JP2018148173A - Machine for operation on substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a machine for operation on a substrate, capable of bending a lead wire inserted into a through hole, even when the hole diameter of the through hole formed on a substrate is not constant, and mounting a lead component more reliably on the substrate.SOLUTION: A controller of a machine for operation on a substrate executes processing for controlling a drive section depending on the hole diameter of a through hole formed on the substrate, prior to cutting each of a pair of lead wires, moving a pair of movable blades so as to change the distance between movable blades while each of the pair of lead wires has been inserted into insertion holes and processing of cutting and bending each of the pair of lead wires by means of the pair of movable blades, after changing the distance between the movable blades.SELECTED DRAWING: Figure 18

Description

  The present invention is inserted into an electronic component (hereinafter, may be abbreviated as “component”) in a state where a lead wire is inserted into a through hole of a circuit board (hereinafter may be abbreviated as “substrate”). The present invention relates to a substrate working machine that performs cutting and bending of lead wires.

  Among the components to be mounted on the board, there are components having lead wires (hereinafter sometimes referred to as “lead components”). This lead component is, for example, an axial component such as a resistance element or a radial component such as a capacitor. In a substrate working machine that mounts a lead component on a substrate, for example, the lead wire of the lead component held by the mounting head is inserted into the through hole of the substrate fixed at the working position. Some substrate working machines include a cut and clinching device that processes a lead wire inserted into a through hole of a substrate. In this cut and clinching apparatus, a lead wire protruding from the back surface of the substrate is cut into an appropriate length and bent along the back surface of the substrate (for example, Patent Document 1).

International Publication No. WO2015 / 063827

  By the way, the hole diameter of the through hole formed in the substrate is, for example, formed to have a predetermined size and ratio based on the wire diameter of the lead wire. However, some of the various substrates are manufactured with large hole diameters. If a bending operation similar to that of a substrate with a small hole diameter is performed on a substrate with a large hole diameter, the lead wire may or may not come in contact with the through hole. If the position where the lead wire is in contact with the through hole, that is, the fulcrum of the bending operation is not determined at an appropriate position, the cut-and-clinch device cannot bend the lead wire well along the back surface of the substrate. As a result, the occurrence of wobbling of parts becomes a problem.

  The present invention has been made in view of the above situation, and the problem of the present invention is that the lead wire inserted into the through hole is changed even when the hole diameter of the through hole formed in the substrate fluctuates. An object of the present invention is to provide a working machine for a substrate that can bend and securely mount lead components on a substrate.

  The present specification holds a substrate holding unit that holds a substrate and a lead component having a pair of lead wires, and a pair of penetrations formed in the substrate with respect to the substrate held by the substrate holding unit. A working head for inserting the pair of lead wires into each of the holes; a pair of moving blade portions each having an insertion hole for inserting the tip of the pair of lead wires inserted into the substrate; A drive for changing the distance between the moving blade portions, which is the distance between the pair of moving blade portions, by moving the holding portion movably holding the moving blade portion close to or away from the pair of moving blade portions. And a control device, wherein the control device controls the drive unit according to the diameter of the through hole formed in the substrate prior to cutting each of the pair of lead wires. The pair of lead wires is inserted into the insertion hole and the pair of lead wires is inserted. After moving the moving blade portion and changing the distance between the moving blade portions, and after changing the distance between the moving blade portions, each of the pair of lead wires is cut and bent by the pair of moving blade portions. An anti-substrate work machine that performs processing is disclosed.

  According to the present disclosure, the control device changes the distance between the moving blade portions and cuts and bends the lead wire by the pair of moving blade portions. This allows the lead wire to contact the through-hole more reliably, and the lead wire can be bent appropriately using the contacted position as a fulcrum for the bending operation. it can.

It is a perspective view which shows a substrate working machine. It is a perspective view which shows a component mounting apparatus. It is a side view which shows a component holder. It is a front view which shows a component holder. It is an enlarged view which shows the front-end | tip part of a component holder. It is a side view which shows the component holder of the state holding the lead component. It is a perspective view which shows a cut and clinching apparatus. It is a perspective view which shows a cut and clinching unit. It is sectional drawing which shows a slide body. It is an enlarged view which shows a slide body. It is an enlarged view which shows the upper end part of a slide body. It is a block diagram which shows a control apparatus. It is the schematic which shows the relationship between the through-hole of a board | substrate, and the insertion hole of a cut and clinching apparatus. It is sectional drawing which shows the cut and clinch unit just before the lead | read | reed of a lead component is cut | disconnected. It is sectional drawing which shows the cut and clinch unit after the lead | read | reed of lead components is cut | disconnected. It is sectional drawing which is a case where the hole diameter of a through-hole is large, Comprising: The cut and clinch unit just before a lead wire of a lead component is cut | disconnected. FIG. 5 is a cross-sectional view showing a cut-and-clinch unit after a lead wire of a lead component is cut in a case where the diameter of the through hole is large. FIG. 5 is a cross-sectional view showing a state immediately before the lead wire is cut, when the slide body is brought closer to the through hole having a large hole diameter and the lead wire is bent inward. FIG. 6 is a cross-sectional view showing a state after a lead is cut in a case where a slide body is brought closer to a through hole having a large hole diameter and a lead wire is bent inward. FIG. 6 is a cross-sectional view showing a state immediately before cutting a lead wire, in a case where the slide body is further separated from the through hole having a large hole diameter and the lead wire is bent outward. FIG. 6 is a cross-sectional view showing a state after a lead is cut in a case where a slide body is further separated from a through hole having a large hole diameter and a lead wire is bent outwardly. It is sectional drawing which shows the state after changing the slide distance of a movable blade with respect to the through-hole with a large hole diameter, and cutting a lead | read | reed.

Hereinafter, an embodiment of the present application will be described in detail with reference to the drawings.
(Configuration of substrate working machine)
FIG. 1 shows a perspective view of the substrate working machine 10 of the present embodiment. The substrate working machine 10 is a device for performing a component mounting operation on the circuit base 12. The substrate working machine 10 includes an apparatus main body 20, a base material conveyance holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a loose component supply device 32, and a cut and clinching device 34 (FIG. 7). And a control device 36 (see FIG. 12). The circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.

  The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40. The substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52. The conveyance device 50 is a device that conveys the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position. In the following description, the conveyance direction of the circuit substrate 12 is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction. That is, the width direction of the substrate working machine 10 is the X direction, and the front-back direction is the Y direction.

  The component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. The work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. The work heads 60 and 62 are detachably attached to sliders 74 and 76 (see FIG. 2), and the Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

  Further, as shown in FIG. 2, a component holder 78 is attached to the lower end surface of each work head 60, 62. The component holder 78 holds the lead wire of the lead component, and as shown in FIGS. 3 to 5, the main body portion 80, a pair of claw portions 82, an auxiliary plate 84, and an opening / closing device 86 ( 12), a pusher 88, and an elevating device 90 (see FIG. 12). 3 is a side view of the component holder 78, FIG. 4 is a front view of the component holder 78, and FIG. 5 is a perspective view of the pair of claw portions 82 and the auxiliary plate 84 from above. It is an enlarged view shown in FIG.

  The pair of claw portions 82 are held by the main body portion 80 so as to be slidable. The operation of the opening / closing device 86 causes the pair of claw portions 82 to be moved while moving the pair of claw portions 82 toward and away from each other. A recess 95 having a size corresponding to the wire diameter of the lead wire 94 of the lead component 92 to be held is formed inside the pair of claws 82. The auxiliary plate 84 is positioned between the pair of claw portions 82 and swings together with the pair of claw portions 82. At this time, the auxiliary plate 84 enters between the pair of lead wires 94 of the lead component 92. When the pair of claw portions 82 are close to the auxiliary plate 84, each of the pair of lead wires 94 of the lead component 92 is sandwiched from both side surfaces by the concave portion 95 of the claw portion 82 and the auxiliary plate 84. The Thereby, as shown in FIG. 6, the lead component 92 is held by the pair of claw portions 82 at the proximal end portion of the lead wire 94, that is, the end portion of the lead component 92 on the side close to the component main body 96. . At this time, the lead wire 94 is sandwiched between the concave portion 95 of the claw portion 82 and the auxiliary plate 84, so that a certain degree of bending, bending or the like is corrected. The pusher 88 is held by the main body portion 80 so as to be movable in the vertical direction, and moves up and down by the operation of the lifting device 90. When the pusher 88 is lowered, the pusher 88 contacts the component main body 96 of the lead component 92 held by the pair of claw portions 82 and presses the lead component 92 downward.

  Further, as shown in FIG. 2, the mark camera 26 is attached to the slider 74 so as to face downward, and moves together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the components held by the component holder 78 of the work heads 60 and 62.

  The component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 97 and a feeder-type component supply device 98 (see FIG. 12). The tray-type component supply device 97 is a device that supplies components placed on the tray. The feeder-type component supply device 98 is a device that supplies components by a tape feeder or a stick feeder (not shown).

  The bulk component supply device 32 is disposed at the other end of the frame portion 40 in the front-rear direction. The separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.

  Note that examples of the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, components of solar cells, components of power modules, and the like. Electronic circuit components include components having leads and components not having leads.

  The cut and clinching device 34 is disposed below the transport device 50, and includes a cut and clinching unit 100 and a unit moving device 102 as shown in FIG. As shown in FIG. 8, the cut and clinching unit 100 includes a unit main body 110, a pair of slide bodies 112, and a pitch changing mechanism 114. A slide rail 116 is disposed at the upper end of the unit main body 110 so as to extend in the X direction. The pair of slide bodies 112 are slidably supported by the slide rail 116. As a result, the pair of slide bodies 112 can approach or be separated in the X direction. The pitch changing mechanism 114 has an electromagnetic motor 118, and changes the distance between the pair of slide bodies 112 by the operation of the electromagnetic motor 118.

  As shown in FIG. 9, each of the pair of slide bodies 112 includes a fixed portion 120, a movable portion 122, and a slide device 124. The fixed portion 120 is slidably held on the slide rail 116. ing. Two slide rails 126 are fixed to the back side of the fixing portion 120 so as to extend in the X direction. The movable part 122 is slidably held by these two slide rails 126. Thereby, the movable part 122 slides in the X direction with respect to the fixed part 120. Further, the slide device 124 has an electromagnetic motor 128 (see FIG. 12), operates the electromagnetic motor 128, and slides the movable portion 122 relative to the fixed portion 120.

  Moreover, the upper end part of the fixing | fixed part 120 is made into the tapered shape, and the 1st insertion hole 130 is formed so that the upper end part may be penetrated to an up-down direction. The first insertion hole 130 communicates with an opening formed in the upper end surface of the fixing portion 120 at the upper end. A fixed blade 131 (see FIG. 14) is formed at the opening edge at the upper end of the first insertion hole 130. In addition, the first insertion hole 130 opens on the side surface of the fixing portion 120 at the lower end. A disposal box 132 is disposed below the side opening.

  Further, as shown in FIG. 10, the upper end portion of the movable portion 122 is also tapered. A bent portion 133 that is bent in an L shape is formed at the upper end portion of the movable portion 122. The bent portion 133 extends above the upper end surface of the fixed portion 120, and the bent portion 133 and the upper end surface of the fixed portion 120 face each other with a slight clearance (see FIG. 11). In addition, the first insertion hole 130 that opens to the upper end surface of the fixing portion 120 is covered with a bent portion 133 that is disposed above. A second insertion hole 136 is formed in the bent portion 133 so as to face the first insertion hole 130 in the vertical direction.

  As shown in FIG. 11, the second insertion hole 136 is a through-hole penetrating the bent portion 133 in the vertical direction, and the inner peripheral surface of the second insertion hole 136 has a smaller inner diameter as it goes downward from above. It is a tapered surface. On the other hand, the inner peripheral surface in the vicinity of the opening in the first insertion hole 130 (the opening on the upper end surface of the fixing portion 120) is not a tapered surface. The inner diameter in the vicinity of the opening of the first insertion hole 130 is substantially uniform. Incidentally, when the inner diameter of the first insertion hole 130 is L1, the inner diameter L2 of the opening on the lower end side of the second insertion hole 136 is L2 (> L1), and the inner diameter L3 of the opening on the upper end side is L3. (> L2).

  Moreover, the opening edge to the lower end surface of the bending part 133 in the 2nd insertion hole 136 is made into the movable blade 138 (refer FIG. 14). A guide groove 140 (see FIG. 10) is formed on the upper end surface of the bent portion 133 so as to extend in the X direction, that is, in the sliding direction of the movable portion 122. The guide groove 140 is formed so as to straddle the opening of the second insertion hole 136 in the X direction, and the guide groove 140 and the second insertion hole 136 are connected. The guide groove 140 is open on both side surfaces of the bent portion 133.

  The slide body 112 is provided with a lead wire sensor 146 (see FIG. 12). The lead wire sensor 146 contacts the lead wire 94 and the inner wall surface of the first insertion hole 130 when the lead wire 94 of the lead component 92 is inserted into the first insertion hole 130 via the second insertion hole 136. Thus, the insertion of the lead wire 94 into the first insertion hole 130 is detected. For this reason, it is preferable that the inner diameter L1 (see FIG. 11) of the first insertion hole 130 is slightly larger (about 0.1 mm) than the wire diameter of the lead wire 94. The wire diameter of the lead wire 94 is, for example, about 0.5 mm to 0.8 mm. In this case, the inner diameter L1 is about 0.6 mm to 0.9 mm.

  As shown in FIG. 7, the unit moving device 102 includes an X direction moving device 150, a Y direction moving device 152, a Z direction moving device 154, and a rotation device 156. X-direction moving device 150 includes a slide rail 160 and an X slider 162. The slide rail 160 is disposed so as to extend in the X direction. The X slider 162 is slidably held on the slide rail 160. The X slider 162 moves in the X direction by driving the electromagnetic motor 164 (see FIG. 12). The Y-direction moving device 152 includes a slide rail 166 and a Y slider 168. The slide rail 166 is disposed on the X slider 162 so as to extend in the Y direction. The Y slider 168 is slidably held on the slide rail 166. The Y slider 168 moves in the Y direction by driving the electromagnetic motor 170 (see FIG. 12). The Z direction moving device 154 includes a slide rail 172 and a Z slider 174. The slide rail 172 is disposed on the Y slider 168 so as to extend in the Z direction. The Z slider 174 is slidably held on the slide rail 172. The Z slider 174 moves in the Z direction by driving an electromagnetic motor 176 (see FIG. 12).

  The rotation device 156 has a generally disk-shaped rotary table 178. The rotary table 178 is supported by the Z slider 174 so as to be rotatable about its axis, and is rotated by driving of an electromagnetic motor 180 (see FIG. 12). A cut and clinching unit 100 is disposed on the rotary table 178. With such a structure, the cut and clinch unit 100 is moved to an arbitrary position by the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, and is rotated at an arbitrary angle by the rotation device 156. To do. Thereby, the cut and clinching unit 100 can be positioned at an arbitrary position below the circuit substrate 12 held by the clamp device 52.

  As shown in FIG. 12, the control device 36 includes a controller 190, a plurality of drive circuits 192, and an image processing device 196. The plurality of drive circuits 192 include the transport device 50, the clamp device 52, the work head moving device 64, the opening / closing device 86, the lifting / lowering device 90, the tray-type component supply device 97, the feeder-type component supply device 98, and the bulk component supply device 32. Are connected to electromagnetic motors 118, 128, 164, 170, 176, 180. The controller 190 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 192. As a result, the operations of the substrate conveyance holding device 22, the component mounting device 24, and the like are controlled by the controller 190. The controller 190 is also connected to the image processing device 196. The image processing device 196 processes image data obtained by the mark camera 26 and the part camera 28. The controller 190 acquires various types of information from the image data processed by the image processing device 196. Further, the controller 190 is also connected to the lead wire sensor 146 and acquires a detection value by the lead wire sensor 146.

(Operation of substrate work machine)
With the above-described configuration, the substrate work machine 10 performs a component mounting operation on the circuit base material 12 held by the base material conveyance holding device 22. Although the substrate working machine 10 of this embodiment can mount various components on the circuit base material 12, in the following description, a case where the lead component 92 is mounted on the circuit base material 12 will be described.

  The controller 190 of the substrate work machine 10 according to the present embodiment executes the mounting work based on the control data D1. The control data D <b> 1 (so-called recipe) is data for instructing the work content, for example, at which coordinate position of the circuit substrate 12 the lead component 92 supplied from which supply device is mounted. The control data D1 is generated by a user in a management computer (not shown) that manages the production line of the substrate work machine 10, for example. The control data D1 is transmitted from the management computer to the substrate work machine 10 and stored in the memory 210 of the controller 190. The controller 190 performs the mounting operation based on the control data D1 stored in the memory 210. In the control data D1 of the present embodiment, a change distance for changing the distance L6 between the moving blades described later is set for the through hole 208 (see FIG. 14) formed in the circuit base 12. Then, the controller 190 moves the movable blade 138 and the fixed blade 131 (slide body 112) closer to or away from each other based on the change distance of the distance L6 between the moving blade portions.

  In the mounting operation, first, the circuit substrate 12 is transported to the operation position, and is fixedly held by the clamp device 52 at the position. Next, the mark camera 26 moves above the circuit substrate 12 and images the circuit substrate 12. And the controller 190 calculates the information regarding the holding position etc. of the circuit base material 12 based on the imaging data. Further, the component supply device 30 or the bulk component supply device 32 supplies the lead component 92 at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the supply position of the lead component 92, and the lead component 92 is held by the component holder 78.

  Subsequently, the work heads 60 and 62 holding the lead component 92 move above the part camera 28, and the lead component 92 held by the component holder 78 is imaged by the part camera 28. And the controller 190 calculates the information regarding the holding position etc. of components based on the imaging data. At this time, the controller 190 also calculates a distance between the pair of lead wires 94 of the lead component 92 (hereinafter may be referred to as “distance between leads”) based on the imaging data. The inter-lead distance L5 (see FIG. 13) is, for example, the distance between the center of one tip surface of the pair of lead wires 94 and the center of the other tip surface. Further, “calculation” in this specification is a concept including processing by a computer such as the controller 190, and is an action for obtaining a predetermined value by processing various data.

  When the imaging of the lead component 92 by the parts camera 28 is completed, the work heads 60 and 62 holding the lead component 92 move above the circuit substrate 12, and the error in the holding position of the circuit substrate 12 and the component holding position To correct errors. Then, a pair of lead wires 94 of the lead component 92 held by the component holder 78 is inserted into two through holes 208 (see FIG. 14) formed in the circuit base 12. At this time, the cut and clinching unit 100 is moved below the circuit substrate 12.

  Specifically, first, a pair of lead wires 94 of the lead component 92 is properly inserted into the first insertion hole 130 and the second insertion hole 136 of the cut and clinch unit 100 through the through hole 208. The distance between the slide bodies 112 (hereinafter may be referred to as “distance between moving blade portions”) is adjusted. The distance L6 between the moving blade portions (see FIG. 14) is the distance between the fixed blade 131 and the movable blade 138. In the cut-and-clinch device 34 of this embodiment, the fixed blade 131 and the movable blade 138 are moved integrally, that is, the pair of slide bodies 112 are moved closer to or away from each other, and the distance L6 between the moving blade portions is changed. In this case, the distance L6 between the movable blade portions is, for example, as shown in FIG. 14, the central axis of one first insertion hole 130 and the second insertion hole 136, and the other first insertion hole 130 and the second insertion hole. 136 is the distance from the central axis. In addition, the definition of the distance between moving blade parts when changing the slide distance of the movable blade 138 as another example will be described later (see the distance L8 between moving blade parts in FIG. 22).

  The controller 190 performs control so that the centers of the first insertion hole 130 and the second insertion hole 136, the center of the through hole 208 of the circuit base material 12, and the center of the lead wire 94 coincide with each other in coordinates in the XY directions. The controller 190 adjusts the position of the slide body 112 by the pitch changing mechanism 114 so that the calculated distance L5 between the leads and the distance L6 between the moving blades coincide.

  In addition, the controller 190 controls the unit moving device 102 based on the position where the circuit substrate 12 is fixed and the coordinates of the through hole 208 set in the control data D1, and changes the position of the cut and clinching unit 100, for example. Then, the position of the slide body 112 (the first insertion hole 130 and the second insertion hole 136) is adjusted. Specifically, for example, the cut and clinching unit 100 is operated by the rotation of the rotation device 156 so that a straight line connecting the pair of through holes 208 and a straight line connecting the pair of first insertion holes 130 are parallel to each other. Rotated. In addition, the cut and clinching unit 100 includes the X-direction moving device 150 and the straight-line midpoint connecting the pair of through holes 208 and the midpoint of the straight line connecting the pair of first insertion holes 130. By the operation of the Y-direction moving device 152, the Y-direction moving device 152 is moved in the XY direction. Further, the cut and clinching unit 100 is moved up and down by the operation of the Z-direction moving device 154 so that the upper end portion of the slide body 112 is located slightly below the lower surface of the circuit base 12. In this way, by adjusting the distance L6 between the moving blades and the position of the cut-and-clinch unit 100, if there is no bending of the lead wire 94 or distortion of the through hole 208, the first insertion is performed as shown in FIG. The hole 130, the second insertion hole 136, and the through hole 208 of the circuit substrate 12 are overlapped in the vertical direction.

  The inner dimension of the opening on the lower end side of the second insertion hole 136 (inner diameter L2 in FIG. 11) is larger than, for example, the inner dimension of the first insertion hole 130 (inner diameter L1 in FIG. 11). Further, the inner dimension (the inner diameter L3 in FIG. 11) on the upper end side of the second insertion hole 136 may be larger or smaller than the inner dimension of the through hole 208 depending on the inner dimension of the through hole 208. As shown in FIG. 13, the taper surface of the second insertion hole 136 is substantially between the outer edge of the first insertion hole 130 and the outer edge of the through hole 208 as viewed from above the through hole 208. Thereby, for example, even when the lead wire 94 is bent and the tip of the lead wire 94 is displaced from the position of the first insertion hole 130, the tip of the lead wire 94 inserted into the through hole 208. Comes into contact with the tapered surface of the second insertion hole 136, is guided to the tapered surface, and is inserted into the first insertion hole 130.

  The controller 190 lowers the lead component 92 held by the component holder 78 and inserts the lead wire 94 of the lead component 92 into the through hole 208 of the circuit substrate 12. As shown in FIG. 14, the lead wire 94 is inserted into the first insertion hole 130 through the second insertion hole 136. Next, the pair of movable parts 122 moves relative to the fixed part 120 and slides in a direction approaching the fixed part 120 by the operation of the slide device 124, for example. As a result, as shown in FIG. 15, the lead wire 94 is cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136. Then, the tip portion separated by cutting the lead wire 94 falls inside the first insertion hole 130 and is discarded in the disposal box 132. FIG. 15 shows a case where the pair of movable parts 122 are brought close to each other, that is, a case where the lead wire 94 is bent inward. The case of bending the lead wire 94 will be described later. Incidentally, the inner bend or the outer bend is determined according to the shape and direction of the wiring pattern of the circuit substrate 12 or the type of the lead component 92 (radial component or axial component).

  In addition, the pair of movable parts 122 are slid in a direction closer to each other even after the lead wire 94 is cut. For this reason, the new leading end portion of the lead wire 94 due to the cutting is bent along the tapered surface of the inner periphery of the second insertion hole 136 as the movable portion 122 slides. Furthermore, as the movable portion 122 slides, the leading end portion of the lead wire 94 is bent along the guide groove 140. As a result, the lead wire 94 is bent at a substantially right angle, and the lead component 92 is attached to the circuit substrate 12 in a state in which the lead wire 94 is prevented from coming off from the through hole 208.

  Here, as shown in FIG. 14, when the hole diameter of the through hole 208 is W and the wire diameter of the lead wire 94 is φ, the hole diameter W of the through hole 208 is, for example, the wire diameter φ of the lead wire 94. It is formed with a predetermined size and ratio as a reference. For example, the hole diameter W is 0.4 mm longer than the wire diameter φ. If the wire diameter φ is 0.7 mm, the hole diameter W is 1.1 mm (= 0.7 mm + 0.4 mm). The distance L7 between the outer peripheral surface of the lead wire 94 and the inner peripheral surface of the through hole 208 is (hole diameter W−wire diameter φ) / 2, and is 0.2 mm (= (((1.1 mm−0.7 mm)). / 2)). The lead wire 94 is separated from the inner peripheral surface of the through hole 208 by a distance L7 (0.2 mm). If the hole diameter W is an appropriate size (+0.4 mm) with respect to the wire diameter φ, as shown in FIG. Contact. The lead wire 94 is bent from the slide body 112 by bending a contact portion as a fulcrum 212, and bends at a substantially right angle along the back surface of the circuit substrate 12.

  On the other hand, FIG. 16 shows a case where the hole diameter W of the through hole 208 is larger than that of FIG. 14 (for example, +1.0 mm). In this case, the distance L7 is 0.5 mm (= ((1.7 mm−0.7 mm) / 2)), which is larger than the case of FIG. 14 (for example, 0.1 mm). That is, the distance between the lead wire 94 and the through hole 208 is long, and the lead wire 94 is located away from the inner wall of the through hole 208.

  As a result, as shown in FIG. 17, when a bending operation similar to that of the circuit base 12 having a small hole diameter W (see FIG. 14) is performed on the circuit base 12 having a large hole diameter W, the lead wire 94 is There is a possibility that the position in contact with the inner wall or the like of the through hole 208 is shifted or not in contact. The position where the lead wire 94 and the through hole 208 are in contact, that is, the fulcrum 212 (see FIG. 15) of the bending operation cannot be determined at an appropriate position, and the lead wire 94 is not bent along the back surface of the circuit substrate 12. Become. The lead wire 94 is not prevented from coming off from the through hole 208, and the lead component 92 is wobbled or dropped from the circuit substrate 12.

  Therefore, the cut-and-clinch device 34 of the present embodiment controls the pitch changing mechanism 114 (electromagnetic motor 118) according to the hole diameter W of the through hole 208, and inserts each of the pair of lead wires 94 into the insertion holes (first The pair of slide bodies 112 are moved in a state of being inserted into the insertion hole 130 and the second insertion hole 136) to change the distance L6 between the moving blade portions. As described above, the controller 190 of the present embodiment performs the mounting operation based on the control data D1 stored in the memory 210. In the control data D1, a change distance for changing the distance L6 between the moving blades is set for each pair of through holes 208 through which the pair of lead wires 94 are inserted. In addition, you may set the change distance of the distance L6 between moving blade parts not only for every pair of through-hole 208 but for every through-hole 208 formed in the circuit base material 12, for example. In this case, the distance for changing the distance L6 between the movable blade portions is a value obtained by summing the change distances set for each of the pair of through holes 208. Moreover, you may set one value collectively with respect to the circuit base material 12 as a change distance of the distance L6 between moving blade parts.

  For example, the user actually measures the hole diameter W of the through hole 208 for the circuit substrate 12 used for production, or measures the wire diameter φ of the lead wire 94 for the lead component 92 to be mounted. And a user determines the change distance of the distance L6 between moving blade parts, and sets it to the control data D1. As a result, the controller 190 moves the movable blade 138 and the fixed blade 131 (slide body 112) closer to or away from each other based on the change distance of the distance L6 between the moving blades set in the control data D1. In addition, the user confirms the actual measurement of the hole diameter W, the mounting status of the produced lead component 92, and the like, and sets the change distance in the control data D1, whereby the substrate working machine 10 (cut-and-clinch device 34). Can be changed to a desired mode.

  The user can set a distance that is, for example, (hole diameter W−wire diameter φ) as the change distance. This distance (hole diameter W−wire diameter φ) is twice the distance L7 between the lead wire 94 and the through hole 208 (= (hole diameter W−wire diameter φ) / 2). In the case of inward bending, each of the pair of lead wires 94 moves inward by a distance L7 by shortening the distance L6 between the movable blade portions by a distance of (hole diameter W−wire diameter φ). Thereby, each of the lead wires 94 comes close to or contacts the inner wall of the inner through hole 208. Further, in the case of external bending, each of the pair of lead wires 94 moves outward by a distance L7 by increasing the distance L6 between the moving blades by a distance of (hole diameter W−wire diameter φ). Thereby, each of the lead wires 94 comes close to or contacts the inner wall of the outer through hole 208. Accordingly, for example, in the case of internal bending, the user sets the distance L6- (hole diameter W−wire diameter φ) between moving blades, and in the case of external bending, the distance L6 + (hole diameter between moving blades). By setting (W−wire diameter φ), an appropriate change distance can be set and the lead wire 94 can be brought close to the through hole 208. In addition, the change distance of the distance L6 between movable blade parts is not restricted to the method set to the control data D1 by the user, For example, the through-hole 208 is imaged with the mark camera 26, and the hole calculated based on the imaging data is used. The diameter W may be determined. In this case, the controller 190, based on the calculated hole diameter W and the preset wire diameter φ of the lead wire 94, for example, in the case of inward bending, as the change distance, the moving blade portion distance L6- ( The value of (hole diameter W−wire diameter φ) can be automatically set.

  FIG. 18 shows a state in which the pair of slide bodies 112 (each set of the fixed blade 131 and the movable blade 138) are brought closer to each other as compared with the case of FIG. The controller 190 controls the pitch changing mechanism 114 and the unit moving device 102 so that the centers of the first insertion hole 130 and the second insertion hole 136, the center of the through hole 208 of the circuit substrate 12, and the center of the lead wire 94 coincide. Control. Further, the controller 190 controls the pitch changing mechanism 114, for example, based on the change distance of the distance L6 between the moving blades set in the control data D1 before the lead wire 94 is cut after matching the centers. Then, the slide bodies 112 are brought close to each other. The cut and clinching device 34 brings the pair of slide bodies 112 close to each other, moves the fixed blade 131 and the movable blade 138 integrally, and shortens the distance L6 between the moving blade portions.

  As shown in FIG. 18, the pair of slide bodies 112 are closer to each other than the state of FIG. The distance L6 between the moving blade portions is shorter than that in the case of FIG. The pair of lead wires 94 are bent inwardly in the direction of approaching each other when the slide body 112 is brought close to the first insertion hole 130 and the second insertion hole 136. As a result, a part of the lead wire 94 is close to the inner wall inside the through hole 208.

  Then, in a state where the position of the fixed portion 120 (fixed blade 131) is fixed, the pair of movable portions 122 slide in the approaching direction by the operation of the slide device 124. Accordingly, as shown in FIG. 19, the lead wire 94 is cut by the fixed blade 131 and the movable blade 138 and contacts a part of the through hole 208 during the bending operation. The lead wire 94 is bent from the slide body 112 by bending a contact portion as a fulcrum 212, and bends at a substantially right angle along the back surface of the circuit substrate 12. That is, the lead wire 94 comes into contact with a part of the through hole 208 and is bent appropriately. The lead component 92 is mounted on the circuit substrate 12 in a state in which the lead wire 94 is prevented from coming off from the through hole 208.

(For external bending)
In FIGS. 18 and 19, the case where the lead wire 94 is bent inward (a pair of movable parts 122 are brought close to each other) has been described, but the case where the lead wire 94 is bent outwardly is similarly between the moving blade portions. The distance L6 can be adjusted. FIG. 20 shows a state in which the pair of slide bodies 112 are separated from each other as compared with the case of FIG. For example, the controller 190 may adjust the pitch changing mechanism 114 or the unit moving device so that the centers of the first insertion hole 130 and the second insertion hole 136, the center of the through hole 208 of the circuit base material 12, and the center of the lead wire 94 coincide. 102 is controlled. Furthermore, the controller 190 controls the pitch changing mechanism 114 to separate the slide bodies 112 from each other based on the changing distance of the distance L6 between the moving blades set in the control data D1 after matching the centers. . The cut and clinching device 34 separates the pair of slide bodies 112 from each other and moves the fixed blade 131 and the movable blade 138 integrally to increase the distance L6 between the moving blade portions.

  As shown in FIG. 20, the pair of slide bodies 112 are separated from each other compared to the state of FIG. The distance L6 between the moving blade portions is longer than that in the case of FIG. The pair of lead wires 94 are bent outward in a direction away from each other by separating the slide body 112 while being inserted into the first insertion hole 130 and the second insertion hole 136. As a result, a part of the lead wire 94 is close to the inner wall outside the through hole 208.

  Then, in a state where the position of the fixed portion 120 (fixed blade 131) is fixed, the pair of movable portions 122 are slid in the separating direction by the operation of the slide device 124. Accordingly, as shown in FIG. 21, the lead wire 94 is cut by the fixed blade 131 and the movable blade 138, and contacts a part of the through hole 208 during the bending operation. The lead wire 94 is applied with a force to bend the contacted portion as a fulcrum 212 from the slide body 112, and bends outward substantially at a right angle along the back surface of the circuit substrate 12. That is, the lead wire 94 can be appropriately bent as in the case of the internal bending shown in FIGS.

(When changing the sliding distance of the movable blade 138 in another example)
In the above-described example, the cut-and-clinch device 34 brings the pair of slide bodies 112 close to each other and moves the fixed blade 131 and the movable blade 138 integrally to shorten the distance L6 between the moving blade portions. However, the method for changing the distance between the moving blade portions in the present application is not limited to this. For example, the sliding amount of the movable portion 122 (movable blade 138) may be changed without changing the distance L6 between the moving blade portions. FIG. 22 corresponds to FIG. 17 and shows a state in which the movable part 122 is further slid inward compared to the case of FIG. That is, the controller 190 changes the distance L8 between the moving blades by increasing or decreasing the distance by which the movable blade 138 slides with respect to the fixed blade 131 in the cutting operation according to the hole diameter W of the through hole 208. .

  Here, the distance L8 between the movable blade portions is different from the distance L6 between the movable blade portions of the fixed blade 131 and the movable blade 138 that move integrally as described above, and a pair of movable blades that slide relative to the fixed blade 131. The distance between 138 is shown. The distance L8 between the movable blade portions is, for example, the distance between the central axes of the pair of second insertion holes 136. For example, in the case of inward bending with a large hole diameter W, the controller 190 makes the distance by which the movable blade 138 slides inward longer. The distance L8 between the movable blade portions shown in FIG. 22 is shorter than that in the case of FIG. Accordingly, as shown in FIG. 22, the pair of lead wires 94 are bent inward by the cutting operation, and a force that bends the portion in contact with the through hole 208 in the bending operation as a fulcrum 212 is the slide body 112. Added from. Therefore, the lead wire 94 can be appropriately bent. Further, the control device 36 changes the distance L8 between the movable blade portions during a series of operations of cutting and bending. This eliminates the need to change the distance L6 between the moving blade portions in advance before performing cutting or the like. In addition, since the method of changing the sliding amount of the movable blade 138 and performing external bending can be implemented similarly to the case of internal bending, the description is abbreviate | omitted. Further, when changing the slide amount, the slide amount can be set in the control data D1 in the same manner as the change amount of the distance L6 between the moving blades is set. Moreover, you may change the distance between moving blade parts using both the process which changes the above-mentioned distance L6 between moving blade parts, and the process which changes the distance L8 between moving blade parts.

  Incidentally, in the said embodiment, the circuit base material 12 is an example of a board | substrate. The unit main body 110 is an example of a holding unit. The substrate conveyance holding device 22 is an example of a substrate holding unit. The slide body 112 is an example of a moving blade part. The electromagnetic motor 118 and the electromagnetic motor 128 are examples of driving units. The first insertion hole 130 and the second insertion hole 136 are examples of insertion holes.

As described above, according to the embodiment described in detail, the following effects can be obtained.
The control device 36 controls the electromagnetic motor 118 and the like according to the hole diameter W of the through hole 208 formed in the circuit base material 12, and controls each of the pair of lead wires 94 to the first insertion hole 130 and the second insertion hole. The pair of slide bodies 112 (the fixed blade 131 and the movable blade 138) and the like are moved in the state inserted in 136, thereby changing the distance L6 between the moving blade portions before cutting. For example, when the inner diameter of the through hole 208 is larger than the diameter φ of the lead wire 94 and the lead wire 94 is bent inward, the control device 36 makes the distance L6 between the movable blade portions smaller. As a result, the pair of lead wires 94 is inserted in the first insertion hole 130 of the slide body 112 and the like in a direction in which the distance between the lead wires 94 is made smaller (an approaching direction). Moving. Due to this movement, each of the pair of lead wires 94 is shifted to one side (inward) in the through hole 208 and approaches the inner wall of the through hole 208. The lead wire 94 is close to or in contact with the inner wall of the through hole 208. Each of the pair of lead wires 94 is in such a state, and the control device 36 cuts and bends each of the pair of lead wires 94. Accordingly, in the substrate working machine 10 of the present embodiment, the lead wire 94 can be more reliably brought into contact with the through hole 208, and the lead wire 94 can be appropriately bent with the contact position as a fulcrum 212 of the bending operation. The component 92 can be securely mounted by the circuit base 12.

In addition, this application is not limited to the said embodiment, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
For example, in the above embodiment, the change amount of the moving blade portion distance L6 and the moving blade portion distance L8 is determined based on the value set in the control data D1, but the present invention is not limited to this. For example, the controller 190 may detect the motor current supplied to the electromagnetic motor 118 from the drive circuit 192 that drives the electromagnetic motor 118 that is the drive source of the pitch changing mechanism 114. For example, when the pitch changing mechanism 114 is driven to bring the slide body 112 close and the lead wire 94 is brought into contact with the through hole 208, the torque generated in the electromagnetic motor 118 increases and the motor current also increases. Therefore, the controller 190 can detect contact between the lead wire 94 and the through hole 208 from an increase in motor current (torque). In this case, the controller 190 moves the slide body 112 until the lead wire 94 and the through hole 208 come into contact with each other, and then performs a bending operation to bring the lead wire 94 into contact with the through hole 208 and bend it appropriately. Is possible. Moreover, it becomes unnecessary to set the change distance of the distance L6 between moving blade parts etc. with respect to the control data D1.

In the above embodiment, both the pair of slide bodies 112 are moved to change the distances L6 and L8 between the moving blades, but even if only one of them is moved to change the distances L6 and L8 between the moving blades. Good.
In the above-described embodiment, the component holder 78 capable of correcting the bending of the lead wire 94 is employed, but a component holder such as a suction nozzle that cannot correct the bending of the lead wire 94 is employed. It is possible.

  DESCRIPTION OF SYMBOLS 10 Board | substrate work machine, 12 Circuit base material (board | substrate), 22 Base material conveyance holding | maintenance apparatus (board | substrate holding part), 36 Control apparatus, 60,62 Work head, 92 Lead components, 94 Lead wire, 110 Unit main body (holding part) ), 112 Slide body (moving blade portion), 118 Electromagnetic motor (driving portion), 128 Electromagnetic motor (driving portion), 130 First insertion hole (insertion hole), 131 Fixed blade (moving blade portion), 138 Movable blade ( (Moving blade part), 136 second insertion hole (insertion hole), 208 through hole, D1 control data, L6, L8 distance between moving blade parts, W hole diameter, φ wire diameter.

Claims (5)

A substrate holder for holding the substrate;
An operation of holding a lead component having a pair of lead wires and inserting the pair of lead wires into each of a pair of through holes formed in the substrate with respect to the substrate held by the substrate holding portion. Head,
A pair of movable blade portions each having an insertion hole for inserting a tip of the pair of lead wires inserted into the substrate;
A holding portion that holds the pair of movable blade portions in a movable manner;
A drive unit that moves the pair of moving blades close to or away from each other and changes a distance between the moving blades that is a distance between the pair of moving blades; and
A control device,
The control device includes:
Prior to cutting each of the pair of lead wires, the drive unit is controlled according to the diameter of a through hole formed in the substrate, and each of the pair of lead wires is used as the insertion hole. A process of changing the distance between the moving blade portions by moving the pair of moving blade portions in the inserted state;
After changing the distance between the moving blade parts, a process of cutting and bending each of the pair of lead wires by the pair of moving blade parts;
Perform a board work machine. The control device controls the drive unit based on control data,
The to-substrate working machine according to claim 1, wherein a change distance for changing the distance between the movable blade portions is set in the control data for the pair of through holes formed in the substrate. When the diameter of each of the pair of through holes is W and the diameter of each of the pair of lead wires is φ,
The substrate working machine according to claim 2, wherein a distance that is (hole diameter W−wire diameter φ) is set as the change distance. Each of the pair of movable blade portions is
A fixed blade;
It is arrange | positioned between the said fixed blade and the said board | substrate, slides relatively with respect to the said fixed blade, and cut | disconnects one lead wire among the said pair of lead wires between the said fixed blades. A movable blade,
The control device includes:
Prior to cutting each of the pair of lead wires, the drive unit is controlled in accordance with the diameter of the through hole formed in the substrate, and the fixed blade and the movable blade are set as one set 2 A process of changing the distance between the moving blade parts by moving the fixed blade and the movable blade of one set close to or away from the fixed blade and the movable blade of the other set with respect to the set;
After changing the distance between the movable blade portions, the position of the fixed blade is fixed, and the movable blade is slid relative to the fixed blade to cut and bend each of the pair of lead wires. Processing,
4. The substrate work machine according to claim 1, wherein: A substrate holder for holding the substrate;
An operation of holding a lead component having a pair of lead wires and inserting the pair of lead wires into each of a pair of through holes formed in the substrate with respect to the substrate held by the substrate holding portion. Head,
A pair of movable blade portions each having an insertion hole for inserting a tip of the pair of lead wires inserted into the substrate;
A holding portion that holds the pair of movable blade portions in a movable manner;
A drive unit that moves the pair of moving blades close to or away from each other and changes a distance between the moving blades that is a distance between the pair of moving blades; and
A control device,
Each of the pair of movable blade portions is
A fixed blade;
It is arrange | positioned between the said fixed blade and the said board | substrate, slides relatively with respect to the said fixed blade, and cut | disconnects one lead wire among the said pair of lead wires between the said fixed blades. A movable blade,
The control device includes:
The distance between the moving blades is changed by increasing or decreasing the distance by which the movable blade slides relative to the fixed blade in the cutting operation according to the diameter of the through hole formed in the substrate. Board work machine.

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