JP2018107363A - Sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor device having a wire connecting a circuit board mounted with a sensor to an internal terminal mounted in a housing, which has a reliable wire structure capable of preventing signal delay while reducing stroke noises and ensuring the life of the wire.SOLUTION: The distance Lt1 between the output terminals of a pair of wire groups is narrower than the distance Ls1 between the substrate pads of the pair of wire groups. The pair of wire groups are continuously formed.SELECTED DRAWING: Figure 3

Description

  The present invention provides a substrate on which a physical quantity sensor for detecting a physical quantity such as acceleration and angular velocity is mounted together with electronic components, a housing for housing the board, a pad formed on the board, and a terminal terminal formed integrally with the housing. The present invention relates to a wire connection structure of a sensor device including a plurality of wires to be connected.

  In automobiles, sensors that detect physical quantities such as angular velocity and acceleration are used for attitude control and brake control of a vehicle in order to support stable vehicle traveling during turning and running on an inclined ground. Similarly, a physical quantity sensor is also applied to an agricultural machine or a construction machine for posture control, particularly horizontal control of a farm body for cultivating a vehicle body or a farm.

  The physical quantity sensor is mounted on a printed circuit board together with other electronic components necessary for operating and controlling the sensor. A printed circuit board equipped with a physical quantity sensor is housed in a housing with a connector part that inputs and outputs electrical signals to the outside and supplies power, and between the pads formed on the printed circuit board and the terminal terminals attached to the connector Are electrically connected with a plurality of wires and then modularized to be used as a sensor device.

  A sensor device in which a physical quantity sensor is modularized is required to be small and light. In order to meet this requirement, the distance between the wires connecting the pads of the printed circuit board and the terminal terminals tends to be narrow. It is assumed that the physical quantity sensor is subjected to excessive shock and vibration when traveling on a rough road of an automobile or climbing over a step of an agricultural machine. When the distance between the wires is narrow, the wires may come into contact with each other due to an impact or vibration load, and the electrical characteristics may deteriorate.

  In recent years, the demand for automatic driving has been increasing in automobiles and agricultural machinery, and in order to ensure safety during driving, angular velocity and acceleration are measured with high accuracy, and signals measured at high speed are obtained. There has been a demand for processing. For example, in vehicle attitude control, it is required to measure an inclination angle calculated from measured values of an acceleration sensor and an angular velocity sensor with an accuracy of 1 degree or less. In order to achieve such measurement accuracy, it is essential to reduce noise superimposed on the sensor output. Furthermore, when a circuit that performs signal processing at high speed is mounted on a sensor device, it is necessary to take measures to reduce noise in the wire connection structure that connects the pads of the printed circuit board and the terminal terminals.

  As for the wire connection structure, for example, JP-A-8-186144 (Patent Document 1) is known.

  In Patent Document 1, in a chip including a first pad and a second pad arranged in a staggered manner along the outer edge of the chip, the respective wires are arranged at equal intervals when viewed from a direction perpendicular to the chip surface. A configuration is disclosed.

JP-A-8-186144

  According to the prior art disclosed in Patent Document 1, by configuring all the intervals between the wires at equal intervals, it is possible to eliminate a portion where the intervals are partially narrow and to prevent the wires from contacting each other. Is obtained.

  However, in the technique described in Patent Document 1, since a plurality of wires are extended in parallel in the same direction, no consideration is given to reducing crosstalk noise. Also, since adjacent wire lengths are different, when signal transmission is performed differentially, noise superimposed on the wire cannot be completely canceled, and noise may be added to the output signal.

  An object of the present invention is to provide a board on which a physical quantity sensor for detecting a physical quantity such as acceleration and angular velocity is mounted together with electronic components, a housing for housing the board, a pad formed on the board, and a terminal terminal formed integrally with the housing. In a sensor device including a plurality of wires that connect each other, it is possible to provide a sensor device that reduces noise generated at a wire connecting portion and prevents contact between wires.

  Arranged in parallel to connect between a board on which an inertial force sensor and electronic components are mounted, a housing that houses the board, a board pad formed on the board, and a terminal terminal connection formed on the housing In the sensor device having a plurality of wires, the distance Lt1 between the terminal terminals of the pair of wires is narrower than the distance Ls1 between the board pads, and the distance Lt2 between the terminal terminals of adjacent wire groups is the board. The distance between the pads is larger than the distance Ls2, and the two pairs of wires are continuously formed.

  Further, a connection is made between a substrate on which the inertial force sensor and the electronic component are mounted, a housing that houses the substrate, a substrate pad formed on the substrate, and a terminal terminal connection formed on the housing. In a sensor device in which a set of wire connection portions are arranged in parallel, the terminal terminal connection portion and board pad position of one set of wire connection portions, and the terminal terminal connection portion of another adjacent wire connection portion, The position of the substrate pad is shifted in the wire extending direction, and the wires are not overlapped on the projection plane in the direction perpendicular to the wire extending direction.

  Further, the lengths of the wires connecting the connection portions of the terminal terminals and the substrate pads are made equal.

  According to the present invention, in a sensor device that houses a wire that connects a circuit board on which a sensor is mounted and an internal terminal mounted on a housing, the life of the wire is ensured, stroke noise is reduced, and signal delay is prevented. Therefore, it is possible to provide a sensor having a highly reliable wire structure that can be used.

External view of sensor device of the present invention Top view with the cover removed in Example 1 Enlarged view around the pad in Example 1 Enlarged view around the pad in Example 2 Enlarged view around the pad portion in Example 3

  Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

  A first embodiment of the present invention will be described with reference to FIGS. The sensor device according to the present embodiment includes a circuit board 6 on which a sensor 11 for detecting angular velocity and acceleration is mounted, and a connector 2 and terminals (not shown) that are electrically connected to an external device. A case portion 1 that is a member storage portion of the housing 100 to be stored, a positioning guide 8 that determines a mounting position of the circuit board 6, a housing 100 in which a flange 12 for fixing to an external device is formed, and a cover 3 are provided. .

  In addition to the sensor 11, an electronic component 7 is mounted on the circuit board 6 on which the sensor is mounted. The electronic component 7 includes components such as a microcomputer, a voltage regulator (regulator), a resistor, a capacitor, and a diode, and performs sensor control, power supply, external communication control, and the like.

  As the circuit board 6, a glass epoxy board or a ceramic board is used. The case portion 1, the connector 2, the flange 12, and the cover 3 of the housing 100 are formed of PBT (polybutylene terephthalate) resin, PPS (polyphenylene sulfide) resin, or the like. An epoxy resin, a silicone resin, or the like is used as an adhesive for fixing the circuit board 6 or the cover 3 to a predetermined portion of the case 1. The circuit board 6 is installed so as to be in contact with four positions of the positioning guide 8 in the housing 1, and the side surface of the circuit board 6 is fixed to a predetermined position of the case portion 1 by an adhesive 14 a.

  The positioning guide 8 is formed in the thick portion 101 on the side surface of the case, and is installed at four locations, two on the connector side of the case portion 1 of the housing 100 and two on the flange side surface on one side. It protrudes inside the case.

  The pad 9 on the circuit board 6 and the internal terminal 5 which is one end of the terminal of the connector 2 are electrically connected by a wire 10 made of a thin metal wire (aluminum wire or the like) and is the other end of the connector terminal. An external terminal (not shown) is coupled to a connection terminal of an external device inside the connector. After the circuit board 6 is stored in the case 1 and the connection of the wire 10 is completed, the gel 13 is applied so as to cover the circuit board 6 and the wire 10, and the cover 3 is placed at a predetermined position of the housing 1. 3 The peripheral portion is fixed with an adhesive 14b to cover the opening of the housing 3.

  The sensor device of the present invention is fixed to an external device by screwing using attachment holes 4 formed in flanges 5 provided at two places on the outer side of the case 1.

  Since the communication mode is assumed to be CAN communication, the wire 10 includes a power source and GND, and further CAN_High and CAN_Low output signals. By arranging the power supply and GND on the wires 10a and 10d at both ends and arranging the signal line on the central wires 10b and 10c, it is possible to prevent the power supply and GND from contacting and short-circuiting.

  FIG. 3 shows the positions and length relationships of the internal terminals 5, the pads 9 on the circuit board 6, and the wires 10 in FIG. 2. The distance between internal terminal 5a and internal terminal 5b is distance Lt1, the distance between internal terminal 5b and internal terminal 5c is distance Lt2, the distance between internal terminal 5c and internal terminal 5d is distance Lt3, and between pad 9a and pad 9b. When the distance is the distance Ls1, the distance between the pad 9b and the pad 9c is the distance Ls2, and the distance between the pad 9c and the pad 9d is the distance Ls3, the distance Lt1> distance Ls1, the distance Lt2 <distance Ls2, and the distance Lt3> distance Ls3. By installing in such a way, contact between adjacent wires is suppressed. Further, it is possible to prevent adjacent wires from being arranged side by side and to reduce stroke noise. Further, by alternately connecting the wires in a square shape, the loop length of the wires can be increased and the life of the wires can be ensured.

  Further, by making the loop lengths of the wires 10a, 10b, 10c, and 10d the same, the noise flowing through each wire can be made equal, and the control can be facilitated by setting the signal delay to the same time.

  FIG. 4 shows a configuration diagram of internal terminals, pads, and wires in Embodiment 2 of the present invention. Note that a description of the same structure as in the first embodiment will be omitted.

  The case portion of the housing 100 is formed with a protruding portion so as to protrude toward the circuit board. Internal terminals 5b and 5c are formed in the protruding portion. The circuit board 6 is formed with a recessed portion in accordance with the protruding portion. The pads 9b and 9c are arranged on the indentation direction side of the pads 9a and 9d. When the distance between the internal terminal 5b and the internal terminal 5c is the distance Ltt and the distance between the pad 9b and the pad 9c is the distance Lss, the distance Ltt <the distance Lss.

  According to the present embodiment, adjacent wires 10b and 10c can be connected in a square shape, and stroke noise can be reduced by preventing the wires from being connected in parallel. Moreover, the effect similar to 1st embodiment can be acquired by making the loop length of the wire 10a, 10b, 10c, 10d at this time into the same length.

  Furthermore, the positioning accuracy of the circuit board 6 in the case is improved by the protrusion and the recess. The protruding portion may be formed on the circuit board 6 and the concave portion may be formed on the case portion of the housing 100.

  FIG. 5 shows a configuration diagram of internal terminals, pads, and wires in Embodiment 3 of the present invention. Note that a description of the same configuration as in the first and second embodiments is omitted.

  The case portion of the housing 100 is formed with a protruding portion so that the internal terminals 5b and 5d protrude toward the circuit board from the internal terminals 5a and 5c.

  The circuit board 6 is formed with a recessed portion and a protruding portion corresponding to the protruding portion, and pads 9b and 9d are installed in the recessed portion. The pads 9 a and 9 c are installed on the protruding portion of the circuit board 6.

  The set of the internal terminal 5a, the pad 9a and the wire 10a and the set of the adjacent internal terminal 5b, the pad 9b and the wire 10b are arranged so as to be shifted in the wire extending direction, and the wire is projected on the projection plane in the direction perpendicular to the wire extending direction. There is no overlap.

  Similarly, the other adjacent pairs are also arranged so as to be shifted in the wire extending direction, and the wires do not overlap on the projection plane perpendicular to the wire extending direction.

  According to the present embodiment, the same effects as those of the first embodiment are obtained. That is, since adjacent wires are not arranged in parallel, stroke noise can be reduced. And contact between wires can also be prevented.

  Further, by making the loop lengths of the wires 10a, 10b, 10c, and 10d the same, the same effects as those in the first embodiment and the second embodiment can be obtained.

100. Housing 1. Case part 2. Connector 3. Cover 4. 4. Mounting hole Internal terminal 5a. Internal terminal a
5b. Internal terminal b
5c. Internal terminal c
5d. Internal terminal d
6). Circuit board 7. Electronic component8. 8. Positioning guide Pad 9a. Pad a
9b. Pad b
9c. Pad c
9d. Pad d
10. Wire 10a. Wire a
10b. Wire b
10c. Wire c
10d. Wire d
11. Sensor 12. Flange 13. Gel 14a. Adhesive material a
14b. Adhesive material b
101. Case thick part

Claims (4)

An electronic component to which a sensor signal is input is mounted, and a substrate having a plurality of pads;
In a sensor device comprising a plurality of output terminals electrically connected by pads and wires of the substrate,
Define a pair of pads, wires, and output terminals, and define two pairs as a pair of wires,
The distance Lt1 between the output terminals of the pair of wires is smaller than the distance Ls1 between the substrate pads of the pair of wires.
A sensor device in which the pair of wire groups are continuously provided. An electronic component to which a sensor signal is input is mounted, and a substrate having a plurality of pads;
In a sensor device comprising a plurality of output terminals electrically connected by pads and wires of the substrate,
A set of pads, wires and output terminals,
When a pair of adjacent pad intervals is Ls1 and an output terminal interval is Lt1, Lt1> Ls1 holds,
A sensor device in which Lt2 <Ls2 is established, where Ls2 is an interval between the next set of pads and Lt2 is an interval between output terminals.   A set of boards for connecting an inertial force sensor and an electronic component mounted thereon, a housing for housing the board, a board pad formed on the board, and a terminal terminal connection formed on the housing. In the sensor device in which the wire connecting portions are arranged in parallel, the terminal terminal connecting portion and the board pad position of one set of wire connecting portions, and the terminal terminal connecting portion and the substrate pad of another adjacent wire connecting portion The sensor device is characterized in that the positions of the wires are shifted in the wire drawing direction, and the wires do not overlap each other on a projection plane in a direction perpendicular to the wire drawing direction. The sensor device according to claim 1, wherein
A sensor device characterized in that the plurality of wires have the same length.

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