JP2018112548A - 半導体試験のためのフリーピストンスターリングクーラー温度制御システム - Google Patents
半導体試験のためのフリーピストンスターリングクーラー温度制御システム Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 238000012360 testing method Methods 0.000 title claims abstract description 60
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 abstract description 11
- 239000003507 refrigerant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F02G1/043—Hot gas positive-displacement engine plants of closed-cycle type the engine being operated by expansion and contraction of a mass of working gas which is heated and cooled in one of a plurality of constantly communicating expansible chambers, e.g. Stirling cycle type engines
- F02G1/0435—Hot gas positive-displacement engine plants of closed-cycle type the engine being operated by expansion and contraction of a mass of working gas which is heated and cooled in one of a plurality of constantly communicating expansible chambers, e.g. Stirling cycle type engines the engine being of the free piston type
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/006—Thermal coupling structure or interface
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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Abstract
【解決手段】半導体デバイス試験のための持ち運び可能な冷却システムおよび装置100は、フリーピストンスターリングクーラー102を含む。これが、冷却機、コンプレッサ、冷却液貯蔵機器、ホースおよびホース継手など、扱いにくい遠隔に配置された機器の必要性をなくす。電力線110および空気供給線112が、ヘッド制御ユニットから持ち運び可能なシステム制御ユニットに配線される。ヘッド制御ユニットは、試験中の半導体デバイスの真上にスターリングクーラーを垂直に配置するように、調整可能なフレーム構造によって位置決めされる。ヘッド制御ユニットは、フリーピストンスターリングクーラーと試験中の半導体デバイスとの間に構成されるサーマルアダプタシステムを含む。
【選択図】図1
Description
Claims (16)
- 持ち運び可能な半導体冷却装置であって、
フリーピストンスターリングクーラー(FPSC)と、
試験中の半導体デバイスの真上に垂直方向に前記FPSCを配置するために構成される支持部材と
前記FPSCに連結され、前記試験中の半導体デバイスに連結するために構成されるサーマルアダプタと
を含む、装置。 - 請求項1に記載の装置であって、前記フリーピストンスターリングクーラーに連結される持ち運び可能なシステム制御ユニットを含む、装置。
- 請求項2に記載の装置であって、前記持ち運び可能なシステム制御ユニットと前記FPSCとの間に延在する電力線を含む、装置。
- 請求項3に記載の装置であって、前記持ち運び可能なシステム制御ユニットと前記FPSCとの間に延在する空気供給線を含む、装置。
- 請求項4に記載の装置であって、前記電力線および前記空気供給線が、前記支持部材によって支持される、装置。
- 請求項1に記載の装置であって、前記支持部材を含む調整可能な支持フレームを含み、前記調整可能な支持フレームが、前記試験中の半導体デバイスに近接した固定された位置に前記FPSCを配置および配向するために構成される、装置。
- 請求項6に記載の装置であって、前記FPSCが、垂直に前記試験中の半導体の上につるされる、装置。
- 請求項7に記載の装置であって、
前記調整可能な支持フレームに連結される支持フレームベースであって、前記支持フレームベースがシステム制御ユニット支持構造を含む、前記支持フレームベースと、
前記システム制御ユニット支持構造によって支持されるシステム制御ユニットと
を含む、装置。 - 請求項8に記載の装置であって、前記調整可能な支持フレーム内のケーブル経路を介して、前記FPSCから前記システム制御ユニットまで延在する電力線および空気供給線を含む、装置。
- 持ち運び可能な半導体冷却装置であって、
フリーピストンスターリングクーラー(FPSC)と、
試験中の半導体デバイスの真上に前記FPSCを配置するために構成される支持部材と、
前記FPSCに連結され、前記試験中の半導体デバイスに連結するために構成されるサーマルアダプタと、
前記持ち運び可能なシステム制御ユニットと前記FPSCとの間を延在する電力線を介して、および、前記持ち運び可能なシステム制御ユニットと前記FPSCとの間を延在する空気供給線を介して、前記フリーピストンスターリングクーラーに連結される持ち運び可能なシステム制御ユニットであって、前記電力線および前記空気供給線が前記支持部材によって支持される、前記持ち運び可能なシステム制御ユニットと、
前記支持部材を含む調整可能な支持フレームであって、前記調整可能な支持フレームが、前記試験中の半導体デバイスに近接した固定された位置に前記FPSCを配置および配向するために構成される、前記調整可能な支持フレームと、
前記調整可能な支持フレームに連結される支持フレームベースであって、前記支持フレームベースがシステム制御ユニット支持構造を含む、前記支持フレームベースと、
前記システム制御ユニット支持構造によって支持されるシステム制御ユニット支持構造と
を含む、装置。 - 試験中の半導体デバイスを冷却する方法であって、
フリーピストンスターリングクーラー(FPSC)を前記試験中の半導体デバイスに近接して配置することと、
前記サーマルアダプタが前記試験中の半導体デバイスに直接的に対向するように、前記FPSCと前記試験中の半導体デバイスとの間にサーマルアダプタを配置することと、
持ち運び可能なシステム制御ユニットを前記FPSCに近接して配置することと、
電力供給線を介して、および、空気供給線を介して、前記FPSCを前記持ち運び可能なシステム制御ユニットに連結することと、
前記FPSCを動作させるため、前記電力供給線および空気供給線を介して、前記FPSCに電力および空気を提供するように前記持ち運び可能なシステム制御ユニットを構成することと
を含む、方法。 - 請求項11に記載の方法であって、さらに、前記FPSCの動作状況をモニタするように、前記持ち運び可能なシステム制御ユニットを構成することを含む、方法。
- 請求項12に記載の方法であって、前記動作状況をモニタすることが、前記サーマルアダプタに近接した前記FPSCの温度をモニタすることを含む、方法。
- 請求項11に記載の方法であって、前記FPSCの前記動作によって前記試験中の半導体デバイスを冷却することを含む、方法。
- 請求項14に記載の方法であって、前記冷却することが、−100℃より低く前記半導体デバイスの温度を低下させるように実行される、方法。
- 請求項11に記載の方法であって、前記FPSCの前記動作によって、前記試験中の半導体デバイスを加熱することを含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/404,650 | 2017-01-12 | ||
US15/404,650 US10126359B2 (en) | 2017-01-12 | 2017-01-12 | Free piston stirling cooler temperature control system for semiconductor test |
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JP2018112548A true JP2018112548A (ja) | 2018-07-19 |
JP7360237B2 JP7360237B2 (ja) | 2023-10-12 |
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US (1) | US10126359B2 (ja) |
JP (1) | JP7360237B2 (ja) |
KR (1) | KR20180083266A (ja) |
CN (1) | CN108302836B (ja) |
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GB (1) | GB2560068B (ja) |
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CN106103959B (zh) * | 2014-02-21 | 2019-12-13 | Ks科尔本施密特有限公司 | 带敞开的具有利于流动的油引导面的冷却腔的活塞以及用于冷却所述活塞的方法 |
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- 2017-01-12 US US15/404,650 patent/US10126359B2/en active Active
- 2017-12-19 GB GB1721282.0A patent/GB2560068B/en active Active
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- 2018-01-11 DE DE102018100509.1A patent/DE102018100509A1/de active Pending
- 2018-01-11 KR KR1020180003824A patent/KR20180083266A/ko not_active Application Discontinuation
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JP2004527764A (ja) * | 2001-05-31 | 2004-09-09 | クライオテック インコーポレイテッド | 電子デバイスの温度制御装置及び温度制御方法 |
US20050097911A1 (en) * | 2003-11-06 | 2005-05-12 | Schlumberger Technology Corporation | [downhole tools with a stirling cooler system] |
JP2008292411A (ja) * | 2007-05-28 | 2008-12-04 | Espec Corp | 試験装置 |
US20090146676A1 (en) * | 2007-12-05 | 2009-06-11 | Olivier Zogmal | Measuring module for rapid measurement of electrical, electronic and mechanical components at cryogenic temperatures and measuring device having such a module |
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US20180196102A1 (en) | 2018-07-12 |
GB2560068A (en) | 2018-08-29 |
JP7360237B2 (ja) | 2023-10-12 |
KR20180083266A (ko) | 2018-07-20 |
CN108302836B (zh) | 2020-12-01 |
DE102018100509A1 (de) | 2018-07-12 |
CN108302836A (zh) | 2018-07-20 |
US10126359B2 (en) | 2018-11-13 |
GB201721282D0 (en) | 2018-01-31 |
GB2560068B (en) | 2019-05-22 |
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