JP2018121024A - Substrate processing apparatus, dummy dispensing method and computer readable storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve downsizing of a process unit while inhibiting liquid splatter to a discharge port of a nozzle.SOLUTION: A liquid process unit U1 comprises: a rotation holding part 20 for rotating a wafer W while holding the wafer W; a process liquid supply part 40 formed to supply a process liquid L1 from a nozzle N1 to a surface Wa of the wafer W; a cup 30 which surrounds a circumference of the wafer W held by the rotation holding part 20 and receives the process liquid L1 supplied by the process liquid supply part 40; and a controller 10. The cup 30 has an external wall 32 for preventing scattering of a liquid shook off by the wafer W which is rotated while being held by the rotation holding part 20. The controller 10 performs processing for causing the nozzle N1 to dummy dispense the process liquid L1 to an inner region R between the external wall 32 and the rotation holding part 20.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a substrate processing apparatus, a dummy dispensing method, and a computer-readable recording medium.

  At present, when a semiconductor device is manufactured by finely processing a substrate (for example, a semiconductor wafer), a concavo-convex pattern is widely formed on the substrate using a photolithography technique. For example, the step of forming a concavo-convex pattern on a substrate includes forming a resist film on the surface of the substrate, exposing the resist film along a predetermined pattern, and developing the exposed resist film with a developer. Forming a resist pattern and etching the substrate through the resist pattern.

  Thus, when the substrate is finely processed, various processing liquids are supplied to the substrate from the nozzle. On the other hand, during the standby state in which the processing liquid is not supplied from the nozzle to the substrate, the processing liquid is dispensed from the nozzle. The dummy dispensing is a process of appropriately discharging the processing liquid from the nozzle during standby, for example, in order to prevent the processing liquid from staying in the nozzle and deteriorating.

  Patent Document 1 discloses a substrate holding mechanism configured to hold a substrate, a supply unit configured to supply a processing liquid from a nozzle to a substrate held by the substrate holding mechanism, and a substrate holding mechanism. A substrate processing apparatus including a processing unit including a nozzle bus arranged so as to be adjacent to each other is disclosed. In the processing unit, dummy dispensing is performed from the nozzle in a state where the nozzle is positioned above the nozzle bath while the processing liquid is not supplied to the substrate.

Japanese Patent Laying-Open No. 2006-042565

  However, since the nozzle bath is generally small, there is a concern that when the processing liquid is discharged from the nozzle into the nozzle bath, the processing liquid that has collided with the wall surface of the nozzle bath will bounce back to the nozzle, and the bounced processing liquid may adhere to the vicinity of the nozzle outlet. there were. In this case, there is a possibility that the processing liquid adhering to the vicinity of the discharge port of the nozzle falls on the substrate during the processing of the substrate and a defect occurs in the processed substrate.

  In general, the substrate processing apparatus includes a plurality of processing modules. In this case, since the processing unit includes not only the substrate holding mechanism but also the nozzle bath, the size of the processing unit tends to increase. For this reason, when a large number of processing units are mounted on the substrate processing apparatus in order to increase the processing amount of the substrate, there is a concern that the size of the substrate processing apparatus is increased, leading to an increase in cost.

  Thus, the present disclosure describes a substrate processing apparatus, a dummy dispensing method, and a computer-readable recording medium that can reduce the size of a processing unit while suppressing liquid splashing to the discharge port of a nozzle.

  [1] A substrate processing apparatus according to an aspect of the present disclosure includes a rotation holding unit that rotates while holding a substrate, and a first supply unit configured to supply liquid from an upper nozzle to the surface of the substrate. And a cup that surrounds the periphery of the substrate held by the rotation holding unit and receives the liquid supplied from the first supply unit, and a control unit. The cup has an outer peripheral wall that prevents scattering of the liquid shaken off from the substrate that is rotated while being held by the rotation holding unit. The control unit executes a process of performing dummy dispensing of the processing liquid on the inclined surface from the upper nozzle.

  In the substrate processing apparatus according to one aspect of the present disclosure, the control unit controls the first supply unit to cause the upper nozzle to perform a dummy dispense of the liquid on the inclined surface. Since the space in the cup is larger than that of the conventional nozzle bath, even if the liquid is ejected from the upper nozzle, the liquid splashed from the cup hardly reaches the upper nozzle. Therefore, it is possible to suppress liquid splash to the upper nozzle. Accordingly, defects are less likely to occur in the processed substrate. In addition, in the substrate processing apparatus according to one aspect of the present disclosure, dummy dispensing is performed from the upper nozzle into the cup. This eliminates the need for a nozzle bath for dummy dispensing. Therefore, it is possible to reduce the size of the processing unit.

  [2] In the apparatus of the first item, the control unit controls the first supply unit to discharge the upper nozzle below the upper end of the cup or below the substrate support surface of the chuck of the rotation holding unit. In a state where the outlet is positioned, a process of performing dummy dispensing of liquid from the upper nozzle may be executed. In this case, the momentum of the liquid ejected from the upper nozzle colliding with the object in the cup is weakened. Therefore, since the liquid is difficult to change into a mist shape, it is possible to suppress scattering of the mist around the mist. In particular, if the discharge port of the upper nozzle is positioned below the substrate support surface of the chuck of the rotation holding unit, the generated mist is difficult to adhere to the substrate support surface of the chuck. Therefore, it becomes possible to suppress the contamination of the substrate by the mist.

  [3] In the apparatus according to the first or second item, a liquid receiving portion in which the upper nozzle can wait on the upper side may be provided on the outer peripheral surface of the cup. In this case, in a standby state where the upper nozzle does not discharge liquid into the cup, the upper nozzle stands by at a standby position above the liquid receiving portion. For this reason, even if the liquid drops from the upper nozzle in the standby state, the dropped liquid is received by the liquid receiving portion, so that contamination of the outside of the cup due to the liquid can be suppressed. Moreover, since a part of liquid receiving part is comprised by the outer peripheral surface of the cup, liquid receiving part itself can be reduced in size. For this reason, it is possible to further reduce the size of the processing unit.

  [4] The apparatus according to any one of [1] to [3] further includes an exhaust unit configured to exhaust the inside of the cup, and the first supply unit treats the surface of the substrate. A cleaning liquid nozzle for supplying a liquid, a cleaning liquid nozzle for supplying a cleaning liquid to the surface of the substrate, a first drive unit for moving a first arm provided with the processing liquid nozzle, and a cleaning liquid nozzle are provided. A second drive unit that moves the second arm, and the control unit controls the first supply unit and the exhaust unit to exhaust the inside of the cup by the exhaust unit, and the first drive unit By moving the first arm, the first processing for positioning the processing liquid nozzle in the inner region, and by moving the second arm by the second driving unit, the first nozzle for positioning the cleaning liquid nozzle in the inner region. 2 and the first and second treatments, the treatment liquid nozzle and And a third process of each treatment liquid and cleaning liquid from the cleaning liquid nozzle dummy dispense may execute. In this case, dummy dispensing from the processing liquid nozzle and the cleaning liquid nozzle is performed in a state where the inside of the cup is exhausted. Therefore, even when the processing liquid and the cleaning liquid discharged from the processing liquid nozzle and the cleaning liquid nozzle respectively collide with an object in the cup and change into a mist shape, the mist is exhausted from the cup. Accordingly, since the mist does not spread around, it is possible to suppress the mist from adhering to the processing liquid nozzle or the cleaning liquid nozzle. As a result, mist aggregates on the surface of the nozzle to form droplets, and the droplets are prevented from falling onto the substrate during processing of the substrate, so that the processed substrate is less likely to be defective.

  [5] In the apparatus according to the fourth item, in the first process, the control unit moves the first arm by the first driving unit to move the processing liquid nozzle to a predetermined first in the inner region. In the second process, the second arm is moved by the second drive unit in the second process, so that the cleaning liquid nozzle is opposite to the first region in the inner region with the rotation holding unit in between. It may be located in the second region. In this case, at the time of dummy dispensing from the processing liquid nozzle and the cleaning liquid nozzle, the processing liquid nozzle and the cleaning liquid nozzle are positioned so as to face each other with the rotation holding portion therebetween. For this reason, the rebounded liquids hardly adhere to each other. Accordingly, it is possible to perform dummy dispensing simultaneously from both nozzles while suppressing liquid splashing with respect to both nozzles. As a result, the processing time for dummy dispensing is shortened, so that the throughput can be improved.

  [6] In the apparatus according to item 5, the first area is an area closer to the standby position where the processing liquid nozzle and the cleaning liquid nozzle stand by outside the cup than the rotation holding portion in the inner area, and the second area. May be a region on the side farther from the standby position than the rotation holding portion in the inner region. In this case, when the dummy dispensing is performed from the processing liquid nozzle, the processing liquid nozzle does not exceed the rotation holding portion. Therefore, even if the processing liquid drops from the processing liquid nozzle during the movement of the processing liquid nozzle, the processing liquid does not easily adhere to the rotation holding unit. Therefore, it is possible to suppress contamination of the rotation holding unit with the processing liquid.

  [7] In the apparatus according to any one of Items 4 to 6, the first supply unit includes a gas nozzle provided on the second arm while supplying a dry gas to the surface of the substrate, The control unit controls the rotation holding unit and the first supply unit, and rotates the chuck of the rotation holding unit to move the second arm to the second driving unit so that the gas nozzle passes above the chuck. You may perform the 4th process which supplies a dry gas to a chuck | zipper from a gas nozzle, moving by. In this case, since the dry gas is supplied from the gas nozzle to the rotating chuck, foreign matters such as particles adhering to the chuck are removed. For this reason, the chucking force of the substrate by the chuck is maintained. Thus, since the cleaning of the chuck is mechanically completed by the gas nozzle regardless of the manual operation, the cleaning process can be automated and shortened.

  [8] In the apparatus according to item 7, in the fourth process, the control unit moves the gas nozzle and the cleaning liquid nozzle so that both the gas nozzle and the cleaning liquid nozzle move from the central portion toward the peripheral portion with the chuck rotated. When the gas nozzle and the cleaning liquid nozzle pass above the central part of the chuck while moving the two arms by the second driving unit, the dry gas is supplied from the gas nozzle to the central part of the chuck. When the cleaning nozzle is not supplied and when the gas nozzle and the cleaning liquid nozzle pass above the intermediate area between the central portion and the peripheral edge of the chuck, the dry gas and the cleaning liquid are respectively supplied from the gas nozzle and the cleaning liquid nozzle to the intermediate area of the chuck. And when the gas nozzle and the cleaning liquid nozzle pass above the peripheral edge of the chuck, The but is supplied to the peripheral portion of the chuck, from the cleaning liquid nozzles may execute and that does not supply the cleaning liquid. In this case, since the cleaning liquid is supplied to the chuck as well as the dry gas, the chuck can be further cleaned. In addition, since the cleaning liquid is not supplied to the central portion of the chuck, the cleaning liquid is difficult to enter the suction hole located in the central portion of the chuck. For this reason, it is possible to suppress a decrease in the adsorption capacity of the substrate by the chuck. Furthermore, since the drying gas is supplied from the gas nozzle to the peripheral edge of the chuck, the cleaning liquid is not supplied from the cleaning liquid nozzle, so that the cleaning liquid that has spread to the peripheral edge of the chuck by the centrifugal force is blown off by the dry gas. Therefore, it is possible to prevent the cleaning liquid from remaining on the chuck. Therefore, it is possible to suppress contamination of the chuck with the cleaning liquid while cleaning the chuck with the cleaning liquid and the dry gas.

  [9] The apparatus according to any one of items 4 to 8 includes a second supply unit configured to supply a cleaning liquid from a lower nozzle located in the cup to the back surface of the substrate. The controller may further include a fifth process of controlling the first and second supply units to supply the cleaning liquid from the lower nozzle to the first or second arm. In this case, even if the processing liquid discharged from the processing liquid nozzle collides with an object in the cup and bounces off and adheres to the lower surface of the first or second arm, the lower nozzle moves from the first nozzle to the first or second arm. The processing liquid is removed from the first or second arm by the supplied cleaning liquid. Therefore, it can suppress that a process liquid falls on a board | substrate from the 1st or 2nd arm at the time of the process of a board | substrate. Accordingly, defects are less likely to occur in the processed substrate.

  [10] The apparatus according to item 7 or 8 further includes a second supply unit configured to supply a cleaning liquid to a back surface of the substrate from a lower nozzle located in the cup, and a control unit Controls the first and second supply sections to discharge the cleaning liquid from the lower nozzle to supply the cleaning liquid to the first or second arm outside the rotation holding section and to dry gas from the gas nozzle. And a sixth process of forming a dry gas stream on the rotation holding unit side of the position where the cleaning liquid discharged from the lower nozzle is supplied to the first or second arm may be executed. . In this case, the air flow of the dry gas from the gas nozzle is formed on the rotation holding unit side from the position where the cleaning liquid discharged from the lower nozzle is supplied to the first or second arm continuously or at a predetermined timing. Is done. Therefore, even if the cleaning liquid discharged from the lower nozzle collides with the first or second arm and bounces or becomes a mist, the bounced cleaning liquid or the mist-like cleaning liquid may flow to the rotation holding unit side. Suppressed by dry gas. Therefore, it becomes difficult for the cleaning liquid or its mist to adhere to the substrate support surface of the chuck. As a result, it is possible to suppress contamination of the substrate by the cleaning liquid or its mist.

  [11] A dummy dispensing method according to another aspect of the present disclosure is a dummy dispensing method in an upper nozzle that supplies liquid to the surface of a substrate that is held by a rotation holding unit and surrounded by a cup. The cup has an outer peripheral wall that prevents scattering of the liquid shaken off from the substrate that is rotated while being held by the rotation holding unit. A dummy dispensing method according to another aspect of the present disclosure includes a step of performing dummy dispensing of liquid from an upper nozzle to an inner region between the outer peripheral wall and the rotation holding unit. In this case, the same function and effect as those of the apparatus of the first item are obtained.

  [12] In the method described in [11] above, in the step, the upper nozzle discharge port is positioned below the upper end of the cup or below the substrate support surface of the chuck of the rotation holding unit. The treatment liquid may be dummy dispensed. In this case, the same effect as the apparatus of the second item is obtained.

  [13] In the method of the above item 11 or 12, when the dummy dispensing is not performed, the upper nozzle may be made to wait above the liquid receiving portion provided on the outer peripheral surface of the cup. In this case, the same effect as the apparatus of the third item is obtained.

  [14] In the method according to any one of Items 11 to 13, the dummy dispensing method according to another aspect of the present disclosure is provided with a processing liquid nozzle for supplying a processing liquid to the surface of the substrate. Moving the first arm and moving the second arm provided with the cleaning liquid nozzle for supplying the cleaning liquid to the surface of the substrate, the first step of positioning the processing liquid nozzle in the inner region, A second step of positioning the cleaning liquid nozzle in the standby position above the inclined surface; and a third step of performing dummy dispensing of the processing liquid and the cleaning liquid from the processing liquid nozzle and the cleaning liquid nozzle, respectively, after the first and second steps. The first to third steps may be performed while exhausting the inside of the cup. In this case, the same function and effect as the apparatus of the fourth item can be obtained.

  [15] In the method of item 14, in the first step, the processing liquid nozzle is positioned in a predetermined first area of the inner area, and in the second process, the cleaning liquid nozzle is positioned in the first area of the inner area. The rotation holding portion may be positioned in the second region opposite to the region. In this case, the same function and effect as those of the apparatus of the fifth item are obtained.

  [16] In the method of the fifteenth item, the first area is an area closer to the standby position where the processing liquid nozzle and the cleaning liquid nozzle stand by outside the cup than the rotation holding portion in the inner area, and the second area. May be a region on the side farther from the standby position than the rotation holding portion in the inner region. In this case, the same function and effect as those of the apparatus of the sixth item are obtained.

  [17] In the method according to any one of items 14 to 16, the gas nozzle provided on the second arm passes above the chuck while the chuck of the rotation holding unit is rotated. A fourth step of supplying dry gas from the gas nozzle to the chuck while moving the second arm may be further included. In this case, the same function and effect as those of the apparatus of the seventh item are obtained.

  [18] In the method of item 17, in the fourth step, the second arm is moved so that both the gas nozzle and the cleaning liquid nozzle move from the central portion toward the peripheral portion while the chuck is rotated. When the gas nozzle and the cleaning liquid nozzle pass above the central part of the chuck while moving, the dry gas is supplied from the gas nozzle to the central part of the chuck, but the cleaning liquid is not supplied from the cleaning liquid nozzle. When the nozzle passes above the intermediate region between the central portion and the peripheral portion of the chuck, the dry gas and the cleaning liquid are supplied from the gas nozzle and the cleaning liquid nozzle to the intermediate region of the chuck, respectively, and the gas nozzle and the cleaning liquid nozzle As the gas passes over the periphery of the chuck, dry gas is supplied from the gas nozzle to the periphery of the chuck. It may include a not to supply the cleaning liquid from the liquid nozzle. In this case, the same function and effect as those of the apparatus of the eighth item are obtained.

  [19] The method according to any one of items 14 to 18 may further include a fifth step of supplying the cleaning liquid to the first or second arm from the lower nozzle located in the cup. . In this case, the same function and effect as those of the apparatus of the ninth item are achieved.

  [20] In the method of the above item 17 or 18, the cleaning liquid is discharged from the lower nozzle located in the cup to supply the cleaning liquid to the first or second arm outside the rotation holding unit. A sixth step of discharging the dry gas from the gas nozzle to form a dry gas stream on the rotation holding unit side of the position where the cleaning liquid discharged from the lower nozzle is supplied to the first or second arm. Further, it may be included. In this case, the same function and effect as those of the apparatus of the above item 10 are obtained.

  [21] A computer-readable recording medium according to another aspect of the present disclosure records a program for causing a substrate processing apparatus to execute the dummy dispensing method according to any one of Items 11 to 20 above. Yes. In the computer-readable recording medium according to another aspect of the present disclosure, it is possible to reduce the size of the processing unit while suppressing the liquid splash to the nozzle outlet, as in the above-described dummy dispensing method. In the present specification, a computer-readable recording medium includes a non-transitory computer recording medium (for example, various main storage devices or auxiliary storage devices) and a propagation signal (transitory computer recording medium). (For example, a data signal that can be provided via a network).

  [22] A substrate processing apparatus according to another aspect of the present disclosure includes a rotation holding unit that rotates while holding a substrate, an upper nozzle that is configured to supply liquid from above to the surface of the substrate, and A gas nozzle that supplies a dry gas from above to the front surface of the substrate, a lower nozzle that is configured to supply a cleaning liquid from below to the back surface of the substrate, and a control unit. The control unit controls the operation of each nozzle, discharges the cleaning liquid from the lower nozzle, and supplies the cleaning liquid to the arm holding the upper nozzle or the arm holding the gas nozzle outside the rotation holding unit, A process in which a dry gas is discharged from the gas nozzle, and a flow of the dry gas is formed on the rotation holding unit side from the position where the cleaning liquid discharged from the lower nozzle is supplied to the arm holding the upper nozzle or the arm holding the gas nozzle. Execute. In this case, the same function and effect as those of the apparatus of the above item 10 are obtained.

  [23] An arm cleaning method according to another aspect of the present disclosure includes an arm or a rotation holding unit configured to hold an upper nozzle configured to supply liquid from above to a surface of a substrate held by the rotation holding unit. The cleaning liquid is supplied from below to the back surface of the substrate held by the rotation holding unit with respect to the arm that holds the gas nozzle that supplies the dry gas from above to the surface of the substrate held on the substrate. A step of cleaning the arm holding the upper nozzle or the arm holding the gas nozzle by supplying the cleaning liquid from the lower nozzle is included. In the step of cleaning the arm holding the upper nozzle or the arm holding the gas nozzle, the cleaning liquid is discharged from the lower nozzle, and the cleaning liquid is applied to the arm holding the upper nozzle or the arm holding the gas nozzle outside the rotation holding unit. And at the rotation holding portion side of the position where the cleaning liquid discharged from the lower nozzle is supplied to the arm holding the upper nozzle or the arm holding the gas nozzle. Create an air flow. In this case, the same function and effect as those of the apparatus of the twenty-second item are achieved.

  [24] A computer-readable recording medium according to another aspect of the present disclosure records a program for causing a substrate processing apparatus to execute the dummy dispensing method of the above item 23. In this case, the same effect as the method of the above item 23 is obtained.

  According to the substrate processing apparatus, the dummy dispensing method, and the computer-readable recording medium according to the present disclosure, it is possible to reduce the size of the processing unit while suppressing liquid splashing to the nozzle outlet.

FIG. 1 is a plan view schematically showing a substrate processing system. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a schematic diagram when the liquid processing unit is viewed from the side. FIG. 5 is a schematic view when the vicinity of the cup is viewed from above. FIG. 6 is a block diagram illustrating the substrate processing system. FIG. 7 is a schematic diagram centering on the hardware configuration of the controller. FIG. 8 is a flowchart for explaining the procedure of dummy dispensing. FIG. 9 is a diagram for explaining the procedure of dummy dispensing, and is a schematic diagram when the vicinity of the cup is viewed from above. FIG. 10 is a flowchart for explaining a chuck cleaning procedure (first procedure). FIG. 11 is a diagram for explaining the chuck cleaning procedure (first procedure), and is a schematic view when viewed from the side centering on the cup. FIG. 12 is a flowchart for explaining a chuck cleaning procedure (second procedure). FIG. 13 is a diagram for explaining the chuck cleaning procedure (second procedure), and is a schematic diagram when viewed from the side centering on the cup. FIG. 14 is a view for explaining the arm cleaning procedure, and is a schematic view when seen from the side centering on the cup.

  Since the embodiment according to the present disclosure described below is an example for explaining the present invention, the present invention should not be limited to the following contents. In the following description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

[Substrate processing system]
As shown in FIG. 1, the substrate processing system 1 (substrate processing apparatus) includes a coating and developing apparatus 2 (substrate processing apparatus) and a controller 10 (control unit). The substrate processing system 1 is provided with an exposure apparatus 3. The exposure apparatus 3 includes a controller (not shown) that can communicate with the controller 10 of the substrate processing system 1. The exposure apparatus 3 exchanges the wafer W (substrate) with the coating and developing apparatus 2 and performs exposure processing (pattern exposure) of the photosensitive resist film formed on the surface Wa (see FIG. 4 and the like) of the wafer W. Configured to do. Specifically, an energy ray is selectively irradiated to the exposure target portion of the photosensitive resist film (photosensitive coating) by a method such as immersion exposure. Examples of the energy rays include ArF excimer laser, KrF excimer laser, g-line, i-line, and extreme ultraviolet (EUV).

  The coating and developing apparatus 2 performs a process of forming various coating films Cf (see FIG. 4) including a photosensitive resist film on the surface Wa of the wafer W before the exposure process by the exposure apparatus 3. The coating and developing apparatus 2 performs development processing of the photosensitive resist film after the exposure processing of the photosensitive resist film by the exposure device 3.

  The wafer W may have a disk shape, or may have a plate shape other than a circle such as a polygon. The wafer W may have a notch partly cut away. The notch may be, for example, a notch (a U-shaped groove, a V-shaped groove, etc.) or a straight line portion (so-called orientation flat) extending linearly. The wafer W may be, for example, a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or other various substrates. The diameter of the wafer W may be about 200 mm to 450 mm, for example.

  As shown in FIGS. 1 to 3, the coating and developing apparatus 2 includes a carrier block 4, a processing block 5, and an interface block 6. The carrier block 4, the processing block 5, and the interface block 6 are arranged in the horizontal direction.

  As shown in FIGS. 1 and 3, the carrier block 4 includes a carrier station 12 and a carry-in / carry-out unit 13. The carrier station 12 supports a plurality of carriers 11. The carrier 11 accommodates at least one wafer W in a sealed state. On the side surface 11a of the carrier 11, an opening / closing door (not shown) for taking in and out the wafer W is provided. The carrier 11 is detachably installed on the carrier station 12 so that the side surface 11a faces the loading / unloading unit 13 side.

  The carry-in / carry-out unit 13 is located between the carrier station 12 and the processing block 5. The carry-in / carry-out unit 13 includes a plurality of opening / closing doors 13a. When the carrier 11 is placed on the carrier station 12, the opening / closing door of the carrier 11 faces the opening / closing door 13a. By opening the open / close door 13a and the open / close door on the side surface 11a at the same time, the inside of the carrier 11 and the inside of the carry-in / out unit 13 are communicated. The carry-in / carry-out unit 13 incorporates a delivery arm A1. The transfer arm A1 takes out the wafer W from the carrier 11 and transfers it to the processing block 5, receives the wafer W from the processing block 5, and returns it to the carrier 11.

  As shown in FIGS. 1 and 2, the processing block 5 includes unit processing blocks 14 to 17. The unit processing blocks 14 to 17 are arranged in the order of the unit processing block 17, the unit processing block 14, the unit processing block 15, and the unit processing block 16 from the floor side. As shown in FIG. 3, the unit processing blocks 14 to 17 include a liquid processing unit U1 (substrate processing apparatus) and a heat treatment unit U2.

  The liquid processing unit U1 is configured to supply various processing liquids or gases to the front surface Wa or the rear surface Wb (see FIG. 4) of the wafer W. The heat treatment unit U2 is configured to heat the wafer W by, for example, a hot plate, and to perform the heat treatment by cooling the heated wafer W by, for example, a cooling plate.

  The unit processing block 14 is a lower layer film forming block (BCT block) configured to form a lower layer film on the surface Wa of the wafer W. The unit processing block 14 includes a transfer arm A2 for transferring the wafer W in each unit U1, U2 (see FIG. 2). The liquid processing unit U1 of the unit processing block 14 applies a coating liquid (processing liquid) for forming a lower layer film to the surface Wa of the wafer W to form a coating film. The heat treatment unit U2 of the unit processing block 14 performs various heat treatments accompanying the formation of the lower layer film. Specific examples of the heat treatment include heat treatment for curing the coating film to form a lower layer film. Examples of the lower layer film include an antireflection (SiARC) film.

  The unit processing block 15 is an intermediate film (hard mask) forming block (HMCT block) configured to form an intermediate film on the lower layer film. The unit processing block 15 includes a transfer arm A3 for transferring the wafer W in each unit U1, U2 (see FIG. 2). The liquid processing unit U1 of the unit processing block 15 applies a coating liquid (processing liquid) for forming an intermediate film on the lower layer film to form a coating film. The heat treatment unit U2 of the unit processing block 15 performs various heat treatments accompanying the formation of the intermediate film. Specific examples of the heat treatment include heat treatment for curing the coating film to form an intermediate film. Examples of the intermediate film include an SOC (Spin On Carbon) film and an amorphous carbon film.

  The unit processing block 16 is a resist film forming block (COT block) configured to form a thermosetting resist film on the intermediate film. The unit processing block 16 includes a transfer arm A4 for transferring the wafer W in each unit U1, U2 (see FIG. 2). The liquid processing unit U1 of the unit processing block 16 forms a coating film by coating a coating liquid (processing liquid) for forming a resist film on the intermediate film. The heat treatment unit U2 of the unit processing block 16 performs various heat treatments accompanying the formation of the resist film. A specific example of the heat treatment includes a heat treatment (PAB: Pre Applied Bake) for curing the coating film to form a resist film. Note that the resist film includes a photosensitive resist film and a non-photosensitive resist film.

  The unit processing block 17 is a development processing block (DEV block) configured to perform development processing of the exposed resist film. The unit processing block 17 includes a transfer arm A5 that transfers the wafer W to each unit U1, U2, and a direct transfer arm A6 that transfers the wafer W without passing through these units (see FIG. 2). The liquid processing unit U1 of the unit processing block 17 supplies a developing solution (processing solution) to the resist film after exposure to develop the resist film. The liquid processing unit U1 of the unit processing block 17 supplies a cleaning liquid (rinsing liquid) to the developed resist film and rinses away the dissolved components of the resist film together with the developing liquid. An example of the cleaning liquid is pure water (DIW: deionized water). Thereby, the resist film is partially removed, and a resist pattern is formed. The heat treatment unit U2 of the unit processing block 16 performs various heat treatments associated with the development processing. Specific examples of the heat treatment include a heat treatment before development processing (PEB: Post Exposure Bake), a heat treatment after development processing (PB: Post Bake), and the like.

  As shown in FIGS. 2 and 3, a shelf unit U <b> 10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is provided from the floor surface to the unit processing block 15, and is partitioned into a plurality of cells arranged in the vertical direction. An elevating arm A7 is provided in the vicinity of the shelf unit U10. The raising / lowering arm A7 raises / lowers the wafer W between the cells of the shelf unit U10.

  A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is provided from the floor to the upper part of the unit processing block 17, and is partitioned into a plurality of cells arranged in the vertical direction.

  The interface block 6 incorporates a delivery arm A8 and is connected to the exposure apparatus 3. The delivery arm A8 is configured to take out the wafer W of the shelf unit U11 and deliver it to the exposure apparatus 3, and to receive the wafer W from the exposure apparatus 3 and return it to the shelf unit U11.

  The controller 10 controls the substrate processing system 1 partially or entirely. The controller 10 can transmit and receive signals to and from the controller of the exposure apparatus 3, and the substrate processing system 1 and the exposure apparatus 3 are controlled by the cooperation of the controllers. Details of the controller 10 will be described later.

[Configuration of liquid processing unit]
Subsequently, the liquid processing unit U1 will be described in more detail with reference to FIG. 4 and FIG. Here, as an example, the liquid processing unit U1 in the unit processing block 17 will be described. As shown in FIG. 4, the liquid processing unit U1 includes a rotation holding unit 20, a cup 30, a processing liquid supply unit 40 (first supply unit), and a gas-liquid supply unit 50 (first supply unit). A cleaning liquid supply unit 60 (second supply unit), an exhaust unit 70, and a blower B.

  The rotation holding unit 20 includes a rotation unit 21, a shaft 22, and a holding unit 23 (chuck). The rotating unit 21 operates based on an operation signal from the controller 10 and rotates the shaft 22. The rotating unit 21 is a power source such as an electric motor. The holding part 23 is provided at the tip of the shaft 22. A wafer W is disposed on the holding unit 23. The holding unit 23 is a suction chuck configured to hold the wafer W substantially horizontally, for example, by suction. That is, the rotation holding unit 20 rotates the wafer W around an axis (rotation axis) perpendicular to the surface Wa of the wafer W in a state in which the posture of the wafer W is substantially horizontal. In the present embodiment, since the rotation axis passes through the center of the wafer W having a circular shape, it is also the center axis. In the present embodiment, as shown in FIG. 4, the rotation holding unit 20 rotates the wafer W at a predetermined number of rotations clockwise as viewed from above. The rotation speed of the wafer W may be, for example, about 10 rpm to 2000 rpm.

  The cup 30 is provided around the rotation holding unit 20. The cup 30 functions as a liquid collection container that receives the liquid supplied to the wafer W for processing the wafer W and the liquid discharged into the cup 30 by the dummy dispense. The cup 30 may be made of, for example, polypropylene (PP), polyvinyl chloride (PVC), poly phenylene sulfide (PPS) resin, or the like. The cup 30 includes a bottom wall 31, an outer peripheral wall 32, an inner peripheral wall 33, a partition wall 34, a drainage pipe 35, an exhaust pipe 36, an oblique wall 37 (inner wall part), and a partition wall 38. .

  The bottom wall 31 has an annular shape surrounding the rotation holding unit 20. The outer peripheral wall 32 has a cylindrical shape surrounding the wafer W and the inner peripheral wall 33 held by the rotation holding unit 20. The outer peripheral wall 32 extends vertically upward from the outer peripheral edge of the bottom wall 31. The outer peripheral wall 32 is located outside the periphery of the wafer W held by the rotation holding unit 20. Therefore, the outer peripheral wall 32 has a function of preventing scattering of the liquid shaken off from the wafer W rotated while being held by the rotation holding unit 20. The portion on the upper end 32a side of the outer peripheral wall 32 is an inclined wall 32b that is inclined inward (rotation holding unit 20 side) as it goes upward.

  A liquid receiver 39 is provided on the outer peripheral surface of the outer peripheral wall 32 so as to project outward from the outer peripheral surface. The liquid receiver 39 functions as a liquid collection container that receives the liquid together with the outer peripheral surface of the outer peripheral wall 32. A through hole 32 c that communicates the inside and outside of the cup 30 is provided on the lower end side of the liquid receiving portion 39 and on the outer peripheral surface of the outer peripheral wall 32. The liquid received by the liquid receiving part 39 flows into the cup 30 through the through hole 32c.

  The inner peripheral wall 33 has a cylindrical shape surrounding the rotation holding unit 20. The inner peripheral wall 33 extends vertically upward from the inner peripheral edge of the bottom wall 31. The inner peripheral wall 33 is positioned inside the peripheral edge of the wafer W held by the rotation holding unit 20. The upper end portion of the inner peripheral wall 33 is closed by a partition wall 38. A through hole is provided in the center of the partition wall 38, and the shaft 22 is inserted into the through hole.

  The partition wall 34 has a cylindrical shape. The partition wall 34 extends vertically upward from between the outer peripheral wall 32 and the inner peripheral wall 33 of the bottom wall 31. That is, the partition wall 34 surrounds the inner peripheral wall 33.

  The drainage pipe 35 is connected to a liquid discharge hole 31 a formed between the outer peripheral wall 32 and the partition wall 34 in the bottom wall 31. The exhaust pipe 36 is connected to a gas exhaust hole 31 b formed in a portion of the bottom wall 31 between the partition wall 34 and the inner peripheral wall 33.

  The inclined wall 37 is attached to the upper end portion of the inner peripheral wall 33 so as to protrude outward from the partition wall 34. The inclined wall 37 has an umbrella shape (mountain shape) protruding upward. That is, the inclined wall 37 includes an inclined surface S that is inclined downward as it goes outward in the radial direction of the rotation axis of the rotation holding unit 20. The inclined surface S faces the peripheral edge portion of the wafer W held by the rotation holding unit 20. Therefore, the liquid that has been shaken off from the wafer W and dropped, flows through the inclined surface S, is guided between the outer peripheral wall 32 and the partition wall 34, and is discharged through the liquid discharge hole 31 a and the drainage pipe 35.

  The processing liquid supply unit 40 is configured to supply the processing liquid L1 to the surface Wa of the wafer W. The processing liquid L1 may be a developer, for example. The processing liquid supply unit 40 includes a liquid source 41, a pump 42, a valve 43, an arm 44 (first arm), a pipe 45, a driving mechanism 46 (first driving unit), and a nozzle N1 (processing). Liquid nozzle, upper nozzle).

  The liquid source 41 functions as a supply source of the processing liquid L1. The pump 42 operates based on an operation signal from the controller 10, sucks the processing liquid L <b> 1 from the liquid source 41, and sends it out to the nozzle N <b> 1 through the pipe 45 and the valve 43. The valve 43 operates based on an operation signal from the controller 10 and opens and closes the pipe 45 before and after the valve 43.

  The arm 44 is provided with a nozzle N1 and a drive mechanism 46. As shown in FIG. 5, the arm 44 may be provided with a plurality of nozzles N1 having different discharge flow rates, discharge directions, and the like. The pipe 45 connects the liquid source 41, the pump 42, the valve 43, and the nozzle N1 in order from the upstream side. The drive mechanism 46 operates based on an operation signal from the controller 10 and moves the arm 44 in the horizontal direction and the vertical direction. The drive mechanism 46 is a servo motor with an encoder, for example, and may control the moving speed and moving position of the arm 44.

  The nozzle N <b> 1 can be moved by the driving mechanism 46 between the upper side of the wafer W and the upper side of the liquid receiving unit 39 such that the discharge port faces the surface Wa of the wafer W or the liquid receiving unit 39. The nozzle N1 can discharge the processing liquid L1 sent out from the pump 42 downward.

The gas-liquid supply unit 50 is configured to supply the cleaning liquid L2 and the dry gas G to the surface Wa of the wafer W. The cleaning liquid L2 may be pure water, for example. The dry gas G may be various inert gases, for example, nitrogen gas (N ₂ gas). The gas-liquid supply unit 50 includes a liquid source 51A, a gas source 51B, pumps 52A and 52B, valves 53A and 53B, an arm 54 (second arm), pipes 55A and 55B, and a drive mechanism 56 (first 2 drive unit) and a nozzle N2 (upper nozzle).

  The liquid source 51A functions as a supply source of the cleaning liquid L2. The gas source 51B functions as a supply source of the dry gas G. The pump 52A operates based on the operation signal from the controller 10, sucks the cleaning liquid L2 from the liquid source 51A, and sends it out to the nozzle N2 via the pipe 55A and the valve 53A. The pump 52B operates based on the operation signal from the controller 10, sucks the dry gas G from the gas source 51B, and sends it to the nozzle N2 via the pipe 55B and the valve 53B. The valve 53A operates based on an operation signal from the controller 10, and opens and closes the pipe 55A before and after the valve 53A. The valve 53B operates based on an operation signal from the controller 10, and opens and closes the pipe 55B before and after the valve 53B.

  A nozzle N2 and a drive mechanism 56 are attached to the arm 54. As shown in FIG. 5, the arm 54 may be provided with a plurality of nozzles N2a (cleaning liquid nozzles) from which the cleaning liquid L2 is discharged and nozzles N2b (gas nozzles) from which the dry gas G is discharged. The plurality of nozzles N2a may have different discharge flow rates, discharge directions, and the like.

  The pipe 55A connects a liquid source 51A, a pump 52A, a valve 53A, and a nozzle N2a in order from the upstream side. The pipe 55B connects a gas source 51B, a pump 52B, a valve 53B, and a nozzle N2b in order from the upstream side. The drive mechanism 56 operates based on an operation signal from the controller 10 and moves the arm 54 in the horizontal direction and the vertical direction. The drive mechanism 56 is a servo motor with an encoder, for example, and may control the moving speed and moving position of the arm 54.

  The nozzles N <b> 2 a and N <b> 2 b can be moved between the upper side of the wafer W and the upper side of the liquid receiving unit 39 by the driving mechanism 56 so that the discharge port faces the surface Wa of the wafer W or the liquid receiving unit 39. The nozzle N2a can discharge the cleaning liquid L2 sent out from the pump 52A downward. The nozzle N2b can discharge the dry gas G sent from the pump 52B downward.

  The cleaning liquid supply unit 60 is configured to supply the cleaning liquid L3 to the back surface Wb of the wafer W. The cleaning liquid L3 may be pure water, for example. The cleaning liquid supply unit 60 includes a liquid source 61, a pump 62, a valve 63, a pipe 65, and a nozzle N3 (cleaning liquid nozzle, lower nozzle).

  The liquid source 61 functions as a supply source of the cleaning liquid L3. The pump 62 operates based on an operation signal from the controller 10, sucks the cleaning liquid L <b> 3 from the liquid source 61, and sends it out to the nozzle N <b> 3 through the pipe 65 and the valve 63. The valve 63 operates based on an operation signal from the controller 10 and opens and closes the pipe 65 before and after the valve 63.

  The pipe 65 connects a liquid source 61, a pump 62, a valve 63, and a nozzle N3 in order from the upstream side. The nozzle N3 is disposed such that the discharge port faces the peripheral edge portion of the back surface Wb of the wafer W. The nozzle N3 can discharge the cleaning liquid L3 sent from the pump 62 obliquely upward.

  The exhaust unit 70 is configured to exhaust the liquid processing unit U1 or the cup 30. The exhaust unit 70 includes an intake port 71, a pump 72, valves 73A and 73B, and pipes 75A to 75C. The intake port 71 is located in the liquid processing unit U1, and suction of gas in the liquid processing unit U1 is performed.

  The pump 72 operates based on an operation signal from the controller 10 and sucks gas through the pipe 75C. The valve 73A operates based on an operation signal from the controller 10, and opens and closes the pipe 75A before and after the valve 73A. The valve 73B operates based on an operation signal from the controller 10, and opens and closes the pipe 75B before and after the valve 73B.

  The pipe 75 </ b> A is connected to the intake port 71. The pipe 75 </ b> B is connected to the exhaust pipe 36 of the cup 30. The pipe 75C is connected to the pipes 75A and 75B and extends to the outside of the liquid processing unit U1. Therefore, if the pump 72 operates when the valve 73A is open and the valve 73B is closed, the liquid processing unit U1 is exhausted. Specifically, the gas in the liquid processing unit U1 is sucked from the intake port 71 and discharged out of the liquid processing unit U1 through the pipes 75A and 75C. On the other hand, if the pump 72 operates when the valve 73A is closed and the valve 73B is opened, the exhaust in the cup 30 is performed. Specifically, the gas in the cup 30 flows into the exhaust pipe 36 from between the inclined wall 37 and the partition wall 34 and is discharged out of the liquid processing unit U1 through the pipes 75B and 75C.

  The blower B is disposed above the liquid processing unit U1. The blower B operates based on an operation signal from the controller 10 and forms a downflow toward the cup 30.

[Controller configuration]
As illustrated in FIG. 6, the controller 10 includes a reading unit M1, a storage unit M2, a processing unit M3, and an instruction unit M4 as functional modules. These functional modules are merely the functions of the controller 10 divided into a plurality of modules for convenience, and do not necessarily mean that the hardware constituting the controller 10 is divided into such modules. Each functional module is not limited to that realized by executing a program, but is realized by a dedicated electric circuit (for example, a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) in which this is integrated. May be.

  The reading unit M1 reads a program from a computer-readable recording medium RM. The recording medium RM records a program for operating each part of the substrate processing system 1. As the recording medium RM, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk may be used.

  The storage unit M2 stores various data. The storage unit M2 is inputted by an operator via, for example, a program read from the recording medium RM in the reading unit M1, various data (so-called processing recipe) when processing the wafer W, and an external input device (not shown). Stores setting data and the like.

  The processing unit M3 processes various data. The processing unit M3, for example, based on various data stored in the storage unit M2, the liquid processing unit U1 (for example, the rotation holding unit 20, pumps 42, 52A, 52B, 62, 72, valves 43, 53A, 53B). , 63, 73A, 73B, drive mechanisms 46, 56, blower B, etc.) and heat treatment unit U2 are generated.

  The instruction unit M4 transmits the operation signal generated in the processing unit M3 to various devices.

  The hardware of the controller 10 is configured by one or a plurality of control computers, for example. The controller 10 includes, for example, a circuit 10A illustrated in FIG. 7 as a hardware configuration. The circuit 10A may be composed of electric circuit elements (circuitry). Specifically, the circuit 10A includes a processor 10B, a memory 10C (storage unit), a storage 10D (storage unit), a driver 10E, and an input / output port 10F. The processor 10B executes the program in cooperation with at least one of the memory 10C and the storage 10D, and executes the input / output of signals through the input / output port 10F, thereby configuring each functional module described above. The memory 10C and the storage 10D function as the storage unit M2. The driver 10 </ b> E is a circuit that drives various devices of the substrate processing system 1. The input / output port 10F includes a driver 10E and various devices of the substrate processing system 1 (for example, the rotation holding unit 20, pumps 42, 52A, 52B, 62, 72, valves 43, 53A, 53B, 63, 73A, 73B, drive mechanism) 46, 56, blower B, etc.).

  In the present embodiment, the substrate processing system 1 includes one controller 10, but may include a controller group (control unit) including a plurality of controllers 10. When the substrate processing system 1 includes a controller group, each of the functional modules may be realized by a single controller 10 or may be realized by a combination of two or more controllers 10. . When the controller 10 is composed of a plurality of computers (circuit 10A), each of the above functional modules may be realized by one computer (circuit 10A), or two or more computers (circuit 10A). ) May be realized. The controller 10 may have a plurality of processors 10B. In this case, each of the functional modules may be realized by one processor 10B, or may be realized by a combination of two or more processors 10B.

[Dummy dispensing method]
Subsequently, a method of performing dummy dispensing from the nozzles N1 and N2 will be described with reference to FIGS. In the initial state of the dummy dispensing process, the wafer W is not held by the rotation holding unit 20, and the nozzles N1 and N2 stand by above the liquid receiving unit 39 (see FIG. 9). That is, the upper part of the liquid receiving part 39 functions as a standby position where the nozzles N1 and N2 stand by when no liquid or gas is discharged from the nozzles N1 and N2.

  Subsequently, from the initial state, the controller 10 controls the blower B, the valve 73B and the pump 72 to operate the blower B and exhaust the cup 30 (see step S10 in FIG. 8). Thereby, a down blow (downflow) is generated in the liquid processing unit U1, and the state in which the gas in the liquid processing unit U1 is discharged out of the liquid processing unit U1 through the cup 30 and the exhaust pipe 36 is continued.

  Subsequently, the controller 10 controls the drive mechanism 46 to move the nozzle N1 from the standby position to the inner region R (see FIG. 4) between the outer peripheral wall 32 and the rotation holding unit 20 (first process; First step; see step S11 in FIG. In the present embodiment, the nozzle N1 is moved above the inclined surface S. Specifically, as shown in FIG. 5, the nozzle N <b> 1 has a region R <b> 1 (indicated by a right-upward oblique line in FIG. 5) on the inclined surface S on the standby position side (liquid receiving unit 39 side) relative to the rotation holding unit 20. The first region).

  Subsequently, the controller 10 controls the drive mechanism 56 to move the nozzle N2 from the standby position to the inner region R (see FIG. 4) between the outer peripheral wall 32 and the rotation holding unit 20 (second process; Second step; see step S12 in FIG. 8). In the present embodiment, the nozzle N2 is moved above the inclined surface S. Specifically, as shown in FIG. 5, the nozzle N <b> 2 has a region R <b> 2 (lower right in FIG. 5) on the side of the inclined surface S that is farther from the standby position (liquid receiver 39) than the rotation holding unit 20. It is located on the area | region shown with a diagonal line; 2nd area | region).

  Subsequently, the controller 10 controls the pump 42 and the valve 43 to discharge the processing liquid L1 from the nozzle N1 to the region R1 of the inclined surface S (third process; third process; see step S13 in FIG. 8). ). Thereby, the dummy dispensing process is performed in the nozzle N1. When a plurality of nozzles N1 are provided on the arm 44, the same kind or different kinds of processing liquids L1 may be discharged simultaneously from each nozzle N1, or the same kind or different kinds of processing liquids L1 may be discharged from each nozzle N1. You may make it discharge at a different timing.

  Subsequently, the controller 10 controls the pumps 52A and 52B and the valves 53A and 53B to discharge the cleaning liquid L2 and the dry gas G from the nozzle N2 to the region R2 of the inclined surface S (third process; third step). ; See step S14 in FIG. 8). Thereby, the dummy dispensing process is performed in the nozzle N2. When a plurality of nozzles N2a are provided on the arm 54, the same kind or different kinds of cleaning liquids L2 may be simultaneously discharged from each nozzle N2a, or the same kind or different kinds of cleaning liquids L2 may be discharged from each nozzle N2a at different timings. May be discharged. Further, the cleaning liquid L2 and the dry gas G may be discharged simultaneously from the nozzles N2a and N2b, or the cleaning liquid L2 and the dry gas G may be discharged at different timings.

  Subsequently, the controller 10 controls the drive mechanism 46 to move the nozzle N1 from above the inclined surface S (region R1) to the standby position (see step S15 in FIG. 8). Similarly, the controller 10 controls the drive mechanism 56 to move the nozzle N2 from above the inclined surface S (region R2) to the standby position (see step S16 in FIG. 8).

  Thereafter, the controller 10 controls the valves 73A and 73B to open the valve 73A and close the valve 73B (see step S17 in FIG. 8). Accordingly, the gas in the liquid processing unit U1 is exhausted from the intake port 71. Thus, the dummy dispensing process at the nozzles N1 and N2 is completed.

[Action]
In the present embodiment as described above, the controller 10 controls the processing liquid supply unit 40 to perform the dummy dispensing of the processing liquid L1 from the nozzle N1 to the inner region R. Since the space in the cup 30 is larger than that of the conventional nozzle bath, even if the processing liquid L1 is ejected from the nozzle N1 to the inclined surface S of the inclined wall 37 located in the cup 30, it rebounds from the cup 30. It is difficult for the processing liquid L1 to reach the upper nozzle. Accordingly, defects are less likely to occur in the processed wafer W. Further, in the present embodiment, dummy dispensing is performed from the nozzle N1 into the cup 30. This eliminates the need for a nozzle bath for dummy dispensing. Therefore, the liquid processing unit U1 can be downsized.

  In the present embodiment, the controller 10 has a slant wall 37 located between the outer peripheral wall 32 and the rotation holding unit 20 and in the cup 30, and the controller 10 controls the processing liquid supply unit 40 to control the processing liquid from the nozzle N <b> 1. L1 is dummy-dispensed on the inclined wall 37. Therefore, the processing liquid L1 is reliably discharged from the nozzle N1 into the cup 30. Therefore, it is possible to further suppress the liquid splash to the nozzle N1.

  In the present embodiment, the controller 10 controls the processing liquid supply unit 40 to perform the dummy dispensing of the processing liquid L1 from the nozzle N1 particularly on the inclined surface S in the inner region R. Therefore, it is difficult for the processing liquid L1 that has bounced off the inclined surface S toward the nozzle N1. Therefore, it is possible to further suppress the liquid splash to the nozzle N1.

  In the present embodiment, a liquid receiving portion 39 is provided on the outer peripheral surface of the cup 30, and the nozzles N <b> 1 and N <b> 2 can stand by above the liquid receiving portion 39. Therefore, in a standby state where the nozzles N1 and N2 do not discharge the processing liquid L1 or the cleaning liquid L2 into the cup 30, the nozzles N1 and N2 stand by at a standby position above the liquid receiving unit 39. Therefore, even if the processing liquid L1 or the cleaning liquid L2 drops from the nozzles N1 and N2 in the standby state, the dropped liquid is received by the liquid receiving unit 39, so that contamination of the outside of the cup 30 by the processing liquid L1 or the cleaning liquid L2 is suppressed. It becomes possible. In addition, since a part of the liquid receiving part 39 is constituted by the outer peripheral surface of the cup 30, the liquid receiving part 39 itself can be miniaturized. Therefore, the liquid processing unit U1 can be further downsized.

  In the present embodiment, dummy dispensing from the nozzles N1 and N2 is performed in a state where the inside of the cup 30 is exhausted. Therefore, even when the processing liquid L1 and the cleaning liquid L2 respectively discharged from the nozzles N1 and N2 collide with objects in the cup 30 and change into a mist shape, the mist is exhausted from the cup 30. Accordingly, since the mist does not spread around, it is possible to suppress the mist from adhering to the nozzles N1 and N2. As a result, mist aggregates on the surfaces of the nozzles N1 and N2 to form droplets, and the droplets are prevented from dropping onto the wafer W during the processing of the wafer W, so that the processed wafer W is less likely to be defective. Become.

  In the present embodiment, the nozzle N1 and the nozzle N2 are positioned so as to face each other with the rotation holding unit 20 therebetween when performing dummy dispensing from the nozzles N1 and N2. For this reason, the rebounded liquids hardly adhere to each other. Therefore, it is possible to perform dummy dispensing from both nozzles N1 and N2 at the same time while suppressing liquid splashing with respect to both nozzles N1 and N2. As a result, the processing time for dummy dispensing is shortened, and the throughput can be improved.

  In the present embodiment, dummy dispensing of the processing liquid L1 from the nozzle N1 is performed on the region R1 in the inclined surface S. Therefore, the nozzle N1 does not exceed the rotation holding unit 20 during the dummy dispensing process in the nozzle N1. Therefore, even if the processing liquid L1 drops from the nozzle N1 during the movement of the nozzle N1, the processing liquid L1 is difficult to adhere to the rotation holding unit 20 (holding unit 23). As a result, it is possible to suppress contamination of the rotation holding unit 20 (holding unit 23) with the processing liquid L1.

[Other Embodiments]
As mentioned above, although embodiment concerning this indication was described in detail, you may add various deformation | transformation to said embodiment within the range of the summary of this invention.

(Modification 1)
For example, the holding unit 23 of the rotation holding unit 20 may be cleaned using the dry gas G discharged from the nozzle N2. Modification 1 will be specifically described with reference to FIGS. 10 and 11. First, similarly to the above-described step S10, the exhaust in the cup 30 is performed in the initial state (see step S20 in FIG. 10).

  Subsequently, the controller 10 controls the drive mechanism 56 to move the nozzle N2 so that the discharge port of the nozzle N2 is located above the central portion of the holding unit 23 (see step S21 in FIG. 10 and FIG. 11). . Subsequently, the controller 10 controls the rotation holding unit 20 to rotate the holding unit 23 by the rotation unit 21 (see step S22 in FIG. 10 and FIG. 11).

  Subsequently, in a state where the holding unit 23 is rotating, the controller 10 controls the pump 52B and the valve 53B to supply the dry gas G from the nozzle N2b to the central part of the holding unit 23 (fourth process; Fourth step; see step S23 in FIG. 10 and FIG. 11). Further, the controller 10 controls the drive mechanism 56 to move the nozzle N2 toward the outside (periphery side of the holding portion 23) in the radial direction of the central axis of the rotation holding portion 20 (see the same).

  When the nozzle N2 reaches the periphery of the holding unit 23, the controller 10 controls the pump 52B and the valve 53B to stop the discharge of the dry gas G from the nozzle N2b (see step S24 in FIG. 10). Further, the controller 10 controls the rotation holding unit 20 to stop the rotation of the holding unit 23 (see the same).

  Subsequently, the nozzle N2 is moved to the standby position (see step S25 in FIG. 10), and the gas in the liquid processing unit U1 is exhausted (see step S26 in FIG. 10), as in steps S16 and S17 described above.

  According to the modified example 1 described above, the dry gas G is supplied from the nozzle N2b to the rotating holding unit 23. Therefore, foreign matters such as particles adhering to the holding unit 23 are removed. In particular, in the central portion of the holding portion 23, since the centrifugal force hardly acts on the foreign matter even when the holding portion 23 rotates, the foreign matter is effectively removed by spraying the dry gas G onto the holding portion 23. Accordingly, the suction force of the wafer W by the holding unit 23 is maintained. As described above, since the cleaning of the holding unit 23 is mechanically completed by the nozzle N2b regardless of the manual operation, the cleaning process can be automated and shortened.

(Modification 2)
For example, the holding unit 23 of the rotation holding unit 20 may be cleaned using the dry gas G and the cleaning liquid L2 discharged from the nozzle N2. This form will be specifically described with reference to FIGS. First, the same processing as in steps S20 to S22 described above is performed. Specifically, the exhaust in the cup 30 is performed in the initial state (see step S30 in FIG. 12). Next, the nozzle N2 is moved so that the discharge port of the nozzle N2 is positioned above the central portion of the holding unit 23 (see step S31 in FIG. 12 and FIG. 13A). Next, the holding unit 23 is rotated (see step S32 in FIG. 12 and FIG. 13A).

  Subsequently, in a state where the holding unit 23 is rotating, the controller 10 controls the pump 52B and the valve 53B to supply the dry gas G from the nozzle N2b to the central part of the holding unit 23 (fourth process; Fourth step; see step S33 in FIG. 12 and FIG. 13A). Further, the controller 10 controls the drive mechanism 56 to move the nozzle N2 toward the outside (periphery side of the holding portion 23) in the radial direction of the central axis of the rotation holding portion 20 (see the same). At this time, the nozzle N2 moves in a first section between the central axis of the rotation holding unit 20 and a first point that is a predetermined distance away from the central axis. The first point may be outside a suction hole (not shown) provided in the central portion of the holding unit 23 in order to suck the wafer W by the holding unit 23. That is, the first point may be, for example, a point about 5 mm outward from the suction hole, or a point about 15 mm from the central axis.

  When the nozzle N2 reaches the first point, the controller 10 controls the pump 52A and the valve 53A while the dry gas G is being discharged from the nozzle N2b, so that the cleaning liquid L2 from the nozzle N2a is in the middle of the holding unit. It is made to supply to an area | region (between a center part and a peripheral part) (4th process; 4th process; Refer FIG.12 S34 and FIG.13 (b)). At this time, the nozzle N2 moves in a second section between the first point and a second point further away from the central point of the rotation holding unit 20 than the second point. The second point is located inside the peripheral edge of the holding part 23. The second point may be, for example, a point about 10 mm inward from the periphery of the holding unit 23 or a point about 55 mm from the central axis.

  When the nozzle N2 reaches the second point, the controller 10 controls the pump 52A and the valve 53A to stop the discharge of the cleaning liquid L2 from the nozzle N2a while the dry gas G is being discharged from the nozzle N2b. (Fourth process; fourth step; see step S35 in FIG. 12 and FIG. 13 (c)). At this time, the nozzle N <b> 2 moves in the third section between the second point and the periphery of the holding unit 23.

  Subsequently, similarly to steps S24 to S26 described above, the discharge of the dry gas G from the nozzle N2b is stopped and the rotation of the holding unit 23 is stopped (see step S36 in FIG. 12), and the nozzle N2 is moved to the standby position. After that (see step S37 in FIG. 12), the gas in the liquid processing unit U1 is exhausted (see step S38 in FIG. 12).

  According to Modification 2 described above, the same operational effects as Modification 1 can be obtained. Moreover, according to the modified example 2, since not only the dry gas G but also the cleaning liquid L2 is supplied to the holding unit 23, the holding unit 23 can be further cleaned. Further, since the cleaning liquid L2 is not supplied to the central part of the holding part 23, the cleaning liquid L2 is difficult to enter the suction hole located in the central part of the holding part 23. Therefore, it is possible to suppress a decrease in the wafer W adsorption capability by the holding unit 23. Furthermore, since the drying gas G is supplied from the nozzle N2b to the peripheral portion of the holding unit 23 while the cleaning liquid L2 is not supplied from the nozzle N2a, the cleaning liquid L2 that has spread to the peripheral portion of the holding unit 23 by the centrifugal force is the dry gas. B blown away by G. For this reason, the cleaning liquid L <b> 2 is suppressed from remaining in the holding unit 23. Therefore, it is possible to suppress contamination of the holding unit 23 with the cleaning liquid L2 while cleaning the holding unit 23 with the cleaning liquid L2 and the dry gas G. If the nozzle N2b is located behind the nozzle N2a in the advancing direction of the arm 54, the dry gas G discharged from the nozzle N2b always blows the cleaning liquid L2 discharged from the nozzle N2a outward. The cleaning liquid L2 hardly remains on the surface of the holding unit 23.

(Modification 3)
For example, as shown in FIG. 14, the arms 44 and 54 may be cleaned using a nozzle N3 that supplies a cleaning liquid L3 to the back surface Wb of the wafer W (fifth process; fifth process). . That is, first, the controller 10 controls the pump 62 and the valve 63 to discharge the cleaning liquid L3 from the nozzle N3. In this state, the controller 10 further controls the drive mechanism 46 or the drive mechanism 56 to move the arms 44 and 54 so that the lower surfaces of the arms 44 and 54 come into contact with the cleaning liquid L3 discharged from the nozzle N3. In this case, even if the processing liquid L1 discharged from the nozzle N1 collides with the inclined surface S and rebounds and adheres to the lower surfaces of the arms 44 and 54, the arm 44 is washed by the cleaning liquid L3 supplied from the nozzle N3 to the arms 44 and 54. , 54, the processing liquid L1 is removed. Therefore, it is possible to suppress the processing liquid L1 from dropping from the arms 44 and 54 to the wafer W during the processing of the wafer W. Therefore, defects are less likely to occur in the processed wafer W. The lower surfaces of the arms 44 and 54 may be inclined. In this case, the cleaning liquid L3 easily flows from the lower surfaces of the arms 44 and 54, and the cleaning liquid L3 hardly remains in the arms 44 and 54.

  As shown in FIG. 14, when the lower surfaces of the arms 44 and 54 are cleaned by the cleaning liquid L3 discharged from the nozzle N3, the dry gas G may be discharged from the nozzle N2 (sixth process; sixth Process). Specifically, in a state where an airflow curtain is formed outside the rotation holding unit 20 (holding unit 23) by the dry gas G discharged from the nozzle N2, the outer side than the rotation holding unit 20 (holding unit 23). When the lower surfaces of the arms 44 and 54 are cleaned with the cleaning liquid L3 from the nozzle N3, the drying gas G is discharged from the nozzle N2, and the position where the cleaning liquid L3 is supplied to the arms 44 and 54 is closer to the rotation holding unit 20 side. An air flow of the dry gas G may be formed. In this case, the airflow of the dry gas G from the nozzle N2 is formed on the rotation holding unit 20 (holding unit 23) side from the position where the cleaning liquid L3 is supplied to the arms 44 and 54 continuously or at a predetermined timing. The Therefore, even if the cleaning liquid L3 discharged from the nozzle N3 collides with the arms 44 and 54 and bounces back or becomes a mist, the bounced cleaning liquid L3 or the mist-like cleaning liquid L3 flows to the rotation holding unit 20 side. It is suppressed by the dry gas G. Therefore, it becomes difficult for the cleaning liquid L3 or its mist to adhere to the substrate support surface of the holding unit 23. As a result, contamination of the wafer W by the cleaning liquid L3 or its mist can be suppressed.

  In the cleaning process of the arms 44 and 54 in the third modification, the cleaning liquid L3 discharged from the nozzle N3 is supplied to the arms 44 and 54 outside the rotation holding unit 20 in the radial direction of the rotation axis of the rotation holding unit 20. The position of the nozzle N3 itself is not particularly limited, and the nozzle N3 can be arranged at an arbitrary position. Further, in the cleaning process of the arms 44 and 54 in the modified example 3, the airflow of the dry gas G from the nozzle N2 is closer to the rotation holding unit 20 (holding unit 23) than the position where the cleaning liquid L3 is supplied to the arms 44 and 54. The position of the nozzle N2 itself is not particularly limited, and the nozzle N2 can be arranged at an arbitrary position.

  The cleaning process of the arms 44 and 54 in the third modification may be performed before, during or during the dummy dispensing process, or may be performed independently without being related to the dummy dispensing process.

(Modification 4)
During dummy dispensing, the discharge ports of the nozzles N1 and N2 may be located inside the cup 30 or may be located outside the cup 30. That is, at the time of dummy dispensing, the height of the discharge ports of the nozzles N1 and N2 from the inclined surface S may be lower than the upper end 32a or higher than the upper end 32a. If the discharge ports of the nozzles N1 and N2 are positioned inward of the cup 30, the momentum at which the liquid discharged from the nozzles N1 and N2 collides with an object in the cup 30 is weakened. Therefore, since the liquid is difficult to change into a mist shape, it is possible to suppress scattering of the mist around the mist. Further, even if the liquid discharged from the nozzles N1 and N2 bounces off the inclined surface S, the bounce liquid does not easily splash outside the cup 30. In particular, when the discharge ports of the nozzles N <b> 1 and N <b> 2 are positioned below the substrate support surface of the holding unit 23 of the rotation holding unit 20, the generated mist is difficult to adhere to the substrate support surface of the holding unit 23. For this reason, contamination of the wafer W by the mist can be suppressed. On the other hand, when the discharge ports of the nozzles N1 and N2 are located outside the cup 30, even if the liquid discharged from the nozzles N1 and N2 rebounds on the inclined surface S, the rebound liquid adheres to the nozzles N1 and N2. It becomes difficult.

(Modification 5)
A surface treatment that reduces the liquid contact angle may be applied to at least the regions R1 and R2 of the inclined surface S. In this case, if the contact angle of the liquid in these regions R1 and R2 is small, liquid splash is unlikely to occur when the liquid from the nozzles N1 and N2 collides with the regions R1 and R2 during dummy dispensing. Examples of the surface treatment include blast treatment. Alternatively, instead of the surface treatment, dimple processing may be performed on at least the regions R1 and R2 of the inclined surface S, and a plurality of grooves extending in the radial direction of the central axis of the rotation holding unit 20 are formed. It may be.

(Modification 6)
The oblique wall 37 may be separate from the other walls 31 to 34 as in the above embodiment, or may be integrated with any of the walls 31 to 34 constituting the cup 30.

(Modification 7)
The dummy dispensing from the nozzles N1 and N2 may be performed on members other than the inclined wall 37 as long as it is located in the cup 30 and between the rotation holding unit 20 and the outer peripheral wall 32.

(Modification 8)
The position of the dummy dispense by the nozzle N1 may be the region R2, and the position of the dummy dispense by the nozzle N2 may be the region R1. Alternatively, the position of the dummy dispense by the nozzles N1 and N2 is not limited to the regions R1 and R2, but may be the inner region R.

  DESCRIPTION OF SYMBOLS 1 ... Substrate processing system (substrate processing apparatus), 2 ... Coating and developing apparatus (substrate processing apparatus), 10 ... Controller (control part), 20 ... Rotation holding part, 23 ... Holding part (chuck), 30 ... Cup, 32 ... Outer peripheral wall, 32a ... upper end, 37 ... inclined wall (inner wall part), 40 ... treatment liquid supply part (first supply part), 44 ... arm (first arm), 46 ... drive mechanism (first drive part) ), 50... Gas / liquid supply unit (first supply unit), 54... Arm (second arm), 56... Drive mechanism (second drive unit), 60 .. Cleaning liquid supply unit (second supply unit) 70 ... exhaust part, G ... dry gas, L1 ... processing liquid, L2, L3 ... cleaning liquid, N1 ... nozzle (processing liquid nozzle, upper nozzle), N2 ... nozzle (upper nozzle), N2a ... nozzle (cleaning liquid nozzle), N2b ... Nozzle (gas nozzle), N3 ... Nozzle (cleaning liquid nozzle, lower side) , R ... inner region, R1 ... region (first region), R2 ... region (second region), RM ... recording medium, S ... inclined surface, U1 ... liquid processing unit (substrate processing apparatus), W ... wafer (substrate), Wa ... front surface, Wb ... back surface.

Claims (21)

A rotation holding unit that rotates while holding the substrate;
A first supply unit configured to supply liquid from an upper nozzle to the surface of the substrate;
A cup that surrounds the periphery of the substrate held by the rotation holding unit and receives the liquid supplied from the first supply unit;
A control unit,
The cup has an outer peripheral wall that prevents scattering of the liquid spun off from the substrate rotated while being held by the rotation holding unit,
The said control part is a substrate processing apparatus which controls the said 1st supply part and performs the process which carries out the dummy dispensing of the process liquid to the inner area | region between the said outer peripheral wall and the said rotation holding part from the said upper nozzle.   The control unit controls the first supply unit so that a discharge port of the upper nozzle is positioned below the upper end of the cup or below the substrate support surface of the chuck of the rotation holding unit. The apparatus according to claim 1, wherein a process of performing dummy dispensing of liquid from the upper nozzle is performed.   The apparatus according to claim 1, wherein a liquid receiving portion in which the upper nozzle can stand by is provided above the outer peripheral surface of the cup. An exhaust unit configured to exhaust the inside of the cup;
The first supply unit includes:
A processing liquid nozzle for supplying a processing liquid to the surface of the substrate;
A cleaning liquid nozzle for supplying a cleaning liquid to the surface of the substrate;
A first drive unit that moves a first arm provided with the treatment liquid nozzle;
A second drive unit that moves the second arm provided with the cleaning liquid nozzle,
The control unit controls the first supply unit and the exhaust unit, and exhausts the inside of the cup by the exhaust unit,
A first process of moving the first arm by the first drive unit to position the processing liquid nozzle in the inner region;
A second process of moving the second arm by the second drive unit to position the cleaning liquid nozzle in the inner region;
4. The third process according to claim 1, wherein after the first process and the second process, a third process of performing dummy dispense of the process liquid and the cleaning liquid from the process liquid nozzle and the cleaning liquid nozzle, respectively, is performed. Equipment. The controller is
In the first process, the processing liquid nozzle is positioned in a predetermined first area of the inner area by moving the first arm by the first driving unit,
In the second process, the second arm is moved by the second driving unit, so that the cleaning liquid nozzle is opposite to the first region in the inner region with the rotation holding unit in between. The apparatus according to claim 4, wherein the apparatus is located in the second region of the device. The first area is an area closer to a standby position where the processing liquid nozzle and the cleaning liquid nozzle stand by outside the cup than the rotation holding unit in the inner area,
The apparatus according to claim 5, wherein the second region is a region on the side farther from the standby position than the rotation holding portion in the inner region. The first supply unit has a gas nozzle provided on the second arm while supplying a dry gas to the surface of the substrate,
The control unit controls the rotation holding unit and the first supply unit to rotate the chuck of the rotation holding unit so that the gas nozzle passes above the chuck. The apparatus according to any one of claims 4 to 6, wherein a fourth process of supplying a dry gas from the gas nozzle to the chuck while moving an arm by the second drive unit is performed. In the fourth process, the control unit moves the second arm so that both the gas nozzle and the cleaning liquid nozzle move from the central portion toward the peripheral portion of the chuck while the chuck is rotated. While being moved by the second drive unit,
When the gas nozzle and the cleaning liquid nozzle pass above the central part of the chuck, dry gas is supplied from the gas nozzle to the central part of the chuck, but no cleaning liquid is supplied from the cleaning liquid nozzle;
When the gas nozzle and the cleaning liquid nozzle pass above an intermediate area between the central portion and the peripheral edge of the chuck, dry gas and cleaning liquid are respectively supplied from the gas nozzle and the cleaning liquid nozzle to the intermediate area of the chuck. To supply,
When the gas nozzle and the cleaning liquid nozzle pass above the peripheral edge of the chuck, the dry gas is supplied from the gas nozzle to the peripheral edge of the chuck, but the cleaning liquid is not supplied from the cleaning liquid nozzle. The apparatus of claim 7. A second supply unit configured to supply a cleaning liquid to the back surface of the substrate from a lower nozzle located in the cup;
The said control part controls the said 1st and 2nd supply part, and performs the 5th process which supplies a washing | cleaning liquid to the said 1st or 2nd arm from the said lower nozzle. The apparatus as described in any one of. A second supply unit configured to supply a cleaning liquid to the back surface of the substrate from a lower nozzle located in the cup;
The control unit controls the first and second supply units to discharge the cleaning liquid from the lower nozzle and supply the cleaning liquid to the first or second arm outside the rotation holding unit. In addition, a dry gas is discharged from the gas nozzle, and a dry gas flow is formed on the rotation holding unit side from the position where the cleaning liquid discharged from the lower nozzle is supplied to the first or second arm. The apparatus according to claim 7 or 8, wherein the sixth process is executed. A method of performing dummy dispensing from an upper nozzle that supplies liquid to the surface of a substrate that is held by a rotation holding unit and is surrounded by a cup,
The cup has an outer peripheral wall that prevents scattering of the liquid spun off from the substrate rotated while being held by the rotation holding unit,
A dummy dispensing method including a step of performing dummy dispensing of liquid from the upper nozzle to an inner region between the outer peripheral wall and the rotation holding unit.   In the step, dummy dispensing of liquid from the upper nozzle is performed in a state where the discharge port of the upper nozzle is positioned below the upper end of the cup or below the substrate support surface of the chuck of the rotation holding unit. Item 12. The method according to Item 11.   The method according to claim 11 or 12, wherein when the dummy dispensing is not performed, the upper nozzle is made to wait above a liquid receiving portion provided on an outer peripheral surface of the cup. A first step of moving a first arm provided with a processing liquid nozzle for supplying a processing liquid to the surface of the substrate to position the processing liquid nozzle in the inner region;
A second step of moving a second arm provided with a cleaning liquid nozzle for supplying a cleaning liquid to the surface of the substrate to position the cleaning liquid nozzle in the inner region;
After the first and second steps, a third step of performing dummy dispensing of the processing liquid and the cleaning liquid from the processing liquid nozzle and the cleaning liquid nozzle, respectively,
The method according to any one of claims 11 to 13, wherein the first to third steps are performed while exhausting the inside of the cup. In the first step, the processing liquid nozzle is positioned in a predetermined first region of the inner region,
The method according to claim 14, wherein, in the second step, the cleaning liquid nozzle is positioned in a second region opposite to the first region in the inner region, the rotation holding unit being opposite to the first region. The first area is an area closer to a standby position where the processing liquid nozzle and the cleaning liquid nozzle stand by outside the cup than the rotation holding unit in the inner area,
The method according to claim 15, wherein the second region is a region on the side farther from the standby position than the rotation holding portion in the inner region.   In a state where the chuck of the rotation holding unit is rotated, the gas nozzle provided on the second arm moves the second arm so that the gas nozzle passes above the chuck, and dry gas is discharged from the gas nozzle to the chuck. The method according to any one of claims 14 to 16, further comprising a fourth step of supplying to the device. In the fourth step, with the chuck rotated, while moving the second arm so that the gas nozzle and the cleaning liquid nozzle are both moved from the central part toward the peripheral part of the chuck,
When the gas nozzle and the cleaning liquid nozzle pass above the central part of the chuck, dry gas is supplied from the gas nozzle to the central part of the chuck, but no cleaning liquid is supplied from the cleaning liquid nozzle;
When the gas nozzle and the cleaning liquid nozzle pass above an intermediate area between the central portion and the peripheral edge of the chuck, dry gas and cleaning liquid are respectively supplied from the gas nozzle and the cleaning liquid nozzle to the intermediate area of the chuck. Supplying,
When the gas nozzle and the cleaning liquid nozzle pass above the peripheral edge of the chuck, a dry gas is supplied from the gas nozzle to the peripheral edge of the chuck, but no cleaning liquid is supplied from the cleaning liquid nozzle. The method of claim 17.   The method according to any one of claims 14 to 18, further comprising a fifth step of supplying cleaning liquid to the first or second arm from a lower nozzle located in the cup.   The cleaning liquid is discharged from the lower nozzle located in the cup to supply the cleaning liquid to the first or second arm outside the rotation holding unit, and the drying gas is discharged from the gas nozzle, The method further comprises a sixth step of forming a dry gas stream on the side of the rotation holding unit from a position where the cleaning liquid discharged from the lower nozzle is supplied to the first or second arm. The method described in 1.   A computer-readable recording medium having recorded thereon a program for causing a substrate processing apparatus to execute the dummy dispensing method according to any one of claims 11 to 20.

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