JP6248286B2 - Component mounting system and method for changing data for component mounting - Google Patents

Description

  The present invention relates to a component mounting system including a component mounting apparatus used for manufacturing a component mounting board, and a component mounting data changing method for changing component mounting data used for work in the component mounting apparatus.

  The component mounting system manufactures a component mounting board by mounting an electronic component (hereinafter referred to as “component”) on a substrate. The component mounting system is configured by connecting a plurality of component mounting devices such as a solder printing device, a print inspection device, a component mounting device, a mounting state inspection device, and a reflow device. Component mounting data such as work parameters for properly executing work operations in the component mounting device should be mounted when trouble or deterioration of production efficiency occurs in the component mounting device that is manufacturing the component mounting board. Change during board manufacturing to improve trouble and deterioration of production efficiency. (For example, refer to Patent Document 1).

JP-A-11-103196

  However, even if the component mounting data is changed, there is a case where the trouble or production efficiency does not change or the situation gets worse. Thereafter, even if the situation is improved by changing the component mounting data different from the previously changed portion, the change of the component mounting data of the previously changed portion is maintained. As a result, changes in the component mounting data that are unnecessary for improving the situation are finally maintained, and there is a possibility that new troubles and deterioration in production efficiency may occur due to the changes.

  Accordingly, the present invention provides a component mounting system and a component mounting data changing method capable of preventing troubles caused by unnecessary changes in component mounting data and deterioration of production efficiency and changing the data to appropriate component mounting data. The purpose is to provide.

  The component mounting system of the present invention is a component mounting system including a component mounting device used for manufacturing a component mounting board, and includes a work parameter for the component mounting device to perform a predetermined operation. A storage unit that stores data; a work control unit that controls work of the component mounting apparatus based on the component mounting data; an input unit that can input changes in the component mounting data by an operator; It is determined whether the work result of the component mounting apparatus after the change of the component mounting data via the input unit satisfies a predetermined condition, and if the predetermined condition is not satisfied, And a data return control unit for returning to the component mounting data before the change.

  The component mounting data changing method of the present invention is a component mounting data changing method for changing component mounting data including work parameters for a component mounting apparatus used for manufacturing a component mounting board to perform a predetermined operation. It is determined whether the work result of the component mounting apparatus after the component mounting data is changed by an operator satisfies a predetermined condition. If the predetermined condition is not satisfied, Return to the component mounting data before the change.

  According to the present invention, it is possible to prevent trouble and deterioration of production efficiency due to the change of the component mounting data, and change the data to appropriate component mounting data.

Configuration explanatory diagram of a component mounting system according to an embodiment of the present invention The figure which shows the component mounting data and monitoring item in the component mounting apparatus contained in the component mounting system of one embodiment of this invention The block diagram which shows the structure of the component mounting system of one embodiment of this invention Flow chart of data changing process in component mounting data changing method of one embodiment of the present invention Explanatory drawing of the component information screen in the component mounting system of one embodiment of this invention Explanatory drawing of the condition setting screen in the component mounting system of one embodiment of this invention Explanatory drawing of the notification screen in the component mounting system of one embodiment of this invention

  Next, an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the component mounting system 1 will be described with reference to FIG. FIG. 1 is a configuration explanatory diagram of a component mounting system according to the present embodiment. The component mounting system 1 is a device group or a device used for manufacturing a component mounting board. In the present embodiment, the component mounting system 1 includes a component mounting line 1a in which a plurality of component mounting apparatuses are connected, a line overall control device 4 that controls the component mounting line 1a, and another component mounting line 1a (not shown). A host control device 3 that controls a plurality of line control devices 4 including another line control device 4 that controls the network, and a communication network 2 that connects them.

  The component mounting line 1a is a component mounting device, which is a substrate supply device M1, a substrate delivery device M2, a solder printing device M3, a print inspection device M4, a first component mounting device M5, a second component mounting device M6, and a mounting state inspection. The apparatus M7, the reflow apparatus M8, and the substrate recovery apparatus M9 are connected in series. The board supply device M1 has a function of supplying a board to be mounted, the board delivery apparatus M2 has a function of delivering a board to be mounted, and the board collection device M9 has a function of collecting a completed component mounting board.

  The solder printing apparatus M3 prints solder on the board to be mounted. The print inspection apparatus M4 inspects the state of the solder printed on the board. The first component mounting device M5 and the second component mounting device M6 each mount components on the substrate. The mounting state inspection device M7 inspects the state of components mounted on the board. The reflow device M8 heats the substrate to cure the solder. Each of the substrate supply device M1 to the substrate recovery device M9 is connected to the line integrated control device 4 via the communication network 2a.

  Each component mounting apparatus of the component mounting line 1a has a substrate transport mechanism for transporting a substrate, which are connected in series to form a substrate transport path. In the component mounting line 1a, the solder printing device M3, the print inspection device M4, the first component mounting device M5, the second component mounting device M6, and the mounting state inspection device M7 are applied to the substrate conveyed along the substrate conveyance path. Then, a component mounting operation for mounting the component is performed by the reflow device M8. More specifically, the board supplied by the board supply apparatus M1 is carried into the solder printing apparatus M3 via the board delivery apparatus M2, and a solder printing operation for screen printing solder for component joining on the board is performed here. The board after the solder printing is delivered to the print inspection apparatus M4, where the print inspection work of the solder printed on the board is performed.

  The board after the printing inspection is sequentially transferred to the first component mounting apparatus M5 and the second component mounting apparatus M6, where a component mounting operation for mounting the components on the solder printed board is executed. The board after mounting the components is carried into the mounting state inspection apparatus M7, where the mounting state inspection work for the components mounted on the substrate is performed. Then, the board after the mounting state inspection is carried into the reflow apparatus M8, where it is heated in accordance with a predetermined heating profile, so that the solder for joining the components is melted and solidified. As a result, the component is soldered to the substrate, and a component mounting substrate in which the component is mounted on the substrate is completed, and is recovered by the substrate recovery device M9.

  In such a component mounting board manufacturing process, in order to maintain the quality and productivity of the component mounting board, monitoring items that serve as indicators such as component mounting work accuracy and frequency of component mounting work errors in the component mounting device Is measured and monitored. The device or the operator determines that the value of the monitoring item is bad. If the value is bad, the component mounting data is changed by the operator and adjustment / improvement of the component mounting work is executed. Whether or not the value of the monitoring item is bad may be determined based on whether or not a predetermined condition predetermined on the apparatus is satisfied, or may be determined based on the subjectivity of the operator. Here, an example of component mounting data and monitoring items of each component mounting apparatus will be described with reference to FIG.

  In FIG. 2, in the component mounting apparatus row 5, the flow of the component mounting apparatus and the board being manufactured is indicated by arrows. The component mounting data string 6 shows an example of component mounting data that is changed to improve quality and productivity. In the monitoring item column 7, monitoring items to be measured and monitored for maintaining quality and productivity and the direction of monitoring are indicated by arrows. The direction of monitoring here represents the component mounting apparatus being monitored by the arrow, and the component mounting apparatus to be monitored by the tip of the arrow. In each component mounting device, monitoring items that serve as indicators such as component mounting work accuracy and component mounting work errors are measured and monitored by signals from various sensors arranged in each part of the mechanism and timers of the control device. Yes. Hereinafter, it demonstrates along the flow of a board | substrate.

  The state of the solder printed on the substrate by the solder printing operation which is the component mounting operation in the solder printing apparatus M3 is measured and monitored in the printing inspection operation which is the component mounting operation of the print inspection apparatus M4 in the next process. (Arrow 7a). In the solder printing operation, the printing mask is brought into contact with the substrate, the cream solder is supplied onto the printing mask, and the squeegee is slid at a predetermined squeegee moving speed while being pressed with a predetermined squeegee printing pressure. Here, the squeegee printing pressure and the squeegee moving speed are squeegee parameters for controlling the operation of the squeegee. Next, after sliding, the substrate is pulled away from the printing mask at a predetermined plate separation speed, whereby solder is printed on the substrate through the pattern holes formed in the printing mask.

  In the print inspection work, the solder printed on the board is measured to measure the solder shape, the solder printing work accuracy, which is the amount of solder misalignment of the solder with respect to the board, and solder such as solder bleeding, blurring, and bridges. Printing work mistakes are measured and monitored. Then, a ratio of the normal printing frequency to the solder printing operation frequency, that is, a solder printing pass rate that is a ratio of the normal printing frequency in which the solder printing work accuracy satisfies a predetermined standard without a mistake of the solder printing work is obtained. When the solder printing pass rate is poor, the operator can eliminate the solder printing work mistake by changing the component mounting data of the solder printing apparatus M3 including work parameters such as the squeegee printing pressure, the squeegee moving speed, and the plate separation speed. To improve. In this way, the solder printing pass rate is monitored as a monitoring item, and the component mounting data of the solder printing apparatus M3 is changed to improve quality and productivity.

  In the first component mounting apparatus M5 and the second component mounting apparatus M6 (hereinafter referred to as “component mounting apparatuses M5 and M6”), a component mounting operation that is a component mounting operation is executed. In the component mounting operation, the components are picked up and taken out from the component supply unit by the suction nozzle of the mounting head, recognized by the component recognition camera, and then transferred and mounted on the substrate by the suction nozzle. During the component mounting operation, various component mounting operation mistakes are monitored and detected (arrow 7b). The component mounting operation mistake includes a suction mistake when picking up and taking out a component from the component supply unit, and a recognition mistake occurring when recognizing a state where the picked-up component is held by the suction nozzle.

  When a suction error or recognition error occurs, the part that was the target of suction is discarded and suctioned and mounted with a new part. For this reason, if suction mistakes and recognition mistakes occur frequently, the disposal and production time of parts increase, and the production efficiency deteriorates. Therefore, monitoring items such as an adsorption rate, which is a ratio of the normal adsorption frequency that does not cause an adsorption error to the adsorption frequency, and a recognition rate, which is a ratio of the normal recognition frequency that does not cause an identification error to the recognition frequency, are monitored.

  When the suction rate is poor, the worker improves the production efficiency by changing the component mounting data including the suction parameter that is a work parameter. That is, the nozzle lowering speed for lowering the suction nozzle relative to the part, the suction height when the suction nozzle is sucked to the part, the suction waiting time from when the part is supplied to the part supply unit to the suction, the suction nozzle after suction The adsorption parameters such as the nozzle ascending speed for raising the pressure are changed. Similarly, when the recognition rate is poor, the operator recognizes the component from the image data captured by the component recognition camera, the suction nozzle height at the time of imaging, and the component held by the suction nozzle passes through the component recognition camera. Production efficiency is improved by changing recognition parameters such as speed and brightness of the illumination at the time of imaging.

  In the mounting state inspection apparatus M7, a mounting state inspection operation that is a component mounting operation is performed. In the mounting state inspection work, by measuring the components transferred and mounted on the substrate, the mounted components generated when the components are transferred to the substrate by the suction nozzles in the component mounting apparatuses M5 and M6 are placed at predetermined positions. The mounting position deviation or the like deviated is measured and monitored as a monitoring item (arrow 7c). If the mounting position deviation is bad, the operator attempts to improve the component mounting apparatuses M5 and M6 by changing component mounting data such as suction parameters and recognition parameters.

  Next, with reference to FIG. 3, the configurations of the solder printing device M3 to the mounting state inspection device M7, the line overall control device 4, and the host control device 3 will be described. The solder printing device M3, the print inspection device M4, the first component mounting device M5, the second component mounting device M6, and the mounting state inspection device M7 have the same configuration, and only the solder printing device M3 is illustrated here. The solder printing apparatus M3 includes a work control unit 10, a work unit 11, a storage unit 12, a data change unit 13, a condition achievement determination unit 14, an operation / input unit 15, a display unit 16, and a communication unit 17.

  The work control unit 10 controls the component mounting operation of the component mounting apparatus by controlling the working unit 11 based on the component mounting data. That is, the solder printing apparatus M3 controls the solder printing work, the print inspection apparatus M4 controls the printing inspection work, the first component mounting apparatus M5 and the second component mounting apparatus M6 control the component mounting work, and the mounting state inspection apparatus M7 controls the mounting state inspection work. Is done.

  The storage unit 12 stores component mounting data including work parameters necessary for the component mounting apparatus to execute a predetermined work, which is necessary for the control of the work unit 11 by the work control unit 10. The storage unit 12 also includes a data change history, which is a change history of component mounting data, a judgment condition including a judgment value of a monitoring item used for judgment of a condition achievement judgment unit 14 to be described later, and a judgment timing of condition achievement, A work history including work results that are work, measurement, and monitoring records of work is stored.

  The data change unit 13 performs data change processing such as data update processing for updating and changing the component mounting data, and data return processing for returning the component mounting data to the state after the update change. In addition, the data changing unit 13 stores various data stored in the storage unit 12 into other component mounting devices connected via the communication networks 2 and 2a, the line overall control device 4, and the storage unit 12 of the host control device 3. , 42, and 32 are synchronized.

  The condition achievement determination unit 14 is a condition in which monitoring items such as component mounting work accuracy and component mounting work error occurrence frequency in the component mounting apparatus are predetermined after the worker changes the component mounting data. A condition achievement determination process is performed to determine whether the condition is achieved. The operation / input unit 15 is an input device such as a keyboard, a touch panel, and a mouse. The operation / input unit 15 is used when inputting operation commands and data, and is an input unit that allows an operator to input change of component mounting data. The display unit 16 is a display device such as a liquid crystal panel, and displays a guidance screen at the time of operation by the operation / input unit 15 and various screens at the time of input and change of the component mounting data shown in FIGS. The communication unit 17 is a communication interface, and exchanges signals with other component mounting apparatuses and the line integrated control apparatus 4 via the communication network 2a.

  The line overall control device 4 includes a storage unit 42, a data change unit 43, a condition achievement determination unit 44, an operation / input unit 45, a display unit 46, and a communication unit 47. The storage unit 42 to display unit 46 have the same functions as the storage unit 12 to display unit 16 of the solder printing apparatus M3, respectively. The communication unit 47 is a communication interface, and exchanges signals between the solder printing device M3 to the mounting state inspection device M7 via the communication network 2a and the host control device 3 via the communication network 2.

  The host control device 3 includes a storage unit 32, a data change unit 33, a condition achievement determination unit 34, an operation / input unit 35, a display unit 36, and a communication unit 37. The storage unit 32 to the display unit 36 have the same functions as the storage unit 12 to the display unit 16 of the solder printing apparatus M3, respectively. The communication unit 37 is a communication interface, and exchanges signals with the line integrated control device 4 of the component mounting line 1a and the line integrated control device (not shown) of other component mounting lines via the communication network 2.

  The storage unit 12 of the solder printing device M3 to the mounting state inspection device M7, the storage unit 42 of the line overall control device 4, and the storage unit 32 of the host control device 3 store the data by executing data synchronization processing at a predetermined timing. Various data to be synchronized are synchronized with each other. Therefore, change of component mounting data and various notifications for each component mounting device are performed by any of the operation / input units 15 and 45 of the solder printing device M3 to the mounting state inspection device M7, the line overall control device 4, and the host control device 3. , 35, and the display units 16, 46, 36, the same processing can be executed.

  The component mounting system 1 according to the embodiment of the present invention is configured as described above. Next, the component mounting data changing method according to the embodiment of the present invention will be described with reference to the flow of FIG. It demonstrates with reference to ~ 7. During the production of component mounting boards in the component mounting system 1, deterioration of component mounting work accuracy and increase in frequency of component mounting work errors occur due to various causes, and the quality and productivity of component mounting boards May get worse. In other words, due to errors and variations in work operations of each component mounting device, changes in installation environment such as temperature and humidity, component manufacturing variations, etc., component mounting work accuracy, frequency of component mounting work errors, etc. Monitoring items may become worse.

  At that time, if the deterioration of the component mounting work accuracy or the increase in the frequency of component mounting work errors is not fatal to the manufacturing of the component mounting board, the component mounting data is Improvements in quality and productivity will be made. FIG. 4 shows a process for changing component mounting data that can improve quality and productivity while continuing to manufacture a component mounting board. This component mounting data changing process can be executed using any of the solder printing device M3 to the mounting state inspection device M7, the line overall control device 4, and the host control device 3, but in the following, the host control device 3 This will be described in an example using

  In the component mounting data change process, the operator first monitors the component mounting data to be updated and the monitoring items for determining that the situation has been improved by updating the component mounting data, The achievement condition which is the condition is input via the operation / input unit 35 (ST1: update data input step). Next, data update processing by the data changing unit 33 is executed, and the component mounting data, the achievement conditions, and the data change history are updated in the storage unit 32 (ST2: data update process). After the component mounting data is updated in the data update process (ST2), a component mounting board is manufactured based on the updated component mounting data (ST3: manufacturing process after data update).

  Next, in the post-data update manufacturing process (ST3), when it is time to achieve the set conditions such as the number of component-mounted boards manufactured and the elapsed manufacturing time, whether or not the set monitoring items have achieved the set conditions? Is determined (ST4: condition achievement determination step). If it is determined in the condition achievement determining step (ST4) that the condition for which the monitoring item is set has been achieved, the component mounting data is determined by the data updated in the data updating step (ST2) (ST5).

  In addition, the component mounting data determined in this way can be diverted to a component mounting apparatus of another component mounting line connected via the communication networks 2 and 2a. By diverting the component mounting data in this way, it is possible to improve the production efficiency by omitting additional trials even in the component mounting apparatus of other component mounting lines. If it is determined in the condition achievement determination step (ST4) that the condition set by the monitoring item has not been achieved, the data return process is performed and the component mounting data is updated in the data update step (ST2). (ST6: data return step).

  In this way, it is determined whether or not the work result of the component mounting apparatus after the component mounting data is changed by the worker satisfies the predetermined condition. If the predetermined result is not satisfied, the change is automatically made. Return to the previous component mounting data. That is, the condition achievement determination unit 34 and the data change unit 33 determine whether the work result of the component mounting apparatus after the change of the component mounting data via the input unit satisfies a predetermined condition, When the predetermined condition is not satisfied, the data return control unit automatically returns to the component mounting data before the change.

  If the expected improvement effect cannot be obtained, that is, if the predetermined conditions are not satisfied, the component mounting data is automatically returned to the original state, thereby preventing the problem that the production continues while the production efficiency deteriorates. it can. Furthermore, when the worker changes the component mounting data again as the next improvement measure, changing the other component mounting data while leaving the change without the improvement effect left undesirably deteriorates the situation. Can be prevented.

  Next, the display unit 36 notifies that the component mounting data has been returned before the change (ST7: notification step). That is, the display unit 36 serving as a notification unit notifies that the data return control unit has automatically returned the component mounting data before the change. In this way, when the component mounting data is automatically returned before the change without obtaining the expected improvement effect, the situation can be accurately conveyed to the operator by notifying that effect, The next work can be encouraged at an early stage. Furthermore, since it takes a certain amount of time for the component mounting data to be changed and the component mounting board to be manufactured and for the improvement effect to be judged, the worker who performs the next work takes over from the worker who changed the data. This is effective in preventing work mistakes in such cases.

  Next, a return data display process for displaying the data returned in the data return step (ST6) on the display unit 36 is executed (ST8: return data display step). That is, when the data return control unit automatically returns the component mounting data before the change, the component mounting data changed by the operator via the operation / input unit 35 as an input unit is a display unit. It is displayed on the display unit 36. In this way, when the component mounting data was automatically returned before the change without obtaining the expected improvement effect, the expected effect was not obtained in addition to the data before the change. By simultaneously displaying the component mounting data changed by the operator, it helps the next component mounting data change. In particular, it is effective to save the labor of checking the change history when a worker different from the worker who changed the component mounting data for improvement re-changes the component mounting data, which is the next task. is there.

  Next, the component information screen 51 displayed on the display unit 36 in the update data input step (ST1) and the return data display step (ST8) will be described with reference to FIG. The display unit 36 displays a “component information” 51 a indicating the title of the component information screen 51 and a product type display column 51 b for displaying the target product name of the component information screen 51.

  In the component information display column 51c, the “current value” display column 51f and the “previous change value” display column of the component mounting data corresponding to the monitoring items (here, the suction rate 51d, the recognition rate 51e,...). 51g is displayed. For example, as the component mounting data corresponding to the suction rate 51d, the nozzle lowering speed, the suction height, the suction waiting time, and the nozzle rising speed are displayed. In addition, as component mounting data corresponding to the recognition rate 51e, an algorithm, nozzle height, passage speed, brightness, and the like are displayed. Here, by operating the scroll bar 51h, the component information display column 51c can be scrolled up and down to display the component mounting data in the monitoring items other than the suction rate 51d and the recognition rate 51e.

  In the “current value” display column 51f, the numerical value of the current component mounting data is displayed. In the update data input step (ST1), the operator selects a column corresponding to the component mounting data to be updated, and inputs a numerical value to be updated via the operation / input unit 35. In the return data display step (ST8), the data before update returned in the data return step (ST6), which is the current numerical value, is displayed in the “current value” display column 51f. In the “previous change value” display column 51g, data before being returned in the return data display step (ST8), that is, the previous change value is displayed. In the return data display step (ST8), the component mounting data that is not returned, that is, the column for the component mounting data that has not been changed last time is displayed blank.

  By operating the operation button “Update” 51i in the update data input process (ST1), the data update process of the data update process (ST2) is executed. By operating the operation button “clear” 51j, the “current value” display field 51f being input returns to the current component mounting data stored in the storage unit 32 (the input is cleared). By operating the operation button “history” 51k, a transition is made to a history screen (not shown). By operating the operation button “condition setting” 51l, a transition is made to a condition setting screen 52 described later.

  Next, the condition setting screen 52 displayed on the display unit 36 in the update data input process (ST1) will be described with reference to FIG. A “condition setting screen” 52 a indicating the title of the condition setting screen 52 is displayed on the display unit 36. In the achievement condition display field 52b, an item selection check field 52c corresponding to the monitoring item, a “monitoring item” display field 52d, a “threshold” display field 52e, and a “judgment time” display field 52f are displayed. In the item selection check field 52c, the item selected as the achievement condition in the condition achievement determination step (ST4) and monitored to determine whether the condition has been achieved is displayed as “re”.

  In the “monitoring item” display field 52d, the monitoring item monitored in the condition achievement determination step (ST4) is displayed. In the “threshold” display field 52e, the threshold value for determining that the corresponding monitoring item has achieved the condition is “ In the “judgment time” display field 52f, the time when achievement is judged is displayed. In the example of FIG. 6, the suction rate is selected as the monitoring item. When the component mounting board is manufactured for 30 minutes after the component mounting data is updated in the data update process (ST2), for example, data It is determined whether the adsorption rate, which was 85% before the update, has improved by 10% to achieve 95% (95% or more). Further, by operating the operation button “add conditional expression” 52g, a transition is made to a conditional expression addition screen (not shown).

  Next, the notification screen 53 displayed on the display unit 36 in the notification step (ST7) will be described with reference to FIG. A “notification screen” 53 a indicating the title of the notification screen 53 is displayed on the display unit 36. In the notification column 53b, it is determined in the condition achievement judgment step (ST4) that the monitoring item has not fulfilled the condition, the fact that the component mounting data has been returned before the change, the achievement condition, and the data re-change A notification prompting selection is displayed. Then, by operating the operation button “Yes” 53c, the return data display process of the return data display step (ST8) is executed, and the screen transits to the component information screen 51. By operating the operation button “No” 53d, the notification step (ST7) is completed and the screen is changed to the next screen.

  As described above, in the present embodiment, the component mounting system 1 including the component mounting apparatus used for manufacturing the component mounting board has the operation parameters for the component mounting apparatus to execute a predetermined component mounting operation. The storage unit 12 that stores the component mounting data, the work control unit 10 that controls the component mounting work of the component mounting apparatus based on the component mounting data, and the operator can input changes to the component mounting data. The operation result of the component mounting apparatus after the operation / input unit 15 and the component mounting data changed via the operation / input unit 15 satisfy a predetermined condition. If not, a data return control unit that automatically returns to the component mounting data before the change is provided. As a result, if the improvement effect cannot be obtained, it is automatically returned to the component mounting data before the change, so that the change without the improvement effect is not neglected, and trouble or production caused by the change of the component mounting data The deterioration of efficiency can be prevented and the data can be changed to appropriate component mounting data.

  In the above embodiment, component mounting data in the component mounting system 1 including the solder printing device M3, the print inspection device M4, the component mounting devices M5 and M6, the mounting state inspection device M7, and the reflow device M8 as the component mounting devices. Although an example of the change method is shown, the present invention is not limited to these component mounting apparatuses. For example, an adhesive application device that applies an adhesive that adheres components to the substrate may be included. In addition, component mounting data, monitoring items, and achievement conditions (predetermined conditions) can be changed, monitored and judged in order to maintain the quality and productivity of the component mounting board in the component mounting board manufacturing process. Well, it is not limited to the example of the above embodiment.

  According to the present invention, it is possible to prevent troubles caused by changes in component mounting data and deterioration in production efficiency, and to have an effect of being able to change to appropriate component mounting data, and to manufacture a component mounting board. Useful in.

DESCRIPTION OF SYMBOLS 1 Component mounting system 12, 32, 42 Memory | storage part 10 Work control part 13, 33, 43 Data change part (data return control part)
14, 34, 44 Condition achievement determination unit (data return control unit)
15, 35, 45 Operation / input section (input section)
16, 36, 46 Display section (notification means, display means)

Claims (6)

A component mounting system including a component mounting apparatus used for manufacturing a component mounting board,
A storage unit for storing component mounting data including work parameters for the component mounting apparatus to perform a predetermined operation;
Based on the component mounting data, a work control unit that controls work of the component mounting apparatus;
An input unit capable of inputting a change in the component mounting data by an operator;
It is determined whether the work result of the component mounting apparatus after the change of the component mounting data via the input unit satisfies a predetermined condition, and if the predetermined condition is not satisfied, automatic A component mounting system comprising a data return control unit for returning to the component mounting data before change.   The component mounting system according to claim 1, further comprising notification means for notifying that the data return control unit has returned the component mounting data before the change.   3. The display unit according to claim 1, further comprising: a display unit configured to display the component mounting data changed via the input unit when the data return control unit returns the component mounting data before the change. Component mounting system. A component mounting data changing method for changing component mounting data including work parameters for a component mounting apparatus used for manufacturing a component mounting board to perform a predetermined work,
It is determined whether the work result of the component mounting apparatus after the component mounting data is changed by an operator satisfies a predetermined condition. The component mounting data changing method for returning to the component mounting data.   5. The component mounting data changing method according to claim 4, wherein when the component mounting data is automatically returned before the change, the fact is notified.   The component mounting data changing method according to claim 4 or 5, wherein when the component mounting data is automatically returned before the change, the component mounting data changed by an operator is displayed.

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