JP2018130925A - Resin-metal bonded body and semiconductor sensor using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a resin-metal bonded body with high bonding reliability, which is acquired by bonding a metal member having a roughened area and a non-roughened area with a resin member.SOLUTION: Provided is a resin-metal bonded body which includes, in a bonded manner: a metal member 10 having a metal pin 11 including one end side 11a and the other end side 11b and a flange part 12 formed integrally with the pin between the one end side and the other end side; and a resin member 20. The flange part 12 has a roughened area 121 with unevenness of a micro-order height formed in a size larger than that of the metal pine 11 in a radial direction by taking the extending direction of the metal pin 11 as the axis and taking the axis as a normal direction. The resin member 20 seals an area neighboring to the flange part out of the flange part 12 and the metal pin 11 of the metal member 10. Thereby, progression of exfoliation is suppressed by the flange part 12 even if there is exfoliation generated in the interface between the metal pin 11 and the resin member 20. This provides a resin-metal bonded body with high bonding reliability.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin-metal bonded body in which a surface of a metal member and a resin member are bonded, and a semiconductor sensor including the same.

  As this type of resin-metal bonded body (hereinafter referred to as “bonded body”), for example, a bonded body described in Patent Document 1 is known. In the joined body described in Patent Document 1, the metal surface has a region in which micro-order irregularities are formed (hereinafter referred to as “roughened region”). The micro-order unevenness is provided such that the unevenness is provided with a period of 1 to 10 μm, and the height difference of the unevenness is about half of the period. Further, nano-order fine irregularities with a period of 10 to 500 nm are formed on the inner wall surface of the recesses on the surface where the irregularities are formed. Thereby, an anchor effect arises because a resin member enters into the crevice of a metal surface, and the joined object by which the metal surface and resin were joined firmly is obtained.

  Such a joined body can be used as a part of a semiconductor sensor. For example, a connector case is used as the resin member, and a connector pin having a roughened area formed on the surface is used as the metal member, and a part of the connector pin is sealed to the connector case. And it is set as the semiconductor sensor provided with such a joined body and a sensor chip, and the connector pin was connected to the sensor chip. In a semiconductor sensor including such a joined body, for example, a pressure sensor, since the surface of the metal member and the resin member are firmly connected, the peeling at the interface between the roughened region and the resin member on the surface of the metal member is prevented. The device is less likely to occur and has high bonding reliability.

Japanese Patent No. 5237303

  As described above, in the joined body described in Patent Document 1, since the roughened region of the metal member and the resin member are firmly joined, the resin member peels from the roughened region of the metal member at these interfaces. Hateful.

  However, as such a joined body, a roughened region and a flat region in which a roughened region is not formed (hereinafter referred to as “non-roughened region”) at the interface between the surface of the metal member and the resin member are made of metal. Some are provided on the surface of the member. The non-roughened area does not have a shape that allows the resin member to enter and exhibits an anchor effect as in the case of a recess, etc., but is in close contact with the resin member, but is strongly bonded to the resin member compared to the roughened area. This is not an area. In a joined body including a metal member having such a roughened region and a non-roughened region, when peeling between the metal member and the resin member occurs in the non-roughened region, the peeling can proceed to the roughened region. .

  Specifically, since the metal member and the resin member are not strongly bonded in the non-roughened region, when such a bonded body is exposed to an environmental change such as a thermal cycle, the metal member and the resin member are The resin member can be peeled off from the metal member due to the stress caused by the difference in thermal expansion coefficient. Then, when the peeling that occurs in the non-roughened region proceeds to the boundary between the non-roughened region and the roughened region, the peeling in the non-roughened region proceeds to the roughened region, and the metal member and the resin member The reliability of bonding will be reduced.

  Moreover, even if it is a joined body in which the metal member and the resin member are in contact with each other only in the roughened region of the surface of the metal member and joined, as in the joined body described in Patent Document 1, these are caused for some reason. When peeling occurs at a part of the interface, it is difficult to stop the progress.

  The present invention has been made in view of the above points, and is a resin-metal bonded body, which is a resin having high bonding reliability even when a roughened region and a non-roughened region are present on the metal surface. An object is to provide a metal bonded body and a semiconductor sensor including the metal bonded body.

  In order to achieve the above object, a resin-metal bonded body according to claim 1 is a resin-metal bonded body in which a metal member (10) and a resin member (20) are bonded, and the metal member is made of a resin member. The metal pin (11) having one end (11a) and the other end (11b) that are exposed and the metal pin are formed between the one end and the other end in the length direction that is integrated with the metal pin and extends. And a flange (12) having a thickness larger than the maximum thickness of the metal pin on a plane composed of a radial direction with the length direction as an axis. In such a configuration, a region adjacent to the flange portion of the metal member and the flange portion of the metal member is sealed by the resin member, and the surface of the flange portion has unevenness of micro-order height. A roughened region (121) is formed.

  As a result, even if interface peeling between the metal member and the resin member occurs in the non-roughened region of the metal member, the peeling progress direction is linear due to the structure in which the collar portion is formed. In other words, the bonded body has a structure in which the progress of the interfacial peeling is hindered. As a result, compared with the conventional joined body, the interfacial peeling between the metal member and the resin member is less likely to proceed, and the joined body has high joining reliability.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows an example of a corresponding relationship with the specific means as described in embodiment mentioned later.

It is sectional drawing which shows the resin metal joined body of 1st Embodiment. It is an expanded sectional view which shows the joining structure of the metal member and resin member in the area | region shown to II in FIG. It is an expanded sectional view which shows the joining direction of the metal member and resin member in the conventional resin metal joined body, and the advancing direction of peeling. It is an expanded sectional view which shows the joining structure of the metal member and the resin member in the area | region shown by IV in FIG. 3, and the advancing direction of peeling. It is an expanded sectional view which shows the joining structure of the metal member and resin member in 1st Embodiment, and the advancing direction of peeling. FIG. 6 is an enlarged cross-sectional view illustrating a joining structure between a metal member and a resin member in a region indicated by VI in FIG. 5 and a traveling direction of peeling. It is sectional drawing which shows the arrangement | positioning relationship between the metal member and resin member in the resin metal joined body of 2nd Embodiment. It is a layout figure which shows the arrangement | positioning relationship of a metal member and a collar part when the resin metal joined body of 2nd Embodiment is seen from the other end side of the metal pin in FIG. It is sectional drawing which shows the thickness of the resin member in the resin metal joined body of 2nd Embodiment. It is sectional drawing which shows the shape of the collar part in the resin metal joined body of 3rd Embodiment. In the resin metal joined body of 3rd Embodiment, it is a layout figure which shows the formation position of the recessed part in a collar part when it sees from the other end side of a metal pin. It is sectional drawing which shows the shape of the collar part in the resin metal joined body of other embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
The joined body of 1st Embodiment is described with reference to FIGS. In FIG. 1, the drawing is simplified for easy understanding of the outline of the joined body of the present embodiment, and roughened regions 111 and 121 formed in the metal pin 11 and the flange portion 12 described later are omitted. .

  As shown in FIG. 1, the joined body of the present embodiment covers the resin molded body 30, a part of the surface of the resin molded body 30, and a part of the metal member 10 protruding from one surface 30 a of the resin molded body 30 It has the resin member 20 to do. The resin molded body 30 includes a sensor chip 32 that generates an electrical output corresponding to a physical quantity such as pressure, magnetism, and light quantity of the measurement medium. The sensor chip 32 is electrically connected to the metal member 10 via a wire 33 made of a conductive material such as A1 or Au in the resin molded body 30.

  In the joined body of the present embodiment, for example, the resin molded body 30 is set in a mold or the like, a resin material constituting the resin member 20 is injection-molded, and a part of the surface of the resin molded body 30 and one of the protruding metal members 10 are formed. By sealing the part, the configuration shown in FIG. 1 is obtained.

  The joined body of the present embodiment is preferably applied to a semiconductor sensor or the like that is mounted on a vehicle such as an automobile and generates an electrical output corresponding to the physical quantity of the measurement medium. As shown in FIG. It constitutes a pressure sensor.

  In this embodiment, the metal member 10 includes a metal pin 11 made of a rod-shaped metal and a flange 12 formed so as to be integrated with the metal pin 11 as shown in FIG. A part of the metal pin 11 and the flange 12 of the metal member 10 are sealed with the resin member 20.

  The metal pin 11 is for electrically connecting the sensor chip 32 and an external wiring member (not shown), and in the present embodiment, has a quadrangular prism shape. One end side 11 a of the metal pin 11 is covered with the resin molded body 30, and the remaining portion protrudes from one surface 30 a of the resin molded body 30. Further, as shown in FIG. 1, the remaining portion of the metal pin 11 is formed so as to be integrated with the flange portion 12 and is sealed together with the flange portion 12 by the resin member 20 outside the resin molded body 30. Yes. The other end 11 b, which is the tip of the remaining portion of the metal pin 11, protrudes from the opening 21 formed in the resin member 20 and is exposed from the resin member 20.

  In the present embodiment, as shown in FIG. 2, the metal pin 11 causes an anchor effect when the resin member 20 enters at least a region adjacent to the flange portion 12 on the surface thereof, so that the metal member 10 and the resin member 20 are formed. A roughened region 111 for improving the bonding strength is formed.

  The roughened region 111 has, for example, unevenness (hereinafter referred to as “micro unevenness”) in which the surface roughness Ra, which is the arithmetic average roughness specified in the Japanese Industrial Standard (JIS standard), is in the micron order (eg, 1 to 10 μm). It is a formed region. In the roughened region 111, for example, fine unevenness (hereinafter referred to as “nano unevenness”) having a surface roughness Ra of nano order (for example, 10 to 500 nm) may be formed on the surface of the micro unevenness.

  The roughened region 111 is preferably formed in a region of the metal pin 11 adjacent to at least the flange portion 12 described later from the viewpoint of suppressing the progress of peeling between the metal member 10 and the resin member 20.

  The roughened region 111 has a shape in which the material of the resin member 20 can easily enter when covered with the resin member 20. For example, laser processing, blasting, polishing, plasma irradiation, chemical chemical treatment, etc. for the micro unevenness of the roughened region 111, and laser processing, blasting, chemical chemical processing, etc. for the nano unevenness of the roughened region 111, etc. It is formed by any processing method.

  Specifically, for example, when the roughened region 111 is formed by laser irradiation, the surface of the metal pin 11 is irradiated with laser light having a predetermined energy density, and the metal material near the surface is partially melted or evaporated. Thereby, micro unevenness | corrugation can be formed. Further, for example, the metal material evaporated by laser irradiation can be deposited on the micro unevenness or other regions, and the nano unevenness can be formed by solidifying the metal material.

  At least one end side 11a and the other end side 11b of the metal pin 11 are non-roughened regions 112, which are regions where the roughened region 111 is not formed, from the viewpoint of connection stability with the wire 33 or a wiring member (not shown). It is preferable that The non-roughened region 112 of the metal pin 11 is not formed with irregularities that allow the resin member 20 to enter, and has a flat shape, for example. Therefore, the non-roughened region 112 is a region where connection such as wire bonding or contact connection such as insertion into another member is easily performed, and the connection with the wire 33 or a wiring member (not shown) is stably performed.

  In addition, in FIG. 1 etc., although the metal pin 11 has shown the example made into the square pillar rod shape, you may make it a cylindrical rod shape and may be made into other arbitrary rod shapes. Moreover, although the metal pin 11 is made into the linear rod shape, the process of bending etc. may be carried out as needed.

  The flange portion 12 is formed so as to be integrated with the metal pin 11, and even in the case where peeling occurs at the interface between the metal pin 11 and the resin member 20, the flange portion 12 is formed in the bonding region between the metal member 10 and the resin member 20. This is a member provided to prevent the peeling from further proceeding and to maintain adhesion.

  Specifically, the dimension in the radial direction of the collar part 12 of the metal member 10 is larger than the dimension in the radial direction of the region of the metal member 10 where the collar part 12 is not formed. That is, the flange portion 12 swells more than the metal pin 11 in the radial direction.

  Thereby, even if peeling occurs between the metal pin 11 and the resin member 20, the peeling progress direction changes in the region where the flange 12 is formed, so that the peeling between the flange 12 and the resin member 10 occurs. Is suppressed, and the reliability of joining of the metal member 10 and the resin member 20 is improved. The improvement of the bonding reliability due to the formation of the flange 12 will be described in detail later.

  In the present embodiment, the flange portion 12 has a shape formed by connecting two cones having the same size with each other at the bottom surface (hereinafter referred to as “abacus sphere”), and is made of metal or the like. The flange 12 is formed, for example, by caulking a metal block to the metal pin 11, joining metal powder to the metal pin 11 by metal spraying, or dipping solder.

  Specifically, for example, a doughnut-shaped metal block is prepared separately from the metal pin 11, and the metal pin 11 is passed through the hole in the center of the metal block and then caulked by using a mold or the like. 12 can be formed. For example, the collar part 12 can also be formed by metal spraying which sprays the metal spray 11 to the thermal spray material which melt | dissolved metal powder using plasma etc.

  In addition, when the collar part 12 is comprised with a metal material, the collar part 12 should just be what can form the roughening area | region 121 mentioned later, joining with the metal pin 11, and is comprised with the metal material same as the metal pin 11. Alternatively, the metal pin 11 may be made of a different metal material.

  The flange 12 is preferably formed by plastic deformation by a method such as caulking a metal material in a room temperature environment, that is, cold forging. In cold forging, it is not necessary to heat the metal, so in addition to high processing accuracy, it is possible to obtain a high-strength member that does not interrupt the fiber flow line of the metal material in the middle, such as cutting. This is because it is a possible processing method. Moreover, it is because the roughening area | region 121 mentioned later can also be formed in the collar part 12 simultaneously with formation of the collar part 12 by cold forging, and a manufacturing process can be shortened and cost reduction can be anticipated.

  As shown in FIG. 2, a roughened region 121 is formed on the surface of the flange portion 12 to cause the anchor effect by allowing the resin member 20 to enter and to improve the bonding strength with the resin member 20. . The roughened region 121 is formed by an arbitrary processing method similar to the roughened region 111 of the metal pin 11. The roughened region 121 is preferably formed at least in a region adjacent to the roughened region 111 from the viewpoint of suppressing peeling between the metal member 10 and the resin member 20, and is formed in the entire region of the surface of the flange portion 12. It is more preferable.

  Note that the roughened region 121 is, for example, a region where micro unevenness is formed in the same manner as the roughened region 111. Specifically, when the roughened region 121 is not formed on the surface of the flange 12, the smoothed surface is defined as a virtual surface, and the height of the roughened region 121 in the normal direction with respect to the virtual surface is in the micro order. This is a region where micro unevenness is formed. Further, similarly to the roughened region 111, nano-order nano unevenness may be formed on the surface of the micro unevenness of the roughened region 121.

  Further, the roughened region 121 may be formed together with the roughened region 111 when forming the roughened region 111 on the metal pin 11, or when the flange portion 12 is formed by cold forging as described above, You may form simultaneously with formation of the collar part 12. FIG. Specifically, after forming the flange portion 12 on the metal pin 11, the roughened region 111 and the roughened region 121 are formed by laser irradiation or the like, or the metal pin 11 on which the roughened region 111 is formed by laser irradiation or the like. It can be formed simultaneously with the formation of the collar portion 12. In addition, the metal member 10 shown in FIG. 2 is an example formed in the former process.

  In this embodiment, the resin member 20 is made of a thermoplastic resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate), and is injection-molded so as to seal a part of the resin molded body 30. It is formed by performing. The resin member 20 may be added with an additive having a functional group such as a hydroxyl group or an epoxy group, if necessary, in order to improve the adhesion with the resin molded body 30.

  As shown in FIG. 2, the resin member 20 seals a region including the roughened region 111 and the flange portion 12 of the metal pin 11 in the metal member 10. Thereby, even if peeling occurs at the interface between the metal member 10 and the resin member 20 on the one end side 11a or the other end side 11b which is the non-roughened region 112 of the metal member 10, the progress of the peeling by the flange portion 12 occurs. Is suppressed. This will be described in detail later.

  As shown in FIG. 1, the resin molded body 30 includes a metal member 10, a sensor chip 32, a wire 33 that electrically connects them, and a coating resin 31 in this embodiment.

  In this embodiment, the coating resin 31 seals a part of the sensor chip 32, one end side 11a connected to the wire 33 among the wire 33 and the metal member 10, and is, for example, a thermosetting resin such as an epoxy resin. It becomes by. The coating resin 31 may contain a filler made of an insulating material such as silica or alumina as necessary from the viewpoint of adjusting the linear expansion coefficient. The coating resin 31 is formed, for example, by performing molding such as transfer molding or compression molding and thermosetting.

  In addition, from the viewpoint of improving the adhesion to the resin member 20, the coating resin 31 contains an additive having a functional group that chemically reacts with the additive when the resin member 20 contains an additive. May be.

  The sensor chip 32 is a semiconductor element that generates an electrical output according to a physical quantity such as pressure, magnetism, and light quantity of a measurement medium, for example, an element used for a pressure sensor, a magnetic sensor, an optical sensor, and the like, and is made of a semiconductor material such as silicon. Become. In the present embodiment, the sensor chip 32 is electrically connected to the one end 11 a side of the metal pin 11 via the wire 33. The sensor chip 32 is formed by a known semiconductor process. In the present embodiment, the sensor chip 32 is, for example, an element that detects pressure.

  When the sensor chip 32 is an element for detecting pressure as in the present embodiment, the sensor chip 32 is exposed to the coating resin 31 and the pressure is measured as shown in FIG. A space 31a is formed.

  The above is the basic configuration of the joined body of the present embodiment. Next, it will be described with reference to FIG. 3 to FIG. 6 that the metal member 10 has a configuration in which the flange portion 12 is formed, so that the progress of peeling from the resin member 20 can be suppressed. In FIGS. 3 to 6, for the sake of easy understanding, portions other than the joint portion between the metal member 10 and the resin member 20 and the vicinity thereof are omitted.

  FIG. 3 shows a conventional joined body in which the conventional metal member 101 and the resin member 200 in which the flange portion 12 is not formed are joined. The metal member 101 includes a roughened region 1011 for improving the bonding strength with the resin member 200 and a non-roughened non-roughened region 1012, and a part of the roughened region 1011 and the non-roughened region 1012 is formed. Sealed by the resin member 200. One end side 101 a of the metal member 101 that is the non-roughened region 1012 protrudes from the resin member 200 and is exposed.

  The anchor effect or the like does not work between the resin member 200 and the non-roughened region 1012, and these are not strongly bonded as compared with the roughened region 1011. Therefore, peeling may occur at the interface between the resin member 200 and the non-roughened region 1012 due to stress such as stress caused by a difference in thermal expansion coefficient between members in a cooling cycle or the like. When such peeling occurs, the peeling proceeds along the Y1 direction, which is a direction from the non-roughened region 1012 to the roughened region 1011 as shown in FIG. 3 or FIG. At this time, as shown in FIG. 3, when the metal member 101 has a linearly extending shape, the peeling progresses along the Y1 direction, and the roughened region is strongly bonded to the resin member 200 by the anchor effect. In 1011 also, the metal member 101 and the resin member 200 are peeled off. As a result, the peeling that occurs from the one end side 101a of the metal member 101 proceeds to the other end side, and the bonding reliability between the metal member 101 and the resin member 200 decreases.

  That is, in the conventional joined body, since the joining interface between the metal member 101 and the resin member 200 is linearly arranged, the roughened region 1011 is provided in the metal member 101 when peeling occurs. However, it was difficult to suppress the progress of peeling along the Y1 direction.

  On the other hand, in the joined body of the present embodiment, as shown in FIG. 5, the metal member 10 has a configuration in which the flange portion 12 including the roughened region 121 is formed. And in the area | region where the collar part 12 was formed in the metal pin 11, the dimension in the radial direction centering on the length direction of the metal pin 11 as an axis | shaft is large. That is, unlike the metal member 101, the metal member 10 has a structure including a portion extending linearly along the length direction of the metal pin 11 and a portion swelled in the radial direction by the flange portion 12. For this reason, the joined body of the present embodiment does not have a structure in which the joining interface between the metal member 10 and the resin member 20 is linearly arranged. However, similarly to the above-described conventional joined body, the other end 11b of the metal pin 11 which is the non-roughened region 112 protrudes from the resin member 20 and is exposed.

  In the joined body of this embodiment, as shown in FIG. 6, when peeling occurs between the non-roughened region 112 and the resin member 20 due to stress such as stress, the peeling is Y1 as in the conventional joined body. Proceed along the direction. However, even if the peeling proceeds to the roughened region 111 of the metal pin 11 along the Y1 direction, the flange 12 is formed. It changes to the surface direction of the resin member 20 and the interface, that is, the Y2 direction shown in FIG. 5 or FIG. That is, when the flange 12 is formed on the metal pin 11, the peeling progress direction changes from the Y1 direction to the Y2 direction. As a result, the peeling between the roughened region 111 and the resin member 20 stops at the flange portion 12 and is prevented from progressing to the interface between the roughened region 121 and the resin member 20. Further, in the joined body of this embodiment having a structure in which the roughened region 121 is formed in the flange portion 12, the region in which the metal member 10 and the resin member 20 are firmly adhered by the anchor effect is the same as that in the conventional joined body. It becomes wider than that. Therefore, in the joined body of the present embodiment, even if the non-roughened region 112 and the resin member 20 are peeled from the other end side 11b, the progress of the peeling is suppressed by the flange 12, and the peeling is performed to the one end side 11a. Never reach. Therefore, the joined body of the present embodiment is a joined body having higher joining reliability between the metal member 10 and the resin member 20 than the conventional joined body.

  In the above description, the example in which the peeling of the metal member 10 and the resin member 20 has progressed from the other end side 11b has been described. However, the same effect is achieved even when the interface peeling has progressed from the one end side 11a. Thus, the progress of the interfacial peeling is suppressed by the flange 12.

  According to the present embodiment, even in the case where interface peeling occurs in the non-roughened region 112 in the interface between the metal member 10 and the resin member 20, the flange portion 12 is formed. The direction of peeling is not linear. Therefore, the progress of the interfacial peeling in the non-roughened region 112 is hindered by the flange 12 and does not proceed easily, resulting in a bonded body with higher bonding reliability between the metal member 10 and the resin member 20 than the conventional bonded body. .

(Second Embodiment)
The joined body of 2nd Embodiment is described with reference to FIGS. 7 to 9 are deformed for easy understanding of the configuration, and the regions other than the region where the metal member 10 and the resin member 20 are joined and the roughened regions 111 and 121 are omitted. Moreover, in FIG.7 and FIG.8, the collar part 12 in another cross section is shown with the broken line. In FIG. 8, the left-right direction on the paper surface is the X direction, and the direction orthogonal to the X direction on the paper surface is the Y direction.

  As shown in FIG. 8, the joined body of the present embodiment includes a plurality of metal members 10, and these metal members 10 are arranged with their length directions aligned and spaced apart from each other. And the collar part 12 formed in each metal member 10 is another metal member 10 (hereinafter referred to as “adjacent metal member”) adjacent to the metal member 10 in which the collar part 12 is formed along the X direction and the Y direction. ) And the resin member 20. In other words, the flange 12 needs to have a radial plane as a radial plane of the metal pin 11 so that it does not come into contact with another flange 12 (hereinafter referred to as “adjacent flange”) formed on the adjacent metal member. Accordingly, the metal pin 11 is formed at a position different from the position on the radial plane to which the adjacent flange portion belongs. These points are different from the first embodiment. In the present embodiment, these differences will be mainly described.

  In the present embodiment, a plurality of, for example, six metal members 10 are formed, and are electrically connected to the sensor chip 32 and the like, respectively. And these metal members 10 are arrange | positioned mutually apart along the X direction and the Y direction, as shown in FIG. In the present embodiment, three metal members 10 linearly arranged along the X direction are arranged in two rows in the Y direction, and are arranged so that the two metal members 10 face each other along the Y direction. Has been.

  In addition, about the number of metal members 10, and its arrangement | positioning, it is arbitrary and is not restricted to said example, You may be set as another number and arrangement | positioning.

  In this embodiment, the flange portion 12 is formed one by one on each metal member 10 and, as shown in FIG. 7 or FIG. 8, another metal adjacent to the metal member 10 on which the flange portion 12 is formed. It arrange | positions so that the member 10 may not be contacted. Specifically, in the present embodiment, the flange portion 12 is disposed with the adjacent metal member and the resin member 20 separated from each other along the X direction or the Y direction. In other words, the flange 12 is not in contact with the adjacent metal member, that is, the formation position in the length direction of the metal pin 11 is different from the position on the radial plane to which the adjacent flange belongs (hereinafter referred to as “adjacent flange position”). It is formed to be.

  More specifically, as shown in FIG. 8, when the six metal members 10 are viewed from the other end 11b side, the three metal members 10 formed on the three metal members 10 that are not adjacent to each other in the X direction and the Y direction. The collar part 12 is arrange | positioned at zigzag form. And these three collar parts 12 arrange | positioned in zigzag form are arrange | positioned so that it may belong on the same radial plane. Further, the three flanges 12 formed on the remaining three metal members 10 are arranged in a staggered manner in the same manner as the previous three flanges 12 and are made of metal so as not to contact the previous three flanges 12. The pins 11 are shifted in the length direction.

  The flange 12 may be formed at the same position as the adjacent flange position of the metal pin 11 on which the flange 12 is formed as long as it does not contact with the other flange 12, but is different from the adjacent flange position. It is preferable to be formed at a position. This is because the collar 12 can be formed larger when the collar 12 is formed at a position different from the adjacent collar position than when the collar 12 is formed at the same position as the adjacent collar position. It is. That is, by enlarging the flange portion 12, the bonding area between the flange portion 12 on which the roughened region 121 is formed and the resin member 20 can be increased, and the bonding reliability between the metal member 10 and the resin member 20 is further increased. It is because it can do.

  In addition, about the arrangement | positioning of the collar part 12, the collar part 12 should just be made so that it may not contact with the other metal member 10 which adjoins, It is not restricted to said zigzag-shaped arrangement | positioning, You may be made other arrangements. .

  Next, the formation of a thin portion of the resin member 20 to be described later and the improvement of the joining reliability due to the formation of the flange portion 12 will be described with reference to FIG.

  As shown in FIG. 9, among the resin members 20 filled in the gaps between the adjacent metal members 10, the width in the region where the flange 12 is not formed is A1, and the width in the region where the flange 12 is formed is A2. Then, A1> A2. That is, the thickness (A2) of the resin member 20 in the region where the flange portion 12 is formed in the gap between the adjacent metal members 10 is thinner than the thickness (A1) in the region where the flange portion 12 is not formed.

  By using the metal member 10 having the flange 12 formed in this manner, a region where the thickness of the resin member 20 in the region where the flange 12 is formed (hereinafter referred to as “thin wall portion”) is formed. It is preferable. By suppressing the generation of bubbles, that is, voids, in the thin-walled portion of the resin member 20, defects such as cracks due to the generation of voids can be suppressed, and the reliability of the bonding between the metal member 10 and the resin member 20 in the vicinity of the flange portion 12 is suppressed. This is because of the increase. Specifically, when molding a resin molded product by injection molding or the like, the thinner the resin thickness, the shorter the time required for air to escape from the interior of the molded product, making it less likely that bubbles remain inside. Therefore, it is difficult to obtain a molded product containing a large-sized void inside. Thereby, generation | occurrence | production of a big size void is suppressed in the thin part of the resin member 20. FIG.

  On the other hand, since the thickness of the resin member between adjacent metal members is generally increased in the conventional joined body in which a plurality of metal members including the metal pins 11 are provided and these are joined to the resin member, it is large. It is likely to include voids of size, and the reliability of bonding is lowered.

  Therefore, by using a joined body constituted by the metal member 10 and the resin member 20 in which the flange portion 12 is formed, the joining reliability is improved as compared with the conventional joined body.

  According to the present embodiment, as in the first embodiment, the progress of the interfacial peeling in the non-roughened region 112 is hindered by the flange 12 and does not proceed easily. A bonded body with high bonding reliability with the resin member 20 is obtained. Further, in the configuration including a plurality of metal members 10, the formation of the flange portion 12 suppresses the generation of voids due to the formation of a thin portion of the resin member 20 between the adjacent metal members 10, compared to a conventional joined body. Thus, a bonded body with high bonding reliability is obtained.

(Third embodiment)
The joined body of the third embodiment will be described with reference to FIGS. 10 and 11. In FIGS. 10 and 11, the structure is deformed for easy understanding, and the regions other than the region where the metal member 10 and the resin member 20 are joined and the roughened regions 111 and 121 are omitted. Moreover, in FIG. 10, FIG. 11, the collar part 12 in another cross section is shown with the broken line.

  As shown in FIG. 10 or FIG. 11, the joined body of the present embodiment is recessed with a dimension larger than the height of the micro unevenness of the roughened region 121 in the flange 12 in addition to the configuration of the second embodiment. The point which the hollow part 122 is formed differs from the said 2nd Embodiment. In the present embodiment, this difference will be mainly described.

  Here, “the height of the micro unevenness” refers to a plane obtained by connecting the bottoms of the recesses of the unevenness on the micro unevenness forming surface, and the recesses of the unevenness in the normal direction to the virtual plane. Among the distances between the bottom of the projections and the tops of the projections of the projections and depressions, it is the maximum distance.

  The recess 122 is formed in the flange 12 and has a shape that is larger than the height of the micro unevenness in the roughened region 121, for example, a shape recessed in the millimeter order (for example, 1 mm or more). As shown in FIG. 10 or FIG. 11, the recess 122 is formed between the metal member 10 and the resin member 20 by an anchor effect in a region different from the roughened region 121 by allowing the resin member 20 to enter the recess in the millimeter order. It is formed in order to improve adhesion. The recessed portion 122 is formed simultaneously with the formation of the flange portion 12 such as cold forging using a mold, or by post-processing after the formation of the flange portion 12 such as punching or etching.

  About the formation position of the hollow part 122, since it should just exhibit the anchor effect, it is arbitrary, From the viewpoint of forming the thin part of the resin member 20 demonstrated in the said 2nd Embodiment, the position which faces an adjacent metal member, Different positions are preferred. Thereby, it can be set as the joined body which improved the joining reliability of the metal member 10 and the resin member 20 by the anchor effect by the hollow part 122, forming the thin part of the resin member 20 and suppressing generation | occurrence | production of a void.

  Although FIG. 10 or FIG. 11 shows an example in which one recess 122 is provided in every flange 12 of the metal member 10, it is not always necessary to form it in all the flanges 12. In addition, a plurality of depressions 122 may be formed in one brim 12.

  The depression 122 only needs to exhibit the above-described anchor effect, and thus is not limited to a depression shape in which a part of a sphere is missing from the collar part 12 illustrated in FIG. 10 or FIG. It may be made into other arbitrary dent shape. In addition, in the example shown in FIG. 10 or FIG. 11, the hollow portion 122 is shaped to penetrate to the other surface of the flange portion 12, but is not shaped to penetrate to the other surface of the flange portion 12. Also good.

  According to the present embodiment, similarly to the above-described embodiments, a bonded body having higher bonding reliability between the metal member 10 and the resin member 20 than the conventional bonded body is obtained. In addition, by being configured to include a plurality of metal members 10 in which the flange portion 12 having the recess portion 122 is formed, it is possible to suppress the generation of voids due to the formation of the thin portion of the resin member 20 and the anchor effect due to the recess portion 122. Compared to the bonded body, the bonded body has high bonding reliability.

(Other embodiments)
Note that the joined body shown in each of the above embodiments is an example of the joined body of the present invention, and is not limited to each of the above embodiments, and is within the scope described in the claims. Can be changed as appropriate.

  For example, in each of the above-described embodiments, the example in which the collar part 12 has an abacus spherical shape has been described. However, the collar part 12 only needs to have a shape in which the thickness of the metal pin 11 is increased. As shown in (c), it may be disc-shaped, spherical, or drum-shaped. Further, as shown in FIG. 12 (d), the collar portion 12 may be formed into a shape in which the thickest part of the abacus sphere is widened in the length direction of the metal pin 11, an elliptical sphere, or the like. It may be said.

  Although each said embodiment demonstrated the example in which the one collar part 12 was formed in the one metal member 10, it is not restricted to this, The several collar part 12 may be formed in the one metal member 10. . Moreover, since the collar part 12 should just join with the metal pin 11 and can form the roughening area | region 121, it may be comprised not only with a metal material but with ceramics, such as a metal oxide.

  In each of the above-described embodiments, an example has been described in which Ra is 1 nm to 10 nm for the micro unevenness formed in the roughened region 111 and the roughened region 121, and Ra is 10 nm to 500 nm for the nano unevenness. However, the Ra of the micro unevenness and the nano unevenness may be set to the micro order or the nano order, as long as the anchor effect with the resin member 20 is exhibited, and may be any numerical value other than the above example.

  In each of the above-described embodiments, examples in which the micro unevenness and the nano unevenness are formed in the roughened region 111 and the roughened region 121 have been described. However, the roughened region 111 and the roughened region 121 need only have a shape that exhibits the anchor effect when the resin member 20 enters, and are not limited to the unevenness, and a shape having a large number of holes or a large number of holes. You may be made into the shape etc. which were connected to mesh shape. Such a shape can be formed by any processing method such as laser irradiation.

  In each of the above-described embodiments, the example in which the joined body constitutes the pressure sensor as a whole has been described. However, the sensor chip 32 may be an element that generates an electric output according to magnetism or the amount of light. The joined body is a magnetic sensor or an optical sensor as a whole. When the joined body is a magnetic sensor or an optical sensor, the sensor chip 32 may be entirely covered with the coating resin 31. The same applies to other embodiments.

  In each of the above embodiments, an example of a joined body in which a part of the surface of the resin molded body 30 including the sensor chip 32 is sealed with the resin member 20 and configures the pressure sensor as a whole has been described. It may be a metal molded body.

  Specifically, a metal molded body having a metal stem formed with a diaphragm that is displaced according to pressure, a sensor chip 32 joined to the diaphragm, and a housing connected to the metal stem; May be. In this case, a connector case is formed by the metal member 10 and the resin member 20, and is connected to the metal molded body by, for example, an O-ring or caulking. Then, the one end side 11a and the other end side 11b of the metal pin 11 are exposed from the resin member 20, and the one end side 11a is electrically connected to the sensor chip 32 via a wire or the like. It becomes a sensor.

  In addition, in such a pressure sensor, a different part from the composite body of the metal member 10 and the resin member 20 is set as the structure similar to a well-known pressure sensor. Even if the sensor chip 32 is an element that generates an output corresponding to a physical quantity other than pressure, and the bonded body is a semiconductor sensor that measures other physical quantities, the parts different from the composite are described. The structure is the same as that of a known semiconductor sensor.

DESCRIPTION OF SYMBOLS 10 Metal member 11 Metal pin 111 Roughening area | region 112 Non-roughening area | region 12 The collar part 121 Roughening area | region 122 Recessed part 20 Resin member 30 Resin molded object 32 Sensor chip

Claims (5)

A resin metal joined body in which the metal member (10) and the resin member (20) are joined,
The metal member includes a metal pin (11) having one end (11a) and the other end (11b) exposed from the resin member;
A diameter that is integrated with the metal pin and is formed between the one end and the other end in a length direction that is a direction in which the metal pin extends, and that has the length direction as an axis and a center axis of the axis. A flange (12) having a dimension larger than the maximum dimension of the metal pin in the direction,
Of the metal member, a region adjacent to the collar part of the collar part and the metal pin is sealed by the resin member, and the surface of the collar part has irregularities with a height of micro order. A resin-metal bonded body in which a roughened region (121) is formed. A plurality of the metal members are formed with the length direction aligned, and are disposed apart from each other,
2. The resin metal joint according to claim 1, wherein the flange portion is disposed such that the resin member is separated from another metal member adjacent to the metal member on which the flange portion is formed among the plurality of metal members. body.   3. The resin-metal bonded body according to claim 1, wherein the collar portion has one of a spherical shape, a disk shape, a drum shape, and an abacus spherical shape.   4. The ridge portion is formed with a recess portion (122) having a shape in which the surface is recessed with a size larger than the height of the unevenness of the roughened region. The resin metal joined body as described in any one of these. A semiconductor sensor comprising: the resin-metal bonded body according to any one of claims 1 to 4; and a sensor chip (32) that generates an electrical output corresponding to a physical quantity of a measurement medium,
A terminal electrically connected to the sensor chip;
A connector case formed so as to cover a part of the terminal,
The terminal is the metal member;
A semiconductor sensor in which the connector case is the resin member.

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