JP2018170449A - Manufacturing method of tactile sense presentation device and tactile sense presentation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a tactile sense presentation device that can suppress the occurrence of warping, and to provide a tactile sense presentation device.SOLUTION: Electrodes 10a and 10b of a piezoelectric element 6 are short-circuited, the piezoelectric element 6 is pasted on a glass panel 5 by using a thermosetting resin, the glass panel 5 is heated, a thermosetting resin is cured, and the short circuit of the electrodes 10a and 10b is released after the heating of the glass panel 5 has been completed. Therefore, it is possible to release electric charge generated in the piezoelectric element 6 in a heating step to reduce deformation of the piezoelectric element 6 and to suppress warping of the piezoelectric element 6 and the glass panel 5. In addition, since the short-circuit of the electrodes 10a and 10b is released after the heating, there is no influence on the use of a tactile sense presentation device 4.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a tactile sensation presentation apparatus and a tactile sensation presentation apparatus.

  2. Description of the Related Art Conventionally, a touch panel in which a vibration member is bonded to present a tactile sensation to a user is known (for example, see Patent Document 1). In addition, a tactile sensation presentation device in which a piezoelectric element is mounted on a glass panel is known. This tactile sensation presentation apparatus is disposed on an electrostatic touch panel via a gap. For example, when using a touch panel mounted on a smartphone, a tablet terminal, or the like, the tactile sensation presentation apparatus presents a tactile sensation according to the displayed image to the user.

JP 2014-99210 A

  In the tactile sensation presentation apparatus, in order to efficiently transmit the vibration of the piezoelectric element to the glass panel, a high-hardness adhesive is used for bonding the piezoelectric element and the glass panel. In particular, a thermosetting resin excellent in mechanical strength, heat resistance and adhesiveness is used.

  When the piezoelectric element is bonded to the glass panel with the thermosetting resin, the glass panel is heated and the thermosetting resin is cured. Thereafter, the glass panel shrinks during cooling, while the piezoelectric element extends during cooling. For this reason, a warp occurs in the tactile sensation presentation apparatus.

  An object of the present invention is to provide a method for manufacturing a tactile sensation presentation apparatus and a tactile sensation presentation apparatus that can suppress the occurrence of warping.

  In order to achieve the above object, a method for manufacturing a tactile sensation presentation device disclosed in the specification includes short-circuiting a first electrode and a second electrode of a piezoelectric element, and using a thermosetting resin to panel the piezoelectric element. The panel is heated, the panel is heated, the thermosetting resin is cured, and after the heating of the panel is completed, a short circuit between the first electrode and the second electrode is opened.

  According to the present invention, the occurrence of warpage can be suppressed.

FIG. 1A is an exploded perspective view of a system including a tactile sensation presentation apparatus according to the present embodiment. FIG. 1B is a side view in the A direction of the system of FIG. FIG. 2A is a diagram illustrating a conduction state between the electrodes 10 a and 10 b of the piezoelectric element 6. FIG. 2B is a diagram showing an open state between the electrodes 10a and 10b. FIG. 3A is a side view of the tactile sensation presentation device 4. FIG. 3B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 4A shows an end portion of the wiring 7 to which the FPC 12 is connected. FIG. 4B is an enlarged view of a region X in FIG. FIG. 4C is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 5A is a diagram showing a state where the electrodes 10a and 10b of the piezoelectric element 6 are connected by a conductive paint. FIG. 5B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 6A is a side view of the tactile sensation presentation device 4. FIG. 6B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 7A is a side view of the tactile sensation presentation device 4. FIG. 7B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 7A is a side view of the tactile sensation presentation device 4. FIG. 8B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 9A is a side view of the tactile sensation presentation device 4. FIG. 9B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 10A is a diagram showing the warp of the glass panel 5. FIG. 10B is a diagram showing the relationship between the member used for short-circuiting the electrodes 10a and 10b, the height of the warp, and the effect.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1A is an exploded perspective view of a system including a tactile sensation presentation apparatus according to the present embodiment. FIG. 1B is a side view in the A direction of the system of FIG.

  As shown in FIGS. 1A and 1B, the system 1 includes a touch panel 2, a base 3 (3 a, 3 b), and a tactile sensation presentation device 4. The tactile sensation presentation device 4 includes a glass panel 5, a pair of piezoelectric elements 6 provided at both left and right ends of the glass panel 5, and a wiring 7 made of silver paste or the like formed so as to be extended from the piezoelectric element 6 by screen printing. And. One end of each wiring 7 is connected to an unillustrated FPC (Flexible printed circuits), and the other end is connected to the piezoelectric element 6. When an AC voltage is applied from the FPC to the piezoelectric element 6, the piezoelectric element 6 vibrates in the ultrasonic band. A cover or a decorative film (not shown) is disposed on the piezoelectric element 6 and the wiring 7 so that the piezoelectric element 6 and the wiring 7 are hidden from the operator. The piezoelectric element 6 and the wiring 7 are arranged outside the touch panel 2 when viewed from above, and are arranged so as not to overlap the touch panel 2.

  For example, the piezoelectric element 6 has a width of 5 mm, a length of 40 mm, and a thickness of 0.5 mm. The width of the glass panel 5 is 50 mm, the length is 100 mm, and the thickness is 0.5 mm. The sizes of the piezoelectric element 6 and the glass panel 5 are not limited to these examples.

  The tactile sensation presentation device 4 is fixed on the base 3a. The piezoelectric element 6 faces the base 3b with a gap 8 therebetween. The touch panel 2 is an electrostatic touch panel and faces the glass panel 5 through the gap 8.

  The piezoelectric element 6 is fixed to the glass panel 5 with a thermosetting resin such as an epoxy resin. For example, the curing temperature of the thermosetting resin is 120 degrees and the curing time is 30 minutes. Since the thermosetting resin is excellent in mechanical strength, heat resistance, and adhesiveness, it has a characteristic that it is not easily affected by the heat generated by the piezoelectric element 6.

  The glass panel 5 has the property of extending during heating and contracting during cooling. On the other hand, the piezoelectric element 6 has a characteristic of contracting during heating and extending during cooling. Therefore, when the glass panel 5 to which the piezoelectric element 6 is attached is heated to cure the thermosetting resin, and the piezoelectric element 6 is bonded and then cooled, the glass panel 5 tends to shrink and the piezoelectric element 6 tends to expand. Therefore, a warp in the direction of arrow B occurs.

  In particular, the piezoelectric effect and pyroelectric effect of the piezoelectric element 6 (the characteristic that the polarization of the dielectric changes with temperature change) affects the occurrence of warpage. Normally, when the piezoelectric element 6 is heated, a voltage is generated between the electrodes of the piezoelectric element 6 due to the electric charge generated by the pyroelectric effect, and the piezoelectric element 6 is further deformed by the piezoelectric effect due to this voltage. As a result, the composite of the glass panel 5 and the piezoelectric element 6 is warped.

  For this reason, in the present embodiment, while the glass panel 5 is heated, the electrodes 10a and 10b of the piezoelectric element 6 are short-circuited as shown in FIG. The deformation of the piezoelectric element 6 due to the effect is reduced. On the other hand, in the processes other than heating, as shown in FIG. 2B, the electrodes 10a and 10b of the piezoelectric element 6 are electrically opened. For example, when the tactile sensation presentation device 4 is used, it is necessary to electrically cut a path that does not pass through the piezoelectric element 6 between the electrodes 10a and 10b. The electrodes 10a and 10b function as a first electrode and a second electrode, respectively. 2A is a diagram showing a conductive state between the electrodes 10a and 10b of the piezoelectric element 6 during the heating process of the glass panel 5, and FIG. 2B is a diagram showing the piezoelectric element 6 in a process other than heating. It is a figure which shows the open state of electrode 10a, 10b. Hereinafter, an example will be described in which the electrodes 10a and 10b are electrically connected when the glass panel 5 is heated, and the electrodes 10a and 10b are opened at other times.

  FIG. 3A is a side view of the tactile sensation presentation device 4. FIG. 3B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. 3A shows a state in which the tactile sensation presentation device 4 in FIG. 1 is turned over.

  In the initial state, the electrodes 10a and 10b of the piezoelectric element 6 are spaced apart and electrically insulated. First, the bonding wire 11 is attached to the electrodes 10a and 10b of the piezoelectric element 6 with gold (S1). Next, a thermosetting resin is applied on the glass panel 5, and the piezoelectric element 6 is pasted on the glass panel 5 (S2). The glass panel 5 is heated to cure the thermosetting resin (S3). The state of the tactile sensation presentation device 4 at S3 is shown in FIG. Thereafter, the bonding wire 11 is cut by physical means such as a cutter, a laser, or an ultrasonic wave (S4).

  FIG. 4A shows an end portion of the wiring 7 to which the FPC 12 is connected. FIG. 4B is an enlarged view of a region X in FIG. FIG. 4C is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4.

  As shown in FIGS. 4A and 4B, the end portion of the wiring 7 to which the FPC 12 is connected has the most detail 13 that is melted by flowing current. The width of the finest detail 13 is, for example, 0.05 mm. While the glass panel 5 is heated, the finest detail 13 is not cut, but after the piezoelectric element 6 is fixed on the glass panel 5 with a thermosetting resin, a current (for example, 1 A) at a level that melts the finest detail 13 from the FPC 12 is applied. The finest part 13 is melted by flowing.

  As shown in FIG. 4C, first, the wiring 7 having the most detail 13 is formed on the glass panel 5 (S11). Next, a thermosetting resin is applied on the glass panel 5, the piezoelectric element 6 is attached on the glass panel 5 (S12), and the glass panel 5 is heated to cure the thermosetting resin (S13). Next, the wiring 7 is soldered to the electrodes 10a and 10b of the piezoelectric element 6 and connected (S14). Finally, the finest portion 13 is blown out by electrical means for supplying a current (for example, 1 A) at a level that blows out the finest portion 13 from the FPC 12 (S15).

  FIG. 5A is a diagram showing a state in which the electrodes 10a and 10b of the piezoelectric element 6 are connected by a conductor 7a formed of a conductive paint. FIG. 5B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4.

  As shown in FIG. 5A, a conductor 7a that connects the electrodes 10a and 10b of the piezoelectric element 6 is formed by a conductive paint. In addition, the conductor 7a may have the most detail 13 melt | dissolved by sending an electric current etc. similarly to FIG.4 (B), and it is preferable that the width of the most detail 13 is 0.05 mm in this case. . While the glass panel 5 is heated, the conductor 7a or the finest portion 13 is not cut, but after the piezoelectric element 6 is fixed on the glass panel 5 with a thermosetting resin, the electric conductor 7a or the finest portion 13 is melted. The conductor 7a or the finest portion 13 is melted or cut by an electric current (for example, 1A) or a laser.

  As shown in FIG. 5B, first, a conductor 7a that connects the electrodes 10a and 10b is formed (S11a). Next, a thermosetting resin is applied on the glass panel 5, and the piezoelectric element 6 is pasted on the glass panel 5 (S12a). The glass panel 5 is heated to cure the thermosetting resin (S13a). Finally, a current (for example, 1A) of a level that melts the conductor 7a formed between the electrode 10a and the electrode 10b is passed (S15a), or is cut by physical means such as laser irradiation, or chemical etching, etc. It may be removed by chemical means. Note that the cutting method is not limited to these means.

  FIG. 6A is a side view of the tactile sensation presentation device 4. FIG. 6B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. FIG. 6A shows a state in which the tactile sensation presentation device 4 of FIG. 1 is turned upside down.

  In the initial state, the electrodes 10a and 10b of the piezoelectric element 6 are spaced apart and electrically insulated. First, the electrodes 10a and 10b are connected with a conductive tape 30 such as a copper foil tape (S21). Next, a thermosetting resin is applied on the glass panel 5, and the piezoelectric element 6 is pasted on the glass panel 5 (S22). The glass panel 5 is heated to cure the thermosetting resin (S23). Finally, the conductive tape 30 is peeled off (S24).

  FIG. 7A is a side view of the tactile sensation presentation device 4. FIG. 7B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. 7A shows a state in which the tactile sensation presentation device 4 of FIG. 1 is turned over.

  As shown in FIG. 7A, a copper alloy bimetal 15 is fixed to one electrode 10a of the piezoelectric element 6 by soldering. For example, the bimetal 15 has a width of 3 mm, a length of 5 mm, and a thickness of 2 mm. The bimetal 15 includes a first layer 15a that is deformed at, for example, 80 degrees or more and has a large coefficient of thermal expansion, and a second layer 15b that has a smaller coefficient of thermal expansion than the first layer 15a. At normal temperature, the state where one end of the bimetal 15 is fixed to the electrode 10a is maintained as shown in the upper diagram of FIG. In the heating step, since the first layer 15a expands more than the second layer 15b, the bimetal 15 is bent toward the second layer 15b and contacts the electrode 10b as shown in the lower diagram of FIG. Thereby, the electrodes 10a and 10b are short-circuited, and the electric charge generated in the piezoelectric element 6 is released, thereby reducing the deformation of the piezoelectric element 6.

  In FIG. 7B, first, the bimetal 15 is fixed to the electrode 10a with solder (S31). Next, a thermosetting resin is applied on the glass panel 5, and the piezoelectric element 6 is pasted on the glass panel 5 (S32). At this time, the bimetal 15 is in the state shown in the upper diagram of FIG. Next, the glass panel 5 is heated to cure the thermosetting resin (S33). At this time, the bimetal 15 is in the state shown in the lower diagram of FIG. When the bimetal 15 is cooled by natural heat dissipation or a cooling device after the heating is completed, the state returns to the state shown in the upper diagram of FIG.

  FIG. 8A is a side view of the tactile sensation presentation device 4. FIG. 8B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. 8A shows a state in which the tactile sensation presentation device 4 in FIG. 1 is turned over.

  As shown in FIG. 8A, the semiconductor 16 is bonded on the electrodes 10a and 10b with a silicon-based adhesive so as to connect the electrodes 10a and 10b of the piezoelectric element 6. The semiconductor 16 is an oxide semiconductor made of, for example, silicon, nickel, manganese, cobalt, or iron. Since the semiconductor 16 has a characteristic that the resistance value decreases as the temperature rises, the semiconductor 16 is in an insulating state at room temperature, but is in a low resistance state in the heating process. Therefore, the semiconductor 16 short-circuits the electrodes 10a and 10b in the heating process, releases charges generated in the piezoelectric element 6 to reduce deformation of the piezoelectric element 6, and insulates the electrodes 10a and 10b at room temperature.

  Instead of the semiconductor 16, an NTC (Negative Temperature Coefficient) thermistor having a characteristic that the resistance value decreases as the temperature rises may be bonded onto the electrodes 10a and 10b.

  In FIG. 8B, first, the semiconductor 16 is bonded onto the electrodes 10a and 10b with a silicon-based adhesive (S41). Next, a thermosetting resin is applied on the glass panel 5, and the piezoelectric element 6 is pasted on the glass panel 5 (S42). At this time, the semiconductor 16 is in an insulated state. Next, the glass panel 5 is heated to cure the thermosetting resin (S43). At this time, the semiconductor 16 is in a low resistance state. When the semiconductor 16 is naturally radiated or cooled by a cooling device after the heating process is completed, the semiconductor 16 returns to an insulating state.

  FIG. 9A is a side view of the tactile sensation presentation device 4. FIG. 9B is a flowchart showing a method for manufacturing the tactile sensation presentation apparatus 4. 9A shows a state in which the tactile sensation presentation device 4 of FIG. 1 is turned over.

  As shown in FIG. 9A, the optical semiconductor 17 connects the electrodes 10a, 10b with a silicon-based adhesive so as to connect the electrodes 10a, 10b of the piezoelectric element 6, that is, to straddle the electrodes 10a, 10b. 10b is bonded. The optical semiconductor 17 is, for example, a phototransistor, a photodiode, CdS, or the like. Since the optical semiconductor 17 has a characteristic that the resistance value decreases when it is exposed to light, the tactile sensation presentation device 4 is manufactured in a place where external light is blocked. In the heating process, the light source 20 is turned on in a state where external light is blocked, and the light from the light source 20 is irradiated onto the optical semiconductor 17. Thereby, the optical semiconductor 17 becomes a low resistance state in the heating process.

  When maintaining the optical semiconductor 17 in a high resistance state or an insulating state, the optical semiconductor 17 is covered with a protective cover (not shown). For example, in a state where the tactile sensation presentation device 4 is attached to the base 3, a cover or a decorative film (not shown) is arranged on the piezoelectric element 6 to block external light. Thereby, the optical semiconductor 17 becomes a high resistance state in processes other than heating. If the optical semiconductor 17 does not need to be maintained in a high resistance state or an insulating state, it is not necessary to cover the optical semiconductor 17 with a protective cover or the like.

  In FIG. 9B, the optical semiconductor 17 is bonded onto the electrodes 10a and 10b with a silicon-based adhesive so as to connect the electrodes 10a and 10b of the piezoelectric element 6 (S51). Next, a thermosetting resin is applied on the glass panel 5, and the piezoelectric element 6 is pasted on the glass panel 5 (S52). Next, the glass panel 5 is heated and the thermosetting resin is cured (S54) while irradiating the light from the light source 20 to the optical semiconductor 17 with the external light blocked (S53). In this manner, the optical semiconductor 17 is brought into a low resistance state, the electrodes 10a and 10b of the piezoelectric element 6 are short-circuited in the heating process, the electric charge generated in the piezoelectric element 6 is released, and deformation of the piezoelectric element 6 is reduced.

  FIG. 10A is a diagram showing the warp of the glass panel 5. FIG. 10B is a diagram showing the relationship between the member used for short-circuiting the electrodes 10a and 10b, the height of the warp, and the effect. In the column of the effect in FIG. 10B, “◯” is described when the height of the warp is less than 20 μm, and “X” is described when the height of the warp is 20 μm or more. .

  The inventor actually manufactured the tactile sensation presentation device 4 using the bonding wire 11, the wiring 7 having the finest 13, the conductor 7 a, the conductive tape 30, the bimetal 15, the semiconductor 16, and the optical semiconductor 17. And the height of the warp was measured.

  When the bonding wire 11 was used, the warp height was 15 μm. When the wiring 7 having the most detail 13 was used, the height of the warp was 17 μm. When the conductor 7a was used, the height of the warp was 17 μm. When the conductive tape 30 was used, the warp height was 17 μm. When the bimetal 15 was used, the height of the warp was 18 μm. When the semiconductor 16 was used, the height of the warp was 17 μm. When the optical semiconductor 17 was used, the height of the warp was 17 μm. When the electrodes 10a and 10b of the piezoelectric element 6 were not short-circuited, the height of the warp was 100 μm.

  As described above, according to the present embodiment, the electrodes 10a and 10b of the piezoelectric element 6 are short-circuited, and after the thermosetting resin is cured, the short-circuiting of the electrodes 10a and 10b is opened. Therefore, the electric charge generated in the piezoelectric element 6 in the heating process can be released, the deformation of the piezoelectric element 6 can be reduced, and the warpage of the piezoelectric element 6 and the glass panel 5 can be suppressed. Moreover, since the short circuit of the electrodes 10a and 10b is opened after heating, the use of the tactile sensation presentation device 4 is not affected.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications within a range not departing from the gist thereof.

2 Touch Panel 3 Base 4 Tactile Presentation Device 5 Glass Panel 6 Piezoelectric Element 7 Wiring 10a, 10b Electrode 11 Bonding Wire 13 Finest 15 Bimetal 16 Semiconductor 17 Optical Semiconductor

Claims (6)

Short-circuiting the first electrode and the second electrode of the piezoelectric element;
Paste the piezoelectric element on the panel using a thermosetting resin,
Heating the panel, curing the thermosetting resin,
A method of manufacturing a tactile sensation presentation apparatus, comprising: opening a short circuit between the first electrode and the second electrode after heating of the panel is completed. By connecting a conductor to the first electrode and the second electrode, the first electrode and the second electrode are short-circuited,
The method of manufacturing a tactile sensation presentation apparatus according to claim 1, wherein a short circuit between the first electrode and the second electrode is opened by cutting the conductor. Forming a wiring for short-circuiting the first electrode and the second electrode;
The method for manufacturing a tactile sensation presentation apparatus according to claim 1, wherein a short circuit between the first electrode and the second output electrode is opened by flowing a current through the wiring and fusing. One end of the bimetal is fixed to the first electrode, and the other end of the bimetal is brought into contact with the second electrode due to the deformation of the bimetal in the heating process of the panel. The two electrodes are short-circuited,
The short circuit between the first electrode and the second electrode is opened by cooling the bimetal after heating the panel and returning the deformation of the bimetal to the original. Method for producing a tactile sensation presentation apparatus. The method for manufacturing a tactile sensation presentation device according to claim 1, wherein the thermosetting resin is cured in a state where the first electrode and the second electrode are connected by a semiconductor.   A tactile sensation presentation apparatus manufactured by the manufacturing method according to claim 1.

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