JP2018148591A - Imaging unit and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the thickness of an imaging unit.SOLUTION: The imaging unit comprises: a semiconductor chip 31 having an imaging region; a first translucent plate 32 joined to the semiconductor chip 31 so as to cover the imaging region therewith; a support member 33 which comprises an opening 33a and supports the first translucent plate 32; plural abutting portions 33d which are locally provided on both sides in a Y-axis direction with respect to the opening 33a in the support member 33 and have the rear surface and front surface of the first translucent plate 32 abutted thereon in the direction of an optical axis; and an adhesive for partially adhering the first translucent plate 32 and the support member 33.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an imaging unit and an imaging apparatus using the imaging unit.

  In Patent Document 1 below, an optical member that transmits imaging light, a flexible printed board in which a connection pattern is provided on one surface, and the surface of the optical member is fixed to the other surface, and the imaging surface are the above-described ones. An image sensor electrically connected to the connection pattern on the one surface of the flexible printed circuit board via a bump so as to face the optical member, and a support member fixed to the back surface of the image sensor surface of the image sensor An imaging apparatus having the above is disclosed.

JP 2006-332894 A

  However, since the conventional imaging device has a support member fixed to the back surface of the imaging surface of the image sensor, the support member exists on the back surface of the image sensor, so that the thickness of the support member Accordingly, the thickness of the image pickup apparatus in the optical axis direction is increased, and the image pickup apparatus cannot be thinned.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an imaging unit that can be thinned and an imaging apparatus using the imaging unit.

  The following aspects are presented as means for solving the problems. An imaging unit according to a first aspect includes a semiconductor chip having an imaging region, a first translucent plate bonded to the semiconductor chip so as to cover the imaging region, and an opening. A support member that supports the optical plate, and provided locally on both sides of the support member in the first direction with respect to the opening, and a rear surface or a front surface of the first light transmissive plate is in contact with the optical axis direction. A plurality of contact portions that are in contact with each other, and an adhesive that partially adheres between the first translucent plate and the support member.

  In the present specification, for the front and rear, the subject side in the optical axis direction is the front, and the opposite side is the rear.

  In the imaging unit according to a second aspect, in the first aspect, the adhesive includes first and second adhesives, and the first adhesive is the first translucent plate. A portion located on one side of the first direction and located near the center of the second direction orthogonal to the first direction, and located on one side of the first direction with respect to the opening in the support member The second adhesive is located on the other side of the first direction of the first translucent plate and near the center of the second direction. And a portion located on the other side in the first direction with respect to the opening in the support member.

  The image pickup unit according to a third aspect is the image pickup unit according to the second aspect, wherein the distance between the adhesive portion by the first adhesive and the adhesive portion by the second adhesive in the support member expands and contracts. Defects for relieving stress due to deformation of the support member are formed on both sides of the support member in the second direction with respect to the opening.

  In the second or third aspect, an imaging unit according to a fourth aspect is provided with an adhesive reservoir that constitutes a recess that receives the first and second adhesives.

  In the imaging unit according to a fifth aspect, in any one of the first to fourth aspects, a wiring pattern electrically connected to the semiconductor chip is formed on the first translucent plate, 1st and 2nd flexible printed circuit board electrically connected to the wiring pattern of the 1st translucent board, and the 1st and 2nd flexible printed circuit board are said 1st translucent board Are led rearward from both side portions in the second direction through the opening portions on both sides in the second direction with respect to the first translucent plate in the opening.

  The imaging unit according to a sixth aspect is the imaging unit according to any one of the first to fifth aspects, wherein a rear surface of the first light transmissive plate is in contact with the plurality of contact portions, A second translucent plate disposed on the front side of the translucent plate at a distance from the first translucent plate, and between the first translucent plate and the second translucent plate A frame-shaped rubber member that seals the space, and a frame-shaped pressing member that urges the second translucent plate, the rubber member, and the first translucent plate backward. It is.

  An imaging device according to a seventh aspect includes an imaging unit according to any one of the first to sixth aspects.

  ADVANTAGE OF THE INVENTION According to this invention, the imaging unit which can achieve thickness reduction and an imaging device using the same can be provided.

It is a schematic sectional drawing which shows typically the electronic camera by the 1st Embodiment of this invention. It is a schematic plan view which shows typically a part of imaging unit in FIG. FIG. 3 is a schematic cross-sectional view schematically showing the imaging unit in FIG. 1 corresponding to a cross section along line Y1-Y2 in FIG. 2. It is a schematic sectional drawing which shows typically the imaging unit in FIG. 1 corresponded to the cross section along the Y3-Y4 line | wire in FIG. FIG. 3 is a schematic cross-sectional view schematically showing the imaging unit in FIG. 1 corresponding to a cross section along line X1-X2 in FIG. It is a schematic plan view which shows typically a part of imaging unit by a comparative example. It is a schematic sectional drawing which shows typically the imaging unit by the comparative example corresponded to the cross section along the Y5-Y6 line | wire in FIG. It is a schematic plan view which shows typically a part of imaging unit of the electronic camera by the 2nd Embodiment of this invention. It is a schematic plan view which shows typically a part of imaging unit of the electronic camera by the 3rd Embodiment of this invention.

  Hereinafter, an imaging unit and an imaging apparatus according to the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic cross-sectional view schematically showing an electronic camera 1 as an imaging apparatus according to the first embodiment of the present invention. As shown in FIG. 1, an X axis, a Y axis, and a Z axis that are orthogonal to each other are defined. Of the X axis directions, the direction of the arrow is called the + X direction or the + X side, and the opposite direction is called the -X direction or the -X side, and the same applies to the Y axis direction and the Z axis direction. The Z-axis coincides with the direction of the optical axis O of the photographing lens 3 of the electronic camera 1, the X-axis coincides with the left-right direction (horizontal direction) of the electronic camera 1, and the Y-axis coincides with the up-down direction (vertical direction) of the electronic camera 1. Is consistent with The −Z side is called the front side on the subject side, and the + Z side is called the rear side. These points are the same for the drawings described later.

  The electronic camera 1 according to the present embodiment is configured as a single-lens reflex digital camera. However, the imaging apparatus according to the present invention is not limited to this, and other electronic cameras such as a mirrorless camera and a compact camera, and a mobile phone. The present invention can be applied to various imaging apparatuses such as an electronic camera mounted on the camera and an electronic camera such as a video camera that captures moving images.

  The electronic camera 1 according to the present embodiment includes a camera body 2 and a photographing lens 3 that is exchangeably held by the camera body 2. In FIG. 1, the photographing lens 3 is indicated by an imaginary line.

  The camera body 2 includes a lens mount (body-side mount) 11 that holds the photographing lens 3 in an exchangeable manner, a mount base 12 to which the lens mount 11 is attached, and an outer housing 13 that accommodates these and components to be described later. And have. The mount base 12 has a central opening 12a along the optical axis O, and the lens mount 11 is attached to the front side thereof. The camera body 2 includes a quick return mirror 14, a focal plane shutter 15, and an imaging unit 16 as members disposed along the optical axis O in the central opening 12 a of the mount base 12. Further, the camera body 2 includes a focusing screen 17, a pentaprism 18, and an eyepiece 19 as members that are fixedly supported on the upper side of the mount base 12 and constitute a finder device. A finder observation window 20 is provided at a position facing the eyepiece 19 in the outer housing 13.

  The subject light that has passed through the photographic lens 3 is reflected upward by the quick return mirror 14 and forms an image on the focusing screen 17. The subject image formed on the focusing screen 17 is observed from the finder observation window 20 through the eyepiece 19 through the pentaprism 18. The quick return mirror 14 jumps upward when a release button (not shown) is fully pressed, and the subject image from the photographing lens 3 enters the imaging unit 16.

  A liquid crystal display device 21 is provided on the back surface of the outer casing 13 of the camera body 2. Between the imaging unit 16 and the liquid crystal display device 21, a circuit board 22 on which a predetermined circuit (for example, a circuit for controlling an image sensor mounted on the semiconductor chip 31) is mounted is supported by a member (not shown). Has been placed.

  FIG. 2 is a schematic plan view schematically showing a part of the imaging unit 16 in FIG. 1 (semiconductor chip 31, glass substrate 32, support member 33, and first and second flexible printed boards 34, 35). . FIG. 3 is a schematic cross-sectional view schematically showing the imaging unit 16 in FIG. 1 corresponding to a cross section along line Y1-Y2 in FIG. FIG. 4 is a schematic cross-sectional view schematically showing the imaging unit 16 in FIG. 1 corresponding to a cross section along line Y3-Y4 in FIG. In order to facilitate understanding, FIGS. 3 and 4 also show ear portions 33c on the −X side and + Y side of the support member 33 that do not appear in the cross section. FIG. 5 is a schematic cross-sectional view schematically showing the imaging unit 16 in FIG. 1 corresponding to a cross section taken along line X1-X2 in FIG.

  In the present embodiment, the imaging unit 16 includes a semiconductor chip 31 having an imaging region (light receiving region) 31a on the front surface (surface on the −Z side), and a glass substrate 32 as a first translucent plate, It has a so-called COG (Chip on glass) structure. In addition, the imaging unit 16 includes a plate-like support member (bracket) 33 that has an opening 33a and supports the glass substrate 32, first and second flexible printed boards 34 and 35, and a second translucent property. An optical low-pass filter 36 serving as a plate, a frame-shaped rubber member 37, and a frame-shaped pressing member 38 are provided.

  In the present embodiment, the semiconductor chip 31 is an image sensor such as a CMOS or CCD configured as a chip, and a plurality of pixels (not shown) are two-dimensionally arranged in the imaging region 31a. The semiconductor chip 31 photoelectrically converts incident light incident on the imaging region 31a via the glass substrate 32 and outputs an image signal. For example, a read circuit (not shown) that reads out an image signal by driving the pixels and a processing circuit (for example, an AD conversion circuit) that processes an output signal may be mounted on the semiconductor chip 31.

  The glass substrate 32 is disposed on the −Z side of the semiconductor chip 31 so as to cover the imaging region 31 a on the −Z side of the semiconductor chip 31, and is bonded to the semiconductor chip 31 with a bump 39 and an adhesive 40. The space between the semiconductor chip 31 and the glass substrate 32 is kept airtight by the adhesive 40. The glass substrate 32 protrudes from the semiconductor chip 31 to the periphery in a plan view viewed from the + Z side in the −Z direction. Electrode pads (not shown) are formed on the + X side and the −X side on the front surface (the −Z side surface) of the semiconductor chip 31, and the internal connection electrode pads 41 a are formed on the rear surface (the + Z side surface) of the glass substrate 32. They are formed, and they are joined by bumps 39. External connection electrode pads 41b are formed at portions of the rear surface of the glass substrate 32 that protrude from the semiconductor chip 31 to the + X side and the −X side. A wiring pattern 41c is formed on the rear surface of the glass substrate 32 to connect the electrode pads 41a and 41b. The conductor patterns constituting the electrode pads 41a and 41b and the wiring pattern 41c can be formed by vapor deposition or printing on the glass substrate 32, for example. As the first light transmissive plate, another light transmissive plate such as an optical low-pass filter may be used instead of the glass substrate 32.

  In the present embodiment, the support member 33 is formed in a rectangular frame plate shape and has an opening 33a. As the material of the support member 33, for example, any material such as metal can be used, but it is preferable to use a material having high rigidity and a linear expansion coefficient as small as possible, such as aluminum or stainless steel.

  The support member 33 has three ear portions 33c having attachment holes 33b. One ear 33c is arranged to protrude to the + Y side on the -X side, the other ear 33c is arranged to protrude to the + Y side on the + X side, and the other one ear 33c is arranged to the + X side It is arranged so as to protrude to the −Y side at the side. The mount base 12 has an imaging unit mounting portion 12b that protrudes rearward (to the + Z side) at a position corresponding to each ear portion 33c on the rear surface side. After the support member 33 is positioned, etc., the screw 42 (see FIG. 1) is inserted through the attachment hole 33b of each ear portion 33c and screwed into the screw hole (not shown) of the corresponding imaging unit attachment portion 12b. For example, the mounting unit 12 is attached to the imaging unit mounting part 12b.

  The support member 33 has a plurality of contact portions 33d in which the rear surface (+ Z side surface) of the glass substrate 32 is contacted in the direction of the optical axis O (the + Z direction in the present embodiment) with respect to the opening 33a. It is provided on both sides of one direction (Y-axis direction in the present embodiment). In the present embodiment, the number of contact portions 33d is three, one contact portion 33d is disposed on the + Y side and + X side with respect to the opening portion 33a, and the other contact portion 33d is + Y with respect to the opening portion 33a. The remaining one contact portion 33d is disposed on the −Y side and in the center in the X-axis direction with respect to the opening 33a so that the three contact portions 33d receive the glass substrate 32 in a balanced manner. It is arranged to form a wide triangle. However, the number of contact portions 33d is not necessarily limited to three, and may be four or more, and their arrangement is not limited to the arrangement described above. The abutting portion 33d only abuts on the rear surface of the glass substrate 32 and is not fixed to the rear surface of the glass substrate 32.

  The + Y side portion of the support member 33 with respect to the opening 33a (particularly the portion close to the opening 33a) and the + Y side portion of the glass substrate 32 (particularly the portion protruding from the semiconductor chip 31 to the + Y side) are in the Z-axis direction. It overlaps with. Similarly, a −Y side portion (particularly a portion close to the opening 33a) of the support member 33 with respect to the opening 33a and a −Y side portion (particularly, a portion protruding from the semiconductor chip 31 to the −Y side) of the glass substrate 32. And overlap in the Z-axis direction. In the present embodiment, the position in the Z-axis direction of the front surface (the surface on the −Z side) in the vicinity of the overlapping portion of the support member 33 with the glass substrate 32 is made one step lower in the + Z direction than the other portions. This is preferable because the thickness of the entire imaging unit 16 in the Z-axis direction can be further reduced. However, in the present invention, the vicinity of the overlapping portion of the support member 33 with the glass substrate 32 is not necessarily lowered one step. In the present embodiment, the three contact portions 33d are provided on the −Z side surface of the support member 33 where the glass substrate 32 overlaps, so as to slightly protrude in the −Z direction. For example, the contact portion 33d can be configured by a convex shape formed by a half blank manufacturing method or a drawing manufacturing method on a metal plate made of aluminum or the like forming the support member 33. If necessary, the surface accuracy of the contact portion 33 may be improved by adjusting the surface roughness of the convex surface by milling or the like.

  Near the center of the second direction (X-axis direction) that is located on one side (+ Y side) of the first direction (Y-axis direction) in the glass substrate 32 and is orthogonal to the first direction (Y-axis direction) And a portion located on one side (+ Y side) of the first direction (Y-axis direction) with respect to the opening 33a of the support member 33 are bonded by the first adhesive 51. Yes.

  In the present embodiment, the portion where the −Z side surface of the support member 33 is one step lower in the + Z direction is + Y from the vicinity of the + Y side overlap with the glass substrate 32 of the support member 33 near the center in the X-axis direction. It is also expanded in the direction, and the expanded portion serves as an adhesive reservoir 33e constituting a recess for receiving the first adhesive 51. By providing the first adhesive 51 in the adhesive reservoir 33e, the end surface on the + Y side of the glass substrate 32 is bonded and fixed to the support member 33 by the first adhesive 51.

  Further, a portion of the glass substrate 32 that is located on the other side (−Y side) of the first direction (Y-axis direction) and near the center of the second direction (X-axis direction), and a support member 33. The second adhesive 52 adheres the portion located on the other side (−Y side) of the first direction (Y-axis direction) to the opening 33a.

  In the present embodiment, the portion where the −Z side surface of the support member 33 is one step lower in the + Z direction is near the −Y side overlap portion with the glass substrate 32 of the support member 33 in the vicinity of the center in the X-axis direction. It is also expanded in the −Y direction, and the expanded portion serves as an adhesive reservoir 33 f that forms a recess that receives the second adhesive 52. By providing the second adhesive 52 in the adhesive reservoir 33 f, the end surface on the −Y side of the glass substrate 32 is bonded and fixed to the support member 33 by the second adhesive 52.

  In the present embodiment, since the adhesive reservoirs 33e and 33f are provided, the positions and widths of the adhesives 51 and 52 in the X-axis direction can be easily defined, which is preferable. However, in the present invention, the adhesive reservoirs 33e and 33f are not necessarily provided.

  The glass substrate 32 and the support member 33 are partially bonded by the first and second adhesives 51 and 52 and are fixed only by the first and second adhesives 51 and 52. The width of the adhesive reservoirs 33e and 33f in the X-axis direction is preferably configured to be a width that is not easily affected by the difference in linear expansion deformation between the support member 33 and the glass substrate 32 within the operating temperature range of the electronic camera 1. As the adhesives 51 and 52, it is basically preferable to use a hard adhesive in order to guarantee the absolute position of the semiconductor chip 31, but the support member 33 and the glass in the operating temperature range of the electronic camera 1 are used. It is preferable to employ an adhesive having a slightly soft element that does not peel off or break the adhesives 51 and 52 even if a slight difference in linear expansion deformation from the substrate 32 occurs. Examples of such adhesives include synthetic rubber type and silicone type adhesives. In addition, by adopting a slightly soft adhesive as the adhesives 51 and 52, the glass substrate 32 is hardly broken against an impact such as dropping.

  Further, in the present embodiment, stress due to deformation of the support member 33 when the distance between the adhesion portion by the first adhesive 51 and the adhesion portion by the second adhesive 52 in the support member 33 expands and contracts is relieved. Defects 33g to be formed are formed on both side portions (+ X side portion and −X side portion) of the support member 33 in the second direction (X-axis direction) with respect to the opening portion 33a. In the present embodiment, the defect portion 33g is configured as a trapezoidal cutout portion continuous with the opening portion 33a.

  As described above, the external connection electrode pad 41b is formed on the rear surface of the glass substrate 32 from the semiconductor chip 31 to the + X side and the −X side. The first flexible printed board 34 is bonded to the external connection electrode pad 41 b on the −X side by bumps 61. The second flexible printed circuit board 35 is bonded to the + X side external connection electrode pad 41 b by bumps 62.

  The + X side portion and the −X side portion in the opening 33 a of the support member 33 are directly open portions without the glass substrate 32 overlapping. The first and second flexible printed boards 34 and 35 are guided rearward from both sides of the glass substrate 32 in the X-axis direction through the openings 33a on both sides of the glass substrate 32 in the X-axis direction. It is connected to the circuit board 22. In this way, the semiconductor chip 31 and the circuit board 22 are electrically connected via the first and second flexible printed boards 34 and 35. Since the first and second flexible printed boards 34 and 35 are guided backward by using the + X side opening and the −X side opening in the opening 33a, the first and second flexible printed boards 34 and 35 do not need to be tampered with and shortened. Can do.

  In the present embodiment, the optical low-pass filter 36 is used as the second light-transmitting plate, but another light-transmitting plate such as an IR cut filter may be used. The optical low-pass filter 36 is disposed on the front side of the glass substrate 32 with a space from the glass substrate 32. The frame-shaped rubber member 37 seals the space between the glass substrate 32 and the optical low-pass filter 36. The frame-shaped pressing member 38 is fixed to the support member 33, biases the optical low-pass filter 36, the rubber member 37, and the glass substrate 32 backward, and holds them by pressing them.

  According to the present embodiment, the opening 33 a is provided in the support member 33, and the glass substrate 32 is in contact with the contact portion 33 d of the support member 33 without the support member 33 existing on the rear surface of the semiconductor chip 31. Therefore, the thickness of the entire imaging unit 16 in the direction of the optical axis O (Z-axis direction) can be reduced, and the electronic camera 1 can be reduced in thickness. In other words, in an interchangeable lens camera, the distance from the lens mounting mount to the imaging light receiving surface is limited (fixed to a certain distance), so an object is placed on the back (+ Z direction) of the imaging light receiving surface. By not doing so, the total thickness of the electronic camera 1 can be minimized.

  And in this Embodiment, since between the glass substrate 32 and the supporting member 33 is being fixed by the 1st and 2nd adhesive agents 51 and 52 only near the center of the X-axis direction of the glass substrate 32, Depending on the deformation difference in the X-axis direction among the linear expansion deformation differences between the support member 33 and the glass substrate 32 in the operating temperature range of the electronic camera 1, stress is applied to the bonded portions by the first and second adhesives 51 and 52. Hardly occurs. Therefore, according to this Embodiment, the influence of the difference of the linear thermal expansion coefficient between the glass substrate 32 and the supporting member 33 can be reduced. Further, the glass substrate 32 and the support member 33 are fixed by the first and second adhesives 51 and 52 near the center of the glass substrate 32 in the X-axis direction and on both sides of the glass substrate 32 in the Y-axis direction. Therefore, even if the linear expansion deformation difference between the support member 33 and the glass substrate 32 occurs in the operating temperature range of the electronic camera 1, the center of the optical axis of the support member 33 and the glass substrate 32 is not shifted. The position of the imaging surface can be maintained.

  In the present embodiment, the first and second adhesions between the glass substrate 32 and the support member 33 are near the center of the glass substrate 32 in the X-axis direction and on both sides of the glass substrate 32 in the Y-axis direction. Since it is fixed by the agents 51 and 52, depending on the deformation difference in the Y-axis direction among the linear expansion deformation differences between the support member 33 and the glass substrate 32 in the operating temperature range of the electronic camera 1, the first and second Stress is generated in the bonded portions by the adhesives 51 and 52. However, in the present embodiment, this stress is relieved by the defective portion 33 g formed in the support member 33. Therefore, according to this Embodiment, the influence of the difference of the linear thermal expansion coefficient between the glass substrate 32 and the supporting member 33 can be reduced more. However, in the present invention, it is not always necessary to form the defective portion 33 g in the support member 33.

  FIG. 6 is a schematic plan view schematically showing a part of an imaging unit 71 according to a comparative example compared with the imaging unit 16 in the present embodiment, and corresponds to FIG. FIG. 7 is a schematic cross-sectional view schematically showing an imaging unit 71 according to a comparative example corresponding to a cross section taken along line Y5-Y6 in FIG. 2, and corresponds to FIG. 6 and 7, the same or corresponding elements as those in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The imaging unit 71 according to this comparative example is different from the imaging unit 16 in the present embodiment in the points described below.

  In this comparative example, the support member 33 supports the semiconductor chip 31 instead of the glass substrate 32. The support member 33 is not formed with the opening 33a, the portion where the −Z side surface is lowered in the + Z direction, the missing portion 33g, and the adhesive reservoirs 33e and 33f. Instead, an adhesive reservoir 33h is formed near the center. In this comparative example, the glass substrate 32 is not in contact with the support member 33, and the vicinity of the center of the rear surface (+ Z side surface) of the semiconductor chip 31 is supported by the adhesive 72 in the adhesive reservoir 33h. The other part of the rear surface of the semiconductor chip 31 that is bonded to 33 is only brought into contact with the front surface (the surface on the −Z side) of the support member 33 and is not fixed to the support member 33.

  In this comparative example, since the space between the semiconductor chip 31 and the support member 33 is fixed by the adhesive 72 only near the center of the semiconductor chip 31, the support member 33 and the semiconductor chip in the operating temperature range of the electronic camera 1 are used. No matter what the linear expansion deformation difference between the first and second adhesives 51 and 52 is caused by the difference in linear expansion and deformation in any direction with respect to 31, almost no stress is generated. However, in this comparative example, since the support member 33 is present on the rear surface (+ Z side surface) of the semiconductor chip 31, the thickness of the imaging unit 71 is increased by the thickness of the support member 33.

  On the other hand, the imaging unit 16 in the present embodiment can be thinned as described above.

  Thus, according to the present embodiment, the imaging unit 16 can be thinned, and the influence of the difference in linear thermal expansion coefficient between the glass substrate 32 and the support member 33 can be reduced. it can.

[Second Embodiment]
FIG. 8 is a schematic plan view schematically showing a part of the imaging unit of the electronic camera according to the second embodiment of the present invention, and corresponds to FIG. In FIG. 8, the same or corresponding elements as those in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

  This embodiment is different from the first embodiment in that the missing portion 33g of the support member 33 is not a trapezoidal cutout portion, but is located on both sides of the support member 33 in the X-axis direction with respect to the opening 33a. It is only a point that a part is formed so as to form a zigzag shape. This deficient portion 33g also relieves stress due to deformation of the support member 33 when the distance between the bonded portion by the first adhesive 51 and the bonded portion by the second adhesive 52 in the support member 33 expands and contracts. The That is, by forming a horizontal beam in the support member 33, an elastic force in the Y direction is formed, and the stress between the glass and the adhesive due to linear expansion is absorbed by the elastic force, and the deformation stress of the support member 33 is reduced. Alleviated.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

[Third Embodiment]
FIG. 9 is a schematic plan view schematically showing a part of an imaging unit of an electronic camera according to the third embodiment of the present invention, and corresponds to FIG. 9, elements that are the same as or correspond to elements in FIG. 2 are given the same reference numerals, and redundant descriptions thereof are omitted.

  This embodiment is different from the first embodiment in that the missing portion 33g of the support member 33 is not a trapezoidal cutout, but is formed as two slits each extending in the Y-axis direction. It is only a point. This deficient portion 33g also relieves stress due to deformation of the support member 33 when the distance between the bonded portion by the first adhesive 51 and the bonded portion by the second adhesive 52 in the support member 33 expands and contracts. The That is, by reducing the cross-sectional area in the Y direction and reducing the amount of deformation due to linear expansion, it is possible to prevent the adhesive from peeling within the operating environment range of the camera, and to reduce the amount of deformation with high accuracy. It can be accommodated within the allowable range.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

  For example, in the present invention, in each of the above embodiments, the + Z side and the −Z side of the support member 33 are reversed, and the front surface (the −Z side surface) of the glass substrate 32 protrudes in the + Z direction of the support member 33. You may contact | abut to the contact part 33d in the -Z direction from + Z side. In this case, in order to seal the space between the optical low-pass filter 36 and the glass substrate 32, not only is the space between the optical low-pass filter 36 and the support member 33 sealed by the rubber member 37, but, for example, glass The space between the substrate 32 and the support member 33 is sealed with a sealing material over the entire circumference of the glass substrate 32. As this sealing material, a material that does not substantially fix the space between the glass substrate 32 and the support member 33 such as using a sufficiently soft adhesive or an oil seal material is used.

  However, in each of the above embodiments, the imaging unit 16 can be made thinner, the sealing material is unnecessary, and the thickness of the glass substrate 32 varies. This is preferable in that it does not affect the position of the semiconductor chip 31.

DESCRIPTION OF SYMBOLS 1 Electronic camera 3 Shooting lens 11 Lens mount 12 Mount base 16 Imaging unit 31 Semiconductor chip 31a Imaging area 32 Glass substrate (1st translucent board)
33 support member 33a opening 33d contact part 51 first adhesive 52 second adhesive

Claims (11)

A substrate on which light is incident;
A member having an opening in which an imaging element into which light from the substrate is incident is disposed, and a contact portion that is in contact with the substrate;
An imaging unit comprising:   The imaging unit according to claim 1, wherein the member includes a plurality of the contact portions.   The imaging unit according to claim 1, wherein the contact portion protrudes in a direction from the imaging element toward the substrate in the member. The member has a recess in which an adhesive for fixing the substrate is disposed,
The imaging unit according to claim 3, wherein the contact portion forms part of the recess.   The imaging unit according to any one of claims 1 to 4, further comprising a connection portion that electrically connects the substrate and the imaging element.   The imaging unit according to claim 5, wherein the substrate has a wiring connected to the connection portion.   The imaging unit according to claim 6, further comprising a flexible substrate connected to the wiring.   The imaging unit according to claim 1, further comprising an elastic member in contact with the member and the substrate.   The imaging unit according to claim 8, wherein the elastic member has an opening through which light toward the substrate passes. An optical low-pass filter in contact with the elastic member;
The imaging unit according to any one of claims 1 to 9, wherein light from the optical low-pass filter is incident on the substrate.   An imaging device comprising the imaging unit according to any one of claims 1 to 10.

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