JP2018107212A - Printed-circuit board - Google Patents

Printed-circuit board Download PDF

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JP2018107212A
JP2018107212A JP2016249888A JP2016249888A JP2018107212A JP 2018107212 A JP2018107212 A JP 2018107212A JP 2016249888 A JP2016249888 A JP 2016249888A JP 2016249888 A JP2016249888 A JP 2016249888A JP 2018107212 A JP2018107212 A JP 2018107212A
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insulating
main surface
layer
insulating substrate
signal wiring
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JP6795969B2 (en
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増夫 永崎
Masuo Nagasaki
増夫 永崎
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Kyocera Corp
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Kyocera Corp
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Abstract

PROBLEM TO BE SOLVED: To allow radio frequency signals to easily pass through signal wires to control crossing of signals (cross talk) between proximity signal wires.SOLUTION: A printed-circuit board 100 comprises: an insulating substrate 1; signal wires 2 that are formed on one principal surface of the insulating substrate 1; a first ground layer 7 or a power supply layer that is formed on the other principal surface of the insulating substrate 1; insulating parts 3 that are formed on one principal surface of the insulating substrate 1 where the signal wires 2 are not formed; a magnetic substance part 4 that covers at least principal surfaces of the signal wires 2; an insulating layer 5 that is formed on a principal surface of the magnetic substance part 4; and a second ground layer 6 that is formed on a principal surface of the insulating layer 5.SELECTED DRAWING: Figure 1

Description

本開示は、高周波信号を通しやすい印刷配線板に関する。   The present disclosure relates to a printed wiring board that easily allows high-frequency signals to pass through.

ＬＳＩ（大規模集積回路）の高周波電源電流は、基板の電源層に廻り込むと、信号配線間の高周波信号の電磁放射ノイズ（電源ノイズ）の原因となる。この電源ノイズの発生を低減させるために、特許文献１には、電源層内に形成されたインピーダンス付加回路の上下の少なくとも一方に磁性体を設けることで、回路のインピーダンスをコントロールして低減する多層プリント基板が記載されている。   When a high frequency power supply current of an LSI (Large Scale Integrated circuit) wraps around the power supply layer of the substrate, it causes electromagnetic radiation noise (power supply noise) of a high frequency signal between signal wirings. In order to reduce the occurrence of power supply noise, Patent Document 1 discloses a multilayer that controls and reduces the impedance of a circuit by providing a magnetic material on at least one of the top and bottom of an impedance addition circuit formed in the power supply layer. A printed circuit board is described.

特開平１０−２４２６０２号公報Japanese Patent Laid-Open No. 10-242602

本開示の印刷配線板は、絶縁基板と、絶縁基板の一方の主面に形成された信号配線と、絶縁基板の他方の主面に形成された第１のグランド層または電源層と、絶縁基板の一方の主面の、信号配線が形成されていない部分に形成された絶縁部と、信号配線の少なくとも主面を被覆している磁性体部と、磁性体部の主面に形成された絶縁層と、絶縁層の主面に形成された第２のグランド層とを含む。   A printed wiring board according to the present disclosure includes an insulating substrate, a signal wiring formed on one main surface of the insulating substrate, a first ground layer or a power supply layer formed on the other main surface of the insulating substrate, and an insulating substrate. An insulating portion formed on a portion of one of the main surfaces where the signal wiring is not formed, a magnetic body portion covering at least the main surface of the signal wiring, and an insulation formed on the main surface of the magnetic body portion And a second ground layer formed on the main surface of the insulating layer.

本開示の一実施形態に係る印刷配線板を示す説明図である。It is explanatory drawing which shows the printed wiring board which concerns on one Embodiment of this indication. 本開示の別の実施形態に係る印刷配線板を示す説明図である。It is explanatory drawing which shows the printed wiring board which concerns on another embodiment of this indication. 本開示のさらに別の実施形態に係る印刷配線板を示す説明図である。It is explanatory drawing which shows the printed wiring board which concerns on another embodiment of this indication. （ａ）〜（ｄ）は本開示の一実施形態に係る印刷配線板の製造方法を示す説明図である。(A)-(d) is explanatory drawing which shows the manufacturing method of the printed wiring board which concerns on one Embodiment of this indication.

上述のように、特許文献１の多層プリント基板には、電源層内に形成されたインピーダンス付加回路の上下の少なくとも一方に磁性体が設けられている。そのため、電源ノイズの発生を低減することができる。しかし、特許文献１の多層プリント基板では、信号配線に対して特に加工が施されておらず、高周波信号の通しやすさを考慮していない。さらに、近接する信号配線間の信号の混線（クロストーク）を抑制することもできない。   As described above, the multilayer printed circuit board of Patent Document 1 is provided with a magnetic material on at least one of the upper and lower sides of the impedance addition circuit formed in the power supply layer. Therefore, generation of power supply noise can be reduced. However, the multilayer printed circuit board disclosed in Patent Document 1 does not particularly process the signal wiring, and does not consider the ease of passing high-frequency signals. Furthermore, it is not possible to suppress signal crossing (crosstalk) between adjacent signal lines.

これに対して、本開示の印刷配線板では、磁性体部が、絶縁基板の一方の主面に形成された信号配線の少なくとも主面を被覆しており、この磁性体部の主面に形成された絶縁層を介して第２のグランド層が形成されている。また、絶縁部が、絶縁基板の一方の主面の信号配線が形成されていない部分に形成されている。したがって、信号配線の主面に設けた磁性体部により、信号配線とその上の第２のグランド層との間の磁界結合を強くすることができる。そのため、信号配線のインダクタンスを大きくすることができ、高周波信号を通しやすくなる。さらに、絶縁基板の主面の信号配線が形成されていない部分（信号配線間の間隙）に形成された絶縁層により、近接する信号配線間のクロストークを抑制することができる。   On the other hand, in the printed wiring board of the present disclosure, the magnetic body portion covers at least the main surface of the signal wiring formed on one main surface of the insulating substrate, and is formed on the main surface of the magnetic body portion. A second ground layer is formed via the insulating layer formed. Further, the insulating part is formed in a portion where the signal wiring on one main surface of the insulating substrate is not formed. Therefore, magnetic coupling between the signal wiring and the second ground layer thereon can be strengthened by the magnetic part provided on the main surface of the signal wiring. As a result, the inductance of the signal wiring can be increased and high-frequency signals can be easily passed. Furthermore, crosstalk between adjacent signal wirings can be suppressed by an insulating layer formed in a portion (gap between signal wirings) where the signal wiring is not formed on the main surface of the insulating substrate.

本開示の一実施形態に係る印刷配線板を、図１に基づいて説明する。図１に示すように、印刷配線板１００は、第１の絶縁基板１と信号配線２と絶縁部３と磁性体部４と絶縁層５と第１のグランド層７と、第２のグランド層６と第２の絶縁基板８と信号配線９とを含む。   A printed wiring board according to an embodiment of the present disclosure will be described with reference to FIG. As shown in FIG. 1, the printed wiring board 100 includes a first insulating substrate 1, a signal wiring 2, an insulating portion 3, a magnetic body portion 4, an insulating layer 5, a first ground layer 7, and a second ground layer. 6, a second insulating substrate 8 and a signal wiring 9.

第１の絶縁基板１としては、絶縁性を有する素材（絶縁板）であれば特に限定されず、複数積層されていてもよい。例えば、エポキシ樹脂、ビスマレイミド−トリアジン樹脂、ポリイミド樹脂、ポリフェニレンエーテル樹脂などの有機樹脂などが挙げられる。これらの有機樹脂は２種以上を混合して用いてもよい。絶縁性を有する素材として有機樹脂を使用する場合、有機樹脂に補強材を配合して使用するのが好ましい。補強材としては、例えば、ガラス繊維、ガラス不織布、アラミド不織布、アラミド繊維、ポリエステル繊維などの絶縁性布材が挙げられる。補強材は２種以上を併用してもよい。さらに、絶縁性を有する素材には、シリカ、硫酸バリウム、タルク、クレー、ガラス、炭酸カルシウム、酸化チタンなどの無機充填材が含まれていてもよい。   The first insulating substrate 1 is not particularly limited as long as it is an insulating material (insulating plate), and a plurality of layers may be laminated. Examples thereof include organic resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, polyphenylene ether resins, and the like. These organic resins may be used in combination of two or more. When an organic resin is used as a material having insulating properties, it is preferable to use the organic resin mixed with a reinforcing material. Examples of the reinforcing material include insulating fabric materials such as glass fiber, glass nonwoven fabric, aramid nonwoven fabric, aramid fiber, and polyester fiber. Two or more reinforcing materials may be used in combination. Further, the insulating material may include inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide.

第１の絶縁基板１の少なくとも一方の主面（上面）には、導体としての信号配線２が形成されている。図１に示すように、通常、信号配線２は複数形成される（例えば、２本１組の差動配線など）方が高周波信号を通しやすくなる。この信号配線２は、例えばサブトラクティブ法、セミアディティブ法、ＭＳＡＰ(Modified Semi Additive Process)などの公知の工法により形成される。信号配線２の素材としては例えば銅が挙げられる。   A signal wiring 2 as a conductor is formed on at least one main surface (upper surface) of the first insulating substrate 1. As shown in FIG. 1, normally, a plurality of signal wirings 2 are formed (for example, a set of two differential wirings, etc.), so that a high-frequency signal can be easily passed. The signal wiring 2 is formed by a known method such as a subtractive method, a semi-additive method, or an MSAP (Modified Semi Additive Process). An example of the material of the signal wiring 2 is copper.

第１の絶縁基板１の他方の主面（下面）には、第１のグランド層７が形成されている。第１のグランド層７の代わりに電源層が形成されていてもよい。第１のグランド層７は、例えば銅から形成される。
このような第１の絶縁基板１と信号配線２と第１のグランド層７とは、例えば１つの両面金属張積層板（両面銅張積層板）として予め一体に形成されていてもよい。この場合、第１の絶縁基板１は、両面にそれぞれ形成された信号配線２と第１のグランド層７とで挟まれる形となる。 A first ground layer 7 is formed on the other main surface (lower surface) of the first insulating substrate 1. A power supply layer may be formed instead of the first ground layer 7. The first ground layer 7 is made of, for example, copper.
The first insulating substrate 1, the signal wiring 2, and the first ground layer 7 may be integrally formed in advance as one double-sided metal-clad laminate (double-sided copper-clad laminate), for example. In this case, the first insulating substrate 1 is sandwiched between the signal wiring 2 and the first ground layer 7 respectively formed on both surfaces.

第１の絶縁基板１の一方の主面の、信号配線２が形成されていない部分（間隙２０）には絶縁部３が形成される。絶縁部３は第１の絶縁基板１、第２の絶縁基板８および絶縁層５よりも低い比誘電率を有していてもよく、例えば低誘電材料で形成される。低誘電材料は、例えば３．８以下の比誘電率を有するのがよい。低誘電材料で形成することによって、信号配線２間の絶縁性を強くしてクロストークを抑制することができる。このような低誘電材料としては、例えば、ポリテトラフルオロエチレン、液晶ポリマ、ポリフェニレンエーテル、ポリフェニレンオキシド、シアネートエステル、ポリオレフィンなどの樹脂が挙げられる。これらの樹脂は単独で用いてもよく、２種以上を併用してもよい。このような材料としては、例えばＲＯ２９２９（Ｒｏｇｅｒｓ社製）、ＧＸ１３（味の素ファインテクノ（株）製）、ＧＸ９２（味の素ファインテクノ（株）製）などが市販されている。この絶縁部３は、間隙２０に絶縁樹脂素材を充填するなどして形成され、その表面（主面）は、信号配線２と面一（平坦）であるのがよい。間隙２０の幅は信号配線２の大きさによって適宜決定するものなので、間隙２０が複数設けられた場合、各間隙２０の幅は同じでも異なっていてもよい。   An insulating portion 3 is formed in a portion (gap 20) where the signal wiring 2 is not formed on one main surface of the first insulating substrate 1. The insulating part 3 may have a relative dielectric constant lower than that of the first insulating substrate 1, the second insulating substrate 8, and the insulating layer 5, and is formed of, for example, a low dielectric material. The low dielectric material may have a relative dielectric constant of, for example, 3.8 or less. By forming with a low dielectric material, the insulation between the signal wirings 2 can be strengthened and crosstalk can be suppressed. Examples of such a low dielectric material include resins such as polytetrafluoroethylene, liquid crystal polymer, polyphenylene ether, polyphenylene oxide, cyanate ester, and polyolefin. These resins may be used alone or in combination of two or more. As such a material, for example, RO2929 (manufactured by Rogers), GX13 (manufactured by Ajinomoto Fine Techno Co., Ltd.), GX92 (manufactured by Ajinomoto Fine Techno Co., Ltd.) and the like are commercially available. The insulating portion 3 is formed by filling the gap 20 with an insulating resin material, and its surface (main surface) is preferably flush with the signal wiring 2 (flat). Since the width of the gap 20 is appropriately determined depending on the size of the signal wiring 2, when a plurality of gaps 20 are provided, the width of each gap 20 may be the same or different.

磁性体部４は、信号配線２の少なくとも主面を被覆するように形成される。この磁性体部４は、図１に示すように、連続的な層状を有している。磁性体部４は、信号配線２と絶縁層５を介して形成された第２のグランド層６との間の磁界結合を強くして、信号配線２自体のインダクタンスを大きくすることができる。また、磁性体部４の厚みを調整することで、信号配線２自体のインダクタンスを調整することができる。この磁性体部４の厚みは５μｍ以上であるのがよい。   The magnetic part 4 is formed so as to cover at least the main surface of the signal wiring 2. As shown in FIG. 1, the magnetic part 4 has a continuous layer shape. The magnetic body portion 4 can strengthen the magnetic field coupling between the signal wiring 2 and the second ground layer 6 formed via the insulating layer 5 and increase the inductance of the signal wiring 2 itself. Moreover, the inductance of the signal wiring 2 itself can be adjusted by adjusting the thickness of the magnetic part 4. The thickness of the magnetic part 4 is preferably 5 μm or more.

磁性体部４の磁性材料としては絶縁性を有するのが良い。これらの中でも加工のしやすさなどから、スピネル形結晶構造のフェライト、六方晶フェライト、ガーネットフェライトなどのフェライトがよい。特に磁性材料としては、透磁率が高く、電気抵抗が高い点から、スピネル形結晶構造のフェライト（スピネルフェライト（組成式ＡＦｅ2Ｏ4、ＡはＭｎ、Ｃｏ、Ｎｉ、Ｃｕ、Ｚｎなどを示す））を用いてもよい。 The magnetic material of the magnetic part 4 is preferably insulative. Among these, ferrites such as ferrite having a spinel crystal structure, hexagonal ferrite, and garnet ferrite are preferable because they are easy to process. In particular, as a magnetic material, ferrite having a spinel crystal structure (spinel ferrite (composition formula AFe 2 O 4 , A represents Mn, Co, Ni, Cu, Zn, etc.) from the viewpoint of high magnetic permeability and high electrical resistance. ) May be used.

絶縁層５は、磁性体部４の主面に形成される。絶縁層５は、絶縁性を有する素材で形成されていれば、特に限定されない。絶縁性を有する素材としては、例えば、エポキシ樹脂、ビスマレイミド−トリアジン樹脂、ポリイミド樹脂、ポリフェニレンエーテル（ＰＰＥ）樹脂、フェノール樹脂、ポリテトラフルオロエチレン（ＰＴＦＥ）樹脂、ケイ素樹脂、ポリブタジエン樹脂、ポリエステル樹脂、メラミン樹脂、ユリア樹脂、ポリフェニレンサルファイド（ＰＰＳ）樹脂、ポリフェニレンオキシド（ＰＰＯ）樹脂などが挙げられる。これらの樹脂は２種以上を混合してもよい。これらの樹脂には、絶縁性布材（例えば、ガラス繊維、ガラス不織布など）、シリカ、硫酸バリウム、タルク、クレー、炭酸カルシウム、酸化チタンなどの補強材や無機充填材、フェノール樹脂やメタクリル樹脂からなる有機充填材が含まれていてもよい。この絶縁層５は、上記した第１の絶縁基板１と同じ樹脂および補強材を用いてもよい。   The insulating layer 5 is formed on the main surface of the magnetic part 4. The insulating layer 5 is not particularly limited as long as it is formed of an insulating material. Examples of the insulating material include epoxy resin, bismaleimide-triazine resin, polyimide resin, polyphenylene ether (PPE) resin, phenol resin, polytetrafluoroethylene (PTFE) resin, silicon resin, polybutadiene resin, polyester resin, Examples include melamine resin, urea resin, polyphenylene sulfide (PPS) resin, polyphenylene oxide (PPO) resin, and the like. Two or more of these resins may be mixed. These resins include insulating fabrics (for example, glass fibers, glass nonwoven fabrics, etc.), silica, barium sulfate, talc, clay, calcium carbonate, titanium oxide and other reinforcing materials, inorganic fillers, phenolic resins and methacrylic resins. An organic filler may be included. The insulating layer 5 may use the same resin and reinforcing material as the first insulating substrate 1 described above.

絶縁層５の主面には第２のグランド層６が形成される。この第２のグランド層６は、信号配線２との間に磁性体部４を挟んでいるので、磁界結合が強くなる。第２のグランド層６は、例えば銅から形成される。電流をより精度よく流すために、図１に示すように、信号配線２の上下方向に、２つのグランド層（第２のグランド層６および第１のグランド層７）を形成するのがよい。   A second ground layer 6 is formed on the main surface of the insulating layer 5. Since the second ground layer 6 sandwiches the magnetic part 4 between the signal wiring 2 and the magnetic field coupling, the magnetic field coupling becomes strong. The second ground layer 6 is made of, for example, copper. In order to flow current more accurately, it is preferable to form two ground layers (second ground layer 6 and first ground layer 7) in the vertical direction of the signal wiring 2 as shown in FIG.

第２のグランド層６の主面（上面）には第２の絶縁基板８が形成される。この第２の絶縁基板８は、上述した第１の絶縁基板１と同じ材質や形状であってもよい。また、第２の絶縁基板８の主面（上面）にはさらに信号配線９を配置することができる。この第２の絶縁基板８と第２のグランド層６と信号配線９は、例えば１つの両面銅張積層板として予め一体に形成されていてもよい。その場合、絶縁層５の主面に、上記の両面銅張積層板を第２のグランド層６側から積層するだけで、印刷配線板１００が形成される。   A second insulating substrate 8 is formed on the main surface (upper surface) of the second ground layer 6. The second insulating substrate 8 may be the same material and shape as the first insulating substrate 1 described above. Further, a signal wiring 9 can be further arranged on the main surface (upper surface) of the second insulating substrate 8. The second insulating substrate 8, the second ground layer 6, and the signal wiring 9 may be integrally formed in advance as one double-sided copper-clad laminate, for example. In that case, the printed wiring board 100 is formed only by laminating the double-sided copper-clad laminate on the main surface of the insulating layer 5 from the second ground layer 6 side.

（別の実施形態）
図２に本開示の別の実施形態に係る印刷配線板１０１を示す。なお、上記した印刷配線板１００の部材と同じ作用を有する部材には、同符号を付して説明は省略する。図２に示すように、磁性体部４０は、信号配線２の主面を被覆するように断続的な層状を有していてもよく、特に信号配線２と同じ幅で形成されるのがよい。磁性体部４０は、連続的な層状で形成する磁性体部４（図１参照）よりも、絶縁部３０で隣り合う磁性体部４０同士が区切られるので、さらに信号配線２間の磁界結合（電気的な結合）を強くしつつ、クロストークを抑制することができる。磁性体部４０の厚みは、上述のように５μｍ以上であるのがよい。絶縁部３０は、上述の絶縁部３で説明したとおりであり、詳細な説明は省略する。 (Another embodiment)
FIG. 2 shows a printed wiring board 101 according to another embodiment of the present disclosure. In addition, the same code | symbol is attached | subjected to the member which has the same effect | action as the member of the above-mentioned printed wiring board 100, and description is abbreviate | omitted. As shown in FIG. 2, the magnetic part 40 may have an intermittent layer shape so as to cover the main surface of the signal wiring 2, and in particular, it should be formed with the same width as the signal wiring 2. . In the magnetic body portion 40, the adjacent magnetic body portions 40 are separated from each other by the insulating portion 30 rather than the magnetic body portion 4 (see FIG. 1) formed in a continuous layer shape. Crosstalk can be suppressed while strengthening (electrical coupling). The thickness of the magnetic part 40 is preferably 5 μm or more as described above. The insulating unit 30 is as described in the above-described insulating unit 3, and detailed description thereof is omitted.

（さらに別の実施形態）
図３に示すように、印刷配線板１０２は、印刷配線板１００の信号配線９が形成されていない部分に形成した絶縁部３'と、信号配線９の主面に形成した磁性体部４'と、磁性体部４'の主面（上面）に形成した、第３のグランド層６'と第３の絶縁基板８'と信号配線９'とを含むものである。これらの部材は上述した第１、第２の絶縁基板１，８、第１，２のグランド層６，７、信号配線２，９とそれぞれ同じ部材であってもよく、詳細は省略する。また、絶縁部３'および磁性体部４'の代わりに、図２に示す絶縁部３０で区切られて隣り合う磁性体部４０のような、断続的な層状の磁性体部を組み合わせて用いることもできる。また、信号配線９’の主面に磁性体部、絶縁部、および絶縁層をそれぞれ形成し、さらに別の両面銅張積層板をグランド層側から主面に積層することができる。 (Still another embodiment)
As shown in FIG. 3, the printed wiring board 102 includes an insulating portion 3 ′ formed on a portion of the printed wiring board 100 where the signal wiring 9 is not formed, and a magnetic body portion 4 ′ formed on the main surface of the signal wiring 9. And a third ground layer 6 ′, a third insulating substrate 8 ′, and a signal wiring 9 ′ formed on the main surface (upper surface) of the magnetic part 4 ′. These members may be the same members as the first and second insulating substrates 1 and 8, the first and second ground layers 6 and 7, and the signal wirings 2 and 9, respectively, and the details are omitted. Further, instead of the insulating portion 3 ′ and the magnetic body portion 4 ′, an intermittent layered magnetic body portion such as the adjacent magnetic body portion 40 separated by the insulating portion 30 shown in FIG. 2 is used in combination. You can also. In addition, a magnetic part, an insulating part, and an insulating layer can be formed on the main surface of the signal wiring 9 ′, and another double-sided copper-clad laminate can be stacked on the main surface from the ground layer side.

（製造方法）
次に、本開示に係る印刷配線板の製造方法の一実施形態を説明する。この製造方法は、下記の工程（ｉ）〜（ｉｖ）を含む。ただし、上記した部材と同じ作用を有する部材には同符号を付して説明は省略する。
（ｉ）絶縁基板の両面に金属箔を貼り付けた両面金属張積層板の一方の主面に回路パターン（信号配線）を形成し、他方の主面にグランド層または電源層を形成する。
（ｉｉ）絶縁基板の一方の主面の、信号配線が形成されていない部分に、信号配線の主面と面一になるように絶縁樹脂素材を充填・硬化させ絶縁部を形成する。
（ｉｉｉ）少なくとも信号配線の主面を被覆するように磁性体部を形成する。
（ｉｖ）磁性体部の主面に、第１のグランド層を形成済みの両面金属張積層板を、プリプレグを介して、熱プレスで熱圧着させる。 (Production method)
Next, an embodiment of a method for manufacturing a printed wiring board according to the present disclosure will be described. This manufacturing method includes the following steps (i) to (iv). However, members having the same functions as those described above are denoted by the same reference numerals and description thereof is omitted.
(I) A circuit pattern (signal wiring) is formed on one main surface of a double-sided metal-clad laminate in which metal foil is bonded to both surfaces of an insulating substrate, and a ground layer or a power supply layer is formed on the other main surface.
(Ii) An insulating portion is formed by filling and curing an insulating resin material in a portion of one main surface of the insulating substrate where the signal wiring is not formed so as to be flush with the main surface of the signal wiring.
(Iii) A magnetic part is formed so as to cover at least the main surface of the signal wiring.
(Iv) A double-sided metal-clad laminate having a first ground layer formed on the main surface of the magnetic body portion is hot-pressed by hot pressing through a prepreg.

まず、図４（ａ）に示すように、第１の絶縁基板１の両面に金属箔（例えば、銅箔）を貼り付けた両面金属張積層板１１を準備し、例えばサブトラクティブ法、ＭＳＡＰなどの公知の工法により、一方の主面に回路パターン（信号配線２）を、他方の主面に第１のグランド層７をそれぞれ形成する。   First, as shown in FIG. 4A, a double-sided metal-clad laminate 11 in which metal foils (for example, copper foils) are attached to both sides of the first insulating substrate 1 is prepared. For example, a subtractive method, MSAP, etc. The circuit pattern (signal wiring 2) is formed on one main surface, and the first ground layer 7 is formed on the other main surface.

次に、図４（ｂ）に示すように、第１の絶縁基板１（両面金属張積層板１１）の一方の主面の、信号配線２が形成されていない部分（間隙２０）に、信号配線２の主面と面一になるように、例えば低誘電材料を充填・硬化させ絶縁部３を形成する。より具体的には、信号配線２の主面から突出した絶縁部３を研磨などで切除して信号配線２の主面と面一に形成する。絶縁部３については上述のとおりであり、詳細な説明は省略する。   Next, as shown in FIG. 4B, the signal is not transferred to the portion (gap 20) where the signal wiring 2 is not formed on one main surface of the first insulating substrate 1 (double-sided metal-clad laminate 11). For example, a low dielectric material is filled and cured so as to be flush with the main surface of the wiring 2 to form the insulating portion 3. More specifically, the insulating portion 3 protruding from the main surface of the signal wiring 2 is cut off by polishing or the like to form the same surface as the main surface of the signal wiring 2. The insulating unit 3 is as described above, and detailed description thereof is omitted.

次に、図４（ｃ）に示すように、連続的な層状を有する磁性体部４を、少なくとも信号配線２の主面を被覆するように形成する。磁性体部４を形成する磁性材料としては上述のとおりであり、詳細な説明は省略する。磁性体部４はペースト状の磁性材料を塗布および乾燥して形成してもよく、シート状に加工された磁性材料（磁性体シート）で形成してもよい。磁性材料としては、例えば、ＲＡＹＢＲＩＤ（東レ（株）製）などが市販されている。   Next, as shown in FIG. 4C, the magnetic body portion 4 having a continuous layer shape is formed so as to cover at least the main surface of the signal wiring 2. The magnetic material forming the magnetic body portion 4 is as described above, and detailed description thereof is omitted. The magnetic part 4 may be formed by applying and drying a paste-like magnetic material, or may be formed of a magnetic material (magnetic sheet) processed into a sheet shape. As a magnetic material, for example, RAYBRID (manufactured by Toray Industries, Inc.) is commercially available.

磁性体部４は、必ずしも図４（ｃ）に示すような連続的な層状を有するものではなく、図２に示すような断続的な層状を有していてもよい。断続的な層状に加工する方法は特に限定されない。例えば、連続的な層状を有する磁性体部を形成した後、信号配線を被覆する部分を残して他の部分を除去してもよく、予め信号配線のみを被覆するように磁性体部を形成してもよい。   The magnetic body portion 4 does not necessarily have a continuous layer shape as shown in FIG. 4C, and may have an intermittent layer shape as shown in FIG. The method of processing into an intermittent layer is not particularly limited. For example, after forming a magnetic layer part having a continuous layer shape, the other part may be removed while leaving the part covering the signal wiring, or the magnetic part is formed in advance so as to cover only the signal wiring. May be.

最後に、図４（ｄ）に示すように、磁性体部４の主面に絶縁層５を形成と同時に第２のグランド層６を構成する。具体的には、磁性体部４の主面にシート状に加工された絶縁性を有する素材（樹脂）を絶縁層５として積層させる。シート状に加工された素材としては、例えば、絶縁性布材に上述の絶縁性を有する樹脂を含浸させたプリプレグを用いるのがよい。すなわち、磁性体部４の主面に、絶縁層５と、信号配線９および第２のグランド層６を形成済みの両面金属張積層板１２とを同時に積層し、熱プレスで熱圧着させることで印刷配線板１００を得ることができる。また、印刷配線板１００の表面にソルダーレジスト層（図示せず）を形成してもよい。   Finally, as shown in FIG. 4D, the second ground layer 6 is formed simultaneously with the formation of the insulating layer 5 on the main surface of the magnetic part 4. Specifically, an insulating material (resin) processed into a sheet shape is laminated on the main surface of the magnetic body portion 4 as the insulating layer 5. As the material processed into a sheet shape, for example, a prepreg in which an insulating cloth material is impregnated with the resin having the above-described insulating property may be used. That is, the insulating layer 5 and the double-sided metal-clad laminate 12 on which the signal wiring 9 and the second ground layer 6 have been formed are simultaneously laminated on the main surface of the magnetic body portion 4 and thermocompression-bonded by hot pressing. The printed wiring board 100 can be obtained. A solder resist layer (not shown) may be formed on the surface of the printed wiring board 100.

このような印刷配線板は、例えば両面金属張積層板１１の信号配線９の間隙を絶縁部で充填した後、信号配線の主面を被覆するように形成した磁性体部の主面に、絶縁層を介して、別の両面金属張積層板を上記と同様に構成し、図３に示すような印刷配線板１０２を得ることもできる。   Such a printed wiring board, for example, insulates the main surface of the magnetic body portion formed so as to cover the main surface of the signal wiring after filling the gap of the signal wiring 9 of the double-sided metal-clad laminate 11 with the insulating portion. Another double-sided metal-clad laminate can be configured in the same manner as described above via the layers, and a printed wiring board 102 as shown in FIG. 3 can be obtained.

本開示の印刷配線板は上記実施形態に限定されるものではなく、種々の改善または改良が可能である。例えば、印刷配線板にさらに配線パターン（信号配線）やビアなどを含む絶縁基板を複数積層してビルドアップ層を形成したビルドアップ構造や多層構造としてもよい。   The printed wiring board of the present disclosure is not limited to the above-described embodiment, and various improvements or improvements can be made. For example, a build-up structure or multilayer structure in which a build-up layer is formed by laminating a plurality of insulating substrates including a wiring pattern (signal wiring) and vias on a printed wiring board may be used.

１ 第１の絶縁基板
２ 信号配線
３、３'、３０ 絶縁部
４、４'、４０ 磁性体部
５、５’ 絶縁層
６ 第２のグランド層
６' 第３のグランド層
７ 第１のグランド層
８ 第２の絶縁基板
８' 第３の絶縁基板
９、９' 信号配線
１１，１２ 両面金属張積層板
２０ 間隙
１００、１０１、１０２ 印刷配線板 DESCRIPTION OF SYMBOLS 1 1st insulating substrate 2 Signal wiring 3, 3 ', 30 Insulating part 4, 4', 40 Magnetic body part 5, 5 'Insulating layer 6 2nd ground layer 6' 3rd ground layer 7 1st ground Layer 8 Second insulating substrate 8 ′ Third insulating substrate 9, 9 ′ Signal wiring 11, 12 Double-sided metal-clad laminate 20 Gap 100, 101, 102 Printed wiring board

Claims (5)

絶縁基板と、
絶縁基板の一方の主面に形成された信号配線と、
絶縁基板の他方の主面に形成された第１のグランド層または電源層と、
絶縁基板の一方の主面の、信号配線が形成されていない部分に形成された絶縁部と、
信号配線の少なくとも主面を被覆している磁性体部と、
磁性体部の主面に形成された絶縁層と、
絶縁層の主面に形成された第２のグランド層と、
を含むことを特徴とする印刷配線板。 An insulating substrate;
Signal wiring formed on one main surface of the insulating substrate;
A first ground layer or a power supply layer formed on the other main surface of the insulating substrate;
An insulating portion formed on a portion of one main surface of the insulating substrate where the signal wiring is not formed;
A magnetic part covering at least the main surface of the signal wiring;
An insulating layer formed on the main surface of the magnetic part;
A second ground layer formed on the main surface of the insulating layer;
A printed wiring board comprising: 前記磁性体部が、連続的な層状を有している請求項１に記載の印刷配線板。   The printed wiring board according to claim 1, wherein the magnetic body portion has a continuous layer shape. 前記磁性体部が、断続的な層状を有している請求項１に記載の印刷配線板。   The printed wiring board according to claim 1, wherein the magnetic body portion has an intermittent layer shape. 前記絶縁部が、絶縁基板ならびに絶縁層よりも低い比誘電率を有している請求項１〜３のいずれかに記載の印刷配線板。   The printed wiring board according to claim 1, wherein the insulating portion has a relative dielectric constant lower than that of the insulating substrate and the insulating layer. 前記磁性体部が、スピネルフェライトを含む請求項１〜４のいずれかに記載の印刷配線板。   The printed wiring board according to claim 1, wherein the magnetic part includes spinel ferrite.
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120890A (en) * 1989-10-04 1991-05-23 Ibiden Co Ltd Magnetic alloy layer coated circuit board
JPH08250858A (en) * 1995-03-07 1996-09-27 Ngk Spark Plug Co Ltd Circuit board
JPH11220263A (en) * 1998-01-29 1999-08-10 Oki Electric Ind Co Ltd Printed wiring board
JP2000183540A (en) * 1998-12-17 2000-06-30 Nec Corp Printed wiring board
JP2002076644A (en) * 2000-08-28 2002-03-15 Matsushita Electric Works Ltd Multilayer printed wiring board
JP2005032969A (en) * 2003-07-11 2005-02-03 Mitsui Chemicals Inc Base material for electric circuit board
US20050205295A1 (en) * 2004-03-19 2005-09-22 Tsuk Michael J Apparatuses, systems and/or methods to affect impedance
WO2008127196A1 (en) * 2007-04-12 2008-10-23 Agency For Science, Technology And Research Composite structure for an electronic circuit
JP2012023275A (en) * 2010-07-16 2012-02-02 Meiko Electronics Co Ltd Crosstalk suppression circuit board
JP2014192185A (en) * 2013-03-26 2014-10-06 Shinshu Univ High frequency circuit board

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120890A (en) * 1989-10-04 1991-05-23 Ibiden Co Ltd Magnetic alloy layer coated circuit board
JPH08250858A (en) * 1995-03-07 1996-09-27 Ngk Spark Plug Co Ltd Circuit board
JPH11220263A (en) * 1998-01-29 1999-08-10 Oki Electric Ind Co Ltd Printed wiring board
JP2000183540A (en) * 1998-12-17 2000-06-30 Nec Corp Printed wiring board
JP2002076644A (en) * 2000-08-28 2002-03-15 Matsushita Electric Works Ltd Multilayer printed wiring board
JP2005032969A (en) * 2003-07-11 2005-02-03 Mitsui Chemicals Inc Base material for electric circuit board
US20050205295A1 (en) * 2004-03-19 2005-09-22 Tsuk Michael J Apparatuses, systems and/or methods to affect impedance
WO2008127196A1 (en) * 2007-04-12 2008-10-23 Agency For Science, Technology And Research Composite structure for an electronic circuit
JP2012023275A (en) * 2010-07-16 2012-02-02 Meiko Electronics Co Ltd Crosstalk suppression circuit board
JP2014192185A (en) * 2013-03-26 2014-10-06 Shinshu Univ High frequency circuit board

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