered with a mask 120, and in this state, the adhesive layer 31 of the second sheet 3B is recessed in the container 100. The main surface is brought into contact with the 100a side. As a result, the RFIC elements 4 housed in the first row and fourth row recesses 100a are attached to the adhesive layer 31 of the second sheet 3B, and the plurality of RFIC elements 4 are arranged at the arrangement interval L2. The second sheet 3B can be obtained. In addition, the recesses 100a other than the second row and the fifth row of the container 100 are covered with the mask 120, and the adhesive layer 31 of the second sheet 3B is covered with the main surface of the container 100 on the recess 100a side in this state. The contact is made by shifting the arrangement interval L1 in the X1 direction. As a result, the RFIC elements 4 housed in the second row and fifth row recesses 100a are attached to the adhesive layer 31 of the second sheet 3B, and the plurality of RFIC elements 4 are arranged at the arrangement interval L2. The second sheet 3B can be obtained. Further, the recesses 100a other than the third row and the sixth row of the container 100 are covered with the mask 120, and the adhesive layer 31 of the second sheet 3B is covered with the main surface of the container 100 on the recess 100a side in this state. Further contact is made by shifting the arrangement interval L1 in the X1 direction. As a result, the RFIC elements 4 accommodated in the recesses 100a in the third and sixth rows are attached to the adhesive layer 31 of the second sheet 3B, and the plurality of RFIC elements 4 are arranged at the arrangement interval L2. The second sheet 3B can be obtained.

  In other words, the plurality of RFIC elements 4 are arranged in the container 100 at the first arrangement interval L1, and the plurality of RFIC elements 4 arranged in the container 100 are narrower than the first arrangement interval. Then, the RFIC element group having the second arrangement interval L2 corresponding to the arrangement interval of the plurality of antenna patterns 21 arranged on the first sheet 2B is taken out, and the second sheet is maintained in the state where the second arrangement interval is maintained. You may arrange | position to 3B. According to this method, a plurality of RFIC elements 4 accommodated in one container 100 can be arranged in a plurality of second sheet 3B.

  While the invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as being included therein, so long as they do not depart from the scope of the present invention according to the appended claims.

  The present invention is particularly useful for a method for manufacturing a small-sized RFID tag because it can suppress poor attachment of an RFIC element and suppress a decrease in productivity of the RFID tag.

DESCRIPTION OF SYMBOLS 1 RFID tag 2 Antenna base material 2A Antenna base material tape 2B 1st sheet | seat sheet 3 Holding base material 3B 2nd sheet | seat sheet 4 RFIC element 10 Laminated body 10A Through-hole 21 Antenna pattern 21a, 21b Antenna conductor 21aa 1st input / output Terminal 21ba Second input / output terminal 22 Adhesive layer 23 Release paper 31 Adhesive layer 41A, 41B, 41C Insulating sheet 41Ba Through hole 42 Chip 42a First input / output terminal 42b Second input / output terminal 43A, 43B, 43C, 43D Inductance element 43Aa , 43Ab, 43Ba, 43Bb, 43Ca, 43Da Land 44A, 44B External connection terminal 45A, 45B, 45C, 45D Interlayer connection conductor 50 Base 51 Pin 60 Tape-like member 100 Container 100a Recess 110 Vibration device 120 Mask

Claims (8)

Preparing a first sheet having a plurality of antenna patterns arranged;
Preparing a second sheet having a plurality of RFIC elements arranged at positions corresponding to the plurality of antenna patterns;
Aligning the plurality of antenna patterns and the plurality of RFIC elements, and bonding the first sheet and the second sheet in the thickness direction;
Cutting the first sheet and the second sheet after bonding in the thickness direction, and separating them into individual RFID tags;
A method for manufacturing an RFID tag, comprising:   The second sheet includes an adhesive layer, the plurality of RFIC elements are arranged on the adhesive layer, and are attached to the first sheet by the adhesive force of the adhesive layer. The manufacturing method of the RFID tag of description. On the main surface opposite to the main surface on which the antenna pattern of the first sheet is arranged, release paper is attached,
When cutting the first sheet and the second sheet after bonding in the thickness direction, the first sheet and the second sheet are not cut so that the release sheet is not cut. The manufacturing method of the RFID tag of Claim 1 or 2 which cut | disconnects.   A plurality of laminates of the first sheet and the second sheet, in which the plurality of antenna patterns and the plurality of RFIC elements are aligned, are stacked in the thickness direction, and pressure is applied in the thickness direction. The manufacturing method of the RFID tag according to any one of claims 1 to 3, wherein the first sheet and the second sheet in each stacked body are bonded together.   The method further includes the step of forming a conductive paste in which conductive particles are dispersed on the first sheet before the step of bonding the first sheet and the second sheet. The manufacturing method of the RFID tag as described in any one of 1-4. Before the plurality of RFIC elements are arranged on the second sheet, a pass / fail determination is made and identification information is stored.
The method further includes the step of collectively reading the identification information stored in each of the plurality of RFIC elements by a reader device after the step of bonding the first sheet and the second sheet.
The manufacturing method of the RFID tag as described in any one of Claims 1-5.   The plurality of RFIC elements are held by a tape-like member, removed from the tape-like member by a mounter, and arranged at a predetermined interval on the second sheet. The manufacturing method of the RFID tag as described in one.   The plurality of RFIC elements are respectively housed in a plurality of recesses provided in the container and vibrated in the plurality of recesses when the container vibrates while being placed on the container. The RFID tag according to claim 1, wherein the RFID tag is arranged at a predetermined interval on the second sheet by being attached to the adhesive layer of the second sheet. Production method.

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