JP2018160562A - Member preparation method and member preparation device - Google Patents

Member preparation method and member preparation device Download PDF

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JP2018160562A
JP2018160562A JP2017057069A JP2017057069A JP2018160562A JP 2018160562 A JP2018160562 A JP 2018160562A JP 2017057069 A JP2017057069 A JP 2017057069A JP 2017057069 A JP2017057069 A JP 2017057069A JP 2018160562 A JP2018160562 A JP 2018160562A
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rank
component
information
mounting
production
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JP6496915B2 (en
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淳 中薗
Atsushi Nakazono
淳 中薗
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2017057069A priority Critical patent/JP6496915B2/en
Priority to US15/909,134 priority patent/US10512201B2/en
Priority to CN202010616284.2A priority patent/CN111629582B/en
Priority to CN201810188849.4A priority patent/CN108633244B/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

PROBLEM TO BE SOLVED: To provide a member preparation method and a member preparation device that can appropriately prepare members used in manufacture of a mounting board.SOLUTION: A member preparation method includes: a requirement rank determination step (ST2) of determining, on the basis of substrate information including mounting positions of members mounted on a mounting board in which the members are mounted on a substrate, and member information on the members mounted on the mounting board, a required member rank of members suitable for manufacture of the mounting board; an adaptable member extraction step (ST3) of extracting, on the basis of a manufacturing plan for the mounting board and held member information in which the member rank is associated with each of a plurality of members that can be used in manufacture of the mounting board, adaptable members adaptable to the required member rank from the plurality of members; a usable member selection step (ST10) of selecting usable members used in manufacture of the mounting board from the adaptable members; and a member preparation instruction step (ST11) of creating instructions for preparing the usable members.SELECTED DRAWING: Figure 18

Description

本発明は、部品を基板に実装した実装基板の生産で使用される部材の部材準備方法および部材準備装置に関するものである。   The present invention relates to a member preparation method and member preparation device for members used in the production of a mounting board in which components are mounted on a substrate.

部品を基板に実装した実装基板を生産する実装機には、部品を吸着する吸着ノズル、吸着ノズルが装着される実装ヘッド、部品を格納するキャリヤテープより部品を供給するテープフィーダ(部品供給装置)などの部材が装着されて使用される。これらの部材は、メンテナンスしながら長期間使用する消耗材であり、使用時間、メンテナンス具合などによって実装精度が変動する(例えば特許文献1参照)。特許文献1では、テープフィーダから取り出されて吸着ノズルに保持された部品の吸着位置ずれ量に基づく工程能力指数より、テープフィーダと吸着ノズルの実装精度のランクを算出し、ランクが低下するとメンテナンスを実施している。   In a mounting machine that produces a mounting board with components mounted on a substrate, a suction nozzle that picks up the component, a mounting head to which the suction nozzle is mounted, and a tape feeder that supplies the component from a carrier tape that stores the component (component supply device) A member such as is mounted and used. These members are consumables that are used for a long period of time while performing maintenance, and the mounting accuracy varies depending on the usage time, maintenance condition, and the like (see, for example, Patent Document 1). In patent document 1, the rank of the mounting accuracy of the tape feeder and the suction nozzle is calculated from the process capability index based on the amount of suction position deviation of the parts taken out from the tape feeder and held by the suction nozzle, and maintenance is performed when the rank decreases. We are carrying out.

また、各部材は、並行して実装基板を生産している複数の実装機において共用で使用されており、生産する実装基板に応じて適宜組み合わせられて使用される(例えば特許文献2参照)。特許文献2では、実装基板の生産計画と部材の在庫状況に基づいて、新たに生産対象となる実装基板の生産で使用する部材を準備している。   In addition, each member is used in common in a plurality of mounting machines that produce mounting boards in parallel, and is used in an appropriate combination according to the mounting board to be produced (see, for example, Patent Document 2). In Patent Document 2, a member to be used for production of a mounting board to be newly produced is prepared based on a production plan of the mounting board and a stock status of the member.

特許第5807158号公報Japanese Patent No. 5807158 特許第5945690号公報Japanese Patent No. 5945690

しかしながら、特許文献1、特許文献2を含む従来技術では、実装基板の生産で使用する部材を準備するにあたり、使用状況などで変動する部材の実装精度までは考慮されておらず、さらなる改善の余地があるという課題があった。   However, in the prior art including Patent Document 1 and Patent Document 2, when preparing a member to be used in the production of a mounting substrate, the mounting accuracy of the member that varies depending on the usage situation is not considered, and there is room for further improvement. There was a problem that there was.

そこで本発明は、実装基板の生産で使用する部材を適切に準備することができる部材準備方法および部材準備装置を提供することを目的とする。   Then, an object of this invention is to provide the member preparation method and member preparation apparatus which can prepare appropriately the member used by production of a mounting substrate.

本発明の部材準備方法は、基板に部品を実装した実装基板に実装される部品の実装位置を含む基板情報と、前記実装基板に実装される部品の部品情報に基づいて、前記実装基板の生産に適した部材の要求部材ランクを決定する要求ランク決定工程と、前記実装基板の生産計画と、前記実装基板の生産で使用可能な複数の部材のそれぞれに部材ランクを紐付けた保有部材情報に基づいて、前記複数の部材の中から前記要求ランク決定工程で決定された前記要求部材ランクに適合する適合部材を抽出する適合部材抽出工程と、前記適合部材抽出工程で抽出された前記適合部材の中から前記実装基板の生産で使用する使用部材を選択する使用部材選択工程と、前記使用部材選択工程で選択した前記使用部材を準備する指示を生成する部材準備指示工程と、を含む。   The member preparation method of the present invention is based on board information including a mounting position of a component mounted on a mounting board on which a component is mounted on a board, and component information of the component mounted on the mounting board. A required rank of a member suitable for the required rank, a production plan for the mounting board, and possessed member information in which a member rank is associated with each of a plurality of members that can be used in the production of the mounting board. Based on the matching member extraction step of extracting the matching member that matches the required member rank determined in the required rank determination step from among the plurality of members, and the matching member extracted in the matching member extraction step Use member selection process for selecting a use member to be used in production of the mounting board from among them, and a member preparation instruction process for generating an instruction for preparing the use member selected in the use member selection process And, including the.

本発明の部材準備装置は、基板に部品を実装した実装基板に実装される部品の実装位置を含む基板情報と、前記実装基板に実装される部品の部品情報と、前記実装基板の生産計画と、前記実装基板の生産で使用可能な複数の部材のそれぞれに部材ランクを紐付けた保有部材情報とを取得する生産情報取得部と、前記生産情報取得部が取得した前記基板情報と前記部品情報に基づいて、前記実装基板の生産に適した部材の要求部材ランクを決定する要求ランク決定部と、前記生産情報取得部が取得した前記生産計画と前記保有部材情報に基づいて、前記複数の部材の中から前記要求ランク決定部が決定した前記要求部材ランクに適合する適合部材を抽出する適合部材抽出部と、前記適合部材抽出部が抽出した前記適合部材の中から前記実装基板の生産で使用する使用部材を選択する使用部材選択部と、前記使用部材選択部が選択した前記使用部材を準備する指示を生成する部材準備指示部と、を備える。   The member preparation apparatus of the present invention includes board information including a mounting position of a component mounted on a mounting board in which the component is mounted on the board, component information of the component mounted on the mounting board, and a production plan for the mounting board. A production information acquisition unit for acquiring possessed member information in which a member rank is associated with each of a plurality of members that can be used in the production of the mounting board; and the board information and the component information acquired by the production information acquisition unit A plurality of members based on the production plan and the possessed member information acquired by the production information acquisition unit; and a request rank determination unit that determines a required member rank of a member suitable for production of the mounting board. A matching member extraction unit that extracts a matching member that matches the requirement member rank determined by the requirement rank determination unit, and the mounting substrate from among the matching members extracted by the matching member extraction unit Comprising the use member selection unit for selecting a use member used in production, and a member preparation instruction section that generates an instruction to prepare the materials used for the members used selection section has selected.

本発明によれば、実装基板の生産で使用する部材を適切に準備することができる。   According to the present invention, it is possible to appropriately prepare a member used in the production of a mounting board.

本発明の一実施の形態の部品実装システムの構成説明図Configuration explanatory diagram of a component mounting system according to an embodiment of the present invention 本発明の一実施の形態の部品実装システムが備える実装機の構成説明図Structure explanatory drawing of the mounting machine with which the component mounting system of one embodiment of this invention is provided 本発明の一実施の形態の部品実装システムの制御系の構成を示すブロック図The block diagram which shows the structure of the control system of the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される携帯端末の制御系の構成を示すブロック図The block diagram which shows the structure of the control system of the portable terminal used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される部品情報の一例の構成説明図Structure explanatory drawing of an example of the component information used in the component mounting system of one embodiment of this invention (a)(b)本発明の一実施の形態の部品実装システムにおいて使用されるランク区分情報の一例の構成説明図(A) (b) Structure explanatory drawing of an example of the rank division information used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される保有部材情報の一例の構成説明図Structure explanatory drawing of an example of the possession member information used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される保有部材情報の一例の構成説明図Structure explanatory drawing of an example of the possession member information used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される保有部材情報の一例の構成説明図Structure explanatory drawing of an example of the possession member information used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される要求ランク情報の一例の構成説明図Configuration explanatory diagram of an example of request rank information used in the component mounting system of one embodiment of the present invention 本発明の一実施の形態の部品実装システムにおいて使用される適合部材情報の一例の構成説明図Structure explanatory drawing of an example of the compatible member information used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される適合部材情報の一例の構成説明図Structure explanatory drawing of an example of the compatible member information used in the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装システムにおいて使用される適合部材情報の一例の構成説明図Structure explanatory drawing of an example of the compatible member information used in the component mounting system of one embodiment of this invention (a)(b)(c)本発明の一実施の形態の部品実装システムにおいて使用される使用部材情報の一例の構成説明図(A) (b) (c) Structure explanatory drawing of an example of the used member information used in the component mounting system of one embodiment of the present invention 本発明の一実施の形態の部品実装システムにおいて使用される準備指示情報の一例の構成説明図Structure explanatory drawing of an example of the preparation instruction information used in the component mounting system of one embodiment of this invention (a)(b)(c)本発明の一実施の形態の部品実装システムにおいて使用される未達部材情報の一例の構成説明図(A) (b) (c) Structure explanatory drawing of an example of unreached member information used in the component mounting system of one embodiment of the present invention 本発明の一実施の形態の部品実装システムにおいて使用される処理指示情報の一例の構成説明図Configuration explanatory diagram of an example of processing instruction information used in the component mounting system of one embodiment of the present invention 本発明の一実施の形態の部品実装システムにおける部材管理方法のフロー図The flowchart of the member management method in the component mounting system of one embodiment of this invention

以下に図面を用いて、本発明の一実施の形態を詳細に説明する。以下で述べる構成、形状等は説明のための例示であって、部品実装システム、管理コンピュータ(部材準備装置、部材処理装置)の仕様に応じ、適宜変更が可能である。以下では、全ての図面において対応する要素には同一符号を付し、重複する説明を省略する。   Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are illustrative examples, and can be appropriately changed according to the specifications of the component mounting system and the management computer (member preparation device, member processing device). Below, the same code | symbol is attached | subjected to the element which respond | corresponds in all the drawings, and the overlapping description is abbreviate | omitted.

まず図1を参照して、部品実装システム1の構成を説明する。部品実装システム1は、基板に部品を実装して実装基板を生産する機能と、実装基板の生産に使用する部材を管理し、メンテナンスする機能を有している。部品実装システム1は、管理コンピュータ2、生産計画装置3、部材管理エリア4、部品実装ライン5を主体として構成され、これらの各部は通信ネットワーク6によって接続されている。管理コンピュータ2は、実装基板の生産管理、実装基板の生産で使用する部材の管理、部材のメンテナンスの管理などを行う。生産計画装置3は、部品実装システム1において生産される実装基板の基板情報、部品情報、実装基板の生産計画などを収集し、整理して記憶している。   First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting a component on a board to produce a mounting board, and a function of managing and maintaining members used for production of the mounting board. The component mounting system 1 is mainly composed of a management computer 2, a production planning device 3, a member management area 4, and a component mounting line 5, and these components are connected by a communication network 6. The management computer 2 performs production management of the mounting board, management of members used in the production of the mounting board, management of maintenance of the members, and the like. The production planning apparatus 3 collects, organizes, and stores board information, component information, production plans, and the like of mounting boards produced in the component mounting system 1.

部材管理エリア4には、通信ネットワーク6に接続されている部材管理装置7、部材管理装置7に接続されている保守作業装置8、部材庫9が設置されている。部材庫9には、現在の実装基板の生産で使用されていない部材、メンテナンス作業待ちの部材などが保管されている。部材管理装置7は、部品実装システム1において実装基板の生産で使用されている部材、部材庫9に保管されている部材など部品実装システム1が保有する保有部材の所在や、部材の状態と品質で決まる部材ランクなどを管理する。保守作業装置8は、後述する吸着ノズル、テープフィーダ、実装ヘッドなどの部材のメンテナンス作業を実行する。なお、保守作業装置8は、通信ネットワーク6を介して部材管理装置7と接続するようにしてもよい。   In the member management area 4, a member management device 7 connected to the communication network 6, a maintenance work device 8 connected to the member management device 7, and a member store 9 are installed. The member store 9 stores members that are not used in production of the current mounting board, members waiting for maintenance work, and the like. The member management device 7 determines the location of members possessed by the component mounting system 1 such as members used in the production of mounting boards in the component mounting system 1 and members stored in the member store 9, and the state and quality of the members. The member rank determined by is managed. The maintenance work device 8 performs maintenance work for members such as a suction nozzle, a tape feeder, and a mounting head described later. The maintenance work device 8 may be connected to the member management device 7 via the communication network 6.

図1において、部品実装ライン5は、ライン管理装置10、印刷機M1、実装機M2,M3を備えており、各装置は通信ネットワーク6を介して管理コンピュータ2に接続されている。印刷機M1は、印刷作業部によって上流側から搬入された基板にマスクを介してクリーム半田を印刷するはんだ印刷作業を実行する。実装機M2,M3は、印刷機M1によりクリーム半田が印刷された基板に、部品実装作業部によって部品を実装する部品実装作業を実行して実装基板を生産する。ライン管理装置10は、部品実装ライン5の各装置間の作業を管理する他、印刷機M1、実装機M2,M3において使用されている部材の使用状況、エラー率などの情報を収集する。   In FIG. 1, the component mounting line 5 includes a line management device 10, a printing machine M <b> 1, mounting machines M <b> 2 and M <b> 3, and each device is connected to the management computer 2 via a communication network 6. The printing machine M1 executes a solder printing operation for printing cream solder on the substrate carried in from the upstream side by the printing operation unit via a mask. The mounting machines M2 and M3 produce a mounting board by executing a component mounting operation for mounting a component on the board on which cream solder is printed by the printing machine M1 using a component mounting operation unit. The line management device 10 collects information such as the usage status of members used in the printing machine M1, the mounting machines M2 and M3, and the error rate, in addition to managing work between the devices on the component mounting line 5.

なお、部品実装ライン5は、印刷機M1や実装機M2,M3の前後に印刷状態や部品実装状態を検査する検査機をさらに備え、ライン管理装置10は、検査機の検査結果に基づくエラー率も収集してもよい。また、部品実装ライン5が備える実装機M2,M3は2台である必要はなく、1台でも3台以上であってもよい。また、部品実装システム1が備える部品実装ライン5は、一つである必要はなく、部品実装システム1が複数の部品実装ライン5を備える構成でもよい。部品実装システム1が複数の部品実装ライン5を備えている場合、部品実装ライン5毎にライン管理装置10を配置しても、複数の部品実装ライン5に共通の1台のライン管理装置10を配置してもよい。すなわち、ライン管理装置10が収集する情報が、各部品実装ライン5の各装置を特定する情報に紐付けられて記憶されればよい。   The component mounting line 5 further includes an inspection machine that inspects the printing state and the component mounting state before and after the printing machine M1 and the mounting machines M2 and M3, and the line management apparatus 10 has an error rate based on the inspection result of the inspection machine. May also be collected. Further, the mounting machines M2 and M3 provided in the component mounting line 5 do not have to be two, and may be one or three or more. Moreover, the component mounting system 1 does not need to have one component mounting line 5, and the component mounting system 1 may include a plurality of component mounting lines 5. When the component mounting system 1 includes a plurality of component mounting lines 5, even if a line management device 10 is arranged for each component mounting line 5, one line management device 10 common to the plurality of component mounting lines 5 is provided. You may arrange. That is, the information collected by the line management device 10 may be stored in association with information specifying each device of each component mounting line 5.

図1において、部材管理エリア4、部品実装ライン5などで各種作業を行う作業者は、携帯端末11を携帯している。携帯端末11は、管理コンピュータ2と無線で通信して情報の授受を行う端末側通信部12、表示機能と入力機能を有するタッチパネル13を備えている。携帯端末11は、管理コンピュータ2から受信した各種情報を表示処理してタッチパネル13に表示する。また、携帯端末11は、タッチパネル13から入力された各種情報などを管理コンピュータ2に送信する。   In FIG. 1, an operator who performs various operations in the member management area 4, the component mounting line 5, etc. carries a mobile terminal 11. The portable terminal 11 includes a terminal-side communication unit 12 that wirelessly communicates with the management computer 2 to exchange information, and a touch panel 13 having a display function and an input function. The mobile terminal 11 displays various information received from the management computer 2 and displays it on the touch panel 13. In addition, the mobile terminal 11 transmits various information input from the touch panel 13 to the management computer 2.

ここで図2を参照して、基板に部品を実装する実装機M2,M3の構成について説明する。基台14の上部には、上流側の印刷機M1から搬入された基板Bを搬送する基板搬送機構15がX方向(基板搬送方向)に配設されている。基板搬送機構15のY方向(水平面内でX方向と直交する方向)の側方には、部品供給部16が配設されている。部品供給部16には、着脱自在の複数のテープフィーダ17がX方向に並列に配置されている。テープフィーダ17は、部品Dを収納したキャリヤテープTをテープ送り方向にピッチ送りすることにより、以下に説明する実装ヘッドによる部品取り出し位置に部品Dを供給する。キャリヤテープTは、リールRに巻回収納された状態で部品供給部16に保持されている。   Here, with reference to FIG. 2, the structure of the mounting machines M2 and M3 for mounting components on the board will be described. A substrate transport mechanism 15 that transports the substrate B carried in from the upstream printing machine M1 is arranged in the X direction (substrate transport direction) on the upper portion of the base 14. A component supply unit 16 is disposed on the side of the substrate transport mechanism 15 in the Y direction (a direction perpendicular to the X direction in the horizontal plane). In the component supply unit 16, a plurality of detachable tape feeders 17 are arranged in parallel in the X direction. The tape feeder 17 feeds the component D to the component pick-up position by the mounting head described below by pitch-feeding the carrier tape T containing the component D in the tape feeding direction. The carrier tape T is held by the component supply unit 16 while being wound around the reel R.

基台14の上方には、実装ヘッド18と、装着された実装ヘッド18を水平方向(X方向、Y方向)に移動させるヘッド移動機構19が配設されている。実装ヘッド18は複数の吸着ユニット18aを備えており、吸着ユニット18aのそれぞれの下端には部品Dを吸着保持する吸着ノズル18bが着脱可能に装着されている。吸着ユニット18aは、吸着ノズル18bをZ方向(水平面に直交する方向)に昇降させる。実装ヘッド18は、吸着ノズル18bによってテープフィーダ17の部品取り出し位置に供給された部品Dを取り出し、基板搬送機構15に位置決めされた基板Bの実装位置に部品Dを実装する。   A mounting head 18 and a head moving mechanism 19 that moves the mounted mounting head 18 in the horizontal direction (X direction, Y direction) are disposed above the base 14. The mounting head 18 includes a plurality of suction units 18a, and suction nozzles 18b that suck and hold the component D are detachably attached to the lower ends of the suction units 18a. The suction unit 18a moves the suction nozzle 18b up and down in the Z direction (direction perpendicular to the horizontal plane). The mounting head 18 takes out the component D supplied to the component pickup position of the tape feeder 17 by the suction nozzle 18 b and mounts the component D at the mounting position of the board B positioned by the board transport mechanism 15.

図2において、吸着ノズル18b、実装ヘッド18、テープフィーダ17(部品供給装置)などの部材は、基板Bに実装する部品Dの種別、隣接する部品Dとの間隔、実装精度などに応じて適宜選択され、実装機M2,M3に装着されて使用される。   In FIG. 2, members such as the suction nozzle 18 b, the mounting head 18, and the tape feeder 17 (component supply device) are appropriately selected according to the type of the component D to be mounted on the substrate B, the interval between the adjacent components D, the mounting accuracy, and the like. It is selected and used by being mounted on the mounting machines M2 and M3.

実装機M2,M3において基板Bへの部品Dの実装が反復実行される際には、テープフィーダ17が部品Dを部品取り出し位置に正常に供給できない供給エラー、吸着ノズル18bが部品Dを正常に吸着できない吸着エラー、部品Dが基板Bの実装位置に正常に実装されない実装エラーなど各種エラーが発生する。このように実装作業中に発生する各種エラーは、ライン管理装置10が備えるライン情報収集部31a(図3参照)によって適宜収集されて、生産状況情報Ila(図3参照)として記憶される。   When the mounting of the component D on the board B is repeatedly executed in the mounting machines M2 and M3, the supply error that the tape feeder 17 cannot normally supply the component D to the component take-out position, and the suction nozzle 18b normally corrects the component D. Various errors occur such as a suction error that cannot be picked up and a mounting error in which the component D is not properly mounted on the mounting position of the board B. In this way, various errors that occur during the mounting operation are appropriately collected by the line information collection unit 31a (see FIG. 3) included in the line management apparatus 10 and stored as production status information Ila (see FIG. 3).

次に図3を参照して、部品実装システム1の制御系の構成について説明する。生産計画装置3は、生産制御部21、生産記憶部22、通信部23を備えている。通信部23は通信インターフェースであり、通信ネットワーク6を介して管理コンピュータ2との間で信号、情報の授受を行う。生産制御部21はCPU機能を備える演算装置であり、通信ネットワーク6に接続されるデータベース(図示省略)から各種情報を収集し、整理して生産記憶部22に記憶させる。生産記憶部22は記憶装置であり、基板情報Iba、部品情報Ida、生産計画情報Ipaなどを記憶する。   Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. The production planning device 3 includes a production control unit 21, a production storage unit 22, and a communication unit 23. The communication unit 23 is a communication interface, and exchanges signals and information with the management computer 2 via the communication network 6. The production control unit 21 is an arithmetic device having a CPU function, collects various information from a database (not shown) connected to the communication network 6, organizes it, and stores it in the production storage unit 22. The production storage unit 22 is a storage device, and stores board information Iba, component information Ida, production plan information Ipa, and the like.

基板情報Ibaには、基板Bに実装される部品Dの種別と実装位置が含まれている。部品情報Idaには、実装基板に実装される部品Dの種別、形状、サイズの少なくともいずれかが含まれている。生産計画情報Ipaには、実装基板の生産枚数、生産時期などの生産計画が含まれている。   The board information Iba includes the type and mounting position of the component D mounted on the board B. The component information Ida includes at least one of the type, shape, and size of the component D mounted on the mounting board. The production plan information Ipa includes a production plan such as the number of mounted substrates produced and the production time.

ここで図5を参照して、部品情報Ida(Idb)の一例について説明する。この例では、部品情報Idaには、「部品名」欄71に部品Dの種別、「形状」欄72に部品Dの形状、「サイズ」欄73に部品Dのサイズが含まれている。部品Dの形状には、略立方体の形状の「通常」と、略立方体の本体部から電極端子が外部に延伸する形状の「特殊」などが記憶される。   Here, an example of the component information Ida (Idb) will be described with reference to FIG. In this example, the component information Ida includes the type of the component D in the “component name” column 71, the shape of the component D in the “shape” column 72, and the size of the component D in the “size” column 73. As the shape of the part D, “normal” having a substantially cubic shape, “special” having a shape in which the electrode terminal extends from the main body of the substantially cube, and the like are stored.

「要求部材ランク」欄74a〜76cには、「部品名」欄71の種別の部品Dを基板Bに実装する際に使用する部材に要求される部材ランクが指定されている。より具体的には、部品Dを吸着する吸着ノズル18bの要求部材ランクが、「Excellent」欄74a、「Good」欄74b、「Bad」欄74cにYes(使用可能)又はNo(使用不可能)で指定されている。同様に、部品Dを供給するテープフィーダ17の要求部材ランクが「Excellent」欄75a、「Good」欄75b、「Bad」欄75cに、部品Dを基板Bに実装する実装ヘッド18の要求部材ランクが「Excellent」欄76a、「Good」欄76b、「Bad」欄76cに指定されている。   In the “required member rank” columns 74a to 76c, the member ranks required for the members used when the component D of the type in the “component name” column 71 is mounted on the board B are specified. More specifically, the required member rank of the suction nozzle 18b that sucks the part D is Yes (usable) or No (unusable) in the “Excellent” column 74a, the “Good” column 74b, and the “Bad” column 74c. It is specified by. Similarly, the required member rank of the tape feeder 17 that supplies the component D is listed in the “Excellent” column 75a, the “Good” column 75b, and the “Bad” column 75c, and the required member rank of the mounting head 18 that mounts the component D on the board B. Are designated in the “Excellent” column 76a, the “Good” column 76b, and the “Bad” column 76c.

図3において、ライン管理装置10は、ライン制御部31、ライン記憶部32、通信部33を備えている。通信部33は通信インターフェースであり、通信ネットワーク6を介して管理コンピュータ2、部材管理装置7との間で信号、情報の授受を行う。ライン制御部31はCPU機能を備える演算装置であり、ライン情報収集部31aなどの内部処理部を有している。ライン記憶部32は記憶装置であり、生産状況情報Ilaなどを記憶する。ライン情報収集部31aは、印刷機M1、実装機M2,M3に装着されて実装基板の生産に使用されている部材(吸着ノズル18b、テープフィーダ17、実装ヘッド18など)の部品実装回数、使用期間、各種エラー(吸着エラー、供給エラー、実装エラーなど)の回数などを収集して生産状況情報Ilaとしてライン記憶部32に記憶する。   In FIG. 3, the line management apparatus 10 includes a line control unit 31, a line storage unit 32, and a communication unit 33. The communication unit 33 is a communication interface, and exchanges signals and information with the management computer 2 and the member management device 7 via the communication network 6. The line control unit 31 is an arithmetic device having a CPU function, and has an internal processing unit such as a line information collection unit 31a. The line storage unit 32 is a storage device and stores production status information Ila and the like. The line information collection unit 31a is used to mount and use components (such as the suction nozzle 18b, the tape feeder 17, and the mounting head 18) that are mounted on the printing machine M1, the mounting machines M2 and M3 and are used for the production of the mounting board. The period, the number of various errors (such as suction error, supply error, and mounting error) are collected and stored in the line storage unit 32 as production status information Ila.

図3において、部材管理装置7は、部材制御部41、部材記憶部42、入力部43、表示部44、プリンタ45、通信部46、無線通信部47を備えている。入力部43は、キーボード、タッチパネル、マウスなどの入力装置であり、操作コマンドやデータ入力時などに用いられる。表示部44は液晶パネルなどの表示装置であり、入力部43による操作のための操作画面などの各種画面の他、各種情報を表示する。プリンタ45は、管理コンピュータ2より取得した準備指示、処理指示などを印刷する。通信部46は通信インターフェースであり、通信ネットワーク6を介して管理コンピュータ2、ライン管理装置10との間で信号、情報の授受を行う。無線通信部47は、携帯端末11と無線で通信して情報の授受を行う。   3, the member management apparatus 7 includes a member control unit 41, a member storage unit 42, an input unit 43, a display unit 44, a printer 45, a communication unit 46, and a wireless communication unit 47. The input unit 43 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 44 is a display device such as a liquid crystal panel, and displays various information in addition to various screens such as an operation screen for operation by the input unit 43. The printer 45 prints a preparation instruction, a processing instruction, etc. acquired from the management computer 2. The communication unit 46 is a communication interface, and exchanges signals and information with the management computer 2 and the line management device 10 via the communication network 6. The wireless communication unit 47 communicates with the mobile terminal 11 wirelessly to exchange information.

部材制御部41はCPU機能を備える演算装置であり、情報取得部41a、評価取得部41b、ランク決定部41c、準備指示取得部41d、処理指示取得部41eなどの内部処理部を有している。部材記憶部42は記憶装置であり、保守情報Im、生産状況情報Ilb、ランク区分情報Ir、保有部材情報Ica、準備指示情報Peb、処理指示情報Pmbなどを記憶する。保守情報Imには、部材管理装置7に接続される保守作業装置8によって実行されるメンテナンス作業の情報であるメンテナンス回数、最終メンテナンス後の経過時間などが各部材に紐付けられて記憶されている。   The member control unit 41 is an arithmetic device having a CPU function, and includes internal processing units such as an information acquisition unit 41a, an evaluation acquisition unit 41b, a rank determination unit 41c, a preparation instruction acquisition unit 41d, and a processing instruction acquisition unit 41e. . The member storage unit 42 is a storage device, and stores maintenance information Im, production status information Ilb, rank classification information Ir, possessed member information Ica, preparation instruction information Peb, processing instruction information Pmb, and the like. In the maintenance information Im, the number of times of maintenance, which is information on maintenance work executed by the maintenance work device 8 connected to the member management device 7, the elapsed time after the final maintenance, and the like are stored in association with each member. .

図3において、情報取得部41aは、ライン管理装置10から生産状況情報Ilaを取得して生産状況情報Ilbとして部材記憶部42に記憶させる。ランク区分情報Irには、各部材の部材ランクを決定するための部材の状態、品質のランク区分が含まれる。   In FIG. 3, the information acquisition unit 41 a acquires the production status information Ila from the line management device 10 and stores it in the member storage unit 42 as the production status information Ilb. The rank classification information Ir includes the rank classification of the state and quality of the member for determining the member rank of each member.

ここで図6を参照して、ランク区分情報Irの一例について説明する。部材ランクは、部材状態ランクと部材品質ランクに基づいて決定される。図6(a)には部材状態ランクのランク区分情報Ir1、図6(b)には部材品質ランクのランク区分情報Ir2を示す。   Here, an example of the rank division information Ir will be described with reference to FIG. The member rank is determined based on the member state rank and the member quality rank. FIG. 6A shows the rank classification information Ir1 of the member status rank, and FIG. 6B shows the rank classification information Ir2 of the member quality rank.

図6(a)において、部材状態ランクは、「項目」欄81に示される項目(a)累積使用時間、項目(b)メンテナンス回数、項目(c)最終メンテナンス後の経過時間、に基づいて決定される。累積使用時間は、生産状況情報Ilbに基づいて算出される。メンテナンス回数、最終メンテナンス後の経過時間は、保守情報Imに含まれている。「項目数」欄82には「部材状態ランク」欄83に示す部材状態ランクを決める内容が示されている。この例での部材状態ランクは、項目(a)〜(c)の「全項目が閾値内」の場合は「Excellent」、「1項目が閾値外」の場合は「Good」、「2項目が閾値外」の場合は「Bad」、「全項目が閾値外」の場合は「Disabled」と指定されている。   In FIG. 6A, the member state rank is determined based on the item (a) accumulated use time, the item (b) the number of maintenance times, and the item (c) elapsed time after the final maintenance shown in the “item” column 81. Is done. The accumulated usage time is calculated based on the production status information Ilb. The number of maintenance and the elapsed time after the final maintenance are included in the maintenance information Im. In the “number of items” column 82, contents for determining the member state rank shown in the “member state rank” column 83 are shown. The member state rank in this example is “Excellent” when the items (a) to (c) are “all items within the threshold value”, “Good” when the “one item is outside the threshold value”, and “2 items are “Bad” is designated for “outside threshold”, and “Disabled” is designated for “all items are outside threshold”.

図6(b)において、部材品質ランクは、「項目」欄84に示される項目(d)部品実装回数あたりのエラー率、項目(e)使用期間あたりのエラー率、項目(f)部材の評価情報、に基づいて決定される。部品実装回数あたりのエラー率、使用期間あたりのエラー率は、生産状況情報Ilbに基づいて算出される。部材の評価情報は、設備の精度検証によって得られた工程能力指数や、設備の劣化状態に対する作業者の主観的判断などの情報をもとに、作業者によって入力される。「項目数」欄85には「部材品質ランク」欄86に示す部材品質ランクを決める内容が示されている。   In FIG. 6B, the member quality rank is the item (d) error rate per component mounting number, item (e) error rate per usage period, item (f) member evaluation shown in the “item” column 84. Information. The error rate per number of component mountings and the error rate per usage period are calculated based on the production status information Ilb. The member evaluation information is input by the worker based on information such as the process capability index obtained by the accuracy verification of the facility and the subjective judgment of the worker with respect to the deterioration state of the facility. In the “number of items” column 85, contents for determining the member quality rank shown in the “member quality rank” column 86 are shown.

この例での部材品質ランクは、項目(d)〜(f)の「全項目が閾値内」の場合は「Excellent」、「1項目が閾値外」の場合は「Good」、「2項目が閾値外」の場合は「Bad」、「全項目が閾値外」の場合は「Disabled」と指定されている。図6(a)、図6(b)において、項目(a)〜(f)の閾値は、実績や経験に基づいて決められる。また、部材状態ランク、部材品質ランクを決める項目は、上記の例に限定されることはなく、適宜、部材の種類や要求される実装品質などに応じて決められる。   The member quality rank in this example is “Excellent” when the items (d) to (f) are “all items within the threshold”, “Good” when “one item is outside the threshold”, and “2 items are “Bad” is designated for “outside threshold”, and “Disabled” is designated for “all items are outside threshold”. In FIG. 6A and FIG. 6B, the threshold values of items (a) to (f) are determined based on actual results and experience. Further, the items for determining the member state rank and the member quality rank are not limited to the above example, and are appropriately determined according to the type of member, the required mounting quality, and the like.

図3において、評価取得部41bは、部材品質ランクを決めるための部材の評価情報を取得する。より具体的には、部材の外観や実装基板の生産におけるエラーの頻度などに基づいて、作業者が携帯端末11のタッチパネル13に入力した部材の評価情報を、評価取得部41bが無線通信部47を介して取得して保有部材情報Icaに記憶させる。   In FIG. 3, the evaluation acquisition unit 41 b acquires member evaluation information for determining a member quality rank. More specifically, based on the appearance of the member, the frequency of errors in the production of the mounting board, and the like, the evaluation acquisition unit 41b uses the wireless communication unit 47 to input the member evaluation information input to the touch panel 13 of the mobile terminal 11. And stored in the retained member information Ica.

ランク決定部41cは、保守情報Im、生産状況情報Ilb、ランク区分情報Irに基づいて、実装基板の生産で使用可能な複数の保有部材の部材ランクを決定し、決定した部材ランクを各保有部材に紐付けた保有部材情報Icaを作成して部材記憶部42に記憶させる。すなわち、部材ランクは、部材の累積使用時間、メンテナンス回数、最終メンテナンス後の経過時間の少なくともひとつに基づいて設定された部材状態ランク(図6(a)参照)と、部材の部品実装回数あたりのエラー率、部材の使用期間あたりのエラー率、部材の評価情報の少なくともひとつに基づいて設定された部材品質ランク(図6(b)参照)に基づいて決定される。   The rank determination unit 41c determines the member ranks of a plurality of holding members that can be used in the production of the mounting board based on the maintenance information Im, the production status information Ilb, and the rank classification information Ir, and determines the determined member ranks for each holding member The possessed member information Ica associated with is created and stored in the member storage unit 42. That is, the member rank is determined based on the member state rank (see FIG. 6A) set based on at least one of the cumulative use time of the member, the number of times of maintenance, and the elapsed time after the final maintenance, and the number of parts mounted on the member. This is determined based on a member quality rank (see FIG. 6B) set based on at least one of an error rate, an error rate per member usage period, and member evaluation information.

ここで図7〜図9を参照して、保有部材情報Ica(Icb)について説明する。図7に、吸着ノズル18bの保有部材情報Ica1(Icb1)の一例を示す。吸着ノズル18bの保有部材情報Ica1(Icb1)には、「ノズル番号」欄91に部材番号、「ノズル種別」欄92に部材の種別、「対応部品形状」欄93に吸着可能な部品Dの形状、「対応部品サイズ」欄94に吸着可能な部品Dのサイズ、「対応実装間隔」欄95に基板Bに実装可能な隣接部品との最小間隔、「部材状態ランク」欄96に現在の部材状態ランク、「部材品質ランク」欄97に現在の部材品質ランク、「部材ランク」欄98に現在の部材ランクが含まれている。   Here, the retained member information Ica (Icb) will be described with reference to FIGS. FIG. 7 shows an example of the retained member information Ica1 (Icb1) of the suction nozzle 18b. The possessed member information Ica1 (Icb1) of the suction nozzle 18b includes a member number in the “nozzle number” column 91, a member type in the “nozzle type” column 92, and a shape of the component D that can be sucked in the “corresponding component shape” column 93. , The size of the component D that can be picked up in the “corresponding component size” column 94, the minimum interval between adjacent components that can be mounted on the board B in the “corresponding mounting interval” column 95, and the current member state in the “member state rank” column 96 The rank, the “member quality rank” column 97 includes the current member quality rank, and the “member rank” column 98 includes the current member rank.

図8に、テープフィーダ17の保有部材情報Ica2(Icb2)の一例を示す。テープフィーダ17の保有部材情報Ica2(Icb2)には、「フィーダ番号」欄101に部材番号、「フィーダ種別」欄102に部材の種別、「対応テープサイズ」欄103に装着可能なキャリヤテープTのサイズ、「部材状態ランク」欄104に現在の部材状態ランク、「部材品質ランク」欄105に現在の部材品質ランク、「部材ランク」欄106に現在の部材ランクが含まれている。   FIG. 8 shows an example of the holding member information Ica2 (Icb2) of the tape feeder 17. The holding member information Ica2 (Icb2) of the tape feeder 17 includes a member number in the “feeder number” column 101, a member type in the “feeder type” column 102, and a carrier tape T that can be loaded in the “corresponding tape size” column 103. The size, the “member state rank” column 104 includes the current member state rank, the “member quality rank” column 105 includes the current member quality rank, and the “member rank” column 106 includes the current member rank.

図9に、実装ヘッド18の保有部材情報Ica3(Icb3)の一例を示す。実装ヘッド18の保有部材情報Ica3(Icb3)には、「ヘッド番号」欄111に部材番号、「ヘッド種別」欄112に部材の種別、「ノズル数」欄113に実装ヘッド18に装着可能な吸着ノズル18bの数、「対応部品サイズ」欄114に実装可能な部品Dのサイズ、「部材状態ランク」欄115に現在の部材状態ランク、「部材品質ランク」欄116に現在の部材品質ランク、「部材ランク」欄117に現在の部材ランクが含まれている。これらの例では、ランク決定部41cは、部材状態ランクと部材品質ランクのうちの悪い方を部材ランクとして決定している。   FIG. 9 shows an example of holding member information Ica3 (Icb3) of the mounting head 18. The holding member information Ica3 (Icb3) of the mounting head 18 includes a member number in the “head number” column 111, a member type in the “head type” column 112, and a suction that can be mounted on the mounting head 18 in the “nozzle number” column 113. The number of nozzles 18b, the size of the component D that can be mounted in the “corresponding component size” column 114, the current member state rank in the “member state rank” column 115, the current member quality rank in the “member quality rank” column 116, “ The current member rank is included in the “member rank” column 117. In these examples, the rank determining unit 41c determines the worse one of the member state rank and the member quality rank as the member rank.

図3において、準備指示取得部41dは、管理コンピュータ2より後述する実装基板の生産で使用する使用部材を準備するための準備指示を含む準備指示情報Peaを取得して、準備指示情報Pebとして部材記憶部42に記憶させる。処理指示取得部41eは、管理コンピュータ2より後述する要求部材ランクを満たさないランク未達部材をメンテナンスするための処理指示を含む処理指示情報Pmaを取得して、処理指示情報Pmbとして部材記憶部42に記憶させる。   In FIG. 3, the preparation instruction acquisition unit 41 d acquires preparation instruction information Pea including a preparation instruction for preparing a member to be used for production of a mounting board, which will be described later, from the management computer 2, and prepares the member as preparation instruction information Peb. The data is stored in the storage unit 42. The processing instruction acquisition unit 41e acquires processing instruction information Pma including a processing instruction for maintaining a rank unachieved member that does not satisfy a requested member rank, which will be described later, from the management computer 2, and the member storage unit 42 as the processing instruction information Pmb. Remember me.

図3において、管理コンピュータ2は、管理制御部51、管理記憶部52、入力部53、表示部54、通信部55、無線通信部56を備えている。入力部53は、キーボード、タッチパネル、マウスなどの入力装置であり、操作コマンドやデータ入力時などに用いられる。表示部54は液晶パネルなどの表示装置であり、入力部53による操作のための操作画面などの各種画面の他、各種情報を表示する。通信部55は通信インターフェースであり、通信ネットワーク6を介して生産計画装置3、部材管理装置7、ライン管理装置10との間で信号、情報の授受を行う。無線通信部56は、携帯端末11と無線で通信して情報の授受を行う。   In FIG. 3, the management computer 2 includes a management control unit 51, a management storage unit 52, an input unit 53, a display unit 54, a communication unit 55, and a wireless communication unit 56. The input unit 53 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 54 is a display device such as a liquid crystal panel, and displays various types of information in addition to various screens such as an operation screen for operation by the input unit 53. The communication unit 55 is a communication interface, and exchanges signals and information with the production planning device 3, the member management device 7, and the line management device 10 via the communication network 6. The wireless communication unit 56 communicates with the mobile terminal 11 wirelessly to exchange information.

管理制御部51はCPU機能を備える演算装置であり、生産情報取得部51a、要求ランク決定部51b、適合部材抽出部51c、使用部材選択部51d、部材準備指示部51e、未達部材抽出部51f、部材処理指示部51gなどの内部処理部を有している。管理記憶部52は記憶装置であり、基板情報Ibb、部品情報Idb、生産計画情報Ipb、保有部材情報Icb、要求ランク情報Ial、適合部材情報Iad、使用部材情報Isd、準備指示情報Pea、未達部材情報Iud、処理指示情報Pmaなどを記憶する。   The management control unit 51 is an arithmetic device having a CPU function, and includes a production information acquisition unit 51a, a request rank determination unit 51b, a compatible member extraction unit 51c, a used member selection unit 51d, a member preparation instruction unit 51e, and an unreached member extraction unit 51f. And an internal processing unit such as a member processing instruction unit 51g. The management storage unit 52 is a storage device, and includes board information Ibb, parts information Idb, production plan information Ipb, possessed member information Icb, required rank information Ial, compatible member information Iad, used member information Isd, preparation instruction information Pea, unachieved The member information Iud, processing instruction information Pma, and the like are stored.

図3において、生産情報取得部51aは、生産計画装置3から基板情報Iba、部品情報Ida、実装基板の生産計画を含む生産計画情報Ipaを、部材管理装置7から保有部材情報Icaを取得して、それぞれ基板情報Ibb、部品情報Idb、生産計画情報Ipb、保有部材情報Icbとして管理記憶部52に記憶させる。   In FIG. 3, the production information acquisition unit 51 a acquires the board information Iba, the component information Ida, the production plan information Ipa including the production plan of the mounting board from the production planning apparatus 3, and the possessed member information Ica from the member management apparatus 7. These are stored in the management storage unit 52 as board information Ibb, component information Idb, production plan information Ipb, and possessed member information Icb, respectively.

要求ランク決定部51bは、生産情報取得部51aが取得した基板情報Ibbと部品情報Idb(図5参照)に基づいて、実装基板の生産に適した部材の要求部材ランクを決定して、要求ランク情報Ialとして管理記憶部52に記憶させる。その際、要求ランク決定部51bは、基板Bに実装される部品Dとその部品Dに隣接する部品Dとの間隔(実装間隔)に基づいて要求ランクを決定する。要求ランク決定部51bは、基板情報Ibbに含まれる実装基板における部品Dの実装位置と、部品情報Idbに含まれる部品Dの形状、サイズに基づいて、実装間隔を算出する。これによって、必要な実装品質を実現することができる部材を適切に準備することができる。   Based on the board information Ibb and the component information Idb (see FIG. 5) acquired by the production information acquisition unit 51a, the request rank determination unit 51b determines the required member rank of the member suitable for the production of the mounting board, and the request rank The information is stored in the management storage unit 52 as information Ial. At that time, the required rank determining unit 51b determines the required rank based on the interval (mounting interval) between the component D mounted on the board B and the component D adjacent to the component D. The request rank determination unit 51b calculates the mounting interval based on the mounting position of the component D on the mounting board included in the board information Ibb and the shape and size of the component D included in the component information Idb. As a result, a member capable of realizing the required mounting quality can be appropriately prepared.

ここで図10を参照して、要求ランク情報Ialの一例について説明する。要求ランク情報Ialには、「部品名」欄121に実装基板に実装される部品Dの種別、「形状」欄122に部品Dの形状、「サイズ」欄123に部品Dのサイズ、「最小実装間隔」欄124に隣接する部品Dとの最小間隔、「部品数」欄125に実装基板に実装される部品Dの数、「吸着ノズル」欄126に部品Dを吸着する吸着ノズル18bの要求部材ランク、「テープフィーダ」欄127に部品Dを供給するテープフィーダ17の要求部材ランク、「実装ヘッド」欄128に部品Dを実装する実装ヘッド18の要求部材ランクが含まれている。ここでは、4つの種別の部品D(PA01、PA02、PA03、PA08)の要求ランクが含まれている。   Here, an example of the request rank information Ial will be described with reference to FIG. The required rank information Ial includes the “component name” column 121 for the type of component D mounted on the mounting board, the “shape” column 122 for the shape of component D, the “size” column 123 for the size of component D, and “minimum mounting”. The minimum distance from the component D adjacent to the “interval” column 124, the number of components D mounted on the mounting board in the “number of components” column 125, and the required member of the suction nozzle 18b that sucks the component D in the “suction nozzle” column 126 The required member rank of the tape feeder 17 that supplies the component D is included in the rank, the “tape feeder” column 127, and the required member rank of the mounting head 18 that mounts the component D is included in the “mounting head” column 128. Here, the request ranks of four types of parts D (PA01, PA02, PA03, PA08) are included.

図3において、適合部材抽出部51cは、生産情報取得部51aが取得した生産計画情報Ipbと保有部材情報Icb(図7〜図9参照)に基づいて、複数の保有部材の中から要求ランク決定部51bが決定した要求部材ランク(要求ランク情報Ial(図10参照))に適合する適合部材を抽出して、適合部材情報Iadとして管理記憶部52に記憶させる。   In FIG. 3, the compatible member extracting unit 51c determines a request rank from a plurality of held members based on the production plan information Ipb and the owned member information Icb (see FIGS. 7 to 9) acquired by the production information acquiring unit 51a. The compatible member that matches the required member rank (required rank information Ial (see FIG. 10)) determined by the unit 51b is extracted and stored in the management storage unit 52 as the compatible member information Iad.

ここで図11〜図13を参照して、適合部材情報Iadについて説明する。図11に、吸着ノズル18bの適合部材情報Iad1の一例を示す。吸着ノズル18bの適合部材情報Iad1には、「部品名」欄131に実装基板に実装する部品Dの種別、「ノズル番号」欄132に部材番号、「ノズル種別」欄133に部材の種別、「要求部材ランク」欄134に部品Dを吸着する吸着ノズル18bの要求部材ランク、「部材ランク」欄135に吸着ノズル18bの現在の部材ランクが含まれている。ここでは、部品D(PA01)および部品D(PA02)を吸着する吸着ノズル18bとしてNA01とNA02、およびNA01とNA02とNB01と複数の適合部材が抽出されている。   Here, the compatible member information Iad will be described with reference to FIGS. FIG. 11 shows an example of the compatible member information Iad1 of the suction nozzle 18b. In the compatible member information Iad1 of the suction nozzle 18b, the “component name” column 131 indicates the type of the component D to be mounted on the mounting board, the “nozzle number” column 132 indicates the member number, the “nozzle type” column 133 indicates the member type, The “required member rank” column 134 includes the required member rank of the suction nozzle 18b that sucks the part D, and the “member rank” column 135 includes the current member rank of the suction nozzle 18b. Here, NA01 and NA02, NA01, NA02, NB01, and a plurality of compatible members are extracted as the suction nozzle 18b that sucks the part D (PA01) and the part D (PA02).

図12に、テープフィーダ17の適合部材情報Iad2の一例を示す。テープフィーダ17の適合部材情報Iad2には、「部品名」欄141に実装基板に実装する部品Dの種別、「フィーダ番号」欄142に部材番号、「フィーダ種別」欄143に部材の種別、「要求部材ランク」欄144に部品Dを供給するテープフィーダ17の要求部材ランク、「部材ランク」欄145にテープフィーダ17の現在の部材ランクが含まれている。ここでは、各部品D(PA01〜PA03、PA08)を供給するテープフィーダ17として複数の適合部材(FA01〜FA04)が抽出されている。   FIG. 12 shows an example of the compatible member information Iad2 of the tape feeder 17. The compatible member information Iad2 of the tape feeder 17 includes the “component name” column 141 in the type of the component D to be mounted on the mounting board, the “feeder number” column 142 in the member number, the “feeder type” column 143 in the member type, The required member rank of the tape feeder 17 that supplies the part D is included in the “required member rank” column 144, and the current member rank of the tape feeder 17 is included in the “member rank” column 145. Here, a plurality of compatible members (FA01 to FA04) are extracted as the tape feeder 17 that supplies each component D (PA01 to PA03, PA08).

図13に、実装ヘッド18の適合部材情報Iad3の一例を示す。実装ヘッド18の適合部材情報Iad3には、「部品名」欄151に実装基板に実装する部品Dの種別、「ヘッド番号」欄152に部材番号、「ヘッド種別」欄153に部材の種別、「要求部材ランク」欄154に部品Dを実装する実装ヘッド18の要求部材ランク、「部材ランク」欄155に実装ヘッド18の現在の部材ランクが含まれている。ここでは、部品D(PA08)を実装する実装ヘッド18としてHA01とHB01と複数(2つ)の適合部材が抽出されている。   FIG. 13 shows an example of the compatible member information Iad3 of the mounting head 18. In the compatible member information Iad3 of the mounting head 18, the “component name” column 151 includes the type of the component D to be mounted on the mounting board, the “head number” column 152 includes the member number, the “head type” column 153 includes the member type, “ The “required member rank” column 154 includes the required member rank of the mounting head 18 on which the component D is mounted, and the “member rank” column 155 includes the current member rank of the mounting head 18. Here, HA01, HB01, and a plurality of (two) compatible members are extracted as the mounting head 18 for mounting the component D (PA08).

なお、これらの例の適合部材抽出部51cが抽出する適合部材の部材ランクには、その部材を実装基板の生産に使用するために準備(部材庫9から払出)する時に予想される予想部材ランクが使用されている。より具体的には、その部材が対象実装基板の生産に使用されるまでにメンテナンスする予定がある場合は、予想部材ランクはメンテナンス後に予想される部材ランクが使用される。   Note that the member rank of the matching member extracted by the matching member extraction unit 51c in these examples is an expected member rank expected when the member is prepared (paid from the member store 9) for use in the production of the mounting board. Is used. More specifically, when the maintenance is scheduled before the member is used for the production of the target mounting board, the predicted member rank is the member rank expected after the maintenance.

また、その部材が対象実装基板の生産に使用される前に他の生産にも使用される場合は、予想部材ランクは生産に使用された後の累積使用時間などに基づいて予想される部材ランクが使用される。これによって、対象実装基板の生産開始までに時間がある場合であっても、より正確な部材ランクに基づいて、実装基板の生産で使用する部材を適切に準備することができる。   In addition, when the member is used for other productions before it is used for the production of the target mounting board, the expected member rank is the expected member rank based on the accumulated usage time after being used for production. Is used. Thereby, even if there is a time until the production of the target mounting board is started, it is possible to appropriately prepare a member used in the production of the mounting board based on a more accurate member rank.

図3において、使用部材選択部51dは、適合部材抽出部51cが抽出した適合部材(図11〜図13参照)の中から実装基板の生産で使用する使用部材を選択して、使用部材情報Isdとして管理記憶部52に記憶させる。   In FIG. 3, the used member selection unit 51d selects a used member to be used in the production of the mounting board from the matching members (see FIGS. 11 to 13) extracted by the matching member extraction unit 51c, and uses member information Isd. Is stored in the management storage unit 52.

ここで図14を参照して、使用部材情報Isdについて説明する。図14(a)に、吸着ノズル18bの使用部材情報Isd1の一例を示す。吸着ノズル18bの使用部材情報Isd1には、「ノズル番号」欄161に部材番号、「ノズル種別」欄162に部材の種別、「要求部材ランク」欄163に要求部材ランク、「部材ランク」欄164に現在の部材ランクが含まれている。   Here, the used member information Isd will be described with reference to FIG. FIG. 14A shows an example of use member information Isd1 of the suction nozzle 18b. In the used member information Isd1 of the suction nozzle 18b, the “nozzle number” column 161 has a member number, the “nozzle type” column 162 has a member type, the “required member rank” column 163 has a required member rank, and the “member rank” column 164 has. Contains the current member rank.

図14(b)に、テープフィーダ17の使用部材情報Isd2の一例を示す。テープフィーダ17の使用部材情報Isd2には、「フィーダ番号」欄165に部材番号、「フィーダ種別」欄166に部材の種別、「要求部材ランク」欄167に要求部材ランク、「部材ランク」欄168に現在の部材ランクが含まれている。図14(c)に、実装ヘッド18の使用部材情報Isd3の一例を示す。実装ヘッド18の使用部材情報Isd3には、「ヘッド番号」欄169に部材番号、「ヘッド種別」欄170に部材の種別、「要求部材ランク」欄171に要求部材ランク、「部材ランク」欄172に現在の部材ランクが含まれている。   FIG. 14B shows an example of the used member information Isd2 of the tape feeder 17. The used member information Isd2 of the tape feeder 17 includes a “feeder number” column 165, a member number, a “feeder type” column 166, a member type, a “required member rank” column 167, a required member rank, and a “member rank” column 168. Contains the current member rank. FIG. 14C shows an example of the used member information Isd3 of the mounting head 18. The used member information Isd3 of the mounting head 18 includes a member number in the “head number” column 169, a member type in the “head type” column 170, a required member rank in the “required member rank” column 171, and a “member rank” column 172. Contains the current member rank.

図3において、部材準備指示部51eは、使用部材選択部51dが選択した使用部材を準備する指示を生成して、準備指示情報Peaとして管理記憶部52に記憶させる。   In FIG. 3, the member preparation instructing unit 51e generates an instruction to prepare the used member selected by the used member selecting unit 51d, and stores it in the management storage unit 52 as the preparation instruction information Pea.

ここで図15を参照して、準備指示情報Pea(Peb,Pec)の一例について説明する。準備指示情報Peaには、「部材番号」欄181に準備する吸着ノズル18b、テープフィーダ17、実装ヘッド18などの部材の部材番号、「部材種別」欄182に部材の種別、「要求部材ランク」欄183に準備する部材の要求部材ランクが含まれている。   Here, an example of the preparation instruction information Pea (Peb, Pec) will be described with reference to FIG. The preparation instruction information Pea includes the member numbers of the suction nozzle 18b, tape feeder 17, and mounting head 18 to be prepared in the “member number” column 181, the member type in the “member type” column 182, and “required member rank”. The column 183 includes the required member rank of the member to be prepared.

図3において、未達部材抽出部51fは、適合部材抽出部51cが実装基板の生産に必要な数の適合部材を抽出できない場合、複数の保有部材のうち、要求部材ランクを満たさないランク未達部材を抽出して、未達部材情報Iudとして管理記憶部52に記憶させる。   In FIG. 3, the unreached member extraction unit 51f, when the matching member extraction unit 51c cannot extract the number of matching members necessary for the production of the mounting board, among the plurality of holding members, the rank that does not satisfy the required member rank is not reached. The member is extracted and stored in the management storage unit 52 as unreached member information Iud.

ここで図16を参照して、未達部材情報Iudについて説明する。図16(a)に、吸着ノズル18bの未達部材情報Iud1の一例を示す。吸着ノズル18bの未達部材情報Iud1には、「ノズル番号」欄191に部材番号、「ノズル種別」欄192に部材の種別、「要求部材ランク」欄193に要求部材ランク、「部材ランク」欄194に現在の部材ランクが含まれている。ここでは、吸着ノズル18bの使用部材情報Isd1(図14(a)参照)のうち、ノズル番号がNA02とND01の2つの吸着ノズル18bがランク未達部材として抽出されている。   Here, the unreached member information Iud will be described with reference to FIG. FIG. 16A shows an example of unreached member information Iud1 of the suction nozzle 18b. The unreached member information Iud1 of the suction nozzle 18b includes a member number in the “nozzle number” column 191, a member type in the “nozzle type” column 192, a required member rank in the “required member rank” column 193, and a “member rank” column. 194 includes the current member rank. Here, in the use member information Isd1 (see FIG. 14A) of the suction nozzle 18b, two suction nozzles 18b with nozzle numbers NA02 and ND01 are extracted as rank unachieved members.

図16(b)に、テープフィーダ17の未達部材情報Iud2の一例を示す。テープフィーダ17の未達部材情報Iud2には、「フィーダ番号」欄195に部材番号、「フィーダ種別」欄196に部材の種別、「要求部材ランク」欄197に要求部材ランク、「部材ランク」欄198に現在の部材ランクが含まれている。ここでは、テープフィーダ17の使用部材情報Isd2(図14(b)参照)のうち、フィーダ番号がFA02のテープフィーダ17がランク未達部材として抽出されている。   FIG. 16B shows an example of the unreached member information Iud2 of the tape feeder 17. The unreached member information Iud2 of the tape feeder 17 includes a “feeder number” column 195, a member number, a “feeder type” column 196, a member type, a “required member rank” column 197, a requested member rank, and a “member rank” column. 198 contains the current member rank. Here, the tape feeder 17 with the feeder number FA02 is extracted as the unranked member from the used member information Isd2 of the tape feeder 17 (see FIG. 14B).

図16(c)に、実装ヘッド18の未達部材情報Iud3の一例を示す。実装ヘッド18の未達部材情報Iud3には、「ヘッド番号」欄199に部材番号、「ヘッド種別」欄200に部材の種別、「要求部材ランク」欄201に要求部材ランク、「部材ランク」欄202に現在の部材ランクが含まれている。ここでは、実装ヘッド18の使用部材情報Isd3(図14(c)参照)には、現在の部材ランクが要求部材ランクを満たさない実装ヘッド18が存在しないため、ランク未達部材は抽出されていない。   FIG. 16C shows an example of unreached member information Iud3 of the mounting head 18. The unreachable member information Iud3 of the mounting head 18 includes a member number in the “head number” column 199, a member type in the “head type” column 200, a required member rank in the “required member rank” column 201, and a “member rank” column. 202 includes the current member rank. Here, since the mounting member 18 whose current member rank does not satisfy the required member rank does not exist in the used member information Isd3 (see FIG. 14C) of the mounting head 18, a member that has not reached the rank is not extracted. .

図3において、部材処理指示部51gは、未達部材抽出部51fが抽出したランク未達部材の現在の部材ランクが要求部材ランクを満たすためのメンテナンスなどの処理をする指示を生成して、処理指示情報Pmaとして管理記憶部52に記憶させる。また、部材処理指示部51gは、ランク未達部材の処理に要する時間などに基づいて、その部材が実装基板の生産に必要となる日時までにランク未達部材の処理が終了しないと判断した場合は、その旨を管理コンピュータ2の表示部54に報知させる。なお、その旨を携帯端末11または部材管理装置7に送信し、携帯端末11のタッチパネル13または部材管理装置7の表示部44に報知させるようにしてもよい。   In FIG. 3, the member processing instruction unit 51 g generates an instruction to perform a process such as maintenance for the current member rank of the rank unachieved member extracted by the unreached member extraction unit 51 f to satisfy the required member rank. The information is stored in the management storage unit 52 as the instruction information Pma. In addition, when the member processing instruction unit 51g determines that the processing of the rank unachieved member does not end by the date and time when the member is required for the production of the mounting board based on the time required to process the rank unachieved member Informs the display unit 54 of the management computer 2 to that effect. Note that this may be transmitted to the mobile terminal 11 or the member management apparatus 7 so that the touch panel 13 of the mobile terminal 11 or the display unit 44 of the member management apparatus 7 is notified.

ここで図17を参照して、処理指示情報Pma(Pmb,Pmc)の一例について説明する。処理指示情報Pmaには、「部材番号」欄211に処理をする吸着ノズル18b、テープフィーダ17、実装ヘッド18などの部材の部材番号、「部材種別」欄212に部材の種別、「要求部材ランク」欄213に処理後に期待される要求部材ランク、「部材ランク」欄214に現在の部材ランク、「終了予定日時」欄215に処理が終了することが期待される日時が含まれている。   Here, an example of the processing instruction information Pma (Pmb, Pmc) will be described with reference to FIG. In the processing instruction information Pma, the member number of the member such as the suction nozzle 18b, the tape feeder 17 and the mounting head 18 to be processed in the “member number” column 211, the member type, “required member rank” in the “member type” column 212 ”Column 213 includes a requested member rank expected after processing,“ member rank ”column 214 includes the current member rank, and“ scheduled end date and time ”column 215 includes the date and time when processing is expected to end.

次に図4を参照して、携帯端末11の制御系の構成について説明する。携帯端末11は、端末制御部61、端末記憶部62、端末側通信部12、タッチパネル13を備えている。端末側通信部12は、無線通信によって管理コンピュータ2、部材管理装置7との間で情報の授受を行う。端末制御部61はCPU機能を備える演算装置であり、指示取得部61a、表示処理部61bなどの内部処理部を有している。端末記憶部62は記憶装置であり、準備指示情報Pec、処理指示情報Pmcなどを記憶する。指示取得部61aは、管理コンピュータ2から準備指示情報Pea(図15参照)、処理指示情報Pma(図17参照)を取得して、準備指示情報Pec、処理指示情報Pmcとして端末記憶部62に記憶させる。   Next, the configuration of the control system of the mobile terminal 11 will be described with reference to FIG. The mobile terminal 11 includes a terminal control unit 61, a terminal storage unit 62, a terminal side communication unit 12, and a touch panel 13. The terminal-side communication unit 12 exchanges information with the management computer 2 and the member management device 7 by wireless communication. The terminal control unit 61 is an arithmetic device having a CPU function, and has internal processing units such as an instruction acquisition unit 61a and a display processing unit 61b. The terminal storage unit 62 is a storage device and stores preparation instruction information Pec, processing instruction information Pmc, and the like. The instruction acquisition unit 61a acquires preparation instruction information Pea (see FIG. 15) and processing instruction information Pma (see FIG. 17) from the management computer 2, and stores them in the terminal storage unit 62 as preparation instruction information Pec and processing instruction information Pmc. Let

表示処理部61bは、準備指示情報Pecに基づいて、作業者が実装基板の生産に使用する部材を準備(払出)するための操作画面を作成してタッチパネル13に表示させる。また、表示処理部61bは、処理指示情報Pmcに基づいて、作業者がランク未達部材の部材ランクが要求部材ランクを満たすための部材の清掃、部材の調整、部材の評価情報の更新をするための操作画面を作成してタッチパネル13に表示させる。すなわち、部材処理指示部51gが指示する要求部材ランクを満たすための処理は、部材の清掃、部材の調整、部材の評価情報の更新の少なくともいずれかである。部材の清掃、調整(メンテナンス)によって、部材の状態を回復させて部品実装の品質、エラー率を適正な水準に保つことができる。   Based on the preparation instruction information Pec, the display processing unit 61b creates an operation screen for an operator to prepare (pay out) a member to be used for production of the mounting board and display the operation screen on the touch panel 13. In addition, based on the processing instruction information Pmc, the display processing unit 61b allows the worker to clean the member, adjust the member, and update the member evaluation information so that the member rank of the member that has not reached the rank satisfies the required member rank. An operation screen is created and displayed on the touch panel 13. That is, the process for satisfying the required member rank instructed by the member processing instruction unit 51g is at least one of member cleaning, member adjustment, and member evaluation information update. By cleaning and adjusting (maintenance) the member, the state of the member can be recovered and the component mounting quality and error rate can be maintained at appropriate levels.

このように、管理コンピュータ2は、基板情報Iba(Ibb)と部品情報Ida(Idb)と生産計画情報Ipa(Ipb)と保有部材情報Ica(Icb)を取得する生産情報取得部51aと、実装基板の生産に適した部材(吸着ノズル18b、テープフィーダ17、実装ヘッド18)の要求部材ランクを決定する要求ランク決定部51bと、要求部材ランクに適合する適合部材を抽出する適合部材抽出部51cと、実装基板の生産で使用する使用部材を選択する使用部材選択部51dと、使用部材を準備する指示を生成する部材準備指示部51eを備える部材準備装置となる。この部材準備装置によって、実装基板の生産で使用する部材を必要な部材ランクに基づいて適切に準備することができる。   As described above, the management computer 2 includes the production information acquisition unit 51a that acquires the board information Iba (Ibb), the part information Ida (Idb), the production plan information Ipa (Ipb), and the possessed member information Ica (Icb), and the mounting board. A required rank determining unit 51b for determining a required member rank of members (suction nozzle 18b, tape feeder 17 and mounting head 18) suitable for production, and a compatible member extracting unit 51c for extracting a compatible member that matches the required member rank; The member preparing device includes a used member selecting unit 51d that selects a used member to be used in the production of the mounting board, and a member preparing instruction unit 51e that generates an instruction to prepare the used member. By this member preparation device, the members used in the production of the mounting board can be appropriately prepared based on the necessary member rank.

また、管理コンピュータ2は、基板情報Iba(Ibb)と部品情報Ida(Idb)と生産計画情報Ipa(Ipb)と保有部材情報Ica(Icb)を取得する生産情報取得部51aと、実装基板の生産に適した部材の要求部材ランクを決定する要求ランク決定部51bと、要求部材ランクに適合する適合部材を抽出する適合部材抽出部51cと、必要な数の適合部材を抽出できない場合、複数の所有部材のうち要求部材ランクを満たさないランク未達部材を抽出する未達部材抽出部51fと、ランク未達部材の部材ランクが要求部材ランクを満たすための処理をする指示を生成する部材処理指示部51gを備える部材処理装置となる。この部材処理装置によって、部材を実装基板の生産で使用するのに適切なタイミングでメンテナンスなどの処理をすることができる。   The management computer 2 also includes a production information acquisition unit 51a that acquires board information Iba (Ibb), component information Ida (Idb), production plan information Ipa (Ipb), and possessed member information Ica (Icb), and production of mounted boards. A required rank determining unit 51b for determining a required member rank of a member suitable for the case, a compatible member extracting unit 51c for extracting a compatible member that matches the required member rank, and a plurality of owned members if a required number of compatible members cannot be extracted. Of the members, the unreached member extraction unit 51f that extracts a member that does not satisfy the required member rank, and a member processing instruction unit that generates an instruction to perform processing for satisfying the required member rank. It becomes a member processing apparatus provided with 51g. With this member processing apparatus, processing such as maintenance can be performed at an appropriate timing for using the member in the production of the mounting board.

次に図18のフローに沿って、部品実装システム1における部材管理方法について説明する。まず管理コンピュータ2において、生産情報取得部51aは、基板情報Ibb、部品情報Idb、生産計画情報Ipb、保有部材情報Icbを取得する(ST1:生産情報取得工程)。次いで要求ランク決定部51bは、実装基板に実装される部品Dの実装位置を含む基板情報Ibbと、実装基板に実装される部品の部品情報Idb(図5参照)に基づいて、実装基板の生産に適した部材(吸着ノズル18b、テープフィーダ17、実装ヘッド18)の要求部材ランク(要求ランク情報Ial(図10参照))を決定する(ST2:要求ランク決定工程)。   Next, a member management method in the component mounting system 1 will be described along the flow of FIG. First, in the management computer 2, the production information acquisition unit 51a acquires board information Ibb, component information Idb, production plan information Ipb, and possessed member information Icb (ST1: production information acquisition process). Next, the request rank determination unit 51b produces the mounting board based on the board information Ibb including the mounting position of the component D mounted on the mounting board and the component information Idb (see FIG. 5) of the component mounted on the mounting board. The required member rank (required rank information Ial (see FIG. 10)) of the members (suction nozzle 18b, tape feeder 17, mounting head 18) suitable for the above is determined (ST2: required rank determining step).

次いで適合部材抽出部51cは、実装基板の生産計画(生産計画情報Ipb)と、実装基板の生産で使用可能な複数の保有部材のそれぞれに部材ランクを紐付けた保有部材情報Icb(図7〜図9参照)に基づいて、複数の保有部材の中から要求ランク決定工程(ST2)で決定された要求部材ランクに適合する適合部材(適合部材情報Iad(図11〜図13参照))を抽出する(ST3:適合部材抽出工程)。なお、適合部材抽出工程(ST3)で抽出される適合部材の部材ランクは、現在の部材ランクに限定されることなく、その部材を準備する時に予想される予想部材ランクであってもよい。これによって、部材を適切に準備、メンテナンス(処理)することができる。   Next, the compatible member extraction unit 51c has a mounting board production plan (production plan information Ipb) and holding member information Icb in which a member rank is associated with each of a plurality of holding members that can be used in the production of the mounting board (FIG. 7 to FIG. 7). Based on FIG. 9), a compatible member (compatible member information Iad (see FIGS. 11 to 13)) that matches the required member rank determined in the required rank determination step (ST2) is extracted from a plurality of held members. (ST3: conforming member extraction step). Note that the member rank of the compatible member extracted in the compatible member extraction step (ST3) is not limited to the current member rank, and may be an expected member rank expected when the member is prepared. Thus, the member can be appropriately prepared and maintained (processed).

図18において、次いで未達部材抽出部51fは、適合部材抽出工程(ST3)において実装基板の生産に必要な数の適合部材が抽出できたか否かを判断する(ST4:適合部材数判断工程)。実装基板の生産に必要な数の適合部材が抽出できない場合(ST4においてNo)、未達部材抽出部51fは、複数の保有部材のうち、要求部材ランクを満たさないランク未達部材(未達部材情報Iud(図16参照))を抽出する(ST5:ランク未達部材抽出工程)。次いで未達部材抽出部51fは、ランク未達部材のメンテナンスなどの処理がその部材の使用日時に間に合うか否かを判断する(ST6:納期判断処理)。   In FIG. 18, the unreached member extraction unit 51 f then determines whether or not the number of compatible members necessary for the production of the mounting board has been extracted in the compatible member extraction step (ST3) (ST4: number of compatible members determination step). . When the required number of conforming members necessary for the production of the mounting board cannot be extracted (No in ST4), the unreached member extraction unit 51f has a rank unreachable member (unreachable member) that does not satisfy the required member rank among the plurality of retained members. Information Iud (see FIG. 16)) is extracted (ST5: rank unachieved member extraction step). Next, the unreached member extraction unit 51f determines whether or not processing such as maintenance of the rank unreached member is in time for the use date and time of the member (ST6: delivery date determination process).

処理が使用日時に間に合わない場合(ST6においてNo)、処理が使用日時に間に合わない旨が管理コンピュータ2の表示部54、または携帯端末11のタッチパネル13、部材管理装置7の表示部44に報知される(ST7:報知工程)。処理が使用日時に間に合う場合(ST6においてYes)、部材処理指示部51gは、ランク未達部材抽出工程(ST5)で抽出されたランク未達部材の部材ランクが要求部材ランクを満たすための処理をする指示(処理指示情報Pma(図17参照))を生成する(ST8:部材処理指示工程)。   When the process is not in time for the use date and time (No in ST6), the display unit 54 of the management computer 2, the touch panel 13 of the portable terminal 11, and the display unit 44 of the member management device 7 are notified that the process is not in time for the use date and time. (ST7: Notification step). When the process is in time for the use date and time (Yes in ST6), the member processing instruction unit 51g performs a process for satisfying the member rank of the member that has not reached the rank extracted in the rank unachieved member extraction step (ST5). Instruction (processing instruction information Pma (see FIG. 17)) is generated (ST8: member processing instruction process).

図18において、次いで部材管理エリア4において、処理指示(処理指示情報Pmb)を取得した部材管理装置7のプリンタ45が印刷した指示、処理指示(処理指示情報Pmc)を取得した携帯端末11のタッチパネル13に表示された指示などに従って、作業者によって部材の清掃、部材の調整のメンテナンスや、部材の評価情報の更新などの処理が実行される(ST9:処理実行工程)。これによって、ランク未達部材の部材ランクが要求部材ランクを満たす適合部材となる。   18, in the member management area 4, the touch panel of the portable terminal 11 that has acquired the instruction and processing instruction (processing instruction information Pmc) printed by the printer 45 of the member management apparatus 7 that has acquired the processing instruction (processing instruction information Pmb). In accordance with the instruction displayed in FIG. 13 and the like, processing such as member cleaning, member adjustment maintenance, and member evaluation information update is performed by the operator (ST9: processing execution step). As a result, the member rank of the member that has not reached the rank satisfies the required member rank.

適合部材数判断工程(ST4)において実装基板の生産に必要な数の適合部材が抽出できたと判断された場合(ST4においてNo)、または、処理実行工程(ST9)が実行されてランク未達部材が適合部材となった場合、もしくは、処理実行工程(ST9)が実行される見込みがある場合は、実装基板の生産に必要な数の適合部材があることになる。そこで、使用部材選択部51dは、適合部材抽出工程(ST3)で抽出された適合部材の中から実装基板の生産で使用する使用部材(使用部材情報Isd(図14参照))を選択する(ST10:使用部材選択工程)。   When it is determined that the number of compatible members necessary for the production of the mounting board has been extracted in the compatible member number determining step (ST4), or the processing execution step (ST9) is executed and the rank unachieved member Is a compatible member, or when the process execution step (ST9) is expected to be executed, there are as many compatible members as necessary for the production of the mounting board. Therefore, the used member selection unit 51d selects a used member (used member information Isd (see FIG. 14)) to be used in the production of the mounting board from the compatible members extracted in the compatible member extraction step (ST3) (ST10). : Used member selection step).

次いで部材準備指示部51eは、使用部材選択工程(ST10)で選択した使用部材を準備する指示(準備指示情報Pea(図15参照))を生成する(ST11:部材準備指示工程)。次いで部材管理エリア4において、準備指示(準備指示情報Peb)を取得した部材管理装置7のプリンタ45が印刷した指示、準備指示(準備指示情報Pec)を取得した携帯端末11のタッチパネル13に表示された指示などに従って、作業者によって使用部材の準備(払出)が実行される(ST12:準備実行工程)。これによって、部材ランクが要求部材ランクを満たす実装基板の生産で使用される使用部材が準備(払出)される。   Next, the member preparation instructing unit 51e generates an instruction (preparation instruction information Pea (see FIG. 15)) for preparing the used member selected in the used member selecting step (ST10) (ST11: member preparation instructing step). Next, in the member management area 4, the instruction printed by the printer 45 of the member management apparatus 7 that has acquired the preparation instruction (preparation instruction information Peb) and the preparation instruction (preparation instruction information Pec) are displayed on the touch panel 13 of the portable terminal 11. The member is prepared (dispensed) by the operator in accordance with the received instruction (ST12: preparation execution step). As a result, a member to be used that is used in the production of a mounting board whose member rank satisfies the required member rank is prepared (dispensed).

上記説明した部材管理方法において、要求ランク決定工程(ST2)、適合部材抽出工程(ST3)、使用部材選択工程(ST10)、部材準備指示工程(ST11)を含むフローは、使用部材を準備する部材準備方法となる。部材準備方法によって、実装基板の生産で使用する部材を必要な部材ランクに基づいて適切に準備することができる。   In the member management method described above, the flow including the required rank determining step (ST2), the compatible member extracting step (ST3), the used member selecting step (ST10), and the member preparation instructing step (ST11) is a member for preparing a used member. It becomes a preparation method. By the member preparation method, the members used in the production of the mounting board can be appropriately prepared based on the necessary member rank.

また、上記説明した部材管理方法において、要求ランク決定工程(ST2)、適合部材抽出工程(ST3)、ランク未達部材抽出工程(ST5)、部材処理指示工程(ST8)を含むフローは、ランク未達部材の部材ランクが要求部材ランクを満たすための処理をする部材処理方法となる。部材処理方法によって、部材を実装基板の生産で使用するのに適切なタイミングで処理することができる。   In the member management method described above, the flow including the required rank determination step (ST2), the compatible member extraction step (ST3), the rank unachieved member extraction step (ST5), and the member processing instruction step (ST8) is not ranked. This is a member processing method for performing processing so that the member rank of the reaching member satisfies the required member rank. By the member processing method, the member can be processed at an appropriate timing for use in the production of the mounting board.

本発明の部材準備方法および部材準備装置は、実装基板の生産で使用する部材を適切に準備することができるという効果を有し、部品を基板に実装する部品実装分野において有用である。   The member preparation method and member preparation apparatus of the present invention have an effect that members used in production of a mounting board can be appropriately prepared, and are useful in the component mounting field in which components are mounted on a board.

2 管理コンピュータ(部材準備装置)
17 テープフィーダ(部品供給装置)
18 実装ヘッド
18b 吸着ノズル
B 基板
D 部品
2 Management computer (component preparation device)
17 Tape feeder (part supply device)
18 Mounting head 18b Suction nozzle B Substrate D Component

Claims (12)

基板に部品を実装した実装基板に実装される部品の実装位置を含む基板情報と、前記実装基板に実装される部品の部品情報に基づいて、前記実装基板の生産に適した部材の要求部材ランクを決定する要求ランク決定工程と、
前記実装基板の生産計画と、前記実装基板の生産で使用可能な複数の部材のそれぞれに部材ランクを紐付けた保有部材情報に基づいて、前記複数の部材の中から前記要求ランク決定工程で決定された前記要求部材ランクに適合する適合部材を抽出する適合部材抽出工程と、
前記適合部材抽出工程で抽出された前記適合部材の中から前記実装基板の生産で使用する使用部材を選択する使用部材選択工程と、
前記使用部材選択工程で選択した前記使用部材を準備する指示を生成する部材準備指示工程と、を含む、部材準備方法。
The required member rank of the member suitable for the production of the mounting board based on the board information including the mounting position of the component mounted on the mounting board, and the component information of the component mounted on the mounting board. A request rank determination process for determining
Based on the production plan of the mounting board and possessed member information in which a member rank is associated with each of a plurality of members usable in the production of the mounting board, determined in the required rank determination step from the plurality of members A compatible member extraction step of extracting a compatible member that matches the required member rank,
A use member selection step of selecting a use member to be used in production of the mounting board from the adaptation members extracted in the adaptation member extraction step;
A member preparation instruction step for generating an instruction for preparing the member to be used selected in the member selection step.
前記部材ランクは、部材の累積使用時間、メンテナンス回数、最終メンテナンス後の経過時間の少なくともひとつに基づいて設定された部材状態ランクと、部材の部品実装回数あたりのエラー率、部材の使用期間あたりのエラー率、部材の評価情報の少なくともひとつに基づいて設定された部材品質ランクに基づいて決定される、請求項1に記載の部材準備方法。   The member rank is a member state rank set based on at least one of the cumulative use time of the member, the number of times of maintenance, and the elapsed time after the final maintenance, the error rate per the number of times the component is mounted, The member preparation method according to claim 1, wherein the member preparation method is determined based on a member quality rank set based on at least one of an error rate and member evaluation information. 前記適合部材抽出工程で抽出される適合部材の部材ランクは、その部材を準備する時の予想部材ランクである、請求項1または2に記載の部材準備方法。   The member preparation method according to claim 1 or 2, wherein the member rank of the compatible member extracted in the compatible member extraction step is an expected member rank when the member is prepared. 前記部材は、部品を吸着する吸着ノズル、装着された吸着ノズルと伴に移動されて基板に部品を実装する実装ヘッド、部品を実装ヘッドに供給する部品供給装置の少なくともいずれかである、請求項1から3のいずれかに記載の部材準備方法。   The component is at least one of a suction nozzle that sucks a component, a mounting head that is moved together with the mounted suction nozzle to mount the component on a substrate, and a component supply device that supplies the component to the mounting head. The member preparation method in any one of 1-3. 前記部品情報は、前記部品の種別、形状、サイズの少なくともいずれかである、請求項1から4のいずれかに記載の部材準備方法。   The member preparation method according to claim 1, wherein the component information is at least one of a type, a shape, and a size of the component. 前記要求ランク決定工程において、前記基板に実装される部品とその部品に隣接する部品との間隔に基づいて前記要求部材ランクが決定される、請求項1から5のいずれかに記載の部材準備方法。   6. The member preparation method according to claim 1, wherein, in the required rank determination step, the required member rank is determined based on an interval between a component mounted on the substrate and a component adjacent to the component. . 基板に部品を実装した実装基板に実装される部品の実装位置を含む基板情報と、前記実装基板に実装される部品の部品情報と、前記実装基板の生産計画と、前記実装基板の生産で使用可能な複数の部材のそれぞれに部材ランクを紐付けた保有部材情報とを取得する生産情報取得部と、
前記生産情報取得部が取得した前記基板情報と前記部品情報に基づいて、前記実装基板の生産に適した部材の要求部材ランクを決定する要求ランク決定部と、
前記生産情報取得部が取得した前記生産計画と前記保有部材情報に基づいて、前記複数の部材の中から前記要求ランク決定部が決定した前記要求部材ランクに適合する適合部材を抽出する適合部材抽出部と、
前記適合部材抽出部が抽出した前記適合部材の中から前記実装基板の生産で使用する使用部材を選択する使用部材選択部と、
前記使用部材選択部が選択した前記使用部材を準備する指示を生成する部材準備指示部と、を備える、部材準備装置。
Board information including the mounting position of the component mounted on the mounting board, the component information mounted on the mounting board, the production plan for the mounting board, and the mounting board used. A production information acquisition unit for acquiring possessed member information in which a member rank is associated with each of a plurality of possible members;
Based on the board information and the component information acquired by the production information acquisition unit, a request rank determination unit that determines a required member rank of a member suitable for production of the mounting board;
Based on the production plan acquired by the production information acquisition unit and the possessed member information, a compatible member extraction that extracts a compatible member that matches the required member rank determined by the required rank determination unit from among the plurality of members. And
A used member selecting unit for selecting a used member to be used in the production of the mounting board from the adapted members extracted by the adapted member extracting unit;
A member preparation device, comprising: a member preparation instruction unit that generates an instruction to prepare the use member selected by the use member selection unit.
前記部材ランクは、部材の累積使用時間、メンテナンス回数、最終メンテナンス後の経過時間の少なくともひとつに基づいて設定された部材状態ランクと、部材の部品実装回数あたりのエラー率、部材の使用期間あたりのエラー率、部材の評価情報の少なくともひとつに基づいて設定された部材品質ランクに基づいて決定される、請求項7に記載の部材準備装置。   The member rank is a member state rank set based on at least one of the cumulative use time of the member, the number of times of maintenance, and the elapsed time after the final maintenance, the error rate per the number of times the component is mounted, The member preparation device according to claim 7, wherein the member preparation device is determined based on a member quality rank set based on at least one of an error rate and member evaluation information. 前記適合部材抽出部が抽出する適合部材の部材ランクは、その部材を準備する時の予想部材ランクである、請求項7または8に記載の部材準備装置。   The member preparation apparatus according to claim 7 or 8, wherein the member rank of the matching member extracted by the matching member extraction unit is an expected member rank when the member is prepared. 前記部材は、部品を吸着する吸着ノズル、装着された吸着ノズルと伴に移動されて基板に部品を実装する実装ヘッド、部品を実装ヘッドに供給する部品供給装置の少なくともいずれかである、請求項7から9のいずれかに記載の部材準備装置。   The component is at least one of a suction nozzle that sucks a component, a mounting head that is moved together with the mounted suction nozzle to mount the component on a substrate, and a component supply device that supplies the component to the mounting head. The member preparation apparatus in any one of 7 to 9. 前記部品情報は、前記部品の種別、形状、サイズの少なくともいずれかである、請求項7から10のいずれかに記載の部材準備装置。   The member preparation device according to claim 7, wherein the component information is at least one of a type, a shape, and a size of the component. 前記要求ランク決定部は、前記基板に実装される部品とその部品に隣接する部品との間隔に基づいて前記要求部材ランクを決定する、請求項7から11のいずれかに記載の部材準備装置。   The member preparation device according to any one of claims 7 to 11, wherein the required rank determination unit determines the required member rank based on a distance between a component mounted on the board and a component adjacent to the component.
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