JP2018139331A5 - Substrate processing method and substrate processing apparatus - Google Patents
Substrate processing method and substrate processing apparatus Download PDFInfo
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- JP2018139331A5 JP2018139331A5 JP2018112953A JP2018112953A JP2018139331A5 JP 2018139331 A5 JP2018139331 A5 JP 2018139331A5 JP 2018112953 A JP2018112953 A JP 2018112953A JP 2018112953 A JP2018112953 A JP 2018112953A JP 2018139331 A5 JP2018139331 A5 JP 2018139331A5
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- 239000000758 substrate Substances 0.000 title claims description 66
- 238000003672 processing method Methods 0.000 title claims description 10
- 239000000126 substance Substances 0.000 claims description 55
- 238000000859 sublimation Methods 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 10
- 238000001556 precipitation Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 230000001376 precipitating Effects 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims 17
- 238000000151 deposition Methods 0.000 claims 1
- 239000008155 medical solution Substances 0.000 claims 1
- 239000012487 rinsing solution Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
Description
本発明は、基板処理方法および基板処理装置に関する。 The present invention relates to a substrate processing method and a substrate processing apparatus.
本発明は、乾燥時にパターン倒壊を防止することができる基板の処理技術を提供するものである。 The present invention provides a substrate processing technique capable of preventing pattern collapse during drying .
本発明の第１の観点によれば、表面に凹凸のパターンが形成された基板を処理する基板処理方法において、前記基板に薬液を供給して前記基板を洗浄する薬液洗浄工程と、前記薬液洗浄工程の後に、前記基板にリンス液を供給するリンス工程と、前記リンス工程の後に、前記基板に昇華性物質の溶液を供給して、前記パターンの凹部内に前記溶液を充填する昇華性物質充填工程と、昇華性物質充填工程の後に、前記パターンの凹部内に固体の状態の前記昇華性物質を析出させる析出工程と、前記析出工程の後に、前記固体の状態の昇華性物質を、昇華させることによって前記基板から除去する昇華性物質除去工程と、を備え、前記薬液洗浄工程と、前記リンス工程と、前記昇華性物質充填工程と、前記析出工程と、前記昇華性物質除去工程と、を１つのユニット内で行う、基板処理方法が提供される。 According to a first aspect of the present invention, in a substrate processing method for processing a substrate having a concavo-convex pattern formed on a surface, a chemical cleaning step of supplying a chemical to the substrate to clean the substrate, and the chemical cleaning After the step, a rinsing step for supplying a rinsing liquid to the substrate, and after the rinsing step , a sublimation substance solution is supplied to the substrate and the solution is filled in the recesses of the pattern. a step, after the sublimation material filling step, a precipitation step of precipitating said sublimable substance solid state in a recess in the pattern, after the deposition step, sublimable materials of the state of the solid, subliming and a sublimable substance removing step of removing from said substrate by a the chemical cleaning process, and the rinsing step, and the sublimable material filling step, said precipitation step, and the sublimable substance removing step Is carried out in a single unit, the substrate processing method is provided.
本発明の第２の観点によれば、表面に凹凸のパターンが形成された基板を処理する基板処理装置において、前記基板を洗浄するために前記基板に薬液を供給する薬液供給部と、前記薬液により洗浄された後の前記基板にリンス液を供給するリンス供給部と、前記パターンの凹部内に昇華性物質の溶液を充填するために、前記リンス液が供給された後の前記基板に前記溶液を供給する昇華性物質供給部と、前記パターンの凹部内に固体の状態の前記昇華性物質を析出させるための動作を行う析出部と、前記固体の状態の昇華性物質を昇華させることにより前記基板から除去するための動作を行う昇華性物質除去部と、を備え、前記薬液供給部と、前記リンス供給部と、前記昇華性物質供給部と、前記析出部と、前記昇華性物質除去部と、が１つのユニット内に設けられる、基板処理装置が提供される。 According to a second aspect of the present invention, in a substrate processing apparatus for processing a substrate having a concavo-convex pattern formed on a surface, a chemical solution supply unit that supplies a chemical solution to the substrate for cleaning the substrate, and the chemical solution A rinsing supply unit for supplying a rinsing liquid to the substrate after being cleaned by the step, and a solution for the substrate after the rinsing liquid is supplied in order to fill the recess of the pattern with a solution of a sublimating substance. By sublimating the sublimable substance supply section for supplying the solid sublimable substance in the recesses of the pattern, and a precipitation section for performing an operation for precipitating the sublimable substance in the solid state. A sublimable substance removing unit that performs an operation for removing from the substrate, the chemical solution supplying unit, the rinse supplying unit, the sublimable substance supplying unit, the precipitation unit, and the sublimable substance removing unit. And one Provided in the unit, the substrate processing apparatus is provided.
次に、添付図面を参照して実施の形態について説明する。まずは、液処理後の基板を乾燥させる方法（以下「基板乾燥方法」と称する）を実施するための基板処理装置について説明する。なお、基板乾燥方法は、好ましくは、前工程と組み合わされた一連のプロセス（つまり、「基板処理方法」）として実施される。ここでは、前工程としての薬液洗浄工程およびリンス工程と組み合わされて一連のプロセスとして実施される基板乾燥方法について説明する。 Next, embodiments will be described with reference to the accompanying drawings. First, a substrate processing apparatus for carrying out a method for drying a substrate after liquid processing (hereinafter referred to as “substrate drying method”) will be described. The substrate drying method is preferably performed as a series of processes combined with the previous step (that is, “substrate processing method”) . Here, a substrate drying method implemented as a series of processes in combination with a chemical solution cleaning process and a rinsing process as the previous process will be described.
Claims (8)
前記基板に薬液を供給して前記基板を洗浄する薬液洗浄工程と、
前記薬液洗浄工程の後に、前記基板にリンス液を供給するリンス工程と、
前記リンス工程の後に、前記基板に昇華性物質の溶液を供給して、前記パターンの凹部内に前記溶液を充填する昇華性物質充填工程と、
昇華性物質充填工程の後に、前記パターンの凹部内に固体の状態の前記昇華性物質を析出させる析出工程と、
前記析出工程の後に、前記固体の状態の昇華性物質を、昇華させることによって前記基板から除去する昇華性物質除去工程と、
を備え、
前記薬液洗浄工程と、前記リンス工程と、前記昇華性物質充填工程と、前記析出工程と、前記昇華性物質除去工程と、を１つのユニット内で行う、基板処理方法。 In a substrate processing method for processing a substrate having an uneven pattern formed on the surface ,
A chemical cleaning step of cleaning the substrate by supplying a chemical to the substrate;
A rinsing step of supplying a rinsing liquid to the substrate after the chemical solution cleaning step;
Sublimation substance filling step of supplying a solution of the sublimation substance to the substrate after the rinsing step, and filling the solution into the recesses of the pattern;
After the sublimation substance filling step, a precipitation step of depositing the sublimation substance in a solid state in the concave portion of the pattern;
Sublimation substance removing step of removing the sublimation substance in the solid state from the substrate by sublimation after the precipitation step ;
With
The substrate processing method which performs the said chemical | medical solution washing | cleaning process, the said rinse process, the said sublimation substance filling process, the said precipitation process, and the said sublimation substance removal process in one unit .
前記薬液洗浄工程、前記リンス工程及び前記昇華性物質充填工程は、前記基板保持部により保持された前記基板を前記回転駆動部により回転させつつ、前記薬液、前記リンス液、前記溶液をそれぞれ供給する、請求項１に記載の基板処理方法。The chemical solution cleaning step, the rinsing step, and the sublimation substance filling step supply the chemical solution, the rinsing solution, and the solution, respectively, while rotating the substrate held by the substrate holding unit by the rotation driving unit. The substrate processing method according to claim 1.
前記基板を洗浄するために前記基板に薬液を供給する薬液供給部と、A chemical solution supply unit for supplying a chemical solution to the substrate for cleaning the substrate;
前記薬液により洗浄された後の前記基板にリンス液を供給するリンス供給部と、A rinse supply unit for supplying a rinse solution to the substrate after being cleaned with the chemical solution;
前記パターンの凹部内に昇華性物質の溶液を充填するために、前記リンス液が供給された後の前記基板に前記溶液を供給する昇華性物質供給部と、A sublimation substance supply unit for supplying the solution to the substrate after the rinse liquid is supplied in order to fill the recess of the pattern with the solution of the sublimation substance;
前記パターンの凹部内に固体の状態の前記昇華性物質を析出させるための動作を行う析出部と、A deposition part that performs an operation for precipitating the sublimable substance in a solid state in the recesses of the pattern;
前記固体の状態の昇華性物質を昇華させることにより前記基板から除去するための動作を行う昇華性物質除去部と、A sublimable substance removing unit that performs an operation to remove the sublimable substance in the solid state from the substrate by sublimating;
を備え、With
前記薬液供給部と、前記リンス供給部と、前記昇華性物質供給部と、前記析出部と、前記昇華性物質除去部と、が１つのユニット内に設けられる、基板処理装置。The substrate processing apparatus, wherein the chemical solution supply unit, the rinse supply unit, the sublimation substance supply unit, the precipitation unit, and the sublimation substance removal unit are provided in one unit.
前記薬液供給部による前記薬液の供給、前記リンス供給部による前記リンス液の供給及び前記昇華性物質供給部による前記溶液の供給は、前記基板保持部により保持された前記基板を前記回転駆動部により回転させながら行われる、請求項５に記載の基板処理装置。The supply of the chemical solution by the chemical solution supply unit, the supply of the rinse solution by the rinse supply unit, and the supply of the solution by the sublimable substance supply unit are performed by using the rotation driving unit to hold the substrate held by the substrate holding unit. 6. The substrate processing apparatus according to claim 5, which is performed while rotating.
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| JP7163248B2 (en) | 2019-05-29 | 2022-10-31 | 株式会社Ｓｃｒｅｅｎホールディングス | Method for producing liquid containing sublimable substance, method for drying substrate, and substrate processing apparatus |
| JP7419163B2 (en) | 2020-05-29 | 2024-01-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing device, substrate processing method, learning data generation method, learning method, learning device, learned model generation method, and learned model |
| JP2023020501A (en) * | 2021-07-30 | 2023-02-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method and substrate processing apparatus |
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| JPH07142333A (en) * | 1993-06-29 | 1995-06-02 | Kawasaki Steel Corp | Method and device for developing and rinsing of resist |
| JP2947694B2 (en) * | 1993-07-02 | 1999-09-13 | 株式会社日立製作所 | Method of forming resist pattern |
| JP4833753B2 (en) * | 2006-06-29 | 2011-12-07 | アルバック成膜株式会社 | Manufacturing method of semiconductor device |
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