JP2018148794A - Power converter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power converter located on the side of a heating element, and ensuring sufficient protection against the heat radiated from the heating element.SOLUTION: A power converter 200 located on the side of a heating element 100 includes a first flow path formation body 216 forming a first flow path 215 for cooling a first electric circuit 213, a second flow path formation body 226 forming a second flow path 225 for cooling a second electric circuit 220, a relay flow path formation body 260 forming a relay flow path 261 connecting the first flow path 215 and second flow path 225, and a circuit board 240 having a circuit for driving or controlling the first electric circuit or second electric circuit. The relay flow path formation body 260 is placed in a space 110 sandwiched between the heating element 100 and circuit board 240.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a power conversion device.

  Vehicles such as hybrid vehicles, plug-in hybrid vehicles, and electric vehicles include power conversion devices such as inverters and converters. In order to increase the effective space of the vehicle, such a power conversion device may be arranged with a motor in a narrow space such as the bottom of a passenger compartment, for example.

Conventionally, the following inverter devices are known.
On one side of the motor generator, a power semiconductor module in which a semiconductor element is built in a water channel housing having good heat conductivity is accommodated. A heat radiation sheet and a capacitor are disposed on the other surface side of the water channel housing, and a control board is disposed on the capacitor. In this inverter device, the power semiconductor module having a large calorific value is cooled by the cooling water flowing inside the water channel housing. Moreover, the heat | fever which penetrate | invades into a capacitor | condenser from the outside is thermally radiated to a water channel housing | casing through a thermal radiation sheet (for example, patent document 1).

JP 2013-192367 A

  The power conversion device disposed on the side of the motor generator is affected not only by the heat from the power semiconductor module but also by the heat radiated from the motor generator which is also a heating element. In the inverter device described in Patent Document 1, protection against heat radiated from the motor generator is not sufficient.

  The power conversion device of the present invention is a power conversion device disposed on a side portion of a heating element, and includes a first flow path forming body that forms a first flow path for cooling the first electric circuit, and a second electric circuit. A second flow path forming body that forms a second flow path for cooling the first flow path, a relay flow path forming body that forms a relay flow path connecting the first flow path and the second flow path, a first electric circuit, and a second electric circuit And a circuit board having a circuit for driving or controlling any one of the circuits, and the relay flow path forming body is disposed in a space between the heating element and the circuit board.

  According to the power conversion device of the present invention, sufficient protection from the heat generated from the heating element can be achieved by the relay flow path forming body arranged in the space between the heating element and the circuit board.

The figure which shows arrangement | positioning of the power converter device and heat generating body of Embodiment 1 of this invention. The external appearance perspective view as Embodiment 2 which shows arrangement | positioning of the motor and power converter device of this invention. The disassembled perspective view as Embodiment 2 of the power converter device illustrated in FIG. 2 is an external perspective view showing the assembled state of the power converter shown in FIG. IV-IV sectional view taken on the line of FIG. VV sectional view taken on the line of FIG. The top view which looked at FIG. 4 from upper direction. The external appearance perspective view as Embodiment 3 which shows arrangement | positioning of the motor of this invention, and a power converter device. (A) is the front view seen from the y direction of FIG. 8, (b) is the figure which removed the cover member in (a). (A) is a perspective view of FIG.9 (b), (b) is an enlarged view of the area | region of the downward side of (a). The perspective view which shows the connection structure of a power semiconductor module and a capacitor | condenser element. FIG. 12 is an exploded perspective view of FIG. 11. FIG. 13 is an exploded perspective view of the capacitor module and positive / negative side DC bus bars shown in FIG. 12. Sectional drawing which shows the structure in a capacitor | condenser case. The figure which removed the power semiconductor module in FIG. 12, and was seen from the y direction.

Embodiment 1
With reference to FIG. 1, the power converter device 200 of Embodiment 1 is demonstrated.
The power conversion device 200 according to the first embodiment is disposed on the side of a heating element (for example, the motor 100, hereinafter referred to as the heating element 100). The power conversion device 200 includes a first electric circuit 210, a second electric circuit 220, and a circuit board 240 having a circuit for driving and controlling at least one of the first electric circuit 210 and the second electric circuit 220. Since the first and second electric circuits 210 and 220 and the circuit board 240 are disposed on the side of the heating element 100, the temperature further increases due to the heat from the heating element 100 in addition to the temperature increase due to the heat generated by itself. Cheap. Therefore, in the power conversion device 200 of the first embodiment, the first flow path forming body 216 that forms the first flow path 215 that cools the first electric circuit 210 and the second flow path 225 that cools the second electric circuit 220. A second flow path forming body 226 that forms the first flow path, and a relay flow path 261 that connects the first flow path 215 and the second flow path 225, and is a relay flow disposed in a space between the heating element 100 and the circuit board 240. A path forming body 260.
As described above, in the power conversion device 200 according to the first embodiment, the relay flow path forming body 260 is arranged in the space between the heating element 100 and the circuit board 240. For this reason, the heat radiated from the heating element 100 toward the circuit board 240 can be absorbed by the cooling water flowing through the relay flow path forming body 260, and the temperature rise of the circuit board 240 can be suppressed. Moreover, since the power converter device 200 is cooled by the relay flow path formation body 260, the cooling capacity of the power converter device 200 can be improved.

Embodiment 2
Hereinafter, Embodiment 2 of the present invention will be described with reference to FIGS.
(overall structure)
FIG. 2 is an external perspective view showing the arrangement of the motor and the power converter according to the second embodiment of the present invention.
The power conversion device 200 is disposed on the side portion of the motor 100. When the power conversion device 200 is projected from the z direction, the entire power conversion device 200 is disposed within the projection region of the motor 100. The motor 100 is an electric motor or an electric motor / generator operable by switching between an electric motor and a generator. The motor 100 includes a motor rotation shaft 101, a motor rotor and a motor stator (not shown). The motor 100 is used, for example, in a vehicle such as a hybrid vehicle or an electric vehicle. The motor 100 generates a running torque of the automobile, and thus consumes high power and becomes a heating element. The power conversion device 200 includes a case member 201 having a cylindrical upper surface 201 a along the outer periphery of the motor 100. The motor 100 is placed on the upper surface 201 a of the case member 201.
In the following description, the x direction, the y direction, and the z direction are as illustrated.

(Power converter)
FIG. 3 is an exploded perspective view of the power conversion device illustrated in FIG. 2 as a second embodiment, and FIG. 4 is an external perspective view illustrating an assembled state of the power conversion device illustrated in FIG. 3. 5 is a cross-sectional view taken along the line IV-IV in FIG. 4, and FIG. 6 is a cross-sectional view taken along the line V-V in FIG. 3 to 5, the case member 201 is not shown.
The power conversion device 200 includes a base 270, a capacitor module 210, three power semiconductor modules 220a to 220c, a circuit board 240, a relay flow path forming body 260, a semiconductor case 221, and other electronic components. .
Capacitor module 210 is a capacitor that is connected to a direct current battery (not shown) mounted on the vehicle and smoothes direct current from the direct current battery.
Although not shown, each power semiconductor module 220a to 220c includes an inverter circuit formed by power semiconductor elements such as IGBTs and diodes. Each of the power semiconductor modules 220a to 220c is connected to the capacitor module 210 and converts the DC power from the capacitor module 210 into AC power.

(Second flow path forming body)
The semiconductor case 221 is a rectangular frame-shaped member, and three openings 221a to 221c are provided on one side surface 221d parallel to the x direction. The semiconductor case 221 is formed of a member having good thermal conductivity such as an aluminum alloy. In the semiconductor case 221, three power semiconductor modules 220a to 220c are arranged and accommodated along the x direction. The opening on the upper side of the semiconductor case 221 is sealed by the upper cover 222. The opening on the lower side of the semiconductor case 221 is sealed by the lower cover 280. The sealing by the upper cover 222 and the lower cover 280 is, for example, by a fastening member. The semiconductor case 221 and the upper and lower covers 222 and 280 are formed of a member having good thermal conductivity, such as an aluminum alloy, and the semiconductor case pack 224 is configured by sealing the upper and lower surfaces of the semiconductor case 221.

The power semiconductor modules 220a to 220c are inserted into the openings 221a to 221c of the semiconductor case 221 respectively. Each of the power semiconductor modules 220a to 220c includes a metal case having one side opened, and a flange 228 that seals the opening of the metal case. As described above, a semiconductor switching element such as an IGBT is accommodated in the metal case. A large number of heat dissipating fins are formed on the front and back surfaces of the metal case, respectively. In the state in which each power semiconductor module 220 a to 220 c is inserted into the semiconductor case pack 224, the flange portion 228 comes into contact with the peripheral edge portion of one side surface 221 d of the semiconductor case 221 to seal the semiconductor case pack 224. Thereby, the semiconductor case pack 224 functions as a second flow path forming body 226 (see FIG. 5) through which cooling water for cooling the power semiconductor modules 220a to 220c flows.
A second flow path inlet 225a that is an inlet of cooling water is formed at the right end of the upper cover 222 of the semiconductor case pack 224 in the x direction. A second channel outlet 225 b that is an outlet for cooling water is formed at the left end of the upper cover 222. A second flow path 225 through which cooling water for cooling each power semiconductor module 220a to 220c flows is formed in the semiconductor case pack 224 (see FIG. 5). That is, the semiconductor case pack 224 has a function as the second flow path forming body 226 that cools the power semiconductor modules 220a to 220c with the cooling water flowing through the second flow path 225.

(First flow path forming body)
The capacitor module 210 has a plurality (seven in the embodiment) of capacitor elements 213 (see FIG. 6). Five capacitor elements 213 are arranged along the x direction.
In FIG. 6, two capacitor elements 213 are stacked on the capacitor element 213 on the right end side. That is, three capacitor elements 213 on the right end side are stacked. All of these capacitor elements 213 are accommodated in the capacitor case 211. That is, the capacitor case 211 has a first housing portion 211a having a low height for housing four capacitor elements 213 and a second housing portion 211b having a high height for housing three stacked capacitor elements 213 ( (See FIG. 3). The capacitor case 211 is made of, for example, an insulating resin. A first flow path 215 through which cooling water for cooling the capacitor element 213 accommodated therein is formed in the first accommodating portion 211a of the capacitor case 211 (see FIG. 5). That is, the first accommodating portion 211a of the capacitor case 211 has a function as a first flow path forming body 216 (see FIGS. 3 and 5) that cools the capacitor element 213 with the cooling water flowing through the first flow path 215. A first flow path inlet 215a (see FIG. 3) that is an inlet of the cooling water is formed at the right end in the x direction on the upper surface of the first housing part 211a of the capacitor case 211. A first flow path outlet 215b (see FIG. 3), which is an outlet for cooling water, is formed at the left end in the x direction of the first accommodating portion 211a.

  A terminal of each capacitor element 213 is connected to the DC bus bar 212. The DC bus bar 212 has a connection portion 217 connected to each of the power semiconductor modules 220a to 220c (see FIG. 3).

  Electronic components such as a microcomputer (not shown) are mounted on the circuit board 240. The microcomputer calculates the switching timing of the IGBT of each power semiconductor module 220a to 220c. The microcomputer calculates a current command value and a voltage command value based on the target torque value of the motor 100. The microcomputer generates a PWM signal based on the current / voltage command value and supplies the PWM signal to a driver circuit formed of a semiconductor IC. The driver circuit amplifies the PWM signal and outputs it to the power semiconductor modules 220a to 220c. Thereby, drive control of IGBT is carried out.

  A discharge resistor 250 connected to the circuit board 240 is disposed on the upper cover 222. The discharge resistor 250 discharges the electric charge stored in the capacitor module 210 when the power conversion device 200 stops. The circuit board 240 is also connected with a current sensor 290 that detects a current flowing through the AC bus bar 230.

  The base 270 is a substantially rectangular plate-like member formed of a member having good thermal conductivity such as an aluminum alloy. A first recess 272 in which the capacitor module 210 is accommodated and a second recess 273 in which the semiconductor case pack 224 is accommodated are formed on the upper surface of the base 270. The first recess 272 and the second recess 273 are formed extending in parallel to the x direction. An opening 271 is formed between the first recess 272 and the second recess 273. The opening 271 is required when the capacitor module 210 and each of the power semiconductor modules 220a to 220c are connected by the AC bus bar 230. That is, the first terminal portion of the AC bus bar 230 is joined to the terminals of the capacitor module 210 by welding or the like, and the second terminal portion of the AC bus bar 230 and the terminals of the power semiconductor modules 220a to 220c are joined to the joint portion 227. (See FIG. 5). At this time, a welding machine is inserted from the opening 271 to perform the above welding. The opening 271 is sealed by a welded lower cover 280.

  The relay flow path forming body 260 is disposed above the circuit board 240. The relay flow path forming body 260 is formed of a member having good thermal conductivity such as an aluminum alloy or a resin, and a relay flow path 261 (see FIGS. 5 and 6) through which cooling water flows is formed therein. Has been. The relay flow path forming body 260 includes a first region portion 260a covering the first housing portion 211a of the capacitor case 211, a second region portion 260b covering a part of the power semiconductor module 220c, the first region portion 260a, and the first region portion 260a. And a third region portion 260c connecting the two region portions 260b. The first region portion 260a is disposed to face the first housing portion 211a of the capacitor case 211. The second region portion 260b is disposed to face the periphery of the upper cover 222 where the second flow path inlet 225a is formed. The third region 260c extends from the right side of the first region 260a to the second region 260b in a stepped manner. On the lower surface of the relay channel forming body 260, the relay channel inlet 261 a (see FIG. 6) connected to the first channel outlet 215 b of the capacitor case 211 and the second channel inlet 225 a of the semiconductor case pack 224. A relay channel outlet 261b (see FIG. 5) is provided.

(Power converter assembly structure)
As shown in FIG. 4, the semiconductor case pack 224 in which the power semiconductor modules 220 a to 220 c are accommodated is mounted in the second recess 273 of the base 270. The capacitor module 210 is mounted in the first recess 272 of the base 270. The semiconductor case pack 224 and the capacitor module 210 are arranged in parallel to the y direction. As shown in FIG. 5, the capacitor module 210 and the power semiconductor modules 220 a to 220 c are electrically connected by a DC bus bar 212 at a joint portion 227. A circuit board 240 is disposed on the first housing portion 211 a of the capacitor module 210. The circuit board 240 has a shape and size that covers a part of the semiconductor case pack 224. The relay flow path forming body 260 is disposed on the circuit board 240 and on the periphery of the second flow path inlet 225 a of the semiconductor case pack 224. In this state, the first region portion 260 a of the relay flow path forming body 260 faces the first housing portion 211 a of the capacitor case 211 via the circuit board 240.

  An AC bus bar 230 is disposed on a region of the upper surface of the semiconductor case pack 224 that is not covered by the circuit board 240. Disposed on the semiconductor case pack 224 is a discharge resistor 250 that is electrically connected to the circuit board 240. The discharge resistor 250 may be disposed on the side of the first flow path 215 of the first flow path forming body 216. Alternatively, the discharge resistor 250 may be disposed on the circuit board 240. A current sensor 290 that is electrically connected to the circuit board 240 is further disposed on the semiconductor case pack 224.

  The relay flow path forming body 260 is disposed in a space 110 (see FIG. 5) between the circuit board 240 and the motor 100. The circuit board 240 is disposed in a region between the relay flow path forming body 260 and the capacitor module 210. As described above with reference to FIG. 6, the relay channel inlet 261 a of the relay channel forming body 260 is connected to the first channel outlet 215 b of the capacitor case 211. The relay channel outlet 261 b (FIG. 5) of the relay channel forming body 260 is connected to the second channel inlet 225 a of the semiconductor case pack 224.

(Cooling structure of power converter)
6 is a cross-sectional view taken along line VI-VI in FIG. 4, and FIG. 7 is a plan view of FIG. 4 viewed from above.
As shown in FIGS. 6 and 7, a first flow path forming body 216 is formed in the first housing portion 211 a of the capacitor case 211. The cooling water flows into the first flow path forming body 216 from the first flow path inlet 215a, flows through the first flow path 215, and flows out from the first flow path outlet 215b. Each capacitor element 213 of the capacitor module 210 is cooled by this cooling water. The cooling water flowing out from the first flow path outlet 215b flows into the relay flow path forming body 260 from the relay flow path inlet 261a, flows through the relay flow path 261, and flows out from the relay flow path outlet 261b. The cooling water flowing out from the relay channel outlet 261b flows into the second channel forming body 226 from the second channel inlet 225a of the semiconductor case pack 224, flows through the second channel 225, and each power semiconductor module. Cool 220a-220c. The cooling water that has flowed through the second flow path 225 flows out of the second flow path outlet 225b and returns to the cooling water supply source. The flow of the cooling water is indicated by a two-dot chain arrow in FIG. The cooling water flows in the order of 500a → 500b → 500c.

  The first flow path 215, the second flow path 225, and the relay flow path 261 are provided in parallel to the xy plane. The circuit board 240 is disposed substantially parallel to each of the flow paths 215, 225, and 261 in the z direction.

  The circuit board 240 is cooled from both the front and back surfaces by the first flow path 215 or the second flow path 225 and the relay flow path 261. For this reason, a cooling capacity improves compared with the case where it cools from only one surface. In addition, a relay flow path forming body 260 is disposed in the space between the circuit board 240 and the motor 100. For this reason, the heat radiated from the motor 100 toward the circuit board 240 is absorbed and cooled by the cooling water flowing in the relay flow path forming body 260. For this reason, the heat transmitted to the circuit board 240 is reduced, and the cooling effect can be improved.

In the following description, reference is made to FIG.
The side 216a extending in the x direction that is the longitudinal direction of the first flow path forming body 216 and the side side 226a extending in the x direction that is the longitudinal direction of the second flow path forming body 226 are in the y direction. They are arranged in parallel. The center line in the x direction of the side 216a of the first flow path forming body 216 is c1-c1, and the center line in the x direction of the side 226a of the second flow path forming body 226 is c2-c2. The first flow path forming body 216 is divided into two at the center line c1-c1, and the upper side in FIG. 7 is defined as one region 216b and the lower side as the other region 216c. The second flow path forming body 226 is divided into two at the center line c2-c2, and the upper side in FIG. 7 is defined as one region 226b and the lower side as the other region 226c.
The relay flow path forming body 260 has a structure that connects one region 216 b of the first flow path forming body 216 and the other region 226 c of the second flow path forming body 226. That is, the relay flow path 261 that connects the first flow path forming body 216 and the second flow path forming body 226 is diagonally formed in a diagonal line connecting the upper corner side and the lower corner side in plan view. Yes. Thereby, the length of the relay flow path 261, that is, the cooling area is increased, and the cooling capacity is increased.

  In the above-described embodiment, the first flow path outlet 215b of the first flow path forming body 216 is disposed near the upper end of the one region 216b, and the second flow path inlet 225a of the second flow path forming body 226 is The other region 226c is disposed near the lower end. For this reason, the cooling area of the relay flow path 261 is substantially maximized.

  3, 4, and 7, the first region 260 a of the relay flow path forming body 260 is viewed in plan view, in other words, the arrangement direction of the relay flow path forming body 260 and the circuit board 240. When viewed from the side, the capacitor case 211 has an area 210 s substantially opposite to the first housing portion 211 a. This area is larger than the area 220s where the second region 260b of the relay flow path forming body 260 faces the periphery of the second flow path inlet 225a. As shown in FIG. 5, the terminal 214 of the capacitor element 213 has a cross-sectional area far smaller than the cross-sectional area of the DC bus bar 212. For this reason, there is a concern that the electric characteristics of the capacitor element 213 that generates heat during energization and has a low heat-resistant temperature may be affected. By increasing the facing area of the relay flow path forming body 260 to the capacitor module 210, the capacitor element 213 can be sufficiently cooled, and the reliability can be ensured.

  The first flow path forming body 216, the second flow path forming body 226, the relay flow path forming body 260, and the circuit board 240 are projected from the opposite side of the motor 100 on one side of the motor 100. Arranged in the projection area. For this reason, the space which accommodates the power converter device 200 can be made small.

According to the said Embodiment 2, there exist the following effects.
(1) The relay flow path forming body 260 is disposed in the space 110 sandwiched between the motor 100 and the circuit board 240. For this reason, the heat radiated from the motor 100 toward the circuit board 240 can be absorbed by the cooling water flowing through the relay flow path forming body 260, and the temperature rise of the circuit board 240 can be suppressed. Moreover, since the power converter device 200 is cooled by the relay flow path formation body 260, the cooling capacity of the power converter device 200 can be improved.

(2) The relay channel 261 is formed by one region 216b of the two regions divided by the center line c1-c1 in the longitudinal direction of the capacitor case 211 and the center line c2-c2 in the longitudinal direction of the semiconductor case pack 224. It is formed so as to connect the other region 226c of the two regions to be divided. For this reason, the cooling area of the relay flow path 261 becomes large, and it is possible to improve the cooling capacity of the power conversion device 200 and to suppress the temperature rise due to the heat radiated from the motor 100. In particular, when a power conversion device such as an inverter is downsized and the degree of circuit integration increases, the amount of heat generated by electronic components mounted on the circuit board 240 increases. For this reason, it is necessary to increase the area for protecting the circuit board 240 by cooling, but the cooling capacity can be increased by the above configuration.

(3) The circuit board 240 is disposed between the relay flow path forming body 260 and the capacitor module 210. The capacitor module 210 has a first flow path 215 through which cooling water flows on the side facing the circuit board 240. For this reason, the circuit board 240 can be sufficiently cooled from both the front and back surfaces by the relay flow path forming body 260 and the semiconductor case pack 224.

(4) The area 210s where the relay flow path forming body 260 faces the capacitor module 210 is made larger than the area 220s where the relay flow path forming body 260 faces the power semiconductor module 220a. For this reason, the cooling capacity with respect to the capacitor module 210 is increased, and deterioration of the capacitor element 213 due to heat can be suppressed.

(5) The first flow path forming body 216, the second flow path forming body 226, the relay flow path forming body 260, and the circuit board 240 on the one surface side of the motor 100 opposite to the one surface of the motor 100. Placed in the projected area projected from. For this reason, the space which accommodates the power converter device 200 can be made small.

  In the second embodiment, the power conversion device 200 has been described as a configuration arranged on the side of the motor 100. However, the present invention can also be applied to the case where the power conversion device 200 is disposed on a side of a heating element other than the motor 100, such as a light emitting device.

  In the said Embodiment 2, it illustrated as the power converter device 200 provided with the capacitor | condenser module 210 and the power semiconductor modules 220a-220c. However, the present invention can also be applied to other power conversion devices such as a power conversion device including a DC-DC converter and a charger.

  The circuit of the circuit board 240 of the second embodiment is exemplified as a configuration in which a microcomputer is mounted. However, as a circuit of the circuit board 240, an electronic component having a large heat generation amount such as a transformer, a semiconductor IC, or a discharge resistor 250 may be mounted in addition to the microcomputer. By disposing these electronic components so as to overlap the relay flow path forming body 260 when viewed from the arrangement direction of the relay flow path forming body 260 and the circuit board 240, the heat radiated from the motor 100 is cut off, and The relay flow path forming body 260 and the first flow path forming body 216 can be cooled from both the front and back surfaces.

  In the said Embodiment 2, it demonstrated as a structure using the cooling device which used the cooling water as a refrigerant | coolant. However, a cooling device using another coolant or a gas such as air can be used as the refrigerant.

Embodiment 3
A surge voltage is generated in the power semiconductor module constituting the power converter. As the surge voltage is generated, an instantaneous voltage change occurs at the connection between the power semiconductor module and the DC bus bar. There is a concern that this voltage change becomes conduction noise / radiation noise and flows into the power supply circuit, which may adversely affect the battery and surrounding electric circuits.
Embodiment 3 shown below can suppress the ripple noise of such a switching power supply.
FIG. 8 is an external perspective view of a power converter according to Embodiment 3 of the present invention and a motor, FIG. 9A is a front view seen from the y direction of FIG. 8, and FIG. It is the figure which removed the cover member in Fig.9 (a). 10 (a) is a perspective view of FIG. 9 (b), and FIG. 10 (b) is an enlarged view of a lower region of FIG. 10 (a).
Also in the third embodiment, the x direction, the y direction, and the z direction are as illustrated.
As shown in FIGS. 8 and 9A, in the third embodiment as well, the power conversion device 200 </ b> A is disposed on the side portion of the motor 100 as in the second embodiment. The motor 100 includes a motor rotation shaft 101, a motor rotor and a motor stator (not shown). The motor 100 is used, for example, in a vehicle such as a hybrid vehicle or an electric vehicle. The motor 100 generates a running torque of the automobile, and thus consumes high power and becomes a heating element. The power conversion device 200 includes a case member 201 having a cylindrical upper surface 201 a along the outer periphery of the motor 100. The motor 100 is placed on the upper surface 201 a of the case member 201.

9 (b), 10 (a), and 10 (b), the power conversion device 200A is illustrated with the circuit board 240 and the relay flow path forming body 260 omitted. Also, the base 270 and the semiconductor case pack 224 are not shown. Also, the capacitor case 211 of the capacitor module is not shown.
The power conversion device 200 </ b> A includes a capacitor module 210, three power semiconductor modules 220 a to 220 c, and a DC bus bar 212. The DC bus bar 212 is a plate-like conductor part, and includes a positive side DC bus bar 212a and a negative side DC bus bar 212b, and connects the capacitor module 210 and the power semiconductor modules 220a to 220c.

When the power conversion device 200A is projected from the z direction, the entire power conversion device 200A is disposed within the projection region p of the motor 100. As shown in FIG. 9B, the positive-side DC bus bar 212a and the negative-side DC bus bar 212b are located on a radial straight line Lr passing through the motor rotation shaft 101 and separated from the outer periphery of the motor 100 by a predetermined distance. The adjacent portion Pu is connected to the first remote portion Pr1 and the second remote portion Pr2 separated by a predetermined distance in a direction perpendicular to the straight line Lr, and is extended linearly. The power semiconductor modules 220a to 220c are arranged substantially in parallel with the positive / negative side DC bus bars 212a and 212b. Each of the positive and negative DC bus bars 212a and 212b has a power supply terminal 300. The power supply terminal 300 is formed in the vicinity of the first remote portion Pr1 of the positive / negative side DC bus bars 212a and 212b so as to protrude toward the motor 100 side.
With the above configuration, ripple noise can be suppressed as described below.

  The distances Lr1 and Lr2 between the motor rotating shaft 101 and the first and second remote parts Pr1 and Pr2 are larger than the radial distance Lu between the motor rotating shaft 101 and the proximity part Pu, respectively. Therefore, the distance in the z direction between the first and second remote parts Pr 1 and Pr 2 and the outer periphery of the motor 100 is larger than the distance in the z direction between the proximity part Pu and the outer periphery of the motor 100. By providing the power supply terminals 300 of the positive and negative DC bus bars 212a and 212b in the vicinity of the first remote part Pr1, the space where the motor 100 and the power converter 200A are arranged can be reduced.

  In the above embodiment, the positive / negative side DC bus bars 212a and 212b are illustrated as having the first and second remote parts Pr1 and Pr2. However, the positive / negative side DC bus bars 212a and 212b may have only one remote part Pr out of the first and second remote parts Pr1 and Pr2. That is, the positive / negative side DC bus bars 212a and 212b may be configured to extend between the proximity part Pu and the remote part Pr spaced apart from the proximity part Pu to one side in the x direction by a predetermined distance.

FIG. 11 is a perspective view showing a connection structure between the power semiconductor module and the capacitor element, and FIG. 12 is an exploded perspective view of FIG. 13 is an exploded perspective view of the capacitor module and the positive / negative side DC bus bar shown in FIG. 12, and FIG. 14 is a view as seen from the y direction with the power semiconductor module removed in FIG.
As shown in FIG. 11, the positive side DC bus bar 212a and the negative side DC bus bar 212b are electrically connected to the capacitor element 213 and the power semiconductor modules 220a to 220c, respectively.
As shown in FIG. 13, the positive / negative side DC bus bars 212a and 212b are plate-like members bent in an approximately L shape. Each of the positive / negative side DC bus bars 212a and 212b includes the power supply terminal 300 and the low profile 301 described above. The height of the power supply terminal 300, that is, the length in the z direction is larger than the height of the low profile portion 301. Connection portions 217a to 217c connected to the power semiconductor modules 220a to 220c are formed in the low profile portion 301.
Three slits 304 are provided in the low profile 301 of the positive-side DC bus bar 212a so as to be spaced apart from each other in the x direction. Two slits 305 are provided in the low-profile 301 of the negative-side DC bus bar 212b so as to be separated from each other in the x direction. The slit 304 of the positive side DC bus bar 212a is formed corresponding to the middle position of the slit 305 of the low profile 301 of the negative side DC bus bar 212b. The slit 305 of the negative side DC bus bar 212b is formed corresponding to the middle position of the slit 304 of the low profile 301 of the positive side DC bus bar 212a.

  The positive electrode side DC bus bar 212a and the negative electrode side DC bus bar 212b are arranged so as to be slightly separated from each other in the y direction, that is, in an insulated state and overlap each other. In this state, as shown in FIGS. 12 and 14, the power supply terminal 300 of the positive side DC bus bar 212a has an exposed edge 303 exposed from the power supply terminal 300 of the negative side DC bus bar 212b.

  The capacitor case 211 includes a first housing portion 211a having a low height for housing four capacitor elements 213 and a second housing portion 211b having a high height for housing three stacked capacitor elements 213. As shown in FIG. 13, a first flow path 215 through which cooling water for cooling the capacitor element 213 accommodated therein is formed in the first accommodating portion 211 a of the capacitor case 211. That is, the first housing portion 211 a of the capacitor case 211 has a function as the first flow path forming body 216 that cools the capacitor element 213 with the cooling water flowing through the first flow path 215. A first flow path inlet 215a that is an inlet of cooling water is formed at the right end in the x direction on the upper surface of the first housing part 211a of the capacitor case 211. A first channel outlet 215b that is an outlet for cooling water is formed at the left end in the x direction on the upper surface of the first accommodating portion 211a.

  The capacitor element 213 has a cylindrical shape with an elliptical cross section, and is formed of a metal vapor deposition film. A positive electrode 213 a is formed on one side surface parallel to the yz plane of the capacitor element 213. A negative electrode 213b is formed on the side surface of the capacitor element 213 opposite to the positive electrode 213a. The positive electrode 213a of the capacitor element 213 is provided with a positive electrode terminal 214a. A negative electrode side terminal 214 b is provided on the negative electrode side electrode 213 b of the capacitor element 213.

  The positive electrode side terminal 214a of the capacitor element 213 is connected to the positive electrode side DC bus bar 212a. Since the tip of the positive terminal 214a connected to the positive DC bus bar 212a protrudes to a position corresponding to the slit 305 of the negative DC bus bar 212b, it does not short-circuit to the negative DC bus bar 212b. The negative electrode side terminal 214b of the negative electrode side DC bus bar 212b is inserted through the slit 304 of the positive electrode side DC bus bar 212a and connected to the negative electrode side DC bus bar 212b. Also in this case, the negative electrode side terminal 214b of the negative electrode side DC bus bar 212b is not short-circuited to the positive electrode side DC bus bar 212a.

  As shown in FIG. 12, the connecting portions 217a to 217c of the positive / negative side DC bus bars 212a and 212b are connected to the power semiconductor modules 220a to 220c, respectively. Connection portions 217 a to 217 c of the positive / negative side DC bus bars 212 a and 212 b are connected to the power supply terminal 300 via the low-profile portion 301. The low-profile 301 is lower than the power terminal 300, extends in the x direction, and has a higher impedance than the power terminal 300. By adopting such a configuration, a high resistance value is given to the frequency, and the voltage change of the power supply accompanying the surge voltage that is a high-frequency voltage change is suppressed.

  As shown in FIG. 14, the positive and negative terminals 214a and 214b of the capacitor element 213 are provided above the thickness of the capacitor element 213, that is, above the center plane ff of the length in the z direction. . That is, the positive and negative terminals 214 a and 214 b of the capacitor element 213 are formed on the side close to the first flow path forming body 216. The cross-sectional area of the positive / negative side terminals 214a, 214b of the capacitor element 213 is much smaller than the cross-sectional area of the power supply terminal 300 of the positive / negative side DC bus bars 212a, 212b. For this reason, there is a concern that heat generation due to current concentration may occur in the positive and negative terminals 214a and 214b of the capacitor element 213 due to this sudden change in the cross-sectional area. By bringing the positive and negative terminals 214a and 214b of the capacitor element 213 closer to the first flow path forming body 216, the capacitor element 213 having low heat resistance can be cooled and protected.

The power conversion device 200A of the third embodiment has the following configuration.
(1) In the power converter arranged on the side of the motor rotating shaft 101 with the motor rotor or motor stator interposed therebetween, the plate-like conductor portion 212 that electrically connects the capacitor element 213 and the power semiconductor modules 220a to 220c. And a power supply terminal 300 that receives DC power, and the plate-like conductor portion 212 is formed such that the width of the plate-like conductor portion 212 in the radial direction of the rotation axis with respect to the motor rotation shaft 101 is non-uniform. At least one of the connection portions 217a to 217c between the modules 220a to 220c and the plate-like conductor portion 212 has a radial width of the plate-like conductor portion 212 that is larger than a portion where the radial width of the plate-like conductor portion 212 is larger. The power supply terminal 300 is connected near a small portion, and the radial width of the plate-like conductor portion 212 is larger than the portion where the radial width of the plate-like conductor portion 212 is small It is connected to a nearby place.

Further, the power conversion device 200A of the third embodiment has the following configuration.
(2) The power converter arranged on the side of the motor rotating shaft 101 with the motor rotor or motor stator interposed therebetween is a plate-like conductor that electrically connects the capacitor element 213 and the plurality of power semiconductor modules 220a to 220c. Part 212 and a power supply terminal 300 for receiving DC power, and the plate-like conductor part 212 has a plurality of connection parts 217a to 217c connected to each power semiconductor module 220a to 220c, and a power supply terminal 300. The plate-like conductor portion 212 is positioned on a radial straight line Lr passing through the motor rotation shaft 101, and in a direction perpendicular to the straight line Lr from the proximity portion Pu, which is separated from the outer periphery of the motor 100 by a predetermined distance. The power supply terminal 300 of the plate-like conductor portion 212 is formed in the remote portion Pr1, and is connected to the remote portion Pr1 that is separated by a predetermined distance. At least one of the connecting portion 217a~217c is formed in a portion other than the remote unit Pr1.
In the configuration (2), the plate-like conductor portion 212 may be extended from the proximity portion Pu to the second remote portion Pr2, which is separated from the remote portion Pr1 by a predetermined distance.

According to the power converter described in the above (1) or (2), the following effects are obtained.
(I) The impedance between the proximity portion Pu of the plate-like conductor portion 212 and the power supply terminal 300 can be increased. For this reason, the voltage change of the power supply accompanying the surge voltage which is a high frequency voltage change can be suppressed.

  200 A of power converters shown in the said Embodiment 3 are arrange | positioned entirely in the projection area | region p of the motor 100, when projecting from the z direction which is the opposite side to the arrangement position with respect to the motor 100 of 200 A of power converters. For this reason, the accommodation space of 200 A of power converter devices can be made small.

  The positive and negative terminals 214 a and 214 b of the capacitor element 213 are formed on the side close to the first flow path forming body 216 formed in the capacitor case 211. For this reason, the capacitor element 213 having a smaller cross-sectional area than the power supply terminal 300 and fearing heat generation can be sufficiently cooled and protected from heat.

In addition, the said Embodiment 3 is provided with the 1st flow path formation body 216, the 2nd flow path formation body 226, and the relay flow path formation body 260 similarly to Embodiment 2. FIG. For this reason, it has the effects (1) to (5) of the second embodiment.
However, as long as the power conversion device 200A shown in the third embodiment includes the configuration (1) or (2), the effect (i) can be obtained. The configuration (1) or (2) can also be applied to a power conversion device that does not include the second flow path forming body 226 or the relay flow path forming body 260.
That is, the power conversion device 200 </ b> A shown in the third embodiment can be configured as a power conversion device that does not include the second flow path forming body 226 and the relay flow path forming body 260.

  Although various embodiments have been described above, the present invention is not limited to these contents. Other embodiments conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

100 motor (heating element)
DESCRIPTION OF SYMBOLS 101 Motor rotating shaft 110 Space 200, 200A Power converter 210 Capacitor module (1st electric circuit)
210S area 212 DC bus bar (plate conductor)
212a Positive side DC bus bar 212b Negative side DC bus bar 213 Capacitor element (capacitor)
215 1st channel 216 1st channel formation object 216a Side 216b One field 216c Other field 220, 220a-220c Power semiconductor module (2nd electric circuit)
220S area 225 second flow path 226 second flow path formation body 226a side 226b one area 226c other area 240 circuit board 260 relay flow path formation body 260c third area portion 261 relay flow path 300 power supply terminal p projection area

Claims (1)

A power conversion device disposed on the side of the heating element,
A first flow path forming body that forms a first flow path for cooling the first electric circuit;
A second flow path forming body that forms a second flow path for cooling the second electric circuit;
A relay channel forming body that forms a relay channel connecting the first channel and the second channel;
A circuit board having a circuit for driving or controlling any one of the first electric circuit and the second electric circuit;
The relay flow path forming body is a power conversion device disposed in a space between the heating element and the circuit board.

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