JP2018113416A

JP2018113416A - Communication apparatus

Info

Publication number: JP2018113416A
Application number: JP2017004482A
Authority: JP
Inventors: 上田　英一; Hidekazu Ueda; 英一上田
Original assignee: New Cosmos Electric Co Ltd
Current assignee: New Cosmos Electric Co Ltd
Priority date: 2017-01-13
Filing date: 2017-01-13
Publication date: 2018-07-19
Anticipated expiration: 2037-01-13
Also published as: JP6873708B2

Abstract

PROBLEM TO BE SOLVED: To provide a communication apparatus capable of reducing influences to a circuit board caused by dew condensation, in a housing of the communication apparatus attached to an outdoor attachment target body.SOLUTION: A communication apparatus 1 has a circuit board 3 provided with an electronic component, and is configured to communicate with an alarm and provided outside. The communication apparatus 1 comprises: a housing 2 that has an attachment face 21 attached to an attachment target body; and a substrate supporting body that supports the circuit board 3, and arranged so as to be opposed to an inner surface 21a of the attachment face 21 that is an inner surface side of the housing 2. The communication apparatus 1 has a thermal insulation space SP between a surface 4a on the circuit board 3 side of the substrate supporting body and the inner surface 21a of the attachment face 21.SELECTED DRAWING: Figure 7

Description

本発明は通信機に関する。さらに詳しくは、本発明は、電子部品が設けられた回路基板を有し、警報器と通信するように構成された、室外に設けられる通信機に関する。 The present invention relates to a communication device. More specifically, the present invention relates to a communication device provided outdoors that includes a circuit board provided with electronic components and is configured to communicate with an alarm device.

一般的に、ガス漏れや火災、熱中症のような環境の異常を検知する警報器が家屋内に設置され、ガス漏れや火災などの環境の異常を報知することが行なわれている。このような警報器と、屋外に設けられたガスメータとを通信させることにより、警報器により異常が検知された後、ガスメータの遮断弁を遮断し、ガス漏れや火災による被害を低減させるシステムが知られている（たとえば特許文献１参照）。 In general, an alarm device that detects environmental abnormalities such as gas leaks, fires, and heat strokes is installed in a house to notify environmental abnormalities such as gas leaks and fires. A system is known that communicates such an alarm device with a gas meter installed outdoors to shut off the shut-off valve of the gas meter after an abnormality is detected by the alarm device to reduce damage caused by gas leakage or fire. (See, for example, Patent Document 1).

このようなシステムは、たとえば、警報器と、警報器と通信可能な無線端末と、無線端末を介して遮断弁を遮断してガスの供給を停止することが可能なガスメータとを有している。このようなシステムに用いられる無線端末は、通信や所望の制御を行うために、筐体の内部に回路基板を有している。無線端末は、たとえば、ガスメータの筐体、ガスメータに接続されるガス管、建物の外壁などに取り付けられ、無線端末が屋外など、警報器が設けられた部屋の室外に設けられることがある。 Such a system includes, for example, an alarm device, a wireless terminal capable of communicating with the alarm device, and a gas meter capable of shutting off a shutoff valve and stopping gas supply via the wireless terminal. . A wireless terminal used in such a system has a circuit board inside the housing in order to perform communication and desired control. The wireless terminal is attached to, for example, a gas meter casing, a gas pipe connected to the gas meter, an outer wall of a building, and the like, and the wireless terminal may be provided outside a room provided with an alarm device such as outdoors.

特開２００５−１８７３５号公報JP 2005-18735 A

このように室外に無線端末などの通信機が設けられる場合、通信機の筐体内外の外的要因によって回路基板に結露が生じて回路基板へ悪影響をもたらすことがある。たとえば、通信機の筐体が、通信機が取り付けられて接触するガスメータ、ガス管、建物の外壁などから冷やされたり、天候などにより通信機の筐体が冷やされることにより、通信機の筐体内部に設けられた回路基板に熱が伝達され、回路基板の温度が低下する場合がある。回路基板の温度が低下すると、通信機の筐体内部の水蒸気を含んだ空気が回路基板と接触して冷やされると、水蒸気を含んだ空気が露点温度以下となり、回路基板に結露が生じてしまう場合がある。回路基板に結露が生じると、回路のショートなど、回路基板に悪影響を及ぼし、通信機の故障の一因となる。 When a communication device such as a wireless terminal is provided outside in this way, condensation may occur on the circuit board due to external factors inside and outside the housing of the communication device, which may adversely affect the circuit board. For example, the communication device casing is cooled by a gas meter, a gas pipe, an outer wall of a building, or the like that comes in contact with the communication device, or the communication device case is cooled by the weather, etc. In some cases, heat is transmitted to a circuit board provided inside, and the temperature of the circuit board is lowered. When the temperature of the circuit board is lowered, when the air containing water vapor inside the housing of the communication device comes into contact with the circuit board and is cooled, the air containing water vapor falls below the dew point temperature, causing condensation on the circuit board. There is a case. If dew condensation occurs on the circuit board, it may adversely affect the circuit board, such as a short circuit, causing a failure of the communication device.

そこで、本発明はかかる問題点に鑑みて、ガスメータ、ガス管、建物の外壁など、室外の取付対象体に取り付けられる通信機の筐体内部において、通信機の回路基板が結露することを抑制し、結露による回路基板への影響を低減することを目的とする。特に、本発明は、通信機が接触する取付対象体からの通信機の筐体の取付面からの熱伝導に起因する結露を抑制し、結露による回路基板への影響を低減することを目的とする。 Therefore, in view of such a problem, the present invention suppresses the dew condensation on the circuit board of the communication device inside the housing of the communication device attached to an object to be attached outdoors such as a gas meter, a gas pipe, and an outer wall of a building. The purpose is to reduce the influence of condensation on the circuit board. In particular, the present invention aims to suppress condensation caused by heat conduction from the mounting surface of the casing of the communication device from the mounting target body with which the communication device contacts, and to reduce the influence on the circuit board due to condensation. To do.

本発明の通信機は、電子部品が設けられた回路基板を有し、警報器と通信するように構成された、室外に設けられる通信機であって、前記通信機が、取付対象体に取付けられる取付面を有する筐体と、前記回路基板を支持し、前記取付面の筐体内面側となる内面に対向して配置される基板支持体とを備え、前記基板支持体の前記回路基板側の面と前記取付面の内面との間に断熱空間を有していることを特徴とする。 The communication device of the present invention is a communication device provided outside the room, having a circuit board provided with electronic components and configured to communicate with an alarm device, and the communication device is attached to a mounting object. A housing having a mounting surface, and a substrate support that supports the circuit board and is disposed to face an inner surface of the mounting surface that is the housing inner surface side, the circuit board side of the substrate support It has the heat insulation space between the surface of this and the inner surface of the said mounting surface, It is characterized by the above-mentioned.

また、前記基板支持体が、前記回路基板と対向する平板状の基部と、前記基部から前記取付面に向かって立設する立設部とを有し、前記基部、前記立設部および前記取付面の内面の間に断熱空間が形成されることが好ましい。 The substrate support includes a flat plate-like base portion facing the circuit board, and a standing portion standing from the base portion toward the mounting surface, and the base portion, the standing portion, and the attachment It is preferable that a heat insulating space is formed between the inner surfaces of the surfaces.

また、前記断熱空間が、前記立設部により、前記基部に略平行な方向に複数の小断熱空間に分割されていることが好ましい。 Moreover, it is preferable that the said heat insulation space is divided | segmented into the some small heat insulation space by the said standing part in the direction substantially parallel to the said base.

また、前記立設部が、第１の方向に延びる第１立設部と、前記第１の方向に略垂直な方向に延びる第２立設部とを備えて格子状に設けられていることが好ましい。 Moreover, the said standing part is provided in the grid | lattice form provided with the 1st standing part extended in a 1st direction, and the 2nd standing part extended in the direction substantially perpendicular | vertical to the said 1st direction. Is preferred.

また、前記基板支持体が、前記小断熱空間は前記筐体の上端側よりも下端側が大きくなるように構成されていることが好ましい。 Moreover, it is preferable that the said board | substrate support body is comprised so that the lower end side may become larger than the upper end side of the said housing | casing in the said small heat insulation space.

また、前記筐体の正面から前記回路基板までの距離が、前記筐体の取付面の内面から前記回路基板までの距離よりも大きいことが好ましい。 Moreover, it is preferable that the distance from the front surface of the housing to the circuit board is larger than the distance from the inner surface of the mounting surface of the housing to the circuit board.

また、前記回路基板は、前記回路基板の基板支持体側の面と反対側の面に熱源が設けられていることが好ましい。 Moreover, it is preferable that the said circuit board is provided with the heat source in the surface on the opposite side to the surface at the side of the board | substrate support body of the said circuit board.

また、前記取付面の取付対象体側の外面が、前記外面から立設する取付面側立設部を有していることが好ましい。 Moreover, it is preferable that the outer surface by the side of the attachment object of the said attachment surface has the attachment surface side standing part standing from the said outer surface.

本発明の通信機によれば、ガスメータ、ガス管、建物の外壁など、室外の取付対象体に取り付けられる通信機の筐体内部において、通信機の回路基板が結露することを抑制し、結露による回路基板への影響を低減することができる。特に、本発明は、通信機が接触する取付対象体からの通信機の筐体の取付面からの熱伝導に起因する結露を抑制し、結露による回路基板への影響を低減することができる。 According to the communication device of the present invention, dew condensation on the circuit board of the communication device is suppressed within the housing of the communication device attached to an object to be attached outdoors such as a gas meter, a gas pipe, and an outer wall of a building. The influence on the circuit board can be reduced. In particular, the present invention can suppress dew condensation caused by heat conduction from the mounting surface of the communication device casing from the mounting target body with which the communication device is in contact, and can reduce the influence of the dew condensation on the circuit board.

本発明の一実施形態の通信機が取付対象体に取り付けられた状態を示す概略図である。It is the schematic which shows the state by which the communication apparatus of one Embodiment of this invention was attached to the attachment target body. 本発明の一実施形態の通信機の正面図である。It is a front view of the communication apparatus of one Embodiment of this invention. 本発明の一実施形態の通信機の側面図である。It is a side view of the communication apparatus of one Embodiment of this invention. 本発明の一実施形態の通信機の背面図である。It is a rear view of the communication apparatus of one Embodiment of this invention. 本発明の一実施形態の通信機の底面図である。It is a bottom view of the communication apparatus of one Embodiment of this invention. 図２のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 図２のＢ−Ｂ線で切断した、回路基板上の電子部品を一部取り除いた概略断面図である。FIG. 3 is a schematic cross-sectional view in which a part of electronic components on a circuit board is cut along the line BB in FIG. 2. 図２のＣ−Ｃ線で切断した、回路基板上の電子部品を一部取り除いた概略断面図である。FIG. 3 is a schematic cross-sectional view in which a part of electronic components on a circuit board is cut along the line C-C in FIG. 2. 本発明の一実施形態の通信機の筐体に、基板支持体が取り付けられた状態を示す図である。It is a figure which shows the state by which the board | substrate support body was attached to the housing | casing of the communication apparatus of one Embodiment of this invention. 回路基板が取り付けられた基板支持体を示す正面図である。It is a front view which shows the board | substrate support body to which the circuit board was attached. 図１０に示される基板支持体の背面図である。It is a rear view of the board | substrate support body shown by FIG.

以下、図面を参照し、本発明の通信機を説明する。 The communication device of the present invention will be described below with reference to the drawings.

図１に示されるように、本実施形態の通信機１は室外に設けられ、警報器ＡＬと通信するように構成されている。本実施形態では、通信機１は、警報器ＡＬと通信することにより、警報器ＡＬと連動し、警報器ＡＬが検知した状態（たとえば、ガス漏れや火災などの異常状態など）を他の機器に送信することができる。より具体的には、本実施形態では、通信機１は、ガスメータＭと通信可能に構成され、警報器ＡＬから受信した状態に基づいてガスメータＭと通信を行い、たとえば、ガス漏れや火災などの異常状態を警報器ＡＬが検知した際に、ガスメータＭの弁を閉鎖して、ガスの供給を停止するように構成されている。なお、本実施形態で説明する通信機１の用途はあくまで一例であり、本発明の通信機は以下の実施形態に限定されるものではない。 As shown in FIG. 1, the communication device 1 of the present embodiment is provided outside the room and is configured to communicate with the alarm device AL. In the present embodiment, the communication device 1 communicates with the alarm device AL, thereby interlocking with the alarm device AL and detecting the state detected by the alarm device AL (for example, an abnormal state such as gas leakage or fire). Can be sent to. More specifically, in the present embodiment, the communication device 1 is configured to be communicable with the gas meter M, and communicates with the gas meter M based on the state received from the alarm device AL. When the alarm device AL detects an abnormal state, the valve of the gas meter M is closed and the gas supply is stopped. In addition, the use of the communication apparatus 1 demonstrated by this embodiment is an example to the last, and the communication apparatus of this invention is not limited to the following embodiment.

警報器ＡＬは、家庭の台所など室内に設けられ、室内の異常を検知して警報を行う。また、警報器ＡＬは、たとえば無線などにより、通信機１と通信できるように構成されている。警報器ＡＬの構成は特に限定されないが、たとえば、警報器ＡＬは、検知対象を検知するセンサ部と、センサ部により検知対象が検知されたときに、音や光など所定の警報手段により警報を発生させる警報部と、通信機１と通信するための送受信部とを有している。警報器ＡＬが検知する検知対象は特に限定されず、警報器ＡＬは、たとえば、ＬＰガスセンサ、可燃性ガスセンサ、都市ガスセンサ、ＣＯセンサ、火災センサ、温湿度センサを有する警報器とすることができる。警報器ＡＬのセンサ部により異常が検出されると、警報器ＡＬの警報部が警報を生じるとともに、警報器ＡＬの送受信部から通信機１に対して、異常状態を示す信号が送信される。 The alarm device AL is provided in a room such as a home kitchen and detects an abnormality in the room to give an alarm. The alarm device AL is configured to be able to communicate with the communication device 1 by, for example, radio. The configuration of the alarm device AL is not particularly limited. For example, the alarm device AL has a sensor unit that detects a detection target, and when the detection target is detected by the sensor unit, an alarm is generated by a predetermined alarm unit such as sound or light. An alarm unit to be generated and a transmission / reception unit for communicating with the communication device 1 are provided. The detection target detected by the alarm device AL is not particularly limited, and the alarm device AL may be, for example, an alarm device having an LP gas sensor, a combustible gas sensor, a city gas sensor, a CO sensor, a fire sensor, and a temperature / humidity sensor. When an abnormality is detected by the sensor unit of the alarm device AL, the alarm unit of the alarm device AL generates an alarm, and a signal indicating an abnormal state is transmitted from the transmission / reception unit of the alarm device AL to the communication device 1.

通信機１は、本実施形態では、警報器ＡＬと通信するとともに、室外に設けられたガスメータＭとも通信可能に構成されている。なお、本明細書において、「室外」とは、屋外など、家屋やビルなどの建物の居室の外側全般をいい、建物の完全に外側だけでなく、廊下など建物の共用部分や、居室の外側にあり、開閉可能な扉を有するガスメータＭなどが収容されるパイプスペースなども含む。 In the present embodiment, the communication device 1 is configured to communicate with the alarm device AL and also communicate with a gas meter M provided outside the room. In this specification, “outdoor” refers to the outside of the living room of a building such as a house or a building, such as outdoors, and not only completely outside the building, but also the common part of the building such as a corridor or the outside of the living room. And a pipe space in which a gas meter M having an openable / closable door is accommodated.

通信機１と警報器ＡＬとの間の通信と同様に、通信機１とガスメータＭとの間の通信はたとえば無線により行うことができる。本実施形態では、通信機１、警報器ＡＬおよびガスメータＭを備えた異常監視システムに用いられており、異常通信システムは、室内の異常状態の警報を行うとともに、異常状態においてガスの供給を停止させるように構成されている。本実施形態では、通信機１は、警報器ＡＬおよびガスメータＭとの間で通信を行うための通信部（アンテナ部）と、警報器ＡＬから異常状態を示す信号が通信機１に送信された場合に、ガスメータＭに信号を送信するための制御部とを備えている。これにより、警報器ＡＬから異常状態を示す信号が送信された後、通信機１からガスメータＭに異常状態を示す信号が送信されることにより、ガスメータＭに設けられた、ガスの供給を停止させることが可能な遮断弁が閉鎖されるように構成されている。したがって、たとえば、ガス漏れや火災時などに、警報器ＡＬが異常を検知すると、ガスの供給が停止され、ガス漏れや火災などによる被害の拡大を防ぐことができる。なお、図１においては、通信機１、警報器ＡＬおよびガスメータＭは、それぞれ１つずつ設けられているが、それぞれが複数設けられていても構わない。たとえば、共同住宅など複数のガスメータＭや警報器ＡＬを有する場合に、１または複数の通信機１が警報器ＡＬから異常状態を受信し、複数のガスメータＭにおけるガスの供給を停止するように構成してもよい。また、通信機１と警報器ＡＬとの間に、中継器を設けて、通信機１と警報器ＡＬとの間の通信を中継してもよい。 Similar to the communication between the communication device 1 and the alarm device AL, the communication between the communication device 1 and the gas meter M can be performed, for example, wirelessly. In this embodiment, it is used for an abnormality monitoring system provided with a communication device 1, an alarm device AL, and a gas meter M. The abnormality communication system alerts an indoor abnormal state and stops supplying gas in the abnormal state. It is configured to let you. In the present embodiment, the communication device 1 has a communication unit (antenna unit) for communicating between the alarm device AL and the gas meter M and a signal indicating an abnormal state transmitted from the alarm device AL to the communication device 1. In some cases, a control unit for transmitting a signal to the gas meter M is provided. Thereby, after the signal indicating the abnormal state is transmitted from the alarm device AL, the signal indicating the abnormal state is transmitted from the communication device 1 to the gas meter M, thereby stopping the gas supply provided in the gas meter M. The possible shut-off valve is configured to be closed. Therefore, for example, when the alarm AL detects an abnormality during a gas leak or a fire, the supply of gas is stopped, and the spread of damage due to the gas leak or fire can be prevented. In FIG. 1, one each of the communication device 1, the alarm device AL, and the gas meter M is provided, but a plurality of each may be provided. For example, when there are a plurality of gas meters M and an alarm device AL such as an apartment house, one or a plurality of communication devices 1 receive an abnormal state from the alarm device AL and stop supplying gas in the plurality of gas meters M. May be. Further, a relay device may be provided between the communication device 1 and the alarm device AL to relay communication between the communication device 1 and the alarm device AL.

通信機１は、通信機能を有する装置であり、室外の取付対象体Ｏ（図１参照）に取り付けることができる筐体２を有している（図２〜図５参照）。本実施形態では、取付対象体Ｏは、図１に示されるように、建物の外壁として示されているが、筐体２を取り付けることが可能な、室外に設けられた対象物であれば特に限定されず、たとえば、ガスメータＭの筐体やガスメータＭに接続されているガス管などであっても構わない。より具体的には、通信機１は、図６〜図８に示されるように、取付対象体Ｏに取付けられる取付面２１を有する筐体２と、電子部品が設けられた回路基板３と、回路基板３を支持し、取付面２１の筐体内面側となる内面２１ａに対向して配置される基板支持体４とを備えている。 The communication device 1 is a device having a communication function, and has a housing 2 that can be attached to an outdoor attachment object O (see FIG. 1) (see FIGS. 2 to 5). In this embodiment, the attachment object O is shown as an outer wall of a building as shown in FIG. 1, but is particularly an object provided outside the room to which the housing 2 can be attached. For example, the casing of the gas meter M or a gas pipe connected to the gas meter M may be used. More specifically, as shown in FIGS. 6 to 8, the communication device 1 includes a housing 2 having an attachment surface 21 attached to the attachment object O, a circuit board 3 provided with electronic components, The circuit board 3 is supported, and the board | substrate support body 4 arrange | positioned facing the inner surface 21a used as the housing | casing inner surface side of the attachment surface 21 is provided.

回路基板３は、通信機１の上述した通信部や制御部の機能を実現するために、所定の電子部品、電池等の電源および所定の回路を有している。本実施形態では、熱源となる電子部品等は、回路基板３のうち、基板支持体４側の面３ａとは反対側の面（正面側の面）３ｂに設けられている。なお、図７および図８においては、理解を容易にするために、回路基板３上の電子部品を一部省略し、簡略化して示している。 The circuit board 3 has a predetermined electronic component, a power source such as a battery, and a predetermined circuit in order to realize the functions of the communication unit and the control unit described above of the communication device 1. In the present embodiment, an electronic component or the like serving as a heat source is provided on a surface (surface on the front side) 3b of the circuit board 3 opposite to the surface 3a on the substrate support 4 side. 7 and 8, some of the electronic components on the circuit board 3 are omitted and simplified for easy understanding.

筐体２は、基板支持体４に支持された回路基板３を内部に収容し、取付対象体Ｏに取り付けられる。筐体２は、基板支持体４に支持された回路基板３を内部に収容し、取付対象体Ｏに取り付けることができれば、特にその形状や構造は限定されない。本実施形態では、筐体２は、電子部品や電池などが設けられた回路基板３を内部に収容できる収容空間を有している。本実施形態では、筐体２は、図２〜図４に示されるように、取付対象体Ｏに筐体２を固定するための固定部２２を有している。本実施形態では、固定部２２は筐体２の上下端に設けられているが、固定部２２を設ける位置は特に限定されない。固定部２２は、本実施形態では、筐体２を取付対象体Ｏに取り付けるためのネジや結束バンド等を入れる孔が形成されているが、取付対象体Ｏに筐体２を固定することができれば、任意の形状、構造とすることができる。また、筐体２の材料は、たとえば合成樹脂とすることができるが、筐体２の材料は特に限定されない。筐体２は取付面２１を有し、取付面２１を介して取付対象体Ｏに取り付けられ、室外に設置される。なお、筐体２の取付面２１は、筐体２のうち、取付対象体Ｏに対向する面をいい、取付面２１の少なくとも一部が取付対象体Ｏに接触することができればよく、必ずしも取付対象体Ｏに取付面２１全体が面接触する必要はない。本実施形態では、図６〜図８に示されるように、筐体２の背面側に設けられ、回路基板３および基板支持体４に略平行に設けられている。 The housing 2 accommodates the circuit board 3 supported by the board support 4 inside and is attached to the attachment object O. As long as the housing 2 accommodates the circuit board 3 supported by the substrate support 4 inside and can be attached to the attachment object O, the shape and structure thereof are not particularly limited. In this embodiment, the housing | casing 2 has the accommodation space which can accommodate the circuit board 3 in which the electronic component, the battery, etc. were provided in the inside. In this embodiment, the housing | casing 2 has the fixing | fixed part 22 for fixing the housing | casing 2 to the attachment target body O, as FIG. In the present embodiment, the fixing portion 22 is provided at the upper and lower ends of the housing 2, but the position where the fixing portion 22 is provided is not particularly limited. In the present embodiment, the fixing portion 22 is formed with a hole for inserting a screw, a binding band, or the like for attaching the casing 2 to the attachment target body O. However, the fixing section 22 may be fixed to the attachment target body O. If possible, it can be of any shape and structure. Moreover, although the material of the housing | casing 2 can be made into a synthetic resin, for example, the material of the housing | casing 2 is not specifically limited. The housing | casing 2 has the attachment surface 21, is attached to the attachment object O through the attachment surface 21, and is installed outdoors. Note that the mounting surface 21 of the housing 2 refers to a surface of the housing 2 that faces the mounting target body O, and it is sufficient that at least a part of the mounting surface 21 can contact the mounting target body O. The entire attachment surface 21 does not need to be in surface contact with the object O. In the present embodiment, as shown in FIGS. 6 to 8, it is provided on the back side of the housing 2, and is provided substantially parallel to the circuit board 3 and the board support 4.

本実施形態では、筐体２は、図６〜図８に示されるように、取付面２１を含む第１の筐体部２ａと、筐体２の正面部を構成し、第１の筐体部２ａに対して取り付けられる第２の筐体部２ｂとを有している。なお、本明細書において、「正面」、「背面」、「上」、「下」、「側部」という用語は、通常の筐体等の設置状態における位置関係を示すために用いられており、特に本発明を限定するものではない。 In the present embodiment, as shown in FIGS. 6 to 8, the housing 2 constitutes the first housing portion 2 a including the attachment surface 21 and the front portion of the housing 2, and the first housing And a second housing part 2b attached to the part 2a. In this specification, the terms “front”, “back”, “up”, “bottom”, and “side” are used to indicate the positional relationship in the installation state of a normal housing or the like. However, the present invention is not particularly limited.

第１の筐体部２ａは、図６〜図９に示されるように、略平板状の取付面２１と、取付面２１の両側縁から筐体２の正面側に向かって突出する一対の側壁２３（図８参照）と、取付面２１の（上下方向における）一端側（図６における上端側）において、筐体２内に配置された回路基板３の一端（上端）近傍の周囲を取り囲む囲い部２４とを有している。 As shown in FIGS. 6 to 9, the first housing portion 2 a includes a substantially flat mounting surface 21 and a pair of side walls protruding from both side edges of the mounting surface 21 toward the front side of the housing 2. 23 (see FIG. 8) and an enclosure that surrounds the vicinity of one end (upper end) of the circuit board 3 disposed in the housing 2 on one end side (upper side in FIG. 6) of the mounting surface 21 (in the vertical direction). Part 24.

囲い部２４は、基板支持体４が第１の筐体部２ａに取り付けられた状態において、回路基板３の上端部の周囲（回路基板３の上方、側方、正面側）を、図６に示されるように、取付面２１とともに取り囲むように形成されている。本実施形態では、囲い部２４は取付面２１と一体的に形成されており、たとえば、第２の筐体部２ｂが取り外されているときなど、回路基板３の上端側に設けられたアンテナ部（図示せず）に外部からの水等が接触することが防止される。なお、本実施形態では、第１の筐体部２ａは、取付面２１、側壁２３、囲い部２４以外に、筐体２の上下端に設けられた固定部２２と、取付面２１の取付対象体Ｏ側の外面２１ｂから立設する取付面側立設部２１０とを有している。 FIG. 6 shows the enclosure 24 around the upper end of the circuit board 3 (above, on the side, and on the front side) in a state where the substrate support 4 is attached to the first housing 2a. As shown, it is formed so as to surround the mounting surface 21. In the present embodiment, the enclosure portion 24 is formed integrally with the mounting surface 21. For example, when the second housing portion 2b is removed, the antenna portion provided on the upper end side of the circuit board 3 is used. It is possible to prevent external water or the like from coming into contact with (not shown). In addition, in this embodiment, the 1st housing | casing part 2a has the fixing | fixed part 22 provided in the upper and lower ends of the housing | casing 2 other than the attachment surface 21, the side wall 23, and the enclosure part 24, and the attachment object of the attachment surface 21 And an attachment surface side standing portion 210 standing from the outer surface 21b on the body O side.

本実施形態では、第１の筐体部２ａは、一対の側壁２３の間の正面側と、下端側が開放しており、図９に示されるように、第１の筐体部２ａの下端側から上端側に向かって回路基板３を支持する基板支持体４をスライドさせて、基板支持体４を第１の筐体部２ａに取り付けるように構成されている。また、第１の筐体部２ａは、図９に示されるように、一対の側壁２３の間の正面側が回路基板３の少なくとも一部が露出するように開放している。したがって、第２の筐体部２ｂを第１の筐体部２ａから取り外したときに、基板支持体４に支持された回路基板３上の電子部品へのアクセスが容易となる。 In the present embodiment, the first housing portion 2a is open on the front side and the lower end side between the pair of side walls 23, and as shown in FIG. 9, the lower end side of the first housing portion 2a. The substrate support 4 that supports the circuit board 3 is slid from the upper end toward the upper end, so that the substrate support 4 is attached to the first housing portion 2a. Further, as shown in FIG. 9, the first housing portion 2 a is open such that at least a part of the circuit board 3 is exposed on the front side between the pair of side walls 23. Therefore, when the second casing 2b is removed from the first casing 2a, access to the electronic components on the circuit board 3 supported by the board support 4 is facilitated.

第２の筐体部２ｂは、たとえばネジ等の固定手段により、第１の筐体部２ａに取り付けられる。第２の筐体部２ｂは筐体２の正面部を構成している。第２の筐体部２ｂは、回路基板３を支持する基板支持体４が取り付けられた第１の筐体部２ａを閉鎖することができれば、その形状や構造は特に限定されない。 The second casing 2b is attached to the first casing 2a by fixing means such as screws. The second housing part 2 b constitutes the front part of the housing 2. If the 2nd housing | casing part 2b can close the 1st housing | casing part 2a with which the board | substrate support body 4 which supports the circuit board 3 was attached, the shape and structure will not be specifically limited.

本実施形態では、第１の筐体部２ａおよび第２の筐体部２ｂとの間に、雨水など外部からの水の浸入を防止するための防水構造が設けられている。具体的には、第１の筐体部２ａの一対の側壁２３、囲い部２４の下端に、ゴム材料などから構成されるシール部材Ｓを収容する溝Ｇが形成されている。本実施形態では、溝Ｇは、図９に示されるように、一対の側壁２３および囲い部２４の下端側に沿って略Ｕ字状に延び、略Ｕ字状の溝Ｇに沿ってシール部材Ｓが設けられている。なお、溝Ｇやシール部材Ｓの形状は図示するものに限定されない。図６〜図８に示されるように、第２の筐体部２ｂには、第１筐体部２ａに設けられたシール部材Ｓに沿うように延び、第２の筐体部２ｂの内面側から突出する押圧部Ｐが設けられている。これにより、第２の筐体部２ｂが第１の筐体部２ａにネジ止め等されることにより、シール部材Ｓの表面が押圧部Ｐにより押圧されて隙間がシールされ、筐体２の側方および上方側から筐体２の内部への水の浸入が防止される。また、囲い部２４の下端側におけるシール部材Ｓの上側には、図６に示されるように、第１の筐体部２ａおよび第２の筐体部２ｂのそれぞれから互いに向かって延びる突条Ｐａ、Ｐｂを有している。第２の筐体部２ｂが第１の筐体部２ａに取り付けられた際に、突条Ｐａ、Ｐｂが互いに噛み合うラビリンス構造を形成することにより、隙間からの水が筐体２の内側へと浸入しにくい。 In the present embodiment, a waterproof structure is provided between the first housing portion 2a and the second housing portion 2b for preventing intrusion of water such as rainwater from the outside. Specifically, a groove G that accommodates a sealing member S made of a rubber material or the like is formed in the lower ends of the pair of side walls 23 and the enclosure portion 24 of the first housing portion 2a. In the present embodiment, as shown in FIG. 9, the groove G extends in a substantially U shape along the lower end side of the pair of side walls 23 and the enclosure portion 24, and the sealing member along the substantially U-shaped groove G. S is provided. In addition, the shape of the groove | channel G or the sealing member S is not limited to what is illustrated. As shown in FIGS. 6 to 8, the second casing portion 2 b extends along the seal member S provided on the first casing portion 2 a and is on the inner surface side of the second casing portion 2 b. The pressing part P which protrudes from is provided. As a result, the second casing 2b is screwed to the first casing 2a and the like, so that the surface of the seal member S is pressed by the pressing portion P, and the gap is sealed. Intrusion of water into the inside of the housing 2 from the side and the upper side is prevented. Further, on the upper side of the seal member S at the lower end side of the enclosure portion 24, as shown in FIG. 6, the protrusions Pa that extend toward each other from the first housing portion 2a and the second housing portion 2b. , Pb. When the second housing part 2b is attached to the first housing part 2a, a labyrinth structure is formed in which the protrusions Pa and Pb mesh with each other, so that water from the gaps enters the inside of the housing 2 Difficult to penetrate.

また、筐体２は、図５に示されるように、筐体２の下端に、筐体２の内部に外部から浸入した水や、筐体２の内部で結露が生じた場合に、筐体２の外部に水を排出するための水抜き孔Ｈを有している。水抜き孔Ｈは、筐体２の内部から水を排出することが可能で、かつ、虫の筐体２の内部への侵入を防止することができる大きさに開口していることが好ましい。本実施形態では、水抜き孔Ｈとして高さ（図５における上下方向の長さ）が０．３〜０．５ｍｍの横長のスリットを設けている。このような水抜き孔Ｈを設けることで、虫の侵入を防ぎつつ、幅（図５における左右方向の長さ）を大きくすることで水の排出を効率よく行うことができる。また水抜き孔Ｈの筐体２の下端における位置は特に限定されないが、本実施形態では、後述するように、筐体２の内部のうち取付面２１側で結露が生じた場合にその結露水を排出するために、筐体２の下端のうち取付面２１側（背面側）に設けられることが好ましい。また断熱空間ＳＰで生じた結露水を排出可能なように、断熱空間ＳＰの下端部側と連通していることが好ましい。 In addition, as shown in FIG. 5, the case 2 is formed when water enters the inside of the case 2 from the outside or condensation occurs inside the case 2 at the lower end of the case 2. 2 has a drain hole H for discharging water. It is preferable that the drain hole H is opened to a size that can discharge water from the inside of the housing 2 and can prevent insects from entering the housing 2. In the present embodiment, as the water drain hole H, a horizontally long slit having a height (length in the vertical direction in FIG. 5) of 0.3 to 0.5 mm is provided. By providing such a drain hole H, it is possible to efficiently discharge water by increasing the width (length in the left-right direction in FIG. 5) while preventing insects from entering. Moreover, although the position in the lower end of the housing | casing 2 of the drain hole H is not specifically limited, In this embodiment, when dew condensation arises in the attachment surface 21 side among the insides of the housing | casing 2, that dew condensation water will be mentioned later. Is preferably provided on the attachment surface 21 side (rear side) of the lower end of the housing 2. Moreover, it is preferable to communicate with the lower end side of the heat insulation space SP so that the condensed water generated in the heat insulation space SP can be discharged.

基板支持体４は、回路基板３を支持する支持体である。基板支持体４は、図１０および図１１に示されるように、回路基板３を支持し、回路基板３と対向する基部４１を有している。本実施形態では、回路基板３は、図６〜図８に示されるように、回路基板３の基板支持体４側の面３ａと、基板支持体４（基部４１）の回路基板３側の面４ａとが離間するように基板支持体４に支持されている。基板支持体４による回路基板３を支持する方法は特に限定されないが、たとえば、基部４１の回路基板３側の面４ａに、回路基板３を基板支持体４に対して離間した状態で取り付けられる基板取付部４１ａが設けられ、基板取付部４１ａを介して回路基板３を支持することができる。本実施形態では、基板取付部４１ａは、基部４１の回路基板３側の面４ａから突出した、回路基板３の周縁部が載置される載置部として示されているが、基板取付部４１ａは、回路基板３を基板支持体４に取り付けることができれば特に限定されない。 The substrate support 4 is a support that supports the circuit board 3. As shown in FIGS. 10 and 11, the board support 4 has a base 41 that supports the circuit board 3 and faces the circuit board 3. In this embodiment, as shown in FIGS. 6 to 8, the circuit board 3 includes a surface 3 a on the circuit board 3 side of the circuit board 3 and a surface of the circuit board support 4 (base 41) on the circuit board 3 side. It is supported by the substrate support 4 so as to be separated from 4a. The method of supporting the circuit board 3 by the board support 4 is not particularly limited. For example, a board that is attached to the surface 4 a of the base 41 on the circuit board 3 side in a state of being separated from the board support 4. An attachment portion 41a is provided, and the circuit board 3 can be supported via the substrate attachment portion 41a. In the present embodiment, the substrate mounting portion 41a is shown as a mounting portion on which the peripheral portion of the circuit board 3 protruding from the surface 4a of the base 41 on the circuit board 3 side is mounted. Are not particularly limited as long as the circuit board 3 can be attached to the board support 4.

基板支持体４は、本実施形態では、上述したように筐体２に対して上下方向に移動可能で、筐体２の下端側からスライド式に取り付けられる。具体的には、図９に示されるように、回路基板３が支持された基板支持体４を筐体２の取付面２１の内面に対してスライドさせて、基板支持体４が筐体２に取り付けられる。回路基板３が基板支持体４に支持された状態で、筐体２に対してスライドさせることで取り付ける場合、（基板支持体４を有しない）従来の回路基板の縁を筐体に設けられた差し込み溝やスロットに差し込んで取り付けるもののように、回路基板の縁と差し込み溝との間の位置合わせなどが不要となる。したがって、本実施形態のように、回路基板３が支持された基板支持体４をスライドさせて筐体２に取り付けることにより、回路基板３の位置合わせが不要で取り付けが容易となり、従来の回路基板の縁を差し込み溝に差し込む方式のもののように回路基板が破損することが防止される。また、本実施形態では、基板支持体４の回路基板３を支持する部分の両側部がスライド方向で先端側（図１０および図１１における上側）が先細となるように形成されている。これにより基板支持体４の筐体２の内部空間へのスライドによる挿入を容易にしている。基板支持体４は、本実施形態では、図１１に示されるように、基板支持体４の取付面２１との対向面４ｂに係止部（係止爪）４１ｂを有し、その係止部４１ｂが筐体２の取付面２１に設けられた被係止部（係止孔）２１１（図４参照）に係止されることにより、基板支持体４が筐体２に取り付けられる。 In the present embodiment, the substrate support 4 is movable in the vertical direction with respect to the housing 2 as described above, and is slidably attached from the lower end side of the housing 2. Specifically, as shown in FIG. 9, the substrate support 4 on which the circuit board 3 is supported is slid with respect to the inner surface of the mounting surface 21 of the housing 2, and the substrate support 4 is attached to the housing 2. It is attached. When the circuit board 3 is supported by the substrate support 4 and is attached to the housing 2 by sliding, the edge of a conventional circuit board (without the substrate support 4) is provided on the housing. The alignment between the edge of the circuit board and the insertion groove becomes unnecessary as in the case of attaching by inserting into the insertion groove or slot. Therefore, as in the present embodiment, the circuit board 3 supported by the circuit board 3 is slid and attached to the housing 2 so that the circuit board 3 does not need to be aligned and can be easily attached. It is possible to prevent the circuit board from being damaged as in the case of the type in which the edge of the circuit is inserted into the insertion groove. In the present embodiment, both sides of the portion of the substrate support 4 that supports the circuit board 3 are formed so that the tip side (upper side in FIGS. 10 and 11) is tapered in the sliding direction. This facilitates the insertion of the substrate support 4 by sliding into the internal space of the housing 2. In this embodiment, as shown in FIG. 11, the substrate support 4 has a locking portion (locking claw) 41 b on the surface 4 b facing the mounting surface 21 of the substrate support 4, and the locking portion. The substrate support 4 is attached to the housing 2 by being engaged with a locked portion (locking hole) 211 (see FIG. 4) provided on the attachment surface 21 of the housing 2.

また、本実施形態では、基板支持体４は、基板支持体４の下端部に基部４１に対して略垂直に延び、筐体２の下端を閉鎖する閉鎖部４２を有し（図６参照）、基板支持体４の筐体２の内部空間への挿入が完了したときに、筐体２の下端側の開口が閉鎖されるように構成されている。なお、本実施形態では、基板支持体４は筐体２にスライド式に取り付けられているが、基板支持体４の筐体２への取付方法は特に限定されず、たとえば、筐体２の取付面２１に対して基板支持体４を垂直な方向に移動させて取り付けても構わない。 Moreover, in this embodiment, the board | substrate support body 4 has the closing part 42 extended substantially perpendicularly with respect to the base 41 at the lower end part of the board | substrate support body 4, and closing the lower end of the housing | casing 2 (refer FIG. 6). The opening on the lower end side of the housing 2 is closed when the insertion of the substrate support 4 into the internal space of the housing 2 is completed. In the present embodiment, the substrate support 4 is slidably attached to the housing 2, but the method of attaching the substrate support 4 to the housing 2 is not particularly limited. The substrate support 4 may be attached by moving in the direction perpendicular to the surface 21.

図７および図８に示されるように、本実施形態の通信機１は、基板支持体４の回路基板３側の面４ａと取付面２１の内面２１ａとの間に断熱空間ＳＰを有している。断熱空間ＳＰは、通信機１の取付面２１側からの熱を回路基板３の表面に伝達しにくくすることにより、回路基板３の表面と、回路基板３の周囲の空気との温度差が大きくならないようにする。それにより、回路基板３の表面に接触する空気の温度が低下することによる結露を抑制する。断熱空間ＳＰは、取付面２１に対して垂直な方向に、基板支持体４と取付面２１とを離間させる空間である。本実施形態では、断熱空間ＳＰは、図７および図８に示されるように、基板支持体４の取付面２１との対向面４ｂと取付面２１の内面２１ａとの間に形成されている。しかし、断熱空間ＳＰは、基板支持体４の回路基板３側の面４ａと取付面２１の内面２１ａとの間に形成され、回路基板３への熱伝達を抑制することができれば、図示するものに限定されない。たとえば、基板支持体４が、互いに離間する２枚の板状体を有し、一対の板状体の間に断熱空間ＳＰが形成されたものであってもよい。また、断熱空間ＳＰは、本実施形態では基板支持体４が筐体２に取り付けられたときに、回路基板３の周囲の空気に対して閉じられた空間であってもよいし、連通した空間であってもよい。 As shown in FIG. 7 and FIG. 8, the communication device 1 of the present embodiment has a heat insulating space SP between the surface 4 a on the circuit board 3 side of the substrate support 4 and the inner surface 21 a of the mounting surface 21. Yes. The heat insulating space SP makes it difficult to transfer heat from the mounting surface 21 side of the communication device 1 to the surface of the circuit board 3, so that the temperature difference between the surface of the circuit board 3 and the air around the circuit board 3 is large. Do not become. Thereby, the dew condensation by the temperature of the air which contacts the surface of the circuit board 3 falls is suppressed. The heat insulating space SP is a space that separates the substrate support 4 and the mounting surface 21 in a direction perpendicular to the mounting surface 21. In the present embodiment, the heat insulating space SP is formed between a surface 4 b facing the mounting surface 21 of the substrate support 4 and an inner surface 21 a of the mounting surface 21 as shown in FIGS. 7 and 8. However, if the heat insulation space SP is formed between the surface 4a of the substrate support 4 on the circuit board 3 side and the inner surface 21a of the mounting surface 21, and heat transfer to the circuit board 3 can be suppressed, the heat insulation space SP is illustrated. It is not limited to. For example, the substrate support 4 may include two plate-like bodies that are separated from each other, and the heat insulating space SP may be formed between a pair of plate-like bodies. Further, in the present embodiment, the heat insulating space SP may be a space closed to the air around the circuit board 3 when the board support 4 is attached to the housing 2, or may be a communicating space. It may be.

本実施形態の通信機１は、基板支持体４の回路基板３側の面４ａと取付面２１の内面２１ａとの間に断熱空間ＳＰを有していることにより、上述したように回路基板３の表面での結露を抑制し、結露による回路基板３への影響を低減することができる。より具体的に説明すると、筐体２の内部に水蒸気を多く含んだ暖かい空気が存在する状態において、通信機１の外部環境などにより、取付対象体Ｏの温度が低下することがある。取付対象体Ｏの温度が低下すると、取付対象体Ｏと接触する筐体２の取付面２１の温度が低下する。取付面２１の温度が低下すると、取付面２１から基板支持体４に熱が伝わるが、本実施形態では、基板支持体４と取付面２１との間に断熱空間ＳＰを有しているため、基板支持体４の回路基板３側の面４ａに熱が伝わりにくくなる。そのため、基板支持体４の回路基板３側の面４ａの温度が下がりにくく、回路基板３の温度低下が抑制される。したがって、回路基板３の表面において、回路基板３の表面と接触する空気が冷却されにくく、回路基板３の表面における結露が抑制される。特に夏場などの気温が高く湿度が高いときに、突然激しい雨が降った場合などは結露が生じやすいが、本実施形態では、そのような急激な温度差が生じた際であっても、断熱空間ＳＰが熱伝導の緩衝作用をもたらし、回路基板３の表面における結露を抑制することができる。 The communication device 1 according to the present embodiment includes the heat insulating space SP between the surface 4a on the circuit board 3 side of the substrate support 4 and the inner surface 21a of the mounting surface 21, and thus the circuit board 3 as described above. Condensation on the surface of the substrate can be suppressed, and the influence of the condensation on the circuit board 3 can be reduced. More specifically, in a state where warm air containing a lot of water vapor is present inside the housing 2, the temperature of the attachment object O may be lowered due to the external environment of the communication device 1 or the like. When the temperature of the attachment object O decreases, the temperature of the attachment surface 21 of the housing 2 that comes into contact with the attachment object O decreases. When the temperature of the mounting surface 21 decreases, heat is transferred from the mounting surface 21 to the substrate support 4, but in the present embodiment, the heat insulating space SP is provided between the substrate support 4 and the mounting surface 21. It becomes difficult for heat to be transmitted to the surface 4a of the substrate support 4 on the circuit board 3 side. Therefore, the temperature of the surface 4a on the circuit board 3 side of the substrate support 4 is hardly lowered, and the temperature drop of the circuit board 3 is suppressed. Therefore, the air in contact with the surface of the circuit board 3 is hardly cooled on the surface of the circuit board 3, and condensation on the surface of the circuit board 3 is suppressed. In particular, when the temperature is high and humidity is high, such as in summer, when sudden rain falls suddenly, condensation tends to occur.In this embodiment, even if such a sudden temperature difference occurs, heat insulation is performed. The space SP provides a heat conduction buffering action, and can suppress condensation on the surface of the circuit board 3.

また、本実施形態では、図６〜図８に示されるように、回路基板３は筐体２には直接接触しておらず、断熱空間ＳＰを形成する基板支持体４を介して取り付けられている。そのため、回路基板３が筐体２や取付対象体Ｏが冷却されることによる影響を受けにくく、より回路基板３の表面における結露を抑制することができる。また、回路基板３は回路基板３の周縁部において基板支持体４に支持され、回路基板３と基板支持体４との間には、第２の断熱空間ＳＰ２が形成される。そのため、取付面２１側から回路基板３へ、より熱が伝達されにくい。 Further, in the present embodiment, as shown in FIGS. 6 to 8, the circuit board 3 is not in direct contact with the housing 2, and is attached via the board support 4 that forms the heat insulating space SP. Yes. Therefore, the circuit board 3 is not easily affected by the cooling of the housing 2 and the attachment object O, and condensation on the surface of the circuit board 3 can be further suppressed. The circuit board 3 is supported by the board support 4 at the peripheral edge of the circuit board 3, and a second heat insulation space SP <b> 2 is formed between the circuit board 3 and the board support 4. Therefore, heat is less likely to be transmitted from the mounting surface 21 side to the circuit board 3.

本実施形態では、筐体２の表面から回路基板３までの距離（平均の距離）は、筐体２の取付面２１の内面２１ａから回路基板３までの距離（平均の距離）よりも大きくなるように構成されている。この場合、筐体２の表面の内面から回路基板３までの間には充分な空間が存在することにより、回路基板３の表面側は結露しにくく、回路基板３の裏面側は断熱空間ＳＰを形成する基板支持体４により、回路基板３から取付面２１までの距離が小さい場合であっても、結露を防止することができる。そのため、回路基板３を取付面２１に近付けても結露の発生を抑えることができるため、通信機１の厚さ（回路基板３に対する垂直方向の厚さ）を薄くすることができる。 In the present embodiment, the distance (average distance) from the surface of the housing 2 to the circuit board 3 is larger than the distance (average distance) from the inner surface 21 a of the mounting surface 21 of the housing 2 to the circuit board 3. It is configured as follows. In this case, since there is a sufficient space between the inner surface of the surface of the housing 2 and the circuit board 3, the surface side of the circuit board 3 is unlikely to condense, and the rear surface side of the circuit board 3 has a heat insulating space SP. Even if the distance from the circuit board 3 to the mounting surface 21 is small, the substrate support 4 to be formed can prevent condensation. For this reason, the occurrence of condensation can be suppressed even when the circuit board 3 is brought close to the mounting surface 21, so that the thickness of the communication device 1 (the thickness in the direction perpendicular to the circuit board 3) can be reduced.

また、上述したように、回路基板３は、回路基板３の基板支持体４側の面３ａと反対側の面３ｂに熱源が設けられている。このため、熱を発生する電子部品や電池など、熱源が設けられた回路基板３の反対側に、断熱空間ＳＰを有しているので、熱が伝わりにくく、熱源による温度上昇に起因する結露発生を抑制することができる。 Further, as described above, the circuit board 3 is provided with a heat source on the surface 3b opposite to the surface 3a of the circuit board 3 on the substrate support 4 side. For this reason, since the heat insulation space SP is provided on the opposite side of the circuit board 3 provided with a heat source such as an electronic component or a battery that generates heat, heat is not easily transmitted, and condensation occurs due to a temperature rise by the heat source. Can be suppressed.

本実施形態では、図７、図８および図１１に示されるように、基板支持体４は、回路基板３と対向する平板状の基部４１と、基部４１から取付面２１に向かって立設する立設部４３とを有し、基部４１、立設部４３および取付面２１の内面の間に断熱空間ＳＰが形成される。これにより、本実施形態では、取付面２１と基板支持体４との間の接触面積が小さくなり、取付面２１からの熱の伝達が抑制されるとともに、取付面２１の内面２１ａと、立設部４３の部分において、周囲の空気が冷やされ、回路基板３との関係において、取付面２１の内面２１ａと立設部４３において優先的に結露が生じる。取付面２１の内面２１ａと立設部４３の部分で生じた結露水は、基部４１の取付面２１との対向面４ｂまたは取付面２１を伝って、通信機１の下端側に向かって移動し、水抜き孔Ｈから排出される。結露水が生じた場合であっても、本実施形態では、基板支持体４の取付面２１との対向面４ｂ側において結露を生じさせており、回路基板３は、基板支持体４の基部４１により基板支持体４の取付面２１との対向面４ｂ側とは隔てられている。そのため、回路基板３は結露水による影響を受けにくい。また、結露が進行するにつれ、結露した水が集まって大きな水滴を形成する場合であっても、回路基板３に接触することがない。したがって、回路基板３を基板支持体４に近付けて配置することもできる。 In the present embodiment, as shown in FIGS. 7, 8, and 11, the substrate support 4 is erected from a flat base 41 facing the circuit board 3 and from the base 41 toward the mounting surface 21. A heat insulating space SP is formed between the base 41, the standing portion 43, and the inner surface of the mounting surface 21. Thereby, in this embodiment, while the contact area between the attachment surface 21 and the board | substrate support body 4 becomes small, while the transmission of the heat from the attachment surface 21 is suppressed, the inner surface 21a of the attachment surface 21, and standing arrangement | positioning In the portion 43, ambient air is cooled, and in the relationship with the circuit board 3, dew condensation preferentially occurs on the inner surface 21 a of the mounting surface 21 and the standing portion 43. Condensed water generated at the inner surface 21 a of the mounting surface 21 and the portion of the standing portion 43 moves toward the lower end side of the communication device 1 along the surface 4 b facing the mounting surface 21 of the base 41 or the mounting surface 21. The water is discharged from the drain hole H. Even in the case where dew condensation water is generated, in the present embodiment, dew condensation is caused on the side of the surface 4 b facing the mounting surface 21 of the substrate support 4, and the circuit board 3 has a base 41 of the substrate support 4. Therefore, the substrate support 4 is separated from the side 4 b facing the mounting surface 21. Therefore, the circuit board 3 is not easily affected by condensed water. Further, as the dew condensation progresses, the condensed water does not come into contact with the circuit board 3 even when it forms large water droplets. Therefore, the circuit board 3 can be arranged close to the board support 4.

立設部４３は、図７および図８に示されるように、取付面２１の内面２１ａに少なくとも一部が当接するように設けられているが、立設部４３は、断熱空間ＳＰが筐体２内の他の空間と気密状態で隔離されておらず、空気および水が流通可能となるように設けられている。そのため、断熱空間ＳＰ内で結露が生じると筐体２内全体の湿度が下がり、回路基板３の周囲での結露がより一層生じにくくなる。なお、立設部４３は、空気および水が流通しやすいように、断熱空間ＳＰ内同士、または、断熱空間ＳＰと筐体２内の他の空間との間で、空気および水が流通可能な流通路（たとえば、切欠きや溝など）が形成されていてもよい。そして、本実施形態では、回路基板３の結露を、断熱空間ＳＰを形成する基板支持体４により抑制しているため、通信機１の筐体２に通気性を良くする孔などの機構を設ける必要がなく、水抜き孔Ｈ以外は、筐体２の外部に開口を設ける必要もない。そのため、通気性を良くするために設けられた開口から水や虫などが浸入することがなく、浸入を防止する特殊な機構などを別途設ける必要もない。 As shown in FIG. 7 and FIG. 8, the standing portion 43 is provided so that at least a part thereof is in contact with the inner surface 21 a of the mounting surface 21. It is not isolated from other spaces in 2 in an airtight state, and is provided so that air and water can be circulated. For this reason, when condensation occurs in the heat insulating space SP, the humidity in the entire housing 2 is reduced, and condensation around the circuit board 3 is further less likely to occur. In addition, the standing part 43 can distribute | circulate air and water between heat insulation spaces SP or between heat insulation space SP and the other space in the housing | casing 2 so that air and water may distribute | circulate easily. A flow passage (for example, a notch or a groove) may be formed. And in this embodiment, since the dew condensation of the circuit board 3 is suppressed by the board | substrate support body 4 which forms the heat insulation space SP, mechanisms, such as a hole which improves air permeability, are provided in the housing | casing 2 of the communication apparatus 1. There is no need, and it is not necessary to provide an opening outside the casing 2 except for the drain hole H. Therefore, water and insects do not enter from the opening provided for improving the air permeability, and it is not necessary to provide a special mechanism for preventing the entry.

また、本実施形態では、図７、図８および図１１に示されるように、断熱空間ＳＰは、立設部４３により、基部４１に略平行な方向に（たとえば、後述する第１の方向および第２の方向の少なくとも一方の方向に沿って）複数の小断熱空間ＳＳＰに分割されていることが好ましい。断熱空間ＳＰが複数の小断熱空間ＳＳＰに分割されていることにより、基部４１に略平行な方向での断熱効果がさらに向上する。したがって、たとえば、取付面２１が温度の低い取付対象体Ｏに局所的に接触する場合に（たとえば、通信機１が通信機１の幅よりも幅が狭いガス管などに取り付けられる場合や、熱伝導率が異なる素材にまたがるようにして通信機１が取付対象体Ｏに取り付けられる場合）、温度の低下が基部４１において全体に広がることを抑制し、結露を部分的なものに収め、回路基板３への影響をさらに低減することができる。また、断熱空間ＳＰを複数の小断熱空間ＳＳＰに分割する場合、立設部４３が基板支持体４の強度を向上させるリブとしても機能し、基板支持体４の変形が防止される。 Moreover, in this embodiment, as FIG.7, FIG.8 and FIG.11 shows, the heat insulation space SP is set by the standing part 43 in the direction substantially parallel to the base 41 (for example, the 1st direction and below mentioned). It is preferable that it is divided into a plurality of small heat insulating spaces SSP (along at least one direction of the second direction). Since the heat insulating space SP is divided into a plurality of small heat insulating spaces SSP, the heat insulating effect in a direction substantially parallel to the base 41 is further improved. Therefore, for example, when the attachment surface 21 locally contacts the attachment object O having a low temperature (for example, when the communication device 1 is attached to a gas pipe whose width is narrower than the width of the communication device 1 or the like, When the communication device 1 is attached to the attachment object O so as to straddle materials having different conductivities), it is possible to suppress a decrease in temperature from spreading to the whole at the base portion 41, and to condense the condensation into a partial one. 3 can be further reduced. Moreover, when dividing | segmenting the heat insulation space SP into several small heat insulation space SSP, the standing part 43 functions also as a rib which improves the intensity | strength of the board | substrate support body 4, and a deformation | transformation of the board | substrate support body 4 is prevented.

複数の小断熱空間ＳＳＰに分割する場合の立設部４３の構造は特に限定されないが、本実施形態では、図１１に示されるように、立設部４３は、第１の方向に延びる第１立設部４３ａと、第１の方向に略垂直な第２の方向に延びる第２立設部４３ｂとを備えて格子状に設けられている。これにより、断熱空間ＳＰは、第１の方向および第２の方向に沿って、複数の小断熱空間ＳＳＰに分割されている。本実施形態では、第１の方向は、通信機１の上下方向（図１１における上下方向）、第２の方向は通信機１の左右方向（図１１における左右方向）として示されているが、第１および第２の方向は通信機１の上下方向または左右方向に対して傾斜していてもよい。本実施形態のように、立設部４３が第１および第２立設部４３ａ、４３ｂを有し、断熱空間ＳＰが、第１の方向および第２の方向に沿って複数の小断熱空間ＳＳＰに分割されている場合、基板支持体４の強度を向上するとともに、第１の方向および第２の方向における熱の伝達を抑制することができる。なお、本実施形態では、第１立設部４３ａおよび第２立設部４３ｂは、互いに略垂直な方向に設けられているが、第１立設部４３ａおよび第２立設部４３ｂがなす角度は特に限定されない。また、第１立設部４３ａおよび第２立設部４３ｂは、本実施形態では直線状に延びているが、第１立設部４３ａおよび第２立設部４３ｂは、それぞれ屈曲または湾曲していても構わない。 Although the structure of the standing part 43 in the case of dividing | segmenting into the some small heat insulation space SSP is not specifically limited, as FIG. 11 shows in this embodiment, the standing part 43 is the 1st extended in a 1st direction. The upright portions 43a and the second upright portions 43b extending in a second direction substantially perpendicular to the first direction are provided in a lattice shape. Thereby, the heat insulation space SP is divided | segmented into the some small heat insulation space SSP along the 1st direction and the 2nd direction. In the present embodiment, the first direction is shown as the vertical direction of the communication device 1 (vertical direction in FIG. 11), and the second direction is shown as the horizontal direction of the communication device 1 (horizontal direction in FIG. 11). The first and second directions may be inclined with respect to the up-down direction or the left-right direction of the communication device 1. Like this embodiment, the standing part 43 has the 1st and 2nd standing part 43a, 43b, and heat insulation space SP is several small heat insulation space SSP along a 1st direction and a 2nd direction. When it is divided into two, the strength of the substrate support 4 can be improved, and the heat transfer in the first direction and the second direction can be suppressed. In the present embodiment, the first standing portion 43a and the second standing portion 43b are provided in a direction substantially perpendicular to each other, but the angle formed by the first standing portion 43a and the second standing portion 43b. Is not particularly limited. Further, in the present embodiment, the first standing portion 43a and the second standing portion 43b extend linearly, but the first standing portion 43a and the second standing portion 43b are bent or curved, respectively. It doesn't matter.

また、本実施形態では、図１１に示されるように、基板支持体４は、小断熱空間ＳＳＰは筐体２の上端側よりも下端側が大きくなるように構成されている。なお、図面においては、小断熱空間ＳＳＰの下端側が上端側に比べてわずかに大きくなるように構成されているが、下端側と上端側との間の大きさの比率は適宜変更しても構わない。結露水は、上述したように、基板支持体４の背面側を伝って基板支持体４の下部側へと流れ、水抜き孔Ｈから排出されるが、水抜き孔Ｈの寸法は虫が入らないように非常に小さい。そのため、結露水の量が多くなると、基板支持体４の最下部に溜まってから排出される。この場合に、下端側の小断熱空間ＳＳＰを大きくすることにより、結露水の量が多くなっても、容積の大きい下端側の小断熱空間ＳＳＰに結露水が貯留された後、下端側の小断熱空間ＳＳＰと連通する水抜き孔Ｈから結露水を筐体２の外部に容易に排出することができる。 In the present embodiment, as shown in FIG. 11, the substrate support 4 is configured such that the lower thermal insulation space SSP is larger on the lower end side than the upper end side of the housing 2. In the drawing, the lower end side of the small heat insulating space SSP is configured to be slightly larger than the upper end side, but the size ratio between the lower end side and the upper end side may be changed as appropriate. Absent. As described above, the dew condensation water flows along the back side of the substrate support 4 to the lower side of the substrate support 4 and is discharged from the drain hole H. However, the dimensions of the drain hole H contain insects. Not so small. Therefore, if the amount of dew condensation water increases, it is discharged after it has accumulated at the bottom of the substrate support 4. In this case, by increasing the small heat insulating space SSP on the lower end side, even if the amount of dew condensation water increases, after the condensed water is stored in the small heat insulating space SSP on the lower end side having a large volume, the small size on the lower end side is reduced. Condensed water can be easily discharged to the outside of the housing 2 through the water drain hole H communicating with the heat insulating space SSP.

また、本実施形態では、図４および図６〜図８に示されるように、取付面２１の取付対象体Ｏ側の外面２１ｂが、外面２１ｂから立設する取付面側立設部２１０を有している。これにより、取付面２１の外面２１ｂと取付対象体Ｏとの間に断熱空間が形成され、さらに断熱効果を高めることができる。 Further, in the present embodiment, as shown in FIGS. 4 and 6 to 8, the outer surface 21 b on the mounting object body O side of the mounting surface 21 has the mounting surface side standing portion 210 that stands up from the outer surface 21 b. doing. Thereby, a heat insulation space is formed between the outer surface 21b of the attachment surface 21 and the attachment object O, and the heat insulation effect can be further enhanced.

１通信機
２筐体
２ａ第１の筐体部
２ｂ第２の筐体部
２１取付面
２１ａ取付面の内面
２１ｂ取付面の外面
２１０取付面側立設部
２１１被係止部（係止孔）
２２固定部
２３側壁
２４囲い部
３回路基板
３ａ回路基板の基板支持体側の面
３ｂ回路基板の基板支持体側の面の反対側の面
４基板支持体
４ａ基板支持体の回路基板側の面
４ｂ基板支持体の取付面との対向面
４１基部
４１ａ基板取付部
４１ｂ係止部（係止爪）
４２閉鎖部
４３立設部
４３ａ第１立設部
４３ｂ第２立設部
ＡＬ警報器
Ｇ溝
Ｈ水抜き孔
Ｍガスメータ
Ｏ取付対象体
Ｐ押圧部
Ｐａ、Ｐｂ突条
Ｓシール部材
ＳＰ断熱空間
ＳＰ２第２の断熱空間
ＳＳＰ小断熱空間 DESCRIPTION OF SYMBOLS 1 Communication apparatus 2 Housing | casing 2a 1st housing | casing part 2b 2nd housing | casing part 21 Mounting surface 21a Inner surface of a mounting surface 21b Outer surface of a mounting surface 210 Mounting surface side standing part 211 Locked part (locking hole)
22 fixed portion 23 side wall 24 enclosure 3 circuit board 3a surface on substrate support side of circuit board 3b surface on opposite side of substrate support side of circuit board 4 substrate support surface 4a surface on circuit board side of substrate support 4b substrate Face facing the mounting surface of the support body 41 Base 41a Substrate mounting portion 41b Locking portion (locking claw)
42 Closure part 43 Standing part 43a First standing part 43b Second standing part AL Alarm G Groove H Drain hole M Gas meter O Attachment object P Pressing part Pa, Pb Projection S Seal member SP Thermal insulation space SP2 First 2 heat insulation space SSP small heat insulation space

Claims

A communicator provided outside the room having a circuit board provided with electronic components and configured to communicate with an alarm device,
The communication device is
A housing having a mounting surface to be attached to the mounting object;
A board support that supports the circuit board and is disposed to face the inner surface of the mounting surface that is the housing inner surface side;
The communication apparatus which has heat insulation space between the surface by the side of the said circuit board of the said board | substrate support body, and the inner surface of the said attachment surface.

The substrate support has a flat plate-like base portion facing the circuit board, and a standing portion standing from the base portion toward the mounting surface, and the base portion, the standing portion, and the mounting surface The communication device according to claim 1, wherein a heat insulating space is formed between the inner surfaces.

The communication apparatus according to claim 2, wherein the heat insulation space is divided into a plurality of small heat insulation spaces by the standing portion in a direction substantially parallel to the base portion.

The standing portion is provided in a lattice shape with a first standing portion extending in a first direction and a second standing portion extending in a second direction substantially perpendicular to the first direction. The communication device according to claim 3.

5. The communication device according to claim 3, wherein the substrate support is configured such that a lower end side of the small heat insulating space is larger than an upper end side of the housing.

The communication device according to any one of claims 1 to 5, wherein a distance from a surface of the housing to the circuit board is larger than a distance from an inner surface of an attachment surface of the housing to the circuit board.

The communication device according to any one of claims 1 to 6, wherein the circuit board is provided with a heat source on a surface opposite to a surface on the substrate support side of the circuit substrate.

The communication device according to any one of claims 1 to 7, wherein an outer surface of the mounting surface on an attachment target body side has a mounting surface side standing portion standing from the outer surface.