JP2018120951A - Exposure device and led head, and image formation apparatus including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide means for increasing the number of substrates that can be taken out in the production by an exposure device.SOLUTION: An exposure device comprises: a substrate with a plurality of light-emitting elements provided thereon in an array direction; a lens which is arranged for condensing light from the plurality of light-emitting elements, and which can be extended in the array direction; and a holder serving to support the substrate and the lens. The holder has a plurality of contacting parts arrayed in the array direction, provided that substrates are to be put in contact with the contacting parts. The substrate has: a protrusion part protruding from one end in a widthwise direction, which is a direction orthogonal to the array direction, to the widthwise direction; and a recessed part formed by notching, in the widthwise direction, the substrate at a position corresponding to the protrusion part, at the other end on a side opposite to the one end. The protrusion part is put in contact with the contacting part of the holder to dispose the substrate in the holder.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an exposure apparatus, an LED head, and an image forming apparatus including the exposure apparatus in which a substrate on which the light emitting element is mounted and a lens that collects light from the light emitting element are supported by a holder.

  An LED (Light Emitting Diode) head used in a conventional printer or the like is assembled by pressing both side end portions of a substrate on which a plurality of LED array chips are mounted against a contact surface provided on a holder (for example, Patent Documents). 1).

JP 2009-73041 A (paragraphs 0022, 0033, 0040, FIG. 1)

However, in the conventional LED head described above, it is necessary to secure a space for bringing the substrate into contact with the holder, and the width of the substrate increases. Therefore, the number of substrates that can be cut out from one work board (called the number to be taken) )) Will decrease.
The present invention aims to solve the above problems.

  In order to solve the above problems, the present invention provides an exposure apparatus in which a substrate on which a plurality of light emitting elements are mounted in the arrangement direction, a lens that collects light from the light emitting elements, and that extends in the arrangement direction, A holder for supporting the lens and the lens, wherein the holder has a plurality of abutting portions arranged in the arrangement direction and abutting on the substrate, and the substrate is in a direction orthogonal to the arrangement direction. A convex portion projecting in the width direction from one end in the width direction, and a concave portion formed by cutting out a position corresponding to the convex portion on the other end opposite to the one end in the width direction, The convex portion is brought into contact with the contact portion of the holder, and the substrate is arranged in the holder.

  Thereby, the present invention has an effect that the number of substrates that can be cut out from one work board can be increased.

Explanatory drawing which shows the printer of Example 1. Explanatory drawing which shows the LED head of Example 1. Explanatory drawing which shows the board | substrate of Example 1. FIG. Explanatory drawing which shows the assembly | attachment method of the board | substrate of Example 1. FIG. Explanatory drawing which shows the other aspect of the contact part of Example 1. FIG. Explanatory drawing which shows the board | substrate of Example 2. FIG. Explanatory drawing which shows the assembly | attachment method of the board | substrate of Example 2. FIG.

  Embodiments of an exposure apparatus, an LED head, and an image forming apparatus according to the present invention will be described below with reference to the drawings.

  The LED head and printer according to this embodiment will be described below with reference to FIGS.

  A printer 1 as an image forming apparatus according to the present embodiment is an electrophotographic printer, and has a function of printing an image based on input print data on printing paper as a medium. The configuration shown in FIG. 1 is provided.

The printer 1 is provided with a sheet conveyance path 2 that connects the upper surface and the lower part of the apparatus housing in a substantially S shape, and serves as a medium accommodating section that accommodates sheets at one end on the lower side of the sheet conveyance path 2. The other paper cassette 3 is provided, and the other end is provided with a stacker 4 for collecting printed paper.
A hopping roller 5 is provided at the connecting portion between the paper transport path 2 and the paper feed cassette 3 to feed the paper from the paper feed cassette 3 to the paper transport path 2 one by one. A registration roller 6 for correcting the skew of the conveyed paper is disposed on the downstream side (see the arrow in FIG. 1).

On the downstream side of the registration roller 6, a conveyance belt 7, a fixing device 8, and a discharge roller 9 are sequentially arranged along the sheet conveyance direction.
The fixing device 8 includes a heating roller 8a, a backup roller 8b, and the like, and fixes a toner image as a developer image on a sheet by pressure and heat.

  In the printer 1 of the present embodiment, four independent image forming units 11k, 11y, 11m, and 11c are arranged in the order of developing toner images along the paper conveyance direction. Since the set colors are the same except for the set colors, that is, K color (black), Y color (yellow), M color (magenta), and C color (cyan), one image forming unit 11 will be described below. To do.

  The image forming unit 11 has a photosensitive drum 12 as an image carrier on which an electrostatic latent image is formed, a charging roller 13 as a charging unit, and a photosensitive drum 12 as a charging unit that uniformly and uniformly charges the photosensitive drum 12. A developer roller 14 as a developer carrier, a supply roller 15, and a set color are formed by attaching toner as a developer to the electrostatic latent image formed on the outer peripheral surface of the toner. A toner cartridge 16 or the like as a developer container that contains toner is included.

A supply roller 15 as a developer supply member presses the outer peripheral surface of the development roller 14 and supplies the toner supplied from the toner cartridge 16 to the development roller 14.
A developing blade 17 as a developer layer regulating member presses the outer peripheral surface of the developing roller 14 and thins the toner supplied from the supply roller 15 onto the developing roller 14.

A cleaning blade 18 as a cleaning member presses the outer peripheral surface of the photosensitive drum 12 and scrapes off and removes toner remaining on the photosensitive drum 12 after transfer.
A transfer roller 19 serving as a transfer device is arranged opposite to the opposite side of the photosensitive drum 12 of each image forming unit 11 with the conveying belt 7 interposed therebetween, and charges the sheet with a polarity opposite to that of the toner to form a surface on the photosensitive drum 12. The formed toner image is transferred onto a sheet.

  The LED head 20 serving as an exposure device is disposed above the photoconductive drum 12 of each image forming unit 11 to expose the photoconductive drum 12 according to the image data of each set color, and electrostatic latent image on the photoconductive drum 12. Form an image.

  Hereinafter, a printing operation by the printer 1 of the present embodiment will be described.

  When print data is received from a host device (not shown) such as a personal computer, the printer 1 starts a printing operation, feeds the paper in the paper cassette 3 to the paper transport path 2 by the hopping roller 5, and feeds the fed paper to the registration roller 6. Transport to.

The sheet conveyed to the registration roller 6 is conveyed from the registration roller 6 to the conveyance belt 7, and sequentially passes through the image forming units 11k, 11y, 11m, and 11c as the conveyance belt 7 rotates in the sheet conveyance direction.
At this time, in each image forming unit 11, the surface of the photosensitive drum 12 is uniformly charged by the charging roller 13, and the charged surface is exposed by the LED head 20 that emits light according to the image data, so that the electrostatic latent image is formed. It is formed.

To this electrostatic latent image, the toner thinned by the developing blade 17 on the developing roller 14 is electrostatically attached, and a toner image of each set color is formed.
The formed toner images of the respective set colors are transferred onto the paper by the transfer roller 19, and a color toner image is formed on the paper.
The toner remaining on the photosensitive drum 12 after the transfer is removed by the cleaning blade 18.

On the other hand, the sheet on which the color toner image has been transferred is conveyed to the fixing device 8, where the toner image is fixed on the sheet by the fixing device 8, and a color image is printed on the sheet.
The printed paper on which the color image is printed is sandwiched between the discharge rollers 9 and discharged onto the stacker 4.

  In this way, the printing operation by the printer 1 of this embodiment is performed.

As shown in FIG. 2, the LED head 20 mounted on each image forming unit 11 of the printer 1 includes an LED array chip 21 as a light emitting element and a drive IC that drives the LED array chip 21. And the like, a lens 22 such as a Selfoc lens array (Selfoc is a registered trademark of Nippon Sheet Glass Co., Ltd.), a mounting plate 24, a holder 25 supporting these, and the like. Composed.
FIG. 2 is a perspective view having a cross section along the ZZ cross section line shown in FIG.

  The LED array chip 21 is mounted along the direction perpendicular to the paper conveyance direction (referred to as the arrangement direction) in the center of the substrate 22 (see FIG. 3), and each LED chip constituting the LED array chip 21 receives image data. Light is emitted according to the image data signal formed on the basis.

  A plurality of bonding pads 26 are arranged on one side in the direction orthogonal to the arrangement direction of the substrates 22 (width direction), and a connector 26a (see FIG. 5) for mounting a flexible flat cable (not shown) is attached to the bonding pads 26. ) To the LED array chip 21 is connected to a wire 26b for transmitting an image data signal or the like.

The lens 23 is attached along the arrangement direction below the LED array chip 21 at the center of the lower portion of the holder 25 by an adhesive portion 27 made of silicone resin, epoxy adhesive, acrylic adhesive, or the like.
The attachment plate 24 is attached to the side plates on both sides of the holder 25 by joint portions 28 made of a bonding agent such as a silicone resin, an epoxy adhesive, and an acrylic adhesive.
The mounting plate 24 is provided with a cable insertion hole (not shown) for connecting a flexible flat cable to the connector 26a on the substrate 22.

The holder 25 of this embodiment is provided with a plurality of support portions 29 formed by bending a part of the side plates on both sides inward, and on the support portion 29, an ultraviolet curable resin, an epoxy-based adhesive is provided. A cylindrical contact portion 31 formed of an acrylic adhesive or the like is provided.
The height of the contact surface of the contact portion 31 with the substrate 22 is determined so that the distance between the lens 23 and the LED array chip 21 becomes an optimum focus value unique to the lens 23.

FIG. 3 is a diagram showing a state in which the substrate 22 for mounting the LED head on which the LED array chip 21 and the like are mounted is cut out from the work board. FIG. 3A shows a state in which the two conventional substrates 22 are cut out. (B) shows the cut-out state of the two substrates 22 of the present embodiment.
As shown in FIG. 3A, the conventional substrate 22 has a plurality of LED array chips 21 arranged along the arrangement direction on the center line at a distance A from the side edges on both sides in the width direction. A plurality of bonding pads 26 are arranged along the arrangement direction on the side of the.

Further, a contact area 22a (referred to as an area having a width B indicated by a two-dot chain line in FIG. 3) for contacting the contact portion 31 of the holder 25 is provided at each side end of the substrate 22. It is secured.
This is because a wire 26b is connected to the bonding pad 26 of the substrate 22 (see FIG. 2), so that a dedicated area is provided in order to bring the substrate 22 into direct contact with the contact portion 31 of the holder 25. It is necessary.

The reason why the LED array chip 21 is arranged at the center in the width direction of the substrate 22 is to suppress bending in the width direction due to heat generation during light emission of the LED chip.
For this reason, the conventional substrate 22 has a region that is not electrically required on the side opposite to the bonding pad 26.
In addition, the length of the width direction of the conventional board | substrate 22 of a present Example is about 7-8 mm.

Such a conventional substrate 22 for mounting an LED head is formed by moving a router having a predetermined diameter in the arrangement direction and cutting it with a cutting width C.
The cut width C is formed as a result of moving the same router a plurality of times along the same route while changing the position in the width direction.

  On the other hand, as shown in FIG. 3B, the substrate 22 of this embodiment has the LED array chip 21 and the bonding pads 26 arranged in the same manner as in the prior art. In order to secure the contact area 22a, a convex portion 33 is provided that protrudes from one end of the substrate 22 in the width direction.

  Further, a recess 34 is formed by cutting the substrate 22 in the width direction from the other end at a position corresponding to the convex portion 33 on the other side end of the substrate 22, and the other end excluding the recess 34 is in contact with the width B. Used as area 22a.

  In FIG. 3 (b), one convex portion 33 and one concave portion 34 are shown, but in reality, a plurality of convex portions 33 and concave portions 34 are provided along the arrangement direction, and the arrangement direction of the contact areas 22a between the concave portions 34 is provided. Is longer than the length of the projections 33 in the arrangement direction.

The LED array chip 21 of the present embodiment is arranged on a center line in which the distance D ₁ from one side end and the distance D ₂ from the other side end are set to be the same in order to suppress bending in the width direction. The
The distance D ₁ is set so that the distance from one side end to the bonding pad 26 end is set to E so that the router does not interfere with the bonding pad 26 when the substrate 22 is cut (E is 100 μm in this embodiment). that's all).

  The substrate 22 for mounting the LED head of this embodiment is moved in the arrangement direction once by a width B at the convex portion 33 after moving the router having the same diameter as the conventional one in the arrangement direction. After the movement, it is formed by cutting back by the width B in the width direction, moving again in the arrangement direction, and cutting with the same cutting width C as in the prior art.

Thereby, the convex part 33 is formed in the end of the width direction of the board | substrate of a present Example, and the recessed part 34 is simultaneously formed in the position corresponding to the convex part 33 of the other end.
Further, the length of the opening of the concave portion 34 in the arrangement direction is longer by 2C than the length of the tip of the convex portion 33, and the distance between the tip of the convex portion 33 and the bottom of the concave portion 34 is C which is the same as the cutting width.

  In this embodiment, the same cutting width C is used to cut with the same router as in the prior art. If the distance between the two substrates 22 is increased, the distance and time for cutting with the router are increased. If the distance between 22 is reduced, a router with a smaller diameter than before will be used, increasing the frequency of router replacement, or reducing the number of stacked work boards when cutting, increasing the cost of board production. Because it does.

Thus, in the substrate 22 of this embodiment, the distance from the tip of the convex portion 33 to the center line of the LED array chip 21 is A, and the distance from the center line to both ends in the width direction of the substrate 22 is the same D ₁ and D ₂ , so that the distance from the tip of the convex portion 33 to the other end is the length corresponding to the width B of the contact area 22a even if the contact area 22a of the width B is secured at the other end. It becomes shorter and the width | variety of the board | substrate 22 required for one board | substrate production can be made small.

The substrate 22 of the present embodiment as described above is mounted in the holder 25 shown in FIG. 4A manufactured as the width of the substrate 22 is reduced.
4A is a top view showing a state in which the lens 23 is bonded to the holder 25 by the bonding portion 27. FIG.

  In the holder 25, the support portions 29 provided on the side plates on both sides and the contact portions 31 thereon are staggered along the arrangement direction, that is, the contact portions 31 do not face each other in the width direction, and the recesses are recessed. It is arranged at a position that does not overlap with the formation position of 34.

When the substrate 22 is arranged in such a holder 25, as shown in FIG. 4 (b), the projection 33 provided at one end in the width direction of the substrate 22 is in contact with the opposite position. The abutting area 22a of the other end is placed on the abutting part 31 placed on the abutting surface of the part 31 and avoiding the recess 34 at the other end. A joint 28 is formed by a bonding agent at the corners on both sides of the holding plate 24 and the side plate of the holder 25 and fixed.
The arrangement of the contact portions 31 in the vicinity of the mounting region of the connector 26a on the board 22 is preferably in the mode shown in FIGS.

That is, since the load accompanying insertion / extraction of the flexible flat cable is applied to the connector 26a, at least one convex portion 33 and the abutting portion 31 to be brought into contact with the at least one convex portion 33 are provided at the central portion in the arrangement direction of the mounting region of the connector 26a of the board 22. In the contact area 22a on the opposite side in the width direction, two contact portions 31 that contact the contact area 22a are provided.
In this case, the arrangement of the abutting portions 31 is such that the two abutting portions 31 on the opposite side are provided at positions where isosceles triangles with the abutting portions 31 that abut the convex portions 33 as a vertex are formed. Good.

  As described above, in this embodiment, the contact area 22a for contacting the contact portion 31 of the holder 25 is the convex portion 33 protruding from one end of the substrate 22, and the LED array chip 21 is replaced with the substrate 22. The width of the substrate 22 can be narrowed while suppressing the bending of the substrate 22 due to the heat generation of the LED array chip 21, and the substrate 22 that can be cut out from one work board can be removed. The number can be increased.

  As a result, the unit price per substrate can be reduced, the LED head 20 can be reduced in size, and the cost of components such as the mounting plate 24 constituting the LED head can be reduced. .

  Hereinafter, the LED head of this embodiment will be described with reference to FIGS. Note that parts similar to those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

FIG. 6 is a diagram showing a state in which the substrate 22 for mounting the LED head on which the LED array chip 21 and the like are mounted is cut out from the work board. FIG. 6A shows a state in which the two conventional substrates 22 are cut out. (B) shows the cut-out state of the two substrates 22 of the present embodiment.
Since the configuration of the conventional substrate 22 shown in FIG. 6A is the same as that of the first embodiment, the description thereof is omitted.

  As shown in FIG. 6B, the substrate 22 of the present embodiment has the LED array chip 21 and the bonding pad 26 arranged in the same manner as in the prior art. In addition, a convex portion 33 (hereinafter referred to as a first convex portion 33) for securing the contact area 22a having a width B is provided.

  Projecting in the width direction from the other end of the substrate 22 at a position avoiding the position of the first convex portion 33 at the other side end of the substrate 22 in order to secure a contact area 22a of the width B of the other end portion. The second convex portion 41 is provided so that the first convex portion 33 and the second convex portion 41 do not face each other in the width direction.

As in the first embodiment, the LED array chip 21 of the present embodiment is disposed on a center line having the same distances D ₁ and D ₂ from the side ends on both sides in order to suppress bending in the width direction. The
The distance E for setting the distance D ₁ is the same as that in the first embodiment.

  The substrate 22 for mounting the LED head of this embodiment is moved by a width B once in the width direction at the first convex portion 33 after moving the router having the same diameter as the conventional one in the arrangement direction, After moving in the arrangement direction, move back by the width B in the width direction and move again in the arrangement direction. When returning the router, the second convex portion 41 is once moved in the width direction by the width B and moved in the arrangement direction. After the movement, it is formed by cutting back by the width B in the width direction, moving again in the arrangement direction, and cutting with the same cutting width C as in the prior art.

  As a result, the first convex portion 33 is formed at one end in the width direction of the substrate of the present embodiment, and the nested second convex portion 41 is simultaneously formed at a position avoiding the first convex portion 33 at the other end. Is done.

As described above, in the substrate 22 of this example, the distances from the respective tips of the first convex portion 33 and the second convex portion 41 to the center line of the LED array chip 21 are A, respectively, The distances to both ends in the width direction of 22 are the same D ₁ and D ₂ . That is, the distance between the side edges on both sides of the substrate 22 and the inner surface of the side plate of the holder 25 facing it is substantially the same.

  For this reason, the distance between the respective tips of the first convex portion 33 and the second convex portion 41 is 2A as in the prior art, but the first convex portion 33 and the second convex portion 41 are nested. The distance F between one side edge of the first substrate 22 and the other side edge of the second substrate 22 is determined by the width B and the cutting width C of the contact area 22a. Thus, the number of substrates 22 that can be cut out from one work board can be increased.

  The substrate 22 of the present embodiment as described above is mounted in a conventional holder 25 shown in FIG.

  As in the first embodiment, the holder 25 has the support portions 29 provided on the side plates on both sides and the contact portions 31 thereabove in a staggered manner along the arrangement direction, that is, the contact portions 31 have a width. It is arranged at a position that does not oppose in the direction and overlaps with the formation position of the first convex portion 33 and the second convex portion 41.

  When the substrate 22 is arranged in such a holder 25, as shown in FIG. 7B, the first convex portion 33 provided at one end in the width direction of the substrate 22 is provided at a position facing it. The second convex portion 41 at the other end is placed on the abutting portion 31 provided at a position opposite to the second convex portion 41, and the substrate 22 is attached by the mounting plate 24. suppress.

  Then, a bonding agent for forming the bonding portion 28 is poured from a gap on both sides between the side surfaces on both sides of the mounting plate 24 and the inner surface of the side plate of the holder 25 using a nozzle or the like. The gap between the end and the inner surface of the side plate of the holder 25 is sealed with a bonding agent, and bonding portions 28 are formed and fixed at the corners on both sides of the mounting plate 24 and the side plate of the holder 25.

  As described above, in this embodiment, the first convex portion 33 and the second convex portion 41 are nested, and the substrate 22 is cut out from the work board. The distance F between one side edge and the other side edge of the second substrate 22 can be shortened by the difference between the width B of the contact area 22a and the cutting width C. The number of substrates 22 that can be cut out from the work board can be increased, and compatibility with the conventional substrate 22 can be ensured.

When the substrate 22 is mounted in the holder 25, the distance between the side ends on both sides of the substrate 22 and the inner surface of the side plate of the holder 25 facing the substrate 22 is substantially the same. Since the distances D ₁ and D ₂ between the LED array chip 21 and the both ends of the substrate 22 are the same, the amount of heat associated with the light emission of the LED array chip 21 is equal to one end of the substrate 22. Side and the other end are evenly discharged to the holder 25, the uniformity of the temperature distribution of the substrate 22 can be improved, and the bending of the LED array chip 21 during light emission can be further suppressed, and color misregistration during color printing can be prevented. It is possible to suppress the deterioration of the print quality.

In each of the above embodiments, the position where the LED array chip 21 is provided is described as being on the center line of the substrate 22 with the same distances D ₁ and D ₂ from the side edges on both sides, but the distance D ₁ , D ₂ may be any substantially the same. Specifically, if the distance D ₁ is within ± 10% of the distance D ₂ , the effect of suppressing the bending of the substrate 22 can be obtained.

  In each of the above embodiments, the contact portion 31 with which the substrate 22 abuts is formed on the support portion 29 formed by bending a part of the side plate of the holder 25 inward using an ultraviolet curable resin or the like. As described above, when the holder 25 is formed using a mold resin or the like, the contact portion 31 may be integrally formed, or may be formed by machining an aluminum die cast.

  Further, in each of the above embodiments, the medium is described as a printing sheet. However, the medium is not limited to the above, and may be an OHP sheet, an envelope, a copy sheet, a special sheet, or the like.

DESCRIPTION OF SYMBOLS 1 Printer 2 Paper conveyance path 3 Paper feed cassette 4 Stacker 5 Hopping roller 6 Registration roller 7 Conveyance belt 8 Fixing device 9 Ejection roller 11, 11k, 11y, 11m, 11c Image forming unit 12 Photosensitive drum 13 Charging roller 14 Development roller 15 Supply roller 16 Toner cartridge 17 Developing blade 18 Cleaning blade 19 Transfer roller 20 LED head 21 LED array chip 22 Substrate 22a Contact area 23 Lens 24 Mounting plate 25 Holder 26 Bonding pad 26a Connector 26b Wire 27 Bonding portion 28 Joining portion 29 Supporting portion 31 Abutting part 33 Convex part (first convex part)
34 Concave portion 41 Second convex portion

Claims (7)

A substrate on which a plurality of light emitting elements are mounted in the arrangement direction;
A lens that condenses the light from the light emitting element and extends in the arrangement direction;
A holder for supporting the substrate and the lens,
The holder is
A plurality of contact portions disposed in the arrangement direction and contacting the substrate;
The substrate is
A convex portion projecting in the width direction from one end of the width direction which is an orthogonal direction of the arrangement direction;
A recess formed by cutting out a position corresponding to the projection on the other end opposite to the one end in the width direction;
An exposure apparatus, wherein the convex portion is brought into contact with the contact portion of the holder, and the substrate is disposed in the holder. The exposure apparatus according to claim 1,
The exposure apparatus, wherein the light emitting element is disposed at a position where a distance from one end of the substrate and a distance from the other end of the substrate are substantially the same. In the exposure apparatus according to claim 1 or 2,
A contact area for contacting the contact portion is provided between the recesses,
An exposure apparatus, wherein a length of the contact area in the arrangement direction is longer than a length of the first protrusion in the arrangement direction of the protrusions. In the exposure apparatus according to any one of claims 1 to 3,
An exposure apparatus, wherein a bonding pad is disposed along the arrangement direction between the light emitting element and the convex portion. In the exposure apparatus according to any one of claims 1 to 4,
The convex portion is a first convex portion,
In place of the concave portion, a second convex portion projecting in the width direction from the other end of the substrate is provided at a position of the other end of the substrate that does not face the first convex portion in the width direction,
An exposure apparatus, wherein the first and second convex portions are brought into contact with the contact portion of the holder, and the substrate is disposed in the holder. A substrate on which a plurality of LED array chips are mounted in the arrangement direction;
A lens that condenses the light from the light emitting element and extends in the arrangement direction;
A holder for supporting the substrate and the lens,
The holder is
A plurality of contact portions disposed in the arrangement direction and contacting the substrate;
The substrate is
A convex portion projecting in the width direction from one end of the width direction which is an orthogonal direction of the arrangement direction;
A recess formed by cutting out a position corresponding to the projection on the other end opposite to the one end in the width direction;
The LED head according to claim 1, wherein the convex portion is brought into contact with the contact portion of the holder, and the substrate is disposed in the holder.   An image forming apparatus comprising the exposure apparatus according to claim 1 or the LED head according to claim 6.

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