JP2018185170A - Method for manufacturing inspection jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an inspection jig that can respond to a fine pitch without damaging an inspection object when inspecting the electric characteristics.SOLUTION: A photosensitive resin film 12 is exposed to light, using a photomask 13 and is developed, a through-hole is formed in a thickness direction of the flexible sheet 15, and a conductive material 17 containing conductive particles is filled into the through-hole of the flexible sheet 15, using a fine amount dispenser 16.SELECTED DRAWING: Figure 1

Description

  The present technology relates to a method of manufacturing an inspection jig for electronic components such as wafers, chips, and packages.

  Currently, electrical characteristics evaluation of a semiconductor device at a wafer level is performed by directly contacting a probe with conductive pads and bumps formed on the front surface and the back surface of the wafer using a probe card (for example, Patent Documents). 1).

  According to this method, it is possible to inspect before packaging and before three-dimensional mounting.

  However, in order to remove the oxide film on the pad surface of the wafer, the surface is scratched and the probe inspection is performed, so that after the inspection-accepted product is mounted, a reject product is generated due to the damage caused by the inspection. There is a case. Further, as the pad size is reduced, the effect of scratches at the time of inspection, which causes defects during bump formation and mounting, increases. Particularly in recent years, the fine pitch of semiconductor chips has been increasingly advanced, so that scratches at the time of inspection become an increasingly serious problem.

  For bare chips and packages, handler tests using rubber connectors are being conducted. As a rubber connector serving as an inspection probe sheet, for example, an anisotropic conductive sheet has been proposed in which conductive particles oriented in a magnetic field are arranged to penetrate in the thickness direction of the elastomer sheet (see, for example, Patent Document 2). ).

  The inspection probe sheet described in Patent Document 2 is difficult to cope with fine pitch because the conductive particles are connected in the in-plane direction when the conductive particles are magnetically oriented in the rubber elastic elastomer resin. . In addition, although the frame is attached to surround the periphery for the purpose of improving durability, the elastomer resin inside the frame is a substance that easily expands and contracts due to thermal expansion. This may cause inspection failures due to misalignment. In particular, misalignment in a heat cycle test or the like is fatal, and it becomes difficult to cope with further fine pitches in the future.

  In general, a rubber connector in which a conductive substance is disposed in an elastomer resin is difficult to manufacture a connector having a fine pitch. For example, a test connector having a level of 200 μm P or less is difficult to manufacture. For this reason, the actual situation is that inspection is performed on the assembled package, and as a result, the yield is extremely deteriorated, and the price cannot be reduced.

JP 2009-042008 A JP 2006-024580 A

  The present technology solves the above-described problems, and provides a manufacturing method of an inspection jig that can cope with a fine pitch without damaging an inspection object during an inspection of electrical characteristics.

  As a result of intensive studies, the inventors of the present technology formed a through-hole in the thickness direction of the flexible sheet, and filled the through-hole with a conductive material containing conductive particles, thereby inspecting an object at the time of inspecting electrical characteristics. It has been found that it is possible to manufacture an inspection jig that can handle fine pitch without damaging the surface.

  That is, the manufacturing method of the inspection jig according to the present technology includes a through hole forming step of forming a through hole penetrating in the thickness direction of the flexible sheet, and a conductive particle that fills the through hole of the flexible sheet with a conductive material containing conductive particles. Filling step.

  Moreover, the inspection jig according to the present technology includes a flexible sheet having a plurality of through holes arranged in a desired pattern, and a conductive material filled in the through holes and containing conductive particles.

  According to this technology, by filling conductive material containing conductive particles into the through-holes of flexible sheets, manufacture inspection jigs that can handle fine pitch without damaging inspection objects during electrical property inspections can do.

FIG. 1 is a cross-sectional view schematically showing an example of a method for manufacturing an inspection jig, and FIG. FIG. 1B shows an exposure process, FIG. 1C shows a development process, FIG. 1D shows a conductive particle filling process, and FIG. FIG. 1 (F) shows a base material peeling step. FIG. 2 is a cross-sectional view illustrating a configuration example of the inspection jig.

Hereinafter, embodiments of the present technology will be described in detail in the following order.
1. 1. Manufacturing method of inspection jig Inspection jig

<1. Inspection jig manufacturing method>
The manufacturing method of the inspection jig according to the present technology includes a through-hole forming step of forming a through-hole penetrating in the thickness direction of the flexible sheet, and a conductive particle filling step of filling the through-hole of the flexible sheet with a conductive resin containing conductive particles. And have. Thereby, it is possible to manufacture an inspection jig capable of dealing with a fine pitch without damaging an inspection object during inspection of electrical characteristics.

  FIG. 1 is a cross-sectional view schematically showing an example of a method for manufacturing an inspection jig, and FIG. FIG. 1B shows an exposure process, FIG. 1C shows a development process, FIG. 1D shows a conductive particle filling process, and FIG. FIG. 1 (F) shows a base material peeling step. Hereinafter, the through hole forming step and the conductive particle filling step will be described with reference to FIG.

[Through hole forming step]
First, as shown to FIG. 1 (A), the photosensitive resin composition is apply | coated on the base material 11, and the photosensitive resin film 12 used as a flexible sheet is formed.

  The base material 11 only needs to be excellent in heat resistance and chemical resistance. For example, polyethylene terephthalate (PET) can be used. Moreover, since the base material 11 becomes unnecessary when using the inspection jig, it is preferable that the base material 11 has been subjected to a peeling treatment.

  The photosensitive resin film 12 is a so-called permanent resist film that is used as an insulating material even after pattern processing, and preferably contains a polyimide precursor from the viewpoint of heat resistance.

  Next, as shown in FIG. 1B, the photosensitive resin film 12 is exposed and developed using a photomask 13 or the like to form a pattern in which through holes are arranged. As shown, a flexible sheet 15 having a through hole is produced.

  The through holes are formed in a pattern according to the shape of the pad or bump of the inspection object, the diameter of the through holes is preferably 1 to 100 μm, and the distance between the through holes is preferably 10 to 100 μm. .

  The flexible sheet 15 preferably has flexibility and insulation, has a low coefficient of thermal expansion, and high heat resistance. The flexible sheet 15 preferably contains polyimide from the viewpoint of heat resistance.

  Since the durability of the flexible sheet 15 is inferior when it is too thin, it is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 20 μm or more. Moreover, since formation of a through-hole will become difficult if the thickness of the flexible sheet 15 is too thick, Preferably it is 500 micrometers or less, More preferably, it is 100 micrometers or less, More preferably, it is 50 micrometers or less.

  Thus, by forming the through holes by patterning by exposure of the photosensitive resin film, a desired pattern with high resolution can be formed.

[Conductive particle filling process]
Next, as shown in FIGS. 1D and 1E, the through hole of the flexible sheet 15 is filled with a conductive material 17 containing conductive particles using a small amount of dispenser 16, and dried.

  The conductive material 17 preferably has a certain degree of rigidity after drying and is not easily deformed, and preferably contains an epoxy resin or a silicone resin. Thereby, a certain degree of rigidity can be imparted by thermal curing or ultraviolet curing, and the probe pin can be pressed many times during inspection.

  The positions of the conductive materials 17 arranged in a plan view on the flexible sheet 15 preferably have a specific shape and regularity, and are preferably arranged in a regular arrangement such as a lattice shape or a staggered shape. . Examples of the lattice shape include an orthorhombic lattice, a hexagonal lattice, a tetragonal lattice, a rectangular lattice, and a parallel lattice. Moreover, you may have regularity with the predetermined arrangement | sequence shape with respect to the longitudinal direction of a film.

  As the conductive particles, common particles used in anisotropic conductive films can be used. For example, metal particles such as nickel, cobalt, iron, etc., or particles obtained by plating a conductive metal on the surface of resin core particles or inorganic core particles can be used. Examples of conductive metal plating include Ni / Au plating, Ni / Pd plating, and Ni / Pd / Au plating. Among these, from the viewpoint of reducing damage to the inspection object and durability of the sheet, it is preferable to use particles in which a conductive metal is plated on the surface of the resin core particles.

  Moreover, it is preferable that the average particle diameter of electroconductive particle is 1/4 or less of the average diameter of a through-hole. As a result, the through holes can be filled with the conductive particles at a high level, and the resistance value can be reduced. The smaller the average particle diameter of the conductive particles is, the smaller the size that can correspond to a fine pad or bump, so that it is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less.

  When the inspection jig is used, as shown in FIG. 1 (F), the base material 11 is peeled off from the flexible sheet 15, and one surface of the flexible sheet 15 is attached to an electronic component such as a wafer, a chip, or a package. The probe is pressed against the conductive material 17 from the other surface of the flexible sheet 15, and the electrical characteristics are inspected.

  According to such an inspection jig manufacturing method, it is possible to obtain an inspection jig capable of adapting to a fine pitch without damaging an inspection object during inspection of electrical characteristics.

<2. Inspection jig>
FIG. 2 is a cross-sectional view illustrating a configuration example of the inspection jig. As shown in FIG. 2, the inspection jig includes a flexible sheet 21 having a plurality of through holes arranged in a desired pattern, and a conductive material 22 filled in the through holes and containing conductive particles. Such an inspection jig can be obtained, for example, by the above-described method for manufacturing an inspection jig.

  Like the flexible sheet 15, the flexible sheet 21 is preferably flexible and insulating, has a low thermal expansion coefficient, and high heat resistance. The flexible sheet 21 preferably contains polyimide from the viewpoint of heat resistance. Moreover, since durability will be inferior if the thickness of the flexible sheet 21 is too thin, Preferably it is 5 micrometers or more, More preferably, it is 10 micrometers or more, More preferably, it is 20 micrometers or more. Moreover, since formation of a through-hole will become difficult if the thickness of the flexible sheet 21 is too thick, Preferably it is 500 micrometers or less, More preferably, it is 100 micrometers or less, More preferably, it is 50 micrometers or less.

  Like the conductive material 17, the conductive material 22 preferably has a certain degree of rigidity and is not easily deformed, and preferably contains an epoxy resin or a silicone resin. Thereby, a certain degree of rigidity can be imparted by thermal curing or ultraviolet curing, and the probe pin can be pressed many times during inspection.

  The conductive material 22 filled in the through hole is conductive in the thickness direction of the flexible sheet 21 and may protrude from at least one surface of the flexible sheet 21.

  As the conductive particles, common particles used in anisotropic conductive films can be used in the same manner as the conductive particles described above. Moreover, it is preferable that the average particle diameter of electroconductive particle is 1/4 or less of the average diameter of a through-hole. As a result, the through holes can be filled with the conductive particles at a high level, and the resistance value can be reduced.

  According to such an inspection jig, it is possible to cope with the fine pitch without damaging the pads and bumps of the semiconductor wafer during the inspection of the electrical characteristics.

11 Base material, 12 Photosensitive resin film, 13 Photomask, 14 Trace dispenser, 15 Flexible sheet, 16 Trace dispenser, 17 Conductive material, 21 Flexible sheet, 22 Conductive material

Claims (7)

A through hole forming step for forming a through hole penetrating in the thickness direction of the flexible sheet;
A conductive particle filling step of filling a through hole of the flexible sheet with a conductive material containing conductive particles.   The manufacturing method of the inspection jig according to claim 1, wherein in the through hole forming step, the through hole is formed by patterning by exposure of the photosensitive resin film.   The method for manufacturing an inspection jig according to claim 1 or 2, wherein an average particle diameter of the conductive particles is ¼ or less of an average diameter of the through holes. The photosensitive resin film contains a polyimide precursor,
The manufacturing method of the inspection jig according to claim 2 or 3, wherein the conductive material includes an epoxy resin or a silicone resin. A flexible sheet having a plurality of through holes arranged in a desired pattern;
An inspection jig comprising: a conductive material filled in the through hole and containing conductive particles.   The inspection jig according to claim 5, wherein an average particle diameter of the conductive particles is ¼ or less of an average diameter of the through holes. The flexible sheet contains polyimide,
The inspection jig according to claim 5 or 6, wherein the conductive material includes an epoxy resin or a silicone resin.

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