JP2018133549A - Aggregate substrate and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aggregate substrate capable of stably mounting electronic components by suppressing deformation and damage of an aggregate substrate, and a manufacturing method thereof.SOLUTION: An aggregate substrate includes a first substrate 10 that includes a plurality of product regions 14 positioned in rows and columns and having a component mounting surface 14a and a board connecting surface 14b, a discarding region 15 surrounding the product region 14 and including a plurality of first connecting portions 16 on the board connecting surface 14b side, and a second substrate 20 having a surface including second connecting portions 17 arranged corresponding to the arrangement of the respective first connecting portions 16, and the first connecting portion 16 and the second connecting portion 17 are opposed to each other and joined by a joining material 30.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a collective substrate having a plurality of product regions that are arranged vertically and laterally, and a disposal margin region that surrounds the product regions, and a method for manufacturing the same.

  Conventionally, as a wiring board on which electronic components such as semiconductor elements are mounted, there is a board that includes an insulating layer and a wiring conductor on both surfaces of a core substrate including a reinforcing material. Currently, instead of such a wiring substrate, for example, a thin wiring substrate having no core substrate is being developed. Thin wiring boards are used in portable communication devices, game machines, and the like. Note that a thin wiring board is obtained by mounting an electronic component on a collective board in which product areas arranged vertically and horizontally and a disposal area surrounding the product area are integrally formed, and then the collective boards are separated into pieces. It is manufactured by a method of cutting (see Patent Document 1).

JP 2014-181379 A

  The aggregate substrate is required to be thin. Along with this, the rigidity of the collective substrate decreases, and deformation or damage may occur due to external pressure accompanying mounting of electronic components. As a result, the electronic component may not be stably mounted on the collective substrate.

  The collective board of the present disclosure is disposed in the vertical and horizontal directions, and includes a plurality of product areas having a component mounting surface and a board connection surface, and a disposal that surrounds the product area and includes a plurality of first connection portions on the board connection surface side. A first substrate having a surrogate region, and a second substrate having a surface including a second connection portion arranged corresponding to the arrangement of each first connection portion, the first connection portion and the second connection portion Are opposed to each other and bonded by a bonding material.

  A method of manufacturing a collective substrate according to the present disclosure includes a plurality of product regions having a component mounting surface and a substrate connection surface positioned vertically and horizontally, and surrounding the product region and a plurality of first connection portions on the substrate connection surface side. Preparing a first substrate having a disposal margin region including: a step of preparing a second substrate having a surface including a second connection portion arranged corresponding to the arrangement of each first connection portion; 1 connection part is piled up on a 2nd connection part corresponding to each via a joining material, and the process of joining together the 1st connection part and the 2nd connection part with joining material is characterized by the above-mentioned. is there.

  According to the collective substrate and the manufacturing method thereof of the present disclosure, it is possible to provide the collective substrate capable of stably mounting electronic components and the manufacturing method thereof.

1A to 1C are a schematic plan view and a cross-sectional view illustrating a first embodiment of an aggregate substrate of the present disclosure. FIG. 2 is a schematic plan view illustrating a second embodiment of the collective substrate of the present disclosure. 3A to 3C are schematic cross-sectional views illustrating an embodiment example of a method for manufacturing an aggregate substrate of the present disclosure. FIG. 4 is a schematic plan view illustrating a third embodiment of the collective substrate of the present disclosure. 5A to 5C are a schematic plan view and a cross-sectional view illustrating a fourth embodiment of the collective substrate of the present disclosure. 6A to 6C are a schematic plan view and a cross-sectional view illustrating a fifth embodiment of the collective substrate of the present disclosure.

  Next, the collective substrate A according to the embodiment of the present disclosure will be described with reference to FIG. FIG. 1A is a top view illustrating an exemplary embodiment of the aggregate substrate A of the present disclosure. FIG. 1B is a bottom view showing an example embodiment of the first substrate 10. FIG.1 (c) is sectional drawing which passes between XX shown to Fig.1 (a).

  The collective substrate A includes a first substrate 10 and a second substrate 20. The first substrate 10 and the second substrate 20 are bonded by a bonding material 30. The first substrate 10 is a portion including a plurality of regions (described later) that become individual wiring boards. The second substrate 20 is a part that ensures mechanical strength as the collective substrate A. The bonding material 30 is a part for bonding the first substrate 10 and the second substrate 20 to each other.

  The first substrate 10 includes an insulating layer 11, a wiring conductor layer 12, and a solder resist layer 13. The insulating layer 11 is made of an insulating material such as an epoxy resin or a bismaleimide triazine resin, and is laminated in two layers. The wiring conductor layer 12 is made of a highly conductive material such as copper plating or copper foil, and is located between the laminated insulating layers 11 and on the outermost surface of the insulating layer 11. The solder resist layer 13 is made of an insulating material such as an epoxy resin or a polyimide resin, and is located on the surface of the insulating layer 11. The solder resist layer 13 is mainly for protecting the wiring conductor layer 12 from the external environment. For example, when using solder as the bonding material 30, the solder resist layer 13 protects the wiring conductor layer 12 from heat generated when the solder is melted. Provided for. The thickness of the first substrate 10 may be 100 μm or less. When viewed from above, the first substrate 10 has a rectangular shape, and the corners may be chamfered (R surface).

  The first substrate 10 has a plurality of product areas 14 and a margin area 15. The product area 14 is arranged vertically and horizontally. The shape of each product region 14 is a square shape. The wiring conductor layer 12 is disposed at least in the product region 14. The upper surface of each product region 14 is a component mounting surface 14a on which an electronic component (not shown) such as a semiconductor element is mounted. The electronic component is electrically connected to the wiring conductor layer 12 on the component mounting surface 14a via, for example, solder. The lower surface of the product area 14 is a board connection surface 14b to which an external electric board is connected. The external electric board is electrically connected to the wiring conductor layer 12 on the board connection surface 14b via, for example, solder.

  The disposal allowance area 15 is located so as to surround the product area 14 and connects adjacent product areas 14 to each other. The wiring conductor layer 12 may also be disposed in the disposal margin region 15. For example, the wiring conductor layer 12 in the disposal margin region 15 has a function of electrically connecting the wiring conductor layers 12 in the adjacent product regions 14 to each other. In such a case, the wiring conductor layers 12 of the plurality of product regions 14 are electrically connected to each other, and operations such as electrical inspection or electroplating can be performed collectively. The disposal allowance area 15 includes a cutting area for dividing each product area 14 into pieces, and is discarded after cutting.

  A plurality of first connection portions 16 are formed on the substrate connection surface 14 b side surface in the disposal margin region 15. The 1st connection part 16 consists of metals, such as copper plating and copper foil, for example. The surface of the first connection portion 16 may be covered with gold plating.

  The second substrate 20 is, for example, a metal plate such as copper, stainless steel or aluminum, a glass plate, or a flat resin plate in which a glass fiber for reinforcement is impregnated with a resin. The second substrate 20 has higher mechanical strength such as rigidity than the first substrate 10. Therefore, the second substrate 20 is made of a material having a mechanical strength higher than that of the first substrate 10, for example. Alternatively, the second substrate 20 is thicker than the first substrate 10. The second substrate 20 includes the second connection portion 17 on the upper surface (the surface facing the substrate connection surface 14b of the first substrate 10 and the lower surface of the disposal margin region 15). Similarly to the first connection portion 16, the second connection portion 17 is also made of metal such as copper plating or copper foil. The arrangement of the second connection portion 17 corresponds to the arrangement of the first connection portion 16. In other words, the first connection portion 16 and the second connection portion 17 are positioned so as to overlap each other when viewed from above. The area of the second connection part 17 may be larger than the area of the first connection part 16. Thereby, it can function as a position adjustment allowance between the first substrate 10 and the second substrate 20. The vertical and horizontal outer diameter dimensions of the second substrate 20 may be larger than the vertical and horizontal outer diameter dimensions of the first substrate 10. That is, it refers to a state where the outer peripheral edge of the first substrate 10 is disposed so as to be within the outer peripheral edge of the second substrate 20 in a top view. By taking such an arrangement, it is easy to avoid the first substrate 10 from coming into contact with the outside. The thickness of the second substrate 20 may be about 50 to 300 μm.

  The bonding material 30 is made of, for example, solder, epoxy resin, or the like. The bonding material 30 is interposed between the first connection portion 16 and the second connection portion 17 that face each other, and connects the two. As a result, the first substrate 10 and the second substrate 20 are joined together to form the collective substrate A.

  As described above, the first substrate 10 and the second substrate 20 are bonded to each other via the bonding material 30 in the discard margin region 15 of the first substrate 10. Therefore, as will be described later, if the collective substrate A is cut in the discard margin region 15 (if the discard margin region 15 is eliminated), the first substrate 10 and the second substrate 20 are separated from each other.

  The solder resist layer 13 is located in the product region 14 and the disposal margin region 15 on both outermost surfaces of the insulating layer 11. The solder resist layer 13 has an opening that exposes a part of the wiring conductor layer 12 and the first connection portion 16. The thickness of the solder resist layer 13 may be about 5 to 50 μm. The shape of the opening may be circular, square, or oval. The volume of the bonding material 30 may be smaller than the volume of the opening that exposes the first connection portion 16.

  In addition, after the electronic component is mounted, the collective substrate A is cut into cutting pieces in the cutting area 15 and divided into individual pieces, each of which is a wiring board having a product region 14 (the electronic component is mounted on the wiring board). Individual electronic devices). Details of the division of the aggregate substrate A will be described later.

  As described above, in the collective substrate A of this example, the first substrate 10 and the second substrate 20 are bonded by the bonding material 30. As a result, the second substrate 20 can compensate for the rigidity that has decreased due to the thinning of the first substrate 10. As a result, even when the first substrate 10 is subjected to an external pressure accompanying the mounting of the electronic component, deformation and damage of the first substrate 10 can be suppressed. Thereby, it is possible to provide the collective substrate A capable of stably mounting electronic components.

  Since the divided product area (wiring board) does not include the second board 20, a thin wiring board can be provided. Since this wiring board is one in which the second board 20 is separated after the electronic components are mounted, the possibility that a large force is applied is small. Therefore, the possibility of deformation of the wiring board is effectively reduced, and an electronic device in which electronic components are stably mounted can be obtained.

  In addition to the above configuration, the collective substrate A may have a mark indicating a cutting position in a cutting area in the discard margin area 15.

  Next, an aspect of the method for manufacturing a collective substrate of the present disclosure will be described with reference to FIG. In addition, about the same member as FIG. 1, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  First, as shown in FIG. 3A, a first substrate 10 and a second substrate 20 are prepared. The first substrate 10 is formed as follows, for example. First, an insulating layer 11 obtained by curing a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin is prepared. Insulating particles such as silicon oxide may be dispersed in the thermosetting resin. Next, a plurality of through holes are formed in regions corresponding to the product regions 14 in the insulating layer 11. The through hole is formed by drilling, laser processing, blasting, or the like. Next, the wiring conductor layer 12 is integrally formed on the upper and lower surfaces of the insulating layer 11 and in the through holes by plating such as a semi-additive method. Thereby, the wiring conductor layers 12 on the upper and lower surfaces are electrically connected through the through holes. At this time, the first connection portion 16 is simultaneously formed in a region corresponding to the discard margin region 15 below the insulating layer 11. Next, the first substrate 10 is formed by sequentially forming the insulating layer 11 and the wiring conductor layer 12 on the upper side of the insulating layer 11 by the same method.

  For example, the second substrate 20 is formed as follows. First, a flat metal plate is prepared. Next, the flat metal plate is cut into the same outer diameter as that of the first substrate 10 in a top view. Next, the second substrate 20 is formed by forming the second connection portion 17 on the upper surface of the metal plate by plating or vapor deposition.

  Next, as shown in FIG. 3B, a bonding material 30 is applied to the surface of the second connection portion 17. The bonding material 30 is attached to the surface of the second connection portion 17 by, for example, a screen printing method or a coating method using a dispenser.

  Finally, as shown in FIG. 3C, the first substrate 10 is placed on the second substrate 20 such that the first connection portion 16 and the second connection portion 17 face each other with the bonding material 30 interposed therebetween. To join them together. When the bonding material 30 is solder, the first substrate 10 and the second substrate 20 overlapped with each other through the bonding material 30 are cured after the solder is melted by heat treatment and bonded to each other. In order to place the first substrate 10 on the second substrate 20 with high accuracy, the alignment mark 19 is provided on the second substrate 20, and the alignment hole 18 is provided in the disposal margin region 15 of the first substrate 10. It does not matter. Then, the first substrate 10 may be placed on the second substrate 20 while being aligned so that the alignment mark 19 is accommodated in the alignment hole 18 in a top view. Thereby, the positional accuracy of the first substrate 10 and the second substrate 20 is improved. In this case, the shape of the upper surface of some of the alignment marks 19 or the alignment holes 18 may be different from the others so that the vertical and horizontal alignment positions of the first substrate 10 and the second substrate 20 can be confirmed.

  As described above, according to the method for manufacturing the collective substrate A of the present example, the rigidity reduced by the thinning of the first substrate 10 is compensated by being joined to the second substrate 20. As a result, even when the first substrate 10 receives an external pressure when mounting the electronic component, the first substrate 10 can be prevented from being deformed or damaged. Thereby, it is possible to provide a collective substrate A capable of stably mounting electronic components. In addition, after the electronic component is mounted, the collective board A is cut at a cutting area included in the disposal margin area 15 around each product area 14. Thereby, a plurality of wiring boards are formed simultaneously. At this time, since all of the bonding material 30 is disposed only in the disposal allowance region 15, the bonding material 30 does not remain on each wiring board.

  The process of forming the soldering resist layer 13 may be further included with respect to said process. The solder resist layer 13 is formed to have an opening that exposes the first connection portion 16. The solder resist layer 13 is exposed to a pattern having an opening that exposes the first connection portion 16 while affixing a photosensitive thermosetting resin film such as an acrylic-modified epoxy resin to the outermost surface of the insulating layer 11. And after development, it is formed by UV curing and heat curing. In this case, if solder is used as the bonding material 30, there is an effect in that the bonding strength is improved as compared with the epoxy resin.

  Note that the present disclosure is not limited to the above-described exemplary embodiment, and various modifications can be made without departing from the gist of the present disclosure. For example, in the example of the above-described embodiment, the case where the first connection portion 16 is located only in the disposal margin region 15 in the outer peripheral portion and the central portion of the first substrate 10 is shown, but as shown in FIG. In addition, the first connecting portion 16 may be positioned in the margin area 15 around each of the product areas 14 adjacent to each other. By doing in this way, the tolerance of the 1st substrate 10 to the external pressure at the time of mounting increases, and deformation and damage of the 1st substrate 10 are controlled more.

  However, the form shown in FIG. 1 is more advantageous in increasing the number of product regions 14 that can be arranged per certain area in the top view of the first substrate 10 (the collective substrate A). In this case, it is possible to obtain an effect of improving productivity and economy as a plurality of wiring boards and electronic devices. The selection of these forms can be appropriately set according to the use of the assembly board A to be manufactured, the type of electronic component to be mounted, the arrangement form of the wiring conductor layer 12, the unit price (cost), and the like.

  Further, as shown in a plan view of the first substrate 10 viewed from the lower surface side in FIG. 4, a slit 21 may be provided in the disposal margin region 15. In the portion where the slit 21 is provided, the first substrate 10 is relatively easily deformed. Thereby, for example, even when a thermal stress is generated when the first substrate 10 and the second substrate 20 are joined by solder, the thermal stress is absorbed and relaxed by the slits 21 and the first substrate 10 is warped. Further, it can be effectively prevented.

  In the example shown in FIG. 4, the slit 21 penetrates the first substrate 10 in the thickness direction. For example, in the example shown in FIG. 4, the slit 21 has an elongated oval shape in a top view, and the long side is parallel to the outer periphery of the product region 14. Even when the slits 21 are provided, the width of the slits 21 (the dimension in the direction orthogonal to the outer periphery of the product region 14 adjacent to the slits 21 in a top view) is relatively small, so that the rigidity of the first substrate 10 is It can be ensured to the same extent as when there is no slit 21.

  In the example shown in FIG. 4, the slit 21 is provided at an intermediate portion between the outer peripheries of the adjacent product regions 14. In this case, the slit 21 is arranged in a straight line with the first connection portion 16 and the second connection portion 17. When the aggregate substrate A is cut between the product regions 14, the slits 21 are also removed. Therefore, it is difficult for the traces of the slits to remain on the side surfaces of the individual wiring boards.

  Such a slit 21 may have a rectangular shape along each outer periphery of each product region 14. The width of the slit 21 is, for example, about 10 to 30% with respect to the distance between adjacent product regions 14 (the width of the discard margin region 15). Further, the length of the slit 21 (the length of the long side in the top view) may be set to, for example, about 50 to 120% with respect to the outer peripheral length of the adjacent product region 14.

  The slit 21 is formed by various cutting processes. Examples of the cutting processing include router processing and laser processing. Note that the slit 21 may be formed so as to be completely included in the cutting region or completely removed from the cutting region. Thereby, when cutting the collective substrate A, the escape of the cutting blade can be prevented and cutting can be performed with high accuracy.

  That is, the manufacturing method of the aggregate substrate A including the slits 21 includes a step of forming the slits 21 by a processing method such as router processing or laser processing in addition to the above-described steps. This processing is performed along the outer periphery of the product region 14 in the disposal margin region 15 of the first substrate 10. Further, this processing is performed so as to penetrate the first substrate 10 in the thickness direction.

  Further, as shown in FIG. 5 or FIG. 6, a through-hole 22 may be provided in both or one of the first connection portion 16 in the first substrate 10 and the second connection portion 17 in the second substrate 20. . A bonding material 30 is injected into the through hole 22 to bond the first substrate 10 and the second substrate 20 together. By accommodating the bonding material 30 in such a through hole 22, it is possible to suppress the bonding material 30 from protruding into the product region 14. Moreover, since the clearance gap between the 1st board | substrate 10 and the 2nd board | substrate 20 can be reduced, the cutting property at the time of dividing | segmenting the aggregate substrate A improves.

  In the example shown in FIG. 5, the through hole 22 penetrates the first substrate 10 and the second substrate 20. That is, the through hole 22 penetrates the collective substrate A in the thickness direction. At this time, since the internal capacity of the through hole 22 is increased, a large amount of the bonding material 30 can be injected, so that it is easy to strongly bond the first substrate 10 and the second substrate 20.

  In the case of the example shown in FIG. 6, the through hole 22 penetrates the second substrate 20 at the second connection portion 17. The through hole 22 does not extend to the first substrate. That is, the portion where the first connection portion 16 and the second connection portion 17 face each other is the bottom portion of the through hole 22. At this time, since the bonding material 30 stays at the bottom of the through hole 22, the bonding material 30 can be easily injected.

  Note that the plurality of through holes 22 may be a mixture of those that penetrate both the first substrate 10 and the second substrate 20 and those that penetrate only one of the second substrate 20 and the like, for example. I do not care. At this time, it is easy to adjust the balance between the bondability of the first substrate 10 and the second substrate and the injection property of the bonding material 30.

  Further, the arrangement of the plurality of through holes 22 may not be equal. For example, as in the example shown in FIGS. 5 and 6, the adjacent interval between the through holes 22 is close to a portion (corner portion) where the first and second first connecting portions 16 (or second connecting portions 17) intersect each other in plan view. It may be relatively narrow. Such a corner portion receives a greater force from the cutting blade when cutting the aggregate substrate A than the center portion. For this reason, by arranging the through holes 22 closely in the corner portions, the bonding strength can be improved and resistance to the force applied during cutting can be provided.

  Further, the sizes of the plurality of through holes 22 in plan view need not be the same as each other, and may be different from each other. A large bonding strength can be effectively imparted by arranging a large through-hole 22 at a place where the bonding strength is required. However, having the same shape and size is advantageous in terms of productivity.

  The manufacturing method of the aggregate substrate A including the through holes 22 includes a step of forming the through holes 22 by, for example, drilling in addition to the above steps. This processing is performed on both or one of the first connection portion 16 of the first substrate 10 and the second connection portion 17 of the second substrate 20. The through hole 22 not only accommodates the bonding material 30 but can also be used as an alignment mark when, for example, the first substrate 10 and the second substrate 20 are placed facing each other. When the through holes 22 are formed in both the first substrate 10 and the second substrate 20, the two substrates can be placed with high accuracy by overlapping the through holes 22 of the both substrates in a top view. For example, when the through hole 22 is formed only in the second substrate, the through hole 22 and the first connecting portion 16 may be overlapped.

  If the through holes 22 are formed at positions close to the corners of the product region 14, vibration of the corners of the product region 14 is suppressed when cutting the collective substrate A, and the corners are prevented from being lost. It is effective to do.

DESCRIPTION OF SYMBOLS 10 1st board | substrate 13 Solder resist layer 14 Product area | region 14a Component mounting surface 14b Board | substrate connection surface 15 Discard allowance area | region 16 1st connection part 17 2nd connection part 20 2nd board | substrate 30 Joining material A Collective board

Claims (8)

A plurality of product regions having a component mounting surface and a board connection surface that are vertically and horizontally arranged, and a disposal area that surrounds the product region and includes a plurality of first connection portions on the substrate connection surface side. 1 substrate,
A second substrate having a surface including a second connection portion arranged corresponding to the arrangement of each of the first connection portions,
The collective substrate, wherein the first connection portion and the second connection portion face each other and are bonded by a bonding material.   The said 1st board | substrate has a soldering resist layer provided with the opening part which exposes the said 1st connection part on the said board | substrate connection surface side, The said joining material is solder, The soldering material is characterized by the above-mentioned. The collective board described.   3. The collective substrate according to claim 1, wherein the first substrate has a slit along the outer periphery of the product region in the discard margin region.   4. The collective substrate according to claim 1, wherein a through-hole is provided in at least one of the first connection portion in the first substrate and the second connection portion in the second substrate. A plurality of product regions having a component mounting surface and a board connection surface that are vertically and horizontally arranged, and a disposal area that surrounds the product region and includes a plurality of first connection portions on the substrate connection surface side. Preparing one substrate;
Preparing a second substrate having a surface including a second connection portion arranged corresponding to the arrangement of each of the first connection portions;
Superposing the first connection portions on the corresponding second connection portions via a bonding material, and bonding the first connection portions and the second connection portions to each other with the bonding materials;
A method for manufacturing an aggregate substrate, comprising:   The said 1st board | substrate further includes the process of providing the soldering resist layer provided with the opening part which exposes the said 1st connection part on the said board | substrate connection surface side, Solder is used as the said bonding material, The manufacturing method of the collective substrate as described.   The method for manufacturing a collective substrate according to claim 5, further comprising a step of forming a slit in the discard margin area along an outer periphery of the product area.   8. The method according to claim 5, further comprising a step of forming a through hole in at least one of the first connection portion in the first substrate and the second connection portion in the second substrate. Method for manufacturing a collective substrate.

Images