JP2018176246A5 - - Google Patents

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Publication number
JP2018176246A5
JP2018176246A5 JP2017082254A JP2017082254A JP2018176246A5 JP 2018176246 A5 JP2018176246 A5 JP 2018176246A5 JP 2017082254 A JP2017082254 A JP 2017082254A JP 2017082254 A JP2017082254 A JP 2017082254A JP 2018176246 A5 JP2018176246 A5 JP 2018176246A5
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JP
Japan
Prior art keywords
temperature
target temperature
soldering
soldering point
solder
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JP2017082254A
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English (en)
Japanese (ja)
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JP2018176246A (ja
JP6874979B2 (ja
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Publication of JP2018176246A5 publication Critical patent/JP2018176246A5/ja
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JP2017082254A 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置 Active JP6874979B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017082254A JP6874979B2 (ja) 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017082254A JP6874979B2 (ja) 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置

Publications (3)

Publication Number Publication Date
JP2018176246A JP2018176246A (ja) 2018-11-15
JP2018176246A5 true JP2018176246A5 (https=) 2020-01-30
JP6874979B2 JP6874979B2 (ja) 2021-05-19

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JP2017082254A Active JP6874979B2 (ja) 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置

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JP (1) JP6874979B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7239151B2 (ja) * 2018-12-14 2023-03-14 株式会社ジャパンユニックス レーザー式はんだ付け装置及びはんだ付け方法
CN114713925B (zh) * 2022-02-16 2024-05-14 深圳市鹏汇激光科技有限公司 激光焊锡控制方法、装置、系统及计算机可读存储介质
CN116140735B (zh) * 2023-02-13 2025-09-09 广州大学 一种激光软钎焊设备焊接过程中的温度控制方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06285625A (ja) * 1993-04-06 1994-10-11 Hitachi Ltd 自動ろう付け装置
JP5378874B2 (ja) * 2009-05-11 2013-12-25 三菱電機株式会社 レーザはんだ付け装置及びレーザはんだ付け方法

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