JP2018106923A - Method of manufacturing heating member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a heating member, allowing for formation of a highly accurate metal pattern.SOLUTION: There is provide the method of manufacturing a heating member 10 for heating an object to be heated. The method includes the steps of (a1) forming a plating base pattern 14b on a base layer 12 or (a2) forming a mask pattern 26 on a plating base layer 24 formed on the base layer 12; and (b) performing plating after (a1) or (a2) thereby forming a metal pattern 14a on the plating base.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a heating member, and more particularly to a method for manufacturing a heating member suitably used in a fixing process of an electrophotographic apparatus.

  In electrophotographic equipment such as copying machines, printers, and facsimiles that employ an electrophotographic system, a toner image is formed on a recording medium (such as paper), and this is heated and pressed by a heating member (fixing member) to be fixed. An image is formed. This fixing process accounts for most of the power consumption of electrophotographic equipment. For this reason, the improvement of a heating member is calculated | required from a viewpoint of energy saving.

  For example, in Patent Document 1, conventionally, a heater is incorporated in a hollow metal shaft and the outer peripheral surface of an elastic material layer provided around the hollow metal shaft is heated using this heater as a heat source. Proposal to shorten the warm-up time of the fixing device and save energy by using a rotating rotating body that has a metal pattern that can be heated and energized on the outer or inner surface of a cylindrical body made of doing. The metal pattern is formed by applying a conductive paste containing metal to the outer peripheral surface or inner peripheral surface of the cylindrical body.

Japanese Patent No. 5544801

  The method of applying a conductive paste to form a metal pattern is inferior in the precision of the thin line portion. As a result, there is a problem that temperature unevenness is likely to occur.

  The problem to be solved by the present invention is to provide a method for manufacturing a heating member capable of forming a highly accurate metal pattern.

  In order to solve the above-mentioned problems, a heating member manufacturing method according to the present invention is a heating member manufacturing method for heating an object to be heated, and (a1) a step of forming a plating base pattern on a base layer, or ( a2) a step of forming a mask pattern on the plating base layer formed on the base layer, and (b) a step of performing plating after the step (a1) or (a2) to form a metal pattern on the plating base. And having a gist.

  The plating base pattern is preferably formed by laser marking of the plating base layer formed on the base layer, or screen printing using a plating base forming paint containing a plating catalyst and a binder. The plating base pattern is preferably formed by laser marking of the plating base layer formed on the base layer. The mask pattern is preferably formed by applying a masking paint. The plating base is preferably a coating film containing a plating catalyst and a binder.

  According to the heating member manufacturing method of the present invention, after forming a plating base pattern on the base layer, or after forming a mask pattern on the plating base layer formed on the base layer, plating is performed. Since the metal pattern is formed on the ground, patterning accuracy is improved and temperature unevenness is improved as compared with the conventional method in which the metal pattern is formed by applying a conductive paste.

  At this time, if the plating base pattern is formed by laser marking of the plating base layer formed on the base layer, finer patterning can be formed, and the patterning accuracy is further improved. In addition, when the plating base pattern is formed by screen printing using a plating base forming paint containing a plating catalyst and a binder, finer patterning can be formed, and the patterning accuracy is further improved. Further, when the mask is formed by applying a masking paint, it can be performed using an ink jet coating machine, so that finer patterning can be formed and patterning accuracy is further improved.

It is the external appearance schematic diagram (a) of the heating member which concerns on one Embodiment of this invention, and a part (b) of radial direction cross section. It is an expanded view of the heat generating layer of a heating member. It is process drawing of the manufacturing method of the heating member which concerns on 1st embodiment. It is process drawing of the manufacturing method of the heating member which concerns on 2nd embodiment. It is process drawing of the manufacturing method of the heating member which concerns on 3rd embodiment. It is a schematic diagram explaining the evaluation method of surface temperature nonuniformity. It is a schematic diagram explaining the evaluation method of durability.

  The heating member according to the present invention is used to heat the object to be heated. As long as the object to be heated is heated, the type of the object to be heated is not particularly limited. Examples of the object to be heated include unfixed toner transferred to a recording medium such as paper in an electrophotographic apparatus such as a copying machine, a printer, and a facsimile machine. In this case, the heating member is used as a heating member (fixing member) in the fixing process of the electrophotographic apparatus. Examples of the heating member (fixing member) in the electrophotographic apparatus include a fixing belt formed in a cylindrical shape, a fixing roll formed in a roll shape on the outer periphery of the shaft body, and the like. In terms of durability, the fixing belt and the fixing roll preferably have a seamless structure that is seamless in the circumferential direction.

  Fig.1 (a) is an external appearance schematic diagram of the heating member which concerns on one Embodiment of this invention. FIG.1 (b) is a part of radial cross section of the heating member. FIG. 2 is a development view of the heat generation layer of the heating member.

  As shown in FIG. 1A, the heating member 10 is formed in a cylindrical shape and has a seamless structure that is seamless in the circumferential direction. As shown in FIG. 1B, the heating member 10 has a base layer 12 and a heat generating layer 14.

  The base layer 12 is a base of the heating member 10. The base layer 12 is formed in a cylindrical shape and has a seamless structure that is seamless in the circumferential direction. The base layer 12 can be formed of an organic polymer or the like.

  The heat generating layer 14 is a portion that generates heat when energized. As shown in FIG. 2, the heat generating layer 14 has a metal pattern 14a in the heat generating region l. The metal pattern 14a is a resistance heating element and generates heat when energized. This type of heating member has high heat transfer efficiency, and can quickly raise the surface temperature of the heating member to a predetermined temperature after the start of energization to the resistance heating element, so that the rise is quick.

  The metal pattern 14a is made of a metal wire having a uniform width and may extend along the axial direction of the heating member 10 as shown in FIG. 2 or may have a ring shape in the circumferential direction. . Further, it may be spiral in the axial direction. The metal pattern 14a is formed by this repeating structure. The shape of the metal pattern 14a is not particularly limited. The heating member 10 is configured to generate heat uniformly on its outer peripheral surface, and is configured to prevent temperature unevenness. The end portions of the metal pattern 14 a are connected to power supply portions (electrodes) 18 a and 18 b disposed at the end portions of the heat generating region in the axial direction of the heating member 10. The metal wire is formed by plating as will be described later.

  On the base layer 12 under the metal pattern 14a, there is a plating base pattern 14b. The plating base pattern 14b is a base for forming the metal pattern 14a by plating. The plating base pattern 14b includes at least a plating catalyst necessary for performing plating. The plating base pattern 14b is in contact with the metal pattern 14a and the base layer 12, respectively. The plating base pattern 14b is equal in width to the metal pattern 14a and is formed in the same pattern shape as the metal pattern 14a.

  The heating member 10 can be manufactured by the manufacturing method according to the present invention. Below, embodiment of the manufacturing method which concerns on this invention is described.

(First embodiment)
The manufacturing method according to the first embodiment includes the following steps (a1) and (b).
(A1) Step of forming plating base pattern 14b on base layer 12 (b) Step of forming metal pattern 14a on the plating base by performing plating after step (a1)

  First, as shown in FIG. 3A, the base layer 12 is prepared. The base layer 12 can be formed using a base layer forming material containing an organic polymer. When the base layer 12 is cylindrical (belt-shaped), the base layer forming material (paint) is applied to the outer peripheral surface of a cylindrical or columnar mold and dried. You may heat-process as needed. Examples of the coating method include a dip coating method, a dispenser coating method (nozzle coating method), a roll coating method, and a ring coating method. When the base layer 12 is in a roll shape, the base layer forming material (kneaded material) is injected into a roll molding die and heat-treated. Alternatively, the base layer forming material (kneaded material) is extruded.

  Next, as shown in FIG. 3B, a plating base layer 24 is formed on the base layer 12. The plating base layer 24 is not yet formed by patterning. The plating base layer 24 can be formed by coating using a base forming material (paint) containing a plating catalyst and a binder. You may dry and heat-process as needed. Examples of the coating method include a dip coating method, a dispenser coating method (nozzle coating method), a roll coating method, and a ring coating method. The plating underlayer 24 is a coating film containing a plating catalyst and a binder.

  The plating catalyst only needs to have a catalytic ability necessary for plating on the plating base. Examples of such a catalyst metal include Pt group metals such as Pd and Pt, Ag, Au, and alloys thereof. These may be used individually by 1 type as a catalyst metal for plating, and may be used in combination of 2 or more types. Among these, Pd, Pt, Ag, and alloys thereof are more preferable from the viewpoint of superior catalytic ability. Pd is particularly preferable.

  Examples of the binder include polyimide, polyamideimide, modified polyamideimide, modified polyimide, polyethersulfone, fluororesin, and polycarbonate.

  In the base material (paint), the solid content concentration of the plating catalyst is preferably 0.1% by mass or more from the viewpoint of plating efficiency and the like. More preferably, it is 0.5 mass% or more. Moreover, it is preferable that it is 2.0 mass% or less from viewpoints, such as the dispersibility of a plating catalyst and the adhesiveness of the metal pattern 14a. More preferably, it is 1.5 mass% or less.

  The thickness of the plating underlayer 24 is not particularly limited, but is preferably 0.05 μm or more from the viewpoint of adhesion to the base layer 12 and the metal pattern 14a, uniformity, and the like. More preferably, it is 0.1 micrometer or more, More preferably, it is 0.3 micrometer or more. Moreover, it is preferable that it is 10 micrometers or less from viewpoints, such as economical efficiency. More preferably, it is 5.0 micrometers or less, More preferably, it is 3.0 micrometers or less.

  Next, as shown in FIG. 3B, the plating base layer 24 is irradiated with laser, and is patterned on the plating base layer 24 by laser marking. As shown in FIG. 3C, the portion irradiated with the laser disappears and the portion not irradiated with the laser remains as a plating base. Thereby, the plating base pattern 14b is formed. If necessary, you may perform a degreasing process, a washing process, etc. after a laser marking process.

  Next, as shown in FIG. 3D, plating is performed to form a metal pattern 14a on the plating base pattern 14b. The metal pattern 14a can be formed by electroless metal plating. Electroless metal plating is performed using a plating solution. If necessary, it may be washed with water after plating.

  The plating solution contains metal ions, reducing agents, complexing agents, pH buffering agents and the like. The metal ions are plating metal ions. Examples of the plating metal include Cu, Ni, Ag, Pd, Sn, Au, and alloys thereof. Among these, Cu, Ni, Ag, and alloys thereof are more preferable from the viewpoint of excellent adhesion to the plating base. Further, Ni and Ni alloys are particularly preferable from the viewpoints of catalytic activity with respect to the catalytic metal of the plating base and adhesion to the plating base.

  Examples of the reducing agent include hypophosphorous acid, hypophosphite, dimethylamine borane, hydrazine and the like. Among these, hypophosphorous acid and hypophosphite are preferable from the viewpoint of the stability of the plating solution. Examples of pH buffering agents include lactic acid, acetic acid, and succinic acid.

  Examples of complexing agents include carboxylic acids and amine compounds. As a complexing agent, only carboxylic acid may be used, only an amine compound may be used, or carboxylic acid and an amine compound may be used in combination. Examples of the carboxylic acid include citric acid, malic acid, tartaric acid, ethylenediaminetetraacetic acid (EDTA), and the like. Examples of the amine compound include glycine, alanine, ethylenediamine, propanediamine, and the like.

  A surfactant can be further blended in the plating solution. Examples of the surfactant include a cationic surfactant and an amphoteric surfactant.

  Examples of the cationic surfactant include quaternary ammonium salt types such as lauryltrimethylammonium chloride and ethylene oxide addition type ammonium chloride. These may be used alone or in combination. Examples of amphoteric surfactants include betaine types such as lauryl betaine, amidopropyl betaine, and dimethylalkylbetaine. These may be used alone or in combination. The compounding amount of the cationic surfactant or the amphoteric surfactant is preferably in the range of 0.01 to 10 g / L.

  The thickness of the metal wire of the metal pattern 14a is not particularly limited, but is preferably 0.1 μm or more from the viewpoint of heat generation efficiency. More preferably, it is 0.3 micrometer or more, More preferably, it is 0.5 micrometer or more. Moreover, 10 micrometers or less are preferable from viewpoints, such as a softness | flexibility. More preferably, it is 5.0 micrometers or less, More preferably, it is 3.0 micrometers or less.

  The width of the metal line of the metal pattern 14a is preferably 0.1 mm or more from the viewpoints of manufacturability and heat generation efficiency. More preferably, it is 0.3 mm or more, More preferably, it is 0.5 mm or more. Moreover, 10 mm or less is preferable from the viewpoint of easily reducing temperature unevenness. More preferably, it is 5.0 mm or less, More preferably, it is 3.0 mm or less.

  The distance between the metal lines of the metal pattern 14a is preferably 0.01 mm or more from the viewpoints of manufacturability and heat generation efficiency. More preferably, it is 0.05 mm or more, More preferably, it is 0.1 mm or more. Moreover, 1.0 mm or less is preferable from the viewpoint of easily reducing temperature unevenness. More preferably, it is 0.5 mm or less, More preferably, it is 0.3 mm or less.

  According to the manufacturing method according to the first embodiment having the above configuration, after forming the plating base pattern 14b on the base layer 12, plating is performed to form the metal pattern 14a on the plating base. Patterning accuracy is improved as compared with the conventional method in which the metal pattern 14a is formed by coating, and temperature unevenness is improved. In particular, since the plating base pattern 14b is formed by laser marking of the plating base layer 24 formed on the base layer 12, finer patterning can be formed, patterning accuracy is further improved, and temperature unevenness is increased. Is improved. When the laser marking process is performed, the periphery of the irradiated part rises, so it is easy to guess that the laser marking process has been performed. Moreover, durability is also improved by being seamless.

(Second embodiment)
The manufacturing method according to the second embodiment includes the following steps (a1) and (b).
(A1) Step of forming plating base pattern 14b on base layer 12 (b) Step of forming metal pattern 14a on the plating base by performing plating after step (a1)

  First, as shown in FIG. 4A, the base layer 12 is prepared. The base layer 12 can be formed similarly to the first embodiment.

  Next, as shown in FIG. 4B, a plating base pattern 14 b is formed on the base layer 12. The plating base pattern 14b can be formed by screen printing using a base forming material (paint) containing a plating catalyst and a binder. You may dry and heat-process as needed. Moreover, you may perform a degreasing process, a washing process, etc. after screen printing. The plating base pattern 14b is a coating film containing a plating catalyst and a binder.

  Next, as shown in FIG. 4C, plating is performed to form a metal pattern 14a on the plating base pattern 14b. The metal pattern 14a can be formed by electroless metal plating. Electroless metal plating is performed using a plating solution. The electroless metal plating and the plating solution are the same as those in the first embodiment. If necessary, it may be washed with water after plating.

  According to the manufacturing method according to the second embodiment having the above configuration, after forming the plating base pattern 14b on the base layer 12, plating is performed to form the metal pattern 14a on the plating base. Patterning accuracy is improved as compared with the conventional method in which the metal pattern 14a is formed by coating, and temperature unevenness is improved. In particular, since the plating base pattern 14b is formed by screen printing using a plating base forming paint containing a plating catalyst and a binder, finer patterning can be formed, and the patterning accuracy is further improved. Unevenness is improved. Moreover, durability is also improved by being seamless.

(Third embodiment)
The manufacturing method according to the third embodiment includes the following steps (a2) and (b).
(A2) Step of forming mask pattern 26 on plating base layer 24 formed on base layer 12 (b) Step of forming metal pattern 14a on plating base by performing plating after step (a2)

  First, as shown in FIG. 5A, the base layer 12 is prepared. The base layer 12 can be formed similarly to the first embodiment.

  Next, as shown in FIG. 5B, the plating base layer 24 is formed on the base layer 12. The plating base layer 24 is not yet formed by patterning. The plating underlayer 24 can be formed in the same manner as in the first embodiment. The plating underlayer 24 is a coating film containing a plating catalyst and a binder.

  Next, as shown in FIG. 5C, a mask pattern 26 is formed on the plating base layer 24. The mask pattern 26 is a mask for forming the metal pattern 14a on the plating base layer 24 by plating. Plating is not formed on the plating base covered with the mask. Plating is formed on a plating base not covered with a mask. The mask pattern 26 is formed by applying a masking paint. The masking paint can be applied using an inkjet coating machine. If necessary, a degreasing process, a cleaning process, or the like may be performed after the mask is formed.

Although it does not specifically limit as a mask material, A resin material can be mentioned. Examples of the resin material include an epoxy resin, a polyester resin, a novolac resin, an acrylic resin, and the like. Among these, acrylic photocurable resins are preferable from the viewpoints of being easy to form by coating, curing by light irradiation, and easily forming a mask.

  Next, as shown in FIG. 5D, plating is performed to form a metal pattern 14a on the plating base. A metal pattern 14a is formed on a portion of the plating base layer 24 that is not covered with a mask. The metal pattern 14a can be formed by electroless metal plating. Electroless metal plating is performed using a plating solution. The electroless metal plating and the plating solution are the same as those in the first embodiment. If necessary, it may be washed with water after plating.

Next, as shown in FIG. 5E, the mask is removed. The mask can be removed using a removing liquid. Examples of the removing liquid include organic solvents such as N-methylpyrrolidone, dimethyl sulfoxide, and ethanolamine, alkaline solutions, and ethylene carbonate.

  According to the manufacturing method according to the third embodiment having the above configuration, after forming the mask pattern 26 on the plating base layer 24 formed on the base layer 12, plating is performed, and the metal pattern 14a is formed on the plating base. Since it is formed, the patterning accuracy is improved and temperature unevenness is improved as compared with the conventional method in which the metal pattern 14a is formed by applying a conductive paste. In particular, since the mask is formed by application of a masking paint, it can be performed using an inkjet coating machine, so that a finer pattern shape can be formed, patterning accuracy is further improved, and temperature unevenness is further improved. Is improved. Moreover, durability is also improved by being seamless.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above embodiment, plating may be further formed by electrolytic plating on the metal pattern 14a formed by electroless metal plating. In addition, a coating layer may be formed in the heat generation region in the axial direction of the heating member 10 so as to cover the metal pattern 14a over the entire circumference. The coating layer can be formed of, for example, an insulating material, a rubber elastic material, a fluororesin material, or the like.

  Moreover, the metal pattern 14a is not limited to the structure of the said embodiment, It can be made into various pattern shapes.

  In the third embodiment, the mask pattern 26 is formed on the plating base layer 24 by applying a masking paint using an ink jet coating machine. However, the mask layer is formed on the plating base layer 24. Then, the mask pattern 26 may be formed from the mask layer by laser marking or a photoresist method. The mask layer is not yet formed by patterning. The mask layer can be formed by applying a masking paint.

  Moreover, in the said embodiment, although it has illustrated that the plating base is a coating film containing a plating catalyst and a binder, you may form a plating base by the conventional method which provides a catalyst on the base layer 12. FIG. Specifically, a catalyst for electroless plating may be adsorbed on the surface of the base layer 12 and then subjected to a reduction treatment to have a catalyst metal for electroless plating on the base layer 12. In order to adsorb the electroless plating catalyst on the surface of the base layer 12, it is preferable to activate the surface of the base layer 12. For example, a hydrophilic group such as a hydroxyl group or a carboxyl group may be generated on the surface of the base layer 12, and a catalyst for electroless plating may be applied to the surface of the base layer 12. The hydrophilic group of the base layer 12 can be formed relatively easily by hydrolysis by alkali treatment. In the reduction treatment, after contacting a metal ion-water soluble polymer complex solution such as Pd, the metal ion is reduced with a reducing agent containing dimethylamine borane, sodium borohydride, etc., and the water soluble polymer is removed. And a method of depositing a metal (alkali catalyst method). In addition, a sensitizer-activator method or a catalyst-accelerator method using the reducing power of tin ions may be used.

  The organic polymer of the base layer 12 is preferably an organic polymer having excellent heat resistance. Examples of the organic polymer of the base layer 12 include polyamideimide, modified polyamideimide, polyimide, modified polyimide, polyethersulfone, fluororesin, and polycarbonate. These may be used individually by 1 type as an organic polymer of the base layer 12, and may be used in combination of 2 or more type. Of these, polyamideimide, modified polyamideimide, polyimide, modified polyimide, and the like are more preferable from the viewpoint of excellent rigidity and improved durability.

  The base layer 12 may contain additives and the like. Examples of the additive include a flame retardant, a filler, a leveling agent, and an antifoaming agent.

  The thickness of the base layer 12 is not particularly limited, but is preferably in the range of 20 to 200 μm from the viewpoint of durability and manufacturability. More preferably, it exists in the range of 40-150 micrometers, More preferably, it exists in the range of 60-100 micrometers.

  Hereinafter, the present invention will be described in detail using Examples and Comparative Examples.

<Base layer forming material>
Toyobo Polyamideimide Varnish “Vilomax HR-16NN (solid content: 14.0%)” was prepared.

<Material for plating base formation>
“Metalloid” manufactured by Iox was prepared as a material for forming a plating base.

<Degreasing liquid>
A degreasing solution was prepared by mixing 200 ml of an alkaline degreasing agent (Okuno Pharmaceutical Co., Ltd., “OPC-190 Cleaner”), 1200 ml of 3% by weight caustic soda, and 600 ml of ion-exchanged water.

<Conditioner liquid>
As a conditioner solution, 50 ml / L of a cationic surface conditioner (Okuno Pharmaceutical Co., Ltd., “Condizer FR Conch”) was used.

<Catalyst imparting material>
Palladium catalyst solution (Okuno Pharmaceutical Co., Ltd., “OPC-50 inducer”) 10 ml / L (palladium ion concentration 0.04 g / L) was used as the catalyst solution.
A reducing agent (Okuno Pharmaceutical Co., Ltd., “OPC-150 Cryster”) was used as the activation liquid.

<Conductive paste material>
As the conductive paste material, a material prepared by the following procedure was used. Rubber (A) in which 5 parts by mass of Kyowamag # 30 (manufactured by Kyowa Chemical Industry) and 5 parts by mass of calzette (manufactured by Kyokuto Kasei Kogyo) are kneaded with two rolls for 20 minutes with 100 parts by mass of Daiel G555 (manufactured by Daikin Industries). Was made. Subsequently, 100 parts by weight of rubber (A) was cut into 2 to 3 mm squares, and 5 parts by weight of acetic acid and 245 parts by weight of methyl ethyl ketone were combined in advance with a 5-minute impeller, and mixed with an air stirrer. The mixture was stirred for 30 minutes to obtain a solution (B). Furthermore, 500 parts by mass of 10% Ag coat 2L3 (Fukuda Metal Foil Powder Industry), 26 parts by mass of Duranate SBN-70D (Asahi Kasei Chemicals), and 510 parts by mass of methyl ethyl ketone with respect to 350 parts by mass of the solution (B), The conductive paste material was prepared by stirring for 2 minutes by hand stirring using a stirring rod.

<Electroless metal plating solution>
By mixing nickel sulfate hexahydrate: 26 g / L, sodium hypophosphite monohydrate (reducing agent): 32 g / L, sodium citrate dihydrate (complexing agent): 30 g / L An electroless metal plating solution was obtained.

<Preparation of base layers of Examples 1 to 4 and Comparative Example 1>
A base layer forming material was applied to the surface of an aluminum cylindrical pipe having a diameter of 40 mm and an axial length of 450 mm by a dip coating method and dried at 230 ° C. for 60 minutes. The pulling speed at the time of coating was 100 mm / second. Thereby, a cylindrical base layer (thickness 80 μm) made of polyamideimide (PAI) was formed on the outer peripheral surface of the cylindrical pipe.

<Preparation of plating underlayer and patterning formation of Example 1>
The surface of the base layer was coated with a plating base forming material by a brush coating method, heat-treated at 120 ° C. for 15 minutes, and further heat-treated at 240 ° C. for 15 minutes. As a result, a plating base layer (0.5 μm) was formed on the base layer. Thereafter, laser marking (width: 0.2 mm, interval: 1 mm) was performed linearly with a laser marker (Panasonic device SUNX LP-420S9U). Thereby, the plating base pattern was formed. Thereafter, it was immersed in a degreasing solution at 65 ° C. for 5 minutes and then washed with pure water. Thereafter, the substrate was immersed in an electroless metal plating solution (plating solution temperature: 84 ° C., plating time: 2 minutes), and then rinsed with pure water. As a result, a metal pattern (nickel plating, thickness 1 μm) patterned in a linear shape with a width of 1 mm and an interval of 0.2 mm was formed on the plating base.

<Preparation of plating base pattern and patterning formation of Example 2>
On the surface of the base layer, the material for forming a plating base was patterned and applied in a linear pattern having a width of 1 mm and an interval of 0.2 mm by screen printing, heat-treated at 120 ° C. for 15 minutes, and further heat-treated at 240 ° C. for 15 minutes. As a result, a plating base pattern (thickness 0.5 μm) was formed on the base layer. Thereafter, it was immersed in a degreasing solution at 65 ° C. for 5 minutes and then washed with pure water. Then, it was immersed in an electroless metal plating solution (plating solution temperature: 84 ° C., plating time: 2 minutes), and then rinsed with pure water. As a result, a metal pattern (nickel plating, thickness 1 μm) patterned in a linear shape with a width of 1 mm and an interval of 0.2 mm was formed on the plating base.

<Preparation and Patterning Formation of Plating Underlayer of Example 3>
The surface of the base layer was coated with a plating base forming material by a brush coating method, heat-treated at 120 ° C. for 15 minutes, and further heat-treated at 240 ° C. for 15 minutes. As a result, a plating base layer (0.5 μm) was formed on the base layer. Thereafter, a UV curable masking paint having a width of 0.2 mm and an interval of 1 mm was applied linearly with an inkjet coating machine, and the paint was cured by irradiation with UV. Thereafter, it was immersed in a degreasing solution at 65 ° C. for 5 minutes and then washed with pure water. Thereby, a mask pattern was formed on the plating base layer. Then, it was immersed in an electroless metal plating solution (plating solution temperature: 84 ° C., plating time: 2 minutes), and then rinsed with pure water. As a result, a metal pattern (nickel plating, thickness 1 μm) patterned in a linear shape with a width of 1 mm and an interval of 0.2 mm was formed on the plating base.

<Preparation and Patterning Formation of Plating Underlayer of Example 4>
The base layer was immersed in a degreasing solution at 65 ° C. for 5 minutes, in a conditioner at 50 ° C. for 2 minutes, in a catalyzing solution at 50 ° C. for 2 minutes, and in an activating solution at 40 ° C. for 2 minutes to give a catalyst to the surface of the base layer. As a result, a plating underlayer was formed on the base layer. In addition, between each process, it washed with water by pouring pure water. Thereafter, laser marking (width: 0.2 mm, interval: 1 mm) was performed linearly with a laser marker (Panasonic device SUNX LP-420S9U). As a result, a plating base pattern was formed on the base layer. At this time, since the base surface was lighter than that in Example 1, the absorption of the laser beam was poor, and the laser output required twice the intensity as in Example 1. Thereafter, it was immersed in a degreasing solution at 65 ° C. for 5 minutes and then washed with pure water. Then, it was immersed in an electroless metal plating solution (plating solution temperature: 84 ° C., plating time: 2 minutes), and then rinsed with pure water. As a result, a metal pattern (nickel plating, thickness 1 μm) patterned in a linear shape with a width of 1 mm and an interval of 0.2 mm was formed on the plating base.

<Patterning of Comparative Example 1>
The conductive paste material was coated on the base layer in a linear shape with a width of 1 mm and an interval of 0.2 mm with a digital dispenser (Musashi Engineering MPP-1), and then heated at 200 ° C. for 60 minutes. A patterning electrode formed in a 20 μm line shape on the base layer was produced.

(Measurement of surface temperature unevenness)
As shown in FIG. 6, a simple evaluation system having a measurement work 1, an oscilloscope 3, an AC power supply 4, and a thermography 5 was created. Black body spray 2 (Japan Sensor Co., Ltd. “JSC-3”) was applied so that only the edge portion was exposed on the surface of measurement workpiece 1. Copper tape was attached to both ends of the measurement workpiece 1 to form electrode portions, a frequency of 100 Hz and an applied voltage of 50 V were applied, and the surface of the measurement workpiece 1 was measured with the thermography 5. The distance from the surface of the measurement workpiece 1 to the thermography 5 was 500 mm. Especially good when the surface temperature unevenness of the workpiece 1 is 5 ° C. or less “」 ”, when the workpiece temperature is more than 5 ° C. and 10 ° C. or less,“ Good ”, when the workpiece temperature is more than 10 ° C. and less than 20 ° C. Slightly inferior “Δ” and those exceeding 20 ° C. were regarded as defective “x”.
AC power supply: NF circuit design block BP4610
-Thermography: Nippon Avionics S30

(durability)
As shown in FIG. 7, the sample 1 was pulled with two axes while applying a load 7 (1 kg), and the rotating shafts (φ5) 6a and 6b were rotated at 1800 rpm to measure the number of rotations until the sample 1 was broken. . Good when the number of revolutions up to 50000 times or more is good, “Good”, what is over 10,000 times but less than 50000 times, “△”, about 10,000 times up to destruction What was less than was made into defect "x".

  In Comparative Example 1, a metal pattern is formed by applying a conductive paste. For this reason, the patterning accuracy was inferior and the temperature unevenness was large. On the other hand, in Example 1, a plating base pattern is formed by performing laser marking on the plating base layer, and electroless plating is performed on the plating base to form a metal pattern. For this reason, the patterning accuracy is excellent, and temperature unevenness is suppressed to a small level. In Example 2, a masking paint is applied by patterning to the plating base layer, and electroless plating is applied thereon to form a metal pattern. For this reason, the patterning accuracy is excellent, and temperature unevenness is suppressed to a small level. In Example 3, a plating base pattern is formed by patterning and applying a plating base forming material by screen printing, and electroless plating is performed on the plating base to form a metal pattern. For this reason, the patterning accuracy is excellent, and temperature unevenness is suppressed to a small level. In Example 4, a plating base pattern is formed by performing laser marking on a plating base layer formed by applying a catalyst, and electroless plating is performed on the plating base to form a metal pattern. For this reason, the patterning accuracy is excellent, and temperature unevenness is suppressed to a small level.

  Among Examples 1 to 4, Example 1 had the smallest temperature unevenness, Example 2 had the next smallest temperature unevenness, and Examples 3 and 4 had relatively large temperature unevenness. Example 1 by laser marking processing is superior in patterning accuracy to Example 3 by screen printing. Further, the patterning accuracy of Example 1 by laser marking is superior to that of Example 2 by applying a masking paint. In Example 4, since the laser output was strong, a part of the metal line at the patterning boundary was missing. For this reason, Example 1 is superior in patterning accuracy. And Examples 1-4 were all seamless and satisfied durability.

  As mentioned above, although the Example of this invention was described, this invention is not limited to the said Example at all, A various change is possible within the range which does not deviate from the meaning of this invention.

DESCRIPTION OF SYMBOLS 10 Heating member 12 Base layer 14 Heat generating layer 14a Metal pattern 14b Plating base pattern 24 Plating base layer 26 Mask pattern

Claims (5)

A method of manufacturing a heating member for heating an object to be heated,
(A1) a step of forming a plating base pattern on the base layer, or (a2) a step of forming a mask pattern on the plating base layer formed on the base layer;
(B) performing the plating after the step (a1) or (a2) to form a metal pattern on the plating base, and a method for manufacturing a heating member.   2. The plating base pattern is formed by laser marking of a plating base layer formed on a base layer or screen printing using a plating base forming paint containing a plating catalyst and a binder. The manufacturing method of the heating member.   The method for manufacturing a heating member according to claim 1, wherein the plating base pattern is formed by laser marking of a plating base layer formed on a base layer.   The said mask pattern is formed by application | coating of a masking coating material, The manufacturing method of the heating member of any one of Claim 1 to 3 characterized by the above-mentioned.   The method for manufacturing a heating member according to any one of claims 1 to 4, wherein the plating base is a coating film containing a plating catalyst and a binder.

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