JP2018167190A - Viscous fluid applicator - Google Patents

Abstract

To make it possible to appropriately deal with adhesion of a viscous fluid to a discharge tool of a discharge head.SOLUTION: A viscous fluid applicator determines a state of adhesion of a viscous fluid to a discharge tool based on an image which is picked up by an imaging device after the discharge tool has discharged the viscous fluid, and when determining that the viscous fluid of a first prescribed discharge quantity or more is adhered to the discharge tool, so controls a mobile device that a discharge head is moved at a speed lower than a prescribed speed when performing application treatment. Thus, in the case that the viscous fluid of the first prescribed quantity or more is adhered to the discharge tool, it can be suppressed that the viscous fluid is dropped onto an application object due to movement of the discharge head at a same prescribed speed as that when performing the application treatment.SELECTED DRAWING: Figure 2

Description

  The present specification discloses a viscous fluid application device.

  2. Description of the Related Art Conventionally, a viscous fluid application device that discharges a viscous fluid such as an adhesive from a discharge tool and applies it to an application object has been proposed that includes an imaging device that can image the discharge tool from the side (for example, a patent). Reference 1). This viscous fluid application device determines the presence or absence of dripping from the ejection tool based on an image obtained by imaging the ejection tool with an imaging device.

WO2015 / 068305A1 publication

  However, in the above-described viscous fluid application device, there is no description about the processing when it is determined that there is dripping from the discharge tool. If the viscous fluid adhering to the discharge tool falls on the application target due to dripping, the application target may become difficult or unusable.

  The main object of the present disclosure is to appropriately cope with the adhesion of viscous fluid to the ejection tool of the ejection head.

  The present disclosure has taken the following measures in order to achieve the main object described above.

  A viscous fluid application apparatus according to the present disclosure includes an ejection head having an ejection tool that ejects viscous fluid, a moving device that moves the ejection head in a horizontal direction, and an imaging that can image the ejection tool of the ejection head from a side. And a coating process for controlling the ejection head and the moving device so as to move the ejection head at a predetermined speed to eject a viscous fluid from the ejection tool and apply the fluid onto a coating object, Determines the state of adhesion of the viscous fluid to the ejection tool based on the image captured by the imaging device after the viscous fluid is ejected, and a viscous fluid of a first predetermined amount or more is adhered to the ejection tool. A control device that controls the moving device so that the ejection head moves at a speed lower than the predetermined speed.

  The viscous fluid application device of the present disclosure determines a state of adhesion of the viscous fluid to the discharge tool based on an image captured by the imaging device after the discharge tool discharges the viscous fluid, and the discharge tool has a first predetermined amount or more. If it is determined that the viscous fluid is attached, the moving device is controlled so that the ejection head moves at a speed lower than a predetermined speed when the coating process is executed. As a result, when the viscous fluid of the first predetermined amount or more adheres to the discharge tool, the viscous fluid is applied to the application object due to the movement of the discharge head at the same predetermined speed as when the application process is executed. Can be prevented from falling. Therefore, it is possible to appropriately cope with the adhesion of the viscous fluid to the discharge tool of the discharge head.

FIG. 2 is an explanatory diagram showing an overall configuration of a component mounting apparatus 10. FIG. 3 is a block diagram relating to control of the component mounting apparatus 10. The block diagram of the head unit 20 to which the glue head 23 was attached. The flowchart which shows an example of an application | coating process routine. FIG. 6 is an explanatory diagram showing an image in which a glue nozzle is imaged by a side camera. The flowchart which shows an example of the process at the time of glue adhesion. FIG. 5 is an explanatory diagram showing a state in which a movement path of the glue head 23 on the substrate S is selected. FIG. 4 is an explanatory diagram showing a movement path of a glue head 23 outside the substrate S.

  Next, an embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is an explanatory diagram showing the overall configuration of the component mounting apparatus 10. FIG. 2 is a block diagram relating to control of the component mounting apparatus 10. FIG. 3 is a configuration diagram of the head unit 20 to which the glue head 23 is attached. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the vertical direction is the Z-axis direction.

  As shown in FIGS. 1 and 2, the component mounting apparatus 10 includes a component supply device 12, a board transfer device 14, a head unit 20, a moving device 30, a glue cleaning device 40, an operation panel 45, and a control. Device 50. The component supply device 12 supplies components from a reel or the like that stores components to be mounted on the substrate S. Moreover, the board | substrate conveyance apparatus 14 has a pair of conveyor belt provided in the front-back direction of FIG. 1 at intervals, and was spanned in the left-right direction. The substrate transport device 14 transports the substrate S from the left to the right in FIG. 1 by the conveyor belt, and holds the substrate S at a predetermined position. The operation panel 45 includes a display unit 46 that displays various types of information to the worker, and an operation unit 47 that allows the worker to perform various input operations.

  The head unit 20 has a head holder 20a (see FIG. 3) that can be moved up and down by a lifting mechanism (not shown) and rotated by a rotating mechanism, and one head selected from a plurality of types of heads is used as the head holder 20a. It can be automatically replaced. Examples of the plural types of heads include a rotary head 21, a one-nozzle head 22, and a glue head 23. The rotary head 21 is configured such that a plurality of suction nozzles for sucking parts are arranged so as to be movable in the circumferential direction. The one-nozzle head 22 is one in which one suction nozzle for sucking parts is arranged. The glue head 23 is provided with one glue nozzle 24 which is a discharge nozzle for discharging a viscous fluid such as a glue (adhesive) applied to the substrate S. Note that examples of the viscous fluid include cream solder, conductive paste, glue (adhesive), and the like. The head unit 20 is configured to apply a negative pressure to the suction nozzle when the component is sucked to the tip of the suction nozzle, and to apply a positive pressure to the suction nozzle when the component sucked to the tip of the suction nozzle is released. The head unit 20 is configured to apply a negative pressure to the glue nozzle 24 when the glue is not discharged, and to apply a positive pressure to the glue nozzle 24 when the glue is discharged. As described above, the head unit 20 is configured to be able to apply the adhesive to the substrate S and mount components on the substrate S by exchanging the head. Note that these plural types of heads are accommodated in the head accommodating portion 16 when not mounted on the head unit 20.

  Further, the head unit 20 is a side camera that can image the suction nozzle of the rotary head 21, the suction nozzle of the one-nozzle head 22, and the glue nozzle 24 of the glue head 23 from the side when the head holding body 20a is in the upper position. 25. As shown in FIG. 3, the side camera 25 images the glue nozzle 24 from the side, for example, and outputs the captured image to the control device 50.

  As shown in FIG. 1, the moving device 30 includes a Y-axis guide rail 33 provided along the Y-axis direction, a Y-axis slider 34 movable along the Y-axis guide rail 33, and the Y-axis slider 34. An X-axis guide rail 31 provided on the side surface along the X-axis direction, and an X-axis slider 32 that is movable along the X-axis guide rail 31 and to which the head unit 20 is attached. The X-axis slider 32 is detected by the X-axis position sensor 35 (see FIG. 2), and the Y-axis slider 34 is detected by the Y-axis position sensor 36 (see FIG. 2). Is detected. The control device 50 can move the head unit 20 to an arbitrary position on the XY plane by driving and controlling the moving device 30.

  The glue cleaning device 40 is a device that can clean the tip of the glue nozzle 24 of the glue head 23. The glue cleaning device 40 includes a supply roller 42 that supplies an unused cleaning sheet 41 and a collection roller 43 that winds up the used cleaning sheet 41. The cleaning sheet 41 is, for example, paper or cloth, and spans from the supply roller 42 to the collection roller 43. The glue cleaning device 40 cleans the tip of the glue nozzle 24 by rotating the collection roller 43 by driving a drive motor (not shown) while the tip of the glue nozzle 24 of the glue head 23 is pressed against the cleaning sheet 41. Is possible. The glue cleaning device 40 is also used when the glue is ejected from the glue nozzle 24 as a test shot for confirming the ejection state from the glue nozzle 24.

  In addition to these components, the component mounting apparatus 10 includes a parts camera 17 for imaging from the lower side the components sucked by the suction nozzle of the rotary head 21 and the suction nozzle of the one-nozzle head 22. The component mounting apparatus 10 also includes a nozzle stocker that stocks a plurality of types of suction nozzles in order to replace the suction nozzles of the rotary head 21 and the suction nozzles of the one nozzle head 22 in accordance with the size and shape of the components to be mounted. 18 etc. are also provided.

  As shown in FIG. 2, the control device 50 is configured as a microprocessor centered on a CPU 51, and includes a ROM 52 that stores a processing program, an HDD 53 that stores various data, a RAM 54 that is used as a work area, and an external device and an electrical device. An input / output interface 55 for exchanging signals is provided. These are connected via a bus 56. The control device 50 includes detection signals from various sensors (not shown) included in the component supply device 12, the substrate transfer device 14, the head unit 20, the glue cleaning device 40, and the like, detection signals from the X-axis position sensor 35 of the moving device 30, A detection signal from the Y-axis position sensor 36, a captured image from the parts camera 17 and the side camera 25, an input operation signal from the operation unit 47 of the operation panel 45, and the like are input via the input / output interface 55. Further, from the control device 50, a drive signal to the component supply device 12, a drive signal to the substrate transfer device 14, a drive signal to the head unit 20, a drive signal to the moving device 30, and a drive signal to the glue cleaning device 40. An image display signal to the display unit 46 of the operation panel 45 is output via the input / output interface 55.

  The following is the operation of the component mounting apparatus 10 of the present embodiment configured as described above, specifically, the process of applying glue (adhesive) to the substrate S performed with the glue head 23 attached to the head unit 20. Will be described. FIG. 4 is a flowchart showing an example of a coating process routine executed by the CPU 51 of the control device 50. This routine is stored in the HDD 53 of the control device 50, and is executed in a state where preparation for the coating process is completed, for example, the substrate S to be coated is transported and held by the substrate transport device 14 to a predetermined position. FIG. 5 is an explanatory diagram showing an image in which the glue nozzle 24 is captured by the side camera 25.

  When this routine is started, the CPU 51 of the control device 50 first controls the moving device 30 to move the glue head 23 onto the glue cleaning device 40 (S100) and cleans the glue nozzle 24 (S110). The CPU 51 cleans the glue nozzle 24 by controlling the head unit 20 and the glue cleaning device 40 so as to wind up the cleaning sheet 41 in a state where the tip of the glue nozzle 24 is pressed against the cleaning sheet 41 of the glue cleaning device 40. I do. Subsequently, the CPU 51 captures an image before ejection by the side camera 25 before the glue nozzle 24 ejects glue (S120). Since the CPU 51 causes the side camera 25 to capture an image in S120 after cleaning the glue nozzle 24 in S110, the pre-discharge image (post-cleaning image) is captured in a state where no glue is attached to the glue nozzle 24. Can do. Further, the CPU 51 sets a reference height Hre of the glue nozzle 24 in the image from the pre-discharge image (S130). FIG. 5A is an example of a pre-ejection image. The CPU 51 performs a detection process for detecting the glue nozzle 24 from the pre-ejection image. As shown in FIG. 5A, since the glue is usually hardly attached to the discharge port at the tip of the glue nozzle 24 immediately after cleaning, the CPU 51 detects the tip (lower end) of the glue nozzle 24 detected by the detection process. Is set to the reference height Hre.

  Next, the CPU 51 moves the glue head 23 horizontally to the application position on the substrate S at the moving speed Va and lowers it to apply a positive pressure to the glue nozzle 24 to eject the glue and apply it to the substrate S. The apparatus 30 and the head unit 20 are controlled (S140). When the glue is applied to the substrate S, the CPU 51 raises the glue head 23 and sucks the glue by applying a negative pressure to the glue nozzle 24 (S150), and displays the image after ejection after the glue nozzle 24 ejects the glue. An image is taken by the camera 25 (S160). Then, the CPU 51 detects (measures) the glue adhesion height Hg, which is the glue adhesion amount with respect to the reference height Hre, from the post-discharge image (S170). FIG. 5B is an example of an image after ejection in which glue adheres to the glue nozzle 24. The CPU 51 performs the glue detection process on the image area below the reference height Hre acquired in the process of S130, and if a glue is detected, specifies the tip (lower end) position thereof. The position specifying process is performed. Then, as shown in FIG. 5B, the CPU 51 detects the distance from the reference height Hre to the specified tip position as the glue attachment height Hg. Note that the image area where the glue detection process is performed and the glue attachment height Hg may be determined in consideration of an error in the stop position of the glue nozzle 24 in the Z-axis direction. In the present embodiment, since the glue adhesion height Hg is detected from the post-discharge image using the reference height Hre set from the pre-discharge image, the mounting accuracy and backlash of the glue head 23, the glue nozzle 24, the side camera 25, etc. Therefore, even if there is an individual difference in the position of the tip of the glue nozzle 24, the glue adhesion height Hg can be detected with high accuracy. Note that the CPU 51 is not limited to detecting the glue adhesion height Hg, but may detect the glue adhesion amount by detecting the area of the glue glue and calculating the area of the area. Good.

  When the glue adhesion height Hg is detected in this way, the CPU 51 determines whether or not the measured glue adhesion height Hg is less than the adhesion determination threshold value H1 (S180). Here, the adhesion determination threshold value H1 (first predetermined amount) is determined in advance by an experiment or the like as a threshold value for determining that the glue is attached to the tip of the glue nozzle 24 to the extent that it may fall. Height. If the CPU 51 determines that the glue adhesion height Hg is less than the adhesion determination threshold value H1 in S180, the CPU 51 determines whether or not the glue application to the substrate S is completed (S190), and if it determines that the glue application is not completed, the process proceeds to S140. When the process returns and the process is determined to be completed, the coating process routine is terminated. On the other hand, if the CPU 51 determines in step S180 that the glue adhesion height Hg is not less than the adhesion determination threshold value H1, but is greater than or equal to the adhesion determination threshold value H1, the CPU 51 determines that the glue has adhered to the glue nozzle 24 and performs the glue adhesion process. Is executed (S200), the process returns to S120 for processing. The following is a description of the glue attachment process in S200. FIG. 6 is a flowchart illustrating an example of the glue attachment process.

  In the glue adhering process of FIG. 6, the CPU 51 of the control device 50 first has the current glue adhering height Hg measured in S170 of the coating process routine being less than the drop determination threshold H2, which is larger than the adhering determination threshold H1. It is determined whether or not there is (S300). Here, the drop determination threshold H2 (second predetermined amount) indicates that the amount of glue attached to the tip of the glue nozzle 24 is an amount that is highly likely to fall due to vibration caused by movement of the glue head 23. The threshold value for determination is a height determined in advance by experiments or the like. If the CPU 51 determines that the glue adhesion height Hg is less than the drop determination threshold value H2 in S300, the glue attached to the glue nozzle 24 may be dropped, so that vibration due to movement of the glue head 23 must be suppressed. Judge that there is. In that case, the CPU 51 acquires the current position in the XY direction of the glue head 23 based on the detection position of the X-axis position sensor 35 and the detection position of the Y-axis position sensor 36 of the moving device 30 (S310). Next, the CPU 51 selects the shortest path for moving the glue head 23 from the current position to the outside of the substrate S (S320).

  FIG. 7 is an explanatory diagram showing a state in which the movement path of the glue head 23 on the substrate S is selected. Based on the current position of the glue head 23 as shown, the predetermined position where the substrate S is held by the substrate transport device 14, and the size of the substrate S, the CPU 51 passes the paths L1 to L4 in the front, rear, left and right directions. The distance is calculated. As shown in the figure, the path L1 is a path that moves the glue head 23 to the right from the current position to reach the outside of the substrate S. The path L2 is a path for moving the glue head 23 forward from the current position to reach the outside of the substrate S. The path L3 is a path for moving the glue head 23 to the left from the current position to reach the outside of the substrate S. The path L4 is a path for moving the glue head 23 backward from the current position to reach the outside of the substrate S. In S320, the CPU 51 selects the route having the smallest distance among the routes L1 to L4 as the shortest route. The CPU 51 selects the path L3 in the example of FIG. If there is no difference between the paths L1 to L4, the CPU 51 may select the path L1 that moves the glue head 23 to the right from the current position to reach the outside of the substrate S.

  When the movement path is selected, the CPU 51 controls the movement device 30 so that the glue head 23 moves out of the substrate S through the shortest path at a movement speed Vb slower than the movement speed Va during the coating process (S330). It waits for the glue head 23 to reach the outside of the substrate S (S340). In the present embodiment, the CPU 51 controls the moving device 30 so that the maximum speed while the glue head 23 is moving becomes the moving speed Vb that is slower than the moving speed Va. Further, the CPU 51 may reduce the acceleration when accelerating the glue head 23 or reduce the deceleration when decelerating the glue head 23 in accordance with the decrease in the maximum speed. As described above, since the CPU 51 moves the glue head 23 at the slow moving speed Vb, the glue attached to the glue nozzle 24 can be prevented from dropping on the substrate S due to vibration during movement or the like. Further, since the CPU 51 moves the glue head 23 along the selected shortest path, the glue attached to the glue nozzle 24 can be further suppressed from dropping on the substrate S.

  If the CPU 51 determines that the glue head 23 has reached the outside of the substrate S in S340, the image of the glue nozzle 24 is taken again by the side camera 25 (S350), and the glue attachment height Hg is detected again from the image (S350). S360). Next, the CPU 51 determines again whether or not the re-detected glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1 (S370). Here, the CPU 51 performs the glue adhesion process when it is determined in S180 of the application processing routine that the glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1. Therefore, unless the glue adhering to the glue nozzle 24 falls, the CPU 51 determines in S370 that the glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1. In other words, if the CPU 51 determines in S370 that the glue attachment height Hg is less than the adhesion determination threshold value H1, it is determined that the glue attached to the glue nozzle 24 has dropped during the movement of the glue head 23. Can do. Further, since the CPU 51 performs the processes of S350 to S370 when the glue head 23 reaches the outside of the substrate S, if the glue is dropped, it can be determined that it has dropped on the substrate S. If the CPU 51 determines that the glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1 in S370, the CPU 51 moves the glue head 23 to the glue cleaning device 40 at a movement speed Vb that is slower than the movement speed Va (S380). The glue nozzle 24 is cleaned (S390), and the glue adhering process is terminated.

  FIG. 8 is an explanatory diagram showing a movement path of the glue head 23 outside the substrate S. As shown in the drawing, the movement path from the position reaching the outside of the substrate S by the path L3 to the glue cleaning device 40 is illustrated. As shown in the figure, the CPU 51 moves the glue head 23 to the glue cleaning device 40 through a path indicated by a solid line or a dotted line in FIG. A path indicated by a solid line is a path that passes between the conveyor of the substrate transfer device 14 and the parts camera 17 and the nozzle stocker 18 in the front-rear direction. A path indicated by a dotted line is a path that passes above the parts camera 17 and the nozzle stocker 18 and the component supply device 12 in the front-rear direction. As described above, in the present embodiment, the glue head 23 is moved to the glue cleaning device 40 through the path avoiding the parts camera 17, the nozzle stocker 18, and the parts supply device 12. It is possible to prevent the glue from falling on the stocker 18 and the component supply device 12.

  On the other hand, if the CPU 51 determines that the glue adhesion height Hg is not equal to or greater than the adhesion determination threshold value H1 in S370, the CPU 51 determines that the glue has dropped on the substrate S and notifies a glue drop error for notifying the glue drop ( S400). For example, the CPU 51 notifies the glue drop error by displaying an error message indicating that the glue has dropped on the substrate S on the display unit 46 of the operation panel 45. Then, the CPU 51 waits for an error return operation by the operator (S410). Note that the error recovery operation can be performed by the operator operating the operation unit 47 of the operation panel 45. By notifying the glue fall error, the operator recognizes that the glue has fallen on the substrate S, and therefore can cope with the glue fall. For example, if the glue falls to a place where there is no problem in use, the worker can take measures such as removing the dropped glue and cleaning the glue nozzle 24. In addition, if the glue falls to a place where a problem occurs in use, the operator can take measures such as discarding the substrate S and cleaning the glue nozzle 24. If the CPU 51 determines in S410 that an error return operation has been performed, the glue attachment process is terminated.

  If the CPU 51 determines in step S300 that the glue attachment height Hg is equal to or greater than the drop determination threshold H2, the CPU 51 determines that there is a high possibility that the glue will drop, and makes the glue head 23 stand by on the spot without moving it ( S420). Thus, since the CPU 51 does not move the glue head 23, the glue can be prevented from dropping on the substrate S due to vibration accompanying the movement. Further, the CPU 51 notifies an error of excessive glue attachment for notifying that there is a high possibility of dropping due to much adhesion of glue (S430), and waits for an operator to arrive (S440). For example, the CPU 51 displays an error message indicating that there is a high possibility that the glue will fall on the substrate S on the display unit 46 of the operation panel 45, thereby notifying the excessive glue adhesion error. Further, the CPU 51 determines the arrival of the worker based on, for example, the arrival of the operator operating the operation unit 47 of the operation panel 45.

  When the CPU 51 determines that the worker has arrived in S440, the image of the glue nozzle 24 is again picked up by the side camera 25 (S450), the image picked up again in S450, the post-discharge image picked up in S160 of the coating processing routine, and Are arranged and displayed on the display unit 46 of the operation panel 45 (S460). Although illustration of this display is omitted, the operator can grasp the adhesion state of the glue to the glue nozzle 24 from the post-discharge image. Further, the operator can recognize whether or not the glue has already dropped on the substrate S from the post-discharge image and the image taken again when the worker arrives (image upon arrival). For this reason, when the operator recognizes that the glue has fallen on the substrate S, the worker can take the same measures as when the glue fall error is notified in S400. In addition, when the operator recognizes that the glue has not dropped on the substrate S, the worker may take measures such as removing the glue attached to the glue nozzle 24 and cleaning the glue nozzle 24. it can. If the CPU 51 determines that an error return operation has been performed by the operator (S410), the glue attachment process is terminated. In addition, it is not restricted to what makes an operator judge the presence or absence of the fall of a glue by displaying an image by S460, It is good also as what judges the presence or absence of the fall of a glue. In that case, the CPU 51 may determine whether or not the glue has dropped by performing the same processing as in S370 based on the image captured again in S450. Or CPU51 may determine the presence or absence of the fall of a glue based on the comparison with the image imaged again by S450, and the after-discharge image imaged by S160 of an application | coating process routine.

  Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the viscous fluid applying apparatus of the present disclosure will be clarified. The glue nozzle 24 of the present embodiment corresponds to the ejection tool of the present disclosure, the glue head 23 corresponds to the ejection head, the moving device 30 corresponds to the moving device, the side camera 25 corresponds to the imaging device, and the control device 50. Corresponds to a control device, and the component mounting device 10 corresponds to a viscous fluid application device. Further, the glue cleaning device 40 corresponds to a removing device. The display unit 46 of the operation panel 45 corresponds to an error notification device.

  In the component mounting apparatus 10 according to the embodiment described above, the adhesion determination threshold value H <b> 1 (first) is applied to the glue nozzle 24 based on the post-ejection image captured by the side camera 25 after the glue nozzle 24 ejects the viscous fluid (glue). If it is determined that a viscous fluid of a predetermined amount or more is attached, the moving device 30 moves the glue head 23 at a moving speed Vb that is lower than the moving speed Va (predetermined speed) when executing the coating process. To control. Thereby, it is possible to suppress the viscous fluid adhering to the glue nozzle 24 from falling on the substrate S.

  Further, the component mounting apparatus 10 determines the adhesion state of the viscous fluid based on the post-ejection image with reference to the pre-ejection image before the glue nozzle 24 ejects the viscous fluid. Even if a positional deviation or the like occurs due to the above, it is possible to appropriately determine the adhesion state of the viscous fluid without erroneous detection.

  When the component mounting apparatus 10 determines that a viscous fluid that is greater than or equal to the adhesion determination threshold value H1 (first predetermined amount) and less than the drop determination threshold value H2 (second predetermined amount) is adhered to the glue nozzle 24, the glue head 23. Is moved to the glue cleaning device 40 at the moving speed Vb. For this reason, it is possible to prevent the viscous fluid adhering to the glue nozzle 24 from dropping onto the substrate S while the glue head 23 is moved to the glue cleaning device 40.

  Further, since the component mounting apparatus 10 moves the glue head 23 by selecting the path having the shortest moving distance from among a plurality of paths in which the glue head 23 can move to a position off the substrate S, it adheres to the glue nozzle 24. It is possible to further suppress the viscous fluid that has been dropped on the substrate S.

  Further, when the glue head 23 moved at the moving speed Vb reaches a position where it is removed from the substrate S, the component mounting apparatus 10 again determines the state of viscous fluid adhesion based on the image taken again by the side camera 25. Since the determination is made, it is possible to detect at an early stage that the viscous fluid has fallen on the substrate S and to take appropriate measures.

  If the component mounting apparatus 10 determines that the viscous fluid of the drop determination threshold value H2 (second predetermined amount) or more is attached to the glue nozzle 24, the component mounting apparatus 10 notifies the error without moving the glue head 23. For this reason, when the possibility of the viscous fluid dropping is high, it is possible to suppress the viscous fluid from falling on the substrate S due to vibration accompanying the movement of the glue head 23.

  In addition, this indication is not limited to the embodiment mentioned above at all, and as long as it belongs to the technical scope of this indication, it cannot be overemphasized that it can implement with a various aspect.

  For example, in the above-described embodiment, when the glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1, the process is further divided based on whether the glue adhesion height Hg is less than the drop determination threshold value H2. However, it is not limited to this. For example, if the glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1, the glue head 23 is moved at a movement speed Vb that is lower than the movement speed Va, and the glue head 23 is not allowed to wait. Good.

  In the above-described embodiment, when the glue adhesion height Hg is equal to or greater than the adhesion determination threshold value H1 and less than the drop determination threshold value H2, the movement is uniformly performed at the moving speed Vb. However, the present invention is not limited to this. For example, it is good also as what moves with the different moving speed according to the glue adhesion height Hg among the speeds lower than the moving speed Va. Different moving speeds may be used as long as the glue adhesion height Hg is higher, the moving speed becomes lower. For example, the CPU 51 may select a lower movement speed as the glue adhesion height Hg is higher among a plurality of different movement speeds, or set the movement speed such that the higher the glue adhesion height Hg, the lower the movement speed. May be.

  In the embodiment described above, the glue head 23 is selected by selecting the shortest path among the plurality of paths for moving the glue head 23 out of the substrate S when the glue adhesion height Hg is greater than or equal to the adhesion determination threshold H1 and less than the drop determination threshold H2. However, the present invention is not limited to this. For example, the shortest path with the shortest distance from the current position until the glue head 23 reaches the glue cleaning device 40 may be selected. Alternatively, the CPU 51 of the control device 50 can prevent the viscous fluid from dropping on the substrate S or the component based on the positional information of the substrate S or the component stored in the ROM 52 or the HDD 53. It is also possible to select a route that avoids 23 passing over them. In particular, a route that reliably avoids over expensive parts may be selected.

  In the above-described embodiment, the adhesive state of the viscous fluid is determined again when the glue head 23 is moved at the moving speed Vb and reaches the outside of the substrate S. However, the present invention is not limited to this. For example, during the movement of the glue head 23 at the moving speed Vb, the adhesion state of the viscous fluid may be determined again every predetermined time, or the viscosity is changed every time the moving direction of the glue head 23 changes. It is good also as what determines the adhesion state of a fluid again. By determining the adhesion state of the viscous fluid over a plurality of times, the falling range of the viscous fluid can be limited. Or it is good also as what does not re-determine the adhesion state of such a viscous fluid.

  In the above-described embodiment, an error is notified when the glue attachment height Hg is equal to or greater than the drop determination threshold H2, and the image captured again by the side camera 25 and the post-discharge image are displayed side by side when the worker arrives. However, it is not limited to this. For example, only the post-discharge image may be displayed, and when the worker arrives, the side camera 25 may not capture an image again. Or it is good also as what does not display the image which shows the adhesion state of such a viscous fluid.

  In the above-described embodiment, the glue cleaning device 40 is exemplified by cleaning the glue nozzle 24 using the cleaning sheet 41 spanned between the rollers (the supply roller 42 and the collection roller 43), but is not limited thereto. Absent. For example, a glue cleaning device in which a cleaning member such as a sponge is fixedly disposed near the conveyor of the substrate transfer device 14 and the glue nozzle 24 is moved to the cleaning member when it is determined that a viscous fluid is attached. It is good also as what a glue cleaning apparatus removes a viscous fluid by pressing on.

  In the embodiment described above, the viscous fluid application device of the present disclosure is automatically applied to a head (rotary head 21 or one nozzle head 22) for mounting components and a head (glue head 23) for discharging viscous fluid. However, the present invention is not limited to this. For example, the viscous fluid application device according to the present disclosure may be applied to an apparatus that cannot attach a head for mounting a component but can attach only a head for discharging viscous fluid and performs an application process.

  The viscous fluid application device of the present disclosure may be configured as follows.

  In the viscous fluid application apparatus according to the present disclosure, the control device may be configured to use the imaging device after the ejection tool ejects the viscous fluid with reference to an image captured by the imaging device before the ejection tool ejects the viscous fluid. It is good also as what determines the adhesion state of the viscous fluid to the said discharge tool based on the image imaged by (3). In this way, even if a positional deviation or the like occurs due to individual differences of the discharge tools, the state of viscous fluid adhesion can be accurately determined from images taken before and after the discharge tools discharge the viscous fluid. Therefore, it is possible to appropriately cope with the adhesion of the viscous fluid to the discharge tool without erroneous detection.

  The viscous fluid application device of the present disclosure includes a removing device for removing the viscous fluid attached to the discharge tool, and the control device has the first predetermined amount or more of viscous fluid attached to the discharge tool. The discharge head, the moving device, and the removal device may be controlled to move the discharge head to the removal device at the low speed to remove the viscous fluid adhering to the discharge tool. Good. If it carries out like this, it can suppress that the viscous fluid adhering to a discharge tool falls to a coating target object, while moving a discharge head to a removal apparatus.

  In the viscous fluid application apparatus of the present disclosure, when the control device determines that the first predetermined amount or more of the viscous fluid is attached to the discharge tool, the discharge head moves to a position where the discharge head is detached from the application target. The moving device may be controlled such that the ejection head moves along a route having the shortest moving distance among a plurality of possible routes. If it carries out like this, it can suppress more that a viscous fluid falls to an application | coating target object.

  In the viscous fluid coating apparatus according to the present disclosure, when the ejection head that has moved at the low speed reaches a position where the ejection head moves away from the top of the coating target, the control apparatus is based on an image captured again by the imaging apparatus at the position. The state of the viscous fluid adhering to the discharge tool may be determined again. If it carries out like this, it will detect early that the viscous fluid fell to the application target object, and it will become possible to cope with it appropriately.

  The viscous fluid application device of the present disclosure includes an error notification device that notifies an error, and the control device has a viscous fluid of a second predetermined amount or more that is larger than the first predetermined amount attached to the discharge tool. When it is determined, the error notification device may be controlled so as to notify an error without moving the ejection head by the moving device. In this way, even when there is a high possibility that the viscous fluid will fall on the application target because the viscous fluid of the second predetermined amount or more that is larger than the first predetermined amount is attached, the viscous fluid falls on the application target. Can be suppressed.

  The present invention can be used for an apparatus for applying a viscous fluid to an object to be applied.

  DESCRIPTION OF SYMBOLS 10 Component mounting apparatus, 12 Component supply apparatus, 14 Board | substrate conveyance apparatus, 16 Head accommodating part, 17 Parts camera, 18 Nozzle stocker, 20 Head unit, 20a Head holding body, 21 Rotary head, 22 1 Nozzle head, 23 Glue head, 24 glue nozzle, 25 side camera, 30 moving device, 31 X axis guide rail, 32 X axis slider, 33 Y axis guide rail, 34 Y axis slider, 35 X axis position sensor, 36 Y axis position sensor, 40 glue cleaning device , 41 Cleaning sheet, 42 Supply roller, 43 Recovery roller, 45 Operation panel, 46 Display unit, 47 Operation unit, 50 Control device, 51 CPU, 52 ROM, 53 HDD, 54 RAM, 55 Input / output interface (input / output I / O) F), 56 buses, S substrate.

Claims (6)

A discharge head having a discharge tool for discharging viscous fluid;
A moving device for moving the discharge head in a horizontal direction;
An imaging device capable of imaging the ejection tool of the ejection head from a side;
An application process is performed to control the discharge head and the moving device so that the discharge head is moved at a predetermined speed to discharge a viscous fluid from the discharge tool and applied to an application target, and the discharge tool And determining that the viscous fluid is attached to the discharge tool based on an image captured by the imaging device and determining that a viscous fluid of a first predetermined amount or more is attached to the discharge tool. A control device for controlling the moving device so that the ejection head moves at a speed lower than the predetermined speed;
A viscous fluid application device comprising: The viscous fluid application device according to claim 1,
The control device uses the image captured by the imaging device as a reference before the ejection tool ejects the viscous fluid, based on the image captured by the imaging device after the ejection tool ejects the viscous fluid. A viscous fluid applicator that determines the state of viscous fluid adhering to the dispensing tool. The viscous fluid application device according to claim 1 or 2,
A removal device for removing the viscous fluid adhering to the discharge tool;
When the control device determines that the first predetermined amount or more of the viscous fluid is attached to the discharge tool, the control device moves the discharge head to the removal device at the low speed and adheres to the discharge tool. A viscous fluid application device that controls the discharge head, the moving device, and the removal device so as to remove water. The viscous fluid application apparatus according to any one of claims 1 to 3,
When the control device determines that the viscous fluid of the first predetermined amount or more is attached to the ejection tool, the movement distance of a plurality of paths in which the ejection head can move to a position where the ejection head is detached from the application target object. A viscous fluid application device that controls the moving device so that the ejection head moves along the shortest path. The viscous fluid application device according to any one of claims 1 to 4,
When the discharge head that has moved at the low speed reaches a position where it is removed from the top of the application target, the control device causes the viscous fluid to be supplied to the discharge tool based on the image captured again by the imaging device at the position. Viscous fluid application device that re-determines the state of adhesion. The viscous fluid application device according to any one of claims 1 to 5,
An error notification device for notifying an error is provided,
When the control device determines that a viscous fluid of a second predetermined amount or more larger than the first predetermined amount is attached to the discharge tool, an error is notified without moving the discharge head by the moving device. A viscous fluid application device that controls the error notification device.

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